WO2020140824A1 - 一种无线装置的辐射增强器、辐射系统及无线装置 - Google Patents

一种无线装置的辐射增强器、辐射系统及无线装置 Download PDF

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Publication number
WO2020140824A1
WO2020140824A1 PCT/CN2019/128758 CN2019128758W WO2020140824A1 WO 2020140824 A1 WO2020140824 A1 WO 2020140824A1 CN 2019128758 W CN2019128758 W CN 2019128758W WO 2020140824 A1 WO2020140824 A1 WO 2020140824A1
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WIPO (PCT)
Prior art keywords
radiation
conductive element
enhancer
wireless device
dielectric substrate
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PCT/CN2019/128758
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English (en)
French (fr)
Inventor
董怀景
王勇
张书俊
Original Assignee
杭州海康威视数字技术股份有限公司
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Application filed by 杭州海康威视数字技术股份有限公司 filed Critical 杭州海康威视数字技术股份有限公司
Priority to KR1020217024414A priority Critical patent/KR102521291B1/ko
Priority to EP19907537.5A priority patent/EP3907825A4/en
Priority to JP2021539047A priority patent/JP7237161B2/ja
Publication of WO2020140824A1 publication Critical patent/WO2020140824A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/02—Details

Definitions

  • the present application relates to the field of wireless communication technology, in particular to a radiation booster, radiation system and wireless device of a wireless device.
  • the current radiation enhancer 10 ′ includes a dielectric substrate 11 ′, a top conductive element 12 ′, a bottom conductive element 13 ′, and electrically connects the top conductive element 12 ′ and the bottom conductive element 13 ′'S metallized through hole 14 ′, which penetrates the dielectric substrate 11 ′.
  • the radiation enhancer 10 ′ adopting this structure needs to provide a metalized through hole 14 ′ in the dielectric substrate 11 ′ to ensure the electrical connection of the top conductive element 12 ′ and the bottom conductive element 13 ′.
  • the processing process is difficult, the production is cumbersome, and the cost Higher.
  • the present application provides a radiation intensifier for a wireless device.
  • the radiation intensifier has a simple structure, is easy to process and manufacture, and satisfies radiation efficiency while effectively reducing costs.
  • the application also provides a radiation system and a wireless device using the radiation enhancer.
  • An embodiment of the present application provides a radiation enhancer for a wireless device, the radiation enhancer including:
  • a first conductive element installed on the first side surface of the dielectric substrate
  • a second conductive element, the second conductive element is mounted on a second side surface of the dielectric substrate opposite to the first side surface;
  • first side surface and the second side surface that supports the non-contact and electromagnetic coupling connection of the first conductive element and the second conductive element.
  • the first conductive element or the second conductive element defines two internal connection ports.
  • the two internal connection ports are arranged symmetrically with respect to the center line of the first conductive element or the second conductive element.
  • first conductive element and the second conductive element cover corresponding side surfaces of the dielectric substrate, and the two internal connection ports are provided on the first conductive element or the second conductive The end of the element.
  • one internal connection port is used to electrically connect the radio frequency module of the wireless device, and the other internal connection port is used to fix the motherboard of the wireless device.
  • the distance between the first side surface and the second side surface of the dielectric substrate is less than two times the propagation wavelength of the air medium corresponding to the lowest resonance frequency point of the radiation enhancer of the wireless device one tenth.
  • the dielectric substrate is arranged in a cubic shape, and the maximum side length of the dielectric substrate is less than one-twentieth of the propagation wavelength in the air medium corresponding to the lowest resonance frequency point of the radiation enhancer of the wireless device.
  • the lowest resonant frequency point is within a working frequency band of 698MHz to 960MHz.
  • the present application also provides a radiation system for a wireless device.
  • the radiation system includes a radiation structure, a radio frequency module, and an external port.
  • the radiation structure includes the radiation enhancer described above.
  • the radiation enhancer and the external port are respectively
  • the radio frequency module is electrically connected.
  • the radiation structure further includes a ground plane layer, and the ground plane layer electrically connects the radiation enhancer and the radio frequency module.
  • the present application also provides a wireless device.
  • the wireless device includes a radiation system, a matching system, and a transmission line.
  • the radiation structure in the radiation system includes the above-mentioned radiation enhancer.
  • the transmission line electrically connects the matching system and the The radio frequency module in the radiation system.
  • the present application provides a radiation enhancer for a wireless device
  • the radiation enhancer includes a dielectric substrate, a first conductive element, and a second conductive element.
  • the dielectric substrate has a first side surface and a second side surface disposed oppositely, the first conductive element is mounted on the first side surface, the second conductive element is mounted on the second side surface, and the first side surface and the second side surface
  • This arrangement avoids the cumbersome process of opening metallized through holes on the dielectric substrate in the prior art, and improves the processing efficiency; and, compared with the electrical connection method in the prior art, the radiation intensifier provided in the embodiments of the present application
  • the electromagnetic coupling between the first conductive element and the second conductive element forms an electromagnetic field, which can fully extend the current path between the first conductive element and the second conductive element while reducing the size of the dielectric substrate to ensure the radiation efficiency of the wireless device .
  • FIG. 1 is a schematic structural diagram of a radiation enhancer in the prior art
  • FIG. 2 is a schematic structural diagram of a radiation enhancer according to an embodiment of this application.
  • FIG. 3 is a schematic structural diagram of a wireless device in an embodiment of this application.
  • FIG. 4 is a diagram of antenna passive performance-S parameters of a wireless device in an embodiment of the present application.
  • FIG. 2 is a schematic diagram of the structure of the radiation enhancer in the embodiment of the present application
  • FIG. 3 is a schematic diagram of the structure of the wireless device in the embodiment of the present application.
  • an embodiment of the present application provides a radiation enhancer 10 of a wireless device.
  • the radiation enhancer 10 includes a dielectric substrate 11, a first conductive element 12 and a second conductive element 13.
  • the dielectric substrate 11 has a first side surface 111 and a second side surface 112 oppositely arranged.
  • the first conductive element 12 is mounted on the first side surface 111 and the second conductive element 13 is mounted on the second side surface 112.
  • the side surface 111 and the second side surface 112 have a thickness that supports the electromagnetic coupling connection of the first conductive element 12 and the second conductive element 13, and the first conductive element 12 and the second conductive element 13 are non-contact, that is, The first conductive element 12 and the second conductive element 13 are not electrically connected.
  • This arrangement avoids the cumbersome process of opening metallized through holes on the dielectric substrate 11 in the prior art, and improves the processing efficiency.
  • the radiation enhancer 10 may further have a third side surface 113 and a fourth side surface 114 disposed oppositely, and a fifth side surface 115 and a sixth side surface 116 disposed oppositely.
  • the dielectric substrate 11 is a solid dielectric body.
  • the dielectric substrate 11 is not limited to a solid dielectric body, and may also be hollow, or a through hole may be formed in the dielectric substrate 11.
  • the embodiment of the present application does not limit the structural shape of the dielectric substrate 11, as long as the first conductive element 12 and the second conductive element 13 are not in contact, and the first conductive element 12 and the second conductive element 13 can be electromagnetically coupled and connected That's it.
  • the prior art radiation enhancer 10 ′ it is necessary to add a through hole, and it is also necessary to metalize the surface of the hole wall of the through hole to electrically connect the top conductive element 12 ′ and the bottom conductive element 13 ′.
  • the wireless device can have the function of an antenna, the process is difficult, and the cost is high.
  • the dielectric substrate 11 of the radiation enhancer 10 provided by the embodiment of the present application has a thickness that makes the first conductive element 12 and the second conductive element 13 non-contact, and can make the first conductive element 12 and the second conductive element 13 Electromagnetic coupling connection, thereby forming an electromagnetic field through electromagnetic coupling, as compared to electrically connecting the first conductive element 12 and the second conductive element 13 through the metallized via, the distance between the first conductive element 12 and the second conductive element 13 can be sufficiently extended The current path ensures the radiation efficiency of the wireless device.
  • the first conductive element 12 or the second conductive element 13 defines two internal connection ports 14, that is, the two internal connection ports 14 are provided on the same conductive element.
  • two internal connection ports 14 may be opened on the second conductive element 13, and the two internal connection ports 14 are arranged symmetrically with respect to the center line of the second conductive element 13.
  • the internal connection port 14 is used to connect the first conductive element 12 or the second conductive element 13 to other elements.
  • the internal connection port 14 may be a pad.
  • the two internal connection ports 14 may also be provided on the first conductive element 12. In this case, the two internal connection ports 14 are symmetrically arranged with respect to the center line of the first conductive element 12.
  • the first conductive element 12 and the second conductive element 13 cover the corresponding side surfaces of the dielectric substrate 11, that is, the first conductive element 12 may cover the first side surface 111, and the second conductive The element may cover the second side surface 112.
  • the two internal connection ports 14 may be provided at the ends of the second conductive element 13.
  • the two internal connection ports 14 may be provided at the ends of the first conductive element 12.
  • one internal connection port 14 is used to electrically connect the radio frequency module of the wireless device, and the other internal connection port 14 is used to fix the motherboard of the wireless device.
  • one internal connection port 14 can be connected to the TX ( The Transmit (transmit)/RX (Receive) port is electrically connected, and the radiation enhancer 10 is soldered and fixed to the main board through another internal connection port 14.
  • the two internal connection ports 14 may be arranged in a square shape.
  • the distance between the first side surface 111 and the second side surface 112 of the dielectric substrate 11, that is, between the plane of the first conductive element 12 and the plane of the second conductive element 13 in FIG. 2 The distance is less than one-twentieth of the propagation wavelength in the air medium corresponding to the lowest resonance frequency point of the radiation enhancer 10, so that the size of the radiation enhancer 10 can be effectively reduced, and further, the radiation intensifier 10 can be reduced.
  • the size of the wireless device further satisfies the miniaturized design requirements of the wireless device.
  • the dielectric substrate 11 may be arranged in a cubic shape, for example, the dielectric substrate 11 may be a rectangular parallelepiped, or the dielectric base 11 may also be a hexahedron, but it is not limited thereto.
  • the dielectric substrate 11 may have side lengths in three directions of length, width, and height.
  • the distance between the first side surface 111 and the second side surface 112 may be considered to be at a height from the dielectric substrate 11
  • the dimensions of the sides in the direction are the same.
  • the maximum side length of the dielectric substrate 11 that is, the largest side length in the three directions of length, width, and height, is less than the minimum resonance frequency of the radiation enhancer 10 of the wireless device One-twentieth of the propagation wavelength in the air medium corresponding to the point, and thereby reducing the size of the radiation enhancer 10, and thus, the size of the wireless device including the radiation enhancer 10 can be reduced to further satisfy the wireless device’s Miniaturized design requirements.
  • the lowest resonance frequency point of the radiation enhancer 10 may be within the operating frequency band of 698 MHz to 960 MHz.
  • the size of the radiation enhancer 10 can be reduced, and further, the size of the wireless device including the radiation enhancer 10 can be reduced It can be sufficiently reduced to further optimize the structural size of the wireless device and realize the design requirements of miniaturization and light weight.
  • an embodiment of the present application further provides a radiation system including a radiation structure, a radio frequency module 20, and an external port.
  • the radiation structure includes the radiation intensifier 10 in the foregoing embodiments, and the radiation intensifier 10 and the external port are electrically connected to the radio frequency module 20 respectively.
  • the ground plane layer 30 in the radiation structure electrically connects the radiation enhancer 10 and the radio frequency module 20.
  • the ground plane layer 30 may be a single-layer conductor for connecting the radiation enhancer 10 and the radio frequency module 20.
  • one end of the ground plane layer 30 may be electrically connected to an internal connection port 14 in the radiation enhancer 10, and the other end of the ground plane layer 30 is electrically connected to the RF module 20.
  • the external port of the radiation system may be understood as One end of the ground plane layer 30 electrically connected to the radio frequency module 20.
  • the application also provides a wireless device including a radiation system, a matching system 40 and a transmission line.
  • the radiation structure in the radiation system includes the above-mentioned radiation enhancer 10, and the transmission line is electrically connected to the matching system 40 and The radio frequency module 20 in the radiation system.
  • the matching system 40 may include multiple circuits.
  • the matching system 40 is used to adjust the signal generated by the radio frequency module 20 to a preset frequency band.
  • the radiation system in the wireless device may include the radiation structure, the radio frequency module 20, and the external port in the above embodiments.
  • One end of the transmission line may be electrically connected to the radio frequency module 20 in the radiation system, and the other end of the transmission line may be electrically connected to the matching system 40.
  • the wireless device uses the above-mentioned radiation enhancer 10, and the first conductive element 12 and the second conductive element 13 are electromagnetically coupled and connected, the transmission line and the matching system 40 excite the radiation current of the ground plane layer 30, and the radio frequency module 20 is generated based on the matching system 40
  • the signal can be adjusted to complete the electromagnetic energy radiation of single frequency band, dual frequency band and multi frequency band, which effectively improves the radiation efficiency of the wireless device.
  • FIG. 4 is a passive antenna performance-S parameter diagram of a wireless device in an embodiment of the present application.
  • the abscissa indicates the frequency of the signal generated by the wireless device, and the ordinate indicates the return loss.
  • M1 (824MHz, -8.13dB), M2 (960MHz, -7.61dB), M3 (1710MHz, -7.45dB), M4 (2170MHz, -7.35dB), M5 (2300MHz, -10.37dB), M6 ( 2700MHz, -15.42dB), where the frequency band corresponding to M1 to M2, that is, 824MHz ⁇ 960MHz can represent the low frequency band in 2G communication; the frequency band corresponding to M3 to M4, that is, 1710MHz ⁇ 2170MHz can represent the frequency band in 3G communication;
  • the frequency bands corresponding to M5 to M6, that is, 2300MHz to 2700MHz can represent the high frequency bands in 4G communication, and these three frequency bands can cover GSM (Global System for Global Communications) 850, GSM900, GSM1800, GSM1900, WCDMA ( Wideband Code Division Multiple

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Abstract

本申请公开了一种无线装置的辐射增强器、辐射系统及无线装置，辐射增强器包括：介质基板；第一导电元件，第一导电元件装设于介质基板的第一侧表面；第二导电元件，第二导电元件装设于介质基板与第一侧表面相对的第二侧表面；其中，介质基板的第一侧表面和第二侧表面之间具有支持第一导电元件和第二导电元件非接触且电磁耦合连接的厚度。该辐射增强器结构简单、便于加工制造，在满足辐射效率的同时，有效降低了成本。

Description

一种无线装置的辐射增强器、辐射系统及无线装置
本申请要求于2019年01月04日提交中国专利局、申请号为201920013046.5发明名称为“一种无线装置的辐射增强器、辐射系统及无线装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请是关于无线通信技术领域，尤其是关于一种无线装置的辐射增强器、辐射系统及无线装置。
背景技术
无线装置中的辐射增强器对无线装置的工作性能具有至关重要的作用。现有技术中，如图1所示，该现行的辐射增强器10′包括介质基板11′、顶层导电元件12′、底层导电元件13′、以及电连接顶层导电元件12′和底层导电元件13′的金属化通孔14′，该金属化通孔14′贯穿介质基板11′。
采用这种结构的辐射增强器10′需要在介质基板11′设置金属化通孔14′，确保顶层导电元件12′和底层导电元件13′的电连接，其加工工艺难度大，制作繁琐，成本较高。
基于此，对于本领域技术人员而言，提供一种结构简单紧凑、便于加工制作，且能够充分确保辐射效率的辐射增强器是亟待解决的技术问题之一。
发明内容
本申请提供一种无线装置的辐射增强器，该辐射增强器结构简单、便于加工制造，在满足辐射效率的同时，有效降低了成本。本申请还提供一种应用该辐射增强器的辐射系统及无线装置。
本申请的一个实施例提供了一种无线装置的辐射增强器，所述辐射增强器包括：
介质基板；
第一导电元件，所述第一导电元件装设于所述介质基板的第一侧表面；
第二导电元件，所述第二导电元件装设于所述介质基板与所述第一侧表面相对的第二侧表面；
其中，所述第一侧表面和所述第二侧表面之间具有支持所述第一导电元件和所述第二导电元件非接触且电磁耦合连接的厚度。
可选地，所述第一导电元件或所述第二导电元件开设两个内部连接端口。
可选地，两个所述内部连接端口相对所述第一导电元件或所述第二导电元件的中线对称设置。
可选地，所述第一导电元件和所述第二导电元件覆盖于所述介质基板的对应侧表面，且两个所述内部连接端口设置于所述第一导电元件或所述第二导电元件的端部。
可选地，一个所述内部连接端口用于电连接所述无线装置的射频模块，另一个所述内部连接端口用于固连所述无线装置的主板。
可选地，所述介质基板的所述第一侧表面和所述第二侧表面之间的距离，小于所述无线装置的辐射增强器的最低谐振频率点对应的空气介质中传播波长的二十分之一。
可选地，所述介质基板呈立方体状设置，所述介质基板的最大边长，小于所述无线装置的辐射增强器的最低谐振频率点对应的空气介质中传播波长的二十分之一。
可选地，所述最低谐振频率点在698MHz～960MHz的工作频段范围内。
本申请还提供一种无线装置的辐射系统，所述辐射系统包括辐射结构、射频模块和外部端口，所述辐射结构包括以上所述的辐射增强器，所述辐射增强器和所述外部端口分别电连接所述射频模块。
可选地，所述辐射结构还包括接地平面层，所述接地平面层电连接所述辐射增强器和所述射频模块。
本申请还提供一种无线装置，所述无线装置包括辐射系统、匹配系统和传输线，所述辐射系统中的辐射结构包括以上所述的辐射增强器，所述传输线电连接所述匹配系统和所述辐射系统中的射频模块。
由上可见，基于上述的实施例，本申请提供了一种无线装置的辐射增强器，该辐射增强器包括介质基板、第一导电元件和第二导电元件。该介质基 板具有相对设置的第一侧表面和第二侧表面，第一导电元件装设在第一侧表面、第二导电元件装设在第二侧表面，第一侧表面和第二侧表面之间具有支持第一导电元件和第二导电元件电磁耦合连接的厚度，并且，第一导电元件和第二导电元件非接触，也就是说，第一导电元件和第二导电元件之间不电连接。如此设置，规避现有技术中在介质基板上开设金属化通孔的繁琐工艺，提升了加工效率；并且，与现有技术中电连接方式相比，本申请实施例提供的辐射增强器中的第一导电元件和第二导电元件之间电磁耦合而形成电磁场，能够在减小介质基板的尺寸下，充分延长第一导电元件和第二导电元件之间的电流路径，确保无线装置的辐射效率。
附图说明
为了更清楚地说明本申请实施例和现有技术的技术方案，下面对实施例和现有技术中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中辐射增强器的结构示意图；
图2为本申请实施例中辐射增强器的结构示意图；
图3为本申请实施例中无线装置的结构示意图；
图4为本申请实施例中无线装置的天线无源性能-S参数图。
附图标记：
图1中：
10′辐射增强器；
11′介质基板；
12′顶层导电元件；
13′底层导电元件；
14′金属化通孔。
图2和图3中：
10辐射增强器；
11介质基板；
111第一侧表面；
112第二侧表面；
113第三侧表面；
114第四侧表面；
115第五侧表面；
116第六侧表面；
12第一导电元件；
13第二导电元件；
14内部连接端口；
20射频模块；
30接地平面层；
40匹配系统；
50主板。
具体实施方式
为使本申请的目的、技术方案及优点更加清楚明白，以下参照附图并举实施例，对本申请进一步详细说明，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
为了详细说明本申请提供的无线装置的辐射增强器的结构及原理。下面结合附图对辐射增强器进行详细说明。
如图2和图3所示，其中，图2为本申请实施例中辐射增强器的结构示 意图；图3为本申请实施例中无线装置的结构示意图。
需要说明的是，本文中出现的“第一、第二、第三、第四、第五和第六”仅是为了区分相同部件清楚表述技术方案，而并不对部件的主次、重要程度及顺序进行限定，即不限定本申请的技术方案。
如图2所示，本申请实施例提供一种无线装置的辐射增强器10，该辐射增强器10包括介质基板11、第一导电元件12和第二导电元件13。该介质基板11具有相对设置的第一侧表面111和第二侧表面112，第一导电元件12装设在第一侧表面111、第二导电元件13装设在第二侧表面112，第一侧表面111和第二侧表面112之间具有支持第一导电元件12和第二导电元件13电磁耦合连接的厚度，并且，第一导电元件12和第二导电元件13非接触，也就是说，第一导电元件12和第二导电元件13之间不电连接。如此设置，规避现有技术中在介质基板11上开设金属化通孔的繁琐工艺，提升了加工效率。
在一个实施例中，辐射增强器10还可以具有相对设置的第三侧表面113和第四侧表面114，以及相对设置的第五侧表面115和第六侧表面116。
如图2所示，在本申请实施例中，介质基板11为实心介质体。当然，介质基板11并不仅限于实心介质体，也可为空心，也可在介质基板11上开设通孔。本申请实施例对介质基板11的结构形状并不进行限制，只需满足第一导电元件12和第二导电元件13不接触，且能够实现第一导电元件12和第二导电元件13电磁耦合连接即可。
参见图1，现有技术中的辐射增强器10′需要增加开设通孔，并且还需在通孔的孔壁表面金属化，以使顶层导电元件12′和底层导电元件13′电连接，才能够使无线装置具有天线的功能，工艺难度大，成本高。而参见图2，本申请实施例提供的辐射增强器10的介质基板11具有使得第一导电元件12和第二导电元件13非接触的厚度，并且能够使得第一导电元件12和第二导电元件13电磁耦合连接，从而通过电磁耦合形成电磁场，相对于通过金属化通孔电连接第一导电元件12和第二导电元件13，能够充分延长第一导电元件12和第二导电元件13之间的电流路径，确保无线装置的辐射效率。
在一个实施例中，第一导电元件12或第二导电元件13开设两个内部连 接端口14，也就是说，两个内部连接端口14设置在同一导电元件上。参见图2，在本申请实施例中，可以在第二导电元件13上开设两个内部连接端口14，并且，两个内部连接端口14相对第二导电元件13的中线对称设置。
上述内部连接端口14用于第一导电元件12或第二导电元件13与其他元件相连，例如，内部连接端口14可以为焊盘。
在一个实施例中，两个内部连接端口14也可以设置在第一导电元件12上，这种情况下，上述两个内部连接端口14相对第一导电元件12的中线对称设置。
在一个实施例中，第一导电元件12和第二导电元件13覆盖于介质基板11的对应侧表面上，也就是说，第一导电元件12可以覆盖于第一侧表面111上，第二导电元件可以覆盖于第二侧表面112上。
在一个实施例中，如果在第二导电元件13上开设两个内部连接端口14，则两个内部连接端口14可以设置在第二导电元件13的端部。
在一个实施例中，如果在第一导电元件12上开设两个内部连接端口14，则两个内部连接端口14可以设置在第一导电元件12的端部。
在一个实施例中，一个内部连接端口14用于电连接无线装置的射频模块，另一个内部连接端口14用于固连无线装置的主板，例如，一个内部连接端口14可以与射频模块的TX(Transmit，发射)/RX(Receive，接收)端口电连接，并通过另一个内部连接端口14将辐射增强器10焊接固定在主板上。
在一个实施例中，两个内部连接端口14可以呈方形设置。
在一个实施例中，介质基板11的第一侧表面111与第二侧表面112之间的距离，即，图2中第一导电元件12的所在面与第二导电元件13的所在面之间的距离，小于辐射增强器10的最低谐振频率点对应的空气介质中传播波长的二十分之一，从而能够有效减小辐射增强器10的尺寸，进而，能够减小包含该辐射增强器10的无线装置的尺寸，进一步满足了无线装置的小型化设计要求。
在一个实施例中，介质基板11可以呈立方体状设置，例如，介质基板11 可以为长方体，或者，介质基本11也可以为六面体，但并不限于此。
在一个实施例中，介质基板11可以具有长度、宽度、高度三个方向上的边长，上述第一侧表面111和第二侧表面112之间的距离，可以认为是与介质基板11在高度方向上的边长的尺寸相同。对于呈立方体状设置的介质基板11而言，介质基板11的最大边长，即，长度、宽度、高度这三个方向上尺寸最大的边长，小于无线装置的辐射增强器10的最低谐振频率点对应的空气介质中传播波长的二十分之一，并由此减小辐射增强器10的尺寸、进而，能够减小包含该辐射增强器10的无线装置的尺寸，以进一步满足无线装置的小型化设计要求。
在一个实施例中，辐射增强器10的最低谐振频率点可以在698MHz～960MHz的工作频段范围内。
基于本申请提供的辐射增强器10中第一导电元件12和第二导电元件13电磁耦合连接设置，能够减小辐射增强器10的尺寸，进而，使得包含该辐射增强器10的无线装置的尺寸能够充分减小，进一步优化无线装置的结构尺寸，实现小型化、轻量化的设计要求。
除上述无线装置的辐射增强器10外，进一步结合图3所示，本申请实施例还提供一种辐射系统，该辐射系统包括辐射结构、射频模块20和外部端口。
其中，辐射结构包括上述各实施例中的辐射增强器10，辐射增强器10和外部端口分别电连接射频模块20。
在一个实施例中，辐射结构中的接地平面层30电连接辐射增强器10和射频模块20。
接地平面层30可以为单层导体，用于连接辐射增强器10和射频模块20。
在一个实施例中，接地平面层30的一端可以与辐射增强器10中的一个内部连接端口14电连接，接地平面层30的另一端与射频模块20电连接，辐射系统的外部端口可以理解为接地平面层30中与射频模块20电连接的一端。
该申请还提供一种无线装置，该无线装置包括辐射系统、匹配系统40和传输线，如图3所示，辐射系统中的辐射结构包括上述的辐射增强器10，其 传输线电连接匹配系统40和辐射系统中的射频模块20。
匹配系统40中可以包含多条电路，匹配系统40用于将射频模块20产生的信号调整至预设频段。
在一个实施例中，无线装置中的辐射系统可以包括上述实施例中的辐射结构、射频模块20和外部端口。
传输线的一端可以与辐射系统中的射频模块20电连接，传输线的另一端可以与匹配系统40电连接。
该无线装置采用上述的辐射增强器10，通过第一导电元件12和第二导电元件13电磁耦合连接、传输线和匹配系统40激发接地平面层30的辐射电流，基于匹配系统40对射频模块20产生的信号进行调整，可完成单频段、双频段和多频段的电磁能量辐射，有效提高了无线装置的辐射效率。
参见图4，图4为本申请实施例中无线装置的天线无源性能-S参数图。
图4中，横坐标表示无线装置产生的信号的频率，纵坐标表示回波损耗。图4中M1(824MHz，-8.13dB)、M2(960MHz，-7.61dB)、M3(1710MHz，-7.45dB)、M4(2170MHz，-7.35dB)、M5(2300MHz，-10.37dB)、M6(2700MHz，-15.42dB)，其中，M1至M2对应的频段，即，824MHz～960MHz可以表示2G通信中的低频段；M3至M4对应的频段，即，1710MHz～2170MHz可以表示3G通信中的频段；M5至M6对应的频段，即，2300MHz～2700MHz可以表示4G通信中的高频段，这三个频段可以覆盖GSM(全球移动通信系统，Global System for Mobile Communications)850、GSM900、GSM1800、GSM1900、WCDMA(宽带码分多址，Wideband Code Division Multiple Access)1900、WCDMA2100、TD-SCDMA(时分同步码分多址，Time Division-Synchronous Code Division Multiple Access)、CDMA(码分多址，Code Division Multiple Access)、LTE(长期演进，Long Term Evolution)1、LTE3、LTE5、LTE8、LTE38、LTE39、LTE40、LTE41、WIFI2.4～2.5G等多个目前常用的通讯制式，并且，这三个频段的回波损耗都是-5dB以下，即，在2G、3G和4G通信的频段内，基于本申请实施例提供的辐射增强器，能够有效提升无线装置的工作性能。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本申请保护的范围之内。

Claims (11)

  1. 一种无线装置的辐射增强器，其特征在于，所述辐射增强器包括：
    介质基板；
    第一导电元件，所述第一导电元件装设于所述介质基板的第一侧表面；
    第二导电元件，所述第二导电元件装设于所述介质基板与所述第一侧表面相对的第二侧表面；
    其中，所述第一侧表面和所述第二侧表面之间具有支持所述第一导电元件和所述第二导电元件非接触且电磁耦合连接的厚度。
  2. 根据权利要求1所述的辐射增强器，其特征在于，所述第一导电元件或所述第二导电元件开设两个内部连接端口。
  3. 根据权利要求2所述的辐射增强器，其特征在于，两个所述内部连接端口相对所述第一导电元件或所述第二导电元件的中线对称设置。
  4. 根据权利要求3所述的辐射增强器，其特征在于，所述第一导电元件和所述第二导电元件覆盖于所述介质基板的对应侧表面，且两个所述内部连接端口设置于所述第一导电元件或所述第二导电元件的端部。
  5. 根据权利要求2所述的辐射增强器，其特征在于，一个所述内部连接端口用于电连接所述无线装置的射频模块，另一个所述内部连接端口用于固连所述无线装置的主板。
  6. 根据权利要求1所述的辐射增强器，其特征在于，所述第一侧表面和所述第二侧表面之间的距离，小于所述辐射增强器的最低谐振频率点对应的空气介质中传播波长的二十分之一。
  7. 根据权利要求1所述的辐射增强器，其特征在于，所述介质基板呈立方体状设置，所述介质基板的最大边长，小于所述辐射增强器的最低谐振频率点对应的空气介质中传播波长的二十分之一。
  8. 根据权利要求6或7所述的辐射增强器，其特征在于，所述最低谐振频率点在698MHz～960MHz的频段范围内。
  9. 一种无线装置的辐射系统，其特征在于，所述辐射系统包括辐射结构、射频模块和外部端口，所述辐射结构包括权利要求1-8任一项所述的辐射增强器，所述辐射增强器和所述外部端口分别电连接所述射频模块。
  10. 根据权利要求9所述的辐射系统，其特征在于，所述辐射结构还包括接地平面层，所述接地平面层电连接所述辐射增强器和所述射频模块。
  11. 一种无线装置，其特征在于，所述无线装置包括辐射系统、匹配系统和传输线，所述辐射系统中的辐射结构包括权利要求1-8任一项所述的辐射增强器，所述传输线电连接所述匹配系统和所述辐射系统中的射频模块。
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