WO2020187181A1 - 天线装置和电子设备 - Google Patents

天线装置和电子设备 Download PDF

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Publication number
WO2020187181A1
WO2020187181A1 PCT/CN2020/079502 CN2020079502W WO2020187181A1 WO 2020187181 A1 WO2020187181 A1 WO 2020187181A1 CN 2020079502 W CN2020079502 W CN 2020079502W WO 2020187181 A1 WO2020187181 A1 WO 2020187181A1
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WO
WIPO (PCT)
Prior art keywords
conductive
antenna
laminated circuit
antenna substrate
ground layer
Prior art date
Application number
PCT/CN2020/079502
Other languages
English (en)
French (fr)
Inventor
贾玉虎
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP20772990.6A priority Critical patent/EP3920322B1/en
Publication of WO2020187181A1 publication Critical patent/WO2020187181A1/zh
Priority to US17/405,806 priority patent/US20210384615A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
    • H01Q15/008—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices having Sievenpipers' mushroom elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
    • H01Q5/364—Creating multiple current paths
    • H01Q5/371—Branching current paths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna

Definitions

  • This application relates to the field of antenna technology, in particular to an antenna device and electronic equipment.
  • the 5G network has a theoretical peak transmission speed of up to tens of Gb per second, which is hundreds of times faster than the transmission speed of the 4G network. Therefore, the millimeter wave frequency band with sufficient spectrum resources has become one of the working frequency bands of the 5G communication system.
  • the millimeter wave package antenna module is the mainstream packaging solution in the future 5G millimeter wave electronic equipment. It can adopt a multi-layer PCB high-density interconnection process, and a radiating element is provided on one side of the module.
  • the general radiating element is a microstrip patch antenna array, and the size of the microstrip patch antenna array is mainly limited by the dielectric constant of the multilayer PCB board, and its radiation efficiency is low.
  • an antenna device and electronic equipment are provided.
  • An antenna packaging module includes:
  • An antenna substrate on which two opposite sides of the antenna substrate are respectively provided with a first laminated circuit and a ground layer;
  • the radiating element is arranged on the side of the first laminated circuit away from the antenna substrate;
  • the second laminated circuit is arranged on the side of the ground layer away from the antenna substrate, and the side of the second laminated circuit away from the ground layer is used to arrange a radio frequency chip;
  • a power feeding structure which penetrates the second laminated circuit, the ground layer, the base substrate and the first laminated circuit, and is used to connect the radio frequency chip and the radiating element;
  • the conductive grid includes a plurality of conductive structures arranged at intervals, the conductive structures penetrate the antenna substrate and are connected to the ground layer, and part of the feed structure is located in two adjacent Within the gap formed by the conductive structure.
  • an electronic device including: a housing and the above-mentioned antenna packaging module, wherein the antenna packaging module is housed in the housing.
  • the above-mentioned antenna package module and electronic equipment include: an antenna substrate, and a first laminated circuit and a ground layer are respectively provided on opposite sides of the antenna substrate; a radiating element is provided on the first laminated circuit away from the One side of the antenna substrate; a second laminated circuit arranged on the side of the ground layer away from the antenna substrate, and the side of the second laminated circuit away from the ground layer is used for installing a radio frequency chip; Structure, the feeding structure penetrates the second laminated circuit, the ground layer, the base substrate and the first laminated circuit, and is used to connect the radio frequency chip and the radiating element; a conductive grid
  • the conductive grid includes a plurality of conductive structures arranged at intervals, the conductive structures penetrate the antenna substrate and are connected to the ground layer, and part of the feed structure is formed by two adjacent conductive structures. Within the interval. By introducing a conductive grid, surface waves can be suppressed, and antenna radiation efficiency and antenna gain can be improved.
  • Figure 1 is a perspective view of an electronic device in an embodiment
  • FIG. 2 is a schematic diagram of the structure of an antenna package module in an embodiment
  • Figure 3a is a schematic view of the structure of a conductive sheet in an embodiment
  • Figure 3b is a schematic view of the structure of a conductive sheet in another embodiment
  • FIG. 3c is a schematic diagram of the structure of a conductive sheet in another embodiment
  • FIG. 4 is a schematic diagram of the structure of an antenna package module in another embodiment
  • FIG. 5 is a front view of the housing assembly of the electronic device shown in FIG. 1 in another embodiment
  • Fig. 6 is a block diagram of a part of the structure of a mobile phone related to an electronic device provided by an embodiment of the present invention.
  • first, second, etc. used in this application can be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of” means at least two, such as two, three, etc., unless specifically defined otherwise.
  • the antenna device of an embodiment of the present application is applied to electronic equipment.
  • the electronic equipment may include a mobile phone, a tablet computer, a notebook computer, a handheld computer, a mobile Internet device (MID), and a wearable device. (Such as smart watches, smart bracelets, pedometers, etc.) or other communication modules that can be equipped with array antenna devices.
  • the electronic device 10 may include a display screen assembly 110, a housing assembly 120, and a controller.
  • the display screen assembly 110 is fixed on the housing assembly 120, and forms the external structure of the electronic device together with the housing assembly 120.
  • the housing assembly 120 may include a middle frame and a back cover.
  • the middle frame may be a frame structure with through holes. Wherein, the middle frame can be accommodated in the accommodation space formed by the display screen assembly and the back cover.
  • the back cover is used to form the outer contour of the electronic device.
  • the back cover can be integrally formed. During the molding process of the back cover, a rear camera hole, a fingerprint recognition module, an antenna device mounting hole and other structures can be formed on the back cover.
  • the back cover may be a non-metal back cover, for example, the back cover may be a plastic back cover, a ceramic back cover, a 3D glass back cover, etc.
  • the controller can control the operation of electronic equipment and so on.
  • the display screen component can be used to display pictures or fonts, and can provide users with an operation interface.
  • an antenna packaging module is integrated in the housing assembly 120, and the antenna packaging module can transmit and receive millimeter wave signals through the housing assembly 120, so that the electronic device can achieve wide coverage of millimeter wave signals.
  • Millimeter waves refer to electromagnetic waves with wavelengths on the order of millimeters, and their frequencies are approximately between 20 GHz and 300 GHz.
  • 3GPP has specified a list of frequency bands supported by 5G NR.
  • the 5G NR spectrum range can reach 100 GHz. It has specified two frequency ranges: Frequency range 1 (FR1), which is the frequency band below 6 GHz, and Frequency range 2 (FR2), which is the millimeter wave frequency band.
  • FR1 Frequency range 1
  • FR2 Frequency range 2
  • Frequency range 1 frequency range: 450MHz-6.0GHz, of which the maximum channel bandwidth is 100MHz.
  • the frequency range of Frequency range 2 is 24.25GHz-52.6GHz, and the maximum channel bandwidth is 400MHz.
  • Nearly 11GHz spectrum used for 5G mobile broadband includes: 3.85GHz licensed spectrum, for example: 28GHz (24.25-29.5GHz), 37GHz (37.0-38.6GHz), 39GHz (38.6-40GHz) and 14GHz unlicensed spectrum (57-71GHz) .
  • the 5G communication system has three frequency bands: 28GHz, 39GHz, and 60GHz.
  • an embodiment of the present application provides an antenna package module.
  • the antenna package module includes an antenna substrate 210, a first laminated circuit 220, a ground layer 230, a radiating element 240, a second laminated circuit 250, and a feeder.
  • the antenna substrate 210, the first laminated circuit 220, the ground layer 230, and the second laminated circuit 250 may be formed on a multilayer printed circuit board (Printed Circuit Board) integrated using HDI (High Density Interconnection) technology. board, PCB).
  • the multilayer printed circuit board may include a core layer (core layer), and a PP (Prepreg) layer is superimposed on both sides of the core layer, and a metal layer TM is plated on each PP layer and the core layer.
  • the PP layer is a prepreg, which is arranged between the two copper layers to isolate and bond the two copper layers.
  • the metal layer TM may be a copper layer, a tin layer, a lead-tin alloy layer, a tin-copper alloy layer, or the like.
  • the antenna substrate 210 can be understood as a core layer (core layer), where the antenna substrate 210 includes a first surface and a second surface disposed opposite to each other, and the first laminated circuit 220 is disposed on the antenna substrate 210 The first surface.
  • the first laminated circuit 220 may include a plurality of metal layers TM and PP layers arranged at intervals. Among them, the metal layer TM is located above the PP layer.
  • the ground layer 230 is disposed on the second surface of the antenna substrate 210.
  • the second laminated circuit 250 is disposed on the side of the ground layer 230 away from the antenna substrate 210, and the side of the second laminated circuit 250 away from the ground layer 230 is used for disposing a radio frequency chip 270.
  • the second laminated circuit 250 may also include a plurality of metal layers TM and PP layers arranged at intervals. Among them, the metal layer TM is located above the PP layer.
  • the radiating element 240 is disposed on the side of the first laminated circuit 220 away from the antenna substrate 210. Specifically, the radiating element 240 is disposed on the top metal layer TM-p, and is used to transmit and receive millimeter wave signals. Wherein, the radiating element 240 is also provided with a feeding point for feeding in current signals, and the feeding point is connected to the radio frequency chip 270 through the feeding structure 260.
  • the radiating element 240 may be a phased antenna array for radiating millimeter wave signals.
  • the radiating element 240 for radiating millimeter wave signals may be an antenna array composed of a patch antenna, a dipole antenna, a Yagi antenna, a beam antenna, or other suitable antenna elements.
  • the feeding structure 260 penetrates the second laminated circuit 250, the ground layer 230, the antenna substrate 210 and the first laminated circuit 220, and is used to connect the radio frequency chip 270 and the radiating element 240.
  • through holes may be opened on the second laminate circuit 250, the ground layer 230, the antenna substrate 210, and the first laminate circuit 220, and the through holes are in the first laminate circuit 220.
  • the position of is set corresponding to the position of the feeding point.
  • a conductive material can be filled in the through hole to form a feeding structure 260, and the RF chip 270 and the radiating element 240 are connected through the feeding structure 260.
  • the feeding structure 260 of the radio frequency chip 270 is connected to the radiating element 240 to feed current signals into the radiating element 240, so as to realize the transmission and reception of millimeter wave signals.
  • the conductive grid 280 includes a plurality of conductive structures 281 arranged at intervals.
  • the conductive structures 281 penetrate the antenna substrate 210 and are connected to the ground layer 230. Some of the feed structures 260 are located in two adjacent ones. Within the interval formed by the conductive structure 281.
  • the material of the conductive structure 281 may be a conductive material, such as a metal material, an alloy material, a conductive silica gel material, a graphite material, etc., in this embodiment, metallic copper may be used.
  • the above-mentioned antenna package module by introducing a conductive grid 280 into the antenna substrate 210, can suppress surface waves, that is, have high impedance characteristics for surface waves in a certain frequency band; specifically, the first is that the frequency propagating on its surface is located at The surface wave in the stop band has a suppressive effect, or it does not support the propagation of surface waves in the frequency band within the stop band, which can improve the antenna radiation efficiency and increase the antenna gain.
  • a surface wave is a guided wave that propagates along the interface between two media. In a planar antenna, it is the dielectric substrate that causes some electromagnetic waves to be confined to the interface between the medium and the air to propagate.
  • the introduced conductive grid 280 is analogous to multiple parallel LC antenna circuits, which can improve the impedance bandwidth of the antenna and increase the isolation between antenna ports.
  • the introduction of the conductive grid 280 can also reduce the size of the radiating element 240 in the non-scanning direction, thereby reducing the volume of the entire antenna package module.
  • the first laminated circuit 220 includes a first conductive layer 221 on a side close to the antenna substrate 210.
  • the first conductive layer 221 can be understood as a metal layer TM disposed close to the antenna substrate 210 in the first laminated circuit 220.
  • the metal layer can be a copper layer, a tin layer, a lead-tin alloy layer, a tin-copper alloy layer, or the like.
  • the conductive structure 281 includes a conductive pillar 281a penetrating through the antenna substrate 210 and a conductive sheet 281b disposed on the first conductive layer 221, and the conductive sheet 281b is connected to the ground layer 230 through the conductive pillar 281a .
  • the geometric shape of the conductive sheet 281b can include rectangular (Figure 3a), circular ring ( Figure 3b), circular ( Figure 3c), oval, mushroom, inverted "H” shape, "Ten” and other shapes.
  • the geometric shape of the conductive sheet 281b can also be set according to actual requirements, and is not limited to the above examples.
  • the size of the conductive sheet 281b is related to the thickness and dielectric constant of the antenna substrate 210.
  • the size of the conductive sheet 281b is not further limited, and the size of the conductive sheet 281b can be adjusted.
  • the size, the thickness of the antenna substrate 210 and the dielectric constant adjust the resonance frequency of the radiating element 240.
  • the conductive pillars 281a correspond to the conductive sheets 281b one-to-one, and the conductive structure 281 is electrically connected to the antenna layer 240 through the conductive pillars 281a.
  • a plurality of via holes may be opened in the antenna substrate 210, and conductive material may be filled in the via holes to form the conductive pillars 281a.
  • the conductive pillars 281a correspond to the conductive sheets 281b one-to-one, and the conductive structure 281 is electrically connected to the antenna ground through the conductive pillars 281a, so that the conductive sheets 281b share the ground through the conductive pillars 281a.
  • the conductive sheets 281b arranged at intervals are independent of each other and are not connected to each other, and mutual capacitive coupling between the conductive sheets 281b can be realized.
  • the cross-sectional shape of the conductive pillar 281a along the plane where the antenna substrate 210 is located is the same as the geometric shape of the correspondingly connected conductive sheet 281b. That is, the conductive pillar 281a can be understood as a conductive sheet 281b with a relatively large thickness, wherein the thickness of the conductive pillar 281a is the thickness of the antenna substrate 210. For example, when the conductive sheet 281b is circular, the conductive pillar 281a connected to it is a cylinder.
  • the material of the conductive pillar 281a formed by filling the conductive material in the via hole is the same as the material of the conductive structure 281, for example, both may be metal materials, graphite materials, etc.
  • the number of conductive sheets 281b disposed on the first conductive layer 221 is multiple, and they are arranged periodically, for example, may be a honeycomb arrangement structure, a rhombus arrangement structure, or a rectangular arrangement structure. , Radial arrangement structure, gradual arrangement structure, etc.
  • the shape of each conductive sheet 281b may be the same or different.
  • the plurality of conductive sheets 281b arranged periodically are rotationally symmetrical or axisymmetrical in the same plane.
  • each conductive sheet 281b with a plurality of periodically arranged conductive sheets 281b in the same plane is the same, and the area of each conductive sheet 281b is the same, refer to FIG. 3a.
  • the conductive sheets 281b in the conductive grid 280 are arranged in a two-dimensional array.
  • each conductive sheet 281b in the conductive structure 281 is the same, and the conductive sheet 281b located at the center of the conductive grid 280 has the largest area, from the center to the periphery The area of the conductive sheet 281b that is emitted gradually decreases.
  • the conductive sheets 281b in the conductive grid 280 are in an M*M two-dimensional rectangular array, and the geometric shape of each conductive sheet 281b in the conductive grid 280 is circular, and two adjacent conductive sheets 281b are circular.
  • the center distances or margins between the pieces 281b are equal.
  • M can be 4, 5, 6, or a number greater than 6.
  • the shape of the conductive sheet 281b and the value of M are not further limited.
  • the impedance bandwidth and gain of the antenna module can be increased at the same time.
  • the main lobe beam width of the antenna is narrowed and the directivity is strong.
  • each conductive sheet 281b in the conductive grid 280 is the same, and the area of each row of the conductive sheet 281b in the conductive grid 280 in the same direction gradually becomes smaller.
  • the conductive sheets 281b in the conductive grid 280 form an M*M two-dimensional rectangular array, and the geometric shape of each conductive sheet 281b in the conductive grid 280 is a rectangle.
  • the area of the conductive sheets 281b in the row direction from the first row to the Mth row gradually becomes smaller or larger, and two adjacent conductive sheets in the row direction
  • the 281b has the same tendency to gradually become smaller or larger, that is, gradually become smaller or larger according to the same proportion.
  • the area of the conductive sheets 281b from the first column to the Mth column in the column direction gradually decreases, and two conductive sheets 281b are adjacent to each other in the column direction.
  • the trend of gradually becoming smaller or larger is the same, that is, gradually becoming smaller or larger according to the same proportion.
  • the center distance or side distance between two adjacent conductive sheets 281b is equal.
  • M can be 4, 5, 6, or a number greater than 6.
  • the shape of the conductive sheet 281b and the value of M are not further limited.
  • center distance can be understood as the distance between the respective centers of two adjacent conductive sheets 281b; the marginal distance can be understood as the shortest distance between the edges of two adjacent conductive sheets 281b.
  • the impedance bandwidth and gain of the antenna module can be increased at the same time.
  • the main lobe beam width of the antenna is narrowed and the directivity is strong.
  • the antenna package module includes: an antenna substrate 210, a first laminated circuit 220, a ground layer 230, a radiating element 240, a second laminated circuit 250, a feeding structure 260, and a conductive Grid 280.
  • the antenna substrate 210, the first laminated circuit, and the second laminated circuit 250 adopt a PCB stack structure of an 8-layer millimeter wave package antenna integrated by an HDI (High Density Interconnection) process.
  • the first laminated circuit 220 includes metal layers TM1 to TM4, and PP layers (including PP1 to PP3) between adjacent metal layers.
  • the metal layers TM1 to TM4 are the copper layer marking layers of the antenna part.
  • the metal layer TM4 can be understood as the first laminated circuit 220 including the first conductive layer 221 on the side close to the antenna substrate 210.
  • the radiation element 240 is disposed on the metal layer TM1.
  • the metal layer TM5 is the ground layer 230.
  • the second laminated circuit 250 includes metal layers TM6 to TM8 and PP layers (including PP4 to PP6) between adjacent metal layers, where the metal layers TM6 to TM8 are the feeder network and control line wiring of the antenna package module
  • the copper layer, the RF chip 270 is soldered on the TM8 layer.
  • PP1 to PP6 are all prepregs, which are located between the two metal layers TM (for example, copper layers) to isolate and bond the two copper layers.
  • a conductive grid 280 (a plurality of periodically arranged conductive sheets 281b at TM4 and conductive posts 281a penetrating through the antenna substrate 210) and TM5 (ground layer 230) in the metal layer TM4 and the antenna substrate 210 Connecting to form the bottom layer of the antenna of the radiating element 240 can suppress surface waves, thereby increasing the antenna radiation efficiency and thereby increasing the antenna gain.
  • the introduced conductive grid 280 is analogous to multiple parallel LC antenna circuits, which can improve the impedance bandwidth of the antenna and increase the isolation between antenna ports.
  • the introduction of the conductive grid 280 can also reduce the size of the radiating element 240 in the non-scanning direction, thereby reducing the volume of the entire antenna package module.
  • an electronic device includes a housing and the antenna packaging module in any of the above embodiments, wherein the antenna packaging module is housed in the housing.
  • the electronic device includes a plurality of antenna packaging modules, and the plurality of antenna packaging modules are distributed on different sides of the housing.
  • the housing includes a first side 121 and a third side 123 arranged opposite to each other, and a second side 122 and a fourth side 124 arranged opposite to each other.
  • the second side 122 is connected to the first side One end of the side 121 and the third side 123
  • the fourth side 124 is connected to the other end of the first side 121 and the third side 123.
  • At least two of the first side 121, the second side 122, the third side 123, and the fourth side 124 are respectively provided with millimeter wave modules.
  • the two millimeter wave modules 200 are located on the second side 122 and the fourth side 124 respectively, so that the antenna package module is reduced in the overall size in the dimension of the non-scanning direction, so that It is possible to place it on both sides of the electronic device.
  • the electronic equipment with the antenna device of any of the above embodiments can be suitable for the transmission and reception of 5G communication millimeter wave signals, improve the pattern distortion and impedance bandwidth of the antenna module, improve the radiation efficiency and radiation gain of the millimeter wave signal, and can reduce The space occupied by the antenna module in the electronic device.
  • the electronic device can include mobile phones, tablet computers, laptops, palmtop computers, mobile Internet devices (MID), wearable devices (such as smart watches, smart bracelets, pedometers, etc.) or other configurable antennas Communication module.
  • MID mobile Internet devices
  • wearable devices such as smart watches, smart bracelets, pedometers, etc.
  • Fig. 6 is a block diagram of a part of the structure of a mobile phone related to an electronic device provided by an embodiment of the present invention.
  • the mobile phone 600 includes: an array antenna 610, a memory 620, an input unit 630, a display unit 640, a sensor 650, an audio circuit 660, a wireless fidelity (WIFI) module 670, a processor 680, and a power supply 690, etc. part.
  • WIFI wireless fidelity
  • FIG. 6 does not constitute a limitation on the mobile phone, and may include more or fewer components than those shown in the figure, or a combination of certain components, or different component arrangements.
  • the array antenna 610 can be used to send and receive information or receive and send signals during a call. It can receive the downlink information of the base station and send it to the processor 680 for processing; it can also send uplink data to the base station.
  • the memory 620 may be used to store software programs and modules.
  • the processor 680 executes various functional applications and data processing of the mobile phone by running the software programs and modules stored in the memory 620.
  • the memory 620 may mainly include a program storage area and a data storage area, where the program storage area may store an operating system, an application program required by at least one function (such as an application program for a sound playback function, an application program for an image playback function, etc.), etc.;
  • the data storage area can store data (such as audio data, address book, etc.) created according to the use of the mobile phone.
  • the memory 620 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices.
  • the input unit 630 may be used to receive inputted number or character information, and generate key signal input related to user settings and function control of the mobile phone 600.
  • the input unit 630 may include a touch panel 631 and other input devices 632.
  • the touch panel 631 also called a touch screen, can collect the user's touch operations on or near it (for example, the user uses any suitable objects or accessories such as fingers, stylus, etc.) on the touch panel 631 or near the touch panel 631 Operation), and drive the corresponding connection device according to the preset program.
  • the touch panel 631 may include two parts: a touch measurement device and a touch controller.
  • the touch measurement device measures the user's touch position, and measures the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch measurement device, converts it into contact coordinates, and then sends it To the processor 680, and can receive and execute commands sent by the processor 680.
  • the touch panel 631 can be implemented in multiple types such as resistive, capacitive, infrared, and surface acoustic wave.
  • the input unit 630 may also include other input devices 632.
  • the other input device 632 may include, but is not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.).
  • the display unit 640 may be used to display information input by the user or information provided to the user and various menus of the mobile phone.
  • the display unit 640 may include a display panel 641.
  • the display panel 641 may be configured in the form of a liquid crystal display (Liquid Crystal Disply, LCD), an organic light emitting diode (Orgnic Light-Emitting Diode, OLED), etc.
  • the touch panel 631 can cover the display panel 641. After the touch panel 631 measures a touch operation on or near it, it is transmitted to the processor 680 to determine the type of touch event, and then the processor 680 The corresponding visual output is provided on the display panel 641 according to the type of the touch event.
  • the touch panel 631 and the display panel 641 are used as two independent components to realize the input and input functions of the mobile phone, but in some embodiments, the touch panel 631 and the display panel 641 can be integrated. Realize the input and output functions of mobile phones.
  • the mobile phone 600 may also include at least one sensor 650, such as a light sensor, a motion sensor, and other sensors.
  • the light sensor may include an ambient light sensor and a proximity sensor.
  • the ambient light sensor can adjust the brightness of the display panel 641 according to the brightness of the ambient light.
  • the proximity sensor can turn off the display when the mobile phone is moved to the ear. Panel 641 and/or backlight.
  • the motion sensor can include an acceleration sensor.
  • the acceleration sensor can measure the magnitude of acceleration in various directions. The magnitude and direction of gravity can be measured when stationary. It can be used to identify mobile phone gestures (such as horizontal and vertical screen switching) and vibration recognition related functions (such as Pedometer, percussion) etc.
  • the mobile phone can also be equipped with other sensors such as gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc.
  • the audio circuit 660, the speaker 661 and the microphone 662 can provide an audio interface between the user and the mobile phone.
  • the audio circuit 660 can transmit the electric signal converted from the received audio data to the speaker 661, and the speaker 661 converts it into a sound signal for output; on the other hand, the microphone 662 converts the collected sound signal into an electric signal, and the audio circuit 660 After being received, it is converted into audio data, and then processed by the audio data output processor 680, and then sent to another mobile phone via the array antenna 610, or the audio data is output to the memory 620 for subsequent processing.
  • the processor 680 is the control center of the mobile phone. It uses various interfaces and lines to connect various parts of the entire mobile phone. It executes by running or executing software programs and/or modules stored in the memory 620, and calling data stored in the memory 620. Various functions and processing data of the mobile phone can be used to monitor the mobile phone as a whole.
  • the processor 680 may include one or more processing units.
  • the processor 680 may integrate an application processor and a modem processor, where the application processor mainly processes an operating system, a user interface, and application programs, and the modem processor mainly processes wireless communication. It can be understood that the foregoing modem processor may not be integrated into the processor 680.
  • the mobile phone 600 also includes a power source 690 (such as a battery) for supplying power to various components.
  • a power source 690 such as a battery
  • the power source can be logically connected to the processor 680 through a power management system, so that functions such as charging, discharging, and power management are realized through the power management system.
  • the mobile phone 600 may also include a camera, a Bluetooth module, and so on.
  • Non-volatile memory may include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory.
  • Volatile memory may include random access memory (RM), which acts as external cache memory.
  • RM is available in many forms, such as static RM (SRM), dynamic RM (DRM), synchronous DRM (SDRM), double data rate SDRM (DDR SDRM), enhanced SDRM (ESDRM), synchronous Link (Synchlink) DRM (SLDRM), memory bus (Rmbus) direct RM (RDRM), direct memory bus dynamic RM (DRDRM), and memory bus dynamic RM (RDRM).
  • SRM static RM
  • DRM synchronous DRM
  • DDR SDRM double data rate SDRM
  • EDRM enhanced SDRM
  • SDRM synchronous Link
  • SDRM static RM
  • Rmbus direct RM
  • RDRM direct memory bus dynamic RM
  • RDRM memory bus dynamic RM

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Abstract

一种天线封装模组包括：天线基板(210)，天线基板(210)相背的两侧分别设置有第一叠层电路(220)和接地层(230)；辐射元件(240)，设置于第一叠层电路(220)背离天线基板(210)的一侧；第二叠层电路(250)，设置于接地层背离天线基板(210)的一侧，第二叠层电路(250)背离接地层(230)的一侧用于设置射频芯片(270)；馈电结构(260)贯穿第二叠层电路(250)、接地层(230)、天线基板(210)及第一叠层电路(220)，用于连接射频芯片(270)与辐射元件(240)；导电栅格(280)包括多个间隔设置的导电结构(281)，导电结构(281)贯穿天线基板(210)，并与接地层(230)连接，部分馈电结构(260)位于相邻的两个导电结构(281)形成的间隔内。

Description

天线装置和电子设备
相关申请的交叉引用
本申请要求于2019年3月20日提交中国专利局、申请号为2019102114118、发明名称为“天线封装模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及天线技术领域，特别是涉及一种天线装置和电子设备。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有示例性技术。
随着无线通信技术的发展，5G网络技术也随之诞生。5G网络作为第五代移动通信网络，其峰值理论传输速度可达每秒数十Gb，这比4G网络的传输速度快数百倍。因此，具有足够频谱资源的毫米波频段成为了5G通信系统的工作频段之一。
毫米波封装天线模组是未来5G毫米波电子设备中的主流封装方案，其可以采用多层PCB高密度互联工艺，在模组的一侧表面设置辐射元件。但是，一般辐射元件为微带贴片天线阵列，而微带贴片天线阵列的尺寸主要受限于多层PCB板的介电常数，其辐射效率低。
发明内容
根据本申请的各种实施例，提供一种天线装置和电子设备。
一种天线封装模组，包括：
天线基板，所述天线基板相背的两侧分别设置有第一叠层电路和接地层；
辐射元件，设置于所述第一叠层电路背离所述天线基板的一侧；
第二叠层电路，设置于所述接地层背离所述天线基板的一侧，所述第二叠层电路背离所述接地层的一侧用于设置射频芯片；
馈电结构，所述馈电结构贯穿所述第二叠层电路、所述接地层、所述天基板及所述第一叠层电路，用于连接所述射频芯片与所述辐射元件；
导电栅格，所述导电栅格包括多个间隔设置的导电结构，所述导电结构贯穿所述天线基板，并与所述接地层连接，部分所述馈电结构位于相邻的两个所述导电结构形成的间隔内。
此外，还提供一种电子设备，包括：壳体及上述的天线封装模组，其中，所述天线封装模组收容在所述在壳体内。
上述天线封装模组和电子设备，包括：天线基板，所述天线基板相背的两侧分别设置有第一叠层电路和接地层；辐射元件，设置于所述第一叠层电路背离所述天线基板的一侧；第二叠层电路，设置于所述接地层背离所述天线基板的一侧，所述第二叠层电路背离所述接地层的一侧用于设置射频芯片；馈电结构，所述馈电结构贯穿所述第二叠层电路、所述接地层、所述天基板及所述第一叠层电路，用于连接所述射频芯片与所述辐射元件；导电栅格，所述导电栅格包括多个间隔设置的导电结构，所述导电结构贯穿所述天线基板，并与所述接地层连接，部分所述馈电结构位于相邻的两个所述导电结构形成的间隔内。通过引入了导电栅格，可以抑制表面波，可以提高天线辐射效率和天线增益。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其他特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一个实施例中电子设备的立体图；
图2为一实施例中天线封装模组的结构示意图；
图3a为一实施例中导电片的结构示意图；
图3b为另一实施例中导电片的结构示意图；
图3c为又一实施例中导电片的结构示意图；
图4为另一实施例中天线封装模组的结构示意图；
图5为图1所示电子设备的壳体组件在另一实施例中的主视图；
图6为与本发明实施例提供的电子设备相关的手机的部分结构的框图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
可以理解，本申请所使用的术语“第一”、“第二”等可在本文中用于描述各种元件，但这些元件不受这些术语限制。这些术语仅用于将第一个元件与另一个元件区分，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
需要说明的是，当元件被称为“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
本申请一实施例的天线装置应用于电子设备，在其中一实施例中，电子设备可以为包括手机、平板电脑、笔记本电脑、掌上电脑、移动互联网设备(Mobile Internet Device，MID)、可穿戴设备(例如智能手表、智能手环、计步器等)或其他可设置阵列天线装置的通信模块。
如图1所示，在本申请实施例中，电子设备10可包括显示屏组件110、壳体组件120和控制器。显示屏组件110固定于壳体组件120上，与壳体组件120一起形成电子设备的外部结构。壳体组件120可以包括中框和后盖。中框可以为具有通孔的框体结构。其中，中框可以收容在显示屏组件与后盖形成的收容空间中。后盖用于形成电子设备的外部轮廓。后盖可以一体成型。在后盖的成型过程中，可以在后盖上形成后置摄像头孔、指纹识别模组、天线装置安装孔等结构。其中，后盖可以为非金属后盖，例如，后盖可以为塑胶后盖、陶瓷后盖、3D玻璃后盖等。控制器能够控制电子设备的运行等。显示屏组件可用来显示画面或字体，并能够为用户提供操作界面。
在一实施例中，壳体组件120内集成有天线封装模组，天线封装模组能够透过壳体组件120发射和接收毫米波信号，从而使得电子设备能够实现毫米波信号的广覆盖。
毫米波是指波长在毫米数量级的电磁波，其频率大约在20GHz～300GHz之间。3GPP已指定5G NR支持的频段列表，5G NR频谱范围可达100GHz，指定了两大频率范围：Frequency range 1(FR1)，即6GHz以下频段和Frequency range 2(FR2)，即毫米波频段。Frequency range 1的频率范围：450MHz-6.0GHz，其中，最大信道带宽100MHz。Frequency range 2的频率范围为24.25GHz-52.6GHz，最大信道带宽400MHz。用于5G移动宽带的近11GHz频谱包括：3.85GHz许可频谱，例如：28GHz(24.25-29.5GHz)、37GHz(37.0-38.6GHz)、39GHz(38.6-40GHz)和14GHz未许可频谱(57-71GHz)。5G通信系统的工作频段有28GHz，39GHz，60GHz三个频段。
如图2所示，本申请实施例提供一种天线封装模组，天线封装模组包括天线基板210、第一叠层电路220、接地层230、辐射元件240、第二叠层电路250、馈电结构260、射频芯片270和导电栅格280。
在一实施例中，天线基板210、第一叠层电路220、接地层230、第二叠层电路250可形成在为采用HDI(高密度互联)工艺集成的多层印制电路板(Printed circuit board，PCB)中。其中，多层印制电路板可包括芯层(core 层)，以及在芯层的两侧分别叠加PP(Prepreg)层，在每个PP层和芯层上再镀上金属层TM。PP层是半固化片，设置在两个铜层之间，起到隔绝并使得两铜层粘合的作用。金属层TM可以为铜层、锡层、铅锡合金层、锡铜合金层等。
在一实施例中，天线基板210可以理解为芯层(core层)，其中，天线基板210包括相背设置的第一表面和第二表面，其中，第一叠层电路220设置在天线基板210的第一表面。第一叠层电路220可包括多个间隔设置的金属层TM与PP层。其中，金属层TM位于PP层的上方。
在一实施例中，接地层230设置于天线基板210的第二表面。
在一实施例中，第二叠层电路250，设置于接地层230背离所述天线基板210的一侧，所述第二叠层电路250背离所述接地层230的一侧用于设置射频芯片270。第二叠层电路250也可包括多个间隔设置的金属层TM与PP层。其中，金属层TM位于PP层的上方。
在一实施例中，辐射元件240，设置于所述第一叠层电路220背离所述天线基板210的一侧。具体的，辐射元件240设置于顶层金属层TM-p，用于收发毫米波信号。其中，所述辐射元件240上还设有用于馈入电流信号的馈电点，馈电点通过馈电结构260与射频芯片270连接。
在一实施例中，辐射元件240可以为用于辐射毫米波信号的相控天线阵列。例如，用于辐射毫米波信号的辐射元件240可为贴片天线、偶极子天线、八木天线、波束天线或其他合适的天线元件构成的天线阵列。
馈电结构260贯穿所述第二叠层电路250、所述接地层230、所述天线基板210及所述第一叠层电路220，用于连接所述射频芯片270与所述辐射元件240。
在一实施例中，可以在第二叠层电路250、所述接地层230、所述天线基板210及所述第一叠层电路220上开设通孔，其通孔在第一叠层电路220的位置与馈电点的位置对应设置。在该通孔内还可填充导电材料以形成馈电结构260，并通过馈电结构260导通射频芯片270与辐射元件240。该射频芯片 270馈电结构260与所述辐射元件240连接，以将电流信号馈入在该辐射元件240，进而实现毫米波信号的收发。
导电栅格280包括多个间隔设置的导电结构281，所述导电结构281贯穿所述天线基板210，并与所述接地层230连接，部分所述馈电结构260位于相邻的两个所述导电结构281形成的间隔内。
在一实施例中，该导电结构281的材质可以为导电材料，例如金属材料、合金材料、导电硅胶材料、石墨材料等，本实施例中，可以采用金属铜。
上述天线封装模组，通过在天线基板210中引入了导电栅格280，可以抑制表面波，即对某一频段的表面波具有高阻抗特性；具体来说，一是对其表面传播的频率位于其阻带之内的表面波具有抑制作用，或者说不支持频段位于其阻带之内的表面波的传播，进而可以提高天线辐射效率从而提高天线增益。其中，表面波是一种沿两种媒质之间的界面传播的导行波，在平面天线中就是介质基板会使部分电磁波束缚在介质与空气的交界面传播。同时，引入的导电栅格280，类比为多个并联的LC天路，可以改善天线的阻抗带宽，提高天线端口间的隔离度。通过引入导电栅格280还可以减小的辐射元件240在非扫描方向上的尺寸，进而减少整个天线封装模组的体积。
在一实施例中，所述第一叠层电路220包括靠近所述天线基板210一侧的第一导电层221。第一导电层221可以理解为第一叠层电路220中靠近天线基板210设置的金属层TM。该金属层可以为铜层、锡层、铅锡合金层、锡铜合金层等。
具体的，导电结构281包括贯穿所述天线基板210的导电柱281a和设置于所述第一导电层221的导电片281b，所述导电片281b通过所述导电柱281a与所述接地层230连接。
如图3a-图3c所示，导电片281b的几何形状可包括矩形(图3a)、圆环形(图3b)、圆形(图3c)、椭圆形、蘑菇形、倒置“H”形、“十”字形等形状。本申请实施例中，导电片281b的几何形状还可以根据实际需求来设置，并不限于上述举例说明。
需要说明的是，该导电片281b的尺寸与天线基板210的厚度以及介电常数相关，在本申请实施例中，对导电片281b的尺寸大小不做进一步的限定，可以通过调节导电片281b的尺寸、天线基板210的厚度以及介电常数来调节该辐射元件240的谐振频率。
在一实施例中，导电柱281a与所述导电片281b一一对应，所述导电结构281通过导电柱281a与所述天线层240电连接。具体的，可以在天线基板210中开设多个过孔，并在过孔中填充导电材料以形成导电柱281a。导电柱281a与所述导电片281b一一对应，导电结构281通过导电柱281a与天线地层电连接，以实现导电片281b通过导电柱281a共地。同时，间隔设置的导电片281b之间彼此独立，并不相互连接，可实现导电片281b之间的相互容性耦合。
在一实施例中，导电柱281a沿天线基板210所在平面的截面形状与该对应连接的导电片281b的几何形状相同。也即，导电柱281a可以理解为厚度较大的导电片281b，其中，导电柱281a的厚度为该天线基板210的厚度。例如，当导电片281b为圆形时，其与之连接的导电柱281a则为圆柱体。其中，在过孔中填充导电材料以形成的导电柱281a的材质与导电结构281的材料相同，例如可以均为金属材料、石墨材料等。
在一实施例中，设置于所述第一导电层221的导电片281b的数量为多个，且呈周期性排布，例如，可以为蜂窝状排列结构、菱形状排列结构、矩形状排列结构、放射状排列结构、渐变状排列结构等。其中，在同一导电栅格280中，各个导电片281b的形状可以相同，也可以不同。例如，具有周期性排列的多个导电片281b在同一平面内是旋转对称或轴对称的。
在一实施例中，具有周期性排列的多个导电片281b在同一平面内的每个所述导电片281b的几何形状相同，且每个所述导电片281b的面积相等，参考图3a。例如，该导电栅格280中的导电片281b呈二维阵列排布。
在一实施例中，所述导电结构281中的每个所述导电片281b的几何形状相同，且位于导电栅格280中心位置的所述导电片281b的面积最大，从所述 中心位置向四周发射的所述导电片281b的面积逐渐减小。例如，该导电栅格280中的导电片281b呈M*M的二维矩形阵列，且导电栅格280中的每个所述导电片281b的几何形状均为圆形，且相邻两个导电片281b之间的中心距离或边距为相等。其中，M可以为4、5、6或大于6的数字，在本申请实施例中，对导电片281b的形状、M的数值均不作进一步的限定。
本实施例中，通过将导电栅格280设置成M*M的二维矩形阵列，且该矩形阵列中的各个导电片281b呈二维渐变状，可以同时提高天线模组的阻抗带宽和增益，缩窄天线的主瓣波束宽度，方向性较强。
在一实施例中，导电栅格280中的每个所述导电片281b的几何形状相同，且位于导电栅格280中的每一排所述导电片281b在同一方向上的面积逐渐变小。例如，该导电栅格280中的导电片281b呈M*M的二维矩形阵列，且导电栅格280中的每个所述导电片281b的几何形状均为矩形。在一实施例中，M*M的二维矩形阵列中，从第一行至第M行的导电片281b在行方向上的面积逐渐变小或变大，且在行方向上相邻两个导电片281b之间逐渐变小或变大的趋势相同，也即，按照同一比例逐渐变小或变大。
在一实施例中，M*M的二维矩形阵列中，从第一列至第M列的导电片281b在列方向上的面积逐渐变小，且在列方向上相邻两个导电片281b之间逐渐变小或变大的趋势相同，也即，按照同一比例逐渐变小或变大。
进一步的，M*M的二维矩形阵列中，相邻两个导电片281b之间的中心距离或边距为相等。其中，M可以为4、5、6或大于6的数字，在本申请实施例中，对导电片281b的形状、M的数值均不作进一步的限定。
需要说明的是，中心距离可以理解为相邻两个导电片281b各自中心的间距；边距可以理解为相邻两个导电片281b的边缘之间的最短间距。
本实施例中，通过将导电栅格280设置成M*M的二维矩形阵列，且该矩形阵列中的各个导电片281b呈二维渐变状，可以同时提高天线模组的阻抗带宽和增益，缩窄天线的主瓣波束宽度，方向性较强。
如图4所示，在一实施例中，天线封装模组包括：天线基板210、第一 叠层电路220、接地层230、辐射元件240、第二叠层电路250、馈电结构260和导电栅格280。其中，天线基板210、第一叠层电、第二叠层电路250采用HDI(高密度互联)工艺集成的8层毫米波封装天线的PCB叠构。其中，第一叠层电路220包括金属层TM1～TM4，以及相邻金属层之间的PP层(包括PP1～PP3)。其中，金属层TM1～TM4为天线部分的铜层标注层。金属层TM4可以理解为第一叠层电路220包括靠近所述天线基板210一侧的第一导电层221。
辐射元件240设置位于金属层TM1层上。
金属层TM5为接地层230。
第二叠层电路250包括金属层TM6～TM8层以及相邻金属层之间的PP层(包括PP4～PP6)，其中，金属层TM6～TM8层为天线封装模块的馈电网络及控制线布线铜层，射频芯片270焊接在TM8层。
需要说明的是，PP1～PP6均为半固化片，位于在两个金属层TM(例如铜层)之间，起到隔绝并使得两铜层粘合的作用。
通过在金属层TM4和天线基板210中引入了导电栅格280(位于TM4的呈周期性排列的多个间隔设置的导电片281b和贯穿天线基板210的导电柱281a)与TM5(接地层230)连接，以形成辐射元件240的天线底层，可以抑制表面波，进而提高天线辐射效率从而提高天线增益。同时，引入的导电栅格280，类比为多个并联的LC天路，可以改善天线的阻抗带宽，提高天线端口间的隔离度。通过引入导电栅格280还可以减小的辐射元件240在非扫描方向上的尺寸，进而减少整个天线封装模组的体积。
如图5所示，一种电子设备包括壳体及上述任一实施例中的天线封装模组，其中，所述天线封装模组收容在所述壳体内。
在一实施例中，电子设备包括多个天线封装模组，多个天线封装模组分布于壳体的不同侧边。例如，壳体包括相背设置的第一侧边121、第三侧边123，以及相背设置的第二侧边122和第四侧边124，所述第二侧边122连接所述第一侧边121、所述第三侧边123的一端，所述第四侧边124连接所述第一侧边121、所述第三侧边123的另一端。第一侧边121、所述第二侧边 122、所述第三侧边123和所述第四侧边124中的至少两个分别设有毫米波模组。毫米波模组的数量为2个时，2个毫米波模组200分别位于第二侧边122、第四侧边124，从而使得天线封装模组在非扫描方向的维度上缩小整体尺寸，使得放置于电子设备的两侧成为可能。
具有上述任一实施例的天线装置的电子设备，可以适用于5G通信毫米波信号的收发，改善天线模组的方向图畸变和阻抗带宽，提高毫米波信号的辐射效率和辐射增益，同时可以缩小天线模组在电子设备内的占用空间。
该电子设备可以为包括手机、平板电脑、笔记本电脑、掌上电脑、移动互联网设备(Mobile Internet Device，MID)、可穿戴设备(例如智能手表、智能手环、计步器等)或其他可设置天线的通信模块。
图6为与本发明实施例提供的电子设备相关的手机的部分结构的框图。参考图6，手机600包括：阵列天线610、存储器620、输入单元630、显示单元640、传感器650、音频电路660、无线保真(wireless fidelity，WIFI)模块670、处理器680、以及电源690等部件。本领域技术人员可以理解，图6所示的手机结构并不构成对手机的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。
其中，阵列天线610可用于收发信息或通话过程中信号的接收和发送，可将基站的下行信息接收后，给处理器680处理；也可以将上行的数据发送给基站。存储器620可用于存储软件程序以及模块，处理器680通过运行存储在存储器620的软件程序以及模块，从而执行手机的各种功能应用以及数据处理。存储器620可主要包括程序存储区和数据存储区，其中，程序存储区可存储操作系统、至少一个功能所需的应用程序(比如声音播放功能的应用程序、图像播放功能的应用程序等)等；数据存储区可存储根据手机的使用所创建的数据(比如音频数据、通讯录等)等。此外，存储器620可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。
输入单元630可用于接收输入的数字或字符信息，以及产生与手机600 的用户设置以及功能控制有关的键信号输入。在其中一实施例中，输入单元630可包括触控面板631以及其他输入设备632。触控面板631，也可称为触摸屏，可收集用户在其上或附近的触摸操作(比如用户使用手指、触笔等任何适合的物体或附件在触控面板631上或在触控面板631附近的操作)，并根据预先设定的程式驱动相应的连接装置。在其中一实施例中，触控面板631可包括触摸测量装置和触摸控制器两个部分。其中，触摸测量装置测量用户的触摸方位，并测量触摸操作带来的信号，将信号传送给触摸控制器；触摸控制器从触摸测量装置上接收触摸信息，并将它转换成触点坐标，再送给处理器680，并能接收处理器680发来的命令并加以执行。此外，可以采用电阻式、电容式、红外线以及表面声波等多种类型实现触控面板631。除了触控面板631，输入单元630还可以包括其他输入设备632。在其中一实施例中，其他输入设备632可以包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)等中的一种或多种。
显示单元640可用于显示由用户输入的信息或提供给用户的信息以及手机的各种菜单。显示单元640可包括显示面板641。在其中一实施例中，可以采用液晶显示器(Liquid Crystl Disply，LCD)、有机发光二极管(Orgnic Light-Emitting Diode，OLED)等形式来配置显示面板641。在其中一实施例中，触控面板631可覆盖显示面板641，当触控面板631测量到在其上或附近的触摸操作后，传送给处理器680以确定触摸事件的类型，随后处理器680根据触摸事件的类型在显示面板641上提供相应的视觉输出。虽然在图6中，触控面板631与显示面板641是作为两个独立的部件来实现手机的输入和输入功能，但是在某些实施例中，可以将触控面板631与显示面板641集成而实现手机的输入和输出功能。
手机600还可包括至少一种传感器650，比如光传感器、运动传感器以及其他传感器。在其中一实施例中，光传感器可包括环境光传感器及接近传感器，其中，环境光传感器可根据环境光线的明暗来调节显示面板641的亮度，接近传感器可在手机移动到耳边时，关闭显示面板641和/或背光。运动 传感器可包括加速度传感器，通过加速度传感器可测量各个方向上加速度的大小，静止时可测量出重力的大小及方向，可用于识别手机姿态的应用(比如横竖屏切换)、振动识别相关功能(比如计步器、敲击)等。此外，手机还可配置陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器等。
音频电路660、扬声器661和传声器662可提供用户与手机之间的音频接口。音频电路660可将接收到的音频数据转换后的电信号，传输到扬声器661，由扬声器661转换为声音信号输出；另一方面，传声器662将收集的声音信号转换为电信号，由音频电路660接收后转换为音频数据，再将音频数据输出处理器680处理后，经阵列天线610可以发送给另一手机，或者将音频数据输出至存储器620以便后续处理。
处理器680是手机的控制中心，利用各种接口和线路连接整个手机的各个部分，通过运行或执行存储在存储器620内的软件程序和/或模块，以及调用存储在存储器620内的数据，执行手机的各种功能和处理数据，从而对手机进行整体监控。在其中一实施例中，处理器680可包括一个或多个处理单元。在其中一实施例中，处理器680可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等；调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器680中。
手机600还包括给各个部件供电的电源690(比如电池)，优选的，电源可以通过电源管理系统与处理器680逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。
在其中一实施例中，手机600还可以包括摄像头、蓝牙模块等。
本申请所使用的对存储器、存储、数据库或其它介质的任何引用可包括非易失性和/或易失性存储器。合适的非易失性存储器可包括只读存储器(ROM)、可编程ROM(PROM)、电可编程ROM(EPROM)、电可擦除可编程ROM(EEPROM)或闪存。易失性存储器可包括随机存取存储器(RM)，它用作外部高速缓冲存储器。作为说明而非局限，RM以多种形式可得，诸如静态RM(SRM)、动态RM (DRM)、同步DRM(SDRM)、双数据率SDRM(DDR SDRM)、增强型SDRM(ESDRM)、同步链路(Synchlink)DRM(SLDRM)、存储器总线(Rmbus)直接RM(RDRM)、直接存储器总线动态RM(DRDRM)、以及存储器总线动态RM(RDRM)。
以上实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种天线封装模组，其特征在于，包括：
    天线基板，所述天线基板相背的两侧分别设置有第一叠层电路和接地层；
    辐射元件，设置于所述第一叠层电路背离所述天线基板的一侧；
    第二叠层电路，设置于所述接地层背离所述天线基板的一侧，所述第二叠层电路背离所述接地层的一侧用于设置射频芯片；
    馈电结构，所述馈电结构贯穿所述第二叠层电路、所述接地层、所述天基板及所述第一叠层电路，用于连接所述射频芯片与所述辐射元件；
    导电栅格，所述导电栅格包括多个间隔设置的导电结构，所述导电结构贯穿所述天线基板，并与所述接地层连接，部分所述馈电结构位于相邻的两个所述导电结构形成的间隔内。
  2. 根据权利要求1所述的天线封装模组，其特征在于，所述第一叠层电路包括靠近所述天线基板一侧的第一导电层。
  3. 根据权利要求2所述的天线封装模组，其特征在于，所述导电结构包括贯穿所述天线基板的导电柱和设置于所述第一导电层的导电片，所述导电片通过所述导电柱与所述接地层连接。
  4. 根据权利要求1所述的天线封装模组，其特征在于，设置于所述第一导电层的导电片的数量为多个，且呈周期性排布。
  5. 根据权利要求4所述的天线封装模组，其特征在于，呈周期性排列的所述导电片在同一平面内是旋转对称。
  6. 根据权利要求4所述的天线封装模组，其特征在于，呈周期性排列的所述导电片在同一平面内是轴对称的。
  7. 根据权利要求5或6所述的天线封装模组，其特征在于，呈周期性排列的多个所述导电片的几何形状相同，且位于所述导电栅格中心位置的所述导电片的面积最大，从所述中心位置向四周发射的所述导电片的面积逐渐减小。
  8. 根据权利要求5或6所述的天线封装模组，其特征在于，
    呈周期性排列的多个所述导电片中的每一排的所述导电片在同一方向上的面积逐渐变小或变大。
  9. 根据权利要求5或6所述的天线封装模组，其特征在于，呈周期性排列的每个所述导电片的面积相等。
  10. 根据权利要求1所述的天线封装模组，其特征在于，相邻两个所述导电片之间的中心距离或边距为相等。
  11. 根据权利要求1所述的天线封装模组，其特征在于，所述导电柱沿所述天线基板所在平面的截面形状与该对应连接的所述导电片的几何形状相同。
  12. 根据权利要求1所述的天线封装模组，其特征在于，所述导电片的几何形状可包括矩形、圆环形、圆形、椭圆形、蘑菇形和倒置“H”形中的一种。
  13. 根据权利要求1所述的天线封装模组，其特征在于，所述第二叠层电路、所述接地层、所述天线基板及所述第一叠层电路上均开设有通孔，所述通孔中填充有导电材料，以形成所述馈电结构。
  14. 根据权利要求1所述的天线封装模组，其特征在于，所述辐射元件为贴片天线、偶极子天线和八木天线中至少一种天线构成的天线阵列。
  15. 一种电子设备，其特征在于，包括：
    壳体；及
    收容在所述壳体内的天线封装模组，其中，所述天线封装模组包括：
    天线基板，所述天线基板相背的两侧分别设置有第一叠层电路和接地层；
    辐射元件，设置于所述第一叠层电路背离所述天线基板的一侧；
    第二叠层电路，设置于所述接地层背离所述天线基板的一侧，所述第二叠层电路背离所述接地层的一侧用于设置射频芯片；
    馈电结构，所述馈电结构贯穿所述第二叠层电路、所述接地层、所述天基板及所述第一叠层电路，用于连接所述射频芯片与所述辐射元件；
    导电栅格，所述导电栅格包括多个间隔设置的导电结构，所述导电结构贯穿所述天线基板，并与所述接地层连接，部分所述馈电结构位于相邻的两个所述导电结构形成的间隔内。
  16. 根据权利要求15所述的电子设备，其特征在于，所述第一叠层电路包括靠近所述天线基板一侧的第一导电层。
  17. 根据权利要求16所述的电子设备，其特征在于，所述导电结构包括贯穿所述天线基板的导电柱和设置于所述第一导电层的导电片，所述导电片通过所述导电柱与所述接地层连接。
  18. 根据权利要求15所述的电子设备，其特征在于，设置于所述第一导电层的导电片的数量为多个，且呈周期性排布。
  19. 根据权利要求15所述的电子设备，其特征在于，呈周期性排列的所述导电片在同一平面内是旋转对称或轴对称的。
  20. 根据权利要求15所述的电子设备，其特征在于，所述天线封装模组的数量为多个；
    所述壳体包括相背设置的第一侧边、第三侧边，以及相背设置的第二侧边和第四侧边，所述第二侧边连接所述第一侧边、所述第三侧边的一端，所述第四侧边连接所述第一侧边、所述第三侧边的另一端；
    所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边中的至少两个分别设有所述天线封装模组。
PCT/CN2020/079502 2019-03-20 2020-03-16 天线装置和电子设备 WO2020187181A1 (zh)

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