WO2020167630A1 - Printing system, process chamber and printing method for handling substrates in different orientations - Google Patents

Printing system, process chamber and printing method for handling substrates in different orientations Download PDF

Info

Publication number
WO2020167630A1
WO2020167630A1 PCT/US2020/017433 US2020017433W WO2020167630A1 WO 2020167630 A1 WO2020167630 A1 WO 2020167630A1 US 2020017433 W US2020017433 W US 2020017433W WO 2020167630 A1 WO2020167630 A1 WO 2020167630A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
format
chamber
orientation
chambers
Prior art date
Application number
PCT/US2020/017433
Other languages
French (fr)
Inventor
Alexander Sou-Kang Ko
Original Assignee
Kateeva, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kateeva, Inc. filed Critical Kateeva, Inc.
Publication of WO2020167630A1 publication Critical patent/WO2020167630A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Definitions

  • Embodiments of the present application generally relate to inkjet printing systems. Specifically, methods, systems and/or apparatuses for ejection control in inkjet printing systems are described.
  • Inkjet printing is common, both in office and home printers and in industrial scale printers used for fabricating displays, printing large scale written materials, adding material to manufactured articles such as PCBs, and constructing biological articles such as tissues.
  • Commercial, industrial and/or consumer inkjet printers use dispensers to apply print material to a substrate.
  • the dispenser ejects a controlled quantity of print material toward a substrate at a controlled time and rate so that the print material arrives at the substrate in a target location and makes a printed feature having a desired size and shape.
  • the print material is to be ejected toward the substrate while the substrate is in one orientation, whereas in other situations, the print material is to be ej ected toward the substrate while the substrate is in a different orientation.
  • Printing methods, systems and/or process chambers for handling substrates in different orientations are proposed in this aspect.
  • a printing system comprises a plurality of process chambers arranged along a conveyance path for deposition and post-deposition processing of print material on a substrate.
  • Each of the plurality of process chambers has a substrate support with a configuration associated with a first format and a second format.
  • An input rotation chamber is arranged upstream of the plurality of process chambers for selectively rotating the substrate from a first orientation associated with the first format to a second orientation associated with the second format.
  • An output rotation chamber is arranged downstream of the plurality of process chambers for selectively rotating the substrate, with processed print material thereon, from a third orientation associated with the second format to a fourth orientation associated with the first format.
  • the first format is one of a portrait format, having a length in a first direction and a width in a second direction, and a landscape format having the width in the first direction and the length in the second direction.
  • the second format is the other of the portrait format and the landscape format.
  • a process chamber in a printing system comprises a housing, a substrate support in the housing for supporting thereon a substrate, processing equipment, and a plurality of supporting elements.
  • the processing equipment is arranged inside or outside the housing for performing post-deposition processing on the substrate having print material deposited thereon.
  • the plurality of supporting elements are arranged inside the housing in a configuration according to the portrait format and the landscape format.
  • the portrait format has a length in a first direction and a width in a second direction
  • the landscape format has the length in the second direction and the width in the first direction.
  • a printing method in accordance with one embodiment it is determined whether print material is to be deposited on a substrate in a portrait format, in which a length of the substrate is oriented along a first direction, or in a landscape format, in which a width of the substrate is oriented along the first direction.
  • the substrate In response to a determination that the print material is to be deposited on the substrate in the portrait format, the substrate is sequentially conveyed along a conveyance path to a plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, without rotating the substrate from a first orientation associated with the portrait format to a second orientation associated with the landscape format, wherein in each of the process chambers, the substrate is supported by a first set of movable supporting elements arranged in a first configuration corresponding to the first orientation.
  • the substrate In response to a determination that the print material is to be deposited on the substrate in the landscape format, the substrate is rotated from the first orientation associated with the portrait format to the second orientation associated with the landscape format, and then sequentially conveyed along the conveyance path to the plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, wherein in each of the process chambers, the substrate is supported by a second set of movable supporting elements arranged in a second configuration corresponding to the second orientation.
  • a flat panel display is made by a printing method in which it is determined whether print material is to be deposited on a substrate in a portrait format, in which a length of the substrate is oriented along a first direction, or in a landscape format, in which a width of the substrate is oriented along the first direction.
  • the substrate In response to a determination that the print material is to be deposited on the substrate in the portrait format, the substrate is sequentially conveyed along a conveyance path to a plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, without rotating the substrate from a first orientation associated with the portrait format to a second orientation associated with the landscape format, wherein in each of the process chambers, the substrate is supported by a first set of movable supporting elements arranged in a first configuration corresponding to the first orientation.
  • the substrate In response to a determination that the print material is to be deposited on the substrate in the landscape format, the substrate is rotated from the first orientation associated with the portrait format to the second orientation associated with the landscape format, and then sequentially conveyed along the conveyance path to the plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, wherein in each of the process chambers, the substrate is supported by a second set of movable supporting elements arranged in a second configuration corresponding to the second orientation.
  • Fig. l is a top isometric view of a printer.
  • FIG. 2 is a schematic top view of a printing system in accordance with one embodiment.
  • Fig. 3 is a schematic top view of a part of the printing system in Fig. 2.
  • Figs. 4A and 4B are schematic top views of the printing system part of Fig. 3 handling a substrate in a first orientation at various stages.
  • Figs. 4C and 4D are schematic top views of the printing system part of Fig. 3 handling a substrate in a second orientation at various stages.
  • FIGs. 5 A and 5B are schematic top views of a process chamber in a first substrate support configuration and a second substrate support configuration, respectively, for handling substrates in a first orientation and a second orientation, respectively, in accordance with one embodiment.
  • Fig. 5C is a top perspective view of a substrate support and supporting elements of the process chamber in the second substrate support configuration.
  • Fig. 5D is a schematic to view of a process chamber for handling substrates in a first orientation and a second orientation, respectively, according to another embodiment.
  • FIG. 6 is a flowchart of a printing method in accordance with one embodiment.
  • Fig. 7 is a block diagram of a controller, in accordance with one embodiment. DETAILED DESCRIPTION
  • spatially relative terms such as“beneath,”“below,”“lower,”“above,”“upper” and the like, may be used herein for ease of description to describe one element or feature’s relationship to another element(s) or feature(s) as illustrated in the figures.
  • the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
  • the apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
  • Fig. 1 is a top isometric view of a printer 100.
  • the printer 100 has a substrate support 102, a print assembly 104, and a holder assembly 106 for manipulating a substrate for printing.
  • the printer 100 is founded upon a base 108, which is in one example a massive object to minimize vibratory transmissions to the operative parts of the printer 100.
  • the base 108 is a granite block.
  • the substrate support 102 is located upon the base 108, and comprises a support surface 110 along with a device for making the support surface 110 substantially frictionless.
  • the support surface 110 is a flotation table that provides a gas cushion on which the substrate floats.
  • the support surface 110 features a first plurality of holes 112 that allow jets of gas to exit, thus providing an upward force to maintain a substrate at a desired elevation above the support surface 110.
  • the support surface 110 may also have a second plurality of holes configured to allow controlled withdrawal of gas from the gas cushion floating the substrate to provide precise local control of substrate elevation.
  • the print assembly 104 comprises a dispenser assembly 114 disposed on a print support 116.
  • the print support 116 is disposed in relation to the substrate support 102 to provide access for the dispenser assembly 1 14 to position constructively in relation to a substrate on the substrate support 102 to precisely apply print material to the substrate.
  • the print support 116 includes a rail or beam 117 that traverses the substrate support 102, allowing the dispenser assembly 114 to traverse the substrate support 102 and deposit print material at any location on the substrate from one side of the print support 116 to the opposite side thereof.
  • the print support 116 is attached to the base 108 and extends from the base 108 to provide stable support for the dispenser assembly 114.
  • Two stands 120 extend from the base 108, on opposite sides of the substrate support 102, to the rail 117, which extends across the substrate support 102.
  • the stands 120 and the rail 117 are both made of the same material as the base 108.
  • the stands 120, the rail 117, and the base 108 are separate pieces of granite that are bolted together.
  • the dispenser assembly 114 includes at least one printhead assembly 119 along with a print assembly controller 1 18 that includes electronics and/or sensors for controlling the functional parameters of the printhead assembly 119 such as location of the printhead assembly 119 along the print support 116, timing, duration, type of print material, and dispensing profile.
  • the printhead assembly 119 is movable along the rail 117 of the print support 116 by operation of a print carriage 122 that couples with the print support 116 to translate the printhead assembly 119 along the rail 117 from one end of the rail 117 to the other opposite end.
  • the print carriage 122 is driven by a motor or a servomotor. Power and signal conduits are not shown to simplify the figure.
  • a substrate (not shown in Fig. 1) is positioned under the print assembly 104 by the holder assembly 106.
  • the holder assembly 106 acquires secure contact with the substrate upon loading and moves the substrate along the substrate support 102 to position the substrate with respect to the print assembly 104 for dispensing print material onto the substrate in a precise fashion.
  • the holder assembly 106 is located on one side of the substrate support 102 and extends along the substrate support 102 in a first direction to translate the substrate in the first direction during printing.
  • the first direction is denoted in Fig. 1 by arrow 124.
  • the first direction 124 is referred to as the “Y direction”.
  • the printhead assembly 1 19 moves in a second direction substantially transverse to the first direction, guided by the rail 1 17 which extends substantially in the second direction denoted in Fig. 1 by arrow 126.
  • the second direction 126 is referred to as the“X direction” and the rail 1 17 as the“X beam.”
  • a third direction substantially transverse to the first and second directions is denoted in Fig. 1 by arrow 125.
  • the third direction 125 is referred to as the“Z direction.”
  • the X, Y and Z directions are directions of axes of a coordinate system serving as a frame of reference of the printer 100, as illustrated by the arrows 124, 125, and 126.
  • the origin of the coordinate system is at a fixed point, e.g., associated with the base 108.
  • the holder assembly 106 is disposed on a holder assembly support 128, which in one example is a rail that extends in the first direction substantially the entire length of the substrate support 102 along an edge 130 of the substrate support 102.
  • the holder assembly support 128 is attached, for example bolted, to the base 108 to provide stable support for the holder assembly 106.
  • the holder assembly support 128 is made from the same material as the base 108.
  • the holder assembly support 128 is sometimes referred to as the“Y beam.”
  • the holder assembly 106 moves along the holder assembly support 128 during operation to position the securely held substrate at any location on the substrate support 102, and the print assembly 104, for example by operation of the print assembly controller 1 18, positions the printhead assembly 1 19 to provide access to a precise location on the substrate for dispensing print material.
  • the holder assembly is depicted as moving the substrate in the first direction 124 while the dispenser assembly moves in the second direction 126 to access all desired portions of the substrate.
  • the dispenser assembly moves in the first and second directions while the substrate is held stationary.
  • the dispenser assembly is held stationary while the substrate is moved in the first and second directions 124 and 126.
  • the holder assembly and the dispenser assembly both move in the first and second directions 124 and 126. Where the areal coverage of the dispenser assembly is different from the area of the substrate desired for printing, the dispenser assembly and the substrate are relatively moved to accomplish the complete print job.
  • a system controller 129 receives signals from various sensors deployed throughout the printer 100 and sends signals to various components of the printer 100 to control printing.
  • the system controller 129 is operationally coupled, for example, via a network, to the print assembly controller 1 18 and to a holder assembly controller 13 1 , which controls operation of the holder assembly 106.
  • One or more of the substrate support 102, the print assembly 104, the holder assembly 106, and other ancillary systems, such as environment control and materials management systems, have sensors operatively coupled to the system controller 129 to transmit signals to the system controller 129 related to the status of various components during a printing operation.
  • the system controller 129 includes data and instructions to determine control signals to send to various controlled components of the printer 100.
  • two or more of the system controller 129, the print assembly controller 1 18 and the holder assembly controller 13 1 are integrated into a single controller.
  • at least one of the system controller 129, the print assembly controller 1 18 and the holder assembly controller 13 1 is implemented as several controllers distributed in the printer 100 and connected one with another via a network.
  • An example configuration of a controller in accordance with one embodiment is described with respect to Fig. 7.
  • “controller” refers to any one or more of controllers in the printer 100 and/or any one or more of controllers in a printing system using the printer 100.
  • a printer such as the printer 100
  • a printer is integrated with post processing chambers that perform various processes to fix the print material on the substrate after deposition.
  • a particular substrate may have a particular orientation that is most advantageous for performing the designed print job on the substrate.
  • a substrate is advantageously processed in the “portrait” format, where the substrate is inserted into the printer in a direction parallel to the long dimension of the substrate, while at other times the substrate is advantageously processed in the“landscape” format, where the substrate is inserted into the printer in a direction parallel to the short dimension of the substrate.
  • printer 100 is capable of handling and performing deposition of print material on substrates in both orientations, i.e., associated with both the landscape format and portrait format
  • use of post-processing chambers that support only one orientation frequently requires multiple rotations of the substrate between the deposition process and the post-process, at least where different orientations are needed for the two processes.
  • rotation of the substrate between deposition and post-processing can become undesired where the two processes need different substrate orientations.
  • the printers, post-processing chamber, and systems described herein include one or more chambers with the capability to support substrates in orientations associated with the portrait format and landscape format.
  • a substrate rotated to a landscape orientation for print material deposition need not be rotated to a portrait orientation for post-processing.
  • references to“portrait orientation” and “landscape orientation” should be understood as referring to an orientation that corresponds to the portrait format and the landscape format, respectively.
  • a“portrait orientation” is a substrate orientation that enables processing the substrate in the portrait format
  • a“landscape orientation” is a substrate orientation that enables processing the substrate in the landscape format.
  • Fig. 2 is a schematic top view of a printing system 200 in accordance with one embodiment.
  • the printing system 200 comprises a plurality of process chambers arranged along a conveyance path generally designated by arrow 203 , an input rotation chamber 210 arranged upstream of the process chambers, and an output rotation chamber 212 arranged downstream of the process chambers.
  • the input rotation chamber 210 is configured to selectively rotate a substrate from a first orientation associated with a first format to a second orientation associated with a second format
  • the output rotation chamber 212 is configured to selectively rotate the substrate from a third orientation associated with the second format to a fourth orientation associated with the first format.
  • Each of the input rotation chamber 210 and the output rotation chamber 212 can rotate a substrate from an orientation associated with the first format to an orientation associated with the second format, or from an orientation associated with the second format to an orientation associated with the first format.
  • the first orientation is associated with one of the portrait format and the landscape format
  • the second orientation is associated with the other of the portrait format and the landscape format.
  • each of the process chambers is configured to have substrate support configurations corresponding to the first and second formats, so that each process chamber may process a substrate in an orientation associated with either format and rotation of the substrate between the process chambers is not required.
  • the input rotation chamber 210 and the output rotation chamber 212 may process substrates in different orientations or in the same orientations. If the input rotation chamber 210 is not aligned with the output rotation chamber 212, the input rotation chamber 210 rotates substrates from a first orientation associated with the first format to a second orientation associated with the second format, while the output rotation chamber 212 rotates a substrate from a third orientation associated with the second format to a fourth orientation associated with the first format.
  • the process chambers are configured for deposition and/or post-deposition processing of print material on a substrate.
  • Examples of process chambers include, but are not limited to, printing chambers, drying chambers, curing chambers, thermal chambers, and buffer chambers.
  • the process chambers of the printing system 200 include printing chambers 220, 222, 224, 226, drying chambers 230, 232, 234, 236, 238, 240, 242, 244, and a buffer chamber 250. Any of the drying chambers 230, 232, 234, 236, 238, 240, 242, 244, could be configured as a curing chamber.
  • the number and/or type and/or arrangement of the process chambers in Fig. 2 are examples. Other configurations are within the scopes of various embodiments.
  • the printing system 200 further comprises transfer chambers 260, 262, 264, 266, passage or shuttle chambers 270, 272, 274, 276, 278, connection chambers 280, 282, and thermal chambers 290, 292, 294, 296.
  • transfer chambers 260, 262, 264, 266, passage or shuttle chambers 270, 272, 274, 276, 278, connection chambers 280, 282, and thermal chambers 290, 292, 294, 296 The number and/or type and/or arrangement of the chambers in Fig. 2 are examples. Other configurations are within the scopes of various embodiments.
  • the transfer chamber 260 has a loading port 208 through which a substrate delivered to the printing system 200 by a conveyor 206 is loaded into the printing system 200.
  • the connection chamber 282 has an unloading port 214 through which the substrate having print material deposited and processed thereon is unloaded from the printing system 200 onto a conveyor 216. Between the loading port 208 and unloading port 214, the transfer chambers 260, 262, 264, 266, passage or shuttle chambers 270, 272, 274, 276, 278, and connection chambers 280, 282 are coupled together along the conveyance path 203.
  • the process chambers, rotation chambers 210, 212, and thermal chambers 290, 292, 294, 296 are also coupled to the transfer chambers 260, 262, 264, 266 and/or the connection chambers 280, 282.
  • the various chambers, or a subset thereof are coupled together in an airtight manner such that a sealed enclosure is formed in which a controlled environment is maintained.
  • Port 246 of transfer chamber 262 is not coupled to another chamber, and is typically kept closed, and may be sealed.
  • one or more ports of the transfer chambers 260, 262, 264, 266, and/or connection chambers 280, 282, such as a port 246 of the transfer chamber 262, may be uncoupled in this manner.
  • the controlled environment at least one of temperature, pressure, or atmospheric composition is maintained at a condition suitable for the deposition and post-deposition processing of print material.
  • the controlled environment may feature different conditions at different locations in the printing system 200.
  • the controlled environment may include an atmosphere of a gas that is inert to the print material and/or the material of a substrate being processed to prevent degradation of the printed products.
  • the controlled environment may include an atmosphere selected to perform a specific interaction with the substrate or the print material .
  • Each of the described chambers may have a separate controlled environment individually maintained for that chamber.
  • One or more of the described chambers may share the same controlled environment.
  • any controlled environment might include a nitrogen atmosphere, or an atmosphere of a noble gas.
  • the controlled environment might include air, or might be ambient air, or conditioned air such as ozone free air or moisture free air, while temperature and/or pressure may be controlled.
  • Each of the printing chambers 220, 222, 224, 226 includes a printer, such as the printer 100 described with respect to Fig. 1 , and is configured for deposition of print material on a substrate.
  • the printing chambers 220, 222, 224, 226 may deposit the same or different print material.
  • the remaining non-printing chambers i.e., drying chambers, thermal chambers, curing chambers and buffer chambers, are for post deposition processing of the deposited print material on the substrate. Examples of post-deposition processing include, but are not limited to, drying, curing, thermal processing, and buffering (e.g., holding or queuing) substrates. More than one post-deposition processing may be performed in a single process chamber.
  • a printing system may include one printer and one post-processing chamber, with input and output rotation chambers as shown in Fig. 2.
  • the drying chambers 230, 232, 234, 236, 238, 240, 242, 244 are configured to dry the substrate after print material deposition in one or more of the printing chambers 220, 222, 224, 226.
  • the print material may be a liquid mixture of organic compounds and a solvent deposited on the substrate.
  • the substrate with the print material deposited there on is introduced into a drying chamber where the substrate is dried and the solvent is evaporated.
  • Any of the drying chambers 230, 232, 234, 236, 238, 240, 242, 244, may be a vacuum drying chamber configured to accommodate one or more substrates in a stack.
  • a vacuum drying chamber is normally configured to dry substrates in vacuum or at a pressure below the ambient pressure.
  • a vacuum chamber may also be configured to heat or cool the substrate during vacuum drying.
  • a curing chamber is configured to solidify the deposited print material by a curing process to form a permanent printed feature of a printed product.
  • the curing process uses thermal and/or UV treatment.
  • the buffer chamber 250 is configured to hold one or more substrates in a stack.
  • the buffer chamber 250 holds a substrate for production management, for example, until another module or chamber is ready to receive and process the substrate.
  • the buffer chamber 250 holds a defective substrate until it can be removed.
  • the buffer chamber 250 holds a substrate for a period of time as a part of a post-deposition processing, for example, to permit the substrate to cool down and/or to dry.
  • Each of the loading port 208 and unloading port 214 provides an interface between the controlled environment within the sealed enclosure of the printing system 200 and the ambient atmosphere, or between the controlled environment of the printing system 200 and a controlled environment of another printing system coupled to the printing system 200.
  • each of the loading port 208 and unloading port 214 is coupled to a pressurized gas source for purging out contaminants when the port is opened for a substrate to pass through. Thereafter, the port is again sealed.
  • Each of the rotation chambers 210, 212 includes a rotatable substrate support configured to hold a substrate thereon and then rotate to change the orientation of the substrate, as described herein.
  • the output rotation chamber 212 is omitted and/or the substrate is unloaded without being rotated back to the initial orientation when the substrate is loaded into the printing system 200.
  • the rotatable substrate support is configured to provide access for a substrate handler from two adj acent sides of the rotatable chuck such that substrates can be deposited on the rotatable chuck in one orientation and then retrieved from the rotatable chuck in a different orientation.
  • the rotatable substrate support includes a holding surface of some sort, such as a platform or grid or dispersion of posts that can securely support the substrate through a rotation operation.
  • the substrate support may include edge capture features to decrease any tendency of the substrate to shift during rotation. Examples of such features include corner posts or pockets.
  • the posts may be tipped with a material that exhibits a frictional force when contacting the substrate.
  • Each of the transfer chambers 260, 262, 264, 266 includes a handler for handling a substrate, as described herein.
  • An example handler for a transfer chamber includes a robot.
  • Each of the passage or shuttle chambers 270, 272, 274, 276, 278 also includes a handler for handling a substrate.
  • An example handler for a passage or shuttle chamber includes a conveyor.
  • At least one of the passage or shuttle chambers 270, 272, 274, 276, 278 is configured to move a substrate back and forth along the conveyance path 203 between different process chambers.
  • the passage or shuttle chamber 276 may move a substrate from the transfer chamber 264 to the transfer chamber 266 for print material deposition by the printing chamber 226 coupled to the transfer chamber 266. Thereafter, the passage or shuttle chamber 276 may move the substrate in the opposite direction from the transfer chamber 266 back to the transfer chamber 264 to temporarily store the substrate in the buffer chamber 250 coupled to the transfer chamber 264.
  • connection chambers 280, 282 also includes a handler for handling a substrate.
  • the handler of the connection chamber 280 is configured to move substrates among the passage or shuttle chambers 272, 274, and thermal chambers 290, 292.
  • An example handler for a connection chamber includes a robot.
  • the printing system 200 further comprises one or more controllers coupled to one or more or all chambers of the printing system 200, including the process chambers, rotation chambers, curing chambers, thermal chambers, drying chambers, buffer chambers, transfer chambers, passage or shuttle chambers, and connection chambers.
  • controllers coupled to one or more or all chambers of the printing system 200, including the process chambers, rotation chambers, curing chambers, thermal chambers, drying chambers, buffer chambers, transfer chambers, passage or shuttle chambers, and connection chambers.
  • Fig. 3 is a schematic top view of a part 300 of the printing system 200.
  • the transfer chamber 260 is coupled to the input rotation chamber 210, the printing chamber 220, the drying chambers 230, 232, and the passage or shuttle chamber 270.
  • a controller 350 of the printing system 200 is coupled to the transfer chamber 260, the input rotation chamber 210, the printing chamber 220, the drying chambers 230, 232, the passage or shuttle chamber 270 and the conveyor 206 to control various components of the printing system 200 to perform one or more operations described herein.
  • Each transfer chamber 260 has a handler 261 which is moveable inside the transfer chamber 260.
  • the handler 261 A in the transfer chamber 260 nearest the loading port 208, receives or loads a substrate from a conveyor 206 into the transfer chamber 260 through the loading port 208.
  • the handler 261 A may introduce the substrate into or withdraw the substrate from the input rotation chamber 210 in a direction indicated by arrow 310.
  • the handler 261 A may introduce the substrate into or withdraw the substrate from the drying chamber 230 in a direction indicated by arrow 330.
  • the handlers 261 A and B can transfer custody of a substrate between the transfer chambers 260.
  • the handler 26 IB may introduce the substrate into or withdraw the substrate from the printing chamber 220 in a direction indicated by arrow 320.
  • the direction 320 generally coincides with the Y direction (scan direction) of a printer 100 included in the printing chamber 220. Any inaccuracy in the orientation or position of the substrate is correctable by the printer 100, by physically adjusting the substrate and/or by logically correcting printing data used to control print material deposition on the substrate.
  • the handler 261B may introduce the substrate into or withdraw the substrate from the drying chamber 232 in a direction indicated by arrow 332.
  • the handler 261B unloads the substrate in the direction 332 from the transfer chamber 260 into the passage or shuttle chamber 270 to be transferred to the transfer module 262 to be processed by the subsequent process chambers. Substrates can also be removed after processing through the loading port 208, if desired.
  • the directions 310, 320, 330, 332 in which the handlers 261 A and B introduce a substrate into or withdraws the substrate from the corresponding chambers 210, 220, 230, 232 are inclined relative to the direction 332 in which the substrate is transferred through the transfer module 260 to the transfer module 262 and further along the conveyance path 203.
  • Each handler 261 A and B is rotatable about at least one axis to direct the substrate among the numerous directions 310, 320, 330, 332. This arrangement is an example. Other configurations are within the scopes of various embodiments.
  • the input rotation chamber 210 can be used to change the orientation of a substrate at any time during processing in the part 300.
  • a substrate may be loaded into the transfer chamber 260 in a first orientation, but if processing in a second orientation is desired, the substrate can be moved from the transfer chamber 260 to the rotation chamber 210 and rotated to the second orientation. The substrate can then be retrieved from the rotation chamber 210 in the second orientation and moved to any of the drying chambers 230, 232 and/or the printing chamber 220.
  • each of the drying chambers 230, 232 and the printing chamber 220 is configured to process substrates in two different orientations, conventionally described as“portrait” and“landscape” orientations.
  • the substrate orientation can be changed by moving the substrate to the rotation chamber 210, rotating the substrate to a different orientation, and retrieving the substrate. It should be noted that the substrate could also be moved to the output rotation chamber 212 for rotating.
  • FIGs. 4A and 4B are schematic top views of the part 300 of the printing system 200 handling a substrate in a first orientation at various stages. For simplicity, one or more elements discussed with respect to Fig. 3 are omitted in Figs. 4A-4B.
  • the handler 261 in the example configuration in Fig. 4A is a robot comprising a base 462, an articulated robot arm 464 attached to the base 462, and an end effector 464 attached at an end of the robot arm 464.
  • the base 462 is movable in the direction 360 and the robot arm 464 is rotatable to perform various movements for handling the substrate 471.
  • the end effector 464 is configured to positively hold the substrate 471, e.g., by vacuum or suction, or to simply support the substrate 471 by gravity.
  • the end effector 464 is a fork for supporting the substrate 471 from below.
  • the input rotation chamber 210 includes a rotatable chuck 410.
  • the chuck is a vacuum chuck configured to hold a substrate thereon while rotating the substrate to change its orientation to correspond to the portrait format or the landscape format.
  • a substrate 471 in a first orientation corresponding to the portrait format is delivered by the conveyor 206 to the transfer chamber 260.
  • the controller 350 determines, from printing or design data that print material is to be deposited on the substrate 471 in the portrait format. Since the substrate 471 is already oriented according to the portrait format, no re-orientation (i.e. rotation) of the substrate 471 is required, and the controller 350 determines that the input rotation chamber 210 is not necessary for handling the substrate 471.
  • the controller 350 controls the handler 261 to load the substrate 471 into the transfer chamber 260, as indicated at 471 A.
  • the handler 261 then moves the substrate 471 in the direction 360 to a position corresponding to an opening of the printing chamber 220.
  • the handler 261 directs the length of the substrate 471 generally along the direction 320, as indicated at 471E.
  • the direction 320 is generally an operating direction of the printing chamber 220, a direction in which substrates are translated within the printing chamber 220 as material is deposited thereon.
  • the handler 261 then introduces the substrate 471 in the direction 320 into the printing chamber 220 and places the substrate 471 on a substrate support of the printer 100, as indicated at 471F.
  • the printer 100 moves the substrate 471 back and forth in the direction 320, which is the operating direction of the printer 100, while depositing print material on the substrate 471. Since the length of the substrate 471 is directed along the direction 320, the substrate 471 is printed on while oriented according to the portrait format, as described with respect to Fig. IB.
  • the handler 261 Upon completion of the print material deposition, the handler 261 withdraws the substrate 471 in the direction 320 and moves the substrate 471 to another process chamber for post-deposition processing. For example, the handler 261 moves the substrate 471 to a position corresponding to an opening of the drying chamber 230 or 232, and directs the length of the substrate 471 generally along the corresponding direction 330 or 332, as indicated at 471G or 4711.
  • the controller 350 controls the drying chamber 230 or 232 to be configured in a first substrate support configuration to support the substrate 471 in an orientation corresponding to the portrait format, as described with respect to Fig. 5A herein.
  • the first substrate support configuration is generally optimized for supporting the substrate in the first orientation such that the substrate is not damaged or contaminated during processing and such that the substrate can be retrieved after processing.
  • the handler 261 introduces the substrate 471 in the direction 330 or 332 into the drying chamber 230 or 232, and places the substrate 471 on a substrate support (not shown) in the drying chamber, which has already been configured to be in the first substrate support configuration under control of the controller 350, as indicated at 471H or 471J.
  • the described arrangement is applicable to other process chambers for post-deposition processing, such as buffer chambers and curing chambers.
  • the handler 261 Upon completion of the post-deposition processing, the handler 261 withdraws the substrate 471 in the direction 330 or 332 from the drying chamber 230 or 232, and moves the substrate 471 to another process chamber for post-deposition processing, or back to the printing chamber 220 for deposition of another layer of print material, or to the passage or shuttle module 270 for unloading the substrate 471 from the transfer module 260.
  • the handler 261 directs the length of the substrate 471 generally along the direction 360, as indicated at 471K. As a result, the substrate 471 is transferred to the subsequent process chambers in the first orientation.
  • the described arrangement is applicable to other chambers and/or modules along the conveyance path 203 until the substrate 471 is unloaded from the printing system 200 through the unloading port 214.
  • the orientation of the substrate 471 is unchanged from the first orientation despite numerous rotational movements performed by one or more transfer modules between receipt of the substrate and placement of the received substrate in a process chamber, and/or between withdrawal of the processed substrate from the process chamber and transfer of the withdrawn substrate to a subsequent chamber or module.
  • the process chambers in the printing system 200 are configured under control of the controller 350 to be in a first substrate support configuration corresponding to the first orientation, for handling the substrate 471. No re-orientation of the substrate 471 is required between process chambers.
  • the rotation chambers 210, 212 are not necessary for handling the substrate 471.
  • FIGs. 4A-4B The described arrangement in Figs. 4A-4B is given for a situation when substrate re-orientation is not required, i.e., when the substrate 471 is delivered to the printing system 200 in the first orientation and the controller 350 determines from the design data that print material is to be deposited on the substrate 471 in the same orientation.
  • This arrangement is also applicable to a situation when a substrate is delivered to the printing system 200 in the second orientation and the controller 350 determines from the design data that print material is to be deposited on the substrate 471 in the same, second orientation, i.e., substrate re-orientation is not required.
  • Figs. 4C and 4D are schematic top views of the part 300 of the printing system 200 handling a substrate in the second orientation at various stages after being received in the first orientation. For simplicity, one or more elements discussed with respect to Figs. 3, 4A and 4B are omitted in Figs. 4C-4D.
  • a substrate 472 in the first orientation corresponding to the portrait format is delivered by the conveyor 206 to the transfer chamber 260.
  • the controller 350 determines, from printing or design data, that print material is to be deposited on the substrate 472 in the second orientation. Since the substrate 472 is currently in the first orientation, re-orientation of the substrate 472 by the input rotation chamber 210 is required.
  • the controller 350 controls the handler 261 to load the substrate 472 into the transfer chamber 260, move the substrate 472 to a position corresponding to an opening of the input rotation chamber 210, and direct the length of the substrate 472 generally along the direction 310 of the input rotation chamber 210, as indicated at 472A.
  • the handler 261 then introduces the substrate 472 in the direction 310 into the input rotation chamber 210 and places the substrate 472 on the chuck 410, as indicated at 472B.
  • the controller 350 controls the chuck 410 to rotate the substrate 472 from the first orientation to the second orientation.
  • the rotation of the chuck 410 is about 90 degrees, but not necessarily exact 90 degrees, because displacement errors may occur while the substrate 472 is being delivered to the printing system 200 and/or while the substrate 472 is being processed in the printing system 200. Misalignments in the direction and/or position of the substrate 472 will be adjusted in the printing chamber 220 as described herein.
  • the substrate 472 is oriented to the second orientation, as indicated at 472C.
  • the handler 261 withdraws the substrate 472 in the direction 310 from the input rotation chamber 210, as indicated at 472D.
  • the substrate 472 now in the second orientation is moved through the process chambers coupled to the transfer module 260 in a manner similar to that described with respect to Figs. 4A-4B, without re-orienting the substrate 472 between the process chambers.
  • the handler 261 moves the substrate 472 in the direction 360 to a position corresponding to the opening of the printing chamber 220.
  • the handler 261 directs the width of the substrate 472 generally along the direction 320, the operating direction of the printing chamber 220, as indicated at 472E.
  • the handler 261 then introduces the substrate 472 in the direction 320 into the printing chamber 220 and places the substrate 472 on the substrate support of the printer 100, as indicated at 472F.
  • the printer 100 moves the substrate 472 back and forth in the direction 320 while depositing print material on the substrate 472. Since the width of the substrate 472 is directed along the direction 320, the substrate 472 is printed on while in the second orientation, as described with respect to Fig. 1C.
  • first orientation is associated with one of the portrait format and the landscape format
  • second orientation is associated with the other of the portrait and landscape formats.
  • a substrate can be received in an orientation corresponding to the portrait format and rotated and processed in an orientation corresponding to the landscape format, or vice versa.
  • the handler 261 Upon completion of the print material deposition, the handler 261 withdraws the substrate 472 in the direction 320 and moves the substrate 472 to another process chamber for post-deposition processing. For example, the handler 261 moves the substrate 472 to a position corresponding to the opening of the drying chamber 230 or 232, and directs the width of the substrate 472 generally along the corresponding direction 330 or 332, as indicated at 472G or 4721.
  • the controller 350 Prior to placement of the substrate 472 in the drying chamber 230 or 232, the controller 350 controls the drying chamber 230 or 232 to be configured in a second substrate support configuration corresponding to the landscape configuration of the substrate 472, as described with respect to Figs. 5B-5C herein.
  • the handler 261 introduces the substrate 472 in the direction 330 or 332 into the drying chamber 230 or 232, and places the substrate 472 on a substrate support (not shown) in the drying chamber, which has already been configured to be in the second substrate support configuration, corresponding to the second orientation, under control of the controller 350, as indicated at 472H or 472J.
  • the described arrangement is applicable to other process chambers for post-deposition processing, such as buffer chambers and curing chambers.
  • the handler 261 Upon completion of the post-deposition processing, the handler 261 withdraws the substrate 472 in the direction 330 or 332 from the drying chamber 230 or 232, and moves the substrate 472 to another process chamber for post-deposition processing, or back to the printing chamber 220 for deposition of another layer of print material, or to the passage or shuttle chamber 270 for unloading the substrate 472 from the transfer chamber 260.
  • the handler 261 directs the width of the substrate 472 generally along the direction 360, as indicated at 472K. As a result, the substrate 472 is transferred to the subsequent process chambers in the landscape configuration.
  • the described arrangement is applicable to other chambers along the conveyance path 203 until the substrate 472 is ready to be unloaded from the printing system 200 through the unloading port 214.
  • the substrate 472 is unloaded in an orientation corresponding to the portrait format.
  • the substrate 472 is introduced by a handler of the transfer chamber 266 into the output rotation chamber 212, placed on a rotatable chuck of the output rotation chamber 212, and rotated by the chuck to the orientation that corresponds to the portrait format.
  • the rotation of the chuck of the output rotation chamber 212 is about 90 degrees, but not necessarily exactly 90 degrees.
  • the handler of the transfer module 266 then withdraws the re-oriented substrate 472 from the input rotation chamber 212 and transfers the re oriented substrate 472 in the portrait orientation to the passage or shuttle module 278 for unloading at the unloading port 214.
  • the substrate 472 is unloaded in an orientation corresponding to the landscape format, without being rotated to the portrait orientation and without using the output rotation chamber 212.
  • the orientation of the substrate 472 is unchanged from the second orientation despite numerous rotational movements performed by one or more transfer modules between withdrawal of the re-oriented substrate 472 from the input rotation chamber 210 and placement of the re-oriented substrate in a process chamber, and/or between withdrawal of the processed substrate from the process chamber and transfer of the withdrawn substrate to a subsequent chamber.
  • the process chambers in the printing system 200 are configured under control of the controller 350 to be in a second substrate support configuration corresponding to the second orientation, for handling the substrate 472. No re -orientation of the substrate 472 is required between process chambers in this example.
  • FIGs. 5 A and 5B are schematic top views of a process chamber in a first substrate support configuration and a second substrate support configuration, respectively, for handling a substrate in a first orientation and a second orientation, in accordance with one embodiment.
  • Fig. 5C is a top perspective view of a substrate support and supporting elements of the process chamber in the second substrate support configuration.
  • the process chamber is the drying chamber 230
  • the first orientation corresponds to the portrait format
  • the second orientation corresponds to the landscape format.
  • This arrangement is also applicable to other process chambers for post-deposition processing, such as curing chambers and/or buffer chambers.
  • the process chamber e.g., the drying chamber 230, comprises a housing 532 having an opening 534.
  • Processing equipment 538 is arranged inside or outside the housing 532 for performing post-deposition processing on the substrate having print material deposited thereon.
  • the processing equipment 538 may include gas handling equipment to circulate gas and maintain a reduced pressure inside the housing 532.
  • processing equipment examples include, but are not limited to, gas sources for maintaining an intended atmosphere inside the process chamber, heaters and/or cooling devices for drying, curing or maintaining an intended temperature inside the process chamber, vacuum suction and/or pressurized gas supply for an intended pressure or vacuum inside the process chamber, fans and/or blowers and/or ventilation mechanisms for an intended distribution of gas and/or temperature inside the process chamber, UV or other light sources for drying or curing, etc.
  • a controller 550 is coupled to various components of the process chamber to perform one or more operations described herein. In at least one embodiment, the controller 550 is configured as part of the controller 350. In a further embodiment, the controller 550 is a separate controller from, and operable with, the controller 350.
  • a substrate support 536 is provided in the housing 532.
  • the substrate support 536 may have suction holes or channels or cavities (not shown) for holding a substrate thereof by suction or vacuum. Other configurations for holding the substrate are within the scopes of various embodiments. In at least one embodiment, the substrate support 536 simply supports the substrate from below by gravity.
  • a plurality of supporting elements 540 are arranged inside the housing 532 according to a portrait configuration, for example, as shown in Fig. 5 A, and a landscape configuration, for example, as shown in Fig. 5B.
  • the supporting elements 540 may be controllably extendable and retractable relative to the substrate support 536, as best seen in Fig. 5C described herein.
  • Examples of the supporting elements 540 include, but are not limited to, lift pins and posts.
  • a first set of supporting elements 541 is extended from the substrate support 536, whereas the remaining supporting elements 543 remain retracted inside the substrate support 536. These supporting elements are actuated so they can be extended or retracted.
  • the extended supporting elements 541 are illustrated as solid black circles, whereas the supporting elements 543 are illustrated as white circles in Fig. 5A.
  • a second set of supporting elements 542 is extended from the substrate support 536, whereas the remaining supporting elements 544 remain retracted inside the substrate support 536.
  • the extended supporting elements 542 are illustrated as solid black circles, whereas the supporting elements 544 are illustrated as white circles in Fig. 5A.
  • the second set of supporting elements 542 is different from the first set of supporting elements 541 in that at least one supporting element included in the first set of supporting elements 541 is not included in the second set of supporting elements 542, and vice versa.
  • a supporting element 549 is not included in the first set of supporting elements 541 in Fig. 5A, but is included in the second set of supporting elements 542 in Fig. 5B.
  • the first set of supporting elements 541 is arranged in a first pattern 561 that corresponds to the orientation of the substrate 471 according to the portrait format.
  • the size and/or shape of the first pattern 561 may vary depending on the size of the substrate 471 , e.g., by additionally extending one or more supporting element 543 from the substrate support 536 to support a larger substrate in an orientation corresponding to the portrait format, or by retracting one or more supporting elements 541 into the substrate support 536 if such one or more supporting elements 541 are not necessary for supporting a smaller substrate in an orientation corresponding to the portrait format.
  • the first pattern 561 corresponds to the portrait format in that a length LI of the first pattern 561 is oriented along a first direction 330, and a width W1 of the first pattern 561 is oriented along a second direction 530 transverse to the first direction 330.
  • the first direction 330 is the direction in which a handler, such as the handler 261 , introduces the substrate 471 into and withdraws the substrate 471 from the housing 532, through the opening 534.
  • the second direction 530 corresponds to the width direction of the opening 534.
  • the second set of supporting elements 542 is arranged in a second pattern 562 that corresponds to the configuration of the substrate 472 according to the landscape format.
  • the second pattern 562 is different from the first pattern 561.
  • the size and/or shape of the second pattern 562 may vary depending on the size of the substrate 472, e.g., by additionally extending one or more supporting element 544 from the substrate support 536 to support a larger substrate in an orientation corresponding to the landscape format, or by retracting one or more supporting elements 542 into the substrate support 536 if such one or more supporting elements 542 are not necessary for supporting a smaller substrate in an orientation corresponding to the landscape format.
  • the second pattern 562 corresponds to the landscape format in that a length L2 of the second pattern 562 is oriented along the second direction 530, and a width W2 of the second pattern 562 is oriented along the first direction 330.
  • the controller 550 in response to a control signal, for example, from the controller 350, indicating that the substrate 472 in a landscape orientation is to be handled next by the process chamber, the controller 550 causes the supporting elements 540 to be configured according to landscape format by extending supporting elements 542 from the substrate support 536, while maintaining the supporting elements 544 retracted in the substrate support 536.
  • the extended supporting elements 542 create a space 579 between the top ends of the extended supporting elements 542 and the substrate support 536.
  • the end effector 466 of the handler 261 with the substrate 472 held or supported thereon is introduced in the direction 330 through the opening 534 into the inside of the housing 532.
  • the end effector 466 is inserted into the space 579 and lowered to place the substrate 472 on the top ends of the extended supporting elements 542.
  • the end effector 466 is then withdrawn from the housing 532, and the extended supporting elements 542 with the substrate 472 supported thereon are retracted into the substrate support 536, leaving the substrate 472 on the substrate support 536.
  • the supporting elements 542 are extended again to raise the processed substrate 472 from the substrate support 536 and create a space 579 between the processed substrate 472 and the substrate support 536.
  • the end effector 466 is inserted into the space 579, lifts the processed substrate 472 off the top ends of the extended supporting elements 542, and withdraws the processed substrate 472 from the housing 532 in the direction 330.
  • a similar operation is performed for handling the substrate 471 in a portrait orientation.
  • the controller 550 in response to a further control signal, for example, from the controller 350, indicating that the substrate 471 in a portrait orientation is to be handled next by the process chamber, the controller 550 causes the supporting elements 540 to be configured corresponding to portrait format by extending supporting elements 541 from the substrate support 536, while maintaining the supporting elements 543 retracted in the substrate support 536. The operation then proceeds in a manner similar to that described with respect to Figs. 5B-5C.
  • supporting elements are extended and retracted to configure supporting elements according to the portrait or landscape format.
  • the supporting elements may be a plurality of posts fixed in an extended configuration and arranged to provide support for substrates of different sizes in different orientations.
  • the chamber of Figs. 5A-5C feature posts that do not extend and retract, substrates may be placed on the posts in an orientation corresponding to the portrait or landscape format without changing configuration of the supporting elements.
  • the number of supporting elements shown in Figs. 5A-5C are examples, and any appropriate number of supporting elements for the size and type of substrate being supported may be used in this manner.
  • supporting elements can be configured to extend and retract together in a single group pattern to support a substrate in either a portrait or a landscape orientation.
  • a substrate support area 570 is defined by supporting elements 572 that are actuated to extend and retract to process substrates, and the pattern of the actuated supporting elements 572 accommodates a substrate in an orientation corresponding either to the portrait format or to the landscape format.
  • the configuration of the actuated supporting elements 572 has a cross-shape with the first substrate support configuration and the second substrate support configuration, but any shape that will accommodate a substrate in either orientation can be used for this embodiment.
  • the deposition and post-deposition processing may be automatically performed, without manual intervention by a human operator, to handle substrates in both a portrait orientation and a landscape orientation.
  • Fig. 6 is a flowchart of a printing method 600 in accordance with one embodiment.
  • the printing method 600 may be performed in any of the printing systems 100, 200 by, or under control of, at least one controller as described herein. In the description below, the printing method 600 is performed by, or under control of, the controller 350.
  • a substrate is loaded into a printing system.
  • a substrate is loaded through the loading port 208 into the printing system 200 (Fig. 2), as described herein.
  • the following discussion is presented in the context of a substrate loaded into the printing system 200 in a portrait orientation, but a similar process may be followed for a substrate loaded in a landscape orientation.
  • a processing format of the substrate is determined.
  • the controller 350 refers to the design data used for print material deposition, or other available data, to determine whether the substrate is to be processed in the printing system in the portrait format or the landscape format. The determination may be made based on a preferred arrangement of printed features on the substrate. Other data, such as processing signals and design data, may also be used by the controller 350 to determine format.
  • the method proceeds to operation 625. Because the substrate was received and loaded into the printing system in a portrait orientation, the substrate is not re-oriented by rotating the substrate to a different orientation.
  • the substrate is sequentially conveyed along a conveyance path in the printing system to a plurality of process chambers for deposition and post-deposition processing of the print material on the substrate.
  • the substrate is supported by a set of supporting elements, which may be movable, arranged in a first configuration corresponding to the portrait format. For example, as described with respect to Figs.
  • the substrate 471 is processed, without being re-oriented by the input rotation chamber 210, in a plurality of process chambers such as printing chambers, drying chambers, buffer chambers, and curing chambers.
  • a process chamber such as drying chambers, buffer chambers, and curing chambers
  • the substrate 471 is supported by a first set of supporting elements 541 arranged in a first configuration 561 corresponding to the portrait format, as described with respect to Fig. 5 A.
  • the substrate 471 having been processed at operation 625 is unloaded from the printing system 200, for example, through the unloading port 214. Because the substrate was loaded into the printing system in a portrait orientation, and was not rotated for any processing, the substrate is unloaded in a portrait orientation.
  • the method proceeds from operation 615 to operation 635.
  • the substrate is re-oriented from the portrait orientation in which it was received to a landscape orientation.
  • the substrate 472 is rotated in the input rotation chamber 210 from a first orientation (at 472A) associated with the portrait format to a second orientation (at 472D) associated with the landscape format, as described with respect to Figs. 4C-4D.
  • the substrate is sequentially conveyed along the conveyance path in the printing system to be processed by the process chambers in the printing system 200.
  • the substrate is supported by a second set of supporting elements, which may be movable, arranged in a second configuration corresponding to the landscape format.
  • the substrate 472 is processed, in a re-oriented landscape orientation, in a plurality of process chambers such as printing chambers, drying chambers, buffer chambers, and curing chambers.
  • the substrate 472 is supported by a second set of supporting elements 542 arranged in a second configuration 562 corresponding to the landscape format, as described with respect to Figs. 5B-5C.
  • the substrate 472 having been processed at operation 645 is optionally rotated from a landscape orientation to a portrait orientation, for example, at the output rotation chamber 212 before unloading the substrate 472 in the portrait orientation at operation 665.
  • the operation 645 is omitted and the substrate 472 is unloaded at operation 665 in the landscape orientation.
  • the substrate is processed in the process chambers and moved between the process chambers without being re-oriented or rotated between the first orientation associated with the portrait format and the second orientation associated with the landscape format. This arrangement, as noted herein, reduces the printing time and increases productivity.
  • printed products manufactured by the described printing method include, but are not limited to, solar panels, and flat panel displays such as organic light emitting diode (OLED) displays.
  • OLED organic light emitting diode
  • Fig. 7 is a block diagram of a controller, in accordance with one embodiment.
  • One or more of the units and/or systems and/or operations described with respect to Figs. 1-6 is/are realized in one embodiment by one or more controllers 700 of Fig. 7.
  • the controller 700 comprises a hardware processor 702, a storage device 704 including at least one non-transitory, computer readable storage medium, a bus 708, an I/O (input/output) interface 710, and a network interface 712.
  • the processor 702 is coupled with the storage device 704, the I/O interface 710, and the network interface 712 via the bus 708.
  • the network interface 712 is connectable to a network 714, so that the processor 702 and the storage device 704 are communicable with other devices via the network 714.
  • the processor 702 is configured to execute computer program instructions encoded in the storage device 704 and/or to access data stored in the storage device 704 to cause the controller 700 to perform one or more functionalities and/or operations described with respect to Figs. 1A-6.
  • the processor 702 includes one or more of a central processing unit (CPU), a multi-processor, a distributed processing system, an application specific integrated circuit (ASIC), and/or a suitable hardware processing unit.
  • CPU central processing unit
  • the storage device 704 includes one or more of an electronic, magnetic, optical, electromagnetic, infrared, and/or a semiconductor system (or apparatus or device) for storing instructions and/or data in a non-transitory manner.
  • the storage device 704 includes a semiconductor or solid-state memory, a magnetic tape, a removable computer diskette, a random access memory (RAM), a read-only memory (ROM), a rigid magnetic disk, and/or an optical disk.
  • RAM random access memory
  • ROM read-only memory
  • storage device 704 includes a compact disk-read only memory (CD-ROM), a compact disk-read/write (CD-R/W), and/or a digital video disc (DVD).
  • CD-ROM compact disk-read only memory
  • CD-R/W compact disk-read/write
  • DVD digital video disc
  • the I/O interface 710 is circuitry that is connectable with external circuitry.
  • the I/O interface 710 includes one or more of a keyboard, keypad, mouse, trackball, trackpad, cursor direction keys, card reader, communication port, display, signal light, printer and/or audio device for communicating information to/from the processor 702.
  • the I/O interface 710 is omitted.
  • the network interface 712 is circuitry that allows the controller 700 to communicate with the network 714, to which one or more other controllers and/or image capturing/processing equipment are connected.
  • the network interface 712 includes one or more of wireless network interfaces such as BLUETOOTH, WIFI, WIMAX, GPRS, or WCDMA; or wired network interface such as ETHERNET, USB, or IEEE-1394.
  • the network interface 712 is omitted.
  • controller 700 By being configured to execute some or all of functionalities and/or operations described with respect to Figs. 1A-6, the controller 700 enables the realization of one or more advantages and/or effects described with respect to Figs. 1A-6.

Abstract

A printing system includes process chambers arranged along a conveyance path for deposition and post-deposition processing of print material on a substrate. Each process chamber has a substrate support with a configuration associated with a first format and a second format. An input rotation chamber is upstream of the process chambers for selectively rotating the substrate from a first orientation associated with the first format to a second orientation associated with the second format. An output rotation chamber is downstream of the process chambers for selectively rotating the substrate, with processed print material thereon, back to an orientation associated with the first format. The first format is one of a portrait format and a landscape format. The second format is the other of the portrait format and the landscape format.

Description

PRINTING SYSTEM, PROCESS CHAMBER AND PRINTING METHOD FOR HANDLING SUBSTRATES IN DIFFERENT ORIENTATIONS
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application for patent claims benefit of United States Provisional Patent Application Serial No. 62/804, 135 filed February 1 1, 2019, which is incorporated by reference herein.
FIELD
[0002] Embodiments of the present application generally relate to inkjet printing systems. Specifically, methods, systems and/or apparatuses for ejection control in inkjet printing systems are described.
BACKGROUND
[0003] Inkjet printing is common, both in office and home printers and in industrial scale printers used for fabricating displays, printing large scale written materials, adding material to manufactured articles such as PCBs, and constructing biological articles such as tissues. Commercial, industrial and/or consumer inkjet printers use dispensers to apply print material to a substrate. The dispenser ejects a controlled quantity of print material toward a substrate at a controlled time and rate so that the print material arrives at the substrate in a target location and makes a printed feature having a desired size and shape. In some situations, the print material is to be ejected toward the substrate while the substrate is in one orientation, whereas in other situations, the print material is to be ej ected toward the substrate while the substrate is in a different orientation. Printing methods, systems and/or process chambers for handling substrates in different orientations are proposed in this aspect. SUMMARY
[0004] In one embodiment, a printing system comprises a plurality of process chambers arranged along a conveyance path for deposition and post-deposition processing of print material on a substrate. Each of the plurality of process chambers has a substrate support with a configuration associated with a first format and a second format. An input rotation chamber is arranged upstream of the plurality of process chambers for selectively rotating the substrate from a first orientation associated with the first format to a second orientation associated with the second format. An output rotation chamber is arranged downstream of the plurality of process chambers for selectively rotating the substrate, with processed print material thereon, from a third orientation associated with the second format to a fourth orientation associated with the first format. The first format is one of a portrait format, having a length in a first direction and a width in a second direction, and a landscape format having the width in the first direction and the length in the second direction. The second format is the other of the portrait format and the landscape format.
[0005] In one embodiment, a process chamber in a printing system comprises a housing, a substrate support in the housing for supporting thereon a substrate, processing equipment, and a plurality of supporting elements. The processing equipment is arranged inside or outside the housing for performing post-deposition processing on the substrate having print material deposited thereon. The plurality of supporting elements are arranged inside the housing in a configuration according to the portrait format and the landscape format. The portrait format has a length in a first direction and a width in a second direction, and the landscape format has the length in the second direction and the width in the first direction.
[0006] In a printing method in accordance with one embodiment, it is determined whether print material is to be deposited on a substrate in a portrait format, in which a length of the substrate is oriented along a first direction, or in a landscape format, in which a width of the substrate is oriented along the first direction. In response to a determination that the print material is to be deposited on the substrate in the portrait format, the substrate is sequentially conveyed along a conveyance path to a plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, without rotating the substrate from a first orientation associated with the portrait format to a second orientation associated with the landscape format, wherein in each of the process chambers, the substrate is supported by a first set of movable supporting elements arranged in a first configuration corresponding to the first orientation. In response to a determination that the print material is to be deposited on the substrate in the landscape format, the substrate is rotated from the first orientation associated with the portrait format to the second orientation associated with the landscape format, and then sequentially conveyed along the conveyance path to the plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, wherein in each of the process chambers, the substrate is supported by a second set of movable supporting elements arranged in a second configuration corresponding to the second orientation.
[0007] In one embodiment, a flat panel display is made by a printing method in which it is determined whether print material is to be deposited on a substrate in a portrait format, in which a length of the substrate is oriented along a first direction, or in a landscape format, in which a width of the substrate is oriented along the first direction. In response to a determination that the print material is to be deposited on the substrate in the portrait format, the substrate is sequentially conveyed along a conveyance path to a plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, without rotating the substrate from a first orientation associated with the portrait format to a second orientation associated with the landscape format, wherein in each of the process chambers, the substrate is supported by a first set of movable supporting elements arranged in a first configuration corresponding to the first orientation. In response to a determination that the print material is to be deposited on the substrate in the landscape format, the substrate is rotated from the first orientation associated with the portrait format to the second orientation associated with the landscape format, and then sequentially conveyed along the conveyance path to the plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, wherein in each of the process chambers, the substrate is supported by a second set of movable supporting elements arranged in a second configuration corresponding to the second orientation. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
[0009] Fig. l is a top isometric view of a printer.
[0010] Fig. 2 is a schematic top view of a printing system in accordance with one embodiment.
[0011] Fig. 3 is a schematic top view of a part of the printing system in Fig. 2.
[0012] Figs. 4A and 4B are schematic top views of the printing system part of Fig. 3 handling a substrate in a first orientation at various stages.
[0013] Figs. 4C and 4D are schematic top views of the printing system part of Fig. 3 handling a substrate in a second orientation at various stages.
[0014] Figs. 5 A and 5B are schematic top views of a process chamber in a first substrate support configuration and a second substrate support configuration, respectively, for handling substrates in a first orientation and a second orientation, respectively, in accordance with one embodiment.
[0015] Fig. 5C is a top perspective view of a substrate support and supporting elements of the process chamber in the second substrate support configuration.
[0016] Fig. 5D is a schematic to view of a process chamber for handling substrates in a first orientation and a second orientation, respectively, according to another embodiment.
[0017] Fig. 6 is a flowchart of a printing method in accordance with one embodiment.
[0018] Fig. 7 is a block diagram of a controller, in accordance with one embodiment. DETAILED DESCRIPTION
[0019] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subj ect matter. Specific examples of components, values, operations, materials, arrangements, etc., are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. Other components, values, operations, materials, arrangements, etc., are contemplated. For example, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as“beneath,”“below,”“lower,”“above,”“upper” and the like, may be used herein for ease of description to describe one element or feature’s relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
[0020] Fig. 1 is a top isometric view of a printer 100. The printer 100 has a substrate support 102, a print assembly 104, and a holder assembly 106 for manipulating a substrate for printing. The printer 100 is founded upon a base 108, which is in one example a massive object to minimize vibratory transmissions to the operative parts of the printer 100. In one example, the base 108 is a granite block. The substrate support 102 is located upon the base 108, and comprises a support surface 110 along with a device for making the support surface 110 substantially frictionless. In one example, the support surface 110 is a flotation table that provides a gas cushion on which the substrate floats. The support surface 110 features a first plurality of holes 112 that allow jets of gas to exit, thus providing an upward force to maintain a substrate at a desired elevation above the support surface 110. The support surface 110 may also have a second plurality of holes configured to allow controlled withdrawal of gas from the gas cushion floating the substrate to provide precise local control of substrate elevation. [0021] The print assembly 104 comprises a dispenser assembly 114 disposed on a print support 116. The print support 116 is disposed in relation to the substrate support 102 to provide access for the dispenser assembly 1 14 to position constructively in relation to a substrate on the substrate support 102 to precisely apply print material to the substrate. The print support 116 includes a rail or beam 117 that traverses the substrate support 102, allowing the dispenser assembly 114 to traverse the substrate support 102 and deposit print material at any location on the substrate from one side of the print support 116 to the opposite side thereof. In one example, the print support 116 is attached to the base 108 and extends from the base 108 to provide stable support for the dispenser assembly 114. Two stands 120 extend from the base 108, on opposite sides of the substrate support 102, to the rail 117, which extends across the substrate support 102. In one example, the stands 120 and the rail 117 are both made of the same material as the base 108. In one example, the stands 120, the rail 117, and the base 108 are separate pieces of granite that are bolted together.
[0022] The dispenser assembly 114 includes at least one printhead assembly 119 along with a print assembly controller 1 18 that includes electronics and/or sensors for controlling the functional parameters of the printhead assembly 119 such as location of the printhead assembly 119 along the print support 116, timing, duration, type of print material, and dispensing profile. The printhead assembly 119 is movable along the rail 117 of the print support 116 by operation of a print carriage 122 that couples with the print support 116 to translate the printhead assembly 119 along the rail 117 from one end of the rail 117 to the other opposite end. In one example, the print carriage 122 is driven by a motor or a servomotor. Power and signal conduits are not shown to simplify the figure.
[0023] A substrate (not shown in Fig. 1) is positioned under the print assembly 104 by the holder assembly 106. The holder assembly 106 acquires secure contact with the substrate upon loading and moves the substrate along the substrate support 102 to position the substrate with respect to the print assembly 104 for dispensing print material onto the substrate in a precise fashion. The holder assembly 106 is located on one side of the substrate support 102 and extends along the substrate support 102 in a first direction to translate the substrate in the first direction during printing. The first direction is denoted in Fig. 1 by arrow 124. The first direction 124 is referred to as the “Y direction”. The printhead assembly 1 19 moves in a second direction substantially transverse to the first direction, guided by the rail 1 17 which extends substantially in the second direction denoted in Fig. 1 by arrow 126. The second direction 126 is referred to as the“X direction” and the rail 1 17 as the“X beam.” A third direction substantially transverse to the first and second directions is denoted in Fig. 1 by arrow 125. The third direction 125 is referred to as the“Z direction.” The X, Y and Z directions are directions of axes of a coordinate system serving as a frame of reference of the printer 100, as illustrated by the arrows 124, 125, and 126. In one example, the origin of the coordinate system is at a fixed point, e.g., associated with the base 108.
[0024] The holder assembly 106 is disposed on a holder assembly support 128, which in one example is a rail that extends in the first direction substantially the entire length of the substrate support 102 along an edge 130 of the substrate support 102. In one example, the holder assembly support 128 is attached, for example bolted, to the base 108 to provide stable support for the holder assembly 106. In one example, the holder assembly support 128 is made from the same material as the base 108. The holder assembly support 128 is sometimes referred to as the“Y beam.” The holder assembly 106 moves along the holder assembly support 128 during operation to position the securely held substrate at any location on the substrate support 102, and the print assembly 104, for example by operation of the print assembly controller 1 18, positions the printhead assembly 1 19 to provide access to a precise location on the substrate for dispensing print material.
[0025] In the embodiment described above, the holder assembly is depicted as moving the substrate in the first direction 124 while the dispenser assembly moves in the second direction 126 to access all desired portions of the substrate. In other configurations, the dispenser assembly moves in the first and second directions while the substrate is held stationary. In other configurations, the dispenser assembly is held stationary while the substrate is moved in the first and second directions 124 and 126. In still other configurations, the holder assembly and the dispenser assembly both move in the first and second directions 124 and 126. Where the areal coverage of the dispenser assembly is different from the area of the substrate desired for printing, the dispenser assembly and the substrate are relatively moved to accomplish the complete print job. [0026] A system controller 129 receives signals from various sensors deployed throughout the printer 100 and sends signals to various components of the printer 100 to control printing. The system controller 129 is operationally coupled, for example, via a network, to the print assembly controller 1 18 and to a holder assembly controller 13 1 , which controls operation of the holder assembly 106. One or more of the substrate support 102, the print assembly 104, the holder assembly 106, and other ancillary systems, such as environment control and materials management systems, have sensors operatively coupled to the system controller 129 to transmit signals to the system controller 129 related to the status of various components during a printing operation. The system controller 129 includes data and instructions to determine control signals to send to various controlled components of the printer 100. In one embodiment, two or more of the system controller 129, the print assembly controller 1 18 and the holder assembly controller 13 1 are integrated into a single controller. In one embodiment, at least one of the system controller 129, the print assembly controller 1 18 and the holder assembly controller 13 1 is implemented as several controllers distributed in the printer 100 and connected one with another via a network. An example configuration of a controller in accordance with one embodiment is described with respect to Fig. 7. For simplicity, in the description below,“controller” refers to any one or more of controllers in the printer 100 and/or any one or more of controllers in a printing system using the printer 100.
[0027] Typically a printer, such as the printer 100, is integrated with post processing chambers that perform various processes to fix the print material on the substrate after deposition. In some cases, a particular substrate may have a particular orientation that is most advantageous for performing the designed print job on the substrate. For example, sometimes a substrate is advantageously processed in the “portrait” format, where the substrate is inserted into the printer in a direction parallel to the long dimension of the substrate, while at other times the substrate is advantageously processed in the“landscape” format, where the substrate is inserted into the printer in a direction parallel to the short dimension of the substrate. While the printer 100 is capable of handling and performing deposition of print material on substrates in both orientations, i.e., associated with both the landscape format and portrait format, use of post-processing chambers that support only one orientation frequently requires multiple rotations of the substrate between the deposition process and the post-process, at least where different orientations are needed for the two processes. In complex printing systems including several printers, rotation of the substrate between deposition and post-processing can become undesired where the two processes need different substrate orientations.
[0028] In this aspect, the printers, post-processing chamber, and systems described herein include one or more chambers with the capability to support substrates in orientations associated with the portrait format and landscape format. As a result, a substrate rotated to a landscape orientation for print material deposition need not be rotated to a portrait orientation for post-processing. This arrangement saves time and increases productivity compared to the other approaches as discussed above. In this disclosure, references to“portrait orientation” and “landscape orientation” should be understood as referring to an orientation that corresponds to the portrait format and the landscape format, respectively. In this sense, a“portrait orientation” is a substrate orientation that enables processing the substrate in the portrait format and a“landscape orientation” is a substrate orientation that enables processing the substrate in the landscape format.
[0029] Fig. 2 is a schematic top view of a printing system 200 in accordance with one embodiment. The printing system 200 comprises a plurality of process chambers arranged along a conveyance path generally designated by arrow 203 , an input rotation chamber 210 arranged upstream of the process chambers, and an output rotation chamber 212 arranged downstream of the process chambers. The input rotation chamber 210 is configured to selectively rotate a substrate from a first orientation associated with a first format to a second orientation associated with a second format, and the output rotation chamber 212 is configured to selectively rotate the substrate from a third orientation associated with the second format to a fourth orientation associated with the first format. Each of the input rotation chamber 210 and the output rotation chamber 212 can rotate a substrate from an orientation associated with the first format to an orientation associated with the second format, or from an orientation associated with the second format to an orientation associated with the first format. In an example, the first orientation is associated with one of the portrait format and the landscape format, and the second orientation is associated with the other of the portrait format and the landscape format. As noted above, each of the process chambers is configured to have substrate support configurations corresponding to the first and second formats, so that each process chamber may process a substrate in an orientation associated with either format and rotation of the substrate between the process chambers is not required.
[0030] It should be noted that the input rotation chamber 210 and the output rotation chamber 212 may process substrates in different orientations or in the same orientations. If the input rotation chamber 210 is not aligned with the output rotation chamber 212, the input rotation chamber 210 rotates substrates from a first orientation associated with the first format to a second orientation associated with the second format, while the output rotation chamber 212 rotates a substrate from a third orientation associated with the second format to a fourth orientation associated with the first format.
[0031] The process chambers are configured for deposition and/or post-deposition processing of print material on a substrate. Examples of process chambers include, but are not limited to, printing chambers, drying chambers, curing chambers, thermal chambers, and buffer chambers. In the example configuration in Fig. 2, the process chambers of the printing system 200 include printing chambers 220, 222, 224, 226, drying chambers 230, 232, 234, 236, 238, 240, 242, 244, and a buffer chamber 250. Any of the drying chambers 230, 232, 234, 236, 238, 240, 242, 244, could be configured as a curing chamber. The number and/or type and/or arrangement of the process chambers in Fig. 2 are examples. Other configurations are within the scopes of various embodiments.
[0032] Besides the process chambers and the rotation chambers 210, 212, the printing system 200 further comprises transfer chambers 260, 262, 264, 266, passage or shuttle chambers 270, 272, 274, 276, 278, connection chambers 280, 282, and thermal chambers 290, 292, 294, 296. The number and/or type and/or arrangement of the chambers in Fig. 2 are examples. Other configurations are within the scopes of various embodiments.
[0033] The transfer chamber 260 has a loading port 208 through which a substrate delivered to the printing system 200 by a conveyor 206 is loaded into the printing system 200. The connection chamber 282 has an unloading port 214 through which the substrate having print material deposited and processed thereon is unloaded from the printing system 200 onto a conveyor 216. Between the loading port 208 and unloading port 214, the transfer chambers 260, 262, 264, 266, passage or shuttle chambers 270, 272, 274, 276, 278, and connection chambers 280, 282 are coupled together along the conveyance path 203. The process chambers, rotation chambers 210, 212, and thermal chambers 290, 292, 294, 296 are also coupled to the transfer chambers 260, 262, 264, 266 and/or the connection chambers 280, 282. In some cases the various chambers, or a subset thereof, are coupled together in an airtight manner such that a sealed enclosure is formed in which a controlled environment is maintained. Port 246 of transfer chamber 262 is not coupled to another chamber, and is typically kept closed, and may be sealed. In general, one or more ports of the transfer chambers 260, 262, 264, 266, and/or connection chambers 280, 282, such as a port 246 of the transfer chamber 262, may be uncoupled in this manner. In the controlled environment, at least one of temperature, pressure, or atmospheric composition is maintained at a condition suitable for the deposition and post-deposition processing of print material. The controlled environment may feature different conditions at different locations in the printing system 200. In an example, the controlled environment may include an atmosphere of a gas that is inert to the print material and/or the material of a substrate being processed to prevent degradation of the printed products. Alternately, the controlled environment may include an atmosphere selected to perform a specific interaction with the substrate or the print material . Each of the described chambers may have a separate controlled environment individually maintained for that chamber. One or more of the described chambers may share the same controlled environment. In an example, any controlled environment might include a nitrogen atmosphere, or an atmosphere of a noble gas. In other cases, the controlled environment might include air, or might be ambient air, or conditioned air such as ozone free air or moisture free air, while temperature and/or pressure may be controlled.
[0034] Each of the printing chambers 220, 222, 224, 226 includes a printer, such as the printer 100 described with respect to Fig. 1 , and is configured for deposition of print material on a substrate. The printing chambers 220, 222, 224, 226 may deposit the same or different print material. The remaining non-printing chambers, i.e., drying chambers, thermal chambers, curing chambers and buffer chambers, are for post deposition processing of the deposited print material on the substrate. Examples of post-deposition processing include, but are not limited to, drying, curing, thermal processing, and buffering (e.g., holding or queuing) substrates. More than one post-deposition processing may be performed in a single process chamber. Moreover, a printing system may include one printer and one post-processing chamber, with input and output rotation chambers as shown in Fig. 2.
[0035] The drying chambers 230, 232, 234, 236, 238, 240, 242, 244 are configured to dry the substrate after print material deposition in one or more of the printing chambers 220, 222, 224, 226. For example, the print material may be a liquid mixture of organic compounds and a solvent deposited on the substrate. The substrate with the print material deposited there on is introduced into a drying chamber where the substrate is dried and the solvent is evaporated. Any of the drying chambers 230, 232, 234, 236, 238, 240, 242, 244, may be a vacuum drying chamber configured to accommodate one or more substrates in a stack. A vacuum drying chamber is normally configured to dry substrates in vacuum or at a pressure below the ambient pressure. A vacuum chamber may also be configured to heat or cool the substrate during vacuum drying.
[0036] A curing chamber is configured to solidify the deposited print material by a curing process to form a permanent printed feature of a printed product. In an example, the curing process uses thermal and/or UV treatment.
[0037] The buffer chamber 250 is configured to hold one or more substrates in a stack. In an example, the buffer chamber 250 holds a substrate for production management, for example, until another module or chamber is ready to receive and process the substrate. In a further example, the buffer chamber 250 holds a defective substrate until it can be removed. In another example, the buffer chamber 250 holds a substrate for a period of time as a part of a post-deposition processing, for example, to permit the substrate to cool down and/or to dry.
[0038] Each of the loading port 208 and unloading port 214 provides an interface between the controlled environment within the sealed enclosure of the printing system 200 and the ambient atmosphere, or between the controlled environment of the printing system 200 and a controlled environment of another printing system coupled to the printing system 200. For example, each of the loading port 208 and unloading port 214 is coupled to a pressurized gas source for purging out contaminants when the port is opened for a substrate to pass through. Thereafter, the port is again sealed.
[0039] Each of the rotation chambers 210, 212 includes a rotatable substrate support configured to hold a substrate thereon and then rotate to change the orientation of the substrate, as described herein. In an example, the output rotation chamber 212 is omitted and/or the substrate is unloaded without being rotated back to the initial orientation when the substrate is loaded into the printing system 200. The rotatable substrate support is configured to provide access for a substrate handler from two adj acent sides of the rotatable chuck such that substrates can be deposited on the rotatable chuck in one orientation and then retrieved from the rotatable chuck in a different orientation. In some cases, the rotatable substrate support includes a holding surface of some sort, such as a platform or grid or dispersion of posts that can securely support the substrate through a rotation operation. The substrate support may include edge capture features to decrease any tendency of the substrate to shift during rotation. Examples of such features include corner posts or pockets. For post supports, the posts may be tipped with a material that exhibits a frictional force when contacting the substrate.
[0040] Each of the transfer chambers 260, 262, 264, 266 includes a handler for handling a substrate, as described herein. An example handler for a transfer chamber includes a robot.
[0041] Each of the passage or shuttle chambers 270, 272, 274, 276, 278 also includes a handler for handling a substrate. An example handler for a passage or shuttle chamber includes a conveyor. At least one of the passage or shuttle chambers 270, 272, 274, 276, 278 is configured to move a substrate back and forth along the conveyance path 203 between different process chambers. For example, the passage or shuttle chamber 276 may move a substrate from the transfer chamber 264 to the transfer chamber 266 for print material deposition by the printing chamber 226 coupled to the transfer chamber 266. Thereafter, the passage or shuttle chamber 276 may move the substrate in the opposite direction from the transfer chamber 266 back to the transfer chamber 264 to temporarily store the substrate in the buffer chamber 250 coupled to the transfer chamber 264.
[0042] Each of the connection chambers 280, 282 also includes a handler for handling a substrate. For example, the handler of the connection chamber 280 is configured to move substrates among the passage or shuttle chambers 272, 274, and thermal chambers 290, 292. An example handler for a connection chamber includes a robot.
[0043] The printing system 200 further comprises one or more controllers coupled to one or more or all chambers of the printing system 200, including the process chambers, rotation chambers, curing chambers, thermal chambers, drying chambers, buffer chambers, transfer chambers, passage or shuttle chambers, and connection chambers. A more detailed description of the one or more controllers is given below with respect to Fig. 3.
[0044] Fig. 3 is a schematic top view of a part 300 of the printing system 200. In Fig. 3, the transfer chamber 260 is coupled to the input rotation chamber 210, the printing chamber 220, the drying chambers 230, 232, and the passage or shuttle chamber 270. A controller 350 of the printing system 200 is coupled to the transfer chamber 260, the input rotation chamber 210, the printing chamber 220, the drying chambers 230, 232, the passage or shuttle chamber 270 and the conveyor 206 to control various components of the printing system 200 to perform one or more operations described herein.
[0045] Each transfer chamber 260 has a handler 261 which is moveable inside the transfer chamber 260. The handler 261 A, in the transfer chamber 260 nearest the loading port 208, receives or loads a substrate from a conveyor 206 into the transfer chamber 260 through the loading port 208. The handler 261 A may introduce the substrate into or withdraw the substrate from the input rotation chamber 210 in a direction indicated by arrow 310. The handler 261 A may introduce the substrate into or withdraw the substrate from the drying chamber 230 in a direction indicated by arrow 330. The handlers 261 A and B can transfer custody of a substrate between the transfer chambers 260. The handler 26 IB, nearest the passage or shuttle chamber 270, may introduce the substrate into or withdraw the substrate from the printing chamber 220 in a direction indicated by arrow 320. The direction 320 generally coincides with the Y direction (scan direction) of a printer 100 included in the printing chamber 220. Any inaccuracy in the orientation or position of the substrate is correctable by the printer 100, by physically adjusting the substrate and/or by logically correcting printing data used to control print material deposition on the substrate. The handler 261B may introduce the substrate into or withdraw the substrate from the drying chamber 232 in a direction indicated by arrow 332. When print material deposition and/or post-deposition processing in one or more of the printing chamber 220, and drying chambers 230, 232 is completed, the handler 261B unloads the substrate in the direction 332 from the transfer chamber 260 into the passage or shuttle chamber 270 to be transferred to the transfer module 262 to be processed by the subsequent process chambers. Substrates can also be removed after processing through the loading port 208, if desired. The directions 310, 320, 330, 332 in which the handlers 261 A and B introduce a substrate into or withdraws the substrate from the corresponding chambers 210, 220, 230, 232 are inclined relative to the direction 332 in which the substrate is transferred through the transfer module 260 to the transfer module 262 and further along the conveyance path 203. Each handler 261 A and B is rotatable about at least one axis to direct the substrate among the numerous directions 310, 320, 330, 332. This arrangement is an example. Other configurations are within the scopes of various embodiments.
[0046] The input rotation chamber 210 can be used to change the orientation of a substrate at any time during processing in the part 300. For example, a substrate may be loaded into the transfer chamber 260 in a first orientation, but if processing in a second orientation is desired, the substrate can be moved from the transfer chamber 260 to the rotation chamber 210 and rotated to the second orientation. The substrate can then be retrieved from the rotation chamber 210 in the second orientation and moved to any of the drying chambers 230, 232 and/or the printing chamber 220. As will be described further below, each of the drying chambers 230, 232 and the printing chamber 220 is configured to process substrates in two different orientations, conventionally described as“portrait” and“landscape” orientations. At any time during processing in the part 300, if desired, the substrate orientation can be changed by moving the substrate to the rotation chamber 210, rotating the substrate to a different orientation, and retrieving the substrate. It should be noted that the substrate could also be moved to the output rotation chamber 212 for rotating.
[0047] Figs. 4A and 4B are schematic top views of the part 300 of the printing system 200 handling a substrate in a first orientation at various stages. For simplicity, one or more elements discussed with respect to Fig. 3 are omitted in Figs. 4A-4B.
[0048] The handler 261 in the example configuration in Fig. 4A is a robot comprising a base 462, an articulated robot arm 464 attached to the base 462, and an end effector 464 attached at an end of the robot arm 464. The base 462 is movable in the direction 360 and the robot arm 464 is rotatable to perform various movements for handling the substrate 471. The end effector 464 is configured to positively hold the substrate 471, e.g., by vacuum or suction, or to simply support the substrate 471 by gravity. In an example, the end effector 464 is a fork for supporting the substrate 471 from below. The input rotation chamber 210 includes a rotatable chuck 410. In an example, the chuck is a vacuum chuck configured to hold a substrate thereon while rotating the substrate to change its orientation to correspond to the portrait format or the landscape format.
[0049] As shown in Fig. 4A, a substrate 471 in a first orientation corresponding to the portrait format is delivered by the conveyor 206 to the transfer chamber 260. The controller 350 determines, from printing or design data that print material is to be deposited on the substrate 471 in the portrait format. Since the substrate 471 is already oriented according to the portrait format, no re-orientation (i.e. rotation) of the substrate 471 is required, and the controller 350 determines that the input rotation chamber 210 is not necessary for handling the substrate 471.
[0050] As shown in Fig. 4B, the controller 350 controls the handler 261 to load the substrate 471 into the transfer chamber 260, as indicated at 471 A. The handler 261 then moves the substrate 471 in the direction 360 to a position corresponding to an opening of the printing chamber 220. The handler 261 directs the length of the substrate 471 generally along the direction 320, as indicated at 471E. The direction 320 is generally an operating direction of the printing chamber 220, a direction in which substrates are translated within the printing chamber 220 as material is deposited thereon. The handler 261 then introduces the substrate 471 in the direction 320 into the printing chamber 220 and places the substrate 471 on a substrate support of the printer 100, as indicated at 471F. The printer 100 moves the substrate 471 back and forth in the direction 320, which is the operating direction of the printer 100, while depositing print material on the substrate 471. Since the length of the substrate 471 is directed along the direction 320, the substrate 471 is printed on while oriented according to the portrait format, as described with respect to Fig. IB.
[0051] Upon completion of the print material deposition, the handler 261 withdraws the substrate 471 in the direction 320 and moves the substrate 471 to another process chamber for post-deposition processing. For example, the handler 261 moves the substrate 471 to a position corresponding to an opening of the drying chamber 230 or 232, and directs the length of the substrate 471 generally along the corresponding direction 330 or 332, as indicated at 471G or 4711. Prior to placement of the substrate 471 in the drying chamber 230 or 232, the controller 350 controls the drying chamber 230 or 232 to be configured in a first substrate support configuration to support the substrate 471 in an orientation corresponding to the portrait format, as described with respect to Fig. 5A herein. The first substrate support configuration is generally optimized for supporting the substrate in the first orientation such that the substrate is not damaged or contaminated during processing and such that the substrate can be retrieved after processing. The handler 261 introduces the substrate 471 in the direction 330 or 332 into the drying chamber 230 or 232, and places the substrate 471 on a substrate support (not shown) in the drying chamber, which has already been configured to be in the first substrate support configuration under control of the controller 350, as indicated at 471H or 471J. The described arrangement is applicable to other process chambers for post-deposition processing, such as buffer chambers and curing chambers.
[0052] Upon completion of the post-deposition processing, the handler 261 withdraws the substrate 471 in the direction 330 or 332 from the drying chamber 230 or 232, and moves the substrate 471 to another process chamber for post-deposition processing, or back to the printing chamber 220 for deposition of another layer of print material, or to the passage or shuttle module 270 for unloading the substrate 471 from the transfer module 260. For unloading, the handler 261 directs the length of the substrate 471 generally along the direction 360, as indicated at 471K. As a result, the substrate 471 is transferred to the subsequent process chambers in the first orientation. The described arrangement is applicable to other chambers and/or modules along the conveyance path 203 until the substrate 471 is unloaded from the printing system 200 through the unloading port 214.
[0053] The orientation of the substrate 471 is unchanged from the first orientation despite numerous rotational movements performed by one or more transfer modules between receipt of the substrate and placement of the received substrate in a process chamber, and/or between withdrawal of the processed substrate from the process chamber and transfer of the withdrawn substrate to a subsequent chamber or module. The process chambers in the printing system 200 are configured under control of the controller 350 to be in a first substrate support configuration corresponding to the first orientation, for handling the substrate 471. No re-orientation of the substrate 471 is required between process chambers. The rotation chambers 210, 212 are not necessary for handling the substrate 471.
[0054] The described arrangement in Figs. 4A-4B is given for a situation when substrate re-orientation is not required, i.e., when the substrate 471 is delivered to the printing system 200 in the first orientation and the controller 350 determines from the design data that print material is to be deposited on the substrate 471 in the same orientation. This arrangement is also applicable to a situation when a substrate is delivered to the printing system 200 in the second orientation and the controller 350 determines from the design data that print material is to be deposited on the substrate 471 in the same, second orientation, i.e., substrate re-orientation is not required.
[0055] Figs. 4C and 4D are schematic top views of the part 300 of the printing system 200 handling a substrate in the second orientation at various stages after being received in the first orientation. For simplicity, one or more elements discussed with respect to Figs. 3, 4A and 4B are omitted in Figs. 4C-4D.
[0056] As shown in Fig. 4C, a substrate 472 in the first orientation corresponding to the portrait format is delivered by the conveyor 206 to the transfer chamber 260. Unlike the substrate 471 , the controller 350 determines, from printing or design data, that print material is to be deposited on the substrate 472 in the second orientation. Since the substrate 472 is currently in the first orientation, re-orientation of the substrate 472 by the input rotation chamber 210 is required.
[0057] The controller 350 controls the handler 261 to load the substrate 472 into the transfer chamber 260, move the substrate 472 to a position corresponding to an opening of the input rotation chamber 210, and direct the length of the substrate 472 generally along the direction 310 of the input rotation chamber 210, as indicated at 472A. The handler 261 then introduces the substrate 472 in the direction 310 into the input rotation chamber 210 and places the substrate 472 on the chuck 410, as indicated at 472B. The controller 350 controls the chuck 410 to rotate the substrate 472 from the first orientation to the second orientation. The rotation of the chuck 410 is about 90 degrees, but not necessarily exact 90 degrees, because displacement errors may occur while the substrate 472 is being delivered to the printing system 200 and/or while the substrate 472 is being processed in the printing system 200. Misalignments in the direction and/or position of the substrate 472 will be adjusted in the printing chamber 220 as described herein.
[0058] As shown in Fig. 4D, as a result of the rotation of the chuck 410, the substrate 472 is oriented to the second orientation, as indicated at 472C. The handler 261 withdraws the substrate 472 in the direction 310 from the input rotation chamber 210, as indicated at 472D. The substrate 472 now in the second orientation is moved through the process chambers coupled to the transfer module 260 in a manner similar to that described with respect to Figs. 4A-4B, without re-orienting the substrate 472 between the process chambers.
[0059] Specifically, the handler 261 moves the substrate 472 in the direction 360 to a position corresponding to the opening of the printing chamber 220. The handler 261 directs the width of the substrate 472 generally along the direction 320, the operating direction of the printing chamber 220, as indicated at 472E. The handler 261 then introduces the substrate 472 in the direction 320 into the printing chamber 220 and places the substrate 472 on the substrate support of the printer 100, as indicated at 472F. The printer 100 moves the substrate 472 back and forth in the direction 320 while depositing print material on the substrate 472. Since the width of the substrate 472 is directed along the direction 320, the substrate 472 is printed on while in the second orientation, as described with respect to Fig. 1C. Note that the first orientation is associated with one of the portrait format and the landscape format, while the second orientation is associated with the other of the portrait and landscape formats. Thus, a substrate can be received in an orientation corresponding to the portrait format and rotated and processed in an orientation corresponding to the landscape format, or vice versa.
[0060] Upon completion of the print material deposition, the handler 261 withdraws the substrate 472 in the direction 320 and moves the substrate 472 to another process chamber for post-deposition processing. For example, the handler 261 moves the substrate 472 to a position corresponding to the opening of the drying chamber 230 or 232, and directs the width of the substrate 472 generally along the corresponding direction 330 or 332, as indicated at 472G or 4721. Prior to placement of the substrate 472 in the drying chamber 230 or 232, the controller 350 controls the drying chamber 230 or 232 to be configured in a second substrate support configuration corresponding to the landscape configuration of the substrate 472, as described with respect to Figs. 5B-5C herein. The handler 261 introduces the substrate 472 in the direction 330 or 332 into the drying chamber 230 or 232, and places the substrate 472 on a substrate support (not shown) in the drying chamber, which has already been configured to be in the second substrate support configuration, corresponding to the second orientation, under control of the controller 350, as indicated at 472H or 472J. The described arrangement is applicable to other process chambers for post-deposition processing, such as buffer chambers and curing chambers.
[0061] Upon completion of the post-deposition processing, the handler 261 withdraws the substrate 472 in the direction 330 or 332 from the drying chamber 230 or 232, and moves the substrate 472 to another process chamber for post-deposition processing, or back to the printing chamber 220 for deposition of another layer of print material, or to the passage or shuttle chamber 270 for unloading the substrate 472 from the transfer chamber 260. For unloading, the handler 261 directs the width of the substrate 472 generally along the direction 360, as indicated at 472K. As a result, the substrate 472 is transferred to the subsequent process chambers in the landscape configuration. The described arrangement is applicable to other chambers along the conveyance path 203 until the substrate 472 is ready to be unloaded from the printing system 200 through the unloading port 214.
[0062] In an example, the substrate 472 is unloaded in an orientation corresponding to the portrait format. For this purpose, the substrate 472 is introduced by a handler of the transfer chamber 266 into the output rotation chamber 212, placed on a rotatable chuck of the output rotation chamber 212, and rotated by the chuck to the orientation that corresponds to the portrait format. Again, the rotation of the chuck of the output rotation chamber 212 is about 90 degrees, but not necessarily exactly 90 degrees. The handler of the transfer module 266 then withdraws the re-oriented substrate 472 from the input rotation chamber 212 and transfers the re oriented substrate 472 in the portrait orientation to the passage or shuttle module 278 for unloading at the unloading port 214.
[0063] In a further example, the substrate 472 is unloaded in an orientation corresponding to the landscape format, without being rotated to the portrait orientation and without using the output rotation chamber 212.
[0064] Once the substrate 472 has been re-oriented by the input rotation chamber 210, the orientation of the substrate 472 is unchanged from the second orientation despite numerous rotational movements performed by one or more transfer modules between withdrawal of the re-oriented substrate 472 from the input rotation chamber 210 and placement of the re-oriented substrate in a process chamber, and/or between withdrawal of the processed substrate from the process chamber and transfer of the withdrawn substrate to a subsequent chamber. The process chambers in the printing system 200 are configured under control of the controller 350 to be in a second substrate support configuration corresponding to the second orientation, for handling the substrate 472. No re -orientation of the substrate 472 is required between process chambers in this example.
[0065] The described arrangement in Figs. 4C-4D is given for a situation when substrate re-orientation is performed, i.e., when the substrate 472 is delivered to the printing system 200 in the first orientation and the controller 350 determines from the design data that print material is to be deposited on the substrate 472 in the second orientation.
[0066] Figs. 5 A and 5B are schematic top views of a process chamber in a first substrate support configuration and a second substrate support configuration, respectively, for handling a substrate in a first orientation and a second orientation, in accordance with one embodiment. Fig. 5C is a top perspective view of a substrate support and supporting elements of the process chamber in the second substrate support configuration.
[0067] In the example configuration in Figs. 5A-5B, the process chamber is the drying chamber 230, the first orientation corresponds to the portrait format, and the second orientation corresponds to the landscape format. This arrangement is also applicable to other process chambers for post-deposition processing, such as curing chambers and/or buffer chambers.
[0068] The process chamber, e.g., the drying chamber 230, comprises a housing 532 having an opening 534. Processing equipment 538 is arranged inside or outside the housing 532 for performing post-deposition processing on the substrate having print material deposited thereon. In this case, the processing equipment 538 may include gas handling equipment to circulate gas and maintain a reduced pressure inside the housing 532. Examples of processing equipment include, but are not limited to, gas sources for maintaining an intended atmosphere inside the process chamber, heaters and/or cooling devices for drying, curing or maintaining an intended temperature inside the process chamber, vacuum suction and/or pressurized gas supply for an intended pressure or vacuum inside the process chamber, fans and/or blowers and/or ventilation mechanisms for an intended distribution of gas and/or temperature inside the process chamber, UV or other light sources for drying or curing, etc. A controller 550 is coupled to various components of the process chamber to perform one or more operations described herein. In at least one embodiment, the controller 550 is configured as part of the controller 350. In a further embodiment, the controller 550 is a separate controller from, and operable with, the controller 350.
[0069] A substrate support 536 is provided in the housing 532. The substrate support 536 may have suction holes or channels or cavities (not shown) for holding a substrate thereof by suction or vacuum. Other configurations for holding the substrate are within the scopes of various embodiments. In at least one embodiment, the substrate support 536 simply supports the substrate from below by gravity.
[0070] A plurality of supporting elements 540 are arranged inside the housing 532 according to a portrait configuration, for example, as shown in Fig. 5 A, and a landscape configuration, for example, as shown in Fig. 5B. The supporting elements 540 may be controllably extendable and retractable relative to the substrate support 536, as best seen in Fig. 5C described herein. Examples of the supporting elements 540 include, but are not limited to, lift pins and posts.
[0071] In the configuration in Fig. 5A corresponding to the portrait format, a first set of supporting elements 541 is extended from the substrate support 536, whereas the remaining supporting elements 543 remain retracted inside the substrate support 536. These supporting elements are actuated so they can be extended or retracted. The extended supporting elements 541 are illustrated as solid black circles, whereas the supporting elements 543 are illustrated as white circles in Fig. 5A.
[0072] In the configuration in Fig. 5B corresponding to the landscape format, a second set of supporting elements 542 is extended from the substrate support 536, whereas the remaining supporting elements 544 remain retracted inside the substrate support 536. The extended supporting elements 542 are illustrated as solid black circles, whereas the supporting elements 544 are illustrated as white circles in Fig. 5A.
[0073] The second set of supporting elements 542 is different from the first set of supporting elements 541 in that at least one supporting element included in the first set of supporting elements 541 is not included in the second set of supporting elements 542, and vice versa. For example, a supporting element 549 is not included in the first set of supporting elements 541 in Fig. 5A, but is included in the second set of supporting elements 542 in Fig. 5B.
[0074] The first set of supporting elements 541 is arranged in a first pattern 561 that corresponds to the orientation of the substrate 471 according to the portrait format. The size and/or shape of the first pattern 561 may vary depending on the size of the substrate 471 , e.g., by additionally extending one or more supporting element 543 from the substrate support 536 to support a larger substrate in an orientation corresponding to the portrait format, or by retracting one or more supporting elements 541 into the substrate support 536 if such one or more supporting elements 541 are not necessary for supporting a smaller substrate in an orientation corresponding to the portrait format. The first pattern 561 corresponds to the portrait format in that a length LI of the first pattern 561 is oriented along a first direction 330, and a width W1 of the first pattern 561 is oriented along a second direction 530 transverse to the first direction 330. The first direction 330 is the direction in which a handler, such as the handler 261 , introduces the substrate 471 into and withdraws the substrate 471 from the housing 532, through the opening 534. The second direction 530 corresponds to the width direction of the opening 534.
[0075] The second set of supporting elements 542 is arranged in a second pattern 562 that corresponds to the configuration of the substrate 472 according to the landscape format. The second pattern 562 is different from the first pattern 561. The size and/or shape of the second pattern 562 may vary depending on the size of the substrate 472, e.g., by additionally extending one or more supporting element 544 from the substrate support 536 to support a larger substrate in an orientation corresponding to the landscape format, or by retracting one or more supporting elements 542 into the substrate support 536 if such one or more supporting elements 542 are not necessary for supporting a smaller substrate in an orientation corresponding to the landscape format. The second pattern 562 corresponds to the landscape format in that a length L2 of the second pattern 562 is oriented along the second direction 530, and a width W2 of the second pattern 562 is oriented along the first direction 330.
[0076] Refer to Fig. 5C, in operation, in response to a control signal, for example, from the controller 350, indicating that the substrate 472 in a landscape orientation is to be handled next by the process chamber, the controller 550 causes the supporting elements 540 to be configured according to landscape format by extending supporting elements 542 from the substrate support 536, while maintaining the supporting elements 544 retracted in the substrate support 536. The extended supporting elements 542 create a space 579 between the top ends of the extended supporting elements 542 and the substrate support 536. The end effector 466 of the handler 261 with the substrate 472 held or supported thereon is introduced in the direction 330 through the opening 534 into the inside of the housing 532. The end effector 466 is inserted into the space 579 and lowered to place the substrate 472 on the top ends of the extended supporting elements 542. The end effector 466 is then withdrawn from the housing 532, and the extended supporting elements 542 with the substrate 472 supported thereon are retracted into the substrate support 536, leaving the substrate 472 on the substrate support 536. Upon completion of post-deposition processing, the supporting elements 542 are extended again to raise the processed substrate 472 from the substrate support 536 and create a space 579 between the processed substrate 472 and the substrate support 536. The end effector 466 is inserted into the space 579, lifts the processed substrate 472 off the top ends of the extended supporting elements 542, and withdraws the processed substrate 472 from the housing 532 in the direction 330.
[0077] A similar operation is performed for handling the substrate 471 in a portrait orientation. Specifically, in response to a further control signal, for example, from the controller 350, indicating that the substrate 471 in a portrait orientation is to be handled next by the process chamber, the controller 550 causes the supporting elements 540 to be configured corresponding to portrait format by extending supporting elements 541 from the substrate support 536, while maintaining the supporting elements 543 retracted in the substrate support 536. The operation then proceeds in a manner similar to that described with respect to Figs. 5B-5C.
[0078] In the embodiments shown in Figs. 5A-5C, supporting elements are extended and retracted to configure supporting elements according to the portrait or landscape format. It should be noted that in alternate embodiments, the supporting elements may be a plurality of posts fixed in an extended configuration and arranged to provide support for substrates of different sizes in different orientations. For example, if the chamber of Figs. 5A-5C feature posts that do not extend and retract, substrates may be placed on the posts in an orientation corresponding to the portrait or landscape format without changing configuration of the supporting elements. It should also be noted that the number of supporting elements shown in Figs. 5A-5C are examples, and any appropriate number of supporting elements for the size and type of substrate being supported may be used in this manner.
[0079] In another embodiment, shown in Fig. 5D, supporting elements can be configured to extend and retract together in a single group pattern to support a substrate in either a portrait or a landscape orientation. A substrate support area 570 is defined by supporting elements 572 that are actuated to extend and retract to process substrates, and the pattern of the actuated supporting elements 572 accommodates a substrate in an orientation corresponding either to the portrait format or to the landscape format. Here, the configuration of the actuated supporting elements 572 has a cross-shape with the first substrate support configuration and the second substrate support configuration, but any shape that will accommodate a substrate in either orientation can be used for this embodiment. [0080] As described herein, by selectively re-orienting a substrate depending on whether print material is to be deposited on the substrate in the portrait format or landscape format, and by providing process chambers with the capability to handling substrates in both a portrait orientation and a landscape orientation, it is possible in some embodiments to avoid having to re-orient a substrate between process chambers. As a result, the printing speed and the productivity increase, compared to other approaches. In at least one embodiment, the deposition and post-deposition processing may be automatically performed, without manual intervention by a human operator, to handle substrates in both a portrait orientation and a landscape orientation.
[0081] Fig. 6 is a flowchart of a printing method 600 in accordance with one embodiment. The printing method 600 may be performed in any of the printing systems 100, 200 by, or under control of, at least one controller as described herein. In the description below, the printing method 600 is performed by, or under control of, the controller 350.
[0082] At operation 605, a substrate is loaded into a printing system. For example, a substrate is loaded through the loading port 208 into the printing system 200 (Fig. 2), as described herein. The following discussion is presented in the context of a substrate loaded into the printing system 200 in a portrait orientation, but a similar process may be followed for a substrate loaded in a landscape orientation.
[0083] At operation 615, a processing format of the substrate is determined. The controller 350 refers to the design data used for print material deposition, or other available data, to determine whether the substrate is to be processed in the printing system in the portrait format or the landscape format. The determination may be made based on a preferred arrangement of printed features on the substrate. Other data, such as processing signals and design data, may also be used by the controller 350 to determine format.
[0084] When it is determined that the processing orientation corresponds to the portrait format, which is to say that the substrate is to be processed in a portrait orientation, the method proceeds to operation 625. Because the substrate was received and loaded into the printing system in a portrait orientation, the substrate is not re-oriented by rotating the substrate to a different orientation. The substrate is sequentially conveyed along a conveyance path in the printing system to a plurality of process chambers for deposition and post-deposition processing of the print material on the substrate. In each of the process chambers, the substrate is supported by a set of supporting elements, which may be movable, arranged in a first configuration corresponding to the portrait format. For example, as described with respect to Figs. 4A-4B, the substrate 471 is processed, without being re-oriented by the input rotation chamber 210, in a plurality of process chambers such as printing chambers, drying chambers, buffer chambers, and curing chambers. In each of the process chambers, such as drying chambers, buffer chambers, and curing chambers, the substrate 471 is supported by a first set of supporting elements 541 arranged in a first configuration 561 corresponding to the portrait format, as described with respect to Fig. 5 A.
[0085] At operation 665, the substrate 471 having been processed at operation 625 is unloaded from the printing system 200, for example, through the unloading port 214. Because the substrate was loaded into the printing system in a portrait orientation, and was not rotated for any processing, the substrate is unloaded in a portrait orientation.
[0086] When it is determined that the processing orientation corresponds to the landscape format, the method proceeds from operation 615 to operation 635. At operation 635, the substrate is re-oriented from the portrait orientation in which it was received to a landscape orientation. For example, the substrate 472 is rotated in the input rotation chamber 210 from a first orientation (at 472A) associated with the portrait format to a second orientation (at 472D) associated with the landscape format, as described with respect to Figs. 4C-4D.
[0087] At operation 645, the substrate is sequentially conveyed along the conveyance path in the printing system to be processed by the process chambers in the printing system 200. In each of the process chambers, the substrate is supported by a second set of supporting elements, which may be movable, arranged in a second configuration corresponding to the landscape format. For example, as described with respect to Figs. 4C-4D, the substrate 472 is processed, in a re-oriented landscape orientation, in a plurality of process chambers such as printing chambers, drying chambers, buffer chambers, and curing chambers. In each of the process chambers, such as drying chambers, buffer chambers, and curing chambers, the substrate 472 is supported by a second set of supporting elements 542 arranged in a second configuration 562 corresponding to the landscape format, as described with respect to Figs. 5B-5C.
[0088] At operation 655, the substrate 472 having been processed at operation 645 is optionally rotated from a landscape orientation to a portrait orientation, for example, at the output rotation chamber 212 before unloading the substrate 472 in the portrait orientation at operation 665. In at least one embodiment, the operation 645 is omitted and the substrate 472 is unloaded at operation 665 in the landscape orientation. [0089] In one or more embodiments, regardless of whether the print material is to be deposited on a substrate in the portrait format or the landscape format, the substrate is processed in the process chambers and moved between the process chambers without being re-oriented or rotated between the first orientation associated with the portrait format and the second orientation associated with the landscape format. This arrangement, as noted herein, reduces the printing time and increases productivity.
[0090] In one embodiment, printed products manufactured by the described printing method include, but are not limited to, solar panels, and flat panel displays such as organic light emitting diode (OLED) displays.
[0091] The described methods include example operations, but they are not necessarily required to be performed in the order shown. Operations may be added, replaced, changed order, and/or eliminated as appropriate, in accordance with the spirit and scope of embodiments of the disclosure. Embodiments that combine different features and/or different embodiments are within the scope of the disclosure and will be apparent to those of ordinary skill in the art after reviewing this disclosure.
[0092] Fig. 7 is a block diagram of a controller, in accordance with one embodiment. One or more of the units and/or systems and/or operations described with respect to Figs. 1-6 is/are realized in one embodiment by one or more controllers 700 of Fig. 7.
[0093] The controller 700 comprises a hardware processor 702, a storage device 704 including at least one non-transitory, computer readable storage medium, a bus 708, an I/O (input/output) interface 710, and a network interface 712. The processor 702 is coupled with the storage device 704, the I/O interface 710, and the network interface 712 via the bus 708. The network interface 712 is connectable to a network 714, so that the processor 702 and the storage device 704 are communicable with other devices via the network 714. The processor 702 is configured to execute computer program instructions encoded in the storage device 704 and/or to access data stored in the storage device 704 to cause the controller 700 to perform one or more functionalities and/or operations described with respect to Figs. 1A-6. [0094] The processor 702 includes one or more of a central processing unit (CPU), a multi-processor, a distributed processing system, an application specific integrated circuit (ASIC), and/or a suitable hardware processing unit.
[0095] The storage device 704 includes one or more of an electronic, magnetic, optical, electromagnetic, infrared, and/or a semiconductor system (or apparatus or device) for storing instructions and/or data in a non-transitory manner. For example, the storage device 704 includes a semiconductor or solid-state memory, a magnetic tape, a removable computer diskette, a random access memory (RAM), a read-only memory (ROM), a rigid magnetic disk, and/or an optical disk. As examples of optical disks, storage device 704 includes a compact disk-read only memory (CD-ROM), a compact disk-read/write (CD-R/W), and/or a digital video disc (DVD).
[0096] The I/O interface 710 is circuitry that is connectable with external circuitry. For example, the I/O interface 710 includes one or more of a keyboard, keypad, mouse, trackball, trackpad, cursor direction keys, card reader, communication port, display, signal light, printer and/or audio device for communicating information to/from the processor 702. In an example, the I/O interface 710 is omitted.
[0097] The network interface 712 is circuitry that allows the controller 700 to communicate with the network 714, to which one or more other controllers and/or image capturing/processing equipment are connected. For example, the network interface 712 includes one or more of wireless network interfaces such as BLUETOOTH, WIFI, WIMAX, GPRS, or WCDMA; or wired network interface such as ETHERNET, USB, or IEEE-1394. In an example, the network interface 712 is omitted.
[0098] By being configured to execute some or all of functionalities and/or operations described with respect to Figs. 1A-6, the controller 700 enables the realization of one or more advantages and/or effects described with respect to Figs. 1A-6.
[0099] The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims

1. A printing system, comprising:
a plurality of process chambers arranged along a conveyance path for deposition and post-deposition processing of print material on a substrate, each of the plurality of process chambers having a substrate support with a configuration associated with a first format and a second format;
an input rotation chamber arranged upstream of the plurality of process chambers for selectively rotating the substrate from a first orientation associated with the first format to a second orientation associated with the second format; and
an output rotation chamber arranged downstream of the plurality of process chambers for selectively rotating the substrate, with processed print material thereon, from a third orientation associated with the second format to a fourth orientation associated with the first format,
wherein
the first format is one of a portrait format, having a length in a first direction and a width in a second direction, and a landscape format having the width in the first direction and the length in the second direction, and
the second format is the other of the portrait format and the landscape format.
2. The printing system of claim 1, wherein
each of the plurality of process chambers includes one selected from the group consisting of a printing chamber, a drying chamber, a curing chamber, a thermal chamber, and a buffer chamber.
3. The printing system of claim 1, further comprising:
a plurality of handlers arranged along the conveyance path among the plurality of process chambers,
wherein at least one handler of the plurality of handlers is configured to
receive the substrate,
place the received substrate into at least one process chamber among the plurality of process chambers to be processed by the at least one process chamber,
withdraw the processed substrate from the at least one process chamber, and transfer the withdrawn substrate to a further handler among the plurality of handlers.
4. The printing system of claim 3, wherein
each of the plurality of handlers includes at least one of a robot or a conveyor.
5. The printing system of claim 3, wherein
said at least one handler is configured to perform
a first rotational movement between receipt of the substrate and placement of the received substrate in the at least one process chamber, and
a second rotational movement between withdrawal of the processed substrate from the at least one process chamber and transfer of the withdrawn substrate, and
an orientation of the substrate at the receipt of the substrate by the handler is associated with the same format as at the transfer of the substrate to the further handler, without being changed by the first and second rotational movements of the handler.
6. The printing system of claim 3, wherein
the first direction corresponding to the length of the portrait format and the width of the landscape format is a direction in which said at least one handler is configured to place the substrate into and withdraw the substrate from the at least one process chamber, and
the second direction corresponding to the width of the portrait format and the length of the landscape format is transverse to the first direction.
7. The printing system of claim 1, wherein
the first direction corresponding to the length of the portrait format and the width of the landscape format is a direction in which the printing system is configured to move the substrate along the conveyance path, and
the second direction corresponding to the width of the portrait format and the length of the landscape format is transverse to the first direction.
8. The printing system of claim 1, wherein
each of the plurality of process chambers includes
a housing; and processing equipment arranged inside or outside the housing for performing deposition or post-deposition processing on the substrate,
wherein the substrate support comprises a plurality of supporting elements arranged inside the housing according to the first format and the second format and controllably extendable and retractable relative to the substrate support.
9. The printing system of claim 8, wherein
in each of the plurality of process chambers,
a first set of supporting elements among the plurality of supporting elements is extendable from the substrate support in accordance with the first format, which is a portrait format, and
a second set of supporting elements among the plurality of supporting elements is extendable from the substrate support in accordance with the second format, which is a landscape format, the second set being different from the first set.
10. The printing system of claim 8, wherein
the plurality of supporting elements include lift pins.
11. The printing system of claim 1, wherein the plurality of processing chambers includes at least one deposition chamber and at least one post-processing chamber.
12. A process chamber in a printing system, the process chamber comprising: a housing;
a substrate support in the housing for supporting thereon a substrate;
processing equipment arranged inside or outside the housing for performing post deposition processing on the substrate having print material deposited thereon; and
a plurality of supporting elements arranged inside the housing according to a portrait format and a landscape format,
the portrait format having a length in a first direction and a width in a second direction, and the landscape format having the length in the second direction and the width in the first direction.
13. The process chamber of claim 12, further comprising: a controller configured to
cause a first set of supporting elements among the plurality of supporting elements to extend from the substrate support in accordance with a first input signal indicating that the substrate is to be processed in the landscape format, and
cause a second set of supporting elements among the plurality of supporting elements to extend from the substrate support in accordance with a second input signal indicating that the substrate is to be processed in the format , the second set being different from the first set.
14. The process chamber of claim 12, wherein
the plurality of supporting elements include lift pins.
15. The process chamber of claim 12, wherein
at least a portion of the supporting elements are controllably extendable and retractable relative to the substrate support
16. The process chamber of claim 12, further comprising:
an opening through which a handler is configured to introduce the substrate into and withdraw the substrate from an interior of the housing in the first direction,
wherein the second direction corresponds to a widthwise direction of the opening.
17. The process chamber of claim 12, wherein
the process chamber is one selected from the group consisting of a drying chamber, a curing chamber, and a buffer chamber.
18. A printing method, comprising:
determining whether print material is to be deposited on a substrate in a portrait format, in which a length of the substrate is oriented along a first direction, or in a landscape format, in which a width of the substrate is oriented along the first direction;
in response to a determination that the print material is to be deposited on the substrate in the portrait format, sequentially conveying the substrate along a conveyance path to a plurality of process chambers for deposition and post-deposition processing of the print material on the substrate, without rotating the substrate from a first orientation associated with the portrait format to a second orientation associated with the landscape format,
wherein, in each of the process chambers, the substrate is supported by a first set of movable supporting elements arranged in a first configuration corresponding to the first orientation; and
in response to a determination that the print material is to be deposited on the substrate in the landscape format,
rotating the substrate from the first orientation associated with the portrait format to the second orientation associated with the landscape format, and then
sequentially conveying the substrate along the conveyance path to the plurality of process chambers for deposition and post-deposition processing of the print material on the substrate,
wherein, in each of the process chambers, the substrate is supported by a second set of movable supporting elements arranged in a second
configuration corresponding to the second orientation.
19. The printing method of claim 18, further comprising:
when the print material is to be deposited on the substrate in the landscape format, rotating the substrate from the second orientation to the first orientation after passing through the process chambers, and
unloading the substrate in the first orientation.
20. The printing method of claim 18, further comprising:
when the print material is to be deposited on the substrate in the landscape format, unloading the substrate in the second orientation after passing through the process chambers.
21. The printing method of claim 18, wherein
regardless of whether the print material is to be deposited on the substrate in the portrait format or the landscape format, the substrate is processed in the process chambers and moved between the process chambers without being rotated between the first orientation and the second orientation.
22. The printing method of claim 18, wherein
each of the plurality of process chambers includes one selected from the group consisting of a printing chamber, a drying chamber, a curing chamber, and a buffer chamber.
PCT/US2020/017433 2019-02-11 2020-02-10 Printing system, process chamber and printing method for handling substrates in different orientations WO2020167630A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962804135P 2019-02-11 2019-02-11
US62/804,135 2019-02-11

Publications (1)

Publication Number Publication Date
WO2020167630A1 true WO2020167630A1 (en) 2020-08-20

Family

ID=72044785

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2020/017433 WO2020167630A1 (en) 2019-02-11 2020-02-10 Printing system, process chamber and printing method for handling substrates in different orientations

Country Status (1)

Country Link
WO (1) WO2020167630A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011007616A1 (en) * 2009-07-13 2011-01-20 シャープ株式会社 Support device and drying device provided with said support device
US20110150608A1 (en) * 2004-03-24 2011-06-23 Jusung Engineering Co., Ltd. Apparatus for transferring a substrate
US8104752B2 (en) * 2006-03-20 2012-01-31 Boaz Eidelberg Integrated large XY rotary positioning table with virtual center of rotation
WO2012141082A1 (en) * 2011-04-13 2012-10-18 シャープ株式会社 Substrate support device, and drying device
WO2012147600A1 (en) * 2011-04-26 2012-11-01 シャープ株式会社 Substrate holding device
US20170301580A1 (en) * 2014-02-27 2017-10-19 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US20190025469A1 (en) * 2017-07-19 2019-01-24 Intevac, Inc. System for forming nano-laminate optical coating

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110150608A1 (en) * 2004-03-24 2011-06-23 Jusung Engineering Co., Ltd. Apparatus for transferring a substrate
US8104752B2 (en) * 2006-03-20 2012-01-31 Boaz Eidelberg Integrated large XY rotary positioning table with virtual center of rotation
WO2011007616A1 (en) * 2009-07-13 2011-01-20 シャープ株式会社 Support device and drying device provided with said support device
WO2012141082A1 (en) * 2011-04-13 2012-10-18 シャープ株式会社 Substrate support device, and drying device
WO2012147600A1 (en) * 2011-04-26 2012-11-01 シャープ株式会社 Substrate holding device
US20170301580A1 (en) * 2014-02-27 2017-10-19 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US20190025469A1 (en) * 2017-07-19 2019-01-24 Intevac, Inc. System for forming nano-laminate optical coating

Similar Documents

Publication Publication Date Title
KR101268261B1 (en) Substrate buffer device, method of buffering substrate, substrate processing apraratus and computer readable storage medium
KR101188077B1 (en) Substrate processing apparatus
CN102637618B (en) Annealing device and heat treatment method
JP3445757B2 (en) Substrate processing apparatus and substrate processing method
JP4969138B2 (en) Substrate processing equipment
KR20160108142A (en) Door opening and closing apparatus
JP6559087B2 (en) Substrate processing equipment
JP2005223119A (en) Apparatus and method for forming coating film
US11251411B2 (en) Systems and methods for supporting and conveying a substrate
US11731435B2 (en) Printer, method of operating printer, and substrate handling mechanism
JP6681565B2 (en) Prober
JP2009018917A (en) Application device, substrate delivery method and application method
US8692208B2 (en) Ion supply device and workpiece processing system provided with the same
JP4274601B2 (en) Substrate transfer device and operation method thereof
JP2022177010A (en) Conveying unit
JP2012023341A (en) Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program
JP2024023874A (en) Substrate processing equipment and substrate storage container storage method
WO2020167630A1 (en) Printing system, process chamber and printing method for handling substrates in different orientations
JP2004221610A (en) Semiconductor processing apparatus
WO2021060259A1 (en) Transport system
JP2023085369A (en) prober
KR100715350B1 (en) A banking device of semiconductor wafers
KR20120028423A (en) Apparatus for transferring panel and method for transferring

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20756344

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20756344

Country of ref document: EP

Kind code of ref document: A1