WO2020189108A1

WO2020189108A1 - Component installation device and component installation method, mounting substrate manufacturing system and mounting substrate manufacturing method, and installed component inspection device

Info

Publication number: WO2020189108A1
Application number: PCT/JP2020/005512
Authority: WO
Inventors: 谷口　昌弘; 利彦永冶; 貴之北; 哲矢田中; 正宏木原
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2019-03-15
Filing date: 2020-02-13
Publication date: 2020-09-24
Also published as: JP7382551B2; CN113508652A; DE112020001298T5; CN113508652B; JPWO2020189108A1

Abstract

This mounting substrate manufacturing system has a solder section formed on a substrate, and includes a component-installing device that installs a component in this solder section. According to this system, mounting point position data obtained by making actual measurements of the substrate is associated with identification information of the substrate. Also, the position of the solder section formed on the substrate is measured, and solder section position data is created. Then, the solder section position data is associated with the substrate identification information. Furthermore, installation-target position data is created on the basis of the mounting point position data and the solder section position data identified by the same identification information, the installation-target position data including the installation-target position of the component identified by the identification information.

Description

Component mounting device and component mounting method, mounting board manufacturing system and mounting board manufacturing method, and mounted component inspection device

The present disclosure relates to a component mounting device and a component mounting method for mounting components on a substrate on which a solder portion is formed, a mounting board manufacturing system and a mounting board manufacturing method using the same, and a mounted component inspection device.

A mounting board manufacturing system that mounts electronic components on a board to manufacture a mounting board is configured by connecting a plurality of component mounting equipment such as a solder printing device, a component mounting device, and a reflow device. In a mounting board manufacturing system having such a configuration, if the solder printing position shifts with respect to the solder bonding land on the board, mounting defects due to this shift occur. For the purpose of preventing such mounting defects, a position correction technique for feeding forward the solder position information on the substrate after solder printing to a subsequent process is used. In the position correction based on the feed forward of the solder position information, the solder position information obtained by actually measuring the printing position of the solder is sent to the component mounting device in the subsequent process. In the component mounting device, the mounting position is corrected based on the sent solder position information (see, for example, Patent Document 1). In the technique shown in Patent Document 1, the component mounting device executes the first mounting mode in which the feed-forwarded solder position information is applied to execute the component mounting, and the component mounting without applying the solder position information. Selectively execute the second mounting mode.

Japanese Unexamined Patent Publication No. 2014-103191

The mounting board manufacturing system of the present disclosure includes a mounting point position data storage unit, a solder part forming device, a solder part inspection device, a solder part position data storage unit, a mounting target position data creation unit, and a component mounting device. Have. The mounting point position data storage unit stores the mounting point position data including the mounting point position obtained by actually measuring the board in association with the identification information for identifying the board. The solder portion forming apparatus forms a solder portion on the substrate. The solder part inspection device measures the solder part formed on the substrate by the solder part forming device, and creates the solder part position data including the position of the solder part. The solder portion position data storage unit stores the solder portion position data in association with the identification information. The mounting target position data creation unit creates mounting target position data including the mounting target position of the component on the board specified by the identification information based on the mounting point position data specified by the identification information and the solder part position data. .. The component mounting device positions the substrate whose position of the solder portion is measured by the solder portion inspection device at the working position. Further, the component mounting device has a mounting head. The mounting head mounts the component at the mounting target position on the board located at the working position. The mounting target position is specified by the mounting target position data associated with the identification information of the substrate.

In the mounting board manufacturing method of the present disclosure, a component mounting device having a mounting head for mounting a component at a mounting point of the board is used. In this manufacturing method, the mounting point position data including the mounting point position obtained by actually measuring the board is stored in association with the identification information for identifying the board. On the other hand, a solder portion is formed on the substrate. Then, the solder portion position data is stored in association with the identification information. Further, based on the mounting point position data specified by the identification information and the solder portion position data, mounting target position data including the mounting target position of the component on the substrate specified by the identification information is created. Then, the component mounting device positions the board whose position of the solder portion is measured at the working position, and mounts the component at the mounting target position specified by the mounting target position data associated with the identification information of the board.

The component mounting device of the present disclosure includes a board transporting unit, a mounting target position data acquisition unit, and a mounting work unit. The substrate transport unit receives the substrate to which unique identification information is given, the solder portion is formed, and the position of the solder portion is measured, and positions the substrate at the working position. The board transfer unit further carries out the component-mounted board on which the component has been mounted from the work position to the equipment downstream. The mounting target position data acquisition unit acquires the mounting target position data calculated based on the mounting point position data and the solder portion position data specified by the same identification information as the mounting point position data. The mounting point position data is obtained by actually measuring the board and includes the position of the mounting point of the board. The solder portion position data includes the position of the solder portion obtained by actually measuring the solder portion. The mounting work unit has a mounting head. The mounting head mounts the component at the mounting target position on the board located at the working position. The mounting target position is specified by the mounting target position data associated with the identification information of the substrate.

The component mounting method of the present disclosure is executed by a component mounting device that holds a component with a mounting head and mounts the component on a board to which unique identification information is given. In this component mounting method, the board is received from the upstream equipment and positioned at the working position by the mounting head. On the other hand, the mounting target position data calculated based on the mounting point position data and the solder portion position data specified by the same identification information as the mounting point position data is acquired. The mounting point position data includes the position of the mounting point of the board obtained by actually measuring the board. The solder portion position data includes the position of the solder portion obtained by actually measuring the solder portion. Then, the component is mounted by the mounting head at the mounting target position specified by the mounting target position data associated with the identification information of the board located at the working position.

The mounted component inspection device of the present disclosure is included in the mounting board manufacturing system of the present disclosure, and measures the deviation of the mounting position of the mounted component at the mounting point of the board identified by the unique identification information. This inspection device has a work stage, a data acquisition unit, and an inspection unit. The work stage holds a component-mounted board on which components are mounted by a component-mounting device. The data acquisition unit acquires the mounting target position data associated with the identification mark of the substrate held on the work stage. The mounting target position data is created in advance by the mounting target position data creation unit in the information management device of the mounting board manufacturing system. The inspection unit obtains the deviation of the mounting position of the component mounted at the mounting point of the board held on the work stage. That is, the inspection unit obtains the deviation of the mounting position of the component with respect to the mounting target position set based on the mounting target position data.

According to the present disclosure, a high level of component mounting quality can be realized by applying the accurate position information of the mounting point of the board and the solder position information obtained by actually measuring the board.

Configuration explanatory view of the mounting board manufacturing system according to the embodiment of the present disclosure. Configuration explanatory view of the screen printing apparatus constituting the mounting board manufacturing system shown in FIG. Functional explanatory view of the screen printing apparatus constituting the mounting board manufacturing system shown in FIG. Configuration explanatory view of the board measuring device, the solder part inspection device, the mounted component inspection device, and the mounting board inspection device constituting the mounting board manufacturing system shown in FIG. Configuration explanatory view of the component mounting device constituting the mounting board manufacturing system shown in FIG. A block diagram showing a configuration of a control system of an information management device and a component mounting device in the mounting board manufacturing system shown in FIG. A block diagram showing a configuration of a control system of a mounted component inspection device in the mounting board manufacturing system shown in FIG. A flowchart showing processing in the substrate measuring apparatus shown in FIG. A process explanatory view showing processing in the board measuring apparatus constituting the mounting board manufacturing system shown in FIG. A flowchart showing processing in the screen printing apparatus shown in FIG. A process explanatory view showing processing in the screen printing apparatus shown in FIG. A flowchart showing processing in the solder portion inspection apparatus shown in FIG. A process explanatory view showing processing in the solder portion inspection apparatus shown in FIG. A flowchart showing processing in the information management device shown in FIG. A process explanatory diagram showing processing in the information management device shown in FIG. A flowchart showing processing in the component mounting device shown in FIG. A process explanatory diagram showing processing in the component mounting apparatus shown in FIG. Flow chart showing processing in the mounted parts inspection device shown in FIG. A process explanatory view showing processing in the mounted parts inspection apparatus shown in FIG. A flowchart showing processing in the mounting board inspection apparatus shown in FIG. A process explanatory view showing processing in the mounting board inspection apparatus shown in FIG. Cross-sectional view of the land of the first pattern formed on the substrate to be worked on the mounting substrate manufacturing system of the embodiment of the present disclosure. Top view of the land of the first pattern shown in FIG. 15A Cross-sectional view of the land of the second pattern formed on the substrate to be worked on the mounting substrate manufacturing system of the embodiment of the present disclosure. Top view of the land of the second pattern shown in FIG. 16A Diagram showing an example of computer hardware configuration

Prior to the embodiment of the present disclosure, the background to the present disclosure will be described. Including the technique shown in Patent Document 1 described above, it is difficult to further improve the position correction accuracy in the prior art due to the method of setting the position reference in the position correction. That is, in the prior art, the solder position after printing and the mounting position after component mounting are measured based on the land position and mounting point indicated by the CAD data used for the board design, and the amount of misalignment obtained by these measurements is measured. Is applied to correct the component mounting position. However, the land position and mounting point on the actual board often deviate from the position indicated by the CAD data due to factors such as variations in the board manufacturing process and the influence of thermal expansion in reflow. Therefore, there is a limit to the accuracy of position correction to which the above-mentioned feed-forwarded solder position information is applied, and it is required to solve this problem in order to realize a higher level of component mounting quality. In particular, in a mounting board in which components are mounted on both sides of the board, fluctuations in the land position of the second surface are unavoidable due to the influence of thermal expansion in the reflow after mounting on the first surface. Therefore, in the case of double-sided mounting, it is more difficult to achieve a high degree of component mounting quality.

The present disclosure discloses a component mounting device and a component mounting method capable of improving the accuracy of position correction to which solder position information is applied to achieve a high degree of component mounting quality, and a mounting board manufacturing system and mounting board using these. Provide a manufacturing method. The present disclosure also provides a mounted component inspection device used in a mounting board manufacturing system.

Next, an embodiment of the present disclosure will be described with reference to the drawings. First, the configuration and function of the mounting board manufacturing system 1 in the present embodiment will be described with reference to FIGS. 1 and 2. The mounting board manufacturing system 1 manufactures a mounting board on which electronic components (hereinafter referred to as components) are mounted on the board 4 shown in FIG. In FIG. 1, the mounting board manufacturing system 1 mainly includes a component mounting line 1a in which a plurality of component mounting devices are connected. The equipment constituting the component mounting line 1a is connected to each other by the communication network 2 and is connected to the information management device 3 via the communication network 2.

In the component mounting line 1a, in order from the upstream, the board supply device M1, the board identification information imparting device M2, the board measuring device M3, the screen printing device M4, the solder part inspection device M5, the component mounting devices M6, M7, and the mounted component inspection device. The M8, the reflow device M9, the mounting board inspection device M10, and the board recovery device M11 are connected in series in the board transfer direction (positive direction of the X-axis). These component mounting equipment include component mounting devices M6 and M7 that hold components by component holding nozzles and mount them at mounting points of a substrate 4 on which a solder portion is formed.

The board supply device M1 supplies the unmounted board 4 to be produced to the downstream board identification information imparting device M2. The board identification information giving device M2 gives the board 4 supplied from the board supply device M1 unique identification information for identifying the board 4. For example, the substrate identification information imparting device M2 is a laser marker that prints an identification code, which is identification information, on the substrate 4 by a laser.

The board measuring device M3 actually measures the position (land position) and size of the reference mark formed on the board 4 and the land for solder connection by imaging the board 4. Then, the land measurement data including the measured land position and size is transmitted to the information management device 3 via the communication network 2 together with the identification information of the board 4 to be measured. Further, the board measuring device M3 calculates the position of the mounting point from the measurement result. The position of the mounting point is specified by the relative positional relationship with the reference mark of the substrate 4. Specifically, the position of the mounting point is specified by the coordinates in the coordinate system determined by the reference mark. The board measuring device M3 calculates the mounting point position data including the positional relationship between the reference mark of the board 4 and the mounting point from the measurement result, associates it with the identification information of the board 4, and establishes the information management device 3 via the communication network 2. Send to. The mounting point position data is transmitted to the screen printing device M4, the solder part inspection device M5, the component mounting devices M6, M7, the mounted component inspection device M8, and the mounting board inspection device M10, which are a group of devices downstream by the information management device 3. Feed forward.

In the present embodiment, the board measuring device M3 functions as a mounting point position data acquisition unit. That is, the mounting point position data acquisition unit acquires the mounting point position data regarding the positional relationship between the reference mark of the substrate and the mounting point obtained by the actual measurement. A device other than the board measuring device M3 (for example, the information management device 3 may calculate the mounting point position data. In this case, the board measuring device M3 and the device for calculating the mounting point position data are the mounting point positions. Alternatively, the board measuring device M3 may directly feed forward the mounting point position data to the downstream device group without going through the information management device 3.

Further, the mounting point position data is not indispensable for the screen printing device M4, the component mounting devices M6, M7, and the mounted component inspection device M8. Therefore, these devices may be excluded from the feed forward target. In this way, by acquiring the mounting point position data based on the measurement result of the actual measurement, the position error caused by the deformation of the board in the manufacturing process is eliminated, and the positional relationship between the mounting point and the reference mark of the board 4 is eliminated. Can be calculated accurately.

The screen printing device M4 forms a solder portion by screen printing on the land formed on the substrate 4. Therefore, the screen printing apparatus M4 functions as a solder portion forming apparatus for forming a solder portion on the substrate 4. In addition to using a screen printing device, for forming the solder portion, for example, a solder coating device that forms the solder portion by applying solder to the lands may be used.

The solder part inspection device M5 measures the position of the solder part formed on the substrate 4 by the screen printing device M4, and creates the solder part position data including the positional relationship between the reference mark and the solder part. That is, the solder portion position data includes the coordinates of the solder portion in the coordinate system determined by the reference mark. In the present embodiment, the mounting target position is calculated in consideration of the displacement of the solder portion based on the solder portion position data and the mounting point position data specified by the same identification information.

The component mounting devices M6 and M7 hold the component by the component holding nozzle, and mount the component at the mounting point of the substrate 4 on which the solder portion is formed by the screen printing device M4. In the present embodiment, unique identification information is given to the substrate 4 to be worked on by the component mounting devices M6 and M7 by the substrate identification information giving device M2. As a result, the correspondence between the solder portion position data and the mounting point position data described above is correctly determined via the identification information applied to the substrate 4.

The mounted component inspection device M8 measures the deviation of the component mounting position (hereinafter referred to as the mounting deviation) on the board 4 (hereinafter referred to as the component mounted board) on which the component is mounted by the component mounting devices M6 and M7. To do. The mounted component inspection device M8 outputs component mounting misalignment data related to this mounting misalignment. In the present embodiment, the mounted component inspection device M8 feeds back the component mounting misalignment data to the component mounting devices M6 and M7 to correct the component mounting misalignment caused by the time variation of the component mounting devices M6 and M7. Will be done. That is, calibration is performed. When the mounted component inspection device M8 measures the mounting misalignment of a component on the above-mentioned mounted component board, the mounted component inspection device M8 uses the mounting target position data associated with the identification information of the mounted component board as a reference for measuring the mounting misalignment of the component. Used as.

The reflow device M9 heats the component-mounted substrate according to a predetermined heating profile to melt and solidify the solder portion of the land and solder-join the component to the substrate 4. The mounting board inspection device M10 performs an inspection for determining the quality of the mounting board based on the image obtained by imaging the board 4 after the reflow. That is, the mounting board inspection device M10 inspects the mounting state of the board 4, that is, the quality of the position and orientation of the components after soldering, by recognizing the acquired image. The board recovery device M11 collects the completed non-defective mounting board after the mounting board inspection device M10 inspects the board.

Next, the configuration of the mounting equipment constituting the above-mentioned component mounting line 1a will be described with reference to FIGS. 2 to 5. Of these mounting equipment, only the screen printing device M4, the board measuring device M3, the solder part inspection device M5, the mounted component inspection device M8, the mounting board inspection device M10, and the component mounting devices M6 and M7 will be described here. However, the description of other equipment will be omitted.

First, the configuration of the screen printing device M4 will be described with reference to FIG. The substrate positioning unit 11 has a printing stage XYΘ table (hereinafter, table) 11a which is an alignment mechanism, and a printing stage elevating mechanism (hereinafter, elevating mechanism) 11b provided on the upper surface of the table 11a. The table 11a has a built-in screen printing control unit (hereinafter, control unit) 10 that controls each unit described below. The elevating mechanism 11b holds the printing stage 13 via the elevating table 13a.

By driving the table 11a, the print stage 13 moves horizontally in the XYΘ direction, and by driving the elevating mechanism 11b, the print stage 13 moves up and down. A board support portion 14 having a board support pin 14a is provided on the upper surface of the elevating table 13a. The board support unit 14 is driven up and down by a board support unit elevating mechanism (hereinafter, elevating mechanism) 14b.

Further, the elevating table 13a supports the printing stage conveyor 15b constituting the substrate transport unit 15 from below. The substrate transport unit 15 further includes a carry-in conveyor 15a located upstream of the printing stage conveyor 15b and a carry-out conveyor 15c located downstream. The substrate 4 carried into the carry-in conveyor 15a from the upstream is delivered to the printing stage conveyor 15b and is subject to screen printing by the screen printing unit 16 described below. The substrate 4 after screen printing is carried out downstream via the carry-out conveyor 15c.

A screen printing unit 16 is arranged above the printing stage 13. The screen printing unit 16 includes a screen mask 18 provided with a printing pattern for printing solder on the substrate 4. Above the screen mask 18, a squeegee drive mechanism 17a for bringing the squeegee 17 and the squeegee 17 into contact with the screen mask 18 to perform a squeezing operation is provided.

A camera unit 19 including a mask camera 19a and a substrate camera 19b is arranged between the printing stage 13 and the screen mask 18. The camera unit 19 can be moved along the X-axis and the Y-axis by a camera moving mechanism (not shown). As a result, the mask camera 19a images the desired position of the screen mask 18, and the substrate camera 19b images the desired position of the substrate 4. By recognizing the image acquired by this imaging, the horizontal positions of the screen mask 18 and the substrate 4 are detected. Then, based on this position detection result, the substrate 4 and the screen mask 18 can be aligned by horizontally moving the print stage 13.

In the screen printing of solder by the screen printing apparatus M4, as shown in FIG. 3, the elevating mechanism 11b is driven to raise the printing stage 13 while the substrate 4 is held by the printing stage conveyor 15b (arrow a). .. At the same time, the elevating mechanism 14b is driven to raise the board support portion 14 together with the board support pin 14a (arrow b). Further, the substrate 4 is received from the lower surface by the substrate support pin 14a, and the substrate 4 is pressed against the lower surface of the screen mask 18. Then, in this state, the squeegee 17 is lowered (arrow c) and brought into contact with the screen mask 18. The squeegee 17 is then moved along the Y axis. As a result, solder is screen-printed on the substrate 4 through the pattern holes formed in the screen mask 18, and a solder portion is formed on the land of the substrate 4.

Next, with reference to FIG. 4, the configurations and functions of the board measuring device M3, the solder part inspection device M5, the mounted component inspection device M8, and the mounting board inspection device M10 will be described. Since these devices have different inspection / measurement targets, the detailed configuration differs for each device, but they are common in that the inspection / measurement target is imaged by a camera and optically recognized. Hereinafter, the substrate measuring device M3 will be described as a representative.

The processing unit 20 is built in the base 21. The processing unit 20 controls various work operations and processes in the substrate measuring device M3, for example, a substrate transport operation, an imaging process, an image recognition process obtained by imaging, and an inspection / measurement process based on the image. The substrate transport portion 22 is arranged on the upper surface of the base 21. The substrate transport unit 22 transports the substrate 4 to be inspected / measured carried in from the upstream, and positions the substrate 4 at the inspection / measurement work position by the inspection head 24 described below.

The inspection head 24 has a lens barrel portion 24a and a lighting unit 24b provided at the lower end portion of the lens barrel portion 24a, and is along the X-axis and the Y-axis by the inspection head moving mechanism 25 composed of an XY table. And move horizontally. The camera 26 is built in the lens barrel portion 24a with its imaging direction facing downward. With this configuration, the camera 26 can be positioned above the desired portion of the substrate 4. The lighting unit 24b has a built-in upper lighting 28a and a lower lighting 28b.

When the camera 26 takes an image, the processing unit 20 turns on either or both of the upper illumination 28a and the lower illumination 28b according to the illumination conditions suitable for the imaging target. Further, a coaxial illumination 28c is provided on the side surface of the lens barrel portion 24a. By turning on the coaxial illumination 28c, the substrate 4 can be illuminated from the direction coaxial with the imaging direction of the camera 26 via the half mirror 27 arranged inside the lens barrel portion 24a. The upper lighting 28a, the lower lighting 28b, and the coaxial lighting 28c constitute an illumination light source unit 28.

By switching the lighting conditions in this way, it is possible to carry out inspections and measurements for different purposes with the same camera 26. The board measuring device M3 measures the board 4 and acquires (creates) mounting point position data, and the solder portion inspection device M5 inspects the solder portion and acquires (creates) the solder portion position data. Further, the mounted component inspection device M8 measures the mounting misalignment of the components mounted on the substrate 4 and acquires (creates) the component mounting misalignment data, and the mounting board inspection device M10 inspects the soldered components. Then, the mounting board inspection data is acquired (created).

Next, the configurations and functions of the component mounting devices M6 and M7 will be described with reference to FIG. Since the basic configurations of the component mounting devices M6 and M7 are common, the component mounting device M6 will be described as a representative. The component mounting device M6 mounts the component at the mounting point of the substrate 4 to which the component is held by the component holding nozzle 37b and unique identification information is given. A component mounting control unit (hereinafter, control unit) 30 is built in the base 31. The control unit 30 controls the work operation of the component mounting device M6 described below. The control unit 30 controls, for example, the substrate transfer operation and the component mounting operation by the component mounting mechanism. Further, the control unit 30 performs recognition processing of the image acquired by the component recognition camera 36 and the board recognition camera 39 included in the component mounting device M6. Hereinafter, the component recognition camera 36 and the board recognition camera 39 will be referred to as a first camera 36 and a second camera 39.

On the upper surface of the base 31, a substrate transfer unit 35 having a pair of substrate transfer conveyors is arranged along the X axis indicating the substrate transfer direction. The substrate transport unit 35 transports the substrate 4 to be worked on along the X axis. On the upper surface of the base 31, a substrate lower receiving portion 34 is provided between the substrate conveying portions 35. The substrate lower receiving portion 34 has a plurality of support pins 34a and a support pin elevating mechanism 34b for raising and lowering the support pins 34a. While the board 4 is carried into the mounting work position, the control unit 30 drives the support pin elevating mechanism 34b to raise the support pin 34a, so that the plurality of support pins 34a support the lower surface of the board 4.

Carts 32 for supplying parts are set on both sides of the base 31 in the Y-axis direction. A tape feeder 33, which is a component supply unit, is mounted on the upper surface of the carriage 32. The tape feeder 33 pitch-feeds the carrier tape containing the components mounted on the substrate 4 to supply the components to the component taking-out position by the component mounting mechanism described below.

Next, the configuration of the component mounting mechanism will be described. A mounting head moving mechanism (hereinafter, moving mechanism) 38 is arranged along the Y axis in the frame portion (not shown) supported by the base 31. The mounting head 37 is mounted on the moving mechanism 38 via the moving member 37a. A component holding nozzle 37b is provided at the lower end of the mounting head 37. By driving the moving mechanism 38, the mounting head 37 moves along the X-axis and the Y-axis. As a result, the mounting head 37 moves between the substrate 4 positioned and held by the substrate transport unit 35 and the tape feeder 33. Then, the components taken out from the tape feeder 33 by the component holding nozzle 37b are mounted on the substrate 4.

The first camera 36 is arranged between the substrate transport unit 35 and the tape feeder 33, respectively. The first camera 36 takes an image of the parts held by the mounting head 37 from below in a state where the mounting head 37 from which the parts are taken out from the tape feeder 33 is positioned above the first camera 36. As a result, the component held by the mounting head 37 is recognized, and the component is identified and the misalignment is detected.

A second camera 39 is arranged on the moving member 37a with the imaging direction facing downward. The second camera 39 takes an image of the substrate 4 held by the substrate transport unit 35 in a state where the second camera 39 is moved together with the mounting head 37 and positioned above the substrate 4. By recognizing the identification information of the substrate 4 and the images of the reference mark and the mounting point acquired by this imaging, the control unit 30 can identify the substrate 4 and detect the position. In the component mounting by the component mounting devices M6 and M7, the component mounting operation by the component mounting mechanism is corrected based on the identification result and the position detection result of the substrate 4 acquired in this way.

In the above configuration, the substrate transport unit 35 has the following functions. After the solder part is formed by the screen printing device M4 as the solder part forming device and the solder part is measured by the solder part inspection device M5, the board transporting part 35 first receives the board 4 and works with the component holding nozzle 37b. Position it. Next, the component-mounted board on which the component has been mounted by the component holding nozzle 37b is carried out from the work position to the equipment downstream.

Next, with reference to FIG. 6, the configuration of the control system of the information management device 3 and the component mounting devices M6 and M7 constituting the mounting board manufacturing system 1 will be described. The information management device 3 is connected to the control units 30 of the component mounting devices M6 and M7 via the communication network 2. The information management device 3 has a mounting point position data storage unit 41, a soldering unit position data storage unit 42, a mounting target position data creating unit 43, and a mounting target position data storage unit 44 as internal processing functions. Hereinafter, the mounting point position data storage unit 41 is the first storage unit 41, the solder unit position data storage unit 42 is the second storage unit 42, the mounting target position data creation unit 43 is the creation unit 43, and the mounting target position data storage unit 44 is It is referred to as a third storage unit 44. The first storage unit 41 stores the mounting point position data received from the solder unit inspection device M5 in association with the identification information that individually identifies the substrate 4. The mounting point position data is data related to the positional relationship between the reference mark of the board 4 and the mounting point obtained by actually measuring the board 4.

The second storage unit 42 stores the solder unit position data. The solder portion is formed on the substrate 4 by the screen printing device M4 which is a solder portion forming device, and the solder portion position data is obtained by measuring with the solder portion inspection device M5. The creating unit 43 creates mounting target position data of the component on the substrate 4 specified by the identification information based on the mounting point position data specified by the same identification information and the soldering part position data. The purpose of creating the mounting target position data based on the mounting point position data and the solder part position data is to consider the behavior of the component due to the surface tension of the molten liquid solder (hereinafter referred to as molten solder). This is to install. The third storage unit 44 stores the mounting target position data created by the creation unit 43. The mounting target position data is stored in association with the identification information of the corresponding substrate 4. The mounting target position data includes the coordinates of the mounting target position in the coordinate system determined by the reference mark on the substrate 4.

Further, the information management device 3 has a first information processing unit 45, a second information processing unit 46, and a third information processing unit 47. The first information processing unit 45, the second information processing unit 46, and the third information processing unit 47 are each configured to be communicable with one or more specific devices in the component mounting line 1a. Then, specific data corresponding to the one or more specific devices is exchanged with the one or more specific devices. The first information processing unit 45 can communicate with the solder unit inspection device M5 and the component mounting devices M6 and M7. The first information processing unit 45 receives the solder unit position data created by the solder unit inspection device M5 and stores it in the second storage unit 42. Further, the first information processing unit 45 transmits the mounting target position data stored in the third storage unit 44 to the component mounting devices M6 and M7. Specifically, when the first information processing unit 45 receives the identification information of the board 4 on which the component is to be mounted from the component mounting devices M6 and M7, the first information processing unit 45 mounts the component mounting target position data related to the identification information. Output to devices M6 and M7.

The second information processing unit 46 can communicate with at least the mounted parts inspection device M8. The second information processing unit 46 reads the mounting target position data related to the identification information of the substrate 4 inspected by the mounted parts inspection device M8 from the third storage unit 44 and provides the mounted parts inspection device M8 with the data. .. This is for the mounted component inspection device M8 to use the component mounting target position data related to the mounting target position as a reference for measuring the mounting deviation of the component. When the second information processing unit 46 receives the identification information of the board 4 from the mounted component inspection device M8, the second information processing unit 46 transmits the mounting target position data related to the identification information to the mounted component inspection device M8.

The third information processing unit 47 is capable of communicating with a plurality of component mounting devices (here, component mounting devices M6 and M7) and the mounted component inspection device M8. Then, the third information processing unit 47 distributes the component mounting deviation data output from the mounted component inspection device M8 to the component mounting devices that have executed the mounting of the components related to the mounting deviation, and distributes the component mounting deviation data to each component mounting device. provide. Specifically, the component mounting device includes a component mounting device M6 for mounting the first component on the board 4, and a component mounting device M7 for mounting the second component on the same board 4. The mounted component inspection device M8 measures the deviation of the first mounting position of the first component and the deviation of the second mounting position of the second component for each of the plurality of component mounted boards. Then, as the component mounting deviation data, the first component mounting deviation data regarding the deviation of the first mounting position is output, and the second component mounting deviation data regarding the deviation of the second mounting position is output. The third information processing unit 47 provides the first component mounting deviation data to the component mounting device M6 among the component mounting deviation data output from the mounted component inspection device M8, and the second component mounting deviation data is loaded as a component. Provided to device M7.

The configuration and division of the first information processing unit 45, the second information processing unit 46, and the third information processing unit 47 described above are arbitrary. For example, as shown in the present embodiment, the first information processing unit 45, the second information processing unit 46, and the third information processing unit 47 may be used as independent information processing devices having dedicated functions, respectively. The functions of the second information processing unit 46 and the third information processing unit 47 may be combined into a single information processing device. Further, all the functions of the first information processing unit 45, the second information processing unit 46, and the third information processing unit 47 may be combined to form one information processing device as a whole.

The control unit 30 is connected to the mounting head 37, the moving mechanism 38, and the substrate transport unit 35 to control them. Further, the control unit 30 captures the imaging results of the second camera 39 and the first camera 36.

As internal processing functions, the control unit 30 includes a board recognition unit 51, a component recognition unit 52, a component mounting processing unit 54, a mounting point position data acquisition unit 55, a mounting target position data acquisition unit 56, a calibration data calculation unit 57, and a component. It has a mounting misalignment data acquisition unit 58 and a data output unit 59. Further, the control unit 30 has a production-related data storage unit 53 as an internal memory, a mounting point position data storage unit 55a, a mounting target position data storage unit 56a, and a component mounting misalignment data storage unit 58a. Hereinafter, the mounting point position data acquisition unit 55, the mounting target position data acquisition unit 56, the calibration data calculation unit 57, and the component mounting deviation data acquisition unit 58 are combined with the first acquisition unit 55, the second acquisition unit 56, the calculation unit 57, and the second. 3 Acquisition unit 58, production-related data storage unit 53, mounting point position data storage unit 55a, mounting target position data storage unit 56a, component mounting misalignment data storage unit 58a are referred to as fourth storage unit 53, fifth storage unit 55a, It is referred to as a sixth storage unit 56a and a seventh storage unit 58a.

The board recognition unit 51 recognizes the image acquired by the second camera 39, and the component recognition unit 52 recognizes the image acquired by the first camera 36. That is, the substrate recognition unit 51 detects the identification information of the substrate 4 which is conveyed by the substrate transfer unit 35 and whose position is held by the substrate lower receiving unit 34, and recognizes the positions of the reference mark and the mounting point. Further, the component recognition unit 52 identifies a component held by the mounting head 37 and detects a misaligned state of the component.

The component mounting processing unit 54 controls the board transport unit 35, the mounting head 37, and the moving mechanism 38 to execute the component mounting process for mounting the components on the board on which the solder portion has been formed. Various production-related data such as mounting data referred to in this component mounting process are stored in the fourth storage unit 53.

The first acquisition unit 55 acquires the mounting point position data stored in the first storage unit 41 of the information management device 3. This mounting point position data relates to the positional relationship between the reference mark and the mounting point obtained by the actual measurement of the board 4 by the board measuring device M3. The fifth storage unit 55a stores the mounting point position data acquired by the first acquisition unit 55.

The second acquisition unit 56 acquires the mounting target position data created by the creation unit 43 of the information management device 3. The mounting target position data is calculated based on the mounting point position data and the solder portion position data including the position of the solder portion measured by the solder portion inspection device. The mounting point position data and the solder portion position data are specified by the same identification information. The sixth storage unit 56a stores the mounting target position data acquired by the second acquisition unit 56.

The calculation unit 57 calculates calibration data for correcting the component mounting deviation due to the time-dependent fluctuation of the component mounting device M6. This calibration data is calculated based on the component mounting deviation data related to the component mounting deviation measured by the mounted component inspection device M8 for the plurality of component mounted boards. In the component mounting work, the component mounting device M6 uses calibration data for correcting the mounting deviation of the component due to the time variation of the component mounting device M6, and the component when the component is mounted at the mounting target position. The stop position of the holding nozzle 37b is corrected. The calculation unit 57 calculates the same calibration data for the component mounting device M7, and the component mounting device M7 also uses the calibration data to correct the stop position of the component holding nozzle 37b.

The third acquisition unit 58 acquires component mounting misalignment data related to component mounting misalignment measured by the mounted component inspection device M8. The third acquisition unit 58 acquires the component mounting misalignment data distributed by the above-mentioned third information processing unit 47. The seventh storage unit 58a stores the component mounting misalignment data acquired by the third acquisition unit 58. The calculation unit 57 refers to the component mounting misalignment data stored in the seventh storage unit 58a when calculating the calibration data described above.

The data output unit 59 uploads operation information including log information collected by the component mounting devices M6 and M7 to a monitoring system (not shown) connected via the information management device 3 or the communication network 2. The log information includes error information and the like as well as information for identifying the component supply unit (tape feeder 33) and the component holding nozzle 37b used when supplying the component.

In the above configuration, the mounting head 37, the second camera 39, the moving mechanism 38, the first camera 36, the board recognition unit 51, the component recognition unit 52, the fourth storage unit 53, and the component mounting processing unit 54 perform operations for mounting components. The mounting work unit 40 for executing the above is configured. That is, the mounting work unit 40 detects the position of the reference mark on the substrate 4 located at the working position by the mounting head 37. Then, the mounting target position of the component at the working position is recognized from the detected position of the reference mark and the mounting target position data associated with the identification information of the substrate 4. Further, the component is mounted by the component holding nozzle 37b with the target mounting position as the target.

Next, with reference to FIG. 7, the configuration of the control system of the mounted component inspection device M8 constituting the mounting board manufacturing system 1 will be described. The information management device 3 is connected to the processing unit 20 of the mounted component inspection device M8 via the communication network 2. The processing unit 20 has a substrate recognition unit 20a, an inspection unit 20b, a data acquisition unit 20e, and a data output unit 20f as internal processing functions. Further, the processing unit 20 has an inspection-related data storage unit 20c and an inspection result storage unit 20d as internal memories. Hereinafter, the inspection-related data storage unit 20c and the inspection result storage unit 20d will be referred to as an eighth storage unit 20c and a ninth storage unit 20d.

The board transfer unit 22 carries in the component-mounted board sent from the component mounting device M7 and holds it in the central portion thereof. That is, the substrate transport unit 22 functions as a work stage in the mounted component inspection device M8.

The board recognition unit 20a recognizes and processes the image acquired by the camera 26. That is, the substrate recognition unit 20a detects the identification information of the substrate 4 conveyed by the substrate transfer unit 22 and recognizes the reference mark of the substrate 4.

The inspection unit 20b inspects the position and state of the parts mounted on the substrate 4 by analyzing the image acquired by the camera 26. Specifically, the position deviation from the mounting target position of the component (component mounting deviation), the presence or absence of the component, etc. are inspected. The inspection unit 20b inspects the parts mounted on the substrate 4 by using the inspection-related data stored in the eighth storage unit 20c. The ninth storage unit 20d stores the inspection result by the inspection unit 20b. The inspection result is recorded in a record created for each board identification information, and the inspection result can be referred to for each board.

The data acquisition unit 20e acquires the data required for inspection through the communication network 2. The data required for the inspection includes the mounting target position data stored in the third storage unit 44 of the information management device 3. The data acquired by the data acquisition unit 20e is stored in the eighth storage unit 20c. That is, the data acquisition unit 20e functions as a data acquisition unit that is created by the creation unit 43 and acquires mounting target position data held on the work stage (board transfer unit 22). The mounting target position data is associated with the identification mark on the substrate 4.

The inspection unit 20b obtains the mounting deviation of the component with respect to the mounting target position set based on the mounting target position data acquired by the data acquisition unit 20e. Specifically, the positional deviation between the position of the component mounted at the mounting point and the mounting target position is obtained as the component mounting deviation.

As described above, the board measuring device M3, the solder portion inspection device M5, and the mounting board inspection device M10 have the same configuration as the mounted component inspection device M8. However, with respect to the control system, particularly the inspection unit 20b, the eighth storage unit 20c, and the ninth storage unit 20d, the target parts and data are different depending on the purpose of each device.

Next, with reference to FIGS. 8A to 14B, the process flow in each device from the board measuring device M3 to the mounting board inspection device M10 and the work contents executed in these processes will be described. Here, the following processing is sequentially performed on the substrate 4 after being supplied from the substrate supply device M1 and assigned an identification code which is identification information by the substrate identification information imparting device M2. These processes include a component mounting method in a component mounting device in which a component holding nozzle 37b holds a component and mounts the component at a mounting point of a substrate 4 on which a solder portion is formed, and a mounting board manufacturing method using this component mounting device. Shown.

First, the processing in the substrate measuring device M3 will be described with reference to FIGS. 8A and 8B. As shown in FIG. 8A, the substrate 4 is carried in by the substrate transport unit 22 shown in FIG. 4 and is positioned directly below the inspection head 24 (ST1). Next, the reference mark measurement (ST2) is performed. In the reference mark measurement, the camera 26 captures the reference mark on the substrate 4, and the processing unit 20 (board recognition unit 20a) recognizes the acquired image to detect the position of the reference mark. The reference mark is not shown here.

Next, the land L shown in FIG. 8B is measured (ST3). A land L is formed on the substrate 4 for solder joining of parts. The position of the land L does not match the position of the land (L) on the design data described below due to factors such as an error in the manufacturing process, and is often misaligned. Therefore, in the present embodiment, the processing unit 20 determines the position of the mounting point J based on the positional deviation obtained by ST3.

Therefore, the position and dimensions of the land formed on the substrate 4 are measured. That is, the processing unit 20 calculates the position and dimensions of the land from the image taken by the camera 26. In the substrate 4, (L) and (J) indicated by broken lines indicate lands (L) and mounting points (J) on the design data, respectively. Further, L and J shown by solid lines indicate land L and mounting point J on the actual substrate 4, respectively. The position of the mounting point J is determined by the positions of a plurality of lands L for soldering the components mounted on the mounting point J. Here, an example is shown in which the mounted component is a rectangular chip component having connection terminals at both ends, and a pair of lands L is provided as a pattern of a plurality of lands for soldering the chip components. In this example, the processing unit 20 defines the midpoint of the straight line connecting the pair of lands L as the mounting point J.

In the present embodiment, the actual land to which the terminals of the parts are solder-bonded and the opening formed in the resist film 4a that covers and protects the surface of the substrate 4 corresponding to the land body La. The combination is defined as a land for solder bonding. The actual land corresponds to the land body portion La shown in FIGS. 15A to 16B, and the opening corresponds to the opening 4b. Further, in the present embodiment, as a land formed for solder joining of parts, any of two types of patterns having different forms of the resist film 4a that covers and protects the surface of the substrate 4 at the time of solder joining can be adopted. It has become. These two types of patterns are the land LA of the first pattern shown in FIGS. 15A and 15B and the land LB of the second pattern shown in FIGS. 16A and 16B.

First, the first pattern of land LA formed on the upper surface of the substrate 4 will be described with reference to FIGS. 15A and 15B. 15A and 15B are a cross-sectional view and a plan view of the substrate 4, respectively, and FIG. 15A shows a cross section taken along the line 15A-15A shown in FIG. 15B. As shown in FIG. 15B, a pair of land main body La formed of a metal film such as copper is formed in a rectangular shape on the upper surface of the substrate 4 at a position corresponding to the connection terminal of the chip component mounted on the substrate 4. Has been done. A resist film 4a covering the upper surface of the substrate 4 is formed around the land main body La. In the resist film 4a, a rectangular opening 4b is formed at a position corresponding to the land main body La. In FIG. 15B, the resist film 4a is omitted except for the vicinity of the peripheral edge of the opening 4b.

The opening edge 4c of the resist film 4a located on the inner peripheral edge of the opening 4b covers the land edge Lb, which is the outer peripheral edge of the land main body La, from the upper surface and the side surface of the land main body La. In this configuration, the land body La and the opening 4b form a first pattern of land LA in which the resist film 4a covers the land edge Lb of the land body La. Then, in ST3, the land LA of each first pattern is detected by detecting the opening edge portion 4c, and the midpoint of the pair of land LA is specified as the mounting point J.

Next, the second pattern of land LB will be described with reference to FIGS. 16A and 16B. 16A and 16B are a cross-sectional view and a plan view of the substrate 4, respectively, and FIG. 16A shows a cross section taken along the line 16A-16A shown in FIG. 16B. As shown in FIG. 16B, a pair of land main body La is formed in a rectangular shape on the upper surface of the substrate 4 as in FIG. 15B, and a resist film 4a covering the upper surface of the substrate 4 is formed around the land main body La. Is formed. In the resist film 4a, a rectangular opening 4b is formed at a position corresponding to the land main body La. Note that FIG. 16B omits the illustration of the resist film 4a except for the vicinity of the peripheral edge of the opening 4b.

The shape and size of the opening 4b are set so that the inner peripheral edge is separated from the outer peripheral edge of the land main body La by a predetermined edge gap 4c'. As a result, the entire land body La is exposed in the opening 4b. In this configuration, the land body La and the opening 4b form a second pattern of land LB in which the entire land body La is exposed in the opening 4b. Then, in ST3, each land LB is detected by detecting the land main body La, and the midpoint of the pair of land LBs is specified as the mounting point J. In the examples shown in FIGS. 15A to 16B, the shape of the land body La and the opening 4b is rectangular, but the land body La and the opening 4b may have shapes other than the rectangle. Further, the land LA and the land LB may be formed by a plurality of land main bodies La and openings 4b.

Next, the processing unit 20 calculates the position of the mounting point based on the measured land position (ST4). As described above, in the present embodiment, the position of the mounting point is specified based on the position of the land where the component is actually soldered or the position of the resist opening corresponding to the land. In the case of a mounting point on which a chip component having a pair of terminals is mounted, the midpoint of a straight line connecting the land positions L1 and L2 of the pair of lands L obtained by measurement is calculated. In this example, the land positions L1 and L2 correspond to the center of gravity of the land L in a plan view, respectively. Then, the calculated midpoint is specified as the mounting point J. Then, the processing unit 20 associates the position of the specified mounting point J with the identification information of the board 4 and uploads it as mounting point position data via the communication network 2 (ST5).

The uploaded mounting point position data is stored in the first storage unit 41 of the information management device 3. That is, the first storage unit 41 stores the mounting point position data relating to the positional relationship between the reference mark and the mounting point obtained by actually measuring the board 4 in association with the identification information for individually identifying the board 4 (mounting point). Position data storage process). After that, the substrate 4 is carried out downstream (ST6), and the processing by the substrate measuring device M3 is completed. In the present embodiment, the position of the mounting point J is calculated by the board measuring device M3 (ST4), but the position of the mounting point J is calculated by another device other than the board measuring device M3 (for example, the information management device 3). You may calculate.

Next, the processing in the screen printing apparatus M4 will be described with reference to FIGS. 9A and 9B. As shown in FIG. 9A, the substrate 4 is carried into the screen printing apparatus M4 by the carry-in conveyor 15a shown in FIG. 2 and delivered to the printing stage conveyor 15b. Then, the control unit 10 positions the substrate 4 at the printing work position by the screen printing unit 16 (ST11). Next, the control unit 10 acquires mounting point position data from the information management device 3 (ST12). Next, the control unit 10 executes board recognition to recognize the position of the mounting point J or the board 4 at the printing work position (ST13). In the substrate recognition, the reference mark on the substrate is imaged by the substrate camera 19b to detect the position of the reference mark in the printing work position. Then, the control unit 10 calculates the position of the mounting point J at the printing work position shown in FIG. 9B based on the detected position of the reference mark and the acquired mounting point position data. Alternatively, the position of the substrate 4 in the printing work position is calculated based on the detected position of the reference mark.

Next, the control unit 10 images the screen mask 18 and the substrate 4 by the mask camera 19a and the substrate camera 19b to recognize the position, and aligns the substrate 4 with respect to the screen mask 18 based on the position recognition result (ST14). .. As a result, the substrate 4 is aligned in contact with the lower surface of the screen mask 18. Further, in the alignment between the screen mask 18 and the substrate 4, the control unit 10 controls the table 11a based on the position of the mounting point J specified by the substrate recognition or the position of the substrate 4. As a result, the land L of the substrate 4 and the pattern hole of the screen mask 18 can be accurately matched.

Next, printing is executed (ST15). That is, as shown in FIG. 3, the control unit 10 squeezes the squeegee 17 on the upper surface of the screen mask 18 to which the solder paste is supplied, with the substrate 4 in contact with the lower surface of the screen mask 18. As a result, solder is printed on the substrate 4 through the pattern holes formed in the screen mask 18, and the solder portion S is formed (solder portion forming step). At this time, the position of the solder portion S formed by printing does not always exactly match the land L on the upper surface of the substrate 4, and as shown in FIG. 9B, the position is displaced (solder position deviation) from the land L. May be. This solder misalignment is measured by a solder inspection by the solder portion inspection device M5 in the next process.

After the screen printing is completed in this way, plate separation is executed, and the screen mask 18 and the substrate 4 are separated (ST16). That is, by lowering the substrate 4 held by the printing stage 13 together with the printing stage 13, the solder portion printed on the substrate 4 is extracted from the pattern hole of the screen mask 18. With the above, the processing in the substrate measuring apparatus M3 is completed, and the substrate 4 is carried out downstream (ST17).

Next, the processing in the solder portion inspection device M5 will be described with reference to FIGS. 10A and 10B. As shown in FIG. 10A, the substrate 4 is carried into the solder portion inspection device M5 by the substrate transport portion 22 shown in FIG. 4 and is positioned at the inspection / measurement work position (ST21). Next, the processing unit 20 acquires land measurement data and mounting point position data from the information management device 3 (ST22).

Next, the processing unit 20 executes board recognition to recognize the land position and the mounting point at the inspection / measurement work position (ST23). In the substrate recognition, the camera 26 takes an image of the reference mark on the substrate 4, and the processing unit 20 processes the acquired image to detect the position of the reference mark in the inspection / measurement work position. Then, the processing unit 20 calculates the actual land L and the mounting point J at the inspection / measurement work position shown in FIG. 10B based on the detected position of the reference mark, the acquired land measurement data, and the mounting point position data. It should be noted that the acquisition of the mounting point position data in the solder portion inspection device M5 is not essential and may be omitted.

Next, when the camera 26 takes an image of the substrate 4 on which the solder portion has been formed, the processing unit 20 processes the acquired image, and the position and area of the solder portion S formed on the substrate 4 can be measured three-dimensionally. The volume is measured (ST24). That is, the positions S1 and S2 of the solder portions S formed on the substrate 4 by the solder portion forming step are measured, and the solder portion position data including the positional relationship between the reference mark and the solder portion S is created (solder portion position data). Creation process). In this example, the positions S1 and S2 of the solder portion S correspond to the center of gravity of the solder portion S in a plan view, respectively.

The solder portion position data created in this way is associated with the identification information of the substrate 4 and uploaded to the information management device 3 via the communication network 2 (ST25), and the identification of the substrate 4 is performed in the second storage unit 42. It is stored in association with the information (solder part position data storage process). With the above, the processing in the solder portion inspection device M5 is completed, and the substrate 4 is carried out downstream (ST26).

Next, the processing in the information management device 3 will be described with reference to FIGS. 11A and 11B. As shown in FIG. 11A, first, the creating section 43 shown in FIG. 6 reads the mounting point position data and the solder section position data (ST31). That is, the mounting point position data and the solder portion position data acquired by the board measuring device M3 and the solder portion inspection device M5 and stored in the first storage unit 41 and the second storage unit 42, respectively, are read. Next, the creating unit 43 calculates the position of the solder pattern position SP (ST32). The solder pattern position SP is defined by a plurality of solder portions S formed for solder joining the components mounted at the mounting point J. When the component to be mounted is a rectangular chip component having connection terminals at both ends, the midpoint of a straight line connecting a pair of solder portions S formed on a pair of lands L is specified as a solder pattern position SP.

Next, the creating unit 43 calculates the positional deviation between the calculated solder pattern position SP and the mounting point J specified by the mounting point position data (ST33). Here, the deviation of the solder pattern position SP with respect to the mounting point J is obtained. That is, as shown in FIG. 10B, the solder pattern deviation (ΔX, ΔY) indicating the amount of deviation between the position where the solder portion S should be originally formed and the position of the solder portion S actually formed is obtained. If the solder portion S is formed on the land L without any misalignment, the mounting point J and the solder pattern position SP are at the same position, and the solder pattern misalignment (ΔX, ΔY) is also zero. On the other hand, when the positional deviation between the solder portion S and the land L becomes large, the solder pattern deviation (ΔX, ΔY) also becomes large.

Next, the creation unit 43 calculates the mounting target position (ST34: mounting target position data creation process). As shown in FIG. 11B, the creating unit 43 has a target when the component P is mounted on the substrate 4 between the mounting point J given by the mounting point position data and the solder pattern position SP given by the soldering part position data. Set the mounting target position MP. That is, the creating unit 43 creates the mounting target position data on the substrate 4 specified by the identification information based on the mounting point position data and the soldering unit position data specified by the same identification information. The mounting target position data includes the mounting target position MP of the component P. The component P shown by the broken line in FIG. 11B shows the outer shape of the component P when the component P is mounted at the mounting target position MP. The created mounting target position data is stored in the third storage unit 44 (ST35).

The mounting target position MP is appropriately set between the mounting point J and the solder pattern position SP in consideration of the behavior of parts due to molten solder in the reflow process by the reflow device M9. In the case of minute parts that are easily affected by the surface tension of the molten solder, the creating unit 43 adjusts the mounting target position MP according to the degree of the influence and the magnitude of the deviation between the mounting point J and the solder pattern position SP. In the example shown in FIG. 11B, the mounting target position MP is set at a substantially intermediate position between the mounting point J and the solder pattern position SP. In addition, for large parts that are not easily affected by the surface tension of molten solder, and for insert parts that are mounted by inserting leads into the substrate 4, the effect of which does not need to be considered, the creating unit 43 mounts. The point J is set as the mounting target position.

Next, the processing in the component mounting device M6 will be described with reference to FIGS. 12A and 12B. Since the processing of the component mounting device M7 is the same as that of the component mounting device M6 except that the mounting position and the like are different from the mounted component, only the processing of the component mounting device M6 will be described here. As shown in FIG. 12A, the substrate 4 is first carried in and is positioned at the working position for mounting the components. That is, the control unit 30 shown in FIG. 5 controls the substrate transport unit 35 to receive the substrate 4 from the solder portion inspection device M5 which is an upstream facility, and mounts the substrate 4 by the component holding nozzle 37b of the mounting head 37. (ST41: Substrate acceptance process).

Next, the mounting point position data is acquired (ST42: mounting point position data acquisition process). That is, the control unit 30 acquires the mounting point position data by the function of the first acquisition unit 55 shown in FIG. As described above, the mounting point position data relates to the positional relationship between the reference mark of the substrate 4 and the mounting point, and is obtained in advance by actual measurement with the substrate measuring device M3. The timing of acquiring the mounting point position data is not particularly limited, and any timing may be used as long as it is before the substrate 4 reaches the working position. Further, in the component mounting device M6, acquisition of mounting point position data is not essential and may be omitted.

Next, the mounting target position data is acquired (ST43: mounting target position acquisition process). That is, the control unit 30 acquires the mounting target position data created by the information management device 3 by the function of the second acquisition unit 56 shown in FIG. Specifically, the second acquisition unit 56 transmits the identification information of the substrate 4 carried in in the substrate receiving process to the first information processing unit 45 of the information management device 3, and mount target position data of the same substrate 4. Is requested from the first information processing unit 45. Then, when the desired mounting target position data is received from the first information processing unit 45, the second acquisition unit 56 stores the data in the sixth storage unit 56a.

Next, the component mounting misalignment data is updated and the calibration data is calculated (ST44: calibration data calculation process). That is, the control unit 30 acquires the latest component mounting misalignment data measured by the mounted component inspection device M8 by the function of the third acquisition unit 58 shown in FIG. 6, and stores it in the seventh storage unit 58a. Update the data. Further, the control unit 30 calculates the calibration data from the updated component mounting misalignment data by the function of the calculation unit 57. Calibration data is calculated for each mounting point. The calibration data is calculated by statistically processing the component mounting deviations collected from a plurality of boards at the same mounting point.

Next, the control unit 30 executes board recognition and recognizes the mounting target position MP of the component P at the mounting work position shown in FIG. 12B (ST45: board recognition step). In the board recognition step, the mounting target position MP at the mounting work position is recognized based on the position of the reference mark detected by the recognition and the positional relationship between the reference mark and the mounting target position MP. The positional relationship between the reference mark and the mounting target position MP is given by the mounting target position data.

After this, the component P is mounted (ST46: component mounting process). In the component mounting process, the control unit 30 uses the calibration data to correct the stop position of the component holding nozzle 37b when the component P is mounted at the mounting target position MP. When the mounting of the component P by the component mounting device M6 is completed, the data output unit 59 uploads the operation information (ST47: data output process). After that, the substrate transport unit 35 carries out the substrate 4 (ST48), and the processing by the component mounting device M6 ends.

Next, the processing in the mounted parts inspection device M8 will be described with reference to FIGS. 13A and 13B. As shown in FIG. 13A, the component-mounted substrate 4 is carried in by the substrate transport unit 22 shown in FIG. 4 and positioned at the inspection / measurement work position (ST51: component-mounted substrate receiving process). Next, the data acquisition unit 20e shown in FIG. 7 acquires the mounting point position data from the information management device 3 (ST52), and acquires the mounting target position data from the third storage unit 44 (ST53: measurement reference acquisition step). The data acquisition unit 20e transmits the identification information of the component-mounted board 4 carried into the board transfer unit 22 to the first information processing unit 45 of the information management device 3, and transmits the mounting target position data of the same board 4 to the first information processing unit 45. Request to the information processing unit 45 of 1. Then, when the desired mounting target position data is received from the first information processing unit 45, the data acquisition unit 20e stores the data in the eighth storage unit 20c. That is, the mounting target position data specified by the identification information given to the substrate 4 positioned at the inspection / measurement work position is acquired.

Next, the board recognition unit 20a shown in FIG. 7 executes board recognition and recognizes the mounting point J and the mounting target position MP at the inspection / measurement work position (ST54: board recognition process). In the substrate recognition step, the substrate recognition unit 20a detects the position of the reference mark in the inspection / measurement work position from the reference mark of the substrate 4 imaged by the camera 26. Then, the board recognition unit 20a calculates the position of the mounting point J at the inspection / measurement working position from the detected position of the reference mark and the acquired mounting point position data. Further, the substrate recognition unit 20a calculates the mounting target position MP at the inspection / measurement work position from the detected position of the reference mark and the acquired mounting target position data. In the calculation of the mounting target position MP, the mounting target position data specified by the identification information of the substrate 4 positioned at the inspection / measurement work position is used.

Next, the mounted component position is measured (ST55: component mounting position measurement process). Here, as shown in FIG. 13B, the camera 26 first captures the mounted component P'mounted by the component mounting device M6 (or M7). Then, the inspection unit 20b shown in FIG. 7 detects the component P'from the captured image and also detects the mounting position of the component P'by image recognition or the like. When the component P'is a square chip, the component center PC is detected as the component mounting position. Next, the inspection unit 20b calculates the deviation of the component mounting position based on the measurement result (ST56: component mounting deviation data creation step). That is, the inspection unit 20b acquires the mounting target position data specified by the identification information of the substrate 4 positioned at the inspection / measurement work position from the third storage unit 44. Then, the inspection unit 20b obtains the deviation between the mounting target position MP and the component mounting position (part center PC) based on the acquired data as component mounting deviation data (ΔX', ΔY'). That is, the inspection unit 20b measures the deviation of the component mounting position on the component mounted board on which the component is mounted by the component mounting process by the component mounting device M6 (or M7). Furthermore, component mounting deviation data related to the deviation of the mounting position is created. When the component mounting deviation data creation process is completed for all the mounting points of one component-mounted board, the data output unit 20f shown in FIG. 7 uploads the component mounting deviation data (ST57). After that, the processing unit 20 controls the substrate transport unit 22 shown in FIG. 4 to carry the substrate 4 downstream (ST58), and completes the processing in the mounted component inspection device M8.

The component mounting misalignment data uploaded in ST57 is fed back to the component mounting devices M6 and M7 by the third information processing unit 47 of the information management device 3 shown in FIG. 6, and is used for calculating the calibration data by the calculation unit 57. Be done. That is, the component mounting devices M6 and M7 acquire the component mounting deviation data related to the deviation of the component mounting position measured by the mounted component inspection device M8 for the plurality of component mounted boards (component mounting deviation data acquisition process). 7 Update the data in the storage unit 58a.

Then, as described above, the calculation unit 57 calculates the calibration data based on the acquired component mounting misalignment data (ST44: calibration data calculation process). That is, in the present embodiment, the calibration data for correcting the deviation of the component mounting position due to the time-dependent fluctuation is the deviation of the component mounting position measured by the mounted component inspection device M8 for the plurality of component mounted boards. It is calculated based on the data about.

In the present embodiment, the component mounting line 1a has the component mounting devices M6 and M7. When the component mounting line has a plurality of component mounting devices in this way, the calibration data calculation process is executed by each of the plurality of component mounting devices. Then, in the above-mentioned component mounting deviation data creation process, the mounting target position data referred to by each component mounting device is used as a reference for measuring the displacement of the mounting position. When the above-mentioned component mounting process is executed by a plurality of component mounting devices, the mounting deviation data created in the above-mentioned component mounting deviation data creation process is distributed to the component mounting devices on which the components related to the mounting deviation are mounted. And provide it to each component mounting device (component mounting misalignment data processing process).

Next, the processing in the mounting board inspection device M10 will be described with reference to FIGS. 14A and 14B. In the mounting board inspection performed by the mounting board inspection device M10, the quality of the mounting state including the position of the component P in the state of being soldered by the reflow in the reflow device M9 is inspected. As shown in FIG. 14A, the mounting board is carried in by the board transport unit 22 shown in FIG. 4 and positioned at the inspection / measurement work position (ST61). Next, the processing unit 20 acquires mounting point position data from the information management device 3 (ST62).

Next, the processing unit 20 executes board recognition and recognizes the mounting point J at the inspection / measurement work position (ST63). In the substrate recognition, the position of the reference mark in the inspection / measurement work position is detected from the reference mark of the substrate 4 imaged by the camera 26. Then, the processing unit 20 calculates the position of the mounting point J at the inspection / measurement working position from the detected position of the reference mark and the acquired mounting point position data.

Next, the inspection is executed (ST64). That is, the processing unit 20 obtains the deviation between the obtained coordinates of the component center Pm and the correct mounting point J as mounting position deviations ΔXm and ΔYm. In the image obtained by imaging the substrate 4 after the reflow, as shown in FIG. 14B, the solder portion S is melted and solidified to form the solder portion S'. The entire surface of the land L is covered by the solder portion S'.

Due to the behavior of the molten solder in the reflow process, the position of the component center Pm corresponding to the component center of the component P'does not always coincide with the mounting point J, and the mounting position deviations ΔXm and ΔYm exist. If at least one of these mounting misalignments exceeds each allowable value, it is determined to be defective. When the inspection process for all the parts to be inspected is completed, the inspection results are uploaded (ST65), and the substrate 4 is carried out downstream (ST66).

As described above, the mounting board manufacturing system 1 shown in the present embodiment includes a mounting point position data storage unit (first storage unit) 41, a screen printing device M4 as a solder part forming device, and a solder part inspection device. It has an M5, a solder unit position data storage unit (second storage unit) 42, a mounting target position data creation unit (creation unit) 43, and a component mounting device M6 (M7). The first storage unit 41 stores the mounting point position data including the position of the mounting point J obtained by actually measuring the board 4 in association with the identification information for identifying the board 4. For example, the mounting point position data relates to the positional relationship between the reference mark on the substrate 4 and the mounting point J. The screen printing apparatus M4 forms a solder portion S on the substrate 4. The solder portion inspection device M5 measures the solder portion S formed on the substrate 4 by the screen printing device M4, and creates solder portion position data including the position of the solder portion S. For example, the solder portion position data includes the positional relationship between the reference mark and the solder portion S. The second storage unit 42 stores the solder unit position data in association with the identification information. The creation unit 43 creates mounting target position data including the mounting target position of the component P on the substrate 4 specified by the identification information based on the mounting point position data specified by the identification information and the solder portion position data. The component mounting device M6 (M7) positions the substrate 4 whose position of the solder portion S is measured by the solder portion inspection device M5 at the working position. Further, the component mounting device M6 (M7) has a mounting head 37. The mounting head 37 mounts the component P at the mounting target position on the substrate 4 located at the working position. The mounting target position is specified by the mounting target position data associated with the identification information of the substrate 4. With this configuration, the accuracy of position correction to which the solder position information is applied can be improved, and a high level of component mounting quality can be realized.

Further, the component mounting device M6 (M7) shown in the present embodiment has a board transport unit 35, a mounting target position data acquisition unit (second acquisition unit) 56, and a mounting work unit 40. The substrate transport unit 35 receives the substrate 4 to which unique identification information is given, the solder portion S is formed, and the position of the solder portion S is measured, and positions the substrate 4 at the working position. The board transfer unit 35 further carries out the component-mounted board 4 on which the component P has been mounted from the working position to the equipment downstream. The second acquisition unit 56 acquires the mounting target position data calculated based on the mounting point position data and the solder portion position data specified by the same identification information as the mounting point position data. The mounting point position data is obtained by actually measuring the board 4, and includes the position of the mounting point J on the board 4. The solder portion position data includes the position of the solder portion S obtained by actually measuring the solder portion S. The mounting work unit 40 has a mounting head 37. The mounting head 37 mounts the component P at the mounting target position on the substrate 4 located at the working position. The mounting target position is specified by the mounting target position data associated with the identification information of the substrate 4. With this configuration, the accuracy of position correction to which the solder position information is applied can be improved, and a high level of component mounting quality can be realized.

Further, the mounted component inspection device M8 shown in the present embodiment is included in the mounting board manufacturing system 1 shown in the present embodiment, and is a component mounted at the mounting point J of the board 4 identified by the unique identification information. Measure the deviation of the mounting position of P. The mounted component inspection device M8 has a substrate transport unit 22 as a work stage, a data acquisition unit 20e, and an inspection unit 20b. The board transfer unit 22 holds the component-mounted board 4 on which the component P is mounted by the component mounting device M6 (M7). The data acquisition unit 20e acquires the mounting target position data associated with the identification mark of the substrate 4 held by the substrate transport unit 22. The mounting target position data is created in advance by the mounting target position data creating unit 43 in the information management device 3 of the mounting board manufacturing system. The inspection unit 20b obtains a deviation of the mounting position of the component P mounted on the mounting point J of the board 4 held by the board transporting unit 22. That is, the inspection unit 20b obtains the deviation of the mounting position of the component P with respect to the mounting target position set based on the mounting target position data.

FIG. 17 is a diagram showing an example of the hardware configuration of the computer. The functions of the information management device 3 in the above-described embodiment, the control unit 30 in the component mounting devices M6 and M7, and the processing unit 20 in the mounted component inspection device M8 are realized by, for example, a program executed by the computer 2100.

The computer 2100 has an input device 2101 such as an input button and a touch pad, an output device 2102 such as a display and a speaker, a CPU 2103, a ROM (Read Only Memory) 2104, and a RAM (Random Access Memory) 2105. In addition, the computer 2100 reads information from a hard disk device, a storage device 2106 such as an SSD (Solid State Drive), a DVD-ROM (Digital Versailles Disk Read Only Memory), and a recording medium such as a USB (Universal Serial Bus) memory. 2107, a transmission / reception device 2108 that communicates via a network. The above-mentioned parts are connected by a bus 2109.

Then, the reading device 2107 reads the program from the non-temporary recording medium on which the program for realizing the functions of the above parts is recorded, and stores the program in the storage device 2106. Alternatively, the transmission / reception device 2108 communicates with the server device connected to the network, and stores the program downloaded from the server device for realizing the functions of the above parts in the storage device 2106.

Then, the CPU 2103 copies the program stored in the storage device 2106 to the RAM 2105, and sequentially reads and executes the instructions included in the program from the RAM 2105. As a result, the functions of the creation unit 43 of the information management device 3, the first information processing unit 45 to the third information processing unit 47, and the functional blocks other than the fourth storage unit 53 to the seventh storage unit 58a of the control unit 30 Functions, functions of functional blocks other than the eighth storage unit 20c and the ninth storage unit 20d of the processing unit 20 are realized. Further, when the program is executed, the information obtained by the above-mentioned various processes is stored in the RAM 2105 or the storage device 2106, and is appropriately used.

As another example, the functional block of the information management device 3, the control unit 30, and the processing unit 20 may be realized as a physical circuit such as a dedicated IC (integrated circuit) or LSI (range-scale integration). it can. Alternatively, such a combination of a general-purpose computer and software and a dedicated circuit may be combined to form a functional block, a control unit 30, and a processing unit 20 of the information management device 3. Alternatively, two or more of the functional blocks of the information management device 3, the control unit 30, and the processing unit 20 may be configured as a physically integrated circuit.

Each storage unit included in the information management device 3, the control unit 30, and the processing unit 20 is composed of a storage device 2106 such as a ROM 2104, a RAM 2105, a hard disk device, and an SSD (Solid State Drive), or a server device including any of them. Ru. Two or more of these storage units may be composed of a physically integrated storage device or server device. Further, one or more of these storage units may be configured in the cloud server.

The component mounting device and component mounting method of the present disclosure have the effect of improving the accuracy of position correction to which solder position information is applied and achieving a high level of component mounting quality. It is useful in the technical field of holding and mounting on a mounting point of a substrate on which a solder portion is formed.

1 Mounting board manufacturing system 1a Parts mounting line 2 Communication network 3 Information management device 4 Board 4a Resist film 4b Opening 4c Opening edge 4c'Edge gap 10 Screen printing control unit (control unit)
11 Board positioning unit 11a Printing stage XYΘ table (table)
11b Printing stage elevating mechanism (elevating mechanism)
13 Printed stage 13a Lifting table 14 Board support part 14a Board support pin 14b Board support part Lifting mechanism (lifting mechanism)
15 Substrate transport section 15a Carry-in conveyor 15b Printing stage conveyor 15c Carry-out conveyor 16 Screen printing section 17 Squeegee 17a Squeegee drive mechanism (elevation mechanism)
18 Screen mask 19 Camera unit

19a Mask camera

19b Board camera 20 Processing unit 20a Board recognition unit 20b Inspection unit 20c Inspection-related data storage unit (8th storage unit)
20d Test result storage unit (9th storage unit)
20e Data acquisition unit 20f

Data output unit

21, 31 Base 22 Board transfer unit 24 Inspection head 24a Lens barrel unit 24b Lighting unit 25 Inspection head movement mechanism (movement mechanism)
26 Camera 27 Half mirror 28 Lighting light source unit 28a Upper stage lighting 28b Lower stage lighting 28c Coaxial lighting 30 Parts mounting control unit (control unit)
32 Bogie 33 Tape feeder 34 Board underlaying part 34a Support pin 34b Support pin lifting mechanism (lifting mechanism)
35 Board carrier 36 Parts recognition camera (first camera)
37 Mounting head 37a Moving member 37b Parts holding nozzle 38 Mounting head moving mechanism (moving mechanism)
39 Board recognition camera (second camera)
40 Mounting work unit 41 Mounting point position data storage unit (first storage unit)
42 Solder section position data storage section (second storage section)
43 Mounting target position data creation unit (creation unit)
44 Mounting target position data storage unit (third storage unit)
45 1st information processing unit 46 2nd information processing unit 47 3rd information processing unit 51 Board recognition unit 52 Parts recognition unit 53 Production-related data storage unit (4th storage unit)
54 Parts mounting processing unit 55 Mounting point position data acquisition unit (first acquisition unit)
55a Mounting point position data storage unit (fifth storage unit)
56 Mounting target position data acquisition unit (second acquisition unit)
56a Mounting target position data storage unit (6th storage unit)
57 Calibration data calculation unit (calculation unit)
58 Parts mounting misalignment data acquisition unit (3rd acquisition unit)
58a Parts mounting misalignment data storage unit (7th storage unit)
59 Data output unit 2100 Computer 2101 Input device 2102 Output device 2103 CPU
2104 ROM
2105 RAM
2106 Storage device 2107 Reading device 2108 Transmission / reception device 2109 Bus M1 Board supply device M2 Board identification information addition device M3 Board measurement device M4 Screen printing device M5 Solder part inspection device M6, M7 Parts mounting device M8 Mounted parts inspection device M9 Reflow device M10 Mounting board inspection device M11 Board recovery device L, LA, LB Land L1, L2 Land position La Land body Lb Land edge J Mounting point S, S'Solder part S1, S2 Position SP Solder pattern position MP Mounting target position P Parts P'Installed parts PC, Pm parts center

Claims

A mounting point position data storage unit that stores mounting point position data including the mounting point positions obtained by actually measuring the board in association with identification information that identifies the board.
A solder portion forming device for forming a solder portion on the substrate,
A solder portion inspection device that measures the solder portion formed on the substrate by the solder portion forming device and creates solder portion position data including the position of the solder portion.
A solder portion position data storage unit that stores the solder portion position data in association with the identification information,
A mounting target for creating mounting target position data including a mounting target position of the component on the substrate specified by the identification information based on the mounting point position data specified by the identification information and the solder portion position data. Position data creation unit and
The substrate whose position of the solder portion is measured by the solder portion inspection device is positioned at a working position, and the component is located at the mounting target position specified by the mounting target position data associated with the identification information of the substrate. With a component mounting device, which has a mounting head,
Mounting board manufacturing system.
Further, a first information processing unit configured to communicate with the solder unit inspection device and the component mounting device is provided.
The first information processing unit includes the solder unit position data storage unit and the mounting target position data creation unit.
The mounting board manufacturing system according to claim 1.
The component mounting device uses calibration data for correcting a deviation in the mounting position of the component due to a change over time of the component mounting device, and mounts the component at the mounting target position. Correct the stop position of the head,
The mounting board manufacturing system according to claim 1.
With the mounted component inspection device, which measures the deviation of the mounting position for each of the plurality of component-mounted boards on which the component is mounted by the component mounting device, and outputs the component mounting deviation data related to the deviation of the mounting position. ,
A calibration data calculation unit for calculating the calibration data based on the component mounting deviation data of the plurality of component-mounted boards is further provided.
The mounting board manufacturing system according to claim 3.
When the mounted component inspection device measures the deviation of the mounting position for each of the plurality of component mounted boards, the mounted component inspection device is associated with the identification information of each of the plurality of component mounted boards. The data is used as a reference for measuring the deviation of the mounting position.
The mounting board manufacturing system according to claim 4.
The component mounting device has the calibration data calculation unit.
The mounting board manufacturing system according to claim 4.
Further, a second information processing unit configured to communicate with the mounted component inspection device is provided.
The second information processing unit provides the mounted target position data referred to by the component mounting device to the mounted component inspection device.
The mounting board manufacturing system according to claim 4.
The component mounting device includes a first component mounting device that mounts a first component on the board, and a second component mounting device that mounts a second component on the board.
The mounting board manufacturing system further includes a first component mounting device, a second component mounting device, and a third information processing unit capable of communicating with the mounted component inspection device.
The mounted component inspection device measures the deviation of the first mounting position of the first component and the deviation of the second mounting position of the second component for each of the plurality of component mounted boards, and the above-mentioned As the component mounting misalignment data, the first component mounting misalignment data relating to the first mounting misalignment is output, and the second component mounting misalignment data relating to the second mounting misalignment is output.
The third information processing unit provides the first component mounting deviation data among the component mounting deviation data output from the mounted component inspection device to the first component mounting device, and the second component mounting. The deviation data is provided to the second component mounting device.
The mounting board manufacturing system according to claim 6.
It is a mounting board manufacturing method using a component mounting device having a mounting head for mounting components at a mounting point of the board.
A step of storing the mounting point position data including the mounting point position obtained by actually measuring the board in association with the identification information for identifying the board.
The step of forming a solder portion on the substrate and
A step of measuring the solder portion formed on the substrate and creating solder portion position data including the position of the solder portion, and
A step of storing the solder portion position data in association with the identification information,
A step of creating mounting target position data including a mounting target position of the component on the substrate specified by the identification information based on the mounting point position data specified by the identification information and the solder portion position data. When,
The component mounting device positions the board whose position of the solder portion is measured at a working position, and the component is positioned at the mounting target position specified by the mounting target position data associated with the identification information of the board. With steps to mount,
Mounting board manufacturing method.
Using the calibration data for correcting the deviation of the mounting position of the component due to the time variation of the component mounting device, the stop position of the mounting head when the component is mounted at the mounting target position is corrected. To do
The mounting substrate manufacturing method according to claim 9.
A step of measuring the deviation of the mounting position for each of a plurality of component-mounted boards on which the component is mounted by the component mounting device, and creating component mounting deviation data related to the deviation of the mounting position.
A step of calculating the calibration data based on the component mounting deviation data of the plurality of component mounted boards is further provided.
The mounting substrate manufacturing method according to claim 10.
When measuring the deviation of the mounting position for each of the plurality of component-mounted boards, the mounting target position data associated with the identification information of each of the plurality of component-mounted boards is used to determine the deviation of the mounting position. Used as a measurement standard,
The mounting substrate manufacturing method according to claim 11.
The component mounting device calculates the calibration data and
When creating the component mounting deviation data, the mounting target position data referred to by the component mounting device is used as a reference for measuring the deviation of the mounting position.
The mounting substrate manufacturing method according to claim 11.
The component mounting device includes a first component mounting device that mounts a first component on the board, and a second component mounting device that mounts a second component on the board.
When creating the component mounting deviation data, the deviation of the first mounting position of the first component and the deviation of the second mounting position of the second component are measured for each of the plurality of component-mounted boards. Then, as the component mounting misalignment data, the first component mounting misalignment data relating to the misalignment of the first mounting position is output, and the second component mounting misalignment data relating to the misalignment of the second mounting position is output.
Of the output component mounting deviation data, the first component mounting deviation data is provided to the first component mounting device, and the second component mounting deviation data is provided to the second component mounting device.
The mounting substrate manufacturing method according to claim 12.
Unique identification information is given, a solder portion is formed, the board on which the position of the solder portion is measured is received and positioned at the work position, and the component-mounted board on which the components have been mounted is located downstream from the work position. The board transport section that carries out to the equipment and
The solder portion obtained by actually measuring the solder portion, which is specified by the mounting point position data including the position of the mounting point of the board obtained by actually measuring the board and the identification information same as the mounting point position data. A mounting target position data acquisition unit that acquires mounting target position data calculated based on the solder portion position data including the position of the solder portion, and a mounting target position data acquisition unit.
A mounting work unit having a mounting head for mounting the component is provided at a mounting target position specified by mounting target position data associated with the identification information of the substrate located at the working position.
Parts mounting device.
The mounting work unit uses calibration data for correcting the deviation of the mounting position of the component due to the time variation of the component mounting device, and mounts the component at the mounting target position. Correct the stop position of the head,
The component mounting device according to claim 15.
The component-mounted board is one of a plurality of component-mounted boards.
The component mounting device further includes a calibration data calculation unit that calculates the calibration data based on the data regarding the deviation of the mounting position measured for the plurality of the component mounted boards.
The component mounting device according to claim 16.
Further, a component mounting deviation data acquisition unit for acquiring the data regarding the deviation of the mounting position of the plurality of the component mounted boards is further provided.
The calibration data calculation unit calculates the calibration data based on the data regarding the deviation of the mounting position acquired by the component mounting deviation data acquisition unit.
The component mounting device according to claim 17.
It is a component mounting method in a component mounting device in which a component is held by a mounting head and the component is mounted on a board to which unique identification information is given.
A step of receiving the board from upstream equipment and locating it at a working position by the mounting head.
The solder portion provided on the board is actually measured, which is specified by the mounting point position data including the position of the mounting point of the board obtained by actually measuring the board and the identification information same as the mounting point position data. The step of acquiring the mounting target position data calculated based on the solder part position data including the position of the solder part obtained by
A step of mounting the component with the mounting head at the mounting target position specified by the mounting target position data associated with the identification information of the substrate located at the working position is provided.
Parts mounting method.
Using the calibration data for correcting the deviation of the mounting position of the component due to the time variation of the component mounting device, the stop position of the mounting head when the component is mounted at the mounting target position is corrected. To do
The component mounting method according to claim 19.
Based on the component mounting deviation data related to the deviation of the mounting position, which is created by measuring the deviation of the mounting position for each of the plurality of component-mounted boards on which the components are mounted by the component mounting device. With additional steps to calculate calibration data,
The component mounting method according to claim 20.
In order to use the component mounting target position data related to the mounting target position as a reference for measuring the deviation of the mounting position of the component, a step of outputting the component mounting target position data in association with the identification information is further provided.
The component mounting method according to claim 21.
A mounted component inspection device included in the mounting board manufacturing system according to claim 4, which measures a deviation of the mounting position of the component mounted at the mounting point of the board identified by the identification information.
A work stage for holding the component-mounted board on which the component is mounted by the component-mounting device, and
A data acquisition unit that acquires mounting target position data created by the mounting target position data creation unit and associated with the identification information of the substrate held on the work stage, and
It is provided with an inspection unit for obtaining a deviation of the mounting position of the component mounted on the mounting point of the board held on the work stage.
The inspection unit obtains the deviation of the mounting position of the component with respect to the mounting target position set based on the mounting target position data.
Installed parts inspection device.