JP7130124B2 - Electronic controller and rotary drive mechanism - Google Patents

Description

The present disclosure relates to electronic controllers and rotary drive mechanisms.

2. Description of the Related Art Conventionally, motors for vehicles such as ships, aircraft, automobiles, and trains, and industrial machines are equipped with electronic control devices that generate power and control the operation of the devices. Electronic circuits such as a power supply circuit, a drive circuit, a control circuit, a protection circuit, and a communication circuit are configured in such an electronic control device. The electronic circuit is divided and formed on a plurality of circuit boards.

The electronic control device has a wiring structure for electrically connecting a plurality of circuit boards and a wiring structure for electrically connecting the electronic control device and the outside. Further, the electronic control device has a heat dissipation structure for dissipating heat generated from a plurality of circuit boards. Patent document 1 is an example of a patent document disclosing this type of electronic control device.

Japanese Patent No. 4231626

The wiring structure and heat dissipation structure of the electronic control device are housed in a sealed housing in order to prevent foreign substances such as dirt and dust from entering from the external environment. The space in the housing is limited, and the wiring structure and the like are required to be small and space-saving. In particular, drive circuits require a large amount of electric power on the order of several tens to several hundreds of amperes. The generated heat tends to be trapped. For this reason, electronic control devices are required to have shorter wiring conductors.

SUMMARY OF THE INVENTION The present disclosure has been made to solve the above problems. An object of the present invention is to provide a rotation drive mechanism to which a control device is applied.

An electronic control device according to the present disclosure includes a cylindrical housing, a drive shaft insertion portion, a circuit board portion, and a wiring portion. The cylindrical housing extends cylindrically in one direction. The drive shaft insertion part is arranged in the cylindrical housing and allows the drive shaft arranged to pass through the cylindrical housing in one direction to pass therethrough. The circuit board portion includes a first circuit board and a second circuit board that are held by the drive shaft insertion portion and arranged radially from the drive shaft insertion portion. The wiring portion includes wiring conductors that electrically connect the first circuit board and the second circuit board. The wiring conductor is arranged on the side where the drive shaft insertion portion is located.

A rotation drive mechanism according to the present disclosure is a rotation drive mechanism including the electronic control device, and includes a drive section, an electronic control device, and an inter-equipment wiring section. The driving section has a rotating shaft as a driving shaft and rotates the rotating shaft. The electronic control device is arranged side by side with the drive section, with the rotary shaft inserted through the drive shaft insertion section. The inter-device wiring section electrically connects the driving section and the electronic control unit.

According to the electronic control device of the present disclosure, the wiring conductors that electrically connect the first circuit board and the second circuit board, which are arranged radially from the drive shaft insertion portion, are located on the side where the drive shaft insertion portion is located. are placed in Thereby, the length of the wiring conductor can be shortened.

According to the rotary drive mechanism according to the present disclosure, since the electronic control device is provided, the wiring conductor can be shortened, and the power loss due to the wiring conductor can be reduced. Also, heat generation associated with power loss can be suppressed.

1 is a perspective view showing an electronic control device according to Embodiment 1; FIG. FIG. 2 is a perspective view showing the appearance of an electronic control unit in the same embodiment; FIG. 2 is an exploded perspective view for explaining the structure of an electronic control unit in the same embodiment; FIG. 4 is a top view showing an example of the internal structure of the cylindrical housing of the electronic control device in the embodiment; FIG. 4 is a first exploded perspective view for explaining a mounting structure of a circuit board in the electronic control device in the same embodiment; FIG. 10 is a second exploded perspective view for explaining the mounting structure of the circuit board in the electronic control device in the same embodiment; FIG. 11 is a third exploded perspective view for explaining the mounting structure of the circuit board in the electronic control device in the same embodiment; FIG. 4 is a perspective view showing an example of the shape of a circuit board in the same embodiment; FIG. 10 is a perspective view showing another example of the shape of the circuit board in the embodiment; FIG. 2 is a plan view showing a first example of a metal bus bar in the same embodiment; FIG. 4 is a plan view showing a second example of a metal bus bar in the same embodiment; FIG. 10 is a plan view showing a third example of the metal bus bar in the same embodiment; FIG. 4 is a perspective view showing a rotary drive mechanism to which an electronic control device is applied in the same embodiment; FIG. 5 is a partial perspective view showing a rotation drive mechanism according to a comparative example; FIG. 5 is a partial side view showing the structure inside the housing of the electronic control unit according to the comparative example; In the same embodiment, it is an exploded perspective view showing an example of a mounting structure of a circuit board in an electronic control device according to a modification. In the same embodiment, it is a top view showing an example of the internal structure of the cylindrical housing of the electronic control device according to another modification. FIG. 11 is a partially enlarged perspective view showing the structure of a cylindrical side wall portion of an electronic control device according to another modification of the same embodiment; FIG. 11 is a perspective view schematically showing the configuration of an electronic control unit according to still another modification of the same embodiment; FIG. 7 is a perspective view schematically showing the configuration of an electronic control device according to Embodiment 2; FIG. 4 is a perspective view for explaining a mounting structure of one heat sink in the same embodiment; FIG. 4 is a top view showing a first example of the internal structure of the cylindrical housing of the electronic control device in the same embodiment; FIG. 4 is a top view showing a second example of the internal structure of the cylindrical housing of the electronic control device in the embodiment; FIG. 10 is a top view showing a third example of the internal structure of the cylindrical housing of the electronic control device in the embodiment; FIG. 10 is a top view showing a fourth example of the internal structure of the cylindrical housing of the electronic control device in the embodiment; FIG. 4 is a first perspective view for explaining another mounting structure of a heat sink in the same embodiment; FIG. 11 is a second perspective view for explaining another mounting structure of a heat sink in the same embodiment; FIG. 11 is a perspective view for explaining still another attachment structure of a heat sink in the same embodiment; FIG. 4 is a first perspective view for explaining a structure for adjusting the radial position of a heat sink in the same embodiment; FIG. 10 is a second perspective view for explaining a structure for adjusting the radial position of the heat sink in the same embodiment. FIG. 11 is a top view showing a fifth example of the internal structure of the cylindrical housing of the electronic control device in the embodiment; FIG. 4 is a partially enlarged perspective view showing the structure of a cylindrical side wall portion of the electronic control device in the embodiment; FIG. 11 is a top view showing a sixth example of the internal structure of the cylindrical housing of the electronic control device in the embodiment; FIG. 20 is a top view showing a seventh example of the internal structure of the cylindrical housing of the electronic control device in the same embodiment;

Embodiment 1.
An example of an electronic control device according to Embodiment 1 and an example of a rotation drive mechanism to which the electronic control device is applied will be described.

As shown in FIG. 1, the electronic control unit 1 is attached to a rotating drive shaft 67, for example. The electronic control unit 1 has, for example, a function of controlling its rotational drive. The electronic control unit 1 has a tubular housing 3 extending in one direction in a cylindrical shape, and a circuit board (not shown) including control functions is arranged inside the tubular housing 3 .

The electronic control unit 1 will be explained in detail. As shown in FIGS. 2 and 3, the cylindrical housing 3 has a cylindrical side wall portion 11, a first opposing wall portion 5a and a second opposing wall portion 5b. The first opposing wall portion 5a and the second opposing wall portion 5b are spaced apart in the direction in which the cylindrical side wall portion 11 extends. The first opposing wall portion 5 a functions as a lid and closes one side of the cylindrical side wall portion 11 . The second opposing wall portion 5b closes the other side of the cylindrical side wall portion 11 as a bottom portion. A metal bus bar outlet 49 is provided in the first opposing wall portion 5a. A metal bus bar 43 that electrically connects the electronic control unit 1 and the outside protrudes from the metal bus bar outlet 49 .

As shown in FIGS. 3 and 4, a drive shaft insertion portion 15 through which a drive shaft 67 (see FIG. 1) is inserted is arranged inside the cylindrical housing 3 . The drive shaft 67 is inserted through the drive shaft insertion portion 15 so as to pass through the cylindrical housing 3 . The drive shaft insertion portion 15 has a double structure including an insertion body portion 16 and a circuit board holding portion 17 . A drive shaft 67 (see FIG. 1) is inserted through the insertion body portion 16 . The circuit board holding portion 17 is arranged radially apart from the insertion body portion 16 . A space is provided between the circuit board holding portion 17 and the insertion body portion 16 .

A space inside the cylindrical housing 3 is partitioned by a partition wall 21 . Here, it is partitioned by a partition wall 21a and a partition wall 21b. A plurality of circuit boards 23 are arranged in a space partitioned by partition walls 21a and 21b. The plurality of circuit boards 23 are held by the circuit board holding portion 17 and arranged radially toward the cylindrical side wall portion 11 . An electronic component 31 is mounted on each of the plurality of circuit boards 23 . Wiring conductors (wiring cable 35 , metal bus bar 41 ) electrically connecting the circuit boards 23 are arranged on the drive shaft insertion portion 15 side. The wiring conductor will be described later.

The plurality of circuit boards 23 includes, for example, a power supply circuit board, a drive circuit board, a control circuit board, a protection circuit board, a communication circuit board, and the like. The power supply circuit board has a function of receiving power from the power source and supplying power set to a voltage required for the circuit board to the device. The drive circuit board has a function of driving a power section such as a motor. The control circuit board has a function of controlling the operation of the drive circuit. The protection circuit board has the function of preventing damage to the device in the event of an abnormality and ensuring safety. The communication circuit board has a function of communicating with the outside.

As the plurality of circuit boards 23, for example, five circuit boards 23 of circuit board 23a, circuit board 23b, circuit board 23c, circuit board 23d and circuit board 23e are arranged. The circuit boards 23a to 23e are not meant to be specific circuit boards such as the power supply circuit board.

Electronic components 31a and 31b are mounted on one main surface of the circuit board 23a. The electronic component 31c is mounted on one main surface of the circuit board 23b, and the electronic component 31d is mounted on the other main surface of the circuit board 23b. The electronic component 31e is mounted on one main surface of the circuit board 23c, and the electronic component 31f is mounted on the other main surface of the circuit board 23c. An electronic component 31g is mounted on one main surface of the circuit board 23d. An electric component 31h and an electronic component 31i are mounted on one main surface of the circuit board 23e.

The electronic components 31 range from relatively low electronic components such as ICs (Integrated Circuits), microcomputers, and chips to relatively tall electronic components such as coils, capacitors, sensors, and connectors. There are even electronic components. A relatively short electronic component 31 is mounted on the circuit board 23 on the side of the circuit board holding portion 17 . On the other hand, on the cylindrical side wall portion 11 side of the circuit board 23, a relatively tall electronic component 31 is mounted. Note that the electronic components 31a to 31i are not intended to be specific electronic components either.

Next, a mounting structure for the circuit board 23 will be described. As shown in FIG. 5, the circuit board holding portion 17 is formed with a slit-shaped gap portion 19 along one direction. A fixing bracket 25 is attached to the circuit board 23 . The fixing metal fitting 25 is fitted along the gap portion 19 . The fixing metal fitting 25 is formed with a collar portion 25a that sandwiches the circuit board holding portion 17 from both the outside and the inside.

As shown in FIGS. 5 and 6, when the fixing bracket 25 is fitted into the gap 19, the lower end of the circuit board 23 is fitted into the groove-shaped slit 7 as the first receiving part. With the circuit board 23 fitted in the slit 7, the circuit board 23 is fixed to the second opposing wall 5b, which is the bottom surface, by inserting the board fixing screw 29 into the board fixing bracket 27 and tightening it. . Thus, each of the circuit boards 23 is fitted into both the gap 19 and the slit 7 and fixed to the tubular housing 3 .

Next, wiring conductors for electrically connecting the circuit boards 23 will be described. Wiring conductors for electrically connecting the plurality of circuit boards 23 fixed to the cylindrical housing 3 include, for example, the wiring cable 35 and the metal bus bar 41 .

First, the wiring cable 35 will be described. A wiring cable 35 (one end side or the other end side) is connected to a connector 33 provided on the circuit board 23 . The wiring cable 35 is arranged, for example, in the space (space R) between the insertion main body portion 16 and the circuit board holding portion 17 . The circuit board holding portion 17 is formed with a wiring cable hole 37 that communicates the space on the insertion main body portion 16 side with the space on the cylindrical side wall portion side. The distribution cable 35 is arranged in the space R through the distribution cable hole 37 .

As shown in FIG. 4, for example, the circuit board 23a and the circuit board 23e are electrically connected by a wiring cable 35a. Also, the circuit board 23a and the circuit board 23d are electrically connected by a wiring cable 35b. The wiring cable 35 does not necessarily have to be arranged in the space R. For example, the wiring cable 35 may be arranged along the outer peripheral surface of the circuit board holding portion 17 like the wiring cable 35b electrically connecting the circuit board 23d and the circuit board 23c. You can also place

Next, the metal busbar 41 will be described. Metal bus bar 41 is arranged along the outer peripheral surface of circuit board holding portion 17 . The metal busbar 41 (one end side or the other end side) is fixed to a metal busbar mounting terminal 45 provided on the circuit board 23 with a fixing screw 47 . As shown in FIG. 4, for example, adjacent circuit boards 23a and 23b are electrically connected by metal bus bars 41a. Adjacent circuit boards 23b and 23c are electrically connected by a metal bus bar 41b.

The metal bus bar 41 does not necessarily have to electrically connect adjacent circuit boards 23 . As shown in FIG. 7, for example, in addition to the metal bus bar 41c electrically connecting the adjacent circuit boards 23g and 23h, for example, the circuit boards 23f and 23h positioned so as to sandwich the circuit board 23g. A metal bus bar 41d may be arranged so as to electrically connect the .

In this case, as shown in FIG. 8 or 9, the circuit board 23g positioned between the circuit board 23f and the circuit board 23h should be provided with a notch 24 for passing the metal bus bar 41d. is preferred. The notch 24 can also be used to pass a wiring cable 35 electrically connecting the circuit board 23f and the circuit board 23h.

The metal bus bar 41 is arranged along the outer peripheral surface of the circuit board holding portion 17 . Therefore, the metal bus bar 41 has an arcuate portion corresponding to the positional relationship (circumference angle) of the two circuit boards 23 electrically connected. When the two circuit boards 23 are relatively close to each other, a metal bus bar 41 having a relatively short arc-shaped portion is applied as shown in FIG. On the other hand, when the two circuit boards 23 are separated from each other, as shown in FIG. 11, a metal bus bar 41 having a relatively long arcuate portion is applied. Also, if the two circuit boards 23 are fairly close together, a straight metal bus bar 41 may be applied as shown in FIG.

In order to fix the ends of the metal busbars 41 to the metal busbar mounting terminals 45, screw holes 42 through which fixing screws 47 are inserted are formed in the ends. When fastening the fixing screw 47, the metal bus bar 41 is oriented so that the screw hole 42 faces upward so that the fixing screw 47 can be easily fastened from above (the side on which the first opposing wall portion 5a is arranged). are placed. Further, the screw holes 42 are formed to have a cross-sectional area larger than that of the fixing screws 47 as an opening cross-sectional area so as to absorb misalignment of the metal busbars 41 with respect to the metal busbar mounting terminals 45 . Here, screw hole 42 has, for example, an elliptical shape as an opening shape.

Next, an example of a rotation drive mechanism to which the electronic control device 1 described above is applied will be described. As shown in FIG. 13 , the rotary drive mechanism 60 includes a motor 61 , a generator 63 , a drive shaft 67 , a power source 71 , an electronic control unit 1 and a rotary drive body 65 . Motor 61 , generator 63 and electronic control unit 1 are attached to drive shaft 67 . The rotary drive body 65 is attached to the end of the rotary drive shaft 6 .

The rotational drive force of the motor 61 rotates the drive shaft 67, so that the rotary driver 65 rotates. The generator 63 generates power by rotating the drive shaft 67 . The electronic control unit 1 is electrically connected to each of the motor 61 and the generator 63 by wiring cables 69a. The electronic control unit 1 controls the operation of the rotation drive mechanism 60 including the motor 61 and the like.

The electronic control unit 1 is electrically connected to the power source 71 by a wiring cable 69b. Power for the electronic control unit 1 and the like is supplied from a power source 71 . For example, a storage battery or the like is used as the power source 71 . The electronic control unit 1 and the rotation drive mechanism 60 according to Embodiment 1 are configured as described above.

Advantages of the electronic control unit 1 and the like described above will be described in comparison with an electronic control unit according to a comparative example. FIG. 14 shows a rotary drive mechanism 160 to which the electronic control device 101 according to the comparative example is applied. As shown in FIG. 14, in the electronic control unit 101 according to the comparative example, the housing 103 has a substantially rectangular parallelepiped (hexahedron) shape. Therefore, the electronic control unit 101 is arranged at a position distant from the motor 61 and the generator 63 . The electronic control unit 101 is electrically connected to each of the motor 61 and the generator 63 by wiring cables 169a. The electronic control unit 101 is electrically connected to the power source 71 by a wiring cable 169b.

As shown in FIG. 15, a plurality of circuit boards 123, such as a circuit board 123a, a circuit board 123b, and a circuit board 123c, are arranged in the housing 103 of the electronic control device 101. As shown in FIG. Electronic components 131a and 131b are mounted on the circuit board 123a. Electronic components 131c and 131d are mounted on the circuit board 123b. Electronic components 131e and 131f are mounted on the circuit board 123c.

Circuit board 123a and circuit board 123b are electrically connected by, for example, metal bus bar 141b. Circuit board 123a and circuit board 123c are electrically connected by, for example, metal bus bar 141a. Circuit board 123b and circuit board 123c are electrically connected by, for example, metal bus bar 141c.

The circuit board 123a and the circuit board 123b are held at a distance D1 that does not interfere with each other in consideration of the heights of the electronic components 131b and 131c. Therefore, the metal bus bar 141b is set to have a length based on this interval D1. The circuit board 123b and the circuit board 123c are held at a distance D2 that does not interfere with each other, considering the heights of the electronic components 131d and 131e. Therefore, the metal bus bar 141c is set to have a length based on this interval D2. Furthermore, the metal bus bar 141a is set to have a length that is the sum of the distance D1 and the distance D2.

In this manner, the lengths of the metal bus bars 141a to 141c are set based on the distance between the circuit boards 123 in consideration of the height of the electronic component 130. FIG. Therefore, there is a limit to shortening the length of the metal bus bars 141a to 141c. Therefore, there is a limit to reducing the power loss caused by the resistance and inductance of the metal bus bars 141a-141c.

In contrast to the comparative example, in the rotary drive mechanism 60 including the electronic control device 1 according to the first embodiment, as shown in FIGS. , are held by the circuit board holding portion 17 and arranged radially from the circuit board holding portion 17 toward the cylindrical side wall portion 11 .

As wiring members for electrically connecting the plurality of circuit boards 23 radially arranged, the metal bus bar 41 and the wiring cable 35 are arranged on the side of the circuit board holding portion 17 where the plurality of circuit boards 23 are close to each other. are placed. As a result, the length of each of the metal busbars 41 and the like can be shortened compared to the comparative example. As a result, compared to the comparative example, it is possible to reduce the power loss caused by the resistance or inductance of the metal bus bar 41 and the like, and to suppress the heat generated due to the power loss.

Further, in the rotary drive mechanism 60 described above, the electronic control unit 1 is attached to the drive shaft 67 together with the motor 61 and the generator 63 . As a result, compared with the comparative example, the length of the wiring cable 69a electrically connecting the electronic control unit 1 and the motor 61 and the length of the wiring cable 69a electrically connecting the electronic control unit 1 and the generator 63 are reduced. can be shortened.

(Modification)
In the rotary drive mechanism 60, various damping or vibrations are transmitted to the motor 61 and the like as the device operates. Therefore, it is required that the cylindrical housing 3 of the electronic control unit 1 is also fixed to the rotary drive shaft with sufficient strength. Also, the circuit board 23 and the like in the cylindrical housing 3 are required to have durability against vibrations and the like.

In the electronic control device 1 described above, the case where the circuit board 23 is held in the gap portion 19 of the circuit board holding portion 17 and is fixed by being inserted into the slit 7 provided in the second opposing wall portion 5b has been described. The method for fixing the circuit board 23 inside the cylindrical housing 3 is not limited to this.

As shown in FIG. 16, as the first receiving portion, in addition to the groove-shaped slit 7, for example, a guide portion 9 is formed in the second opposing wall portion 5b, and the circuit board 23 is fixed to the guide portion 9. You may do so. Further, as shown in FIGS. 17 and 18, a guide portion 13 as a second receiving portion is formed on the cylindrical side wall portion 11 of the cylindrical housing 3, and the circuit board 23 is fixed to the guide portion 13. may As a result, the circuit board 23 can be more firmly fixed inside the tubular housing 3 .

Further, the cylindrical housing 3 may be filled with resin or the like in order to fix the circuit board 23 and the like and to improve the heat dissipation. Furthermore, a heat dissipation mechanism for flowing cooling water or air may be provided inside the cylindrical housing 3 or in the second opposing wall portion 5b or the like. As shown in FIG. 19 , for example, a cooling water heat radiation surface 77 may be provided on the lower portion of the cylindrical housing 3 . In this case, the electronic control unit 1 is provided with a cooling water inlet 75 and a cooling water outlet 76 . The cooling water flowing from the cooling water inlet 75 is heat-exchanged with the heat generated in the electronic control unit 1 while passing through the cooling water heat radiation surface 77, and the inside of the electronic control unit 1 is cooled. The heat-exchanged cooling water is discharged to the outside of the electronic control unit 1 from the cooling water outlet 76 . Furthermore, a radiator plate 80 (see FIG. 20) may be provided for releasing the generated heat. The radiator plate 80 will be described in detail in the second embodiment.

Embodiment 2.
An electronic control unit according to Embodiment 2 will be described. Here, the structure for dissipating heat generated inside the electronic control unit will be described more specifically. As shown in FIG. 4 and the like, a plurality of electronic components 31 are mounted on the circuit board 23 arranged inside the electronic control device 1 . These electronic components 31 generate heat as the electronic control unit 1 operates. In order to stably operate the electronic control unit 1, it is necessary to dissipate the generated heat to the outside.

As shown in FIG. 20, in order to efficiently dissipate the heat, it is necessary to stably attach the heat sink 80 to the heat dissipation surface of the cooling water heat dissipation surface 77 . At this time, it is necessary to arrange the heat sink 80 as close as possible to the electronic component 31 (see FIG. 22 etc.) without interfering with the arrangement of the wiring cable 35 and the metal bus bar 41 (see FIG. 22 etc.). .

As shown in FIG. 21 , the radiator plate 80 is attached to the fixing bracket 25 . This attachment structure is the same as the structure in which the circuit board 23 is attached to the fixing bracket 25 . By fitting the fixing metal fittings 25 into the gaps 19 (see FIGS. 5 and 6) of the circuit board holding portion 17, the radiator plate 80 is fixed to the cylindrical housing 3 (second opposing wall portion 5b).

The radiator plate 80 is connected to the fixing bracket 25 by the radiator plate position fixing portion 90 . One end side of the heat sink position fixing portion 90 is connected to, for example, the upper end portion of the heat sink 80 . Therefore, a gap is formed between the heat sink 80 and the fixing bracket 25 below the heat sink position fixing portion 90 . By arranging the metal bus bar 41 or the like in this gap, it is possible to electrically connect the circuit boards 23 (see FIG. 6 and the like) at the shortest distance.

Although the case where one end side of the heat sink position fixing portion 90 is connected to the upper end portion of the heat sink plate 80 is taken as an example, one end side of the heat sink position fixing portion 90 is connected to the lower end portion of the heat sink plate 80 . may be Also, one end side of the heat sink position fixing portion 90 may be connected to an intermediate portion between the upper end portion and the lower end portion of the heat sink 80 .

Next, a method for attaching the heat sink 80 will be described. First, in the same manner as the method of mounting the circuit board 23 shown in FIGS. Next, as shown in FIG. 22, for example, a heat sink 80a as one of the heat sinks 80 is brought into close contact with an electronic component 31e as one of the electronic components 31. Next, as shown in FIG. Thus, the heat sink 80 is attached.

The radiator plate 80 is made of metal or the like having high thermal conductivity. As shown in FIG. 20 , a portion (lower end) of the heat sink 80 is also in contact with the cooling water heat sink surface 77 . Here, the contact in this case means that a part (lower end) of the heat sink 80 is in direct contact with the cooling water heat radiating surface 77, and a part (lower end) of the heat sink 80 is in direct contact with the cooling water heat radiating surface 77. A case in which a thermally conductive member such as heat radiation silicon or a heat radiation sheet is interposed between the coolant heat radiation surface 77 is also included. The heat generated from the electronic component 31e is transferred from the heat sink 80a to the cooling water through the cooling water heat radiation surface 77, and is radiated to the outside of the electronic control unit 1. FIG.

The radiator plate 80a is attached to the fixing bracket 25 via the radiator plate position fixing portion 90, and is also fixed to the second opposing wall portion 5b of the cylindrical housing 3 with a fixing jig 87a and a fixing screw 88a. . As a result, even if the heat sink 80a vibrates or is deformed due to temperature changes, the heat sink 80a can be stably brought into close contact with the electronic component 31e.

As shown in FIG. 23, when the electronic component 31 to be heat-dissipated is an electronic component 31a, a heat-radiating plate 80b adapted to the shape of the electronic component 31a is used as the heat-radiating plate 80. The heat generated in the electronic component 31a can be dissipated by bringing it into close contact with the component 31a.

Furthermore, the circuit board 23 may have a plurality of electronic components 31, such as the electronic components 31a and 31b, mounted thereon, for example, like the circuit board 23a. The electronic component 31a and the electronic component 31b have different heights from the surface of the circuit board 23a. For this reason, it is assumed that a single plate-like heat sink 80 cannot be brought into close contact with both the electronic component 31a and the electronic component 31b.

In such a case, as shown in FIG. 24, a radiator plate 80c having a shape corresponding to the height of the electronic component 31a from the surface of the circuit board 23a and the height of the electronic component 31b from the surface of the circuit board 23a is provided. Just install it. By attaching the heat sink 80c having a shape corresponding to the height of the electronic component 31 from the surface of the circuit board 23, the heat sink 80c is in close contact with the electronic component 31a and the electronic component 31b. The heat generated in each can be dissipated.

In FIG. 24, two electronic components 31, ie, the electronic components 31a and 31b are mounted on the circuit board 23a. Not limited. For example, for three or more electronic components 31, heat generated in the electronic components 31 can be dissipated by attaching a heat sink (not shown) corresponding to the height of each of the electronic components 31 as the heat sink 80. can dissipate heat. Also, the arrangement of the electronic components 31a and 31b and the shape of the heat sink 80c corresponding to the arrangement shown in FIG. 24 are merely examples.

Further, as the heat sink 80, the heat sink 80 fixed to the circuit board holding portion 17 side by the heat sink position fixing portion 90 and the fixing metal fitting 25 was taken as an example, but the heat sink 80 is not attached to the cylindrical housing 3. It may be fixed to the cylindrical side wall portion 11 side. As shown in FIG. 25 , in this case, the cylindrical side wall portion 11 is provided with the heat sink guide portion 14 . The radiator plate guide portion 14 includes a first portion 14a and a second portion 14b. The heat sink 80c may be fixed while being sandwiched between the first portion 14a and the second portion 14b. Further, the radiator plate 80c may be more firmly fixed to the second opposing wall portion 5b by using the radiator plate fixing jig 87c and the radiator plate fixing screw 88c.

The radiator plate 80 described above is configured to be fixed to the cylindrical housing 3 by the radiator plate position fixing portion 90 and the fixing bracket 25 . In this case, the radiator plate 80 is arranged on the assumption that it will come into contact with a specific electronic component 31 . Here, the contact in this case means that the radiator plate 80 is in direct contact with the specific electronic component 31, or that heat-dissipating silicone or A case in which a thermally conductive member such as a heat radiation sheet is interposed is also included. On the other hand, it is conceivable that the heat sink 80 cannot be brought into close contact with the electronic component 31 due to, for example, dimensional tolerances associated with manufacturing. Further, for example, it is conceivable that the shape of the electronic component 31 is changed due to a change in the specification of the electronic component 31 or the like, and the heat sink 80 cannot be brought into close contact with the electronic component 31 .

Assuming such a case, the heat sink 80 capable of adjusting the circumferential position and the radial position of the heat sink 80 in the cylindrical housing 3 will be described. As shown in FIGS. 26 and 27 , the radiator plate position fixing section 90 is composed of a radiator plate rotation mechanism 81 , a radiator plate rotation fixing screw 82 , a radiator plate slide portion 91 and a radiator plate slide portion 92 .

The radiator plate rotation mechanism 81 is cylindrical and has a hinge structure. The heat sink rotating mechanism 81 is interposed between the heat sink 80 and the heat sink position fixing portion 90 . As shown in FIG. 26 , mainly the circumferential position of the heat sink 80 can be adjusted by the heat sink rotating mechanism 81 . After the circumferential position of the heat radiating plate 80 is determined with respect to the fixing bracket 25 , the circumferential position of the heat radiating plate 80 is fixed by tightening the heat radiating plate rotation fixing screw 82 .

One of the heat sink slide portion 91 and the heat sink slide portion 92 is slidable with respect to the other. Thereby, as shown in FIG. 27, mainly the radial position of the heat sink 80 can be adjusted. This will be discussed later.

Furthermore, as shown in FIG. 28, a plurality of heat sinks 80a and 80b may be connected as the heat sink 80 of the heat sink rotating mechanism 81. FIG. In this case, as the heat sink rotating mechanism 81, a heat sink rotating mechanism 81a and a heat sink rotating mechanism 81b are provided. The heat sink rotating mechanism 81 a is interposed between the heat sink 80 a and the heat sink position fixing portion 90 . The heat sink rotating mechanism 81b is interposed between the heat sink 80a and the heat sink 80b. The radiator plate 80a is fixed by a radiator plate rotation fixing screw 82a. The radiator plate 80b is fixed by a radiator plate rotation fixing screw 82b.

The radiator plate rotating mechanism 81b allows the radiator plate 80b to be bent and arranged at a desired circumferential position with respect to the radiator plate 80a. Accordingly, the electronic component to which the heat sink 80 is attached is not limited to one electronic component, and the heat sink 80 can be attached to a plurality of electronic components 31 having different heights. Moreover, depending on the internal structure, it is also possible to arrange the radiator plate 80 so as to bypass a specific position.

The structures of the heat sink slide portion 91 and the heat sink slide portion 92 will be described. As shown in FIGS. 29 and 30 , the size of the heat sink slide portion 92 is slightly larger than the size of the heat sink slide portion 91 . The heat sink slide portion 91 is arranged so as to be fitted inside the heat sink slide portion 92 . The radial position of the heat sink 80 is set by the heat sink slide portion 91 and the heat sink slide portion 92 .

As shown in FIG. 29 , slide fixing screw holes 93 are formed in the heat sink slide portion 91 . The slide fixing screw hole 93 is formed as an elongated hole extending from one end of the heat sink slide portion 91 facing the other with a distance in the slide direction to just before the other end. The slide fixing screw hole 93 is formed in a size corresponding to the slide fixing screw 95 . One or more slide fixing screw holes 94 are formed in the side surface of the heat sink slide portion 92 .

The lengths of the heat sink slide portions 91 and 92 in the sliding direction are adjusted by relatively sliding the heat sink slide portions 91 and 92 . As shown in FIG. 30, by tightening a slide fixing nut 96 to a slide fixing screw 95 in a state where the lengths in the sliding direction of the heat sink slide portion 91 and the heat sink slide portion 92 have reached desired lengths, The heat sink slide portion 91 and the heat sink slide portion 92 are fixed to each other.

Next, an example of the electronic control unit 1 including the heat sink 80 having the heat sink position fixing portion 90 described above will be described. As shown in FIG. 31, the radial position and the circumferential position of the heat sink 80e are adjusted by the heat sink slide portions 91a and 92a and the heat sink rotating mechanism 81a. The radiator plate 80e is fixed by a radiator plate rotation fixing screw 82a, a radiator plate fixing jig 87e, and a radiator plate fixing screw 88e. Thereby, the heat sink 80e contacts the surface of the electronic component 31e. As a result, the heat generated from the electronic component 31e can be reliably conducted to the radiator plate 80e, and the heat can be efficiently dissipated.

When the electronic component 31 is changed from the electronic component 31e to another electronic component (not shown), the change can be achieved by adjusting the radial position and the circumferential position of the heat sink 80e. The heat can be dissipated by contacting the surface of the electronic component.

Further, as shown in FIG. 31, the heat sink 80 is fixed to the cylindrical side wall portion 11 side of the cylindrical housing 3 in addition to the heat sink 80e fixed to the circuit board holding portion 17 side. A heat sink 80d may be used. As shown in FIG. 32 , the cylindrical side wall portion 11 (peripheral portion) of the electronic control device 1 is provided with a heat sink slit 8 . A radiator plate guide portion 14 is provided in the radiator plate slit 8 .

The radiator plate guide portion 14 is composed of a first portion 14a and a second portion 14b. The radiator plate guide portion 14 is fixed to the radiator plate slit 8 by radiator plate fixing jigs 85 (85a, 85b) and radiator plate fixing screws 86 (86a, 86b). The first portion 14a is fixed to the heat sink slit 8 by a heat sink fixing jig 85a and a heat sink fixing screw 86a. The second portion 14b is fixed to the heat sink slit 8 by a heat sink fixing jig 85b and a heat sink fixing screw 86b. The heat sink 80d is fixed by being sandwiched between the first portion 14a and the second portion 14b.

A heat sink position fixing portion 90d having a heat sink rotation mechanism 81d and heat sink slide portions 91d and 92d is provided as the heat sink position fixing portion 90 to adjust the radial position and the circumferential position of the heat sink 80d. can be done. The heat sink 80d is fixed by a heat sink rotation fixing screw 82d, a heat sink fixing jig 87d, and a heat sink fixing screw 88d. Thereby, heat can be radiated by contacting the heat sink 80d with the surface of the electronic component 31a.

Another example of the electronic control unit 1 including the heat sink 80 having the heat sink position fixing portion 90 will be described. As shown in FIG. 33, the radial and circumferential positions of the heat sink 80f and the heat sink 80g are adjusted by the heat sink slide portions 91f and 92f (91 and 92) and the heat sink rotation mechanisms 81e, 81f and 81g. adjusted. The radiator plate 80f is fixed by a radiator plate rotation fixing screw 82e, and the radiator plate 80g is further fixed by radiator plate rotation fixing screws 82f and 82g.

As a result, the heat sink 80f comes into contact with the surface of the electronic component 31b. The heat sink 80g contacts the surface of the electronic component 31a. As a result, the heat generated from the electronic component 31a can be reliably conducted to the radiator plate 80g, and the heat generated from the electronic component 31b can be reliably conducted to the radiator plate 80f, so that the heat can be efficiently dissipated. can be done.

In addition, in the electronic control unit 1 described above, the heat sink 80 g side may be fixed to the cylindrical side wall portion 11 of the electronic control unit 1 . In this case, as shown in FIG. 34, the radiating plate 80g is provided with a sandwiched portion 97 that is nipped by the radiating plate guide portion 14 via the radiating plate rotating mechanism 81h.

The sandwiched portion 97 of the radiator plate 80g is sandwiched between the first portion 14a and the second portion 14b of the radiator plate guide portion 14, and the radiator plate 80g is fixed in the cylindrical housing 3 by a radiator plate rotation fixing screw 82h. be. The radiator plate guide portion 14, the sandwiched portion 97, the radiator plate rotation fixing screw 82h, and the like function as a radiator plate position fixing portion 90e that fixes the radiator plate 80g. It should be noted that instead of the clamped portion 97, radiator plate sliding portions 91 and 92 as shown in FIG. 31 may be used.

The side of the heat sink 80f is fixed to the circuit board holding portion 17, and the side of the heat sink 80g is fixed to the cylindrical side wall portion 11, so that the electronic control unit 1 is mounted, for example, the rotary driver 65 (FIG. 13), etc., can be improved in resistance to external vibrations.

Further, in the above-described electronic control device 1 as well, as described in the first embodiment, the cylindrical housing 3 is filled with a resin or the like (not shown) in order to improve the heat dissipation of the circuit board 23 and the like. can be By filling the cylindrical housing 3 with resin, the circuit board 23 and the like are fixed more firmly, and the resistance to vibration can be improved.

Further, for example, a slit 7 (eg, see FIG. 5) may be provided in each of the first opposing wall portion 5a and the second opposing wall portion 5b of the cylindrical housing 3, and the heat sink may be fitted in the slit. By fitting the heat sink into each of the slits, the resistance to vibration can be further improved.

It should be noted that the electronic control unit and the rotation drive mechanism described in the embodiments can be combined in various ways as required.

The embodiment disclosed this time is an example and is not limited to this. The present disclosure is defined by the scope of the claims rather than the scope described above, and is intended to include all changes within the scope and meaning equivalent to the scope of the claims.

INDUSTRIAL APPLICABILITY The present invention is effectively used for controlling a rotary drive mechanism having a rotary drive unit such as a motor or tires.

REFERENCE SIGNS LIST 1 electronic control device 3 cylindrical housing 5a first opposing wall portion 5b second opposing wall portion 7 slit 8 slit for heat sink 9 guide portion 11 cylindrical side wall portion 13 guide portion 14 heat sink guide part 14a first part 14b second part 15 drive shaft insertion part 16 insertion main body part 17 circuit board holding part 19 gap part 21, 21a, 21b partition wall 23, 23a, 23b, 23c , 23d, 23e, 23f, 23g, 23h Circuit board 24 Notch 25 Fixing metal fitting 25a Collar 27, 27a, 27b, 27c, 27d, 27e Board fixing metal fitting 29 Board fixing screw 31 , 31a, 31b, 31c, 31c, 31d, 31e, 31f, 31g, 31h, 31i Electronic components 33, 33a, 33b, 33c, 33d, 33e, 33f Connectors 35, 35a, 35b, 35c, 35d, 35e, 35f, distribution cable, 37 distribution cable hole, 41, 41a, 41b, 41c, 41d metal busbar, 42 screw hole, 43, 43a, 43b, 43c metal busbar for external connection, 45 metal busbar mounting terminal, 47 fixing screw, 49 metal bus bar outlet, 60 rotary drive mechanism, 61 motor, 63 generator, 65 rotary drive body, 67 rotary drive shaft, 69, 69a, 69b wiring cable, 71 power source, 75 cooling water inlet, 76 cooling water outlet, 77 Coolant heat radiation surface 80, 80a, 80b, 80c, 80d, 80e, 80f, 80g Radiator plate 81, 81a, 81b, 81c, 81d, 81e, 81f, 81g, 81h Radiator plate rotation mechanism 82, 82a, 82b , 82cc, 82d, 82e, 82f, 82g, 82h Heat sink rotation fixing screw 85 Side wall heat sink fixing jig 86 Side wall heat sink fixing screw 87, 87a, 87b, 87c, 87d, 87e Heat sink fixing jig , 88, 88a, 88b, 88c, 88d, 88e heat sink fixing screw 90 heat sink position fixing part 91 heat sink slide part 92 heat sink slide part 93 slide fixing screw hole 94 slide fixing screw hole 95 slide fixing screw, 96 heat sink fixing nut;

Claims (18)

a cylindrical housing extending cylindrically in one direction;
a drive shaft insertion portion arranged in the cylindrical housing for inserting a drive shaft arranged so as to penetrate the cylindrical housing in the one direction;
a circuit board section including a first circuit board and a second circuit board held in the drive shaft insertion section and arranged radially from the drive shaft insertion section;
a wiring portion including a wiring conductor electrically connecting the first circuit board and the second circuit board;
The electronic control unit, wherein the wiring conductor is arranged on the side where the drive shaft insertion portion is located. The drive shaft insertion portion is
a body through which the drive shaft is inserted;
2. The electronic control device according to claim 1, further comprising: a substrate holding portion radially spaced apart from said main body portion and arranged so as to surround said main body portion in a circumferential direction, and holding said circuit board portion. The substrate holding portion is provided with a gap portion along the one direction,
3. The electronic control device according to claim 2, wherein said circuit board portion is provided with a fitting portion that is fitted into said gap portion and held by said board holding portion. The substrate holding portion is provided with a communication portion that communicates between the side on which the circuit board portion is arranged and the side on which the main body portion is arranged,
3. The electronic control device according to claim 2, wherein said wiring conductor includes a wiring cable arranged between said main body and said board holding portion via said communicating portion. 3. The electronic control device according to claim 2, wherein said wiring conductor includes a metal bus bar arranged along said substrate holding portion. The circuit board section includes a third circuit board held by the board holding section and arranged between the first circuit board and the second circuit board,
6. The electronic control device according to claim 5, wherein said third circuit board is formed with a notch through which said metal bus bar is passed. The metal bus bar has a terminal connected to the first circuit board,
The first circuit board is provided with mounting terminals to which the terminals are mounted,
The terminal is provided with a fastening hole through which a fastening member is inserted,
6. The electronic control device according to claim 5, wherein the terminal is attached to the mounting terminal in such a manner that the fastening member is inserted through the fastening hole from the one direction. 8. The electronic control device according to claim 7, wherein said fastening hole has a size larger than the diameter of said fastening member. The cylindrical housing is
a cylindrical side wall portion; and a first opposing wall portion that closes one side of the cylindrical side wall portion and a second opposing wall portion that closes the other side of the cylindrical side wall portion. The electronic control unit according to claim 1. 10. The electronic control device according to claim 9, wherein one of said first opposing wall portion and said second opposing wall portion is formed with a first receiving portion for receiving said first circuit board. 11. The electronic control unit according to claim 10, wherein said first receiving portion is groove-shaped. 10. The electronic control device according to claim 9, wherein said cylindrical side wall portion is formed with a second receiving portion for receiving said first circuit board. The electronic control device according to any one of claims 1 to 12, further comprising a radiator plate arranged in said cylindrical housing so as to be in contact with said circuit board portion. 14. The heat sink is fixed on at least one of the side of the heat sink on which the drive shaft insertion portion is located and the side opposite to the side on which the drive shaft insertion portion is located. electronic controller. The heat sink is
a first heat sink;
a second heat sink connected to the first heat sink,
The circuit board section
including a first electronic component and a second electronic component each mounted on the first circuit board and having different heights;
The first heat sink is in contact with the first electronic component,
15. The electronic control device according to claim 13, wherein said second heat sink contacts said second electronic component. The electronic control device according to any one of claims 13 to 15, further comprising a heat sink rotating mechanism for adjusting the circumferential position of the heat sink in the tubular housing. The electronic control device according to any one of claims 13 to 16, further comprising a radiator plate slide portion for adjusting a radial position of said radiator plate in said cylindrical housing. A rotary drive mechanism comprising the electronic control device according to any one of claims 1 to 17,
a driving unit having a rotating shaft as the driving shaft and rotating the rotating shaft;
the electronic control device having the rotating shaft inserted through the drive shaft insertion portion and arranged side by side with the drive portion;
A rotation drive mechanism, comprising: an inter-device wiring section that electrically connects the drive section and the electronic control device.

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