WO2020187110A1

WO2020187110A1 - Dielectric transmission line coupler, dielectric transmission line coupling assembly, and network device

Info

Publication number: WO2020187110A1
Application number: PCT/CN2020/078828
Authority: WO
Inventors: 张鲁奇; 唐先锋; 刘余; 李昆
Original assignee: 华为技术有限公司
Priority date: 2019-03-18
Filing date: 2020-03-11
Publication date: 2020-09-24
Also published as: CN111725597B; CN111725597A

Abstract

The present invention provides a dielectric transmission line coupler, comprising a circuit board, a microstrip line, a metal connector, and a coupling part. The circuit board comprises an insulated surface. The coupling part comprises a metal base and a resonator having a plurality of resonance points. The metal base is mounted on the surface, and comprises a resonant cavity and a channel communicating the resonant cavity with the exterior of the metal base. The resonator is located in the resonant cavity and fixed on the surface. Both the resonator and the resonant cavity are centrally symmetric structures and the centers coincide. The microstrip line is provided on the surface and linearly extends into the resonant cavity along the surface of the circuit board from the exterior of the metal base towards the center of the resonant cavity through the channel. The microstrip line and the resonator are arranged at an interval. The metal connector is mounted on the side of the circuit board facing away from the surface of the circuit board, and the cut-off frequency is lower than the operating frequency of electromagnetic waves in the resonant cavity. A dielectric transmission line is inserted in the metal connector, and the resonant cavity and the resonator pass through the circuit board and the metal connector and are coupled into the dielectric transmission line after performing mode conversion on the electromagnetic signal transmitted by the microstrip line.

Description

Medium transmission line coupler, medium transmission line coupling component and network equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on March 18, 2019, the application number is 201910206043.8, and the application name is "medium transmission line coupler, medium transmission line coupling assembly and network equipment", the entire content of which is incorporated by reference Incorporated in this application.

Technical field

The present invention relates to the technical field related to communication transmission, in particular to a medium transmission line coupler, a medium transmission line coupling component and a network device.

Background technique

At present, with the application of large-capacity network devices, the transmission rate requirements for interconnection between devices are getting higher and higher. The use of high-frequency (millimeter wave, terahertz) electromagnetic waves as a carrier can meet the requirements of high-speed interconnection, and the performance of high-frequency transmission lines largely determines the communication rate between communication devices. Polymer transmission lines have the advantages of low loss, light weight, and flexible application. As the carrier frequency increases to millimeter wave and terahertz frequency bands, the transmission loss of traditional copper wires and metal waveguides increases sharply, which limits the interconnection distance and channel performance In contrast, how to apply polymer transmission lines in high-speed interconnect modules, coupling the modulated carrier signal output by the chip to the polymer transmission line is a key issue in such systems.

Summary of the invention

The embodiment of the present invention provides a medium transmission line coupler, which can couple a carrier signal output by a radio frequency chip to a medium transmission line and use the medium transmission line for transmission to reduce transmission loss between network devices.

The embodiment of the present invention also provides a medium transmission line coupling component and a network device.

In one aspect, the dielectric transmission line coupler includes a circuit board, a microstrip line, a hollow metal connector, and a coupling portion. The circuit board includes an insulating surface. The coupling portion includes a metal base and a plurality of resonance points. A resonant body, the metal base is mounted on the surface, the metal base includes a resonant cavity and a channel connecting the resonant cavity and the outside of the metal base, and the cavity bottom wall of the resonant cavity is the circuit board The resonant body is located in the resonant cavity and is fixed on the surface, and the resonant body and the resonant cavity are both centrally symmetric structures and their centers coincide.

The microstrip line is arranged on the surface, and the microstrip line extends linearly from the metal base to the center of the resonant cavity through the channel along the circuit board, and is located in the resonant cavity. The microstrip line in the resonant cavity and the resonator body are arranged at intervals, the metal connector is mounted on the circuit board on a side facing away from the surface of the circuit board, and the metal connector The cut-off frequency is lower than the working frequency of the electromagnetic wave in the resonant cavity to ensure signal transmission; the metal connector is used to plug the dielectric transmission line, and the resonant cavity and the resonator body transmit the microstrip line After the electromagnetic signal undergoes mode conversion, it passes through the circuit board and is coupled to the medium transmission line through the metal connector.

In one embodiment, the high-frequency modulation signal in the RF transceiver chip is guided into the resonant cavity of the coupling part through the microstrip line on the circuit board, and the transmission mode (quasi-TEM mode) in the microstrip line is transferred through the resonant cavity and the resonator. ) Is converted to the working mode in the resonant coupling structure. The medium transmission line coupler of the embodiment of the present invention is used to couple the electromagnetic signal emitted by the network device to the medium transmission line, realize high-speed transmission through the medium transmission line, ensure the communication rate and reduce the transmission loss. Moreover, the dielectric transmission line coupler of the embodiment of the present invention has a simple structure and is easy to assemble. The resonant body and the resonant cavity are both centrally symmetrical and overlapped to ensure the impedance matching of the mode conversion.

Further, the axis of the metal connector coincides with the axis of the resonant cavity, which can ensure coupling efficiency.

Further, the depth of the resonant cavity is equal to a quarter of the wavelength of the waveguide in the resonant cavity, thereby achieving a better bandwidth and low reflection.

In one embodiment, the metal connector has a hollow cylindrical shape and includes a transmission channel with a circular cross-section for inserting a dielectric transmission line with a circular cross-section to improve the matching degree to ensure the accuracy of the insertion; The cross-section of the cavity is circular, and the diameter of the resonant cavity is equal to the diameter of the transmission channel, thereby ensuring the transmission efficiency of the signal from the resonant cavity to the metal connector to the dielectric transmission line and reducing insertion loss. Wherein, the cross section refers to a plane taken perpendicular to the axial direction. The resonant body is a sheet with a centrally symmetric structure and is attached to the cavity bottom wall of the resonant cavity. The resonator body is provided with multiple resonance points to increase the bandwidth. The metal base is a rectangular metal block, and the resonant cavity is a cylindrical cavity formed on the metal base. The microstrip line is an elongated metal sheet, which is spaced from the resonator to ensure the bandwidth characteristics of the resonant cavity, and is used to conduct the modulated signal of the radio frequency transceiver chip to the coupling part through the coupling part provided on the circuit board. The resonant body and the resonant cavity convert the transmission mode in the microstrip line into the working mode of the coupling part, and then into the transmission mode of the metal connector, and couple to the dielectric transmission line through the metal connector. Through the cooperation of the resonant body and the resonant cavity described in the embodiment of the present invention, the high-frequency electromagnetic signal in the radio frequency transceiver chip can be coupled to the medium transmission line, so as to realize the interconnection between communication devices.

In an embodiment, the resonator body includes a plurality of resonant branches symmetrically arranged around the center of the resonant cavity, and the multiple resonant points are generated by the multiple resonant branches; each branch is arranged at equal intervals from the cavity wall of the resonant cavity to ensure The performance of the mode conversion structure is to ensure the bandwidth width and reduce the insertion loss and reflection.

In this embodiment, the resonator body is a cross structure, that is, a cross-shaped sheet body, which includes four resonant branches, each resonant branch includes a main body and an extension at the free end of the main body, and the microstrip line is located at The part in the resonant cavity is opposite to the free end of a resonant branch, which reduces the reflection of the resonant cavity. Each main body is a rectangular sheet body, and the extension section is formed by extending the short sides of the rectangular sheet body to a certain width while extending in the width direction of the main body.

Further, the width of the extension section of each resonant branch is greater than or equal to the maximum value of the width dimension of the microstrip line and the width dimension of the main body, so as to achieve a small impedance matching insertion loss of the resonant body.

In one embodiment, the channel extends from the resonant cavity to an outer side of the metal base, and includes a first section and a second section connected and communicated with the first section. An inner opening is formed on the cavity wall of the resonant cavity, the second section forms an outer opening on an outer side of the metal base, and the dimension of the second section perpendicular to the extension direction of the microstrip line is determined by the second section. The connection between the segment and the first segment gradually increases toward the outer opening direction, which can ensure the impedance matching of the microstrip line at the feed end. The metal base is a rectangular metal block, and the channel penetrates an outer side surface of the metal base to communicate with the resonant cavity. The microstrip line extends through the channel into the resonant cavity, and does not contact the channel wall of the channel to ensure transmission performance. In other embodiments, the channels extend in a straight line and have the same size perpendicular to the extension direction of the microstrip line.

In an embodiment, the circuit board includes a dielectric layer and a conductive layer that are stacked, and the surface is the surface of the dielectric layer facing away from the conductive layer; the conductive layer is provided with a center coincident with the resonant cavity The metal connector is inserted into the mounting hole and connected with the dielectric layer. The metal connector avoids contact with the conductive layer to ensure the boundary conditions of the metal base and the metal connector, thereby ensuring the electric field performance inside the metal connector and the coupling performance of the coupler.

In another embodiment, the circuit board includes a dielectric layer, a conductive layer, and a substrate stacked in sequence, and the surface is the surface of the dielectric layer facing away from the conductive layer; the substrate and the conductive layer are provided with A mounting hole coincident with the center of the resonant cavity, one end of the metal connector is inserted into the mounting hole and connected with the dielectric layer.

In one embodiment, the metal base includes a base body and a base cover, the resonant cavity is provided on the base body, and the base cover covers the surface of the base body and Package the resonant cavity with the circuit board. The metal base may also be integrally formed. In this embodiment, the cover plate and the base body are used to facilitate the alignment and assembly of the metal base, the resonator body and the microstrip line.

In an embodiment, the metal connector and the metal base are made of copper material.

The medium transmission line coupling assembly provided by the embodiment of the present invention includes a chip and the medium transmission line coupler, the chip is mounted on the circuit board and the coupling part is spaced apart, and the chip and the circuit board and The microstrip line is electrically connected. In one embodiment, the chip is a radio frequency transceiver chip. After receiving the signal from the network device, the chip transmits the signal to the resonant cavity via the microstrip line for transmission mode conversion and then adopts a medium transmission line for transmission, which reduces transmission loss and can ensure transmission efficiency.

The network device provided by the embodiment of the present invention includes a cabinet, a medium transmission line, and the medium transmission line coupler, the cabinet includes a server and a switch, and the medium transmission line is plugged into the metal connector of the medium transmission line coupler, The medium transmission line coupler is electrically connected to the chip of the cabinet, and data transmission is performed between the server and the switch, or/and the cabinet and the cabinet through the medium transmission line. Specifically, the data transmission between the cabinet and the cabinet usually refers to the interconnection between the top switch and the aggregation switch. The chip is a high-speed radio frequency chip or a transceiving chip, the medium transmission line coupler is connected to the transceiving chip or the high-speed radio frequency chip in the cabinet, and the transceiving module is plugged and electrically connected to the switch of the cabinet or the server.

Further, the medium transmission line includes a plug-in end, and the plug-in end has a conical shape and is used for plugging with the end of the metal connector. The metal connector includes a cavity with a circular cross-section, which is plugged into the plug end to ensure plug stability, thereby achieving impedance matching in the broadband range, and realizing coupling with low insertion loss and small reflection in the broadband range.

The medium transmission line coupler of the present invention can transmit high-frequency electromagnetic wave signals through the medium transmission line, can ensure the communication rate between devices and reduce the transmission loss, and meet the requirements of high-speed interconnection.

Description of the drawings

Figure 1 is a three-dimensional schematic diagram of a dielectric transmission line coupler provided by the present invention;

Fig. 2 is a partial structural diagram of the dielectric transmission line coupler shown in Fig. 1;

3 is a schematic cross-sectional view of a circuit board of the dielectric transmission line coupler shown in FIG. 1 along the axial direction of the metal connector;

FIG. 4 is a simulation diagram of S parameters of the dielectric transmission line coupler shown in FIG. 3;

5 is a schematic cross-sectional view of another mode of the circuit board of the dielectric transmission line coupler shown in FIG. 1 along the axial direction of the metal connector;

Fig. 6 is an S parameter simulation diagram of the dielectric transmission line coupler shown in Fig. 5;

FIG. 7 is a schematic structural diagram of a dielectric transmission line coupler assembly provided by the present invention;

Fig. 8 is a schematic diagram of a network device provided by the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

An embodiment of the present invention provides a dielectric transmission line coupler. Refer to Figures 1 and 2. Figure 1 is a three-dimensional schematic diagram of a dielectric transmission line coupler provided by an embodiment of the present invention. Figure 2 is the dielectric transmission line coupling shown in Figure 1. Schematic diagram of part of the device. The dielectric transmission line coupler 100 includes a circuit board 10, a microstrip line 15, a hollow metal connector 20, and a coupling portion. The circuit board 10 includes an insulating surface 11, and the coupling portion includes a metal base 31 and multiple The metal base 31 is mounted on the surface 11, and the metal base 31 includes a resonant cavity 32 and a channel 34 connecting the resonant cavity 32 and the outside of the metal base 31. The cavity bottom wall 321 of the resonant cavity 32 is a part of the surface 11 of the circuit board 10, the resonator 33 is located in the resonant cavity 32 and fixed on the surface 11, and the resonator 33 and the resonant cavity 32 are both It is a centrally symmetric structure and the centers coincide.

The microstrip line 15 is provided on the surface 11, and the microstrip line 15 extends along the circuit board 10 from the metal base 31 to the center of the resonant cavity 32 through the channel. In the resonant cavity 32, the microstrip line 15 located in the resonant cavity 32 and the resonator 33 are spaced apart to ensure bandwidth characteristics. The metal connector 20 is mounted on the circuit board 10 on the side facing away from the surface 11 of the circuit board 10, and the cut-off frequency of the metal connector 20 is lower than the operating frequency of the electromagnetic wave in the resonant cavity 32 , In order to ensure signal transmission; the metal connector 20 is used to plug the dielectric transmission line 40, the resonant cavity 32 and the resonator 33 transfer the microstrip line 15 into the electromagnetic signal for mode conversion and then pass through the The circuit board 10 is coupled to the dielectric transmission line 40 through the metal connector 20.

In one embodiment, the high-frequency modulation signal in the RF transceiver chip is guided into the resonant cavity 32 of the coupling part through the microstrip line 15 on the circuit board 10, and the resonant cavity 32 and the resonator 33 are used to transfer the The transmission mode (quasi-TEM mode) is converted to the working mode in the resonant coupling structure.

The medium transmission line coupler of the embodiment of the present invention is used to couple the electromagnetic signal emitted by the network device to the medium transmission line, realize high-speed transmission through the medium transmission line, ensure the communication rate and reduce the transmission loss. Moreover, the dielectric transmission line coupler of the embodiment of the present invention has a simple structure and is easy to assemble. The resonator 33 and the resonant cavity 32 are both centrally symmetrical and have overlapping centers to ensure impedance matching for mode conversion.

3, the metal base 31 is a rectangular metal block, the resonant cavity 32 is a cylindrical cavity formed in the metal base 31, and the axial section of the resonant cavity 32 is circular, and The diameter of the resonant cavity 32 is equal to the diameter of the transmission channel 21, thereby ensuring the transmission efficiency of the signal from the resonant cavity 32 to the metal connector 20 to the dielectric transmission line 40 and reducing insertion loss. Further, the depth of the resonant cavity 32 is equal to one-fourth of the waveguide wavelength in the resonant cavity 32, so that the resonant cavity 32 and the metal connector 20 can achieve good impedance matching, which can ensure the efficient coupling of electromagnetic waves from resonance. Into the metal connector, and then achieve better bandwidth. In an embodiment, the metal base 31 includes a base body 311 and a base cover 312, the resonant cavity 32 is provided on the base body 311, and the base cover 312 covers the The surface 11 of the base body and the circuit board 10 encapsulate the resonant cavity 32. The metal base 31 may also be integrally formed. In this embodiment, the base cover 312 is matched with the base body 311 to facilitate the installation of the resonator 33 and the microstrip line 15 and the alignment and assembly of the metal base 31 with the resonator 33 and the microstrip line 15.

2 together, in one embodiment, the channel 34 extends from the resonant cavity 32 toward an outer side of the metal base 31, and the surface 11 of the circuit board 10 is exposed in the channel 34 for microstrip Line 15 passes. The passage 34 includes a first section 341 and a second section 342 connected and communicated with the first section 341. The first section 341 forms an inner opening 343 on the cavity wall 320 of the resonant cavity 32, and the second section 341 The section 342 forms an outer opening 344 on an outer side of the metal base 31, and the size of the second section 342 perpendicular to the extension direction of the microstrip line 15 is connected by the second section 342 and the first section 341 The position gradually increases toward the outer opening 344, which can ensure the impedance matching of the microstrip line 15 at the feeding end. The metal base 31 is a rectangular metal block, and the channel 34 penetrates an outer surface of the metal base 31 and communicates with the resonant cavity 32. The microstrip line 15 extends through the channel 34 into the resonant cavity 32, and does not contact the channel wall of the channel to ensure transmission performance. In other embodiments, the channels extend in a straight line and have the same size perpendicular to the extension direction of the microstrip line 15.

In one embodiment, the microstrip line 15 is a long strip of metal, which is attached to the surface 11 of the circuit board 10 and extends from the outside of the metal block 31 through the channel 34 into the resonant cavity 32. The microstrip line 15 with the line 15 located in the resonant cavity 32 is spaced from the resonator 33 to ensure the bandwidth characteristics of the resonant cavity 32. In one embodiment, the width of the microstrip line 15 is smaller than the width of the channel 34 to avoid transmission interference. The microstrip line 15 is used to connect to the chip. In this embodiment, a radio frequency chip is used as an example. The modulation signal of the radio frequency transceiver chip is conducted to the coupling part, and the transmission mode in the microstrip line 15 is converted into the working mode of the coupling part through the resonator 33 and the resonant cavity 32 of the coupling part provided on the circuit board 10, It is then coupled to the metal connector 20 and transferred to the dielectric transmission line through the metal connector 20. Through the cooperation of the resonant body 33 and the resonant cavity 32 described in the embodiment of the present invention, the high-frequency electromagnetic signal in the radio frequency transceiver chip can be coupled to the medium transmission line to realize the interconnection between communication devices.

As shown in FIG. 2, in one embodiment, the resonator 33 is a sheet with a center symmetric structure and is attached to the cavity bottom wall 321 of the resonant cavity 32. The resonator body 33 is provided with multiple resonance points to increase the bandwidth. In an embodiment, the resonator 33 includes a plurality of resonant branches 331 symmetrically arranged about the center of the resonant cavity 32, and multiple resonant points are generated by the multiple resonant branches 331; each resonant branch 331 and the cavity of the resonant cavity 32 The walls 320 are arranged at equal intervals to ensure the performance of the mode conversion structure, that is, to ensure the bandwidth width and reduce the insertion loss and reflection.

Specifically, the resonator body 33 has a cross structure, that is, a cross-shaped sheet body, which includes four resonance branches 331, and the four resonance branches 331 are attached to the cavity bottom wall 321. Each resonant branch 331 includes a main body 332 and an extension 333 located at the free end of the main body 332. The part of the microstrip line 15 located in the resonant cavity 32 is opposite to the free end of a resonant branch 331. The reflection of the small cavity 32. Each main body 332 is a rectangular sheet body, and the extension section 333 is formed by extending the short side of the rectangular sheet body to a certain width while extending in the width direction of the main body 32. The extension section 333 is provided to increase the resonance point of the coupling component, thereby widening the coupling. bandwidth.

Please refer to FIG. 4. In other embodiments, the resonator 33 is formed by four triangles. In fact, the shape of the resonator body 33 is not limited, as long as it conforms to a structure that can generate multiple resonance points and is center-symmetrical.

Further, the width of the extension 333 of each resonance branch 331 is greater than or equal to the maximum value of the width dimension of the microstrip line 15 and the width dimension of the main body 332, so as to realize the impedance matching insertion loss of the resonator 33 small.

Please refer to FIGS. 1 and 3 together. FIG. 3 is a cross-sectional view along the axis of the dielectric transmission line coupler shown in FIG. 1. The axis of the metal connector 20 coincides with the axis of the resonant cavity 32 to ensure that Coupling efficiency. In an embodiment, the metal connector 20 and the metal base 31 are made of copper material. In one embodiment, the metal connector 20 has a hollow cylindrical shape (as shown in FIG. 3), which includes a transmission channel 21 with a circular axial section for inserting a medium transmission line 40 with a circular section to improve matching. To ensure the accuracy of insertion. The metal connector 20 includes a connection end (not marked in the figure) connected to the circuit board 10 and a plug end 202 for plugging the medium transmission line 40.

Referring to FIG. 3, in an embodiment, the circuit board 10 includes a dielectric layer 111 and a conductive layer 112 that are stacked, and the surface 11 is the surface of the dielectric layer 111 facing away from the conductive layer 112; The layer 112 is provided with a mounting hole 113 coincident with the center of the resonant cavity 32, and the metal connector 20 is inserted into the mounting hole 113 and connected to the dielectric layer 111. Specifically, the mounting hole 113 penetrates the conductive layer 112 and exposes the surface of the dielectric layer 111 facing away from the surface 11. The metal connector 20 includes a connecting end 201 and a plug for plugging the dielectric transmission line 40. The connecting end 202, the connecting end 201 is inserted into the mounting hole 113 and connected to the surface of the dielectric layer 111 facing away from the surface 11, and the leveling position does not have the conductive layer 112. The mounting hole 113 coincides with the axis of the metal connector 20 and has an interference fit. The diameter of the metal connector 20 can be ensured to fit into the mounting hole 113, but there should not be too large a gap with the mounting hole 113. It is necessary to ensure that the axis of the metal connector 20 and the axis of the resonant cavity are within a certain allowable range. Ensure coupling performance. At the same time, the metal connector 20 passes through the mounting hole 113 to prevent the transmission channel 21 from contacting the conductive layer 112 and ensure the boundary conditions of the metal base 31 and the metal connector 20, thereby ensuring the electric field performance inside the metal connector 20. The coupling performance of the coupler.

In this embodiment, a specific structure and data are listed for description and simulation. The material of the dielectric transmission line 40 is polytetrafluoroethylene, which has a relative permittivity of 2.1 in the D (110-170GHz) band and a loss tangent of 0.0002. The diameter of the dielectric transmission line 40 is 2 mm, the relative dielectric constant of the dielectric layer 111 of the circuit board is 2.65 and the thickness is 0.1788 mm, and the thickness of the conductive layer 112 is 0.018 mm. The diameter of the metal connector 20 is 1.68 mm and the length is 6 mm. The line width of the microstrip line 15 is 0.23mm, the thickness of the microstrip line 15 is 0.018mm, and the length that extends into the cavity 32 is 0.45mm. The diameter of the cavity 32 is 1.68mm and the depth is 0.28mm. The channel 34 The width is 0.52mm and the length is 0.66mm. The length of the resonant branch of the resonator body is 0.23mm, the width is 0.12mm, and the thickness is 0.018mm. In the electromagnetic simulation software, modeling is performed according to the structural dimensions given in this embodiment, and by feeding power at the port of the microstrip line, the S parameters of the coupling part in the D band can be obtained, as shown in FIG. 4. It can be seen from the calculation results that the reflection parameter S11 is less than -10dB in the 110-150GHz frequency band, and the transmission parameter S21 is greater than -3.6dB. This indicates that the coupling scheme of the embodiment of the present invention has device performance with large bandwidth, low insertion loss, and low reflection.

Referring to FIG. 5, in another embodiment, the circuit board 10 includes a dielectric layer 115, a conductive layer 116, and a substrate 117 stacked in sequence, and the surface 11 is the dielectric layer 115 facing away from the conductive layer 116. The substrate 117 and the conductive layer 116 are provided with a mounting hole 118 coincident with the center of the resonant cavity 32, and one end of the metal connector 20 is inserted into the mounting hole 118 and with the dielectric layer 115 connections. Specifically, the mounting hole 113 penetrates the conductive layer 116 and the substrate 117 and exposes the surface of the dielectric layer 115 that faces away from the surface 11, and the connecting end 21 of the metal connector 20 is inserted into the mounting hole 113 In contact with the surface of the dielectric layer 111 facing away from the surface 11, the mounting hole 113 coincides with the axis of the metal connector 20 and has an interference fit. At the same time, the metal connector 20 passes through the mounting hole 113 to prevent the transmission channel 21 from contacting the conductive layer 116, and to ensure the boundary conditions of the metal base 31 and the metal connector 20, thereby ensuring the electric field performance inside the metal connector 20. The coupling performance of the coupler.

In this embodiment, the relative dielectric constant of the base layer and the base layer are 2.65 and the thickness is 0.1788 mm; the relative dielectric constant of the dielectric layer 115 is 2.35 and the thickness is 0.4826 mm; the thickness of the conductive layer 116 is 0.018 mm. The diameter of the metal connector 20 is 1.68 mm and the length is 6 mm. The microstrip line 15 has a line width of 0.22mm, a thickness of 0.018mm, and a length of 0.43mm extending into the cavity 32; the diameter of the cavity 32 is 1.68mm, the depth is 0.3mm, and the width of the channel 34 is 0.6mm , The length is 0.66mm. The length of the resonance branch of the resonator body is 0.47 mm, the width is 0.12 mm, and the thickness is 0.018 mm.

In the electromagnetic simulation software, modeling is carried out according to the structure size given in the above simulation data description. By feeding power at the port of the microstrip line, the S parameters of the coupler in the D band can be obtained, as shown in Figure 6. Show. It can be seen from the calculation results that the reflection parameter S11 is less than -15dB and the transmission parameter S21 is greater than -3.1dB in the 110-160GHz frequency band. This indicates that the coupling scheme of the present invention has device performance with large bandwidth, low insertion loss and low reflection. Due to the introduction of multi-resonant branch resonators and microstrip lines in the metal resonant cavity, multiple resonance points are introduced into the dielectric transmission line coupler, which broadens the working bandwidth of the dielectric transmission line coupler. At the same time, the resonant cavity and the resonator constitute a quarter-wavelength resonance condition, which can realize high-efficiency mode conversion between the electromagnetic wave microstrip line and the metal connector. It can realize the high-efficiency coupling of the medium transmission line coupler to the medium transmission line. It should be noted that the numbers used in the simulation of the above two embodiments are only one of the medium transmission line couplers of the present application, and it is not limited to these embodiments if the above effects can be achieved.

Referring to FIG. 7, an embodiment of the present invention provides a dielectric transmission line coupling assembly 200, which includes a chip 210 and the dielectric transmission line coupler 100. The chip 210 is mounted on the circuit board 10 and is spaced apart from the coupling part. , And the chip 50 is electrically connected to the circuit board 10 and the microstrip line 15. In one embodiment, the chip 50 is a radio frequency transceiver chip. After receiving the signal from the network device, the chip 50 transmits the signal to the resonant cavity 32 through the microstrip line 15 for transmission mode conversion and then adopts a medium transmission line for transmission, which reduces transmission loss and can ensure transmission efficiency. In one manner, the chip of the medium transmission line coupling assembly 200 is used for electrical connection with the network cabinet, such as plugging through a connector or a plug-in module.

Referring to FIG. 8, an embodiment of the present invention provides a network device, including a cabinet 300, a medium transmission line 40, and the medium transmission line coupler 100. The cabinet 300 includes a server 310 and a switch 320, and the medium transmission line 40 is plugged in. On the metal connection head 20 of the medium transmission line coupler 100, the medium transmission line coupler 100 is electrically connected to the chip of the cabinet 300, and the server 310 and the switch 320, or/and all are connected through the medium transmission line. Data transmission between the cabinet and the cabinet. Specifically, the data transmission between the cabinet and the cabinet usually refers to the interconnection between the top switch and the aggregation switch. The chip is a high-speed radio frequency chip or a transceiver chip, and the medium transmission line coupler is connected with the transceiver chip or high-speed radio frequency chip in the cabinet, and the interconnection between the server and the switch is realized through the medium transmission line.

In this embodiment, both ends of the medium transmission line 40 are respectively plugged into the server 310 and the switch 320 to implement data transmission between the server 310 and the switch 320. The number of the medium transmission line 40 is set according to actual needs, and the plug-in manner of the medium transmission line 40 and the server 310 and the switch 320 adopts but is not limited to a connector plug-in manner. The network device uses the medium transmission line coupler 100 described in the present application for signal transmission, and the medium transmission line can be used for high frequency signal transmission, which reduces transmission loss and ensures the performance of servers and switches. The medium transmission line coupler 100 is suitable for high transmission rate interconnection between large-capacity network devices. Specifically, it may be between the server inside the cabinet and the top switch and the cabinet in the TOR network architecture of the data center.

Further, the medium transmission line 40 includes a plug-in end 401, and the plug-in end 401 has a conical shape and is used for plug-in connection with the plug-in end 202 of the metal connector 20. The metal connector 20 includes a cavity with a circular cross-section. The plug-in end 401 of the dielectric transmission line 40 adopts a tapered structure and is plugged into the metal connector 20 to ensure plug stability and realize a wideband range. Internal impedance matching realizes coupling with low insertion loss and small reflection in the broadband range.

The embodiments of the present invention are described in detail above, and specific examples are used in this article to illustrate the principles and implementation of the present invention. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the present invention; Persons of ordinary skill in the art, based on the idea of the present invention, will have changes in the specific implementation and the scope of application. In summary, the content of this specification should not be construed as limiting the present invention.

Claims

A dielectric transmission line coupler, characterized in that the dielectric transmission line coupler includes a circuit board, a microstrip line, a hollow metal connector and a coupling part,

The circuit board includes an insulating surface, the coupling portion includes a metal base and a resonator body with a plurality of resonance points, the metal base is mounted on the surface, and the metal base includes a resonant cavity and a communication point. The resonant cavity and the channel outside the metal base, the cavity bottom wall of the resonant cavity is a part of the surface of the circuit board, the resonator is located in the resonant cavity and is fixed on the surface, and the resonator is in harmony The vibrating cavities are all centrally symmetrical and the centers coincide,

The microstrip line is arranged on the surface, and the microstrip line extends linearly from the metal base to the center of the resonant cavity through the channel along the surface of the circuit board to the inside of the resonant cavity. The microstrip line in the resonant cavity and the resonator body are arranged at intervals,

The metal connector is mounted on the side of the circuit board facing away from the surface of the circuit board, and the cut-off frequency is lower than the working frequency of the electromagnetic wave in the resonant cavity; the metal connector is used to plug the In the dielectric transmission line, the resonant cavity and the resonant body convert the electromagnetic signal transmitted from the microstrip line for mode conversion, pass through the circuit board, and are coupled to the dielectric transmission line through the metal connector.
The dielectric transmission line coupler according to claim 1, wherein the axis of the metal connector coincides with the axis of the resonant cavity.
The dielectric transmission line coupler according to claim 2, wherein the resonator body comprises a plurality of resonant branches symmetrically arranged about the center of the resonant cavity, and each resonant branch is arranged at an equal interval from the cavity wall of the resonant cavity.
The dielectric transmission line coupler of claim 1, wherein the depth of the resonant cavity is equal to one-fourth of the waveguide wavelength in the resonant cavity.
The dielectric transmission line coupler according to any one of claims 1-4, wherein the channel extends from the resonant cavity to an outer direction of the metal base, and includes a first section and a first section. The second section is connected and communicated with each other, the first section forms an inner opening on the cavity wall of the resonant cavity, the second section forms an outer opening on an outer side of the metal base, and the first section The size of the two sections perpendicular to the extending direction of the microstrip line gradually increases from the connection point with the first section toward the outer opening direction.
The dielectric transmission line coupler according to any one of claims 1 to 4, wherein the resonator body is a cross structure, which includes four resonant branches, and each resonant branch includes a main body and a free end of the main body. In the extension section, the part of the microstrip line located in the resonant cavity is opposite to the free end of a resonant branch.
7. The dielectric transmission line coupler of claim 6, wherein the width of the extension of each resonant branch is greater than or equal to the maximum of the width of the microstrip line and the width of the main body.
The dielectric transmission line coupler according to any one of claims 1 to 4, wherein the metal connector has a hollow cylindrical shape and includes a transmission channel with a circular cross section, and the cross section of the resonant cavity is a circular , And the diameter of the resonant cavity is equal to the diameter of the transmission channel, wherein the cross section refers to a plane taken perpendicular to the axial direction.
8. The dielectric transmission line coupler according to claim 8, wherein the circuit board comprises a dielectric layer and a conductive layer that are stacked, and the surface is the surface of the dielectric layer facing away from the conductive layer;

The conductive layer is provided with a mounting hole coincident with the center of the resonant cavity, and the metal connector is inserted into the mounting hole and connected with the dielectric layer.
8. The dielectric transmission line coupler according to claim 8, wherein the circuit board comprises a dielectric layer, a conductive layer and a substrate stacked in sequence, and the surface is the surface of the dielectric layer facing away from the conductive layer; The substrate and the conductive layer are provided with a mounting hole coincident with the center of the resonant cavity, and one end of the metal connector is inserted into the mounting hole and connected with the dielectric layer.
The dielectric transmission line coupler according to any one of claims 1 to 4, wherein the metal base includes a base body and a base cover, the resonant cavity is provided on the base body, and The base cover plate covers the surface of the base body and encapsulates the resonant cavity.
The dielectric transmission line coupler according to any one of claims 1 to 4, wherein the metal connector and the metal base are made of copper material.
A dielectric transmission line coupling assembly, comprising a chip and the dielectric transmission line coupler according to any one of claims 1-12, the chip is mounted on the circuit board and is spaced apart from the coupling part, and the The chip is electrically connected with the circuit board and the microstrip line.
A network device, comprising a cabinet, a medium transmission line, and the medium transmission line coupler according to any one of claims 1-12, the cabinet including a server and a switch, and the medium transmission line is plugged into the medium transmission line On the metal connector of the coupler, the medium transmission line coupler is plugged and electrically connected to the chip of the cabinet, and data is performed between the server and the switch, or/and the cabinet and the cabinet through the medium transmission line. transmission.
The network device according to claim 14, wherein the medium transmission line includes a plug-in end, and the plug-in end has a conical shape and is used for plugging with the end of the metal connector.