WO2020143127A1 - 芯片绑定区域的结构及显示面板 - Google Patents

芯片绑定区域的结构及显示面板 Download PDF

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Publication number
WO2020143127A1
WO2020143127A1 PCT/CN2019/082857 CN2019082857W WO2020143127A1 WO 2020143127 A1 WO2020143127 A1 WO 2020143127A1 CN 2019082857 W CN2019082857 W CN 2019082857W WO 2020143127 A1 WO2020143127 A1 WO 2020143127A1
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Prior art keywords
opening
film layer
organic film
chip
display panel
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PCT/CN2019/082857
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English (en)
French (fr)
Inventor
吴焕达
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深圳市华星光电半导体显示技术有限公司
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Publication of WO2020143127A1 publication Critical patent/WO2020143127A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels

Definitions

  • the present invention relates to the field of display technology, in particular to a structure of a chip binding area and a display panel.
  • a thin film transistor Thin Film Transistor, TFT for short
  • TFT Thin Film Transistor
  • the manufacturing process of the circuit board module includes bonding the chip to the glass substrate of the display panel, or bonding the flexible circuit with the driving circuit to the display panel.
  • the assembly of the display panel, the flexible circuit board, and the chip module is fixed by conductive adhesive.
  • space is reserved in advance for the chip binding according to the chip binding position.
  • the chip binding position of the conventional display panel is in the shape of a rectangular frame, which is used for coating conductive adhesive inside.
  • the purpose of the present invention is to provide a structure of a chip binding area, which can effectively reduce the process of binding the chip to the binding reserved area of the substrate, causing bubbles to occur between the conductive adhesive film and the binding reserved area Residue.
  • the present invention provides a structure of a chip binding area for binding a driving chip of a display panel.
  • the structure of the chip binding area includes: a glass substrate; and an organic film layer provided on the glass substrate, and the organic film layer has an opening for accommodating the driving chip; wherein the At least one channel is provided around the opening of the organic film layer, and the at least one channel extends into the organic film layer and communicates with the opening.
  • the present invention further provides a display panel including a structure of a chip binding area.
  • the structure of the chip binding area includes: a glass substrate; and an organic film layer provided on the glass substrate, and the organic film layer has An opening for accommodating the driving chip; wherein the organic film layer is provided with at least one channel around the opening, the at least one channel extends into the organic film layer and communicates with the Opening.
  • the opening portion includes four end portions, and the organic film layer is respectively provided with the channels adjacent to the four end portions.
  • At least one other channel is provided between any two ends of the opening.
  • the channels of the four end portions respectively extend obliquely by a predetermined distance from the corresponding end portions.
  • the opening has a rectangular configuration, and at least one of the channels is provided on each side of the organic film layer adjacent to the opening.
  • the organic film layer is made of polyimide
  • the driving chip is bound to the glass substrate through a conductive adhesive film, relative to the opening of the organic film layer Within the ministry.
  • the structure of the chip binding area of the present invention utilizes the design of the channel around the opening so that the bubbles in the conductive adhesive film can be discharged from the channel, effectively reducing the bubbles remaining in the conductive adhesive film and ensuring The reliability and stable binding of the electrical conduction of the driving chip are described.
  • the structure of the chip binding area of the present invention effectively solves the problems of traditional bubbles that are likely to cause bubbles in the conductive adhesive film, which further affects the reliability of chip electrical conduction and the stability of chip binding.
  • FIG. 1 is a schematic cross-sectional view of a structure of a chip bonding area according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic plan view of the structure of a chip binding area according to a preferred embodiment of the present invention.
  • FIG. 3 is a three-dimensional exploded schematic view of the structure of the chip binding area and the chip binding according to the present invention.
  • FIG. 4 is a schematic plan view of a structure of a chip bonding area according to another preferred embodiment of the present invention.
  • FIG. 5 is a schematic plan view of a structure of a chip binding area according to another preferred embodiment of the present invention.
  • FIG. 6 is a schematic plan view of a display panel according to a preferred embodiment of the present invention.
  • the invention is a structure of a chip binding area, which is used to bind a driving chip of a display panel, wherein the driving chip is used to control and provide signals of pixel units of the display panel.
  • the interface connection between the driving chip and the display panel may adopt the COG process (Chip On Glass, COG) in which the chip is directly bound to the glass substrate, or the chip is directly bound in the flexible COB process (ChipOn Board, COB) on the circuit board.
  • COG Chip On Glass
  • COB ChipOn Board
  • the display panel of the present invention may be a general liquid crystal display panel or an organic light emitting diode display panel, which includes a base substrate, an array substrate, or a light emitting mold layer (not shown), and the detailed film structure will not be described here Special Note.
  • FIG. 1 is a schematic cross-sectional view of a structure of a chip bonding area according to a preferred embodiment of the present invention.
  • the structure of the chip binding area of the present invention includes a glass substrate 1 and an organic film layer 2 disposed on the glass substrate 1, wherein the organic film layer 2 is polyimide (PI) ), but not limited to this.
  • the organic film layer 2 has an opening 20 for accommodating the driving chip 3.
  • the driving chip 3 is bound to the opening 20 of the glass substrate 1 relative to the organic film layer 2 through a conductive adhesive film 31, wherein the conductive adhesive film 31 is anisotropic conductive adhesive (Anisotropic Conductive Film) , ACF), and the glass substrate 1 is provided with a metal contact portion (not shown) corresponding to the chip electrode at the corresponding binding position.
  • a conductive adhesive film 31 is anisotropic conductive adhesive (Anisotropic Conductive Film) , ACF)
  • ACF anisotropic Conductive Film
  • FIG. 2 is a schematic plan view of the structure of a chip binding area according to a preferred embodiment of the present invention.
  • the shape and size of the opening 20 depend on the outline of the driving chip 3, and the area of the opening 20 is equal to or larger than the area of the driving chip 3.
  • the organic film layer 2 is provided with at least one channel 21 adjacent to the opening 20, which extends into the organic film layer 2 and communicates with the opening 20.
  • the opening portion 20 includes four end portions 201, and the organic film layer 2 is provided with the channels 21 adjacent to the four end portions 201, and each of the channel 21 is respectively formed by a corresponding
  • the end portion 201 extends obliquely for a predetermined distance.
  • the channels 21 of the four end portions 201 are respectively inclined outward and form an angle of 45 degrees with the horizontal line.
  • FIG. 3 is a three-dimensional exploded schematic view of the structure of the chip binding area and the chip binding according to the present invention.
  • the driving chip 3 is adhesively bound in the opening 20 by the conductive adhesive film 31. Because the conductive adhesive film will be affected by the curing temperature and affect the curing rate, it will more or less cause the generation of bubbles.
  • the conductive adhesive film will be adhered to the opening portion 20 on the glass substrate 1, since the shape and size of the opening portion 20 match the driving chip 3, the bubbles cannot naturally flow to the opening portion 20 The discharge of the surrounding, and the reliability of the video chip electrically conductive.
  • the channels 21 of the four end portions 201 of the present invention can effectively provide the bubbles to be discharged from the conductive adhesive film 31.
  • the driving chip 3 is bound in the opening 20 by an appropriate pressure, the pressure will cause the bubbles to squeeze out all around, and the arrangement of the channels 21 of the four end portions 201 can exert the maximum effect Discharge the air bubbles to ensure the stability of the binding and the reliable electrical connection between the chip and the ACF.
  • FIG. 4 is a schematic plan view of a structure of a chip bonding area according to another preferred embodiment of the present invention.
  • the opening 20 has a rectangular configuration according to the configuration of the driving chip.
  • Each short side of the organic film layer 2 adjacent to the opening 20 is provided with one of the channels 21, and each long side of the adjacent opening 20 is provided with two of the channels 21, the channels 21
  • the opening 20 extends outward into the organic film layer 2.
  • FIG. 5 is a schematic plan view of a structure of a chip binding area according to another preferred embodiment of the present invention. At least one other channel 21 is provided between any two adjacent end portions 201 of the organic film layer 2, and the channel 21 extends outward from the opening 20 into the organic film layer 2.
  • the aforementioned channel 21 shown in FIG. 4 and FIG. 5 has the same function as the channel of the embodiment shown in FIG. 2, that is, to discharge air bubbles generated by the ACF due to chip binding.
  • the structure of the chip binding area of the present invention is designed by using the channel 21 around the opening 20, so that the bubbles in the conductive adhesive film 31 can be discharged from the channel 21, effectively reducing the bubbles remaining in the conductive adhesive film Within 31, the reliability and stable binding of the electrical conduction of the driving chip 3 are ensured.
  • the structure of the chip binding area of the present invention effectively solves the problems of traditional bubbles that are likely to cause bubbles in the conductive adhesive film, which further affects the reliability of chip electrical conduction and the stability of chip binding.
  • the invention additionally provides a display panel.
  • the display panel 10 of the present invention includes a structure of a chip binding area.
  • the display panel 10 includes an effective display area 101 located in a frame portion and a non-effective display area 102 surrounding the effective display area 101, wherein the chip binding area is located in the non-effective display area 102.
  • the structure of the chip binding area of the display panel 10 has been described in detail in the foregoing embodiments, and will not be repeated here.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)

Abstract

一种芯片绑定区域的结构，用于绑定显示面板的驱动芯片。芯片绑定区域的结构包括玻璃基板及设于玻璃基板上的有机膜层。有机膜层具有一开口部，其用于容置驱动芯片。有机膜层相邻开口部的周围设有至少一通道，其延伸进入有机膜层并连通所述开口部。

Description

芯片绑定区域的结构及显示面板 技术领域
本发明涉及显示技术领域，特别是涉及一种芯片绑定区域的结构及显示面板。
 背景技术
随着显示技术发展，平板显示早已成为当下主流显示器件所用。在平板显示装置中，无论是液晶显示面板或是有机发光二极管显示面板，为了对各像素进行控制，通常在阵列基板上设置有薄膜晶体管(Thin Film Transistor，简称TFT)、用于控制和驱动薄膜晶体管的驱动芯片，及线路板模组。
线路板模组制程包括将芯片绑定在显示面板的玻璃基板上，或将带有驱动电路的柔性线路粘合在显示面板上等工艺。现有技术中，显示面板与柔性线路板、芯片模组等组装采用导电胶压合固定，其中显示面板于制作过程中，会根据芯片绑定位置预先留出空间给芯片绑定用。具体而言，根据芯片的外形，会于显示面板内部的膜层挖开一接近芯片外形的区域，之后，芯片即可绑定于该挖开的区域内。然而，传统显示面板的芯片绑定位置为矩形框状，内用于涂布导电胶。由于导电胶经过芯片压合时会往四周扩散，但对于传统芯片绑定位置的构型而言，芯片压合黏着过程，导电胶与玻璃基板之间容易产生气泡，并无法有效排放出芯片绑定位置，造成气泡积存于导电胶内，影响芯片的绑定效果，更可能使芯片无法有效运作，造成显示器件的显示异常的问题。
 技术问题
本发明的目的在于提供一种芯片绑定区域的结构，其可有效降低芯片绑定于基板的绑定预留区域的过程时，造成导电胶膜和绑定预留区域之间的气泡发生而残留。
 技术解决方案
为实现上述目的，本发明提供一种芯片绑定区域的结构，用于绑定显示面板的驱动芯片。所述芯片绑定区域的结构包含：玻璃基板；及有机膜层，设于所述玻璃基板上，且所述有机膜层具有一开口部，其用于容置所述驱动芯片；其中所述有机膜层相邻所述开口部的周围设有至少一通道，所述至少一通道延伸进入所述有机膜层并连通所述开口部。
本发明另外提供一种显示面板，包括芯片绑定区域的结构，所述芯片绑定区域的结构包括：玻璃基板；及有机膜层，设于所述玻璃基板上，且所述有机膜层具有一开口部，其用于容置所述驱动芯片；其中所述有机膜层相邻所述开口部的周围设有至少一通道，所述至少一通道延伸进入所述有机膜层并连通所述开口部。
依据本发明的一优选实施例，所述开口部包括四个端部，所述有机膜层相邻所述四个端部分别设有所述通道。
依据本发明的另一优选实施例，所述开口部的任二所述端部之间分别设有至少另一所述通道。
依据本发明的另一优选实施例，所述四个端部的通道分别由相应的所述端部倾斜地延伸一预定距离。
依据本发明的另一优选实施例，所述开口部具有一矩形构型，所述有机膜层相邻所述开口部的每一边设有至少一所述通道。
依据本发明的另一优选实施例，所述有机膜层为聚酰亚胺所制，且所述驱动芯片通过导电胶膜绑定于所述玻璃基板上，相对于所述有机膜层的开口部内。
 有益效果
本发明的芯片绑定区域的结构，利用所述开口部周围的通道设计，使所述导电胶膜内的气泡可以由所述通道排出，有效减少气泡残留于所述导电胶膜内，确保所述驱动芯片电性导通的可靠性及稳固的绑定。本发明的芯片绑定区域的结构有效解决传统芯片绑定时，容易造成导电胶膜内残留气泡，进而影响芯片电性导通的可靠性及芯片绑定的稳固的问题。
 附图说明
图1为根据本发明的一较佳实施例的芯片绑定区域的结构的断面示意图。
图2为根据本发明的一较佳实施例的芯片绑定区域的结构的平面示意图。
图3为根据本发明的芯片绑定区域的结构与芯片绑定的立体分解示意图。
图4为根据本发明的另一较佳实施例的芯片绑定区域的结构的平面示意图。
图5为根据本发明的另一较佳实施例的芯片绑定区域的结构的平面示意图。
图6为根据本发明的一较佳实施例的显示面板的平面示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
本发明为一种芯片绑定区域的结构，其用于绑定显示面板的驱动芯片，其中所述驱动芯片用于控制并提供述显示面板的像素单元的信号。于此较佳实施例中，所述驱动芯片与所述显示面板之间的接口衔接可采用芯片直接绑定在玻璃基板上的COG 工艺(Chip On Glass，COG)，或芯片直接绑定在柔性电路板上的COB工艺(ChipOn Board，COB)。相同于常规技术，所述显示面板于制作过程中即预先保留芯片绑定的区域。此外，本发明所述显示面板可为一般的液晶显示面板或有机发光二极管显示面板，其包括衬底基板、阵列基板，或发光模层等(未图示)，详细膜层结构于此不再特别说明。
图1为根据本发明的一较佳实施例的芯片绑定区域的结构的断面示意图。如图1所述，本发明的芯片绑定区域的结构包含玻璃基板1及设于所述玻璃基板1上的有机膜层2，其中所述有机膜层2为聚酰亚胺(polyimide, PI)所制，惟并不以此为限。所述有机膜层2具有一开口部20，其用于容置驱动芯片3。所述驱动芯片3通过导电胶膜31绑定于所述玻璃基板1上相对于所述有机膜层2的开口部20内，其中所述导电胶膜31为异方性导电胶(Anisotropic Conductive Film, ACF)，且所述玻璃基板1对应绑定处设有对应芯片电极的金属接触部(未图示)。
图2为根据本发明的一较佳实施例的芯片绑定区域的结构的平面示意图。如图2所示，所述开口部20的形状及大小依据所述驱动芯片3的轮廓而定，且所述开口部20的面积为等于或大于所述驱动芯片3的面积。具体而言，所述有机膜层2相邻所述开口部20的周围设有至少一通道21，其延伸进入所述有机膜层2并连通所述开口部20。较佳地，所述开口部20包括四个端部201，所述有机膜层2相邻所述四个端部201分别设有所述通道21，且每一所述通道21分别由相应的所述端部201倾斜地延伸一预定距离。于此较佳实施例中，所述四个端部201的通道21分别向外倾斜，并和水平线之间构成45度夹角。
图3为根据本发明的芯片绑定区域的结构与芯片绑定的立体分解示意图。所述驱动芯片3藉由所述导电胶膜31黏着绑定于所述开口部20内。由于导电胶膜会受到固化温度不同而影响固化率，或多或少会造成气泡的产生。当所述导电胶膜黏着于所述玻璃基板1上对应所述开口部20处，由于所述开口部20的形状大小相符于所述驱动芯片3，所述气泡自然无法向所述开口部20的周围排出，而影像芯片电性导通的可靠性。如图3所示，本发明所述四个端部201的通道21可有效地提供所述气泡由所所述导电胶膜31内排出。尤其，所述驱动芯片3通过适当压力绑定于所述开口部20内，所述压力会造成所述气泡往四周外挤，而所述四个端部201的通道21的设置可发挥最大功效排出气泡，确保绑定的稳固及芯片与ACF之间可靠的电性连接。
图4为根据本发明的另一较佳实施例的芯片绑定区域的结构的平面示意图。所述开口部20依据驱动芯片的构型而具有一矩形构型。所述有机膜层2相邻所述开口部20的每一短边设有一所述通道21，相邻所述开口部20的每一长边设有二个所述通道21，所述通道21由所述开口部20向外延伸进入所述有机膜层2。
图5为根据本发明的另一较佳实施例的芯片绑定区域的结构的平面示意图。所述有机膜层2相邻任二所述端部201之间分别设有至少另一所述通道21，且所述通道21由所述开口部20向外延伸进入所述有机膜层2。前述图4及图5所示的所述通道21，其作用与图2所示实施例的通道相同，亦即在于排出ACF因芯片绑定所产生的气泡。
本发明的芯片绑定区域的结构，利用所述开口部20周围的通道21设计，使所述导电胶膜31内的气泡可以由所述通道21排出，有效减少气泡残留于所述导电胶膜31内，确保所述驱动芯片3电性导通的可靠性及稳固的绑定。本发明的芯片绑定区域的结构有效解决传统芯片绑定时，容易造成导电胶膜内残留气泡，进而影响芯片电性导通的可靠性及芯片绑定的稳固的问题。
本发明另外提供一种显示面板。如图6所述，本发明的显示面板10，包括芯片绑定区域的结构。所述显示面板10包括位于边框部位的有效显示区域101及围绕所述有效显示区域101的非有效显示区域102，其中所述芯片绑定区域位于所述非有效显示区域102内。所述显示面板10的芯片绑定区域的结构已详述于前述实施例中，于此不再复述。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (13)

  1. 一种芯片绑定区域的结构，用于绑定显示面板的驱动芯片，所述芯片绑定区域的结构包含：
    玻璃基板；及
    有机膜层，设于所述玻璃基板上，且所述有机膜层具有一开口部，其用于容置所述驱动芯片；
    其中所述有机膜层相邻所述开口部的周围设有至少一通道，所述至少一通道延伸进入所述有机膜层并连通所述开口部。
  2. 如权利要求1的芯片绑定区域的结构，其中所述开口部包括四个端部，所述有机膜层相邻所述四个端部分别设有所述通道。
  3. 如权利要求2的芯片绑定区域的结构，其中所述开口部的任二所述端部之间分别设有至少另一所述通道。
  4. 如权利要求2的芯片绑定区域的结构，其中所述四个端部的通道分别由相应的所述端部倾斜地延伸一预定距离。
  5. 如权利要求1的芯片绑定区域的结构，其中所述开口部具有一矩形构型，所述有机膜层相邻所述开口部的每一边设有至少一所述通道。
  6. 如权利要求1的芯片绑定区域的结构，其中所述有机膜层为聚酰亚胺所制，且所述驱动芯片通过导电胶膜绑定于所述玻璃基板上，相对于所述有机膜层的开口部内。
  7. 一种显示面板，包括芯片绑定区域的结构，所述芯片绑定区域的结构包括：
    玻璃基板；及
    有机膜层，设于所述玻璃基板上，且所述有机膜层具有一开口部，其用于容置所述驱动芯片；
    其中所述有机膜层相邻所述开口部的周围设有至少一通道，所述至少一通道延伸进入所述有机膜层并连通所述开口部。
  8. 如权利要求7的显示面板，其中所述开口部包括四个端部，所述有机膜层相邻所述四个端部分别设有所述通道。
  9. 如权利要求8的显示面板，其中所述四个端部的通道分别由相应的所述端部倾斜地延伸一预定距离。
  10. 如权利要求7的显示面板，其中所述开口部具有一矩形构型，所述有机膜层相邻所述开口部的每一边设有至少一所述通道。
  11. 一种芯片绑定区域的结构，用于绑定显示面板的驱动芯片，所述芯片绑定区域的结构包含：
    玻璃基板；及
    有机膜层，设于所述玻璃基板上，且所述有机膜层具有一开口部，其用于容置所述驱动芯片；
    其中所述开口部包括四个端部，所述有机膜层相邻所述四个端部分别设有一通道，其延伸进入所述有机膜层并连通所述开口部，且所述有机膜层为聚酰亚胺所制，所述驱动芯片通过导电胶膜绑定于所述玻璃基板上，相对于所述有机膜层的开口部内。
  12. 如权利要求11的芯片绑定区域的结构，其中所述开口部的任二所述端部之间分别设有至少另一所述通道。
  13. 如权利要求11的芯片绑定区域的结构，其中所述开口部具有一矩形构型，所述有机膜层相邻所述开口部的每一边设有至少一所述通道。
PCT/CN2019/082857 2019-01-08 2019-04-16 芯片绑定区域的结构及显示面板 WO2020143127A1 (zh)

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