CN109714696A - A kind of assembly method of magnetic circuit component - Google Patents
A kind of assembly method of magnetic circuit component Download PDFInfo
- Publication number
- CN109714696A CN109714696A CN201811497906.3A CN201811497906A CN109714696A CN 109714696 A CN109714696 A CN 109714696A CN 201811497906 A CN201811497906 A CN 201811497906A CN 109714696 A CN109714696 A CN 109714696A
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- Prior art keywords
- magnetic
- magnet
- conductive board
- frequency alternating
- assembly method
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of assembly method of magnetic circuit component, which includes: to provide magnetic conductive board and magnet, and the magnetic conductive board lid is located on the magnet；Heat-curable adhesive is set between the magnetic conductive board and the magnet；The magnetic conductive board and the magnet are placed in high-frequency alternating magnetic field, the magnetic conductive board and the magnet are heated using high-frequency alternating magnetic field；Solidify to the heat-curable adhesive, the magnetic conductive board is fixedly connected with the magnet.Of the invention one has technical effect that, accelerates curing rate, the bonding agent thermally equivalent of bonding agent, improves the adhesive effect of bonding agent.
Description
Technical field
The present invention relates to electroacoustic switch technology fields, more particularly, to a kind of assembly method of magnetic circuit component.
Background technique
In recent years, consumer electronics product is rapidly developed, and sounding device is electricity important in consumer electronics product
Sound transducer part is widely used as loudspeaker, earpiece, earphone etc..It is related with the performance improvement of electronic product
The improvement of processing technology, the assembly method of sounding device etc. is also inevitable trend.
Sounding device includes shell, magnetic circuit component and vibration component.Wherein, magnetic circuit component by magnetic conductive board, magnet and
Conductive magnetic yoke is constituted.In the prior art, it is heated by electrical heating core directly to magnetic circuit component, to be used in connection magnetic circuit component
Bonding agent is by heat cure, but there is many defects for this assembly method.
On the one hand, electrical heating core heats single component, causes bonding agent single side heated, uneven heating is even, affects bonding
The solidification effect of agent.On the other hand, electrical heating core needs continuous high temperature heating, working region temperature high, waste of resource and heating
Equipment takes up space is big.
Therefore, it is necessary to a kind of assembly method of new magnetic circuit component be proposed, to overcome drawbacks described above.
Summary of the invention
It is an object of the present invention to provide a kind of new solutions of the assembly method of magnetic circuit component.
According to the first aspect of the invention, a kind of assembly method of magnetic circuit component is provided, which includes: to provide
The magnetic conductive board lid is located on the magnet by magnetic conductive board and magnet；
Heat-curable adhesive is set between the magnetic conductive board and the magnet；
The magnetic conductive board and the magnet are placed in high-frequency alternating magnetic field, using high-frequency alternating magnetic field to the magnetic conductive board
It is heated with the magnet；
Solidify to the heat-curable adhesive, the magnetic conductive board is fixedly connected with the magnet.
Optionally, high-frequency alternating magnetic field is applied to the magnetic conductive board and the magnet using hot-wire coil, by the magnetic conduction
Plate and the magnet are placed in the circular region of the coil.
Optionally, conductive magnetic yoke is fixedly installed far from the side of the magnetic conductive board in the magnet.
Optionally, heat-curable adhesive is set between the magnet and the conductive magnetic yoke；
The magnet and the conductive magnetic yoke are placed in high-frequency alternating magnetic field, using high-frequency alternating magnetic field to the magnet and
The conductive magnetic yoke is heated；
Solidify to the heat-curable adhesive, the magnet is fixedly connected with the conductive magnetic yoke.
Optionally, the magnet and the conductive magnetic yoke are located in high-frequency alternating magnetic field, and the magnetic conductive board is located at high-frequency alternating
Outside magnetic field.
Optionally, high-frequency alternating magnetic field is applied to the magnet and the conductive magnetic yoke using hot-wire coil, by the magnet
It is placed in the circular region of the coil with the conductive magnetic yoke.
Optionally, the frequency of energization is 200KHZ-300KHZ.
Optionally, the time of energization is 1s-3s.
Optionally, the temperature of high-frequency alternating magnetic field is 135 ° -145 °.
Of the invention one has technical effect that, by the way that the magnetic conductive board and magnet that are provided with heat-curable adhesive are placed in height
In frequency alternating magnetic field, magnetic conductive board and magnet can be made to generate heat, and make the thermosetting property in magnetic conductive board and magnet by heat transfer
Bonding agent is heated, to realize the bonding of magnetic conductive board and magnet.The assembly method thermal efficiency provided by the invention is high, can significantly add
Curing rate, the bonding agent thermally equivalent of fast bonding agent, improve the adhesive effect of bonding agent.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the assembling schematic diagram for the magnetic circuit component that the specific embodiment of the invention provides；
Fig. 2 is another assembling schematic diagram for the magnetic circuit component that the specific embodiment of the invention provides.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Fig. 1 shows the assembling schematic diagram of magnetic circuit component in sounding device, and Fig. 2 shows magnetic circuit components in sounding device
Another assembling schematic diagram.It can be seen that the assembly relation of magnetic conductive board, magnet and conductive magnetic yoke in magnetic circuit component by Fig. 1 and Fig. 2.It is existing
By taking Fig. 1 to Fig. 2 as an example, principle, the step etc. of the assembly method of magnetic circuit component of the invention are described in detail.
The present invention provides a kind of assembly method of magnetic circuit component, and this method is applied to the assembly of sounding device magnetic circuit component
In.This method comprises: providing magnetic conductive board 10 and magnet 20, the magnetic conductive board 10 lid is located on the magnet 20.As shown in Figure 1
Embodiment in, magnetic conductive board 10 is located at the top of the magnet 20, and magnetic conductive board 10 is similar with the joint face shape of magnet 20,
For circle.Heat-curable adhesive (not shown) is provided between the magnetic conductive board 10 and the magnet 20.Thermosetting property is viscous
Connect agent it is heated after, molecule can further polymerize and be crosslinked adult form reticular structure, form insoluble solid-state bonding layer, and reach
The purpose of splicing.
Due to electromagnetic induction phenomenon, induced current can be generated in the conductor in high-frequency alternating magnetic field, this induced electricity
Stream can cause conductor temp.-elevating.The present invention is conducive to this principle, magnetic conductive board and magnet is placed in high-frequency alternating magnetic field, using height
Frequency alternating magnetic field heats the magnetic conductive board and the magnet.After magnetic conductive board and magnet are heated, by heat transfer, heat can
For delivery on the heat-curable adhesive between magnetic conductive board and magnet.After heat-curable adhesive solidification, by the magnetic conductive board and
The magnet is fixedly connected.The heat-curable adhesive on two surfaces of magnetic conductive board and magnet is attached in the effect of heat transfer
Under, while heating, heating up, this method can be such that heat-curable adhesive is heated evenly, and improve the bonding of heat-curable adhesive
Effect is conducive to the connective stability for promoting magnetic circuit component, promotes the quality of sounding device.
The assembly method of magnetic circuit component provided in this embodiment, by the magnetic conductive board and magnetic that will be provided with heat-curable adhesive
Iron is placed in high-frequency alternating magnetic field, and high-frequency alternating magnetic field produces eddy current to magnetic conductive board and magnet, can make magnetic conductive board and magnetic
Iron fever, and keep the heat-curable adhesive being located in magnetic conductive board and magnet heated by heat transfer, to realize magnetic conductive board and magnetic
The bonding of iron.Compared to traditional in such a way that heating core keeps magnetic conductive board heated and then drives bonding agent single side heated.This hair
Curing rate, the bonding agent thermally equivalent that the assembly method thermal efficiency of bright offer is high, can dramatically speed up bonding agent, improve viscous
Connect the adhesive effect of agent.In addition, this assembly method reduces the temperature of working region, high temperature is avoided to product and tooling etc.
Size influence, it is ensured that the precision of Product Assembly.
In a kind of possible embodiment, height is applied to the magnetic conductive board 10 and the magnet 10 using hot-wire coil 40
Frequency alternating magnetic field.For example, by the scheme of high-frequency current and coil combination, by magnetic conductive board 10 and magnet 20 be placed in by coil 40 around
It is solenoidal to be internally hollow in manufactured solenoid, when being passed through high frequency alternating current to solenoid, meeting inside solenoid
Generate high-frequency alternating magnetic field.As shown in Figure 1, the magnetic conductive board 10 and the magnet 20 are placed in the circular area of the coil 40
In domain.Wherein, magnetic conductive board 10 and magnet 20 with and be not directly contacted with, electric energy is passed to position by electromagnetic induction by hot-wire coil 40
Magnetic conductive board 10 and magnet 20 in coil 40, electric energy are thermal energy in the inner transformation of magnetic conductive board 10 and magnet 20.Due to magnetic conduction
Plate 10 and magnet 20 generate heat simultaneously, are attached to the heat-curable adhesive in magnetic conductive board 10 and magnet 20 in the effect of heat transfer
Under can also Double-side Heating simultaneously, to realize to the rapid link of magnetic circuit component.
In alternatively possible embodiment, magnetic circuit component includes: magnetic conductive board 10, magnet 10 and conductive magnetic yoke 30.?
The magnet 20 is fixedly installed conductive magnetic yoke 30 far from the side of the magnetic conductive board 10.As shown in Fig. 2, conductive magnetic yoke 30 is located at magnetic conduction
The lower section of plate and magnet assemblies.
Optionally, firstly, being set on joint face between the magnetic conductive board 10, the magnet 20 and the conductive magnetic yoke 30
It is equipped with heat-curable adhesive.Wherein, it is provided on two surfaces that magnet 20 is connect with magnetic conductive board 10 and conductive magnetic yoke 30 respectively
Heat-curable adhesive.The magnetic circuit component being made of magnetic conductive board 10, magnet 20 and conductive magnetic yoke 30 is placed in high-frequency alternating magnetic field again
In, the magnetic circuit component is heated using high-frequency alternating magnetic field.By heat transfer, heat can be bonded for delivery to thermosetting property
In agent, after heat-curable adhesive solidification, magnetic conductive board, magnet and conductive magnetic yoke can be fixedly connected.This embodiment, one
The secondary bonding that can be completed to magnetic conductive board, magnet and conductive magnetic yoke, assembly efficiency are higher.
Alternatively, magnetic conductive board and magnet first can also be realized connection by those skilled in the art, by magnetic conductive board and magnet
Component and conductive magnetic yoke, which are realized, to be connected.
Specifically, the magnet 20 and the conductive magnetic yoke 30 are located in high-frequency alternating magnetic field, and the magnetic conductive board 10 is located at height
Outside frequency alternating magnetic field.Wherein, magnetic conductive board 10 and magnet 20 be it is pre- first pass through the component that forms of bonding, this component again with magnetic conduction
Yoke 30 is attached.Since magnetic conductive board 10 is located at outside high-frequency alternating magnetic field, the effect of electromagnetic induction not will receive, magnetic conductive board 10 is simultaneously
It will not generate heat.And high-frequency alternating magnetic field produces eddy current to magnet 20 and conductive magnetic yoke 30, can make magnet 20 and conductive magnetic yoke 30
Fever, and heat is conducted on heat-curable adhesive between the two, to realize bonding.
As shown in Fig. 2, applying high-frequency alternating magnetic field to the magnet 20 and the conductive magnetic yoke 30 using hot-wire coil 40.Institute
It states magnet 20 and the conductive magnetic yoke 30 is placed in the circular region of the coil 40, the magnetic conductive board 10 is surround from the coil 40
Region in expose, i.e., magnetic conductive board 10 is higher than the circular region of the coil 40.In this way, electric energy is passed through electromagnetism sense by hot-wire coil
Magnet and conductive magnetic yoke in coil should be passed to, electric energy is thermal energy in magnet and the inner transformation of conductive magnetic yoke, is attached to magnetic
Heat-curable adhesive in the iron and conductive magnetic yoke Double-side Heating simultaneously under the action of heat transfer, to realize to the fast of magnetic circuit component
Speed bonding.
In the above-described embodiment, the frequency of energization is 200KHZ-300KHZ.It will be appreciated by those skilled in the art that,
The heating power of induced potential is related with frequency height and magnetic field power.The frequency being powered in coil is bigger, the magnetic flux generated
Amount is also bigger, therefore, improves the vortex that the frequency of electric current in hot-wire coil can be such that the magnetic circuit component being placed in coil generates
Increase, increase heating effect, makes heat-curable adhesive heating faster.In the assembly method of magnetic circuit component provided by the invention, lead to
The frequency of electricity is 200KHZ-300KHZ, and bonding agent curing rate can be improved, and saves assembly time, improves assembly efficiency.
In the specific implementation process, hot-wire coil can be placed on flow production line.Magnetic conductive board, magnet and conductive magnetic yoke are logical
It crosses in the high-frequency alternating magnetic field that manipulator circulation is formed to hot-wire coil.When those skilled in the art pass through the energization of control coil
Between, can magnetic circuit component heating time, to control the curing time of bonding agent.Preferably, conduction time 1s-
3s.This assembly method, intermittent-heating, the thermal efficiency that magnetic circuit component may be implemented are higher, and bonding agent is heated evenly, adhesive effect
It is good, it is not necessarily to long-time heating, has saved resource.
Wherein, the temperature of high-frequency alternating magnetic field is 135 ° -145 °.Traditional side for keeping magnetic conductive board heated using heating core
Formula, needs heating core continuous heating, and temperature is usually spent at 150 ° -200.On the one hand, in this assembly method, heat-curable adhesive
It is that single side is heated, uneven heating is even, and adhesive effect is poor；On the other hand, continuous high temperature heats, and assembly work regional temperature is excessively high,
Assembly precision etc. to product adversely affects.
In addition, traditional heating equipment land occupation is big, poor with assembly line coordinated effect.And invent the magnetic circuit component provided
The assembly method thermal efficiency is higher, curing rate, the bonding agent thermally equivalent that can dramatically speed up bonding agent, improve bonding agent
Adhesive effect.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (9)
1. a kind of assembly method of magnetic circuit component, which is characterized in that this method comprises:
Magnetic conductive board and magnet are provided, the magnetic conductive board lid is located on the magnet；
Heat-curable adhesive is set between the magnetic conductive board and the magnet；
The magnetic conductive board and the magnet are placed in high-frequency alternating magnetic field, using high-frequency alternating magnetic field to the magnetic conductive board and institute
Magnet is stated to be heated；
Solidify to the heat-curable adhesive, the magnetic conductive board is fixedly connected with the magnet.
2. assembly method according to claim 1, which is characterized in that using hot-wire coil to the magnetic conductive board and the magnetic
Iron applies high-frequency alternating magnetic field, and the magnetic conductive board and the magnet are placed in the circular region of the coil.
3. assembly method according to claim 1, which is characterized in that solid in side of the magnet far from the magnetic conductive board
Surely it is provided with conductive magnetic yoke.
4. assembly method according to claim 3, which is characterized in that heat is arranged between the magnet and the conductive magnetic yoke
Solidity bonding agent；
The magnet and the conductive magnetic yoke are placed in high-frequency alternating magnetic field, using high-frequency alternating magnetic field to the magnet and described
Conductive magnetic yoke is heated；
Solidify to the heat-curable adhesive, the magnet is fixedly connected with the conductive magnetic yoke.
5. assembly method according to claim 3, which is characterized in that the magnet and the conductive magnetic yoke are located at high-frequency alternating
In magnetic field, the magnetic conductive board is located at outside high-frequency alternating magnetic field.
6. assembly method according to claim 3, which is characterized in that using hot-wire coil to the magnet and the magnetic conduction
Yoke applies high-frequency alternating magnetic field, and the magnet and the conductive magnetic yoke are placed in the circular region of the coil.
7. assembly method according to claim 2, which is characterized in that the frequency of energization is 200KHZ-300KHZ.
8. assembly method according to claim 7, which is characterized in that the time of energization is 1s-3s.
9. assembly method according to claim 1, which is characterized in that the temperature of high-frequency alternating magnetic field is 135 ° -145 °.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811497906.3A CN109714696A (en) | 2018-12-07 | 2018-12-07 | A kind of assembly method of magnetic circuit component |
| PCT/CN2019/109005 WO2020114056A1 (en) | 2018-12-07 | 2019-09-29 | Assembling method for magnetic circuit assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811497906.3A CN109714696A (en) | 2018-12-07 | 2018-12-07 | A kind of assembly method of magnetic circuit component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109714696A true CN109714696A (en) | 2019-05-03 |
Family
ID=66254089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811497906.3A Pending CN109714696A (en) | 2018-12-07 | 2018-12-07 | A kind of assembly method of magnetic circuit component |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109714696A (en) |
| WO (1) | WO2020114056A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020114056A1 (en) * | 2018-12-07 | 2020-06-11 | 歌尔股份有限公司 | Assembling method for magnetic circuit assembly |
| CN114257052A (en) * | 2020-09-23 | 2022-03-29 | 丰田自动车株式会社 | Method and device for manufacturing rotor for rotating electrical machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0467016A2 (en) * | 1990-07-20 | 1992-01-22 | Pioneer Electronic Corporation | Magnetic circuit for a speaker |
| JPH0595598A (en) * | 1991-10-01 | 1993-04-16 | Onkyo Corp | Method for sticking edge material and gasket |
| CN102056057A (en) * | 2009-11-06 | 2011-05-11 | 宝星电子股份有限公司 | Microspeaker |
| JP4877579B2 (en) * | 2005-05-20 | 2012-02-15 | 株式会社安川電機 | Rotor manufacturing method, rotor manufactured by this method, and motor using this rotor |
| CN108666123A (en) * | 2017-03-28 | 2018-10-16 | 丰田自动车株式会社 | reactor manufacturing method and heating device |
| CN208112946U (en) * | 2018-05-17 | 2018-11-16 | 歌尔科技有限公司 | Magnetic circuit system and acoustical generator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103442470A (en) * | 2013-09-05 | 2013-12-11 | 哈尔滨理工大学 | Electromagnetic heating device and heating method for electromagnetic heating device |
| CN105072728B (en) * | 2015-08-07 | 2017-02-01 | 湖南千豪机电技术开发有限公司 | Magnetic shielding tube-type electromagnetic induction heating device |
| CN109714696A (en) * | 2018-12-07 | 2019-05-03 | 歌尔股份有限公司 | A kind of assembly method of magnetic circuit component |
-
2018
- 2018-12-07 CN CN201811497906.3A patent/CN109714696A/en active Pending
-
2019
- 2019-09-29 WO PCT/CN2019/109005 patent/WO2020114056A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0467016A2 (en) * | 1990-07-20 | 1992-01-22 | Pioneer Electronic Corporation | Magnetic circuit for a speaker |
| JPH0595598A (en) * | 1991-10-01 | 1993-04-16 | Onkyo Corp | Method for sticking edge material and gasket |
| JP4877579B2 (en) * | 2005-05-20 | 2012-02-15 | 株式会社安川電機 | Rotor manufacturing method, rotor manufactured by this method, and motor using this rotor |
| CN102056057A (en) * | 2009-11-06 | 2011-05-11 | 宝星电子股份有限公司 | Microspeaker |
| CN108666123A (en) * | 2017-03-28 | 2018-10-16 | 丰田自动车株式会社 | reactor manufacturing method and heating device |
| CN208112946U (en) * | 2018-05-17 | 2018-11-16 | 歌尔科技有限公司 | Magnetic circuit system and acoustical generator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020114056A1 (en) * | 2018-12-07 | 2020-06-11 | 歌尔股份有限公司 | Assembling method for magnetic circuit assembly |
| CN114257052A (en) * | 2020-09-23 | 2022-03-29 | 丰田自动车株式会社 | Method and device for manufacturing rotor for rotating electrical machine |
| CN114257052B (en) * | 2020-09-23 | 2023-09-15 | 丰田自动车株式会社 | Method and apparatus for manufacturing rotor for rotating electrical machine |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020114056A1 (en) | 2020-06-11 |
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Application publication date: 20190503 |