WO2020170498A1 - Display device - Google Patents

Display device Download PDF

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Publication number
WO2020170498A1
WO2020170498A1 PCT/JP2019/040280 JP2019040280W WO2020170498A1 WO 2020170498 A1 WO2020170498 A1 WO 2020170498A1 JP 2019040280 W JP2019040280 W JP 2019040280W WO 2020170498 A1 WO2020170498 A1 WO 2020170498A1
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WO
WIPO (PCT)
Prior art keywords
display device
substrate
adhesive layer
electrode
polarizing plate
Prior art date
Application number
PCT/JP2019/040280
Other languages
French (fr)
Japanese (ja)
Inventor
義弘 渡辺
佳克 今関
陽一 上條
光一 宮坂
修一 大澤
Original Assignee
株式会社ジャパンディスプレイ
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Publication date
Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2020170498A1 publication Critical patent/WO2020170498A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • the embodiment of the present invention relates to a display device.
  • a transparent conductive film provided on the surface of one substrate and an electrode having a ground potential provided on the other substrate are electrically connected by a conductive member such as a conductive paste from the viewpoint of preventing electrification.
  • the technology connected to is known.
  • Such a structure for preventing electrification is provided in the frame area around the display area, but further narrowing of the frame is required.
  • One of the objects of the present disclosure is to provide a display device capable of narrowing a frame in a peripheral area outside a display area.
  • the display device includes a first substrate, a polarizing plate, a second substrate, a cover member, an adhesive layer, and an electrode.
  • the first substrate has a first insulating substrate and a plurality of pixels arranged in a matrix.
  • the polarizing plate has a first surface facing the first substrate and a second surface opposite to the first surface, and overlaps the display area in which the plurality of pixels are arranged.
  • the second substrate has a second insulating substrate and is arranged between the first substrate and the first surface of the polarizing plate.
  • the cover member is provided at a position facing the second surface of the polarizing plate, and overlaps the display region and a peripheral region located around the display region.
  • the adhesive layer adheres the polarizing plate and the cover member and has conductivity.
  • the electrode is provided in the peripheral area and is maintained at a predetermined potential. The adhesive layer and the electrode are electrically connected.
  • the embodiment it is possible to provide a display device capable of narrowing a frame in the peripheral area outside the display area.
  • FIG. 1 is a plan view showing a schematic configuration of the display device according to the first embodiment.
  • FIG. 2 is a schematic perspective view in the vicinity of the mounting area of the display device according to the first embodiment.
  • FIG. 3 is a schematic cross-sectional view of the display device taken along the line II in FIG.
  • FIG. 4 is a schematic cross-sectional view of the display device taken along the line II-II in FIG.
  • FIG. 5 is a diagram showing a schematic cross section of the display device according to the comparative example and the display device according to the first embodiment.
  • FIG. 6 is a diagram showing a schematic appearance of the display device according to the comparative example and the display device according to the first embodiment.
  • FIG. 7 is a diagram showing a schematic appearance when the display device according to the first embodiment is provided with a plurality of first electrodes.
  • FIG. 8 is a plan view showing a schematic configuration of the display device according to the second embodiment.
  • FIG. 9 is a schematic perspective view in the vicinity of the mounting area of the display device according to the second embodiment.
  • FIG. 10 is a schematic cross-sectional view of the display device taken along the line III-III in FIG.
  • FIG. 11 is a diagram showing a schematic cross section of the display device according to the comparative example and the display device according to the second embodiment.
  • a liquid crystal display device including a liquid crystal display element is disclosed.
  • each embodiment does not prevent the application of each technical idea disclosed in each embodiment to another type of display device including a display element other than the liquid crystal display element.
  • Examples of other types of display devices include a self-luminous display device having an organic electroluminescence (EL) display element, a Light Emitting Diode (LED) display element, an electronic paper type display device having an electrophoretic element, and a Micro device.
  • EL organic electroluminescence
  • LED Light Emitting Diode
  • a display device to which Electro Mechanical Systems (MEMS) is applied, a display device to which electrochromism is applied, or the like can be given.
  • MEMS Electro Mechanical Systems
  • FIG. 1 is a plan view showing the appearance of a display device 1A according to the first embodiment.
  • the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90°.
  • the first direction X and the second direction Y correspond to the directions parallel to the main surface of the substrate forming the display device 1A
  • the third direction Z corresponds to the thickness direction of the display device 1A.
  • the first direction X corresponds to the short side direction of the display device 1A
  • the second direction Y corresponds to the long side direction of the display device 1A.
  • the display device 1A includes a display panel 2, a flexible printed circuit board 3, an IC chip 4, and a circuit board 5.
  • the display panel 2 is, for example, a liquid crystal display panel, and includes a first substrate SUB1 having a first insulating substrate, a second substrate SUB2 having a second insulating substrate, and a liquid crystal layer LC described later.
  • the display panel 2 includes a display area DA for displaying an image and a frame-shaped peripheral area SA surrounding the display area DA.
  • the first substrate SUB1 includes a first area A1 and a second area A2 arranged in the second direction Y.
  • the second substrate SUB2 overlaps the first substrate SUB1 in the first area A1 and does not overlap the second area A2.
  • the display area DA is included in the first area A1.
  • the peripheral area SA includes the second area A2.
  • the second area A2 may be referred to as a mounting area.
  • the flexible printed circuit board 3 and the IC chip 4 mounted on the second area A2 may be collectively referred to as electronic components.
  • the display area DA includes a plurality of pixels PX arranged in a matrix in the first direction X and the second direction Y.
  • the pixel PX here indicates a minimum unit that can be individually controlled according to a pixel signal, and may be referred to as a subpixel.
  • the pixel PX is, for example, a red pixel that displays red, a green pixel that displays green, a blue pixel that displays blue, or a white pixel that displays white.
  • the flexible printed circuit board 3 is mounted in the second area A2 and electrically connected to the circuit board 5.
  • the IC chip 4 is mounted in the second area A2 and electrically connected to the circuit board 5 via the flexible printed circuit board 3.
  • the IC chip 4 may be mounted on the flexible printed circuit board 3.
  • the IC chip 4 has a built-in display driver DD.
  • the display driver DD outputs a signal necessary for image display in the image display mode for displaying an image.
  • the display driver DD supplies a pixel signal to the plurality of pixels PX.
  • the IC chip 4 has a built-in touch controller TC.
  • the touch controller TC controls a touch sensing mode for detecting the approach or contact of an object with the display device 1A.
  • the first substrate SUB1 includes the first electrode EL1 in the second area A2.
  • the first electrode EL1 is provided in the second area A2, but the first electrode EL1 may be provided in the peripheral area SA.
  • the first substrate SUB1 includes a plurality of second electrodes EL2 in the second region A2, as shown in FIG. 2 described later.
  • the first electrode EL1 is, for example, grounded via the flexible printed circuit board 3, but may be maintained at a predetermined potential.
  • the predetermined potential is applied to the first electrode EL1 by a direct current having a ground potential or a fixed potential of several V or an alternating current having a predetermined amplitude.
  • the first electrode EL1 is arranged at one place on the first substrate SUB1, but the present invention is not limited to this, and the plurality of first electrodes EL1 are arranged on the first substrate SUB1. May be arranged at a plurality of positions (more specifically, on the peripheral area SA).
  • the plurality of second electrodes EL2 are electrically connected to the flexible printed circuit board 3 and the IC chip 4, for example.
  • the display device 1A includes a first polarizing plate PL1 adhered to a second substrate SUB2.
  • the first polarizing plate PL1 overlaps the display area DA.
  • the display device 1A also includes a second polarizing plate PL2 bonded to the first substrate SUB1.
  • the side of the second substrate SUB2 on the second region A2 side is referred to as a first side E1
  • the side of the first polarizing plate PL1 on the second region A2 side is referred to as a second side E2.
  • the second side E2 overlaps the first side E1.
  • the "side” includes a side surface (a surface extending in the Z direction) including the side.
  • the display device 1A includes a cover member CM that overlaps the display area DA and the peripheral area SA.
  • the cover member CM can be formed of, for example, glass or transparent resin.
  • the cover member CM is bonded to the first polarizing plate PL1 and the first substrate SUB1 by a conductive adhesive layer AD3, as shown in FIG. 2 described later.
  • FIG. 2 is a schematic perspective view of the display device 1A in the second area A2.
  • FIG. 2 also shows a schematic cross-sectional view of the display device 1A.
  • the first substrate SUB1 and the second substrate SUB2 are attached to each other by an annular seal material SE that surrounds the display area DA.
  • the liquid crystal layer LC is sealed in the region inside the sealing material SE.
  • the first polarizing plate PL1 has a first surface facing the second substrate SUB2 (first substrate SUB1) and a second surface opposite to the first surface, and the first adhesive layer AD1 forms the second substrate. It is glued to SUB2.
  • the second polarizing plate PL2 is adhered to the first substrate SUB1 by the second adhesive layer AD2.
  • the polarization axes of the first polarizing plate PL1 and the second polarizing plate PL2 are, for example, orthogonal to each other.
  • the cover member CM is provided at a position facing the upper surface (second surface) of the first polarizing plate PL1 and is bonded to the first polarizing plate PL1 and the first substrate SUB1 by a conductive adhesive layer AD3 having conductivity. .. More specifically, the cover member CM is adhered to the first polarizing plate PL1 in the first area A1 and to the first substrate SUB1 in the second area A2 by the conductive adhesive layer AD3.
  • the conductive adhesive layer AD3 for example, an adhesive containing conductive metal particles can be used.
  • the sheet resistance value of the conductive adhesive layer AD3 is preferably similar to the sheet resistance value of ITO (Indium Tin Oxide) or the like, and specifically, it is 10 8 to 10 10 [ ⁇ / ⁇ ]. preferable.
  • the first adhesive layer AD1 and the second adhesive layer AD2 do not have conductivity.
  • the side of the AD1 on the second region A2 side and the side of the sealant SE on the second region A2 side also overlap.
  • the first electrode EL1 and a plurality of second electrodes EL2 are provided in the second region A2 of the first substrate SUB1.
  • the upper surfaces of the plurality of second electrodes EL2 are covered with an anisotropic conductive film.
  • an anisotropic conductive film for example, a thermosetting resin containing conductive metal particles can be used.
  • the flexible printed circuit board 3 and the IC chip 4 are connected to the second electrode EL2 via an anisotropic conductive film. As a result, each circuit of the flexible printed circuit board 3 and the IC chip 4 is electrically connected to the second electrode EL2.
  • Each circuit that is electrically connected to the plurality of second electrodes EL2 is covered with an insulating member 11 and insulated from the conductive adhesive layer AD3.
  • the insulating member 11 for example, an oxide film such as SiO or a nitride film such as SiN can be appropriately used.
  • the insulating member 11 may be formed of, for example, an organic material.
  • the first electrode EL1 is not insulated from the conductive adhesive layer AD3 by the insulating member 11.
  • the present invention is not limited to this, and each circuit that conducts with the plurality of second electrodes EL2.
  • the circuit may be individually covered with a plurality of insulating members 11.
  • FIG. 3 is a schematic sectional view of the display device 1A taken along the line II in FIG.
  • the conductive adhesive layer AD3 is applied over the entire area of the inner surface of the cover member CM. Therefore, in the first area A1, the conductive adhesive layer AD3 continuously covers, for example, the upper surface of the first polarizing plate PL1 to bond the cover member CM and the first polarizing plate PL1 to each other, and in the second area A2. Covers the upper surface of the first substrate SUB1 and the first electrode EL1 to bond the cover member CM and the first substrate SUB1.
  • the conductive adhesive layer AD3 is used not only for the adhesion between the cover member CM and the first polarizing plate PL1 and the adhesion between the cover member CM and the first substrate SUB1, but also for the electrostatic discharge caused by the charging of the second substrate SUB2. It also has a role of protecting various circuits from (ESD). That is, since the conductive adhesive layer AD3 has conductivity and is electrically connected to the first electrode EL1 of the ground potential provided in the second region A2 of the first substrate SUB1, the second The electric charge that tends to be charged on the substrate SUB2 can be released through the first electrode EL1 and the flexible printed circuit board 3 (the wiring that connects the first electrode EL1 and the flexible printed circuit board 3).
  • FIG. 4 is a schematic sectional view of the display device 1A taken along the line II-II in FIG.
  • the conductive adhesive layer AD3 is also applied in the first area A1 in the cross section shown in FIG.
  • the cover member CM and the first polarizing plate PL1 are adhered to each other while continuously covering the upper surface of the first polarizing plate PL1.
  • the conductive adhesive layer AD3 covers the upper surface of the first substrate SUB1 and the insulating member 11 to bond the cover member CM and the first substrate SUB1.
  • the effects of the display device 1A according to the present embodiment will be described using a comparative example.
  • the comparative example is intended to explain some of the effects that the display device 1A according to the present embodiment can achieve, and excludes configurations common to the comparative example and the present embodiment from the scope of the present invention. Not a thing.
  • FIG. 5 shows schematic cross sections of the display device 100 according to the comparative example and the display device 1A according to the present embodiment.
  • FIG. 6 shows a schematic external appearance of the display device 100 according to the comparative example and a schematic external view of the display device 1A according to the present embodiment.
  • FIG. 7 shows a schematic appearance when the display device 1A according to the present embodiment is provided with a plurality of first electrodes EL1.
  • a transparent conductive film 12 such as ITO or ATO (Antimony Tin Oxide) is provided as a resistance film on the upper surface of the second substrate SUB2.
  • a conductive member 13A conductive paste that connects the transparent conductive film 12 and the first electrode EL1 is provided.
  • a first electrode EL1 that is grounded via the flexible printed circuit board 3 is provided in the second area A2 of the first substrate SUB1, and the first electrode EL1 and the second substrate EL1 are grounded.
  • the transparent conductive film 12 provided on the upper surface of the SUB2 via the conductive member 13A By electrically connecting to the transparent conductive film 12 provided on the upper surface of the SUB2 via the conductive member 13A, the electric charge to be charged on the second substrate SUB2 is released through the first electrode EL1 and the flexible printed circuit board 3. According to this, it is possible to suppress the occurrence of various problems (for example, the occurrence of display unevenness) due to the electrostatic discharge of the second substrate SUB2.
  • a space for applying the conductive member 13A is required on the transparent conductive film 12 provided on the upper surface of the second substrate SUB2, so that the frame is narrowed by the space. There is an inconvenience that you cannot do it.
  • the conductive adhesive layer AD3 having conductivity is used as the agent, and the conductive adhesive layer AD3 covers the first electrode EL1 to electrically connect the conductive adhesive layer AD3 and the first electrode EL1 to each other, and thus the second substrate It is supposed that the electric charge to be charged in the SUB2 is released through the first electrode EL1 and the flexible printed circuit board 3.
  • the space for applying the conductive member 13A, which was necessary in the display device 100 according to the comparative example, is not required, and therefore, the space, specifically, the distance shown in FIGS.
  • the frame can be narrowed by d1 minutes.
  • the display device 100 according to the comparative example it was necessary to provide the transparent conductive film 12 as a resistance film on the upper surface of the second substrate SUB2 in order to apply the conductive member 13A, but the display device according to the present embodiment.
  • the manufacturing process film forming process
  • the manufacturing process can be reduced by one process as compared with the display device 100 according to the comparative example.
  • the adhesive for bonding the cover member CM and the first polarizing plate PL1 and the cover member CM and the first substrate SUB1 is a conductive adhesive layer having conductivity. Since AD3 is used, it is sufficient to provide the conductive adhesive layer AD3 during the process of bonding the cover member CM in the display device 100 according to the comparative example, and it is possible to obtain the effect that no new process is required.
  • the display device 1A since the conductive adhesive layer AD3 is applied over the entire area of the inner surface of the cover member CM, the display device 1A (for example, the first substrate SUB1 and the first polarized light). It is also possible to cover the entire side surfaces of the plate PL1 and the second substrate SUB2) with the conductive adhesive layer AD3.
  • the conductive adhesive layer AD3 is electrically connected to the first electrode EL1 which is grounded via the flexible printed circuit board 3, and the conductive adhesive layer AD3 is, as described above, the entire circumference of the side surface of the display device 1A. Therefore, the display device 1A according to the present embodiment can also obtain the effect of being less likely to be affected by charging from the side surface.
  • the conductive adhesive layer AD3 is applied over the entire area of the inner surface of the cover member CM, so that the first conductive layer is grounded via the flexible printed circuit board 3.
  • the electrode EL1 is provided on the first substrate SUB1 (on the peripheral area SA)
  • the conductive adhesive layer AD3 and the first electrode EL1 can be electrically connected. According to this, the effect that the degree of freedom in designing the display device 1A can be increased can be obtained.
  • a plurality of first electrodes EL1 are provided in a second area A2 on which the flexible printed circuit board 3 and the IC chip 4 are mounted, and a peripheral area SA other than the second area A2. It is also possible to provide each of them.
  • FIG. 8 is a plan view showing a schematic appearance of the display device 1B according to the second embodiment.
  • the display device 1B is different from the display device 1A according to the first embodiment in that the display device 1B includes an optical adhesive member AD4 protruding in the second area A2 and a conductive member 13B in the second area A2 of the first substrate SUB1. To do.
  • FIG. 9 is a schematic perspective view of the display device 1B. In FIG. 9, as in FIG. 2, a schematic cross section of the display device 1B is also shown.
  • a conductive member 13B that is in contact with the first electrode EL1 that is grounded via the flexible printed circuit board 3 is provided.
  • the conductive member 13B may be provided on the first electrode EL1 or may be provided so as to cover the first electrode EL1.
  • the conductive member 13B is insulated by the insulating member 11 from each circuit that is electrically connected to the plurality of second electrodes EL2 provided in the second region A2 of the first substrate SUB1.
  • the conductive member 13B is adhered to the optical adhesive member AD4. According to this, the optical adhesive member AD4 and the first electrode EL1 are electrically connected via the conductive member 13B.
  • One of the side surfaces of the conductive member 13B faces the side surface of the second substrate SUB2 on the second region A2 side. Note that in FIG. 9, one of the side surfaces of the conductive member 13B is in contact with the side surface of the seal material SE, the second substrate SUB2, the first adhesive layer AD1 and the first polarizing plate PL1 on the second region A2 side.
  • the conductive member 13B is not limited to this, and the conductive member 13B may not be in contact with each of these layers.
  • the length (thickness) of the conductive member 13B in the third direction Z is smaller than the total thickness of the second substrate SUB2, the liquid crystal layer LC (sealing material SE), the first adhesive layer AD1 and the first polarizing plate PL1. Alternatively, they are preferably the same.
  • the length (width) of the conductive member 13B in the second direction Y is preferably about the same as the width of the first electrode EL1 from the viewpoint of narrowing the frame.
  • the cover member CM is adhered to the first polarizing plate PL1 by an optical adhesive member AD4 having conductivity.
  • the sheet resistance value of the optical adhesive member AD4 is preferably the same as the sheet resistance value of ITO or the like, and specifically, it is preferably 10 8 to 10 10 [ ⁇ / ⁇ ].
  • the optical adhesive member AD4 is provided on the upper surface of the first polarizing plate PL and the upper surface of the conductive member 13B using any method of optical adhesion such as OCA (Optical Clear Adhesive) or OCR (Optical Clear Resin).
  • FIG. 10 is a schematic sectional view of the display device 1B taken along the line III-III in FIG.
  • the optical adhesive member AD4 not only adheres the cover member CM and the first polarizing plate PL1 but also has a role of protecting various circuits from static electricity charged on the second substrate SUB2. That is, the optical adhesive member AD4 has conductivity and is electrically connected to the first electrode EL1 at the ground potential provided in the second region A2 of the first substrate SUB1 via the conductive member 13B. Therefore, the electric charge that is about to be charged on the second substrate SUB2 can be released through the first electrode EL1 and the flexible printed circuit board 3 (the wiring that connects the first electrode EL1 and the flexible printed circuit board 3). it can.
  • FIG. 11 shows schematic cross sections of the display device 100 according to the comparative example and the display device 1B according to the present embodiment. Since the display device 100 according to the comparative example has the same configuration as the display device 100 according to the comparative example shown in FIG. 5A, detailed description thereof will be omitted here.
  • the conductive member 13B that comes into contact with the first electrode EL1 that is grounded via the flexible printed circuit board 3, but
  • the optical adhesive member AD4 having the conductivity that allows the conductive member 13B to be adhered and the cover member CM and the first polarizing plate PL1 to be adhered to each other, the conductive member is provided as in the display device 100 according to the comparative example.
  • a space for applying 13A is not necessary, and the frame can be narrowed by the space, specifically, the distance d1 shown in FIG.
  • the display device 100 according to the comparative example it was necessary to provide the transparent conductive film 12 as a resistance film on the upper surface of the second substrate SUB2 in order to apply the conductive member 13A, but the display device according to the present embodiment.
  • the configuration of 1B since it is not necessary to provide the transparent conductive film 12, it is possible to reduce the manufacturing process by one process as compared with the display device 100 according to the comparative example.
  • the adhesive for adhering the cover member CM and the first polarizing plate PL1 is the optical adhesive member AD4 having conductivity, so that the comparative example is concerned.
  • the optical adhesive member AD4 may be provided during the process of attaching the cover member CM in the display device 100, and an effect that a new process is not required can be obtained.
  • 1A, 1B... Display device 2... Display panel, 3... Flexible printed circuit board, 4... IC chip, 5... Circuit board, 11... Insulating member, 13B... Conductive member, A1... First area, A2... Second area , AD3... Conductive adhesive layer, AD4... Optical adhesive member, CM... Cover member, DA... Display area, E1... First side, E2... Second side, EL1... First electrode, EL2... Second electrode, PL1... 1 polarizing plate, SA... peripheral area, SUB1... first substrate, SUB2... second substrate.

Abstract

Provided is a display device capable of narrowing a frame in the peripheral region outside the display region. The display device is provided with a first substrate, a polarizing plate, a second substrate, a cover material, an adhesive layer, and an electrode. The first substrate has a first insulating substrate and a plurality of pixels arranged in a matrix. The polarizing plate has a first surface facing the first substrate and a second surface opposite from the first surface; the polarizing plate overlaps the display region whereon the plurality of pixels is arranged. The second substrate has a second insulating substrate and is arranged between the first substrate and the first surface of the polarizing plate. The cover material faces the second surface of the polarizing plate and overlaps the display region and the peripheral region surrounding the display region. The adhesive layer bonds the polarizing plate and the cover material and is electrically conductive. The electrode is provided in the peripheral region and maintained at a given potential. The adhesive layer and the electrode are electrically connected to each other.

Description

表示装置Display device
 本発明の実施形態は、表示装置に関する。 The embodiment of the present invention relates to a display device.
 近年、液晶表示装置において、帯電防止の観点から、一方の基板の表面に設けられた透明導電膜と、他方の基板に設けられた接地電位の電極とが、導電ペースト等の導電部材によって電気的に接続される技術が知られている。かかる帯電防止のための構成は表示領域の周囲の額縁領域に設けられるが、一方でさらなる狭額縁化が要求されている。 In recent years, in a liquid crystal display device, a transparent conductive film provided on the surface of one substrate and an electrode having a ground potential provided on the other substrate are electrically connected by a conductive member such as a conductive paste from the viewpoint of preventing electrification. The technology connected to is known. Such a structure for preventing electrification is provided in the frame area around the display area, but further narrowing of the frame is required.
特開2015-11121号公報JP, 2005-11121, A 特開2012-177895号公報Japanese Unexamined Patent Publication No. 2012-177895 特開2011-170200号公報JP, 2011-170200, A
 本開示は、表示領域の外側の周辺領域の狭額縁化が可能な表示装置を提供することを目的の一つとする。 One of the objects of the present disclosure is to provide a display device capable of narrowing a frame in a peripheral area outside a display area.
 一実施形態に係る表示装置は、第1基板と、偏光板と、第2基板と、カバー部材と、接着層と、電極と、を備える。前記第1基板は、第1絶縁基板と、マトリクス状に配置された複数の画素と、を有する。前記偏光板は、前記第1基板に対向する第1面と、前記第1面の反対側の第2面とを有し、前記複数の画素が配置された表示領域と重畳する。前記第2基板は、第2絶縁基板を有し、前記第1基板と前記偏光板の前記第1面との間に配置される。前記カバー部材は、前記偏光板の前記第2面と対向する位置に設けられ、前記表示領域と、当該表示領域の周囲に位置する周辺領域と重畳する。前記接着層は、前記偏光板と前記カバー部材とを接着し、導電性を有する。前記電極は、前記周辺領域に設けられ、所定の電位に維持される。前記接着層と前記電極とは電気的に接続される。 The display device according to one embodiment includes a first substrate, a polarizing plate, a second substrate, a cover member, an adhesive layer, and an electrode. The first substrate has a first insulating substrate and a plurality of pixels arranged in a matrix. The polarizing plate has a first surface facing the first substrate and a second surface opposite to the first surface, and overlaps the display area in which the plurality of pixels are arranged. The second substrate has a second insulating substrate and is arranged between the first substrate and the first surface of the polarizing plate. The cover member is provided at a position facing the second surface of the polarizing plate, and overlaps the display region and a peripheral region located around the display region. The adhesive layer adheres the polarizing plate and the cover member and has conductivity. The electrode is provided in the peripheral area and is maintained at a predetermined potential. The adhesive layer and the electrode are electrically connected.
 実施形態によれば、表示領域の外側の周辺領域の狭額縁化が可能な表示装置を提供することができる。 According to the embodiment, it is possible to provide a display device capable of narrowing a frame in the peripheral area outside the display area.
図1は、第1実施形態に係る表示装置の概略的な構成を示す平面図である。FIG. 1 is a plan view showing a schematic configuration of the display device according to the first embodiment. 図2は、第1実施形態に係る表示装置の実装領域近傍における概略的な斜視図である。FIG. 2 is a schematic perspective view in the vicinity of the mounting area of the display device according to the first embodiment. 図3は、図2におけるI-I線に沿う表示装置の概略的な断面図である。FIG. 3 is a schematic cross-sectional view of the display device taken along the line II in FIG. 図4は、図2におけるII-II線に沿う表示装置の概略的な断面図である。FIG. 4 is a schematic cross-sectional view of the display device taken along the line II-II in FIG. 図5は、比較例に係る表示装置と、第1実施形態に係る表示装置との概略的な断面を示す図である。FIG. 5 is a diagram showing a schematic cross section of the display device according to the comparative example and the display device according to the first embodiment. 図6は、比較例に係る表示装置と、第1実施形態に係る表示装置との概略的な外観を示す図である。FIG. 6 is a diagram showing a schematic appearance of the display device according to the comparative example and the display device according to the first embodiment. 図7は、第1実施形態に係る表示装置に複数の第1電極が設けられる場合の概略的な外観を示す図である。FIG. 7 is a diagram showing a schematic appearance when the display device according to the first embodiment is provided with a plurality of first electrodes. 図8は、第2実施形態に係る表示装置の概略的な構成を示す平面図である。FIG. 8 is a plan view showing a schematic configuration of the display device according to the second embodiment. 図9は、第2実施形態に係る表示装置の実装領域近傍における概略的な斜視図である。FIG. 9 is a schematic perspective view in the vicinity of the mounting area of the display device according to the second embodiment. 図10は、図9におけるIII-III線に沿う表示装置の概略的な断面図である。FIG. 10 is a schematic cross-sectional view of the display device taken along the line III-III in FIG. 図11は、比較例に係る表示装置と、第2実施形態に係る表示装置との概略的な断面を示す図である。FIG. 11 is a diagram showing a schematic cross section of the display device according to the comparative example and the display device according to the second embodiment.
 いくつかの実施形態につき、図面を参照しながら説明する。 Some embodiments will be described with reference to the drawings.
 なお、開示はあくまで一例に過ぎず、当業者において、発明の主旨を保っての適宜変更について容易に想到し得るものについては、当然に本発明の範囲に含有される。また、図面は、説明をより明確にするため、実施の態様に比べて模式的に表される場合があるが、あくまで一例であって、本発明の解釈を限定するものではない。各図において、連続して配置される同一または類似の要素については符号を省略することがある。また、本明細書と各図において、既出の図に関して前述したものと同一または類似した機能を発揮する構成要素には同一の参照符号を付し、重複する詳細な説明を省略することがある。 It should be noted that the disclosure is merely an example, and a person skilled in the art can easily think of an appropriate modification while keeping the gist of the invention, and is naturally included in the scope of the invention. Further, although the drawings may be schematically illustrated in comparison with the embodiments for the sake of clearer description, they are merely examples and do not limit the interpretation of the present invention. In each drawing, reference numerals may be omitted for the same or similar elements arranged successively. Further, in the present specification and the drawings, constituent elements that exhibit the same or similar functions as those described above with reference to the already-existing drawings are designated by the same reference numerals, and redundant detailed description may be omitted.
 各実施形態においては、液晶表示素子を備える液晶表示装置を開示する。但し、各実施形態は、液晶表示素子以外の表示素子を備える他種の表示装置に対する、各実施形態にて開示される個々の技術的思想の適用を妨げるものではない。他種の表示装置としては、例えば、有機エレクトロルミネッセンス(EL)表示素子や、Light Emitting Diode(LED)表示素子を有する自発光型の表示装置、電気泳動素子を有する電子ペーパ型の表示装置、Micro Electro Mechanical Systems(MEMS)を応用した表示装置、あるいは、エレクトロクロミズムを応用した表示装置等が挙げられる。 In each embodiment, a liquid crystal display device including a liquid crystal display element is disclosed. However, each embodiment does not prevent the application of each technical idea disclosed in each embodiment to another type of display device including a display element other than the liquid crystal display element. Examples of other types of display devices include a self-luminous display device having an organic electroluminescence (EL) display element, a Light Emitting Diode (LED) display element, an electronic paper type display device having an electrophoretic element, and a Micro device. A display device to which Electro Mechanical Systems (MEMS) is applied, a display device to which electrochromism is applied, or the like can be given.
 [第1実施形態]
 図1は、第1実施形態に係る表示装置1Aの外観を示す平面図である。一例では、第1方向X、第2方向Y、および、第3方向Zは、互いに直交しているが、90°以外の角度で交差していても良い。第1方向Xおよび第2方向Yは、表示装置1Aを構成する基板の主面と平行な方向に相当し、第3方向Zは、表示装置1Aの厚さ方向に相当する。例えば、第1方向Xは表示装置1Aの短辺方向に相当し、第2方向Yは表示装置1Aの長辺方向に相当する。本明細書において、第3方向Zを示す矢印の先端側に表示装置1Aを観察する観察位置があるものとし、この観察位置から、第1方向Xおよび第2方向Yで規定されるX-Y平面に向かって見ることを平面視と言う。
[First Embodiment]
FIG. 1 is a plan view showing the appearance of a display device 1A according to the first embodiment. In one example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90°. The first direction X and the second direction Y correspond to the directions parallel to the main surface of the substrate forming the display device 1A, and the third direction Z corresponds to the thickness direction of the display device 1A. For example, the first direction X corresponds to the short side direction of the display device 1A, and the second direction Y corresponds to the long side direction of the display device 1A. In the present specification, it is assumed that there is an observation position for observing the display device 1A on the tip side of the arrow indicating the third direction Z, and XY defined by the first direction X and the second direction Y from this observation position. Looking toward a plane is called planar view.
 表示装置1Aは、表示パネル2と、フレキシブルプリント回路基板3と、ICチップ4と、回路基板5と、を備えている。 The display device 1A includes a display panel 2, a flexible printed circuit board 3, an IC chip 4, and a circuit board 5.
 表示パネル2は、例えば液晶表示パネルであり、第1絶縁基板を有する第1基板SUB1と、第2絶縁基板を有する第2基板SUB2と、後述する液晶層LCと、を備えている。表示パネル2は、画像を表示する表示領域DAと、表示領域DAを囲む額縁状の周辺領域SAとを備えている。 The display panel 2 is, for example, a liquid crystal display panel, and includes a first substrate SUB1 having a first insulating substrate, a second substrate SUB2 having a second insulating substrate, and a liquid crystal layer LC described later. The display panel 2 includes a display area DA for displaying an image and a frame-shaped peripheral area SA surrounding the display area DA.
 第1基板SUB1は、第2方向Yに並んだ第1領域A1および第2領域A2を備えている。第2基板SUB2は、第1領域A1において第1基板SUB1に重畳し、第2領域A2には重畳していない。 The first substrate SUB1 includes a first area A1 and a second area A2 arranged in the second direction Y. The second substrate SUB2 overlaps the first substrate SUB1 in the first area A1 and does not overlap the second area A2.
 表示領域DAは、第1領域A1に含まれる。周辺領域SAは、第2領域A2を含む。後述するが、第2領域A2には、フレキシブルプリント回路基板3やICチップ4が実装されるため、当該第2領域A2は、実装領域と称されても良い。また、第2領域A2に実装されるフレキシブルプリント回路基板3やICチップ4は、電子部品と総称されても良い。 The display area DA is included in the first area A1. The peripheral area SA includes the second area A2. As will be described later, since the flexible printed circuit board 3 and the IC chip 4 are mounted in the second area A2, the second area A2 may be referred to as a mounting area. The flexible printed circuit board 3 and the IC chip 4 mounted on the second area A2 may be collectively referred to as electronic components.
 表示領域DAは、第1方向Xおよび第2方向Yにマトリクス状に配置された複数の画素PXを備えている。ここでの画素PXとは、画素信号に応じて個別に制御することができる最小単位を示し、副画素と称する場合がある。画素PXは、例えば、赤色を表示する赤画素、緑色を表示する緑画素、青色を表示する青画素、または、白色を表示する白画素のいずれかである。 The display area DA includes a plurality of pixels PX arranged in a matrix in the first direction X and the second direction Y. The pixel PX here indicates a minimum unit that can be individually controlled according to a pixel signal, and may be referred to as a subpixel. The pixel PX is, for example, a red pixel that displays red, a green pixel that displays green, a blue pixel that displays blue, or a white pixel that displays white.
 フレキシブルプリント回路基板3は、第2領域A2に実装され、回路基板5と電気的に接続されている。ICチップ4は、第2領域A2に実装され、フレキシブルプリント回路基板3を介して回路基板5と電気的に接続されている。なお、ICチップ4は、フレキシブルプリント回路基板3に実装されても良い。 The flexible printed circuit board 3 is mounted in the second area A2 and electrically connected to the circuit board 5. The IC chip 4 is mounted in the second area A2 and electrically connected to the circuit board 5 via the flexible printed circuit board 3. The IC chip 4 may be mounted on the flexible printed circuit board 3.
 ICチップ4は、ディスプレイドライバDDを内蔵している。ディスプレイドライバDDは、画像を表示する画像表示モードにおいて画像表示に必要な信号を出力する。例えば、ディスプレイドライバDDは、複数の画素PXに画素信号を供給する。図1に示した例では、ICチップ4は、タッチコントローラTCを内蔵している。タッチコントローラTCは、表示装置1Aへの物体の接近または接触を検出するタッチセンシングモードを制御する。 IC chip 4 has a built-in display driver DD. The display driver DD outputs a signal necessary for image display in the image display mode for displaying an image. For example, the display driver DD supplies a pixel signal to the plurality of pixels PX. In the example shown in FIG. 1, the IC chip 4 has a built-in touch controller TC. The touch controller TC controls a touch sensing mode for detecting the approach or contact of an object with the display device 1A.
 第1基板SUB1は、第2領域A2において、第1電極EL1を備えている。なお、図1に示した例では、第1電極EL1は、第2領域A2に備えられているが、第1電極EL1は、周辺領域SAに備えられていれば良い。また、第1基板SUB1は、後述する図2に示すように、第2領域A2において、複数の第2電極EL2を備えている。 The first substrate SUB1 includes the first electrode EL1 in the second area A2. In the example shown in FIG. 1, the first electrode EL1 is provided in the second area A2, but the first electrode EL1 may be provided in the peripheral area SA. Further, the first substrate SUB1 includes a plurality of second electrodes EL2 in the second region A2, as shown in FIG. 2 described later.
 第1電極EL1は、例えば、フレキシブルプリント回路基板3を介して接地されているが、所定の電位に維持されていれば良い。所定の電位は、接地電位や数Vの固定電位を有する直流電流や、所定の振幅を有する交流電流によって当該第1電極EL1に与えられる。図1に示した例では、第1電極EL1は、第1基板SUB1上の1か所に配置されるとしたが、これに限定されず、複数の第1電極EL1が、第1基板SUB1上の(より詳しくは、周辺領域SA上の)複数個所にそれぞれ配置されるとしても良い。 The first electrode EL1 is, for example, grounded via the flexible printed circuit board 3, but may be maintained at a predetermined potential. The predetermined potential is applied to the first electrode EL1 by a direct current having a ground potential or a fixed potential of several V or an alternating current having a predetermined amplitude. In the example shown in FIG. 1, the first electrode EL1 is arranged at one place on the first substrate SUB1, but the present invention is not limited to this, and the plurality of first electrodes EL1 are arranged on the first substrate SUB1. May be arranged at a plurality of positions (more specifically, on the peripheral area SA).
 複数の第2電極EL2は、例えば、フレキシブルプリント回路基板3やICチップ4と電気的に接続されている。 The plurality of second electrodes EL2 are electrically connected to the flexible printed circuit board 3 and the IC chip 4, for example.
 表示装置1Aは、第2基板SUB2に接着された第1偏光板PL1を備えている。第1偏光板PL1は、表示領域DAと重畳する。後述する図2に示すように、表示装置1Aは、第1基板SUB1に接着された第2偏光板PL2も備えている。以下の説明においては、第2基板SUB2の第2領域A2側の辺を第1辺E1と称し、第1偏光板PL1の第2領域A2側の辺を第2辺E2と称する。本実施形態においては、第2辺E2は第1辺E1に重畳している。なお、上記「辺」とは、当該辺を含む側面(Z方向に延在する面)を含む。 The display device 1A includes a first polarizing plate PL1 adhered to a second substrate SUB2. The first polarizing plate PL1 overlaps the display area DA. As shown in FIG. 2 described later, the display device 1A also includes a second polarizing plate PL2 bonded to the first substrate SUB1. In the following description, the side of the second substrate SUB2 on the second region A2 side is referred to as a first side E1, and the side of the first polarizing plate PL1 on the second region A2 side is referred to as a second side E2. In this embodiment, the second side E2 overlaps the first side E1. The "side" includes a side surface (a surface extending in the Z direction) including the side.
 表示装置1Aは、表示領域DAおよび周辺領域SAと重畳するカバー部材CMを備えている。カバー部材CMは、例えばガラスや透明樹脂で形成することができる。カバー部材CMは、後述する図2に示すように、導電接着層AD3によって、第1偏光板PL1および第1基板SUB1と接着される。 The display device 1A includes a cover member CM that overlaps the display area DA and the peripheral area SA. The cover member CM can be formed of, for example, glass or transparent resin. The cover member CM is bonded to the first polarizing plate PL1 and the first substrate SUB1 by a conductive adhesive layer AD3, as shown in FIG. 2 described later.
 次に、図2を参照して、第2領域A2の構造(実装領域の構造)について説明する。図2は、第2領域A2における表示装置1Aの概略的な斜視図である。図2においては、表示装置1Aの概略的な断面図も示している。 Next, the structure of the second area A2 (the structure of the mounting area) will be described with reference to FIG. FIG. 2 is a schematic perspective view of the display device 1A in the second area A2. FIG. 2 also shows a schematic cross-sectional view of the display device 1A.
 第1基板SUB1と第2基板SUB2とは、表示領域DAを囲う環状のシール材SEによって貼り合わされている。液晶層LCは、シール材SEの内側の領域に封入されている。 The first substrate SUB1 and the second substrate SUB2 are attached to each other by an annular seal material SE that surrounds the display area DA. The liquid crystal layer LC is sealed in the region inside the sealing material SE.
 第1偏光板PL1は、第2基板SUB2(第1基板SUB1)と対向する第1面と、当該第1面の反対側の第2面とを有し、第1接着層AD1により第2基板SUB2に接着されている。また、第2偏光板PL2は、第2接着層AD2により第1基板SUB1に接着されている。第1偏光板PL1および第2偏光板PL2の偏光軸は、例えば互いに直交する。 The first polarizing plate PL1 has a first surface facing the second substrate SUB2 (first substrate SUB1) and a second surface opposite to the first surface, and the first adhesive layer AD1 forms the second substrate. It is glued to SUB2. The second polarizing plate PL2 is adhered to the first substrate SUB1 by the second adhesive layer AD2. The polarization axes of the first polarizing plate PL1 and the second polarizing plate PL2 are, for example, orthogonal to each other.
 カバー部材CMは、第1偏光板PL1の上面(第2面)と対向する位置に設けられ、導電性を有する導電接着層AD3により、第1偏光板PL1および第1基板SUB1に接着されている。より詳しくは、カバー部材CMは、導電接着層AD3により、第1領域A1においては第1偏光板PL1に接着され、第2領域A2においては第1基板SUB1に接着されている。 The cover member CM is provided at a position facing the upper surface (second surface) of the first polarizing plate PL1 and is bonded to the first polarizing plate PL1 and the first substrate SUB1 by a conductive adhesive layer AD3 having conductivity. .. More specifically, the cover member CM is adhered to the first polarizing plate PL1 in the first area A1 and to the first substrate SUB1 in the second area A2 by the conductive adhesive layer AD3.
 導電接着層AD3としては、例えば、接着剤に導電性の金属粒子を含ませたものを用いることができる。また、導電接着層AD3のシート抵抗値は、ITO(Indium Tin Oxide)等のシート抵抗値と同様であることが好ましく、具体的には、10~1010[Ω/□]であることが好ましい。なお、本実施形態において、第1接着層AD1および第2接着層AD2は、導電性を有していない。 As the conductive adhesive layer AD3, for example, an adhesive containing conductive metal particles can be used. Further, the sheet resistance value of the conductive adhesive layer AD3 is preferably similar to the sheet resistance value of ITO (Indium Tin Oxide) or the like, and specifically, it is 10 8 to 10 10 [Ω/□]. preferable. In this embodiment, the first adhesive layer AD1 and the second adhesive layer AD2 do not have conductivity.
 第2基板SUB2の第2領域A2側の第1辺E1と、第1偏光板PL1の第2領域A2側の第2辺E2とは重畳し、これら2辺E1およびE2は、第1接着層AD1の第2領域A2側の辺と、シール材SEの第2領域A2側の辺とも重畳している。 The first side E1 of the second substrate SUB2 on the second region A2 side and the second side E2 of the first polarizing plate PL1 on the second region A2 side overlap, and these two sides E1 and E2 are the first adhesive layer. The side of the AD1 on the second region A2 side and the side of the sealant SE on the second region A2 side also overlap.
 第1基板SUB1の第2領域A2には、第1電極EL1および複数の第2電極EL2が設けられている。 The first electrode EL1 and a plurality of second electrodes EL2 are provided in the second region A2 of the first substrate SUB1.
 複数の第2電極EL2は、上面が異方性導電膜により覆われている。異方性導電膜としては、例えば、熱硬化型樹脂に導電性の金属粒子を含ませたものを用いることができる。フレキシブルプリント回路基板3やICチップ4は、異方性導電膜を介して、第2電極EL2と接続されている。これにより、フレキシブルプリント回路基板3やICチップ4の各回路と、第2電極EL2とが導通する。 The upper surfaces of the plurality of second electrodes EL2 are covered with an anisotropic conductive film. As the anisotropic conductive film, for example, a thermosetting resin containing conductive metal particles can be used. The flexible printed circuit board 3 and the IC chip 4 are connected to the second electrode EL2 via an anisotropic conductive film. As a result, each circuit of the flexible printed circuit board 3 and the IC chip 4 is electrically connected to the second electrode EL2.
 複数の第2電極EL2と導通する各回路は、絶縁部材11により覆われ、導電接着層AD3から絶縁されている。絶縁部材11としては、例えばSiOのような酸化膜やSiNのような窒化膜を適宜に用いることができる。あるいは、絶縁部材11は、例えば有機材料で形成されても良い。なお、複数の第2電極EL2に通じる配線が第1基板SUB1の上面に配置される場合、上記した各回路に加えて、当該配線もまた絶縁部材11によって覆われる。 Each circuit that is electrically connected to the plurality of second electrodes EL2 is covered with an insulating member 11 and insulated from the conductive adhesive layer AD3. As the insulating member 11, for example, an oxide film such as SiO or a nitride film such as SiN can be appropriately used. Alternatively, the insulating member 11 may be formed of, for example, an organic material. When the wirings that lead to the plurality of second electrodes EL2 are arranged on the upper surface of the first substrate SUB1, the wirings are also covered by the insulating member 11 in addition to the circuits described above.
 なお、本実施形態において、第1電極EL1は、第2電極EL2とは異なり、絶縁部材11により導電接着層AD3から絶縁されない。また、ここでは、複数の第2電極EL2と導通する各回路が、一つの絶縁部材11により覆われている場合について説明したが、これに限定されず、複数の第2電極EL2と導通する各回路は、複数の絶縁部材11によりそれぞれ個別に覆われていても良い。 In the present embodiment, unlike the second electrode EL2, the first electrode EL1 is not insulated from the conductive adhesive layer AD3 by the insulating member 11. In addition, here, the case where each circuit that conducts with the plurality of second electrodes EL2 is covered with one insulating member 11 is described, but the present invention is not limited to this, and each circuit that conducts with the plurality of second electrodes EL2. The circuit may be individually covered with a plurality of insulating members 11.
 図3は、図2におけるI-I線に沿う表示装置1Aの概略的な断面図である。 FIG. 3 is a schematic sectional view of the display device 1A taken along the line II in FIG.
 導電接着層AD3は、カバー部材CMの内面の全領域に亘って塗布される。このため、導電接着層AD3は、第1領域A1においては、例えば第1偏光板PL1の上面を連続的に覆って、カバー部材CMと第1偏光板PL1とを接着し、第2領域A2においては、第1基板SUB1の上面および第1電極EL1を覆って、カバー部材CMと第1基板SUB1とを接着している。 The conductive adhesive layer AD3 is applied over the entire area of the inner surface of the cover member CM. Therefore, in the first area A1, the conductive adhesive layer AD3 continuously covers, for example, the upper surface of the first polarizing plate PL1 to bond the cover member CM and the first polarizing plate PL1 to each other, and in the second area A2. Covers the upper surface of the first substrate SUB1 and the first electrode EL1 to bond the cover member CM and the first substrate SUB1.
 本実施形態において、導電接着層AD3は、カバー部材CMと第1偏光板PL1の接着、および、カバー部材CMと第1基板SUB1の接着だけでなく、第2基板SUB2の帯電に起因した静電気放電(ESD)から各種回路を保護する役割も有している。すなわち、導電接着層AD3は、導電性を有しており、かつ、第1基板SUB1の第2領域A2に設けられた接地電位の第1電極EL1と電気的に接続されているので、第2基板SUB2に帯電しようとする電荷を、第1電極EL1と、(第1電極EL1とフレキシブルプリント回路基板3とを繋ぐ配線と、)フレキシブルプリント回路基板3とを通じて逃がすことができる。 In the present embodiment, the conductive adhesive layer AD3 is used not only for the adhesion between the cover member CM and the first polarizing plate PL1 and the adhesion between the cover member CM and the first substrate SUB1, but also for the electrostatic discharge caused by the charging of the second substrate SUB2. It also has a role of protecting various circuits from (ESD). That is, since the conductive adhesive layer AD3 has conductivity and is electrically connected to the first electrode EL1 of the ground potential provided in the second region A2 of the first substrate SUB1, the second The electric charge that tends to be charged on the substrate SUB2 can be released through the first electrode EL1 and the flexible printed circuit board 3 (the wiring that connects the first electrode EL1 and the flexible printed circuit board 3).
 図4は、図2におけるII-II線に沿う表示装置1Aの概略的な断面図である。 FIG. 4 is a schematic sectional view of the display device 1A taken along the line II-II in FIG.
 図3において説明したように、導電接着層AD3は、カバー部材CMの内面の全領域に亘って塗布されるため、図4に示す断面においても、導電接着層AD3は、第1領域A1においては、例えば第1偏光板PL1の上面を連続的に覆って、カバー部材CMと第1偏光板PL1とを接着している。一方で、第2領域A2においては、導電接着層AD3は、第1基板SUB1の上面および絶縁部材11を覆って、カバー部材CMと第1基板SUB1とを接着している。 As described in FIG. 3, since the conductive adhesive layer AD3 is applied over the entire area of the inner surface of the cover member CM, the conductive adhesive layer AD3 is also applied in the first area A1 in the cross section shown in FIG. For example, the cover member CM and the first polarizing plate PL1 are adhered to each other while continuously covering the upper surface of the first polarizing plate PL1. On the other hand, in the second area A2, the conductive adhesive layer AD3 covers the upper surface of the first substrate SUB1 and the insulating member 11 to bond the cover member CM and the first substrate SUB1.
 続いて、比較例を用いて、本実施形態に係る表示装置1Aの効果について説明する。なお、比較例は、本実施形態に係る表示装置1Aが奏し得る効果の一部を説明するためのものであって、比較例と本実施形態とで共通する構成を本願発明の範囲から除外するものではない。 Next, the effects of the display device 1A according to the present embodiment will be described using a comparative example. It should be noted that the comparative example is intended to explain some of the effects that the display device 1A according to the present embodiment can achieve, and excludes configurations common to the comparative example and the present embodiment from the scope of the present invention. Not a thing.
 図5は、比較例に係る表示装置100と、本実施形態に係る表示装置1Aとの概略的な断面をそれぞれ示す。図6は、比較例に係る表示装置100と、本実施形態に係る表示装置1Aとの概略的な外観をそれぞれ示す。図7は、本実施形態に係る表示装置1Aに複数の第1電極EL1が設けられる場合の概略的な外観を示す。 FIG. 5 shows schematic cross sections of the display device 100 according to the comparative example and the display device 1A according to the present embodiment. FIG. 6 shows a schematic external appearance of the display device 100 according to the comparative example and a schematic external view of the display device 1A according to the present embodiment. FIG. 7 shows a schematic appearance when the display device 1A according to the present embodiment is provided with a plurality of first electrodes EL1.
 比較例に係る表示装置100は、図5(a)に示すように、第2基板SUB2の上面に、例えばITOやATO(Antimony Tin Oxide)といった透明導電膜12が抵抗膜として設けられる点と、当該透明導電膜12と第1電極EL1とを接続する導電部材13A(導電ペースト)が設けられる点とで、本実施形態に係る表示装置1Aと相違している。 In the display device 100 according to the comparative example, as shown in FIG. 5A, a transparent conductive film 12 such as ITO or ATO (Antimony Tin Oxide) is provided as a resistance film on the upper surface of the second substrate SUB2. This is different from the display device 1A according to the present embodiment in that a conductive member 13A (conductive paste) that connects the transparent conductive film 12 and the first electrode EL1 is provided.
 比較例に係る表示装置100においては、第1基板SUB1の第2領域A2に、フレキシブルプリント回路基板3を介して接地されている第1電極EL1を設け、この第1電極EL1と、第2基板SUB2の上面に設けられる透明導電膜12とを導電部材13Aを介して導通させることで、第2基板SUB2に帯電しようとする電荷を、第1電極EL1およびフレキシブルプリント回路基板3を通じて逃がすとしている。これによれば、第2基板SUB2の静電気放電に起因した各種不具合の発生(例えば、表示むらの発生等)を抑止することが可能となる。 In the display device 100 according to the comparative example, a first electrode EL1 that is grounded via the flexible printed circuit board 3 is provided in the second area A2 of the first substrate SUB1, and the first electrode EL1 and the second substrate EL1 are grounded. By electrically connecting to the transparent conductive film 12 provided on the upper surface of the SUB2 via the conductive member 13A, the electric charge to be charged on the second substrate SUB2 is released through the first electrode EL1 and the flexible printed circuit board 3. According to this, it is possible to suppress the occurrence of various problems (for example, the occurrence of display unevenness) due to the electrostatic discharge of the second substrate SUB2.
 一方で、比較例に係る表示装置100においては、第2基板SUB2の上面に設けられる透明導電膜12上に導電部材13Aを塗布するためのスペースが必要となるため、当該スペース分、狭額縁化することができないという不都合がある。 On the other hand, in the display device 100 according to the comparative example, a space for applying the conductive member 13A is required on the transparent conductive film 12 provided on the upper surface of the second substrate SUB2, so that the frame is narrowed by the space. There is an inconvenience that you cannot do it.
 これに対し、本実施形態に係る表示装置1Aは、図5(b)に示すように、カバー部材CMと第1偏光板PL1、および、カバー部材CMと第1基板SUB1を接着するための接着剤を、導電性を有した導電接着層AD3とし、導電接着層AD3により第1電極EL1を覆うことで、当該導電接着層AD3と当該第1電極EL1とを電気的に接続させ、第2基板SUB2に帯電しようとする電荷を、第1電極EL1およびフレキシブルプリント回路基板3を通じて逃がすとしている。 On the other hand, in the display device 1A according to the present embodiment, as shown in FIG. 5B, the bonding for bonding the cover member CM and the first polarizing plate PL1 and the cover member CM and the first substrate SUB1. The conductive adhesive layer AD3 having conductivity is used as the agent, and the conductive adhesive layer AD3 covers the first electrode EL1 to electrically connect the conductive adhesive layer AD3 and the first electrode EL1 to each other, and thus the second substrate It is supposed that the electric charge to be charged in the SUB2 is released through the first electrode EL1 and the flexible printed circuit board 3.
 この構成によれば、比較例に係る表示装置100においては必要であった導電部材13Aを塗布するためのスペースが必要ないため、当該スペース分、具体的には、図5および図6に示す距離d1分、狭額縁化が可能となる。 According to this configuration, the space for applying the conductive member 13A, which was necessary in the display device 100 according to the comparative example, is not required, and therefore, the space, specifically, the distance shown in FIGS. The frame can be narrowed by d1 minutes.
 また、比較例に係る表示装置100においては、導電部材13Aを塗布するために、第2基板SUB2の上面に抵抗膜として透明導電膜12を設ける必要があったが、本実施形態に係る表示装置1Aの構成においては、透明導電膜12を設ける必要はないため、比較例に係る表示装置100に比べて、製造プロセス(成膜プロセス)を1プロセス減らすことが可能となる。 Further, in the display device 100 according to the comparative example, it was necessary to provide the transparent conductive film 12 as a resistance film on the upper surface of the second substrate SUB2 in order to apply the conductive member 13A, but the display device according to the present embodiment. In the configuration of 1A, since it is not necessary to provide the transparent conductive film 12, the manufacturing process (film forming process) can be reduced by one process as compared with the display device 100 according to the comparative example.
 本実施形態に係る表示装置1Aの構成においては、カバー部材CMと第1偏光板PL1、および、カバー部材CMと第1基板SUB1を接着するための接着剤を、導電性を有した導電接着層AD3としているため、比較例に係る表示装置100におけるカバー部材CMを貼り合わせるプロセス時に導電接着層AD3を設ければ良く、新たなプロセスを必要としないという効果を得ることもできる。 In the configuration of the display device 1A according to the present embodiment, the adhesive for bonding the cover member CM and the first polarizing plate PL1 and the cover member CM and the first substrate SUB1 is a conductive adhesive layer having conductivity. Since AD3 is used, it is sufficient to provide the conductive adhesive layer AD3 during the process of bonding the cover member CM in the display device 100 according to the comparative example, and it is possible to obtain the effect that no new process is required.
 さらには、比較例に係る表示装置100においては必要であった導電部材13Aを塗布するプロセスを省略することも可能となり、比較例に係る表示装置100に比べて、製造プロセスをさらに減らすことが可能となる。 Further, it is possible to omit the process of applying the conductive member 13A, which is necessary in the display device 100 according to the comparative example, and it is possible to further reduce the manufacturing process as compared with the display device 100 according to the comparative example. Becomes
 また、本実施形態に係る表示装置1Aにおいては、カバー部材CMの内面の全領域に亘って導電接着層AD3を塗布する構成としているので、表示装置1A(例えば、第1基板SUB1、第1偏光板PL1および第2基板SUB2)の側面全周を導電接着層AD3で覆うことも可能である。導電接着層AD3は、フレキシブルプリント回路基板3を介して接地されている第1電極EL1と電気的に接続されており、この導電接着層AD3が、上記したように、表示装置1Aの側面全周を覆う構成となるため、本実施形態に係る表示装置1Aにおいては、側面からの帯電の影響を受けにくいという効果を得ることもできる。 Further, in the display device 1A according to the present embodiment, since the conductive adhesive layer AD3 is applied over the entire area of the inner surface of the cover member CM, the display device 1A (for example, the first substrate SUB1 and the first polarized light). It is also possible to cover the entire side surfaces of the plate PL1 and the second substrate SUB2) with the conductive adhesive layer AD3. The conductive adhesive layer AD3 is electrically connected to the first electrode EL1 which is grounded via the flexible printed circuit board 3, and the conductive adhesive layer AD3 is, as described above, the entire circumference of the side surface of the display device 1A. Therefore, the display device 1A according to the present embodiment can also obtain the effect of being less likely to be affected by charging from the side surface.
 さらに、本実施形態に係る表示装置1Aにおいては、カバー部材CMの内面の全領域に亘って導電接着層AD3を塗布する構成としているので、フレキシブルプリント回路基板3を介して接地されている第1電極EL1が第1基板SUB1上の(周辺領域SA上の)どの位置に設けられていても、導電接着層AD3と第1電極EL1とは電気的に接続可能である。これによれば、表示装置1Aの設計の自由度を高めることができるという効果を得ることができる。具体的には、図7に示すように、複数の第1電極EL1を、フレキシブルプリント回路基板3やICチップ4が実装される第2領域A2と、当該第2領域A2以外の周辺領域SAとにそれぞれ設けることも可能である。 Further, in the display device 1A according to the present embodiment, the conductive adhesive layer AD3 is applied over the entire area of the inner surface of the cover member CM, so that the first conductive layer is grounded via the flexible printed circuit board 3. Wherever the electrode EL1 is provided on the first substrate SUB1 (on the peripheral area SA), the conductive adhesive layer AD3 and the first electrode EL1 can be electrically connected. According to this, the effect that the degree of freedom in designing the display device 1A can be increased can be obtained. Specifically, as shown in FIG. 7, a plurality of first electrodes EL1 are provided in a second area A2 on which the flexible printed circuit board 3 and the IC chip 4 are mounted, and a peripheral area SA other than the second area A2. It is also possible to provide each of them.
 [第2実施形態]
 次に、第2実施形態について説明する。特に言及しない構成および効果については、第1実施形態と同様である。
[Second Embodiment]
Next, a second embodiment will be described. The configurations and effects not particularly mentioned are the same as those in the first embodiment.
 図8は、第2実施形態に係る表示装置1Bの概略的な外観を示す平面図である。 FIG. 8 is a plan view showing a schematic appearance of the display device 1B according to the second embodiment.
 表示装置1Bは、第2領域A2に突出する光学接着部材AD4と、第1基板SUB1の第2領域A2に導電部材13Bとを備えている点で、第1実施形態に係る表示装置1Aと相違する。 The display device 1B is different from the display device 1A according to the first embodiment in that the display device 1B includes an optical adhesive member AD4 protruding in the second area A2 and a conductive member 13B in the second area A2 of the first substrate SUB1. To do.
 図9は、表示装置1Bの概略的な斜視図である。図9においては、図2と同様に表示装置1Bの概略的な断面も示している。 FIG. 9 is a schematic perspective view of the display device 1B. In FIG. 9, as in FIG. 2, a schematic cross section of the display device 1B is also shown.
 第1基板SUB1の第2領域A2には、フレキシブルプリント回路基板3を介して接地されている第1電極EL1と接触する導電部材13Bが設けられている。導電部材13Bは、第1電極EL1の上に設けられていても良いし、第1電極EL1を覆うようにして設けられていても良い。導電部材13Bは、絶縁部材11により、第1基板SUB1の第2領域A2に設けられる複数の第2電極EL2と導通する各回路と絶縁されている。 In the second area A2 of the first substrate SUB1, a conductive member 13B that is in contact with the first electrode EL1 that is grounded via the flexible printed circuit board 3 is provided. The conductive member 13B may be provided on the first electrode EL1 or may be provided so as to cover the first electrode EL1. The conductive member 13B is insulated by the insulating member 11 from each circuit that is electrically connected to the plurality of second electrodes EL2 provided in the second region A2 of the first substrate SUB1.
 導電部材13Bは、光学接着部材AD4と接着している。これによれば、光学接着部材AD4と第1電極EL1とが導電部材13Bを介して導通する。導電部材13Bの側面の一つは、第2基板SUB2の第2領域A2側の側面と対向する。なお、図9では、導電部材13Bの側面の一つが、シール材SE、第2基板SUB2、第1接着層AD1および第1偏光板PL1の第2領域A2側の側面と接触している場合を例示したが、これに限定されず、導電部材13Bは、これら各層と接触していなくても良い。 The conductive member 13B is adhered to the optical adhesive member AD4. According to this, the optical adhesive member AD4 and the first electrode EL1 are electrically connected via the conductive member 13B. One of the side surfaces of the conductive member 13B faces the side surface of the second substrate SUB2 on the second region A2 side. Note that in FIG. 9, one of the side surfaces of the conductive member 13B is in contact with the side surface of the seal material SE, the second substrate SUB2, the first adhesive layer AD1 and the first polarizing plate PL1 on the second region A2 side. Although illustrated, the conductive member 13B is not limited to this, and the conductive member 13B may not be in contact with each of these layers.
 導電部材13Bの第3方向Zの長さ(厚さ)は、第2基板SUB2、液晶層LC(シール材SE)、第1接着層AD1および第1偏光板PL1の厚さの総和よりも小さいまたは同一であることが好ましい。また、導電部材13Bの第2方向Yの長さ(幅)は、狭額縁化の観点から、第1電極EL1の幅と同程度であることが好ましい。 The length (thickness) of the conductive member 13B in the third direction Z is smaller than the total thickness of the second substrate SUB2, the liquid crystal layer LC (sealing material SE), the first adhesive layer AD1 and the first polarizing plate PL1. Alternatively, they are preferably the same. The length (width) of the conductive member 13B in the second direction Y is preferably about the same as the width of the first electrode EL1 from the viewpoint of narrowing the frame.
 カバー部材CMは、導電性を有した光学接着部材AD4により、第1偏光板PL1に接着されている。 The cover member CM is adhered to the first polarizing plate PL1 by an optical adhesive member AD4 having conductivity.
 光学接着部材AD4のシート抵抗値は、ITO等のシート抵抗値と同様であることが好ましく、具体的には、10~1010[Ω/□]であることが好ましい。光学接着部材AD4は、例えばOCA(Optical Clear Adhesive)またはOCR(Optical Clear Resin)等、光学接着のいずれかの手法を用いて、第1偏光板PLの上面および導電部材13Bの上面に設けられる。 The sheet resistance value of the optical adhesive member AD4 is preferably the same as the sheet resistance value of ITO or the like, and specifically, it is preferably 10 8 to 10 10 [Ω/□]. The optical adhesive member AD4 is provided on the upper surface of the first polarizing plate PL and the upper surface of the conductive member 13B using any method of optical adhesion such as OCA (Optical Clear Adhesive) or OCR (Optical Clear Resin).
 図10は、図9におけるIII-III線に沿う表示装置1Bの概略的な断面図である。 FIG. 10 is a schematic sectional view of the display device 1B taken along the line III-III in FIG.
 光学接着部材AD4は、カバー部材CMと第1偏光板PL1との接着だけでなく、第2基板SUB2上に帯電する静電気から各種回路を保護する役割も有している。すなわち、光学接着部材AD4は、導電性を有しており、かつ、第1基板SUB1の第2領域A2に設けられた接地電位の第1電極EL1と導電部材13Bを介して電気的に接続されているので、第2基板SUB2に帯電しようとする電荷を、第1電極EL1と、(第1電極EL1とフレキシブルプリント回路基板3とを繋ぐ配線と、)フレキシブルプリント回路基板3とを通じて逃がすことができる。 The optical adhesive member AD4 not only adheres the cover member CM and the first polarizing plate PL1 but also has a role of protecting various circuits from static electricity charged on the second substrate SUB2. That is, the optical adhesive member AD4 has conductivity and is electrically connected to the first electrode EL1 at the ground potential provided in the second region A2 of the first substrate SUB1 via the conductive member 13B. Therefore, the electric charge that is about to be charged on the second substrate SUB2 can be released through the first electrode EL1 and the flexible printed circuit board 3 (the wiring that connects the first electrode EL1 and the flexible printed circuit board 3). it can.
 図11は、比較例に係る表示装置100と、本実施形態に係る表示装置1Bとの概略的な断面をそれぞれ示す。なお、比較例に係る表示装置100は、図5(a)に示した比較例に係る表示装置100と同様の構成のため、ここではその詳しい説明は省略する。 FIG. 11 shows schematic cross sections of the display device 100 according to the comparative example and the display device 1B according to the present embodiment. Since the display device 100 according to the comparative example has the same configuration as the display device 100 according to the comparative example shown in FIG. 5A, detailed description thereof will be omitted here.
 本実施形態に係る表示装置1Bは、図11(b)に示すように、フレキシブルプリント回路基板3を介して接地されている第1電極EL1と接触する導電部材13Bを設ける必要はあるが、この導電部材13Bと接着し、かつ、カバー部材CMと第1偏光板PL1とを接着可能な導電性を有した光学接着部材AD4を設けることで、比較例に係る表示装置100のように、導電部材13Aを塗布するためのスペースが必要なくなり、当該スペース分、具体的には、図11に示す距離d1分、狭額縁化が可能となる。 In the display device 1B according to the present embodiment, as shown in FIG. 11B, it is necessary to provide the conductive member 13B that comes into contact with the first electrode EL1 that is grounded via the flexible printed circuit board 3, but By providing the optical adhesive member AD4 having the conductivity that allows the conductive member 13B to be adhered and the cover member CM and the first polarizing plate PL1 to be adhered to each other, the conductive member is provided as in the display device 100 according to the comparative example. A space for applying 13A is not necessary, and the frame can be narrowed by the space, specifically, the distance d1 shown in FIG.
 また、比較例に係る表示装置100においては、導電部材13Aを塗布するために、第2基板SUB2の上面に抵抗膜として透明導電膜12を設ける必要があったが、本実施形態に係る表示装置1Bの構成においては、透明導電膜12を設ける必要はないため、比較例に係る表示装置100に比べて、製造プロセスを1プロセス減らすことが可能となる。 Further, in the display device 100 according to the comparative example, it was necessary to provide the transparent conductive film 12 as a resistance film on the upper surface of the second substrate SUB2 in order to apply the conductive member 13A, but the display device according to the present embodiment. In the configuration of 1B, since it is not necessary to provide the transparent conductive film 12, it is possible to reduce the manufacturing process by one process as compared with the display device 100 according to the comparative example.
 さらに、本実施形態に係る表示装置1Bの構成においては、カバー部材CMと第1偏光板PL1を接着するための接着剤を、導電性を有した光学接着部材AD4としているため、比較例に係る表示装置100におけるカバー部材CMを貼り合わせるプロセス時に光学接着部材AD4を設ければ良く、新たなプロセスを必要としないという効果を得ることもできる。 Furthermore, in the configuration of the display device 1B according to the present embodiment, the adhesive for adhering the cover member CM and the first polarizing plate PL1 is the optical adhesive member AD4 having conductivity, so that the comparative example is concerned. The optical adhesive member AD4 may be provided during the process of attaching the cover member CM in the display device 100, and an effect that a new process is not required can be obtained.
 以上説明した少なくとも一つの実施形態によれば、表示領域の外側の周辺領域の狭額縁化が可能な表示装置を提供することができる。 According to at least one embodiment described above, it is possible to provide a display device capable of narrowing the frame of the peripheral area outside the display area.
 以上、本発明の実施形態として説明した表示装置を基にして、当業者が適宜設計変更して実施し得る全ての表示装置も、本発明の要旨を包含する限り、本発明の範囲に属する。 As described above, all display devices that can be appropriately designed and modified by those skilled in the art based on the display devices described as the embodiments of the present invention are also included in the scope of the present invention as long as they include the gist of the present invention.
 本発明の思想の範疇において、当業者であれば、各種の変形例に想到し得るものであり、それら変形例についても本発明の範囲に属するものと解される。例えば、上述の各実施形態に対して、当業者が適宜、構成要素の追加、削除、若しくは設計変更を行ったもの、または、工程の追加、省略若しくは条件変更を行ったものも、本発明の要旨を備えている限り、本発明の範囲に含まれる。 Various modifications are conceivable to those skilled in the art within the scope of the idea of the present invention, and it is understood that these modifications also belong to the scope of the present invention. For example, those skilled in the art appropriately add, delete, or change the design of each of the above-described embodiments, or add or omit steps or change the conditions of the present invention. As long as it has the gist, it is included in the scope of the present invention.
 また、上述の各実施形態において述べた態様によりもたらされる他の作用効果について、本明細書の記載から明らかなもの、または当業者において適宜想到し得るものについては、当然に本発明によりもたらされるものと解される。 In addition, as for other operational effects brought about by the aspects described in the above-mentioned respective embodiments, those apparent from the description of the present specification or those which can be appropriately conceived by those skilled in the art are naturally brought about by the present invention. Is understood.
 1A,1B…表示装置、2…表示パネル、3…フレキシブルプリント回路基板、4…ICチップ、5…回路基板、11…絶縁部材、13B…導電部材、A1…第1領域、A2…第2領域、AD3…導電接着層、AD4…光学接着部材、CM…カバー部材、DA…表示領域、E1…第1辺、E2…第2辺、EL1…第1電極、EL2…第2電極、PL1…第1偏光板、SA…周辺領域、SUB1…第1基板、SUB2…第2基板。 1A, 1B... Display device, 2... Display panel, 3... Flexible printed circuit board, 4... IC chip, 5... Circuit board, 11... Insulating member, 13B... Conductive member, A1... First area, A2... Second area , AD3... Conductive adhesive layer, AD4... Optical adhesive member, CM... Cover member, DA... Display area, E1... First side, E2... Second side, EL1... First electrode, EL2... Second electrode, PL1... 1 polarizing plate, SA... peripheral area, SUB1... first substrate, SUB2... second substrate.

Claims (9)

  1.  第1絶縁基板と、マトリクス状に配置された複数の画素と、を有する第1基板と、
     前記第1基板に対向する第1面と、前記第1面の反対側の第2面とを有し、前記複数の画素が配置された表示領域と重畳する偏光板と、
     第2絶縁基板を有し、前記第1基板と前記偏光板の前記第1面との間に配置された第2基板と、
     前記偏光板の前記第2面と対向する位置に設けられ、前記表示領域と、当該表示領域の周囲に位置する周辺領域と重畳するカバー部材と、
     前記偏光板と前記カバー部材とを接着する導電性の接着層と、
     前記周辺領域に設けられ、所定の電位に維持される電極と、
     を具備し、
     前記接着層と前記電極とは電気的に接続される、表示装置。
    A first substrate having a first insulating substrate and a plurality of pixels arranged in a matrix;
    A polarizing plate having a first surface facing the first substrate and a second surface opposite to the first surface, and overlapping the display area in which the plurality of pixels are arranged;
    A second substrate having a second insulating substrate and disposed between the first substrate and the first surface of the polarizing plate;
    A cover member which is provided at a position facing the second surface of the polarizing plate and overlaps the display region and a peripheral region located around the display region;
    A conductive adhesive layer for bonding the polarizing plate and the cover member,
    An electrode provided in the peripheral region and maintained at a predetermined potential,
    Equipped with,
    A display device, wherein the adhesive layer and the electrode are electrically connected.
  2.  前記接着層は、前記電極と接触して、当該電極と電気的に接続される、
     請求項1に記載の表示装置。
    The adhesive layer is in contact with the electrode and electrically connected to the electrode,
    The display device according to claim 1.
  3.  前記接着層は、導電性の金属粒子を含んだ接着剤である、
     請求項1に記載の表示装置。
    The adhesive layer is an adhesive containing conductive metal particles,
    The display device according to claim 1.
  4.  前記接着層と、前記電極とを接続する導電性の接続部材をさらに具備し、
     前記接着層と前記電極とは、前記接続部材を介して電気的に接続される、
     請求項1に記載の表示装置。
    Further comprising a conductive connecting member for connecting the adhesive layer and the electrode,
    The adhesive layer and the electrode are electrically connected via the connection member,
    The display device according to claim 1.
  5.  前記接着層は、光学接着部材である、
     請求項4に記載の表示装置。
    The adhesive layer is an optical adhesive member,
    The display device according to claim 4.
  6.  前記複数の画素に画素信号を供給する電子部品をさらに含み、
     前記周辺領域は、前記電子部品を実装する実装領域を備え、
     前記実装領域に実装された電子部品は、少なくとも実装領域上に位置する一部が絶縁部材により覆われている、
     請求項1に記載の表示装置。
    Further comprising an electronic component that supplies a pixel signal to the plurality of pixels,
    The peripheral area includes a mounting area for mounting the electronic component,
    The electronic component mounted in the mounting area, at least a portion located on the mounting area is covered by an insulating member,
    The display device according to claim 1.
  7.  前記偏光板の前記実装領域側の辺と、前記第2基板の前記実装領域側の辺とは、重畳する、
     請求項6に記載の表示装置。
    A side of the polarizing plate on the mounting region side and a side of the second substrate on the mounting region side overlap with each other;
    The display device according to claim 6.
  8.  前記電極は、前記実装領域と、当該実装領域以外の周辺領域とにそれぞれ設けられる、
     請求項6に記載の表示装置。
    The electrodes are provided in the mounting area and a peripheral area other than the mounting area,
    The display device according to claim 6.
  9.  前記接着層のシート抵抗値は、10乃至1010[Ω/□]のうちのいずれかである、
     請求項1に記載の表示装置。
    The sheet resistance value of the adhesive layer is any one of 10 8 to 10 10 [Ω/□],
    The display device according to claim 1.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113534517A (en) * 2021-07-22 2021-10-22 北京京东方光电科技有限公司 Display module and display device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008052088A (en) * 2006-08-25 2008-03-06 Bridgestone Corp Antireflection film for display and display using the same
JP2008233853A (en) * 2007-02-22 2008-10-02 Epson Imaging Devices Corp Electro-optical device and electronic equipment
JP2011129487A (en) * 2009-12-21 2011-06-30 Canon Inc Display apparatus
JP2015179157A (en) * 2014-03-19 2015-10-08 トッパン・フォームズ株式会社 information display medium
JP2016136227A (en) * 2015-01-14 2016-07-28 株式会社ジャパンディスプレイ Display device
US20170276979A1 (en) * 2015-10-21 2017-09-28 Boe Technology Group Co., Ltd. Display Device
JP2018081260A (en) * 2016-11-18 2018-05-24 株式会社ジャパンディスプレイ Display and method for manufacturing display
US20180246366A1 (en) * 2017-02-24 2018-08-30 Chunghwa Picture Tubes, Ltd. Display panel

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008052088A (en) * 2006-08-25 2008-03-06 Bridgestone Corp Antireflection film for display and display using the same
JP2008233853A (en) * 2007-02-22 2008-10-02 Epson Imaging Devices Corp Electro-optical device and electronic equipment
JP2011129487A (en) * 2009-12-21 2011-06-30 Canon Inc Display apparatus
JP2015179157A (en) * 2014-03-19 2015-10-08 トッパン・フォームズ株式会社 information display medium
JP2016136227A (en) * 2015-01-14 2016-07-28 株式会社ジャパンディスプレイ Display device
US20170276979A1 (en) * 2015-10-21 2017-09-28 Boe Technology Group Co., Ltd. Display Device
JP2018081260A (en) * 2016-11-18 2018-05-24 株式会社ジャパンディスプレイ Display and method for manufacturing display
US20180246366A1 (en) * 2017-02-24 2018-08-30 Chunghwa Picture Tubes, Ltd. Display panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113534517A (en) * 2021-07-22 2021-10-22 北京京东方光电科技有限公司 Display module and display device
CN113534517B (en) * 2021-07-22 2023-11-28 北京京东方光电科技有限公司 Display module and display device

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