WO2020137489A1 - Deposition preventing member and vacuum processing device - Google Patents
Deposition preventing member and vacuum processing device Download PDFInfo
- Publication number
- WO2020137489A1 WO2020137489A1 PCT/JP2019/048078 JP2019048078W WO2020137489A1 WO 2020137489 A1 WO2020137489 A1 WO 2020137489A1 JP 2019048078 W JP2019048078 W JP 2019048078W WO 2020137489 A1 WO2020137489 A1 WO 2020137489A1
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- WIPO (PCT)
- Prior art keywords
- deposition
- discharge space
- body member
- holding member
- preventing
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
Definitions
- the present invention relates to a technique of an adhesion-preventing member used in a vacuum processing apparatus such as a sputtering apparatus.
- a plate-shaped deposition-inhibitory member is provided in order to prevent the deposition material or the like from adhering to the wall surface in the vacuum chamber when performing vacuum processing such as sputtering.
- This adhesion-preventing member is provided near the substrate in the discharge space where plasma processing is performed, such as a sputtering device.
- the deposition-inhibitory member is attached to, for example, a frame-shaped holding member in the vacuum chamber in a direction parallel to the substrate.
- the film-forming material adheres to the deposition-inhibitory member during film formation such as sputtering. At that time, the film forming material adheres to the surface of the bolt, which causes the generation of particles. Therefore, a cap is attached to each bolt to prevent the film forming material from adhering, but the film forming material attached to the cap also causes the generation of particles.
- attachment-preventing member is attached to the holding member from the discharge space side using a large number of bolts, there is no friction between the holding member and the holding member due to the expansion of the attachment-preventing member due to heat during discharge. This causes particles to be generated.
- JP-A-4-78132 Japanese Patent Laid-Open No. 10-060624 JP, 2004-315948, A International Publication 2006-067836
- the present invention has been made in view of the problems of the related art as described above, and an object thereof is to suppress particles generated from the deposition-inhibitory member arranged in the discharge space during vacuum processing. It is to provide the technology that can.
- the present invention made to achieve the above object is an adhesion preventing member for preventing adhesion of a substance generated during vacuum processing using plasma into a vacuum chamber, and a frame-shaped adhesion preventing main body member.
- a frame-shaped holding member that holds the deposition-inhibiting body member in close contact with the discharge space side in the vacuum chamber, the deposition-inhibiting body member being opposite to a surface of the holding member on the discharge space side. Is fixed by a plurality of fastening members from the side surface, and each of the fastening members is configured such that the respective tip portions thereof are not exposed to the discharge space side from the discharge space side surface of the deposition-inhibiting body member. It is an attachment prevention member.
- the present invention is the deposition-inhibitory member in which a cooling portion for cooling the deposition-inhibition body member is provided on the surface of the holding member on the deposition-inhibition body member side.
- the present invention is the deposition-inhibitory member in which a plasma-shielding wall portion extending to the surface side facing the discharge space in the vacuum chamber is provided at the peripheral edge of each component of the deposition-inhibiting body member.
- the present invention provides the deposition-inhibitory member, wherein a peripheral portion of each component of the deposition-inhibiting body member is provided with a mounting portion for the holding member so as to extend outward with respect to the plasma shielding wall. Is.
- the present invention is the deposition-inhibitory member configured to be arranged substantially vertically in the vacuum chamber.
- the present invention includes a vacuum chamber and any of the above-described deposition preventing members provided in the vacuum chamber, and performs a predetermined vacuum treatment on an object to be treated arranged in the vicinity of the deposition preventing member.
- the vacuum processing apparatus is configured as described above.
- the present invention is a vacuum processing apparatus having the vacuum chamber in which a sputtering target is arranged, and configured to perform sputtering on a processing object arranged near the deposition-inhibitory member.
- the deposition-preventing main body member is fixed by a plurality of fastening members from the surface of the holding member on the side opposite to the discharge space side, and each fastening member has a tip portion of the deposition-preventing main body. Since it is configured not to be exposed to the discharge space side from the surface of the discharge space side of the member, it is necessary to use a large number of bolts with a cover as in the prior art in order to hold the deposition-preventing main body member on the holding member. Absent.
- the present invention it is possible to reduce the unevenness of the surface of the deposition-inhibitory member on the side of the discharge space and reduce its surface area. Generation of particles due to separation from the surface can be suppressed.
- the deposition-preventing main body member and the holding member can be reliably brought into close contact with each other, for example, even when the deposition-preventing member is arranged in the vertical direction, the deposition-preventing member does not warp. Therefore, no gap is created between the deposition-preventing main body member and the holding member.
- the cooling member for cooling the deposition-inhibiting body member when the cooling member for cooling the deposition-inhibiting body member is provided on the surface of the holding member on the deposition-inhibiting body member side, the deposition-inhibiting body member and the holding member surely come into close contact with each other. Combined with this, the deposition-inhibitory member can be reliably cooled. As a result, according to the present invention, it is possible to reliably prevent the generation of particles due to rubbing caused by the elongation of the deposition-inhibitory member due to heat during discharge.
- the mounting is performed. Even when the deposition-preventing main body member is attached to the holding member with a screw in the section, the substance generated during vacuum processing is blocked by the plasma shielding wall portion provided in the deposition-preventing main body member, and Since it is possible to prevent the member from adhering to the attachment portion, it is possible to further suppress the generation of particles due to peeling of the substance from the surface of the deposition-inhibitory member.
- FIG. 2(a) is a front view seen from the discharge space side
- FIG. 3A is a front view seen from the discharge space side
- FIG. 4(a) is a front view showing the state seen from the front side of the deposition-inhibiting body member.
- 4(b) is a front view showing a state seen from the back side surface side of the deposition-preventing main body member
- FIG. 4(c) is a partial sectional view taken along the line BB of FIG. 4(b)
- FIG. 4(d) is 4B is a sectional view taken along the line CC of FIG. (A) and (b):
- FIG. 5(a) is a front view seen from the discharge space side
- FIG. 5(b) is the opposite side of the discharge space.
- FIG. 6A to 6D show examples of the configuration of the accommodating recesses and holes of the holding member
- FIG. 6A is a front view showing a state viewed from the front side of the holding member
- FIG. ) Is a front view showing a state viewed from the back side of the holding member
- FIG. 6C is a sectional view taken along the line DD of FIG. 6A
- FIG. 6D is FIG. 6B.
- EE line sectional view 7A and 7B are schematic configuration diagrams showing an example of the deposition-inhibitory member according to the present invention
- FIG. 7A is a front view seen from the discharge space side
- FIG. 7B is the opposite of the discharge space.
- FIG. 8A to 8D are views showing a fixed portion of the deposition-preventing main body member and the holding member in the deposition-preventing member of this example, and FIG. 8A shows a state viewed from the back side surface of the holding member.
- a front view FIG. 8B is a front view showing a state seen from the front side surface side of the deposition-preventing main body member
- FIG. 8C is a cross-sectional view taken along line GG of FIG. 8A
- FIG. 8D is a sectional view taken along the line HH of FIG. (A) (b): It is a figure which shows the attachment part of the attachment main body member and the holding member in the attachment member of this example, and FIG. 9(a) is the state seen from the front side surface side of the holding member.
- 9B is a front view showing the above
- FIG. 9B is a sectional view taken along the line II of FIG. 9A.
- FIG. 1 is a schematic configuration diagram showing an internal configuration of a sputtering apparatus which is an example of a vacuum processing apparatus according to the present invention.
- FIG. 2A and 2B are schematic configuration diagrams showing an example of the deposition-preventing main body member of the deposition-inhibitory member according to the present invention.
- FIG. 2A is a front view seen from the discharge space side
- FIG. b) is a front view seen from the opposite side of the discharge space.
- FIG. 3A is a schematic configuration diagram showing an example of the deposition-preventing main body member
- FIG. 3A is a front view seen from the discharge space side
- FIG. 3B is FIG. 3 is a sectional view taken along line AA of FIG.
- FIG. 4(a) to 4(d) show an example of the configuration of the holding portion provided on the deposition-inhibiting body member, and FIG. 4(a) shows the state seen from the front side of the deposition-inhibiting body member.
- 4B is a front view showing a state seen from the back side surface side of the deposition-preventing main body member, and FIG. 4C is a partial sectional view taken along line BB of FIG. 4B.
- 4(d) is a sectional view taken along line CC of FIG. 4(b).
- the deposition-preventing main body member 10 of this example constitutes a deposition-preventing member 30 used in a sputtering apparatus 40 which is a vacuum processing apparatus, and includes a substrate 8 (processing target) in a grounded vacuum chamber 6 Object) is disposed in a state of being held by a holding member 20 described later.
- the substrate 8, the sputtering target (hereinafter, referred to as “target”) 7, and the deposition-preventing member 30 are provided in a substantially vertical direction, and the deposition-preventing main body member 10 includes the substrate 8 and the target 7. It is arranged so as to face the target 7 in the discharge space 9 between them.
- a sputtering gas is introduced into the vacuum chamber 6 and a negative voltage is applied to the target 7 to generate plasma discharge in the discharge space 9.
- the negatively charged target 7 is sputtered by the ions in the plasma, and a film is formed on the substrate 8 by the sputtered particles ejected from the surface of the target 7.
- the deposition-preventing main body member 10 of this example has, for example, linear plate-shaped first to fourth constituent members 1 to 4 and a rectangular frame shape having an opening 10a. Is formed on.
- FIG. 2A shows a surface of the deposition-inhibiting body member 10 on the discharge space 9 side, that is, a front surface 10F
- FIG. 2B shows a surface of the deposition-inhibiting body member 10 opposite to the discharge space 9.
- the face or back side 10R is shown.
- the deposition-preventing main body member 10 of this example is made of a metal such as aluminum (Al), stainless steel, or titanium (Ti), and is usually placed in a state of being oriented substantially vertically.
- the deposition-preventing main body member 10 is arranged between the first component member 1 and the second component member 2 arranged on the upper and lower sides and extending in the horizontal direction, and between the first component member 1 and the second component member 2 in the horizontal direction. It has a third component member 3 and a fourth component member 4 arranged on the left right side and extending in the vertical direction.
- X-axis direction the longitudinal direction of the first constituent member 1 and the second constituent member 2 of the deposition-preventing main body member 10
- Z longitudinal direction of the third constituent member 3 and the fourth constituent member 4
- the first to fourth constituent members 1 to 4 of this example are arranged with a slight gap between both ends of adjacent members in consideration of expansion due to heat during vacuum processing.
- the first constituent member 1 and the second constituent member 2, and the third constituent member 3 and the fourth constituent member 4 are straight lines passing through the center point of the deposition-preventing main body member 10. Are formed and arranged in a line-symmetrical shape with respect to.
- the first to fourth constituent members 1 to 4 are held by a holding member 20 described later.
- Plasma shielding walls walls portions for plasma shielding 1c, 2c, 3c, 4c formed so as to extend are provided.
- the rear side surface 10R of the first to fourth constituent members 1 to 4 of the present example has a holding member 16 to be described later for holding the first to fourth constituent members 1 to 4 on the holding member 20, respectively.
- the portion 15 is provided at a position surrounding the opening 10a.
- the holding portion 15 is formed in an elongated shape, and has a horizontal holding portion 15h extending in the horizontal direction and a vertical holding portion 15v extending in the vertical direction, which have the same basic configuration.
- the horizontal holding portions 15h are linearly arranged, for example, in a line along the longitudinal direction (X-axis direction) of each of the first and second constituent members 1 and 2.
- the vertical holding portion 15v is a longitudinal direction (Z-axis direction) of the third and fourth constituent members 3 and 4 in both end portions of the first and second constituent members 1 and 2 and the third and fourth constituent members 3 and 4. Are arranged in a straight line along, for example.
- the horizontal holding portion 15h and the vertical holding portion 15v are the first to fourth portions of the deposition-inhibiting body member 10. It is preferable to provide a plurality of horizontal holding portions 15h and vertical holding portions 15v so as to be line-symmetric with respect to a straight line orthogonal to the longitudinal direction of the constituent members 1 to 4.
- a plurality of mounting portions 5 for mounting the first to fourth constituent members 1 to 4 to the holding member 20 using bolts described later are provided at the peripheral portions of the first to fourth constituent members 1 to 4, respectively. It is provided so as to extend (project) outward from the plasma shield walls 1c to 4c.
- Each of the plurality of mounting portions 5 is provided with a screw hole 50 for mounting the deposition-inhibiting body member 10 from the discharge space 9 side with a bolt (see FIG. 3(a)).
- the holding portion 15 of the present example described above has, for example, an elongated shape in a recess 10b having a rectangular parallelepiped shape provided on the back side surface 10R of the deposition-inhibiting main body member 10.
- the fastening holding member 16 is attached.
- the fastening holding member 16 is made of, for example, a nut with a plate, and engages with the threaded portion 23c (see FIGS. 8C and 8D) of the tension bolt 23 described later on the back side surface 10R side of the deposition-preventing main body member 10. It has a screw hole 16a in which a screw portion 16b is formed.
- the fastening holding member 16 is provided with a pair of fixing bolts 17 having screw portions that mesh with the screw portions of the pair of screw holes 10c provided on the back side surface 10R of the deposition-inhibiting body member 10 and the recess 10b in the deposition-inhibiting body member 10.
- a pair of flange portions extending on both sides in the longitudinal direction are attached and fixed to the deposition-inhibiting body member 10.
- FIG. 5A and 5B are schematic configuration diagrams showing an example of a holding member used in the present invention
- FIG. 5A is a front view seen from the discharge space side
- FIG. 5B is a discharge space. It is the front view seen from the opposite side.
- FIG. 6(a) to 6(d) show an example of the configuration of the accommodation recess and hole of the holding member
- FIG. 6(a) is a front view showing the state viewed from the front side of the holding member.
- 6(b) is a front view showing a state viewed from the back side surface side of the holding member
- FIG. 6(c) is a sectional view taken along the line DD of FIG. 6(a)
- FIG. FIG. 6B is a sectional view taken along line EE of FIG.
- the holding member 20 is fixed in the vacuum chamber 6 shown in FIG. 1, and the first to fourth constituent members 1 to 4 of the deposition-preventing main body member 10 described above are provided on the discharge space 9 side of the holding member 20. It is attached.
- the holding member 20 of this example is formed in a rectangular frame shape.
- the holding member 20 is integrally formed by using a plate material having high rigidity, has an outer diameter slightly larger than the outer diameter of the deposition-inhibiting body member 10 described above, and is larger than the opening 10a of the deposition-inhibiting body member 10 described above.
- An opening 20a having a slightly larger inner diameter is provided.
- the holding member 20 is composed of first to fourth frame portions 11 to 14 corresponding to the first to fourth constituent members 1 to 4 of the deposition-inhibiting main body member 10. That is, the first frame portion 11 and the second frame portion 12 that extend in the horizontal direction are provided in the upper and lower portions of the holding member 20, and between the first frame portion 11 and the second frame portion 12, the left and right sides of the holding member 20 in the horizontal direction.
- the third frame portion 13 and the fourth frame portion 14 extending in the vertical direction are provided in the portion.
- the longitudinal direction of the first frame portion 11 and the second frame portion 12 of the holding member 20 will be appropriately referred to as "X-axis direction”
- the longitudinal direction of the third frame portion 13 and the fourth frame portion 14 will be appropriately referred to as "Z-axis direction”.
- the holding member 20 has a plurality of holding members mounted on the deposition-preventing main body member 10 while surrounding the opening 20 a on the surface on the discharge space 9 side shown in FIG.
- a plurality of accommodation recesses 21 are provided at positions corresponding to the portions 15 as spaces for accommodating the holding portions 15.
- each accommodation recess 21 is formed in an elongated shape and has a horizontal accommodation recess 21h extending in the horizontal direction and a vertical accommodation recess 21v extending in the vertical direction, which have the same basic configuration.
- the horizontal accommodating recesses 21h are provided in the first frame portion 11 and the second frame portion 12 of the holding member 20 in a line, for example, in a line along the longitudinal direction (X-axis direction) of each.
- the vertical accommodating recesses 21v are provided in the third frame portion 13 and the fourth frame portion 14 of the holding member 20 so as to be linearly aligned, for example, in a line along the respective longitudinal directions (Z-axis direction).
- the horizontal accommodation recess 21h and the vertical accommodation recess 21v are the first to fourth frame portions in the holding member 20. It is preferable to provide a plurality of horizontal accommodating recesses 21h and a plurality of vertical accommodating recesses 21v so as to be line-symmetric with respect to a straight line orthogonal to the longitudinal direction of 11 to 14.
- the accommodating recess 21 of the holding member 20 of this example is provided with an elongated recess 21a on the front side surface 20F of the holding member 20.
- a hole 21b is provided on the inside.
- the recess 21 a of the accommodation recess 21 of the holding member 20 is formed to have a size to accommodate the fastening holding member 16 attached to the holding portion 15 of the deposition-inhibiting body member 10, and holds the deposition-inhibiting body member 10 in the holding member 20.
- the back side surface 10R of the deposition-inhibiting main body member 10 is configured to be in close contact with the front side surface 20F of the holding member 20 when held (see FIGS. 8C and 8D).
- FIG. 5B the surface of the holding member 20 opposite to the discharge space 9 shown in FIG.
- a plurality of accommodation holes 22 are provided at positions corresponding to the holding portion 15.
- each accommodation hole 22 is formed in an elongated hole shape, and has a horizontal hole 22h extending in the horizontal direction and a vertical hole 22v extending in the vertical direction, which have the same basic configuration.
- the horizontal hole portions 22h are provided in the first frame portion 11 and the second frame portion 12 of the holding member 20 so as to be linearly arranged, for example, in a line along the longitudinal direction (X-axis direction) of each.
- the vertical hole portions 22v are provided in the third frame portion 13 and the fourth frame portion 14 of the holding member 20 in a line, for example, in a line along the respective longitudinal directions (Z-axis direction).
- a plurality of screw holes 25 for attaching the mounting portion 5 of the attachment-preventing main body member 10 to the front side surface 20F of the holding member 20 by using bolts 24 described later are provided at the edge of the front side surface 20F of the holding member 20. Is provided.
- the accommodation hole portions 22 provided on the back side surface 20R of the holding member 20 of the present example have the accommodation recesses 21 provided on the front side surface 20F of the holding member 20. It is formed so as to extend in the same direction as the hole 21b.
- Each accommodation hole 22 is formed so as to be continuous with the hole 21b of the accommodation recess 21 on the front surface 20F of the holding member 20.
- a cooling unit 26 that cools the deposition-inhibitory member 30 is provided inside the front side surface 20F of the holding member 20.
- the cooling unit 26 can be configured, for example, by providing a groove on the front side surface 20F of the holding member 20 to cover the lower surface of the holding member 20, in the present example, around the opening 20a of the holding member 20. It is formed so as to go between the upper part and the upper part.
- the cooling unit 26 of the present example has a pair of cooling units 26a and 26b formed so as to be line-symmetrical with respect to a straight line parallel to the Z axis passing through the center of the holding member 20.
- the cooling unit 26 includes a second frame on the front side surface 20F side of the holding member 20 from a refrigerant introduction port 26c for introducing a refrigerant (for example, water) provided in the second frame section 12 on the back side surface 20R side of the holding member 20.
- a refrigerant for example, water
- the refrigerant is introduced into one end portion 26e of the pair of cooling portions 26a and 26b of the portion 12, respectively.
- the pair of cooling portions 26a and 26b are arranged such that the other end portions 26f of the pair of cooling portions 26a and 26b of the second frame portion 12 on the front side surface 20F side of the holding member 20 are on the back side surface 20R side of the holding member 20. Are connected by a connecting pipe 26d provided in the second frame portion 12.
- FIG. 7A and 7B are schematic configuration diagrams showing an example of the deposition-inhibitory member according to the present invention.
- FIG. 7A is a front view seen from the discharge space side, and FIG. It is the front view seen from the other side of the space.
- the first to fourth frame portions 11 to 14 of the holding member 20 are attached to the deposition-preventing main body member 10.
- the tension bolts 23, which are fastening members are inserted into the horizontal hole portion 22h and the vertical hole portion 22v from the back side surface 20R side of the holding member 20, and these tension bolts 23 of the attachment-preventing main body member 10 are inserted.
- the attachment-preventing main body member 10 is fixed in a state of being in close contact with the holding member 20 by being respectively fastened to the holding portions 15.
- bolts 24 are respectively inserted into the screw holes 50 of the attachment portion 5 of the deposition-inhibiting body member 10 from the front side surface 10F side of the deposition-inhibiting body member 10, and these bolts 24 are screwed into the screw holes 25 in the holding member 20.
- the attachment-preventing main body member 10 is attached to the holding member 20 by fastening each of them (see FIG. 5A).
- FIG. 8(a) to 8(d) are views showing a fixed portion between the deposition-preventing main body member and the holding member in the deposition-preventing member of this example, and FIG. 8(a) is seen from the back side surface side of the holding member.
- 8B is a front view showing a state
- FIG. 8B is a front view showing a state seen from the front side surface side of the deposition-preventing main body member
- FIG. 8C is a sectional view taken along line GG of FIG. 8A.
- FIG. 8D is a sectional view taken along line HH of FIG.
- the outer diameter (diameter) of the head portion 23a thereof is accommodated in the back side surface 20R of the holding member 20.
- the diameter of the body portion 23b is larger than the width of the hole portion 22 and is slightly smaller than the width of the accommodation hole portion 22 of the holding member 20.
- the screw portion 23c of the strut bolt 23 is inserted into the accommodation hole portion 22 of the holding member 20, and is meshed with the screw portion 16b of the fastening holding member 16 of the holding portion 15 to tighten the strut bolt 23.
- the tip end of the body portion 23b of the strut bolt 23 is pressed against the surface of the fastening holding member 16 on the holding member 20 side.
- the dimensions of the recess 10b of the deposition-inhibiting body member 10 and the screw portion 16b of the fastening and holding member 16 are set.
- the screw tip portion 23d of the tension bolt 23 for fixing the deposition-inhibition main body member 10 and the holding member 20 to each other is It is configured so as not to be exposed from the front side surface 10F to the discharge space 9 side.
- FIG. 9(a) and 9(b) are views showing the attachment portion of the attachment body member and the attachment member of the attachment member of this example, and FIG. 9(a) is a front side surface side of the attachment member.
- 9B is a sectional view taken along the line II of FIG. 9A.
- the screw hole 50 (see FIG. 2(a)) of the attachment portion 5 of the deposition-inhibiting body member 10 is attached to the front side surface 10F of the deposition-inhibiting body member 10.
- the head portion 24a of the bolt 24 and the deposition-inhibiting body member is preferable to provide a slight clearance c between the front surface 10 and the front surface 10F.
- the clearance c between the head portion 24a of the bolt 24 and the front side surface 10F of the deposition-preventing main body member 10 is set to about 0.1 to 1 mm.
- the deposition-preventing body member 10 is fixed from the surface of the holding member 20 on the side opposite to the discharge space 9 side by the plurality of tension bolts 23, and each tension bolt 23 is fixed.
- the respective screw tips 23d are not exposed to the discharge space 9 side from the discharge space 9 side surface of the deposition-prevention main body member 10, so that the holding member 20 holds the deposition-prevention main body member 10. Therefore, it is not necessary to use a large number of bolts with a cover as in the prior art.
- the present embodiment it is possible to reduce the irregularities on the surface of the deposition-inhibitory member 30 on the side of the discharge space 9 and reduce the surface area thereof. Generation of particles due to peeling from the surface of the deposition-inhibitory member can be suppressed.
- the deposition-preventing main body member 10 and the holding member 20 can be surely brought into close contact with each other, even if the deposition-preventing member 30 is arranged in the vertical direction, A warp of the attachment member 30 does not cause a gap between the attachment-preventing main body member 10 and the holding member 20.
- the holding member 20 on the side of the attachment-preventing main body member 10 is provided with the cooling section 26 for cooling the attachment-preventing main body member 10, the holding member 20 and the attachment-preventing main body member 10 are retained.
- the deposition-inhibitory member 30 can be reliably cooled.
- the plasma shield walls 1c to 4c extending to the surface side of the vacuum chamber 6 facing the discharge space 9 are provided at the peripheral portions of the first to fourth constituent members 1 to 4 of the deposition-inhibiting main body member 10. Since it is possible to further reduce the amount of a substance such as a film forming material that adheres to the surface of the deposition-inhibitory member 30 on the side of the discharge space 9, the amount of the substance from the surface of the deposition-inhibitory member 30 can be reduced. Generation of particles due to peeling can be further suppressed.
- the holding member 20 is provided at the peripheral edge of the first to fourth constituent members 1 to 4 of the deposition-inhibiting body member 10 so as to extend outward from the plasma shielding walls 1c to 4c. Since the attachment portion 5 is provided, even when the deposition-preventing main body member 10 is attached to the holding member 20 from the discharge space 9 side using the bolt 24, the substance generated during the vacuum treatment is the deposition-preventing main body. Since the plasma shield walls 1c to 4c provided on the member 10 can prevent the adhesion-preventing main body member 10 from adhering to the attachment portion 5, the substance is separated from the surface of the adhesion-preventing member 30. Generation of particles can be further suppressed.
- the tension bolt is used as the fastening member that fastens the deposition-inhibiting body member to the holding member, but the present invention is not limited to this, and from the surface on the side opposite to the discharge space side surface of the holding member. As long as they can be fixed and are configured so that their respective tip portions are not exposed in the discharge space from the discharge space side surface of the deposition-preventing main body member, various fastening members can be used for protection.
- the attachment body member can be fastened to the holding member.
- the present invention is not limited to this and can be applied to various vacuum processing apparatuses.
- Substrate (processing target) 10 Substrate (processing target) 10... Deposition-preventing main body member 11... First frame portion 12... Second frame portion 13... Third frame portion 14... Fourth frame portion 20... Holding member 21... Housing recess 21h... Horizontal housing recess 21v... Vertical housing recess 22... Housing hole 22h... Horizontal hole 22v... Vertical hole 23... Strut bolt (fastening member) 24... Bolt 25... Screw hole 26... Cooling unit 40... Sputtering device (vacuum processing device) 50...Screw hole
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Abstract
Description
しかし、保持部材に取り付けられた防着部材においては、種々の課題がある。 Conventionally, such an attachment preventing member is attached to the holding member using a large number of bolts.
However, the attachment-preventing member attached to the holding member has various problems.
本発明は、前記保持部材の前記防着本体部材側の面に、当該防着本体部材を冷却する冷却部が設けられている防着部材である。
本発明は、前記防着本体部材の各構成部材の周縁部に、前記真空槽内の放電空間に対向する面側に延びるプラズマ遮蔽用の壁部が設けられている防着部材である。
本発明は、前記防着本体部材の各構成部材の周縁部に、前記プラズマ遮蔽用の壁部に対して外方側に延びるように、前記保持部材に対する取付部が設けられている防着部材である。
本発明は、前記真空槽内において概ね鉛直方向に向けて配置するように構成されている防着部材である。
本発明は、真空槽と、前記真空槽内に設けられた上述したいずれかの防着部材とを備え、前記防着部材の近傍に配置された処理対象物に対して所定の真空処理を行うように構成されている真空処理装置である。
本発明は、スパッタリングターゲットが配置される前記真空槽を有し、前記防着部材の近傍に配置される処理対象物に対してスパッタリングを行うように構成されている真空処理装置である。 The present invention made to achieve the above object is an adhesion preventing member for preventing adhesion of a substance generated during vacuum processing using plasma into a vacuum chamber, and a frame-shaped adhesion preventing main body member. A frame-shaped holding member that holds the deposition-inhibiting body member in close contact with the discharge space side in the vacuum chamber, the deposition-inhibiting body member being opposite to a surface of the holding member on the discharge space side. Is fixed by a plurality of fastening members from the side surface, and each of the fastening members is configured such that the respective tip portions thereof are not exposed to the discharge space side from the discharge space side surface of the deposition-inhibiting body member. It is an attachment prevention member.
The present invention is the deposition-inhibitory member in which a cooling portion for cooling the deposition-inhibition body member is provided on the surface of the holding member on the deposition-inhibition body member side.
The present invention is the deposition-inhibitory member in which a plasma-shielding wall portion extending to the surface side facing the discharge space in the vacuum chamber is provided at the peripheral edge of each component of the deposition-inhibiting body member.
The present invention provides the deposition-inhibitory member, wherein a peripheral portion of each component of the deposition-inhibiting body member is provided with a mounting portion for the holding member so as to extend outward with respect to the plasma shielding wall. Is.
The present invention is the deposition-inhibitory member configured to be arranged substantially vertically in the vacuum chamber.
The present invention includes a vacuum chamber and any of the above-described deposition preventing members provided in the vacuum chamber, and performs a predetermined vacuum treatment on an object to be treated arranged in the vicinity of the deposition preventing member. The vacuum processing apparatus is configured as described above.
The present invention is a vacuum processing apparatus having the vacuum chamber in which a sputtering target is arranged, and configured to perform sputtering on a processing object arranged near the deposition-inhibitory member.
図1は、本発明に係る真空処理装置の例であるスパッタリング装置の内部構成を示す概略構成図である。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing an internal configuration of a sputtering apparatus which is an example of a vacuum processing apparatus according to the present invention.
1c…プラズマ遮蔽壁(プラズマ遮蔽用の壁部)
2……第2構成部材
2c…プラズマ遮蔽壁
3……第3構成部材
3c…プラズマ遮蔽壁
4……第4構成部材
4c…プラズマ遮蔽壁
5……取付部
6……真空槽
7……スパッタリングターゲット
8……基板(処理対象物)
10…防着本体部材
11…第1枠部
12…第2枠部
13…第3枠部
14…第4枠部
20…保持部材
21…収容凹部
21h…水平収容凹部
21v…鉛直収容凹部
22…収容孔部
22h…水平孔部
22v…鉛直孔部
23…突っ張りボルト(締結部材)
24…ボルト
25…ねじ穴
26…冷却部
40…スパッタリング装置(真空処理装置)
50…ねじ孔 1...
2...
10... Deposition-preventing
24...
50...Screw hole
Claims (7)
- プラズマを用いた真空処理の際に発生する物質の真空槽内への付着を防止する防着部材であって、
枠状の防着本体部材と、
前記防着本体部材を前記真空槽内の放電空間側に密着した状態で保持する枠状の保持部材とを備え、
前記防着本体部材が、前記保持部材の前記放電空間側の面と反対側の面から複数の締結部材によって固定されるとともに、当該各締結部材は、それぞれの先端部分が前記防着本体部材の前記放電空間側の面から当該放電空間側に露出しないように構成されている防着部材。 A deposition preventing member for preventing adhesion of substances generated during vacuum processing using plasma into the vacuum chamber,
A frame-shaped attachment-resistant body member,
A frame-shaped holding member that holds the deposition-preventing body member in a state of being in close contact with the discharge space side in the vacuum chamber,
The adhesion-preventing main body member is fixed by a plurality of fastening members from the surface of the holding member on the side opposite to the discharge space side, and each of the fastening members has a tip portion of the adhesion-preventing main body member. An adhesion-preventing member configured so as not to be exposed from the surface on the discharge space side to the discharge space side. - 前記保持部材の前記防着本体部材側の面に、当該防着本体部材を冷却する冷却部が設けられている請求項1記載の防着部材。 The deposition-inhibitory member according to claim 1, wherein a cooling section for cooling the deposition-inhibition body member is provided on a surface of the holding member on the deposition-inhibition body member side.
- 前記防着本体部材の各構成部材の周縁部に、前記真空槽内の放電空間に対向する面側に延びるプラズマ遮蔽用の壁部が設けられている請求項1記載の防着部材。 The deposition-inhibitory member according to claim 1, wherein a peripheral wall of each constituent member of the deposition-inhibitory body member is provided with a plasma-shielding wall extending toward a surface facing the discharge space in the vacuum chamber.
- 前記防着本体部材の各構成部材の周縁部に、前記プラズマ遮蔽用の壁部に対して外方側に延びるように、前記保持部材に対する取付部が設けられている請求項1記載の防着部材。 2. The deposition-proof according to claim 1, wherein a mounting portion for the holding member is provided at a peripheral edge of each component of the deposition-preventing main body member so as to extend outward with respect to the plasma shielding wall. Element.
- 前記真空槽内において概ね鉛直方向に向けて配置するように構成されている請求項1乃至4のいずれか1項記載の防着部材。 The deposition-inhibitory member according to any one of claims 1 to 4, which is configured to be arranged substantially vertically in the vacuum chamber.
- 真空槽と、前記真空槽内に設けられ、プラズマを用いた真空処理の際に発生する物質の前記真空槽内への付着を防止する防着部材とを備え、
前記防着部材は、枠状の防着本体部材と、前記防着本体部材を前記真空槽内の放電空間側に密着した状態で保持する枠状の保持部材とを有し、前記防着本体部材が、前記保持部材の前記放電空間側の面と反対側の面から複数の締結部材によって固定されるとともに、当該各締結部材は、それぞれの先端部分が前記防着本体部材の前記放電空間側の面から当該放電空間側に露出しないように構成され、
前記防着部材の近傍に配置された処理対象物に対して所定の真空処理を行うように構成されている真空処理装置。 A vacuum tank, and a deposition preventing member that is provided in the vacuum tank and prevents adhesion of substances generated during vacuum processing using plasma to the vacuum tank,
The deposition-inhibitory member includes a frame-shaped deposition-inhibitory body member, and a frame-shaped holding member that holds the deposition-inhibition body member in a state of being in close contact with the discharge space side in the vacuum chamber. The member is fixed by a plurality of fastening members from the surface of the holding member opposite to the surface on the discharge space side, and each of the fastening members has a tip end portion on the discharge space side of the deposition main body member. Is configured so as not to be exposed to the discharge space side from the surface of
A vacuum processing apparatus configured to perform a predetermined vacuum processing on an object to be processed arranged near the deposition-inhibitory member. - スパッタリングターゲットが配置される前記真空槽を有し、前記防着部材の近傍に配置される処理対象物に対してスパッタリングを行うように構成されている請求項6記載の真空処理装置。
7. The vacuum processing apparatus according to claim 6, further comprising the vacuum chamber in which a sputtering target is arranged, and configured to perform sputtering on an object to be processed arranged near the deposition-inhibitory member.
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JPH1046333A (en) * | 1996-08-01 | 1998-02-17 | Matsushita Electric Ind Co Ltd | Sputtering device |
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