WO2020114056A1 - Assembling method for magnetic circuit assembly - Google Patents

Assembling method for magnetic circuit assembly Download PDF

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Publication number
WO2020114056A1
WO2020114056A1 PCT/CN2019/109005 CN2019109005W WO2020114056A1 WO 2020114056 A1 WO2020114056 A1 WO 2020114056A1 CN 2019109005 W CN2019109005 W CN 2019109005W WO 2020114056 A1 WO2020114056 A1 WO 2020114056A1
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WO
WIPO (PCT)
Prior art keywords
magnet
magnetic
frequency alternating
magnetic field
assembling method
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PCT/CN2019/109005
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French (fr)
Chinese (zh)
Inventor
于洁
褚勇
鲁路路
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歌尔股份有限公司
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Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2020114056A1 publication Critical patent/WO2020114056A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Definitions

  • the invention discloses a method for assembling a magnetic circuit assembly.
  • the assembling method includes: providing a magnetic conductive plate and a magnet, and covering the magnetic conductive plate on the magnet; between the magnetic conductive plate and the magnet Set thermosetting adhesive between; place the magnetic permeable plate and the magnet in a high frequency alternating magnetic field, and use the high frequency alternating magnetic field to heat the magnetic permeable plate and the magnet; wait for the thermosetting adhesive
  • the adhesive is cured, and the magnetic conductive plate and the magnet are fixedly connected.
  • One technical effect of the present invention is that the curing speed of the adhesive is accelerated, the adhesive is uniformly heated, and the adhesive effect of the adhesive is improved.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Disclosed is an assembling method for a magnetic circuit assembly. The assembling method comprises: providing a magnetic conduction plate and a magnet, and making the magnetic conduction plate cover the magnet; providing a thermosetting adhesive between the magnetic conduction plate and the magnet; providing the magnetic conduction plate and the magnet in a high frequency alternating magnetic field, and heating the magnetic conduction plate and the magnet by using the high frequency alternating magnetic field; and after the thermosetting adhesive is cured, fixedly connecting the magnetic conduction plate and the magnet. The present invention has the technical effects of accelerating the curing speed of the adhesive, uniformly heating the adhesive, and improving the bonding effect of the adhesive.

Description

无标题Untitled
本发明公开了一种磁路组件的装配方法，该装配方法包括：提供导磁板和磁铁，将所述导磁板盖设在所述磁铁上；在所述导磁板和所述磁铁之间设置热固性粘接剂；将所述导磁板和所述磁铁置于高频交变磁场中，采用高频交变磁场对所述导磁板和所述磁铁进行加热；待所述热固性粘接剂固化，将所述导磁板和所述磁铁固定连接。本发明的一个技术效果在于，加快粘接剂的固化速度、粘接剂均匀受热，提升了粘接剂的粘接效果。The invention discloses a method for assembling a magnetic circuit assembly. The assembling method includes: providing a magnetic conductive plate and a magnet, and covering the magnetic conductive plate on the magnet; between the magnetic conductive plate and the magnet Set thermosetting adhesive between; place the magnetic permeable plate and the magnet in a high frequency alternating magnetic field, and use the high frequency alternating magnetic field to heat the magnetic permeable plate and the magnet; wait for the thermosetting adhesive The adhesive is cured, and the magnetic conductive plate and the magnet are fixedly connected. One technical effect of the present invention is that the curing speed of the adhesive is accelerated, the adhesive is uniformly heated, and the adhesive effect of the adhesive is improved.

Claims (9)

  1. 一种磁路组件的装配方法，其特征在于，该方法包括：A method for assembling a magnetic circuit assembly, characterized in that the method includes:
    提供导磁板和磁铁，将所述导磁板盖设在所述磁铁上；Provide a magnetic conductive plate and a magnet, and cover the magnetic conductive plate on the magnet;
    在所述导磁板和所述磁铁之间设置热固性粘接剂；A thermosetting adhesive is provided between the magnetic conductive plate and the magnet;
    将所述导磁板和所述磁铁置于高频交变磁场中，采用高频交变磁场对所述导磁板和所述磁铁进行加热；Placing the magnetically conductive plate and the magnet in a high-frequency alternating magnetic field, and heating the magnetically conductive plate and the magnet using a high-frequency alternating magnetic field;
    待所述热固性粘接剂固化，将所述导磁板和所述磁铁固定连接。After the thermosetting adhesive is cured, the magnetic conductive plate and the magnet are fixedly connected.
  2. 根据权利要求1所述的装配方法，其特征在于，采用通电线圈对所述导磁板和所述磁铁施加高频交变磁场，将所述导磁板和所述磁铁置于所述线圈所环绕的区域中。The assembling method according to claim 1, characterized in that an energized coil is used to apply a high-frequency alternating magnetic field to the magnetic conductive plate and the magnet, and the magnetic conductive plate and the magnet are placed on the coil In the surrounding area.
  3. 根据权利要求1所述的装配方法，其特征在于，在所述磁铁远离所述导磁板的一侧固定设置有导磁轭。The assembling method according to claim 1, characterized in that a magnetic guide yoke is fixedly provided on the side of the magnet away from the magnetic guide plate.
  4. 根据权利要求3所述的装配方法，其特征在于，在所述磁铁和所述导磁轭之间设置热固性粘接剂；The assembly method according to claim 3, wherein a thermosetting adhesive is provided between the magnet and the magnetic yoke;
    将所述磁铁和所述导磁轭置于高频交变磁场中，采用高频交变磁场对所述磁铁和所述导磁轭进行加热；Placing the magnet and the magnetic yoke in a high-frequency alternating magnetic field, and heating the magnet and the magnetic yoke using a high-frequency alternating magnetic field;
    待所述热固性粘接剂固化，将所述磁铁和所述导磁轭固定连接。After the thermosetting adhesive is cured, the magnet and the magnetic yoke are fixedly connected.
  5. 根据权利要求3所述的装配方法，其特征在于，所述磁铁和所述导磁轭位于高频交变磁场中，所述导磁板位于高频交变磁场外。The assembling method according to claim 3, wherein the magnet and the magnetic yoke are located in a high frequency alternating magnetic field, and the magnetic conducting plate is located outside the high frequency alternating magnetic field.
  6. 根据权利要求3所述的装配方法，其特征在于，采用通电线圈对所述磁铁和所述导磁轭施加高频交变磁场，将所述磁铁和所述导磁轭置于所述线圈所环绕的区域中。The assembling method according to claim 3, characterized in that an energized coil is used to apply a high-frequency alternating magnetic field to the magnet and the magnetic yoke, and the magnet and the magnetic yoke are placed on the coil In the surrounding area.
  7. 根据权利要求2所述的装配方法，其特征在于，通电的频率为200KHZ-300KHZ。The assembling method according to claim 2, characterized in that the frequency of energization is 200KHZ-300KHZ.
  8. 根据权利要求7所述的装配方法，其特征在于，通电的时间为1s-3s。The assembling method according to claim 7, characterized in that the power-on time is 1s-3s.
  9. 根据权利要求1所述的装配方法，其特征在于，高频交变磁场的温度为135°-145°。The assembly method according to claim 1, wherein the temperature of the high-frequency alternating magnetic field is 135°-145°.
PCT/CN2019/109005 2018-12-07 2019-09-29 Assembling method for magnetic circuit assembly WO2020114056A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811497906.3 2018-12-07
CN201811497906.3A CN109714696A (en) 2018-12-07 2018-12-07 A kind of assembly method of magnetic circuit component

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WO2020114056A1 true WO2020114056A1 (en) 2020-06-11

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109714696A (en) * 2018-12-07 2019-05-03 歌尔股份有限公司 A kind of assembly method of magnetic circuit component
CN114257052B (en) * 2020-09-23 2023-09-15 丰田自动车株式会社 Method and apparatus for manufacturing rotor for rotating electrical machine

Citations (7)

* Cited by examiner, † Cited by third party
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EP0467016A2 (en) * 1990-07-20 1992-01-22 Pioneer Electronic Corporation Magnetic circuit for a speaker
CN102056057A (en) * 2009-11-06 2011-05-11 宝星电子股份有限公司 Microspeaker
JP4877579B2 (en) * 2005-05-20 2012-02-15 株式会社安川電機 Rotor manufacturing method, rotor manufactured by this method, and motor using this rotor
CN103442470A (en) * 2013-09-05 2013-12-11 哈尔滨理工大学 Electromagnetic heating device and heating method for electromagnetic heating device
CN105072728A (en) * 2015-08-07 2015-11-18 湖南千豪机电技术开发有限公司 Magnetic shielding tube-type electromagnetic induction heating device
US20180286580A1 (en) * 2017-03-28 2018-10-04 Toyota Jidosha Kabushiki Kaisha Manufacturing method of reactor and heating device
CN109714696A (en) * 2018-12-07 2019-05-03 歌尔股份有限公司 A kind of assembly method of magnetic circuit component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0595598A (en) * 1991-10-01 1993-04-16 Onkyo Corp Method for sticking edge material and gasket
CN208112946U (en) * 2018-05-17 2018-11-16 歌尔科技有限公司 Magnetic circuit system and acoustical generator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0467016A2 (en) * 1990-07-20 1992-01-22 Pioneer Electronic Corporation Magnetic circuit for a speaker
JP4877579B2 (en) * 2005-05-20 2012-02-15 株式会社安川電機 Rotor manufacturing method, rotor manufactured by this method, and motor using this rotor
CN102056057A (en) * 2009-11-06 2011-05-11 宝星电子股份有限公司 Microspeaker
CN103442470A (en) * 2013-09-05 2013-12-11 哈尔滨理工大学 Electromagnetic heating device and heating method for electromagnetic heating device
CN105072728A (en) * 2015-08-07 2015-11-18 湖南千豪机电技术开发有限公司 Magnetic shielding tube-type electromagnetic induction heating device
US20180286580A1 (en) * 2017-03-28 2018-10-04 Toyota Jidosha Kabushiki Kaisha Manufacturing method of reactor and heating device
CN109714696A (en) * 2018-12-07 2019-05-03 歌尔股份有限公司 A kind of assembly method of magnetic circuit component

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