WO2020154949A1 - 触控装置、电子设备、触控装置制备方法及加压治具 - Google Patents

触控装置、电子设备、触控装置制备方法及加压治具 Download PDF

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Publication number
WO2020154949A1
WO2020154949A1 PCT/CN2019/073893 CN2019073893W WO2020154949A1 WO 2020154949 A1 WO2020154949 A1 WO 2020154949A1 CN 2019073893 W CN2019073893 W CN 2019073893W WO 2020154949 A1 WO2020154949 A1 WO 2020154949A1
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Prior art keywords
touch
substrate
touch substrate
layer
pattern
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Ceased
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PCT/CN2019/073893
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English (en)
French (fr)
Inventor
陈靖
包春贵
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to CN201980073523.XA priority Critical patent/CN113260965A/zh
Priority to PCT/CN2019/073893 priority patent/WO2020154949A1/zh
Publication of WO2020154949A1 publication Critical patent/WO2020154949A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to the field of touch technology, in particular to a touch device, an electronic device, a method for preparing a touch device, and a pressure fixture.
  • touch technology has been used in consumer electronics, smart home and other aspects. Compared with the graphic design of traditional consumer electronics, smart homes face more diverse scenarios. At present, the existing touch technology can only realize touch solutions in two-dimensional directions such as planes and curved surfaces, and cannot realize touch patterns on three-dimensional or irregular curved surfaces.
  • An embodiment of the present invention provides a touch device, the touch device includes a touch substrate, the touch substrate has an inner surface and an outer surface disposed oppositely, the inner surface is a curved surface, and one side of the inner surface A stretch layer is provided, one side of the stretch layer is provided with a touch pattern, the stretch layer can be deformed to connect the touch pattern to the touch substrate, and the outer surface constitutes the The touch contact surface of the touch device.
  • the touch device provided by the embodiment of the present invention includes a touch substrate, the touch substrate has an inner surface and an outer surface that are opposed to each other, the inner surface is a curved surface, and one side of the inner surface is provided with a stretching layer, so One side of the stretching layer is provided with a touch pattern, the touch pattern is connected to the touch substrate through the stretching layer, and the outer surface of the touch substrate serves as the touch contact of the touch device surface.
  • An embodiment of the present invention further provides an electronic device, which includes the touch device as described above.
  • the embodiment of the present invention also provides a method for preparing a touch device, and the method for preparing a touch device includes:
  • the inner surface of the touch substrate is curved to form an accommodation space
  • a touch substrate is provided, the touch substrate includes a stretched layer and a touch pattern on one side of the stretched layer;
  • the touch substrate is processed so that the touch substrate squeezes the inner surface of the touch substrate, so that the touch pattern or the stretched layer is bonded to the touch substrate On the inner surface.
  • An embodiment of the present invention also provides a pressure jig, which is used to pressurize the touch substrate in any of the above embodiments.
  • FIG. 1 is a schematic structural diagram of a first touch device provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a second touch device provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a third touch device provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a fourth touch device provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a fifth touch device provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a sixth touch device provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a seventh touch device provided by an embodiment of the present application.
  • Fig. 8 is a schematic structural diagram of an electronic device provided by a preferred embodiment of the present application.
  • FIG. 9 is a schematic flowchart of a first method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 10 is a schematic diagram of the structure corresponding to step S100 of the first method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram corresponding to step S200 of the first method for manufacturing a touch device provided by an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram corresponding to step S400 of the first method for manufacturing a touch device provided by an embodiment of the present application.
  • FIG. 13 is a schematic partial flowchart of a second method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 14 is a schematic partial flowchart of a third method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 15 is a schematic structural diagram corresponding to step S420 of the third method for manufacturing a touch device provided by an embodiment of the present application.
  • FIG. 16 is a schematic partial flowchart of a fourth method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 17 is a schematic structural diagram corresponding to step S320 of the fourth method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 18 is a schematic partial flowchart of a fifth method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 19 is a schematic partial flowchart of a sixth method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 20 is a schematic partial flowchart of a seventh method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 21 is a schematic structural diagram corresponding to step S440 of the seventh method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 22 is a schematic partial flowchart of an eighth method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 23 is a schematic partial flowchart of a ninth method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 24 is a schematic partial flowchart of a tenth method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 25 is a schematic partial flowchart of an eleventh method for manufacturing a touch device according to an embodiment of the present application.
  • FIG. 26 is a schematic structural diagram corresponding to step S210 of the eleventh touch device manufacturing method provided by an embodiment of the present application.
  • FIG. 27 is a schematic structural diagram of the first pressurizing jig provided by an embodiment of the present application.
  • FIG. 28 is a schematic diagram of preparing a touch device using a pressure fixture in an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a first touch device provided by an embodiment of the present application.
  • the touch device 10 includes a touch substrate 100, the touch substrate 100 has an inner surface 100a and an outer surface 100b disposed oppositely, the inner surface 100a is a curved surface, and one side of the inner surface 100a is provided with a stretch Layer 200, one side of the stretched layer 200 is provided with a touch pattern 300, the stretched layer 200 can be deformed to connect the touch pattern 300 to the touch substrate 100, and the outer surface 100b constitutes the touch contact surface of the touch device 10.
  • the inner surface 100a of the touch substrate 100 is an irregular curved surface, that is, the curvature of the inner surface 100a of the touch substrate 100 is variable and not a constant value. It can be understood that in other embodiments, the curvature of the inner surface 100a of the touch substrate 100 may also be a constant value.
  • the touch substrate 100 may be a rigid substrate, such as a glass substrate; optionally, the touch substrate 100 may also be a flexible substrate, for example, the flexible substrate is made of polyimide film (PI) or polyester.
  • PI polyimide film
  • the film is compounded with copper foil. Due to the excellent properties of polyimide, such as high temperature soldering resistance, high strength, and flame retardancy, polyimide, as a polymer material, has outstanding thermal stability, good radiation resistance and chemical stability, and excellent mechanical properties.
  • the touch pattern 300 is formed by patterning a paint layer 1000 (please refer to FIG. 11).
  • the paint layer 1000 is made of a stretchable conductive mixed system, which is a composite material of resin and conductive components.
  • the touch substrate 100 is recessed and has an inner surface 100a and an outer surface 100b that are opposed to each other.
  • the inner surface 100a is a curved surface, and the inner surface 100a is formed with a stretching layer 200 and
  • the touch pattern 300 is used for receiving touch signals (including driving signals and sensing signals) and sensing a user's touch operation.
  • the touch substrate 100 may also be in a bent curve shape, with a concave portion and a convex portion, and the concave portion is provided with a stretching layer 200 and a touch pattern 300, so The protrusion is used for the user to touch.
  • the touch device 10 may be spherical or other three-dimensional curved structures.
  • the stretching layer 200 can be stretched and deformed, the stretching layer 200 is connected to the inner surface 100 a, and the outer surface 100 b serves as a touch contact surface of the touch device 10.
  • the touch device 10 senses the capacitance change on the outer surface 100b, thereby calculating the coordinates of the touched part, and then knowing a certain part of the outer surface 100b Whether the part is touched or not, the touch device 10 responds differently to the change of the capacitance value of different parts to realize different functions.
  • the touch pattern 300 may be a pattern distributed in a matrix, may also be a pattern distributed in a net shape, or may be a pattern in other shapes.
  • the structure and shape of the touch device 10 can be the same as that of a vase.
  • Touch on the outer surface 100b of the vase By sequentially forming a stretched layer 200 and a touch pattern 300 on the inner surface 100a of the vase, Touch on the outer surface 100b of the vase.
  • the touch device 10 composed of a vase can be used to adjust the opening and closing of the air conditioner, and adjust the temperature of the air conditioner. Then, you only need to touch the outer surface 100b of the vase to complete the opening and closing of the air conditioner and the temperature of the air conditioner.
  • the touch device 10 provided by the embodiment of the present invention includes a touch substrate 100, the touch substrate 100 has an inner surface 100a and an outer surface 100b disposed oppositely, the inner surface 100a is a curved surface, and one side of the inner surface 100a A stretch layer 200 is provided, and a touch pattern 300 is arranged on a side of the stretch layer 200 away from the inner surface 100a, and the touch pattern 300 is connected to the inner surface 100a through the stretch layer 200,
  • the outer surface 100 b of the touch substrate 100 serves as a touch contact surface of the touch device 10.
  • FIG. 2 is a schematic structural diagram of a second touch device provided by an embodiment of the present application.
  • the schematic structural diagram of the second touch device 10 is basically the same as the schematic structural diagram of the first touch device 10, except that, in this embodiment, the inner surface 100a and the stretching layer 200 are arranged between There is an optical glue 400, and the optical glue 400 is used to fixedly connect the stretching layer 200 to the inner surface 100a.
  • the optical adhesive 400 may be an OCA (Optically Clear Adhesive) optical adhesive 400, which is a special adhesive used to bond transparent optical elements (such as lenses). It is required to be colorless and transparent, light transmittance above 90%, good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage.
  • OCA optical glue 400 is one of the important raw materials for touch screens.
  • OCA Optical Adhesive 400 is an optically transparent layer of special double-sided adhesive without substrate.
  • FIG. 3 is a schematic structural diagram of a third touch device provided by an embodiment of the present application.
  • the touch pattern 300 is disposed on a side of the stretch layer 200 close to the inner surface 100a, and the touch pattern 300 includes a plurality of contact foot portions 1200, and the contact foot portions 1200 are used to pull the The stretched layer 200 is fixedly connected to the inner surface 100a.
  • the contact foot part 1200 has a cilia shape and is inclined at a set angle with respect to the stretch layer 200.
  • FIG. 4 is a schematic structural diagram of a fourth touch device provided by an embodiment of the present application.
  • the schematic structural diagram of the fourth touch device 10 is basically the same as the schematic structural diagram of the first touch device 10, except that, in this embodiment, the touch pattern 300 is away from the inner surface 100a.
  • a protection layer 500 is provided, and the protection layer 500 is used to form insulation protection for the touch pattern 300.
  • the protective layer 500 may be an insulating protective ink, which is used to form an insulating protection for the touch pattern 300 to prevent the touch pattern 300 from being damaged and causing touch failure.
  • the touch pattern 300 includes a plurality of touch units 310 distributed in an array, and each of the touch units 310 constitutes a touch electrode.
  • the protective layer 500 is made of an insulating material, in a mesh or strip structure, and is used to fill the gap between two adjacent touch units 310 to connect two adjacent touch units 310.
  • the units 310 are separated from each other. It is possible to avoid erroneous contact between two adjacent touch units 310, thereby avoiding touch failure, and helping to improve the touch sensitivity of the touch device 10.
  • the protective layer 500 is used for insulating and isolating the touch pattern 300 to prevent the touch pattern 300 from being corroded and damaged by moisture, dust, etc. in the external environment.
  • FIG. 5 is a schematic structural diagram of a fifth touch device provided by an embodiment of the present application.
  • the schematic diagram of the structure of the fifth type of touch device 10 is basically the same as the schematic diagrams of the structure of the first, second, and third touch devices 10, except that, in this embodiment, the touch pattern 300 includes There are several touch units 310 arranged at intervals, and the several touch units 310 are arranged in an array on the touch substrate 100.
  • the several touch units 310 arranged at intervals refer to two or more touch units 310 arranged at intervals.
  • part of the touch unit 310 constitutes driving electrodes
  • part of the touch unit 310 constitutes sensing electrodes.
  • the driving electrodes and the sensing electrodes cooperate with each other.
  • the transmission of the touch signal is completed, and the touch function of the touch device 10 is realized.
  • FIG. 6 is a schematic structural diagram of a sixth touch device provided by an embodiment of the present application.
  • the schematic structural diagram of the sixth type of touch device 10 is basically the same as that of the fourth type of touch device 10, except that, in this embodiment, the touch device 10 further includes an electrode layer 600 and a circuit board 700
  • the electrode layer 600 includes a plurality of electrodes 610
  • the touch unit 310 is electrically connected to the circuit board 700 through the electrodes 610
  • the circuit board 700 is used to control the touch unit 310 to achieve a touch function .
  • the electrode 610 is a conductive electrode 610, which is used to transmit touch signals from the touch unit 310 to the circuit board 700, and then the circuit board 700 controls the touch unit 310 to implement corresponding touch functions.
  • the touch units 310 in each row are connected to one electrode 610, so that the touch units 310 in each row share one electrode 610, and then the electrode 610 is electrically connected to all the touch units 310.
  • the circuit board 700 is used to control the touch unit 310 through the circuit board 700 to realize the touch function of the touch unit 310.
  • FIG. 7 is a schematic structural diagram of a seventh touch device provided by an embodiment of the present application.
  • the schematic structural diagram of the seventh type of touch device 10 is basically the same as that of the sixth type of touch device 10, except that, in this embodiment, the touch device 10 further includes a touch substrate connected to the touch substrate.
  • the bottom wall 100c of 100, the electrode layer 600 is disposed on the bottom wall 100c.
  • the bottom wall 100c is connected to the inner surface 100a and the outer surface 100b at the same time, and a plurality of the electrodes 610 are distributed in a curve on the bottom wall 100c.
  • the circuit board 700 can be disposed on the bottom wall 100c, and the electrical connection relationship between the circuit board 700 and the electrode layer 600 is maintained, so that the circuit board 700 is in contact with each other.
  • the control unit 310 performs control to realize the touch function of the touch unit 310.
  • FIG. 8 is a schematic structural diagram of an electronic device provided by a preferred embodiment of the present application.
  • the electronic device 1 includes the touch device 10 provided in any of the above embodiments.
  • the electronic device 1 may be any device with touch function.
  • tablet computers mobile phones, e-readers, remote controls, personal computers (PC), notebook computers, in-vehicle devices, Internet TVs, wearable devices, etc.
  • PC personal computers
  • notebook computers in-vehicle devices, Internet TVs, wearable devices, etc.
  • FIG. 9 is a schematic flowchart of the first method for manufacturing a touch device according to an embodiment of the present application.
  • the manufacturing method of the touch device includes but is not limited to steps S100, S200, S300, S400, and S500.
  • steps S100, S200, S300, S400, and S500 please refer to the following introduction.
  • S100 Provide a touch substrate 100, and the inner surface 100a of the touch substrate 100 is curved to form an accommodation space 100A. See Figure 10 for details.
  • the touch substrate 100 may be a rigid substrate, such as a glass substrate; optionally, the touch substrate 100 may also be a flexible substrate, for example, the flexible substrate is made of polyimide film (PI) or polyester.
  • PI polyimide film
  • the film is compounded with copper foil. Due to the excellent properties of polyimide, such as high temperature soldering resistance, high strength, flame retardancy, etc., polyimide as a polymer material has outstanding thermal stability, good radiation resistance and chemical stability, and excellent mechanical properties.
  • the touch substrate 100 is curved and has a curved inner surface 100a, and the inner surface 100a forms a receiving space 100A.
  • the quality of the touch substrate 100 needs to be tested to ensure that the touch substrate 100 meets the quality requirements. If the touch substrate 100 does not meet the quality standards, consider The touch substrate 100 is replaced to ensure that the prepared touch device 10 reaches the normal index.
  • the method for detecting whether the touch substrate 100 meets the quality standard may be infrared detection.
  • An infrared detector is used to detect the touch substrate 100 and receive the detected data. If there are some parts of the detected data, The position data is obviously too small, it can be considered that the area has cracks or holes, and the touch substrate 100 is considered to be out of quality standards. Therefore, it is necessary to consider replacing the touch substrate 100 to ensure the prepared touch device 10 the quality of.
  • the provided touch substrate 100 is sampled and tested.
  • the touch substrate 100 is sampled.
  • the sampling method of the touch substrate 100 may be: extract a preset number of the touch substrate 100 within a preset period, measure the size of the preset number of the touch substrate 100, and determine the preset number of touch Whether the size of the substrate 100 is within the allowable value range. If the size of the touch substrate 100 is within the allowable value range, proceed to the next step. If the size of the touch substrate 100 exceeds the allowable value range, the preparation parameters etc. for preparing the touch substrate 100 are adjusted in order to obtain the qualified touch substrate 100.
  • the touch substrate 800 includes a stretched layer 200 and a touch pattern 300 on one side of the stretched layer 200. Refer to Figure 11 and Figure 12 for details.
  • the stretched layer 200 is formed of a stretchable substrate, and the touch pattern 300 is formed by patterning the paint layer 1000 on the side of the stretched layer 200.
  • the touch substrate 800 includes a stretching layer 200 and a coating layer 1000, but is not limited to including the stretching layer 200 and the coating layer 1000.
  • the stretching layer 200 may be in direct contact with the coating layer 1000, and the stretching layer 200 may also be in indirect contact with the coating layer 1000.
  • the coating layer 1000 includes a plurality of coating units 1001 arranged at intervals, the optical glue 400 includes a colloid unit 401 covering the coating unit 1001, and the colloid unit 401 corresponds to the coating unit 1001 one-to-one.
  • the glue unit 401 is used for fixing the corresponding paint unit 1001 to the touch substrate 100.
  • the material of the coating layer 1000 is a stretchable conductive mixed system, which is a composite material of resin and conductive components.
  • the resin is a continuous phase and can be stretched, that is, the resin is elastic, and the conductive component is a dispersed phase and can conduct electricity.
  • the paint layer 1000 is a pad printing conductive paint, which can be transferred to the inner surface of the touch substrate under heating.
  • the paint layer 1000 is fabricated on the stretched layer 200 by means of screen printing and yellowing process.
  • the manufacturing method of the touch device further includes forming a protective layer on the stretched layer, and the protective layer is arranged on a side of the touch pattern away from the inner surface.
  • the protective layer 500 is disposed on the side of the paint layer 1000 away from the inner surface 100 a, that is, above the stretched layer 200, and the protective layer 500 is used to form insulation protection for the paint layer 1000.
  • the protective layer 500 may be an insulating protective ink for insulating and protecting the touch pattern 300 to prevent the touch pattern 300 from being damaged and causing touch failure.
  • the stretch layer 200 and the paint layer 1000 are placed in the containing space 100A together, and the stretch layer 200 and the paint layer 1000 are directly facing the inner surface 100 a of the touch substrate 100.
  • the paint layer 1000 is disposed adjacent to the inner surface 100 a relative to the stretch layer 200.
  • S400 Process the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the stretched layer 200 It is bonded on the inner surface 100a of the touch substrate 100. See Figure 9 and Figure 12 for details.
  • the processing of the touch substrate 800 includes two aspects of processing. First, the touch substrate 800 is pressurized and heated; second, the touch substrate 800 is pressure-reduced. The handling of these two aspects is specifically introduced as follows.
  • the touch substrate 800 By pressing and heating the touch substrate 800, under the stretching action of the stretching layer 200, the touch substrate 800 is pressed against the inner surface 100a of the touch substrate 100, and then the pressurized state is maintained. Setting time allows the coating layer 1000 to form a continuous pressing force on the inner surface 100a of the touch substrate 100, which is an important step in the manufacturing process of the touch pattern 300.
  • the number of times that the touch substrate 800 is subjected to pressure treatment may be once or multiple times.
  • the touch substrate 800 can be pressurized by injecting gas, injecting a liquid, or expanding a solid. I won't do too much explanation here, and I will explain in detail later.
  • the touch substrate 800 is kept in a pressurized state for a preset time, and the preset time is sufficient to enable the touch pattern 300 formed by the coating layer 1000 on the touch substrate 800 to be completely bonded to the touch substrate by thermal transfer.
  • the inner surface 100a of the substrate 100 is controlled so as to avoid the touch failure problem caused by the incompleteness of the touch pattern 300.
  • the preset time can be obtained through multiple experimental data, so as to ensure that the touch pattern 300 formed by the coating layer 1000 has a perfect touch function.
  • the number of times of decompression may be one or multiple.
  • the touch substrate 800 can be decompressed by absorbing air, and the coating layer 1000 can be bonded to the inner surface 100a of the touch substrate 100 through the shrinkage of the stretched layer 200 to form The pattern 300 is touched while the stretched layer 200 is peeled off.
  • FIG. 13 is a schematic partial flowchart of the second method for manufacturing a touch device according to an embodiment of the present application.
  • the step S300 place the touch substrate 800 in the containing space 100A” includes but is not limited to step S310.
  • S410 Press and heat the touch substrate 800 to make the coating layer 1000 adhere to the inner surface 100a of the touch substrate 100.
  • the coating layer 1000 Since the coating layer 1000 is arranged closer to the inner surface 100a than the stretching layer 200, the side of the stretching layer 200 far away from the coating layer 1000 can be subjected to pressure treatment. Through the expansion and stretching action of the stretching layer 200, The coating layer 1000 covers the inner surface 100a and forms a certain pressing force on the inner surface 100a. Specifically, the stretched layer 200 can be uniformly pressurized and heated, so that the stretched layer 200 has viscosity at high temperatures, so that the coating layer 1000 is uniformly bonded to the stretched layer 200 under the traction of the stretched layer 200. On the inner surface 100 a of the touch substrate 100, it can be ensured that the manufactured touch pattern 300 is relatively complete, which helps to ensure the sensitivity of the touch function of the touch device 10.
  • the touch substrate 800 further includes a protective layer 500 located between the coating layer 1000 and the stretching layer 200, and the protective layer 500 is used to form an insulation protection for the coating layer 1000.
  • the protective layer 500 may be an insulating protective ink, which is used to form an insulating protection for the touch pattern 300 to prevent the touch pattern 300 from being damaged and causing touch failure.
  • the protective layer 500 is an insulating material and has a mesh or strip structure.
  • the protective layer 500 is used to insulate and isolate the touch pattern 300 to prevent the touch pattern 300 from being exposed to moisture in the external environment. , Dust and other corrosion and damage.
  • step S400 processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The adhesion of the stretched layer 200 on the inner surface 100a of the touch substrate 100" includes but is not limited to step S420.
  • the description of step S420 is as follows.
  • S420 Press and heat the touch substrate 800 to make the paint layer 1000, the protective layer 500 and the stretch layer 200 squeeze the inner surface 100a of the touch substrate 100. See Figure 15 for details.
  • the protective layer 500 is located between the stretch layer 200 and the paint layer 1000, so that the stretch layer 200 can be processed on the side far away from the paint layer 1000.
  • Pressure and heat treatment, through the expansion and stretching action of the stretching layer 200, the coating layer 1000, the protective layer 500 and the stretching layer 200 are covered on the inner surface 100a, and a certain degree of extrusion is formed on the inner surface 100a. Degree of stress.
  • the stretched layer 200 can be uniformly pressurized and heated, so that the stretched layer 200 is viscous at high temperatures and has a uniform expansion effect, so that the coating layer 1000, the protective layer 500 and the stretched layer 200 are Under the traction of the stretched layer 200, it evenly covers the inner surface 100a of the touch substrate 100, thereby ensuring that the manufactured touch pattern 300 is relatively complete, which helps to ensure the touch function of the touch device 10 Sensitivity.
  • step “S400: processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The adhesion of the stretched layer 200 on the inner surface 100a of the touch substrate 100” includes but is not limited to step S421, which is described as follows.
  • S421 Perform a pressure reduction treatment on the touch substrate 800, so that the stretch layer 200 is bonded to the inner surface 100a of the touch substrate 100, or the touch pattern 300 is bonded to all The touch substrate 100 is on the inner surface 100a.
  • the number of times of performing pressure reduction treatment on the stretched layer 200 may be one or multiple times.
  • the process of decompressing the stretching layer 200 can be performed at a uniform speed, so that the coating layer 1000 and the protective layer 500 can be uniformly bonded on the inner surface 100a of the touch substrate 100, and the coating layer 1000 constitutes the The touch pattern 300.
  • the protective layer 500 is used for insulating and isolating the touch pattern 300 to prevent the touch pattern 300 from being corroded and damaged by moisture, dust, etc. in the external environment.
  • the touch substrate 800 further includes a protective layer 500 located between the coating layer 1000 and the stretching layer 200 and an optical glue 400 covering the coating layer 1000.
  • the optical adhesive 400 may be an OCA (Optically Clear Adhesive) optical adhesive 400, which is a special adhesive used to bond transparent optical elements (such as lenses). It is required to be colorless and transparent, light transmittance above 90%, good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage.
  • OCA optical glue 400 is one of the important raw materials for touch screens.
  • OCA Optical Adhesive 400 is an optically transparent layer of special double-sided adhesive without substrate.
  • step "S300: placing the touch substrate 800 in the containing space 100A” includes but is not limited to step S320, and step S320 is introduced as follows.
  • the optical glue 400 is located on the coating layer 1000 and is more adjacent to the inner surface 100a.
  • step “S400: processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The adhesion of the stretching layer 200 on the inner surface 100a of the touch substrate 100” includes but is not limited to step S430, which is described as follows.
  • S430 Press and heat the touch substrate 800 to make the optical glue 400, the coating layer 1000, the protective layer 500 and the stretch layer 200 squeeze the touch substrate 100 ⁇ surface 100a.
  • the stretching layer 200 can be moved away from the side of the optical glue 400, the coating layer 1000, and the protective layer 500 Pressure and heat treatment are performed, and the expansion and stretching action of the stretching layer 200 causes the optical glue 400, the coating layer 1000, the protective layer 500 and the stretching layer 200 to cover the inner surface 100a, and to the inner surface 100a.
  • 100a forms a certain squeeze force.
  • the stretched layer 200 can be uniformly pressurized and heated, so that the stretched layer 200 has a uniform expansion effect, so that the optical glue 400, the coating layer 1000 and the protective layer 500 are in the stretched layer 200. Under traction, it evenly covers the inner surface 100a of the touch substrate 100, so as to ensure that the manufactured touch pattern 300 is relatively complete, which helps to ensure the sensitivity of the touch function of the touch device 10.
  • step S400 processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The adhesion of the stretched layer 200 on the inner surface 100a of the touch substrate 100" includes but is not limited to step S432.
  • step S432 is as follows.
  • S432 Perform a pressure reduction treatment on the touch substrate 800, so that the touch substrate 800 is bonded to the inner surface 100a of the touch substrate 100 through the optical glue 400.
  • the number of times of performing pressure reduction treatment on the stretched layer 200 may be one or multiple times.
  • the process of decompressing the stretching layer 200 can be performed at a uniform speed, so that the coating layer 1000 and the protective layer 500 can be uniformly bonded on the inner surface 100a of the touch substrate 100, and the coating layer 1000 constitutes the The touch pattern 300.
  • the protective layer 500 is used for insulating and isolating the touch pattern 300 to prevent the touch pattern 300 from being corroded and damaged by moisture, dust, etc. in the external environment.
  • FIG. 18 is a schematic partial flowchart of the fifth method for manufacturing a touch device according to an embodiment of the present application.
  • the method for preparing the touch device further includes but is not limited to steps S250 and S260, details about steps S250 and S260 The introduction is as follows.
  • the paint layer 1000 is etched to form a plurality of paint units 1001 arranged at intervals, and each paint unit 1001 is used to make a touch unit.
  • S260 Form a colloid unit 401 covering the paint unit 1001, the colloid unit 401 corresponds to the paint unit 1001 one-to-one, and a plurality of the colloid units 401 are arranged at intervals to form the optical glue 400.
  • one colloid unit 401 corresponds to a paint unit 1001, and the colloid unit 401 is used to fix the paint unit 1001 to the inner surface 100a of the touch substrate 100.
  • the optical adhesive 400 may be an OCA (Optically Clear Adhesive) optical adhesive 400, which is a special adhesive used to bond transparent optical elements (such as lenses). It is required to be colorless and transparent, light transmittance above 90%, good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage.
  • OCA optical glue 400 is one of the important raw materials for touch screens.
  • OCA Optical Adhesive 400 is an optically transparent layer of special double-sided adhesive without substrate.
  • FIG. 19 is a schematic partial flowchart of the sixth method for manufacturing a touch device according to an embodiment of the present application.
  • step "S300: placing the touch substrate 800 in the containing space 100A” includes but is not limited to step S330, and step S330 is introduced as follows.
  • the stretching layer 200 is located between the coating layer 1000 and the inner surface 100 a of the touch substrate 100.
  • FIG. 20 is a partial flowchart of a seventh method for manufacturing a touch device according to an embodiment of the present application.
  • the touch substrate 800 further includes an optical glue 400 on the side of the stretching layer 200 away from the coating layer 1000 and a protective layer 500 on the side of the coating layer 1000 away from the stretching layer 200.
  • the protective layer 500 may be an insulating protective ink, which is used to form an insulating protection for the touch pattern 300 to prevent the touch pattern 300 from being damaged and causing touch failure.
  • step S400 processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The adhesion of the stretching layer 200 on the inner surface 100a of the touch substrate 100" includes but is not limited to step S440, and the description of step S440 is as follows.
  • the stretching layer 200 is arranged closer to the inner surface 100a relative to the coating layer 1000, the side of the coating layer 1000 away from the stretching layer 200 can be pressurized, and through the expansion and stretching action of the stretching layer 200, The coating layer 1000 and the stretching layer 200 are covered on the inner surface 100a, and a certain pressing force is formed on the inner surface 100a.
  • the coating layer 1000 can be uniformly pressurized and heated, and the stretching layer 200 is squeezed by the coating layer 1000, so that the stretching layer 200 has a uniform expansion effect, and the coating layer 1000 can be stretched Under the traction of the stretched layer 200, it evenly covers the inner surface 100a of the touch substrate 100, so as to ensure that the manufactured touch pattern 300 is relatively complete, which helps to ensure the sensitivity of the touch function of the touch device 10.
  • step S400 processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the
  • the “adhesive stretching layer 200 on the inner surface 100a of the touch substrate 100” includes but is not limited to step S441.
  • Step S441 is introduced as follows.
  • S441 Perform a pressure reduction treatment on the touch substrate 800, so that the optical glue 400, the stretching layer 200, the coating layer 1000 and the protective layer 500 are bonded on the inner surface 100a .
  • the number of times of performing the pressure reduction treatment on the protective layer 500 may be one or multiple times.
  • the process of decompressing the protective layer 500 can be performed at a uniform speed, so that the coating layer 1000 and the protective layer 500 can be uniformly bonded on the inner surface 100a of the touch substrate 100.
  • the coating layer 1000 The touch pattern 300 is formed, and the protective layer 500 is used for insulating and isolating the touch pattern 300 to prevent the touch pattern 300 from being corroded and damaged by moisture, dust, etc. in the external environment.
  • FIG. 22 is a partial flowchart of the eighth method for manufacturing a touch device according to an embodiment of the present application.
  • step S400 processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The adhesion of the stretched layer 200 on the inner surface 100a of the touch substrate 100” includes but is not limited to step S450, which is described as follows.
  • S450 Blow air on the side of the touch substrate 800 away from the inner surface 100a toward the inner surface 100a, and keep the blowing speed consistent, wherein the temperature of the blown gas is higher than a preset temperature .
  • the blowing process is also accompanied by a heating process. Therefore, the temperature of the blowing gas is higher than a certain preset temperature.
  • the blowing device can be a blowing machine, a high-pressure nozzle, an air gun, and other equipment.
  • This application does not limit the manner of achieving blowing, as long as it does not violate the original intent of the technical solution of this application, it is within the scope of protection claimed by this application, and it is considered to be a blowing manner that meets the conditions.
  • a pressure jig is used to pressurize the touch substrate 800.
  • the pressure jig is provided with a plurality of pressure holes, and the touch substrate 800 is applied through the plurality of pressure holes.
  • the pressure causes the touch substrate 800 to adhere to the inner surface 100a of the touch substrate 100, thereby obtaining a better touch pattern 300, which helps to improve the touch sensitivity of the touch device 10.
  • this application does not limit the number of blowing devices.
  • the effect of filling the glue can be combined to determine the blowing device. Number.
  • the application does not limit the number of blows.
  • the number of blows can be one or multiple. Specifically, it can be combined with the touch substrate 800 when it is attached to the inner surface 100a. Effect to determine the number of blows. And when blowing air on the side of the touch substrate 800 away from the inner surface 100a toward the direction of the inner surface 100a, the touch substrate 800 can be pressurized and heated, so that It helps the touch substrate 800 to better move toward the preset direction, so that the touch substrate 800 is attached to the inner surface 100a of the touch substrate 100.
  • the direction of blowing air toward the direction of the inner surface 100a on the side of the touch substrate 800 away from the inner surface 100a can be changed. 800.
  • the direction of blowing air on the side away from the inner surface 100a toward the inner surface 100a can be perpendicular to the inner surface 100a, or it can be tangent to the inner surface 100a, or it can be tangent to the inner surface 100a.
  • the inner surface 100a is at a certain angle.
  • the application does not limit the blowing direction toward the inner surface 100a from the side of the touch substrate 800 away from the inner surface 100a. Any blowing direction is not limited.
  • the touch substrate 800 can be blown along the extension direction of the inner surface 100a, so that the touch substrate 800 can be Move along the extending direction of the inner surface 100a, so as to achieve the purpose of quickly attaching the inner surface 100a of the touch substrate 100.
  • FIG. 23 is a partial flowchart of a ninth method for manufacturing a touch device according to an embodiment of the present application.
  • step S400 processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The adhesion of the stretching layer 200 on the inner surface 100a of the touch substrate 100" includes but is not limited to step S460, and the description of step S460 is as follows.
  • S460 Inject a fluid on the side of the touch substrate 800 away from the inner surface 100a toward the inner surface 100a, and the temperature of the fluid is higher than a preset temperature.
  • the fluid can be water or other liquid media.
  • a mathematical model for pressurizing the touch substrate 800 is established, and then the touch substrate 800 is moved away from the inner surface One side of 100a is pressurized.
  • the amount of pressure applied to the touch substrate 800 is positively correlated with the distance between the touch substrate 800 and the inner surface 100a. That is, the greater the distance between the touch substrate 800 and the inner surface 100a, the greater the pressure applied to the touch substrate 800, which can be based on the shape and contour of the inner surface 100a of the touch substrate 100
  • the pressure value applied to the touch substrate 800 can be flexibly adjusted to ensure that a relatively complete touch pattern 300 is obtained, which helps to improve the touch sensitivity of the touch device 10.
  • the expansion speed of the stretched layer 200 can be increased, thereby helping to shorten the contact length of the touch substrate 800 attached to the inner surface 100a of the touch substrate 100.
  • the speed helps to shorten the manufacturing cycle of the touch device 10.
  • the coating layer 1000 can be completely flattened, which is more helpful to obtain a relatively complete touch pattern 300, and helps to improve the sensitivity of the touch device 10.
  • FIG. 24 is a partial flowchart of the tenth method for manufacturing a touch device according to an embodiment of the present application.
  • the step “S400: processing the touch substrate 800 so that the touch substrate 800 squeezes the inner surface 100a of the touch substrate 100, so that the touch pattern 300 or the The stretching layer 200 is bonded to the inner surface 100a of the touch substrate 100” includes but is not limited to steps S470 and S480.
  • the steps S470 and S480 are introduced as follows.
  • S470 Inject fluid on the side of the touch substrate 800 away from the inner surface 100a toward the inner surface 100a.
  • step S470 refer to the introduction of step S460, which will not be repeated here.
  • the volume of the solidified part formed by the freezing of the liquid will increase, so that the touch substrate 800 is held against the inner surface 100a of the touch substrate 100, thereby making the acquisition more complete
  • the touch pattern 300 is helpful to improve the touch sensitivity of the touch device 10.
  • the cooling speed is controlled to be uniform, so that the fluid is uniformly frozen to form a solidified part, so that the touch substrate 800 uniformly resists the inner surface 100a of the touch substrate 100 , So that a relatively complete touch pattern 300 can be obtained, which helps to improve the touch sensitivity of the touch device 10.
  • FIG. 25 is a schematic partial flowchart of the eleventh method for manufacturing a touch device according to an embodiment of the present application.
  • the manufacturing method of the touch device further includes but is not limited to steps S210, S220, and S230.
  • steps S210, S220, and S230 are as follows.
  • S210 Perform a patterning process on the paint layer 1000 located on one side of the stretching layer 200, so that the paint layer 1000 forms a plurality of contact foot parts 1200. Refer to Figure 26 for details.
  • the touch pattern 300 includes a plurality of contact foot parts 1200.
  • the contact foot parts 1200 have a cilia shape and are inclined at a set angle with respect to the stretching layer 200.
  • the contact foot parts 1200 are used to
  • the touch substrate 800 is fixedly connected to the inner surface 100 a of the touch substrate 100.
  • the surface of the paint layer 1000 away from the stretching layer 200 is made into a plurality of contact foot parts 1200, and presents fluff-like protrusions, and these contact foot parts 1200 can provide strong adhesion through van der Waals keys.
  • Van der Waals bond principle When two atoms are close to each other, the electron cloud surrounding the nucleus of each atom changes, so that weak electrostatic attraction is generated to have adhesion to the two atoms.
  • the electrostatic attraction between two atoms is weak, however, if there are multiple contact foot portions 1200 and the end of each contact foot portion 1200 is cracked, the strength of the attraction generated by each contact foot portion 1200 is gathered, thereby increasing Its strength.
  • S220 Press and heat the stretched layer 200 to make the contact foot portion 1200 squeeze the inner surface 100a.
  • the coating layer 1000 is arranged closer to the inner surface 100a than the stretching layer 200, the side of the stretching layer 200 far away from the coating layer 1000 can be subjected to pressure treatment. Through the expansion and stretching action of the stretching layer 200, The coating layer 1000 and the stretching layer 200 are made to cover the inner surface 100a, and the contact foot 1200 forms a certain pressing force on the inner surface 100a.
  • the stretching layer 200 can be uniformly pressurized and heated, and the coating layer 1000 can be squeezed by the stretching layer 200, so that the coating layer 1000 has a uniform expansion effect, and the coating layer 1000 can be stretched Under the traction of the stretched layer 200, the contact foot portion 1200 is uniformly adsorbed on the inner surface 100a of the touch substrate 100, thereby ensuring that the manufactured touch pattern 300 is relatively complete, and the touch pattern 300 can be firmly attached to
  • the inner surface 100a of the touch substrate 100 helps to ensure the sensitivity of the touch function of the touch device 10.
  • S230 Perform a pressure reduction treatment on the stretching layer 200, so that a plurality of the contact foot portions 1200 are connected to the inner surface 100a.
  • the number of times of performing pressure reduction treatment on the stretched layer 200 may be one or multiple times.
  • the process of decompressing the stretching layer 200 can be performed at a uniform speed, so that the coating layer 1000 and the stretching layer 200 can be uniformly bonded to the inner surface 100a of the touch substrate 100.
  • the layer 1000 constitutes the touch pattern 300, and the stretched layer 200 is used to provide adsorption force to the touch pattern 300 to prevent the touch pattern 300 from falling off the inner surface 100a of the touch substrate 100, so that The touch pattern 300 can be firmly attached to the inner surface 100 a of the touch substrate 100, which helps to ensure the sensitivity of the touch function of the touch device 10.
  • FIG. 27 is a schematic structural diagram of the first pressurizing jig provided by an embodiment of the present application.
  • FIG. 28 is a schematic diagram of preparing a touch device using a pressure fixture in an embodiment of the present application.
  • the pressing jig 2000 is used to pressurize the touch substrate 800 provided in any of the above embodiments.
  • the pressure jig 2000 has a plurality of pressure holes 2100.
  • the pressure hole 2100 faces the touch Control the substrate 800 settings.
  • the pressure holes 2100 are evenly distributed on the surface of the pressure jig 2000.

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Abstract

本发明提供一种触控装置(10)、电子设备(1)、触控装置制备方法及加压治具(2000)，所述触控装置(10)包括触控基板(100)，所述触控基板(100)具有相对设置的内表面(100a)和外表面(100b)，所述内表面(100a)为曲面，所述内表面(100a)的一侧设置有拉伸层(200)，所述拉伸层(200)的一侧设置有触控图案(300)，所述拉伸层(200)可产生变形，以将所述触控图案(300)连接于所述触控基板(100)，所述外表面(100b)构成所述触控装置(10)的触控接触面。本申请的技术方案可以在三维曲面结构上实现触控功能。

Description

触控装置、电子设备、触控装置制备方法及加压治具 技术领域
本发明涉及触控技术领域，尤其涉及一种触控装置、电子设备、触控装置制备方法及加压治具。
背景技术
随着触控技术的发展，触控技术已经运用在消费电子，智能家居等方方面面。相比传统的消费电子的平面设计，智能家居所面对的场景更多种多样。目前现有触控技术，只能实现平面，曲面等二维方向的触控方案，无法实现在三维立体曲面或者不规则曲面上做触控图案。
发明内容
本发明实施例提供一种触控装置，所述触控装置包括触控基板，所述触控基板具有相对设置的内表面和外表面，所述内表面为曲面，所述内表面的一侧设置有拉伸层，所述拉伸层的一侧设置有触控图案，所述拉伸层可产生变形，以将所述触控图案连接于所述触控基板，所述外表面构成所述触控装置的触控接触面。
本发明实施例提供的触控装置包括触控基板，所述触控基板具有相对设置的内表面和外表面，所述内表面为曲面，所述内表面的一侧设置有拉伸层，所述拉伸层的一侧设置有触控图案，所述触控图案通过所述拉伸层连接于所述触控基板，所述触控基板的外表面作为所述触控装置的触控接触面。
本发明实施例还提供一种电子设备，所述电子设备包括如上所述的触控装置。
本发明实施例还提供一种触控装置制备方法，所述触控装置制备方法包括：
提供触控基板，所述触控基板的内表面呈曲面形成收容空间；
提供触控基材，所述触控基材包括拉伸层以及位于所述拉伸层的一侧的触控图案；
将所述触控基材放置于所述收容空间内；
对所述触控基材进行处理，以使得所述触控基材挤压所述触控基板的内表面，从而使得所述触控图案或所述拉伸层粘结在所述触控基板的内表面上。
本发明实施例还提供一种加压治具，所述加压治具用于对上述任一实施例中的触控基材进行加压处理。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的第一种触控装置的结构示意图。
图2是本申请实施例提供的第二种触控装置的结构示意图。
图3是本申请实施例提供的第三种触控装置的结构示意图。
图4是本申请实施例提供的第四种触控装置的结构示意图。
图5是本申请实施例提供的第五种触控装置的结构示意图。
图6是本申请实施例提供的第六种触控装置的结构示意图。
图7是本申请实施例提供的第七种触控装置的结构示意图。
图8是本申请一较佳实施例提供的电子设备的结构示意图。
图9是本申请实施例提供的第一种触控装置制备方法的流程示意图。
图10是本申请实施例提供的第一种触控装置制备方法的步骤S100对应的结 构示意图。
图11是本申请实施例提供的第一种触控装置制备方法的步骤S200对应的结构示意图。
图12是本申请实施例提供的第一种触控装置制备方法的步骤S400对应的结构示意图。
图13是本申请实施例提供的第二种触控装置制备方法的局部流程示意图。
图14是本申请实施例提供的第三种触控装置制备方法的局部流程示意图。
图15是本申请实施例提供的第三种触控装置制备方法的步骤S420对应的结构示意图。
图16是本申请实施例提供的第四种触控装置制备方法的局部流程示意图。
图17是本申请实施例提供的第四种触控装置制备方法的步骤S320对应的结构示意图。
图18是本申请实施例提供的第五种触控装置制备方法的局部流程示意图。
图19是本申请实施例提供的第六种触控装置制备方法的局部流程示意图。
图20是本申请实施例提供的第七种触控装置制备方法的局部流程示意图。
图21是本申请实施例提供的第七种触控装置制备方法的步骤S440对应的结构示意图。
图22是本申请实施例提供的第八种触控装置制备方法的局部流程示意图。
图23是本申请实施例提供的第九种触控装置制备方法的局部流程示意图。
图24是本申请实施例提供的第十种触控装置制备方法的局部流程示意图。
图25是本申请实施例提供的第十一种触控装置制备方法的局部流程示意图。
图26是本申请实施例提供的第十一种触控装置制备方法的步骤S210对应的结构示意图。
图27是本申请实施例提供的第一种加压治具的结构示意图。
图28是本申请实施例采用加压治具制备触控装置的示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1是本申请实施例提供的第一种触控装置的结构示意图。所述触控装置10包括触控基板100，所述触控基板100具有相对设置的内表面100a和外表面100b，所述内表面100a为曲面，所述内表面100a的一侧设置有拉伸层200，所述拉伸层200的一侧设置有触控图案300，所述拉伸层200可产生变形，以将所述触控图案300连接于所述触控基板100，所述外表面100b构成所述触控装置10的触控接触面。
可选的，所述触控基板100的内表面100a为不规则曲面，即所述触控基板100的内表面100a的弯曲曲率是变化的，并非恒定值。可以理解的，在其他实施方式中，所述触控基板100的内表面100a的弯曲曲率也可以为恒定值。
所述触控基板100可以为刚性基板，例如为玻璃基板；可选的，所述触控基板100还可以为柔性基板，例如，所述柔性基板由聚酰亚胺薄膜(PI)或聚酯薄膜与铜箔复合而成。由于聚酰亚胺耐高温锡焊、高强度、阻燃等优良性能，聚酰亚胺作为高分子材料具有突出的热稳定性，良好的耐辐射和化学稳定性和优良的 力学性能。
所述触控图案300由涂料层1000(请参阅图11)图案化形成，所述涂料层1000的制成材料为可拉伸导电混合体系，为树脂与导电成分的复合材料。
在一种实施方式中，所述触控基板100呈凹陷状，具有相对设置的内表面100a和外表面100b，所述内表面100a为曲面，所述内表面100a上形成有拉伸层200和触控图案300，所述触控图案300用于接收触控信号(包括驱动信号和感应信号)并感测用户的触控操作。
可以理解的，在其他实施方式中，所述触控基板100还可以呈弯折的曲线状，具有凹陷部和凸起部，所述凹陷部设置有拉伸层200和触控图案300，所述凸起部用于供用户触摸。所述触控装置10可以为球形，还可以为其它的三维曲面结构。
其中，所述拉伸层200可产生拉伸变形，所述拉伸层200连接于所述内表面100a，所述外表面100b作为所述触控装置10的触控接触面。当用户触摸到所述触控装置10的外表面100b时，触控装置10感测到外表面100b上的电容变化，从而计算出被触摸部位的坐标，进而可以得知外表面100b的某一部位是否被触控，从而针对不同部位的电容值变化，触控装置10做出不同的反应，以实现不同的功能。
其中，触控图案300可以为呈矩阵分布的图案，还可以为呈现网状分布的图案，还可以为呈现其它形状的图案。
本发明的技术方案可以应用于智能家居，举例而言，所述触控装置10的结构形状可以与花瓶相同，通过在花瓶的内表面100a依次形成拉伸层200和触控图案300，从而可以在花瓶的外表面100b上触控。比如，花瓶构成的触控装置10可以用于调节空调的开启、关闭以及对空调的温度进行调节，那么只需要触摸花瓶的外表面100b即可完成对空调的开启、关闭以及对空调的温度等一系列的调节功能，一方面，花瓶起到装饰的效果，另一方面，花瓶还可以起到控制室内家居产品的功能，实现了智能家居的控制，有助于提高用户体验。
本发明实施例提供的触控装置10包括触控基板100，所述触控基板100具有相对设置的内表面100a和外表面100b，所述内表面100a为曲面，所述内表面100a的一侧设置有拉伸层200，所述拉伸层200远离所述内表面100a的一侧设置有触控图案300，所述触控图案300通过所述拉伸层200连接于所述内表面100a，所述触控基板100的外表面100b作为所述触控装置10的触控接触面。
请继续参阅图2，图2是本申请实施例提供的第二种触控装置的结构示意图。第二种触控装置10的结构示意图与第一种触控装置10的结构示意图基本相同，不同之处在于，在本实施例中，所述内表面100a和所述拉伸层200之间设置有光学胶400，所述光学胶400用于将所述拉伸层200固定连接于所述内表面100a。
其中，所述光学胶400可以为OCA(Optically Clear Adhesive)光学胶400，用于胶结透明光学元件(如镜头等)的特种粘胶剂。要求具有无色透明、光透过率在90％以上、胶结强度良好，可在室温或中温下固化，且有固化收缩小等特点。OCA光学胶400是重要触摸屏的原材料之一。OCA光学胶400就是具有光学透明的一层特种无基材的双面胶。
请继续参阅图3，图3是本申请实施例提供的第三种触控装置的结构示意图。所述触控图案300设置在所述拉伸层200靠近所述内表面100a的一侧，所述触控图案300包括若干个触脚部1200，所述触脚部1200用于将所述拉伸层200固定连接于所述内表面100a。
所述触脚部1200具有纤毛形状，并相对于所述拉伸层200以设定的角度倾斜。
请继续参阅图4，图4是本申请实施例提供的第四种触控装置的结构示意图。第四种触控装置10的结构示意图与第一种触控装置10的结构示意图基本相同，不同之处在于，在本实施例中，所述触控图案300远离所述内表面100a的一侧设置有保护层500，所述保护层500用于对所述触控图案300形成绝缘保护。
其中，保护层500可以为绝缘保护油墨，用于对触控图案300形成绝缘保护，防止触控图案300被破坏导致触控失灵的问题。
触控图案300包括若干个呈阵列分布的触控单元310，每个所述触控单元310构成一个触控电极。
具体的，所述保护层500为绝缘材料，呈网状或者是条状结构，用于填充在相邻两个所述触控单元310之间的间隙内，将相邻两个所述触控单元310彼此隔开。可以避免相邻两个触控单元310之间的误接触，从而避免出现触控失灵的情况，有助于提高触控装置10的触控灵敏度。所述保护层500用于对所述触控图案300进行绝缘隔离保护，避免触控图案300受到外界环境中水汽、粉尘等腐蚀和破坏。
请继续参阅图5，图5是本申请实施例提供的第五种触控装置的结构示意图。第五种触控装置10的结构示意图与第一种、第二种和第三种触控装置10的结构示意图基本相同，不同之处在于，在本实施例中，所述触控图案300包括若干个间隔设置的触控单元310，若干个所述触控单元310在所述触控基板100上呈阵列分布。
其中，若干个是指两个或者两个以上，在本实施例中，若干个间隔设置的触控单元310是指两个或者两个以上间隔设置的触控单元310。
其中，部分所述触控单元310构成驱动电极，部分所述触控单元310构成感应电极，所述驱动电极和所述感应电极之间一一对应，所述驱动电极和所述感应电极相互配合完成触控信号的传输，进而实现触控装置10的触控功能。
请继续参阅图6，图6是本申请实施例提供的第六种触控装置的结构示意图。第六种触控装置10的结构示意图与第四种触控装置10的结构示意图基本相同，不同之处在于，在本实施例中，所述触控装置10还包括电极层600和电路板700，所述电极层600包括若干个电极610，所述触控单元310通过所述电极610与所述电路板700电连接，所述电路板700用于控制所述触控单元310实现触控功能。
其中，所述电极610为导电电极610，用于将来自触控单元310的触控信号传输至电路板700，进而通过电路板700控制触控单元310实现相应的触控功能。
当若干个所述触控单元310呈矩阵排列时，每一行的触控单元310均连接至一个电极610，从而使得每一行的触控单元310共用一个电极610，然后将电极610电连接于所述电路板700，从而通过所述电路板700实现对所述触控单元310进行控制，以实现所述触控单元310的触控功能。
请继续参阅图7，图7是本申请实施例提供的第七种触控装置的结构示意图。第七种触控装置10的结构示意图与第六种触控装置10的结构示意图基本相同，不同之处在于，在本实施例中，所述触控装置10还包括连接于所述触控基板100的底壁100c，所述电极层600设置在所述底壁100c上。
在一实施方式中，所述底壁100c同时连接于所述内表面100a和所述外表面100b，若干个所述电极610在所述底壁100c上呈曲线分布。
具体的，当电极层600设置在底壁100c上时，可以将电路板700设置在底 壁100c上，且保持电路板700与电极层600之间的电连接关系，从而通过电路板700对触控单元310进行控制，以实现触控单元310的触控功能。
请继续参阅图8，图8是本申请一较佳实施例提供的电子设备的结构示意图。所述电子设备1包括如上任一实施例提供的触控装置10。
其中，所述电子设备1可以是任何具备触控功能的设备。例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等。
请继续参阅图9，图9是本申请实施例提供的第一种触控装置制备方法的流程示意图。所述触控装置制备方法包括但不限于步骤S100、S200、S300、S400和S500，关于步骤S100、S200、S300、S400和S500参见下面的介绍。
S100：提供触控基板100，所述触控基板100的内表面100a呈曲面形成收容空间100A。具体参见图10。
所述触控基板100可以为刚性基板，例如为玻璃基板；可选的，所述触控基板100还可以为柔性基板，例如，所述柔性基板由聚酰亚胺薄膜(PI)或聚酯薄膜与铜箔复合而成。由于聚酰亚胺耐高温锡焊、高强度、阻燃等优良性能，聚酰亚胺作为高分子材料具有突出的热稳定性，良好的耐辐射和化学稳定性和优良的力学性能。
所述触控基板100呈现弯曲状，具有弯曲的内表面100a，所述内表面100a形成收容空间100A。
在提供触控基板100的同时，需要对所述触控基板100的质量进行检测，确保所述触控基板100是符合质量要求的，如果所述触控基板100不符合质量标准，就要考虑更换触控基板100，以确保制备出来的触控装置10达到正常指标。
具体的，检测所述触控基板100是否达到质量标准的方法可以为红外探测，采用红外探测仪对所述触控基板100进行探测，并接受探测的数据，若探测到的数据中，有局部位置的数据明显偏小，则可以认为该区域有裂缝或者是空洞，认为该触控基板100是不符合质量标准的，因此，需要考虑更换触控基板100，从而保证制备成的触控装置10的质量。
对提供的所述触控基板100抽样检测。
本实施方式中，在提供多个所述触控基板100后，对所述触控基板100进行抽样。所述触控基板100的抽样方法可以是，在预设周期内抽取预设数量的所述触控基板100，测量预设数量的所述触控基板100的尺寸，判断预设数量的触控基板100的尺寸是否在允许值范围内。若所述触控基板100的尺寸在允许值范围内，则进行下一步骤。若所述触控基板100的尺寸超出允许值范围，则调整制备所述触控基板100的制备参数等，以期得到合格的所述触控基板100。
S200：提供触控基材800，所述触控基材800包括拉伸层200以及位于所述拉伸层200的一侧的触控图案300。具体参见图11和图12。
其中，拉伸层200由可拉伸基材形成，触控图案300通过对位于拉伸层200一侧的涂料层1000图案化形成。触控基材800包括拉伸层200和涂料层1000，但不仅限于包括拉伸层200和涂料层1000。所述拉伸层200可以与所述涂料层1000直接接触，所述拉伸层200也可以与所述涂料层1000间接接触。
所述涂料层1000包括若干个间隔排布的涂料单元1001，所述光学胶400包括覆盖所述涂料单元1001的胶体单元401，所述胶体单元401与所述涂料单元1001一一对应，所述胶体单元401用于将对应的所述涂料单元1001固定连接于所述触控基板100。
涂料层1000材料为可拉伸导电混合体系，为树脂与导电成分的复合材料。其中，树脂为连续相，可拉伸，即所述树脂具弹性，而导电成分为分散相，能够进行导电。其中，在本实施方式中，涂料层1000为移印导电涂料，能够在加热的条件下，转移到触控基板内表面。所述涂料层1000通过网版印刷以及黄光工艺等方式制作在所述拉伸层200上。
优选的，所述触控装置制备方法还包括在拉伸层上形成保护层，保护层设置于触控图案远离内表面的一侧。请参阅图17，保护层500设置于涂料层1000远离内表面100a的一侧，即拉伸层200上方，所述保护层500用于对所述涂料层1000形成绝缘保护。保护层500可以为绝缘保护油墨，用于对触控图案300形成绝缘保护，防止触控图案300被破坏导致触控失灵的问题。
S300：将所述触控基材800放置于所述收容空间100A内。继续参见图11。
具体的，将拉伸层200和涂料层1000一并放置在所述收容空间100A内，且使得所述拉伸层200和所述涂料层1000正对所述触控基板100的内表面100a。在本实施方式中，所述涂料层1000相对于所述拉伸层200邻近所述内表面100a设置。
S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上。具体参见图9和图12。
其中，对所述触控基材800进行处理包括两个方面的处理，第一，对触控基材800进行加压及加热处理；第二，对触控基材800进行减压处理。关于这两个方面的处理具体介绍如下。
通过对触控基材800进行加压及加热处理，在拉伸层200的拉伸作用下，使得触控基材800挤压所述触控基板100的内表面100a，然后保持加压状态预设时间，使得涂料层1000对触控基板100的内表面100a形成持续的挤压力度，这是触控图案300的制作过程中较为重要的一个步骤。
其中，对所述触控基材800进行加压处理的次数可以为一次，也可以为多次。具体的，可以通过喷射气体、注射液体或者使得固体膨胀的方式对所述触控基材800进行加压处理。此处不做过多讲解，后面会进行详细说明。
其中，对所述触控基材800保持加压状态预设时间，所述预设时间足以使得涂料层1000在触控基材800上形成的触控图案300通过热转印完全粘结在触控基板100的内表面100a，从而避免触控图案300的不完整性引起的触控失灵问题。预设时间可以通过多次实验数据获得，从而确保通过涂料层1000制作形成的触控图案300具备完善的触控功能。
对触控基材800减压处理，进行减压的次数可以为一次，也可以为多次。具体的，可以通过吸收空气的方式对触控基材800进行减压处理，通过拉伸层200的收缩，从而使得涂料层1000粘结在所述触控基板100的内表面100a上，以构成触控图案300，同时拉伸层200被剥离。
请继续参阅图13，图13是本申请实施例提供的第二种触控装置制备方法的局部流程示意图。所述步骤S300“将所述触控基材800放置于所述收容空间100A内”包括但不限于步骤S310，所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S410，关于步骤S310和S410介绍如下。
S310：将所述触控基材800放置于所述收容空间100A内时，所述涂料层1000 相对所述拉伸层200更加邻近所述内表面100a。
即使得所述涂料层1000朝向所述触控基板100的内表面100a设置。
S410：对所述触控基材800进行加压及加热处理，以使得所述涂料层1000贴合于所述触控基板100的内表面100a。
由于涂料层1000相对拉伸层200更加邻近所述内表面100a设置，从而可以对拉伸层200远离所述涂料层1000的一侧进行加压处理，通过拉伸层200的膨胀拉伸作用，使得涂料层1000覆盖在所述内表面100a上，且对所述内表面100a形成一定的挤压力度。具体的，可以对拉伸层200进行均匀的加压及加热处理，使得拉伸层200在高温下具备粘性，进而使得涂料层1000在所述拉伸层200的牵引下，均匀的粘结于触控基板100的内表面100a上，从而可以确保制作得到的触控图案300较为完整，有助于保证触控装置10的触控功能的灵敏度。
请继续参阅图14，图14是本申请实施例提供的第三种触控装置制备方法的局部流程示意图。所述触控基材800还包括位于所述涂料层1000和所述拉伸层200之间的保护层500，所述保护层500用于对所述涂料层1000形成绝缘保护。
其中，保护层500可以为绝缘保护油墨，用于对触控图案300形成绝缘保护，防止触控图案300被破坏导致触控失灵的问题。
具体的，所述保护层500为绝缘材料，呈网状或者是条状结构，所述保护层500用于对所述触控图案300进行绝缘隔离保护，避免触控图案300受到外界环境中水汽、粉尘等腐蚀和破坏。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S420，关于步骤S420介绍如下。
S420：对所述触控基材800进行加压及加热处理，以使得所述涂料层1000、所述保护层500和所述拉伸层200挤压所述触控基板100的内表面100a。具体参见图15。
由于涂料层1000相对拉伸层200更加邻近所述内表面100a设置，保护层500位于拉伸层200与涂料层1000之间，从而可以对拉伸层200远离所述涂料层1000的一侧进行加压及加热处理，通过拉伸层200的膨胀拉伸作用，使得涂料层1000、保护层500和拉伸层200覆盖在所述内表面100a上，且对所述内表面100a形成一定的挤压力度。具体的，可以对拉伸层200进行均匀的加压及加热处理，使得拉伸层200在高温下具备粘性并形成均匀的膨胀效果，进而使得涂料层1000、保护层500和拉伸层200在所述拉伸层200的牵引下，均匀的覆盖于触控基板100的内表面100a上，从而可以确保制作得到的触控图案300较为完整，有助于保证触控装置10的触控功能的灵敏度。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S421，关于步骤S421介绍如下。
S421：对所述触控基材800进行减压处理，以使得所述拉伸层200粘结在所述触控基板100的内表面100a上，或使得所述触控图案300粘结在所述触控基板100的内表面100a上。
其中，对拉伸层200进行减压处理的次数可以为一次，也可以为多次。对所述拉伸层200进行减压处理的过程可以匀速进行，从而使得涂料层1000和保护 层500可以均匀的粘结在触控基板100的内表面100a上，所述涂料层1000构成所述触控图案300，所述保护层500用于对所述触控图案300进行绝缘隔离保护，避免触控图案300受到外界环境中水汽、粉尘等腐蚀和破坏。
请继续参阅图16，图16是本申请实施例提供的第四种触控装置制备方法的局部流程示意图。所述触控基材800还包括位于所述涂料层1000和所述拉伸层200之间的保护层500，以及覆盖所述涂料层1000的光学胶400。
其中，所述光学胶400可以为OCA(Optically Clear Adhesive)光学胶400，用于胶结透明光学元件(如镜头等)的特种粘胶剂。要求具有无色透明、光透过率在90％以上、胶结强度良好，可在室温或中温下固化，且有固化收缩小等特点。OCA光学胶400是重要触摸屏的原材料之一。OCA光学胶400就是具有光学透明的一层特种无基材的双面胶。
所述步骤“S300：将所述触控基材800放置于所述收容空间100A内”包括但不限于步骤S320，关于步骤S320介绍如下。
S320：将所述触控基材800放置于所述收容空间100A时，所述光学胶400相对所述涂料层1000更加邻近所述内表面100a。具体参见图17。
即所述光学胶400位于所述涂料层1000更加邻近所述内表面100a设置。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S430，关于步骤S430介绍如下。
S430：对所述触控基材800进行加压及加热处理，以使得所述光学胶400、所述涂料层1000、所述保护层500和所述拉伸层200挤压所述触控基板100的内表面100a。
由于光学胶400、涂料层1000和保护层500相对拉伸层200更加邻近所述内表面100a设置，从而可以对拉伸层200远离所述光学胶400、涂料层1000和保护层500的一侧进行加压及加热处理，通过拉伸层200的膨胀拉伸作用，使得光学胶400、涂料层1000、保护层500和拉伸层200覆盖在所述内表面100a上，且对所述内表面100a形成一定的挤压力度。具体的，可以对拉伸层200进行均匀的加压及加热处理，使得拉伸层200形成均匀的膨胀效果，进而使得光学胶400、涂料层1000和保护层500在所述拉伸层200的牵引下，均匀的覆盖于触控基板100的内表面100a上，从而可以确保制作得到的触控图案300较为完整，有助于保证触控装置10的触控功能的灵敏度。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S432，关于步骤S432介绍如下。
S432：对所述触控基材800进行减压处理，以使得所述触控基材800通过所述光学胶400粘结在所述触控基板100的内表面100a上。
其中，对拉伸层200进行减压处理的次数可以为一次，也可以为多次。对所述拉伸层200进行减压处理的过程可以匀速进行，从而使得涂料层1000和保护层500可以均匀的粘结在触控基板100的内表面100a上，所述涂料层1000构成所述触控图案300，所述保护层500用于对所述触控图案300进行绝缘隔离保护，避免触控图案300受到外界环境中水汽、粉尘等腐蚀和破坏。
请继续参阅图18，图18是本申请实施例提供的第五种触控装置制备方法的 局部流程示意图。在所述步骤“S300：将所述触控基材800放置于所述收容空间100A内”之前，所述触控装置制备方法还包括但不限于步骤S250和S260，关于步骤S250和S260的详细介绍如下。
S250：将所述涂料层1000划分为若干个间隔排布的涂料单元1001。
对所述涂料层1000进行蚀刻处理，以形成若干个间隔设置的涂料单元1001，每个涂料单元1001用于制成一个触控单元。
S260：形成覆盖所述涂料单元1001的胶体单元401，所述胶体单元401与所述涂料单元1001一一对应，若干个所述胶体单元401之间间隔排布构成所述光学胶400。
其中，一个胶体单元401对应一个涂料单元1001，胶体单元401用于将涂料单元1001固定连接于触控基板100的内表面100a。
其中，所述光学胶400可以为OCA(Optically Clear Adhesive)光学胶400，用于胶结透明光学元件(如镜头等)的特种粘胶剂。要求具有无色透明、光透过率在90％以上、胶结强度良好，可在室温或中温下固化，且有固化收缩小等特点。OCA光学胶400是重要触摸屏的原材料之一。OCA光学胶400就是具有光学透明的一层特种无基材的双面胶。
请继续参阅图19，图19是本申请实施例提供的第六种触控装置制备方法的局部流程示意图。
所述步骤“S300：将所述触控基材800放置于所述收容空间100A内”包括但不限于步骤S330，关于步骤S330介绍如下。
S330：将所述触控基材800放置于所述收容空间100A内时，所述拉伸层200相对所述涂料层1000靠近所述内表面100a。
即所述拉伸层200位于所述涂料层1000与所述触控基板100的内表面100a之间。
请继续参阅图20，图20是本申请实施例提供的第七种触控装置制备方法的局部流程示意图。所述触控基材800还包括位于所述拉伸层200远离所述涂料层1000一侧的光学胶400，以及位于所述涂料层1000远离所述拉伸层200一侧的保护层500。
其中，保护层500可以为绝缘保护油墨，用于对触控图案300形成绝缘保护，防止触控图案300被破坏导致触控失灵的问题。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S440，关于步骤S440介绍如下。
S440：对所述触控基材800进行加压及加热处理，以使得所述光学胶400、所述拉伸层200、所述涂料层1000和所述保护层500挤压所述内表面100a。具体参见图21。
由于拉伸层200相对涂料层1000更加邻近所述内表面100a设置，从而可以对涂料层1000远离所述拉伸层200的一侧进行加压处理，通过拉伸层200的膨胀拉伸作用，使得涂料层1000和拉伸层200覆盖在所述内表面100a上，且对所述内表面100a形成一定的挤压力度。具体的，可以对涂料层1000进行均匀的加压及加热处理，通过涂料层1000对拉伸层200的挤压，使得拉伸层200形成均匀的膨胀效果，进而使得涂料层1000在所述拉伸层200的牵引下，均匀的覆盖于触控基板100的内表面100a上，从而可以确保制作得到的触控图案300较为 完整，有助于保证触控装置10的触控功能的灵敏度。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S441，关于步骤S441介绍如下。
S441：对所述触控基材800进行减压处理，以使得所述光学胶400、所述拉伸层200、所述涂料层1000和所述保护层500粘结在所述内表面100a上。
其中，对保护层500进行减压处理的次数可以为一次，也可以为多次。对所述保护层500进行减压处理的过程可以匀速进行，从而使得所述涂料层1000和所述保护层500可以均匀的粘结在触控基板100的内表面100a上，所述涂料层1000构成所述触控图案300，所述保护层500用于对所述触控图案300进行绝缘隔离保护，避免触控图案300受到外界环境中水汽、粉尘等腐蚀和破坏。
请继续参阅图22，图22是本申请实施例提供的第八种触控装置制备方法的局部流程示意图。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S450，关于步骤S450介绍如下。
S450：在所述触控基材800远离所述内表面100a的一侧朝向所述内表面100a的方向进行吹气，且使得吹气的速度保持一致，其中吹出气体的温度高于预设温度。
其中，吹气的过程中也伴随着加热的过程，因此，吹出气体的温度高于某一预设温度。
实现吹气的装置可以是吹气机、高压喷嘴、气枪等等器械。本申请对实现吹气的方式不做限定，只要不违背本申请技术方案的本意，都在本申请要求保护的范围内，都认为是满足条件的吹气方式。
举例而言，采用加压治具对所述触控基材800进行加压处理，所述加压治具上开设有若干个加压孔，通过若干个加压孔对触控基材800施加压力，从而使得触控基材800贴合于触控基板100的内表面100a，进而获得较为良好的触控图案300，有助于提高触控装置10的触控灵敏度。
特别说明的是，本申请对于吹气装置的个数不做限定，可以有一个吹气装置，也可以有多个吹气装置，具体的，可以结合填胶时候的效果来确定吹气装置的个数。
此外，需要特别说明的是，本申请对于吹气的次数也不做限定，吹气次数可以是一次，也可以是多次，具体的，可以结合触控基材800贴合内表面100a时候的效果来确定吹气次数。且在对所述触控基材800远离所述内表面100a的一侧朝向所述内表面100a的方向吹气时，可以实现对所述触控基材800进行加压及加热处理，从而可以帮助所述触控基材800更好的朝向预设方向运动，从而使得触控基材800贴合于触控基板100的内表面100a。
此外，还需要特别说明的是，向所述触控基材800远离所述内表面100a的一侧朝向所述内表面100a的方向吹气的方向是可以改变的，向所述触控基材800远离所述内表面100a的一侧朝向所述内表面100a的方向吹气的方向可以是垂直于所述内表面100a，也可以是与所述内表面100a保持相切，还可以是与所述内表面100a呈一定角度的，本申请对向所述触控基材800远离所述内表面100a的 一侧朝向所述内表面100a的方向进行吹气不做限定，任意的吹气方向，只要不违背本申请技术方案的本意，都在本申请要求保护的范围内，都认为是满足条件的吹气方式。举例而言，如果所述内表面100a呈弧形延伸，则可以沿着所述内表面100a的延伸方向对所述触控基材800进行吹气，这样就可以使得所述触控基材800沿着所述内表面100a的延伸方向运动，进而达到快速贴合所述触控基板100的内表面100a的目的。
请继续参阅图23，图23是本申请实施例提供的第九种触控装置制备方法的局部流程示意图。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S460，关于步骤S460介绍如下。
S460：在所述触控基材800远离所述内表面100a的一侧朝向所述内表面100a的方向注射流体，且所述流体的温度高于预设温度。
其中，流体可以为水，还可以为其它液体介质。
通过检测触控基材800与触控基板100的内表面100a之间的距离，建立对所述触控基材800进行加压处理的数学模型，然后对触控基材800远离所述内表面100a的一侧进行加压处理。
在一实施方式中，对所述触控基材800施加的压强大小与所述触控基材800与所述内表面100a之间的距离呈正相关。即触控基材800与所述内表面100a之间的距离越大，施加给所述触控基材800的压强值越大，从而可以根据所述触控基板100的内表面100a的形状轮廓灵活的对施加至触控基材800的压强值进行调整，以确保获取到较为完整的触控图案300，有助于提升触控装置10的触控灵敏度。
进一步的，当所述流体的温度高于预设温度时，可以提高拉伸层200的膨胀速度，从而有助于缩短触控基材800贴合于所述触控基板100的内表面100a的速度，有助于缩短制备触控装置10的周期。且当所述流体的温度高于预设温度时，可以使得涂料层1000完整的铺平，更有助于获取到较为完整的触控图案300，有助于提升触控装置10的灵敏度。
请继续参阅图24，图24是本申请实施例提供的第十种触控装置制备方法的局部流程示意图。
所述步骤“S400：对所述触控基材800进行处理，以使得所述触控基材800挤压所述触控基板100的内表面100a，从而使所述触控图案300或所述拉伸层200粘结在所述触控基板100的内表面100a上”包括但不限于步骤S470和S480，关于步骤S470和S480介绍如下。
S470：在所述触控基材800远离所述内表面100a的一侧朝向所述内表面100a的方向注射流体。
关于步骤S470参见步骤S460的介绍，此处不再赘述。
S480：对所述流体进行降温，以使得所述流体固化膨胀为凝固件，所述凝固件用于将所述触控基材800抵持于所述内表面100a。
通过对流体进行降温使得流体凝固形成凝固件，根据液体冻结形成的凝固件的体积会增大，从而使得触控基材800抵持于触控基板100的内表面100a，从而使得获取到较为完整的触控图案300，有助于提升触控装置10的触控灵敏度。
进一步的，对所述流体进行降温处理时，控制降温的速度保持均匀一致，从 而使得流体均匀的冻结形成凝固件，从而使得触控基材800均匀的抵持于触控基板100的内表面100a，从而使得获取到较为完整的触控图案300，有助于提升触控装置10的触控灵敏度。
请继续参阅图25，图25是本申请实施例提供的第十一种触控装置制备方法的局部流程示意图。
所述触控装置制备方法还包括但不限于步骤S210、S220和S230，关于步骤S210、S220和S230的详细介绍如下。
S210：对位于所述拉伸层200的一侧的涂料层1000进行图案化处理，以使得所述涂料层1000形成若干个触脚部1200。具体参见图26。
所述触控图案300包括若干个触脚部1200，所述触脚部1200具有纤毛形状，并相对于所述拉伸层200以设定的角度倾斜，所述触脚部1200用于将所述触控基材800固定连接于所述触控基板100的内表面100a。
其中，将涂料层1000远离所述拉伸层200的表面做成若干个触脚部1200，且呈现绒毛状的凸起，这些触脚部1200可通过范德瓦尔斯键提供强粘附力。
范德瓦尔斯键原理：当两个原子彼此靠近时，围绕每个原子的原子核的电子云产生变化，使得弱静电吸引被产生以具有对两个原子的粘附力。两个原子之间的静电吸引是弱的，然而，如果存在多个触脚部1200并且每个触脚部1200的末端开裂，则由每个触脚部1200产生的吸引强度被聚集，从而增加其引力度。
S220：对所述拉伸层200进行加压及加热处理，以使得所述触脚部1200挤压所述内表面100a。
由于涂料层1000相对拉伸层200更加邻近所述内表面100a设置，从而可以对拉伸层200远离所述涂料层1000的一侧进行加压处理，通过拉伸层200的膨胀拉伸作用，使得涂料层1000和拉伸层200覆盖在所述内表面100a上，且使得所述触脚部1200对所述内表面100a形成一定的挤压力度。具体的，可以对拉伸层200进行均匀的加压及加热处理，通过拉伸层200对涂料层1000的挤压，使得涂料层1000形成均匀的膨胀效果，进而使得涂料层1000在所述拉伸层200的牵引下，使得触脚部1200均匀的吸附于触控基板100的内表面100a上，从而可以确保制作得到的触控图案300较为完整，且使得触控图案300可以牢牢附着在触控基板100的内表面100a上，有助于保证触控装置10的触控功能的灵敏度。
S230：对所述拉伸层200进行减压处理，以使得若干个所述触脚部1200连接于所述内表面100a。
其中，对拉伸层200进行减压处理的次数可以为一次，也可以为多次。对所述拉伸层200进行减压处理的过程可以匀速进行，从而使得所述涂料层1000和所述拉伸层200可以均匀的粘结在触控基板100的内表面100a上，所述涂料层1000构成所述触控图案300，所述拉伸层200用于对所述触控图案300提供吸附力，避免触控图案300从所述触控基板100的内表面100a上脱落下来，使得触控图案300可以牢牢附着在触控基板100的内表面100a上，有助于保证触控装置10的触控功能的灵敏度。
请继续参阅图27和图28，图27是本申请实施例提供的第一种加压治具的结构示意图。图28是本申请实施例采用加压治具制备触控装置的示意图。
所述加压治具2000用于对上述任一实施例中提供的触控基材800进行加压处理。
所述加压治具2000上具有若干个加压孔2100，当采用所述加压治具2100对所述触控基材800进行加压处理时，所述加压孔2100正对所述触控基材800 设置。
所述加压孔2100在所述加压治具2000的表面呈均匀分布。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以权利要求的保护范围为准。

Claims (24)

  1. 一种触控装置，其特征在于，所述触控装置包括触控基板，所述触控基板具有相对设置的内表面和外表面，所述内表面为曲面，所述内表面的一侧设置有拉伸层，所述拉伸层的一侧设置有触控图案，所述拉伸层可产生变形，以将所述触控图案连接于所述触控基板，所述外表面构成所述触控装置的触控接触面。
  2. 如权利要求1所述的触控装置，其特征在于，所述触控基板的内表面为不规则曲面。
  3. 如权利要求2所述的触控装置，其特征在于，所述内表面和所述拉伸层之间设置有光学胶，所述光学胶用于将所述拉伸层固定连接于所述内表面。
  4. 如权利要求2所述的触控装置，其特征在于，所述触控图案设置在所述拉伸层靠近所述内表面的一侧，所述触控图案包括若干个触脚部，所述触脚部用于将所述拉伸层固定连接于所述内表面。
  5. 如权利要求4所述的触控装置，其特征在于，所述触脚部具有纤毛形状，并相对于所述拉伸层以设定的角度倾斜。
  6. 如权利要求1所述的触控装置，其特征在于，所述触控图案远离所述内表面的一侧设置有保护层，所述保护层用于对所述触控图案形成绝缘保护。
  7. 如权利要求1-6任一项所述的触控装置，其特征在于，所述触控图案包括若干个间隔设置的触控单元，若干个所述触控单元在所述触控基板上呈阵列分布。
  8. 如权利要求7所述的触控装置，其特征在于，所述触控装置还包括电极层和电路板，所述电极层包括若干个电极，所述触控单元通过所述电极与所述电路板电连接，所述电路板用于控制所述触控单元实现触控功能。
  9. 如权利要求8所述的触控装置，其特征在于，所述触控装置还包括连接于所述触控基板的底壁，所述电极层设置在所述底壁上。
  10. 一种电子设备，其特征在于，所述电子设备包括如权利要求1-9任一项所述的触控装置。
  11. 一种触控装置制备方法，其特征在于，所述触控装置制备方法包括：
    提供触控基板，所述触控基板的内表面呈曲面形成收容空间；
    提供触控基材，所述触控基材包括拉伸层以及位于所述拉伸层的一侧的触控图案；
    将所述触控基材放置于所述收容空间内；
    对所述触控基材进行处理，以使得所述触控基材挤压所述触控基板的内表面，从而使所述触控图案或所述拉伸层粘结在所述触控基板的内表面上。
  12. 如权利要求11所述的触控装置制备方法，其特征在于，当所述触控图案直接粘结于所述触控基板的内表面上时，所述触控装置制备方法还包括：剥离所述拉伸层。
  13. 如权利要求11所述的触控装置制备方法，其特征在于，所述“对所述触控基材进行处理，以使得所述触控基材挤压所述触控基板的内表面”包括：对所述触控基材进行加压及加热处理，以使得所述触控基材挤压所述触控基板的内表面。
  14. 如权利要求11所述的触控装置制备方法，其特征在于，所述“对所述触控基材进行处理，使得所述触控图案粘结在所述触控基板的内表面上”包括：对所述触控基材进行减压处理，使得所述拉伸层粘结在所述触控基板的内表面上， 或使得所述触控图案粘结在所述触控基板的内表面上。
  15. 如权利要求11所述的触控装置制备方法，其特征在于，所述触控基材还包括光学胶，将所述触控基材放置于所述收容空间时，所述光学胶位于所述触控基材靠近所述触控基板内表面一侧；
    对所述触控基材进行加压及加热处理，以使得所述触控基材挤压所述触控基板的内表面；
    对所述触控基材进行减压处理，使得所述触控基材通过光学胶粘结在所述触控基板的内表面上。
  16. 如权利要求11所述的触控装置制备方法，其特征在于，所述触控图案包括若干个触脚部，所述触脚部具有纤毛形状，并相对于所述拉伸层以设定的角度倾斜，所述触脚部用于将所述触控基材固定连接于所述触控基板的内表面。
  17. 如权利要求11所述的触控装置制备方法，其特征在于，还包括在所述拉伸层上形成保护层，所述保护层设置于所述触控图案远离所述内表面一侧，所述保护层用于对所述触控图案形成绝缘保护。
  18. 如权利要求15所述的触控装置制备方法，其特征在于，将所述触控基材放置于所述收容空间之前，所述触控装置制备方法还包括：
    将涂料层划分为若干个间隔排布的涂料单元；
    形成覆盖所述涂料单元的胶体单元，所述胶体单元与所述涂料单元一一对应，若干个所述胶体单元之间间隔排布构成所述光学胶。
  19. 如权利要求11所述的触控装置制备方法，其特征在于，所述“对所述触控基材进行处理”包括：
    在所述触控基材远离所述内表面的一侧朝向所述内表面的方向进行吹气，且使得吹气的速度保持一致，其中，吹出气体的温度高于预设温度。
  20. 如权利要求11所述的触控装置制备方法，其特征在于，所述“对所述触控基材进行处理”包括：
    在所述触控基材远离所述内表面的一侧朝向所述内表面的方向注射流体，且所述流体的温度高于预设温度。
  21. 如权利要求11所述的触控装置制备方法，其特征在于，所述“对所述触控基材进行处理”包括：
    在所述触控基材远离所述内表面的一侧朝向所述内表面的方向注射流体；
    对所述流体进行降温，以使得所述流体固化膨胀为凝固件，所述凝固件用于将所述触控基材抵持于所述内表面。
  22. 一种加压治具，其特征在于，所述加压治具用于对权利要求11-21任一项中的触控基材进行加压处理。
  23. 如权利要求22所述的加压治具，其特征在于，所述加压治具上具有若干个加压孔，当采用所述加压治具对所述触控基材进行加压处理时，所述加压孔正对所述触控基材设置。
  24. 如权利要求23所述的加压治具，其特征在于，所述加压孔在所述加压治具的表面呈均匀分布。
PCT/CN2019/073893 2019-01-30 2019-01-30 触控装置、电子设备、触控装置制备方法及加压治具 Ceased WO2020154949A1 (zh)

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