WO2020190658A1 - Friction stir welding in semiconductor manufacturing applications - Google Patents
Friction stir welding in semiconductor manufacturing applications Download PDFInfo
- Publication number
- WO2020190658A1 WO2020190658A1 PCT/US2020/022497 US2020022497W WO2020190658A1 WO 2020190658 A1 WO2020190658 A1 WO 2020190658A1 US 2020022497 W US2020022497 W US 2020022497W WO 2020190658 A1 WO2020190658 A1 WO 2020190658A1
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- WIPO (PCT)
- Prior art keywords
- faceplate
- pedestal assembly
- friction stir
- platen
- heater element
- Prior art date
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-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
- B23K20/1245—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding characterised by the apparatus
- B23K20/1255—Tools therefor, e.g. characterised by the shape of the probe
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/129—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding specially adapted for particular articles or work
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32807—Construction (includes replacing parts of the apparatus)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/206—Modifying objects while observing
- H01J2237/2065—Temperature variations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/021—Heaters specially adapted for heating liquids
Definitions
- the present disclosure relates generally to friction stir welding in semiconductor manufacturing applications, and more particularly to forming friction stir welded components that enable efficient heat transfer during the manufacture of semiconductor devices.
- the disclosure relates to the use of friction stir welding in joining components together in a pedestal, more particularly a showerhead pedestal, for a processing chamber.
- heater coils are embedded into a pedestal platen channel and filled with a metal plug that is e-beam (electron beam) welded or vacuum brazed into place.
- e-beam electron beam
- friction stir welding of heater coils is used to address limitations of conventional welding techniques and to seek to avoid pedestal warping and premature failure thereof. Improved thermal performance of the pedestal is also sought to be provided in some embodiments through the use of thermal posts or columns and cascaded circular baffles.
- a showerhead pedestal assembly for a substrate processing chamber includes a faceplate; a platen disposed within the faceplate, the platen including a heater element extending through at least one groove in the faceplate, the at least one groove profiled to accept at least one portion of the heater element extending therethrough; a power supply for the heater element; wherein a periphery of the platen is joined to an interior surface of the faceplate by a friction stir welded joint.
- the faceplate includes a plurality of apertures to allow the passage of a gas through the showerhead pedestal assembly to an underside of a substrate supported by the showerhead pedestal assembly.
- the showerhead pedestal assembly further comprises a plurality of heat transfer posts extending between opposed surfaces of the faceplate and the platen, the plurality of heat transfer posts including a friction stir welded material.
- the friction stir welded material is dissimilar to a material of the faceplate or the platen and enables the creation of a friction stir welded joint between the faceplate and the platen.
- a material of the plurality of heat transfer posts is selected to enhance or retard heat transfer between the faceplate and the platen.
- a material of the plurality of heat transfer posts is the same as a material of the heater element.
- the showerhead pedestal assembly further comprises a filler cap including at least one baffle sized and configured to reside in the at least one groove in the faceplate.
- the at least one baffle of the filler cap secures the at least one portion of the heater element in a respective groove in the faceplate.
- the at least one baffle includes a curved formation, the curved formation matching a profile of the respective groove in the faceplate.
- the at least one baffle includes a friction stir welded material.
- the at least one baffle is provided along an upper surface of the filler cap.
- a portion of the filler cap includes a heat sink, the heat sink providing a body of relatively cooler material than a material of the platen during operation of the showerhead pedestal assembly.
- the at least one baffle includes at least one aperture allowing the passage of gas therethrough.
- the at least one baffle is provided in a series of baffles extending in a spaced array along a profile of the heater element, the spaced array of baffles including one or more gaps between sequential baffles allowing the passage of gas therethrough.
- the friction stir welded material of the at least one baffle is dissimilar to a material of the faceplate or the heater element and enables the creation of a friction stir welded joint between the heater element and the faceplate.
- the at least one baffle is included in a plurality of concentric rings of baffles.
- At least one ring of the plurality' of concentric rings of baffles includes spaced baffles.
- each of the spaced baffles includes one or more apertures form therein allowing a specific or controlled flow of gas through the one or more apertures.
- a gap between a pair of spaced baffles in the at least one concentric ring of baffles is sized to allow a specific or controlled flow of gas to pass therethrough.
- the heater element is energized by the power supply during formation of the friction stir welded joint.
- FIG. 1 is a sectional view of a showerhead pedestal, according to an example embodiment.
- FIG. 2 depicts an arrangement for friction stir welding, according to an example embodiment.
- FIG. 3 is a pictorial view of a heater element, according to an example embodiment.
- FIG. 4 is a sectional view of a showerhead pedestal, according to an example embodiment.
- FIG. 5 is a pictorial view of a filler cap, according to an example embodiment.
- FIG. 6 is a sectional view of a showerhead pedestal, according to an example embodiment.
- FIG. 7 is a pictorial, part sectional view of a showerhead pedestal, according to an example embodiment.
- FIG. 8 is a sectional view of a showerhead pedestal, according to an example embodiment.
- FIG. 9 is a block diagram illustrating an example of a machine by which one or more example embodiments may be controlled.
- FIG. 10 shows aspects of an arrangement for friction stir welding, according to an example embodiment.
- FIG. 11 is a flowchart including operations in an example method, according to an example embodiment.
- a processing chamber may include a pedestal or truck to secure a substrate (such as a wafer) dining processing.
- a substrate such as a wafer
- heater coils used in such pedestals are usually manufactured by conventional techniques such as vacuum brazing or electron beam welding. Interfacial joint strength between heater coils and pedestal parts have proven to be inconsistent and poor, resulting in non-effective heat transfer between heater and the pedestal plates and sometimes causing pedestal warping and premature failure of a pedestal.
- friction stir welding is employed to manufacture or join pedestal parts such as a heater element, a faceplate, and a pedestal stem, for example.
- pedestal parts such as a heater element, a faceplate, and a pedestal stem
- the manufacture or joining of other components is possible.
- the methods and articles of manufacture described herein may exhibit improved thermal and mechanical properties as compared to articles made using conventional techniques such as vacuum brazing and electron beam welding.
- FSW addresses several limitations of conventional techniques. Such limitations may include weld cracking and porosity resulting in a reduced heat transfer within pedestal components and a diminished efficiency of a processing chamber to which such a pedestal has been fitted.
- an example showerhead pedestal assembly 100 includes a faceplate 102 and a platen 104 disposed within the faceplate 102.
- the faceplate 102 includes apertures as shown to allow the passage of gases up through the showerhead pedestal assembly 100 to an underside of a substrate (such as a wafer) supported by the showerhead pedestal assembly 100 in use.
- the platen 104 distributes heat within the showerhead pedestal assembly 100.
- the platen 104 includes a heater element 106.
- the profile and general configuration of an example heater element 106 may be more clearly reviewed pictorially as shown in example 300 of FIG.3 or in FIG. 7.
- the heater element 106 includes a number of heater coils 108 lying in a common plane within channels (recesses, or grooves) 124 formed in the platen 104, as shown. Other coil arrangements are possible.
- a heater coil 108 is secured within a groove by filler cap 110 material.
- the grooves may be continuous and shaped to accept a profile and configuration of a given heater element 106.
- the material of a filler cap 110 may, or may not, include the same material as a material of the platen 104, or a material of a heater coil 108.
- a material of a filler cap 110 may be selected to improve or boost the transfer of heat through the platen 104 to the faceplate 102 or other regions of the showerhead pedestal assembly 100.
- a deep or increased weld depth enabled in some examples by friction stir welding in a channel 124 allows for the introduction of a heat sink.
- the heat sink provides a body of relatively cooler material than the platen 104, and this cooler mass may assist in preventing platen 104 warping.
- a relative thermal conductivity' of a filler cap 110 material in a channel 124 may also be selected to assist in this regard.
- Power to the heater coils 108 of the heater element 106 may be supplied by a power line 118.
- a gas distribution channel 114 distributes gas to the apertured faceplate 102 and other components of the showerhead pedestal assembly 100.
- the power line 118 and gas distribution channel 114 may pass through a stem 116 of the showerhead pedestal assembly 100, as shown.
- friction stir welding is used to assemble or form components of the showerhead pedestal assembly 100.
- a friction stir weld is employed to join the periphery of the platen 104 to an interior surface of the faceplate 102.
- a friction stir weld is employed to form a filler cap 110 above a heater coil 108 to secure the heater coil 108 in the body of tire platen 104, as shown.
- Other pedestal components may be joined or formed in similar manner.
- Other friction stir welding zones are possible.
- One component 202 of the showerhead pedestal assembly 100 may be joined to another component 204 in the manner shown.
- the illustrated component 202 may include an edge portion of a faceplate 102, disposed for example in zone 120.
- the other illustrated component 204 may include an edge portion of a platen 104, for example disposed in the same zone 120.
- a downward force 206 is exerted on a rotating friction stir welding (FSW) tool 208 that is advanced in a weld direction 210 between the edge portions of the two components 202 and 204.
- the FSW tool 208 includes a shoulder 212 and a pin 214.
- the spinning FSW tool 208 creates a friction stir welded region 216 as it advances though the material of the components 202 and 204 to be joined together.
- the friction stir welded region 216 so formed includes a welded nugget 218 that joins the components 202 and 204 together.
- the nugget 218 has an advancing side 220 and a retreating side 222 corresponding to the spinning rotational direction 224 of tire tool.
- thermal non-uniformity in a pedestal or a showerhead may result in poor“on wafer” (on substrate) processing performance. In this situation, processing heat is lost or not directed correctly to a desired region.
- FIGS.3-4 depict components of a further example of the present disclosure.
- the heater element 300 illustrated in FIG. 3 has features for controlling or enhancing heat transfer within a showerhead pedestal.
- the heater element 300 includes heater coils 306 supplied by one or more power lines 304.
- heat transfer between a faceplate 102 and a platen 104 (or backplate) occurs mostly by conduction at joined edges thereof, for example in or near zone 120 of FIG. 1.
- supplementary heat transfer columns or posts 302 are provided.
- the posts 302 may be separately fabricated or formed by friction stir welding to extend between the faceplate 102 and platen 104, as shown for example at 402 in FIG. 4.
- Other elements of the showerhead pedestal 400 may be the same as or similar to those described above in relation to showerhead pedestal assembly 100 of FIG. 1.
- the posts 302 (402 in FIG.4) manufactured by friction stir welding may assist, for example, in conducting heat between a faceplate 102 and platen 104 within a showerhead pedestal assembly 100.
- the heat transfer posts 302 may enhance a structural rigidity of the showerhead pedestal assembly 100, or a security of a location of a heater element 106 within a platen 104, or a stiffness of a faceplate 102 or platen 104.
- the heat transfer posts 302 allow escape of heat from the faceplate 102 to the platen 104 or by radiation to reduce the temperature of the faceplate 102 during w'afer processing and minimize or avoid faceplate deflection or warping. Other configurations and arrangements of the heat transfer posts 302 are possible.
- a material of the heat transfer posts 302 may be selected to enhance or retard heat transfer between a faceplate 102 and a platen 104.
- a selected material for a post 302 may, or may not, be the same as a material of a heater coil 108.
- FIG.5 illustrates an example filler cap 500 that includes a series of curved or arc-shaped baffles 502 formed along an upper surface thereof, as shown for example. Other configurations are possible.
- the illustrated filler cap 500 can secure the coils 108 of a heater element 106 within the channel 124 of a platen 104, as previously described with reference to FIG. 1.
- a showerhead pedestal 600 in some examples of a showerhead pedestal 600, various combinations of friction stir welded posts 302 (for example, shown in FIG. 3, not visible in FIG. 6) and curved baffles 502 may be interposed between a platen 604 and faceplate 602 to control heat transfer and improve thermal uniformity.
- Other arrangements and configurations of baffles 502 are possible.
- optimized materials pairings, thicknesses and spacing patterns for a series of baffles may be employed and configured, accordingly.
- Other elements of the showerhead pedestal 600 may be tire same as or similar to those described above in relation to showerhead pedestal assembly 100 of FIG. 1.
- some example embodiments may provide more specific control of thermal and gas flow's 708 within a showerhead pedestal 700.
- concentric rings 702, 704, and 706 of spaced baffles 710 are provided to extend between a faceplate 802 and platen 804 (FIG. 8) within a showerhead pedestal 700 (or 100, 400, 600).
- the baffles 710 include apertures 712 and be spaced apart as shown (or in other manners) to allow a specific or controlled flow of gas through the apertures 712 or past the baffles 710 in the spaced gaps therebetween.
- FIG. 10 shows aspects of an example arrangement 1000 for friction stir welding.
- a heater coil 1002 (for example, one of the heater coils 108, FIG. 1) is activated during the friction stir welding by an FSW tool 1004 of pedestal components to control cooling behaviour and grain growth or size around an FSW weld.
- the FSW tool 1004 may include a shoulder 1006 and a pin 1008 as described previously.
- FSW joints are left to cool by natural convection and no process control for the weld zone typically exists in the current context.
- the activation of heater coils 1002 during an FSW process may control (for example, retard) a cooling rate of an FSW weld to configure or provide specific heat affected zones and improve w'eld quality and material properties by controlling grain growth during weld solidification, for example.
- an example method 1100 of forming a showerhead pedestal assembly for a substrate processing chamber comprises: at operation 1102, providing a faceplate; at operation 1104, providing a platen disposed within the faceplate, the platen including a heater element extending through at least one groove in the faceplate, the at least one groove profiled to accept at least one portion of the heater element extending therethrough; at operation 1106, providing a power supply for the heater element; and, at operation 1108, joining a periphery of the platen to an interior surface of the faceplate by friction stir welding.
- the method 1100 further comprises forming in the faceplate a plurality of apertures to allow the passage of a gas through the showerhead pedestal assembly to an underside of a substrate supported by the showerhead pedestal assembly.
- the method 1100 further comprises forming, by friction stir welding, a plurality of heat transfer posts extending between opposed surfaces of the faceplate and the platen.
- the friction stir welding includes a material dissimilar to a material of the faceplate or the platen and enables the creation of a friction stir welded joint between the faceplate and the platen.
- the method 1100 further comprises selecting a material of the plurality of heat transfer posts to enhance or retard a heat transfer between the faceplate and the platen.
- a material of the plurality of heat transfer posts is the same as a material of the heater coil.
- the method 1100 further comprises providing a filler cap for the showerhead pedestal assembly, the filler cap including at least one baffle sized and configured to reside in the at least one groove in the faceplate.
- the at least one baffle of the filler cap secures the at least one portion of the heater coil in a respective groove in the faceplate.
- the at least one baffle includes a curved formation, the curved formation matching a profile of the respective groove in the faceplate.
- the method 1100 further comprises forming the at least one baffle by friction stir welding.
- the method 1100 further comprises providing the at least one baffle along an upper surface of the filler cap.
- a portion of the filler cap includes a heat sink, the heat sink providing a body of relatively cooler material than a material of the platen during operation of the showerhead pedestal assembly.
- the at least one baffle includes at least one aperture allowing the passage of gas therethrough.
- the at least one baffle is provided in a series of baffles extending in a spaced array along a profile of the heater element, the spaced array of baffles including one or more gaps between sequential baffles allowing the passage of gas therethrough.
- a material included in the friction stir welding of the at least one baffle is dissimilar to a material of the faceplate or the heater element and enables the creation of a friction stir welded joint between the heater element and the faceplate.
- the at least one baffle is included in a plurality of concentric rings of baffles.
- the at least one ring of the plurality of concentric rings of baffles includes spaced baffles.
- each of the spaced baffles includes one or more apertures form therein allowing a specific or controlled flow of gas through the one or more apertures.
- a gap between a pair of spaced baffles in the at least one concentric ring of baffles is sized to allow a specific or controlled flow of gas to pass therethrough.
- the method 1100 further comprises energizing the heater element by the power supply during formation of a friction stir welded joint by the friction stir welding.
- FIG. 9 is a block diagram illustrating an example of a machine
- the machine 900 upon which one or more example process embodiments described herein may be implemented, or by which one or more example process embodiments described herein may be controlled.
- the machine 900 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine 900 may operate in the capacity of a server machine, a client machine, or both in server-client network environments. In an example, the machine 900 may act as a peer machine in a peer-to-peer (P2P) (or other distributed) network environment.
- P2P peer-to-peer
- machine shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions 924 to perform any one or mote of the methodologies discussed herein, such as via cloud computing, software as a service (SaaS), or other computer cluster configurations.
- SaaS software as a service
- Examples, as described herein, may include, or may operate by, logic and/or a number of components or mechanisms.
- Circuitry is a collection of circuits implemented in tangible entities that include hardware (e.g., simple circuits, gates, logic, etc.). Circuitry membership may be flexible over time and underlying hardware variability. Circuitries include members that may, alone or in combination, perform specified operations when operating. In an example, hardware of the circuitry' may be immutably designed to carry' out a specific operation (e.g., hardwired).
- the hardware of the circuitry may include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.) including a computer-readable medium physically modified (e.g., magnetically, electrically, by moveable placement of invariant massed particles, etc.) to encode instructions 924 of the specific operation.
- a computer-readable medium physically modified (e.g., magnetically, electrically, by moveable placement of invariant massed particles, etc.) to encode instructions 924 of the specific operation.
- the instructions 924 enable embedded hardware (e.g., the execution units or a loading mechanism) to create members of the circuitry in hardware via the variable connections to cany' out portions of the specific operation when in operation.
- the computer-readable medium is communicatively coupled to the other components of the circuitry when the device is operating.
- any of the physical components may be used in more than one member of more than one circuitry.
- execution units may be used in a first circuit of a first circuitry at one point in time and reused by a second circuit in the first circuitry, or by a third circuit in a second circuitry, at a different time.
- the machine (e.g., computer system) 900 may include a hardware processor 902 (e.g., a central processing unit (CPU), a hardware processor core, or any combination thereof), a graphics processing unit (GPU) 903, a main memory 904, and a static memory- 906, some or all of which may communicate with each other via an interlink (e.g., bus) 908.
- the machine 900 may further include a display device 910, an alphanumeric input device 912 (e.g., a keyboard), and a user interface (UI) navigation device 914 (e.g., a mouse).
- the display device 910, alphanumeric input device 912, and UI navigation device 914 may be a touch screen display.
- the machine 900 may additionally include a mass storage device (e.g., drive unit) 916, a signal generation device 918 (e.g., a speaker), a network interface device 920, and one or more sensors 921, such as a Global Positioning System (GPS) sensor, compass, accelerometer, or another sensor.
- the machine 900 may include an output controller 928, such as a serial (e.g., universal serial bus (USB)), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate with or control one or more peripheral devices
- a serial e.g., universal serial bus (USB)
- USB universal serial bus
- IR infrared
- NFC near field communication
- the mass storage device 916 may include a machine-readable medium 922 on which is stored one or more sets of data structures or instructions 924 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein.
- the instructions 924 may also reside, completely or at least partially, within the main memory 904, within the static memory 906, within the hardware processor 902, or within the GPU 903 during execution thereof by the machine 900.
- one or any combination of the hardware processor 902, the GPU 903, the main memory 904, the static memory 906, or the mass storage device 916 may constitute machine-readable media 922.
- machine-readable medium 922 is illustrated as a single medium, the term“machine-readable medium’' may include a single medium, or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 924.
- machine-readable medium may include a single medium, or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 924.
- machine-readable medium may include any medium that can store, encode, or carry instructions 924 for execution by the machine 900 and that cause the machine 900 to perform any one or more of the techniques of the present disclosure, or that can store, encode, or carry data structures used by or associated with such instructions 924.
- Non-limiting machine-readable medium examples may include solid-state memories, and optical and magnetic media.
- a massed machine-readable medium comprises a machine-readable medium 922 with a plurality of particles having invariant (e.g., rest) mass. Accordingly, massed machine-readable media are not transitory propagating signals.
- massed machine-readable media may include non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.
- the instructions 924 may further be transmitted or received over a communications network 926 using a transmission medium via the network interface device 920.
- inventive subject matter may be referred to herein, individually and/or collectively, by the term“invention” merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in feet disclosed.
- inventive concept merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in feet disclosed.
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- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Furnace Charging Or Discharging (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020217033051A KR102646002B1 (en) | 2019-03-15 | 2020-03-12 | Friction stir welding in semiconductor fabrication applications |
| US17/438,932 US12272591B2 (en) | 2019-03-15 | 2020-03-12 | Friction stir welding in semiconductor manufacturing applications |
| JP2021555428A JP7539912B2 (en) | 2019-03-15 | 2020-03-12 | Friction Stir Welding in Semiconductor Manufacturing Applications |
| CN202080021384.9A CN113614902B (en) | 2019-03-15 | 2020-03-12 | Friction Stir Welding in Semiconductor Manufacturing Applications |
| SG11202110075RA SG11202110075RA (en) | 2019-03-15 | 2020-03-12 | Friction stir welding in semiconductor manufacturing applications |
| JP2024135169A JP7725675B2 (en) | 2019-03-15 | 2024-08-14 | Friction Stir Welding in Semiconductor Manufacturing Applications |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962819215P | 2019-03-15 | 2019-03-15 | |
| US62/819,215 | 2019-03-15 |
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| WO2020190658A1 true WO2020190658A1 (en) | 2020-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/US2020/022497 Ceased WO2020190658A1 (en) | 2019-03-15 | 2020-03-12 | Friction stir welding in semiconductor manufacturing applications |
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| US (1) | US12272591B2 (en) |
| JP (2) | JP7539912B2 (en) |
| KR (1) | KR102646002B1 (en) |
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| TW (2) | TWI901065B (en) |
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| KR102940369B1 (en) | 2021-09-29 | 2026-03-16 | 주식회사 엘지에너지솔루션 | Electrode lead gripper |
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- 2020-03-12 US US17/438,932 patent/US12272591B2/en active Active
- 2020-03-12 KR KR1020217033051A patent/KR102646002B1/en active Active
- 2020-03-12 CN CN202080021384.9A patent/CN113614902B/en active Active
- 2020-03-12 SG SG11202110075RA patent/SG11202110075RA/en unknown
- 2020-03-12 JP JP2021555428A patent/JP7539912B2/en active Active
- 2020-03-12 WO PCT/US2020/022497 patent/WO2020190658A1/en not_active Ceased
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Also Published As
| Publication number | Publication date |
|---|---|
| US12272591B2 (en) | 2025-04-08 |
| CN113614902B (en) | 2025-05-06 |
| TWI841699B (en) | 2024-05-11 |
| KR102646002B1 (en) | 2024-03-08 |
| CN113614902A (en) | 2021-11-05 |
| JP7539912B2 (en) | 2024-08-26 |
| TW202101637A (en) | 2021-01-01 |
| JP2024161464A (en) | 2024-11-19 |
| SG11202110075RA (en) | 2021-10-28 |
| TW202445725A (en) | 2024-11-16 |
| KR20210129232A (en) | 2021-10-27 |
| TWI901065B (en) | 2025-10-11 |
| JP2022525191A (en) | 2022-05-11 |
| JP7725675B2 (en) | 2025-08-19 |
| US20220189817A1 (en) | 2022-06-16 |
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