WO2020118892A1 - 柔性显示面板以及显示装置 - Google Patents

柔性显示面板以及显示装置 Download PDF

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Publication number
WO2020118892A1
WO2020118892A1 PCT/CN2019/075443 CN2019075443W WO2020118892A1 WO 2020118892 A1 WO2020118892 A1 WO 2020118892A1 CN 2019075443 W CN2019075443 W CN 2019075443W WO 2020118892 A1 WO2020118892 A1 WO 2020118892A1
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WIPO (PCT)
Prior art keywords
layer
flexible substrate
display panel
hardened
organic light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/075443
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English (en)
French (fr)
Inventor
郭庆勋
王硕晟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/462,542 priority Critical patent/US10861912B2/en
Publication of WO2020118892A1 publication Critical patent/WO2020118892A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

Definitions

  • the present application relates to the field of display technology, in particular to a flexible display panel and a display device.
  • Active matrix organic light emitting display panel Active-matrix organic light emitting diode, AMOLED It has the advantages of fast response, high color gamut, high contrast, wide viewing angle, low power consumption, foldable, light weight, thin thickness, simple structure and low cost, and is regarded as one of the most promising products .
  • the technical problem mainly solved by the present application is how to prevent the flexible display panel from breaking, thereby effectively improving the service life of the flexible display panel.
  • the present application provides a flexible display panel, including:
  • An organic light emitting diode layer is disposed on the flexible substrate, the organic light emitting diode layer includes a plurality of sub-pixels arranged at intervals;
  • a hardened block is provided in the organic light emitting diode layer, and the hardened block is correspondingly disposed at a gap between a plurality of the sub-pixels that are arranged at intervals;
  • the organic light emitting diode layer includes:
  • An active layer a first insulating layer, a gate layer, a second insulating layer, a source and drain layer, a flat layer, an anode layer, an organic light emitting layer, and a cathode layer disposed on the flexible substrate;
  • the orthographic projection of the active layer on the flexible substrate, the orthographic projection of the gate layer on the flexible substrate, the orthographic projection of the source and drain on the flexible substrate, the anode layer The orthographic projection on the flexible substrate and the orthographic projection of the cathode layer on the flexible substrate are located between the orthographic projections of adjacent hardened blocks on the flexible substrate;
  • the material of the hardened block is ultraviolet curing resin.
  • the adjacent hardened blocks are located in the same layer, and the adjacent hardened blocks are located in the same layer as the first insulating layer, the second insulating layer, or the flat layer.
  • adjacent hardened blocks are located in different layers, and the hardened blocks are located in the first insulating layer, the second insulating layer, or the flat layer.
  • the flexible display panel further includes a wiring layer, and the wiring layer is disposed on the organic light emitting diode layer;
  • the trace layer is a grid-like structure
  • the traces in the grid-like trace layer are correspondingly disposed at the gaps between the plurality of sub-pixels
  • the trace layer is on the flexible substrate
  • the orthographic projection above coincides with the orthographic projection of the hardened block on the flexible substrate.
  • the hardening block includes a plurality of hardening blocks correspondingly disposed on the bending region of the flexible substrate, and a plurality of hardening correspondingly disposed on the non-bending regions of the flexible substrate Blocks; wherein, the number of hardened blocks correspondingly disposed on the bending region of the flexible substrate is greater than the number of hardened blocks correspondingly disposed on the non-bending region of the flexible substrate.
  • the hardening block includes a plurality of hardening blocks correspondingly disposed on the bending region of the flexible substrate, and a plurality of hardening correspondingly disposed on the non-bending regions of the flexible substrate Block; wherein, the number of hardened blocks correspondingly disposed on the bending region of the flexible substrate is equal to the number of hardened blocks correspondingly disposed on the non-bending region of the flexible substrate.
  • the flexible display panel further includes an encapsulation layer; wherein the encapsulation layer is disposed between the organic light emitting diode layer and the wiring layer, and the encapsulation layer covers the Organic light emitting diode layer.
  • the present application provides a flexible display panel, including:
  • An organic light emitting diode layer is disposed on the flexible substrate, the organic light emitting diode layer includes a plurality of sub-pixels arranged at intervals;
  • a hardened block is disposed in the organic light emitting diode layer, and the hardened block is correspondingly disposed at a gap between the plurality of sub-pixels that are spaced apart.
  • the organic light emitting diode layer includes:
  • the orthographic projection of the layer on the flexible substrate and the orthographic projection of the cathode layer on the flexible substrate are located between the orthographic projections of the adjacent hardened blocks on the flexible substrate.
  • the adjacent hardened blocks are located in the same layer, and the adjacent hardened blocks are located in the same layer as the first insulating layer, the second insulating layer, or the flat layer.
  • adjacent hardened blocks are located in different layers, and the hardened blocks are located in the first insulating layer, the second insulating layer, or the flat layer.
  • the flexible display panel further includes a wiring layer, and the wiring layer is disposed on the organic light emitting diode layer;
  • the trace layer is a grid-like structure
  • the traces in the grid-like trace layer are correspondingly disposed at the gaps between the plurality of sub-pixels
  • the trace layer is on the flexible substrate
  • the orthographic projection above coincides with the orthographic projection of the hardened block on the flexible substrate.
  • the hardening block includes a plurality of hardening blocks correspondingly disposed on the bending region of the flexible substrate, and a plurality of hardening correspondingly disposed on the non-bending regions of the flexible substrate Blocks; wherein, the number of hardened blocks correspondingly disposed on the bending region of the flexible substrate is greater than the number of hardened blocks correspondingly disposed on the non-bending region of the flexible substrate.
  • the hardening block includes a plurality of hardening blocks correspondingly disposed on the bending region of the flexible substrate, and a plurality of hardening correspondingly disposed on the non-bending regions of the flexible substrate Block; wherein, the number of hardened blocks correspondingly disposed on the bending region of the flexible substrate is equal to the number of hardened blocks correspondingly disposed on the non-bending region of the flexible substrate.
  • the flexible display panel further includes an encapsulation layer; wherein the encapsulation layer is disposed between the organic light emitting diode layer and the wiring layer, and the encapsulation layer covers the Organic light emitting diode layer.
  • the material of the hardened block is an ultraviolet curing resin.
  • the present application provides a display device including a flexible display panel
  • the flexible display panel includes:
  • An organic light emitting diode layer is disposed on the flexible substrate, the organic light emitting diode layer includes a plurality of sub-pixels arranged at intervals;
  • a hardened block is disposed in the organic light emitting diode layer, and the hardened block is correspondingly disposed at a gap between the plurality of sub-pixels that are spaced apart.
  • the organic light emitting diode layer includes:
  • An active layer a first insulating layer, a gate layer, a second insulating layer, a source and drain layer, a flat layer, an anode layer, an organic light emitting layer, and a cathode layer disposed on the flexible substrate;
  • the orthographic projection of the layer on the flexible substrate and the orthographic projection of the cathode layer on the flexible substrate are located between the orthographic projections of the adjacent hardened blocks on the flexible substrate.
  • the adjacent hardened blocks are located in the same layer, and the adjacent hardened blocks are located in the same layer as the first insulating layer, the second insulating layer, or the flat layer.
  • adjacent hardened blocks are located in different layers, and the hardened blocks are located in the first insulating layer, the second insulating layer, or the flat layer.
  • the beneficial effect of the present application is that the hardened block is disposed in the organic light emitting diode layer, and the hardened block pair is disposed at a gap between a plurality of sub-pixels arranged at intervals, which can prevent the flexible display panel from breaking, thereby effectively improving the flexible display The service life of the panel.
  • FIG. 1 is a schematic structural diagram of a first embodiment of a flexible display panel provided by this application.
  • FIG. 2 is a schematic structural diagram of a second embodiment of a flexible display panel provided by this application.
  • FIG. 3 is a schematic structural diagram of a third implementation manner of a flexible display panel provided by this application.
  • FIG. 4 is a schematic structural diagram of a fourth implementation manner of a flexible display panel provided by this application.
  • FIG. 5 is a schematic structural diagram of a fifth embodiment of a flexible display panel provided by this application.
  • FIG. 6 is a schematic structural diagram of a sixth implementation manner of a flexible display panel provided by this application.
  • FIG. 7 is a schematic structural diagram of a seventh embodiment of a flexible display panel provided by this application.
  • FIG. 8 is a schematic plan view of a first embodiment of a flexible display panel provided by this application.
  • FIG. 9 is a schematic plan view of a second embodiment of a flexible display panel provided by this application.
  • FIG. 1 is a schematic structural diagram of a first implementation manner of a flexible display panel provided by this application.
  • the present application provides a flexible display panel 1, which includes a flexible substrate 10 and an organic light emitting diode layer 20.
  • the organic light emitting diode layer 20 is disposed on the flexible substrate 10, and the organic light emitting diode layer 20 includes a plurality of sub-pixels 201 disposed at intervals.
  • the organic light emitting diode layer 20 is provided with a hardened block 30, and the hardened block 30 is correspondingly disposed at a gap between a plurality of sub-pixels 21 arranged at intervals.
  • the material of the flexible substrate 10 may be polyimide (Polyimide, PI).
  • the material of the hardening block 30 may be an ultraviolet curing resin, and the ultraviolet curing resin may be acryloxy, methacryloxy, vinyl, or allyl. Providing the hardened block 30 in the organic light emitting diode layer 20 can improve the bending resistance of the organic light emitting diode layer 20. When the flexible substrate 10 is prevented from bending, some of the film layers in the organic light emitting diode layer 20 are broken due to the bending, thereby causing the flexible display panel 1 to fail.
  • the organic light emitting diode layer 20 may include: an active layer 201, a first insulating layer 202, a gate layer 203, a second insulating layer 204, a source and drain layer 205, a flat layer 206, an anode stacked on the flexible substrate 10
  • the pixel definition layer 210 is used to define pixels, and covers at least part of the anode layer 207.
  • the orthographic projection of the active layer 201 on the flexible substrate 10, the orthographic projection of the gate layer 203 on the flexible substrate 10, the orthographic projection of the source and drain 205 on the flexible substrate 10, and the orthographic projection of the anode layer 207 on the flexible substrate 10 are located between the orthographic projections of the adjacent hardened blocks 30 on the flexible substrate 10. That is, the hardened block 30 is only provided in the first insulating layer 202, the second insulating layer 204, the flat layer 206, or the pixel definition layer 210. In this way, not only can the luminous performance of the flexible display panel 1 be ensured, but also the bending resistance of the flexible display panel 1 can be provided, thereby improving the service life of the flexible display panel 1.
  • the hardened block 30 in the organic light emitting diode layer 20 There are many methods for setting the hardened block 30 in the organic light emitting diode layer 20. For example, after the flat layer 206 is formed on the flexible substrate 10. Using an etching process, the flat layer 206 corresponding to the gap between the plurality of sub-pixels 21 is etched away. Then, the position is filled with ultraviolet curing resin. Immediately afterwards, using its ultraviolet curing properties, it is irradiated with ultraviolet light to cure it. After curing, a plurality of hardened blocks 30 that can improve the bending resistance of the flexible display panel 1 are obtained.
  • the adjacent hardened blocks 30 are located in the same layer, and the adjacent hardened blocks 30 are located in the same layer as the first insulating layer 202, the second insulating layer 204, or the flat layer 206.
  • the adjacent hardened block 30 and the flat layer 206 are located in the same layer, as shown in FIG. 1.
  • the flat layer 206 is formed. Using an etching process, the flat layer 206 corresponding to the gap between the plurality of sub-pixels 21 is etched away. Then, the position is filled with ultraviolet curing resin. Immediately afterwards, using its ultraviolet curing properties, it is irradiated with ultraviolet light to cure it, thereby obtaining a hardened block 30.
  • the adjacent hardened blocks 30 and the first insulating layer 202 are on the same layer, as shown in FIG. 2. During specific implementation, after the first insulating layer 202 is formed.
  • the first insulating layer 202 corresponding to the gap between the plurality of sub-pixels 21 is etched away. Then, the position is filled with ultraviolet curing resin. Immediately afterwards, using its ultraviolet curing properties, it is irradiated with ultraviolet light to cure it, thereby obtaining a hardened block 30.
  • the adjacent hardened block 30 and the second insulating layer 204 are located in the same layer, as shown in FIG. 3.
  • the second insulating layer 204 is formed. Using an etching process, the second insulating layer 204 corresponding to the gap between the plurality of sub-pixels 21 is etched away. Then, the position is filled with ultraviolet curing resin. Immediately afterwards, using its ultraviolet curing properties, it is irradiated with ultraviolet light to cure it, thereby obtaining a hardened block 30.
  • the adjacent hardened blocks 30 and the pixel definition layer 210 are located in the same layer, as shown in FIG. 4.
  • the pixel definition layer 210 is formed. Using an etching process, the pixel definition layer 210 corresponding to the gap between the plurality of sub-pixels 21 is etched away. Then, the position is filled with ultraviolet curing resin. Immediately afterwards, using its ultraviolet curing properties, it is irradiated with ultraviolet light to cure it, thereby obtaining a hardened block 30.
  • adjacent hardened blocks 30 are located in different layers, and the hardened blocks are located in the first insulating layer 202, the second insulating layer 204, or the flat layer 206.
  • one hardened block 30 is located in the first insulating layer 202, and the other hardened block 30 is located in the second insulating layer 204, as shown in FIG.
  • one hardened block 30 is located in the first insulating layer 202, and the other hardened block 30 is located in the flat layer 206, as shown in FIG.
  • this embodiment is merely to give two examples for description, and is not intended to limit the present application, and is specifically set according to the actual situation. It suffices that the adjacent hardened blocks 30 are located in different layers, and the hardened blocks are located in the first insulating layer 202, the second insulating layer 204, or the flat layer 206.
  • the hardening block 30 is disposed in the first insulating layer 202, the second insulating layer 204, or the flat layer 206, and the hardening block 30 is correspondingly disposed at the gap between the plurality of sub-pixels 21 that are spaced apart, which can prevent the flexible display panel 1 Breaking occurs, thereby effectively increasing the service life of the flexible display panel 1.
  • FIG. 7 is a schematic structural diagram of a seventh implementation manner of a flexible display panel provided by this application.
  • the present application provides a flexible display panel 1.
  • the difference between the flexible display panel 1 of FIG. 7 and the flexible display panel 1 of FIG. 1 is that the flexible display panel 1 further includes a wiring layer 40.
  • the wiring layer 40 is disposed on the organic light emitting diode layer 20.
  • the wiring layer 40 has a grid-like structure, and the wiring in the grid-like wiring layer 40 is correspondingly disposed at the gap between the plurality of sub-pixels 21.
  • the orthographic projection of the wiring layer 20 on the flexible substrate 10 and The orthographic projections of the hardened block 30 on the flexible substrate 10 coincide.
  • the hardened block 30 is first disposed in the organic light emitting diode layer 20, and the hardened block 30 is correspondingly disposed at the gap between the plurality of sub-pixels 21 spaced apart, which can prevent the flexible display panel 1 from occurring Fracture, thereby effectively increasing the service life of the flexible display panel 1.
  • the wiring layer 40 provided on the organic light emitting diode layer 20 is patterned to form the wiring layer 40 having a grid-like structure.
  • the traces in the grid-like trace layer 40 are correspondingly arranged at the gaps between the plurality of sub-pixels 21, and this patterned design itself can greatly increase the bending resistance of the trace layer 40, thereby greatly improving The service life of the flexible display panel 1.
  • it also contributes to the light emission of the sub-pixels 21, thereby enhancing the brightness of the flexible display panel 1.
  • the flexible display panel 1 further includes an encapsulation layer 50.
  • the encapsulation layer 50 is disposed between the organic light emitting diode layer 20 and the trace layer 40, and the encapsulation layer 50 covers the organic light emitting diode layer 20.
  • the encapsulation layer 50 is fabricated on the organic light emitting diode layer 20.
  • the encapsulation layer 50 is used to protect the organic material in the organic light-emitting diode layer 20, to prevent the organic material in the organic light-emitting diode layer 20 from contacting with water and oxygen in the air to cause the flexible display panel 1 to fail, thereby further improving the flexible display panel 1 service life.
  • FIG. 8 is a schematic plan view of a first implementation manner of a flexible display panel provided by this application.
  • the present application provides a flexible display panel 1.
  • the flexible substrate 10 includes a bending area 101 and a non-bending area 102.
  • the hardened block 30 includes a plurality of hardened blocks 30 correspondingly disposed on the bending regions 101 of the flexible substrate 10 and a plurality of hardened blocks 30 correspondingly disposed on the non-bent regions 102 of the flexible substrate 10.
  • the number of the hardened blocks 30 correspondingly disposed on the bending region 101 of the flexible substrate 10 is equal to the number of the hardened blocks 30 correspondingly disposed on the non-bending region 102 of the flexible substrate 10.
  • the number of the hardened blocks 30 provided on the bending region 101 is set to be larger than the number of the hardened blocks 30 provided on the non-bending region 102.
  • the stress on the bending area 101 and the non-bending area 102 can be made uniform, and it is convenient for engineering design, so that the production efficiency of the flexible display panel 1 can be improved.
  • FIG. 9 is a schematic plan view of a second embodiment of a flexible display panel provided by this application.
  • the present application provides a flexible display panel 1.
  • the difference between the flexible display panel 1 of FIG. 9 and the flexible display panel 1 of FIG. 8 is that the number of hardened blocks 30 corresponding to the bending regions 101 of the flexible substrate 10 is greater than that of the non-bending regions 102 corresponding to the flexible substrate 10 The number of hardened blocks 30.
  • the present application also provides a display device, including the flexible display panel 1 provided by any embodiment of the present application.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请提供的柔性显示面板以及显示装置,柔性显示面板包括:柔性基底;有机发光二极管层,有机发光二极管层设置在柔性基底上,有机发光二极管层包括间隔设置的多个子像素;其中,有机发光二极管层内设置有硬化块,硬化块对应设置在间隔设置的多个子像素之间的间隙处。

Description

柔性显示面板以及显示装置 技术领域
本申请涉及显示技术领域,具体涉及一种柔性显示面板以及显示装置。
背景技术
有源矩阵有机发光二极管显示面板(Active-matrix organic light emitting diode,AMOLED)它具有快响应、高色域、高对比度、广视角、低功耗、可折叠、重量轻、厚度薄,构造简单以及成本低等优势,被视为最具前途的产品之一。
目前柔性显示屏仍存在众多技术壁垒,在任意弯折屏幕的同时,如何保证屏幕及其上方集成的各种功能的完整性以及其耐弯折性,成为制约柔性屏发展的关键难题。
技术问题
本申请主要解决的技术问题,如何能够防止柔性显示面板发生断裂,从而有效提高柔性显示面板的使用寿命。
技术解决方案
第一方面,本申请提供了一种柔性显示面板,包括:
柔性基底;
有机发光二极管层,所述有机发光二极管层设置在所述柔性基底上,所述有机发光二极管层包括间隔设置的多个子像素;
其中,所述有机发光二极管层内设置有硬化块,所述硬化块对应设置在间隔设置的多个所述子像素之间的间隙处;
所述有机发光二极管层包括:
层叠设置在所述柔性基底上的有源层、第一绝缘层、栅极层、第二绝缘层、源漏极层、平坦层、阳极层、有机发光层以及阴极层;
所述有源层在所述柔性基底上的正投影、所述栅极层在所述柔性基底上的正投影、所述源漏极在所述柔性基底上的正投影、所述阳极层在所述柔性基底上的正投影以及所述阴极层在所述柔性基底上的正投影均位于相邻所述硬化块在所述柔性基底上的正投影之间;
所述硬化块的材料为紫外固化树脂。
在本申请的柔性显示面板中,相邻所述硬化块位于相同层,且相邻所述硬化块与所述第一绝缘层、第二绝缘层或平坦层位于相同层。
在本申请的柔性显示面板中,相邻所述硬化块位于不同层,且所述硬化块位于所述第一绝缘层、第二绝缘层或平坦层之中。
在本申请的柔性显示面板中,所述柔性显示面板还包括走线层,所述走线层设置在所述有机发光二极管层上;
其中,所述走线层为网格状结构,所述网格状走线层中的走线均对应设置在所述多个子像素之间的间隙处,所述走线层在所述柔性基底上的正投影与所述硬化块在所述柔性基底上的正投影重合。
在本申请的柔性显示面板中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量大于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
在本申请的柔性显示面板中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量等于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
在本申请的柔性显示面板中,所述柔性显示面板还包括封装层;其中,所述封装层设置在所述有机发光二极管层与所述走线层之间,且所述封装层覆盖所述有机发光二极管层。
第二方面,本申请提供了一种柔性显示面板,包括:
柔性基底;
有机发光二极管层,所述有机发光二极管层设置在所述柔性基底上,所述有机发光二极管层包括间隔设置的多个子像素;
其中,所述有机发光二极管层内设置有硬化块,所述硬化块对应设置在间隔设置的多个所述子像素之间的间隙处。
在本申请的柔性显示面板中,所述有机发光二极管层包括:
层叠设置在所述柔性基底上的所述有源层、第一绝缘层、栅极层、第二绝缘层、源漏极层、平坦层、阳极层、有机发光层以及阴极层;
其中,所述有源层在所述柔性基底上的正投影、所述栅极层在所述柔性基底上的正投影、所述源漏极在所述柔性基底上的正投影、所述阳极层在所述柔性基底上的正投影以及所述阴极层在所述柔性基底上的正投影均位于相邻所述硬化块在所述柔性基底上的正投影之间。
在本申请的柔性显示面板中,相邻所述硬化块位于相同层,且相邻所述硬化块与所述第一绝缘层、第二绝缘层或平坦层位于相同层。
在本申请的柔性显示面板中,相邻所述硬化块位于不同层,且所述硬化块位于所述第一绝缘层、第二绝缘层或平坦层之中。
在本申请的柔性显示面板中,所述柔性显示面板还包括走线层,所述走线层设置在所述有机发光二极管层上;
其中,所述走线层为网格状结构,所述网格状走线层中的走线均对应设置在所述多个子像素之间的间隙处,所述走线层在所述柔性基底上的正投影与所述硬化块在所述柔性基底上的正投影重合。
在本申请的柔性显示面板中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量大于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
在本申请的柔性显示面板中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量等于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
在本申请的柔性显示面板中,所述柔性显示面板还包括封装层;其中,所述封装层设置在所述有机发光二极管层与所述走线层之间,且所述封装层覆盖所述有机发光二极管层。
在本申请的柔性显示面板中,所述硬化块的材料为紫外固化树脂。
第三方面,本申请提供了一种显示装置,包括柔性显示面板;
所述柔性显示面板包括:
柔性基底;
有机发光二极管层,所述有机发光二极管层设置在所述柔性基底上,所述有机发光二极管层包括间隔设置的多个子像素;
其中,所述有机发光二极管层内设置有硬化块,所述硬化块对应设置在间隔设置的多个所述子像素之间的间隙处。
在本申请的显示装置中,所述有机发光二极管层包括:
层叠设置在所述柔性基底上的有源层、第一绝缘层、栅极层、第二绝缘层、源漏极层、平坦层、阳极层、有机发光层以及阴极层;
其中,所述有源层在所述柔性基底上的正投影、所述栅极层在所述柔性基底上的正投影、所述源漏极在所述柔性基底上的正投影、所述阳极层在所述柔性基底上的正投影以及所述阴极层在所述柔性基底上的正投影均位于相邻所述硬化块在所述柔性基底上的正投影之间。
在本申请的显示装置中,相邻所述硬化块位于相同层,且相邻所述硬化块与所述第一绝缘层、第二绝缘层或平坦层位于相同层。
在本申请的显示装置中,相邻所述硬化块位于不同层,且所述硬化块位于所述第一绝缘层、第二绝缘层或平坦层之中。
有益效果
本申请的有益效果是:将硬化块设置在有机发光二极管层内,且硬化块对设置在在间隔设置的多个子像素之间的间隙处,能够防止柔性显示面板发生断裂,从而有效提高柔性显示面板的使用寿命。
附图说明
图1为本申请提供的柔性显示面板的第一种实施方式的结构示意图;
图2为本申请提供的柔性显示面板的第二种实施方式的结构示意图;
图3为本申请提供的柔性显示面板的第三种实施方式的结构示意图;
图4为本申请提供的柔性显示面板的第四种实施方式的结构示意图;
图5为本申请提供的柔性显示面板的第五种实施方式的结构示意图;
图6为本申请提供的柔性显示面板的第六种实施方式的结构示意图;
图7为本申请提供的柔性显示面板的第七种实施方式的结构示意图;
图8为本申请提供的柔性显示面板的第一种实施方式的平面示意图;
图9为本申请提供的柔性显示面板的第二种实施方式的平面示意图。
本发明的实施方式
下面详细描述本申请的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。
请参阅图1,图1为本申请提供的柔性显示面板的第一种实施方式的结构示意图。
本申请提供一种柔性显示面板1,包括:柔性基底10以及有机发光二极管层20。有机发光二极管层20设置在柔性基底10上,有机发光二极管层20包括间隔设置的多个子像素201。其中,有机发光二极管层20内设置有硬化块30,硬化块30对应设置在间隔设置的多个子像素21之间的间隙处。
柔性基底10的材料可以是聚酰亚胺(Polyimide,PI)。硬化块30的材料可以是紫外固化树脂,该紫外固化树脂可以为丙烯酰氧基、甲基丙烯酰氧基、乙烯基或烯丙基。将该硬化块30设置在有机发光二极管层20内,可以提高该有机发光二极管层20的耐弯折性。防止柔性基底10弯折时,有机发光二极管层20中一些膜层由于弯折而造成断裂,进而造成柔性显示面板1失效。
该有机发光二极管层20可以包括:层叠设置在柔性基底10上的有源层201、第一绝缘层202、栅极层203、第二绝缘层204、源漏极层205、平坦层206、阳极层207、有机发光层208、阴极层209以及设置在阳极层207和阴极层209之间的像素定义层210。该像素定义层210用于定义像素,且至少覆盖部分的阳极层207。
其中,有源层201在柔性基底10上的正投影、栅极层203在柔性基底10上的正投影、源漏极205在柔性基底10上的正投影、阳极层207在柔性基底10上的正投影以及阴极层209在柔性基底10上的正投影均位于相邻硬化块30在柔性基底10上的正投影之间。即,硬化块30只设置在第一绝缘层202、第二绝缘层204、平坦层206或像素定义层210之中。这样不仅可以保证柔性显示面板1的发光性能,还可以提供该柔性显示面板1耐弯折性,进而提高柔性显示面板1的使用寿命。
将硬化块30设置在有机发光二极管层20内的方法有很多种。比如,在柔性基底10上形成平坦层206后。利用刻蚀工艺,将对应设置在多个子像素21之间的间隙处的平坦层206刻蚀掉。然后,在该位置填充紫外固化树脂。紧接着,然后利用其紫外固化特性,对其进行紫外光照射处理,使之固化。固化后得到多个可以提升该柔性显示面板1耐弯折性能的硬化块30。
在一种实施方式中,相邻硬化块30位于相同层,且相邻硬化块30与第一绝缘层202、第二绝缘层204或平坦层206位于相同层。
比如,相邻硬化块30与平坦层206位于同一层,如图1所示。具体实施时,在形成平坦层206后。利用刻蚀工艺,将对应设置在多个子像素21之间的间隙处的平坦层206刻蚀掉。然后,在该位置填充紫外固化树脂。紧接着,然后利用其紫外固化特性,对其进行紫外光照射处理,使之固化,从而得到硬化块30。又比如,相邻硬化块30与第一绝缘层202位于同一层,如图2所示。具体实施时,在形成第一绝缘层202后。利用刻蚀工艺,将对应设置在多个子像素21之间的间隙处的第一绝缘层202刻蚀掉。然后,在该位置填充紫外固化树脂。紧接着,然后利用其紫外固化特性,对其进行紫外光照射处理,使之固化,从而得到硬化块30。
又比如,相邻硬化块30与第二绝缘层204位于同一层,如图3所示。具体实施时,在形成第二绝缘层204后。利用刻蚀工艺,将对应设置在多个子像素21之间的间隙处的第二绝缘层204刻蚀掉。然后,在该位置填充紫外固化树脂。紧接着,然后利用其紫外固化特性,对其进行紫外光照射处理,使之固化,从而得到硬化块30。
再比如,相邻硬化块30与像素定义层210位于同一层,如图4所示。具体实施时,在形成像素定义层210后。利用刻蚀工艺,将对应设置在多个子像素21之间的间隙处的像素定义层210刻蚀掉。然后,在该位置填充紫外固化树脂。紧接着,然后利用其紫外固化特性,对其进行紫外光照射处理,使之固化,从而得到硬化块30。
在另一种实施方式中,相邻硬化块30位于不同层,且硬化块位于第一绝缘层202、第二绝缘层204或平坦层206之中。
比如,一个硬化块30位于第一绝缘层202之中,另一个硬化块30位于第二绝缘层204之中,如图5所示。又比如,一个硬化块30位于第一绝缘层202之中,另一个硬化块30位于平坦层206之中,如图6所示。具体的设置方法请参阅前面实施例。另外,本实施例仅仅只是举出两个例子进行说明,不作为对本申请的限制,具体根据实际情况进行设定。只要满足相邻硬化块30位于不同层,且硬化块位于第一绝缘层202、第二绝缘层204或平坦层206之中即可。
将硬化块30设置在第一绝缘层202、第二绝缘层204或平坦层206内,且硬化块30对应设置在在间隔设置的多个子像素21之间的间隙处,能够防止柔性显示面板1发生断裂,从而有效提高柔性显示面板1的使用寿命。
请参阅图7,图7为本申请提供的柔性显示面板的第七种实施方式的结构示意图。本申请提供一种柔性显示面板1。图7的柔性显示面板1与图1的柔性显示面板1的区别在于:柔性显示面板1还包括走线层40。该走线层40设置在有机发光二极管层20上。其中,走线层40为网格状结构,网格状走线层40中的走线均对应设置在多个子像素21之间的间隙处,走线层20在柔性基底10上的正投影与硬化块30在柔性基底10上的正投影重合。
在该种实施方式中,首先,先将硬化块30设置在有机发光二极管层20,且硬化块30对应设置在在间隔设置的多个子像素21之间的间隙处,能够防止柔性显示面板1发生断裂,从而有效提高柔性显示面板1的使用寿命。然后,再对设置在有机发光二极管层20上的走线层40进行图案化处理,形成具有网格状结构的走线层40。该网格状走线层40中的走线均对应设置在多个子像素21之间的间隙处,这一图案化的设计本身可以极大增加走线层40耐弯折性,从而极大提高柔性显示面板1的使用寿命。其次,还有助于子像素21的发光,从而提升柔性显示面板1的亮度。
请继续参阅图7,柔性显示面板1还包括封装层50。封装层50设置在有机发光二极管层20与走线层40之间,且该封装层50覆盖有机发光二极管层20。在有机发光二极管层20的制程完成后,在有机发光二极管层20上制作该封装层50。该封装层50用于保护有机发光二极管层20中的有机材料,避免有机发光二极管层20中的有机材料与空气中的水氧接触而造成柔性显示面板1失效,从而进一步提高了该柔性显示面板1的使用寿命。
请参阅图8,图8为本申请提供的柔性显示面板的第一种实施方式的平面示意图。本申请提供一种柔性显示面板1。该柔性基底10包括弯折区101和非弯折区102。硬化块30包括多个对应设置在柔性基底10的弯折区101上的硬化块30,以及多个对应设置在柔性基底10的非弯折区102上的硬化块30。其中,对应设置在柔性基底10的弯折区101上的硬化块30的数量等于对应设置在柔性基底10的非弯折区102上的硬化块30的数量。
因此,将设置在弯折区101上的硬化块30的数量设置为大于设置在非弯折区102上的硬化块30的数量。可以使得弯折区101和非弯折区102上的受力均一,并且便于工程设计,从而可以提高柔性显示面板1的生产效率。
请参阅图9,图9为本申请提供的柔性显示面板的第二种实施方式的平面示意图。本申请提供一种柔性显示面板1。图9的柔性显示面板1与图8的柔性显示面板1的区别在于:对应设置在柔性基底10的弯折区101上的硬化块30的数量大于对应设置在柔性基底10的非弯折区102上的硬化块30的数量。
由于柔性显示面板1的弯折区101上应力大于非弯折区101的应力。因此,将设置在弯折区101上的硬化块30的数量设置为大于设置在非弯折区102上的硬化块30的数量,可提高柔性显示面板1弯折区101的耐弯折性。
相应的,本申请还提供一种显示装置,包括本申请任一实施例提供的柔性显示面板1。
以上对本申请实施例提供的柔性显示面板以及显示装置进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请。同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种柔性显示面板,其包括:
    柔性基底;
    有机发光二极管层,所述有机发光二极管层设置在所述柔性基底上,所述有机发光二极管层包括间隔设置的多个子像素;
    其中,所述有机发光二极管层内设置有硬化块,所述硬化块对应设置在间隔设置的多个所述子像素之间的间隙处;
    所述有机发光二极管层包括:
    层叠设置在所述柔性基底上的有源层、第一绝缘层、栅极层、第二绝缘层、源漏极层、平坦层、阳极层、有机发光层以及阴极层;
    所述有源层在所述柔性基底上的正投影、所述栅极层在所述柔性基底上的正投影、所述源漏极在所述柔性基底上的正投影、所述阳极层在所述柔性基底上的正投影以及所述阴极层在所述柔性基底上的正投影均位于相邻所述硬化块在所述柔性基底上的正投影之间;
    所述硬化块的材料为紫外固化树脂。
  2. 根据权利要求1所述的柔性显示面板,其中,相邻所述硬化块位于相同层,且相邻所述硬化块与所述第一绝缘层、第二绝缘层或平坦层位于相同层。
  3. 根据权利要求1所述的柔性显示面板,其中,相邻所述硬化块位于不同层,且所述硬化块位于所述第一绝缘层、第二绝缘层或平坦层之中。
  4. 根据权利要求1所述的柔性显示面板,其中,所述柔性显示面板还包括走线层,所述走线层设置在所述有机发光二极管层上;
    其中,所述走线层为网格状结构,所述网格状走线层中的走线均对应设置在所述多个子像素之间的间隙处,所述走线层在所述柔性基底上的正投影与所述硬化块在所述柔性基底上的正投影重合。
  5. 根据权利要求1所述的柔性显示面板,其中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量大于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
  6. 根据权利要求1所述的柔性显示面板,其中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量等于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
  7. 根据权利要求1所述的柔性显示面板,其中,所述柔性显示面板还包括封装层;其中,所述封装层设置在所述有机发光二极管层与所述走线层之间,且所述封装层覆盖所述有机发光二极管层。
  8. 一种柔性显示面板,其包括:
    柔性基底;
    有机发光二极管层,所述有机发光二极管层设置在所述柔性基底上,所述有机发光二极管层包括间隔设置的多个子像素;
    其中,所述有机发光二极管层内设置有硬化块,所述硬化块对应设置在间隔设置的多个所述子像素之间的间隙处。
  9. 根据权利要求8所述的柔性显示面板,其中,所述有机发光二极管层包括:
    层叠设置在所述柔性基底上的有源层、第一绝缘层、栅极层、第二绝缘层、源漏极层、平坦层、阳极层、有机发光层以及阴极层;
    其中,所述有源层在所述柔性基底上的正投影、所述栅极层在所述柔性基底上的正投影、所述源漏极在所述柔性基底上的正投影、所述阳极层在所述柔性基底上的正投影以及所述阴极层在所述柔性基底上的正投影均位于相邻所述硬化块在所述柔性基底上的正投影之间。
  10. 根据权利要求9所述的柔性显示面板,其中,相邻所述硬化块位于相同层,且相邻所述硬化块与所述第一绝缘层、第二绝缘层或平坦层位于相同层。
  11. 根据权利要求9所述的柔性显示面板,其中,相邻所述硬化块位于不同层,且所述硬化块位于所述第一绝缘层、第二绝缘层或平坦层之中。
  12. 根据权利要求8所述的柔性显示面板,其中,所述柔性显示面板还包括走线层,所述走线层设置在所述有机发光二极管层上;
    其中,所述走线层为网格状结构,所述网格状走线层中的走线均对应设置在所述多个子像素之间的间隙处,所述走线层在所述柔性基底上的正投影与所述硬化块在所述柔性基底上的正投影重合。
  13. 根据权利要求8所述的柔性显示面板,其中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量大于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
  14. 根据权利要求8所述的柔性显示面板,其中,所述硬化块包括多个对应设置在所述柔性基底的弯折区上的硬化块,以及多个对应设置在所述柔性基底的非弯折区上的硬化块;其中,对应设置在所述柔性基底的弯折区上的硬化块的数量等于对应设置在所述柔性基底的非弯折区上的硬化块的数量。
  15. 根据权利要求8所述的柔性显示面板,其中,所述柔性显示面板还包括封装层;其中,所述封装层设置在所述有机发光二极管层与所述走线层之间,且所述封装层覆盖所述有机发光二极管层。
  16. 根据权利要求8所述的显示面板,其中,所述硬化块的材料为紫外固化树脂。
  17. 一种显示装置,其包括柔性显示面板;
    所述柔性显示面板包括:
    柔性基底;
    有机发光二极管层,所述有机发光二极管层设置在所述柔性基底上,所述有机发光二极管层包括间隔设置的多个子像素;
    其中,所述有机发光二极管层内设置有硬化块,所述硬化块对应设置在间隔设置的多个所述子像素之间的间隙处。
  18. 根据权利要求17所述的显示装置,其中,所述有机发光二极管层包括:
    层叠设置在所述柔性基底上的有源层、第一绝缘层、栅极层、第二绝缘层、源漏极层、平坦层、阳极层、有机发光层以及阴极层;
    其中,所述有源层在所述柔性基底上的正投影、所述栅极层在所述柔性基底上的正投影、所述源漏极在所述柔性基底上的正投影、所述阳极层在所述柔性基底上的正投影以及所述阴极层在所述柔性基底上的正投影均位于相邻所述硬化块在所述柔性基底上的正投影之间。
  19. 根据权利要求18所述的显示装置,其中,相邻所述硬化块位于相同层,且相邻所述硬化块与所述第一绝缘层、第二绝缘层或平坦层位于相同层。
  20. 根据权利要求18所述的显示装置,其中,相邻所述硬化块位于不同层,且所述硬化块位于所述第一绝缘层、第二绝缘层或平坦层之中。
PCT/CN2019/075443 2018-12-15 2019-02-19 柔性显示面板以及显示装置 Ceased WO2020118892A1 (zh)

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