WO2020235143A1 - Electronic control device and rotation drive mechanism - Google Patents

Electronic control device and rotation drive mechanism Download PDF

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Publication number
WO2020235143A1
WO2020235143A1 PCT/JP2020/003404 JP2020003404W WO2020235143A1 WO 2020235143 A1 WO2020235143 A1 WO 2020235143A1 JP 2020003404 W JP2020003404 W JP 2020003404W WO 2020235143 A1 WO2020235143 A1 WO 2020235143A1
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WO
WIPO (PCT)
Prior art keywords
heat radiating
circuit board
radiating plate
control device
electronic control
Prior art date
Application number
PCT/JP2020/003404
Other languages
French (fr)
Japanese (ja)
Inventor
太郎 木村
中島　浩二
優 岸和田
田村　憲一
善一 野月
昌也 野々村
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2021520049A priority Critical patent/JP7130124B2/en
Publication of WO2020235143A1 publication Critical patent/WO2020235143A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses

Definitions

  • the present disclosure relates to an electronic control device and a rotary drive mechanism.
  • an electronic control device includes electronic circuits such as a power supply circuit, a drive circuit, a control circuit, a protection circuit, and a communication circuit.
  • the electronic circuit is divided into a plurality of circuit boards.
  • the electronic control device has a wiring structure that electrically connects a plurality of circuit boards and a wiring structure that electrically connects the electronic control device and the outside. Further, the electronic control device has a heat dissipation structure that dissipates heat generated from a plurality of circuit boards.
  • Patent Document 1 is an example of a patent document that discloses this type of electronic control device.
  • the wiring structure and heat dissipation structure of the electronic control device will be housed in a sealed housing in order to prevent foreign matter such as dirt or dust from entering from the external environment.
  • the space inside the housing is limited, and the wiring structure and the like are required to be miniaturized and space-saving.
  • a drive circuit requires a large amount of power of about several tens to several hundreds of A, power loss is likely to occur due to the resistance or inductance component of the wiring conductor forming the wiring structure, and the power loss is accompanied by the power loss.
  • the generated heat is easy to collect. For this reason, electronic control devices are required to shorten wiring conductors.
  • the present disclosure has been made to solve the above problems, one purpose is to provide an electronic control device capable of shortening a wiring conductor, and the other purpose is to provide such an electron. It is to provide a rotary drive mechanism to which a control device is applied.
  • the electronic control device includes a tubular housing, a drive shaft insertion portion, a circuit board portion, and a wiring portion.
  • the tubular housing extends in a tubular shape in one direction.
  • the drive shaft insertion portion is arranged inside the tubular housing, and inserts a drive shaft arranged so as to penetrate the tubular housing in one direction.
  • the circuit board portion includes a first circuit board and a second circuit board that are held by the drive shaft insertion portion and are arranged radially from the drive shaft insertion portion, respectively.
  • the wiring unit includes a wiring conductor that electrically connects the first circuit board and the second circuit board. The wiring conductor is arranged on the side where the drive shaft insertion portion is located.
  • the rotary drive mechanism is a rotary drive mechanism provided with the above-mentioned electronic control device, and includes a drive unit, an electronic control device, and an inter-device wiring unit.
  • the drive unit has a rotation shaft as a drive shaft, and rotates the rotation shaft.
  • the electronic control device is arranged so that the rotating shaft is inserted through the drive shaft insertion portion and is adjacent to the drive portion.
  • the inter-device wiring unit electrically connects the drive unit and the electronic control device.
  • the wiring conductor that electrically connects the first circuit board and the second circuit board, which are arranged radially from the drive shaft insertion portion is on the side where the drive shaft insertion portion is located. It is located in. As a result, the length of the wiring conductor can be shortened.
  • the wiring conductor can be shortened and the power loss due to the wiring conductor can be reduced by providing the electronic control device. In addition, it is possible to suppress the generation of heat due to power loss.
  • FIG. 1 shows the electronic control apparatus which concerns on Embodiment 1.
  • FIG. 1 it is a perspective view which shows the appearance of the electronic control device.
  • it is an exploded perspective view for demonstrating the structure of an electronic control device.
  • it is a top view which shows an example of the internal structure of the tubular housing of an electronic control device.
  • it is 1st exploded perspective view for demonstrating the mounting structure of the circuit board in the electronic control apparatus.
  • it is the 2nd exploded perspective view for demonstrating the mounting structure of the circuit board in the electronic control apparatus.
  • FIG. 1 it is an exploded perspective view which shows an example of the attachment structure of the circuit board in the electronic control apparatus which concerns on the modification.
  • it is a top view which shows an example of the internal structure of the tubular housing of the electronic control device which concerns on another modification.
  • it is a partially enlarged perspective view which shows the structure of the tubular side wall part of the electronic control device which concerns on another modification.
  • it is a perspective view which shows typically the structure of the electronic control apparatus which concerns on still another modification.
  • FIG. 2 it is a perspective view for demonstrating the attachment structure of one heat radiating plate in the same embodiment.
  • it is a top view which shows the 1st example of the internal structure of the tubular housing of an electronic control device.
  • it is a top view which shows the 2nd example of the structure inside the tubular housing of an electronic control device.
  • it is a top view which shows the 3rd example of the structure inside the tubular housing of an electronic control device.
  • it is a top view which shows the 4th example of the structure inside the tubular housing of an electronic control device.
  • It is a 1st perspective view for demonstrating the attachment structure of another heat radiating plate in the same embodiment.
  • It is a 2nd perspective view for demonstrating the attachment structure of another heat radiating plate in the same embodiment.
  • Embodiment 1 An example of the electronic control device according to the first embodiment and an example of the rotation drive mechanism to which the electronic control device is applied will be described.
  • the electronic control device 1 is attached to, for example, a rotating drive shaft 67.
  • the electronic control device 1 has, for example, a function of controlling the rotation drive thereof.
  • the electronic control device 1 has a tubular housing 3 extending in a tubular shape in one direction, and a circuit board or the like (not shown) including a control function is arranged inside the tubular housing 3.
  • the tubular housing 3 has a tubular side wall portion 11, a first facing wall portion 5a, and a second facing wall portion 5b.
  • the first facing wall portion 5a and the second facing wall portion 5b are arranged at intervals in the direction in which the tubular side wall portion 11 extends.
  • the first facing wall portion 5a has a function as a lid and closes one side of the tubular side wall portion 11.
  • the second facing wall portion 5b closes the other side of the tubular side wall portion 11 as a bottom portion.
  • a metal bus bar outlet 49 is provided on the first facing wall portion 5a.
  • a metal bus bar 43 that electrically connects the electronic control device 1 and the outside protrudes from the metal bus bar outlet 49.
  • a drive shaft insertion portion 15 through which the drive shaft 67 (see FIG. 1) is inserted is arranged in the tubular housing 3.
  • the drive shaft 67 is inserted into the drive shaft insertion portion 15 in a manner of penetrating the tubular housing 3.
  • the drive shaft insertion portion 15 has a double structure including an insertion main body portion 16 and a circuit board holding portion 17.
  • the drive shaft 67 (see FIG. 1) is inserted into the insertion main body 16.
  • the circuit board holding portion 17 is arranged at a distance in the radial direction from the insertion main body portion 16. A space is provided between the circuit board holding portion 17 and the insertion main body portion 16.
  • the space inside the tubular housing 3 is partitioned by a partition wall 21.
  • a partition wall 21a and a partition wall 21b are partitioned by a partition wall 21a and a partition wall 21b.
  • a plurality of circuit boards 23 are arranged in the space partitioned by the partition walls 21a and 21b.
  • the plurality of circuit boards 23 are held by the circuit board holding portion 17 and arranged radially toward the tubular side wall portion 11.
  • Electronic components 31 are mounted on each of the plurality of circuit boards 23.
  • the wiring conductors (wiring cable 35, metal bus bar 41) that electrically connect the circuit boards 23 are arranged on the drive shaft insertion portion 15. The wiring conductor will be described later.
  • the plurality of circuit boards 23 include, for example, a power supply circuit board, a drive circuit board, a control circuit board, a protection circuit board, a communication circuit board, and the like.
  • the power supply circuit board has a function of receiving electric power from a power source and supplying electric power set to a voltage required for the circuit board to an apparatus.
  • the drive circuit board has a function of driving a power unit such as a motor.
  • the control circuit board has a function of controlling the operation of the drive circuit.
  • the protection circuit board has a function of preventing damage to the device in the event of an abnormality and ensuring safety.
  • the communication circuit board has a function of communicating with the outside.
  • circuit board 23a As the plurality of circuit boards 23, for example, five circuit boards 23 such as a circuit board 23a, a circuit board 23b, a circuit board 23c, a circuit board 23d, and a circuit board 23e are arranged.
  • the circuit boards 23a to 23e are not intended to be a specific circuit board such as the power supply circuit board described above.
  • the electronic component 31a and the electronic component 31b are mounted on one main surface side.
  • the electronic component 31c is mounted on one main surface side
  • the electronic component 31d is mounted on the other main surface side.
  • the electronic component 31e is mounted on one main surface side
  • the electronic component 31f is mounted on the other main surface side.
  • the electronic component 31g is mounted on one main surface side.
  • the electric component 31h and the electronic component 31i are mounted on one main surface side.
  • Electronic components 31 include relatively short electronic components such as ICs (Integrated Circuits), microcomputers, chips, etc., and relatively tall electronic components such as coils, capacitors, sensors, connectors, etc. There are even electronic components.
  • a relatively short electronic component 31 is mounted on the side of the circuit board holding portion 17 of the circuit board 23.
  • the electronic components 31a to 31i are not intended to be specific electronic components.
  • the circuit board holding portion 17 is formed with a slit-shaped gap portion 19 along one direction.
  • a fixing metal fitting 25 is attached to the circuit board 23.
  • the fixing metal fitting 25 is fitted along the gap 19.
  • the fixing metal fitting 25 is formed with a flange portion 25a that sandwiches the circuit board holding portion 17 from both the outside and the inside.
  • wiring conductor that electrically connects the circuit boards 23 will be described.
  • wiring conductors that electrically connect a plurality of circuit boards 23 fixed to the tubular housing 3 for example, there are a wiring cable 35 and a metal bus bar 41.
  • the wiring cable 35 (one end side or the other end side) is connected to a connector 33 provided on the circuit board 23.
  • the wiring cable 35 is arranged, for example, in the space (space R) between the insertion main body 16 and the circuit board holding portion 17.
  • the circuit board holding portion 17 is formed with a hole 37 for a wiring cable that communicates the space on the side of the insertion main body 16 and the space on the side of the tubular side wall.
  • the wiring cable 35 is arranged in the space R through the wiring cable hole 37.
  • the circuit board 23a and the circuit board 23e are electrically connected by the wiring cable 35a. Further, the circuit board 23a and the circuit board 23d are electrically connected by the wiring cable 35b.
  • the wiring cable 35 does not necessarily have to be arranged in the space R. For example, like the wiring cable 35b that electrically connects the circuit board 23d and the circuit board 23c, the wiring cable 35 is along the outer peripheral surface of the circuit board holding portion 17. May be arranged.
  • the metal bus bar 41 is arranged along the outer peripheral surface of the circuit board holding portion 17.
  • the metal bus bar 41 (one end side or the other end side) is fixed to the metal bus bar mounting terminal 45 provided on the circuit board 23 by a fixing screw 47.
  • the adjacent circuit boards 23a and the circuit boards 23b are electrically connected by a metal bus bar 41a.
  • the adjacent circuit boards 23b and the circuit boards 23c are electrically connected by the metal bus bar 41b.
  • the metal bus bar 41 it is not always necessary to electrically connect the adjacent circuit boards 23 to each other. As shown in FIG. 7, for example, in addition to the metal bus bar 41c that electrically connects the adjacent circuit boards 23g and the circuit boards 23h, for example, the circuit boards 23f and the circuit boards 23h located so as to sandwich the circuit boards 23g.
  • the metal bus bar 41d may be arranged so as to electrically connect the and.
  • the circuit board 23g located between the circuit board 23f and the circuit board 23h is provided with a notch 24 for passing the metal bus bar 41d. Is preferable.
  • the cutout portion 24 can also be used to pass a wiring cable 35 that electrically connects the circuit board 23f and the circuit board 23h.
  • the metal bus bar 41 will be arranged along the outer peripheral surface of the circuit board holding portion 17. Therefore, the metal bus bar 41 is provided with an arc-shaped portion corresponding to the arrangement relationship (circumferential angle) of the two electrically connected circuit boards 23.
  • a metal bus bar 41 having a relatively short arcuate portion is applied.
  • a metal bus bar 41 having a relatively long arcuate portion is applied.
  • a linear metal bus bar 41 may be applied as shown in FIG.
  • a screw hole 42 through which the fixing screw 47 is inserted is formed at the end.
  • the metal bus bar 41 is oriented so that the screw hole 42 faces upward so that the fixing screw 47 can be easily fastened from above (the side on which the first facing wall portion 5a is arranged).
  • the screw hole 42 is formed with a cross-sectional area larger than that of the fixing screw 47 as an opening cross-sectional area so that the misalignment of the metal bus bar 41 with respect to the metal bus bar mounting terminal 45 can be absorbed.
  • the screw hole 42 has, for example, an elliptical shape as the opening shape.
  • the rotation drive mechanism 60 includes a motor 61, a generator 63, a drive shaft 67, a power source 71, an electronic control device 1, and a rotation drive body 65.
  • the motor 61, the generator 63, and the electronic control device 1 are attached to the drive shaft 67.
  • the rotary drive body 65 is attached to an end portion of the rotary drive shaft 6.
  • the drive shaft 67 is rotated by the rotational drive force of the motor 61, so that the rotary drive body 65 rotates.
  • the generator 63 generates electricity by rotating the drive shaft 67.
  • the electronic control device 1 is electrically connected to each of the motor 61 and the generator 63 by a wiring cable 69a. The operation of the rotary drive mechanism 60 including the motor 61 and the like is controlled by the electronic control device 1.
  • the electronic control device 1 is electrically connected to the power source 71 by a wiring cable 69b.
  • the electric power of the electronic control device 1 and the like is supplied from the electric power source 71.
  • the power source 71 for example, a storage battery or the like is used.
  • the electronic control device 1 and the rotation drive mechanism 60 according to the first embodiment are configured as described above.
  • FIG. 14 shows a rotation drive mechanism 160 to which the electronic control device 101 according to the comparative example is applied.
  • the housing 103 has a substantially rectangular parallelepiped (hexahedron) shape. Therefore, the electronic control device 101 is arranged at a position away from the motor 61 and the generator 63.
  • the electronic control device 101 is electrically connected to each of the motor 61 and the generator 63 by a wiring cable 169a.
  • the electronic control device 101 is electrically connected to the power source 71 by a wiring cable 169b.
  • a circuit board 123a, a circuit board 123b, and a circuit board 123c are arranged as a plurality of circuit boards 123 in the housing 103 of the electronic control device 101.
  • An electronic component 131a and an electronic component 131b are mounted on the circuit board 123a.
  • An electronic component 131c and an electronic component 131d are mounted on the circuit board 123b.
  • the electronic component 131e and the electronic component 131f are mounted on the circuit board 123c.
  • the circuit board 123a and the circuit board 123b are electrically connected by, for example, a metal bus bar 141b.
  • the circuit board 123a and the circuit board 123c are electrically connected by, for example, a metal bus bar 141a.
  • the circuit board 123b and the circuit board 123c are electrically connected by, for example, a metal bus bar 141c.
  • the circuit board 123a and the circuit board 123b are held at a distance D1 that does not interfere with each other in consideration of the heights of the electronic component 131b and the electronic component 131c. Therefore, the metal bus bar 141b is set to a length based on this interval D1.
  • the circuit board 123b and the circuit board 123c are held at a distance D2 that does not interfere with each other in consideration of the heights of the electronic component 131d and the electronic component 131e. Therefore, the metal bus bar 141c is set to a length based on this interval D2. Further, the metal bus bar 141a is set to a total length of the interval D1 and the interval D2.
  • the length of the metal bus bars 141a to 141c is set to a length based on the distance between the circuit boards 123 in consideration of the height of the electronic component 130. Therefore, there is a limit to shortening the length of the metal bus bars 141a to 141c. Therefore, there is a limit to reducing the power loss due to the resistance and inductance of the metal bus bars 141a to 141c.
  • each of the plurality of circuit boards 23 is , It is held by the circuit board holding portion 17, and is arranged radially from the circuit board holding portion 17 toward the tubular side wall portion 11.
  • the metal bus bar 41 and the wiring cable 35 are provided on the side of the circuit board holding portion 17 in which the plurality of circuit boards 23 are close to each other as wiring members for electrically connecting the plurality of circuit boards 23 arranged radially. Have been placed. As a result, the length of each of the metal bus bars 41 and the like can be shortened as compared with the comparative example. As a result, as compared with the comparative example, the power loss due to the resistance or inductance of the metal bus bar 41 or the like can be reduced, and the heat generation due to the power loss can be suppressed.
  • the electronic control device 1 is attached to the drive shaft 67 together with the motor 61 and the generator 63.
  • the length of the wiring cable 69a that electrically connects the electronic control device 1 and the motor 61 and the length of the wiring cable 69a that electrically connects the electronic control device 1 and the generator 63. Can be shortened.
  • a guide portion 9 is formed in the second facing wall portion 5b, and the circuit board 23 is fixed to the guide portion 9. You may do so.
  • a guide portion 13 as a second receiving portion is formed on the tubular side wall portion 11 of the tubular housing body 3, and the circuit board 23 is fixed to the guide portion 13. You may. As a result, the circuit board 23 can be more firmly fixed in the tubular housing 3.
  • the tubular housing 3 may be filled with resin or the like.
  • a heat radiating mechanism for flowing cooling water, air or the like may be provided inside the tubular housing 3 or inside the second facing wall portion 5b or the like.
  • the cooling water heat radiating surface 77 may be provided at the lower part of the tubular housing 3.
  • the electronic control device 1 is provided with a cooling water inlet 75 and a cooling water outlet 76. The cooling water flowing in from the cooling water inlet 75 exchanges heat with the heat generated in the electronic control device 1 while passing through the cooling water heat dissipation surface 77, and the inside of the electronic control device 1 is cooled.
  • the heat-exchanged cooling water is discharged to the outside of the electronic control device 1 from the cooling water outlet 76. Further, a heat radiating plate 80 (see FIG. 20) for releasing the generated heat may be provided. The heat radiating plate 80 will be described in detail in the second embodiment.
  • Embodiment 2 The electronic control device according to the second embodiment will be described. Here, the structure for dissipating heat generated inside the electronic control device will be described more specifically. As shown in FIG. 4 and the like, a plurality of electronic components 31 are mounted on the circuit board 23 arranged in the electronic control device 1. These electronic components 31 generate heat as the electronic control device 1 operates. In order to operate the electronic control device 1 stably, it is necessary to dissipate the generated heat to the outside.
  • the heat radiating plate 80 is attached to the fixing metal fitting 25.
  • This mounting structure is the same as the structure in which the circuit board 23 is mounted on the fixing bracket 25.
  • the heat radiating plate 80 is fixed to the tubular housing 3 (second facing wall portion 5b) by fitting the fixing metal fitting 25 into the gap portion 19 (see FIGS. 5 and 6) of the circuit board holding portion 17.
  • the heat radiating plate 80 is connected to the fixing metal fitting 25 by the heat radiating plate position fixing portion 90.
  • One end side of the heat radiating plate position fixing portion 90 is connected to, for example, the upper end portion of the heat radiating plate 80. Therefore, a gap is formed between the heat radiating plate 80 and the fixing metal fitting 25 below the heat radiating plate position fixing portion 90.
  • a metal bus bar 41 or the like can be arranged in this gap to electrically connect the circuit boards 23 (see FIG. 6 or the like) at the shortest distance.
  • one end side of the heat radiating plate position fixing portion 90 is connected to the upper end portion of the heat radiating plate 80 is taken as an example, one end side of the heat radiating plate position fixing portion 90 is connected to the lower end portion of the heat radiating plate 80. You may have. Further, one end side of the heat radiating plate position fixing portion 90 may be connected to an intermediate portion between the upper end portion and the lower end portion of the heat radiating plate 80.
  • the fixing metal fitting 25 to which the heat radiating plate 80 is connected is fitted into the gap portion 19 provided in the circuit board holding portion 17.
  • the heat radiating plate 80a as one of the heat radiating plates 80 is brought into close contact with the electronic component 31e as one of the electronic components 31. In this way, the heat radiating plate 80 is attached.
  • the heat radiating plate 80 is formed of a metal or the like having high thermal conductivity. As shown in FIG. 20, a part (lower end portion) of the heat radiating plate 80 is also in contact with the cooling water heat radiating surface 77.
  • the contact in this case means not only the case where a part (lower end portion) of the heat radiating plate 80 is in direct contact with the cooling water heat radiating surface 77, but also a part (lower end portion) of the heat radiating plate 80.
  • a heat conductive member such as heat radiating silicon or a heat radiating sheet is interposed between the cooling water radiating surface 77 is also included.
  • the heat generated from the electronic component 31e is conducted from the heat radiating plate 80a to the cooling water through the cooling water heat radiating surface 77, and is radiated to the outside of the electronic control device 1.
  • the heat radiating plate 80a is attached to the fixing metal fitting 25 via the heat radiating plate position fixing portion 90, and is fixed to the second facing wall portion 5b of the tubular housing 3 by the fixing jig 87a and the fixing screw 88a. .. As a result, even if the heat radiating plate 80a vibrates or the heat radiating plate 80a is deformed due to a change in temperature, the heat radiating plate 80a can be stably brought into close contact with the electronic component 31e.
  • a heat radiating plate 80b adapted to the shape of the electronic component 31a or the like is used as the heat radiating plate 80, and the heat radiating plate 80b is used as an electron.
  • the heat generated in the electronic component 31a can be dissipated.
  • the circuit board 23 may be equipped with a plurality of electronic components 31 of the electronic component 31a and the electronic component 31b, such as the circuit board 23a.
  • the height of the circuit board 23a from the surface is different between the electronic component 31a and the electronic component 31b. Therefore, as the heat radiating plate 80, it is assumed that one flat plate-shaped heat radiating plate 80 cannot be brought into close contact with both the electronic component 31a and the electronic component 31b.
  • a heat radiating plate 80c having a shape corresponding to the height of the electronic component 31a from the surface of the circuit board 23a and the height of the electronic component 31b from the surface of the circuit board 23a is provided. Just attach it.
  • the heat radiating plate 80c comes into close contact with each of the electronic component 31a and the electronic component 31b, and the electronic component 31a and the electronic component 31b The heat generated in each of the above can be dissipated.
  • the case where two electronic components 31 of the electronic component 31a and the electronic component 31b are mounted on the circuit board 23a is taken as an example, but the number of the electronic components 31 to dissipate heat is two. Not limited.
  • a heat radiating plate (not shown) corresponding to each height of the electronic component 31 as a heat radiating plate 80 to three or more electronic components 31, the heat generated in the electronic component 31 can be dissipated. It can dissipate heat.
  • the arrangement of the electronic components 31a and 31b and the shape of the heat radiating plate 80c corresponding to the arrangement shown in FIG. 24 are only examples.
  • the heat radiating plate 80 the heat radiating plate 80 fixed to the circuit board holding portion 17 side by the heat radiating plate position fixing portion 90 and the fixing metal fitting 25 is given as an example, but the heat radiating plate 80 is in the tubular housing 3. It may be fixed to the side of the tubular side wall portion 11. As shown in FIG. 25, in this case, the heat radiating plate guide portion 14 is provided on the tubular side wall portion 11.
  • the heat radiating plate guide portion 14 includes a first portion 14a and a second portion 14b.
  • the heat radiating plate 80c may be fixed with the heat radiating plate 80c sandwiched between the first part 14a and the second part 14b. Further, the heat radiating plate 80c may be more firmly fixed to the second facing wall portion 5b by using the heat radiating plate fixing jig 87c and the heat radiating plate fixing screw 88c.
  • the heat dissipation plate 80 described above has a structure of being fixed to the tubular housing 3 by the heat dissipation plate position fixing portion 90 and the fixing metal fitting 25.
  • the heat radiating plate 80 is arranged on the assumption that it comes into contact with the specific electronic component 31.
  • the contact in this case means not only the case where the heat radiating plate 80 is in direct contact with the specific electronic component 31, but also the heat radiating silicon or silicon between the heat radiating plate 80 and the specific electronic component 31. It also includes the case where a heat conductive member such as a heat radiating sheet is interposed.
  • the heat radiating plate 80 cannot be brought into close contact with the electronic component 31 due to, for example, a dimensional tolerance associated with manufacturing. Further, for example, it is assumed that the shape of the electronic component 31 is changed due to a change in the specifications of the electronic component 31, and the heat radiating plate 80 cannot be brought into close contact with the electronic component 31.
  • the heat radiating plate 80 capable of adjusting the circumferential position and the radial position of the heat radiating plate 80 in the tubular housing 3 will be described.
  • the heat radiating plate position fixing portion 90 is composed of a heat radiating plate rotating mechanism 81, a heat radiating plate rotation fixing screw 82, a heat radiating plate slide portion 91, and a heat radiating plate slide portion 92.
  • the heat radiating plate rotation mechanism 81 has a cylindrical shape and a hinge structure.
  • the heat radiating plate rotation mechanism 81 is interposed between the heat radiating plate 80 and the heat radiating plate position fixing portion 90. As shown in FIG. 26, the position of the heat radiating plate 80 in the circumferential direction can be adjusted mainly by the heat radiating plate rotating mechanism 81. After the circumferential position of the heat radiating plate 80 is determined with respect to the fixing metal fitting 25, the circumferential position of the heat radiating plate 80 is fixed by tightening with the heat radiating plate rotation fixing screw 82.
  • one of the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 is slidable with respect to the other. As a result, as shown in FIG. 27, the position of the heat radiating plate 80 can be adjusted mainly in the radial direction. This will be described later.
  • a plurality of heat radiating plates 80a and 80b may be connected as the heat radiating plate 80 of the heat radiating plate rotating mechanism 81.
  • the heat radiating plate rotating mechanism 81a and the heat radiating plate rotating mechanism 81b are provided as the heat radiating plate rotating mechanism 81.
  • the heat radiating plate rotation mechanism 81a is interposed between the heat radiating plate 80a and the heat radiating plate position fixing portion 90.
  • the heat radiating plate rotation mechanism 81b is interposed between the heat radiating plate 80a and the heat radiating plate 80b.
  • the heat radiating plate 80a is fixed by the heat radiating plate rotation fixing screw 82a.
  • the heat radiating plate 80b is fixed by the heat radiating plate rotation fixing screw 82b.
  • the heat radiating plate rotating mechanism 81b allows the heat radiating plate 80b to be bent and arranged at a desired circumferential position with respect to the heat radiating plate 80a.
  • the electronic component to which the heat radiating plate 80 is brought into close contact is not limited to one electronic component, and the heat radiating plate 80 can be brought into close contact with a plurality of electronic components 31 having different heights. Further, depending on the internal structure, it is possible to arrange the heat radiating plate 80 so as to bypass a specific position.
  • the size of the heat radiating plate slide portion 92 is one size larger than the size of the heat radiating plate slide portion 91.
  • the heat radiating plate slide portion 91 is arranged so as to be fitted inside the heat radiating plate slide portion 92.
  • the radial position of the heat radiating plate 80 is set by the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92.
  • a slide fixing screw hole 93 is formed in the heat radiating plate slide portion 91.
  • the slide fixing screw hole 93 is formed as an elongated hole in the heat radiating plate slide portion 91 so as to extend from one end facing the other end to the front of the other end at a distance in the slide direction.
  • the slide fixing screw hole 93 is formed in a size corresponding to the slide fixing screw 95.
  • One or more slide fixing screw holes 94 are formed on the side surface of the heat radiating plate slide portion 92.
  • the lengths of the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 in the sliding direction are adjusted.
  • the slide fixing nut 96 to the slide fixing screw 95 in a state where the lengths of the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 in the slide direction are the desired lengths.
  • the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 are fixed to each other.
  • the radial position and the circumferential position of the heat radiating plate 80e are adjusted by the heat radiating plate slide portions 91a and 92a and the heat radiating plate rotating mechanism 81a.
  • the heat radiating plate 80e is fixed by the heat radiating plate rotation fixing screw 82a, the heat radiating plate fixing jig 87e, and the heat radiating plate fixing screw 88e.
  • the heat radiating plate 80e comes into contact with the surface of the electronic component 31e.
  • the heat generated from the electronic component 31e can be reliably conducted to the heat radiating plate 80e, and the heat can be radiated efficiently.
  • the electronic component 31 when the electronic component 31 is changed from the electronic component 31e to another electronic component (not shown), it is changed by adjusting the radial position and the circumferential position of the heat radiating plate 80e.
  • the heat can be dissipated by contacting the surface of the electronic component.
  • the heat radiating plate 80 is fixed to the side of the tubular side wall portion 11 in the tubular housing 3 in addition to the heat radiating plate 80e fixed to the circuit board holding portion 17 side.
  • the heat radiating plate 80d may be used.
  • a heat radiating plate slit 8 is provided in the tubular side wall portion 11 (outer peripheral portion) of the electronic control device 1.
  • a heat radiating plate guide portion 14 is provided in the heat radiating plate slit 8.
  • the heat radiating plate guide portion 14 is composed of a first portion 14a and a second portion 14b.
  • the heat radiating plate guide portion 14 is fixed to the heat radiating plate slit 8 by the heat radiating plate fixing jig 85 (85a, 85b) and the heat radiating plate fixing screw 86 (86a, 86b).
  • the first part 14a is fixed to the heat radiating plate slit 8 by the heat radiating plate fixing jig 85a and the heat radiating plate fixing screw 86a.
  • the second part 14b is fixed to the heat radiating plate slit 8 by the heat radiating plate fixing jig 85b and the heat radiating plate fixing screw 86b.
  • the heat radiating plate 80d is fixed by sandwiching the heat radiating plate 80d between the first part 14a and the second part 14b.
  • the heat radiating plate position fixing portion 90d having the heat radiating plate rotating mechanism 81d and the heat radiating plate slide portions 91d and 92d as the heat radiating plate position fixing portion 90, the radial position and the circumferential position of the heat radiating plate 80d can be adjusted. Can be done.
  • the heat radiating plate 80d is fixed by the heat radiating plate rotation fixing screw 82d, the heat radiating plate fixing jig 87d, and the heat radiating plate fixing screw 88d. As a result, the heat radiating plate 80d can be brought into contact with the surface of the electronic component 31a to dissipate heat.
  • the heat radiating plate slide portions 91f, 92f (91, 92) and the heat radiating plate rotating mechanisms 81e, 81f, 81g allow the heat radiating plate 80f and the heat radiating plate 80g to have their respective radial positions and circumferential positions. It will be adjusted.
  • the heat radiating plate 80f is fixed by the heat radiating plate rotation fixing screws 82e, and the heat radiating plate 80g is further fixed by the heat radiating plate rotation fixing screws 82f, 82g.
  • the heat radiating plate 80f comes into contact with the surface of the electronic component 31b.
  • the heat radiating plate 80g comes into contact with the surface of the electronic component 31a.
  • the heat generated from the electronic component 31a can be reliably conducted to the heat radiating plate 80g, and the heat generated from the electronic component 31b can be reliably conducted to the heat radiating plate 80f, so that the heat can be efficiently dissipated. Can be done.
  • the side of the heat radiating plate 80 g may be fixed to the tubular side wall portion 11 of the electronic control device 1.
  • the heat radiating plate 80g is provided with a sandwiched portion 97 sandwiched by the heat radiating plate guide portion 14 via the heat radiating plate rotation mechanism 81h.
  • the sandwiched portion 97 is sandwiched between the first portion 14a and the second portion 14b of the heat radiating plate guide portion 14, and is fixed in the tubular housing 3 by the heat radiating plate rotation fixing screw 82h.
  • the heat radiating plate guide portion 14, the sandwiched portion 97, the heat radiating plate rotation fixing screw 82h, and the like function as the heat radiating plate position fixing portion 90e for fixing the heat radiating plate 80 g.
  • the heat radiating plate slide portions 91 and 92 as shown in FIG. 31 may be used.
  • the electronic control device 1 is mounted by fixing the side of the heat radiating plate 80f to the circuit board holding portion 17 and fixing the side of the heat radiating plate 80g to the tubular side wall portion 11, for example, the rotary drive body 65 (FIG. FIG. It is possible to improve the resistance to vibration from the outside of the device such as (see 13).
  • the tubular housing 3 is filled with a resin or the like (not shown). It may be. By filling the tubular housing 3 with the resin, the circuit board 23 and the like are fixed more firmly, and the resistance to vibration can be improved.
  • slits 7 may be provided in each of the first facing wall portion 5a and the second facing wall portion 5b of the tubular housing 3, and the heat radiating plate may be fitted into the slits. By fitting the heat radiating plate into each of the slits, the resistance to vibration can be further improved.
  • the present invention is effectively used for controlling a rotary drive mechanism having a rotary drive unit such as a motor or a tire.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

This electronic control device (1) is attached to a drive shaft (67) that rotates. A drive shaft insertion portion (15) is disposed inside a cylindrical chassis (3). The drive shaft insertion portion (15) has an insertion body portion (16) and a circuit board holding portion (17). The circuit board holding portion (17) is disposed at a distance from the insertion body portion (16) in the radial direction. A space is provided between the circuit board holding portion (17) and the insertion body portion (16). Inside the cylindrical chassis (3), a plurality of circuit boards (23) are held at the circuit board holding portion (17) and radially disposed toward a cylindrical side wall portion (11). The plurality of circuit boards (23) are each mounted with electronic components (31). A wiring cable (35) and a metal bus bar (41) for electrically connecting between the circuit boards (23) are disposed on the drive shaft insertion portion (15) side.

Description

電子制御装置および回転駆動機構Electronic control device and rotary drive mechanism
　本開示は、電子制御装置および回転駆動機構に関する。 The present disclosure relates to an electronic control device and a rotary drive mechanism.
　従来、船舶、航空機、自動車、電車等の車両のモーター、工業用機械には、動力を発生させて、機器の動作を制御する電子制御装置が備えられている。このような電子制御装置には、電源回路、駆動回路、制御回路、保護回路および通信回路等の電子回路が構成されている。電子回路は、複数の回路基板に分けて形成されている。 Conventionally, motors and industrial machines for vehicles such as ships, aircraft, automobiles, and trains are equipped with electronic control devices that generate power to control the operation of the equipment. Such an electronic control device includes electronic circuits such as a power supply circuit, a drive circuit, a control circuit, a protection circuit, and a communication circuit. The electronic circuit is divided into a plurality of circuit boards.
　電子制御装置は、複数の回路基板を電気的に接続する配線構造と、電子制御装置と外部とを電気的に接続する配線構造とを有している。また、電子制御装置は、複数の回路基板から発生する熱を放熱させる放熱構造を有している。この種の電子制御装置を開示した特許文献の一例として、特許文献１がある。 The electronic control device has a wiring structure that electrically connects a plurality of circuit boards and a wiring structure that electrically connects the electronic control device and the outside. Further, the electronic control device has a heat dissipation structure that dissipates heat generated from a plurality of circuit boards. Patent Document 1 is an example of a patent document that discloses this type of electronic control device.
特許第４２３１６２６号公報Japanese Patent No. 4231626
　電子制御装置の配線構造および放熱構造は、外部環境から汚れまたは塵埃等の異物等が浸入してくるのを避けるために、密閉された筐体内に収容されることになる。筐体内のスペースは限られており、配線構造等には、小型化、省スペース化が求められている。特に、駆動回路では、数十～数百Ａ程度の大きな電力を必要とされるため、配線構造を成す配線導体が有する抵抗またはインダクタンス成分によって電力損失が発生しやすく、また、電力損失に伴って発生する熱が籠りやすい。このため、電子制御装置では、配線導体を短くすることが求められている。 The wiring structure and heat dissipation structure of the electronic control device will be housed in a sealed housing in order to prevent foreign matter such as dirt or dust from entering from the external environment. The space inside the housing is limited, and the wiring structure and the like are required to be miniaturized and space-saving. In particular, since a drive circuit requires a large amount of power of about several tens to several hundreds of A, power loss is likely to occur due to the resistance or inductance component of the wiring conductor forming the wiring structure, and the power loss is accompanied by the power loss. The generated heat is easy to collect. For this reason, electronic control devices are required to shorten wiring conductors.
　本開示は、上記問題点を解決するためになされたものであり、一つの目的は、配線導体を短くすることができる電子制御装置を提供することであり、他の目的は、そのような電子制御装置を適用した回転駆動機構を提供することである。 The present disclosure has been made to solve the above problems, one purpose is to provide an electronic control device capable of shortening a wiring conductor, and the other purpose is to provide such an electron. It is to provide a rotary drive mechanism to which a control device is applied.
　本開示に係る電子制御装置は、筒状筺体と駆動軸挿通部と回路基板部と配線部とを備えている。筒状筺体は、一方向に筒状に延在する。駆動軸挿通部は、筒状筺体内に配置され、筒状筺体を一方向に貫通するように配置される駆動軸を挿通させる。回路基板部は、駆動軸挿通部に保持され、駆動軸挿通部から放射状にそれぞれ配置された第１回路基板および第２回路基板を含む。配線部は、第１回路基板と第２回路基板とを電気的に接続する配線導体を含む。配線導体は、駆動軸挿通部が位置する側に配置されている。 The electronic control device according to the present disclosure includes a tubular housing, a drive shaft insertion portion, a circuit board portion, and a wiring portion. The tubular housing extends in a tubular shape in one direction. The drive shaft insertion portion is arranged inside the tubular housing, and inserts a drive shaft arranged so as to penetrate the tubular housing in one direction. The circuit board portion includes a first circuit board and a second circuit board that are held by the drive shaft insertion portion and are arranged radially from the drive shaft insertion portion, respectively. The wiring unit includes a wiring conductor that electrically connects the first circuit board and the second circuit board. The wiring conductor is arranged on the side where the drive shaft insertion portion is located.
　本開示に係る回転駆動機構は、上記電子制御装置を備えた回転駆動機構であって、駆動部と電子制御装置と機器間配線部とを備えている。駆動部は、駆動軸としての回転軸を有し、回転軸を回転させる。電子制御装置は、駆動軸挿通部に回転軸が挿通されて、駆動部と併設するように配置されている。機器間配線部は、駆動部と電子制御装置とを電気的に接続する。 The rotary drive mechanism according to the present disclosure is a rotary drive mechanism provided with the above-mentioned electronic control device, and includes a drive unit, an electronic control device, and an inter-device wiring unit. The drive unit has a rotation shaft as a drive shaft, and rotates the rotation shaft. The electronic control device is arranged so that the rotating shaft is inserted through the drive shaft insertion portion and is adjacent to the drive portion. The inter-device wiring unit electrically connects the drive unit and the electronic control device.
　本開示に係る電子制御装置によれば、駆動軸挿通部から放射状にそれぞれ配置された第１回路基板と第２回路基板とを電気的に接続する配線導体が、駆動軸挿通部が位置する側に配置されている。これにより、配線導体の長さを短くすることができる。 According to the electronic control device according to the present disclosure, the wiring conductor that electrically connects the first circuit board and the second circuit board, which are arranged radially from the drive shaft insertion portion, is on the side where the drive shaft insertion portion is located. It is located in. As a result, the length of the wiring conductor can be shortened.
　本開示に係る回転駆動機構によれば、上記電子制御装置を備えていることで、配線導体を短くすることができ、配線導体による電力損失を低減することができる。また、電力損失に伴う熱の発生を抑えることができる。 According to the rotation drive mechanism according to the present disclosure, the wiring conductor can be shortened and the power loss due to the wiring conductor can be reduced by providing the electronic control device. In addition, it is possible to suppress the generation of heat due to power loss.
実施の形態１に係る電子制御装置を示す斜視図である。It is a perspective view which shows the electronic control apparatus which concerns on Embodiment 1. FIG. 同実施の形態において、電子制御装置の外観を示す斜視図である。In the same embodiment, it is a perspective view which shows the appearance of the electronic control device. 同実施の形態において、電子制御装置の構造を説明するための分解斜視図である。In the same embodiment, it is an exploded perspective view for demonstrating the structure of an electronic control device. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の一例を示す上面図である。In the same embodiment, it is a top view which shows an example of the internal structure of the tubular housing of an electronic control device. 同実施の形態において、電子制御装置における回路基板の取り付け構造を説明するための第１の分解斜視図である。In the same embodiment, it is 1st exploded perspective view for demonstrating the mounting structure of the circuit board in the electronic control apparatus. 同実施の形態において、電子制御装置における回路基板の取り付け構造を説明するための第２の分解斜視図である。In the same embodiment, it is the 2nd exploded perspective view for demonstrating the mounting structure of the circuit board in the electronic control apparatus. 同実施の形態において、電子制御装置における回路基板の取り付け構造を説明するための第３の分解斜視図である。In the same embodiment, it is the 3rd exploded perspective view for demonstrating the mounting structure of the circuit board in the electronic control apparatus. 同実施の形態において、回路基板の形状の一例を示す斜視図である。It is a perspective view which shows an example of the shape of the circuit board in the same embodiment. 同実施の形態において、回路基板の形状の他の例を示す斜視図である。It is a perspective view which shows another example of the shape of a circuit board in the same embodiment. 同実施の形態において、金属バスバーの第１例を示す平面図である。It is a top view which shows the 1st example of the metal bus bar in the same embodiment. 同実施の形態において、金属バスバーの第２例を示す平面図である。It is a top view which shows the 2nd example of the metal bus bar in the same embodiment. 同実施の形態において、金属バスバーの第３例を示す平面図である。It is a top view which shows the 3rd example of the metal bus bar in the same embodiment. 同実施の形態において、電子制御装置を適用した回転駆動機構を示す斜視図である。It is a perspective view which shows the rotation drive mechanism which applied the electronic control device in the same embodiment. 比較例に係る回転駆動機構を示す部分斜視図である。It is a partial perspective view which shows the rotation drive mechanism which concerns on a comparative example. 比較例に係る電子制御装置の筺体内の構造を示す部分側面図である。It is a partial side view which shows the structure in the housing of the electronic control device which concerns on a comparative example. 同実施の形態において、変形例に係る電子制御装置における回路基板の取り付け構造の一例を示す分解斜視図である。In the same embodiment, it is an exploded perspective view which shows an example of the attachment structure of the circuit board in the electronic control apparatus which concerns on the modification. 同実施の形態において、他の変形例に係る電子制御装置の筒状筺体の内部の構造の一例を示す上面図である。In the same embodiment, it is a top view which shows an example of the internal structure of the tubular housing of the electronic control device which concerns on another modification. 同実施の形態において、他の変形例に係る電子制御装置の筒状側壁部の構造を示す部分拡大斜視図である。In the same embodiment, it is a partially enlarged perspective view which shows the structure of the tubular side wall part of the electronic control device which concerns on another modification. 同実施の形態において、さらに他の変形例に係る電子制御装置の構成を模式的に示す斜視図である。In the same embodiment, it is a perspective view which shows typically the structure of the electronic control apparatus which concerns on still another modification. 実施の形態２に係る電子制御装置の構成を模式的に示す斜視図である。It is a perspective view which shows typically the structure of the electronic control apparatus which concerns on Embodiment 2. FIG. 同実施の形態において、一の放熱板の取り付け構造を説明するための斜視図である。It is a perspective view for demonstrating the attachment structure of one heat radiating plate in the same embodiment. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の第１例を示す上面図である。In the same embodiment, it is a top view which shows the 1st example of the internal structure of the tubular housing of an electronic control device. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の第２例を示す上面図である。In the same embodiment, it is a top view which shows the 2nd example of the structure inside the tubular housing of an electronic control device. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の第３例を示す上面図である。In the same embodiment, it is a top view which shows the 3rd example of the structure inside the tubular housing of an electronic control device. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の第４例を示す上面図である。In the same embodiment, it is a top view which shows the 4th example of the structure inside the tubular housing of an electronic control device. 同実施の形態において、他の放熱板の取り付け構造を説明するための第１の斜視図である。It is a 1st perspective view for demonstrating the attachment structure of another heat radiating plate in the same embodiment. 同実施の形態において、他の放熱板の取り付け構造を説明するための第２の斜視図である。It is a 2nd perspective view for demonstrating the attachment structure of another heat radiating plate in the same embodiment. 同実施の形態において、さらに他の放熱板の取り付け構造を説明するための斜視図である。It is a perspective view for demonstrating the attachment structure of another heat radiating plate in the same embodiment. 同実施の形態において、放熱板の径方向位置を調整する構造を説明するための第１の斜視図である。It is a 1st perspective view for demonstrating the structure which adjusts the radial position of a heat radiating plate in the same embodiment. 同実施の形態において、放熱板の径方向位置を調整する構造を説明するための第２の斜視図である。It is a 2nd perspective view for demonstrating the structure which adjusts the radial position of a heat radiating plate in the same embodiment. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の第５例を示す上面図である。In the same embodiment, it is a top view which shows the 5th example of the structure inside the tubular housing of an electronic control device. 同実施の形態において、電子制御装置の筒状側壁部の構造を示す部分拡大斜視図である。In the same embodiment, it is a partially enlarged perspective view which shows the structure of the tubular side wall part of an electronic control device. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の第６例を示す上面図である。In the same embodiment, it is a top view which shows the sixth example of the structure inside the tubular housing of an electronic control device. 同実施の形態において、電子制御装置の筒状筺体の内部の構造の第７例を示す上面図である。In the same embodiment, it is a top view which shows the 7th example of the structure inside the tubular housing of an electronic control device.
　実施の形態１．
　実施の形態１に係る電子制御装置の一例と、その電子制御装置を適用した回転駆動機構の一例とについて説明する。 Embodiment 1.
An example of the electronic control device according to the first embodiment and an example of the rotation drive mechanism to which the electronic control device is applied will be described.
　図１に示すように、電子制御装置１は、たとえば、回転する駆動軸６７に取り付けられる。電子制御装置１は、たとえば、その回転駆動を制御する機能を有する。電子制御装置１は、一方向に筒状に延在する筒状筺体３を有し、その筒状筺体３の内部に、制御機能を含む回路基板等（図示せず）が配置されている。 As shown in FIG. 1, the electronic control device 1 is attached to, for example, a rotating drive shaft 67. The electronic control device 1 has, for example, a function of controlling the rotation drive thereof. The electronic control device 1 has a tubular housing 3 extending in a tubular shape in one direction, and a circuit board or the like (not shown) including a control function is arranged inside the tubular housing 3.
　電子制御装置１について、詳しく説明する。図２および図３に示すように、筒状筺体３は、筒状側壁部１１、第１対向壁部５ａおよび第２対向壁部５ｂを有する。第１対向壁部５ａと第２対向壁部５ｂとは、筒状側壁部１１が延在する方向に間隔を隔てて配置されている。第１対向壁部５ａは、蓋としての機能を有し、筒状側壁部１１の一方側を塞いでいる。第２対向壁部５ｂは、底部として筒状側壁部１１の他方側を塞いでいる。第１対向壁部５ａには、金属バスバー取り出し口４９が設けられている。その金属バスバー取り出し口４９から、電子制御装置１と外部とを電気的に接続する金属バスバー４３が突出している。 The electronic control device 1 will be described in detail. As shown in FIGS. 2 and 3, the tubular housing 3 has a tubular side wall portion 11, a first facing wall portion 5a, and a second facing wall portion 5b. The first facing wall portion 5a and the second facing wall portion 5b are arranged at intervals in the direction in which the tubular side wall portion 11 extends. The first facing wall portion 5a has a function as a lid and closes one side of the tubular side wall portion 11. The second facing wall portion 5b closes the other side of the tubular side wall portion 11 as a bottom portion. A metal bus bar outlet 49 is provided on the first facing wall portion 5a. A metal bus bar 43 that electrically connects the electronic control device 1 and the outside protrudes from the metal bus bar outlet 49.
　図３および図４に示すように、筒状筺体３内には、駆動軸６７（図１参照）が挿通される駆動軸挿通部１５が配置されている。駆動軸６７は、筒状筺体３を貫通する態様で、駆動軸挿通部１５に挿通されている。駆動軸挿通部１５は、挿通本体部１６と回路基板保持部１７とを有する二重構造とされる。挿通本体部１６に駆動軸６７（図１参照）が挿通される。回路基板保持部１７は、挿通本体部１６と径方向に距離を隔てて配置されている。回路基板保持部１７と挿通本体部１６の間に空間が設けられている。 As shown in FIGS. 3 and 4, a drive shaft insertion portion 15 through which the drive shaft 67 (see FIG. 1) is inserted is arranged in the tubular housing 3. The drive shaft 67 is inserted into the drive shaft insertion portion 15 in a manner of penetrating the tubular housing 3. The drive shaft insertion portion 15 has a double structure including an insertion main body portion 16 and a circuit board holding portion 17. The drive shaft 67 (see FIG. 1) is inserted into the insertion main body 16. The circuit board holding portion 17 is arranged at a distance in the radial direction from the insertion main body portion 16. A space is provided between the circuit board holding portion 17 and the insertion main body portion 16.
　筒状筺体３内の空間は、仕切り壁２１によって仕切られている。ここでは、仕切り壁２１ａと仕切り壁２１ｂとによって仕切られている。仕切り壁２１ａ、２１ｂによって仕切られた空間に、複数の回路基板２３が配置されている。複数の回路基板２３は、回路基板保持部１７に保持されて、筒状側壁部１１へ向かって放射状に配置されている。複数の回路基板２３のそれぞれに電子部品３１が実装されている。回路基板２３間を電気的に接続する配線導体（配線ケーブル３５、金属バスバー４１）は、駆動軸挿通部１５の側に配置されている。配線導体については、後述する。 The space inside the tubular housing 3 is partitioned by a partition wall 21. Here, it is partitioned by a partition wall 21a and a partition wall 21b. A plurality of circuit boards 23 are arranged in the space partitioned by the partition walls 21a and 21b. The plurality of circuit boards 23 are held by the circuit board holding portion 17 and arranged radially toward the tubular side wall portion 11. Electronic components 31 are mounted on each of the plurality of circuit boards 23. The wiring conductors (wiring cable 35, metal bus bar 41) that electrically connect the circuit boards 23 are arranged on the drive shaft insertion portion 15. The wiring conductor will be described later.
　複数の回路基板２３には、たとえば、電源回路基板、駆動回路基板、制御回路基板、保護回路基板および通信回路基板等が含まれる。電源回路基板は、電力源から電力の供給を受けて、回路基板に必要な電圧に設定された電力を機器へ供給する機能を有する。駆動回路基板は、モーター等の動力部を駆動する機能を有する。制御回路基板は、駆動回路の動作を制御する機能を有する。保護回路基板は、異常時に機器の破損を防ぎ、安全を確保する機能を有する。通信回路基板は、外部との通信を行う機能を有する。 The plurality of circuit boards 23 include, for example, a power supply circuit board, a drive circuit board, a control circuit board, a protection circuit board, a communication circuit board, and the like. The power supply circuit board has a function of receiving electric power from a power source and supplying electric power set to a voltage required for the circuit board to an apparatus. The drive circuit board has a function of driving a power unit such as a motor. The control circuit board has a function of controlling the operation of the drive circuit. The protection circuit board has a function of preventing damage to the device in the event of an abnormality and ensuring safety. The communication circuit board has a function of communicating with the outside.
　複数の回路基板２３として、たとえば、回路基板２３ａ、回路基板２３ｂ、回路基板２３ｃ、回路基板２３ｄおよび回路基板２３ｅの５つの回路基板２３が配置されている。なお、回路基板２３ａ～２３ｅは、上記の電源回路基板等の特定の回路基板を意図するものではない。 As the plurality of circuit boards 23, for example, five circuit boards 23 such as a circuit board 23a, a circuit board 23b, a circuit board 23c, a circuit board 23d, and a circuit board 23e are arranged. The circuit boards 23a to 23e are not intended to be a specific circuit board such as the power supply circuit board described above.
　回路基板２３ａでは、一方の主面側に、電子部品３１ａおよび電子部品３１ｂが実装されている。回路基板２３ｂでは、一方の主面側に電子部品３１ｃが実装され、他方の主面側に電子部品３１ｄが実装されている。回路基板２３ｃでは、一方の主面側に電子部品３１ｅが実装され、他方の主面側に電子部品３１ｆが実装されている。回路基板２３ｄでは、一方の主面側に電子部品３１ｇが実装されている。回路基板２３ｅでは、一方の主面側に電気部品３１ｈおよび電子部品３１ｉが実装されている。 In the circuit board 23a, the electronic component 31a and the electronic component 31b are mounted on one main surface side. In the circuit board 23b, the electronic component 31c is mounted on one main surface side, and the electronic component 31d is mounted on the other main surface side. In the circuit board 23c, the electronic component 31e is mounted on one main surface side, and the electronic component 31f is mounted on the other main surface side. In the circuit board 23d, the electronic component 31g is mounted on one main surface side. In the circuit board 23e, the electric component 31h and the electronic component 31i are mounted on one main surface side.
　電子部品３１には、たとえば、ＩＣ（Integrated　Circuit）、マイコン、チップ等のように、比較的背の低い電子部品から、たとえば、コイル、コンデンサ、センサー、コネクタ等のように、比較的背の高い電子部品まで存在する。回路基板２３における回路基板保持部１７の側では、相対的に背の低い電子部品３１が実装されている。一方、回路基板２３における筒状側壁部１１の側では、相対的に背の高い電子部品３１が実装されている。なお、電子部品３１ａ～３１ｉについても、特定の電子部品を意図するものではない。 Electronic components 31 include relatively short electronic components such as ICs (Integrated Circuits), microcomputers, chips, etc., and relatively tall electronic components such as coils, capacitors, sensors, connectors, etc. There are even electronic components. A relatively short electronic component 31 is mounted on the side of the circuit board holding portion 17 of the circuit board 23. On the other hand, on the side of the tubular side wall portion 11 of the circuit board 23, a relatively tall electronic component 31 is mounted. The electronic components 31a to 31i are not intended to be specific electronic components.
　次に、回路基板２３の取り付け構造について説明する。図５に示すように、回路基板保持部１７には、一方向に沿ってスリット状の間隙部１９が形成されている。回路基板２３には、固定用金具２５が取り付けられている。固定用金具２５は、間隙部１９に沿って嵌め込まれる。固定用金具２５は、回路基板保持部１７を外側と内側との双方から挟み込む鍔部２５ａが形成されている。 Next, the mounting structure of the circuit board 23 will be described. As shown in FIG. 5, the circuit board holding portion 17 is formed with a slit-shaped gap portion 19 along one direction. A fixing metal fitting 25 is attached to the circuit board 23. The fixing metal fitting 25 is fitted along the gap 19. The fixing metal fitting 25 is formed with a flange portion 25a that sandwiches the circuit board holding portion 17 from both the outside and the inside.
　図５および図６に示すように、固定用金具２５が間隙部１９に嵌め込まれると、回路基板２３の下端部が、第１受け入れ部としての溝状のスリット７に嵌め込まれることになる。回路基板２３がスリット７に嵌め込まれた状態で、基板固定用金具２７に基板固定用ねじ２９を挿通し締結することで、回路基板２３が、底面となる第２対向壁部５ｂに固定される。こうして、回路基板２３のそれぞれは、間隙部１９とスリット７との双方に嵌め込まれて、筒状筺体３に固定されている。 As shown in FIGS. 5 and 6, when the fixing metal fitting 25 is fitted into the gap portion 19, the lower end portion of the circuit board 23 is fitted into the groove-shaped slit 7 as the first receiving portion. With the circuit board 23 fitted in the slit 7, the circuit board 23 is fixed to the second facing wall portion 5b, which is the bottom surface, by inserting and fastening the board fixing screw 29 through the board fixing metal fitting 27. .. In this way, each of the circuit boards 23 is fitted into both the gap portion 19 and the slit 7, and is fixed to the tubular housing 3.
　次に、回路基板２３間を電気的に接続する配線導体について説明する。筒状筺体３に固定されている複数の回路基板２３間を電気的に接続する配線導体として、たとえば、配線ケーブル３５と金属バスバー４１とがある。 Next, a wiring conductor that electrically connects the circuit boards 23 will be described. As wiring conductors that electrically connect a plurality of circuit boards 23 fixed to the tubular housing 3, for example, there are a wiring cable 35 and a metal bus bar 41.
　まず、配線ケーブル３５について説明する。配線ケーブル３５（一端側または他端側）は、回路基板２３に設けられたコネクタ３３に接続されている。配線ケーブル３５は、たとえば、挿通本体部１６と回路基板保持部１７との間の空間（空間Ｒ）に配置される。回路基板保持部１７には、挿通本体部１６の側の空間と筒状側壁部の側の空間とを連通する配線ケーブル用穴３７が形成されている。配線ケーブル３５は、配線ケーブル用穴３７を通して空間Ｒに配置される。 First, the wiring cable 35 will be described. The wiring cable 35 (one end side or the other end side) is connected to a connector 33 provided on the circuit board 23. The wiring cable 35 is arranged, for example, in the space (space R) between the insertion main body 16 and the circuit board holding portion 17. The circuit board holding portion 17 is formed with a hole 37 for a wiring cable that communicates the space on the side of the insertion main body 16 and the space on the side of the tubular side wall. The wiring cable 35 is arranged in the space R through the wiring cable hole 37.
　図４に示すように、たとえば、回路基板２３ａと回路基板２３ｅとが、配線ケーブル３５ａによって電気的に接続される。また、回路基板２３ａと回路基板２３ｄとが、配線ケーブル３５ｂによって電気的に接続される。なお、配線ケーブル３５は、必ずしも空間Ｒに配置させる必要はなく、たとえば、回路基板２３ｄと回路基板２３ｃとを電気的に接続する配線ケーブル３５ｂのように、回路基板保持部１７の外周面に沿って配置させてもよい。 As shown in FIG. 4, for example, the circuit board 23a and the circuit board 23e are electrically connected by the wiring cable 35a. Further, the circuit board 23a and the circuit board 23d are electrically connected by the wiring cable 35b. The wiring cable 35 does not necessarily have to be arranged in the space R. For example, like the wiring cable 35b that electrically connects the circuit board 23d and the circuit board 23c, the wiring cable 35 is along the outer peripheral surface of the circuit board holding portion 17. May be arranged.
　次に、金属バスバー４１について説明する。金属バスバー４１は、回路基板保持部１７の外周面に沿って配置される。金属バスバー４１（一端側または他端側）は、回路基板２３に設けられた金属バスバー取り付け端子４５に、固定ネジ４７によって固定されている。図４に示すように、たとえば、隣り合う回路基板２３ａと回路基板２３ｂとが、金属バスバー４１ａによって電気的に接続されている。また、隣り合う回路基板２３ｂと回路基板２３ｃとが、金属バスバー４１ｂによって電気的に接続されている。 Next, the metal bus bar 41 will be described. The metal bus bar 41 is arranged along the outer peripheral surface of the circuit board holding portion 17. The metal bus bar 41 (one end side or the other end side) is fixed to the metal bus bar mounting terminal 45 provided on the circuit board 23 by a fixing screw 47. As shown in FIG. 4, for example, the adjacent circuit boards 23a and the circuit boards 23b are electrically connected by a metal bus bar 41a. Further, the adjacent circuit boards 23b and the circuit boards 23c are electrically connected by the metal bus bar 41b.
　金属バスバー４１としては、必ずしも隣り合う回路基板２３同士を電気的に接続させる必要はない。図７に示すように、たとえば、隣り合う回路基板２３ｇと回路基板２３ｈとを電気的に接続する金属バスバー４１ｃの他に、たとえば、回路基板２３ｇを挟み込むように位置する回路基板２３ｆと回路基板２３ｈとを電気的に接続するように、金属バスバー４１ｄを配置してもよい。 As the metal bus bar 41, it is not always necessary to electrically connect the adjacent circuit boards 23 to each other. As shown in FIG. 7, for example, in addition to the metal bus bar 41c that electrically connects the adjacent circuit boards 23g and the circuit boards 23h, for example, the circuit boards 23f and the circuit boards 23h located so as to sandwich the circuit boards 23g. The metal bus bar 41d may be arranged so as to electrically connect the and.
　この場合には、図８または図９に示すように、回路基板２３ｆと回路基板２３ｈとの間に位置する回路基板２３ｇには、金属バスバー４１ｄを通すための切欠き部２４を設けておくことが好ましい。なお、この切欠き部２４は、回路基板２３ｆと回路基板２３ｈとを電気的に接続する配線ケーブル３５を通すのにも利用することができる。 In this case, as shown in FIG. 8 or 9, the circuit board 23g located between the circuit board 23f and the circuit board 23h is provided with a notch 24 for passing the metal bus bar 41d. Is preferable. The cutout portion 24 can also be used to pass a wiring cable 35 that electrically connects the circuit board 23f and the circuit board 23h.
　金属バスバー４１は、回路基板保持部１７の外周面に沿って配置させることになる。このため、金属バスバー４１は、電気的に接続される２つの回路基板２３の配置関係（円周角度）に対応した円弧状部分を備えている。２つの回路基板２３が比較的接近している場合には、図１０に示すように、円弧状部分の長さが比較的短い金属バスバー４１が適用される。一方、２つの回路基板２３が離れている場合には、図１１に示すように、円弧状部分の長さが比較的長い金属バスバー４１が適用される。また、２つの回路基板２３がかなり接近している場合には、図１２に示すように、直線状の金属バスバー４１を適用してもよい。 The metal bus bar 41 will be arranged along the outer peripheral surface of the circuit board holding portion 17. Therefore, the metal bus bar 41 is provided with an arc-shaped portion corresponding to the arrangement relationship (circumferential angle) of the two electrically connected circuit boards 23. When the two circuit boards 23 are relatively close to each other, as shown in FIG. 10, a metal bus bar 41 having a relatively short arcuate portion is applied. On the other hand, when the two circuit boards 23 are separated from each other, as shown in FIG. 11, a metal bus bar 41 having a relatively long arcuate portion is applied. Further, when the two circuit boards 23 are fairly close to each other, a linear metal bus bar 41 may be applied as shown in FIG.
　金属バスバー４１の端部を金属バスバー取り付け端子４５に固定するために、端部には、固定ネジ４７が挿通されるネジ穴４２が形成されている。固定ネジ４７を締結する際に、上方（第１対向壁部５ａが配置される側）から固定ネジ４７を容易に締結しやすいように、金属バスバー４１は、ネジ穴４２が上方に臨む向きに配置されている。また、ネジ穴４２は、金属バスバー取り付け端子４５に対する金属バスバー４１の位置ずれを吸収できるように、開口断面積として、固定ネジ４７よりも大きい断面積をもって形成されている。ここでは、ネジ穴４２は、開口形状として、たとえば、楕円形状を有する。 In order to fix the end of the metal bus bar 41 to the metal bus bar mounting terminal 45, a screw hole 42 through which the fixing screw 47 is inserted is formed at the end. When fastening the fixing screw 47, the metal bus bar 41 is oriented so that the screw hole 42 faces upward so that the fixing screw 47 can be easily fastened from above (the side on which the first facing wall portion 5a is arranged). Have been placed. Further, the screw hole 42 is formed with a cross-sectional area larger than that of the fixing screw 47 as an opening cross-sectional area so that the misalignment of the metal bus bar 41 with respect to the metal bus bar mounting terminal 45 can be absorbed. Here, the screw hole 42 has, for example, an elliptical shape as the opening shape.
　次に、上述した電子制御装置１を適用した回転駆動機構の一例について説明する。図１３に示すように、回転駆動機構６０は、モーター６１、ジェネレーター６３、駆動軸６７、電力源７１、電子制御装置１および回転駆動体６５を備えている。モーター６１、ジェネレーター６３および電子制御装置１は、駆動軸６７に取り付けられている。回転駆動体６５は、回転駆動軸６の端部に取り付けられている。 Next, an example of a rotation drive mechanism to which the above-mentioned electronic control device 1 is applied will be described. As shown in FIG. 13, the rotation drive mechanism 60 includes a motor 61, a generator 63, a drive shaft 67, a power source 71, an electronic control device 1, and a rotation drive body 65. The motor 61, the generator 63, and the electronic control device 1 are attached to the drive shaft 67. The rotary drive body 65 is attached to an end portion of the rotary drive shaft 6.
　モーター６１の回転駆動力によって、駆動軸６７が回転することで、回転駆動体６５が回転運動をする。ジェネレーター６３は、駆動軸６７に回転によって発電を行う。電子制御装置１は、モーター６１およびジェネレーター６３のそれぞれと、配線ケーブル６９ａによって互いに電気的に接続されている。モーター６１等を含む回転駆動機構６０の動作が、電子制御装置１によって制御される。 The drive shaft 67 is rotated by the rotational drive force of the motor 61, so that the rotary drive body 65 rotates. The generator 63 generates electricity by rotating the drive shaft 67. The electronic control device 1 is electrically connected to each of the motor 61 and the generator 63 by a wiring cable 69a. The operation of the rotary drive mechanism 60 including the motor 61 and the like is controlled by the electronic control device 1.
　電子制御装置１は、電力源７１と配線ケーブル６９ｂによって電気的に接続されている。電子制御装置１等の電力は、電力源７１から供給される。電力源７１として、たとえば、蓄電池等が使用される。実施の形態１に係る電子制御装置１と回転駆動機構６０は上記のように構成される。 The electronic control device 1 is electrically connected to the power source 71 by a wiring cable 69b. The electric power of the electronic control device 1 and the like is supplied from the electric power source 71. As the power source 71, for example, a storage battery or the like is used. The electronic control device 1 and the rotation drive mechanism 60 according to the first embodiment are configured as described above.
　上述した電子制御装置１等のメリットについて、比較例に係る電子制御装置と比較して説明する。図１４に、比較例に係る電子制御装置１０１を適用した回転駆動機構１６０を示す。図１４に示すように、比較例に係る電子制御装置１０１では、筺体１０３は、ほぼ直方体（六面体）の形状を有している。このため、電子制御装置１０１は、モーター６１およびジェネレーター６３とは離れた位置に配置されている。電子制御装置１０１は、モーター６１およびジェネレーター６３のそれぞれとは、配線ケーブル１６９ａによって電気的に接続されている。電子制御装置１０１は、電力源７１とは、配線ケーブル１６９ｂによって電気的に接続されている。 The merits of the above-mentioned electronic control device 1 and the like will be described in comparison with the electronic control device according to the comparative example. FIG. 14 shows a rotation drive mechanism 160 to which the electronic control device 101 according to the comparative example is applied. As shown in FIG. 14, in the electronic control device 101 according to the comparative example, the housing 103 has a substantially rectangular parallelepiped (hexahedron) shape. Therefore, the electronic control device 101 is arranged at a position away from the motor 61 and the generator 63. The electronic control device 101 is electrically connected to each of the motor 61 and the generator 63 by a wiring cable 169a. The electronic control device 101 is electrically connected to the power source 71 by a wiring cable 169b.
　図１５に示すように、電子制御装置１０１の筺体１０３内には、複数の回路基板１２３として、たとえば、回路基板１２３ａ、回路基板１２３ｂおよび回路基板１２３ｃが配置されている。回路基板１２３ａには、電子部品１３１ａおよび電子部品１３１ｂが実装されている。回路基板１２３ｂには、電子部品１３１ｃおよび電子部品１３１ｄが実装されている。回路基板１２３ｃには、電子部品１３１ｅおよび電子部品１３１ｆが実装されている。 As shown in FIG. 15, for example, a circuit board 123a, a circuit board 123b, and a circuit board 123c are arranged as a plurality of circuit boards 123 in the housing 103 of the electronic control device 101. An electronic component 131a and an electronic component 131b are mounted on the circuit board 123a. An electronic component 131c and an electronic component 131d are mounted on the circuit board 123b. The electronic component 131e and the electronic component 131f are mounted on the circuit board 123c.
　回路基板１２３ａと回路基板１２３ｂとは、たとえば、金属バスバー１４１ｂによって電気的に接続されている。回路基板１２３ａと回路基板１２３ｃとは、たとえば、金属バスバー１４１ａによって電気的に接続されている。回路基板１２３ｂと回路基板１２３ｃとは、たとえば、金属バスバー１４１ｃによって電気的に接続されている。 The circuit board 123a and the circuit board 123b are electrically connected by, for example, a metal bus bar 141b. The circuit board 123a and the circuit board 123c are electrically connected by, for example, a metal bus bar 141a. The circuit board 123b and the circuit board 123c are electrically connected by, for example, a metal bus bar 141c.
　回路基板１２３ａと回路基板１２３ｂとは、電子部品１３１ｂおよび電子部品１３１ｃのそれぞれの高さを考慮して互いに干渉しない間隔Ｄ１に保持される。したがって、金属バスバー１４１ｂは、この間隔Ｄ１に基づく長さに設定される。回路基板１２３ｂと回路基板１２３ｃとは、電子部品１３１ｄおよび電子部品１３１ｅのそれぞれの高さを考慮して互いに干渉しない間隔Ｄ２に保持される。したがって、金属バスバー１４１ｃは、この間隔Ｄ２に基づく長さに設定される。さらに、金属バスバー１４１ａは、間隔Ｄ１と間隔Ｄ２とを合わせた長さに設定される。 The circuit board 123a and the circuit board 123b are held at a distance D1 that does not interfere with each other in consideration of the heights of the electronic component 131b and the electronic component 131c. Therefore, the metal bus bar 141b is set to a length based on this interval D1. The circuit board 123b and the circuit board 123c are held at a distance D2 that does not interfere with each other in consideration of the heights of the electronic component 131d and the electronic component 131e. Therefore, the metal bus bar 141c is set to a length based on this interval D2. Further, the metal bus bar 141a is set to a total length of the interval D1 and the interval D2.
　このように、金属バスバー１４１ａ～１４１ｃの長さとして、電子部品１３０の高さを考慮した回路基板１２３間の間隔に基づいた長さに設定される。このため、金属バスバー１４１ａ～１４１ｃの長さを短くするには限界がある。したがって、金属バスバー１４１ａ～１４１ｃが有する抵抗およびインダクタンスに起因する電力損失を低減するには限界がある。 As described above, the length of the metal bus bars 141a to 141c is set to a length based on the distance between the circuit boards 123 in consideration of the height of the electronic component 130. Therefore, there is a limit to shortening the length of the metal bus bars 141a to 141c. Therefore, there is a limit to reducing the power loss due to the resistance and inductance of the metal bus bars 141a to 141c.
　比較例に対して、実施の形態１に係る電子制御装置１を備えた回転駆動機構６０では、たとえば、図４、図６、図７等に示されるように、複数の回路基板２３のそれぞれは、回路基板保持部１７に保持されて、回路基板保持部１７から筒状側壁部１１へ向かって放射状に配置されている。 In contrast to the comparative example, in the rotation drive mechanism 60 provided with the electronic control device 1 according to the first embodiment, for example, as shown in FIGS. 4, 6, 7, and the like, each of the plurality of circuit boards 23 is , It is held by the circuit board holding portion 17, and is arranged radially from the circuit board holding portion 17 toward the tubular side wall portion 11.
　放射状に配置される複数の回路基板２３間を電気的に接続する配線部材として、金属バスバー４１と配線ケーブル３５とは、複数の回路基板２３が互いに接近している回路基板保持部１７の側に配置されている。これにより、比較例と比べて、金属バスバー４１等のそれぞれの長さを短くすることができる。その結果、比較例と比べて、金属バスバー４１等が有する抵抗またはインダクタンスに起因する電力損失を低減することができ、また、電力損失に伴う発熱を抑制することができる。 The metal bus bar 41 and the wiring cable 35 are provided on the side of the circuit board holding portion 17 in which the plurality of circuit boards 23 are close to each other as wiring members for electrically connecting the plurality of circuit boards 23 arranged radially. Have been placed. As a result, the length of each of the metal bus bars 41 and the like can be shortened as compared with the comparative example. As a result, as compared with the comparative example, the power loss due to the resistance or inductance of the metal bus bar 41 or the like can be reduced, and the heat generation due to the power loss can be suppressed.
　さらに、上述した回転駆動機構６０では、モーター６１およびジェネレーター６３とともに、駆動軸６７に電子制御装置１が取り付けられている。これにより、比較例と比べて、電子制御装置１とモーター６１とを電気的に接続する配線ケーブル６９ａの長さと、電子制御装置１とジェネレーター６３とを電気的に接続する配線ケーブル６９ａの長さとを、短くすることができる。 Further, in the rotation drive mechanism 60 described above, the electronic control device 1 is attached to the drive shaft 67 together with the motor 61 and the generator 63. As a result, as compared with the comparative example, the length of the wiring cable 69a that electrically connects the electronic control device 1 and the motor 61 and the length of the wiring cable 69a that electrically connects the electronic control device 1 and the generator 63. Can be shortened.
　（変形例）
　回転駆動機構６０では、モーター６１等には機器を動作に伴って様々な制動または振動が伝わることになる。このため、電子制御装置１の筒状筺体３も十分な強度をもって回転駆動軸に固定されることが要求される。また、筒状筺体３内の回路基板２３等についても、振動等に対する耐久性が求められる。 (Modification example)
In the rotation drive mechanism 60, various brakings or vibrations are transmitted to the motor 61 and the like as the device operates. Therefore, the tubular housing 3 of the electronic control device 1 is also required to be fixed to the rotary drive shaft with sufficient strength. Further, the circuit board 23 and the like in the tubular housing 3 are also required to have durability against vibration and the like.
　上述した電子制御装置１では、回路基板２３を、回路基板保持部１７の間隙部１９に保持させるとともに、第２対向壁部５ｂに設けたスリット７に挿入して固定する場合について説明した。回路基板２３を筒状筺体３内に固定する手法としては、これに限られない。 In the electronic control device 1 described above, a case where the circuit board 23 is held in the gap portion 19 of the circuit board holding portion 17 and inserted into the slit 7 provided in the second facing wall portion 5b to be fixed has been described. The method of fixing the circuit board 23 in the tubular housing 3 is not limited to this.
　図１６に示すように、第１受け入れ部としては、溝状のスリット７の他に、たとえば、第２対向壁部５ｂにガイド部９を形成し、そのガイド部９に回路基板２３を固定するようにしてもよい。さらに、図１７および図１８に示すように、筒状筺体３における筒状側壁部１１に、第２受け入れ部としてのガイド部１３を形成し、そのガイド部１３に回路基板２３を固定するようにしてもよい。これにより、回路基板２３をより強固に筒状筺体３内に固定することができる。 As shown in FIG. 16, as the first receiving portion, in addition to the groove-shaped slit 7, for example, a guide portion 9 is formed in the second facing wall portion 5b, and the circuit board 23 is fixed to the guide portion 9. You may do so. Further, as shown in FIGS. 17 and 18, a guide portion 13 as a second receiving portion is formed on the tubular side wall portion 11 of the tubular housing body 3, and the circuit board 23 is fixed to the guide portion 13. You may. As a result, the circuit board 23 can be more firmly fixed in the tubular housing 3.
　また、回路基板２３等を固定するとともに放熱性を高めるために、筒状筺体３内に樹脂等充填するようにしてもよい。さらに、筒状筺体３の内部または第２対向壁部５ｂ等に冷却水または空気等を流す放熱機構を設けるようにしてもよい。図１９に示すように、たとえば、筒状筺体３の下部に、冷却水放熱面７７を設けるようにしてもよい。この場合には、電子制御装置１に、冷却水入口７５と冷却水出口７６とが設けられる。冷却水入口７５から流入した冷却水は、冷却水放熱面７７を通過する間に電子制御装置１内において発生した熱と熱交換されて、電子制御装置１の内部が冷却されることになる。熱交換された冷却水は、冷却水出口７６から電子制御装置１の外部に排出される。さらに、発生した熱を放出するための放熱板８０（図２０参照）を設けるようにしてもよい。放熱板８０については、実施の形態２において詳しく説明する。 Further, in order to fix the circuit board 23 and the like and improve heat dissipation, the tubular housing 3 may be filled with resin or the like. Further, a heat radiating mechanism for flowing cooling water, air or the like may be provided inside the tubular housing 3 or inside the second facing wall portion 5b or the like. As shown in FIG. 19, for example, the cooling water heat radiating surface 77 may be provided at the lower part of the tubular housing 3. In this case, the electronic control device 1 is provided with a cooling water inlet 75 and a cooling water outlet 76. The cooling water flowing in from the cooling water inlet 75 exchanges heat with the heat generated in the electronic control device 1 while passing through the cooling water heat dissipation surface 77, and the inside of the electronic control device 1 is cooled. The heat-exchanged cooling water is discharged to the outside of the electronic control device 1 from the cooling water outlet 76. Further, a heat radiating plate 80 (see FIG. 20) for releasing the generated heat may be provided. The heat radiating plate 80 will be described in detail in the second embodiment.
　実施の形態２．
　実施の形態２に係る電子制御装置について説明する。ここでは、電子制御装置の内部において発生する熱を放熱する構造について、より具体的に説明する。図４等に示されているように、電子制御装置１内に配置された回路基板２３には、複数の電子部品３１が実装されている。これらの電子部品３１は、電子制御装置１の動作に伴って発熱する。電子制御装置１を安定に動作させるには、発生した熱を外部に放熱させる必要がある。 Embodiment 2.
The electronic control device according to the second embodiment will be described. Here, the structure for dissipating heat generated inside the electronic control device will be described more specifically. As shown in FIG. 4 and the like, a plurality of electronic components 31 are mounted on the circuit board 23 arranged in the electronic control device 1. These electronic components 31 generate heat as the electronic control device 1 operates. In order to operate the electronic control device 1 stably, it is necessary to dissipate the generated heat to the outside.
　図２０に示すように、効率よく放熱させるには、冷却水放熱面７７の放熱面に、放熱板８０を安定に取り付ける必要がある。このとき、配線ケーブル３５および金属バスバー４１（図２２等参照）のそれぞれの配置を妨げることなく、かつ、電子部品３１（図２２等参照）にできるだけ近づけて、放熱板８０を配置する必要がある。 As shown in FIG. 20, in order to dissipate heat efficiently, it is necessary to stably attach the heat radiating plate 80 to the heat radiating surface of the cooling water heat radiating surface 77. At this time, it is necessary to arrange the heat radiating plate 80 without hindering the arrangement of the wiring cable 35 and the metal bus bar 41 (see FIG. 22 etc.) and as close as possible to the electronic component 31 (see FIG. 22 etc.). ..
　図２１に示すように、放熱板８０は、固定用金具２５に取り付けられている。この取り付け構造は、回路基板２３が固定用金具２５に取り付けられている構造と同様である。固定用金具２５が、回路基板保持部１７の間隙部１９（図５および図６参照）に嵌め込まれることで、放熱板８０は筒状筺体３（第２対向壁部５ｂ）に固定される。 As shown in FIG. 21, the heat radiating plate 80 is attached to the fixing metal fitting 25. This mounting structure is the same as the structure in which the circuit board 23 is mounted on the fixing bracket 25. The heat radiating plate 80 is fixed to the tubular housing 3 (second facing wall portion 5b) by fitting the fixing metal fitting 25 into the gap portion 19 (see FIGS. 5 and 6) of the circuit board holding portion 17.
　放熱板８０は、放熱板位置固定部９０によって固定用金具２５に接続されている。放熱板位置固定部９０の一端側は、たとえば、放熱板８０の上端部分に接続されている。このため、放熱板位置固定部９０より下方では、放熱板８０と固定用金具２５との間に隙間が形成されることになる。この隙間に、金属バスバー４１等を配置させて、最短距離で回路基板２３（図６等参照）間を電気的に接続することができる。 The heat radiating plate 80 is connected to the fixing metal fitting 25 by the heat radiating plate position fixing portion 90. One end side of the heat radiating plate position fixing portion 90 is connected to, for example, the upper end portion of the heat radiating plate 80. Therefore, a gap is formed between the heat radiating plate 80 and the fixing metal fitting 25 below the heat radiating plate position fixing portion 90. A metal bus bar 41 or the like can be arranged in this gap to electrically connect the circuit boards 23 (see FIG. 6 or the like) at the shortest distance.
　なお、放熱板位置固定部９０の一端側が、放熱板８０の上端部分に接続されている場合を例に挙げたが、放熱板位置固定部９０の一端側が、放熱板８０の下端部分に接続されていてもよい。また、放熱板位置固定部９０の一端側が、放熱板８０の上端部分と下端部分との間の中間部分に接続されていてもよい。 Although the case where one end side of the heat radiating plate position fixing portion 90 is connected to the upper end portion of the heat radiating plate 80 is taken as an example, one end side of the heat radiating plate position fixing portion 90 is connected to the lower end portion of the heat radiating plate 80. You may have. Further, one end side of the heat radiating plate position fixing portion 90 may be connected to an intermediate portion between the upper end portion and the lower end portion of the heat radiating plate 80.
　次に、放熱板８０の取り付け方法について説明する。まず、図５および図６に示す回路基板２３を取り付ける方法と同様に、放熱板８０が接続された固定用金具２５を、回路基板保持部１７に設けられた間隙部１９に嵌め込む。次に、図２２に示すように、たとえば、放熱板８０の一つとしての放熱板８０ａを、電子部品３１の一つとしての電子部品３１ｅに密着させる。このようにして、放熱板８０が取り付けられる。 Next, the method of attaching the heat radiating plate 80 will be described. First, in the same manner as in the method of attaching the circuit board 23 shown in FIGS. 5 and 6, the fixing metal fitting 25 to which the heat radiating plate 80 is connected is fitted into the gap portion 19 provided in the circuit board holding portion 17. Next, as shown in FIG. 22, for example, the heat radiating plate 80a as one of the heat radiating plates 80 is brought into close contact with the electronic component 31e as one of the electronic components 31. In this way, the heat radiating plate 80 is attached.
　放熱板８０は、熱伝導率の高い金属等から形成されている。図２０に示すように、放熱板８０の一部（下端部）は、冷却水放熱面７７にも接触している。ここで、この場合の接触とは、放熱板８０の一部（下端部）が冷却水放熱面７７に直接的に接触している場合の他に、放熱板８０の一部（下端部）と冷却水放熱面７７との間に、放熱用シリコンまたは放熱シート等の熱伝導性部材を介在させている場合も含む。電子部品３１ｅから発生した熱は、放熱板８０ａから冷却水放熱面７７を経て冷却水に伝導し、電子制御装置１の外部に放熱されることになる。 The heat radiating plate 80 is formed of a metal or the like having high thermal conductivity. As shown in FIG. 20, a part (lower end portion) of the heat radiating plate 80 is also in contact with the cooling water heat radiating surface 77. Here, the contact in this case means not only the case where a part (lower end portion) of the heat radiating plate 80 is in direct contact with the cooling water heat radiating surface 77, but also a part (lower end portion) of the heat radiating plate 80. The case where a heat conductive member such as heat radiating silicon or a heat radiating sheet is interposed between the cooling water radiating surface 77 is also included. The heat generated from the electronic component 31e is conducted from the heat radiating plate 80a to the cooling water through the cooling water heat radiating surface 77, and is radiated to the outside of the electronic control device 1.
　放熱板８０ａは、放熱板位置固定部９０を介して固定用金具２５に取り付けられているとともに、固定治具８７ａおよび固定ねじ８８ａによって筒状筺体３の第２対向壁部５ｂに固定されている。これにより、放熱板８０ａに振動が生じたり、また、温度の変化によって放熱板８０ａに変形が生じたとしても、放熱板８０ａを電子部品３１ｅに安定に密着させることができる。 The heat radiating plate 80a is attached to the fixing metal fitting 25 via the heat radiating plate position fixing portion 90, and is fixed to the second facing wall portion 5b of the tubular housing 3 by the fixing jig 87a and the fixing screw 88a. .. As a result, even if the heat radiating plate 80a vibrates or the heat radiating plate 80a is deformed due to a change in temperature, the heat radiating plate 80a can be stably brought into close contact with the electronic component 31e.
　また、図２３に示すように、放熱させたい電子部品３１が電子部品３１ａである場合には、放熱板８０として電子部品３１ａ等の形状に適応した放熱板８０ｂを用い、その放熱板８０ｂを電子部品３１ａに密着させることで、電子部品３１ａに生じた熱を放熱させることができる。 Further, as shown in FIG. 23, when the electronic component 31 to be radiated is an electronic component 31a, a heat radiating plate 80b adapted to the shape of the electronic component 31a or the like is used as the heat radiating plate 80, and the heat radiating plate 80b is used as an electron. By bringing it into close contact with the component 31a, the heat generated in the electronic component 31a can be dissipated.
　さらに、回路基板２３には、たとえば、回路基板２３ａのように、電子部品３１ａと電子部品３１ｂとの複数の電子部品３１が搭載されている場合がある。電子部品３１ａと電子部品３１ｂとでは、回路基板２３ａの表面からの高さが異なっている。このため、放熱板８０として、１枚の平板状の放熱板８０では、電子部品３１ａと電子部品３１ｂとの双方に密着させることができないことが想定される。 Further, the circuit board 23 may be equipped with a plurality of electronic components 31 of the electronic component 31a and the electronic component 31b, such as the circuit board 23a. The height of the circuit board 23a from the surface is different between the electronic component 31a and the electronic component 31b. Therefore, as the heat radiating plate 80, it is assumed that one flat plate-shaped heat radiating plate 80 cannot be brought into close contact with both the electronic component 31a and the electronic component 31b.
　このような場合には、図２４に示すように、電子部品３１ａの回路基板２３ａの表面からの高さと、電子部品３１ｂの回路基板２３ａの表面からの高さとに対応した形状の放熱板８０ｃを取り付ければよい。電子部品３１の回路基板２３の表面からの高さに対応した形状の放熱板８０ｃを取り付けることで、放熱板８０ｃが電子部品３１ａおよび電子部品３１ｂのそれぞれに密着し、電子部品３１ａおよび電子部品３１ｂのそれぞれに生じた熱を放熱させることができる。 In such a case, as shown in FIG. 24, a heat radiating plate 80c having a shape corresponding to the height of the electronic component 31a from the surface of the circuit board 23a and the height of the electronic component 31b from the surface of the circuit board 23a is provided. Just attach it. By attaching the heat radiating plate 80c having a shape corresponding to the height from the surface of the circuit board 23 of the electronic component 31, the heat radiating plate 80c comes into close contact with each of the electronic component 31a and the electronic component 31b, and the electronic component 31a and the electronic component 31b The heat generated in each of the above can be dissipated.
　なお、図２４では、回路基板２３ａに電子部品３１ａと電子部品３１ｂとの２つの電子部品３１が搭載されている場合を例に挙げたが、放熱させる電子部品３１の個数としては、２つに限られない。たとえば、３つ以上の電子部品３１に対しても、放熱板８０として、電子部品３１のそれぞれの高さに対応した放熱板（図示せず）を取り付けることで、電子部品３１に生じた熱を放熱させることができる。また、図２４に示された、電子部品３１ａ、３１ｂの配置およびその配置に対応した放熱板８０ｃの形状は、一例に過ぎない。 In addition, in FIG. 24, the case where two electronic components 31 of the electronic component 31a and the electronic component 31b are mounted on the circuit board 23a is taken as an example, but the number of the electronic components 31 to dissipate heat is two. Not limited. For example, by attaching a heat radiating plate (not shown) corresponding to each height of the electronic component 31 as a heat radiating plate 80 to three or more electronic components 31, the heat generated in the electronic component 31 can be dissipated. It can dissipate heat. Further, the arrangement of the electronic components 31a and 31b and the shape of the heat radiating plate 80c corresponding to the arrangement shown in FIG. 24 are only examples.
　また、放熱板８０として、放熱板位置固定部９０および固定用金具２５によって、回路基板保持部１７側に固定されている放熱板８０を例に挙げたが、放熱板８０が筒状筺体３における筒状側壁部１１の側に固定されていてもよい。図２５に示すように、この場合には、筒状側壁部１１に放熱板用ガイド部１４を設ける。放熱板用ガイド部１４は、第１部１４ａと第２部１４ｂとを含む。第１部１４ａと第２部１４ｂとの間に放熱板８０ｃを挟み込んだ状態で、放熱板８０ｃを固定すればよい。さらに、放熱板用固定治具８７ｃおよび放熱板用固定ネジ８８ｃを用いて、放熱板８０ｃをより強固に第２対向壁部５ｂに固定するようにしてもよい。 Further, as the heat radiating plate 80, the heat radiating plate 80 fixed to the circuit board holding portion 17 side by the heat radiating plate position fixing portion 90 and the fixing metal fitting 25 is given as an example, but the heat radiating plate 80 is in the tubular housing 3. It may be fixed to the side of the tubular side wall portion 11. As shown in FIG. 25, in this case, the heat radiating plate guide portion 14 is provided on the tubular side wall portion 11. The heat radiating plate guide portion 14 includes a first portion 14a and a second portion 14b. The heat radiating plate 80c may be fixed with the heat radiating plate 80c sandwiched between the first part 14a and the second part 14b. Further, the heat radiating plate 80c may be more firmly fixed to the second facing wall portion 5b by using the heat radiating plate fixing jig 87c and the heat radiating plate fixing screw 88c.
　上述した放熱板８０は、放熱板位置固定部９０および固定用金具２５によって筒状筺体３に固定する構造とされる。この場合には、放熱板８０は、特定の電子部品３１に接触させることを前提として配置されることになる。ここで、この場合の接触とは、放熱板８０が特定の電子部品３１に直接的に接触している場合の他に、放熱板８０と特定の電子部品３１との間に、放熱用シリコンまたは放熱シート等の熱伝導性部材を介在させている場合も含む。一方、電子部品３１には、たとえば、製造に伴う寸法公差等により、放熱板８０を電子部品３１に密着させることができない場合が想定される。また、たとえば、電子部品３１の仕様変更等により、電子部品３１の形状が変更されてしまい、放熱板８０を電子部品３１に密着させることができない場合も想定される。 The heat dissipation plate 80 described above has a structure of being fixed to the tubular housing 3 by the heat dissipation plate position fixing portion 90 and the fixing metal fitting 25. In this case, the heat radiating plate 80 is arranged on the assumption that it comes into contact with the specific electronic component 31. Here, the contact in this case means not only the case where the heat radiating plate 80 is in direct contact with the specific electronic component 31, but also the heat radiating silicon or silicon between the heat radiating plate 80 and the specific electronic component 31. It also includes the case where a heat conductive member such as a heat radiating sheet is interposed. On the other hand, it is assumed that the heat radiating plate 80 cannot be brought into close contact with the electronic component 31 due to, for example, a dimensional tolerance associated with manufacturing. Further, for example, it is assumed that the shape of the electronic component 31 is changed due to a change in the specifications of the electronic component 31, and the heat radiating plate 80 cannot be brought into close contact with the electronic component 31.
　そのような場合を想定して、筒状筺体３内における放熱板８０の周方向位置と径方向位置とを調整することが可能な放熱板８０について説明する。図２６および図２７に示すように、放熱板位置固定部９０は、放熱板回転機構８１、放熱板回転固定ネジ８２、放熱板スライド部９１および放熱板スライド部９２から構成される。 Assuming such a case, the heat radiating plate 80 capable of adjusting the circumferential position and the radial position of the heat radiating plate 80 in the tubular housing 3 will be described. As shown in FIGS. 26 and 27, the heat radiating plate position fixing portion 90 is composed of a heat radiating plate rotating mechanism 81, a heat radiating plate rotation fixing screw 82, a heat radiating plate slide portion 91, and a heat radiating plate slide portion 92.
　放熱板回転機構８１は、円筒状であり、蝶番構造とされる。放熱板回転機構８１は、放熱板８０と放熱板位置固定部９０との間に介在する。図２６に示すように、放熱板回転機構８１によって、放熱板８０の主として周方向位置を調整することができる。固定用金具２５に対して、放熱板８０の周方向位置が決定された後に、放熱板回転固定ネジ８２で締め付けることで、放熱板８０の周方向位置が固定される。 The heat radiating plate rotation mechanism 81 has a cylindrical shape and a hinge structure. The heat radiating plate rotation mechanism 81 is interposed between the heat radiating plate 80 and the heat radiating plate position fixing portion 90. As shown in FIG. 26, the position of the heat radiating plate 80 in the circumferential direction can be adjusted mainly by the heat radiating plate rotating mechanism 81. After the circumferential position of the heat radiating plate 80 is determined with respect to the fixing metal fitting 25, the circumferential position of the heat radiating plate 80 is fixed by tightening with the heat radiating plate rotation fixing screw 82.
　また、放熱板スライド部９１および放熱板スライド部９２は、一方が他方に対してスライド可能とされる。これにより、図２７に示すように、放熱板８０の主として径方向位置を調整することができる。これについては、後述する。 Further, one of the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 is slidable with respect to the other. As a result, as shown in FIG. 27, the position of the heat radiating plate 80 can be adjusted mainly in the radial direction. This will be described later.
　さらに、図２８に示すように、放熱板回転機構８１の放熱板８０として、複数の放熱板８０ａ、８０ｂを接続してもよい。この場合には、放熱板回転機構８１として、放熱板回転機構８１ａと放熱板回転機構８１ｂとが設けられる。放熱板回転機構８１ａは、放熱板８０ａと放熱板位置固定部９０との間に介在する。放熱板回転機構８１ｂは、放熱板８０ａと放熱板８０ｂとの間に介在する。放熱板８０ａは放熱板回転固定ネジ８２ａによって固定される。放熱板８０ｂは放熱板回転固定ネジ８２ｂによって固定される。 Further, as shown in FIG. 28, a plurality of heat radiating plates 80a and 80b may be connected as the heat radiating plate 80 of the heat radiating plate rotating mechanism 81. In this case, the heat radiating plate rotating mechanism 81a and the heat radiating plate rotating mechanism 81b are provided as the heat radiating plate rotating mechanism 81. The heat radiating plate rotation mechanism 81a is interposed between the heat radiating plate 80a and the heat radiating plate position fixing portion 90. The heat radiating plate rotation mechanism 81b is interposed between the heat radiating plate 80a and the heat radiating plate 80b. The heat radiating plate 80a is fixed by the heat radiating plate rotation fixing screw 82a. The heat radiating plate 80b is fixed by the heat radiating plate rotation fixing screw 82b.
　放熱板回転機構８１ｂによって、放熱板８０ａに対して所望の周方向位置に放熱板８０ｂを折り曲げて配置することができる。これにより、放熱板８０を密着させる電子部品としては一つの電子部品に限られず、高さの異なる複数の電子部品３１に、放熱板８０を密着させることができる。また、内部の構造によっては、特定の位置を迂回させるように放熱板８０を配置することも可能である。 The heat radiating plate rotating mechanism 81b allows the heat radiating plate 80b to be bent and arranged at a desired circumferential position with respect to the heat radiating plate 80a. As a result, the electronic component to which the heat radiating plate 80 is brought into close contact is not limited to one electronic component, and the heat radiating plate 80 can be brought into close contact with a plurality of electronic components 31 having different heights. Further, depending on the internal structure, it is possible to arrange the heat radiating plate 80 so as to bypass a specific position.
　放熱板スライド部９１および放熱板スライド部９２の構造について説明する。図２９および図３０に示すように、放熱板スライド部９２のサイズは、放熱板スライド部９１のサイズよりも一回り大きい。放熱板スライド部９１は、放熱板スライド部９２の内側に嵌め込まれるように配置される。放熱板スライド部９１および放熱板スライド部９２によって、放熱板８０の径方向位置が設定される。 The structure of the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 will be described. As shown in FIGS. 29 and 30, the size of the heat radiating plate slide portion 92 is one size larger than the size of the heat radiating plate slide portion 91. The heat radiating plate slide portion 91 is arranged so as to be fitted inside the heat radiating plate slide portion 92. The radial position of the heat radiating plate 80 is set by the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92.
　図２９に示すように、放熱板スライド部９１には、スライド固定ネジ穴９３が形成されている。スライド固定ネジ穴９３は、放熱板スライド部９１における、スライド方向に距離を隔てて対向する一方の端から他方の端の手前まで延在する態様で、長穴として形成されている。スライド固定ネジ穴９３は、スライド固定ネジ９５に対応するサイズに形成されている。放熱板スライド部９２の側面には、１つ以上のスライド固定ネジ穴９４が形成されている。 As shown in FIG. 29, a slide fixing screw hole 93 is formed in the heat radiating plate slide portion 91. The slide fixing screw hole 93 is formed as an elongated hole in the heat radiating plate slide portion 91 so as to extend from one end facing the other end to the front of the other end at a distance in the slide direction. The slide fixing screw hole 93 is formed in a size corresponding to the slide fixing screw 95. One or more slide fixing screw holes 94 are formed on the side surface of the heat radiating plate slide portion 92.
　放熱板スライド部９１と放熱板スライド部９２とを相対的にスライド動作させることによって、放熱板スライド部９１および放熱板スライド部９２のスライド方向の長さが調整される。図３０に示すように、放熱板スライド部９１および放熱板スライド部９２のスライド方向の長さが、所望の長さになった状態で、スライド固定ネジ９５にスライド固定ナット９６を締め付けることによって、放熱板スライド部９１と放熱板スライド部９２とが互いに固定される。 By relatively sliding the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92, the lengths of the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 in the sliding direction are adjusted. As shown in FIG. 30, by tightening the slide fixing nut 96 to the slide fixing screw 95 in a state where the lengths of the heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 in the slide direction are the desired lengths. The heat radiating plate slide portion 91 and the heat radiating plate slide portion 92 are fixed to each other.
　次に、上述した放熱板位置固定部９０を有する放熱板８０を備えた電子制御装置１の一例について説明する。図３１に示すように、放熱板スライド部９１ａ、９２ａおよび放熱板回転機構８１ａによって、放熱板８０ｅの径方向位置と周方向位置とが調整される。放熱板８０ｅは、放熱板回転固定ネジ８２ａ、放熱板固定治具８７ｅおよび放熱板固定ネジ８８ｅによって固定される。これにより、放熱板８０ｅは電子部品３１ｅの表面に接触する。その結果、電子部品３１ｅから発生する熱を放熱板８０ｅへ確実に伝導させることができ、効率的に放熱させることができる。 Next, an example of the electronic control device 1 provided with the heat radiating plate 80 having the heat radiating plate position fixing portion 90 described above will be described. As shown in FIG. 31, the radial position and the circumferential position of the heat radiating plate 80e are adjusted by the heat radiating plate slide portions 91a and 92a and the heat radiating plate rotating mechanism 81a. The heat radiating plate 80e is fixed by the heat radiating plate rotation fixing screw 82a, the heat radiating plate fixing jig 87e, and the heat radiating plate fixing screw 88e. As a result, the heat radiating plate 80e comes into contact with the surface of the electronic component 31e. As a result, the heat generated from the electronic component 31e can be reliably conducted to the heat radiating plate 80e, and the heat can be radiated efficiently.
　また、電子部品３１として、電子部品３１ｅから他の電子部品（図示せず）に変更されるような場合には、放熱板８０ｅの径方向位置と周方向位置とを調整することで、変更された電子部品の表面に接触させて放熱を行うことができる。 Further, when the electronic component 31 is changed from the electronic component 31e to another electronic component (not shown), it is changed by adjusting the radial position and the circumferential position of the heat radiating plate 80e. The heat can be dissipated by contacting the surface of the electronic component.
　さらに、図３１に示すように、放熱板８０としては、回路基板保持部１７側に固定されている放熱板８０ｅの他に、筒状筺体３における筒状側壁部１１の側に固定されている放熱板８０ｄでもよい。図３２に示すように、電子制御装置１の筒状側壁部１１（外周部分）には、放熱板用スリット８が設けられている。その放熱板用スリット８に放熱板用ガイド部１４が設けられている。 Further, as shown in FIG. 31, the heat radiating plate 80 is fixed to the side of the tubular side wall portion 11 in the tubular housing 3 in addition to the heat radiating plate 80e fixed to the circuit board holding portion 17 side. The heat radiating plate 80d may be used. As shown in FIG. 32, a heat radiating plate slit 8 is provided in the tubular side wall portion 11 (outer peripheral portion) of the electronic control device 1. A heat radiating plate guide portion 14 is provided in the heat radiating plate slit 8.
　放熱板用ガイド部１４は、第１部１４ａと第２部１４ｂとによって構成される。放熱板用ガイド部１４は、放熱板固定治具８５（８５ａ、８５ｂ）と放熱板固定ネジ８６（８６ａ、８６ｂ）によって、放熱板用スリット８に固定される。第１部１４ａは、放熱板固定治具８５ａと放熱板固定ネジ８６ａによって、放熱板用スリット８に固定される。第２部１４ｂは、放熱板固定治具８５ｂと放熱板固定ネジ８６ｂによって、放熱板用スリット８に固定される。第１部１４ａと第２部１４ｂとの間に放熱板８０ｄが挟み込まれることで、放熱板８０ｄが固定される。 The heat radiating plate guide portion 14 is composed of a first portion 14a and a second portion 14b. The heat radiating plate guide portion 14 is fixed to the heat radiating plate slit 8 by the heat radiating plate fixing jig 85 (85a, 85b) and the heat radiating plate fixing screw 86 (86a, 86b). The first part 14a is fixed to the heat radiating plate slit 8 by the heat radiating plate fixing jig 85a and the heat radiating plate fixing screw 86a. The second part 14b is fixed to the heat radiating plate slit 8 by the heat radiating plate fixing jig 85b and the heat radiating plate fixing screw 86b. The heat radiating plate 80d is fixed by sandwiching the heat radiating plate 80d between the first part 14a and the second part 14b.
　放熱板位置固定部９０として、放熱板回転機構８１ｄと放熱板スライド部９１ｄ、９２ｄを有する放熱板位置固定部９０ｄを設けることで、放熱板８０ｄの径方向位置と周方向位置とを調整することができる。放熱板８０ｄは、放熱板回転固定ネジ８２ｄ、放熱板固定治具８７ｄおよび放熱板固定ネジ８８ｄをによって、固定される。これにより、放熱板８０ｄを電子部品３１ａの表面に接触させて放熱を行うことができる。 By providing the heat radiating plate position fixing portion 90d having the heat radiating plate rotating mechanism 81d and the heat radiating plate slide portions 91d and 92d as the heat radiating plate position fixing portion 90, the radial position and the circumferential position of the heat radiating plate 80d can be adjusted. Can be done. The heat radiating plate 80d is fixed by the heat radiating plate rotation fixing screw 82d, the heat radiating plate fixing jig 87d, and the heat radiating plate fixing screw 88d. As a result, the heat radiating plate 80d can be brought into contact with the surface of the electronic component 31a to dissipate heat.
　放熱板位置固定部９０を有する放熱板８０を備えた電子制御装置１の他の例について説明する。図３３に示すように、放熱板スライド部９１ｆ、９２ｆ（９１、９２）および放熱板回転機構８１ｅ、８１ｆ、８１ｇによって、放熱板８０ｆおよび放熱板８０ｇのそれぞれの径方向位置と周方向位置とが調整される。放熱板８０ｆは放熱板回転固定ネジ８２ｅによって固定され、放熱板８０ｇは、さらに、放熱板回転固定ネジ８２ｆ、８２ｇによって固定される。 Another example of the electronic control device 1 provided with the heat radiating plate 80 having the heat radiating plate position fixing portion 90 will be described. As shown in FIG. 33, the heat radiating plate slide portions 91f, 92f (91, 92) and the heat radiating plate rotating mechanisms 81e, 81f, 81g allow the heat radiating plate 80f and the heat radiating plate 80g to have their respective radial positions and circumferential positions. It will be adjusted. The heat radiating plate 80f is fixed by the heat radiating plate rotation fixing screws 82e, and the heat radiating plate 80g is further fixed by the heat radiating plate rotation fixing screws 82f, 82g.
　これにより、放熱板８０ｆは電子部品３１ｂの表面に接触する。放熱板８０ｇは電子部品３１ａの表面に接触する。その結果、電子部品３１ａから発生する熱を放熱板８０ｇへ確実に伝導させることができるとともに、電子部品３１ｂから発生する熱を放熱板８０ｆへ確実に伝導させることができ、効率的に放熱させることができる。 As a result, the heat radiating plate 80f comes into contact with the surface of the electronic component 31b. The heat radiating plate 80g comes into contact with the surface of the electronic component 31a. As a result, the heat generated from the electronic component 31a can be reliably conducted to the heat radiating plate 80g, and the heat generated from the electronic component 31b can be reliably conducted to the heat radiating plate 80f, so that the heat can be efficiently dissipated. Can be done.
　なお、上述した電子制御装置１において、放熱板８０ｇの側を、電子制御装置１の筒状側壁部１１に固定するようにしてもよい。この場合には、図３４に示すように、放熱板８０ｇに、放熱板回転機構８１ｈを介して、放熱板用ガイド部１４に挟持される被挟持部９７が設けられている。 In the electronic control device 1 described above, the side of the heat radiating plate 80 g may be fixed to the tubular side wall portion 11 of the electronic control device 1. In this case, as shown in FIG. 34, the heat radiating plate 80g is provided with a sandwiched portion 97 sandwiched by the heat radiating plate guide portion 14 via the heat radiating plate rotation mechanism 81h.
　放熱板８０ｇは、被挟持部９７が放熱板用ガイド部１４の第１部１４ａと第２部１４ｂとの間に挟持されるとともに、放熱板回転固定ネジ８２ｈによって筒状筺体３内に固定される。放熱板用ガイド部１４、被挟持部９７および放熱板回転固定ネジ８２ｈ等は、放熱板８０ｇを固定する放熱板位置固定部９０ｅとして機能する。なお、被挟持部９７に替えて、図３１に示されるような放熱板スライド部９１、９２を用いてもよい。 In the heat radiating plate 80g, the sandwiched portion 97 is sandwiched between the first portion 14a and the second portion 14b of the heat radiating plate guide portion 14, and is fixed in the tubular housing 3 by the heat radiating plate rotation fixing screw 82h. To. The heat radiating plate guide portion 14, the sandwiched portion 97, the heat radiating plate rotation fixing screw 82h, and the like function as the heat radiating plate position fixing portion 90e for fixing the heat radiating plate 80 g. Instead of the sandwiched portion 97, the heat radiating plate slide portions 91 and 92 as shown in FIG. 31 may be used.
　放熱板８０ｆの側が回路基板保持部１７に固定されるとともに、放熱板８０ｇの側が筒状側壁部１１に固定されることで、電子制御装置１が搭載される、たとえば、回転駆動体６５（図１３参照）等の機器の外部からの振動に対する耐性を向上させることができる。 The electronic control device 1 is mounted by fixing the side of the heat radiating plate 80f to the circuit board holding portion 17 and fixing the side of the heat radiating plate 80g to the tubular side wall portion 11, for example, the rotary drive body 65 (FIG. FIG. It is possible to improve the resistance to vibration from the outside of the device such as (see 13).
　また、上述した電子制御装置１においても、実施の形態１において説明したように、回路基板２３等の放熱性を高めるために、筒状筺体３内に樹脂等（図示せず）を充填するようにしてもよい。筒状筺体３内に樹脂が充填されることで、回路基板２３等がより強固に固定されることになり、振動に対する耐性も向上させることができる。 Further, also in the above-mentioned electronic control device 1, as described in the first embodiment, in order to improve the heat dissipation of the circuit board 23 and the like, the tubular housing 3 is filled with a resin or the like (not shown). It may be. By filling the tubular housing 3 with the resin, the circuit board 23 and the like are fixed more firmly, and the resistance to vibration can be improved.
　さらに、たとえば、筒状筺体３の第１対向壁部５ａと第２対向壁部５ｂとのそれぞれにスリット７（たとえば、図５参照）を設け、そのスリットに放熱板を嵌め込むようにしてもよい。放熱板がスリットのそれぞれに嵌め込まれることで、振動に対する耐性をさらに向上させることができる。 Further, for example, slits 7 (see, for example, FIG. 5) may be provided in each of the first facing wall portion 5a and the second facing wall portion 5b of the tubular housing 3, and the heat radiating plate may be fitted into the slits. By fitting the heat radiating plate into each of the slits, the resistance to vibration can be further improved.
　なお、実施の形態において説明した電子制御装置および回転駆動機構については、必要に応じて種々組み合わせることが可能である。 It should be noted that the electronic control device and the rotation drive mechanism described in the embodiment can be combined in various ways as needed.
　今回開示された実施の形態は例示であってこれに制限されるものではない。本開示は上記で説明した範囲ではなく、請求の範囲によって示され、請求の範囲と均等の意味および範囲でのすべての変更が含まれることが意図される。 The embodiment disclosed this time is an example and is not limited to this. The present disclosure is expressed by the scope of claims, not the scope described above, and is intended to include all modifications in the meaning and scope equivalent to the scope of claims.
　本発明は、モーターまたはタイヤ等の回転駆動部を有する回転駆動機構の制御に有効に利用される。 The present invention is effectively used for controlling a rotary drive mechanism having a rotary drive unit such as a motor or a tire.
　１　電子制御装置、３　筒状筺体、５ａ　第１対向壁部、５ｂ　第２対向壁部、７　スリット、８　放熱板用スリット、９　ガイド部、１１　筒状側壁部、１３　ガイド部、１４　放熱板用ガイド部、１４ａ　第１部、１４ｂ　第２部、１５　駆動軸挿通部、１６　挿通本体部、１７　回路基板保持部、１９　間隙部、２１、２１ａ、２１ｂ　仕切り壁、２３、２３ａ、２３ｂ、２３ｃ、２３ｄ、２３ｅ、２３ｆ、２３ｇ、２３ｈ　回路基板、２４　切欠き部、２５　固定用金具、２５ａ　鍔部、２７、２７ａ、２７ｂ、２７ｃ、２７ｄ、２７ｅ　基板固定用金具、２９　基板固定用ネジ、３１、３１ａ、３１ｂ、３１ｃ、３１ｃ、３１ｄ、３１ｅ、３１ｆ、３１ｇ、３１ｈ、３１ｉ　電子部品、３３、３３ａ、３３ｂ、３３ｃ、３３ｄ、３３ｅ、３３ｆ　コネクタ、３５、３５ａ、３５ｂ、３５ｃ、３５ｄ、３５ｅ、３５ｆ、　配線ケーブル、３７　配線ケーブル用穴、４１、４１ａ、４１ｂ、４１ｃ、４１ｄ　金属バスバー、４２　ネジ穴、４３、４３ａ、４３ｂ、４３ｃ　外部接続用金属バスバー、４５　金属バスバー取り付け端子、４７　固定ネジ、４９　　金属バスバー取り出し口、６０　回転駆動機構、６１　モーター、６３　ジェネレーター、６５　回転駆動体、６７　回転駆動軸、６９、６９ａ、６９ｂ　配線ケーブル、７１　電力源、７５　冷却水入口、７６　冷却水出口、７７　冷却水放熱面、８０、８０ａ、８０ｂ、８０ｃ、８０ｄ、８０ｅ、８０ｆ、８０ｇ　放熱板、８１、８１ａ、８１ｂ、８１ｃ、８１ｄ、８１ｅ、８１ｆ、８１ｇ、８１ｈ　放熱板回転機構、８２、８２ａ、８２ｂ、８２ｃｃ、８２ｄ、８２ｅ、８２ｆ、８２ｇ、８２ｈ　放熱板回転固定ネジ、８５　側壁用放熱板固定ジグ、８６　側壁用放熱板固定ネジ、８７、８７ａ、８７ｂ、８７ｃ、８７ｄ、８７ｅ　放熱板用固定ジグ、８８、８８ａ、８８ｂ、８８ｃ、８８ｄ、８８ｅ　放熱板用固定ネジ、９０　放熱板位置固定部、９１　放熱板スライド部、９２　放熱板スライド部、９３　スライド固定ネジ穴、９４　スライド固定ネジ穴、９５　スライド固定ネジ、９６　放熱板固定ナット。 1 Electronic control device, 3 Cylindrical housing, 5a 1st facing wall, 5b 2nd facing wall, 7 slits, 8 heat dissipation plate slits, 9 guides, 11 tubular side walls, 13 guides, 14 heat dissipation plates Guide part, 14a 1st part, 14b 2nd part, 15 drive shaft insertion part, 16 insertion body part, 17 circuit board holding part, 19 gap part, 21, 21a, 21b partition wall, 23, 23a, 23b, 23c , 23d, 23e, 23f, 23g, 23h Circuit board, 24 notch, 25 fixing bracket, 25a flange, 27, 27a, 27b, 27c, 27d, 27e substrate fixing bracket, 29 board fixing screw, 31 , 31a, 31b, 31c, 31c, 31d, 31e, 31f, 31g, 31h, 31i Electronic components, 33, 33a, 33b, 33c, 33d, 33e, 33f connectors, 35, 35a, 35b, 35c, 35d, 35e, 35f, wiring cable, 37 wiring cable hole, 41, 41a, 41b, 41c, 41d metal bus bar, 42 screw hole, 43, 43a, 43b, 43c external connection metal bus bar, 45 metal bus bar mounting terminal, 47 fixing screw, 49 metal bus bar outlet, 60 rotation drive mechanism, 61 motor, 63 generator, 65 rotation drive body, 67 rotation drive shaft, 69, 69a, 69b wiring cable, 71 power source, 75 cooling water inlet, 76 cooling water outlet, 77 Cooling water heat dissipation surface, 80, 80a, 80b, 80c, 80d, 80e, 80f, 80g Heat dissipation plate, 81, 81a, 81b, 81c, 81d, 81e, 81f, 81g, 81h Heat dissipation plate rotation mechanism, 82, 82a, 82b , 82cc, 82d, 82e, 82f, 82g, 82h Heat dissipation plate rotation fixing screw, 85 Side heat dissipation plate fixing jig, 86 Side wall heat dissipation plate fixing screw, 87, 87a, 87b, 87c, 87d, 87e Heat dissipation plate fixing jig , 88, 88a, 88b, 88c, 88d, 88e Heat dissipation plate fixing screw, 90 Heat dissipation plate position fixing part, 91 Heat dissipation plate slide part, 92 Heat dissipation plate slide part, 93 Slide fixing screw hole, 94 Slide fixing screw hole, 95 Slide fixing screw, 96 heat dissipation plate fixing nut.

Claims (18)

  1. 　一方向に筒状に延在する筒状筺体と、
    　前記筒状筺体内に配置され、前記筒状筺体を前記一方向に貫通するように配置される駆動軸を挿通させる駆動軸挿通部と、
    　前記駆動軸挿通部に保持され、前記駆動軸挿通部から放射状にそれぞれ配置された第１回路基板および第２回路基板を含む回路基板部と、
    　前記第１回路基板と前記第２回路基板とを電気的に接続する配線導体を含む配線部と
    を備え、
    　前記配線導体は、前記駆動軸挿通部が位置する側に配置された、電子制御装置。     A tubular housing that extends in a tubular shape in one direction,
    A drive shaft insertion portion for inserting a drive shaft that is arranged inside the tubular housing and is arranged so as to penetrate the tubular housing in one direction.
    A circuit board portion including a first circuit board and a second circuit board, which are held by the drive shaft insertion portion and arranged radially from the drive shaft insertion portion, respectively.
    A wiring portion including a wiring conductor for electrically connecting the first circuit board and the second circuit board is provided.
    The wiring conductor is an electronic control device arranged on the side where the drive shaft insertion portion is located.
  2. 　前記駆動軸挿通部は、
    　前記駆動軸が挿通される本体部と、
    　前記本体部と径方向に間隔を隔てられ、前記本体部を周方向から取り囲むように配置されて、前記回路基板部を保持する基板保持部と
    を有する、請求項１記載の電子制御装置。     The drive shaft insertion portion is
    The main body through which the drive shaft is inserted and
    The electronic control device according to claim 1, further comprising a substrate holding portion that is radially spaced from the main body portion, is arranged so as to surround the main body portion from the circumferential direction, and holds the circuit board portion.
  3. 　前記基板保持部には、前記一方向に沿って間隙部が設けられ、
    　前記回路基板部には、前記間隙部に嵌め込まれて前記基板保持部に保持される嵌め込み部が設けられた、請求項２記載の電子制御装置。     The substrate holding portion is provided with a gap portion along the one direction.
    The electronic control device according to claim 2, wherein the circuit board portion is provided with a fitting portion that is fitted in the gap portion and held by the substrate holding portion.
  4. 　前記基板保持部には、前記回路基板部が配置されている側と前記本体部が配置されている側とを連通する連通部が設けられ、
    　前記配線導体は、前記連通部を介して前記本体部と前記基板保持部との間に配置された配線ケーブルを含む、請求項２記載の電子制御装置。     The substrate holding portion is provided with a communication portion that communicates between the side on which the circuit board portion is arranged and the side on which the main body portion is arranged.
    The electronic control device according to claim 2, wherein the wiring conductor includes a wiring cable arranged between the main body portion and the substrate holding portion via the communication portion.
  5. 　前記配線導体は、前記基板保持部に沿って配置された金属バスバーを含む、請求項２記載の電子制御装置。 The electronic control device according to claim 2, wherein the wiring conductor includes a metal bus bar arranged along the substrate holding portion.
  6. 　前記回路基板部は、前記基板保持部に保持され、前記第１回路基板と前記第２回路基板との間に配置された第３回路基板を含み、
    　前記第３回路基板には、前記金属バスバーを通す切欠きが形成された、請求項５記載の電子制御装置。     The circuit board portion includes a third circuit board held by the substrate holding portion and arranged between the first circuit board and the second circuit board.
    The electronic control device according to claim 5, wherein a notch through which the metal bus bar is passed is formed in the third circuit board.
  7. 　前記金属バスバーは、前記第１回路基板に接続される端子を有し、
    　前記第１回路基板には、前記端子が取り付けられる取り付け端子が設けられ、
    　前記端子には、締結部材が挿通される締結穴が設けられ、
    　前記端子は、前記締結部材が前記一方向から前記締結穴に挿通される態様で、前記取り付け端子に取り付けられた、請求項５記載の電子制御装置。     The metal bus bar has terminals connected to the first circuit board.
    The first circuit board is provided with mounting terminals to which the terminals are mounted.
    The terminal is provided with a fastening hole through which the fastening member is inserted.
    The electronic control device according to claim 5, wherein the terminal is attached to the mounting terminal in such a manner that the fastening member is inserted into the fastening hole from the one direction.
  8. 　前記締結穴として、前記締結部材の直径よりも大きいサイズの締結穴が形成された、請求項７記載の電子制御装置。 The electronic control device according to claim 7, wherein a fastening hole having a size larger than the diameter of the fastening member is formed as the fastening hole.
  9. 　前記筒状筺体は、
    　筒状側壁部と
    　前記一方向に間隔を隔てて配置され、前記筒状側壁部の一方側を塞ぐ第１対向壁部および前記筒状側壁部の他方側を塞ぐ第２対向壁部と
    を含む、請求項１記載の電子制御装置。     The tubular housing is
    Includes a first facing wall portion that is arranged at a distance from the tubular side wall portion in one direction and closes one side of the tubular side wall portion, and a second facing wall portion that closes the other side of the tubular side wall portion. , The electronic control device according to claim 1.
  10. 　前記第１対向壁部および前記第２対向壁部のいずれかには、前記第１回路基板を受け入れる第１受け入れ部が形成された、請求項９記載の電子制御装置。 The electronic control device according to claim 9, wherein a first receiving portion for receiving the first circuit board is formed on either the first facing wall portion or the second facing wall portion.
  11. 　前記第１受け入れ部は、溝状である、請求項１０記載の電子制御装置。 The electronic control device according to claim 10, wherein the first receiving portion has a groove shape.
  12. 　前記筒状側壁部には、前記第１回路基板を受け入れる第２受け入れ部が形成された、請求項９記載の電子制御装置。 The electronic control device according to claim 9, wherein a second receiving portion for receiving the first circuit board is formed on the tubular side wall portion.
  13. 　前記回路基板部に接触するように、前記筒状筺体内に配置された放熱板を備えた、請求項１～１２のいずれか１項に記載の電子制御装置。 The electronic control device according to any one of claims 1 to 12, further comprising a heat radiating plate arranged inside the tubular housing so as to come into contact with the circuit board portion.
  14. 　前記放熱板は、前記放熱板における前記駆動軸挿通部が位置している側および前記駆動軸挿通部が位置している側とは反対側の少なくともいずれかの側が固定された、請求項１３記載の電子制御装置。 13. The thirteenth aspect of the present invention, wherein at least one of the side of the heat radiating plate on which the drive shaft insertion portion is located and the side opposite to the side on which the drive shaft insertion portion is located is fixed. Electronic control device.
  15. 　前記放熱板は、
    　第１放熱板と、
    　前記第１放熱板と接続された第２放熱板と
    を含み、
    　前記回路基板部は、
    　前記第１回路基板にそれぞれ実装され、高さが互いに異なる第１電子部品および第２電子部品を含み、
    　前記第１放熱板は、前記第１電子部品に接触し、
    　前記第２放熱板は、前記第２電子部品に接触する、請求項１３または１４に記載の電子制御装置。     The heat radiating plate is
    The first heat dissipation plate and
    Including the first heat radiating plate and the second heat radiating plate connected to the first heat radiating plate,
    The circuit board portion
    The first electronic component and the second electronic component, which are mounted on the first circuit board and have different heights, are included.
    The first heat radiating plate comes into contact with the first electronic component and
    The electronic control device according to claim 13 or 14, wherein the second heat radiating plate comes into contact with the second electronic component.
  16. 　前記筒状筺体内における前記放熱板の周方向位置を調整する放熱板回転機構を備えた、請求項１３～１５のいずれか１項に記載の電子制御装置。 The electronic control device according to any one of claims 13 to 15, further comprising a heat radiating plate rotating mechanism for adjusting the circumferential position of the heat radiating plate in the tubular housing.
  17. 　前記筒状筺体内における前記放熱板の径方向位置を調整する放熱板スライド部を備えた、請求項１３～１６のいずれか１項に記載の電子制御装置。 The electronic control device according to any one of claims 13 to 16, further comprising a heat radiating plate slide portion for adjusting the radial position of the heat radiating plate in the tubular housing.
  18. 　請求項１～１７のいずれか１項に記載の電子制御装置を備えた回転駆動機構であって、
    　前記駆動軸としての回転軸を有し、前記回転軸を回転させる駆動部と、
    　前記駆動軸挿通部に前記回転軸が挿通されて、前記駆動部と併設するように配置された前記電子制御装置と、
    　前記駆動部と前記電子制御装置とを電気的に接続する機器間配線部と
    を備えた、回転駆動機構。     A rotary drive mechanism including the electronic control device according to any one of claims 1 to 17.
    A drive unit having a rotation shaft as the drive shaft and rotating the rotation shaft,
    The electronic control device, in which the rotating shaft is inserted through the drive shaft insertion portion and is arranged so as to be adjacent to the drive shaft.
    A rotary drive mechanism including an inter-device wiring unit that electrically connects the drive unit and the electronic control device.
PCT/JP2020/003404 2019-05-17 2020-01-30 Electronic control device and rotation drive mechanism WO2020235143A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50131062A (en) * 1974-04-05 1975-10-16
JPH11325871A (en) * 1998-05-11 1999-11-26 Dainippon Printing Co Ltd Rotary circuit board supporting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50131062A (en) * 1974-04-05 1975-10-16
JPH11325871A (en) * 1998-05-11 1999-11-26 Dainippon Printing Co Ltd Rotary circuit board supporting device

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