WO2020113741A1 - 一种扬声器外壳及其成型方法 - Google Patents

一种扬声器外壳及其成型方法 Download PDF

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Publication number
WO2020113741A1
WO2020113741A1 PCT/CN2018/125562 CN2018125562W WO2020113741A1 WO 2020113741 A1 WO2020113741 A1 WO 2020113741A1 CN 2018125562 W CN2018125562 W CN 2018125562W WO 2020113741 A1 WO2020113741 A1 WO 2020113741A1
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Prior art keywords
housing
speaker
connecting member
wall
injection molding
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English (en)
French (fr)
Inventor
毛林进
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Goertek Inc
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Goertek Inc
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/003—Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the invention relates to the technical field of electroacoustic products. More specifically, it relates to a speaker housing and a molding method thereof.
  • Loudspeakers are important acoustic components in portable electronic devices and are used to convert electrical energy into acoustic energy.
  • the loudspeaker can be in the form of a single loudspeaker or a loudspeaker module.
  • the speaker module generally includes a housing and a speaker monomer contained in the housing, the speaker monomer includes a vibration system and a magnetic circuit system, and the speaker module
  • the front acoustic cavity and the rear acoustic cavity are provided inside.
  • the front acoustic cavity is enclosed by the side of the housing facing the vibration system and the vibration system together, and the rear acoustic cavity is enclosed by the side of the housing away from the front acoustic cavity together with the vibration system.
  • the speaker module In the structural design of the speaker module, in order to achieve the sealing and fixing of the speaker module and the electronic equipment such as a mobile phone, and to connect the sound hole of the speaker module with the sound hole of the mobile phone, it is necessary to inject silicone rubber on the middle shell of the speaker module set. In the prior art, the silicone sleeve is directly injected on the middle shell of the module.
  • the yield of silicone molding is low; and the size of the shell body of the module is large, and a set of molds cannot simultaneously mold the silicone sleeve in a batch cavity, resulting in low production efficiency;
  • the shell in the group contains multiple metal inserts that can be turned on, so the cost of scrapping after the silicone sleeve is badly formed is high.
  • the first object of the present invention is to provide a speaker enclosure.
  • the speaker enclosure with this structure can significantly improve the molding yield of the silicone sleeve on the enclosure.
  • the second object of the present invention is to provide a method for forming a speaker enclosure as described above, which can effectively improve the product yield and production efficiency of the speaker enclosure.
  • the present invention provides a speaker enclosure, the speaker enclosure includes:
  • the connecting piece includes a body portion formed with an acoustic channel that communicates the sound outlet hole with the external environment; the body portion includes a protrusion portion that protrudes from the surface of the housing;
  • the connecting member further includes a silicone sleeve formed on the outer wall of the protruding portion around the body portion;
  • the silicone sleeve and the body part are an integral structure formed by injection molding.
  • annular protrusion is formed on the outer wall of the connecting member away from the end of the housing;
  • the annular convex portion is formed by extending outwardly around the outer wall of the protruding portion, or the annular convex portion is formed extending outwardly around the outer wall of the silicone sleeve.
  • an extension part extends outwardly from an outer wall of the end of the body part close to the casing; the extension part is combined and fixed with the casing.
  • the edge of the sound hole is recessed inward to form a sink, and the extension is located in the sink.
  • the connecting member and the housing are integrally formed by injection molding, or the connecting member and the housing are fixed by glue.
  • the housing includes a first housing, a second housing and a third housing joined together, the first housing, the second housing and the third housing together enclose the accommodating cavity ;
  • the sound hole is formed on the second housing.
  • the speaker casing is a speaker module casing or a speaker single casing.
  • the present invention also provides a method for forming the speaker housing as described above, the method includes at least the following steps:
  • connection piece is combined and fixed at the sound hole of the casing.
  • the connector is injection-molded and fixed at the sound outlet of the casing as an insert.
  • the connecting member is combined and fixed at the sound outlet of the casing by means of glue paste.
  • the speaker housing provided by the present invention firstly forms a connector with an integrated structure by injection molding, and then fixes the connector with the housing; the connector is provided with an internal sound channel, which can connect the front sound cavity of the speaker and the external environment through
  • the connector can realize the sealed connection of the speaker and mobile phones and other electronic products, and improve the acoustic performance of the speaker; at the same time, the structure and molding process of the connector are simple, which can significantly improve the molding yield of the silicone sleeve on the housing; and the connector can The batch cavity molding in one batch significantly improves the production efficiency of the speaker housing and reduces the production cost of the speaker housing.
  • FIG. 1 shows a schematic diagram of an exploded structure of a speaker module in a specific embodiment of the present invention.
  • FIG. 2 shows a schematic top view of FIG. 1.
  • Fig. 3 shows a cross-sectional view taken along line A-A of Fig. 2.
  • FIG. 4 shows a partial flow diagram of a method for forming a speaker housing in a specific embodiment of the invention.
  • a silicone sleeve is generally directly injection-molded on the speaker casing, and through the cooperation between the silicone sleeve and a plastic pipe on an electronic product such as a mobile phone, a sealed connection between the speaker and the electronic product is achieved.
  • the molding yield and production efficiency of the silicone sleeve are low, which indirectly increases the production cost of the speaker.
  • the present invention provides a speaker enclosure and a molding method thereof.
  • FIG. 1 shows a schematic diagram of an exploded structure of a speaker module in a specific embodiment of the present invention.
  • FIG. 2 shows a schematic top view of FIG. 1.
  • Fig. 3 shows a cross-sectional view taken along line A-A of Fig. 2.
  • FIG. 4 shows a partial flow diagram of a method for forming a speaker housing in a specific embodiment of the invention.
  • the present invention provides a speaker housing including: a housing with a receiving cavity; an acoustic hole for sound emission is formed on the housing; Describe the connector 14 at the sound hole;
  • the connector 14 includes a body portion 141 formed with an acoustic channel that communicates the sound hole with the external environment; the body portion 141 includes a protrusion 1411 protruding from the surface of the housing;
  • the connecting member 14 further includes a silicone sleeve 142 formed on the outer wall of the protrusion 1411 around the body portion 141; the silicone sleeve 142 and the body portion 141 are an integral structure formed by injection molding.
  • the speaker housing provided by the present invention forms an integral structure connecting piece 14 by injection molding.
  • the connecting piece 14 contains a sound channel, which connects the sound hole of the speaker with the sound hole of the mobile phone, that is, the front sound cavity of the speaker and the outside world Environment, through the connector 14 can achieve a sealed connection between the speaker and mobile phones and other electronic devices; compared with the prior art injection molding silicone sleeve 142 directly on the speaker housing, the structure and molding process of the connector 14 is simple, can Significantly improve the molding yield of the silicone sleeve 142 on the housing; and the connector 14 can be molded in a batch mold cavity, which significantly improves the production efficiency of the speaker housing and reduces the production cost of the speaker housing.
  • the outer wall of the connecting member 14 at an end away from the housing is formed with a ring Protruding portion 1421; the annular protruding portion 1421 is formed by extending outwardly around the outer wall of the silicone sleeve 142, and the annular protruding portion 1421 is formed by an end portion close to the body portion 141 away from the housing Best practice.
  • the provision of the ring-shaped raised portion 1421 can ensure the airtightness of the front acoustic cavity of the speaker module, prevent sound leakage during connection with electronic devices such as mobile phones, and cause poor speaker performance.
  • annular protrusion 1421 may also be formed by extending outward from the outer wall of the protrusion 1411 around the circumference. It should be noted that at this time, the structure of the electronic device that is cooperatively connected with the connector 14 is preferably a deformable soft material, so as to facilitate assembly with the connector 14 of the speaker.
  • an extension portion 1412 extends outward from the outer wall of the end of the body portion 141 close to the housing around the circumference; the connecting member 14 passes through the
  • the extension portion 1412 is fixedly coupled with the housing.
  • the edge of the sound hole is recessed inward to form a sink, the extension 1412 is located in the sink, and the top surface of the extension 1412 is flush with the top surface of the housing.
  • This type of structure is beneficial for positioning in the horizontal direction, which is convenient for the assembly of the speaker.
  • the flush setting can ensure the flatness and aesthetic appearance of the housing.
  • the connecting member 14 and the housing are integrally formed by injection molding.
  • the molding method is simple and the fixing strength is high, which is beneficial to the integration of the speaker housing.
  • glue may also use glue to fix the connecting member 14 and the housing, or use other fixing methods, which is not further limited by the present invention.
  • the housing includes a first housing 11, a second housing 12, and a third housing 13 that are joined together.
  • the first housing 11, the second The housing 12 and the third housing 13 together enclose the accommodating cavity; the sound hole is formed on the second housing 12, and the connecting member 1414 is combined and fixed on the second housing 12 At the sound hole.
  • the above speaker housing provided by the present invention can be applied to a speaker module or a single speaker.
  • the speaker unit When applied to a speaker unit, the speaker unit includes: the speaker housing as described above, and a vibration system and a magnetic circuit system housed in the accommodating cavity.
  • the speaker shell is a single shell, and the connecting member 14 is directly combined and fixed at the sound outlet of the single speaker for sealing and fixing with the electronic device.
  • the preferred embodiment provides a speaker module including the speaker housing.
  • the speaker module further includes a speaker unit accommodated in the accommodating cavity.
  • the first shell 11, the second shell 12 and the third shell 13 respectively correspond to the upper module shell, the middle module shell and the lower module shell, and the sound hole is formed in the middle module shell
  • the connecting member 14 is combined and fixed at the sound outlet of the middle shell of the module.
  • the lower case of the module is formed by a magnetic yoke in the magnetic circuit system 3, which can be formed of a metal material, preferably a steel material with higher strength to provide support for the speaker module.
  • the speaker unit includes a vibration system 2 and a magnetic circuit system 3.
  • the diaphragm assembly 21 in the vibration system 2 may include a diaphragm center part located at the center of the diaphragm and a diaphragm edge part connected to the edge of the diaphragm center part, together forming a diaphragm body part 141.
  • the central portion of the diaphragm generally includes a central portion of the body and a reinforcing central portion coupled to the surface of the central portion of the body.
  • the center of the center of the body can be hollowed out.
  • the hollow edge of the central part of the body needs to be located inside the edge of the reinforced central part combined with it, to ensure that the hollowed area is smaller than the area of the reinforced central part that fits with it, so as to ensure the airtightness of the diaphragm.
  • the magnetic circuit system 3 is formed with a magnetic gap, and the end of the voice coil 22 away from the diaphragm is suspended in the magnetic gap.
  • the magnetic circuit system 3 may include a magnetic conductive yoke (the magnetic conductive yoke may also serve as a lower case of the module), a magnet 32 fixed on the magnetic conductive yoke, and a magnetic conductive plate 31 located on the upper surface of the magnet.
  • the magnetic circuit system 3 uses a central magnet at the center of the magnetic yoke and a magnetic conductive plate 31 to form a central magnetic circuit, and a plurality of magnetic edges at the edge of the magnetic yoke
  • the side magnet forms a side magnetic circuit, so that a magnetic gap accommodating the voice coil 22 is formed between the center magnetic circuit and the side magnetic circuit.
  • the magnetic yoke is usually rectangular, and the side magnets can be arranged on the four sides of the magnetic yoke, or only on the two long or short sides of the magnetic yoke, and the edge of the magnetic yoke without the side magnet can be relative to the magnetic
  • the yoke extends vertically to form a side wall, and the side magnetic circuit and the side wall together form a magnetic gap with the central magnetic circuit.
  • the magnetic yoke may further include a flat bottom wall and a side wall extending toward the vibration system 2 along the edge of the bottom wall.
  • a magnetic gap for accommodating the lower end of the voice coil 22 is formed between the side wall of the magnetic yoke, the magnet, and the magnetic guide plate 31.
  • the present invention also provides a method for forming the speaker enclosure as described above, the method includes at least the following steps:
  • the silicone sleeve 142 is injection-molded on the outer wall of the protruding portion 1411 of the body portion 141 to obtain the connector 14 with an integrated structure;
  • connection member 14 is combined and fixed at the sound hole of the casing.
  • the method for forming a speaker housing provided by the present invention firstly forms an integral structure connecting member 14 by injection molding, and then fixes and connects the connecting member 14 with the housing; the structure and molding process of the connecting member 14 is simple, which can significantly improve the housing The molding yield of the silicone sleeve 142; and the connecting member 14 can be molded in a batch mold cavity, which significantly improves the production efficiency of the speaker housing and reduces the production cost of the speaker housing.
  • the connecting member 14 is injection-molded and fixed at the sound outlet of the housing by an injection molding method.
  • the molding method is simple and the fixing strength is high, which is beneficial to the speaker housing. Integration.
  • the connecting member 14 may also be fixed and fixed at the sound outlet of the housing by glue, or other fixing methods are used, and the present invention does not further limit this.
  • the method for forming a speaker housing in the present invention further includes the step of forming a housing of the speaker housing, which is a conventional method in the art, and the present invention will not repeat them here.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

本发明公开一种扬声器外壳及其成型方法，涉及电声产品技术领域。所述扬声器外壳包括：具有容纳腔的壳体；所述壳体上形成有供声音出射的出声孔；以及结合固定于所述出声孔处的连接件；所述连接件包括本体部，所述本体部上形成有将出声孔与外部环境连通的声通道；所述本体部包括突出于壳体表面的突出部；所述连接件还包括有环绕所述本体部一周形成于所述突出部外壁上的硅胶套；所述硅胶套与所述本体部为通过注塑方式形成的一体结构。本发明提供的扬声器外壳，首先通过注塑形成一体式结构的连接件，然后将该连接件与扬声器外壳结合固定，可以显著提升外壳上硅胶套的成型良率。

Description

一种扬声器外壳及其成型方法 技术领域
本发明涉及电声产品技术领域。更具体地，涉及一种扬声器外壳及其成型方法。
背景技术
扬声器是便携式电子设备中的重要声学部件，用于将电能转换为声能。扬声器可以为扬声器单体形式，也可以为扬声器模组形式。
以扬声器模组在手机中的应用为例，现有技术中，扬声器模组一般包括壳体以及收容于该壳体内部的扬声器单体，扬声器单体包括振动系统和磁路系统，扬声器模组内设有前声腔和后声腔，前声腔由壳体正对振动系统的一侧与振动系统共同围成，后声腔由壳体远离前声腔的一侧与振动系统共同围成。
在扬声器模组的结构设计中，为实现扬声器模组与手机等电子设备的密封固定，并使扬声器模组的出声孔与手机的声孔相连通，需要在扬声器模组中壳上注塑硅胶套。现有技术中硅胶套直接注塑在模组中壳上。但是，由于模组中壳的结构复杂，导致硅胶成型的良率低；且模组中壳本体的尺寸较大，一套模具不能同时批量模穴成型硅胶套，导致其生产效率低；同时模组中壳内包含多个可实现导通的金属嵌件，故硅胶套成型不良后报废的成本较高。
发明内容
本发明的第一个目的在于提供一种扬声器外壳，该结构的扬声器外壳可以显著提升外壳上硅胶套的成型良率。
本发明的第二个目的在于提供一种如上所述的扬声器外壳的成型方法，该方法可有效提升扬声器外壳的产品良率和生产效率。
为达到上述第一个目的，本发明提供一种扬声器外壳，所述扬声器外壳包括：
具有容纳腔的壳体；所述壳体上形成有供声音出射的出声孔；以及
结合固定于所述出声孔处的连接件；
所述连接件包括本体部，所述本体部上形成有将出声孔与外部环境连通 的声通道；所述本体部包括突出于壳体表面的突出部；
所述连接件还包括有环绕所述本体部一周形成于所述突出部外壁上的硅胶套；
所述硅胶套与所述本体部为通过注塑方式形成的一体结构。
优选地，所述连接件的远离所述壳体一端的外壁上形成有环形凸起部；
所述环形凸起部由突出部的外壁上环绕一周向外延伸形成，或者所述环形凸起部由所述硅胶套的外壁上环绕一周向外延伸形成。
优选地，所述本体部的靠近所述壳体的一端外壁上环绕一周向外延伸出有延伸部；所述延伸部与所述壳体结合固定。
优选地，所述出声孔边缘向内凹陷形成沉槽，所述延伸部位于所述沉槽内。
优选地，所述连接件与所述壳体通过注塑的方式一体成型，或者所述连接件与所述壳体之间通过胶体粘贴固定。
优选地，所述壳体包括结合在一起的第一壳体、第二壳体和第三壳体，所述第一壳体、第二壳体和第三壳体共同围成所述容纳腔；所述出声孔形成于所述第二壳体上。
优选地，所述扬声器外壳为扬声器模组外壳或扬声器单体外壳。
根据本发明的第二个目的，本发明还提供一种如上所述的扬声器外壳的成型方法，所述成型方法至少包括以下步骤：
一射注塑成型所述本体部；
在所述本体部的突出部外壁上二射注塑成型所述硅胶套，得到一体结构的连接件；
将所述连接件结合固定在所述壳体上的出声孔处。
优选地，通过注塑的方式将所述连接件作为嵌件注塑成型固定在所述壳体的出声孔处。
优选地，所述连接件通过胶体粘贴的方式结合固定在所述壳体的出声孔处。
本发明的有益效果如下：
本发明提供的扬声器外壳，首先通过注塑形成一体结构的连接件，然后将连接件与壳体结合固定；该连接件为内部设有声通道，该声通道可连通扬声器的前声腔和外界环境，通过该连接件可以实现扬声器与手机等电子产品的密封连接，提升扬声器的声学性能；同时，该连接件的结构和成型工艺简 单，可显著提高外壳上硅胶套的成型良率；且该连接件可以一次批量模穴成型，显著提升了扬声器外壳的生产效率，降低扬声器外壳的生产成本。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明。
图1示出本发明一具体实施例中扬声器模组的分解结构示意图。
图2示出图1的俯视结构示意图。
图3示出图2的A-A线剖视图。
图4示出本发明一具体实施例中扬声器壳体成型方法的部分流程示意图。
附图标记说明：11、第一壳体；12、第二壳体；13、第三壳体；14、连接件；141、本体部；1411、突出部；1412、延伸部；142、硅胶套；1421、环形凸起部；2、振动系统；21、振膜组件；22、音圈；3、磁路系统；31、导磁板；32、磁铁。
具体实施方式
为了更清楚地说明本发明，下面将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
现有技术中，一般在扬声器壳体上直接注塑形成硅胶套，通过硅胶套与手机等电子产品上的塑胶管道之间的配合，实现扬声器与电子产品的密封连接。但是，由于扬声器壳体的结构复杂，导致硅胶套的成型良率和生产效率低，间接增加了扬声器的生产成本。基于现有技术中存在的问题，本发明提供一种扬声器外壳及其成型方法。
具体地，下面结合附图和实施例进行详细说明。图1示出本发明一具体实施例中扬声器模组的分解结构示意图。图2示出图1的俯视结构示意图。 图3示出图2的A-A线剖视图。图4示出本发明一具体实施例中扬声器壳体成型方法的部分流程示意图。
如图1-图4所示，本发明提供一种扬声器外壳，所述扬声器外壳包括：具有容纳腔的壳体；所述壳体上形成有供声音出射的出声孔；以及结合固定于所述出声孔处的连接件14；
所述连接件14包括本体部141，所述本体部141上形成有将出声孔与外部环境连通的声通道；所述本体部141包括突出于壳体表面的突出部1411；
所述连接件14还包括有环绕所述本体部141一周形成于所述突出部1411外壁上的硅胶套142；所述硅胶套142与所述本体部141为通过注塑方式形成的一体结构。
本发明提供的扬声器外壳，通过注塑形成一体结构的连接件14，该连接件14内部含有声通道，该声通道连通扬声器的出声孔与手机的声孔，即连通了扬声器的前声腔和外界环境，通过该连接件14可以实现扬声器与手机等电子设备的密封连接；与现有技术中直接在扬声器壳体上注塑成型硅胶套142相比，该连接件14的结构和成型工艺简单，可显著提高外壳上硅胶套142的成型良率；且该连接件14可以一次批量模穴成型，显著提升了扬声器外壳的生产效率，降低扬声器外壳的生产成本。
在本优选的实施方式中，为了实现扬声器与电子设备的密封固定，防止扬声器在组装或使用过程中从电子产品上脱落，所述连接件14的远离所述壳体一端的外壁上形成有环形凸起部1421；所述环形凸起部1421由所述硅胶套142的外壁上环绕一周向外延伸形成，通过靠近本体部141的远离壳体的端部位置形成所述环形凸起部1421为最优实施方式。该环形凸起部1421的设置，可以保证扬声器模组前声腔的密闭性，防止与手机等电子设备连接的过程中发生漏声现象，导致扬声器性能不良。本领域技术人员可以理解的是，所述环形凸起部1421也可以由所述突出部1411的外壁上环绕一周向外延伸形成。需要说明的是，此时电子设备上与该连接件14配合连接的结构，其材料优选为可形变的软材料，以便于与扬声器的连接件14进行装配。
如图3和图4所示，在该优选实施方式中，所述本体部141的靠近所述壳体的一端外壁上环绕一周向外延伸出有延伸部1412；所述连接件14通过所述延伸部1412与所述壳体结合固定。进一步优选地，所述出声孔边缘向内凹陷形成沉槽，所述延伸部1412位于所述沉槽内，所述延伸部1412的顶面与所述壳体的顶面齐平设置。这种结构形式有利于在水平方向上进行定位，便 于扬声器的装配，齐平设置可以保证壳体的表面平整性和美观度。
优选地，本实施方式中所述连接件14与所述壳体之间通过注塑的方式一体成型，该成型方法简单，固定强度高，有利于扬声器壳体的一体化。需要说明的是，本领域技术人员也可以利用胶体将所述连接件14与所述壳体粘贴固定，或者采用其他的固定方法，本发明对此不做进一步限制。
进一步地，如图1所示，本实施方式中所述壳体包括结合在一起的第一壳体11、第二壳体12和第三壳体13，所述第一壳体11、第二壳体12和第三壳体13共同围成所述容纳腔；所述出声孔形成于所述第二壳体12上，所述连接件1414结合固定在所述第二壳体12上的出声孔处。
本发明提供的上述扬声器外壳，既可以应用于扬声器模组中，也可以应用于扬声器单体中。当应用于扬声器单体时，所述扬声器单体包括：如上所述的扬声器外壳，以及收容于所述容纳腔内的振动系统和磁路系统。此时所述扬声器外壳为单体外壳，所述连接件14直接结合固定在扬声器单体的出声孔处，用于与电子设备之间进行密封固定。
本优选的实施方式提供一种包括该扬声器外壳的扬声器模组，如图1所示，所述扬声器模组还包括收容于所述容纳腔内的扬声器单体。此时，所述第一壳体11、第二壳体12和第三壳体13分别对应模组上壳、模组中壳和模组下壳，所述出声孔形成于模组中壳上，所述连接件14结合固定在模组中壳的出声孔处。其中，模组下壳是由磁路系统3中的导磁轭充当，其可以由金属材料形成，优选强度越高的钢材，以为扬声器模组提供支撑。
所述扬声器单体包括振动系统2和磁路系统3。在可选地实施方式中，振动系统2中的振膜组件21可包括位于振膜中央的振膜中心部以及与所述振膜中心部边缘连接的振膜边缘部，共同形成振膜本体部141。为了增加振膜的振动特性，通常振膜中心部包括本体中心部和结合在所述本体中心部表面的补强中心部。为了减轻振膜重量，进一步提高振膜振动性能，可将本体中心部的中央镂空。其中，本体中心部的镂空边缘需位于与其结合固定的补强中心部边缘的内侧，保证镂空面积小于与其贴合的补强中心部的面积，以保证振膜的气密性。
在可选地实施方式中，磁路系统3形成有磁间隙，音圈22远离振膜的一端悬置在磁间隙中。所述磁路系统3可包括导磁轭(导磁轭可以同时作为模组下壳)、固定在导磁轭上的磁铁32以及位于磁铁上表面的导磁板31。本实施例中，为了增大磁路系统3形成的磁场强度，磁路系统3采用在导磁轭的 中心设置中心磁铁和导磁板31形成中心磁路，在导磁轭的边缘设置多个边磁铁，形成边磁路，从而在中心磁路和边磁路间形成容纳音圈22的磁间隙。导磁轭通常为矩形，边磁铁可设置在导磁轭的四边，也可只设置在导磁轭相对的两个长边或短边，未设置边磁铁的导磁轭边缘可相对于导磁轭垂直延伸形成侧壁，边磁路和侧壁共同与中心磁路形成磁间隙。在其他实施方式中，所述导磁轭还可包括平板状的底壁和沿底壁边缘朝向振动系统2延伸的侧壁。导磁轭的侧壁与磁铁以及导磁板31间形成容纳音圈22下端的磁间隙。
另一方面，本发明还提供一种如上所述的扬声器外壳的成型方法，所述成型方法至少包括以下步骤：
一射注塑成型所述本体部141；
在所述本体部141的突出部1411外壁上二射注塑成型所述硅胶套142，得到一体结构的连接件14；
将所述连接件14结合固定在所述壳体上的出声孔处。
本发明提供的扬声器外壳的成型方法，先通过注塑形成一体结构的连接件14，然后再将该连接件14与壳体固定结合；该连接件14的结构和成型工艺简单，可显著提高外壳上硅胶套142的成型良率；且该连接件14可以一次批量模穴成型，显著提升了扬声器外壳的生产效率，降低扬声器外壳的生产成本。
在本优选的实施方式中，通过注塑的方法将所述连接件14作为嵌件注塑成型固定在所述壳体的出声孔处，该成型方法简单，固定强度高，有利于扬声器壳体的一体化。在另一些实施方式中，也可将所述连接件14通过胶水粘贴的方法结合固定在所述壳体的出声孔处，或者采用其他的固定方法，本发明对此不做进一步限制。
本领域技术人员可以理解的是，本发明中扬声器外壳的成型方法还包括形成扬声器外壳的壳体的步骤，其为本领域常规方法，本发明在此不再赘述。
显然，本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并非是对本发明的实施方式的限定，对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动，这里无法对所有的实施方式予以穷举，凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。

Claims (10)

  1. 一种扬声器外壳，其特征在于，所述扬声器外壳包括：
    具有容纳腔的壳体；所述壳体上形成有供声音出射的出声孔；以及
    结合固定于所述出声孔处的连接件；
    所述连接件包括本体部，所述本体部上形成有将出声孔与外部环境连通的声通道；所述本体部包括突出于壳体表面的突出部；
    所述连接件还包括有环绕所述本体部一周形成于所述突出部外壁上的硅胶套；
    所述硅胶套与所述本体部为通过注塑方式形成的一体结构。
  2. 根据权利要求1所述的扬声器外壳，其特征在于，所述连接件的远离所述壳体一端的外壁上形成有环形凸起部；
    所述环形凸起部由突出部的外壁上环绕一周向外延伸形成，或者所述环形凸起部由所述硅胶套的外壁上环绕一周向外延伸形成。
  3. 根据权利要求1所述的扬声器外壳，其特征在于，所述本体部的靠近所述壳体的一端外壁上环绕一周向外延伸出有延伸部；所述连接件通过所述延伸部与所述壳体结合固定。
  4. 根据权利要求3所述的扬声器外壳，其特征在于，所述出声孔边缘向内凹陷形成沉槽，所述延伸部位于所述沉槽内。
  5. 根据权利要求1所述的扬声器外壳，其特征在于，所述连接件与所述壳体通过注塑的方式一体成型，或者所述连接件与所述壳体之间通过胶体粘贴固定。
  6. 根据权利要求1所述的扬声器外壳，其特征在于，所述壳体包括结合在一起的第一壳体、第二壳体和第三壳体，所述第一壳体、第二壳体和第三壳体共同围成所述容纳腔；所述出声孔形成于所述第二壳体上。
  7. 根据权利要求1所述的扬声器外壳，其特征在于，所述扬声器外壳为扬声器模组外壳或扬声器单体外壳。
  8. 一种如权利要求1所述的扬声器外壳的成型方法，其特征在于，所述成型方法至少包括以下步骤：
    一射注塑成型所述本体部；
    在所述本体部的突出部外壁上二射注塑成型所述硅胶套，得到一体结构的连接件；
    将所述连接件结合固定在所述壳体上的出声孔处。
  9. 根据权利要求8所述的成型方法，其特征在于，通过注塑的方式将所述连接件作为嵌件注塑成型固定在所述壳体的出声孔处。
  10. 根据权利要求8所述的成型方法，其特征在于，所述连接件通过胶体粘贴的方式结合固定在所述壳体的出声孔处。
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