WO2020186984A1 - Panneau d'affichage et son procédé de fabrication, et dispositif d'affichage - Google Patents

Panneau d'affichage et son procédé de fabrication, et dispositif d'affichage Download PDF

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Publication number
WO2020186984A1
WO2020186984A1 PCT/CN2020/076770 CN2020076770W WO2020186984A1 WO 2020186984 A1 WO2020186984 A1 WO 2020186984A1 CN 2020076770 W CN2020076770 W CN 2020076770W WO 2020186984 A1 WO2020186984 A1 WO 2020186984A1
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WIPO (PCT)
Prior art keywords
sub
transparent
layer
display panel
region
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PCT/CN2020/076770
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English (en)
Chinese (zh)
Inventor
谢明哲
孙艳六
冯宇
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京东方科技集团股份有限公司
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Publication of WO2020186984A1 publication Critical patent/WO2020186984A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate

Definitions

  • the embodiments of the present disclosure relate to a display panel, a manufacturing method thereof, and electronic equipment.
  • the embodiments of the present disclosure provide a display panel that does not affect the size of an electronic device and can capture images on the back of the display panel, a manufacturing method thereof, and an electronic device.
  • An embodiment of the present disclosure provides a display panel, which includes: a transparent display area including a display sub-area and a transparent sub-area; sub-pixels located on a base substrate and located in the display sub-area; an insulating layer located in the On the base substrate; an opening located in the transparent sub-region and passing through the base substrate and the insulating layer; and a first transparent layer filled in the opening.
  • the height of the first transparent layer is greater than the height of the insulating layer.
  • the height of the first transparent layer is greater than the sum of the heights of the base substrate and the insulating layer.
  • the display panel further includes a second transparent layer, and the second transparent layer is located in the transparent sub-region.
  • the first transparent layer and the second transparent layer are made of the same material or have the same refractive index.
  • both the first transparent layer and the second transparent layer are made of transparent materials.
  • the insulating layer includes at least one of a buffer layer, a first gate insulating layer, a second gate insulating layer, and a dielectric layer.
  • the sub-pixel includes a thin film transistor and a light emitting structure.
  • the insulating layer includes a buffer layer, the thin film transistor is located on a side of the buffer layer away from the base substrate, and the light emitting structure is located on the thin film transistor. The side away from the base substrate.
  • the display panel further includes a planarization layer covering the thin film transistor, and a portion of the planarization layer located in the transparent sub-region constitutes the The first transparent layer.
  • the display panel further includes a pixel definition layer configured to define a light emitting area of the light emitting structure, and the pixel definition layer is located in the transparent sub-area. The part constitutes the second transparent layer.
  • the display panel further includes a light shielding layer, wherein the light shielding layer is located between the base substrate and the buffer layer.
  • the display sub-region and the transparent sub-region are arranged in close proximity.
  • the sub-pixel includes three sub-pixels
  • the transparent sub-region includes three transparent sub-regions
  • the three sub-pixels and the three transparent sub-regions are arranged In two rows and three columns, the three sub-pixels and the three transparent sub-regions constitute pixel units, the pixel units are provided in multiple, and the multiple pixel units are arranged in an array.
  • the sub-pixel includes three sub-pixels, and the three sub-pixels and the transparent sub-region are arranged in two rows and two columns.
  • the transparent sub-region constitutes a pixel unit, and the pixel unit is provided in multiples, and the multiple pixel units are arranged in an array.
  • At least one embodiment of the present disclosure also provides an electronic device, including any of the above-mentioned display panels, and functional elements arranged on one side of the display panel and located in the transparent display area.
  • the functional element is disposed on a side of the base substrate away from the sub-pixel.
  • the functional element includes a camera.
  • At least one embodiment of the present disclosure further provides a method for manufacturing a display panel, including: forming sub-pixels on a base substrate, the sub-pixels being located in a display sub-region of a transparent display area; and forming on the base substrate An insulating layer; forming an opening penetrating the base substrate and the insulating layer, the opening being located in a transparent sub-region of the transparent display area; and forming a first transparent layer, the first transparent layer filling the opening in.
  • the height of the first transparent layer is greater than the height of the insulating layer.
  • the height of the first transparent layer is greater than the sum of the heights of the base substrate and the insulating layer.
  • the manufacturing method further includes forming a second transparent layer, wherein the second transparent layer is located in the transparent sub-region.
  • the first transparent layer and the second transparent layer are made of the same material or have the same refractive index.
  • both the first transparent layer and the second transparent layer are made of transparent materials.
  • forming the insulating layer includes forming at least one of a buffer layer, a first gate insulating layer, a second gate insulating layer, and a dielectric layer.
  • forming the sub-pixel includes forming a thin film transistor and forming a light-emitting structure.
  • forming the insulating layer includes forming a buffer layer, the thin film transistor is formed on a side of the buffer layer away from the base substrate, and the light emitting structure is formed on The side of the thin film transistor away from the base substrate.
  • the manufacturing method further includes forming a planarization layer, the planarization layer covers the thin film transistor, and a portion of the planarization layer located in the transparent sub-region constitutes The first transparent layer.
  • the manufacturing method further includes forming a pixel definition layer, the pixel definition layer is configured to define a light emitting area of the light emitting structure, and the pixel definition layer is located in the transparent Part of the sub-region constitutes the second transparent layer.
  • the manufacturing method further includes forming a light shielding layer between the base substrate and the buffer layer.
  • FIG. 1 is an exemplary schematic diagram of a display panel with a transparent display area provided by an embodiment of the present disclosure
  • FIG. 2 is an exemplary schematic diagram of a display panel with a transparent display area provided by another embodiment of the present disclosure
  • Fig. 3 is a cross section of the sub-pixel in Fig. 1;
  • FIG. 4 is an exemplary flowchart of a manufacturing method of a display panel provided by an embodiment of the present disclosure
  • 5 to 8 are specific exemplary schematic diagrams of a manufacturing method of a display panel according to an embodiment of the disclosure.
  • FIG. 9 is a schematic diagram of an exemplary structure of an electronic device according to an embodiment of the disclosure.
  • FIG. 1 is an exemplary schematic diagram of a display panel with a transparent display area provided by an embodiment of the present disclosure
  • FIG. 2 is a display panel with a transparent display area provided by another embodiment of the present disclosure
  • Figure 3 is a cross-section of the sub-pixel in Figure 1
  • Figure 9 is an exemplary structural diagram of an electronic device provided by an embodiment of the disclosure.
  • the display panel includes a base substrate 11, a plurality of pixel units 50 arranged in an array arranged in a display area D3 on the base substrate 11, each pixel unit includes at least two sub-pixels, and the display area D3 is provided with A transparent display area D4 containing multiple sub-pixels.
  • the base substrate may be a flexible substrate or a rigid substrate.
  • the material of the flexible substrate includes polyimide, and the material of the rigid substrate includes glass.
  • the transparent sub-area D2 can be arranged in different ways, for example, it can be shown in FIG. 1 and FIG. 2 respectively.
  • each sub-pixel in the transparent display area D4 has a display sub-area D1 and a transparent sub-area D2.
  • the transparent sub-area D2 is located at the position of the opening passing through the base substrate 11, and the opening is provided with transparent material.
  • the transparent display area D4 can both display and transmit light. That is, the transparent display area D4 is an area that has a transparent part and can still be displayed.
  • the transparent display area D4 is an image acquisition area.
  • a camera and other elements are provided at a position on one side of the display surface of the display panel corresponding to the transparent display area D4 to realize functions such as photographing of the display device.
  • the transparent display area D4 in the transparent display area D4, at least one sub-pixel of each pixel unit 150 is a transparent sub-area D2 as a whole, and the remaining sub-pixels are a display sub-area D1 as a whole, and the transparent sub-area D2 is located across the substrate.
  • a transparent material is arranged in the opening.
  • the display sub-region D1 may be an opaque display sub-region, but it is not limited thereto.
  • the camera 102 is arranged on the back of the display panel 101, so that images can be captured without affecting the display effect.
  • the embodiment of the present disclosure provides a transparent display area D4 in the display area D3 of the display panel.
  • the structure of the pixel unit in the transparent display area D4 may adopt the structure shown in FIG. 1 or FIG. 2.
  • one pixel unit 50 includes a sub-pixel 51, a sub-pixel 52, and a sub-pixel 53, and each pixel is divided into a display sub-region D1 and a transparent sub-region D2.
  • one pixel unit 150 includes sub-pixels 151, sub-pixels 152, sub-pixels 153, and sub-pixels 154.
  • the entire sub-pixel 154 is a transparent sub-region D1
  • the other sub-pixels 151, The pixel 152 and the sub-pixel 153 are respectively the display sub-region D2.
  • the structure of the display panel in FIG. 1 and FIG. 2 can realize the normal display of the transparent display area and the acquisition of the image of the rear camera 102. And because the base substrate at the position of the transparent sub-region D2 is removed, and transparent material is filled therein, stray light is reduced, which is beneficial to improve the display effect.
  • the transparent display area adopts the display sub-area D1 and the transparent sub-area D2 of each sub-pixel shown in FIG. 1, in the transparent display area, the display sub-area D1 and the transparent sub-area D2 of each sub-pixel are Arrange in the column direction.
  • the arrangement positions of the display sub-region D1 and the transparent sub-region D2 in the sub-pixels of each row are the same.
  • FIG. 1 only shows the structure in which the display sub-region D1 and the transparent sub-region D2 are arranged along the column direction, and the display sub-region D1 of each sub-pixel is above the transparent sub-region D2.
  • the positions of the two sub-regions in the column direction can be interchanged.
  • the transparent display area adopts the pixel unit shown in FIG. 2 including one sub-pixel whose whole is a transparent sub-area, and three sub-pixels whose whole is a display sub-area. Each sub-pixel adopts an arrangement of two rows and two columns. .
  • the arrangement positions of sub-pixels that are transparent sub-regions as a whole are consistent.
  • FIG. 2 only shows an arrangement of two rows and two columns of the pixel unit 150 including sub-pixels 151, sub-pixels 152, sub-pixels 153, and sub-pixels 154.
  • the sub-pixels 154 in the transparent sub-region D2 are arranged in the pixel unit 150 as a whole. Bottom right corner.
  • the sub-pixels 154 that are the transparent sub-region D2 as a whole can be located at any position in two rows and two columns.
  • the transparent sub-region D2 includes a flat layer 31 and a pixel defining layer 32, and the flat layer 31 and the pixel defining layer 32 are made of the same transparent material or two transparent materials with the same refractive index, reducing the gap between different layers.
  • the optical path design issues such as refraction and reflection, and the interface roughness is small, which improves the light transmittance of the transparent sub-region D2. Therefore, there is only one material for the transparent sub-region D2, and no more than two materials at most.
  • the above scheme compared to the scheme of removing the film layer on the base substrate and retaining the base substrate, prevents the increase of stray light and the reduction of light penetration caused by residues generated in the film removal process or damage to the surface of the base substrate The problem of rate.
  • the sub-pixel includes a light-emitting structure, and the light-emitting structure is only provided in the display sub-region D2.
  • the light emitting structure is not provided on the transparent sub-region.
  • the light emitting structure includes an organic light emitting structure.
  • the light-emitting structure is an electroluminescent device, such as an organic light-emitting device or an organic light-emitting diode.
  • the embodiments of the present disclosure also provide an electronic device. As shown in FIG. 9, the electronic device includes any display panel 101 provided by each embodiment of the present disclosure, and a camera 102 arranged in a transparent display area of the display panel. .
  • the camera 102 is disposed on the side of the base substrate of the display panel 101 away from the light emitting structure.
  • the embodiment of the present disclosure also provides a method for manufacturing a display panel, which will be described below with reference to FIGS. 1 to 9.
  • 4 is an exemplary flow chart of a manufacturing method of a display panel provided by an embodiment of the present disclosure
  • FIGS. 5 to 8 are specific exemplary schematic diagrams of a manufacturing method of a display panel provided by an embodiment of the present disclosure
  • FIG. 9 is the present disclosure An exemplary structural diagram of an electronic device provided by an embodiment.
  • the display panel includes a base substrate and a plurality of pixel units arranged in an array arranged on the base substrate 11.
  • Each pixel unit includes at least two sub-pixels, and the display area is provided with multiple pixels.
  • a transparent display area of two sub-pixels the method includes: the sub-pixels in the transparent display area have a display sub-area D1 and a transparent sub-area D2, forming an opening through a base substrate in the transparent sub-area D1, and filling the opening with a transparent material Or at least one sub-pixel of each pixel unit in the transparent display area is set as a transparent sub-area D2 as a whole, and the remaining sub-pixels as a whole display sub-area D1, an opening through the base substrate is formed in the transparent sub-area D2, and transparent The material fills the opening.
  • the manufacturing process of the display panel is shown in FIGS. 4 to 8 and includes the following steps.
  • Step S10 forming a buffer layer 12, a first gate insulating layer 13, a second gate insulating layer 14, and a dielectric layer 15 on the transparent sub-region of the base substrate 11 in sequence.
  • Step S20 sequentially forming a light shielding layer 21, a buffer layer 12, a semiconductor layer 22, a first gate insulating layer 13, a first gate 23, and a second gate insulating layer on the display sub-region of the base substrate. , GI) 14, a second gate 24, a dielectric layer (interlevel dielectric, ILD) 15 and a source drain layer 25.
  • the light blocking layer 21 is provided in the display sub-region, the display sub-region constitutes an opaque display sub-region.
  • Step S30 As shown in FIG. 6, all the film layers of the transparent sub-region D2 on the glass substrate 10 are removed.
  • the removed film includes part of the base substrate 11, part of the buffer layer 12, and part of the first gate located in the transparent sub-region.
  • the polar insulating layer 13, part of the second gate insulating layer 14 and part of the dielectric layer 15 are formed through the base substrate 11, the buffer layer 12, the first gate insulating layer 13, the second gate insulating layer 14 and the dielectric Layer 15 opening 30.
  • Step S40 As shown in FIG. 7, a transparent material is coated to form a flat layer 31, and the opening 30 is filled at the same time.
  • Step S50 As shown in FIG. 8, an anode layer and a pixel definition layer 32 are formed.
  • a base substrate 11 is formed on a glass substrate 10, and a buffer layer 12, a first gate insulating layer 13, a second gate insulating layer 14, and a buffer layer 12 are sequentially formed on the transparent sub-region D2 of the base substrate 11.
  • a light shielding layer 21, a buffer layer 12, a semiconductor layer (poly-silicon, P-Si) 22, a first gate insulating layer 13, and a first gate insulating layer are sequentially formed on the display sub-region D1 of the base substrate.
  • the source and drain of the source-drain layer 25 are connected to the semiconductor layer 22 through via holes penetrating the dielectric layer 15, the second gate insulating layer 14 and the first gate insulating layer 13, respectively.
  • each of the buffer layer 12, the first gate insulating layer 13, the second gate insulating layer 14, and the dielectric layer 15 on the transparent sub-region D2 and the display sub-region D1 are made of the same.
  • the film layers are formed at the same time using the same process, instead of forming the above-mentioned film layer on the transparent sub-region D2 first, and then forming the above-mentioned film layer on the display sub-region D1.
  • the above representation is used to illustrate the different film structures of the transparent sub-region D2 and the display sub-region D1.
  • the removed film layers include the base substrate 11, the buffer layer 12, and the first gate insulating layer 13 in the removed transparent sub-region D2.
  • the second gate insulating layer 14 and the dielectric layer 15 form an opening 30 passing through the base substrate 11.
  • the opening can be formed by dry etching or wet etching.
  • a transparent material is filled in the opening 30 to form a flat layer 16.
  • the flat layer 16 is formed by a method of spin coating or blade coating of a transparent material.
  • an anode layer 26, a pixel defining layer 32, a light emitting structure 27 and a spacer 18 are formed on the flat layer 16. Then, the base substrate 11 and the glass substrate 10 are separated to complete the manufacture of the display panel.
  • the light emitting structure 27 includes a light emitting function layer and a cathode layer. The light-emitting function layer is located between the anode layer 26 and the cathode layer. It should be noted that the light emitting structure emits light under the action of the anode layer 26 and the cathode layer in the light emitting structure 27.
  • the manufacturing process of the anode layer 26 is different from the manufacturing process of the light emitting structure 25.
  • the manufacturing method of the display panel may further include forming an encapsulation layer before separating the base substrate 11 and the glass substrate 10.
  • the glass substrate 10 is a rigid substrate as a supporting substrate.
  • an embodiment of the present disclosure provides a display panel including: a transparent display area D4, including a display sub-area D1 and a transparent sub-area D2; sub-pixels SP, located on a base substrate 11 and located in the display sub-area In D1; the insulating layer ISL is located on the base substrate 11; the opening 30 is located in the transparent sub-region D2 and penetrates the base substrate 11 and the insulating layer ISL; and the first transparent layer 31 is filled in the opening 30.
  • the base substrate at the position of the transparent sub-region D2 is removed, and the first transparent layer 31 is filled therein, which prevents residues or damage to the surface of the base substrate during the film removal process
  • the problem of increasing stray light and reducing light transmittance is conducive to improving the display effect.
  • the display panel further includes a second transparent layer 32, and the second transparent layer 32 is located in the transparent sub-region D2.
  • the materials of the first transparent layer 31 and the second transparent layer 32 are the same or the refractive index of the material is the same, so as to reduce the optical path design problems such as refraction and reflection between different layers, the interface roughness is small, and the light of the transparent sub-region D2 is improved. Penetration rate.
  • the height of the first transparent layer 31 is greater than the height of the insulating layer ISL.
  • the height of the first transparent layer 31 is greater than the sum of the height of the base substrate 11 and the insulating layer ISL.
  • both the first transparent layer 31 and the second transparent layer 32 are made of transparent materials.
  • the first transparent layer 31 and the second transparent layer 32 are made of materials such as transparent resin or polyimide, but are not limited thereto.
  • the insulating layer ISL includes at least one of a buffer layer 12, a first gate insulating layer 13, a second gate insulating layer 14, and a dielectric layer 15.
  • FIG. 3 takes the insulating layer ISL including the buffer layer 12, the first gate insulating layer 13, the second gate insulating layer 14 and the dielectric layer 15 as an example for illustration.
  • the sub-pixel SP includes a thin film transistor 33 and a light emitting structure LST.
  • the anode of the light emitting structure LST is connected to the drain of the thin film transistor 33.
  • the light emitting structure LST includes an organic light emitting diode, but is not limited thereto.
  • the insulating layer ISL includes a buffer layer 12, the thin film transistor 33 is located on the side of the buffer layer 12 away from the base substrate 11, and the light emitting structure LST is located on the side of the thin film transistor 33 away from the base substrate 11.
  • the display panel further includes a planarization layer 16, the planarization layer 16 covers the thin film transistor 33, and the portion of the planarization layer 16 located in the transparent sub-region D2 constitutes the first transparent layer 31.
  • the display panel further includes a pixel definition layer 17.
  • the pixel definition layer 17 is configured to define the light emitting area of the light emitting structure LST, and the portion of the pixel definition layer 17 located in the transparent sub-region D2 constitutes the second transparent layer. 32.
  • the display panel further includes a light shielding layer 21, and the light shielding layer 21 is located between the base substrate 11 and the buffer layer 12. Therefore, the display sub-region D1 is an opaque display sub-region.
  • the display sub-region D1 and the transparent sub-region D2 are arranged in close proximity.
  • the sub-pixel SP includes three sub-pixels SP, and the three sub-pixels SP are sub-pixel 51, sub-pixel 52, and sub-pixel 53, respectively.
  • the transparent sub-region D2 includes three transparent sub-regions D2, Two sub-pixels SP (sub-pixel 51, sub-pixel 52, and sub-pixel 53) and three transparent sub-regions D2 are arranged in two rows and three columns.
  • Three sub-pixels SP and three transparent sub-regions D2 constitute a pixel unit 50. 50 is provided in multiples, and multiple pixel units 50 are arranged in an array.
  • the sub-pixel SP includes three sub-pixels SP.
  • the three sub-pixels SP are sub-pixel 151, sub-pixel 152, and sub-pixel 153, respectively.
  • the three sub-pixels SP and the transparent sub-region D2 are arranged in two. Rows and two columns, three sub-pixels SP and transparent sub-region D2 constitute pixel units, the pixel units are provided in multiple, and the multiple pixel units are arranged in an array.
  • the transparent sub-region D2 may also be referred to as a sub-pixel 154. That is, the sub-pixel 154 is a transparent sub-pixel for transmitting light.
  • the sub-pixel 151, the sub-pixel 152, and the sub-pixel 153 are all used to emit light for display.
  • an embodiment of the present disclosure further provides an electronic device, including a display panel 101 and a functional element 102 arranged on one side of the display panel 101 and located in the transparent display area D4.
  • the display panel 101 can be any of the above-mentioned display panels.
  • the functional element 102 is disposed on the side of the base substrate 11 away from the sub-pixel SP.
  • the functional element includes a camera, but is not limited to this.
  • An embodiment of the present disclosure also provides a method for manufacturing a display panel.
  • the method includes: forming a sub-pixel SP on the base substrate 11, the sub-pixel SP is located in the display sub-region D1 of the transparent display region D4; An insulating layer ISL is formed on the base substrate 11; an opening 30 penetrating the base substrate 11 and the insulating layer ISL is formed, and the opening 30 is located in the transparent sub-region D2 of the transparent display area D4; and a first transparent layer 31 is formed, and the first transparent layer 31 is filled In the opening 30.
  • the manufacturing method further includes forming a second transparent layer 32, which is located in the transparent sub-region D2.
  • the first transparent layer 31 and the second transparent layer 32 are made of the same material or have the same refractive index.
  • the height of the first transparent layer 31 is greater than the height of the insulating layer ISL.
  • the height of the first transparent layer 31 is greater than the sum of the heights of the base substrate 11 and the insulating layer ISL.
  • both the first transparent layer 31 and the second transparent layer 32 are made of transparent materials.
  • forming the insulating layer ISL includes forming at least one of the buffer layer 12, the first gate insulating layer 13, the second gate insulating layer 14, and the dielectric layer 15.
  • forming the sub-pixel SP includes forming a thin film transistor 33 and forming a light-emitting structure LST.
  • forming the insulating layer ISL includes forming the buffer layer 12, the thin film transistor 33 is formed on the side of the buffer layer 12 away from the base substrate 11, and the light emitting structure LST is formed on the side of the thin film transistor 33 away from the base substrate 11.
  • forming the insulating layer ISL includes forming the buffer layer 12, the thin film transistor 33 is formed on the side of the buffer layer 12 away from the base substrate 11, and the light emitting structure LST is formed on the side of the thin film transistor 33 away from the base substrate 11.
  • the manufacturing method further includes forming a planarization layer 16, the planarization layer 16 covers the thin film transistor 33, and the portion of the planarization layer 16 located in the transparent sub-region D2 constitutes the first transparent layer 31.
  • the manufacturing method further includes forming a pixel defining layer 17 configured to define a light emitting area of the light emitting structure LST, and a portion of the pixel defining layer 17 located in the transparent sub-region D2 constitutes the second transparent layer 32.
  • the manufacturing method further includes forming a light shielding layer 21 between the base substrate 11 and the buffer layer 12.
  • the base substrate 11 is placed on a supporting substrate to produce each film layer, and after the production is completed, the supporting substrate is peeled off.
  • the supporting substrate is a glass substrate, but it is not limited thereto.
  • the base substrate 11 includes a flexible substrate, which is made of a flexible material, such as polyimide, but is not limited thereto.

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Abstract

L'invention concerne un panneau d'affichage, un dispositif électronique et un procédé de fabrication. Le panneau d'affichage comprend : une zone d'affichage transparente, comprenant une sous-zone d'affichage et une sous-zone transparente ; un sous-pixel, situé sur un substrat et situé dans la sous-zone d'affichage ; une couche d'isolation, située sur le substrat ; une ouverture, située dans la sous-zone transparente et traversant le substrat et la couche d'isolation ; et une première couche transparente, remplissant l'ouverture.
PCT/CN2020/076770 2019-03-21 2020-02-26 Panneau d'affichage et son procédé de fabrication, et dispositif d'affichage WO2020186984A1 (fr)

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CN201910219577.4A CN109887984B (zh) 2019-03-21 2019-03-21 有机发光显示面板、电子设备及制造方法

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CN114823825A (zh) * 2022-04-12 2022-07-29 武汉华星光电半导体显示技术有限公司 显示面板及显示装置

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CN109887976B (zh) * 2019-03-07 2021-08-27 合肥鑫晟光电科技有限公司 一种阵列基板及其制备方法及显示面板和显示装置
CN110634935A (zh) * 2019-09-29 2019-12-31 武汉天马微电子有限公司 一种阵列基板及显示装置
CN111048564A (zh) * 2019-12-18 2020-04-21 京东方科技集团股份有限公司 显示面板及显示装置
CN114424850B (zh) * 2022-01-25 2023-08-29 业成科技（成都）有限公司 智能显示头盔

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