JPH1046333A - Sputtering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sputtering device provided with a deposition-proof member in which explacement operation is facilitated, the time therefor is reduced, a deposition- proof function is strengthened, a volume in a chamber is reduced by the minimization of a deposition-proof area, the reproducing cost for removing a deposited film is reduced and a service life is prolonged. SOLUTION: This device is provided with a cylindrical primary deposition-proof member 18 having an inside volume equal to a film deposition space by the absolute minimum to be provided between a target 8 and a substrate 7 and plural planar secondary deposition-proof member 19 arranged around one edge part of the primary deposition-proof member 18. The primary deposition-proof member 18 is arranged along the inside wall face of a chamber 1 also in such a manner that the target 8 is surrounded from the outside by a ring-shaped opening piece 18b crookedly formed toward the outer direction of the one end part thereof, and a mounting frame body 18c extending out toward the inner direction from the other end is mounted so as to be fixed to a mounting booth stand 14 supporting a mask body 17 of the substrate 7. Each deposition-proof preventing member 19 is arranged so as to surround the opening piece 18b from the outside and is fixed to an earth shield body 11 of the target 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a sputtering apparatus used for forming a thin film on the surface of a substrate by using sputter particles emitted from a target of a sputter material.

[0002]

2. Description of the Related Art This type of sputtering apparatus is generally used for a wide variety of purposes such as forming a wiring metal or a magnetic recording material on a semiconductor surface. In such a sputtering apparatus, when sputtered particles adhere to the inner wall surface of the vacuum chamber or a member that cannot be replaced, it becomes extremely difficult to remove the sputtered particles. Therefore, in the film forming chamber inside the vacuum chamber, an anti-adhesion plate is provided to prevent the sputter particles from adhering to a substrate other than the substrate on which the film is to be formed. Is prevented beforehand. The deposition-preventing plate is fixed to the inner wall surface of the chamber as far as possible from the discharge generation area in order to prevent the heat-deposition plate from being thermally deformed by the influence of heat generated by the discharge.

[0003]

However, since the above-mentioned deposition-preventing plates are fixed as far as possible from the discharge-generating region, the number of the individual plates and the length of each individual component are long. As a result, the replacement work becomes complicated, and the work takes too much time. Further, as the number increases, the number of overlapped portions of adjacent deposition-preventing plates increases, and spatter easily leaks to the outside from gaps between the overlapped portions. Because the protective function is not enough,
Despite the provision of the deposition-preventing plate, sputtered particles adhere to the inner wall surface of the chamber and the like, and the cost for regenerating the sputtered film is high. Furthermore, in order to install many deposition plates, the installation space becomes large as a whole, and the volume of the chamber must be increased accordingly. In addition, since the individual protection plates need to be made as light as possible, the thickness cannot be increased even if the shape is relatively long, so that the strength and rigidity are insufficient and the life is short. .

Accordingly, the present invention provides an easy and short replacement work, a strengthening of the deposition prevention function, a reduction in the volume in the chamber by minimizing the deposition prevention range, a reduction in the regeneration cost for removing the adhered film, and It is an object of the present invention to provide a sputtering apparatus provided with a deposition-preventing plate having a long life.

[0005]

In order to achieve the above object, a sputtering apparatus according to the present invention comprises: a sputtering apparatus for forming a thin film on a surface of a substrate by using sputter particles emitted from a target of a sputter rig material; A cylindrical first deposition-inhibiting member having an internal volume equivalent to the minimum necessary film-forming space to be provided between the substrate and a plurality of first deposition-inhibiting members arranged around one end of the first deposition-inhibiting member; A ring-shaped expanding side formed along an inner wall surface of the chamber and bent outward at one end thereof. A mounting frame body is disposed so as to surround the target from the outside at the portion and extends inward from the other end, and is fixedly mounted to a mounting booth body at a location near the substrate, and each of the second The proof plate is expanded as described above. Part of being arranged so as to surround from the outside and is fixed to the vicinity portions of the target.

In the above sputtering apparatus, the first and second
The sputter particles are prevented from adhering to unnecessary portions only by the two types of deposition prevention members, and the first deposition prevention member is
As a cylindrical one-piece, it is possible to cover almost all parts where sputter particles should not adhere, and the plurality of second deposition-preventing members are adhered by the first deposition plate. It is only arranged at a place where it cannot be prevented. Therefore, as the number of the deposition-preventing members is reduced, the replacement work is facilitated and the operation time can be greatly reduced, and the leakage of sputter particles can be suppressed as much as possible by reducing the number of overlapping portions of the neighboring deposition-preventing members. The wearing function is significantly improved. Further, since the first deposition-preventing member has a cylindrical shape having an internal volume equivalent to the minimum necessary film-forming space, the chamber is reduced in size to a volume corresponding to the first deposition-preventing member. it can.
In addition, the strength and rigidity of the deposition-inhibiting member are improved with downsizing, and the life of the deposition-inhibiting member can be extended.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a sputtering apparatus according to one embodiment of the present invention. In FIG. 1, a vacuum chamber 1 is formed by hermetically uniting a lower chamber base 2 and an upper cathode base body 3 and has a film forming chamber 4 provided therein. Below the film forming chamber 4, a glass substrate 7 to be formed is attached to a substrate holder (not shown), and the glass substrate 7 can be moved by the substrate holder.

Above the film forming chamber 4, a flat target 8, which is a sputtering material, is positioned parallel to the substrate 7 and is fixed to a cooling box 9 with screws (not shown). The cooling box 9 is fixed to the cathode base body 3 with a space member 10 interposed therebetween.

On the cathode base body 3, four earth shield bodies 11 are arranged in a rectangular shape and fixed by bolts 12a, and cover pieces 12 projecting inward from the earth shield bodies 11 are respectively attached to the targets 8. On the other hand, the peripheral portion of the target 8 is covered with an appropriate gap. As a result, no discharge is generated at the peripheral portion of the target 8 where no sputtering is performed.
On the other hand, four mask plates 17 are arranged in a rectangular shape on the mounting base 14 arranged around
The mask plate 17 covers the periphery of the substrate 7 so that sputtered particles do not adhere to the periphery.

In such a sputtering apparatus, the film forming chamber 4 of the chamber 1 is evacuated through a vacuum evacuation pipe by the operation of a vacuum pump (not shown) and pulled into a high vacuum state.
A discharge gas such as an argon gas is introduced into the film forming chamber 4 in the high vacuum state through a gas introduction pipe (not shown). In this discharge gas atmosphere, a voltage is applied to the target 8 to generate plasma, and the target 8 is sputtered. A thin film is formed on the substrate 7 by sputtered particles ejected from the target 8.

Next, a description will be given of the deposition-preventing members 18, 19, which are the constitutions of the present invention.

The above-mentioned sputtering apparatus is provided with two types, a first deposition-preventing member 18 shown in FIG. 3 and a second deposition-preventing member 19 shown in FIG. As shown in FIG. 3, the first deposition-inhibiting member 18 has a deposition-preventing main body 18a formed of a thin plate in the shape of a rectangular tube, and extends outward from the periphery near the upper end of the deposition-preventing main body 18a. Is formed by bending, and a rectangular mounting frame 18c is fixed to the lower end of the deposition-preventing main body 18a by welding means. The first attachment member 18 is provided as a single unit. On the other hand, as shown in FIG. 2, the upper end of the main body plate portion 19a is bent in the orthogonal direction to form the extension piece 19b, and further, the end of the extension piece 19b is formed. The attachment piece 19c is formed by being bent in the lower orthogonal direction.

The main body 18 of the first member 18
a is formed in a rectangular cylindrical shape having a volume corresponding to a minimum necessary film forming space formed between the target 8 and the substrate 7 facing each other. This first deposition prevention member 18
A rectangular reinforcing frame 20 is fixed to the lower surface of the mounting frame 18c by screws (not shown) and reinforced. The reinforcing frame 20 is placed on the mounting base 14 and positioning pins are provided. 21 is press-fitted into the reinforcing frame 20 from the side of the mounting base 14 to be fixed to the mounting base 14 in a positioning state. First fixing member 18 in a fixed state
The deposition main body 18a is disposed along the inner wall surface of the vacuum chamber 1, and the deposition chamber 4 is provided inside the deposition main body 18a. Further, the expanded side portion 18 b of the first deposition-inhibiting member 18 is disposed so as to surround the outer periphery of the earth shield body 13. In addition, the mask plate 17 has the attachment-preventing piece 1 covering the mounting portion of the reinforcing frame 20 in the mounting frame 18c from above.
7a is protruded.

The four second attachment members 19 are arranged in a rectangular shape so as to surround the upper part of the first attachment member 18 by their main body plate portions 19a, and each of the mounting pieces 19c is bolted by a bolt 12b. It is fixedly attached to the earth shield body 11. In this mounting state, each second protection member 19
The main body plate portions 19a are located outside the expanded side portion 18b of the first deposition-inhibiting member 18 and are held in a hanging state along the inner wall surface of the cathode base body 3 in the vacuum chamber 1. .

Next, the operation of each of the above-described deposition preventing members 18 and 19 will be described. The first deposition preventing member 18 prevents sputter particles from adhering to the entire inner wall surface of the vacuum chamber 1. Further, the attachment-preventing pieces 17a of the mask body 17 prevent the sputtered particles from leaking from the gap between the inner edge of the mounting frame portion 18c of the first attachment-preventing member 18 and the mask plate 17. Further, the expanded side portion 18b of the first deposition prevention member 18 is
It is provided at an appropriate angle such that sputtered particles do not adhere outward to a. This is because, when the target 8 is an insulator, when the sputtered particles adhere to the upper end of the first depositing member 18 to form an insulating film, the insulating film forms the upper end of the first depositing member 18. Discharge occurs,
This is to prevent the discharge portion from being thermally deformed by the heat generated by the discharge. On the other hand, sputtered particles leaking outward from the gap between the expanded side portion 18b of the first deposition prevention member 18 and the earth shield body 11 are formed in the second deposition prevention member 19 of the cathode base body 3 and the chamber base 2. Prevent it from adhering to each inner wall surface.

In the above-described sputtering apparatus, a single first deposition-inhibiting member 18 integrally formed in a substantially cylindrical shape, and four second deposition-inhibiting members for assisting deposition of the first deposition-inhibiting member 18 are provided. Only 19 are provided, and the number of the deposition-preventing members 18 and 19 is significantly reduced as compared with the conventional device. Due to this reduction in the number of parts, the following effects can be obtained.
That is, the replacement work of the deposition-inhibiting members 18 and 19 becomes easy, and the work time can be greatly reduced. Further, as the number of overlapping portions of the adjacent deposition-inhibiting members 18 and 19 is reduced, the leakage of sputtered particles is remarkably reduced, and the function of preventing sputtered particles from being adhered can be enhanced. Further, the first deposition preventing member 18
Is formed as a substantially cylindrical integral body, the deposition range of sputter particles in the film forming chamber 4 can be made as small as possible, and the chamber 1 corresponds to the first deposition prevention member 18. It is possible to reduce the size by reducing the size to have a volume.

Moreover, since the weight of the deposition-inhibiting members 18 and 19 does not increase even if they are formed into a shape having a sufficient thickness in accordance with the miniaturization, the members have sufficient strength and rigidity, and a long life can be achieved. it can. Furthermore, since spatter particles are less likely to adhere to unnecessary portions, the cost of regenerating the sputter particles to remove the adhered film can be reduced.

[0018]

As described above, according to the sputtering apparatus of the present invention, the first cylindrical deposition prevention having the same internal volume as the minimum necessary film formation space to be provided between the target and the substrate. Since the structure includes the member and a plurality of plate-shaped second deposition members arranged around one end of the first deposition member, replacement is performed as the number of deposition members decreases. Work becomes easy, and work time can be greatly reduced. In addition, since the number of deposition-preventing members is small, the number of overlapping portions of adjacent deposition-preventing members is reduced, and the leakage of sputter particles from the superposed locations can be minimized, so that the deposition-preventing function is significantly improved. I do. Further, since the first deposition-preventing member has a cylindrical shape having an internal volume equivalent to the minimum necessary film forming space, the chamber is reduced in size to a volume corresponding to the first deposition-preventing member. it can. In addition, since the strength and rigidity of the deposition prevention member can be improved, the life of the deposition prevention member can be extended. Further, since the second deposition-preventing member has the expanded side portion, there is an advantage that the life of the deposition-preventing member can be extended even in the case of insulating film formation.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a sputtering apparatus according to one embodiment of the present invention.

FIG. 2 is a perspective view of a second deposition-inhibiting member in the device.

FIG. 3 is a perspective view of a first deposition-inhibiting member in the device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chamber 7 Substrate 8 Target 14 Attachment base stand 18 First attachment member 18b Expanded side portion 18c Attachment frame 19 Second attachment member

Claims (1)

[Claims] 1. A sputtering apparatus for forming a thin film on a surface of a substrate by using sputter particles emitted from a target of a sputter rig material, wherein an internal volume equivalent to a minimum necessary film forming space to be provided between the target and the substrate. And a plurality of plate-shaped second deposition members disposed around one end of the first deposition member. The deposition-inhibiting member is arranged along the inner wall surface of the chamber, and is arranged so as to surround the target from the outside at a ring-shaped expanded side portion formed by bending outward at one end thereof, and inward from the other end. The mounting frame body extending to is fixedly mounted to a mounting booth body at a location near the substrate, and each of the second deposition-preventing plates is disposed so as to surround the expanded side portion from the outside. Fixed to a location near the target Supattarigu apparatus characterized by there.