WO2020125263A1 - 一种led封装表面遮挡结构 - Google Patents

一种led封装表面遮挡结构 Download PDF

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Publication number
WO2020125263A1
WO2020125263A1 PCT/CN2019/116468 CN2019116468W WO2020125263A1 WO 2020125263 A1 WO2020125263 A1 WO 2020125263A1 CN 2019116468 W CN2019116468 W CN 2019116468W WO 2020125263 A1 WO2020125263 A1 WO 2020125263A1
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light
led
emitting module
sealing body
shielding structure
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PCT/CN2019/116468
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English (en)
French (fr)
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游志
裴小明
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深圳市瑞丰光电子股份有限公司
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Priority to US17/414,113 priority Critical patent/US20220052237A1/en
Publication of WO2020125263A1 publication Critical patent/WO2020125263A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the invention relates to the field of LED packaging, in particular to an LED packaging surface shielding structure.
  • LED Light Emitting Diode
  • the light emission of the LED is directional, and it cannot emit light greater than 180 degrees like the traditional light source, and even meets the requirement of 360 degrees in some cases. Therefore, when designing an LED lamp, the direction of the light emitting surface of the LED light source is generally set in the light emitting direction of the lamp according to the needs of use, so as to satisfy the irradiation conditions.
  • the general LED package has a front light-emitting structure, and the emitted light shape is a Lambertian light shape, which is prone to have a high intermediate light intensity and a low ambient light intensity, thereby forming a bright light spot. This situation will cause uneven lighting of the LED lamps, and at the same time the light is more dazzling, so that there is a color difference between the LED point light sources, affecting the overall light perception of the LED lamps.
  • the purpose of the present invention is to provide a new technical solution to solve the existing technical defects.
  • the technical problem to be solved by the present invention is to provide an LED packaging surface shielding structure.
  • a reflective layer is provided at least on the light emitting surface facing the LED light emitting module, so that the LED The light emitted from the front is reflected by the reflective layer, so that part or all of the light can be emitted from the side or other light-emitting surfaces.
  • An LED packaging surface shielding structure includes an LED light emitting module, a sealing body and a reflective layer, wherein the sealing body encapsulates the LED light emitting module inside the sealing body, the sealing body has a plurality of light emitting surfaces, at least in A light reflecting layer is provided on the light emitting surface directly opposite to the LED light emitting module, and the light reflecting layer can reflect part or all of the light emitted by the LED light emitting module to the other light emitting surface.
  • the reflective layer is an opaque material or a translucent material.
  • the reflective surface of the reflective layer is a flat surface, an inclined surface, an arc surface or a wavy surface.
  • the sealing body may be integrally formed by encapsulant.
  • the encapsulant is silica gel or epoxy resin.
  • the sealing body and the reflective layer are fused and connected.
  • the sealing body and the reflective layer are glued together.
  • the invention uses a reflective layer made of white opaque material or translucent material.
  • the reflective layer is directly opposite to the LED light emitting module, and reflects the light emitted by the LED light emitting module to other side light emitting surfaces, thereby increasing the LED lamps in The side light intensity and the overall luminous angle further change the over-bright spot caused by the excessive front light intensity in the prior art, reduce the intensity of the central light intensity, and thereby achieve the effect of improving the uniformity of the spot.
  • Figure 1 is a front view of an embodiment of the present invention
  • FIG. 2 is a left side view of an embodiment of the present invention.
  • FIG. 3 is a front view of an embodiment of the present invention.
  • FIG. 4 is a front view of an embodiment of the present invention.
  • the surface shielding structure of the LED package includes an LED light emitting module 1, a sealing body 2, and a reflective layer 3, wherein the LED light emitting module
  • the group 1 is arranged at the bottom of the LED device and connected to an external circuit, the sealing body 2 encapsulates the LED light-emitting module 1 installed inside it, and the reflective layer 3 is fixed to the outside of the sealing body 2.
  • the LED light emitting module 1 includes a substrate and an LED chip fixed on the substrate. When the power is turned on, the LED light emitting module 1 emits light from the front of the LED chip to the outside.
  • the LED chip is fixed on the substrate by thermal adhesive, that is, the solid crystal process is completed in the designated area of the substrate.
  • the substrate can be a metal substrate with high thermal conductivity (such as an aluminum substrate or a copper substrate), a silicon substrate, or a ceramic substrate.
  • the LED chip may be a blue light chip or an ultraviolet light chip of the same wave band or different wave bands according to needs.
  • the LED light emitting module 1 may also have various combinations and deformations. I will repeat them.
  • the LED light-emitting module 1 is encapsulated outside the LED light-emitting module 1 by an encapsulant to form a sealed body 2, which may be integrally glued and integrally formed, or may be provided outside
  • the transparent casing is encapsulated by encapsulant to form a sealing body 2 to complete the sealing of the LED device.
  • the encapsulant is made of thermosetting material, and the thermosetting material is silica gel or epoxy resin. At the same time, corresponding phosphor powder can be mixed in the encapsulant according to the needs of use to excite light of different wavelengths.
  • the transparent sealing body 2 forms a plurality of light emitting surfaces, and a reflective layer 3 is provided above the sealing body at least directly facing the light emitting surface of the LED light emitting module 1, in other embodiments,
  • the light-reflecting layer 3 can be provided on a plurality of light-emitting surfaces according to the needs of use to control the light-emitting direction of the LED device.
  • the side of the reflective layer 3 facing the LED light-emitting module 1 is a reflective surface, and the reflective surface may be a flat surface, an inclined surface, an arc surface, or a wavy surface. For specific needs, choose a suitable reflective surface.
  • the reflective layer 3 may be a white opaque material or other translucent materials.
  • the thickness or light transmittance of the reflective layer 3 can be adjusted according to the needs of use to adjust the intensity of light passing through the reflective layer 3.
  • the reflective layer 3 can be made of organic polymer materials such as PVC, PC, PE, etc., or other opaque or translucent materials, which can be melted by heating the above materials Furthermore, it is fused with the sealing body 2, and it can also be fixed on the sealing body 2 by using thermosetting glue or other adhesives.
  • the reflective layer 3 is entirely coated on the surface of the package before separation in the packaging process, and then the individual devices are separated, thereby improving production efficiency.
  • the LED light emitting module 1 When in use, the LED light emitting module 1 emits light after being energized, and light is emitted from the front of the LED chip.
  • a light reflecting layer 3 is provided on the light emitting surface facing the light emitting direction, and the light irradiates the reflecting surface of the light reflecting layer 3, and then part or all of the light undergoes one reflection or multiple reflections under the action of the reflecting surface Then it exits from the other light exit surface where the reflective layer 3 is not provided. It realizes that no additional optical lens is adopted, and the front luminous intensity of the LED device is adjusted while increasing the side light intensity and the overall luminous angle, thereby improving the uniformity of the light spot at the receiving end.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED封装表面遮挡结构，包括LED发光模组（1）、密封体（2）与反光层（3），其中所述密封体（2）将所述LED发光模组（1）封装在其内部，所述密封体（2）具有多个出光面，至少在所述LED发光模组（1）所正对的所述出光面上设置反光层（3），所述反光层（3）能够将所述LED发光模组（1）发射的光线部分或全部反射至其它所述出光面。运用在正对LED发光模组（1）方向设置反光层（3），将LED发光模组（1）所发射的光线反射到其他侧面出光面，进而增加LED灯具在侧面的光强和整体的发光角度，进而改变现有技术中因正面光强过大所引起的过亮光斑，降低中心光强的强度，从而达到提高光斑均匀性的效果。

Description

一种LED封装表面遮挡结构 技术领域
本发明涉及LED封装领域，尤其涉及一种LED封装表面遮挡结构。
背景技术
目前，发光二极管(Light Emitting Diode，LED)因具有功耗低、寿命长、体积小及亮度高等特性已经被广泛应用到很多领域，根据不同的使用环境和目的，可设计出不同结构的LED灯具。
根据LED芯片的结构和安装方式可以发现，LED的发光是具有方向性的，并不能像传统光源一样大于180度进行发光，甚至在某些情况下达到360度的发光要求。因此，在进行LED的灯具设计时，一般根据使用需要将LED光源的出光面的方向设置在灯具的出光方向上，进而满足照射条件。而一般LED封装为正面出光结构，所射出的光形为郎伯光形，易出现中间光强高四周光强较低，进而形成明亮光斑。此种情况将会造成LED灯具的发光不均匀，同时光线较为刺眼，使得LED点光源间存在色差，影响LED灯具的整体光感。
在现有技术中，特别是在对于光线均匀性要求较高的领域，例如电视背光源、面板灯灯面光源产品，需要增加二次光学透镜，将光源的光线角度增大，从而增加光斑的均匀性。但是，加设光学透镜将会导致成本和尺寸的增加。
有鉴于此，本发明的目的在于提供一种新的技术方案以解决现存的技术缺陷。
发明内容
本发明所要解决的技术问题，在于提供一种LED封装表面遮挡结构，通过在LED封装器件中设置遮挡结构，进而使得至少在LED发光模组所正对的出光面上设置反光层，使得从LED正面发射的光线经反光层的反射，使得部分或全部光线可以从侧面或其他出光面射出。
本发明解决上述技术问题所采用的技术方案是：
一种LED封装表面遮挡结构，包括LED发光模组、密封体与反光层，其中所述密封体将所述LED发光模组封装在其内部，所述密封体具有多个出光面，至少在所述LED发光模组所正对的所述出光面上设置反光层，所述反光层能够将所述LED发光模组发射的光线部分或全部反射至其它所述出光面。
在一种优选的实施方式中，所述反光层为不透光材料或半透明材料。
在一种优选的实施方式中，所述反光层的反射面为平面、斜面、弧面或波浪面。
在一种优选的实施方式中，所述密封体可由封装胶一体成型。
在一种优选的实施方式中，所述封装胶为硅胶或环氧树脂。
在一种优选的实施方式中，所述密封体和所述反光层熔合相连。
在一种优选的实施方式中，所述密封体和所述反光层胶合相连。
本发明的有益效果是：
本发明运用白色不透光材料或是半透明材料制成的反光层，反光层正对LED发光模组设置，将LED发光模组所发射的光线反射到其他侧面出光面，进而增加LED灯具在侧面的光强和整体的发光角度，进而改变现有技术中因正面光强过大所引起的过亮光斑，降低中心光强 的强度，从而达到提高光斑均匀性的效果。
附图说明
下面结合附图和实施例对本发明做进一步说明。
图1是本发明一个实施例的主视图；
图2是本发明一个实施例的左视图；
图3是本发明一个实施例的主视图；
图4是本发明一个实施例的主视图。
具体实施方式
以下将结合实施例和附图对本发明的构思、具体结构及产生的技术效果进行清楚、完整的描述，以充分地理解本发明的目的、方案和效果。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
需要说明的是，如无特殊说明，当某一特征被称为“固定”、“连接”在另一个特征，它可以直接固定、连接在另一个特征上，也可以间接地固定、连接在另一个特征上。此外，本发明中所使用的上、下、左、右等描述仅仅是相对于附图中本发明各组成部分的相互位置关系来说的。
此外，除非另有定义，本文所使用的所有的技术和科学术语与本技术领域的技术人员通常理解的含义相同。本文说明书中所使用的术语只是为了描述具体的实施例，而不是为了限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的组合。
图1、图2是本发明一个实施例的主视图以及左视图，参照图1、图2，该LED封装表面遮挡结构包括LED发光模组1、密封体2、反光 层3，其中LED发光模组1设置于LED器件底部与外部电路连接，密封体2将完成安装的LED发光模组1封装在其内部，反光层3固定与密封体2外部。LED发光模组1包括基板和固定在基板上的LED芯片，在通电时LED发光模组1从LED芯片正面向外部发射光线。其中LED芯片通过导热胶粘结固设与基板上，即在基板的指定区域完成固晶工艺，基板可采用高导热的金属基板(如铝基板或铜基板)、硅基板或陶瓷基板。同时根据需要LED芯片可以是同波段或不同波段的蓝光芯片或紫外光芯片，在其他实施例中LED发光模组1还可以有多种组合和变形，为本领域的惯用技术手段，在此不予赘述。
如图1和图2所示，在LED发光模组1的外部通过封装胶对于LED发光模组1进行封装形成密封体2，其中可采用整体涂胶一体成型的方式，也可采用在外部设置透明壳体，通过封装胶进行封装进而构成密封体2,完成LED器件的密封。其中封装胶为热固性材料制成，所述热固性材料为硅胶或环氧树脂，同时可以根据使用需要在封装胶内混有相应的荧光粉，以激发出不同波长的光。
完成封装后，在本实施例中，透明的密封体2形成多个出光面，在密封体上方至少正对LED发光模组1的出光面上设置一反光层3，在其他实施例中，也可根据使用需要，在多个出光面上设置反光层3，以控制LED器件的出光方向。如图1、2、3和4所示，其中在本实施例中，反光层3朝向LED发光模组1的一面为反射面，反射面可以为平面、斜面、弧面或波浪面，可以根据具体需要，选用合适的反射面。反光层3可以为白色不透光材料或是其他半透明材料，可以根据使用需要调整反光层3的厚度或透光率，以调整通过反光层3的光线的强 度。在本实施例中，反光层3可以为有机高分子材料制成例如PVC、PC、PE等，也可以由其他不透光或半透明的材料制成，可以通过对于以上材料的加热使其熔化进而与密封体2熔合在一起，也可使用热固胶或其他胶黏剂进行胶合固定在密封体2上。在本实施例中，反光层3在封装过程中分离前整体涂覆在封装表面，然后再将单个器件分离，进而提高生产效率。
在使用时，LED发光模组1通电后发光，光线从LED芯片正面发出。在本实施例中，在正对发光方向的出光面上设置有反光层3，光线照射在反光层3的反射面上，进而部分或全部光线在反射面的作用下经过一次反射或多次反射后从其它没有设置反光层3的出光面射出。实现了不采用额外的光学透镜，实现调整LED器件的正面发光强度的同时增加侧面的出光强度和整体的发光角度，进而改善接收端光斑的均匀性。
以上是对本发明的较佳实施进行了具体说明，但本发明创造并不限于所述实施例，熟悉本领域的技术人员在不违背本发明精神的前提下还可做出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (7)

  1. 一种LED封装表面遮挡结构，其特征在于，包括LED发光模组、密封体与反光层，其中所述密封体将所述LED发光模组封装在其内部，所述密封体具有多个出光面，至少在所述LED发光模组所正对的所述出光面上设置反光层，所述反光层能够将所述LED发光模组发射的光线部分或全部反射至其它所述出光面。
  2. 根据权利要求1所述的LED封装表面遮挡结构，其特征在于，所述反光层为不透光材料或半透明材料。
  3. 根据权利要求1所述的LED封装表面遮挡结构，其特征在于，所述反光层的反射面为平面、斜面、弧面或波浪面。
  4. 根据权利要求1所述的LED封装表面遮挡结构，其特征在于，所述密封体可由封装胶一体成型。
  5. 根据权利要求4所述的LED封装表面遮挡结构，其特征在于，所述封装胶为硅胶或环氧树脂。
  6. 根据权利要求1所述的LED封装表面遮挡结构，其特征在于，所述密封体和所述反光层熔合相连。
  7. 根据权利要求1所述的LED封装表面遮挡结构，其特征在于，所述密封体和所述反光层胶合相连。
PCT/CN2019/116468 2018-12-17 2019-11-08 一种led封装表面遮挡结构 WO2020125263A1 (zh)

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WO2023274855A1 (de) * 2021-06-28 2023-01-05 Osram Opto Semiconductors Gmbh Licht emittierendes bauelement

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CN209344123U (zh) * 2018-12-17 2019-09-03 深圳市瑞丰光电子股份有限公司 一种led封装表面遮挡结构
CN111505865A (zh) * 2020-04-20 2020-08-07 深圳市隆利科技股份有限公司 直下式背光模组
CN112462554B (zh) * 2020-07-16 2024-05-17 江西晶亮光电科技协同创新有限公司 新型发光装置及其制备方法、背光模组
CN114361318A (zh) * 2022-01-14 2022-04-15 福建天电光电有限公司 大角度发光的led封装结构及其封装方法

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