WO2020177412A1 - 图像传感器及其制备方法、图像识别方法、电子设备 - Google Patents

图像传感器及其制备方法、图像识别方法、电子设备 Download PDF

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Publication number
WO2020177412A1
WO2020177412A1 PCT/CN2019/122025 CN2019122025W WO2020177412A1 WO 2020177412 A1 WO2020177412 A1 WO 2020177412A1 CN 2019122025 W CN2019122025 W CN 2019122025W WO 2020177412 A1 WO2020177412 A1 WO 2020177412A1
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image
sensor
sensor unit
layer
recognition
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PCT/CN2019/122025
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English (en)
French (fr)
Inventor
姜迪
王腾
张大龙
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苏州多感科技有限公司
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Priority to JP2021529710A priority Critical patent/JP7105014B2/ja
Priority to KR1020217018819A priority patent/KR102548007B1/ko
Priority to US17/298,311 priority patent/US20220004792A1/en
Publication of WO2020177412A1 publication Critical patent/WO2020177412A1/zh

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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
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Definitions

  • the embodiments of the present application relate to the technical field of image sensors, such as an image sensor and a preparation method thereof, an image recognition method, and electronic equipment.
  • the image sensor converts optical images into electrical signals.
  • image sensors With the development of the computer and communication industries, there is an increasing need for high-performance image sensors in various fields such as digital cameras, video cameras, personal communication systems (PCS), game consoles, cameras, and medical micro cameras.
  • PCS personal communication systems
  • an image sensor may include an image sensor chip and a lens covering the image sensor chip.
  • the imaged object is imaged on the image sensor chip through the lens, and then the image sensor is controlled by a control unit arranged on the periphery of the image sensor chip.
  • the chip is exposed to convert light signals into electrical signals, thereby obtaining an image of the imaged object.
  • the image sensor in the related art requires a larger area of the image sensor chip. Due to the high price of the image sensor chip, the cost of the image sensor is higher.
  • the embodiments of the present application provide an image sensor, a manufacturing method thereof, an image recognition method, and an electronic device, so as to avoid the high manufacturing cost of the image sensor in the related art.
  • an embodiment of the present application provides an image sensor, including: a sensor unit array, the sensor unit array includes a plurality of sensor units, a plurality of the sensor unit arrays are arranged; each sensor unit is configured as A partial size image of the imaging object is generated, and each sensor unit includes at least one interconnection structure; an encapsulation layer covering the sensor unit array, the encapsulation layer exposing the interconnection structure of each sensor unit; The rewiring layer on the side of the encapsulation layer, the rewiring layer is electrically connected to the interconnection structure; the circuit board on the side of the rewiring layer away from the encapsulation layer, the circuit board and the rewiring layer Electric connection.
  • an embodiment of the present application also provides a method for manufacturing an image sensor, including: providing a base substrate; forming a sensor unit array on the base substrate, the sensor unit array including a plurality of sensor units, A plurality of the sensor units are arranged in an array; each sensor unit is configured to generate a partial size image of an imaging object, and each sensor unit includes at least one interconnection structure; an encapsulation layer is prepared on the base substrate, The packaging layer covers the sensor unit array and exposes the interconnection structure of each sensor unit; a rewiring layer is prepared on the side of the packaging layer away from the base substrate, and the rewiring layer is connected to The interconnection structure is electrically connected; a circuit board is prepared on the side of the redistribution layer away from the encapsulation layer, and the circuit board is electrically connected to the redistribution layer.
  • an embodiment of the present application also provides an image recognition method, using the image sensor provided in the first aspect, including: acquiring multiple partial size recognition images generated by the sensor unit array; and recognizing images based on the multiple partial sizes , Acquiring the position information of at least two image feature points; according to the position information of the at least two image feature points, using an image feature point recognition algorithm to recognize the recognition image collected by the image sensor.
  • an embodiment of the present application also provides an electronic device, including the image sensor provided in the first aspect.
  • FIG. 1 is a schematic structural diagram of an image sensor provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a sensor unit provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of an imaging principle of an image sensor provided by an embodiment of the present application.
  • FIG. 12 is a schematic diagram of the principle of taking pictures of an image sensor according to an embodiment of the present application.
  • FIG. 13 is a schematic flowchart of an image recognition method provided by an embodiment of the present application.
  • FIG. 14 is a schematic diagram of the principle of an image recognition method provided by an embodiment of the present application.
  • 15 is a schematic diagram of the imaging principle of the image sensor to recognize the face image provided by an embodiment of the present application.
  • FIG. 16 is a schematic diagram of a drawing principle of a face image recognition by an image sensor according to an embodiment of the present application.
  • FIG. 17 is a schematic flowchart of an image sensor manufacturing method according to an embodiment of the present application.
  • 18-24 are schematic structural diagrams of various steps of an image sensor manufacturing method provided by an embodiment of the present application.
  • An embodiment of the present application provides an image sensor, including: a sensor unit array, the sensor unit array includes a plurality of sensor units, the plurality of sensor unit arrays are arranged; each sensor unit is configured to generate a partial size image of an imaging object, and each The sensor unit includes at least one interconnection structure; an encapsulation layer covering the sensor unit array, the encapsulation layer exposing the interconnection structure of each sensor unit; a redistribution layer on one side of the encapsulation layer, which is electrically connected to the interconnection structure; The wiring layer is away from the circuit board on the side of the packaging layer, and the circuit board is electrically connected to the rewiring layer.
  • the image sensor includes a sensor unit array, the sensor unit array includes a plurality of sensor units, and by setting the sensor includes a plurality of sensor units arranged in an array, each sensor unit generates a partial size image of the imaging object, which is compared with the whole
  • the sensor chip provided on the chip can save the coverage area of the sensor chip, and can effectively reduce the total volume of the entire image sensor without affecting the imaging quality, easy to realize the miniaturization design of the image sensor, and save the preparation cost of the image sensor ;
  • each sensor unit includes at least one interconnection structure, the entire sensor unit array is connected to the circuit board through the interconnection structure and the rewiring layer, and the entire image sensor is packaged using a fan-out process to ensure a good packaging effect.
  • FIG. 1 is a schematic structural diagram of an image sensor provided by an embodiment of the present application.
  • the image sensor provided by an embodiment of the present application may include: a sensor unit array 10, which includes a plurality of sensor units 101 , A plurality of sensor units 101 are arranged in an array; each sensor unit 101 is configured to generate a partial size image of an imaging object, and each sensor unit 101 includes at least one interconnection structure 1014; an encapsulation layer 20 covering the sensor unit array 10, The encapsulation layer 20 exposes the interconnection structure 1014 of each sensor unit 101; the redistribution layer 30 on the side of the encapsulation layer 20 is electrically connected to the interconnection structure 1014; the redistribution layer 30 is located on the side away from the encapsulation layer 20 The circuit board 40 is electrically connected to the redistribution layer 30.
  • the image sensor provided by an embodiment of the present application may include a sensor unit array 10, a plurality of sensor units 101 in the sensor unit array 10 are arranged in an array, and each sensor unit 101 generates a partial size image of an imaging object,
  • the embodiment of the invention creatively applies the concept of "splitting into parts" to the image sensor, and applies the image sensor chip designed on the entire surface in the related technology.
  • the sensor unit array 10 includes a plurality of independently arranged sensor units 101, and each sensor unit 101 generates a partial size image of an imaging object.
  • the technical solutions of the embodiments of the present application can reduce the coverage area of the image sensor chip and save the manufacturing cost of the image sensor.
  • each sensor unit 101 includes at least one interconnection structure 1014, and each interconnection structure 1014 is electrically connected to the redistribution layer 30, and the redistribution layer 30 is connected to the circuit board 40 ,
  • the electrical connection relationship between the sensor unit 101 and the circuit board is realized through the interconnection structure 1014 and the rewiring layer 30.
  • the graph line sensor in the embodiment of the present application is packaged using a fan-out process. Compared with the way that the sensor unit 101 is directly connected to the circuit board 40 through wires, more sensor units 101 can be integrated in the image sensor, and the integration flexibility is good. ; And can ensure that the image sensor packaging effect is good.
  • the image sensor provided by the embodiment of the present application includes a plurality of sensor units arranged in an array, and each sensor unit generates a partial size image of the imaged object. Compared with the sensor chip provided in the whole chip, the sensor can be saved. The coverage area of the chip can effectively reduce the total volume of the entire image sensor without affecting the imaging quality, easy to realize the miniaturization design of the image sensor, and save the preparation cost of the image sensor; at the same time, each sensor unit includes at least An interconnection structure, the entire sensor unit array is connected to the circuit board through a rewiring layer, and the entire image sensor is packaged by fan-out technology to ensure a good packaging effect.
  • FIG. 2 is a schematic structural diagram of a sensor unit provided by an embodiment of the present application.
  • the sensor unit 101 provided by an embodiment of the present application may further include a package cover 1011; a sensor chip 1012 located on one side of the package cover 1011
  • the sensor chip 1012 is configured to generate a partial size image of the imaging object; at least one optical element 1013 is located on the photosensitive side of the sensor chip 1012, and the optical element 1013 is configured to receive part of the incident light of the imaging object and image part of the incident light on the sensor chip ⁇ 1012.
  • the packaging cover 1011 may be a flexible substrate, and its material may include polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyarylate, and poly At least one of ether sulfone; the package cover 1011 may also be a rigid substrate, for example, a silicon wafer, a glass substrate or other rigid substrates.
  • the embodiment of the application does not limit the type and material of the substrate.
  • the optical element 1013 is arranged corresponding to each sensor chip 1012. When the image sensor is working, the optical element 1013 receives part of the incident light from the imaging object and images the part of the incident light on the corresponding sensor chip 1012, and the sensor chip 1012 generates a partial size image of the imaging object.
  • the distance u between the optical element 1013 and the sensor chip 1012 can be adjusted so that the image area is smaller than the object area by a certain multiple, and the size of the sensor chip 1012 is controlled. This provides a degree of freedom for the design of the sensor chip 1012 and ensures that the size of each sensor chip 1012 is flexible.
  • the optical element 1013 may be located between the film layer where the package cover 1011 is located and the film layer where the sensor chip 1012 is located, as shown in FIG. 2; or the optical element 1013 may also be located on a side of the package cover 1011 away from the sensor chip. Side 1012, as shown in FIG. 3, is not limited in comparison with the embodiments of the present application.
  • each sensor chip 1012 may correspond to at least one optical element 1013.
  • FIG. 2 uses an example in which each sensor chip 1012 may correspond to one optical element 1013.
  • FIG. 4 uses each sensor chip 1012 to correspond to two optical elements.
  • the optical element 1013 is described as an example, which is not limited in the embodiment of the present application.
  • the interconnection structure 1014 may include at least one of metal solder balls, metal pads, and metal bumps, which is not limited in the embodiment of the present application, and the interconnection structure 1014 only needs to satisfy electrical and mechanical connections. That is, the drawings in the embodiments of the present application only take the interconnection structure 1014 as a metal solder ball as an example for illustration.
  • Figures 5, 6 and 7 are all schematic structural diagrams of another display panel provided by an embodiment of the present application.
  • the sensor unit provided by the embodiment of the present application may also include
  • the coating 1015 on at least one surface of the package cover 1011 has an opening formed in the coating 1015; the vertical projection of the opening on the plane of the package cover 1011 and the vertical projection of the optical element 1013 on the plane of the package cover 1011 exist Overlapping area.
  • FIG. 5 takes the coating 1015 provided on the side of the package cover 1011 facing the sensor chip 1012 as an example for illustration
  • FIG. 6 takes the coating 1015 provided on the side of the package cover 1011 away from the sensor chip 1012 as an example.
  • FIG. 7 takes the coating 1015 provided on both sides of the package cover plate 1011 as an example for illustration.
  • a coating 1015 is provided on at least one surface of the package cover 1011, and an opening is formed in the coating 1015.
  • the vertical projection of the element 1013 on the plane where the package cover 1011 is located has an overlapping area to ensure that a specific aperture is formed through the coating 1015 and the opening in the coating 1015, and the light emitted by the imaging object reaches the optical element 1013 through the specific aperture. Ensure that interference light can be filtered out and the image quality of the image sensor can be enhanced.
  • the optical element 1013 may be at least one of a lens, an imaging hole, and a collimator.
  • Figures 1 to 7 take the optical element 1013 as a lens as an example.
  • FIGS. 8 and 9 take the optical element 1013 as an imaging hole as an example for description.
  • the sensor unit 101 provided by an embodiment of the present application may further include a gasket 1016, and the gasket 1016 is located on the film layer where the package cover 1011 is located and the film layer where the sensor chip 1012 is located. between.
  • a spacer 1016 is provided between the package cover 1011 and the sensor chip 1012, and the thickness of the spacer 1016 can be adjusted to achieve the purpose of adjusting the distance between the optical element 1013 and the sensor chip 1012, that is, the purpose of adjusting the image distance It is ensured that the sensor unit 101 provided by the embodiment of the present application is the sensor unit 101 with adjustable image distance, and the function of the sensor unit is flexible and diverse.
  • FIG. 10 is a schematic structural diagram of another sensor unit provided by an embodiment of the present application.
  • the sensor unit 101 may also not include the spacer 1016.
  • the sensor unit 101 provided is a sensor unit 101 with an adjustable image distance, and at the same time, the structure of the sensor unit 101 can be ensured to be simple.
  • the image sensor provided by the embodiment of the present application includes a sensor unit array 10, which includes a plurality of sensor units 101. Each sensor unit 101 generates a partial size image of an imaging object.
  • the entire sensor unit array 10 can The full-size image of the imaging object is generated, and the partial size image of the imaging object can also be generated, and the comparison of the embodiments of the present application is not limited.
  • the full-size image of the imaging object generated by the sensor unit array 10 is compared with the preset imaging object image to perform image recognition.
  • the application embodiment will not repeat this description; the embodiment of the application focuses on describing how to perform image recognition when the sensor unit array 10 generates a partial size image of an imaging object, which will be described below.
  • FIG. 11 is a schematic diagram of the imaging principle of an image sensor provided by an embodiment of the present application
  • FIG. 12 is a schematic diagram of the imaging principle of an image sensor provided by an embodiment of the present application, as shown in FIG. 11 and FIG. 12, the sensor unit 101
  • the imaging object coverage area S is formed based on the incident light of the imaging object, and the distance between the coverage areas S of two adjacent sensor units 101 is L, where L>0.
  • the embodiment of the present application creatively proposes an image recognition method using "image feature point recognition".
  • FIG. 13 is a schematic flowchart of an image recognition method provided by an embodiment of the present application.
  • FIG. 14 is a schematic diagram of the principle of an image recognition method provided by an embodiment of the present application. As shown in FIG. 13 and FIG. 14, the application is implemented
  • the image recognition method provided in the example may include step S110 to step S130.
  • step S110 a plurality of partial size recognition images generated by the sensor unit array are acquired.
  • a plurality of partial size recognition images generated by the sensor unit array are acquired, and this step is completed by the image sensor acquisition provided in the embodiment of the present application.
  • step S120 based on the multiple partial size recognition images, position information of at least two image feature points is acquired.
  • the recognition image finally collected by the image sensor is an array composed of multiple partial size recognition images, and each partial size recognition image has a certain probability to include feature points on the recognition image that can be used for recognition. , As the black dot in Figure 14.
  • each sensor cell array may include M rows and N columns of sensor cells, each sensor cell may include X rows and Y columns of pixels. Therefore, for an image feature point that falls within the coverage of the sensor unit, it can be represented by a coordinate (x, y, m, n, ⁇ ) in the feature space.
  • the fingerprint cross point is taken as the feature point of the image, and the angle at the position of the fingerprint cross point is taken as the feature angle of the image feature point as an example for illustration.
  • step S130 according to the location information of the at least two image feature points, an image feature point recognition algorithm is used to recognize the recognition image collected by the image sensor.
  • an image feature point recognition algorithm is used to recognize the recognition image collected by the image sensor.
  • the image feature point recognition algorithm can use the image feature point recognition algorithm known in the art.
  • the image feature point recognition algorithm can refer to the document “Direct gray-scale minutiae detection in fingerprints", doi:10.1109/TPAMI.2007.250596 "Pores and ridges High-resolution fingerprint matching using level 3 features", doi:10.1016/S0031-3203(98)00107-1 document “Fingerprint minutiae extraction from skeletonized binary images” and doi:10.1109/ICCACS.2015.7361357 The document “Extraction of high confidence minutiae points from fingerprint images”.
  • the image recognition method provided by the embodiment of the present application is based on the recognition image collected by the image sensor provided in the embodiment of the present application.
  • using an image feature point recognition algorithm to recognize the recognition image collected by the image sensor may include: calculating any two image feature points based on the location information of the at least two image feature points. The distance between image feature points; according to the distance between any two image feature points, the image feature point recognition algorithm is used to identify the recognition image collected by the image sensor.
  • each sensor unit in the entire sensor unit array since the position of each sensor unit in the entire sensor unit array is known, the collection of all image feature points located within the coverage of the sensor unit can be obtained with certainty.
  • the distance between each image feature point in the set can be calculated accurately.
  • the coordinates of the internal members of the entire image feature point set are unique and certain, and can be used by image recognition algorithms based on image feature points to realize the image recognition function.
  • the multiple partial size recognition images generated by the sensor unit array may further include: multiple acquisitions of multiple partial size entry images generated by the sensor unit array, generating partial size entry into the image library; entry according to the partial size Image library, using image stitching algorithm to generate full-size input images.
  • image recognition can generally be divided into two processes: image entry and image recognition.
  • image entry process the system can require the object to be entered to move multiple times in the image entry plane of the image sensor, and multiple acquisitions generated by the sensor unit array Enter images in multiple partial sizes, and generate partial sizes into the image library. Then enter the image library according to the partial size, and use the image stitching algorithm to cut and stitch the partial size of the entered image to generate a complete entry image that contains all the image feature point information.
  • the subsequent image recognition process based on the acquired recognition image containing part of the image feature points, it is compared with the input image containing all image feature points to perform image recognition.
  • the image recognition method provided in the embodiment of the application only takes fingerprint recognition as an example for description. It is understandable that the image distance of the sensor unit and the focal length of the optical element in the image sensor provided in the embodiment of the application are both Adjustable, so the object distance of the sensor unit in the embodiment of the application is also adjustable. Therefore, the image sensor provided in the embodiment of the application can also recognize objects with different object distances, for example, with a face recognition algorithm, the embodiment of the application provides The image sensor can realize face recognition, as shown in Figure 15 and Figure 16.
  • An embodiment of the present application also provides a method for manufacturing an image sensor. As shown in FIG. 17, the method for manufacturing an image sensor provided in an embodiment of the present application may include step S210 to step S250.
  • step S210 a base substrate is provided.
  • FIG. 18 is a schematic diagram of the structure of preparing a base substrate provided by an embodiment of the present application.
  • the base substrate 50 can be a flexible substrate or a rigid substrate. And the material is limited.
  • a sensor unit array is formed on the base substrate, the sensor unit array includes a plurality of sensor units, and the plurality of sensor unit arrays are arranged; each sensor unit is configured to generate an imaging object A partial size image, and each of the sensor units includes at least one interconnection structure.
  • FIG. 19 is a schematic structural diagram of forming a sensor unit array 10 on a base substrate according to an embodiment of the present application. As shown in FIG. 19, a plurality of sensor units 101 are arrayed on the base substrate 50 to form the sensor unit array 10.
  • the sensor unit array 10 may be adhered to the base substrate 50 by glue.
  • the material of the interconnection structure 1014 is mainly solder metal.
  • solder metal For example, Sn, Ag, Cu, Pb, Au, Ni, Zn, Mo, Ta, Bi, In, etc. and their alloys.
  • step S230 an encapsulation layer is prepared on the base substrate, the encapsulation layer covers the sensor unit array and exposes the interconnection structure of each sensor unit.
  • preparing an encapsulation layer on the base substrate, the encapsulation layer covering the sensor unit array, and exposing the interconnection structure of each sensor unit may include: preparing an encapsulation layer on the base substrate, and the encapsulation layer Encapsulate the sensor unit array; thin the packaging layer to expose the interconnect structure of each sensor unit.
  • FIG. 20 is a schematic diagram of the structure of preparing the encapsulation layer provided by an embodiment of the present application
  • FIG. 21 is a schematic diagram of the structure of thinning the encapsulation layer provided by an embodiment of the present application, as shown in FIG. 20 and FIG. 21, first on the substrate
  • the encapsulation layer 20 is prepared on the substrate 50 to ensure that the encapsulation layer 20 completely covers the sensor unit array 10, and then the encapsulation layer 20 is thinned to expose the interconnection structure 1014 of each sensor unit 101 for subsequent operations.
  • step S240 a rewiring layer is prepared on the side of the packaging layer away from the base substrate, and the rewiring layer is electrically connected to the interconnection structure.
  • preparing the redistribution layer 20 may include a series of thin film deposition, electroplating, photolithography, development, and etching processes.
  • the material of the redistribution layer 20 may be a metal material, such as Al, Au, Cr, Ni, Cu, Mo, Ti, Ta, Ni-Cr, W, etc. and alloys thereof.
  • step S250 a circuit board is prepared on a side of the redistribution layer away from the encapsulation layer, and the circuit board is electrically connected to the redistribution layer.
  • FIG. 23 is a schematic structural diagram of preparing a circuit board according to an embodiment of the present application. As shown in FIG. 23, a circuit board 40 is prepared on the side of the redistribution layer 30 away from the packaging layer 20 to realize the electrical connection between the sensor unit 101 and the circuit board 40. connection.
  • the method for preparing the image sensor includes a plurality of sensor units arranged in an array, and each sensor unit generates a partial size image of the imaged object. Compared with the entire sensor chip, It can save the coverage area of the sensor chip, and can effectively reduce the total volume of the entire image sensor without affecting the imaging quality, easy to realize the miniaturization design of the image sensor, and save the preparation cost of the image sensor; at the same time, each sensor The unit includes at least one interconnection structure, the entire sensor unit array is connected to the circuit board through a rewiring layer, and the entire image sensor is packaged using a fan-out process to ensure a good packaging effect.
  • the method for manufacturing the image sensor provided in the embodiment of the present application may further include peeling off the base substrate.
  • FIG. 24 is a schematic structural diagram of the final image sensor obtained after peeling off the base substrate 50 provided by an embodiment of the present application.
  • the base substrate 50 is set to carry the sensor chip array 10 for subsequent preparation of the redistribution layer 30 and the circuit.
  • the base substrate 10 can be peeled off to ensure the thin design of the image sensor.
  • the embodiment of the present application also provides an electronic device, and the electronic device may include the image sensor provided in the embodiment of the present application, which will not be repeated here.
  • the electronic setting device provided in the embodiment of the present application may be a camera, a video camera, a card punch, a lens module, or other electronic devices that need to use an image sensor, and the embodiments of the present application will not list them one by one.

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Abstract

一种图像传感器及其制备方法、图像识别方法、电子设备，图像传感器包括传感器单元阵列（10），传感器单元阵列（10）包括多个传感器单元（101），多个传感器单元（101）阵列排布；每个传感器单元（101）设置为生成成像物体的部分尺寸图像，且每个传感器单元（101）包括至少一个互联结构（1014）；包覆传感器单元阵列（10）的封装层（20），封装层（20）暴露出每个传感器单元（101）的互联结构（1014）；位于封装层（20）一侧的重布线层（30），重布线层（30）与互联结构（1014）电连接；位于重布线层（30）远离封装层（20）一侧的电路板（40），电路板（40）与重布线层（30）电连接。

Description

图像传感器及其制备方法、图像识别方法、电子设备
本申请要求在2019年3月4日提交中国专利局、申请号为201910160614.9的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及图像传感器技术领域，例如一种图像传感器及其制备方法、图像识别方法、电子设备。
背景技术
图像传感器将光学图像转换成电信号。随着计算机和通信产业发展，在诸如数字照相机、摄像录像机、个人通信系统(Personal Communication System，PCS)、游戏主机、摄像头和医疗微型照相机的各种领域中越来越需要高性能图像传感器。
相关技术中，一个图像传感器可以包括图像传感芯片和覆盖图像传感芯片的透镜，通过透镜将成像物体成像在图像传感芯片，之后通过设置在图像传感芯片外围的控制单元控制图像传感芯片曝光，将光信号转化为电信号，从而得到成像物体的图像。
但是，相关技术中的图像传感器要求图像传感芯片面积较大，由于图像传感芯片价格高昂，造成图像传感器成本较高。
发明内容
本申请实施例提供一种图像传感器及其制备方法、图像识别方法、电子设备，以避免相关技术中图像传感器制作成本高的情况。
第一方面，本申请实施例提供了一种图像传感器，包括：传感器单元阵列，所述传感器单元阵列包括多个传感器单元，多个所述传感器单元阵列排布；每个所述传感器单元设置为生成成像物体的部分尺寸图像，且每个所述传感器单元包括至少一个互联结构；包覆所述传感器单元阵列的封装层，所述封装层暴露出每个所述传感器单元的互联结构；位于所述封装层一侧的重布线层，所述重布线层与所述互联结构电连接；位于所述重布线层远离所述封装层一侧的电路板，所述电路板与所述重布线层电连接。
第二方面，本申请实施例还提供了一种图像传感器的制备方法，包括：提供一衬底基板；在所述衬底基板上形成传感器单元阵列，所述传感器单元阵列包括多个传感器单元，多个所述传感器单元阵列排布；每个所述传感器单元设置为生成成像物体的部分尺寸图像，且每个所述传感器单元包括至少一个互联 结构；在所述衬底基板上制备封装层，所述封装层包覆所述传感器单元阵列，且暴露出每个所述传感器单元的互联结构；在所述封装层远离所述衬底基板的一侧制备重布线层，所述重布线层与所述互联结构电连接；在所述重布线层远离所述封装层的一侧制备电路板，所述电路板与所述重布线层电连接。
第三方面，本申请实施例还提供了一种图像识别方法，采用第一方面提供的图像传感器，包括：获取传感器单元阵列生成的多个部分尺寸识别图像；基于所述多个部分尺寸识别图像，获取至少两个图像特征点位置信息；根据所述至少两个图像特征点的位置信息，采用图像特征点识别算法，识别所述图像传感器采集的识别图像。
第四方面，本申请实施例还提供了一种电子设备，包括第一方面提供的图像传感器。
附图说明
图1是本申请一实施例提供的一种图像传感器的结构示意图；
图2是本申请一实施例提供的一种传感器单元的结构示意图；
图3是本申请一实施例提供的另一种传感器单元的结构示意图；
图4是本申请一实施例提供的另一种传感器单元的结构示意图；
图5是本申请一实施例提供的另一种传感器单元的结构示意图；
图6是本申请一实施例提供的另一种传感器单元的结构示意图；
图7是本申请一实施例提供的另一种传感器单元的结构示意图；
图8是本申请一实施例提供的另一种传感器单元的结构示意图；
图9是本申请一实施例提供的另一种传感器单元的结构示意图；
图10是本申请一实施例提供的另一种传感器单元的结构示意图；
图11是本申请一实施例提供的一种图像传感器的成像原理示意图；
图12是本申请一实施例提供的一种图像传感器采图原理示意图；
图13是本申请一实施例提供的一种图像识别方法的流程示意图；
图14是本申请一实施例提供的一种图像识别方法的原理示意图；
图15是本申请一实施例提供的图像传感器对人脸图像进行识别的成像原理示意图；
图16是本申请一实施例提供的图像传感器对人脸图像进行识别的采图原理示意图；
图17是本申请一实施例提供的一种图像传感器制备方法的流程示意图；
图18-图24是本申请一实施例提供的图像传感器制备方法各个步骤的结构示意图。
具体实施方式
本申请实施例提供一种图像传感器，包括：传感器单元阵列，传感器单元阵列包括多个传感器单元，多个传感器单元阵列排布；每个传感器单元设置为生成成像物体的部分尺寸图像，且每个传感器单元包括至少一个互联结构；包覆传感器单元阵列的封装层，封装层暴露出每个传感器单元的互联结构；位于封装层一侧的重布线层，重布线层与互联结构电连接；位于重布线层远离封装层一侧的电路板，电路板与重布线层电连接。采用上述技术方案，图像传感器包括传感器单元阵列，传感器单元阵列包括多个传感器单元，通过设置传感器包括多个阵列排布的传感器单元，每个传感器单元生成成像物体的部分尺寸图像，相比于整片设置的传感器芯片，可以节省传感器芯片的覆盖面积，在不影响成像质量的情况下，能够有效的减小整个图像传感器的总体积，易于实现图像传感器小型化设计，并且节省图像传感器的制备成本；同时，每个传感器单元包括至少一个互联结构，整个传感器单元阵列通过互联结构和重布线层与电路板连接，整个图像传感器采用扇出工艺进行封装，保证封装效果好。
图1是本申请一实施例提供的一种图像传感器的结构示意图，如图1所示，本申请实施例提供的图像传感器可以包括：传感器单元阵列10，传感器单元阵列10包括多个传感器单元101，多个所传感器单元101阵列排布；每个传感器单元101设置为生成成像物体的部分尺寸图像，且每个传感器单元101包括至少一个互联结构1014；包覆传感器单元阵列10的封装层20，封装层20暴露出每个传感器单元101的互联结构1014；位于封装层20一侧的重布线层30，重布线层30与互联结构1014电连接；位于重布线层30远离封装层20一侧的电路板40，电路板40与重布线层30电连接。
如图1所示，本申请一实施例提供的图像传感器可以包括传感器单元阵列10，传感器单元阵列10中的多个传感器单元101阵列排布，每个传感器单元101生成成像物体的部分尺寸图像，相比于相关技术中在图像传感器中设置整面设置的传感器芯片，发明实施例创造性地将“化整为零”的概念应用在图像传感器中，将相关技术中整面设计的图像传感芯片设计成传感器单元阵列10，传感器单元阵列10包括多个独立设置的传感器单元101，每个传感器单元101生成成像物体的部分尺寸图像。相比于整面的图像传感芯片，本申请实施例的技术方案可以减小图像传感芯片的覆盖面积，节省图像传感器的制备成本。
参考图1，本申请实施例提供的图像传感器中，每个传感器单元101均包括至少一个互联结构1014，且每个互联结构1014与重布线层30电连接，重布线层30与电路板40连接，通过互联结构1014和重布线层30实现传感器单元101与电路板的电连接关系。本申请实施例中的图线传感器采用扇出工艺进行封装，相比于传感器单元101直接与电路板40通过导线连接的方式，可以在图像传感 器中集成更多的传感器单元101，集成灵活性好；并且可以保证图像传感器的封装效果良好。
综上，本申请实施例提供的图像传感器，通过设置传感器包括多个阵列排布的传感器单元，每个传感器单元生成成像物体的部分尺寸图像，相比于整片设置的传感器芯片，可以节省传感器芯片的覆盖面积，在不影响成像质量的情况下，能够有效的减小整个图像传感器的总体积，易于实现图像传感器小型化设计，并且节省图像传感器的制备成本；同时，每个传感器单元包括至少一个互联结构，整个传感器单元阵列通过重布线层与电路板连接，整个图像传感器采用扇出工艺进行封装，保证封装效果好。
图2是本申请一实施例提供的传感器单元的结构示意图，如图2所示，本申请实施例提供的传感器单元101还可以包括封装盖板1011；位于封装盖板1011一侧的传感器芯片1012，传感器芯片1012设置为生成成像物体的部分尺寸图像；位于传感器芯片1012感光侧一侧的至少一个光学元件1013，光学元件1013设置为接收成像物体的部分入射光线并将部分入射光线成像在传感器芯片上1012。
示例性的，封装盖板1011可以为柔性基板，其材料可以包括聚酰亚胺、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚芳酯以及聚醚砜中的至少一种；封装盖板1011也可以为刚性基板，例如可以为硅片，玻璃基板或者其他刚性基板。本申请实施例不对基板的种类以及材料进行限定。
光学元件1013与每个传感器芯片1012对应设置。在图像传感器工作时，光学元件1013接收成像物体的部分入射光线并将该部分入射光线成像在与其对应的传感器芯片1012上，传感器芯片1012生成成像物体的部分尺寸图像。
以透镜为例，根据光学透镜的成像原理，1/f＝1/u+1/v，其中，f表示透镜焦距，u表示像距，v表示物距。通过调整透镜的焦距f以及透镜到被成像物体的距离v，可以调整光学元件1013与传感器芯片1012之间的距离u，使得像的面积以一定的倍数小于物的面积，控制传感器芯片1012大小，这就为传感器芯片1012设计提供了自由度，保证每个传感器芯片1012尺寸设置灵活。
在一实施例中，光学元件1013可以位于封装盖板1011所在膜层与传感器芯片1012所在膜层之间，如图2所示；或者光学元件1013也可以位于封装盖板1011远离传感器芯片的一侧1012，如图3所示，本申请实施例对比不进行限定。
在一实施例中，每个传感器芯片1012可以对应至少一个光学元件1013，图2以每个传感器芯片1012可以对应一个光学元件1013为例进行说明，图4以每个传感器芯片1012可以对应两个光学元件1013为例进行说明，本申请实施例对此不进行限定。
在一实施例中，互联结构1014可以包括金属焊球、金属焊盘和金属凸点中的至少一种，本申请实施例对此不进行限定，互联结构1014只需满足电学连接和机械连接作用即可，本申请实施例中的附图仅以互联结构1014为金属焊球为例进行示例性说明。
图5、图6和图7均是本申请一实施例提供的另一种显示面板的结构示意图，，如图5、图6和图7所示，本申请实施例提供的传感器单元还可以包括位于封装盖板1011至少一侧表面的涂层1015，涂层1015中形成有开口；开口在封装盖板1011所在平面上的垂直投影与光学元件1013在封装盖板1011所在平面上的垂直投影存在交叠区域。
示例性的，图5以涂层1015设置在封装盖板1011朝向传感器芯片1012的一侧为例进行说明，图6以涂层1015设置在封装盖板1011远离传感器芯片1012的一侧为例进行说明，图7以涂层1015设置在封装盖板1011两侧表面为例进行说明。如图5、图6和图7所示，在封装盖板1011的至少一侧表面设置涂层1015，且涂层1015中形成有开口，开口在封装盖板1011所在平面上的垂直投影与光学元件1013在封装盖板1011所在平面上的垂直投影存在交叠区域，保证通过涂层1015以及涂层1015中的开口形成特定的光圈，成像物体发出的光线通过特定的光圈到达光学元件1013上，保证可以滤除干扰光，增强图像传感器的图像质量。
在一实施例中，本申请实施例提供的传感器芯片101中，光学元件1013可以为透镜、成像孔和准直器中的至少一种，图1-图7以光学元件1013为透镜为例进行说明，图8和图9以光学元件1013为成像孔为例进行说明。
在一实施例中，参考图2-图9所示，本申请一实施例提供的传感器单元101还可以包括垫片1016，垫片1016位于封装盖板1011所在膜层与传感器芯片1012所在膜层之间。示例性的，在封装盖板1011与传感器芯片1012之间设置垫片1016，可以通过调节垫片1016的厚度达到调节光学元件1013与传感器芯片1012之间距离的目的，即达到调节像距的目的，保证本申请实施例提供的传感器单元101为像距可调的传感器单元101，保证传感器单元功能灵活多样。
图10是本申请一实施例提供的另一种传感器单元的结构示意图，如图10所示，在光学元件1013位于封装盖板1011远离传感器芯片1012的一侧的情况下，本申请实施例提供的传感器单元101还可以不包括垫片1016，通过调节封装盖板1011的厚度到调节光学元件1013与传感器芯片1012之间距离的目的，即达到调节像距的目的，不仅可以保证本申请实施例提供的传感器单元101为像距可调的传感器单元101，同时还可以保证传感器单元101结构简单。
在一实施例中，本申请实施例提供的图像传感器包括传感器单元阵列10，传感器单元阵列10包括多个传感器单元101，每个传感器单元101生成成像物 体的部分尺寸图像，整个传感器单元阵列10可以生成成像物体的完整尺寸图像，也可以生成成像物体的部分尺寸图像，本申请实施例对比不进行限定。在进行图像识别时，在传感器单元阵列10生成成像物体的完整尺寸图像的情况下，将传感器单元阵列10生成成像物体的完整尺寸图像与预设成像物体图像进行比对即可进行图像识别，本申请实施例对此不再赘述；本申请实施例着重描述在传感器单元阵列10生成成像物体的部分尺寸图像的情况下，如何进行图像识别，下面将进行说明。
图11是本申请一实施例提供的一种图像传感器的成像原理示意图；图12是本申请一实施例提供的一种图像传感器采图原理示意图，如图11和图12所示，传感器单元101基于成像物体的入射光线形成成像物体覆盖区域S，相邻两个传感器单元101的覆盖区域S之间的距离为L，其中，L＞0。
示例性的，在相邻两个传感器单元101的覆盖区域S之间的距离L＞0的情况下，说明本申请实施例提供的传感器单元阵列10的有效视角未能完全覆盖成像物体，传感器单元阵列10没有获取成像物体的完整尺寸图像，无法通过常规的图像识别方法进行图像识别。基于此，本申请实施例创造性地提出采用“图像特征点识别”的图像识别方法。
图13是本申请一实施例提供的一种图像识别方法的流程示意图，图14是本申请一实施例提供的一种图像识别方法的原理示意图，如图13和图14所示，本申请实施例提供的图像识别方法可以包括步骤S110至步骤S130。
在步骤S110中，获取传感器单元阵列生成的多个部分尺寸识别图像。
示例性的，首先获取传感器单元阵列生成的多个部分尺寸识别图像，该步骤通过本申请实施例提供的图像传感器采集完成。
在步骤S120中，基于所述多个部分尺寸识别图像，获取至少两个图像特征点位置信息。
示例性的，如图14所示，图像传感器最终采集到的识别图像是由多个部分尺寸识别图像组成的阵列，每个部分尺寸识别图像有一定概率包括识别图像上可以用于识别的特征点，如图14中的黑色圆点。
由于每个传感器单元阵列可以包括M行N列的传感器单元，每个传感器单元可以包括X行Y列的像素。因此对于一个落入传感器单元覆盖范围内的图像特征点，可以用一个位于特征空间的坐标(x，y，m，n，α)表示。其中x表示图像特征点在某个传感器单元中的横坐标，其中，0≤x≤X；y表示图像特征点在某个传感器单元中的纵坐标，其中，0≤y≤Y；m表示图像特征点所在的传感器单元在整个传感器单元阵列中的横坐标，其中，0≤m≤M；n表示图像特征点所在的传感器单元在整个传感器单元阵列中的纵坐标，其中，0≤n≤N；α表示图像特征点的特征角，图14中以指纹叉点作为图像的特征点，指纹叉点位置 处的夹角作为图像特征点的特征角为例进行说明。
由于每个传感器单元在整个传感器单元阵列中的位置都是已知的，由此可以确定的获取所有位于传感器单元覆盖范围内的所有图像特征点的集合。
在步骤S130中，根据所述至少两个图像特征点的位置信息，采用图像特征点识别算法，识别所述图像传感器采集的识别图像。
示例性的，根据获取的至少两个图像特征点的位置信息，采用图像特征点识别算法，识别图像传感器采集的识别图像。
图像特征点识别算法可以采用本领域公知的图像特征点识别算法，例如图像特征点识别算法可以参考doi:10.1109/34.566808的文献“Direct gray-scale minutiae detection in fingerprints”、doi:10.1109/TPAMI.2007.250596的文献“Pores and ridges High-resolution fingerprint matching using level 3 features”、doi:10.1016/S0031-3203(98)00107-1的文献“Fingerprint minutiae extraction from skeletonized binary images”及doi:10.1109/ICCACS.2015.7361357的文献“Extraction of high confidence minutiae points from fingerprint images”。
本申请实施例提供的图像识别方法，基于本申请实施例提供图像传感器采集的识别图像，首先获取传感器单元阵列生成的多个部分尺寸识别图像，然后基于多个部分尺寸识别图像，获取至少两个图像特征点的位置信息，根据至少两个图像特征点的位置信息，采用图像特征点识别算法，识别图像传感器采集的识别图像。由于图像传感器采集的识别图像无法包括所有的识别图像信息，本申请实施例创造性的采用“图像特征点识别”的图像识别方法，保证图像识别方法准确可行，保证本申请实施例提供的图像识别方法可以准确识别本申请实施例提供的图像传感器采集的识别图像。
在一实施例中，根据至少两个图像特征点的位置信息，采用图像特征点识别算法，识别图像传感器采集的识别图像，可以包括：根据至少两个图像特征点的位置信息，计算任意两个图像特征点之间的距离；根据任意两个图像特征点之间的距离，采用图像特征点识别算法，识别图像传感器采集的识别图像。
示例性的，参考图14所示，由于每个传感器单元在整个传感器单元阵列中的位置都是已知的，由此可以确定的获取所有位于传感器单元覆盖范围内的所有图像特征点的集合，集合内部各个图像特征点之间的距离可以被确切的计算获得。整个图像特征点集合内部成员的坐标具有唯一性和确定性，可以被基于图像特征点的图像识别算法所利用，从而实现图像识别功能。
在一实施例中，获取传感器单元阵列生成的多个部分尺寸识别图像之前，还可以包括：多次获取传感器单元阵列生成的多个部分尺寸录入图像，生成部分尺寸录入图像库；根据部分尺寸录入图像库，采用图像拼接算法生成完整尺寸录入图像。
示例性的，图像识别一般可以分为图像录入和图像识别两个过程，在图像录入过程，系统可以要求被录入对象在图像传感器的图像录入平面内多次移动，多次获取传感器单元阵列生成的多个部分尺寸录入图像，生成部分尺寸录入图像库。然后根据部分尺寸录入图像库，采用图像拼接算法，对部分尺寸录入图像进行裁剪拼接，生成完整的、包含所有图像特征点信息的录入图像。在之后的图像识别过程中，基于获取的包含部分图像特征点的识别图像，与包含所有图像特征点的录入图像进行比对，从而进行图像识别。
需要说明的是，本申请实施例提供的图像识别方法仅以指纹识别为例进行了说明，可以理解的是，由于本申请实施例提供的图像传感器中传感器单元的像距和光学元件的焦距均可调，因此本申请实施例中传感器单元的物距同样可调，因此，本申请实施例提供的图像传感器，同样可以识别不同物距的物体，例如搭配人脸识别算法，本申请实施例提供的图像传感器可以实现人脸识别，如图15和图16所示。
本申请实施例还提供了一种图像传感器的制备方法，如图17所示，本申请一实施例提供的图像传感器的制备方法可以包括步骤S210至步骤S250。
在步骤S210中，提供一衬底基板。
图18是本申请一实施例提供的制备衬底基板的结构示意图，如图18所示，衬底基板50可以为柔性基板，也可以为刚性基板，本申请实施例不对衬底基板50的种类以及材料进行限定。
在步骤S220中，在所述衬底基板上形成传感器单元阵列，所述传感器单元阵列包括多个传感器单元，多个所述传感器单元阵列排布；每个所述传感器单元设置为生成成像物体的部分尺寸图像，且每个所述传感器单元包括至少一个互联结构。
图19是本申请一实施例提供的在衬底基板上形成传感器单元阵列10的结构示意图，如图19所示，多个传感器单元101在衬底基板50上阵列排布形成传感器单元阵列10。
在一实施例中，传感器单元阵列10可以通过胶水黏贴在衬底基板50上。
在一实施例中，互联结构1014的材料主要为焊料金属。如，Sn、Ag、Cu、Pb、Au、Ni、Zn、Mo、Ta、Bi、In等及其合金。
在步骤S230中，在所述衬底基板上制备封装层，所述封装层包覆所述传感器单元阵列，且暴露出每个所述传感器单元的互联结构。
示例性的，在衬底基板上制备封装层，封装层包覆所述传感器单元阵列，且暴露出每个所述传感器单元的互联结构，可以包括：在衬底基板上制备封装层，封装层包覆传感器单元阵列；对封装层进行减薄处理，暴露出每个传感器单元的互联结构。
图20是本申请一实施例提供的制备封装层的结构示意图，图21是本申请一实施例提供的对封装层进行减薄的结构示意图，如图20和图21所示，首先在衬底基板50上制备封装层20，保证封装层20完全包覆传感器单元阵列10，之后对封装层20进行减薄处理，暴露出每个传感器单元101的互联结构1014，以便后续操作。
在步骤S240中，在所述封装层远离所述衬底基板的一侧制备重布线层，所述重布线层与所述互联结构电连接。
图22是本申请一实施例提供的制备重布线层的结构示意图，如图22所示，制备重布线层20可以包含一系列的薄膜沉积、电镀、光刻、显影以及蚀刻等工艺制作。重布线层20的材料可以为金属材料，如Al、Au、Cr、Ni、Cu、Mo、Ti、Ta、Ni-Cr、W等及其合金。
在步骤S250中，在所述重布线层远离所述封装层的一侧制备电路板，所述电路板与所述重布线层电连接。
图23是本申请一实施例提供的制备电路板的结构示意图，如图23所示，在重布线层30远离封装层20的一侧制备电路板40，实现传感器单元101与电路板40的电连接。
综上，本申请实施例提供的图像传感器的制备方法，通过设置传感器包括多个阵列排布的传感器单元，每个传感器单元生成成像物体的部分尺寸图像，相比于整片设置的传感器芯片，可以节省传感器芯片的覆盖面积，在不影响成像质量的情况下，能够有效的减小整个图像传感器的总体积，易于实现图像传感器小型化设计，并且节省图像传感器的制备成本；同时，每个传感器单元包括至少一个互联结构，整个传感器单元阵列通过重布线层与电路板连接，整个图像传感器采用扇出工艺进行封装，保证封装效果好。
在一实施例中，本申请实施例提供的图像传感器的制备方法还可以包括剥离衬底基板。
示例性的，图24是本申请一实施例提供的剥离衬底基板50后得到最终的图像传感器的结构示意图，衬底基板50设置为承载传感器芯片阵列10，以便后续制备重布线层30和电路板40，在完成重布线层30和电路板40之后，可以剥离衬底基板10，保证图像传感器薄型化设计。
本申请实施例还提供了一种电子设备，所述电子设备可以包括本申请实施例提供的图像传感器，这里不再赘述。在一实施例中，本申请实施例提供的电子设置设备可以为照相机、摄像机、打卡机、镜头模组或者其他需要使用图像传感器的电子设备，本申请实施例不再一一列举。

Claims (14)

  1. 一种图像传感器，包括：
    传感器单元阵列，所述传感器单元阵列包括多个传感器单元，多个所述传感器单元阵列排布；每个所述传感器单元设置为生成成像物体的部分尺寸图像，且每个所述传感器单元包括至少一个互联结构；
    包覆所述传感器单元阵列的封装层，所述封装层暴露出每个所述传感器单元的互联结构；
    位于所述封装层一侧的重布线层，所述重布线层与所述互联结构电连接；
    位于所述重布线层远离所述封装层一侧的电路板，所述电路板与所述重布线层电连接。
  2. 根据权利要求1所述的图像传感器，其中，每个所述传感器单元基于成像物体的入射光线形成成像物体覆盖区域；
    相邻两个所述传感器单元的覆盖区域之间的距离为L，其中，L＞0。
  3. 根据权利要求1所述的图像传感器，其中，所述传感器单元还包括：
    封装盖板；
    位于所述封装盖板一侧的传感器芯片，所述传感器芯片设置为生成成像物体的部分尺寸图像；
    位于所述传感器芯片感光侧一侧的至少一个光学元件，所述光学元件设置为接收所述成像物体的部分入射光线并将所述部分入射光线成像在所述传感器芯片上。
  4. 根据权利要求3所述的图像传感器，其中，所述光学元件位于所述封装盖板所在膜层与所述传感器芯片所在膜层之间；
    或者所述光学元件位于所述封装盖板远离所述传感器芯片的一侧。
  5. 根据权利要求3所述的图像传感器，其中，所述传感器单元还包括位于所述封装盖板至少一侧表面的涂层，所述涂层中形成有开口；
    所述开口在所述封装盖板所在平面上的垂直投影与所述光学元件在所述封装盖板所在平面上的垂直投影存在交叠区域。
  6. 根据权利要求3所述的图像传感器，其中，所述传感器单元还包括垫片，所述垫片位于所述封装盖板所在膜层与所述传感器芯片所在膜层之间。
  7. 根据权利要求3所述的图像传感器，其中，所述光学元件包括透镜、成像孔以及准直器中的至少一种。
  8. 一种图像传感器的制备方法，包括：
    提供一衬底基板；
    在所述衬底基板上形成传感器单元阵列，所述传感器单元阵列包括多个传感器单元，多个所述传感器单元阵列排布；每个所述传感器单元设置为生成成像物体的部分尺寸图像，且每个所述传感器单元包括至少一个互联结构；
    在所述衬底基板上制备封装层，所述封装层包覆所述传感器单元阵列，且暴露出每个所述传感器单元的互联结构；
    在所述封装层远离所述衬底基板的一侧制备重布线层，所述重布线层与所述互联结构电连接；
    在所述重布线层远离所述封装层的一侧制备电路板，所述电路板与所述重布线层电连接。
  9. 根据权利要求8所述的图像传感器的制备方法，其中，在所述衬底基板上制备封装层，所述封装层包覆所述传感器单元阵列，且暴露出每个所述传感器单元的互联结构，包括：
    在所述衬底基板上制备封装层，所述封装层包覆所述传感器单元阵列；
    对所述封装层进行减薄处理，暴露出每个所述传感器单元的互联结构。
  10. 根据权利要求8所述的图像传感器的制备方法，还包括：
    剥离所述衬底基板。
  11. 一种图像识别方法，采用权利要求1-7任一项所述的图像传感器，包括：
    获取传感器单元阵列生成的多个部分尺寸识别图像；
    基于所述多个部分尺寸识别图像，获取至少两个图像特征点的位置信息；
    根据所述至少两个图像特征点的位置信息，采用图像特征点识别算法，识别所述图像传感器采集的识别图像。
  12. 根据权利要求11所述的图像识别方法，其中，所述根据所述至少两个图像特征点的位置信息，采用图像特征点识别算法，识别所述图像传感器采集的识别图像，包括：
    根据所述至少两个图像特征点的位置信息，计算任意两个图像特征点之间的距离；
    根据所述任意两个图像特征点之间的距离，采用图像特征点识别算法，识别所述图像传感器采集的识别图像。
  13. 根据权利要求11所述的图像识别方法，其中，所述获取传感器单元阵列生成的多个部分尺寸识别图像之前，还包括：
    多次获取传感器单元阵列生成的多个部分尺寸录入图像，生成部分尺寸录入图像库；
    根据所述部分尺寸录入图像库，采用图像拼接算法生成完整尺寸录入图像。
  14. 一种电子设备，包括权利要求1-7任一项所述的图像传感器。
PCT/CN2019/122025 2019-03-04 2019-11-29 图像传感器及其制备方法、图像识别方法、电子设备 WO2020177412A1 (zh)

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