WO2020206868A1

WO2020206868A1 - Heat dissipation device for high-power led lamp

Info

Publication number: WO2020206868A1
Application number: PCT/CN2019/097027
Authority: WO
Inventors: 雷平
Original assignee: 广州爱奇实业有限公司
Priority date: 2019-04-09
Filing date: 2019-07-22
Publication date: 2020-10-15

Abstract

A heat dissipation device for a high-power LED lamp, comprising a substrate (10). One side of the substrate (10) is provided with a heat dissipation assembly (20), and the other side of the substrate (10) is provided with an LED lamp assembly (30); the heat dissipation assembly (20) is formed by assembling several forged heat dissipation modules (21, 22, 23, 24); heat dissipation air channels are reserved among the heat dissipation modules (21, 22, 23, 24); the heat dissipation modules (21, 22, 23, 24) are several fin structures formed by aluminum ingot forging; gaps among the fin structures are not parallel to the heat dissipation air channels. The heat dissipation assembly (20) is formed as several fin structures by means of aluminum ingot forging, and because the fin structures are formed by means of forging, the heights of the fin structures can reach 100-300 cm; reinforcing columns (25) can be directly formed during forging of heat dissipation fins, and the reinforcing columns (25) can increase the intensity of the heat dissipation fins, and can also increase the heat dissipation area, perfect the heat dissipation channel, and improve the heat dissipation effect.

Description

A heat dissipation device for high-power LED lamps

This application requires the application number of 201910280931.4, the title of the invention to be "a heat sink for high-power LED lamps", the application number of 201920470398.3, and the title of the invention to be submitted to the Chinese Patent Office on April 9, 2019. The priority of the Chinese patent application for the heat dissipation device for high-power LED lamps, the entire content of which is incorporated into this application by reference.

Technical field

The invention relates to a heat dissipation device, in particular to a heat dissipation device for high-power LED lamps.

Background technique

In large sports venues such as football fields, tennis courts, golf courses and other outdoor empty and busy sports venues, or outdoor large-area workplaces such as docks and airports, high-power lamps are usually used to achieve large-scale centralized lighting. High-power lamps include Lamp poles and lamps set on the lamp poles, while the light sources of high-power lamps in the prior art are mainly high-pressure sodium lamps, high-pressure mercury lamps, and metal halide lamps. The light source contains a large amount of mercury vapor. Will volatilize into the atmosphere, and also contain mercury, lead, arsenic and other elements that seriously pollute the environment, which also bring harm to human health; and the photoelectric conversion efficiency is low, so a large amount of heat energy will be generated. Very few, and the lamp body is relatively large and unsightly.

In addition, the height of the heat sink directly affects the heat dissipation effect of the lamp. The heat sinks in the prior art are welded piece by piece. In addition, the air duct design of a certain height of the heat sink is unreasonable, which directly affects the heat dissipation effect and the life of the LED lamp. The high-power lamp of the prior art still has many defects and needs to be improved urgently.

Summary of the invention

In view of the foregoing existing problems, the technical problem to be solved by the present invention is to provide a heat dissipation device for high-power LED lamps to solve the problems existing in the prior art.

The present invention provides a heat dissipation device for high-power LED lamps, including a substrate;

One side of the substrate is provided with a heat dissipation assembly, and the other side of the substrate is provided with an LED lamp assembly;

The heat dissipation assembly includes a plurality of forged heat dissipation modules spliced together;

A heat dissipation air duct is reserved between the heat dissipation modules;

The heat dissipation module is an aluminum ingot forged into a number of fin structures; the gaps between the fin structures and the heat dissipation air ducts are distributed non-parallel;

While the heat generated by the LED lamp assembly is dissipated through the fin structure on the heat dissipation assembly and the gap between the fin structure, it can be dissipated through the heat dissipation air duct.

Preferably, the heat dissipation assembly includes 2-10 heat dissipation modules.

Preferably, the heat dissipation assembly includes 4 heat dissipation modules.

Preferably, the heat dissipation assembly includes a plurality of forged heat dissipation modules welded together; the heat dissipation assembly and the substrate are bonded.

Preferably, the height of the fin structure is 100-300 cm.

Preferably, the height of the fin structure is 200 cm

Preferably, the number of the fin structures on the heat dissipation assembly is 10-100.

Preferably, the height and length of the fin structure are set according to the splicing shape of the heat dissipation component.

Preferably, the forged fin structure includes a reinforcing column.

Preferably, the heat dissipation component includes several forged heat dissipation components spliced into a circle, a sphere, or a square.

In summary, the present invention provides a heat dissipation device for high-power LED lamps. The module is forged into several fin structures by aluminum ingots, which can be directly formed by forging, so the height of the fin structure can reach 100- 300cm, the heat dissipation effect is improved; the air duct formed between the heat dissipation components and the gap between the fin structure are crossed or perpendicular, and the heat dissipation air duct in other directions can be added to further improve the heat dissipation efficiency. Preferably, the heat dissipating component is welded on the substrate, and the surroundings of the heat dissipating component can be welded, which avoids the problem that only one side of the heat sink can be welded during the welding of the single-piece heat sink, and the connection is not firm. As a further preference, the heat dissipation fins can be directly formed into reinforcing columns while forging and pressing. The reinforcing columns can not only increase the strength of the heat dissipation fins, but also increase the heat dissipation area, improve the heat dissipation channels, and improve the heat dissipation effect.

Description of the drawings

In order to explain the embodiments of the present invention more clearly, the following will briefly introduce the drawings needed in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings.

Figure 1 is a three-dimensional schematic diagram of a heat sink for high-power LED lamps;

Figure 2 is a front view of a heat sink for high-power LED lamps without a steering device;

Figure 3 is a top view of a heat sink for high-power LED lamps without a steering device;

Figure 4 is a left side view of a heat sink for high-power LED lamps without a steering device;

Figure 5 is a front view of a heat sink for high-power LED lamps;

Figure 6 is a left view of a heat sink for high-power LED lamps;

Figure 7 is a top view of a heat dissipation device for high-power LED lamps;

Fig. 8 is a three-dimensional schematic diagram of a steering device used for a heat dissipation device of a high-power LED lamp;

Figure 9 is a front view of a steering device used for a heat sink of a high-power LED lamp;

Figure 10 is a top view of a steering device used for a heat sink of a high-power LED lamp;

Figure 11 is a left side view of a steering device used for a heat sink of a high-power LED lamp;

In the picture: 10. base plate, 20. heat dissipation assembly, 21. first heat dissipation module, 22. second heat dissipation module, 23. third heat dissipation module, 24. fourth heat dissipation module, 25. reinforcement column, 30. LED lamp assembly , 40. Steering device, 41. Base, 411. Display plate, 42. Locking part, 43. Knuckle.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

In order to explain the present invention in more detail, a heat dissipation device for high-power LED lamps provided by the present invention will be described in detail below with reference to the accompanying drawings.

Referring to Figures 1-7, a heat dissipation device for high-power LED lamps includes a substrate 10;

One side of the substrate 10 is provided with a heat dissipation assembly 20, and the other side of the substrate 10 is provided with an LED light assembly 30; because it is used in large stadiums such as football fields, basketball courts, or golf courses, airports, docks, etc. For the lighting of the venue, the LED lamp assembly is a high-power LED lamp with a diameter of more than 600 cm and a power of up to 1000W, 1500W or 2000W, or even up to 3000W, which requires extremely high heat dissipation.

The heat dissipation assembly 20 includes a plurality of forged heat dissipation modules 21-24 spliced together; a heat dissipation air duct is reserved between the heat dissipation modules 21-24; the heat dissipation modules 21-24 are aluminum ingots forged into a number of fin structures The gap between the fin structure and the heat dissipation air duct are non-parallel distribution; the heat generated by the LED lamp assembly 30 passes through the fin structure on the heat dissipation assembly 20 and between the fin structure While dissipating heat from the gap, heat can be dissipated through the heat dissipation air duct; in this way, a number of intersecting heat dissipation air ducts are retained, and heat dissipation through the horizontal or vertical air ducts improves the heat dissipation effect.

The heat dissipation assembly 20 includes 2-10 heat dissipation modules; the heat dissipation assembly preferably includes 4 heat dissipation modules, which are respectively a first heat dissipation module 21, a second heat dissipation module 22, a third heat dissipation module 23, and a fourth heat dissipation module 24 , The first heat dissipation module 21, the second heat dissipation module 22, the third heat dissipation module 23, and the fourth heat dissipation module 24 are distributed up and down, the first heat dissipation module 21, the second heat dissipation module 22, the third heat dissipation module 23, and the fourth heat dissipation module 24 The gaps between the fins and the gaps between the fins on the heat dissipation module are vertically distributed, so that several vertical heat dissipation air ducts are retained, and the heat dissipation effect is improved through the heat dissipation of the horizontal or vertical air ducts.

The heat dissipation component includes a number of forged heat dissipation modules welded together; the heat dissipation component and the substrate are bonded; the existing heat sink structure is welded to the chassis through fins one by one, which is limited by the operating space. Welding can only be carried out along one side of the fin. If the welding is not strong, it will affect the heat dissipation effect, and because the lamp is installed at a high altitude, if the heat sink falls from high altitude, it will directly endanger human life; and the heat dissipation assembly 20 is used in this application. The fins are formed by forging, and the fins are connected to each other. Several heat dissipation modules in the heat dissipation assembly 20 are spliced into a whole by welding, which is conducive to the cylindrical shape, the connection is firm, and the influence of excessive solder joints on heat dissipation is avoided.

The height of the fin structure is 100-300cm; preferably, the height of the fin structure is 200cm; this application realizes the forging and pressing of the aluminum ingot to form the heat dissipation module through the modular design of the heat dissipation assembly, based on the forging process With the characteristics of aluminum, it can form a fin height of up to 200cm (Figure 2 shows a fin height of 180mm), which greatly improves the heat dissipation effect.

The number of the fin structures on the heat dissipation assembly 20 is 10-100. According to the characteristics of aluminum materials, a certain number of fin structures can be forged and pressed. The formed fins are connected to each other to avoid The welding procedure between the single pieces is not considered, so the influence of the thickness and height of the fin on the welding process is not considered, but it is only limited by the limitations of forging and aluminum technology.

The height and length of the fin structure are set according to the splicing shape of the heat dissipation component. As shown in Figure 4, the fin structures have the same height and different lengths to form a cylindrical structure;

The forged fin structure includes a reinforced column 25. Due to the characteristics of the forging process, the reinforced column 25 can be directly forged on the fin structure. The reinforced column 25 can not only increase the strength of the heat dissipation fin, but also increase the heat dissipation area and strengthen The arrangement of the post 25 makes a streamlined arc channel formed between the fins, which improves the heat dissipation channel and improves the heat dissipation effect.

The heat dissipation component 20 includes a plurality of forged heat dissipation components spliced into a circle, a sphere, and a square.

As shown in Figures 8-11, the device also includes a steering device 40, the steering device includes a base 41 and a steering knuckle 43; the base 41 is fixed on a wall or a wire rod column; the steering knuckle 43 is connected to the The heat dissipation components 20 are fixedly connected; the steering knuckle 43 and the base 41 are locked by a locking member 42; the base 41 is provided with a display panel 411, and the steering knuckle 43 passes through the display panel after turning a certain angle 411 determines, and locks the steering knuckle 43 and the base 41 through the locking member 42.

In summary, the present invention provides a heat dissipation device for high-power LED lamps. The heat dissipation component is forged into a number of fin structures by aluminum ingots, which can be directly formed by forging, so the height of the fin structure can reach 100 -300cm, the heat dissipation effect is improved; the air duct formed between the heat dissipating components crosses or the gap between the fin structure is crossed or perpendicular, and the heat dissipating ducts in other directions are increased, and the heat dissipation efficiency is improved; On the substrate, the surroundings of the heat dissipation component can be welded, which avoids the problem of only one-side welding during the welding process of the single-piece heat sink, and the connection is not firm; the heat sink fins can be directly formed into reinforcing pillars during forging and pressing to strengthen The column can not only increase the strength of the heat dissipation fin, but also increase the heat dissipation area, improve the heat dissipation channel, and improve the heat dissipation effect.

The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown in this document, but should conform to the widest scope consistent with the principles and novel features disclosed in this document.

Claims

A heat dissipation device for high-power LED lamps, including a substrate;

One side of the substrate is provided with a heat dissipation assembly, and the other side of the substrate is provided with an LED lamp assembly;

The heat dissipation assembly includes a plurality of forged heat dissipation modules spliced together;

A heat dissipation air duct is reserved between the heat dissipation modules;

The heat dissipation module is an aluminum ingot forged into a number of fin structures; the gaps between the fin structures and the heat dissipation air ducts are distributed non-parallel;

While the heat generated by the LED lamp assembly is dissipated through the fin structure on the heat dissipation assembly and the gap between the fin structure, it can be dissipated through the heat dissipation air duct.
The heat dissipation device for high-power LED lamps according to claim 1, wherein the heat dissipation assembly includes 2-10 heat dissipation modules.
The heat dissipation device for high-power LED lamps according to claim 2, wherein the heat dissipation assembly includes 4 heat dissipation modules.
The heat dissipation device for high-power LED lamps according to claim 3, wherein the heat dissipation assembly includes a plurality of forged heat dissipation modules welded together; the heat dissipation assembly and the substrate are bonded.
The heat dissipation device for high-power LED lamps according to claim 4, wherein the height of the fin structure is 100-300 cm.
The heat dissipation device for high-power LED lamps according to claim 5, wherein the height of the fin structure is 200 cm.
The heat dissipation device for high-power LED lamps according to claim 6, wherein the number of the fin structures on the heat dissipation assembly is 10-100.
The heat dissipation device for high-power LED lamps according to claim 7, wherein the height and length of the fin structure are set according to the splicing shape of the heat dissipation component.
8. The heat dissipation device for high-power LED lamps according to claim 8, wherein the forged fin structure includes a reinforcing column.
The heat dissipation device for high-power LED lamps according to claim 9, wherein the heat dissipation component includes a plurality of forged heat dissipation components spliced into a circle, a sphere, and a square.