WO2020156137A1 - 耳机结构及终端 - Google Patents

耳机结构及终端 Download PDF

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Publication number
WO2020156137A1
WO2020156137A1 PCT/CN2020/071921 CN2020071921W WO2020156137A1 WO 2020156137 A1 WO2020156137 A1 WO 2020156137A1 CN 2020071921 W CN2020071921 W CN 2020071921W WO 2020156137 A1 WO2020156137 A1 WO 2020156137A1
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Prior art keywords
earphone
sound
cavity
moving coil
coil unit
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PCT/CN2020/071921
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English (en)
French (fr)
Inventor
连红涛
冯海彬
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维沃移动通信有限公司
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Publication of WO2020156137A1 publication Critical patent/WO2020156137A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/105—Manufacture of mono- or stereophonic headphone components

Definitions

  • the present disclosure relates to the field of communication technology, and in particular to a headset structure and a terminal.
  • the side-sound earphone usually includes a supporting part, a housing and a speaker unit.
  • the speaker unit is arranged in the housing, and the speaker unit divides the inner cavity of the housing into a front cavity and a rear cavity.
  • the front cavity is close to the diaphragm of the speaker unit, and the sound is output from the front cavity side.
  • the high-frequency sound performance may be greatly attenuated, and the high fidelity of the sound cannot be guaranteed.
  • the embodiments of the present disclosure provide a headset structure and a terminal.
  • the embodiments of the present disclosure provide an earphone structure, which is applied to a side-out earphone, including:
  • the moving coil unit, the MEMS unit of the micro-electro-mechanical system and the sound cavity structure arranged in the accommodation space formed by the earphone back cover and the earphone front cover;
  • the sound cavity structure is provided with: a first sound cavity and a second sound cavity that are arranged in isolation, a moving coil unit radiation port is provided on the first cavity wall of the first sound cavity, and a second cavity wall of the second sound cavity
  • a MEMS unit radiation port, a moving coil unit radiation port and a MEMS unit radiation port are provided for sound wave signal output.
  • the embodiments of the present disclosure also provide a terminal, including the aforementioned headset structure.
  • the technical effect of the implementation of the present disclosure is that the moving coil unit and the MEMS unit respectively correspond to their independent sound cavities, so that the sound waves generated by the moving coil unit are not affected by the sound waves generated by the MEMS unit, and the sound waves generated by the MEMS unit are not generated by the moving coil unit.
  • the influence of sound waves can reduce the generation of sound waves and the influence of harmonic distortion, effectively improving the high-fidelity sound quality of headphones.
  • Figure 1 shows an exploded view of the earphone structure of an embodiment of the present disclosure
  • FIG. 2 shows a schematic diagram of an assembly structure of a MEMS structure in the earphone structure of an embodiment of the present disclosure
  • FIG. 3 shows a schematic diagram of the assembly structure of the sound cavity structure and the earphone front cover in the earphone structure of the embodiment of the present disclosure
  • FIG. 4 shows a structural schematic diagram 1 of the sound cavity structure in the earphone structure of the embodiment of the present disclosure
  • FIG. 5 shows the second structural diagram of the sound cavity structure in the earphone structure of the embodiment of the present disclosure.
  • Earphone back cover 2. Earphone front cover, 3. Moving coil unit, 4. MEMS unit, 5. Sound cavity structure;
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the present disclosure, “plurality” means at least two, such as two, three, etc., unless otherwise specifically defined.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , Or integrated; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction between two components.
  • installed may be a fixed connection or a detachable connection , Or integrated; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction between two components.
  • the "on” or “under” of the first feature of the second feature may include the first and second features in direct contact, or may include the first and second features Not in direct contact but through other features between them.
  • “above”, “above” and “above” the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or it simply means that the level of the first feature is higher than the second feature.
  • the “below”, “below” and “below” the first feature of the second feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the embodiments of the present disclosure provide an earphone structure and a terminal to solve the problem of poor high-frequency sound performance of side-out earphones in the related art and cannot guarantee high sound fidelity.
  • the embodiment of the present disclosure provides an earphone structure, which is applied to side-out earphones.
  • the earphone structure includes: an earphone back cover 1 and an earphone front cover 2 that are fastened to each other, and are arranged behind the earphone
  • the moving coil unit 3 the Micro-Electro-Mechanical System (MEMS) unit 4 and the sound cavity structure 5 in the accommodating space formed by the cover 1 and the earphone front cover 2.
  • MEMS Micro-Electro-Mechanical System
  • the sound cavity structure 5 is provided with a first sound cavity and a second sound cavity 51 arranged in isolation, wherein the first sound cavity corresponds to the moving coil unit 3, the second sound cavity corresponds to the MEMS unit 4, and the first sound cavity
  • the first cavity wall of the cavity is provided with a moving coil unit radiation port 52.
  • the second cavity wall of the second sound cavity 51 is provided with a MEMS unit radiation port 53, the moving coil unit radiation port 52 and the MEMS unit.
  • the radiation port 53 is used for acoustic signal output, corresponding to the acoustic radiation channels of the moving coil unit 3 and the MEMS unit 4, and as shown in FIG. 5, the moving coil unit radiation port 52 and the MEMS unit radiation port 53 are completely separated. In this way, the moving coil unit 3 and the MEMS unit 4 are completely independent from the sound source and radiated from the cavity through the sound wave to the radiation port, and will not interfere with each other.
  • the moving coil unit 3 is a sound generating device that can convert electrical signals into sound wave signals.
  • the moving coil unit 3 is mainly used for sound wave radiation in the middle and low frequency parts.
  • the moving coil unit 3 can generate a first sound wave signal through the first sound cavity, and the first sound wave signal is output through the moving coil unit radiation port 52 on the first cavity wall of the first sound cavity.
  • the MEMS unit 4 is also a sounding device, which can convert electrical signals into sound wave signals.
  • the MEMS unit 4 is small in size and can be placed in a semi-in-ear earphone. It has excellent mid-to-high frequency performance and is mainly responsible for the mid-to-high frequency sound wave radiation.
  • the MEMS unit 4 can generate a second sound wave signal through the second sound cavity, and the second sound wave signal is output through the MEMS unit radiation port 53 on the second cavity wall of the second sound cavity.
  • the moving coil unit 3 and the MEMS unit 4 are integrated in the accommodating space formed by the earphone back cover 1 and the earphone front cover 2, and the moving coil unit 3 and the MEMS unit 4 are respectively provided with corresponding independent sound
  • the sound waves generated by the moving coil unit 3 through the first sound cavity are directly output through the moving coil unit radiation port 52
  • the sound waves generated by the MEMS unit 4 through the second sound cavity are directly output through the MEMS unit radiation port 53, and each is not affected by the other side. That is, the sound waves generated by the moving coil unit 3 are not affected by the sound waves generated by the MEMS unit 4, and the sound waves generated by the MEMS unit 4 are not affected by the sound waves generated by the moving coil unit 3.
  • This can reduce the generation of standing waves and reduce The influence of harmonic distortion effectively enhances the high-fidelity sound quality of headphones.
  • the moving coil unit 3 is provided with a first diaphragm, and the first cavity wall is in sealed connection with the edge of the first diaphragm.
  • the first diaphragm is used to generate medium and low frequency sound wave signals, which are radiated and oscillated in the first sound cavity for sound amplification, and are output through the moving coil unit radiation port 52 on the first cavity wall.
  • sealant can be applied to the edge of the first cavity wall and the first diaphragm to achieve a sealed connection between the two.
  • the MEMS unit 4 is provided with a second diaphragm, and the second cavity wall is hermetically connected to the edge of the second diaphragm.
  • the second diaphragm is used to generate medium and high frequency sound wave signals, which are radiated and oscillated in the second sound cavity for sound amplification, and are output through the MEMS unit radiation port 53 on the second cavity wall.
  • sealant can be applied to the edge of the second cavity wall and the second diaphragm to achieve the seal between the two connection.
  • the embodiment of the present disclosure may integrate the moving coil unit 3 and the MEMS unit 4 in the earphone front cover 2.
  • the moving coil unit 3 is fixed in the earphone front cover 2 through the first mounting bracket.
  • the MEMS unit 4 is fixed in the earphone front cover 2 through a second mounting bracket.
  • the sound cavity structure 5 equipped with the MEMS unit 4 is assembled into the earphone front cover 2.
  • the earphone back cover 1 and the earphone front cover 2 are glued together, thereby completing the overall assembly of the earphone.
  • the earphone front cover 2 is provided with a sound hole 21.
  • the earphone front cover 2 is provided with a first sound hole corresponding to the radiation port 52 of the moving coil unit, and a first sound hole corresponding to the MEMS The second sound hole corresponding to the unit radiation port 53.
  • the sound outlet 21 is covered with a mesh cloth to adjust the sound radiation effect and to block dust in the external environment from entering the sound cavity.
  • a sound tube 11 for transmitting audio signals is provided on the back cover 1 of the earphone.
  • the sound tube 11 can be connected to the AUX interface or charging interface of the terminal through a transmission line, or a wireless module can be provided in the sound tube 11 to connect to the terminal, for example, a wireless communication module such as a Bluetooth module or a WIFI module can be provided in the sound tube 11.
  • a pressure relief hole is provided on the earphone back cover 1, and the pressure relief hole includes a first pressure relief hole for communicating the first sound cavity with the external environment, and is used to balance the sound pressure of the first sound cavity and the external environment.
  • the pressure relief hole also includes a second pressure relief hole for communicating the second sound cavity with the external environment, which is used to balance the sound pressure of the second sound cavity and the external environment, and further ensure high sound fidelity.
  • the sound cavity structure 5 is integrated inside the earphone front cover 2, and the first sound cavity of the moving coil unit 3, the radiation port 52 of the moving coil unit, and the second sound of the MEMS unit 4 are designed on the sound cavity structure 5.
  • the cavity 51 and the MEMS unit radiation port 53 can completely separate the sound from the source and the path through the cavity when the moving coil unit 3 and the MEMS unit 4 work, and will not interfere with each other.
  • the MEMS unit 4 has an independent MEMS unit radiation port 53.
  • the sound waves of the MEMS unit 4 can directly propagate to the human ear canal through the MEMS unit radiation port 53 without being affected by the sound cavity and radiation port of the moving coil unit, which improves the sound wave performance.
  • the middle and high frequency radiation response broadens the effective frequency response range of the headset, thereby enhancing the high-fidelity sound quality of the headset.
  • the embodiments of the present disclosure also provide a side-output earphone, including the above-mentioned earphone structure.
  • the side-out earphone of the embodiment of the present disclosure can be used as an in-ear type and a semi-in-ear type.
  • the earphone structure of the embodiment can be applied to a side-tone semi-in-ear earphone.
  • the embodiments of the above-mentioned earphone structure are all applicable to the side-out earphone.
  • the embodiment of the side-out earphone can realize the technical effects of the above-mentioned earphone structure.
  • the embodiments of the present disclosure also provide a terminal, including the above-mentioned earphone structure.
  • the embodiments of the above-mentioned earphone structure are applicable to the terminal and can also achieve the technical effects of the above-mentioned earphone structure.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Headphones And Earphones (AREA)

Abstract

本公开公开了一种耳机结构及终端，包括：相互扣合的耳机后盖和耳机前盖；设置于耳机后盖与耳机前盖所形成的容置空间内的动圈单元、MEMS单元和音腔结构；其中，音腔结构上设置有：隔绝设置的第一音腔和第二音腔，第一音腔的第一腔壁上设置有动圈单元辐射口，第二音腔的第二腔壁上设置有MEMS单元辐射口，动圈单元辐射口和MEMS单元辐射口用于声波信号输出。

Description

耳机结构及终端
相关申请的交叉引用
本申请主张在2019年1月28日在中国提交的中国专利申请No.201910080322.4的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种耳机结构及终端。
背景技术
相关技术中，侧出音式耳机通常包括支撑部、壳体和扬声器单体。扬声器单体被设置在壳体内，扬声器单体将壳体的内腔分隔为前腔和后腔。其中，靠近扬声器单体的振膜的是前腔，声音从前腔侧输出，但是由于前腔侧壁的影响，可能导致高频声音性能受到较大衰减，无法保证声音的高保真。
发明内容
本公开实施例提供了一种耳机结构及终端。
第一方面，本公开实施例提供了一种耳机结构，应用于侧出音式耳机，包括：
相互扣合的耳机后盖和耳机前盖；
设置于耳机后盖与耳机前盖所形成的容置空间内的动圈单元、微机电系统MEMS单元和音腔结构；
其中，音腔结构上设置有：隔绝设置的第一音腔和第二音腔，第一音腔的第一腔壁上设置有动圈单元辐射口，第二音腔的第二腔壁上设置有MEMS单元辐射口，动圈单元辐射口和MEMS单元辐射口用于声波信号输出。
第二方面，本公开实施例还提供了一种终端，包括上述的耳机结构。
本公开实施的技术效果是：动圈单元和MEMS单元分别对应于各自独立的音腔，这样动圈单元产生的声波不受MEMS单元产生的声波影响，MEMS单元产生的声波不受动圈单元产生的声波的影响，可降低声波驻波的产生以 及降低谐波失真的影响，有效提升耳机的高保真音质效果。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1表示本公开实施例的耳机结构的爆炸图；
图2表示本公开实施例的耳机结构中MEMS结构的组装结构示意图；
图3表示本公开实施例的耳机结构中音腔结构与耳机前盖的组装结构示意图；
图4表示本公开实施例的耳机结构中音腔结构的结构示意图一；
图5表示本公开实施例的耳机结构中音腔结构的结构示意图二。
其中，图中：
1、耳机后盖，2、耳机前盖，3、动圈单元，4、MEMS单元，5、音腔结构；
11、音管；
21、出音孔；
51、第二音腔，52、动圈单元辐射口，53、MEMS单元辐射口。
具体实施方式
下面将参照附图更详细地描述本公开的示例性实施例。虽然附图中显示了本公开的示例性实施例，然而应当理解，可以以各种形式实现本公开而不应被这里阐述的实施例所限制。相反，提供这些实施例是为了能够更透彻地理解本公开，并且能够将本公开的范围完整的传达给本领域的技术人员。
在本公开的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、 “水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本公开中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或可以互相通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本公开中的具体含义。
在本公开中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本公开的不同结构。为了简化本公开的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本公开。此外，本公开可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本公开提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本公开实施例提供了一种耳机结构及终端，以解决相关技术中侧出音式 耳机高频声音性能差，无法保证声音高保真的问题。
以下结合附图对本公开的可选的实施例进行说明，应当理解，此处所描述的可选的实施例仅用于说明和解释本公开，并不用于限定本公开。
本公开实施例提供了一种耳机结构，应用于侧出音式耳机，如图1至5所示，该耳机结构包括：相互扣合的耳机后盖1和耳机前盖2，设置于耳机后盖1与耳机前盖2所形成的容置空间内的动圈单元3、微机电系统(Micro-Electro-Mechanical System，MEMS)单元4和音腔结构5。其中，音腔结构5上设置有：隔绝设置的第一音腔和第二音腔51，其中，第一音腔对应于动圈单元3，第二音腔对应于MEMS单元4，第一音腔的第一腔壁上设置有动圈单元辐射口52，如图4所示，第二音腔51的第二腔壁上设置有MEMS单元辐射口53，动圈单元辐射口52和MEMS单元辐射口53用于声波信号输出，分别对应动圈单元3与MEMS单元4的声波辐射通道，且如图5所示，动圈单元辐射口52和MEMS单元辐射口53是完全隔开的。这样将动圈单元3与MEMS单元4从声源开始、经过声波在腔体中辐射到辐射口均是完全独立的，不会相互干扰。
其中，动圈单元3为发声装置，可以将电信号转换为声波信号，另外动圈单元3主要用于中低频部分的声波辐射。动圈单元3可通过第一音腔产生第一声波信号，第一声波信号通过第一音腔的第一腔壁上的动圈单元辐射口52输出。
MEMS单元4亦为发声装置，可以将电信号转换为声波信号，另外MEMS单元4体积小，可置于半入耳式耳机中，且具有优秀的中高频性能，主要负责中高频部分的声波辐射。MEMS单元4可通过第二音腔产生第二声波信号，第二声波信号通过第二音腔的第二腔壁上的MEMS单元辐射口53输出。
本公开实施例中，将动圈单元3和MEMS单元4集成在耳机后盖1和耳机前盖2形成的容置空间内，且为动圈单元3和MEMS单元4分别设置各自对应的独立音腔，这样动圈单元3通过第一音腔产生的声波直接通过动圈单元辐射口52输出，MEMS单元4通过第二音腔产生的声波直接通过MEMS单元辐射口53输出，各自不受另一方的影响，即动 圈单元3产生的声波不受MEMS单元4产生的声波影响，MEMS单元4产生的声波不受动圈单元3产生的声波的影响，这样可降低声波驻波的产生，以及降低谐波失真的影响，有效提升耳机的高保真音质效果。
可选地，动圈单元3设置有第一振膜，第一腔壁与第一振膜的边缘密封连接。其中，第一振膜用于产生中低频声波信号，该中低频声波信号在第一音腔中辐射震荡进行扩音，并通过第一腔壁上的动圈单元辐射口52输出。为了确保第一音腔的密闭性，在动圈单元3与音腔结构5装配时，可以在第一腔壁与第一振膜的边缘点密封胶，实现两者的密封连接。
可选地，MEMS单元4设置有第二振膜，第二腔壁与第二振膜的边缘密封连接。其中，第二振膜用于产生中高频声波信号，该中高频声波信号在第二音腔中辐射震荡进行扩音，并通过第二腔壁上的MEMS单元辐射口53输出。如图2所示，为了确保第二音腔的密闭性，在MESM单元4与音腔结构5装配时，可以在第二腔壁与第二振膜的边缘点密封胶，实现两者的密封连接。
可选地，本公开实施例可将动圈单元3和MEMS单元4集成在耳机前盖2内，具体地，动圈单元3通过第一安装支架固定于耳机前盖2内。MEMS单元4通过第二安装支架固定于耳机前盖2内。具体地，如图3所示，将已装配了MEMS单元4的音腔结构5组装到耳机前盖2的内部。进一步地，动圈单元3组装在耳机前盖2上后，耳机后盖1再与耳机前盖2进行点胶组合，从而完成耳机整体的组装。
可选地，如图1所示，耳机前盖2上设置有出音孔21，具体地，耳机前盖2上设置有与动圈单元辐射口52对应的第一出音孔，以及与MEMS单元辐射口53对应的第二出音孔。其中，出音孔21处覆盖有网布，以调节声音辐射的效果，且能够隔档外界环境中的灰尘进入音腔。
进一步地，耳机后盖1上设置有用于传输音频信号的音管11。其中该音管11可通过传输线与终端的AUX接口或充电接口连接，或者，该音管11内可设置无线模块与终端连接，如在音管11内设置蓝牙模块或WIFI模块等无线通信模块。
可选地，耳机后盖1上设置有泄压孔，该泄压孔包括用于连通第一音腔 与外界环境的第一泄压孔，用于平衡第一音腔与外界环境的声压，泄压孔还包括用于连通第二音腔与外界环境的第二泄压孔，用于平衡第二音腔与外界环境的声压，进一步保证声音高保真。
本公开实施例，通过在耳机前盖2内部集成音腔结构5，并在音腔结构5上设计动圈单元3的第一音腔、动圈单元辐射口52、MEMS单元4的第二音腔51和MEMS单元辐射口53，从而可以将动圈单元3与MEMS单元4工作时的声音从源头、及通过腔体的路径完全隔开，不会相互干扰。MEMS单元4有独立的MEMS单元辐射口53，MEMS单元4的声波可以直接经过MEMS单元辐射口53传播到人耳耳道，不受动圈单元的音腔和辐射口的影响，提高了声波的中高频辐射响应，拓宽了耳机的有效频响范围，从而提升耳机的高保真音质效果。
本公开实施例还提供了一种侧出音式耳机，包括上述的耳机结构，其中，本公开实施例的侧出音式耳机可作为入耳式和半入耳式，为提升佩戴舒适度，本公开实施例的耳机结构可应用于侧出音半入耳式耳机，上述耳机结构的实施例均适用于该侧出音式耳机，该侧出音式耳机的实施例可实现上述耳机结构的技术效果。
另外，本公开实施例还提供了一种终端，包括上述的耳机结构，上述耳机结构的实施例适用于该终端，亦可实现上述耳机结构的技术效果。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。尽管已描述了本公开实施例的可选的实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以所附权利要求意欲解释为包括可选的实施例以及落入本公开实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者终端设备不仅 包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者终端设备中还存在另外的相同要素。
以上所述的是本公开的可选的实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (10)

  1. 一种耳机结构，应用于侧出音式耳机，包括：
    相互扣合的耳机后盖和耳机前盖；
    设置于所述耳机后盖与所述耳机前盖所形成的容置空间内的动圈单元、微机电系统MEMS单元和音腔结构；
    其中，所述音腔结构上设置有：隔绝设置的第一音腔和第二音腔，所述第一音腔的第一腔壁上设置有动圈单元辐射口，所述第二音腔的第二腔壁上设置有MEMS单元辐射口，所述动圈单元辐射口和所述MEMS单元辐射口用于声波信号输出。
  2. 根据权利要求1所述的耳机结构，其中，所述动圈单元设置有第一振膜，所述第一腔壁与所述第一振膜的边缘密封连接。
  3. 根据权利要求1所述的耳机结构，其中，所述MEMS单元设置有第二振膜，所述第二腔壁与所述第二振膜的边缘密封连接。
  4. 根据权利要求1所述的耳机结构，其中，所述动圈单元通过第一安装支架固定于所述耳机前盖内。
  5. 根据权利要求1所述的耳机结构，其中，所述MEMS单元通过第二安装支架固定于所述耳机前盖内。
  6. 根据权利要求1所述的耳机结构，其中，所述耳机前盖上设置有与所述动圈单元辐射口对应的第一出音孔，以及与所述MEMS单元辐射口对应的第二出音孔。
  7. 根据权利要求6所述的耳机结构，其中，所述出音孔处覆盖有网布。
  8. 根据权利要求1所述的耳机结构，其中，所述耳机后盖上设置有用于传输音频信号的音管。
  9. 根据权利要求1所述的耳机结构，其中，所述耳机后盖上设置有泄压孔。
  10. 一种终端，包括如权利要求1至9任一项所述的耳机结构。
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