WO2020135514A1 - 一种滤波器及基站 - Google Patents

一种滤波器及基站 Download PDF

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Publication number
WO2020135514A1
WO2020135514A1 PCT/CN2019/128350 CN2019128350W WO2020135514A1 WO 2020135514 A1 WO2020135514 A1 WO 2020135514A1 CN 2019128350 W CN2019128350 W CN 2019128350W WO 2020135514 A1 WO2020135514 A1 WO 2020135514A1
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WIPO (PCT)
Prior art keywords
cavity
resonator
metal
coupling
dielectric
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PCT/CN2019/128350
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English (en)
French (fr)
Inventor
郭继勇
石晶
李明康
袁本贵
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华为技术有限公司
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Publication of WO2020135514A1 publication Critical patent/WO2020135514A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/207Hollow waveguide filters
    • H01P1/208Cascaded cavities; Cascaded resonators inside a hollow waveguide structure

Definitions

  • This application relates to the field of communication technology, and in particular, to a filter and a base station.
  • the Dielectric Waveguide (DW) filter used in the existing communication system has the characteristics of miniaturization, high quality factor volume ratio, high power, etc.
  • the dielectric waveguide itself needs to be debugged by polishing, It will cause the deviation of the intermodulation characteristics of the filter using the dielectric waveguide, and at the same time, because the higher-order mode frequency of the dielectric waveguide is closer to the transmission main mode, the harmonics at the far end of the filter using the dielectric waveguide will be poor.
  • the method of cascading the dielectric cavity and the metal cavity is often used, but the existing dielectric and metal coupling structure can only achieve a single Magnetic field coupling or electric field coupling, and the method of grinding the medium can only adjust the coupling coefficient in one direction, which affects the cavity layout and coupling adjustment effect in the dielectric metal hybrid filter.
  • the present application provides a filter and a base station to improve the coupling effect between the chambers in the filter.
  • a filter in a first aspect, includes a first cavity and a second cavity, wherein the first cavity and the second cavity are coupled and connected.
  • the coupling structure includes a first resonance element and a second resonance element, wherein the first resonance element and the second resonance element correspond to the first cavity and the second cavity, respectively connection.
  • the first resonating member and the second resonating member When the first resonating member and the second resonating member are specifically provided, the first resonating member and the second resonating member can be relatively moved and locked in a set position, wherein the first resonating member and the The second resonator has an overlapping area in the vertical projection of the first surface; the first surface is a plane parallel to the relative movement direction of the first resonator and the second resonator. And the first resonating member is coupled to the second resonating member. In the above coupling structure, the first resonating member and the second resonating member can move relatively to change the relative area between the first resonating member and the second resonating member.
  • the resonance elements can be either magnetic field coupling or electric field coupling.
  • the coupling mode between the two cavities improves the coupling effect between the two cavities, thereby improving the effect of the filter.
  • the filter when the filter is specifically provided, the filter further includes a dielectric layer disposed between the first resonant member and the second resonant member; and the dielectric layer and the The first resonator is fixedly connected, and/or the dielectric layer is fixedly connected to the second resonator.
  • the first resonant member is a metal sleeve
  • the second resonant member is a metal rod
  • the metal rod part is inserted into the metal sleeve. That is, through the cooperation between the metal sleeve and the metal rod, the switching between the electric field coupling and the magnetic field coupling is realized, so that the coupling type between the first cavity and the second cavity can be flexibly adjusted, thereby improving the first cavity The coupling effect between the body and the second cavity.
  • the metal sleeve structure either an integrated structure or a split structure can be used.
  • the metal sleeve includes a plurality of metal sheets, and the plurality of metal sheets are spaced apart and surround the metal sleeve.
  • the first resonant member is a hollow bolt or a hollow screw.
  • the metal sleeve can also adopt a cylindrical body, and then the cylindrical body is provided with multiple openings and other different structural forms.
  • first resonating member is movably connected to the first dielectric cavity
  • second resonating member Fixedly connected to the second medium cavity
  • the first resonator is movably connected to the first dielectric cavity, and the second resonator is movably connected to the second dielectric cavity; or,
  • the first resonator is fixedly connected to the first dielectric cavity, and the second resonator is movably connected to the second dielectric cavity.
  • the effect of adjusting the size of the overlapping portion between the first resonator and the second resonator can be achieved.
  • the above movable connection includes screw connection or chute connection.
  • the connection between the resonant rod and the corresponding cavity can be achieved through different connection methods.
  • first cavity and the second cavity When the first cavity and the second cavity are specifically arranged, they can be arranged in different ways, for example, the first cavity and the second cavity are arranged side by side; or the first cavity and the second cavity The chambers are out of phase. When the phase shift setting is adopted, the space occupied by the filter can be reduced in the horizontal direction.
  • the first cavity is a metal cavity or a dielectric cavity
  • the second cavity is a metal cavity or a dielectric cavity.
  • the first cavity and the second cavity are both metal or dielectric cavities
  • the first cavity and the second cavity are arranged side by side;
  • the coupling structure can be conveniently arranged.
  • the first cavity is a metal cavity and the second cavity is a dielectric cavity
  • the first cavity and the second cavity are staggered.
  • it is convenient to set the coupling structure and reduce the space occupied by the filter.
  • the filter when the first cavity or the second cavity is a metal cavity, the filter further includes a metal resonator rod disposed in the metal cavity, and inserted into the The metal cavity adjusting screw in the metal cavity.
  • the resonance of the cavity can be adjusted by setting a metal resonance rod and a metal cavity adjusting screw.
  • the filter when the first cavity or the second cavity is a dielectric cavity, the filter further includes at least one dielectric cavity adjusting screw inserted into the dielectric cavity.
  • the resonance of the dielectric cavity can be improved by adjusting the screw of the dielectric cavity.
  • a base station including any one of the above filters.
  • the first resonating member and the second resonating member can move relatively to change the relative area between the first resonating member and the second resonating member.
  • the resonance elements can be either magnetic field coupling or electric field coupling.
  • FIG. 1 is a schematic structural diagram of a filter provided by an embodiment of this application.
  • FIG. 2 is a cross-sectional view of a filter provided by an embodiment of this application.
  • FIG. 3 is another schematic structural diagram of a coupling unit provided by an embodiment of this application.
  • FIG. 4 is another schematic structural diagram of a first resonator provided by an embodiment of the present application.
  • Figure 5 is a schematic diagram of the simulation of the filter shown in Figure 1;
  • FIG. 6 is a schematic structural diagram of another filter provided by an embodiment of the present application.
  • FIG. 7 is a cross-sectional view of another filter provided by an embodiment of the present application.
  • an embodiment of the present application provides a filter that can be applied to wireless communication devices, such as various types of base stations or other communication devices.
  • the filter can be used to form a duplexer, which is used to separate the transceiver signal of the base station system; suppress the output spurs of the power amplifier; suppress various interference signals, avoid receiver blocking, intermodulation and mirroring interference.
  • the filter includes two types of cavities, which are named first cavity 10 and second cavity 20 for convenience of distinction, wherein the number of first cavity 10 and second cavity 20 may be multiple, It may be one respectively, but no matter how many or a single one is used, the first cavity 10 and the second cavity 20 are arranged in pairs, and the first cavity 10 and the second cavity 20 in pairs are coupled and connected .
  • first cavity 10 and second cavity 20 When a plurality of first cavities 10 and a plurality of second cavities 20 are used, the plurality of them refers to two or more than two. And when a plurality of first cavities 10 and second cavities 20 are specifically provided, the first cavity 10 and the second cavity 20 are arranged in a single row, so that the first cavity 10 and the second cavity 20
  • the bodies 20 can be coupled in one-to-one correspondence.
  • the metal cavity is shown in FIGS. 1 and 2.
  • the metal cavity It includes a metal shell 14 and a cover plate 13 that covers the metal shell 14, wherein the metal shell 14 is provided with a metal resonator rod 12 and a metal cavity adjusting screw inserted from the cover plate 13 into the metal cavity 11.
  • the metal resonance rod 12 and the metal cavity adjusting screw 11 can adopt the arrangement method of the resonance rod and the adjusting screw in the metal cavity in the prior art, which will not be repeated here.
  • the dielectric cavity it may include a dielectric block, and at least one dielectric cavity adjustment screw 21 provided on the dielectric block, and the dielectric cavity adjustment screw 21 may be a gap or blind hole or groove provided on the dielectric block .
  • the first cavity 10 and the second cavity 20 provided in the embodiments of the present application may be any of the above two different cavities, for example, the first cavity 10 is a metal cavity or a dielectric cavity, and The second cavity 20 may also be a metal cavity or a dielectric cavity.
  • the first cavity 10 may be a metal cavity and the second cavity 20 may be a dielectric cavity; or the first cavity 10 may be a dielectric cavity or a second cavity 20 It is a metal cavity; or the first cavity 10 and the second cavity 20 are both dielectric cavities; or the first cavity 10 and the second cavity 20 are both metal cavities.
  • different types of cavities can be selected as the first cavity 10 and the second cavity 20 according to actual conditions.
  • the coupling structure 30 when the first cavity 10 and the second cavity 20 are coupled and connected, the coupling structure 30 is implemented.
  • the coupling structure 30 includes two components, namely a first resonator 31 and a second resonator 32.
  • the first resonator 31 is connected to the first cavity 10
  • the second resonator 32 is connected to the second cavity 20.
  • the first resonator 31 is provided in the embodiment of the present application
  • the first resonator 31 and the second resonator 32 can move relative to each other, so that the coupling structure 30 formed by the first resonator 31 and the second resonator 32 can realize magnetic field coupling and electric field coupling.
  • capacitive coupling, electric field coupling, capacitive coupling, etc. are collectively referred to as electric field coupling; and magnetic field coupling, inductive coupling, and inductive coupling are collectively referred to as magnetic field coupling.
  • the metal cavity is coupled to the metal cavity, or the dielectric cavity is coupled to the dielectric cavity.
  • the coupling between the two resonators can only be magnetic field coupling or electric field.
  • One of the couplings, during adjustment, can only adjust the magnitude of the coupling value, and cannot change the nature of the coupling (for example, it cannot be converted from electrical coupling to magnetic coupling, or cannot be converted from magnetic coupling to electric field coupling). Therefore, in the embodiment of the present application, by changing the position between the first resonating member 31 and the second resonating member 32, the coupling property (or the coupling type) can be changed, and the coupling value can also be changed. The effect of coupling between the two cavities is improved.
  • the size of the overlapping portion between the first resonance member 31 and the second resonance member 32 is changed between the first resonance member 31 and the second resonance member 32
  • the first resonator 31 and the second resonator 32 are coupled by an electric field, so that the coupling range of the first cavity 10 and the second cavity 20 can be adjusted.
  • FIG. 2 when the first resonance member 31 and the second resonance member 32 are moved, when the two move in the vertical direction, they at least partially overlap, that is, between the first resonance member 31 and the second resonance member 32 Way out of nesting.
  • connection between the first resonator 31 and the first cavity 10 and/or the second resonator 32 and the second cavity may be used
  • the connection between the bodies 20 is implemented.
  • a movable connection between the first resonator 31 and the first cavity 10 may be used, while the second resonator 32 is fixedly connected to the second cavity 20, or the first resonator 31 and the first cavity may be used
  • the body 10 is movably connected, and the second resonator 32 and the second cavity 20 are also movably connected, or the first resonator 31 is fixedly connected to the first cavity 10, and the second resonator 32 is connected to Different implementation manners such as movable connection between the second chambers 20.
  • the above-mentioned movable refers to the relative movement between two components, either one component is fixed, the other component moves, or both components move simultaneously.
  • the first resonator 31 and the second resonator 32 can be moved to a specific position through a specific structure. Fixed between the body.
  • the first resonance member 31 can move relative to the first cavity 10 below, and the second resonance member 32 is fixed to the second cavity 20 Take connection as an example to illustrate it.
  • the first resonator 31 is screwed to the first cavity 10.
  • the first cavity 10 is provided with a threaded hole.
  • the threaded hole may be provided on the cover plate 13.
  • the first resonating member 31 is provided with an external thread corresponding to the threaded hole. During assembly, the first resonating member 31 is screwed to the threaded hole and extends into the metal cavity through the cover plate 13.
  • the second resonator 32 is fixed on the second cavity 20. As shown in FIG. 1, when the second cavity 20 is a dielectric cavity, the second resonator 32 is fixed on the dielectric cavity and passes through the first The bottom plate of the metal shell 14 of a cavity extends into the first cavity 10, and when the relative movement between the first resonator 31 and the first cavity 10 is achieved, the first resonator 31 can be rotated so that The length of the first resonator 31 inserted into the first cavity 10 becomes longer or shorter, so as to achieve relative movement of the first resonator 31 relative to the second resonator 32.
  • the first resonating member 31 can move relative to the first cavity 10
  • the first resonant member 31 can also be screwed to the first cavity
  • the second resonant member 32 can be screwed to the second cavity, such as
  • the dielectric cavity includes a dielectric block, as shown in FIG. 1, a threaded hole may be provided in the dielectric block, and the second resonator 32 is provided with an external thread that cooperates with the threaded hole, Screw the second resonator 32 in the threaded hole.
  • a threaded hole can be provided in the bottom plate of the metal shell of the metal cavity, and the second resonator 32 can be screwed in this threaded hole. Threaded hole.
  • both the first resonator 31 and the second resonator 32 can move.
  • the size of the overlapping portion between the first resonance member and the second resonance member can be adjusted by adjusting the first resonance member 31, the second resonance member 32, or the first resonance member 31 and the second resonance member 32 at the same time.
  • the first resonator 31 may be fixedly connected to the first cavity 10
  • the second resonator 32 may be screwed to the second cavity 20
  • the first resonator 31 may be adjusted to the second resonator
  • the size of the overlapping portion between 32 can be achieved by rotating the second resonator 32.
  • the screw connection listed above is only a specific connection method.
  • the first cavity 10 is provided with a chute, the first resonance The member 31 is slidingly assembled in the chute, and an elastic protrusion is provided on the first resonance member 31.
  • the elastic protrusion can be caught in the chute
  • the first resonator 31 is relatively fixed to the first cavity 10.
  • the chute when the first cavity 31 is a metal cavity, the chute may be opened on the top cover 13 of the metal cavity, and when the first cavity 31 is a dielectric cavity, the dielectric block Open a chute.
  • the second resonator 32 can also slide relative to the second cavity 20 by using the above-mentioned specific sliding grooves.
  • Other structures in the prior art that can achieve relative movement and can be locked can also be applied to the embodiments of the present application.
  • the relative area between the first resonator 31 and the second resonator 32 refers to the area where the first resonator 31 and the second resonator 32 can form an electric field coupling.
  • the first resonant element 31 and the second resonant element 32 may be conductive parts of metal materials, such as common metal materials such as copper, aluminum, and iron.
  • the first resonator 31 and the second resonator 32 may have different structures.
  • the first resonator 31 is a metal sleeve
  • the second resonator 32 is a metal rod, and the metal rod is partially inserted into the metal sleeve.
  • the first cavity 10 is provided with a threaded hole
  • the metal sleeve is spirally connected in the first cavity 10
  • the body 20 is fixedly connected.
  • the metal sleeve may be a hollow bolt or a hollow screw, and the metal rod partially extends into the hollow bolt or the hollow screw.
  • the depth of the metal rod inserted into the hollow bolt or the hollow screw can be adjusted, thereby changing the size of the overlapping portion between the hollow bolt and the metal rod.
  • the metal sleeve may have other structures besides the hollow bolts listed above, for example, the metal sleeve is an integrated structure.
  • the metal sleeve is a complete barrel structure.
  • the metal sleeve may also adopt a split structure.
  • the metal sleeve includes a plurality of metal sheets, and the plurality of metal sheets are spaced apart to form a ring, but the plurality of metal sheets are electrically connected.
  • a structure formed by forming a plurality of notches 311 in a complete cylindrical structure may be used as the metal sleeve.
  • the metal sleeves listed above can be different types of sleeve structures, as long as the metal rod and the metal sleeve can be sleeved and the electric field coupling can be achieved.
  • the coupling structure 30 further includes a dielectric layer 33 disposed on the first resonating member 31 and the second resonator 32; for improving the dielectric constant between the first resonator 31 and the second resonator 32, in a specific arrangement, the dielectric layer 33 is fixedly connected to the first resonator 31, or The dielectric layer 33 is fixedly connected to the second resonator 32.
  • the dielectric layer 33 may be wrapped on the inner wall of the metal sleeve or on the outer wall of the metal rod, as shown in the structure of FIG. 4 In, the dielectric layer 33 is provided on the inner wall of the metal sleeve.
  • the number of dielectric layers 33 may be two.
  • the two dielectric layers 33 may be provided with metal sleeves and metal rods, respectively, or the first resonator 31 and the first The dielectric constant between the two resonators 32 improves the coupling effect.
  • the thickness of the above dielectric layer can be set according to requirements.
  • the dielectric layer can fill the first resonance element and the second resonance element on the basis of ensuring that the first resonance element and the second resonance element can move relatively.
  • the gap between the two resonating parts thus playing the role of shock absorption.
  • materials with relatively high insulation properties such as dielectric materials (rubber) or ceramics, can be used.
  • the metal rod plugged into the dielectric layer is more resistant to vibration, because The filter needs to meet strict reliability requirements. If it is operated in a vibrating environment, once the suspended metal rod shakes, the coupling coefficient will change, which will cause the frequency response of the filter to change. Therefore, the provided dielectric layer 33 can improve the stability of the entire coupling structure, and can also change the coupling capacitance and tune the coupling amount.
  • the first resonance element 31 and the second resonance element 32 may be either magnetic field coupling or electric field coupling.
  • the filter shown in FIG. 1 uses the filter shown in FIG. 1 as an example for simulation.
  • the first cavity 10 and the second cavity 20 are arranged in a staggered manner, and the first cavity 10 is located above the second cavity 20 (taking the filter placement direction shown in FIG. 1 as a reference direction).
  • the first resonating member 31 is a metal sleeve.
  • the metal sleeve is inserted into the first cavity 10 and screw-connected with the first cavity 10, wherein The depth of the metal sleeve inserted into the first cavity 10 is H.
  • the second resonator 32 is a metal rod, which is connected to the second cavity 20 and partially exposed to the second cavity 20, and the part of the metal rod exposed outside the second cavity 20 is inserted into the first cavity 10, and nested in the metal sleeve in the first cavity 10, and there is no direct contact between the metal rod and the metal sleeve.
  • the simulation results are shown in Figure 5.
  • the depth of the metal sleeve inserted into the metal chamber is used as reference data.
  • H 16mm
  • a positive value indicates magnetic field coupling
  • a negative sign indicates electric field coupling.
  • the absolute value measures the coupling strength. The larger the value, the stronger the coupling ability.
  • the characteristics of the filter are directly related to the arrangement of the cavity and the coupling properties and the coupling value between the cavity; if the coupling property is limited to magnetic field coupling or electric field coupling, then the choice of arrangement and combination method Will be constrained. Therefore, once the electric/magnetic field coupling can be arbitrarily converted, the arrangement and combination between the cavity of the filter is more free, which increases the freedom of filter design.
  • the first cavity 10 and the second cavity 20 may be arranged in different ways when specifically arranged.
  • the first cavity 10 and the second cavity 20 are misaligned.
  • the so-called phase misalignment refers to a height in the height direction of the first cavity 10 and the second cavity 20.
  • the difference specifically, may be that the bottom surface of the first cavity 10 and the bottom surface of the second cavity 20 have a height difference when they are installed, for example, the first cavity 10 is disposed above the second cavity 20.
  • FIG. 1 as an example, when shown in FIG.
  • the first cavity 10 and the second cavity 20 are different types of cavities, for example, the first cavity 10 is a metal cavity and the second cavity 20 As a dielectric cavity, due to the large difference in height between the metal cavity and the dielectric cavity, the coupling structure needs to be placed between the two cavities when placed side by side, so once the two have a large difference in height, it is difficult to interface The structure is applied. Therefore, in order to facilitate the arrangement of the first resonator 32 and the second resonator 32, the first cavity 10 and the second cavity 20 are offset in the height direction. When the same cavity is used for the first cavity 10 and the second cavity 20, since the two cavity types are the same, the volume or the height of the cavity itself is not much different, and the side-by-side arrangement may be adopted.
  • FIGS. 6 and 7 show that the first cavity 10 and the second cavity 20 provided by the embodiments of the present application are both metal cavity structures.
  • the first cavity 10 and the second cavity 20 are arranged, as shown in FIG. 6, when the first cavity 10 and the second cavity 20 are arranged side by side, the structure of the first cavity 10 and the second cavity 20 There is partial overlap to provide a coupled channel.
  • the first cavity 10 and the second cavity 20 share part of the housing and the top cover.
  • the first resonance element 31 and the second resonance element 32 are provided, the first resonance element 31 is provided on the top cover of the common portion, and the second resonance element 32 is provided on the bottom plate of the common portion, but its essence Again, the first resonator 31 is connected to the first cavity 10, and the second resonator 33 is connected to the second cavity 10.
  • the first resonating member 31 is a metal sleeve
  • the second resonating member 32 is a metal rod.
  • the provided coupling structure 30 can realize welding-free, a large debugging range (according to the resonance frequency), and a coupling coefficient of -0.04 to 0.05 can be realized to satisfy the filtering The demand for electronic products.
  • an embodiment of the present application further provides a base station, and the base station may be a base station in a wireless communication system.
  • the base station includes any one of the above filters.
  • the first resonance member 31 and the second resonance member 32 can be relatively moved to change the relative area between the first resonance member 31 and the second resonance member 32.
  • the first The resonance element 31 and the second resonance element 32 may be either magnetic field coupling or electric field coupling.

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Abstract

本申请提供了一种滤波器及基站,该滤波器包括第一腔体、第二腔体、耦合连接的第一谐振件及第二谐振件;其中,第一谐振件与第一腔体连接,第二谐振件与第二腔体连接,且第一谐振件与第二谐振件之间可相对移动并锁定在设定位置;第一谐振件与第二谐振件在第一面的垂直投影有重叠区域;第一面为平行于第一谐振件及第二谐振件相对移动的方向的平面。在采用上述耦合结构中,第一谐振件与第二谐振件之间可以相对移动,第一谐振件与第二谐振件之间既有磁场耦合也有电场耦合,通过改变第一谐振件与第二谐振件相对位置,可以实现磁场耦合和电场耦合之间的切换,从而提高两个腔体之间的耦合效果,进而提高滤波器的效果。

Description

一种滤波器及基站
相关申请的交叉引用
本申请要求在2018年12月29日提交中国专利局、申请号为201811647402.5、申请名称为“一种滤波器及基站”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到通信技术领域,尤其涉及到一种滤波器及基站。
背景技术
在现有通信系统中所使用的介质波导(Dielectric Waveguide,DW)滤波器有小型化,高品质因数体积比,大功率等特点,然而在实际应用中,由于介质波导自身需要靠打磨进行调试,会导致使用介质波导的滤波器互调特性出现偏差,同时由于介质波导高次模频率距离传输主模较近,会造成使用介质波导的滤波器远端谐波较差。为了解决纯介质波导结构的滤波器较差的互调特性和较近的谐波,常采用介质腔和金属腔级联的方法,但是现有介质与金属耦合的结构,均只能实现单一的磁场耦合或者电场耦合,且打磨介质的方法只能对耦合系数单向调节,影响到介质金属混合型滤波器中腔体的排列布局和耦合调节效果。
发明内容
本申请提供了一种滤波器及基站,用以提高滤波器中腔室之间的耦合效果。
第一方面,提供了一种滤波器,该滤波器包括第一腔体及第二腔体,其中,第一腔体与第二腔体之间耦合连接,在具体耦合连接时,是通过设置的耦合结构来实现时,该耦合结构包括第一谐振件及第二谐振件,其中,所述第一谐振件、第二谐振件分别与所述第一腔体及第二腔体一一对应连接。在具体设置第一谐振件及第二谐振件时,所述第一谐振件与所述第二谐振件之间可相对移动并锁定在设定位置,其中,所述第一谐振件与所述第二谐振件在第一面的垂直投影有重叠区域;所述第一面为平行于所述第一谐振件及所述第二谐振件相对移动的方向的平面。并且所述第一谐振件与所述第二谐振件耦合连接。在采用上述耦合结构中,第一谐振件与第二谐振件之间可以相对移动,以改变第一谐振件与第二谐振件之间的相对面积,在耦合时,第一谐振件与第二谐振件之间既可以是磁场耦合也可以是电场耦合,通过改变第一谐振件与第二谐振件相对位置,可以实现磁场耦合和电场耦合之间的转换,从而在耦合时,可以根据需要选择两个腔体之间的耦合方式,从而提高两个腔体之间的耦合效果,进而提高滤波器的效果。
为了更进一步的改善耦合的效果,在具体设置滤波器时,该滤波器还包括设置在所述第一谐振件及所述第二谐振件之间的介质层;且所述介质层与所述第一谐振件固定连接,和/或所述介质层与所述第二谐振件固定连接。通过在第一谐振件与第二谐振件之间增加一层介质层,增强了第一谐振件与第二谐振件之间的介电常数,进一步的改善耦合的效果和稳定性。
在具体设置第一谐振件与第二谐振件时,可以采用不同的结构形式,如在一个具体的 实施方案中,所述第一谐振件为金属套筒;所述第二谐振件为金属杆,且所述金属杆部分插入到所述金属套筒内。即通过金属套筒与金属杆之间的配合,实现了电场耦合和磁场耦合之间的切换,使得第一腔体和第二腔体之间的耦合类型可以灵活调整,从而提高了第一腔体与第二腔体之间的耦合效果。
对于金属套筒结构,即可采用一体结构,也可以采用分体结构。如在采用分体结构时,所述金属套筒包括多个金属片,且所述多个金属片间隔设置并围成所述金属套筒。在采用一体结构时,述第一谐振件为空心螺栓或空心螺钉。当然,金属套筒还可以采用一个筒体,然后筒体上设置多个开口等不同的结构形式。
在具体实现第一谐振件与第二谐振件之间可相对移动时,可以采用不同的结构形式,如所述第一谐振件与所述第一介质腔可移动连接,所述第二谐振件与所述第二介质腔固定连接;或,
所述第一谐振件与所述第一介质腔可移动连接,所述第二谐振件与所述第二介质腔可移动连接;或,
所述第一谐振件与所述第一介质腔固定连接,所述第二谐振件与所述第二介质腔可移动连接。通过第一谐振件和/或第二谐振件与其对应的腔体之间可移动连接,从而可以实现调整第一谐振件与第二谐振件之间重叠部分的尺寸的效果。
上述中的可移动连接包括螺纹连接或滑槽连接。通过不同的连接方式来实现谐振杆与对应的腔体之间的可移动。
在具体设置第一腔体及第二腔体时,可以采用不同的方式排列,如所述第一腔体及所述第二腔体并排设置;或所述第一腔体与所述第二腔体相错设置。在采用相错设置时,可以在水平方向上降低滤波器占用的空间。
在一个具体的实施方案中,所述第一腔体为金属腔体或介质腔体;所述第二腔体为金属腔体或介质腔体。从而可以使得耦合结构适应于包含不同类型腔体的滤波器。
在具体设置时,所述第一腔体与所述第二腔体均为金属腔体或介质腔体时,所述第一腔体及所述第二腔体并排设置;在采用同类型的腔体并排设置时,可以方便耦合结构的设置。
所述第一腔体为金属腔体,所述第二腔体为介质腔体时,所述第一腔体与所述第二腔体相错设置。在采用不同类型的腔体错位设置时,可以方便耦合结构的设置,并且减小滤波器占用的空间。
在一个具体的实施方案中,在所述第一腔体或所述第二腔体为金属腔时,所述滤波器还包括设置在所述金属腔内的金属谐振杆,以及插入到所述金属腔内的金属腔调螺。通过设置金属谐振杆以及金属腔调螺可以调节腔体的谐振。
在一个具体的实施方案中,在所述第一腔体或所述第二腔体为介质腔时,所述滤波器还包括插入到所述介质腔的至少一个介质腔调螺。通过设置的介质腔调螺可以改善介质腔的谐振。
第二方面,提供了一种基站,该基站包括上述任一项的滤波器。在采用上述耦合结构中,第一谐振件与第二谐振件之间可以相对移动,以改变第一谐振件与第二谐振件之间的相对面积,在耦合时,第一谐振件与第二谐振件之间既可以是磁场耦合也可以是电场耦合,通过改变第一谐振件与第二谐振件相对位置,可以实现磁场耦合和电场耦合之间的转换,从而在耦合时,可以根据需要灵活的调整两个腔体之间的耦合类型以及耦合量,从而提高 两个腔体之间的耦合效果,进而提高滤波器的效果。
附图说明
图1为本申请实施例提供的滤波器的结构示意图;
图2为本申请实施例提供的滤波器的剖视图;
图3为本申请实施例提供的耦合单元的另一种结构示意图;
图4为本申请实施例提供的第一谐振件的另一结构示意图;
图5为图1所示的滤波器的仿真示意图;
图6为本申请实施例提供的另一种滤波器的结构示意图;
图7为本申请实施例提供的另一种滤波器的剖视图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。
参考图1本申请实施例提供了一种滤波器,该滤波器可以应用于无线通信设备中,例如各种类型的基站或者其他的通信设备中。在一个具体的示例中,该滤波器可用于组成双工器,该双工器用于分离基站系统的收发信号;抑制功率放大器输出杂散;抑制各种干扰信号,避免接收机阻塞、互调和镜像干扰。
该滤波器包括两类腔体,为了方便区分,分别命名为第一腔体10及第二腔体20,其中,第一腔体10与第二腔体20的个数可以分别为多个,也可以分别为一个,但是无论采用多个或者单个时,第一腔体10与第二腔体20呈对设置,并且呈对设置的第一腔体10与第二腔体20之间耦合连接。在采用多个第一腔体10及多个第二腔体20时,其中的多个指的是两个或两个以上的个数。且在具体设置多个第一腔体10及第二腔体20时,第一腔体10及第二腔体20均采用单排排列的方式设置,以使得第一腔体10与第二腔体20能够一一对应耦合。
对于第一腔体10和第二腔体20来说,其可以选择不同的腔体,如金属腔体或者介质腔体。在如图1所示的滤波器中,第一腔体10为金属腔体,第二腔体20为介质腔体,其中的金属腔体如图1及图2中所示,该金属腔体包括一个金属壳体14,以及盖合在金属壳体14上的一个盖板13,其中,金属壳体14内设置有金属谐振杆12以及从盖板13上插入到金属腔内的金属腔调螺11。其中,金属谐振杆12以及金属腔调螺11可以采用现有技术中的金属腔体中谐振杆与调螺的设置方式,在此不予赘述。继续参考图1,对于介质腔体,其可以包括一个介质块,以及设置在介质块的至少一个介质腔调螺21,该介质腔调螺21可以为设置在介质块上的一个缺口或盲孔或槽。
在本申请实施例提供的第一腔体10和第二腔体20可以为上述的两种不同腔体的任一种腔体,如第一腔体10为金属腔体或介质腔体,而第二腔体20也可以为金属腔体或介质腔体。在具体组成本申请实施例的滤波器时,可以为第一腔体10为金属腔体、第二腔体20为介质腔体;或第一腔体10为介质腔体、第二腔体20为金属腔体;或者第一腔体10与第二腔体20均为介质腔体;或者第一腔体10与第二腔体20均为金属腔体。在具体设置时,可以根据实际的情况选择不同类型的腔体作为第一腔体10和第二腔体20。
在本申请实施例中,第一腔体10与第二腔体20在耦合连接时是通过设置的耦合结构30来实现的。该耦合结构30包括两个部件,分别为第一谐振件31和第二谐振件32。其中,第一谐振件31与第一腔体10连接,而第二谐振件32与第二腔体20连接。为了调整第一腔体10和第二腔体20之间的耦合量,以及改善第一腔体10与第二腔体20之间的耦合效果,在本申请实施例中设置第一谐振件31与第二谐振件32时,第一谐振件31与第二谐振件32可以相对移动,从而使得第一谐振件31与第二谐振件32形成的耦合结构30可以实现在磁场耦合和电场耦合之间进行切换。其中,电容性耦合,电场耦合、容性耦合等统称电场耦合;而磁场耦合、电感耦合、感性耦合统称磁场耦合。而目前传统的滤波器中金属腔体与金属腔体耦合,或者介质腔体与介质腔体耦合等方式的滤波器一旦加工制造出来,两个谐振腔之间的耦合只能是磁场耦合或者电场耦合中的一种,在调节时,只能调节耦合数值的大小,并不能改变耦合的性质(比如不能由电耦合转换到磁耦合,或者不能由磁场耦合转换成电场耦合)。因此,在本申请实施例中,通过改变第一谐振件31与第二谐振件32之间位置时,即能够改变耦合的性质(或称为耦合类型),也可以改变耦合数值的大小,从而提高了两个腔体之间的耦合的效果。
在具体实现进行磁场耦合和电场耦合之间切换时,是通过改变第一谐振件31与第二谐振件32之间重叠的部分的尺寸,在第一谐振件31与第二谐振件32之间相对移动到重叠一定尺寸时,第一谐振件31与第二谐振件32之间通过电场耦合,从而可以调整第一腔体10与第二腔体20的耦合范围。但是在调节第一谐振件31和第二谐振件32的位置时,应该保证第一谐振件31与第二谐振件32在第一面的垂直投影有重叠区域;其中,第一面为平行于第一谐振件31及第二谐振件32相对移动的方向的平面。如图2中所示,在移动第一谐振件31及第二谐振件32时,在竖直方向两者移动时至少部分重叠,即第一谐振件31与第二谐振件32之间不会脱离嵌套的方式。
在具体调整第一谐振件31与第二谐振件32之间的相对移动,可以通过第一谐振件31与第一腔体10之间的连接方式和/或第二谐振件32与第二腔体20之间的连接方式来实现。在具体设置时,可以采用第一谐振件31与第一腔体10之间可移动连接,而第二谐振件32与第二腔体20固定连接,或者采用第一谐振件31与第一腔体10之间可移动连接,而第二谐振件32与第二腔体20之间也可移动连接,或者采用第一谐振件31与第一腔体10固定连接,而第二谐振件32与第二腔体20之间可移动连接等不同的实现方式。应当理解的是,上述的可移动,指的是两个部件之间相向运动,既可以是一个部件固定,另一个部件移动,也可以是两个部件同时移动。另外,无论采用上述第一谐振件31移动还是采用第二谐振件32移动,都可以通过具体的结构实现第一谐振件31及第二谐振件32在移动到特定位置时,能够与其对应的腔体之间固定。
为了方便理解上述中的第一谐振件31与第二谐振件32之间相对移动,下面以第一谐振件31可相对第一腔体10移动,第二谐振件32与第二腔体20固定连接为例对其进行说明。如图2中所示的一个示例中,第一谐振件31与第一腔体10之间螺纹连接。此时,第一腔体10上设置有螺纹孔,以图1中为例,在第一腔体10为金属腔体时,该螺纹孔可以设置在盖板13上。第一谐振件31上设置有与该螺纹孔对应的外螺纹,在装配时,第一谐振件31与螺纹孔螺纹连接,并穿过该盖板13伸入到金属腔体内。而第二谐振件32固定在第二腔体20上,如图1中所示,在第二腔体20为介质腔体时,第二谐振件32固定在介质腔体上,并且穿过第一腔体的金属壳体14的底板后伸入到第一腔体10内,在实现第 一谐振件31与第一腔体10之间相对移动时,可以通过旋转第一谐振件31,使得第一谐振件31插入到第一腔体10内的长度变长或者变短,以实现第一谐振件31相对第二谐振件32相对移动。在采用螺纹连接时,可以保证在第一谐振件31调整到位时,第一谐振件31保持到该位置不会出现变动。除了上述列举的第一谐振件31可相对第一腔体10移动外,还可以将第一谐振件31与第一腔体螺纹连接,第二谐振件32与第二腔体螺纹连接,如第二腔体为介质腔体时,该介质腔体包括一个介质块,如图1中所示,可以在介质块上设置一个螺纹孔,第二谐振件32设置与该螺纹孔配合的外螺纹,将第二谐振件32螺纹连接在该螺纹孔中,如第二腔体为金属腔体,可以在金属腔体的金属壳体的底板上设置一个螺纹孔,将第二谐振件32螺旋在该螺纹孔中。此时第一谐振件31与第二谐振件32均可以移动。可以通过调整第一谐振件31,或者第二谐振件32,或者同时调整第一谐振件31与第二谐振件32来调整第一谐振件和第二谐振件之间的重叠部分的尺寸。除了上述两种方式外,还可以采用第一谐振件31与第一腔体10固定连接,第二谐振件32与第二腔体20螺纹连接,在调整第一谐振件31与第二谐振件32之间的重叠部分的尺寸时,可以通过旋转第二谐振件32来实现。
应当理解的是,上述列举的螺纹连接仅仅是一个具体的连接方式。在本申请实施例提供的耦合结构30中,还可以采用其他的方式来实现第一谐振件31相对第一腔体10移动并可锁定,如第一腔体10上设置滑槽,第一谐振件31滑动装配在该滑槽内,并且在第一谐振件31上设置有一个弹性凸起,在第一谐振件31滑动到特定位置,可以通过该弹性凸起卡在滑槽内,实现将第一谐振件31与第一腔体10的相对固定。在具体设置滑槽时,当第一腔体31为金属腔体时,可以将滑槽开设在金属腔体的顶盖13上,当第一腔体31为介质腔体时,可以在介质块上开设一个滑槽。同样的,第二谐振件32也可以采用上述列具体的滑槽的方式与第二腔体20相对滑动。对于现有技术中的其他可实现相对移动且可进行锁定的结构也可以应用到本申请的实施例中。
但是无论采用上述哪种方式,通过第一谐振件31与第二谐振件32之间相对移动,均可实现改变第一谐振件31与第二谐振件32之间的重叠部分的尺寸,即改变第一谐振件31与第二谐振件32之间的相对面积。其中,第一谐振件31与第二谐振件32之间的相对面积,指的是第一谐振件31与第二谐振件32能够形成电场耦合的面积。
在具体设置第一谐振件31及第二谐振件32时,第一谐振件31与第二谐振件32可以均为金属材料的导电部件,如铜、铝、铁等常见的金属材质。此外,第一谐振件31与第二谐振件32可以采用不同的结构。如在一个具体的实施方案中,第一谐振件31为金属套筒,而第二谐振件32为金属杆,且金属杆部分插入到金属套筒内。以图1及图2中所示的结构为例,在具体设置时,第一腔体10上设置有螺纹孔,金属套筒螺旋连接在第一腔体10内,而金属杆与第二腔体20固定连接。其中的金属套筒可以具体为空心螺栓或空心螺钉,并且金属杆部分伸入到该空心螺栓或空心螺钉螺中。在转动空心螺栓时,可以调整金属杆插入到空心螺栓或空心螺钉中的深度,进而改变空心螺栓与金属杆之间的重叠部分的尺寸。在具体设置上述的金属套筒时,该金属套筒除了上述列举的空心螺栓外,还可以为其他的结构,如金属套筒为一个一体结构,此时,如图2所示,该金属套筒为一个完整的筒状结构。当然,该金属套筒还可以采用分体结构,此时,金属套筒包括多个金属片,且多个金属片间隔设置围成环形,但多个金属片之间电连接。当然也可以采用如图3所示的结构中,在一个完整的筒状结构上开设多个缺口311形成的结构作为金属套筒。对于上 述列举的金属套筒可以为不同形式的套装结构,仅需能够实现金属杆与金属套筒之间能够套装,并实现电场耦合即可。
为了更进一步的改善耦合的效果,在第一谐振件31与第二谐振件32耦合时,如图4所示,耦合结构30还包括一个介质层33,该介质层33设置在第一谐振件31与第二谐振件32之间;用于改善第一谐振件31与第二谐振件32之间的介电常数,在具体设置时,该介质层33与第一谐振件31固定连接,或者该介质层33与第二谐振件32固定连接。在第一谐振件31为金属套筒,第二谐振件32为金属杆时,该介质层33可以包裹在金属套筒的内壁,或者包裹在金属杆的外壁上,在图4所示的结构中,介质层33设置在了金属套筒的内壁上。除上述列举的情况外,还可以采用介质层33的个数为两个,此时,两个介质层33可以分别设置金属套筒以及金属杆上,也可以实现增强第一谐振件31与第二谐振件32之间的介电常数,改善耦合的效果。可选的,上述介质层的厚度可以根据需求设置,在一个具体的实例中,该介质层可以在保证第一谐振件和第二谐振件可以相对移动的基础上,填充第一谐振件和第二谐振件之间的空隙,从而起到减震的效果。对于上述的介质层33可以采用绝缘性能比较高的材质,如介质材料(橡胶)或者陶瓷等,相比于金属杆悬空在金属套筒中,金属杆塞到介质层里更容易抗震动,因为滤波器需满足严格的可靠性要求,如果工作于震动环境下,悬空的金属杆一旦晃动导致耦合系数改变,从而会引起滤波器的频率响应变化。因此,设置的介质层33可以提高整个耦合结构的稳定性,同时还可以改变耦合电容,调谐耦合量。
在采用上述耦合结构30时,第一谐振件31与第二谐振件32之间既可以是磁场耦合也可以是电场耦合,通过改变第一谐振件31与第二谐振件32相对位置,可以实现磁场耦合和电场耦合之间的切换。为了方便理解本申请实施例提供的第一谐振件31与第二谐振件32之间的耦合效果,下面以图1所示的滤波器为例进行仿真,在图1所示的结构中,第一腔体10及第二腔体20相错设置,且第一腔体10位于第二腔体20的上方(以图1所示的滤波器的放置方向为参考方向),在具体设置第一谐振件31及第二谐振件32时,如图2所示,第一谐振件31为金属套筒,该金属套筒插入到第一腔体10内并与第一腔体10螺旋连接,其中,该金属套筒插入到第一腔体10内的深度为H。第二谐振件32为金属杆,该金属杆与第二腔体20连接,并部分外露到第二腔体20外,该金属杆外露在第二腔体20外的部分插入到第一腔体10中,并嵌套在第一腔体10内的金属套筒内,且金属杆与金属套筒之间并未直接接触。在转动金属套筒时,可以改变金属杆插入到金属套筒内的深度。
在对图1及图2所示的滤波器进行仿真后,仿真结果如图5所示,在图5所示的仿真结果中,以金属套筒插入到金属腔室的深度为参考数据,由图5曲线可以看出,通过调节金属套筒进入金属腔内部的深度H,在要求的谐振频率为1.75GHz,介质腔和金属腔之间的耦合系数从磁场耦合0.01(H=7mm)逐步增加至0.04(H=13mm);当进一步增加金属套筒插入的深度时,可以实现耦合翻转,耦合系数变为电场耦合-0.01(H=15mm),继续增加进入深度,最高可以实现-0.05(H=16mm)的耦合系数。其中,上述数据中,正值表示磁场耦合,负号表示电场耦合,绝对值大小衡量耦合的强度,数值越大,耦合能力越强。
在具体设置滤波器时,滤波器的特性与腔体的排列布局以及腔体之间的耦合性质,耦合数值大小直接相关;如果耦合性质被限定为磁场耦合或者电场耦合,那么排列组合方式的选择会被约束。因此,一旦电场/磁场耦合可以任意转换,滤波器的腔体之间的排列组合更加自由,增加了滤波器设计的自由度。
在本申请实施例中,第一腔体10及第二腔体20在具体设置时,可以采用不同的方式排列。例如,如图1中所示,第一腔体10与第二腔体20相错设置,所谓的相错设置指的是在第一腔体10及第二腔体20的高度方向上具有高度差,具体的,可以是第一腔体10的底面和第二腔体20的底面在设置时具有高度差,例如,第一腔体10设置在第二腔体20的上方。如图1中所示为例,在图1所示时,第一腔体10及第二腔体20为不同类型的腔体,如第一腔体10为金属腔体,第二腔体20为介质腔体,由于金属腔体与介质腔体的高度差别较大,并排放置的话需要将耦合结构置于两个腔体之间,所以一旦两者有较大的高度差,难以在分界面上施加该结构。因此,为了方便设置第一谐振件32与第二谐振件32,将第一腔体10与第二腔体20在高度方向上相错而置。第一腔体10与第二腔体20在采用相同类型的腔体时,由于两种腔体的类型相同,其体积或者腔体本身的高度差别不大,可以采用并排设置的方式。如图6及图7所示,其中,图6及图7示出了本申请实施例提供的第一腔体10及第二腔体20均为金属腔体的结构。在第一腔体10及第二腔体20设置时,如图6中所示,第一腔体10及第二腔体20并排设置时,第一腔体10与第二腔体20的结构有部分重叠以提供耦合的通道。具体为第一腔体10与第二腔体20共用部分的壳体以及顶盖。因此,在设置第一谐振件31及第二谐振件32时,第一谐振件31设置在了共用部分的顶盖上,第二谐振件32设置在了共用部分的底板上,但是其本质上还是第一谐振件31与第一腔体10连接,第二谐振件33与第二腔体10连接。其中的第一谐振件31为金属套筒,第二谐振件32为金属杆,在具体设置第一谐振件31及第二谐振件32时,可以参考上述中对第一谐振件31及第二谐振件32的描述。在采用两个金属腔体时,其中,金属套筒与第一腔体10中的顶盖螺纹连接,而金属杆与第二腔体20的底板固定连接。
通过上述描述可以看出,在本申请实施例提供的滤波器中,设置的耦合结构30可以实现免焊接,调试范围大(根据谐振频率),-0.04~0.05耦合系数均可实现,从而满足滤波器产品的需求。
此外,本申请实施例还提供了一种基站,该基站可以为无线通信系统中的基站,具体的,该基站包括上述任一项的滤波器。在采用上述耦合结构30中,第一谐振件31与第二谐振件32之间可以相对移动,以改变第一谐振件31与第二谐振件32之间的相对面积,在耦合时,第一谐振件31与第二谐振件32之间既可以是磁场耦合也可以是电场耦合,通过改变第一谐振件31与第二谐振件32相对位置,可以实现磁场耦合和电场耦合之间的切换,从而在耦合时,可以根据需要选择两个腔体之间的耦合方式,从而提高两个腔体之间的耦合效果,进而提高滤波器的效果。
以上,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以权利要求的保护范围为准。

Claims (13)

  1. 一种滤波器,其特征在于,包括第一腔体、第二腔体、第一谐振件及第二谐振件,且所述第一谐振件与所述第二谐振件之间耦合连接;
    所述第一谐振件与所述第一腔体连接,所述第二谐振件与所述第二腔体连接,且所述第一谐振件与所述第二谐振件之间可相对移动并锁定在设定位置;
    所述第一谐振件与所述第二谐振件在第一面的垂直投影有重叠区域,所述第一面为平行于所述第一谐振件及所述第二谐振件相对移动的方向的平面。
  2. 根据权利要求1所述的滤波器,其特征在于,还包括设置在所述第一谐振件及所述第二谐振件之间的介质层;所述介质层与所述第一谐振件固定连接,和/或所述介质层与所述第二谐振件固定连接。
  3. 根据权利要求1或2所述的滤波器,其特征在于,所述第一谐振件为金属套筒;所述第二谐振件为金属杆,且所述金属杆部分插入到所述金属套筒内。
  4. 根据权利要求3所述的滤波器,其特征在于,所述金属套筒包括多个金属片,且所述多个金属片间隔设置并围成所述金属套筒。
  5. 根据权利要求1至4任一项所述的滤波器,其特征在于,所述第一谐振件与所述第一腔体可移动连接,所述第二谐振件与所述第二腔体固定连接;或,
    所述第一谐振件与所述第一腔体可移动连接,所述第二谐振件与所述第二腔体可移动连接;或,
    所述第一谐振件与所述第一腔体固定连接,所述第二谐振件与所述第二腔体可移动连接。
  6. 根据权利要求5所述滤波器,其特征在于,所述可移动连接包括螺纹连接或滑槽连接。
  7. 根据权利要求6所述的滤波器,其特征在于,在所述第一谐振件与所述第一腔体螺纹连接时,所述第一谐振件为空心螺栓或空心螺钉。
  8. 根据权利要求1~7任一项所述的滤波器,其特征在于,所述第一腔体及所述第二腔体并排设置;或所述第一腔体与所述第二腔体相错设置。
  9. 根据权利要求1~8任一项所述的滤波器,其特征在于,所述第一腔体为金属腔体或介质腔体;所述第二腔体为金属腔体或介质腔体。
  10. 根据权利要求9所述的滤波器,其特征在于,所述第一腔体与所述第二腔体均为金属腔体或所述第一腔体与所述第二腔体均为介质腔体时,所述第一腔体及所述第二腔体并排设置;或者
    所述第一腔体为金属腔体,所述第二腔体为介质腔体时,所述第一腔体与所述第二腔体相错设置。
  11. 根据权利要求9或10所述的滤波器,其特征在于,在所述第一腔体或所述第二腔体为金属腔时,所述滤波器还包括设置在所述金属腔内的金属谐振杆,以及插入到所述金属腔内的金属腔调螺。
  12. 根据权利要求9或10所述的滤波器,其特征在于,在所述第一腔体或所述第二腔体为介质腔体时,所述滤波器还包括设置在所述介质腔体上的至少一个介质腔调螺。
  13. 一种基站,其特征在于,包括如权利要求1~12任一项的滤波器。
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