WO2020173176A1 - 信号调节器、天线装置和制造方法 - Google Patents

信号调节器、天线装置和制造方法 Download PDF

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Publication number
WO2020173176A1
WO2020173176A1 PCT/CN2019/125091 CN2019125091W WO2020173176A1 WO 2020173176 A1 WO2020173176 A1 WO 2020173176A1 CN 2019125091 W CN2019125091 W CN 2019125091W WO 2020173176 A1 WO2020173176 A1 WO 2020173176A1
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WIPO (PCT)
Prior art keywords
electrode
insulating layer
liquid crystal
substrate
microstrip line
Prior art date
Application number
PCT/CN2019/125091
Other languages
English (en)
French (fr)
Inventor
武杰
丁天伦
孔祥忠
李亮
曹雪
王瑛
贾皓程
蔡佩芝
车春城
Original Assignee
京东方科技集团股份有限公司
北京京东方传感技术有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方传感技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/763,404 priority Critical patent/US11462826B2/en
Publication of WO2020173176A1 publication Critical patent/WO2020173176A1/zh
Priority to US17/885,137 priority patent/US11637369B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/18—Phase-shifters
    • H01P1/184—Strip line phase-shifters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/22—Attenuating devices
    • H01P1/227—Strip line attenuators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0075—Stripline fed arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/28—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the amplitude
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/44—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports

Definitions

  • the present disclosure relates to the field of electronic communication technology, and in particular to a signal conditioner, an antenna device and a manufacturing method.
  • Phase shifters and attenuators are widely used in electronic communication systems and are the core components of phased array radars, synthetic aperture radars, radar electronic countermeasures, satellite communications, and receivers. Through the combined effect of the phase shifter and the attenuator, the side lobe of the antenna pattern can be reduced, and the scanning of the antenna can be realized.
  • liquid crystal phased array antennas have appeared. The phased array antenna based on liquid crystal material can realize the scanning function of the antenna beam.
  • a signal conditioner including: a microstrip line, including at least a first part and a second part, a first end of the first part and a first end of the second part Connected, the second end of the first part is connected to the second end of the second part; the insulating layer includes a first insulating layer covering the first part; at least one electrode includes a first electrode, the first The electrode is on the side of the first insulating layer away from the first part; the liquid crystal layer covers the microstrip line, the insulating layer and the at least one electrode; and the common electrode line is on the side of the liquid crystal layer The side away from the microstrip line.
  • the insulating layer further includes a second insulating layer covering the second part; the at least one electrode further includes a second electrode, and the second electrode is located away from the second insulating layer. On one side of the second part, the second electrode and the first electrode are separated by a part of the liquid crystal layer.
  • the length L1 of the first electrode and the length L2 of the second electrode satisfy the following conditions:
  • c is the speed of light
  • f is the frequency of the transmitted signal
  • ⁇ // is the dielectric constant of the liquid crystal when the arrangement of the long axis of the liquid crystal molecules is parallel to the direction of the driving electric field applied to the liquid crystal
  • ⁇ ⁇ is The dielectric constant of the liquid crystal when the arrangement state of the long axis of the liquid crystal molecules is perpendicular to the direction of the driving electric field applied to the liquid crystal.
  • the width of the first electrode is equal to the width of the second electrode.
  • the first part and the second part respectively have a curved shape.
  • the microstrip line further includes a third part, and the first end of the third part is connected to the second end of the first part; the insulating layer further includes a third part covering the third part.
  • the third insulating layer; the at least one electrode further includes a third electrode, the third electrode on the side of the third insulating layer away from the third portion, the third electrode and the first electrode , The second electrodes are respectively separated by a part of the liquid crystal layer.
  • the length L3 of the third electrode satisfies the following conditions:
  • c is the speed of light
  • f is the frequency of the transmitted signal
  • ⁇ // is the dielectric constant of the liquid crystal when the arrangement of the long axis of the liquid crystal molecules is parallel to the direction of the driving electric field applied to the liquid crystal
  • ⁇ ⁇ is The dielectric constant of the liquid crystal when the arrangement state of the long axis of the liquid crystal molecules is perpendicular to the direction of the driving electric field applied to the liquid crystal.
  • the signal conditioner further includes: a first radio frequency port connected to the first end of the first part; and a second radio frequency port connected to the second end of the third part.
  • the second part and the first part are symmetrically arranged with respect to a line in which the first radio frequency port extends.
  • the signal conditioner further includes: a first substrate and a second substrate, wherein the microstrip line, the insulating layer, the at least one electrode, the liquid crystal layer, and the common electrode The line is located between the first substrate and the second substrate, the microstrip line, the insulating layer and the at least one electrode are on the first substrate, and the common electrode line is on the second substrate. On the substrate.
  • an antenna device including: at least one signal conditioner as described above; and at least one antenna unit, each of the at least one antenna unit and one signal conditioner Electric connection.
  • the at least one signal conditioner includes a plurality of signal conditioners
  • the at least one antenna unit includes a plurality of antenna units
  • the antenna device further includes: a signal transmission unit, and the plurality of signal conditioners Where the signal transmission unit includes at least one of a power splitter and a combiner.
  • a method for manufacturing a signal conditioner including: forming a microstrip line on a first substrate, wherein the microstrip line at least includes a first part and a second part, so The first end of the first part is connected to the first end of the second part, and the second end of the first part is connected to the second end of the second part; on the microstrip line away from the first end
  • An insulating layer is formed on one side of a substrate, wherein the insulating layer includes a first insulating layer covering the first part; at least one electrode is formed on the side of the insulating layer away from the microstrip line, and the at least One electrode includes a first electrode formed on the side of the first insulating layer away from the first part; the first substrate is introduced to cover the microstrip line, the insulating layer, and The liquid crystal layer of the at least one electrode; forming a common electrode line on the second substrate; and butting the first substrate and the second substrate so that the liquid crystal
  • the insulating layer in the step of forming the insulating layer, further includes a second insulating layer covering the second portion; in the step of forming the at least one electrode, the at least one electrode It also includes a second electrode formed on a side of the second insulating layer away from the second portion, and the second electrode is separated from the first electrode.
  • the microstrip line further includes a third part, and the first end of the third part is connected to the second end of the first part;
  • the insulating layer further includes a third insulating layer covering the third part;
  • the at least one electrode further includes a third electrode, and A third electrode is formed on a side of the third insulating layer away from the third portion, and the third electrode is separated from the first electrode and the second electrode, respectively.
  • a method for manufacturing a signal conditioner including: forming a microstrip line on a first substrate, wherein the microstrip line at least includes a first part and a second part, so The first end of the first part is connected to the first end of the second part, and the second end of the first part is connected to the second end of the second part; on the microstrip line away from the first end
  • An insulating layer is formed on one side of a substrate, wherein the insulating layer includes a first insulating layer covering the first part; at least one electrode is formed on the side of the insulating layer away from the microstrip line, and the at least One electrode includes a first electrode, the first electrode is formed on the side of the first insulating layer away from the first part; a common electrode line is formed on a second substrate; The two substrates are connected to each other so that the microstrip line, the insulating layer, the at least one electrode, and the common electrode line are between the first substrate and
  • the insulating layer in the step of forming the insulating layer, further includes a second insulating layer covering the second portion; in the step of forming the at least one electrode, the at least one electrode It also includes a second electrode formed on a side of the second insulating layer away from the second portion, and the second electrode is separated from the first electrode.
  • the microstrip line further includes a third part, and the first end of the third part is connected to the second end of the first part;
  • the insulating layer further includes a third insulating layer covering the third part;
  • the at least one electrode further includes a third electrode, and A third electrode is formed on a side of the third insulating layer away from the third portion, and the third electrode is separated from the first electrode and the second electrode, respectively.
  • FIG. 1A is a top view showing a signal conditioner according to some embodiments of the present disclosure
  • FIG. 1B is a cross-sectional view showing the structure of the signal conditioner according to some embodiments of the present disclosure taken along the line A-A' in FIG. 1A;
  • Figure 2A is a top view showing a signal conditioner according to other embodiments of the present disclosure.
  • FIG. 2B is a cross-sectional view showing the structure of the signal conditioner according to other embodiments of the present disclosure taken along the line BB' in FIG. 2A; in addition, FIG. 2B still shows the signal according to other embodiments of the present disclosure A cross-sectional view of the structure of the regulator taken along the line D-D' in FIG. 3A;
  • 3A is a top view showing a signal conditioner according to other embodiments of the present disclosure.
  • 3B is a cross-sectional view showing the structure of the signal conditioner according to other embodiments of the present disclosure taken along the line C-C' in FIG. 3A;
  • FIG. 4 is a flowchart showing a method of manufacturing a signal conditioner according to some embodiments of the present disclosure
  • 5A is a cross-sectional view showing a structure at a stage in a method of manufacturing a signal conditioner according to some embodiments of the present disclosure
  • 5B is a cross-sectional view showing a structure at a stage in a method of manufacturing a signal conditioner according to some embodiments of the present disclosure
  • 6A is a cross-sectional view showing a structure at another stage in a method of manufacturing a signal conditioner according to some embodiments of the present disclosure
  • 6B is a cross-sectional view showing a structure at another stage in the method of manufacturing the signal conditioner according to some embodiments of the present disclosure
  • FIG. 7A is a cross-sectional view showing a structure at another stage in the method of manufacturing the signal conditioner according to some embodiments of the present disclosure
  • FIG. 7B is a cross-sectional view showing the structure at another stage in the method of manufacturing the signal conditioner according to some embodiments of the present disclosure.
  • FIG. 8A is a cross-sectional view showing the structure at another stage in the method of manufacturing the signal conditioner according to some embodiments of the present disclosure
  • 8B is a cross-sectional view showing the structure at another stage in the method of manufacturing the signal conditioner according to some embodiments of the present disclosure.
  • FIG. 9 is a cross-sectional view showing the structure at another stage in the method of manufacturing the signal conditioner according to some embodiments of the present disclosure.
  • FIG. 10 is a flowchart showing a method of manufacturing a signal conditioner according to other embodiments of the present disclosure.
  • 11A is a cross-sectional view showing a structure at a stage in a method of manufacturing a signal conditioner according to other embodiments of the present disclosure
  • 11B is a cross-sectional view showing a structure at a stage in a method of manufacturing a signal conditioner according to other embodiments of the present disclosure
  • FIG. 12 is a schematic diagram showing the structure of an antenna device according to some embodiments of the present disclosure.
  • a specific device when it is described that a specific device is located between the first device and the second device, there may or may not be an intermediate device between the specific device and the first device or the second device.
  • the specific device When it is described that a specific device is connected to another device, the specific device may be directly connected to the other device without an intermediate device, or may not be directly connected to the other device but has an intermediate device.
  • the inventor of the present disclosure found that the liquid crystal phased array antenna of the related art cannot adjust the amplitude of the electromagnetic wave signal. This makes it difficult to reduce the side lobes of the pattern of the liquid crystal phased array antenna.
  • the embodiments of the present disclosure provide a signal conditioner, so that the amplitude of the electromagnetic wave signal can be adjusted.
  • FIG. 1A is a top view showing a signal conditioner according to some embodiments of the present disclosure.
  • FIG. 1B is a cross-sectional view showing the structure of the signal conditioner according to some embodiments of the present disclosure taken along the line A-A' in FIG. 1A.
  • the structure of the signal conditioner according to some embodiments of the present disclosure will be described in detail below with reference to FIGS. 1A and 1B.
  • the signal conditioner includes a microstrip line 100, an insulating layer, at least one electrode, a liquid crystal layer 140, and a common electrode line 150.
  • the microstrip line 100 includes at least a first part 101 and a second part 102.
  • the first end 1011 of the first part 101 is connected to the first end 1021 of the second part 102.
  • the second end 1012 of the first part 101 is connected to the second end 1022 of the second part 102.
  • the first part 101 and the second part 102 may each have a curved shape.
  • the first part 101 may include a plurality of curved parts
  • the second part 102 may also include a plurality of curved parts.
  • the second part 102 and the first part 101 of the microstrip line may be symmetrical with respect to a line in which the first radio frequency port 121 (or the second radio frequency port 122, which will be described later) extends. Set up.
  • the scope of the embodiments of the present disclosure is not limited to this.
  • the second part 102 and the first part 101 of the microstrip line may be arranged asymmetrically with respect to the straight line.
  • the insulating layer includes a first insulating layer 131 covering the first portion 101.
  • the insulating layer may be a passivation layer.
  • the material of the insulating layer may include silicon dioxide or silicon nitride.
  • the at least one electrode includes a first electrode 111.
  • the first electrode 111 is on a side of the first insulating layer 131 away from the first portion 101.
  • the first electrode 111 is on the surface of the first insulating layer 131.
  • the first insulating layer 131 isolates the first electrode 111 from the first portion 101 of the microstrip line.
  • the material of the first electrode 111 may include conductive materials such as ITO (Indium Tin Oxide, indium tin oxide) or metal.
  • the extension direction of the first electrode 111 is the same as the extension direction of the first portion 101 of the microstrip line.
  • the liquid crystal layer 140 covers the microstrip line 100, the insulating layer (for example, the first insulating layer 131), and the at least one electrode (for example, the first electrode 111).
  • the common electrode line 150 is on the side of the liquid crystal layer 140 away from the microstrip line 100. This makes a part of the liquid crystal layer 140 located between the common electrode line 150 and the microstrip line 100.
  • the common electrode line 150 may be a ground electrode line.
  • the microstrip line includes a first part and a second part.
  • a first insulating layer is provided on the first part.
  • a first electrode is provided on the first insulating layer. In this way, the first insulating layer isolates the first electrode from the first part of the microstrip line.
  • the liquid crystal layer covers the microstrip line, the insulating layer and the electrodes.
  • a common electrode line is provided on the side of the liquid crystal layer away from the microstrip line. The signal conditioner can realize the amplitude adjustment of the electromagnetic wave signal.
  • the common electrode line is applied with a common potential (for example, ground potential).
  • the electromagnetic wave signal is input to the signal conditioner through one end of the microstrip line and runs along the line between the microstrip line and the common electrode line.
  • the liquid crystal part is transmitted.
  • the microstrip line includes a first part and a second part. Therefore, the electromagnetic wave signal is transmitted along two branches respectively.
  • the first branch is the liquid crystal part between the first part and the common electrode line
  • the second branch is between the second part and the common electrode line. ⁇ LCD section.
  • the amplitude of the electromagnetic wave signal can be adjusted by applying a voltage to the electrode.
  • applying a voltage to the first electrode causes the dielectric constant of the liquid crystal portion in the first branch to change. Since there is no electrode above the second part of the microstrip line, the dielectric constant of the liquid crystal part of the second branch does not change.
  • the liquid crystal layer exhibits different dielectric constants under different voltages, and the phase constants of electromagnetic wave signals are different when they propagate in media with different dielectric constants. Under the same propagation length, different propagation phase constants will produce different phases. Two signals with different phases are synthesized, and the amplitude of the synthesized electromagnetic wave signal will change. Therefore, after the electromagnetic wave signals respectively transmitted along the two liquid crystal parts are synthesized, the amplitude of the electromagnetic wave signals changes. Therefore, the signal conditioner of the above-mentioned embodiment of the present disclosure can realize the adjustment of the amplitude of the electromagnetic wave signal.
  • the antenna device when the signal conditioner is applied to the antenna device, the antenna device can be made to achieve the purpose of changing the amplitude of the electromagnetic wave signal.
  • the side lobes of the antenna pattern can be reduced, thereby improving the anti-interference ability of the system.
  • the signal conditioner may further include: a first radio frequency port 121 connected to the first end 1011 of the first part 101 (or the first end 1021 of the second part 102) and The second radio frequency port 122 is connected to the second end 1022 of the second part 102 (or the second end 1012 of the first part 101).
  • the first radio frequency port 121 and the second radio frequency port 122 may be respectively used as input and output ports.
  • the material of the first radio frequency port 121 and the second radio frequency port 122 is the same as the material of the microstrip line 100. In this way, in the manufacturing process, the two radio frequency ports can be formed in the process of forming the microstrip line, thereby facilitating manufacturing.
  • the signal conditioner further includes a first substrate 161 and a second substrate 162.
  • the microstrip line 100, the insulating layer (for example, the first insulating layer 131 in FIG. 1B), the at least one electrode (for example, the first electrode 111 in FIG. 1B), the liquid crystal layer 140 and the common electrode line 150 are located in the first Between the substrate 161 and the second substrate 162.
  • the microstrip line 100, the insulating layer and the at least one electrode are on the first substrate 161.
  • the common electrode line 150 is on the second substrate 162.
  • FIG. 1A shows the structural relationship between the microstrip line and the electrode in a top view, but in fact, it can be seen in the cross-sectional view (for example, FIG. 1B) that the microstrip line and the electrode are separated.
  • FIG. 1B shows the cross-sectional view
  • FIG. 2A is a top view showing a signal conditioner according to other embodiments of the present disclosure.
  • 2B is a cross-sectional view showing the structure of the signal conditioner according to other embodiments of the present disclosure taken along the line B-B' in FIG. 2A.
  • the signal conditioner includes some structures that are the same as or similar to the signal conditioner shown in FIGS. 1A and 1B.
  • the insulating layer further includes a second insulating layer 132 covering the second portion 102 of the microstrip line.
  • the at least one electrode may further include a second electrode 112.
  • the second electrode 112 is on a side of the second insulating layer 132 away from the second portion 102.
  • the second electrode 112 is on the surface of the second insulating layer 132.
  • the second insulating layer 132 isolates the second electrode 112 from the second portion 102 of the microstrip line.
  • the second electrode 112 and the first electrode 111 are separated by a part of the liquid crystal layer 140.
  • the first electrode is provided above the first part of the microstrip line
  • the second electrode is provided above the second part of the microstrip line. Therefore, in the process of adjusting the amplitude of the electromagnetic wave signal, different voltages can be applied to the first electrode and the second electrode, thereby changing the dielectric constant of the liquid crystal portion of the respective branch, so as to adjust the liquid crystal along the two branches.
  • the phase of the electromagnetic wave signal transmitted separately. In this way, after the electromagnetic wave signals of different phases are synthesized into one electromagnetic wave signal, the amplitude of the synthesized electromagnetic wave signal changes.
  • the signal conditioner of this embodiment can adjust the amplitude of the electromagnetic wave signal more conveniently.
  • the length of the first electrode 111 is equal to the length of the second electrode 112. This can reduce the uncontrollable influence of the two electrodes on the signal, which is conducive to the controllable adjustment of the signal amplitude.
  • the length of the electrode refers to the size of the electrode along the extension direction of the microstrip line.
  • the length of the first electrode refers to the size of the first electrode along the extension direction of the first portion of the microstrip line
  • the length of the second electrode refers to the size of the second electrode along the extension direction of the second portion of the microstrip line.
  • the length L1 of the first electrode 111 and the length L2 of the second electrode 112 satisfy the following conditions:
  • c is the speed of light
  • f is the frequency of the transmitted signal
  • ⁇ // is the dielectric constant of the liquid crystal when the arrangement of the long axis of the liquid crystal molecules is parallel to the direction of the driving electric field applied to the liquid crystal
  • ⁇ ⁇ is The dielectric constant of the liquid crystal when the arrangement state of the long axis of the liquid crystal molecules is perpendicular to the direction of the driving electric field applied to the liquid crystal.
  • the electromagnetic wave propagates in the medium (for example, the dielectric constant of the medium is ⁇ ), then the wavelength ⁇ g of the electromagnetic wave is
  • the wavelength ⁇ g ⁇ of electromagnetic waves propagating in the liquid crystal medium with dielectric constants ⁇ ⁇ is
  • L is the propagation length
  • propagation length length L1 of the first electrode.
  • Electromagnetic wave in the liquid crystal dielectric constant ⁇ ⁇ are in phase propagation time is ⁇ ⁇
  • the phase change of electromagnetic wave ⁇ is
  • tan ⁇ ⁇ is the loss tangent of the material when the liquid crystal molecules are arranged perpendicular to the direction of the electric field
  • tan ⁇ ⁇ is the loss tangent of the material when the liquid crystal molecules are arranged in parallel with the direction of the electric field.
  • the amplitude adjustment range of the signal conditioner is related to the range of tan ⁇ ⁇ and tan ⁇ ⁇ .
  • the amplitude adjustment range of the signal conditioner is 0-17dB. If the dynamic range of the difference between tan ⁇ ⁇ and tan ⁇ ⁇ (that is, tan ⁇ ⁇ -tan ⁇ ⁇ ) is further reduced, the amplitude adjustment range of the signal conditioner can be further increased. That is, the amplitude adjustment range of the signal conditioner is inversely related to the dynamic range of the difference between tan ⁇ ⁇ and tan ⁇ ⁇ .
  • the first electrode 111 and the second electrode 112 may be arranged symmetrically with respect to a line in which the first radio frequency port 121 (or the second radio frequency port 122) extends. By arranging these two electrodes symmetrically, the amplitude of the electromagnetic wave signal can be easily adjusted.
  • the first electrode 111 and the second electrode 112 may also be arranged asymmetrically with respect to the straight line.
  • the width W1 of the first electrode 111 and the width W2 of the second electrode 112 are equal. This can try to ensure that the losses on the two branch lines are consistent.
  • the width of the electrode refers to the lateral dimension of the electrode in the cross-sectional view.
  • the width of the first electrode 111 refers to the lateral dimension of the first electrode in FIG. 2B
  • the width of the second electrode 112 refers to the lateral dimension of the second electrode in FIG. 2B.
  • FIG. 3A is a top view showing a signal conditioner according to other embodiments of the present disclosure.
  • 3B is a cross-sectional view showing the structure of the signal conditioner according to other embodiments of the present disclosure taken along the line C-C' in FIG. 3A.
  • the cross-sectional view of the structure taken along the line D-D' in FIG. 3A can be referred to as shown in FIG. 2B.
  • the signal conditioner shown in FIG. 3A includes some structures that are the same as or similar to those of the signal conditioner shown in FIGS. 2A and 2B.
  • the microstrip line 100 may further include a third part 103.
  • the first end 1031 of the third part 103 is connected to the second end 1012 of the first part 101.
  • the insulating layer may further include a third insulating layer 133 covering the third portion 103.
  • the at least one electrode may further include a third electrode 113.
  • the third electrode 113 is on a side of the third insulating layer 133 away from the third portion 103.
  • the third electrode 113 is on the surface of the third insulating layer 133.
  • the third insulating layer 133 isolates the third electrode 113 from the third portion 103 of the microstrip line.
  • the third electrode 113 is separated from the first electrode 111 and the second electrode 112 by a part of the liquid crystal layer 140 respectively.
  • the third part of the microstrip line, the third insulating layer and the third electrode are provided in the signal conditioner.
  • the electromagnetic wave signal may be transmitted between the third part of the microstrip line and the liquid crystal part between the common electrode line.
  • the dielectric constant of the liquid crystal portion is changed by applying a voltage to the third electrode. This can change the phase of the transmitted electromagnetic wave signal. Therefore, the signal conditioner shown in FIG. 3A can not only realize the controllable adjustment of the amplitude of the electromagnetic wave signal by the signal conditioner shown in FIG. 2A, but also realize the controllable adjustment of the phase of the electromagnetic wave signal.
  • the antenna device When the signal conditioner is applied to the antenna device, the antenna device can be made to achieve the purpose of changing the amplitude and phase of the electromagnetic wave signal. This can more easily reduce the side lobe of the antenna pattern, thereby improving the anti-interference ability of the system.
  • the length L3 of the third electrode 113 satisfies the following conditions:
  • c is the speed of light
  • f is the frequency of the transmitted signal
  • ⁇ // is the dielectric constant of the liquid crystal when the arrangement of the long axis of the liquid crystal molecules is parallel to the direction of the driving electric field applied to the liquid crystal
  • ⁇ ⁇ is The dielectric constant of the liquid crystal when the arrangement state of the long axis of the liquid crystal molecules is perpendicular to the direction of the driving electric field applied to the liquid crystal.
  • the length L3 of the third electrode 113 satisfies the condition of the above-mentioned relational expression (11), so that the signal can achieve a phase difference of 360 degrees.
  • the width of the first electrode 111, the width of the second electrode 112, and the width of the third electrode 113 are all equal to the width of the microstrip line 100. This can reduce the uncontrollable influence of the three electrodes on the signal.
  • the width of the first electrode 111, the width of the second electrode 112, and the width of the third electrode 113 may not be equal to the width of the microstrip line 100.
  • the width of the three electrodes may not exceed twice the width of the microstrip line.
  • the signal conditioner may further include: a first radio frequency port 121 connected to the first end 1011 of the first part 101 and a first radio frequency port 121 connected to the second end 1032 of the third part 103 Two radio frequency port 322.
  • the first radio frequency port 121 and the second radio frequency port 322 may be respectively used as input and output ports.
  • the material of the first radio frequency port 121 and the second radio frequency port 322 is the same as the material of the microstrip line 100. In this way, in the manufacturing process, the two radio frequency ports can be formed in the process of forming the microstrip line, thereby facilitating manufacturing.
  • the above-mentioned liquid crystal-based amplitude and phase adjuster can independently adjust the amplitude and phase of the signal, or adjust both the amplitude and the phase of the signal.
  • the amplitude and phase regulator can be applied to phased array antennas. Diversification can be achieved when shaping the antenna pattern. By reducing the side lobe of the antenna pattern, the anti-interference ability of the system can be improved.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a signal conditioner according to some embodiments of the present disclosure. As shown in FIG. 4, the manufacturing method includes steps S402 to S412.
  • a microstrip line is formed on the first substrate.
  • the microstrip line includes at least a first part and a second part. The first end of the first part is connected to the first end of the second part, and the second end of the first part is connected to the second end of the second part.
  • an insulating layer is formed on the side of the microstrip line away from the first substrate.
  • the insulating layer includes a first insulating layer covering the first portion.
  • step S406 at least one electrode is formed on the side of the insulating layer away from the microstrip line.
  • the at least one electrode includes a first electrode.
  • the first electrode is formed on a side of the first insulating layer away from the first part.
  • step S408 a liquid crystal layer covering the microstrip line, the insulating layer and the at least one electrode is introduced on the first substrate.
  • step S410 a common electrode line is formed on the second substrate.
  • step S412 the first substrate and the second substrate are butted, so that the liquid crystal layer and the common electrode line are between the first substrate and the second substrate.
  • the microstrip line, the insulating layer, the at least one electrode, the liquid crystal layer, and the common electrode line are all between the two substrates.
  • a method of manufacturing a signal conditioner according to some embodiments of the present disclosure is provided.
  • a microstrip line on the first substrate, an insulating layer on the microstrip line, an electrode on the insulating layer, and a liquid crystal layer covering the microstrip line, the insulating layer, and the electrode are formed.
  • a common electrode line is formed on the second substrate. Then the two substrates are connected to each other so that the microstrip line, the insulating layer, the electrode, the liquid crystal layer and the common electrode line are between the two substrates. In this way, a signal conditioner that can adjust the amplitude of the electromagnetic wave signal is formed.
  • the insulating layer may further include a second insulating layer covering the second portion.
  • the at least one electrode may further include a second electrode.
  • the second electrode is formed on a side of the second insulating layer away from the second part. The second electrode is separated from the first electrode.
  • a second electrode above the second part of the microstrip line is formed. The second electrode and the second part of the microstrip line are separated by a second insulating layer.
  • the microstrip line in the step of forming the microstrip line, may further include a third part.
  • the first end of the third part is connected to the second end of the first part.
  • the insulating layer may further include a third insulating layer covering the third portion.
  • the at least one electrode in the step of forming the at least one electrode, may further include a third electrode.
  • the third electrode is formed on a side of the third insulating layer away from the third part. The third electrode is separated from the first electrode and the second electrode respectively.
  • a third part of the microstrip line and a third electrode above the third part are formed.
  • the third electrode and the third part of the microstrip line are separated by a third insulating layer.
  • FIG. 5A, FIG. 6A, FIG. 7A, FIG. 8A, and FIG. 2B are cross-sectional views showing the structure of several stages taken along the line D-D' in FIG. 3A, for example.
  • 5B, 6B, 7B, 8B, and 3B are cross-sectional views showing the structure of several stages taken along the line C-C' in FIG. 3A, for example.
  • the manufacturing process of the signal conditioner according to some embodiments of the present disclosure will be described in detail below with reference to these drawings.
  • the microstrip line 100 is formed on the first substrate 161.
  • the microstrip line 100 includes at least a first part 101 and a second part 102.
  • the first end of the first part 101 is connected to the first end of the second part 102, and the second end of the first part 101 is connected to the second end of the second part 102 (refer to FIG. 3A as shown in FIG. 5A).
  • the patterned microstrip line 100 may be formed on the first substrate 161 through processes such as deposition and etching.
  • the material of the microstrip line 100 may include conductive materials such as ITO or metal.
  • the microstrip line 100 may further include a third part 103.
  • the first end of the third part 103 is connected to the second end of the first part 101 (see FIG. 3A, but not shown in FIG. 5B).
  • the insulating layer may include a first insulating layer 131 covering the first portion 101.
  • the insulating layer may further include a second insulating layer 132 covering the second portion 102.
  • the insulating layer may further include a third insulating layer 133 covering the third portion 103.
  • the patterned insulating layer can be formed by processes such as deposition and etching.
  • the material of the insulating layer may include silicon dioxide or silicon nitride.
  • the at least one electrode is formed on the side of the insulating layer away from the microstrip line 100.
  • the at least one electrode may include a first electrode 111.
  • the first electrode 111 is formed on a side of the first insulating layer 131 away from the first portion 101.
  • the first electrode is formed on the surface of the first insulating layer 131.
  • the at least one electrode may further include the second electrode 112.
  • the second electrode 112 is formed on a side of the second insulating layer 132 away from the second portion 102.
  • the second electrode 112 is formed on the surface of the second insulating layer 132.
  • the second electrode 112 is separated from the first electrode 111.
  • the at least one electrode may further include a third electrode 113.
  • the third electrode 113 is formed on a side of the third insulating layer 133 away from the third portion 103.
  • the third electrode 113 is formed on the surface of the third insulating layer 133.
  • the third electrode 113 is separated from the first electrode 111 and the second electrode 112 respectively.
  • the covering microstrip line 100 insulating layers (for example, the first insulating layer 131, the second insulating layer 132, and the third insulating layer 133) and the above-mentioned
  • the liquid crystal layer 140 of at least one electrode for example, the first electrode 111, the second electrode 112, and the third electrode 113.
  • an encapsulation glue that surrounds the microstrip line, the insulating layer and the at least one electrode shown is formed on the first substrate, and the liquid crystal is introduced into the encapsulation glue on the first substrate, so that the liquid crystal layer is removed therefrom.
  • a common electrode line 150 is formed on the second substrate 162.
  • the common electrode line can be formed by processes such as deposition and etching.
  • the material of the common electrode line includes conductive materials such as ITO or metal.
  • the first substrate 161 and the second substrate 162 are butted so that the microstrip line 100, the insulating layer, the at least one electrode, the liquid crystal layer 140, and the common electrode line 150 are all located here. Between two substrates.
  • the signal conditioner is formed by this manufacturing method.
  • the signal conditioner can adjust at least one of the amplitude and phase of the electromagnetic wave signal.
  • FIG. 10 is a flowchart showing a method of manufacturing a signal conditioner according to other embodiments of the present disclosure. As shown in FIG. 10, the manufacturing method includes steps S1072 to S1082.
  • a microstrip line is formed on the first substrate.
  • the microstrip line includes at least a first part and a second part. The first end of the first part is connected to the first end of the second part, and the second end of the first part is connected to the second end of the second part.
  • an insulating layer is formed on the side of the microstrip line away from the first substrate.
  • the insulating layer includes a first insulating layer covering the first portion.
  • step S1076 at least one electrode is formed on the side of the insulating layer away from the microstrip line.
  • the at least one electrode includes a first electrode.
  • the first electrode is formed on a side of the first insulating layer away from the first part.
  • step S1078 a common electrode line is formed on the second substrate.
  • step S1080 the first substrate and the second substrate are connected to each other so that the microstrip line, the insulating layer, the at least one electrode, and the common electrode line are between the first substrate and the second substrate.
  • step S1082 liquid crystal is introduced between the first substrate and the second substrate to form a liquid crystal layer covering the microstrip line, the insulating layer and the at least one electrode. A part of the liquid crystal layer is between the microstrip line and the common electrode line.
  • a microstrip line formed on the first substrate, an insulating layer on the microstrip line, and an electrode on the insulating layer are formed.
  • a common electrode line is formed on the second substrate. Then the two substrates are connected to each other so that the microstrip line, the insulating layer, the electrode and the common electrode line are between the two substrates.
  • liquid crystal is introduced between the two substrates to form a liquid crystal layer. In this way, a signal conditioner that can adjust the amplitude of the electromagnetic wave signal is formed.
  • the insulating layer may further include a second insulating layer covering the second portion.
  • the at least one electrode may further include a second electrode formed on a side of the second insulating layer away from the second portion. The second electrode is separated from the first electrode.
  • a second electrode above the second part of the microstrip line is formed. The second electrode and the second part of the microstrip line are separated by a second insulating layer.
  • the microstrip line in the step of forming the microstrip line, may further include a third part.
  • the first end of the third part is connected to the second end of the first part.
  • the insulating layer may further include a third insulating layer covering the third portion.
  • the at least one electrode in the step of forming the at least one electrode, may further include a third electrode.
  • the third electrode is formed on a side of the third insulating layer away from the third part. The third electrode is separated from the first electrode and the second electrode respectively.
  • a third part of the microstrip line and a third electrode above the third part are formed.
  • the third electrode and the third part of the microstrip line are separated by a third insulating layer.
  • FIG. 5A, FIG. 6A, FIG. 7A, FIG. 11A, and FIG. 2B are cross-sectional views showing the structure of several stages taken along the line D-D' in FIG. 3A, for example.
  • 5B, 6B, 7B, 11B, and 3B are cross-sectional views showing the structure of several stages taken along the line C-C' in FIG. 3A, for example.
  • the manufacturing process of the signal conditioner according to other embodiments of the present disclosure will be described in detail below with reference to these drawings.
  • the microstrip line 100 on the first substrate 161 may include the first part 101, the second part 102, and the third part 103
  • the insulating layer on the microstrip line 100 for example, may include The first insulating layer 131, the second insulating layer 132, and the third insulating layer 133) and at least one electrode on the insulating layer (for example, the first electrode 111, the second electrode 112, and the third electrode 113 may be included).
  • a common electrode line 150 is formed on the second substrate 162.
  • the first substrate 161 and the second substrate 162 are butted, so that the microstrip line 100, the insulating layer, the at least one electrode and the common electrode line 150 are connected to the first substrate 161 Between the second substrate 162.
  • the first substrate and the second substrate may be connected to each other by using packaging glue.
  • liquid crystal is introduced between the first substrate 161 and the second substrate 162 to form a liquid crystal layer 140 covering the microstrip line 100, the insulating layer, and the at least one electrode.
  • a part of the liquid crystal layer 140 is between the microstrip line 100 and the common electrode line 150.
  • the signal conditioner is formed by this manufacturing method.
  • the signal conditioner can adjust the amplitude and phase of the electromagnetic wave signal.
  • FIG. 12 is a schematic diagram showing the structure of an antenna device according to some embodiments of the present disclosure.
  • the antenna device may include at least one signal conditioner 1274 and at least one antenna unit 1272.
  • the signal conditioner 1274 may be the aforementioned signal conditioner, such as the signal conditioner shown in FIG. 1A, FIG. 2A or FIG. 3A.
  • each of the at least one antenna unit 1272 is electrically connected to a signal conditioner 1274.
  • the signal conditioner as described above is notified to adjust at least one of the amplitude and phase of the electromagnetic wave signal. This can reduce the side lobe of the antenna device's directional pattern, thereby improving the anti-interference ability of the system.
  • the at least one signal conditioner 1274 includes a plurality of signal conditioners 1274
  • the at least one antenna unit 1272 includes a plurality of antenna units 1272.
  • the plurality of signal conditioners 1274 and the plurality of antenna units 1272 are electrically connected in a one-to-one correspondence.
  • the antenna device may further include a signal transmission unit 1276.
  • the signal transmission unit 1276 is electrically connected to the plurality of signal conditioners 1274.
  • the signal transmission unit 1276 may include at least one of a power divider and a combiner.
  • the antenna device may further include a transmission port 1278.
  • the electromagnetic wave signal can be input to the signal conditioner 1274 through the transmission port 1278 and the signal transmission unit 1276. After the signal conditioner 1274 adjusts the signal amplitude and/or phase, the adjusted signal is transmitted through the antenna unit 1272. Alternatively, the electromagnetic wave signal is received by the antenna unit 1272 and transmitted to the signal conditioner 1274. The signal conditioner 1274 adjusts the amplitude and/or phase of the signal, and transmits the adjusted signal to other devices through the signal transmission unit 1276 and the transmission port 1278. The antenna device realizes the adjustment of the amplitude and/or phase of the electromagnetic wave signal.

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Abstract

本公开提供了一种信号调节器、天线装置和制造方法，涉及电子通信技术领域。该信号调节器包括：微带线、绝缘层、至少一个电极、液晶层和公共电极线。该微带线至少包括第一部分和第二部分。该第一部分的第一端与该第二部分的第一端连接。该第一部分的第二端与该第二部分的第二端连接。该绝缘层包括覆盖第一部分的第一绝缘层。该至少一个电极包括第一电极。该第一电极在第一绝缘层的背离第一部分的一侧。该液晶层覆盖微带线、绝缘层和该至少一个电极。该公共电极线在液晶层的背离微带线的一侧。该信号调节器可以实现对电磁波信号幅度的调节。

Description

信号调节器、天线装置和制造方法
相关申请的交叉引用
本申请是以CN申请号为201910137384.4，申请日为2019年2月25日的申请为基础，并主张其优先权，该CN申请的公开内容在此作为整体引入本申请中。
技术领域
本公开涉及电子通信技术领域，特别涉及一种信号调节器、天线装置和制造方法。
背景技术
移相器和衰减器广泛应用于电子通信系统中，是相控阵雷达、合成孔径雷达、雷达电子对抗、卫星通信、接收发机中的核心组件。通过移相器和衰减器的综合作用，可降低天线方向图的副瓣，以及实现天线的扫描等特性。在相关技术中，出现了液晶相控阵天线。基于液晶材料的相控阵天线可以实现天线波束的扫描功能。
发明内容
根据本公开实施例的一个方面，提供了一种信号调节器，包括：微带线，至少包括第一部分和第二部分，所述第一部分的第一端与所述第二部分的第一端连接，所述第一部分的第二端与所述第二部分的第二端连接；绝缘层，包括覆盖所述第一部分的第一绝缘层；至少一个电极，包括第一电极，所述第一电极在所述第一绝缘层的背离所述第一部分的一侧；液晶层，覆盖所述微带线、所述绝缘层和所述至少一个电极；和公共电极线，在所述液晶层的背离所述微带线的一侧。
在一些实施例中，所述绝缘层还包括覆盖所述第二部分的第二绝缘层；所述至少一个电极还包括第二电极，所述第二电极在所述第二绝缘层的背离所述第二部分的一侧，所述第二电极与所述第一电极通过所述液晶层的一部分隔离开。
在一些实施例中，所述第一电极的长度L1和所述第二电极的长度L2满足以下条件：
Figure PCTCN2019125091-appb-000001
其中，c为光速，f为所传输信号的频率，ε //为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向平行的情况下的液晶的介电常数，ε ⊥为在液晶分子长轴的排 布状态与施加到液晶的驱动电场的方向垂直的情况下的液晶的介电常数。
在一些实施例中，所述第一电极的宽度与所述第二电极的宽度相等。
在一些实施例中，所述第一部分和所述第二部分分别呈弯曲形状。
在一些实施例中，所述微带线还包括第三部分，所述第三部分的第一端与所述第一部分的第二端连接；所述绝缘层还包括覆盖所述第三部分的第三绝缘层；所述至少一个电极还包括第三电极，所述第三电极在所述第三绝缘层的背离所述第三部分的一侧，所述第三电极与所述第一电极、所述第二电极分别通过所述液晶层的一部分隔离开。
在一些实施例中，所述第三电极的长度L3满足以下条件：
Figure PCTCN2019125091-appb-000002
其中，c为光速，f为所传输信号的频率，ε //为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向平行的情况下的液晶的介电常数，ε ⊥为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向垂直的情况下的液晶的介电常数。
在一些实施例中，所述信号调节器还包括：与所述第一部分的第一端连接的第一射频口；以及与所述第三部分的第二端连接的第二射频口。
在一些实施例中，所述第二部分与所述第一部分相对所述第一射频口的延伸方向所在的直线对称设置。
在一些实施例中，所述信号调节器还包括：第一基板和第二基板，其中，所述微带线、所述绝缘层、所述至少一个电极、所述液晶层和所述公共电极线位于所述第一基板与所述第二基板之间，所述微带线、所述绝缘层和所述至少一个电极在所述第一基板上，所述公共电极线在所述第二基板上。
根据本公开实施例的另一个方面，提供了一种天线装置，包括：至少一个如前所述的信号调节器；和至少一个天线单元，所述至少一个天线单元的每一个与一个信号调节器电连接。
在一些实施例中，所述至少一个信号调节器包括多个信号调节器，所述至少一个天线单元包括多个天线单元；所述天线装置还包括：信号传输单元，与所述多个信号调节器电连接，其中，所述信号传输单元包括功分器和合路器中的至少一个。
根据本公开实施例的另一个方面，提供了一种信号调节器的制造方法，包括：在第一基板上形成微带线，其中，所述微带线至少包括第一部分和第二部分，所述第一部分的第一端与所述第二部分的第一端连接，所述第一部分的第二端与所述第二部分 的第二端连接；在所述微带线的背离所述第一基板的一侧形成绝缘层，其中，所述绝缘层包括覆盖所述第一部分的第一绝缘层；在所述绝缘层的背离所述微带线的一侧形成至少一个电极，所述至少一个电极包括第一电极，所述第一电极形成在所述第一绝缘层的背离所述第一部分的一侧；在所述第一基板上导入覆盖所述微带线、所述绝缘层和所述至少一个电极的液晶层；在第二基板上形成公共电极线；以及将所述第一基板与所述第二基板对接，使得所述液晶层和所述公共电极线在所述第一基板与所述第二基板之间。
在一些实施例中，在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第二部分的第二绝缘层；在形成所述至少一个电极的步骤中，所述至少一个电极还包括第二电极，所述第二电极形成在所述第二绝缘层的背离所述第二部分的一侧，所述第二电极与所述第一电极隔离开。
在一些实施例中，在形成所述微带线的步骤中，所述微带线还包括第三部分，所述第三部分的第一端与所述第一部分的第二端连接；在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第三部分的第三绝缘层；在形成所述至少一个电极的步骤中，所述至少一个电极还包括第三电极，所述第三电极形成在所述第三绝缘层的背离所述第三部分的一侧，所述第三电极与所述第一电极、所述第二电极分别隔离开。
根据本公开实施例的另一个方面，提供了一种信号调节器的制造方法，包括：在第一基板上形成微带线，其中，所述微带线至少包括第一部分和第二部分，所述第一部分的第一端与所述第二部分的第一端连接，所述第一部分的第二端与所述第二部分的第二端连接；在所述微带线的背离所述第一基板的一侧形成绝缘层，其中，所述绝缘层包括覆盖所述第一部分的第一绝缘层；在所述绝缘层的背离所述微带线的一侧形成至少一个电极，所述至少一个电极包括第一电极，所述第一电极形成在所述第一绝缘层的背离所述第一部分的一侧；在第二基板上形成公共电极线；将所述第一基板与所述第二基板对接，使得所述微带线、所述绝缘层、所述至少一个电极和所述公共电极线在所述第一基板与所述第二基板之间；以及将液晶导入所述第一基板与所述第二基板之间以形成覆盖所述微带线、所述绝缘层和所述至少一个电极的液晶层，所述液晶层的一部分在所述微带线与所述公共电极线之间。
在一些实施例中，在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第二部分的第二绝缘层；在形成所述至少一个电极的步骤中，所述至少一个电极还包括第二电极，所述第二电极形成在所述第二绝缘层的背离所述第二部分的一侧，所述第二 电极与所述第一电极隔离开。
在一些实施例中，在形成所述微带线的步骤中，所述微带线还包括第三部分，所述第三部分的第一端与所述第一部分的第二端连接；在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第三部分的第三绝缘层；在形成所述至少一个电极的步骤中，所述至少一个电极还包括第三电极，所述第三电极形成在所述第三绝缘层的背离所述第三部分的一侧，所述第三电极与所述第一电极、所述第二电极分别隔离开。
通过以下参照附图对本公开的示例性实施例的详细描述，本公开的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本公开的实施例，并且连同说明书一起用于解释本公开的原理。
参照附图，根据下面的详细描述，可以更加清楚地理解本公开，其中：
图1A是示出根据本公开一些实施例的信号调节器的俯视图；
图1B是示出根据本公开一些实施例的信号调节器沿着图1A中的线A-A’截取的结构的截面图；
图2A是示出根据本公开另一些实施例的信号调节器的俯视图；
图2B是示出根据本公开另一些实施例的信号调节器沿着图2A中的线B-B’截取的结构的截面图；另外，图2B还是示出根据本公开另一些实施例的信号调节器沿着图3A中的线D-D’截取的结构的截面图；
图3A是示出根据本公开另一些实施例的信号调节器的俯视图；
图3B是示出根据本公开另一些实施例的信号调节器沿着图3A中的线C-C’截取的结构的截面图；
图4是示出根据本公开一些实施例的信号调节器的制造方法的流程图；
图5A是示出根据本公开一些实施例的信号调节器的制造方法中在一个阶段的结构的截面图；
图5B是示出根据本公开一些实施例的信号调节器的制造方法中在一个阶段的结构的截面图；
图6A是示出根据本公开一些实施例的信号调节器的制造方法中在另一个阶段的结构的截面图；
图6B是示出根据本公开一些实施例的信号调节器的制造方法中在另一个阶段的结构的截面图；
图7A是示出根据本公开一些实施例的信号调节器的制造方法中在另一个阶段的结构的截面图；
图7B是示出根据本公开一些实施例的信号调节器的制造方法中在另一个阶段的结构的截面图；
图8A是示出根据本公开一些实施例的信号调节器的制造方法中在另一个阶段的结构的截面图；
图8B是示出根据本公开一些实施例的信号调节器的制造方法中在另一个阶段的结构的截面图；
图9是示出根据本公开一些实施例的信号调节器的制造方法中在另一个阶段的结构的截面图；
图10是示出根据本公开另一些实施例的信号调节器的制造方法的流程图；
图11A是示出根据本公开另一些实施例的信号调节器的制造方法中在一个阶段的结构的截面图；
图11B是示出根据本公开另一些实施例的信号调节器的制造方法中在一个阶段的结构的截面图；
图12是示出根据本公开一些实施例的天线装置的结构示意图。
应当明白，附图中所示出的各个部分的尺寸并不是按照实际的比例关系绘制的。此外，相同或类似的参考标号表示相同或类似的构件。
具体实施方式
现在将参照附图来详细描述本公开的各种示例性实施例。对示例性实施例的描述仅仅是说明性的，决不作为对本公开及其应用或使用的任何限制。本公开可以以许多不同的形式实现，不限于这里所述的实施例。提供这些实施例是为了使本公开透彻且完整，并且向本领域技术人员充分表达本公开的范围。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、材料的组分、数字表达式和数值应被解释为仅仅是示例性的，而不是作为限制。
本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的部分。“包括”或者“包含”等类似的词语意指在该词前的 要素涵盖在该词后列举的要素，并不排除也涵盖其他要素的可能。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
在本公开中，当描述到特定器件位于第一器件和第二器件之间时，在该特定器件与第一器件或第二器件之间可以存在居间器件，也可以不存在居间器件。当描述到特定器件连接其它器件时，该特定器件可以与所述其它器件直接连接而不具有居间器件，也可以不与所述其它器件直接连接而具有居间器件。
本公开使用的所有术语(包括技术术语或者科学术语)与本公开所属领域的普通技术人员理解的含义相同，除非另外特别定义。还应当理解，在诸如通用字典中定义的术语应当被解释为具有与它们在相关技术的上下文中的含义相一致的含义，而不应用理想化或极度形式化的意义来解释，除非这里明确地这样定义。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
本公开的发明人发现，相关技术的液晶相控阵天线不能对电磁波信号进行幅度调节。这导致很难降低液晶相控阵天线的方向图的副瓣。鉴于此，本公开的实施例提供一种信号调节器，从而可以调节电磁波信号的幅度。
下面结合附图详细描述根据本公开一些实施例的信号调节器。
图1A是示出根据本公开一些实施例的信号调节器的俯视图。图1B是示出根据本公开一些实施例的信号调节器沿着图1A中的线A-A’截取的结构的截面图。下面结合图1A和图1B详细描述根据本公开一些实施例的信号调节器的结构。
在一些实施例中，如图1A和图1B所示，该信号调节器包括微带线100、绝缘层、至少一个电极、液晶层140和公共电极线150。
如图1A和图1B所示，该微带线100至少包括第一部分101和第二部分102。该第一部分101的第一端1011与该第二部分102的第一端1021连接。该第一部分101的第二端1012与该第二部分102的第二端1022连接。该第一部分101和该第二部分102可以分别呈弯曲形状。例如，该第一部分101可以包括多个弯曲部，该第二部分102也可以包括多个弯曲部。
在一些实施例中，如图1A所示，微带线的第二部分102与第一部分101可以相对第一射频口121(或第二射频口122，后面将描述)的延伸方向所在的直线对称设置。当然，本公开实施例的范围并不仅限于此。例如，微带线的第二部分102与第一 部分101可以相对该直线非对称设置。
如图1B所示，该绝缘层包括覆盖该第一部分101的第一绝缘层131。例如该绝缘层可以为钝化层。例如，该绝缘层的材料可以包括二氧化硅或氮化硅等。
如图1A和图1B所示，所述至少一个电极包括第一电极111。该第一电极111在该第一绝缘层131的背离该第一部分101的一侧。该第一电极111在该第一绝缘层131的表面上。该第一绝缘层131将该第一电极111和微带线的第一部分101隔离开。例如，该第一电极111的材料可以包括ITO(Indium Tin Oxide，氧化铟锡)或金属等导电材料。
在一些实施例中，如图1A所示，该第一电极111的延伸方向与微带线的第一部分101的延伸方向相同。
如图1B所示，该液晶层140覆盖该微带线100、该绝缘层(例如第一绝缘层131)和该至少一个电极(例如第一电极111)。
如图1B所示，该公共电极线150在该液晶层140的背离微带线100的一侧。这使得液晶层140的一部分位于该公共电极线150与该微带线100之间。例如，该公共电极线150可以是接地电极线。
在上述实施例中，提供了根据本公开一些实施例的信号调节器。在该信号调节器中，微带线包括第一部分和第二部分。在第一部分上设置第一绝缘层。在第一绝缘层上设置第一电极。这样，第一绝缘层将该第一电极和该微带线的第一部分隔离开。在该信号调节器中，液晶层覆盖微带线、绝缘层和电极。在液晶层的背离微带线的一侧设置有公共电极线。该信号调节器可以实现对电磁波信号的幅度调节。
在传输电磁波信号的过程中，公共电极线被施加公共电位(例如接地电位)，该电磁波信号通过微带线的一端输入该信号调节器，并沿着在微带线与公共电极线之间的液晶部分传输。在上述信号调节器中，微带线包括第一部分和第二部分。因此，电磁波信号分别沿着两条支路传输，其中，第一条支路为在第一部分与公共电极线之间的液晶部分，第二条支路为在第二部分与公共电极线之间的液晶部分。在该传输电磁波信号的过程中，可以利用对电极施加电压来调节该电磁波信号的幅度。例如，对第一电极施加电压，使得在第一条支路中的液晶部分的介电常数发生改变。由于在微带线的第二部分的上方没有设置电极，因此，第二条支路的液晶部分的介电常数不发生改变。液晶层在不同电压下会表现出不同的介电常数，电磁波信号在不同介电常数的介质中传播过程中其相位常数会不同。在传播相同长度下，不同的传播相位常数会产 生不同的相位。不同相位的两个信号合成，合成后的电磁波信号的幅度会发生变化。因此，分别沿着上述两个液晶部分传输的电磁波信号合成后，该电磁波信号的幅度发生改变。因此，本公开上述实施例的信号调节器可以实现对电磁波信号幅度的调节。
在一些实施例中，在将该信号调节器应用到天线装置的情况下，可以使得该天线装置实现改变电磁波信号的幅度的目的。通过改变电磁波信号的幅度，可以降低天线方向图的副瓣，从而提高系统的抗干扰能力。
在一些实施例中，如图1A所示，该信号调节器还可以包括：与第一部分101的第一端1011(或第二部分102的第一端1021)连接的第一射频口121和与第二部分102的第二端1022(或第一部分101的第二端1012)连接的第二射频口122。这里，第一射频口121和第二射频口122可以分别作为输入输出端口。
在一些实施例中，该第一射频口121和该第二射频口122的材料与微带线100的材料相同。这样在制造过程中，可以在形成微带线的过程中形成这两个射频口，从而方便制造。
在一些实施例中，如图1B所示，该信号调节器还包括第一基板161和第二基板162。该微带线100、绝缘层(例如图1B中的第一绝缘层131)、所述至少一个电极(例如图1B中的第一电极111)、液晶层140和公共电极线150位于该第一基板161与该第二基板162之间。该微带线100、该绝缘层和该至少一个电极在该第一基板161上。该公共电极线150在该第二基板162上。这两个基板对各个结构层可以起到支撑和保护的作用。
需要说明的是，图1A中并没有示出该第一基板、该第二基板、公共电极线和液晶层，这是为了方便示出微带线和电极。另外，图1A是以俯视的视觉角度示出了微带线与电极的结构关系，但实际上，在截面图(例如图1B)中可以看出微带线与电极是隔离开的。下面图2A和图3A与图1A类似。
图2A是示出根据本公开另一些实施例的信号调节器的俯视图。图2B是示出根据本公开另一些实施例的信号调节器沿着图2A中的线B-B’截取的结构的截面图。如图2A和2B所示，该信号调节器包括一些与图1A和图1B所示的信号调节器相同或相似的结构。
在一些实施例中，如图2B所示，该绝缘层还包括覆盖微带线的第二部分102的第二绝缘层132。
在一些实施例中，如图2A和图2B所示，所述至少一个电极还可以包括第二电极 112。该第二电极112在该第二绝缘层132的背离该第二部分102的一侧。该第二电极112在该第二绝缘层132的表面上。该第二绝缘层132将该第二电极112和微带线的第二部分102隔离开。该第二电极112与该第一电极111通过液晶层140的一部分隔离开。
这样，在该实施例的信号调节器中，在微带线的第一部分的上方设置了第一电极，在该微带线的第二部分的上方设置了第二电极。因此，在调节电磁波信号的幅度的过程中，可以对第一电极和第二电极施加不同的电压，从而改变各自相应支路的液晶部分的介电常数，以便调节沿着两条支路的液晶部分分别传输的电磁波信号的相位。这样，在将不同相位的电磁波信号合成为一个电磁波信号后，该合成后的电磁波信号的幅度发生改变。利用该实施例的信号调节器可以更加方便地调节电磁波信号的幅度。
在一些实施例中，第一电极111的长度与第二电极112的长度相等。这可以减小这两个电极对信号的不可控影响，有利于对信号幅度的可控调节。这里需要说明的是，电极的长度是指电极沿着微带线的延伸方向的尺寸。例如，第一电极的长度是指第一电极沿着微带线的第一部分的延伸方向的尺寸，第二电极的长度是指第二电极沿着微带线的第二部分的延伸方向的尺寸。
例如，假定液晶分子垂直电场时的材料特性为ε ⊥和tanδ ⊥，液晶分子平行电场时的材料特性为ε ∥和tanδ ∥。第一电极111的长度L1和第二电极112的长度L2满足以下条件：
Figure PCTCN2019125091-appb-000003
其中，c为光速，f为所传输信号的频率，ε //为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向平行的情况下的液晶的介电常数，ε ⊥为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向垂直的情况下的液晶的介电常数。第一电极111的长度L1和第二电极112的长度L2满足上述公式(1)的条件，可以使得信号衰减的动态范围变大，即幅度调节的范围比较大。
下面描述上述关系式(1)的由来：
电磁波在介质(例如该介质的介电常数为ε)中传播，则该电磁波的波长λ g为
Figure PCTCN2019125091-appb-000004
因此，电磁波在介电常数分别为ε //的液晶介质中传播时的波长λ g//为
Figure PCTCN2019125091-appb-000005
电磁波在介电常数分别为ε ⊥的液晶介质中传播时的波长λ g⊥为
Figure PCTCN2019125091-appb-000006
电磁波在介质中传播时的相位φ为
Figure PCTCN2019125091-appb-000007
这里，L为传播长度。
以沿着在第一电极111上的液晶部分传播为例，传播长度＝第一电极的长度L1。
电磁波在介电常数分别为ε //的液晶介质中传播时的相位Ф //为
Figure PCTCN2019125091-appb-000008
电磁波在介电常数分别为ε ⊥的液晶介质中传播时的相位Ф ⊥为
Figure PCTCN2019125091-appb-000009
电磁波的相位变化ΔФ为
Figure PCTCN2019125091-appb-000010
在
Figure PCTCN2019125091-appb-000011
(电磁波在满足该条件的情况下，可以在传播过程中产生大于或等于π的相位差)的情况下，有
Figure PCTCN2019125091-appb-000012
同理，可以计算得到
Figure PCTCN2019125091-appb-000013
这样，在第一电极111的长度L1与第二电极112的长度L2相等的情况下，可以有上述关系式(1)。
另外，tanδ ⊥是液晶分子排列状态和电场方向垂直时，材料所表现出来的损耗角正切；tanδ ∥是液晶分子排列状态和电场方向平行时，材料所表现出来的损耗角正切。该信号调节器的幅度调整范围与tanδ ⊥和tanδ ∥的取值范围有关。
通过仿真得到，在(tanδ ⊥-tanδ ∥)/tanδ ⊥＝0.7时，该信号调节器的幅度调整范围为0-17dB。如果进一步降低tanδ ⊥与tanδ ∥的差值(即tanδ ⊥-tanδ ∥)的动态范围，则该信号调节器的幅度调整范围可进一步增大。即该信号调节器的幅度调整范围与tanδ ⊥与tanδ ∥的差值的动态范围反相关。
在一些实施例中，如图2A所示，该第一电极111与该第二电极112可以相对第一射频口121(或第二射频口122)的延伸方向所在的直线对称设置。通过将这两个电极对称设置，可以方便调节电磁波信号的幅度。当然，本领域技术人员应该明白，第一电极111与第二电极112也可以相对该直线非对称设置。
在一些实施例中，如图2B所示，第一电极111的宽度W1与第二电极112的宽 度W2相等。这样可以尽量保证两条支线上的损耗一致。这里，需要说明的是，电极的宽度是指电极在横截面图中的横向尺寸。例如，第一电极111的宽度是指第一电极在图2B中的横向尺寸，第二电极112的宽度是指第二电极在图2B中的横向尺寸。
图3A是示出根据本公开另一些实施例的信号调节器的俯视图。图3B是示出根据本公开另一些实施例的信号调节器沿着图3A中的线C-C’截取的结构的截面图。另外，图3A中沿着线D-D’截取的结构的截面图可以参考图2B所示。图3A所示的信号调节器包括一些与图2A和图2B所示的信号调节器相同或相似的结构。
在一些实施例中，如图3A和图3B所示，该微带线100还可以包括第三部分103。该第三部分103的第一端1031与第一部分101的第二端1012连接。该绝缘层还可以包括覆盖该第三部分103的第三绝缘层133。所述至少一个电极还可以包括第三电极113。该第三电极113在该第三绝缘层133的背离该第三部分103的一侧。该第三电极113在该第三绝缘层133的表面上。该第三绝缘层133将该第三电极113和该微带线的第三部分103隔离开。该第三电极113与第一电极111、第二电极112分别通过液晶层140的一部分隔离开。
在该实施例中，在信号调节器中设置了微带线的第三部分、第三绝缘层和第三电极。在电磁波信号在该信号调节器内传输的过程中，该电磁波信号可以在微带线的第三部分与公共电极线之间的液晶部分传输。通过对第三电极施加电压来改变该液晶部分的介电常数。这样可以改变所传输电磁波信号的相位。因此，图3A所示的该信号调节器除了可以如图2A所示的信号调节器实现对电磁波信号的幅度的可控调节之外，还可以实现对电磁波信号的相位的可控调节。
在将该信号调节器应用到天线装置的情况下，可以使得该天线装置实现改变电磁波信号的幅度和相位的目的。这可以更加方便地降低天线方向图的副瓣，从而提高系统的抗干扰能力。
在一些实施例中，该第三电极113的长度L3满足以下条件：
Figure PCTCN2019125091-appb-000014
其中，c为光速，f为所传输信号的频率，ε //为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向平行的情况下的液晶的介电常数，ε ⊥为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向垂直的情况下的液晶的介电常数。该第三电极113的长度L3满足上述关系式(11)的条件，可以使得信号实现360度的相位差。
关于上述关系式(11)，可以采用与前面所述的类似的推导过程得到。电磁波沿 着在第三电极113上的液晶部分传播，则该电磁波的相位变化ΔФ为
Figure PCTCN2019125091-appb-000015
在
Figure PCTCN2019125091-appb-000016
(电磁波在满足该条件的情况下，可以在传播过程中产生大于或等于2π的相位差)的情况下，有上述关系式
Figure PCTCN2019125091-appb-000017
在一些实施例中，第一电极111的宽度、第二电极112的宽度和第三电极113的宽度均与微带线100的宽度相等。这样可以降低三个电极对信号的不可控影响。
在另一些实施例中，第一电极111的宽度、第二电极112的宽度和第三电极113的宽度与微带线100的宽度可以不相等。例如，这三个电极的宽度可以分别不超过微带线宽度的2倍。
在一些实施例中，如图3A所示，该信号调节器还可以包括：与第一部分101的第一端1011连接的第一射频口121和与第三部分103的第二端1032连接的第二射频口322。这里，第一射频口121和第二射频口322可以分别作为输入输出端口。
在一些实施例中，该第一射频口121和该第二射频口322的材料与微带线100的材料相同。这样在制造过程中，可以在形成微带线的过程中形成这两个射频口，从而方便制造。
在本公开的一些实施例中，上述基于液晶的幅相调节器可单独地调控信号的幅度，也可单独地调控信号的相位，还可以既调节信号的幅度又调节信号的相位。该幅相调节器可以应用于相控阵天线。在对天线的方向图赋形时可以实现多样化。通过降低天线方向图的副瓣，可以提高系统的抗干扰能力。
图4是示出根据本公开一些实施例的信号调节器的制造方法的流程图。如图4所示，该制造方法包括步骤S402～S412。
在步骤S402，在第一基板上形成微带线。该微带线至少包括第一部分和第二部分。该第一部分的第一端与该第二部分的第一端连接，该第一部分的第二端与该第二部分的第二端连接。
在步骤S404，在微带线的背离第一基板的一侧形成绝缘层。该绝缘层包括覆盖第一部分的第一绝缘层。
在步骤S406，在绝缘层的背离微带线的一侧形成至少一个电极。所述至少一个电极包括第一电极。该第一电极形成在该第一绝缘层的背离该第一部分的一侧。
在步骤S408，在第一基板上导入覆盖微带线、绝缘层和所述至少一个电极的液晶 层。
在步骤S410，在第二基板上形成公共电极线。
在步骤S412，将第一基板与第二基板对接，使得液晶层和公共电极线在该第一基板与该第二基板之间。通过将第一基板与第二基板对接，使得微带线、绝缘层、所述至少一个电极、液晶层和公共电极线均在这两个基板之间。
在上述实施例中，提供了根据本公开一些实施例的信号调节器的制造方法。在该制造方法中，形成了在第一基板上的微带线、在该微带线上的绝缘层、在该绝缘层上的电极、和覆盖微带线、绝缘层和电极的液晶层。在第二基板上形成公共电极线。然后将这两个基板对接，使得微带线、绝缘层、电极、液晶层和公共电极线在这两个基板之间。这样，形成了可以调节电磁波信号的幅度的信号调节器。
在一些实施例中，在形成绝缘层的步骤中，该绝缘层还可以包括覆盖第二部分的第二绝缘层。在形成所述至少一个电极的步骤中，所述至少一个电极还可以包括第二电极。该第二电极形成在该第二绝缘层的背离该第二部分的一侧。该第二电极与该第一电极隔离开。在该实施例中，形成了在微带线的第二部分上方的第二电极。该第二电极与微带线的第二部分被第二绝缘层隔离开。
在一些实施例中，在形成微带线的步骤中，该微带线还可以包括第三部分。该第三部分的第一端与该第一部分的第二端连接。在形成绝缘层的步骤中，该绝缘层还可以包括覆盖该第三部分的第三绝缘层。在形成所述至少一个电极的步骤中，所述至少一个电极还可以包括第三电极。该第三电极形成在该第三绝缘层的背离该第三部分的一侧。该第三电极与该第一电极、该第二电极分别隔离开。在该实施例中，形成了微带线的第三部分以及在该第三部分上方的第三电极。该第三电极与微带线的第三部分被第三绝缘层隔离开。
图5A-图5B、图6A-图6B、图7A-图7B、图8A-图8B、图9、图2B和图3B是示出根据本公开一些实施例的信号调节器的制造方法中在若干阶段的结构的截面图。这里，图5A、图6A、图7A、图8A和图2B是示出沿着例如图3A中的线D-D’所截取的若干阶段的结构的截面图。图5B、图6B、图7B、图8B和图3B是示出沿着例如图3A中的线C-C’所截取的若干阶段的结构的截面图。下面结合这些附图详细描述根据本公开一些实施例的信号调节器的制造过程。
首先，如图5A所示，在第一基板161上形成微带线100。该微带线100至少包括第一部分101和第二部分102。该第一部分101的第一端与该第二部分102的第一端 连接，该第一部分101的第二端与该第二部分102的第二端连接(可以参考图3A所示，图5A中未示出)。例如，可以通过沉积和刻蚀等工艺在第一基板161上形成图案化的微带线100。该微带线100的材料可以包括ITO或金属等导电材料。
在一些实施例中，如图5B所示，该微带线100还可以包括第三部分103。该第三部分103的第一端与该第一部分101的第二端连接(可以参考图3A所示，图5B中未示出)。
接下来，在微带线100的背离第一基板161的一侧形成绝缘层。例如，如图6A所示，该绝缘层可以包括覆盖第一部分101的第一绝缘层131。又例如，如图6A所示，该绝缘层还可以包括覆盖第二部分102的第二绝缘层132。又例如，如图6B所示，该绝缘层还可以包括覆盖第三部分103的第三绝缘层133。例如，可以通过沉积和刻蚀等工艺形成图案化的绝缘层。该绝缘层的材料可以包括二氧化硅或氮化硅等。
接下来，在绝缘层的背离微带线100的一侧形成至少一个电极。例如，如图7A所示，该至少一个电极可以包括第一电极111。该第一电极111形成在该第一绝缘层131的背离该第一部分101的一侧。该第一电极形成在第一绝缘层131的表面上。
又例如，如图7A所示，在该形成至少一个电极的过程中，该至少一个电极还可以包括第二电极112。该第二电极112形成在该第二绝缘层132的背离第二部分102的一侧。该第二电极112形成在该第二绝缘层132的表面上。该第二电极112与该第一电极111隔离开。
又例如，如图7B所示，在该形成至少一个电极的过程中，该至少一个电极还可以包括第三电极113。该第三电极113形成在该第三绝缘层133的背离该第三部分103的一侧。该第三电极113形成在该第三绝缘层133的表面上。该第三电极113与该第一电极111、该第二电极112分别隔离开。
接下来，如图8A和图8B所示，在第一基板161上导入覆盖微带线100、绝缘层(例如第一绝缘层131、第二绝缘层132和第三绝缘层133)和所述至少一个电极(例如第一电极111、第二电极112和第三电极113)的液晶层140。例如，在第一基板上形成包围微带线、绝缘层和所示至少一个电极的封装胶，将液晶导入该第一基板上的封装胶内，从而从此液晶层。
接下来，如图9所示，在第二基板162上形成公共电极线150。例如，可以通过沉积和刻蚀等工艺形成公共电极线。该公共电极线的材料包括ITO或金属等导电材料。
接下来，如图2B和图3B所示，将第一基板161与第二基板162对接，使得微带 线100、绝缘层、所述至少一个电极、液晶层140和公共电极线150均在这两个基板之间。
至此，提供了根据本公开一些实施例的信号调节器的制造方法。通过该制造方法形成了信号调节器。该信号调节器可以调节电磁波信号的幅度和相位中的至少一个。
图10是示出根据本公开另一些实施例的信号调节器的制造方法的流程图。如图10所示，该制造方法包括步骤S1072～S1082。
在步骤S1072，在第一基板上形成微带线。该微带线至少包括第一部分和第二部分。该第一部分的第一端与该第二部分的第一端连接，该第一部分的第二端与该第二部分的第二端连接。
在步骤S1074，在微带线的背离第一基板的一侧形成绝缘层。该绝缘层包括覆盖该第一部分的第一绝缘层。
在步骤S1076，在绝缘层的背离微带线的一侧形成至少一个电极。该至少一个电极包括第一电极。该第一电极形成在该第一绝缘层的背离该第一部分的一侧。
在步骤S1078，在第二基板上形成公共电极线。
在步骤S1080，将第一基板与第二基板对接，使得微带线、绝缘层、所述至少一个电极和公共电极线在该第一基板与该第二基板之间。
在步骤S1082，将液晶导入第一基板与第二基板之间以形成覆盖微带线、绝缘层和所述至少一个电极的液晶层。该液晶层的一部分在微带线与公共电极线之间。
在上述实施例中，提供了根据本公开另一些实施例的信号调节器的制造方法。在该制造方法中，形成在第一基板上的微带线、在该微带线上的绝缘层和在该绝缘层上的电极。在第二基板上形成公共电极线。然后将这两个基板对接，使得微带线、绝缘层、电极和公共电极线在这两个基板之间。接下来，将液晶导入这两个基板之间以形成液晶层。这样，形成了可以调节电磁波信号的幅度的信号调节器。
在一些实施例中，在形成绝缘层的步骤中，该绝缘层还可以包括覆盖第二部分的第二绝缘层。在形成所述至少一个电极的步骤中，该至少一个电极还可以包括第二电极，该第二电极形成在该第二绝缘层的背离第二部分的一侧。该第二电极与该第一电极隔离开。在该实施例中，形成了在微带线的第二部分上方的第二电极。该第二电极与微带线的第二部分被第二绝缘层隔离开。
在一些实施例中，在形成微带线的步骤中，该微带线还可以包括第三部分。该第三部分的第一端与该第一部分的第二端连接。在形成绝缘层的步骤中，该绝缘层还可 以包括覆盖该第三部分的第三绝缘层。在形成所述至少一个电极的步骤中，该至少一个电极还可以包括第三电极。该第三电极形成在该第三绝缘层的背离该第三部分的一侧。该第三电极与该第一电极、该第二电极分别隔离开。在该实施例中，形成了微带线的第三部分以及在该第三部分上方的第三电极。该第三电极与微带线的第三部分被第三绝缘层隔离开。
图5A-图5B、图6A-图6B、图7A-图7B、图9、图11A-图11B、图2B和图3B是示出根据本公开另一些实施例的信号调节器的制造方法中在若干阶段的结构的截面图。这里，图5A、图6A、图7A、图11A和图2B是示出沿着例如图3A中的线D-D’所截取的若干阶段的结构的截面图。图5B、图6B、图7B、图11B和图3B是示出沿着例如图3A中的线C-C’所截取的若干阶段的结构的截面图。下面结合这些附图详细描述根据本公开另一些实施例的信号调节器的制造过程。
前面结合图5A-图5B、图6A-图6B、以及图7A-图7B所示的结构已经详细描述了若干步骤，因此这里不在赘述。经过这些步骤，形成了在第一基板161上的微带线100(例如可以包括第一部分101、第二部分102和第三部分103)、在该微带线100上的绝缘层(例如可以包括第一绝缘层131、第二绝缘层132和第三绝缘层133)和在该绝缘层上的至少一个电极(例如可以包括第一电极111、第二电极112和第三电极113)。
接下来，如图9所示，在第二基板162上形成公共电极线150。
接下来，如图11A和图11B所示，将第一基板161与第二基板162对接，使得微带线100、绝缘层、所述至少一个电极和公共电极线150在该第一基板161与该第二基板162之间。例如，可以利用封装胶将第一基板与第二基板对接。
接下来，如图2B和图3B所示，将液晶导入第一基板161与第二基板162之间以形成覆盖微带线100、绝缘层和所述至少一个电极的液晶层140。该液晶层140的一部分在微带线100与公共电极线150之间。
至此，提供了根据本公开另一些实施例的信号调节器的制造方法。通过该制造方法形成了信号调节器。该信号调节器可以调节电磁波信号的幅度和相位。
图12是示出根据本公开一些实施例的天线装置的结构示意图。
如图12所示，该天线装置可以包括至少一个信号调节器1274和至少一个天线单元1272。例如，该信号调节器1274可以为前面所述的信号调节器，例如图1A、图2A或图3A所示的信号调节器。如图12所示，该至少一个天线单元1272的每一个与一 个信号调节器1274电连接。在该天线装置中，通知设置如前所述的信号调节器，可以实现对电磁波信号的幅度和相位这二者中的至少一个的调节。这可以降低天线装置的方向图的副瓣，从而提高系统的抗干扰能力。
在一些实施例中，如图12所示，该至少一个信号调节器1274包括多个信号调节器1274，该至少一个天线单元1272包括多个天线单元1272。例如，该多个信号调节器1274与该多个天线单元1272一一对应地电连接。该天线装置还可以包括信号传输单元1276。该信号传输单元1276与该多个信号调节器1274电连接。该信号传输单元1276可以包括功分器和合路器中的至少一个。
在一些实施例中，如图12所示，该天线装置还可以包括传输端口1278。
在上述实施例的天线装置(例如相控阵天线装置)中，电磁波信号可以经过传输端口1278和信号传输单元1276输入到信号调节器1274。经过信号调节器1274对信号进行幅度和/或相位调节后，将调节后的信号通过天线单元1272发射出去。或者，电磁波信号被天线单元1272接收并传输到信号调节器1274。通过信号调节器1274对信号进行幅度和/或相位调节，并经过信号传输单元1276和传输端口1278将调节后的信号传输到其他设备中。该天线装置实现了对电磁波信号的幅度和/或相位的调节。
至此，已经详细描述了本公开的各实施例。为了避免遮蔽本公开的构思，没有描述本领域所公知的一些细节。本领域技术人员根据上面的描述，完全可以明白如何实施这里公开的技术方案。
虽然已经通过示例对本公开的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本公开的范围。本领域的技术人员应该理解，可在不脱离本公开的范围和精神的情况下，对以上实施例进行修改或者对部分技术特征进行等同替换。本公开的范围由所附权利要求来限定。

Claims (18)

  1. 一种信号调节器，包括：
    微带线，至少包括第一部分和第二部分，所述第一部分的第一端与所述第二部分的第一端连接，所述第一部分的第二端与所述第二部分的第二端连接；
    绝缘层，包括覆盖所述第一部分的第一绝缘层；
    至少一个电极，包括第一电极，所述第一电极在所述第一绝缘层的背离所述第一部分的一侧；
    液晶层，覆盖所述微带线、所述绝缘层和所述至少一个电极；和
    公共电极线，在所述液晶层的背离所述微带线的一侧。
  2. 根据权利要求1所述的信号调节器，其中，
    所述绝缘层还包括覆盖所述第二部分的第二绝缘层；
    所述至少一个电极还包括第二电极，所述第二电极在所述第二绝缘层的背离所述第二部分的一侧，所述第二电极与所述第一电极通过所述液晶层的一部分隔离开。
  3. 根据权利要求2所述的信号调节器，其中，所述第一电极的长度L1和所述第二电极的长度L2满足以下条件：
    Figure PCTCN2019125091-appb-100001
    其中，c为光速，f为所传输信号的频率，ε //为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向平行的情况下的液晶的介电常数，ε ⊥为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向垂直的情况下的液晶的介电常数。
  4. 根据权利要求2所述的信号调节器，其中，
    所述第一电极的宽度与所述第二电极的宽度相等。
  5. 根据权利要求1所述的信号调节器，其中，
    所述第一部分和所述第二部分分别呈弯曲形状。
  6. 根据权利要求2所述的信号调节器，其中，
    所述微带线还包括第三部分，所述第三部分的第一端与所述第一部分的第二端连接；
    所述绝缘层还包括覆盖所述第三部分的第三绝缘层；
    所述至少一个电极还包括第三电极，所述第三电极在所述第三绝缘层的背离所述第三部分的一侧，所述第三电极与所述第一电极、所述第二电极分别通过所述液晶层的一部分隔离开。
  7. 根据权利要求6所述的信号调节器，其中，所述第三电极的长度L3满足以下条件：
    Figure PCTCN2019125091-appb-100002
    其中，c为光速，f为所传输信号的频率，ε //为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向平行的情况下的液晶的介电常数，ε ⊥为在液晶分子长轴的排布状态与施加到液晶的驱动电场的方向垂直的情况下的液晶的介电常数。
  8. 根据权利要求6所述的信号调节器，还包括：
    与所述第一部分的第一端连接的第一射频口；以及
    与所述第三部分的第二端连接的第二射频口。
  9. 根据权利要求8所述的信号调节器，其中，
    所述第二部分与所述第一部分相对所述第一射频口的延伸方向所在的直线对称设置。
  10. 根据权利要求1所述的信号调节器，还包括：
    第一基板和第二基板，
    其中，所述微带线、所述绝缘层、所述至少一个电极、所述液晶层和所述公共电极线位于所述第一基板与所述第二基板之间，所述微带线、所述绝缘层和所述至少一个电极在所述第一基板上，所述公共电极线在所述第二基板上。
  11. 一种天线装置，包括：
    至少一个如权利要求1至10任意一项所述的信号调节器；和
    至少一个天线单元，所述至少一个天线单元的每一个与一个信号调节器电连接。
  12. 根据权利要求11所述的天线装置，其中，
    所述至少一个信号调节器包括多个信号调节器，所述至少一个天线单元包括多个天线单元；
    所述天线装置还包括：信号传输单元，与所述多个信号调节器电连接，其中，所述信号传输单元包括功分器和合路器中的至少一个。
  13. 一种信号调节器的制造方法，包括：
    在第一基板上形成微带线，其中，所述微带线至少包括第一部分和第二部分，所述第一部分的第一端与所述第二部分的第一端连接，所述第一部分的第二端与所述第二部分的第二端连接；
    在所述微带线的背离所述第一基板的一侧形成绝缘层，其中，所述绝缘层包括覆盖所述第一部分的第一绝缘层；
    在所述绝缘层的背离所述微带线的一侧形成至少一个电极，所述至少一个电极包括第一电极，所述第一电极形成在所述第一绝缘层的背离所述第一部分的一侧；
    在所述第一基板上导入覆盖所述微带线、所述绝缘层和所述至少一个电极的液晶层；
    在第二基板上形成公共电极线；以及
    将所述第一基板与所述第二基板对接，使得所述液晶层和所述公共电极线在所述第一基板与所述第二基板之间。
  14. 根据权利要求13所述的制造方法，其中，
    在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第二部分的第二绝缘层；
    在形成所述至少一个电极的步骤中，所述至少一个电极还包括第二电极，所述第二电极形成在所述第二绝缘层的背离所述第二部分的一侧，所述第二电极与所述第一电极隔离开。
  15. 根据权利要求14所述的制造方法，其中，
    在形成所述微带线的步骤中，所述微带线还包括第三部分，所述第三部分的第一 端与所述第一部分的第二端连接；
    在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第三部分的第三绝缘层；
    在形成所述至少一个电极的步骤中，所述至少一个电极还包括第三电极，所述第三电极形成在所述第三绝缘层的背离所述第三部分的一侧，所述第三电极与所述第一电极、所述第二电极分别隔离开。
  16. 一种信号调节器的制造方法，包括：
    在第一基板上形成微带线，其中，所述微带线至少包括第一部分和第二部分，所述第一部分的第一端与所述第二部分的第一端连接，所述第一部分的第二端与所述第二部分的第二端连接；
    在所述微带线的背离所述第一基板的一侧形成绝缘层，其中，所述绝缘层包括覆盖所述第一部分的第一绝缘层；
    在所述绝缘层的背离所述微带线的一侧形成至少一个电极，所述至少一个电极包括第一电极，所述第一电极形成在所述第一绝缘层的背离所述第一部分的一侧；
    在第二基板上形成公共电极线；
    将所述第一基板与所述第二基板对接，使得所述微带线、所述绝缘层、所述至少一个电极和所述公共电极线在所述第一基板与所述第二基板之间；以及
    将液晶导入所述第一基板与所述第二基板之间以形成覆盖所述微带线、所述绝缘层和所述至少一个电极的液晶层，所述液晶层的一部分在所述微带线与所述公共电极线之间。
  17. 根据权利要求16所述的制造方法，其中，
    在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第二部分的第二绝缘层；
    在形成所述至少一个电极的步骤中，所述至少一个电极还包括第二电极，所述第二电极形成在所述第二绝缘层的背离所述第二部分的一侧，所述第二电极与所述第一电极隔离开。
  18. 根据权利要求17所述的制造方法，其中，
    在形成所述微带线的步骤中，所述微带线还包括第三部分，所述第三部分的第一端与所述第一部分的第二端连接；
    在形成所述绝缘层的步骤中，所述绝缘层还包括覆盖所述第三部分的第三绝缘层；
    在形成所述至少一个电极的步骤中，所述至少一个电极还包括第三电极，所述第三电极形成在所述第三绝缘层的背离所述第三部分的一侧，所述第三电极与所述第一电极、所述第二电极分别隔离开。
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