WO2020186677A1 - Conductive adhesive dripping system and conductive adhesive dripping method - Google Patents

Conductive adhesive dripping system and conductive adhesive dripping method Download PDF

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Publication number
WO2020186677A1
WO2020186677A1 PCT/CN2019/097666 CN2019097666W WO2020186677A1 WO 2020186677 A1 WO2020186677 A1 WO 2020186677A1 CN 2019097666 W CN2019097666 W CN 2019097666W WO 2020186677 A1 WO2020186677 A1 WO 2020186677A1
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WIPO (PCT)
Prior art keywords
conductive glue
dripper
induction coil
channel
processing unit
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PCT/CN2019/097666
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French (fr)
Chinese (zh)
Inventor
陈基松
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深圳市华星光电技术有限公司
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Publication of WO2020186677A1 publication Critical patent/WO2020186677A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Definitions

  • the invention relates to the field of display technology, in particular to a conductive glue dropping system and a conductive glue dropping method.
  • liquid crystal display Liquid Crystal Display, LCD
  • cathode ray tubes Cathode ray tubes
  • Ray Tube, CRT Ray Tube
  • the LCD panel is composed of a color filter (CF) substrate, thin film transistor (Thin Film Transistor (TFT) array substrate, liquid crystal (LC) sandwiched between the color filter substrate and the thin film transistor array substrate, and a sealant frame (Sealant).
  • CF color filter
  • TFT Thin Film Transistor
  • LC liquid crystal
  • sealant frame Sealant
  • the working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates. The liquid crystal molecules are controlled to change direction by powering on or not, and the light of the backlight module Refraction produces a picture.
  • the liquid crystal display panel includes an array substrate 100 and a color filter substrate 200 arranged opposite to each other, and a conductive adhesive 300 disposed between the array substrate 100 and the color filter substrate 200.
  • the array substrate 100 includes a first substrate 110, an array substrate wiring 120 provided on the first substrate 110, and an insulating layer 130 covering the first substrate 110 and the array substrate wiring 120.
  • the array substrate wiring 120 is a scan line or a data line.
  • the color filter substrate 200 includes a second substrate 210 and a common electrode layer 220 provided on the second substrate 210. The two ends of the conductive glue 300 are respectively connected to the common electrode layer 220 and the insulating layer 130.
  • the conductive glue 300 is provided with a conductive ball 310 connected to the common electrode layer 220 and the insulating layer 130 at both ends.
  • the conductive ball 310 includes a resin material core and is wrapped in resin. Conductive metals outside the core of the material, such as nickel (Ni) or gold (Au).
  • the biggest problem of the conductive adhesive 300 in the use process is the electrostatic discharge (ESD) problem. Specifically, if there is no need to install the conductive adhesive 300 above the traces 120 of the array substrate in the design, the conductive adhesive 300 is limited.
  • the distance between the conductive glue 300 and the array substrate wiring 120 is longer than that between the array substrate wiring 120 and the common electrode layer 220.
  • the distance between the conductive adhesive 300 is much smaller, and the position where the conductive adhesive 300 is opposite to the array substrate trace 120 is likely to cause electrostatic discharge between different potentials, and the more severe the conductive adhesive 300 is squeezed, the more likely it is to cause electrostatic discharge.
  • the conductive ball 310 in the conductive adhesive 300 will crush the insulating layer 130 and contact the array substrate wiring 120, causing the array substrate wiring 120 and the common electrode layer 220 to be short-circuited, affecting the normality of the LCD panel. jobs.
  • the purpose of the present invention is to provide a conductive glue dropping system, which can effectively monitor the dropping position of the conductive glue.
  • Another object of the present invention is to provide a conductive glue dropping method, which can effectively monitor the dropping position of the conductive glue.
  • the present invention first provides a conductive glue dropping system, which includes a dripper, an induction coil sleeved on the dripper, and a processing unit electrically connected to the induction coil;
  • a conductive glue channel is provided in the dripper, and the outlet of the conductive glue channel is provided at one end of the dripper; the induction coil is located outside the end;
  • the drip head is used to drip conductive glue onto the substrate through the outlet of the conductive glue channel;
  • the processing unit energizes the induction coil, and obtains the position coordinates of the dripper when the current change on the induction coil is detected, and when the position coordinates are preset designated coordinates, it is determined that the dripper performs a normal dripping operation, Otherwise, it is determined that the dripper drips abnormally.
  • the conductive glue dropping system further includes an alarm unit electrically connected to the processing unit;
  • the processing unit controls the alarm unit to give an alarm when it is determined that the dripping abnormality occurs in the dripper.
  • the entrance of the conductive glue channel is arranged at the other end of the dripper.
  • the conductive glue dropping system further includes a conductive glue supply device that communicates with the entrance of the conductive glue channel through a conductive glue pipe;
  • the conductive glue providing device is used for transferring the conductive glue to the entrance of the conductive glue channel through the conductive glue pipe.
  • the dripper is in the shape of a truncated cone; the diameter of one end of the dripper with the outlet of the conductive glue channel is smaller than the diameter of the other end of the dripper.
  • the present invention also provides a conductive adhesive dropping method, which includes the following steps:
  • Step S1 providing a conductive glue dropping system and a substrate
  • the conductive glue dropping system includes a dripper, an induction coil sleeved on the dripper, and a processing unit electrically connected to the induction coil; the dripper is provided with a conductive glue channel, and the outlet of the conductive glue channel is set at One end of the dripper; the induction coil is located outside the one end;
  • Step S2 Set the substrate under the dripper; the processing unit energizes the induction coil;
  • Step S3 the dripper drips conductive glue onto the substrate from the outlet of the conductive glue channel;
  • Step S4 The processing unit detects the current change on the induction coil and obtains the position coordinates of the dripper. When the position coordinates are the preset designated coordinates, it is determined that the dripper is performing a normal dripping operation, otherwise it is determined that the dripper has occurred Dripping abnormally.
  • the conductive glue dropping system further includes an alarm unit electrically connected to the processing unit;
  • step S4 when the processing unit determines that the dripper has a dripping abnormality, the alarm unit is controlled to give an alarm.
  • the entrance of the conductive glue channel is arranged at the other end of the dripper.
  • the conductive glue dropping system further includes a conductive glue supply device that communicates with the entrance of the conductive glue channel through a conductive glue pipe;
  • the conductive glue providing device transmits the conductive glue to the entrance of the conductive glue channel through the conductive glue pipe.
  • the dripper is in the shape of a truncated cone; the diameter of one end of the dripper with the outlet of the conductive glue channel is smaller than the diameter of the other end of the dripper.
  • the conductive glue dropping system of the present invention is provided with an induction coil on the dripper, and a processing unit electrically connected to the induction coil, and the induction coil is located outside the end of the dripper with the outlet of the conductive glue channel ,
  • the processing unit energizes the induction coil to generate a magnetic field.
  • the processing unit obtains the position coordinates of the dripper .
  • the position coordinates are the preset designated coordinates, it is determined that the dripper is performing normal dripping operation, otherwise it is determined that the dripper is abnormally dripping, so as to alarm and effectively monitor the dripping position of the conductive glue.
  • the conductive glue dropping method of the present invention can effectively monitor the dropping position of the conductive glue.
  • FIG. 1 is a schematic diagram of the structure of an existing liquid crystal display panel
  • FIG. 2 is a schematic diagram of the structure of the conductive glue dropping system of the present invention.
  • FIG. 3 is a schematic cross-sectional view of the dripper and induction coil of the conductive glue dropping system of the present invention
  • Figure 4 is a flow chart of the conductive glue dropping method of the present invention.
  • FIG. 5 is a schematic diagram of step S3 of the conductive adhesive dropping method of the present invention.
  • the present invention provides a conductive glue dropping system, including a dripper 10, an induction coil 20 sleeved on the dripper 10, and a processing unit 30 electrically connected to the induction coil 20.
  • a conductive glue channel 11 is provided in the dripper 10, and an outlet 111 of the conductive glue channel 11 is provided at one end of the dripper 10.
  • the induction coil 20 is located outside the one end.
  • the drip head 10 is used to drip conductive glue onto the substrate 9 through the outlet 111 of the conductive glue channel 11.
  • the processing unit 30 energizes the induction coil 20, and obtains the position coordinates of the dripper 10 when the current change on the induction coil 20 is detected.
  • the position coordinates are preset designated coordinates, it is determined that the dripper 10 is performing Normal dripping operation, otherwise it is determined that the dripper 10 has dripping abnormality.
  • the conductive glue dropping system further includes an alarm unit 40 electrically connected to the processing unit 30.
  • the processing unit 30 controls the alarm unit 40 to give an alarm when it is determined that the dripper 10 has a dripping abnormality.
  • the entrance 112 of the conductive glue channel 11 is provided at the other end of the dripper 10.
  • the conductive glue dropping system further includes a conductive glue supply device 60 communicating with the inlet 112 of the conductive glue channel 11 through the conductive glue pipe 50.
  • the conductive glue supply device 60 is used to transfer the conductive glue to the entrance 112 of the conductive glue channel 11 through the conductive glue pipe 50.
  • the dripper 10 is in the shape of a truncated cone.
  • the diameter of one end of the dripper 10 with the outlet 111 of the conductive glue channel 11 is smaller than the diameter of the other end of the dripper 10.
  • an induction coil 20 is sleeved on the dripper 10, and a processing unit 30 electrically connected to the induction coil 20 is provided.
  • the induction coil 20 is located on the dripper 10 and has a conductive glue channel 11 Outside of one end of the outlet 111, the processing unit 30 energizes the induction coil 20 to generate a magnetic field.
  • the processing unit 30 energizes the induction coil 20 to generate a magnetic field.
  • the processing unit 30 acquires the dripper.
  • the position coordinate is the preset designated coordinate, it means that the position where the dripper 10 drops the conductive adhesive 8 on the substrate 9 is the designated position. At this time, it is determined that the dripper 10 is performing normal dripping operation.
  • the dripper 10 When it is not the preset designated coordinates, it means that the dripper 10 has performed abnormal dumping at a non-designated position. At this time, it is determined that the dripper is dripping abnormally, and the alarm unit 40 is controlled to give an alarm to alert the operator, which can effectively Monitor the dropping position of the conductive glue 8 to prevent the conductive glue 8 from dropping on the non-designated position of the substrate 9 so that when the substrate 9 with the conductive glue 8 is paired with other substrates, electrostatic discharge and short circuit occur at the position of the conductive glue 8 .
  • the present invention also provides a conductive glue dropping method, which includes the following steps:
  • Step S1 providing a conductive glue dropping system and a substrate 9.
  • the conductive glue dropping system includes a dripper 10, an induction coil 20 sheathed on the dripper 10, and a processing unit 30 electrically connected to the induction coil 20.
  • a conductive glue channel 11 is provided in the dripper 10, and an outlet 111 of the conductive glue channel 11 is provided at one end of the dripper 10.
  • the induction coil 20 is located outside the one end.
  • the substrate 9 may be an array substrate or a color filter substrate.
  • the conductive glue dropping system further includes an alarm unit 40 electrically connected to the processing unit 30.
  • the entrance 112 of the conductive glue channel 11 is provided at the other end of the dripper 10.
  • the conductive glue dropping system further includes a conductive glue supply device 60 communicating with the inlet 112 of the conductive glue channel 11 through the conductive glue pipe 50.
  • the dripper 10 is in the shape of a truncated cone.
  • the diameter of one end of the dripper 10 with the outlet 111 of the conductive glue channel 11 is smaller than the diameter of the other end of the dripper 10.
  • Step S2 placing the substrate 9 under the dripper 10.
  • the processing unit 30 energizes the induction coil 20 to generate a magnetic field.
  • Step S3. Please refer to FIG. 5.
  • the dripper 10 drips the conductive glue 8 from the outlet 111 of the conductive glue channel 11 to the substrate 9.
  • the conductive glue 8 will pass through the induction coil 20, causing a change in the magnetic field, resulting in a current on the induction coil 20 Variety.
  • the conductive glue supply device 60 passes through the conductive glue pipe 50 to the entrance of the conductive glue channel 11 112 transmission conductive glue 8.
  • Step S4 The processing unit 30 detects the current change on the induction coil 20, and obtains the position coordinates of the dripper 10.
  • the position coordinates are the preset designated coordinates, it means that the dripper 10 drops conductive glue on the substrate 9.
  • the position of 8 is the designated position. At this time, it is judged that the dripper 10 is performing the normal dripping operation.
  • the coordinate of the position is not the preset designated coordinate, it means that the dripper 10 has performed abnormal dumping at a non-designated position.
  • the alarm unit 40 is controlled to give an alarm to prompt the operator, which can effectively monitor the dripping position of the conductive adhesive 8 and prevent the conductive adhesive 8 from dripping on the non-designated position of the substrate 9 so that the conductive adhesive 8 will be subsequently conductive.
  • the substrate 9 of the adhesive 8 is paired with other substrates, electrostatic discharge and short-circuit occur at the position of the conductive adhesive 8.
  • an induction coil is sheathed on the dripper, and a processing unit electrically connected to the induction coil is provided.
  • the induction coil is located outside the end of the dripper with the outlet of the conductive glue channel.
  • the processing unit energizes the induction coil to generate a magnetic field.
  • the processing unit obtains the position coordinates of the dripper, When the position coordinates are the preset designated coordinates, it is determined that the dripper is performing a normal dripping operation, otherwise it is determined that the dripper is abnormally dripping, so as to alarm and effectively monitor the dripping position of the conductive glue.
  • the conductive glue dropping method of the present invention can effectively monitor the dropping position of the conductive glue.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
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Abstract

A conductive adhesive dripping system and a conductive adhesive dripping method. An induction coil (20) is sleeved on a dripper (10), and a processing unit (30) electrically connected to the induction coil (20) is provided; the induction coil (20) is located outside one end of the dripper (10) provided with an outlet (111) of a conductive adhesive channel (11); the processing unit (30) energizes the induction coil (20) so as to enable same to generate a magnetic field; when a conductive adhesive (8) drips from the outlet (111) of the conductive adhesive channel (11) of the dripper (10), the magnetic field is changed, causing a change in the current of the induction coil (20); and in this case, the processing unit (30) acquires the position coordinates of the dripper (10), and when the position coordinates are preset specified coordinates, determines that the dripper (10) performs a normal dripping operation, otherwise, determines that the dripping of the dripper (10) is abnormal, so as to give an alarm. The invention can effectively monitor the dripping position of the conductive adhesive (8).

Description

导电胶滴下系统及导电胶滴下方法Conductive glue dropping system and conductive glue dropping method 技术领域Technical field
本发明涉及显示技术领域，尤其涉及一种导电胶滴下系统及导电胶滴下方法。The invention relates to the field of display technology, in particular to a conductive glue dropping system and a conductive glue dropping method.
背景技术Background technique
在显示技术领域，液晶显示装置(Liquid Crystal Display，LCD)等平板显示装置已经逐步取代阴极射线管(Cathode Ray Tube，CRT)显示装置。液晶显示装置具有机身薄、省电、无辐射等众多优点，得到了广泛的应用。In the field of display technology, flat panel display devices such as liquid crystal display (Liquid Crystal Display, LCD) have gradually replaced cathode ray tubes (Cathode ray tubes). Ray Tube, CRT) display device. The liquid crystal display device has many advantages such as thin body, power saving, and no radiation, and has been widely used.
现有市场上的液晶显示装置大部分为背光型液晶显示装置，其包括液晶显示面板及背光模组(backlight module)。通常液晶显示面板由彩膜(Color Filter，CF)基板、薄膜晶体管(Thin Film Transistor，TFT)阵列基板、夹于彩膜基板与薄膜晶体管阵列基板之间的液晶(Liquid Crystal，LC)及密封胶框(Sealant)组成。液晶显示面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，两片玻璃基板中间有许多垂直和水平的细小电线，通过通电与否来控制液晶分子改变方向，将背光模组的光线折射出来产生画面。Most of the liquid crystal display devices currently on the market are backlight liquid crystal display devices, which include a liquid crystal display panel and a backlight module. Usually the LCD panel is composed of a color filter (CF) substrate, thin film transistor (Thin Film Transistor (TFT) array substrate, liquid crystal (LC) sandwiched between the color filter substrate and the thin film transistor array substrate, and a sealant frame (Sealant). The working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates. The liquid crystal molecules are controlled to change direction by powering on or not, and the light of the backlight module Refraction produces a picture.
请参阅图1，为现有的一种液晶显示面板，该液晶显示面板包括相对设置的阵列基板100及彩膜基板200以及设于阵列基板100与彩膜基板200之间的导电胶300。所述阵列基板100包括第一衬底110、设于第一衬底110上的阵列基板走线120、覆盖第一衬底110及阵列基板走线120的绝缘层130。阵列基板走线120为扫描线或数据线。所述彩膜基板200包括第二衬底210及设于第二衬底210上的公共电极层220。导电胶300两端分别连接公共电极层220及绝缘层130，导电胶300中设置有两端分别连接公共电极层220及绝缘层130的导电球310，导电球310包括树脂材料内核及包裹在树脂材料内核外的导电金属，例如镍（Ni）或金（Au）。导电胶300在使用过程中最大的问题是静电放电（ESD）问题，具体来讲，若设计中阵列基板走线120的某处上方并不需要设置导电胶300，而受限于导电胶300的滴下制程，发生异常的甩胶使得导电胶300恰好位于阵列基板走线120的该处上方时，由于导电胶300与阵列基板走线120之间的距离较阵列基板走线120与公共电极层220之间的距离要小很多，在导电胶300与阵列基板走线120相对的位置处容易引起不同电位之间的静电放电现象，且导电胶300所受的挤压越严重越有可能导致静电放电现象的发生，严重时还会出现导电胶300中的导电球310压破绝缘层130与阵列基板走线120接触，致使阵列基板走线120与公共电极层220发生短路，影响液晶显示面板的正常工作。Please refer to FIG. 1, which shows an existing liquid crystal display panel. The liquid crystal display panel includes an array substrate 100 and a color filter substrate 200 arranged opposite to each other, and a conductive adhesive 300 disposed between the array substrate 100 and the color filter substrate 200. The array substrate 100 includes a first substrate 110, an array substrate wiring 120 provided on the first substrate 110, and an insulating layer 130 covering the first substrate 110 and the array substrate wiring 120. The array substrate wiring 120 is a scan line or a data line. The color filter substrate 200 includes a second substrate 210 and a common electrode layer 220 provided on the second substrate 210. The two ends of the conductive glue 300 are respectively connected to the common electrode layer 220 and the insulating layer 130. The conductive glue 300 is provided with a conductive ball 310 connected to the common electrode layer 220 and the insulating layer 130 at both ends. The conductive ball 310 includes a resin material core and is wrapped in resin. Conductive metals outside the core of the material, such as nickel (Ni) or gold (Au). The biggest problem of the conductive adhesive 300 in the use process is the electrostatic discharge (ESD) problem. Specifically, if there is no need to install the conductive adhesive 300 above the traces 120 of the array substrate in the design, the conductive adhesive 300 is limited. During the dropping process, when the conductive glue 300 is located just above the array substrate wiring 120 due to abnormal glue rejection, the distance between the conductive glue 300 and the array substrate wiring 120 is longer than that between the array substrate wiring 120 and the common electrode layer 220. The distance between the conductive adhesive 300 is much smaller, and the position where the conductive adhesive 300 is opposite to the array substrate trace 120 is likely to cause electrostatic discharge between different potentials, and the more severe the conductive adhesive 300 is squeezed, the more likely it is to cause electrostatic discharge. When the phenomenon is serious, the conductive ball 310 in the conductive adhesive 300 will crush the insulating layer 130 and contact the array substrate wiring 120, causing the array substrate wiring 120 and the common electrode layer 220 to be short-circuited, affecting the normality of the LCD panel. jobs.
技术问题technical problem
本发明的目的在于提供一种导电胶滴下系统，能够对导电胶的滴下位置进行有效的监控。The purpose of the present invention is to provide a conductive glue dropping system, which can effectively monitor the dropping position of the conductive glue.
本发明的另一目的在于提供一种导电胶滴下方法，能够对导电胶的滴下位置进行有效的监控。Another object of the present invention is to provide a conductive glue dropping method, which can effectively monitor the dropping position of the conductive glue.
技术解决方案Technical solutions
为实现上述目的，本发明首先提供一种导电胶滴下系统，包括滴头、套设于滴头上的感应线圈及与感应线圈电性连接的处理单元；To achieve the above objective, the present invention first provides a conductive glue dropping system, which includes a dripper, an induction coil sleeved on the dripper, and a processing unit electrically connected to the induction coil;
所述滴头内设有导电胶通道，所述导电胶通道的出口设于滴头的一端；所述感应线圈位于该一端的外侧；A conductive glue channel is provided in the dripper, and the outlet of the conductive glue channel is provided at one end of the dripper; the induction coil is located outside the end;
所述滴头用于经导电胶通道的出口向基板滴下导电胶；The drip head is used to drip conductive glue onto the substrate through the outlet of the conductive glue channel;
所述处理单元对感应线圈进行通电，并在侦测到感应线圈上的电流变化时获取滴头的位置坐标，当该位置坐标为预设的指定坐标时，判定滴头进行正常的滴下操作，否则判定滴头发生滴下异常。The processing unit energizes the induction coil, and obtains the position coordinates of the dripper when the current change on the induction coil is detected, and when the position coordinates are preset designated coordinates, it is determined that the dripper performs a normal dripping operation, Otherwise, it is determined that the dripper drips abnormally.
所述导电胶滴下系统还包括与处理单元电性连接的报警单元；The conductive glue dropping system further includes an alarm unit electrically connected to the processing unit;
所述处理单元在判定滴头发生滴下异常时控制报警单元进行报警。The processing unit controls the alarm unit to give an alarm when it is determined that the dripping abnormality occurs in the dripper.
所述导电胶通道的入口设于滴头的另一端。The entrance of the conductive glue channel is arranged at the other end of the dripper.
所述导电胶滴下系统还包括经导电胶管道与导电胶通道的入口连通的导电胶提供装置；The conductive glue dropping system further includes a conductive glue supply device that communicates with the entrance of the conductive glue channel through a conductive glue pipe;
所述导电胶提供装置用于经导电胶管道向导电胶通道的入口传输导电胶。The conductive glue providing device is used for transferring the conductive glue to the entrance of the conductive glue channel through the conductive glue pipe.
所述滴头呈圆台状；所述滴头设有导电胶通道的出口的一端的直径小于所述滴头的另一端的直径。The dripper is in the shape of a truncated cone; the diameter of one end of the dripper with the outlet of the conductive glue channel is smaller than the diameter of the other end of the dripper.
本发明还提供一种导电胶滴下方法，包括如下步骤：The present invention also provides a conductive adhesive dropping method, which includes the following steps:
步骤S1、提供导电胶滴下系统及基板；Step S1, providing a conductive glue dropping system and a substrate;
所述导电胶滴下系统包括滴头、套设于滴头上的感应线圈及与感应线圈电性连接的处理单元；所述滴头内设有导电胶通道，所述导电胶通道的出口设于滴头的一端；所述感应线圈位于该一端的外侧； The conductive glue dropping system includes a dripper, an induction coil sleeved on the dripper, and a processing unit electrically connected to the induction coil; the dripper is provided with a conductive glue channel, and the outlet of the conductive glue channel is set at One end of the dripper; the induction coil is located outside the one end;
步骤S2、将基板设于滴头下方；所述处理单元对感应线圈进行通电；Step S2: Set the substrate under the dripper; the processing unit energizes the induction coil;
步骤S3、所述滴头由导电胶通道的出口向基板滴下导电胶；Step S3, the dripper drips conductive glue onto the substrate from the outlet of the conductive glue channel;
步骤S4、所述处理单元侦测到感应线圈上的电流变化，获取滴头的位置坐标，当该位置坐标为预设的指定坐标时，判定滴头进行正常的滴下操作，否则判定滴头发生滴下异常。Step S4. The processing unit detects the current change on the induction coil and obtains the position coordinates of the dripper. When the position coordinates are the preset designated coordinates, it is determined that the dripper is performing a normal dripping operation, otherwise it is determined that the dripper has occurred Dripping abnormally.
所述导电胶滴下系统还包括与处理单元电性连接的报警单元；The conductive glue dropping system further includes an alarm unit electrically connected to the processing unit;
所述步骤S4中当所述处理单元判定滴头发生滴下异常时控制报警单元进行报警。In the step S4, when the processing unit determines that the dripper has a dripping abnormality, the alarm unit is controlled to give an alarm.
所述导电胶通道的入口设于滴头的另一端。The entrance of the conductive glue channel is arranged at the other end of the dripper.
所述导电胶滴下系统还包括经导电胶管道与导电胶通道的入口连通的导电胶提供装置；The conductive glue dropping system further includes a conductive glue supply device that communicates with the entrance of the conductive glue channel through a conductive glue pipe;
所述步骤S3中在所述滴头由导电胶通道的出口向基板滴下导电胶之前，所述导电胶提供装置经导电胶管道向导电胶通道的入口传输导电胶。In the step S3, before the dripper drops the conductive glue from the outlet of the conductive glue channel to the substrate, the conductive glue providing device transmits the conductive glue to the entrance of the conductive glue channel through the conductive glue pipe.
所述滴头呈圆台状；所述滴头设有导电胶通道的出口的一端的直径小于所述滴头的另一端的直径。The dripper is in the shape of a truncated cone; the diameter of one end of the dripper with the outlet of the conductive glue channel is smaller than the diameter of the other end of the dripper.
有益效果Beneficial effect
本发明的有益效果：本发明的导电胶滴下系统在滴头上套设感应线圈，并设置与感应线圈电性连接的处理单元，感应线圈位于滴头设有导电胶通道的出口的一端的外侧，处理单元对感应线圈进行通电使其产生磁场，当有导电胶从滴头的导电胶通道的出口滴下时引起磁场变化，导致感应线圈上的电流变化，此时处理单元获取滴头的位置坐标，当该位置坐标为预设的指定坐标时，判定滴头进行正常滴下操作，否则判定滴头发生滴下异常，以便于进行报警，能够有效地对导电胶滴下的位置进行监控。本发明的导电胶滴下方法能够对导电胶的滴下位置进行有效的监控。The beneficial effects of the present invention: The conductive glue dropping system of the present invention is provided with an induction coil on the dripper, and a processing unit electrically connected to the induction coil, and the induction coil is located outside the end of the dripper with the outlet of the conductive glue channel , The processing unit energizes the induction coil to generate a magnetic field. When the conductive glue drips from the outlet of the conductive glue channel of the dripper, the magnetic field changes, which causes the current on the induction coil to change. At this time, the processing unit obtains the position coordinates of the dripper , When the position coordinates are the preset designated coordinates, it is determined that the dripper is performing normal dripping operation, otherwise it is determined that the dripper is abnormally dripping, so as to alarm and effectively monitor the dripping position of the conductive glue. The conductive glue dropping method of the present invention can effectively monitor the dropping position of the conductive glue.
附图说明Description of the drawings
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only provided for reference and illustration and are not used to limit the present invention.
附图中，In the attached picture,
图1为现有的液晶显示面板的结构示意图； FIG. 1 is a schematic diagram of the structure of an existing liquid crystal display panel;
图2为本发明的导电胶滴下系统的结构示意图；2 is a schematic diagram of the structure of the conductive glue dropping system of the present invention;
图3为本发明的导电胶滴下系统的滴头及感应线圈的剖视示意图； 3 is a schematic cross-sectional view of the dripper and induction coil of the conductive glue dropping system of the present invention;
图4为本发明的导电胶滴下方法的流程图；Figure 4 is a flow chart of the conductive glue dropping method of the present invention;
图5为本发明的导电胶滴下方法的步骤S3的示意图。FIG. 5 is a schematic diagram of step S3 of the conductive adhesive dropping method of the present invention.
本发明的实施方式Embodiments of the invention
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。In order to further explain the technical means adopted by the present invention and its effects, the following describes in detail the preferred embodiments of the present invention and the accompanying drawings.
请参阅图2及图3，本发明提供一种导电胶滴下系统，包括滴头10、套设于滴头10上的感应线圈20及与感应线圈20电性连接的处理单元30。Referring to FIGS. 2 and 3, the present invention provides a conductive glue dropping system, including a dripper 10, an induction coil 20 sleeved on the dripper 10, and a processing unit 30 electrically connected to the induction coil 20.
所述滴头10内设有导电胶通道11，所述导电胶通道11的出口111设于滴头10的一端。所述感应线圈20位于该一端的外侧。A conductive glue channel 11 is provided in the dripper 10, and an outlet 111 of the conductive glue channel 11 is provided at one end of the dripper 10. The induction coil 20 is located outside the one end.
所述滴头10用于经导电胶通道11的出口111向基板9滴下导电胶。The drip head 10 is used to drip conductive glue onto the substrate 9 through the outlet 111 of the conductive glue channel 11.
所述处理单元30对感应线圈20进行通电，并在侦测到感应线圈20上的电流变化时获取滴头10的位置坐标，当该位置坐标为预设的指定坐标时，判定滴头10进行正常的滴下操作，否则判定滴头10发生滴下异常。The processing unit 30 energizes the induction coil 20, and obtains the position coordinates of the dripper 10 when the current change on the induction coil 20 is detected. When the position coordinates are preset designated coordinates, it is determined that the dripper 10 is performing Normal dripping operation, otherwise it is determined that the dripper 10 has dripping abnormality.
进一步地，所述导电胶滴下系统还包括与处理单元30电性连接的报警单元40。所述处理单元30在判定滴头10发生滴下异常时控制报警单元40进行报警。Furthermore, the conductive glue dropping system further includes an alarm unit 40 electrically connected to the processing unit 30. The processing unit 30 controls the alarm unit 40 to give an alarm when it is determined that the dripper 10 has a dripping abnormality.
具体地，所述导电胶通道11的入口112设于滴头10的另一端。Specifically, the entrance 112 of the conductive glue channel 11 is provided at the other end of the dripper 10.
具体地，所述导电胶滴下系统还包括经导电胶管道50与导电胶通道11的入口112连通的导电胶提供装置60。所述导电胶提供装置60用于经导电胶管道50向导电胶通道11的入口112传输导电胶。Specifically, the conductive glue dropping system further includes a conductive glue supply device 60 communicating with the inlet 112 of the conductive glue channel 11 through the conductive glue pipe 50. The conductive glue supply device 60 is used to transfer the conductive glue to the entrance 112 of the conductive glue channel 11 through the conductive glue pipe 50.
优选地，所述滴头10呈圆台状。所述滴头10设有导电胶通道11的出口111的一端的直径小于所述滴头10的另一端的直径。Preferably, the dripper 10 is in the shape of a truncated cone. The diameter of one end of the dripper 10 with the outlet 111 of the conductive glue channel 11 is smaller than the diameter of the other end of the dripper 10.
需要说明的是，本发明的导电胶滴下系统在滴头10上套设感应线圈20，并设置与感应线圈20电性连接的处理单元30，感应线圈20位于滴头10设有导电胶通道11的出口111的一端的外侧，处理单元30对感应线圈20进行通电使其产生磁场，请参阅图5，利用导电胶滴下系统向为阵列基板或彩膜基板的基板9滴下导电胶8时，当有导电胶8从滴头10的导电胶通道11的出口111滴下时，导电胶8会穿过感应线圈20，引起磁场变化，导致感应线圈20上的电流变化，此时处理单元30获取滴头10的位置坐标，当该位置坐标为预设的指定坐标时，表示滴头10在基板9上滴下导电胶8的位置为指定位置，此时判定滴头10进行正常滴下操作，当该位置坐标不为预设的指定坐标时，则表示滴头10在非指定位置进行了异常甩胶，此时判定滴头发生滴下异常，并控制报警单元40进行报警对操作人员进行提示，能够有效地对导电胶8滴下的位置进行监控，防止导电胶8滴下在基板9的非指定位置上使得后续将具有导电胶8的基板9与其他基板进行对组时在导电胶8所在位置发生静电放电及短路。It should be noted that in the conductive glue dropping system of the present invention, an induction coil 20 is sleeved on the dripper 10, and a processing unit 30 electrically connected to the induction coil 20 is provided. The induction coil 20 is located on the dripper 10 and has a conductive glue channel 11 Outside of one end of the outlet 111, the processing unit 30 energizes the induction coil 20 to generate a magnetic field. Please refer to Figure 5. When the conductive glue 8 is dropped on the substrate 9 which is the array substrate or the color film substrate by the conductive glue dropping system, when When the conductive glue 8 is dropped from the outlet 111 of the conductive glue channel 11 of the dripper 10, the conductive glue 8 will pass through the induction coil 20, causing a change in the magnetic field, resulting in a change in the current on the induction coil 20, and the processing unit 30 acquires the dripper. The position coordinate of 10. When the position coordinate is the preset designated coordinate, it means that the position where the dripper 10 drops the conductive adhesive 8 on the substrate 9 is the designated position. At this time, it is determined that the dripper 10 is performing normal dripping operation. When it is not the preset designated coordinates, it means that the dripper 10 has performed abnormal dumping at a non-designated position. At this time, it is determined that the dripper is dripping abnormally, and the alarm unit 40 is controlled to give an alarm to alert the operator, which can effectively Monitor the dropping position of the conductive glue 8 to prevent the conductive glue 8 from dropping on the non-designated position of the substrate 9 so that when the substrate 9 with the conductive glue 8 is paired with other substrates, electrostatic discharge and short circuit occur at the position of the conductive glue 8 .
基于同一发明构思，请参阅图4，本发明还提供一种导电胶滴下方法，包括如下步骤：Based on the same inventive concept, please refer to FIG. 4. The present invention also provides a conductive glue dropping method, which includes the following steps:
步骤S1、提供导电胶滴下系统及基板9。Step S1, providing a conductive glue dropping system and a substrate 9.
所述导电胶滴下系统包括滴头10、套设于滴头10上的感应线圈20及与感应线圈20电性连接的处理单元30。所述滴头10内设有导电胶通道11，所述导电胶通道11的出口111设于滴头10的一端。所述感应线圈20位于该一端的外侧。 The conductive glue dropping system includes a dripper 10, an induction coil 20 sheathed on the dripper 10, and a processing unit 30 electrically connected to the induction coil 20. A conductive glue channel 11 is provided in the dripper 10, and an outlet 111 of the conductive glue channel 11 is provided at one end of the dripper 10. The induction coil 20 is located outside the one end.
具体地，该基板9可以为阵列基板，也可以为彩膜基板。Specifically, the substrate 9 may be an array substrate or a color filter substrate.
具体地，所述导电胶滴下系统还包括与处理单元30电性连接的报警单元40。Specifically, the conductive glue dropping system further includes an alarm unit 40 electrically connected to the processing unit 30.
具体地，所述导电胶通道11的入口112设于滴头10的另一端。Specifically, the entrance 112 of the conductive glue channel 11 is provided at the other end of the dripper 10.
进一步地，所述导电胶滴下系统还包括经导电胶管道50与导电胶通道11的入口112连通的导电胶提供装置60。Further, the conductive glue dropping system further includes a conductive glue supply device 60 communicating with the inlet 112 of the conductive glue channel 11 through the conductive glue pipe 50.
优选地，所述滴头10呈圆台状。所述滴头10设有导电胶通道11的出口111的一端的直径小于所述滴头10的另一端的直径。Preferably, the dripper 10 is in the shape of a truncated cone. The diameter of one end of the dripper 10 with the outlet 111 of the conductive glue channel 11 is smaller than the diameter of the other end of the dripper 10.
步骤S2、将基板9设于滴头10下方。所述处理单元30对感应线圈20进行通电使其产生磁场。Step S2, placing the substrate 9 under the dripper 10. The processing unit 30 energizes the induction coil 20 to generate a magnetic field.
步骤S3、请参阅图5，所述滴头10由导电胶通道11的出口111向基板9滴下导电胶8，导电胶8会穿过感应线圈20，引起磁场变化，导致感应线圈20上的电流变化。Step S3. Please refer to FIG. 5. The dripper 10 drips the conductive glue 8 from the outlet 111 of the conductive glue channel 11 to the substrate 9. The conductive glue 8 will pass through the induction coil 20, causing a change in the magnetic field, resulting in a current on the induction coil 20 Variety.
具体地，所述步骤S3中在所述滴头10由导电胶通道11的出口111向基板9滴下导电胶8之前，所述导电胶提供装置60经导电胶管道50向导电胶通道11的入口112传输导电胶8。Specifically, in the step S3, before the dripper 10 drops the conductive glue 8 from the outlet 111 of the conductive glue channel 11 to the substrate 9, the conductive glue supply device 60 passes through the conductive glue pipe 50 to the entrance of the conductive glue channel 11 112 transmission conductive glue 8.
步骤S4、所述处理单元30侦测到感应线圈20上的电流变化，获取滴头10的位置坐标，当该位置坐标为预设的指定坐标时，表示滴头10在基板9上滴下导电胶8的位置为指定位置，此时判定滴头10进行正常滴下操作，当该位置坐标不为预设的指定坐标时，则表示滴头10在非指定位置进行了异常甩胶，此时判定滴头发生滴下异常，并控制报警单元40进行报警对操作人员进行提示，能够有效地对导电胶8滴下的位置进行监控，防止导电胶8滴下在基板9的非指定位置上使得后续将该具有导电胶8的基板9与其他基板进行对组时在导电胶8所在位置发生静电放电及短路。Step S4: The processing unit 30 detects the current change on the induction coil 20, and obtains the position coordinates of the dripper 10. When the position coordinates are the preset designated coordinates, it means that the dripper 10 drops conductive glue on the substrate 9. The position of 8 is the designated position. At this time, it is judged that the dripper 10 is performing the normal dripping operation. When the coordinate of the position is not the preset designated coordinate, it means that the dripper 10 has performed abnormal dumping at a non-designated position. The head drips abnormally, and the alarm unit 40 is controlled to give an alarm to prompt the operator, which can effectively monitor the dripping position of the conductive adhesive 8 and prevent the conductive adhesive 8 from dripping on the non-designated position of the substrate 9 so that the conductive adhesive 8 will be subsequently conductive. When the substrate 9 of the adhesive 8 is paired with other substrates, electrostatic discharge and short-circuit occur at the position of the conductive adhesive 8.
综上所述，本发明的导电胶滴下系统在滴头上套设感应线圈，并设置与感应线圈电性连接的处理单元，感应线圈位于滴头设有导电胶通道的出口的一端的外侧，处理单元对感应线圈进行通电使其产生磁场，当有导电胶从滴头的导电胶通道的出口滴下时引起磁场变化，导致感应线圈上的电流变化，此时处理单元获取滴头的位置坐标，当该位置坐标为预设的指定坐标时，判定滴头进行正常滴下操作，否则判定滴头发生滴下异常，以便于进行报警，能够有效地对导电胶滴下的位置进行监控。本发明的导电胶滴下方法能够对导电胶的滴下位置进行有效的监控。To sum up, in the conductive glue dropping system of the present invention, an induction coil is sheathed on the dripper, and a processing unit electrically connected to the induction coil is provided. The induction coil is located outside the end of the dripper with the outlet of the conductive glue channel. The processing unit energizes the induction coil to generate a magnetic field. When the conductive glue drips from the outlet of the conductive glue channel of the dripper, the magnetic field changes, which causes the current on the induction coil to change. At this time, the processing unit obtains the position coordinates of the dripper, When the position coordinates are the preset designated coordinates, it is determined that the dripper is performing a normal dripping operation, otherwise it is determined that the dripper is abnormally dripping, so as to alarm and effectively monitor the dripping position of the conductive glue. The conductive glue dropping method of the present invention can effectively monitor the dropping position of the conductive glue.
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。As mentioned above, for those of ordinary skill in the art, various other corresponding changes and modifications can be made according to the technical solutions and technical ideas of the present invention, and all these changes and modifications shall fall within the protection scope of the claims of the present invention. .

Claims (10)

  1. 一种导电胶滴下系统，包括滴头、套设于滴头上的感应线圈及与感应线圈电性连接的处理单元；A conductive glue dropping system includes a dripper, an induction coil sheathed on the dripper, and a processing unit electrically connected to the induction coil;
    所述滴头内设有导电胶通道，所述导电胶通道的出口设于滴头的一端；所述感应线圈位于该一端的外侧；A conductive glue channel is provided in the dripper, and the outlet of the conductive glue channel is provided at one end of the dripper; the induction coil is located outside the end;
    所述滴头用于经导电胶通道的出口向基板滴下导电胶；The drip head is used to drip conductive glue onto the substrate through the outlet of the conductive glue channel;
    所述处理单元对感应线圈进行通电，并在侦测到感应线圈上的电流变化时获取滴头的位置坐标，当该位置坐标为预设的指定坐标时，判定滴头进行正常的滴下操作，否则判定滴头发生滴下异常。The processing unit energizes the induction coil, and obtains the position coordinates of the dripper when the current change on the induction coil is detected, and when the position coordinates are preset designated coordinates, it is determined that the dripper performs a normal dripping operation, Otherwise, it is determined that the dripper drips abnormally.
  2. 如权利要求1所述的导电胶滴下系统，还包括与处理单元电性连接的报警单元；5. The conductive glue dropping system according to claim 1, further comprising an alarm unit electrically connected to the processing unit;
    所述处理单元在判定滴头发生滴下异常时控制报警单元进行报警。The processing unit controls the alarm unit to give an alarm when it is determined that the dripper has a dripping abnormality.
  3. 如权利要求1所述的导电胶滴下系统，其中，所述导电胶通道的入口设于滴头的另一端。7. The conductive glue dropping system of claim 1, wherein the entrance of the conductive glue channel is provided at the other end of the dripper.
  4. 如权利要求3所述的导电胶滴下系统，还包括经导电胶管道与导电胶通道的入口连通的导电胶提供装置；The conductive glue dropping system according to claim 3, further comprising a conductive glue supply device connected to the entrance of the conductive glue channel via a conductive glue pipe;
    所述导电胶提供装置用于经导电胶管道向导电胶通道的入口传输导电胶。The conductive glue providing device is used for transferring the conductive glue to the entrance of the conductive glue channel through the conductive glue pipe.
  5. 如权利要求1所述的导电胶滴下系统，其中，所述滴头呈圆台状；所述滴头设有导电胶通道的出口的一端的直径小于所述滴头的另一端的直径。3. The conductive glue dropping system according to claim 1, wherein the dripper is in the shape of a truncated cone; the diameter of one end of the dripper with the outlet of the conductive glue channel is smaller than the diameter of the other end of the dripper.
  6. 一种导电胶滴下方法，包括如下步骤：A method for dropping conductive adhesive includes the following steps:
    步骤S1、提供导电胶滴下系统及基板；Step S1, providing a conductive glue dropping system and a substrate;
    所述导电胶滴下系统包括滴头、套设于滴头上的感应线圈及与感应线圈电性连接的处理单元；所述滴头内设有导电胶通道，所述导电胶通道的出口设于滴头的一端；所述感应线圈位于该一端的外侧； The conductive glue dropping system includes a dripper, an induction coil sleeved on the dripper, and a processing unit electrically connected to the induction coil; the dripper is provided with a conductive glue channel, and the outlet of the conductive glue channel is set at One end of the dripper; the induction coil is located outside the one end;
    步骤S2、将基板设于滴头下方；所述处理单元对感应线圈进行通电；Step S2: Set the substrate under the dripper; the processing unit energizes the induction coil;
    步骤S3、所述滴头由导电胶通道的出口向基板滴下导电胶；Step S3, the dripper drips conductive glue onto the substrate from the outlet of the conductive glue channel;
    步骤S4、所述处理单元侦测到感应线圈上的电流变化，获取滴头的位置坐标，当该位置坐标为预设的指定坐标时，判定滴头进行正常的滴下操作，否则判定滴头发生滴下异常。Step S4. The processing unit detects the current change on the induction coil and obtains the position coordinates of the dripper. When the position coordinates are the preset designated coordinates, it is determined that the dripper is performing a normal dripping operation, otherwise it is determined that the dripper has occurred Dripping abnormally.
  7. 如权利要求6所述的导电胶滴下方法，其中，所述导电胶滴下系统还包括与处理单元电性连接的报警单元；7. The conductive glue dropping method according to claim 6, wherein the conductive glue dropping system further comprises an alarm unit electrically connected to the processing unit;
    所述步骤S4中当所述处理单元判定滴头发生滴下异常时控制报警单元进行报警。In the step S4, when the processing unit determines that the dripper has a dripping abnormality, the alarm unit is controlled to give an alarm.
  8. 如权利要求6所述的导电胶滴下方法，其中，所述导电胶通道的入口设于滴头的另一端。7. The conductive glue dropping method according to claim 6, wherein the entrance of the conductive glue channel is provided at the other end of the dripper.
  9. 如权利要求8所述的导电胶滴下方法，其中，所述导电胶滴下系统还包括经导电胶管道与导电胶通道的入口连通的导电胶提供装置；8. The conductive glue dropping method according to claim 8, wherein the conductive glue dropping system further comprises a conductive glue supply device communicating with the entrance of the conductive glue channel through a conductive glue pipe;
    所述步骤S3中在所述滴头由导电胶通道的出口向基板滴下导电胶之前，所述导电胶提供装置经导电胶管道向导电胶通道的入口传输导电胶。In the step S3, before the dripper drops the conductive glue from the outlet of the conductive glue channel to the substrate, the conductive glue providing device transmits the conductive glue to the entrance of the conductive glue channel through the conductive glue pipe.
  10. 如权利要求6所述的导电胶滴下方法，其中，所述滴头呈圆台状；所述滴头设有导电胶通道的出口的一端的直径小于所述滴头的另一端的直径。7. The conductive glue dropping method according to claim 6, wherein the dripper has a truncated cone shape; the diameter of one end of the dripper with the outlet of the conductive glue channel is smaller than the diameter of the other end of the dripper.
PCT/CN2019/097666 2019-03-21 2019-07-25 Conductive adhesive dripping system and conductive adhesive dripping method WO2020186677A1 (en)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109799633B (en) * 2019-03-21 2020-09-01 深圳市华星光电技术有限公司 Conductive adhesive dripping system and conductive adhesive dripping method
CN114895488A (en) * 2022-06-10 2022-08-12 广州华立学院 Control method of conductive adhesive dripping system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05203558A (en) * 1992-01-24 1993-08-10 Fujitsu Ltd Method for counting dispersion object and manufacture of liquid crystal panel using it
CN1444081A (en) * 2002-03-08 2003-09-24 Lg.菲利浦Lcd株式会社 Device for controlling liquid crystal distribution and method for making liquid crystal display
JP2004020966A (en) * 2002-06-17 2004-01-22 Kyoei Seigyo Kiki Kk Method and device for applying sealing agent to liquid crystal cell
JP2005122027A (en) * 2003-10-20 2005-05-12 Nec Engineering Ltd Display panel sealing apparatus
JP2006267603A (en) * 2005-03-24 2006-10-05 Ulvac Japan Ltd Spacer coating device and spacer coating method
CN1892312A (en) * 2005-06-30 2007-01-10 Lg.菲利浦Lcd株式会社 Liquid crystal display device and fabrication method thereof
JP2014085526A (en) * 2012-10-24 2014-05-12 Kyocera Corp Seal coating device
CN109799633A (en) * 2019-03-21 2019-05-24 深圳市华星光电技术有限公司 Method that conducting resinl drips system and conducting resinl drips

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060082641A (en) * 2005-01-13 2006-07-19 삼성전자주식회사 Liquid crystal dropping amount measuring system and method
KR101471356B1 (en) * 2008-07-28 2014-12-10 주식회사 탑 엔지니어링 Method for verifying dropping of a liquid crytal droplet and liquid crystal dispenser implementing the same
KR100964949B1 (en) * 2008-07-30 2010-06-21 주식회사 탑 엔지니어링 Method for counting the number of liquid crytal droplet
CN102460289B (en) * 2009-05-25 2015-03-25 夏普株式会社 Liquid crystal dropping apparatus and method for monitoring dropping of liquid crystal
KR20100131314A (en) * 2009-06-05 2010-12-15 주식회사 탑 엔지니어링 Method for dispensing paste and substrate having paste pattern formed by using the method
KR20110062654A (en) * 2009-12-03 2011-06-10 주식회사 탑 엔지니어링 Method for locating a position where a droplet of liquid crystal did not drop and method for dropping a droplet of liquid crystal to the position
KR101392437B1 (en) * 2012-05-07 2014-05-07 주식회사 탑 엔지니어링 Method for detecting faulty discharge of liquid crystal
EP3020257B1 (en) * 2013-07-11 2019-12-11 OCE-Technologies B.V. Method for jetting droplets of an electrically conductive fluid and jetting device
CN103909040B (en) * 2014-03-28 2016-08-17 京东方科技集团股份有限公司 Glue spreading apparatus and glue spreading method
JP2017163755A (en) * 2016-03-10 2017-09-14 株式会社明電舎 Rotary electric machine
CN206240727U (en) * 2016-09-12 2017-06-13 东莞市荣旭自动化科技有限公司 Fingerprint button module soft arranging wire glue applying mechanism
CN108993830B (en) * 2018-08-17 2020-11-27 京东方科技集团股份有限公司 Filler dripping device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05203558A (en) * 1992-01-24 1993-08-10 Fujitsu Ltd Method for counting dispersion object and manufacture of liquid crystal panel using it
CN1444081A (en) * 2002-03-08 2003-09-24 Lg.菲利浦Lcd株式会社 Device for controlling liquid crystal distribution and method for making liquid crystal display
JP2004020966A (en) * 2002-06-17 2004-01-22 Kyoei Seigyo Kiki Kk Method and device for applying sealing agent to liquid crystal cell
JP2005122027A (en) * 2003-10-20 2005-05-12 Nec Engineering Ltd Display panel sealing apparatus
JP2006267603A (en) * 2005-03-24 2006-10-05 Ulvac Japan Ltd Spacer coating device and spacer coating method
CN1892312A (en) * 2005-06-30 2007-01-10 Lg.菲利浦Lcd株式会社 Liquid crystal display device and fabrication method thereof
JP2014085526A (en) * 2012-10-24 2014-05-12 Kyocera Corp Seal coating device
CN109799633A (en) * 2019-03-21 2019-05-24 深圳市华星光电技术有限公司 Method that conducting resinl drips system and conducting resinl drips

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