WO2020195443A1 - Production method for layered product - Google Patents

Production method for layered product Download PDF

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Publication number
WO2020195443A1
WO2020195443A1 PCT/JP2020/007298 JP2020007298W WO2020195443A1 WO 2020195443 A1 WO2020195443 A1 WO 2020195443A1 JP 2020007298 W JP2020007298 W JP 2020007298W WO 2020195443 A1 WO2020195443 A1 WO 2020195443A1
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group
sio
adhesive layer
producing
curing
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PCT/JP2020/007298
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French (fr)
Japanese (ja)
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武春 豊島
利之 小材
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信越化学工業株式会社
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/07Aldehydes; Ketones
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • C09J183/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements

Definitions

  • the present invention relates to a method for producing a laminate, and more specifically, to a method for producing a laminate having an adhesive layer made of a cured product of a photocurable silicone composition.
  • Electronic devices such as displays and touch panels that have image display capability generally include protective cover panels made of highly transparent resin such as acrylic or polycarbonate or glass, and polarizing plates and image display elements. It has an image display unit provided on the substrate. An optical transparent resin layer is often arranged between the cover panel and the image display unit in order to improve visibility and mechanical strength.
  • protective cover panels made of highly transparent resin such as acrylic or polycarbonate or glass, and polarizing plates and image display elements. It has an image display unit provided on the substrate.
  • An optical transparent resin layer is often arranged between the cover panel and the image display unit in order to improve visibility and mechanical strength.
  • Patent Document 1 an ultraviolet addition-curable transparent silicone adhesive composition has been proposed (Patent Document 1). Since the curing reaction of this adhesive composition by the platinum catalyst gradually proceeds with the irradiation of ultraviolet rays, the adhesive composition is applied on the polarizing plate of the image display portion, and the cover panel is attached after the irradiation with ultraviolet rays. A processing process can be adopted. As a result, the above-mentioned integrated molding method has the advantages that it can be used in places (dark areas) that are not irradiated with ultraviolet rays, and that a cover panel having an ultraviolet absorber can also be used to impart weather resistance. can get.
  • the curing of the resin may be delayed. It is considered that this phenomenon is because the curing inhibitor generated from the polarizing plate by the irradiation of ultraviolet rays inhibits the activity of the platinum catalyst.
  • the resin is not sufficiently cured on the polarizing plate, and as a result, the adhesive force and the adhesive force are lowered, and the reliability of the device is impaired. In such a case, it becomes necessary to add a temperature raising process using a heating facility to ensure curability, or to extend the standing time until curing, which may reduce mass productivity and heat.
  • the present invention has been made in view of the above circumstances, and even when the adhesive layer made of a photocurable silicone composition is cured at room temperature, it is not hindered by the adherend such as a polarizing plate. It is an object of the present invention to provide a method for producing a laminate.
  • the present inventors irradiate a silicone composition containing a predetermined organopolysiloxane with light of a specific wavelength and cure it to form an adhesive layer at room temperature.
  • the present invention has been completed by finding that the adhesive layer is rapidly cured on the polarizing plate even when the curing is performed with.
  • the present invention 1.
  • a method for producing a laminate which comprises irradiating a photocurable silicone composition with light having a peak wavelength of 380 to 420 nm and curing the photocurable silicone composition.
  • a represents a number of 0.3 to 2
  • b is 0 to 100
  • c is 1 to 1,000
  • b / (b + c) 0 to 0.
  • ⁇ (B) represented by the following average compositional formula (2), organohydrogenpolysiloxane having at least two Si-H bonds in one molecule: 1 to 200 parts by weight R 3 d H e SiO [( 4- de) / 2] (2)
  • R 3 independently represents a substituted or unsubstituted monovalent hydrocarbon group excluding the aliphatic unsaturated hydrocarbon group, and d and e are 0.7 ⁇ d ⁇ 2.5, respectively.
  • (C) A platinum compound having at least one of a ⁇ -diketonato group, a ⁇ -ketoesterate group, and a 1,3-diesterate group as a ligand.
  • a coating step of applying the photocurable silicone composition to the surface of the first substrate and (Ii) A light irradiation step of irradiating a photocurable silicone composition with light having a peak wavelength of 380 to 420 nm, and (Iii) A curing step of curing a photocurable silicone composition to form an adhesive layer, (Iv) Laminating a second base material on a photocurable silicone composition or an adhesive layer, and laminating the first and second base materials via the adhesive composition or the adhesive layer.
  • a method for producing a laminate of 1 or 2 including steps, 4. 3. A method for producing a laminate of 3, wherein the curing step is performed at 5 to 35 ° C. 5.
  • the photocurable silicone composition cures rapidly even at room temperature of about 25 ° C. regardless of the type of polarizing plate with which it comes into contact.
  • the manufacturing method of the present invention having such characteristics can be suitably used as a bonding method for image display devices such as touch panels and displays.
  • the method for producing a laminate according to the present invention is a method for producing a laminate including a first base material and an adhesive layer laminated on the first base material, wherein the adhesive layer is formed as described above ( It is characterized in that a photocurable silicone composition containing the components A) to (C) is irradiated with light having a peak wavelength of 380 to 420 nm and cured to be formed.
  • the component (A) in the photocurable silicone composition used in the present invention is a linear organopolysiloxane represented by the following average formula (1).
  • R 1 independently represents a substituted or unsubstituted alkenyl group.
  • the alkenyl group is not particularly limited and may be linear, branched or cyclic, but those having 2 to 20 carbon atoms are preferable, those having 2 to 10 carbon atoms are more preferable, and carbon atoms are more preferable. Those having the numbers 2 to 6 are even more preferable.
  • Specific examples of the alkenyl group include vinyl, allyl, butenyl, pentenyl, hexenyl group and the like, but the vinyl group is preferable.
  • a part or all of the hydrogen atom of the alkenyl group may be substituted with a halogen atom such as F, Cl, Br, a cyano group or the like.
  • R 2 independently represents a substituted or unsubstituted alkyl group.
  • the alkyl group is not particularly limited and may be linear, branched or cyclic, but those having 1 to 20 carbon atoms are preferable, those having 1 to 10 carbon atoms are more preferable, and carbon atoms are more preferable. Those having the numbers 1 to 5 are even more preferable.
  • Specific examples of the alkyl group include linear or branched alkyl groups such as methyl, ethyl, n-propyl, i-propyl, n-butyl, n-pentyl, n-hexyl and n-heptyl groups; cyclohexyl groups and the like.
  • Cyclic alkyl groups and the like can be mentioned. Further, a part or all of the hydrogen atom of the above alkyl group may be substituted with a halogen atom such as F, Cl, Br, a cyano group or the like, and specific examples of such a group include chloromethyl and 3 -Halogen-substituted alkyl groups such as chloropropyl and 3,3,3-trifluoropropyl groups can be mentioned. Among these, a methyl group is preferable from the viewpoint of heat resistance.
  • Ar represents an independently substituted or unsubstituted aryl group.
  • the aryl group is not particularly limited, but preferably has 6 to 20 carbon atoms, and more preferably 6 to 10 carbon atoms. Specific examples of the aryl group include phenyl, naphthyl, trill, xsilyl, mesitylene and the like. Further, a part or all of the hydrogen atom of the aryl group may be substituted with a halogen atom such as F, Cl, Br, a cyano group or the like, and specific examples of such a group include a chlorophenyl group or the like. Can be mentioned. Of these, a phenyl group is preferable.
  • a represents a number of 0.3 to 2. If a is less than 0.3, the content of R 1 is low, so that there is a risk of bleeding out of uncrosslinked components and the composition becoming too soft.
  • b is a number from 0 to 100, but a number from 0 to 50 is preferable. If b is larger than 100, the viscosity may become too high.
  • c is a number of 1 to 1,000, preferably a number of 1 to 500, and more preferably a number of 100 to 300. If c is less than 1, the cured product may become too hard, and if it is more than 1,000, the viscosity may become too high.
  • b / (b + c) is 0 to 0.7, but 0 to 0.3 is preferable. If b / (b + c) is larger than 0.7, the viscosity may become too high.
  • the weight average molecular weight (Mw) in terms of standard polystyrene as measured by gel permeation chromatography (GPC) using a THF solvent is preferably 500 to 100,000, preferably 700 to 50,000. More preferably, 1,000 to 30,000 is even more preferable.
  • component (A) examples include those represented by the following average formulas (3) to (5), but are not limited thereto.
  • the organopolysiloxane of the component (A) may be used alone or in combination of two or more.
  • Me represents a methyl group
  • Ph represents a phenyl group
  • Vi represents a vinyl group (the same applies hereinafter).
  • the sequence order of the siloxane units is arbitrary.
  • Component (B) The component (B) in the photocurable silicone composition used in the present invention has at least two Si—H bonds in one molecule represented by the following average composition formula (2).
  • Organohydrogen polysiloxane R 3 d H e SiO [( 4-de) / 2] (2)
  • R 3 independently represents a substituted or unsubstituted monovalent hydrocarbon group excluding the aliphatic unsaturated hydrocarbon group.
  • the monovalent hydrocarbon group of R 3 is not particularly limited as long as it does not have an aliphatic unsaturated hydrocarbon group, and may be linear, branched, or cyclic, but those having 1 to 20 carbon atoms are used. Preferably, one having 1 to 10 carbon atoms is more preferable, and one having 1 to 5 carbon atoms is even more preferable.
  • linear or branched alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl and n-hexyl groups; cyclic alkyl groups such as cyclohexyl groups; phenyl and trill groups.
  • aryl groups examples thereof include aralkyl groups such as benzyl and phenylethyl groups.
  • a part or all of the hydrogen atoms of these monovalent hydrocarbon groups may be substituted with halogen atoms such as F, Cl and Br, cyano groups and the like, and specific examples of such groups include.
  • Halogen-substituted hydrocarbon groups such as 3,3,3-trifluoropropyl group; cyano-substituted hydrocarbon groups such as 2-cyanoethyl group and the like can be mentioned. Among these, a methyl group is preferable.
  • 20 mol% or more of the total number of R 3 and Si—H groups in the component (B) is preferably a methyl group, and 50 A methyl group is more preferable in terms of molar% or more.
  • d is a number of 0.7 ⁇ d ⁇ 2.5, preferably a number of 0.7 ⁇ d ⁇ 2.1, and a number of 1.0 ⁇ d ⁇ 1.8. More preferred. If d is less than 0.7, foaming may occur during curing, and the change in hardness with time tends to be large. If d exceeds 2.5, sufficient hardness cannot be obtained.
  • e is a number of 0.01 ⁇ e ⁇ 1.0, a number of 0.02 ⁇ e ⁇ 1.0 is preferable, and a number of 0.1 ⁇ e ⁇ 1.0 is more preferable.
  • d + e satisfies 0.8 ⁇ d + e ⁇ 2.7, preferably 1 ⁇ d + e ⁇ 2.4, and more preferably 1.6 ⁇ d + e ⁇ 2.2. If d + e is less than 0.8, the cured product tends to be hard and brittle, so that cracks are likely to occur in the adhesive layer, and if it exceeds 2.7, the cured product becomes soft and the reinforcing property of the laminated body becomes poor.
  • the kinematic viscosity of the component (B) component organohydrogenpolysiloxane at 25 ° C. is preferably 1,000 mm 2 / s or less, more preferably 0.5 to 1,000 mPa ⁇ s, and more preferably 1 to 500 mm 2 / s. More preferred.
  • the kinematic viscosity is a measured value using a Canon Fenceke viscometer.
  • the blending amount of the organohydrogenpolysiloxane of the component (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the component (A), but 5 to 80 parts by mass is preferable. If the blending amount is less than 1 part by mass, the curability becomes insufficient, and if it exceeds 200 parts by mass, sufficient hardness and strength cannot be obtained. Further, in the organohydrogenpolysiloxane of the component (B), the molar ratio of the silicon atom-bonded hydrogen atom (that is, SiH group) in the component (B) to the alkenyl group in the component (A) is 0.5 to 2. It is preferably blended in an amount of mol / mol, and more preferably blended in an amount of 1 to 1.5 mol / mol.
  • the component (B) include those represented by the following average formulas (6) to (8), but are not limited thereto.
  • the organohydrogenpolysiloxane of the component (B) may be used alone or in combination of two or more.
  • Component (C) The component (C) in the photocurable silicone composition used in the present invention coordinates at least one of a ⁇ -diketonato group, a ⁇ -ketoesterate group, and a 1,3-diesterate group. It is a platinum compound having as a child. Although this platinum compound is inactive in the shaded state, it changes to a platinum catalyst that is active at room temperature when irradiated with light having a wavelength of 380 to 420 nm, and the alkenyl group in the above-mentioned component (A) and ( B) It has a function of promoting the hydrosilylation reaction with the silicon atom-bonded hydrogen atom in the component.
  • component (C) examples include a trimethyl (acetylacetonato) platinum complex, a trimethyl (2,4-pentanetone) platinum complex, a trimethyl (3,5-heptanzionate) platinum complex, and a trimethyl (methylacetoacetate).
  • Platinum complex bis (acetylacetonato) platinum complex, bis (2,4-pentandionato) platinum complex, bis (2,4-hexandionato) platinum complex, bis (2,4-heptandionat) platinum complex, Examples thereof include a bis (3,5-heptandionat) platinum complex, a bis (1-phenyl-1,3-butandionato) platinum complex, and a bis (1,3-diphenyl-1,3-propanedionat) platinum complex. May be used alone or in combination of two or more. Among these, a bis (acetylacetonato) platinum complex and a derivative modified on the acetylacetonato group thereof are preferable.
  • the content of the component (C) is not limited as long as it is an amount that promotes curing (hydrosilylation reaction) of the photocurable silicone composition, but the metal atoms in the composition are mass-converted with respect to the component (A).
  • the amount in the range of 0.01 to 500 ppm is preferable, the amount in the range of 0.05 to 100 ppm is more preferable, and the amount in the range of 0.01 to 50 ppm is even more preferable.
  • composition used in the present invention has adhesiveness to a substrate such as a polarizing plate, glass, polycarbonate resin or acrylic resin as a component (D), if necessary. Adhesive aids for imparting may be added.
  • adhesion aid containing a siloxane bond examples include vinyl trimethoxysilane (KBM-1003 manufactured by Shin-Etsu Chemical Industry Co., Ltd.) and ⁇ - (glycidyloxypropyl) trimethoxysilane ( Shin-Etsu Chemical Industry Co., Ltd., KBM-403), ⁇ - (methacryloxypropyl) trimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., KBM-503), their hydrolyzates, and the following structural formulas. Examples thereof include compounds to be used.
  • the adhesive aid containing no siloxane bond examples include allyl glycidyl ether, vinyl cyclohexene monooxide, diethyl 2-allyl malonate, diallyl bisphenol ether, allyl benzoate, diallyl phthalate, and tetraallyl ester pyromellitic acid.
  • TRIAM805 manufactured by Fujifilm Wako Junyaku Co., Ltd., triallyl isocyanurate, and the like.
  • the component (D) may be used alone or in combination of two or more.
  • the amount added is preferably 0.05 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the component (A).
  • the blending amount of the component (D) is within the above range, appropriate adhesiveness can be imparted.
  • the photocurable silicone adhesive composition used in the present invention includes thickening and gel before heat curing such as when preparing the composition or when applying the composition to a substrate.
  • the reaction control agent (E) may be added for the purpose of controlling the reactivity of the hydrosilylation reaction catalyst so as not to cause the formation.
  • Specific examples of the reaction control agent include 3-methyl-1-butyne-3-ol, 3-methyl-1-pentyne-3-ol, 3,5-dimethyl-1-hexin-3-ol, and 1-ethynyl.
  • 1-ethynylcyclohexanol, ethynylmethyldecylcarbinol, 3-methyl-1-butyne-3-ol, and bis (2,2-dimethyl-3-butynoxy) dimethylsilane are preferable.
  • the blending amount of the component (E) is preferably 0.01 to 2.0 parts by mass, more preferably 0.01 to 0.1 parts by mass with respect to 100 parts by mass of the total of the component (A). Within such a range, the effect of reaction control is fully exhibited.
  • the photocurable silicone adhesive composition used in the present invention contains other components exemplified below as long as the object of the present invention is not impaired. It may be contained.
  • Other components include, for example, a thixophilic control agent such as fumed silica; a reinforcing agent such as crystalline silica; an antioxidant; a light stabilizer; a heat resistance improver such as a metal oxide and a metal hydroxide; and titanium oxide.
  • Colorants such as: Thermal conductivity-imparting fillers such as alumina and crystalline silica; Viscosity modifiers such as non-reactive silicone oil having no reactive functional group; Conductivity-imparting agents such as metal powders such as silver and gold And so on.
  • the photocurable silicone adhesive composition used in the present invention is a mixture of the above components (A) to (C), components (D) and (E) used as necessary, and other components by a known method. Can be prepared.
  • the above-mentioned photocurable silicone adhesive composition is suitably used as a composition for forming an adhesive layer when two base materials constituting a laminate such as an optical device, a display, and a touch panel are bonded together via an adhesive layer. it can.
  • the method for producing the laminate includes a coating step, a light irradiation step, a curing step, and a bonding step, and details of each step include, for example, those shown below.
  • the above-mentioned photocurable silicone adhesive composition is coated on a base material (first base material).
  • the coating method include coating using a slit coat, a DAM-Fill method, a fishbone method, and the like.
  • the coating amount is not particularly limited, but is preferably an amount such that the thickness of the silicone layer after curing is 100 to 5,000 ⁇ m.
  • the base material examples include polarizing materials and composite materials, metal members, plastic members, ceramic members, etc., and in particular, casings for electrical applications, electronic applications, optical applications, etc., coating of members, casting, bonding, sealing, etc. It is useful for those used in the above fields, and is particularly useful for polarizing plates and polarizing films.
  • the photocurable silicone adhesive composition can also be used for a substrate activated by a well-known pretreatment step such as primer treatment, plasma treatment, and excimer light treatment.
  • the photocurable silicone adhesive composition is irradiated with light.
  • the light irradiation method include a method of using a lamp having a peak wavelength of 380 to 420 nm as a light source and irradiating an appropriate amount of light.
  • a 405 nm UV-LED lamp is preferable.
  • the light to be irradiated is light having a peak wavelength of 380 to 420 nm, preferably 395 to 410 nm, and more preferably 405 nm.
  • the temperature at the time of light irradiation is preferably 5 to 60 ° C., more preferably 5 to 35 ° C.
  • the irradiation intensity is preferably 300 to 2,000 mW / cm 2
  • the irradiation dose is preferably 1,000 to 20,000 mJ / cm 2 from the viewpoint of curability and workability.
  • the curing step the light-irradiated composition is cured.
  • the curing method is not particularly limited, and examples thereof include a method in which a light-irradiated composition is allowed to stand in a predetermined environment to be cured to form an adhesive layer.
  • the curing temperature is not particularly limited, but is preferably 5 to 60 ° C., more preferably 5 to 35 ° C., from the viewpoint of suppressing warpage and deterioration due to thermal expansion / contraction of the laminate.
  • the curing atmosphere is arbitrary, but is preferably in an air atmosphere.
  • the curing time is not particularly limited, but is preferably about 1 minute to 24 hours.
  • the second base material is laminated on the photocurable silicone adhesive composition or the adhesive layer, and the two base materials are combined with the adhesive composition or the adhesive layer.
  • a laminated body is formed which is bonded to each other.
  • a bonding method an adhesive layer-base material laminate that has changed from a liquid to a semi-solid state through a coating step, a light irradiation step, and a curing step, a photocurable silicone adhesive composition after the coating step, or a bonding method.
  • the photocurable silicone adhesive composition layer-base material laminate after the coating step and the light irradiation step is installed in a vacuum or atmospheric pressure bonding device, and the second base material is a photocurable silicone adhesive composition or Examples thereof include a method of laminating and laminating on an adhesive layer, and in the case of a composition, performing the remaining steps to cure and form a laminated body.
  • the method for producing a laminate of the present invention is a flat display or a curved display because it is not hindered by oxygen and the curing time after irradiation with light can be changed depending on the design of the adhesive composition and the heating temperature. Etc., the procedures of the coating process, the light irradiation process, the curing process, and the bonding process can be freely selected and changed according to the structure of the device to be manufactured.
  • the method for manufacturing the laminate of the present invention include a method for producing a laminate having a cover panel and an image display panel.
  • the photocurable silicone composition of the present invention is applied onto a polarizing plate constituting an image display panel.
  • a UV-LED lamp having a wavelength peak of 405 nm light with an irradiation intensity of 100 mW / cm 2 using 405 nm light as an index was applied to the photocurable silicone composition at 25 ° C. for 100 seconds at a dose of 10, Irradiate to 000 mJ / cm 2 .
  • the silicone composition is allowed to stand in an environment of 25 ° C. for 30 minutes to cure the silicone composition to form an adhesive layer.
  • the cover panel is laminated on the adhesive layer using a vacuum bonding device to obtain a laminated body in which the cover panel and the image display panel are bonded via the adhesive layer.
  • the cover panel is first laminated on the silicone composition using a vacuum bonding device, so that the image display panel and the cover panel are bonded via the silicone composition, and then at 25 ° C.
  • the silicone composition may be cured by allowing it to stand in the environment for 30 minutes.
  • vacuum bonding may be performed after the coating step, and then light irradiation may be performed through the cover panel to cure the cover panel.
  • the silicone composition that has been irradiated with light in advance may be applied to the image display panel, vacuum-bonded to the cover panel, and cured.
  • Mw represents the weight average molecular weight in terms of standard polystyrene measured by GPC using a THF solvent.
  • (B-2) Dimethylsiloxane Me 1.8 H 0.3 SiO [1.9 / 2] which is represented by the following average composition formula (7) and has a kinematic viscosity of 27 mm 2 / s at 23 ° C. and a hydrodimethylsiloxy group blockade at both ends of the molecular chain .
  • (C) component (C-1) Ethyl acetate 2- (2-butoxyethoxy) ethyl acetate solution of bisacetylacetonato platinum complex (platinum content 0.5% by mass) (C-2) Comparative component Toluene solution of trimethyl (methylcyclopentadienyl) platinum complex (platinum content 0.5% by mass)
  • Fumed silica (Aerosil NSX-200 (average primary particle size 8 nm), Nippon Aerosil Co., Ltd.)
  • ANOJ6186 manufactured by ANOJ6186
  • a UV-LED lamp having a wavelength of 405 nm ANOJ6189, manufactured by Panasonic Corporation
  • Polarizing plate 1 NPF-CWQ1463VCU manufactured by Nitto Denko Corporation Polarizing plate 2: NAZ-EFCFWQVAG15AR manufactured by Nitto Denko Corporation Polarizing plate 3: NAZ-EFCFWQVAG150 manufactured by Nitto Denko Corporation Polarizing plate 4: NPF-CWQ1463VCUAG15ARS manufactured by Nitto Denko KK Polarizing plate 5: NPF-SWQ1423CUARC380 manufactured by Nitto Denko Corporation Polarizing plate 6: NPF-CWQ1463VCUAG150 manufactured by Nitto Denko Corporation
  • the photocurable silicone composition is rapidly cured at 25 ° C. regardless of the type of polarizing plate to be contacted, and the touch panel, display, etc. It can be said that it has been shown that it can be suitably used for bonding image display devices.
  • Comparative Examples 1 and 2 using an addition reaction catalyst other than the component (C) of the present invention curing by light irradiation using an LED light source having a peak wavelength of 405 nm did not occur, and the light source in Examples 1 and 2 peaked. It can be seen that in Comparative Examples 3 and 4 in which the LED light source having a wavelength of 365 nm was changed, curing inhibition due to the polarizing plate may occur.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
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  • Adhesives Or Adhesive Processes (AREA)
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  • Adhesive Tapes (AREA)

Abstract

This production method for a layered product including a substrate, and an adhesive layer stacked on the substrate, wherein the adhesive layer is cured and formed by irradiating a composition containing components (A)-(C) with light having a peak wavelength of 380-420 nm. This method enables production of the layered product without inhibition of the curing by an adherend such as a polarizing plate even when the curing of the adhesive layer containing a photocurable silicone composition is performed at room temperature. (A) A polysiloxane (1): (R1R2 2SiO1/2)a(R2 3SiO1/2)2-a(Ar2SiO2/2)b(R2 2SiO2/2)c {R1 represents alkenyl, R2 represents alkyl, Ar represents aryl, 'a' represents 0.3-2, b represents 0-100, c represents 1-1,000, and b/(b+c) = 0 to 0.7 is satisfied}. (B) A hydrogen polysiloxane (2) having at least two SiH bonds per molecule (2): R3 dHeSiO[(4-d-e)/2] (R3 represents a monovalent hydrocarbon group, except for a C=C group, and d and e satisfy 0.7≤d≤2.5, 0.01≤e≤1.0, and 0.8≤d+e≤2.7). (C) A platinum compound having at least one of a β-diketonate group, a β-ketoesterate group, and a 1,3-diesterate group as a ligand

Description

積層体の製造方法Method of manufacturing a laminate
 本発明は、積層体の製造方法に関し、さらに詳述すると、光硬化型シリコーン組成物の硬化物からなる接着層を備える積層体の製造方法に関する。 The present invention relates to a method for producing a laminate, and more specifically, to a method for producing a laminate having an adhesive layer made of a cured product of a photocurable silicone composition.
 ディスプレイやタッチパネルなどの画像表示能力を有する電子機器は、一般的にアクリルやポリカーボネート等の高透明樹脂またはガラス等からなる光透過性に優れた保護用のカバーパネル、および偏光板や画像表示素子を基板上に備えた画像表示部を有している。
 これらカバーパネルと画像表示部との間には、視認性および機械的強度を向上させるために、光学透明樹脂層が配置されることが多い。
Electronic devices such as displays and touch panels that have image display capability generally include protective cover panels made of highly transparent resin such as acrylic or polycarbonate or glass, and polarizing plates and image display elements. It has an image display unit provided on the substrate.
An optical transparent resin layer is often arranged between the cover panel and the image display unit in order to improve visibility and mechanical strength.
 上記光学透明樹脂層として、紫外線付加硬化型の透明シリコーン接着剤組成物が提案されている(特許文献1)。この接着剤組成物は、紫外線の照射を契機として白金触媒による硬化反応が徐々に進行するため、画像表示部の偏光板上に接着剤組成物を塗布し、紫外線照射した後にカバーパネルを貼り合わせる加工プロセスを採用することができる。これにより、上述の一体型の成形手法では紫外線が照射されない箇所(暗部)への使用が可能となったり、耐候性付与のために紫外線吸収剤を有するカバーパネルも使用可能となったりするメリットが得られる。 As the optical transparent resin layer, an ultraviolet addition-curable transparent silicone adhesive composition has been proposed (Patent Document 1). Since the curing reaction of this adhesive composition by the platinum catalyst gradually proceeds with the irradiation of ultraviolet rays, the adhesive composition is applied on the polarizing plate of the image display portion, and the cover panel is attached after the irradiation with ultraviolet rays. A processing process can be adopted. As a result, the above-mentioned integrated molding method has the advantages that it can be used in places (dark areas) that are not irradiated with ultraviolet rays, and that a cover panel having an ultraviolet absorber can also be used to impart weather resistance. can get.
 一方で、偏光板と液状樹脂が接している状態で、一般的に紫外線硬化に使用されるピーク波長365nmの紫外線を照射した際に、樹脂の硬化が遅れる現象が生じることがある。この現象は、紫外線の照射によって偏光板から発生した硬化阻害物質が、白金触媒の活性を阻害するためであると考えられる。この現象が生じると、偏光板上での樹脂の硬化が不十分となる結果、密着力や接着力が低下してデバイスの信頼性が損なわれる。
 このような場合、硬化性を確保するために加熱設備を用いた昇温工程を追加したり、硬化するまでの静置時間を延長したりする必要が生じ、量産性が低下する懸念や、熱による膨張収縮に伴う部材の反りや樹脂劣化が起こりやすくなる等の懸念がある。しかも、偏光板の種類によって硬化の挙動が変わるため、偏光板を変更するたびに製造プロセスを見直さなければならないという問題もある。
On the other hand, when the polarizing plate and the liquid resin are in contact with each other and irradiated with ultraviolet rays having a peak wavelength of 365 nm, which is generally used for ultraviolet curing, the curing of the resin may be delayed. It is considered that this phenomenon is because the curing inhibitor generated from the polarizing plate by the irradiation of ultraviolet rays inhibits the activity of the platinum catalyst. When this phenomenon occurs, the resin is not sufficiently cured on the polarizing plate, and as a result, the adhesive force and the adhesive force are lowered, and the reliability of the device is impaired.
In such a case, it becomes necessary to add a temperature raising process using a heating facility to ensure curability, or to extend the standing time until curing, which may reduce mass productivity and heat. There is a concern that the member may warp or the resin may deteriorate due to expansion and contraction. Moreover, since the curing behavior changes depending on the type of the polarizing plate, there is also a problem that the manufacturing process must be reviewed every time the polarizing plate is changed.
特開2015-110752号公報JP-A-2015-10752
 本発明は、上記事情に鑑みてなされたものであって、光硬化型シリコーン組成物からなる接着剤層の硬化を室温で行う場合でも、偏光板等の被着体からの硬化阻害を受けない積層体の製造方法を提供することを目的とする。 The present invention has been made in view of the above circumstances, and even when the adhesive layer made of a photocurable silicone composition is cured at room temperature, it is not hindered by the adherend such as a polarizing plate. It is an object of the present invention to provide a method for producing a laminate.
 本発明者らは、上記課題を解決すべく鋭意検討した結果、所定のオルガノポリシロキサンを含むシリコーン組成物に、特定波長の光を照射して硬化させて接着剤層を形成することで、室温で硬化を行う場合でも偏光板上で速やかに接着剤層が硬化することを見出し、本発明を完成した。 As a result of diligent studies to solve the above problems, the present inventors irradiate a silicone composition containing a predetermined organopolysiloxane with light of a specific wavelength and cure it to form an adhesive layer at room temperature. The present invention has been completed by finding that the adhesive layer is rapidly cured on the polarizing plate even when the curing is performed with.
 すなわち、本発明は、
1. 第一の基材と、この第一の基材に積層された接着剤層とを備える積層体の製造方法であって、前記接着剤層を、下記(A)~(C)成分を含有する光硬化型シリコーン組成物に、ピーク波長380~420nmの光を照射して硬化させて形成することを特徴とする積層体の製造方法、
(A)下記平均式(1)で表される直鎖状オルガノポリシロキサン:100質量部
 (R12 2SiO1/2a(R2 3SiO1/22-a(Ar2SiO2/2b(R2 2SiO2/2c  (1)
{式中、R1は、それぞれ独立して、置換または非置換のアルケニル基を表し、R2は、それぞれ独立して、置換または非置換のアルキル基を表し、Arは、それぞれ独立して、置換または非置換のアリール基を表し、aは、0.3~2の数を表し、bは、0~100、cは、1~1,000、かつ、b/(b+c)=0~0.7を満たす数を表す。}
(B)下記平均組成式(2)で表される、1分子中に少なくとも2個のSi-H結合を有するオルガノハイドロジェンポリシロキサン:1~200質量部
 R3 deSiO[(4-d-e)/2]  (2)
(式中、R3は、それぞれ独立して、脂肪族不飽和炭化水素基を除く置換または非置換の一価炭化水素基を表し、dおよびeは、0.7≦d≦2.5、0.01≦e≦1.0、かつ、0.8≦d+e≦2.7を満たす数を表す。)
(C)β-ジケトナト基、β-ケトエステラート基、および1,3-ジエステラート基の少なくとも1つを配位子として有する白金化合物
2. 前記(C)成分が、ビスアセチルアセトナト白金(II)である1の積層体の製造方法、
3. (i)光硬化型シリコーン組成物を第一の基材表面に塗布する塗布工程と、
 (ii)光硬化型シリコーン組成物にピーク波長380~420nmの光を照射する光照射工程と、
 (iii)光硬化型シリコーン組成物を硬化させて接着剤層を形成する硬化工程と、
 (iv)光硬化型シリコーン組成物または接着剤層の上に第二の基材を積層して第一および第二の基材を前記接着剤組成物または接着剤層を介して貼り合わせる貼合工程と
を含む1または2の積層体の製造方法、
4. 前記硬化工程が、5~35℃で行われる3の積層体の製造方法、
5. 前記第二の基材が、偏光板または偏光フィルムである3または4の積層体の製造方法、
6. 前記第一の基材が、偏光板または偏光フィルムである1~5のいずれかの積層体の製造方法、
7. 前記光のピーク波長が405nmである1~6のいずれかの積層体の製造方法、
8. 前記積層体が画像表示装置である1~7のいずれかの積層体の製造方法
を提供する。
That is, the present invention
1. 1. A method for producing a laminated body including a first base material and an adhesive layer laminated on the first base material, wherein the adhesive layer contains the following components (A) to (C). A method for producing a laminate, which comprises irradiating a photocurable silicone composition with light having a peak wavelength of 380 to 420 nm and curing the photocurable silicone composition.
(A) Linear organopolysiloxane represented by the following average formula (1): 100 parts by mass (R 1 R 2 2 SiO 1/2 ) a (R 2 3 SiO 1/2 ) 2-a (Ar 2) SiO 2/2 ) b (R 2 2 SiO 2/2 ) c (1)
{In the formula, R 1 independently represents a substituted or unsubstituted alkenyl group, R 2 independently represents a substituted or unsubstituted alkyl group, and Ar independently represents a substituted or unsubstituted alkyl group. It represents a substituted or unsubstituted aryl group, a represents a number of 0.3 to 2, b is 0 to 100, c is 1 to 1,000, and b / (b + c) = 0 to 0. . Represents a number that satisfies 7. }
(B) represented by the following average compositional formula (2), organohydrogenpolysiloxane having at least two Si-H bonds in one molecule: 1 to 200 parts by weight R 3 d H e SiO [( 4- de) / 2] (2)
(In the formula, R 3 independently represents a substituted or unsubstituted monovalent hydrocarbon group excluding the aliphatic unsaturated hydrocarbon group, and d and e are 0.7 ≦ d ≦ 2.5, respectively. It represents a number that satisfies 0.01 ≦ e ≦ 1.0 and 0.8 ≦ d + e ≦ 2.7.)
(C) A platinum compound having at least one of a β-diketonato group, a β-ketoesterate group, and a 1,3-diesterate group as a ligand. A method for producing a laminate of 1 in which the component (C) is bisacetylacetonato platinum (II).
3. 3. (I) A coating step of applying the photocurable silicone composition to the surface of the first substrate, and
(Ii) A light irradiation step of irradiating a photocurable silicone composition with light having a peak wavelength of 380 to 420 nm, and
(Iii) A curing step of curing a photocurable silicone composition to form an adhesive layer,
(Iv) Laminating a second base material on a photocurable silicone composition or an adhesive layer, and laminating the first and second base materials via the adhesive composition or the adhesive layer. A method for producing a laminate of 1 or 2 including steps,
4. 3. A method for producing a laminate of 3, wherein the curing step is performed at 5 to 35 ° C.
5. A method for producing a laminate of 3 or 4 in which the second base material is a polarizing plate or a polarizing film.
6. The method for producing a laminate according to any one of 1 to 5, wherein the first base material is a polarizing plate or a polarizing film.
7. The method for producing a laminate according to any one of 1 to 6, wherein the peak wavelength of light is 405 nm.
8. Provided is a method for manufacturing a laminate according to any one of 1 to 7, wherein the laminate is an image display device.
 本発明の積層体の製造方法によれば、光硬化型シリコーン組成物が25℃程度の室温においても接触する偏光板の種類によらず速やかに硬化する。このような特徴を有する本発明の製造方法は、タッチパネルやディスプレイ等の画像表示装置の貼り合せ法として好適に使用できる。 According to the method for producing a laminate of the present invention, the photocurable silicone composition cures rapidly even at room temperature of about 25 ° C. regardless of the type of polarizing plate with which it comes into contact. The manufacturing method of the present invention having such characteristics can be suitably used as a bonding method for image display devices such as touch panels and displays.
 以下、本発明について具体的に説明する。
 本発明に係る積層体の製造方法は、第一の基材と、この第一の基材に積層された接着剤層とを備える積層体の製造方法であって、接着剤層を、上記(A)~(C)成分を含有する光硬化型シリコーン組成物に、ピーク波長380~420nmの光を照射して硬化させて形成することを特徴とする。
Hereinafter, the present invention will be specifically described.
The method for producing a laminate according to the present invention is a method for producing a laminate including a first base material and an adhesive layer laminated on the first base material, wherein the adhesive layer is formed as described above ( It is characterized in that a photocurable silicone composition containing the components A) to (C) is irradiated with light having a peak wavelength of 380 to 420 nm and cured to be formed.
〔光硬化型シリコーン接着剤組成物〕
 本発明で用いる光硬化型シリコーン接着剤組成物を構成する各成分について説明する。
[1](A)成分
 本発明で用いる光硬化型シリコーン組成物における(A)成分は、下記平均式(1)で表される直鎖状オルガノポリシロキサンである。
(R12 2SiO1/2a(R2 3SiO1/22-a(Ar2SiO2/2b(R2 2SiO2/2c  (1)
[Photo-curable silicone adhesive composition]
Each component constituting the photocurable silicone adhesive composition used in the present invention will be described.
[1] Component (A) The component (A) in the photocurable silicone composition used in the present invention is a linear organopolysiloxane represented by the following average formula (1).
(R 1 R 2 2 SiO 1/2 ) a (R 2 3 SiO 1/2 ) 2-a (Ar 2 SiO 2/2 ) b (R 2 2 SiO 2/2 ) c (1)
 式(1)において、R1は、それぞれ独立して置換または非置換のアルケニル基を表す。
 このアルケニル基は、特に限定されるものではなく、直鎖、分岐、環状のいずれでもよいが、炭素原子数2~20のものが好ましく、炭素原子数2~10のものがより好ましく、炭素原子数2~6のものがより一層好ましい。
 アルケニル基の具体例としては、ビニル、アリル、ブテニル、ペンテニル、ヘキセニル基等が挙げられるが、ビニル基が好ましい。
 また、上記アルケニル基の水素原子の一部または全部は、F、Cl、Br等のハロゲン原子、シアノ基等で置換されていてもよい。
In formula (1), R 1 independently represents a substituted or unsubstituted alkenyl group.
The alkenyl group is not particularly limited and may be linear, branched or cyclic, but those having 2 to 20 carbon atoms are preferable, those having 2 to 10 carbon atoms are more preferable, and carbon atoms are more preferable. Those having the numbers 2 to 6 are even more preferable.
Specific examples of the alkenyl group include vinyl, allyl, butenyl, pentenyl, hexenyl group and the like, but the vinyl group is preferable.
Further, a part or all of the hydrogen atom of the alkenyl group may be substituted with a halogen atom such as F, Cl, Br, a cyano group or the like.
 R2は、それぞれ独立して、置換または非置換のアルキル基を表す。
 このアルキル基は、特に限定されるものではなく、直鎖、分岐、環状のいずれでもよいが、炭素原子数1~20のものが好ましく、炭素原子数1~10のものがより好ましく、炭素原子数1~5のものがより一層好ましい。
 アルキル基の具体例としては、メチル、エチル、n-プロピル、i-プロピル、n-ブチル、n-ペンチル、n-ヘキシル、n-ヘプチル基等の直鎖または分岐のアルキル基;シクロヘキシル基等の環状アルキル基などが挙げられる。
 また、上記アルキル基の水素原子の一部または全部は、F、Cl、Br等のハロゲン原子、シアノ基等で置換されていてもよく、そのような基の具体例としては、クロロメチル、3-クロロプロピル、3,3,3-トリフルオロプロピル基等のハロゲン置換アルキル基等が挙げられる。
 これらの中でも、耐熱性の点からメチル基が好ましい。
R 2 independently represents a substituted or unsubstituted alkyl group.
The alkyl group is not particularly limited and may be linear, branched or cyclic, but those having 1 to 20 carbon atoms are preferable, those having 1 to 10 carbon atoms are more preferable, and carbon atoms are more preferable. Those having the numbers 1 to 5 are even more preferable.
Specific examples of the alkyl group include linear or branched alkyl groups such as methyl, ethyl, n-propyl, i-propyl, n-butyl, n-pentyl, n-hexyl and n-heptyl groups; cyclohexyl groups and the like. Cyclic alkyl groups and the like can be mentioned.
Further, a part or all of the hydrogen atom of the above alkyl group may be substituted with a halogen atom such as F, Cl, Br, a cyano group or the like, and specific examples of such a group include chloromethyl and 3 -Halogen-substituted alkyl groups such as chloropropyl and 3,3,3-trifluoropropyl groups can be mentioned.
Among these, a methyl group is preferable from the viewpoint of heat resistance.
 Arは、それぞれ独立して置換または非置換のアリール基を表す。
 このアリール基は、特に限定されるものではないが、炭素原子数6~20のものが好ましく、炭素原子数6~10のものがより好ましい。
 アリール基の具体例としては、フェニル、ナフチル、トリル、キシリル、メシチル基等が挙げられる。
 また、上記アリール基の水素原子の一部または全部は、F、Cl、Br等のハロゲン原子、シアノ基等で置換されていてもよく、そのような基の具体例としては、クロロフェニル基等が挙げられる。
 これらの中でもフェニル基が好ましい。
Ar represents an independently substituted or unsubstituted aryl group.
The aryl group is not particularly limited, but preferably has 6 to 20 carbon atoms, and more preferably 6 to 10 carbon atoms.
Specific examples of the aryl group include phenyl, naphthyl, trill, xsilyl, mesitylene and the like.
Further, a part or all of the hydrogen atom of the aryl group may be substituted with a halogen atom such as F, Cl, Br, a cyano group or the like, and specific examples of such a group include a chlorophenyl group or the like. Can be mentioned.
Of these, a phenyl group is preferable.
 上記式(1)において、aは、0.3~2の数を表す。aが0.3未満であると、R1の含有量が低いため、未架橋成分のブリードアウトや、組成物が柔らかくなりすぎるおそれがある。
 bは、0~100の数であるが、0~50の数が好ましい。bが100よりも大きいと、粘度が高くなりすぎるおそれがある。
 cは、1~1,000の数であるが、1~500の数が好ましく、100~300の数がより好ましい。cが1未満であると、硬化物が硬くなりすぎるおそれがあり、1,000よりも大きいと、粘度が高くなりすぎるおそれがある。
 b/(b+c)は0~0.7であるが、0~0.3が好ましい。b/(b+c)が0.7よりも大きいと、粘度が高くなりすぎるおそれがある。
In the above formula (1), a represents a number of 0.3 to 2. If a is less than 0.3, the content of R 1 is low, so that there is a risk of bleeding out of uncrosslinked components and the composition becoming too soft.
b is a number from 0 to 100, but a number from 0 to 50 is preferable. If b is larger than 100, the viscosity may become too high.
c is a number of 1 to 1,000, preferably a number of 1 to 500, and more preferably a number of 100 to 300. If c is less than 1, the cured product may become too hard, and if it is more than 1,000, the viscosity may become too high.
b / (b + c) is 0 to 0.7, but 0 to 0.3 is preferable. If b / (b + c) is larger than 0.7, the viscosity may become too high.
 (A)成分の分子量は、THF溶媒を用いたゲル浸透クロマトグラフィー(GPC)測定による標準ポリスチレン換算の重量平均分子量(Mw)が500~100,000であることが好ましく、700~50,000がより好ましく、1,000~30,000がより一層好ましい。 As for the molecular weight of the component (A), the weight average molecular weight (Mw) in terms of standard polystyrene as measured by gel permeation chromatography (GPC) using a THF solvent is preferably 500 to 100,000, preferably 700 to 50,000. More preferably, 1,000 to 30,000 is even more preferable.
 (A)成分の具体例としては、下記平均式(3)~(5)で表されるものが挙げられるが、これらに限定されるものではない。
 なお、(A)成分のオルガノポリシロキサンは、1種単独で用いても、2種以上を組み合わせて用いてもよい。
Specific examples of the component (A) include those represented by the following average formulas (3) to (5), but are not limited thereto.
The organopolysiloxane of the component (A) may be used alone or in combination of two or more.
Figure JPOXMLDOC01-appb-C000001
〔式中、Meは、メチル基を表し、Phは、フェニル基を表し、Viは、ビニル基を表す(以下同様)。式(3)において、シロキサン単位の配列順は任意である。〕
Figure JPOXMLDOC01-appb-C000001
[In the formula, Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group (the same applies hereinafter). In the formula (3), the sequence order of the siloxane units is arbitrary. ]
[2](B)成分
 本発明で用いる光硬化型シリコーン組成物における(B)成分は、下記平均組成式(2)で表される、1分子中に少なくとも2個のSi-H結合を有するオルガノハイドロジェンポリシロキサンである。
 R3 deSiO[(4-d-e)/2]  (2)
[2] Component (B) The component (B) in the photocurable silicone composition used in the present invention has at least two Si—H bonds in one molecule represented by the following average composition formula (2). Organohydrogen polysiloxane.
R 3 d H e SiO [( 4-de) / 2] (2)
 式(2)において、R3は、それぞれ独立して、脂肪族不飽和炭化水素基を除く置換または非置換の一価炭化水素基を表す。
 R3の1価炭化水素基は、脂肪族不飽和炭化水素基を有しないものであれば特に限定はなく、直鎖、分岐、環状のいずれでもよいが、炭素原子数1~20のものが好ましく、炭素原子数1~10のものがより好ましく、炭素原子数1~5のものがより一層好ましい。
 その具体例としては、メチル、エチル、n-プロピル、イソプロピル、n-ブチル、tert-ブチル、n-ヘキシル基等の直鎖または分岐のアルキル基;シクロヘキシル基等の環状アルキル基;フェニル、トリル基等のアリール基;ベンジル、フェニルエチル基等のアラルキル基などが挙げられる。
 また、これらの1価炭化水素基の水素原子の一部または全部は、F、Cl、Br等のハロゲン原子、シアノ基等で置換されていてもよく、そのような基の具体例としては、3,3,3-トリフルオロプロピル基等のハロゲン置換炭化水素基;2-シアノエチル基等のシアノ置換炭化水素基等が挙げられる。
 これらの中でも、メチル基が好ましい。
In formula (2), R 3 independently represents a substituted or unsubstituted monovalent hydrocarbon group excluding the aliphatic unsaturated hydrocarbon group.
The monovalent hydrocarbon group of R 3 is not particularly limited as long as it does not have an aliphatic unsaturated hydrocarbon group, and may be linear, branched, or cyclic, but those having 1 to 20 carbon atoms are used. Preferably, one having 1 to 10 carbon atoms is more preferable, and one having 1 to 5 carbon atoms is even more preferable.
Specific examples thereof include linear or branched alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl and n-hexyl groups; cyclic alkyl groups such as cyclohexyl groups; phenyl and trill groups. And other aryl groups; examples thereof include aralkyl groups such as benzyl and phenylethyl groups.
Further, a part or all of the hydrogen atoms of these monovalent hydrocarbon groups may be substituted with halogen atoms such as F, Cl and Br, cyano groups and the like, and specific examples of such groups include. Halogen-substituted hydrocarbon groups such as 3,3,3-trifluoropropyl group; cyano-substituted hydrocarbon groups such as 2-cyanoethyl group and the like can be mentioned.
Among these, a methyl group is preferable.
 また、上記(A)成分との相溶性や、硬化物の物性等の点から、(B)成分中のR3とSi-H基の総数のうち20モル%以上はメチル基が好ましく、50モル%以上はメチル基がより好ましい。 Further, from the viewpoint of compatibility with the component (A) and physical properties of the cured product, 20 mol% or more of the total number of R 3 and Si—H groups in the component (B) is preferably a methyl group, and 50 A methyl group is more preferable in terms of molar% or more.
 式(2)において、dは、0.7≦d≦2.5の数であるが、0.7≦d≦2.1の数が好ましく、1.0≦d≦1.8の数がより好ましい。dが0.7未満では、硬化時に発泡するおそれがあるうえ、経時での硬度変化が大きくなりやすく、2.5を超えると、十分な硬度が得られない。
 eは、0.01≦e≦1.0の数であるが、0.02≦e≦1.0の数が好ましく、0.1≦e≦1.0の数がより好ましい。eが0.01未満では、十分な硬度が得られず、1.0を超えると、硬化時に発泡するおそれがあるうえ、経時での硬度変化が大きくなりやすい。
 d+eは、0.8≦d+e≦2.7を満たすが、好ましくは1≦d+e≦2.4、より好ましくは1.6≦d+e≦2.2を満たす。d+eが0.8未満では、硬化物が硬く、また脆くなりやすいため接着剤層中にクラックが入りやすく、2.7を超えると硬化物が柔らかくなり、積層体の補強性に乏しくなる。
In the formula (2), d is a number of 0.7 ≦ d ≦ 2.5, preferably a number of 0.7 ≦ d ≦ 2.1, and a number of 1.0 ≦ d ≦ 1.8. More preferred. If d is less than 0.7, foaming may occur during curing, and the change in hardness with time tends to be large. If d exceeds 2.5, sufficient hardness cannot be obtained.
Although e is a number of 0.01 ≦ e ≦ 1.0, a number of 0.02 ≦ e ≦ 1.0 is preferable, and a number of 0.1 ≦ e ≦ 1.0 is more preferable. If e is less than 0.01, sufficient hardness cannot be obtained, and if it exceeds 1.0, foaming may occur during curing, and the hardness change with time tends to be large.
d + e satisfies 0.8 ≦ d + e ≦ 2.7, preferably 1 ≦ d + e ≦ 2.4, and more preferably 1.6 ≦ d + e ≦ 2.2. If d + e is less than 0.8, the cured product tends to be hard and brittle, so that cracks are likely to occur in the adhesive layer, and if it exceeds 2.7, the cured product becomes soft and the reinforcing property of the laminated body becomes poor.
 (B)成分のオルガノハイドロジェンポリシロキサンの25℃での動粘度は、1,000mm2/s以下が好ましく、0.5~1,000mPa・sがより好ましく、1~500mm2/sがより一層好ましい。なお、本発明において、動粘度はキャノン・フェンスケ粘度計を用いた測定値である。 The kinematic viscosity of the component (B) component organohydrogenpolysiloxane at 25 ° C. is preferably 1,000 mm 2 / s or less, more preferably 0.5 to 1,000 mPa · s, and more preferably 1 to 500 mm 2 / s. More preferred. In the present invention, the kinematic viscosity is a measured value using a Canon Fenceke viscometer.
 上記(B)成分のオルガノハイドロジェンポリシロキサンの配合量は、(A)成分100質量部に対して1~200質量部であるが、5~80質量部が好ましい。配合量が1質量部未満では、硬化性が不十分となり、200質量部を超えると、十分な硬度・強度が得られない。
 また、この(B)成分のオルガノハイドロジェンポリシロキサンは、(A)成分中のアルケニル基に対する(B)成分中のケイ素原子結合水素原子(すなわち、SiH基)のモル比が0.5~2モル/モルとなる量で配合することが好ましく、1~1.5モル/モルとなる量で配合することがより好ましい。
The blending amount of the organohydrogenpolysiloxane of the component (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the component (A), but 5 to 80 parts by mass is preferable. If the blending amount is less than 1 part by mass, the curability becomes insufficient, and if it exceeds 200 parts by mass, sufficient hardness and strength cannot be obtained.
Further, in the organohydrogenpolysiloxane of the component (B), the molar ratio of the silicon atom-bonded hydrogen atom (that is, SiH group) in the component (B) to the alkenyl group in the component (A) is 0.5 to 2. It is preferably blended in an amount of mol / mol, and more preferably blended in an amount of 1 to 1.5 mol / mol.
 (B)成分の具体例としては、下記平均式(6)~(8)で表されるものが挙げられるが、これらに限定されるものではない。
 なお、(B)成分のオルガノハイドロジェンポリシロキサンは、1種単独で用いても、2種以上を組み合わせて用いてもよい。
Me2.00.1SiO[1.9/2]  (6)
Me1.80.3SiO[1.9/2]  (7)
Me1.70.4SiO[1.9/2]  (8)
Specific examples of the component (B) include those represented by the following average formulas (6) to (8), but are not limited thereto.
The organohydrogenpolysiloxane of the component (B) may be used alone or in combination of two or more.
Me 2.0 H 0.1 SiO [1.9 / 2] (6)
Me 1.8 H 0.3 SiO [1.9 / 2] (7)
Me 1.7 H 0.4 SiO [1.9 / 2] (8)
[3](C)成分
 本発明で用いる光硬化型シリコーン組成物における(C)成分は、β-ジケトナト基、β-ケトエステラート基、および1,3-ジエステラート基の少なくとも1つを配位子として有する白金化合物である。この白金化合物は、遮光された状態では不活性であるが、波長380~420nmの光を照射することによって室温で活性な白金触媒に変化し、上述した(A)成分中のアルケニル基と、(B)成分中のケイ素原子結合水素原子とのヒドロシリル化反応を促進する機能を有する。
[3] Component (C) The component (C) in the photocurable silicone composition used in the present invention coordinates at least one of a β-diketonato group, a β-ketoesterate group, and a 1,3-diesterate group. It is a platinum compound having as a child. Although this platinum compound is inactive in the shaded state, it changes to a platinum catalyst that is active at room temperature when irradiated with light having a wavelength of 380 to 420 nm, and the alkenyl group in the above-mentioned component (A) and ( B) It has a function of promoting the hydrosilylation reaction with the silicon atom-bonded hydrogen atom in the component.
 (C)成分の具体例としては、トリメチル(アセチルアセトナト)白金錯体、トリメチル(2,4-ペンタンジオネ-ト)白金錯体、トリメチル(3,5-ヘプタンジオネート)白金錯体、トリメチル(メチルアセトアセテート)白金錯体、ビス(アセチルアセトナト)白金錯体、ビス(2,4-ペンタンジオナト)白金錯体、ビス(2,4-へキサンジオナト)白金錯体、ビス(2,4-へプタンジオナト)白金錯体、ビス(3,5-ヘプタンジオナト)白金錯体、ビス(1-フェニル-1,3-ブタンジオナト)白金錯体、ビス(1,3-ジフェニル-1,3-プロパンジオナト)白金錯体等が挙げられ、これらは1種単独で用いても、2種以上組み合わせて用いてもよい。
 これらの中でも、ビス(アセチルアセトナト)白金錯体、およびそのアセチルアセトナト基上を修飾した誘導体が好適である。
Specific examples of the component (C) include a trimethyl (acetylacetonato) platinum complex, a trimethyl (2,4-pentanetone) platinum complex, a trimethyl (3,5-heptanzionate) platinum complex, and a trimethyl (methylacetoacetate). ) Platinum complex, bis (acetylacetonato) platinum complex, bis (2,4-pentandionato) platinum complex, bis (2,4-hexandionato) platinum complex, bis (2,4-heptandionat) platinum complex, Examples thereof include a bis (3,5-heptandionat) platinum complex, a bis (1-phenyl-1,3-butandionato) platinum complex, and a bis (1,3-diphenyl-1,3-propanedionat) platinum complex. May be used alone or in combination of two or more.
Among these, a bis (acetylacetonato) platinum complex and a derivative modified on the acetylacetonato group thereof are preferable.
 (C)成分の含有量は、光硬化型シリコーン組成物の硬化(ヒドロシリル化反応)を促進する量であれば限定されないが、(A)成分に対して、組成物中の金属原子が質量換算で0.01~500ppmの範囲となる量が好ましく、0.05~100ppmの範囲となる量がより好ましく、0.01~50ppmの範囲となる量がより一層好ましい。 The content of the component (C) is not limited as long as it is an amount that promotes curing (hydrosilylation reaction) of the photocurable silicone composition, but the metal atoms in the composition are mass-converted with respect to the component (A). The amount in the range of 0.01 to 500 ppm is preferable, the amount in the range of 0.05 to 100 ppm is more preferable, and the amount in the range of 0.01 to 50 ppm is even more preferable.
[4](D)成分
 本発明で用いる光硬化型シリコーン組成物には、必要に応じて(D)成分として、偏光板、ガラス、ポリカーボネート樹脂またはアクリル樹脂等の基材に対して接着性を付与するための接着助剤を添加してもよい。
 (D)成分のうち、シロキサン結合を含む接着助剤の具体例としては、ビニルトリメトキシシラン(信越化学工業(株)製、KBM-1003)、γ-(グリシジロキシプロピル)トリメトキシシラン(信越化学工業(株)製、KBM-403)、γ-(メタクリロキシプロピル)トリメトキシシラン(信越化学工業(株)製、KBM-503)、およびそれらの加水分解物、並びに下記構造式で表される化合物等が挙げられる。
[4] Component (D) The photocurable silicone composition used in the present invention has adhesiveness to a substrate such as a polarizing plate, glass, polycarbonate resin or acrylic resin as a component (D), if necessary. Adhesive aids for imparting may be added.
Among the components (D), specific examples of the adhesion aid containing a siloxane bond include vinyl trimethoxysilane (KBM-1003 manufactured by Shin-Etsu Chemical Industry Co., Ltd.) and γ- (glycidyloxypropyl) trimethoxysilane ( Shin-Etsu Chemical Industry Co., Ltd., KBM-403), γ- (methacryloxypropyl) trimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., KBM-503), their hydrolyzates, and the following structural formulas. Examples thereof include compounds to be used.
Figure JPOXMLDOC01-appb-C000002
Figure JPOXMLDOC01-appb-C000002
 また、シロキサン結合を含まない接着助剤の具体例としては、アリルグリシジルエーテル、ビニルシクロヘキセンモノオキサイド、2-アリルマロン酸ジエチル、ジアリルビスフェノールエーテル、安息香酸アリル、フタル酸ジアリル、ピロメリット酸テトラアリルエステル(富士フイルム和光純薬(株)製、TRIAM805)、トリアリルイソシアヌレート等が挙げられる。
 なお、(D)成分は、1種単独で用いても、2種以上を組み合わせて用いてもよい。
Specific examples of the adhesive aid containing no siloxane bond include allyl glycidyl ether, vinyl cyclohexene monooxide, diethyl 2-allyl malonate, diallyl bisphenol ether, allyl benzoate, diallyl phthalate, and tetraallyl ester pyromellitic acid. TRIAM805) manufactured by Fujifilm Wako Junyaku Co., Ltd., triallyl isocyanurate, and the like.
The component (D) may be used alone or in combination of two or more.
 (D)成分を用いる場合、その添加量は、(A)成分100質量部に対して0.05~10質量部が好ましく、0.05~5質量部がより好ましい。(D)成分の配合量が上記範囲であれば、適度な接着性が付与できる。 When the component (D) is used, the amount added is preferably 0.05 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the component (A). When the blending amount of the component (D) is within the above range, appropriate adhesiveness can be imparted.
[5](E)成分
 本発明で用いる光硬化型シリコーン接着剤組成物には、組成物を調製する際や、組成物を基材に塗工する際などの加熱硬化前に増粘やゲル化を起こさないようにヒドロシリル化反応触媒の反応性を制御する目的で、必要に応じて(E)反応制御剤を添加してもよい。
 反応制御剤の具体例としては、3-メチル-1-ブチン-3-オール、3-メチル-1-ペンチン-3-オール、3,5-ジメチル-1-ヘキシン-3-オール、1-エチニルシクロヘキサノール、エチニルメチルデシルカルビノール、3-メチル-3-トリメチルシロキシ-1-ブチン、3-メチル-3-トリメチルシロキシ-1-ペンチン、3,5-ジメチル-3-トリメチルシロキシ-1-ヘキシン、1-エチニル-1-トリメチルシロキシシクロヘキサン、ビス(2,2-ジメチル-3-ブチノキシ)ジメチルシラン、1,3,5,7-テトラメチル-1,3,5,7-テトラビニルシクロテトラシロキサン、1,1,3,3-テトラメチル-1,3-ジビニルジシロキサン等が挙げられ、これらは1種単独で用いても、2種以上を組み合わせて用いてもよい。
 これらの中でも、1-エチニルシクロヘキサノール、エチニルメチルデシルカルビノール、3-メチル-1-ブチン-3-オール、ビス(2,2-ジメチル-3-ブチノキシ)ジメチルシランが好ましい。
[5] Ingredients (E) The photocurable silicone adhesive composition used in the present invention includes thickening and gel before heat curing such as when preparing the composition or when applying the composition to a substrate. If necessary, the reaction control agent (E) may be added for the purpose of controlling the reactivity of the hydrosilylation reaction catalyst so as not to cause the formation.
Specific examples of the reaction control agent include 3-methyl-1-butyne-3-ol, 3-methyl-1-pentyne-3-ol, 3,5-dimethyl-1-hexin-3-ol, and 1-ethynyl. Cyclohexanol, ethynylmethyldecylcarbinol, 3-methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexyne, 1-ethynyl-1-trimethylsiloxycyclohexane, bis (2,2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, Examples thereof include 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, which may be used alone or in combination of two or more.
Among these, 1-ethynylcyclohexanol, ethynylmethyldecylcarbinol, 3-methyl-1-butyne-3-ol, and bis (2,2-dimethyl-3-butynoxy) dimethylsilane are preferable.
 (E)成分の配合量は、(A)成分の合計100質量部に対して0.01~2.0質量部が好ましく、0.01~0.1質量部がより好ましい。このような範囲であれば反応制御の効果が十分発揮される。 The blending amount of the component (E) is preferably 0.01 to 2.0 parts by mass, more preferably 0.01 to 0.1 parts by mass with respect to 100 parts by mass of the total of the component (A). Within such a range, the effect of reaction control is fully exhibited.
[6]その他の成分
 本発明で用いる光硬化型シリコーン接着剤組成物は、上記(A)~(E)成分以外にも、本発明の目的を損なわない限り、以下に例示するその他の成分を含有していてもよい。
 その他の成分としては、例えば、フュームドシリカ等のチクソ性制御剤;結晶性シリカ等の補強剤;酸化防止剤;光安定剤;金属酸化物、金属水酸化物等の耐熱向上剤;酸化チタン等の着色剤;アルミナ、結晶性シリカ等の熱伝導性付与充填剤;反応性官能基を有しない非反応性シリコーンオイル等の粘度調整剤;銀、金等の金属粉等の導電性付与剤等が挙げられる。
[6] Other Ingredients In addition to the above components (A) to (E), the photocurable silicone adhesive composition used in the present invention contains other components exemplified below as long as the object of the present invention is not impaired. It may be contained.
Other components include, for example, a thixophilic control agent such as fumed silica; a reinforcing agent such as crystalline silica; an antioxidant; a light stabilizer; a heat resistance improver such as a metal oxide and a metal hydroxide; and titanium oxide. Colorants such as: Thermal conductivity-imparting fillers such as alumina and crystalline silica; Viscosity modifiers such as non-reactive silicone oil having no reactive functional group; Conductivity-imparting agents such as metal powders such as silver and gold And so on.
 本発明で用いる光硬化型シリコーン接着剤組成物は、上記の(A)~(C)成分、必要に応じて用いられる(D)および(E)成分、並びにその他の成分を公知の方法で混合して調製することができる。 The photocurable silicone adhesive composition used in the present invention is a mixture of the above components (A) to (C), components (D) and (E) used as necessary, and other components by a known method. Can be prepared.
〔積層体の製造方法〕
 上述した光硬化型シリコーン接着剤組成物を用いる積層体の製造方法について説明する。
 上記光硬化型シリコーン接着剤組成物は、光デバイス、ディスプレイ、タッチパネル等の積層体を構成する二枚の基材を、接着層を介して貼り合せる際の接着層形成用組成物として好適に使用できる。
 この場合、積層体の製造方法は、塗布工程、光照射工程、硬化工程、および貼合工程を含み、それぞれの工程の詳細としては、例えば、以下に示すものが挙げられる。
[Manufacturing method of laminate]
A method for producing a laminate using the above-mentioned photocurable silicone adhesive composition will be described.
The above-mentioned photocurable silicone adhesive composition is suitably used as a composition for forming an adhesive layer when two base materials constituting a laminate such as an optical device, a display, and a touch panel are bonded together via an adhesive layer. it can.
In this case, the method for producing the laminate includes a coating step, a light irradiation step, a curing step, and a bonding step, and details of each step include, for example, those shown below.
(i)塗布工程
 塗布工程では、上述した光硬化型シリコーン接着剤組成物を基材(第一の基材)上に塗布する。
 塗布方法としては、例えば、スリットコートを利用した塗布や、DAM-Fill法、フィッシュボーン法等による手法が挙げられる。
 塗布量は、特に限定されるものではないが、硬化後のシリコーン層の厚さが100~5,000μmとなる量が好ましい。
(I) Coating Step In the coating step, the above-mentioned photocurable silicone adhesive composition is coated on a base material (first base material).
Examples of the coating method include coating using a slit coat, a DAM-Fill method, a fishbone method, and the like.
The coating amount is not particularly limited, but is preferably an amount such that the thickness of the silicone layer after curing is 100 to 5,000 μm.
 基材としては、偏光材料および複合材料、金属部材、プラスチック部材、セラミック部材等が挙げられ、特に、電気用途、電子用途、光学用途等のケーシング、部材の被覆、注型、接着、封止等の分野で使用されるものに有用であり、偏光板、偏光フィルムに対して特に有用である。
 なお、上記光硬化型シリコーン接着剤組成物は、プライマー処理、プラズマ処理、エキシマ光処理などの周知の前処理工程によって活性化された基材に対しても用いることができる。
Examples of the base material include polarizing materials and composite materials, metal members, plastic members, ceramic members, etc., and in particular, casings for electrical applications, electronic applications, optical applications, etc., coating of members, casting, bonding, sealing, etc. It is useful for those used in the above fields, and is particularly useful for polarizing plates and polarizing films.
The photocurable silicone adhesive composition can also be used for a substrate activated by a well-known pretreatment step such as primer treatment, plasma treatment, and excimer light treatment.
(ii)光照射工程
 光照射工程では、光硬化型シリコーン接着剤組成物に光を照射する。
 光照射方法としては、光源としてピーク波長380~420nmのランプを使用し、適量の光を照射する方法等が挙げられる。
 光源としては、405nmのUV-LEDランプが好ましい。
 照射する光は、ピーク波長が380~420nm、好ましくは395~410nm、より好ましくは405nmの光である。
 光照射時の温度は、硬化速度と変色防止の観点から、5~60℃が好ましく、5~35℃がより好ましい。
 照射強度は、300~2,000mW/cm2が好ましく、照射線量は硬化性および作業性の点から1,000~20,000mJ/cm2が好ましい。
(Ii) Light Irradiation Step In the light irradiation step, the photocurable silicone adhesive composition is irradiated with light.
Examples of the light irradiation method include a method of using a lamp having a peak wavelength of 380 to 420 nm as a light source and irradiating an appropriate amount of light.
As the light source, a 405 nm UV-LED lamp is preferable.
The light to be irradiated is light having a peak wavelength of 380 to 420 nm, preferably 395 to 410 nm, and more preferably 405 nm.
The temperature at the time of light irradiation is preferably 5 to 60 ° C., more preferably 5 to 35 ° C. from the viewpoint of curing speed and prevention of discoloration.
The irradiation intensity is preferably 300 to 2,000 mW / cm 2 , and the irradiation dose is preferably 1,000 to 20,000 mJ / cm 2 from the viewpoint of curability and workability.
(iii)硬化工程
 硬化工程では、光照射した組成物を硬化させる。
 硬化方法は、特に限定されるものではないが、例えば、光照射した組成物を所定の環境下に静置して硬化させ、接着剤層を形成する手法等が挙げられる。
 硬化温度は、特に限定されるものではないが、積層体の熱膨張/収縮による反りや劣化を抑える観点から、5~60℃が好ましく、5~35℃がより好ましい。
 硬化雰囲気は、任意であるが大気雰囲気下が好ましい。
 硬化時間は、特に限定されるものではないが、1分~24時間程度が好ましい。
(Iii) Curing Step In the curing step, the light-irradiated composition is cured.
The curing method is not particularly limited, and examples thereof include a method in which a light-irradiated composition is allowed to stand in a predetermined environment to be cured to form an adhesive layer.
The curing temperature is not particularly limited, but is preferably 5 to 60 ° C., more preferably 5 to 35 ° C., from the viewpoint of suppressing warpage and deterioration due to thermal expansion / contraction of the laminate.
The curing atmosphere is arbitrary, but is preferably in an air atmosphere.
The curing time is not particularly limited, but is preferably about 1 minute to 24 hours.
(iv)貼合工程
 貼合工程では、光硬化型シリコーン接着剤組成物または接着剤層の上に第二の基材を積層して、二枚の基材を接着剤組成物または接着剤層を介して貼り合わせた積層体を形成する。
 貼合方法としては、塗布工程、光照射工程および硬化工程を経て、液状から半固体状となった接着剤層-基材積層物や、塗布工程後の光硬化型シリコーン接着剤組成物、あるいは塗布工程および光照射工程後の光硬化型シリコーン接着剤組成物層-基材積層物を、真空あるいは大気圧貼り合わせ装置に設置し、第二の基材を光硬化型シリコーン接着剤組成物または接着剤層の上に積層して貼り合わせて、組成物の場合は残りの工程を行って硬化させて積層体を形成する手法等が挙げられる。
(Iv) Laminating Step In the laminating step, the second base material is laminated on the photocurable silicone adhesive composition or the adhesive layer, and the two base materials are combined with the adhesive composition or the adhesive layer. A laminated body is formed which is bonded to each other.
As a bonding method, an adhesive layer-base material laminate that has changed from a liquid to a semi-solid state through a coating step, a light irradiation step, and a curing step, a photocurable silicone adhesive composition after the coating step, or a bonding method. The photocurable silicone adhesive composition layer-base material laminate after the coating step and the light irradiation step is installed in a vacuum or atmospheric pressure bonding device, and the second base material is a photocurable silicone adhesive composition or Examples thereof include a method of laminating and laminating on an adhesive layer, and in the case of a composition, performing the remaining steps to cure and form a laminated body.
 本発明の積層体の製造方法は、酸素による硬化阻害を受けない点、および光を照射してからの硬化時間を接着剤組成物の設計や加熱温度により変えられる点から、フラットディスプレイや曲面ディスプレイ等、製造するデバイスの構造に合わせて塗布工程、光照射工程、硬化工程、および貼合工程の手順を自由に選択・変更することができる。 The method for producing a laminate of the present invention is a flat display or a curved display because it is not hindered by oxygen and the curing time after irradiation with light can be changed depending on the design of the adhesive composition and the heating temperature. Etc., the procedures of the coating process, the light irradiation process, the curing process, and the bonding process can be freely selected and changed according to the structure of the device to be manufactured.
 本発明の積層体の製造方法の具体例として、カバーパネルおよび画像表示パネルを有する積層体の製造方法を挙げる。
 まず、本発明の光硬化型シリコーン組成物を、画像表示パネルを構成する偏光板上に塗布する。その後、波長のピークが405nmにあるUV-LEDランプを用い、光硬化型シリコーン組成物に405nm光を指標とする照射強度100mW/cm2の光を25℃にて100秒間、線量にして10,000mJ/cm2となるように照射する。続いて、25℃の環境で30分間静置してシリコーン組成物を硬化させ接着剤層を形成する。その後、真空貼り合わせ装置を用いて接着剤層の上にカバーパネルを積層することで、カバーパネルと画像表示パネルとを接着剤層を介して貼り合わせた積層体を得る。
 また、光照射工程後、先に真空貼り合わせ装置を用いてシリコーン組成物の上にカバーパネルを積層することで、画像表示パネルとカバーパネルとをシリコーン組成物を介して貼り合わせ、次いで25℃の環境で30分間静置してシリコーン組成物を硬化させてもよい。あるいは、カバーパネルが透明であるため、塗布工程後、真空貼り合わせを行い、次いでカバーパネル越しに光照射を行い、硬化させてもよい。また、予め光照射を行ったシリコーン組成物を画像表示パネルに塗布し、カバーパネルと真空貼り合わせ、硬化させてもよい。
Specific examples of the method for manufacturing the laminate of the present invention include a method for producing a laminate having a cover panel and an image display panel.
First, the photocurable silicone composition of the present invention is applied onto a polarizing plate constituting an image display panel. After that, using a UV-LED lamp having a wavelength peak of 405 nm, light with an irradiation intensity of 100 mW / cm 2 using 405 nm light as an index was applied to the photocurable silicone composition at 25 ° C. for 100 seconds at a dose of 10, Irradiate to 000 mJ / cm 2 . Subsequently, the silicone composition is allowed to stand in an environment of 25 ° C. for 30 minutes to cure the silicone composition to form an adhesive layer. Then, the cover panel is laminated on the adhesive layer using a vacuum bonding device to obtain a laminated body in which the cover panel and the image display panel are bonded via the adhesive layer.
Further, after the light irradiation step, the cover panel is first laminated on the silicone composition using a vacuum bonding device, so that the image display panel and the cover panel are bonded via the silicone composition, and then at 25 ° C. The silicone composition may be cured by allowing it to stand in the environment for 30 minutes. Alternatively, since the cover panel is transparent, vacuum bonding may be performed after the coating step, and then light irradiation may be performed through the cover panel to cure the cover panel. Further, the silicone composition that has been irradiated with light in advance may be applied to the image display panel, vacuum-bonded to the cover panel, and cured.
 以下、実施例および比較例を挙げて本発明をより具体的に説明するが、本発明はこれらの実施例に限定されるものではない。
 なお、下記の例において、MwはTHF溶媒を用いたGPC測定による標準ポリスチレン換算の重量平均分子量を表す。
Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
In the following example, Mw represents the weight average molecular weight in terms of standard polystyrene measured by GPC using a THF solvent.
[製造例1,2および比較製造例1,2]
 下記成分を表1に示す配合量(質量部)にて混合し、光硬化型シリコーン組成物を調製した。
(A)成分:
(A-1)下記平均構造式(3)で表されるオルガノポリシロキサン(Mw:28,000)
[Production Examples 1 and 2 and Comparative Production Examples 1 and 2]
The following components were mixed in the blending amounts (parts by mass) shown in Table 1 to prepare a photocurable silicone composition.
(A) Ingredient:
(A-1) Organopolysiloxane (Mw: 28,000) represented by the following average structural formula (3).
Figure JPOXMLDOC01-appb-C000003
(式中、シロキサン単位の配列順は不定である。)
Figure JPOXMLDOC01-appb-C000003
(In the formula, the sequence order of siloxane units is indefinite.)
(A-2)下記平均構造式(4)で表されるオルガノポリシロキサン(Mw:22,400) (A-2) Organopolysiloxane (Mw: 22,400) represented by the following average structural formula (4).
Figure JPOXMLDOC01-appb-C000004
Figure JPOXMLDOC01-appb-C000004
(A-3)下記平均式(5)で表されるオルガノポリシロキサン(Mw:16,500)
(ViMe2Si)0.57(Me3SiO)1.43(Me2SiO)220    (5)
(A-3) Organopolysiloxane (Mw: 16,500) represented by the following average formula (5)
(ViMe 2 Si) 0.57 (Me 3 SiO) 1.43 (Me 2 SiO) 220 (5)
(B)成分:
(B-1)下記平均組成式(6)で表され、23℃における動粘度が17mm2/sである分子鎖両末端ヒドロジメチルシロキシ基封鎖のジメチルシロキサン
Me2.00.1SiO[1.9/2]  (6)
(B-2)下記平均組成式(7)で表され、23℃における動粘度が27mm2/sである分子鎖両末端ヒドロジメチルシロキシ基封鎖のジメチルシロキサン
Me1.80.3SiO[1.9/2]  (7)
(B-3)下記平均組成式(8)で表され、23℃における動粘度が105mm2/sである分子鎖両末端ヒドロジメチルシロキシ基封鎖のジメチルシロキサン
Me1.70.4SiO[1.9/2]  (8)
(B) Ingredient:
(B-1) Dimethylsiloxane Me 2.0 H 0.1 SiO [1.9 / 2] , which is represented by the following average composition formula (6) and has a kinematic viscosity of 17 mm 2 / s at 23 ° C. and a hydrodimethylsiloxy group blockade at both ends of the molecular chain . (6)
(B-2) Dimethylsiloxane Me 1.8 H 0.3 SiO [1.9 / 2] , which is represented by the following average composition formula (7) and has a kinematic viscosity of 27 mm 2 / s at 23 ° C. and a hydrodimethylsiloxy group blockade at both ends of the molecular chain . (7)
(B-3) Dimethylsiloxane Me 1.7 H 0.4 SiO [1.9 / 2] , which is represented by the following average composition formula (8) and has a kinematic viscosity at 23 ° C. of 105 mm 2 / s and a hydrodimethylsiloxy group blockade at both ends of the molecular chain . (8)
(C)成分:
(C-1)ビスアセチルアセトナト白金錯体の酢酸2-(2-ブトキシエトキシ)エチル溶液(白金含有量0.5質量%)
(C-2)比較成分 トリメチル(メチルシクロペンタジエニル)白金錯体のトルエン溶液(白金含有量0.5質量%)
(C) component:
(C-1) Ethyl acetate 2- (2-butoxyethoxy) ethyl acetate solution of bisacetylacetonato platinum complex (platinum content 0.5% by mass)
(C-2) Comparative component Toluene solution of trimethyl (methylcyclopentadienyl) platinum complex (platinum content 0.5% by mass)
(D)成分:接着助剤
(D-1)7-オクテニルトリメトキシシラン(信越化学工業(株)製、KBM-1083)
(D-2)下記構造式(10)で表される化合物
Component (D): Adhesive aid (D-1) 7-octenyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-1083)
(D-2) Compound represented by the following structural formula (10)
Figure JPOXMLDOC01-appb-C000005
Figure JPOXMLDOC01-appb-C000005
(D-3)下記構造式(11)で表される化合物 (D-3) Compound represented by the following structural formula (11)
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000006
(E)成分:反応制御剤
(E-1)下記式(9)で表される化合物
Component (E): Reaction control agent (E-1) Compound represented by the following formula (9)
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000007
その他の成分:
 フュームドシリカ(アエロジルNSX-200(平均一次粒子径8nm)、日本アエロジル(株))
Other ingredients:
Fumed silica (Aerosil NSX-200 (average primary particle size 8 nm), Nippon Aerosil Co., Ltd.)
Figure JPOXMLDOC01-appb-T000008
Figure JPOXMLDOC01-appb-T000008
[実施例1,2および比較例1~4]
 上記各製造例および比較製造例で調製した光硬化型シリコーン接着剤組成物について、下記手法によってゲル化時間を評価した。結果を表2に示す。
[ゲル化時間]
 UV硬化アクセサリを備えた粘弾性測定装置ARES-G2(ティー・エイ・インスツルメント・ジャパン(株)製)を用いてゲル化時間を測定した。
 調製した各光硬化型シリコーン組成物1mlをステンレススチール製のプレート部、またはこのプレート部上に固定された下記の各偏光板上に塗布し、ピーク波長365nmのUV-LEDランプ(パナソニック(株)製、ANOJ6186)または波長405nmのUV-LEDランプ(パナソニック(株)製、ANOJ6189)を用い、100mW/cm2の光を10,000mJ/cm2となるように25℃で各組成物に照射した。
 その後、25℃に温度を保ち、粘弾性を測定した。UV照射を完了してからtanδ=1となるまでに要した時間(分)をゲル化時間とした。
[Examples 1 and 2 and Comparative Examples 1 to 4]
The gelation time of the photocurable silicone adhesive composition prepared in each of the above production examples and the comparative production examples was evaluated by the following method. The results are shown in Table 2.
[Gelification time]
The gelation time was measured using a viscoelasticity measuring device ARES-G2 (manufactured by TA Instruments Japan Co., Ltd.) equipped with a UV curing accessory.
1 ml of each of the prepared photocurable silicone compositions was applied to a stainless steel plate portion or each of the following polarizing plates fixed on the plate portion, and a UV-LED lamp having a peak wavelength of 365 nm (Panasonic Corporation). ANOJ6186 (manufactured by ANOJ6186) or a UV-LED lamp having a wavelength of 405 nm (ANOJ6189, manufactured by Panasonic Corporation) was used to irradiate each composition with 100 mW / cm 2 light at 25 ° C. to 10,000 mJ / cm 2 . ..
Then, the temperature was maintained at 25 ° C., and the viscoelasticity was measured. The time (minutes) required from the completion of UV irradiation until tan δ = 1 was defined as the gelation time.
偏光板1:日東電工(株)製NPF-CWQ1463VCU
偏光板2:日東電工(株)製NAZ-EFCWQVAG15AR
偏光板3:日東電工(株)製NAZ-EFCWQVAG150
偏光板4:日東電工(株)製NPF-CWQ1463VCUAG15ARS
偏光板5:日東電工(株)製NPF-SWQ1423CUARC380
偏光板6:日東電工(株)製NPF-CWQ1463VCUAG150
Polarizing plate 1: NPF-CWQ1463VCU manufactured by Nitto Denko Corporation
Polarizing plate 2: NAZ-EFCFWQVAG15AR manufactured by Nitto Denko Corporation
Polarizing plate 3: NAZ-EFCFWQVAG150 manufactured by Nitto Denko Corporation
Polarizing plate 4: NPF-CWQ1463VCUAG15ARS manufactured by Nitto Denko KK
Polarizing plate 5: NPF-SWQ1423CUARC380 manufactured by Nitto Denko Corporation
Polarizing plate 6: NPF-CWQ1463VCUAG150 manufactured by Nitto Denko Corporation
Figure JPOXMLDOC01-appb-T000009
Figure JPOXMLDOC01-appb-T000009
 表2に示されるように、本発明の積層体の製造方法によれば、接触する偏光板の種類によらず、光硬化型シリコーン組成物が25℃において速やかに硬化し、タッチパネルやディスプレイ等の画像表示装置の貼り合せに好適に使用できることが示されたといえる。
 一方、本発明の(C)成分以外の付加反応触媒を使用した比較例1,2では、ピーク波長405nmのLED光源を用いた光照射による硬化が起こらず、実施例1,2における光源をピーク波長365nmのLED光源に変更した比較例3,4では、偏光板に起因する硬化阻害が発生する場合があることがわかる。
As shown in Table 2, according to the method for producing a laminate of the present invention, the photocurable silicone composition is rapidly cured at 25 ° C. regardless of the type of polarizing plate to be contacted, and the touch panel, display, etc. It can be said that it has been shown that it can be suitably used for bonding image display devices.
On the other hand, in Comparative Examples 1 and 2 using an addition reaction catalyst other than the component (C) of the present invention, curing by light irradiation using an LED light source having a peak wavelength of 405 nm did not occur, and the light source in Examples 1 and 2 peaked. It can be seen that in Comparative Examples 3 and 4 in which the LED light source having a wavelength of 365 nm was changed, curing inhibition due to the polarizing plate may occur.

Claims (8)

  1.  第一の基材と、この第一の基材に積層された接着剤層とを備える積層体の製造方法であって、
     前記接着剤層を、下記(A)~(C)成分を含有する光硬化型シリコーン組成物に、ピーク波長380~420nmの光を照射して硬化させて形成することを特徴とする積層体の製造方法。
    (A)下記平均式(1)で表される直鎖状オルガノポリシロキサン:100質量部
     (R12 2SiO1/2a(R2 3SiO1/22-a(Ar2SiO2/2b(R2 2SiO2/2c  (1)
    {式中、R1は、それぞれ独立して、置換または非置換のアルケニル基を表し、R2は、それぞれ独立して、置換または非置換のアルキル基を表し、Arは、それぞれ独立して、置換または非置換のアリール基を表し、aは、0.3~2の数を表し、bは、0~100、cは、1~1,000、かつ、b/(b+c)=0~0.7を満たす数を表す。}
    (B)下記平均組成式(2)で表される、1分子中に少なくとも2個のSi-H結合を有するオルガノハイドロジェンポリシロキサン:1~200質量部
     R3 deSiO[(4-d-e)/2]  (2)
    (式中、R3は、それぞれ独立して、脂肪族不飽和炭化水素基を除く置換または非置換の一価炭化水素基を表し、dおよびeは、0.7≦d≦2.5、0.01≦e≦1.0、かつ、0.8≦d+e≦2.7を満たす数を表す。)
    (C)β-ジケトナト基、β-ケトエステラート基、および1,3-ジエステラート基の少なくとも1つを配位子として有する白金化合物
    A method for producing a laminate including a first base material and an adhesive layer laminated on the first base material.
    A laminate characterized by forming the adhesive layer by irradiating a photocurable silicone composition containing the following components (A) to (C) with light having a peak wavelength of 380 to 420 nm and curing the adhesive layer. Production method.
    (A) Linear organopolysiloxane represented by the following average formula (1): 100 parts by mass (R 1 R 2 2 SiO 1/2 ) a (R 2 3 SiO 1/2 ) 2-a (Ar 2) SiO 2/2 ) b (R 2 2 SiO 2/2 ) c (1)
    {In the formula, R 1 independently represents a substituted or unsubstituted alkenyl group, R 2 independently represents a substituted or unsubstituted alkyl group, and Ar independently represents a substituted or unsubstituted alkyl group. It represents a substituted or unsubstituted aryl group, a represents a number of 0.3 to 2, b is 0 to 100, c is 1 to 1,000, and b / (b + c) = 0 to 0. . Represents a number that satisfies 7. }
    (B) represented by the following average compositional formula (2), organohydrogenpolysiloxane having at least two Si-H bonds in one molecule: 1 to 200 parts by weight R 3 d H e SiO [( 4- de) / 2] (2)
    (In the formula, R 3 independently represents a substituted or unsubstituted monovalent hydrocarbon group excluding the aliphatic unsaturated hydrocarbon group, and d and e are 0.7 ≦ d ≦ 2.5, respectively. It represents a number that satisfies 0.01 ≦ e ≦ 1.0 and 0.8 ≦ d + e ≦ 2.7.)
    (C) A platinum compound having at least one of a β-diketonato group, a β-ketoesterate group, and a 1,3-diesterate group as a ligand.
  2.  前記(C)成分が、ビスアセチルアセトナト白金(II)である請求項1記載の積層体の製造方法。 The method for producing a laminate according to claim 1, wherein the component (C) is bisacetylacetonato platinum (II).
  3.  (i)光硬化型シリコーン組成物を第一の基材表面に塗布する塗布工程と、
     (ii)光硬化型シリコーン組成物にピーク波長380~420nmの光を照射する光照射工程と、
     (iii)光硬化型シリコーン組成物を硬化させて接着剤層を形成する硬化工程と、
     (iv)光硬化型シリコーン組成物または接着剤層の上に第二の基材を積層して第一および第二の基材を前記接着剤組成物または接着剤層を介して貼り合わせる貼合工程と
    を含む請求項1または2記載の積層体の製造方法。
    (I) A coating step of applying the photocurable silicone composition to the surface of the first substrate, and
    (Ii) A light irradiation step of irradiating a photocurable silicone composition with light having a peak wavelength of 380 to 420 nm, and
    (Iii) A curing step of curing a photocurable silicone composition to form an adhesive layer,
    (Iv) Laminating a second base material on a photocurable silicone composition or an adhesive layer, and laminating the first and second base materials via the adhesive composition or the adhesive layer. The method for producing a laminate according to claim 1 or 2, which includes a step.
  4.  前記硬化工程が、5~35℃で行われる請求項3記載の積層体の製造方法。 The method for producing a laminate according to claim 3, wherein the curing step is performed at 5 to 35 ° C.
  5.  前記第二の基材が、偏光板または偏光フィルムである請求項3または4記載の積層体の製造方法。 The method for producing a laminate according to claim 3 or 4, wherein the second base material is a polarizing plate or a polarizing film.
  6.  前記第一の基材が、偏光板または偏光フィルムである請求項1~5のいずれか1項記載の積層体の製造方法。 The method for producing a laminate according to any one of claims 1 to 5, wherein the first base material is a polarizing plate or a polarizing film.
  7.  前記光のピーク波長が405nmである請求項1~6のいずれか1項記載の積層体の製造方法。 The method for producing a laminate according to any one of claims 1 to 6, wherein the peak wavelength of the light is 405 nm.
  8.  前記積層体が画像表示装置である請求項1~7のいずれか1項記載の積層体の製造方法。 The method for manufacturing a laminate according to any one of claims 1 to 7, wherein the laminate is an image display device.
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