CN204254557U - There is the LED lamp of flat heat spreader structures - Google Patents
There is the LED lamp of flat heat spreader structures Download PDFInfo
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- CN204254557U CN204254557U CN201420513839.0U CN201420513839U CN204254557U CN 204254557 U CN204254557 U CN 204254557U CN 201420513839 U CN201420513839 U CN 201420513839U CN 204254557 U CN204254557 U CN 204254557U
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 40
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- 239000011701 zinc Substances 0.000 description 9
- 229910052725 zinc Inorganic materials 0.000 description 9
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
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- 229910052749 magnesium Inorganic materials 0.000 description 6
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- 241000276425 Xiphophorus maculatus Species 0.000 description 4
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
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- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
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- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a kind of LED lamp with flat heat spreader structures, comprising: flat radiator and several LED chip.Flat radiator arranges several installation positions.Each installation position correspondence installs a LED chip.Flat radiator is metal flat flat radiator.The above-mentioned LED lamp with flat heat spreader structures is by being set directly on flat radiator by LED chip, structure is comparatively simple, achieves integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, the above-mentioned flat radiator with the LED lamp of flat heat spreader structures directly can be used as shell and use, and there is fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Description
Technical field
The utility model relates to LED lamp heat sink field, particularly relates to a kind of LED lamp with flat heat spreader structures.
Background technology
LED (Light Emitting Diode, light emitting diode), electric energy conversion directly can be become visible ray by efficiently, and have the service life reaching tens thousand of hours ~ 100,000 hours, thus being widely used in the fields such as view, safety, special type and general lighting, market potential is beyond measure.
The basic structure of LED is P-N knot of a semiconductor, and when electric current flows through LED element, the temperature of P-N knot will rise, and the temperature in P-N interface is called the junction temperature of LED, usually because element chip all has very little size, therefore, also the temperature of LED chip is called the junction temperature of LED chip.
The LED lamp adopting LED to make is called as the most frequently used lighting with the advantage such as of fine quality, durable, energy-conservation.
But the drawback that LED lamp self exists is, LED lamp light efficiency is comparatively large by the impact of the junction temperature of LED, and higher junction temperature of chip will cause light efficiency to occur obviously declining, and can have influence on the service life of LED lamp.Because LED is when luminescence, the temperature of himself can constantly raise, and in the illumination work continued, if the heat that LED produces can not exhale in time, will cause the damage of LED, affect the service life of LED.Therefore, the heat dissipation problem solving LED is most important for the performance promoting LED.
For the problems referred to above, some LED lamp generally the heat energy produced during LED luminescence are directly delivered to aluminium alloy or various metal shell dispels the heat, or by heat conductive silica gel transferring heat energy, thus the high temperature produced when reducing LED illumination, reduce LED light to decline, extend LED illumination service life.
But, for the LED lamp that luminous power is larger, due to the radiating effect of shell and the heat-conducting effect of heat conductive silica gel is poor can not meet cooling requirements, therefore well can not realize the high temperature that produces when reducing LED illumination.If set up heat abstractor again on shell in addition, then manufacture difficulty can be increased, and cost is also higher.
Utility model content
Based on this, be necessary to provide that a kind of flat radiator arranges several installation positions, installation position correspondence installs a LED chip, flat radiator comprises several heat-conducting substrates for each, two heat radiation wing plates, two fixing radiating fin, several main radiating fins and several auxiliary radiating fins, heat radiation wing plate, fixing radiating fins and main radiating fin is all fixedly installed on heat-conducting substrate, auxiliary radiating fin is arranged on heat radiation wing plate, the better simply LED lamp with flat heat spreader structures of good heat dissipation effect, structure.
There is a LED lamp for flat heat spreader structures, it is characterized in that, comprising: flat radiator and several LED chip;
Described flat radiator arranges several installation positions;
Described in each, installation position correspondence installs LED chip described in;
Described flat radiator comprises several heat-conducting substrates, two heat radiation wing plates, two fixing radiating fins, several main radiating fins and several auxiliary radiating fins, described heat radiation wing plate, described fixing radiating fin and described main radiating fin are all fixedly installed on described heat-conducting substrate, and described auxiliary radiating fin is arranged on described heat radiation wing plate.
In one of them embodiment, described flat radiator arranges some through holes.
In one of them embodiment, described through hole is that array is arranged.
In one of them embodiment, described installation position is that array is arranged.
In one of them embodiment, installation position described in each is arranged at the center of the rectangle that four described through holes surround.
In one of them embodiment, the aperture of described through hole is less than the spacing of described installation position.
In one of them embodiment, the aperture of described through hole is 20% to 40% of the spacing of described installation position.
In one of them embodiment, described installation position is hemispherical.
In one of them embodiment, described LED chip is arranged on the side of described flat radiator, and is installed in described installation position.
In one of them embodiment, also comprise a scatter plate, described scatter plate is fixedly installed on described flat radiator, and scatter plate described in the light therethrough of described LED chip transmitting.
The above-mentioned LED lamp with flat heat spreader structures is by being set directly on flat radiator by LED chip, structure is comparatively simple, achieves integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, the above-mentioned flat radiator with the LED lamp of flat heat spreader structures directly can be used as shell and use, and there is fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED lamp of the utility model one embodiment;
Fig. 2 is the structural representation with the LED lamp of flat heat spreader structures of the utility model one embodiment;
Fig. 3 is the structural representation of the flat radiator shown in Fig. 2;
Fig. 4 is the structural representation at another visual angle of the flat radiator shown in Fig. 3;
Fig. 5 is the structural representation at the another visual angle of the flat radiator shown in Fig. 2;
Fig. 6 is the structural representation with the LED lamp of panel radiator of the utility model one embodiment;
Fig. 7 is the structural representation of the aluminium base shown in Fig. 6;
Fig. 8 is the structural representation of the thermal column shown in Fig. 6;
Fig. 9 is the structural representation of the integral LED lamp of the utility model one embodiment;
Figure 10 is the structural representation of the scatter plate shown in Fig. 9.
Detailed description of the invention
For enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in detail detailed description of the invention of the present utility model below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the utility model.But the utility model can be much different from alternate manner described here to implement, those skilled in the art can when doing similar improvement without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public specific embodiment.
Refer to Fig. 1, the LED lamp 10 with flat heat spreader structures comprises radiator 70, several LED chip 80 and scatter plate 90.Several LED chip 80 and scatter plate 90 are installed on radiator 70, and by directly arranging on radiator 70 by LED chip 80, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, and the radiator 70 of above-mentioned LED lamp 10 directly can be used as shell and use, and has fabulous heat conduction and radiating effect, and manufacture difficulty is lower, and cost is lower.
Be specific embodiment part below.
Embodiment 1
Refer to Fig. 2, have the LED lamp 20 of flat heat spreader structures, it comprises flat radiator 400, several LED chip (Chip) 500 and scatter plate.Several LED chip 500 and scatter plate are all arranged on flat radiator 400.By LED chip 500 directly being arranged on flat radiator 400, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, the flat radiator 400 of the LED lamp 20 of above-mentioned flat radiator directly can be used as shell and use, and there is fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Refer to Fig. 3 to Fig. 5, it is the structural representation of three different directions of the flat radiator 400 shown in Fig. 2.Flat radiator 400 comprises several heat-conducting substrates 410, two heat radiation wing plate 420, two fixing radiating fins 430, several main radiating fins 440 and several auxiliary radiating fins 450.Heat radiation wing plate 420, fixing radiating fin 430 and main radiating fin 440 are all fixedly installed on heat-conducting substrate 410, and auxiliary radiating fin 450 is arranged on heat radiation wing plate 420.And for example, heat-conducting substrate 410, two heat radiation wing plate 420, two fixing radiating fins 430, several main radiating fins 440 and several auxiliary radiating fins 450 are formed in one structure.Wherein, as shown in Figure 3, Figure 4, the flat design of heat-conducting substrate 410, such as, its thickness is 3 to 5 millimeters, like this, effectively can reduce the integral thickness of flat radiator 400, reaches overall flat effect.
Several heat-conducting substrates 410 successively interval are fixedly installed on fixing radiating fin 430, one side of main radiating fin 440 and heat radiation wing plate 420, that is, the bearing of trend of several heat-conducting substrates 410 is parallel, fixing radiating fin 430, main radiating fin 440 and the heat radiation bearing of trend of wing plate 420 and the bearing of trend of heat-conducting substrate 410 vertical, like this, the hollow out degree of flat radiator 400 can be improved, be convenient to form more heat-dissipating space in flat radiator 400 inside, thus improve the cooling surface area of flat radiator 400, and then improve the radiating effect of flat radiator 400.
In order to increase the cooling surface area of flat radiator 400, simultaneously, be beneficial to flow through both sides heat radiation wing plate 420 compared with cold air take away heat-conducting substrate 410 pass to heat radiation wing plate 420 heat, formation cross-ventilation conducts heat, thus the radiating effect of flat radiator 400 can be improved further, such as, refer to Fig. 3, one side of heat radiation wing plate 420 is fixedly installed on the end, one end of several heat-conducting substrates 410, and heat radiation wing plate 420 forms angle with the plane at several heat-conducting substrate 410 places, such as, the angle of described angle is 30 degree to 90 degree.Be appreciated that, heat radiation wing plate 420 is that incline direction stretches into extraneous air away from a side of heat-conducting substrate 410, like this, the cooling surface area of flat radiator 400 can be increased, in addition, also be beneficial to flow through both sides heat radiation wing plate 420 take away compared with cold air the heat that heat-conducting substrate 410 passes to heat radiation wing plate 420, form cross-ventilation heat transfer, thus the radiating effect of flat radiator 400 can be improved further.And for example, heat radiation wing plate 420 is square platy structure, and and for example, heat radiation wing plate 420 is arc platy structure.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 4, several auxiliary radiating fins 450 successively interval are fixedly installed on heat radiation wing plate 420, the bearing of trend of several auxiliary radiating fins 450 is identical, and the bearing of trend of several auxiliary radiating fins 450 and the bearing of trend of heat-conducting substrate 410 is vertical, like this, the cooling surface area of flat radiator 400 can be increased further, thus the radiating effect of flat radiator 400 can be improved further.
In order to install flat radiator 400 better, such as, refer to Fig. 5, one side of fixing radiating fin 430 is fixedly installed on the medium position of several heat-conducting substrates 410, another side edge bending of fixing radiating fin 430 arranges buckle installation portion 431, like this, flat radiator 400 can be directly installed on outside support by buckle installation portion 431, thus can install flat radiator 400 better.Such as, be arranged on floor body of wall.
In order to increase the cooling surface area of flat radiator 400 further, such as, refer to Fig. 5, one side of main radiating fin 440 is fixedly installed on two side positions of several heat-conducting substrates 410, the bearing of trend of several main radiating fins 440 is identical, and the bearing of trend of several main radiating fins 440 is vertical with the bearing of trend of heat-conducting substrate 410, like this, the cooling surface area of flat radiator 400 can be increased further, thus the radiating effect of flat radiator 400 can be improved further.
In order to install flat radiator 400 better, simultaneously, be beneficial to the structure optimizing flat radiator 400, improve radiating effect better, such as, refer to Fig. 5, two fixing radiating fins 430, sector structure is formed after several main radiating fins 440 and several auxiliary radiating fins 450 are fixedly installed heat-conducting substrate 410, the i.e. height of two fixing radiating fins 430, the height of main radiating fin 440 and the height of auxiliary radiating fin 450 successively decrease successively, like this, main radiating fin 440 and auxiliary radiating fin 450 can be avoided on the one hand to the interference of installing fixing radiating fin 430 generation, by which better fixing radiating fin 430, flat radiator 400 is installed, simultaneously, the effect of the structure optimizing flat radiator 400 can also be played, improve heat dispersion better.
In order to more progressive the heat dispersion improving described flat radiator, such as, described flat radiator is metal flat flat radiator, and and for example, described flat radiator is the flat radiator of alloy.
Such as, the flat radiator of an embodiment comprises each component of following mass percent:
The aluminium of silicon 0.4 part ~ 0.5 part, iron 0.5 part ~ 0.6 part, copper 0.05 part ~ 0.3 part, 0.3 part ~ 0.4 part, manganese, 2.1 parts ~ 2.9 parts, magnesium, chromium 0.18 part ~ 0.28 part, 5.1 parts ~ 6.1 parts, zinc, titanium 0.2 part ~ 0.3 part and surplus.Be appreciated that, by adopting zinc and the magnesium of above-mentioned mass percent, the significant MgZn2 of strengthening effect can be formed, make the thermal effectiveness of flat radiator far better than a zinc bianry alloy, tensile strength will be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat-conductive characteristic is also comparatively large, i.e. the good heat dispersion performance of flat radiator.
Refer to Fig. 2, heat-conducting substrate 410 arranges several installation positions 411, for installing LED chip 500 away from a side of two heat radiation wing plates, 420, two fixing radiating fins 430, several main radiating fins 440 and several auxiliary radiating fins 450.
In order to be arranged on LED chip better and protect LED chip; such as; described installation position is hemispherical; described LED chip is arranged on the side of described heat-conducting substrate; and described LED chip is fixedly placed in described installation position; like this, can LED chip be arranged on better and protect LED chip.
In order to increase the radiating effect of heat-conducting substrate 410 further, such as, refer to Fig. 2, heat-conducting substrate 410 is arranged some through holes 412, through hole 412 can increase the cooling surface area of heat-conducting substrate 410, and heat-conducting substrate 410 be positioned at the side being provided with LED chip 500 comparatively hot-air can by own vol expand via through holes 412 flow into be provided with two heat radiation wing plates 420, two fixing radiating fins 430, the opposite side of several main radiating fins 440 and several auxiliary radiating fins 450, like this, by above-mentioned air circulation, the radiating effect of heat-conducting substrate 410 can be increased further.
In order to further increase the radiating effect of heat-conducting substrate 410, taking away the heat that LED chip 500 produces more quickly, such as, referring to Fig. 2, through hole 412 is arranged in array, and installation position 411 is arranged in array.And for example, each installation position 411 is arranged at the center of the rectangle that four through holes 412 surround.And for example, the aperture of through hole 412 is 20% to 40% of the spacing of installation position 411.And for example, the aperture of through hole 412 is less than the spacing of installation position 411.
Refer to Fig. 2, scatter plate is fixedly installed on heat-conducting substrate 410, and LED chip 500 is between heat-conducting substrate 410 and scatter plate, and the light therethrough scatter plate that LED chip 500 is launched exposes to outside.
The above-mentioned LED lamp 20 with flat radiator passes through LED chip 500 to be set directly on flat radiator 400, and structure is comparatively simple, achieves integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, the above-mentioned flat radiator 400 with the LED lamp 20 of flat radiator directly can be used as shell and use, and there is fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Embodiment 2
Refer to Fig. 6 and Fig. 7, the LED lamp with flat heat spreader structures is the LED lamp 30 with panel radiator, and it comprises panel radiator 700, several LED chip 800 and scatter plate 900.Several LED chip 800 and scatter plate 900 are all arranged on panel radiator 700.By directly arranging on panel radiator 700 by LED chip 800, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, the panel radiator 700 of the LED lamp 30 of above-mentioned panel radiator directly can be used as shell and use, and there is fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower
Refer to Fig. 6, panel radiator 700 comprises an aluminium base 710, two heat-dissipating fins 720, several fixing thermal columns 730, several main thermal columns 740 and several auxiliary thermal columns 750.Heat-dissipating fin 720, fixing thermal column 730 and main thermal column 740 are all fixedly installed on aluminium base 710, and auxiliary thermal column 750 is arranged on heat-dissipating fin 720.
Several fixing thermal columns 730 are arranged on aluminium base 710 in array, and such as, several fixing thermal columns 730 distribute and to be arranged on aluminium base 710 in two rows, and the line of fixing thermal column 730 often in row is straight line.Several main thermal columns 740 are arranged on aluminium base 710 in array, and such as, several main thermal columns 740 are arranged on aluminium base 710 in some rows, and the line of main thermal column 740 often in row is straight line.Several auxiliary thermal columns 750 are arranged on heat-dissipating fin 720 in array, and such as, several auxiliary thermal columns 750 are arranged on heat-dissipating fin 720 in some rows, and the line of auxiliary thermal column 750 often in row is straight line.Like this, the hollow out degree of panel radiator 700 can be improved, be convenient to form more heat-dissipating space in panel radiator 700 inside, thus improve the cooling surface area of panel radiator 700, and then improve the radiating effect of panel radiator 700.
In order to increase the cooling surface area of panel radiator 700, simultaneously, be beneficial to flow through both sides heat-dissipating fin 720 take away compared with cold air the heat that aluminium base 710 passes to heat-dissipating fin 720, formation cross-ventilation conducts heat, thus the radiating effect of panel radiator 700 can be improved further, such as, refer to Fig. 6, one side of heat-dissipating fin 720 is fixedly installed on a side of aluminium base 710, and heat-dissipating fin 720 forms angle with the plane at aluminium base 710 place, such as, the angle of described angle is 30 degree to 90 degree.Be appreciated that, heat-dissipating fin 720 is that incline direction stretches into extraneous air away from a side of aluminium base 710, like this, the cooling surface area of panel radiator 700 can be increased, in addition, also be beneficial to flow through both sides heat-dissipating fin 720 take away compared with cold air the heat that aluminium base 710 passes to heat-dissipating fin 720, form cross-ventilation heat transfer, thus the radiating effect of panel radiator 700 can be improved further.And for example, heat-dissipating fin 720 is square laminated structure, and and for example, heat-dissipating fin 720 is arc-shaped flaky structure.
In order to increase the cooling surface area of panel radiator 700 further, such as, refer to Fig. 6, several auxiliary thermal columns 750 successively interval are fixedly installed on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 are arranged on heat-dissipating fin 720 in array, and for example, several auxiliary thermal columns 750 are arranged on heat-dissipating fin 720 in some rows, and the line of auxiliary thermal column 750 often in row is straight line.Like this, the cooling surface area of panel radiator 700 can be increased further, thus the radiating effect of panel radiator 700 can be improved further.
In order to mounting plate type radiator 700 better, such as, refer to Fig. 6, several fixing thermal columns 730 are arranged on aluminium base 710 in array, such as, several fixing thermal columns 730 distribute and to be arranged on aluminium base 710 in two rows, and the line of fixing thermal column 730 often in row is straight line.And for example, one end of fixing thermal column 730 is fixedly installed on the medium position of several aluminium bases 710, the other end end bending of fixing thermal column 730 arranges buckle installation portion 731, like this, panel radiator 700 can be directly installed on outside support by buckle installation portion 731, thus can mounting plate type radiator 700 better.Such as, be arranged on floor body of wall.
In order to increase the cooling surface area of panel radiator 700 further, such as, refer to Fig. 6, one end of main thermal column 740 is fixedly installed on two side positions of several aluminium bases 710, and for example, several main thermal columns 740 are arranged on aluminium base 710 in array, such as, several main thermal columns 740 are arranged on aluminium base 710 in some rows, and the line of main thermal column 740 often in row is straight line, like this, the cooling surface area of panel radiator 700 can be increased further, thus the radiating effect of panel radiator 700 can be improved further.
In order to mounting plate type radiator 700 better, simultaneously, be beneficial to the structure optimizing panel radiator 700, improve radiating effect better, such as, refer to Fig. 6, two fixing thermal columns 730, bow-shaped structural is formed after several main thermal columns 740 and several auxiliary thermal columns 750 are fixedly installed aluminium base 710, like this, main thermal column 740 and auxiliary thermal column 750 can be avoided on the one hand to the interference of installing fixing thermal column 730 generation, by which better fixing thermal column 730 mounting plate type radiator 700, simultaneously, the effect of the structure optimizing panel radiator 700 can also be played, improve heat dispersion better.
In order to further improve the heat dispersion of described panel radiator, such as, described panel radiator is metal plate type radiator, and and for example, described panel radiator is alloy plate type radiator.
Such as, the panel radiator of an embodiment comprises each component of following mass percent:
The aluminium of silicon 0.7 part ~ 0.5 part, iron 0.5 part ~ 0.6 part, copper 0.05 part ~ 0.3 part, 0.3 part ~ 0.7 part, manganese, 2.1 parts ~ 2.9 parts, magnesium, chromium 0.18 part ~ 0.28 part, 5.1 parts ~ 6.1 parts, zinc, titanium 0.2 part ~ 0.3 part and surplus.Be appreciated that, by adopting zinc and the magnesium of above-mentioned mass percent, the significant MgZn2 of strengthening effect can be formed, make the thermal effectiveness of panel radiator far better than a zinc bianry alloy, tensile strength will be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat-conductive characteristic is also comparatively large, i.e. the good heat dispersion performance of panel radiator.
And for example, or the different setting identical with described thermal column material of described aluminium base, and for example, described aluminium base is aluminium alloy base plate, and described thermal column is copper post.And for example, described thermal column specifically comprises described fixing thermal column, described main thermal column and described auxiliary thermal column.
In order to strengthen the radiating effect of described thermal column further, such as, described thermal column is copper post, and and for example, described copper post is hollow tubular structure, and for example, refers to Fig. 8, the sidewall of copper post 900a offers several louvres 910a.And for example, the height of described copper post is 2 times of the thickness of described aluminium base to 5 times; The such as height of described copper post is 3.2 times of the thickness of described aluminium base.And for example, described thermal column is that array is arranged.Like this, the radiating effect strengthening described thermal column can be increased further.
Please refer to Fig. 6 and Fig. 7, aluminium base 710 arranges several installation positions 711, for installing LED chip 800 away from a side of two heat-dissipating fins 720, several fixing thermal columns 730, several main thermal columns 740 and several auxiliary thermal columns 750.
In order to install LED chip better and protect LED chip; such as; described installation position is hemispherical; described LED chip is arranged on the side of described aluminium base; and described LED chip is fixedly placed in described installation position; like this, can LED chip be arranged on better and protect LED chip.
In order to increase the radiating effect of aluminium base 710 further, such as, refer to Fig. 7, aluminium base 710 is arranged some through holes 712, through hole 712 can increase the cooling surface area of aluminium base 710, and aluminium base 710 be positioned at the side being provided with LED chip 800 comparatively hot-air can by own vol expand via through holes 712 flow into two heat-dissipating fins 720 are installed, several fixing thermal columns 730, the opposite side of several main thermal columns 740 and several auxiliary thermal columns 750, like this, by above-mentioned air circulation, the radiating effect of aluminium base 710 can be increased further.
In order to further increase the radiating effect of aluminium base 710, taking away the heat that LED chip 800 produces more quickly, such as, referring to Fig. 7, through hole 712 is arranged in array, and installation position 711 is arranged in array.And for example, each installation position 711 is arranged at the center of the rectangle that four through holes 712 surround.And for example, the aperture of through hole 712 is 30% to 70% of the spacing of installation position 711.And for example, the aperture of through hole 712 is less than the spacing of installation position 711.
Refer to Fig. 6, scatter plate 900 is fixedly installed on aluminium base 710, and LED chip 800 is between aluminium base 710 and scatter plate 900, and the light therethrough scatter plate 900 that LED chip 800 is launched exposes to outside.
Such as, described panel radiator is provided with several installation positions and several thermal columns; Described panel radiator comprises aluminium base and thermal column, and described aluminium base has the first relative side and the second side, and described installation position is positioned on described first side, and described thermal column is arranged on described second side.And for example, described in each, installation position correspondence installs LED chip described in; Described installation position is that array is arranged.The radius of described copper post is 10% to 20% of the spacing of described installation position.And for example, described scatter plate is fixedly installed on described first side of described aluminium base, and scatter plate described in the light therethrough of described LED chip transmitting.
The above-mentioned LED lamp 30 with panel radiator passes through LED chip 800 to be set directly on panel radiator 700, and structure is comparatively simple, achieves integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, the above-mentioned panel radiator 700 with the LED lamp 30 of panel radiator directly can be used as shell and use, and there is fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Embodiment 3
Refer to Fig. 9, the LED lamp 50 with flat heat spreader structures comprises radiator 100, several LED chip 200 and scatter plate 300.Several LED chip 200 and scatter plate 300 are all arranged on radiator 100.By directly arranging on radiator 100 by LED chip 200, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, and the radiator 100 of the LED lamp 20 of above-mentioned radiator directly can be used as shell and use, and has fabulous heat conduction and radiating effect, and manufacture difficulty is lower, and cost is lower
Refer to Fig. 9, radiator 100 comprises several substrates 110, two heat radiation wing plate 120, two fixing radiating fins 130, several main radiating fins 140 and several auxiliary radiating fins 150.Heat radiation wing plate 120, fixing radiating fin 130 and main radiating fin 140 are all fixedly installed on substrate 110, and auxiliary radiating fin 150 is arranged on heat radiation wing plate 120.
Several substrates 110 successively interval are fixedly installed on a side of fixing radiating fin 130, main radiating fin 140 and heat radiation wing plate 120, that is, the bearing of trend of several substrates 110 is parallel, fixing radiating fin 130, main radiating fin 140 and the heat radiation bearing of trend of wing plate 120 are vertical with the bearing of trend of substrate 110, like this, the hollow out degree of radiator 100 can be improved, be convenient to form more heat-dissipating space in radiator 100 inside, thus improve the cooling surface area of radiator 100, and then improve the radiating effect of radiator 100.
In order to increase the cooling surface area of radiator 100, simultaneously, be beneficial to flow through both sides heat radiation wing plate 120 compared with cold air take away substrate 110 pass to heat radiation wing plate 120 heat, formation cross-ventilation conducts heat, thus the radiating effect of radiator 100 can be improved further, such as, refer to Fig. 9, one side of heat radiation wing plate 120 is fixedly installed on the end, one end of several substrates 110, and heat radiation wing plate 120 forms angle with the plane at several substrate 110 places, such as, the angle of described angle is 30 degree to 90 degree.Be appreciated that, heat radiation wing plate 120 is that incline direction stretches into extraneous air away from a side of substrate 110, like this, the cooling surface area of radiator 100 can be increased, in addition, also be beneficial to flow through both sides heat radiation wing plate 120 take away compared with cold air the heat that substrate 110 passes to heat radiation wing plate 120, form cross-ventilation heat transfer, thus the radiating effect of radiator 100 can be improved further.And for example, heat radiation wing plate 120 is square platy structure, and and for example, heat radiation wing plate 120 is arc platy structure.
In order to increase the cooling surface area of radiator 100 further, such as, refer to Fig. 9, several auxiliary radiating fins 150 successively interval are fixedly installed on heat radiation wing plate 120, the bearing of trend of several auxiliary radiating fins 150 is identical, and the bearing of trend of several auxiliary radiating fins 150 and the bearing of trend of substrate 110 is vertical, like this, the cooling surface area of radiator 100 can be increased further, thus the radiating effect of radiator 100 can be improved further.
In order to installation of heat radiator 100 better, such as, refer to Fig. 9, one side of fixing radiating fin 130 is fixedly installed on the medium position of several substrates 110, another side edge bending of fixing radiating fin 130 arranges buckle installation portion 131, like this, radiator 100 can be directly installed on outside support by buckle installation portion 131, thus can installation of heat radiator 100 better.Such as, be arranged on floor body of wall.
In order to increase the cooling surface area of radiator 100 further, such as, refer to Fig. 9, one side of main radiating fin 140 is fixedly installed on two side positions of several substrates 110, the bearing of trend of several main radiating fins 140 is identical, and the bearing of trend of several main radiating fins 140 and the bearing of trend of substrate 110 is vertical, like this, the cooling surface area of radiator 100 can be increased further, thus the radiating effect of radiator 100 can be improved further.
In order to installation of heat radiator 100 better, simultaneously, be beneficial to the structure optimizing radiator 100, improve radiating effect better, such as, refer to Fig. 9, two fixing radiating fins 130, sector structure is formed after several main radiating fins 140 and several auxiliary radiating fins 150 are fixedly installed substrate 110, the i.e. height of two fixing radiating fins 130, the height of main radiating fin 140 and the height of auxiliary radiating fin 150 successively decrease successively, like this, main radiating fin 140 and auxiliary radiating fin 150 can be avoided on the one hand to the interference of installing fixing radiating fin 130 generation, by which better fixing radiating fin 130 installation of heat radiator 100, simultaneously, the effect of the structure optimizing radiator 100 can also be played, improve heat dispersion better.
In order to more progressive the heat dispersion improving described radiator, such as, described radiator is metal heat sink, and and for example, described radiator is alloy heat-sink device.And for example, described substrate is metal substrate, and and for example, described substrate is aluminium base, and and for example, described radiating fin is copper sheet, and for example, or the different setting identical with described radiating fin material of described substrate.And for example, described radiating fin specifically comprises described fixing radiating fin, described main radiating fin and described auxiliary radiating fin, and for example, and the identical or different setting of described fixing radiating fin, described main radiating fin and described auxiliary radiating fin material.And for example, radiating fin described in some described radiating fins offers several thermal vias.And for example, described in several, between thermal vias, radiating wire is set.And for example, described radiating wire forms network structure.
Such as, the radiator of an embodiment comprises each component of following mass percent:
The aluminium of silicon 0.4 part ~ 0.5 part, iron 0.5 part ~ 0.6 part, copper 0.05 part ~ 0.3 part, 0.3 part ~ 0.4 part, manganese, 2.1 parts ~ 2.9 parts, magnesium, chromium 0.18 part ~ 0.28 part, 5.1 parts ~ 6.1 parts, zinc, titanium 0.2 part ~ 0.3 part and surplus.Be appreciated that, by adopting zinc and the magnesium of above-mentioned mass percent, the significant MgZn2 of strengthening effect can be formed, make the thermal effectiveness of radiator far better than a zinc bianry alloy, tensile strength will be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, heat-conductive characteristic is also comparatively large, i.e. the good heat dispersion performance of radiator.
Refer to Fig. 9, substrate 110 arranges several installation positions 111 and fixed bit 113 away from a side of two heat radiation wing plates, 120, two fixing radiating fins 130, several main radiating fins 140 and several auxiliary radiating fins 150.Installation position 111 is for installing LED chip 200, and such as, described in each, LED chip correspondence arranges installation position described in.Fixed bit 113 is for installing scatter plate 300.
In order to be arranged on LED chip better and protect LED chip; such as; described installation position is hemispherical; described LED chip is arranged on the side of described substrate; and described LED chip is fixedly placed in described installation position; like this, can LED chip be arranged on better and protect LED chip.
In order to increase the radiating effect of substrate 110 further, such as, refer to Fig. 9, substrate 110 is arranged some through holes 112, through hole 112 can increase the cooling surface area of substrate 110, and substrate 110 be positioned at the side being provided with LED chip 200 comparatively hot-air can by own vol expand via through holes 112 flow into be provided with two heat radiation wing plates 120, two fixing radiating fins 130, the opposite side of several main radiating fins 140 and several auxiliary radiating fins 150, like this, by above-mentioned air circulation, the radiating effect of substrate 110 can be increased further.
In order to further increase the radiating effect of substrate 110, taking away the heat that LED chip 200 produces more quickly, such as, referring to Fig. 9, through hole 112 is arranged in array, and installation position 111 is arranged in array.And for example, each installation position 111 is arranged at the center of the rectangle that four through holes 112 surround.And for example, the aperture of through hole 112 is 20% to 10% of the spacing of installation position 111.And for example, the aperture of through hole 112 is less than the spacing of installation position 111.
In order to further increase the radiating effect of substrate 110, such as, referring to Fig. 9, forming a radiating groove 115 between two adjacent substrates 110, radiating groove 115 is beneficial to cross-ventilation heat transfer, like this, further can increase the radiating effect of substrate 110.
Please refer to Fig. 9 and Figure 10, scatter plate 300 is fixedly installed on substrate 110 by fixed bit 112, and LED chip 200 is between substrate 110 and scatter plate 300, and the light therethrough scatter plate 300 that LED chip 200 is launched exposes to outside.Such as, the both sides of scatter plate 300 are provided with strip bulge portion 310, and strip bulge portion 310 is fixedly installed on substrate 110, and for example, strip bulge portion 310 offer several fixing holes 311, for installing fixing scatter plate 300 and substrate 110.
In order to install fixing scatter plate better, such as, described substrate has the first relative side and the second side, described first side is provided with several installation positions and several fixed bits, some described radiating fins are arranged on described second side, and for example, described fixed bit is screw, described scatter plate is spirally connected and is fixedly installed on described each described fixed bit, and for example, described fixed bit is cylinder, described cylindrical height is 1 to 5 millimeter, and for example, described cylinder is copper post, described copper post is bolted in and is fixed on described substrate, and for example, described copper post is bolted in described scatter plate away from one end of described substrate, and described scatter plate and described substrates into intimate contact.
The above-mentioned LED lamp 50 with flat heat spreader structures passes through LED chip 200 to be set directly on radiator 100, and structure is comparatively simple, achieves integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition is in traditional LED lamp relatively, needs to set up heat abstractor at shell, the above-mentioned radiator 100 with the LED lamp 50 of flat heat spreader structures directly can be used as shell and use, and there is fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
It should be noted that, other embodiments of the present utility model also comprise, technical characteristic in the various embodiments described above be combined with each other the LED lamp with flat heat spreader structures that is formed, that can implement, like this, can reach good heat dissipation effect, the simpler and flat technique effect of structure.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. there is a LED lamp for flat heat spreader structures, it is characterized in that, comprising: flat radiator and several LED chip;
Described flat radiator arranges several installation positions;
Described in each, installation position correspondence installs LED chip described in;
Described flat radiator comprises several heat-conducting substrates be arranged side by side, two heat radiation wing plates, two fixing radiating fins, several main radiating fins and several auxiliary radiating fins, described heat radiation wing plate, described fixing radiating fin and described main radiating fin are all fixedly installed on described heat-conducting substrate, and described auxiliary radiating fin is arranged on described heat radiation wing plate.
2. LED lamp according to claim 1, is characterized in that, described flat radiator arranges some through holes.
3. LED lamp according to claim 2, is characterized in that, described through hole is that array is arranged.
4. LED lamp according to claim 3, is characterized in that, described installation position is that array is arranged.
5. LED lamp according to claim 4, is characterized in that, installation position described in each is arranged at the center of the rectangle that four described through holes surround.
6. LED lamp according to claim 5, is characterized in that, the aperture of described through hole is less than the spacing of described installation position.
7. LED lamp according to claim 6, is characterized in that, the aperture of described through hole is 20% to 40% of the spacing of described installation position.
8. LED lamp according to claim 1, is characterized in that, described installation position is hemispherical.
9. LED lamp according to claim 8, is characterized in that, described LED chip is arranged on the side of described flat radiator, and is installed in described installation position.
10., according to the arbitrary described LED lamp of claim 1 to 9, it is characterized in that, also comprise a scatter plate, described scatter plate is fixedly installed on described flat radiator, and scatter plate described in the light therethrough of described LED chip transmitting.
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| CN201420513839.0U CN204254557U (en) | 2014-09-05 | 2014-09-05 | There is the LED lamp of flat heat spreader structures |
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| CN201420513839.0U CN204254557U (en) | 2014-09-05 | 2014-09-05 | There is the LED lamp of flat heat spreader structures |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020206868A1 (en) * | 2019-04-09 | 2020-10-15 | 广州爱奇实业有限公司 | Heat dissipation device for high-power led lamp |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020206868A1 (en) * | 2019-04-09 | 2020-10-15 | 广州爱奇实业有限公司 | Heat dissipation device for high-power led lamp |
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