WO2020113395A1 - 光学反光器、指纹识别模组、移动终端和反光器封装方法 - Google Patents

光学反光器、指纹识别模组、移动终端和反光器封装方法 Download PDF

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Publication number
WO2020113395A1
WO2020113395A1 PCT/CN2018/119033 CN2018119033W WO2020113395A1 WO 2020113395 A1 WO2020113395 A1 WO 2020113395A1 CN 2018119033 W CN2018119033 W CN 2018119033W WO 2020113395 A1 WO2020113395 A1 WO 2020113395A1
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WIPO (PCT)
Prior art keywords
layer
light
base
reflective
optical reflector
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Application number
PCT/CN2018/119033
Other languages
English (en)
French (fr)
Inventor
冷寒剑
吴宝全
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2018/119033 priority Critical patent/WO2020113395A1/zh
Priority to CN201880002696.8A priority patent/CN109690366B/zh
Publication of WO2020113395A1 publication Critical patent/WO2020113395A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0808—Mirrors having a single reflecting layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms

Definitions

  • the embodiments of the present application relate to fingerprint identification technology, and in particular, to an optical reflector, a fingerprint identification module, a mobile terminal, and a reflector packaging method.
  • under-screen fingerprint also known as light-sensitive screen fingerprint recognition
  • optical under-screen fingerprints are the most popular.
  • the principle of under-screen fingerprint technology is: when a finger touches the screen, the light emitted by the screen penetrates the surface of the screen to illuminate the fingerprint texture, the reflected light of the fingerprint penetrates the screen and returns to the sensor, and finally forms a fingerprint image for recognition.
  • the OLED (Organic Light Emitting Display) screen is self-luminous, the screen thickness is thin, and the overall screen structure is light-transmitting material. Therefore, in the prior art, the off-screen fingerprint technology is mainly applied to the OLED screen. Specifically, An image sensor is provided in the OLED screen, and the gap between the OLED sub-pixels is used to allow light to pass through the OLED screen, thereby identifying the fingerprint.
  • the present application provides an optical reflector, a fingerprint recognition module, a mobile terminal, and a reflector packaging method to solve the technical problem that the LCD screen cannot apply the off-screen fingerprint technology in the prior art.
  • the present application provides an optical reflector, including: a base and a reflector;
  • the base is used to be placed on one side of the screen, and the reflective part is connected to the base, and the reflective part has a reflective surface parallel to the screen for reflecting the fingerprint image from the surface of the screen;
  • the base is provided with a light-transmitting cavity.
  • the light-transmitting cavity has a first opening on the side facing the light reflecting portion, and the first opening is provided with a supporting portion for supporting the optical lens.
  • the side is used to set a fingerprint detection chip, and the light-transmitting cavity is used to irradiate the fingerprint image reflected by the reflective part onto the sensing surface of the fingerprint detection chip via an optical lens, and the inner wall of the light-transmitting cavity is a light-absorbing surface.
  • the optical reflector provided by the present application has a second opening on the side of the light-transmitting cavity opposite to the plane where the reflective portion is located, and the second opening is used to set a fingerprint detection chip.
  • the base is used to be installed on the side of the screen or adjacent to the side of the screen, and the top of the base is a plane parallel to the reflective surface.
  • the supporting portion includes a mounting groove, and the mounting groove has two avoidance notches disposed oppositely, and the escape notch is used to avoid the optical lens.
  • the optical reflector provided by the present application is provided with a base material layer and a reflective layer stacked on the base material layer on the reflective portion.
  • the reflective portion further includes a transparent protective layer, and the protective layer is located outside the reflective layer.
  • the reflective portion extends below the bottom of the base and is connected to the bottom of the base.
  • the reflective portion further has a light absorption layer, and the light absorption layer is located at the bottom of the base.
  • the reflective layer and the base are located on the same side of the substrate layer.
  • the edge of the reflective layer is flush with the edge of the base facing the reflective portion; or, the reflective layer extends below the bottom of the base.
  • the reflective layer extends below the bottom of the base, and the reflective layer and the light absorbing layer are located in different layers, and the protective layer is located between the reflective layer and the light absorbing layer.
  • the reflective layer and the base are respectively located on opposite sides of the substrate layer.
  • the light absorption layer is located between the base material layer and the base.
  • the protective layer is located outside the reflective layer.
  • the material of the protective layer is silicon dioxide, silicon nitride, or organic paint.
  • the material of the light absorbing layer is organic glue or inorganic paint.
  • the present application provides a fingerprint identification module, including a fingerprint identification chip, an optical lens, and the above-mentioned optical reflector.
  • the fingerprint identification chip and the optical lens are both located in the light-transmitting cavity of the optical reflector.
  • the fingerprint identification module provided by the present application further includes a light source, which is arranged on the side of the screen and used to illuminate the fingerprint in the fingerprint identification area on the screen.
  • the present application provides a mobile terminal, including the aforementioned fingerprint identification module.
  • an optical reflector packaging method including:
  • a reflective layer and a light-absorbing layer are respectively provided on the base material layer, and at least a part of the reflective layer forms a reflective surface for reflecting the fingerprint image from the surface of the screen;
  • a base is provided at a position of the base material where the light-absorbing layer is provided, and a light-transmitting cavity is opened on the base, the light-transmitting cavity is used to irradiate the fingerprint image on the sensing surface of the fingerprint detection chip, and the inner wall of the light-transmitting cavity is the light-absorbing surface .
  • the optical reflector packaging method provided in the present application, and providing a base at a portion of the substrate where the light absorption layer is provided specifically includes:
  • a supporting layer is provided on the base material layer, and a base is formed in the supporting layer.
  • the optical reflector packaging method provided in this application forming a base in a support layer, specifically includes:
  • the support layer is processed to make the support layer form a base.
  • the processing methods include any one or several of the following: patch, bonding, injection molding, and imprinting.
  • the optical reflector packaging method provided in this application after forming the base in the support layer, further includes:
  • a light-absorbing layer is provided on the inner wall of the light-transmitting cavity.
  • the optical reflector encapsulation method provided by the present application after the reflective layer is provided on the base material layer, further includes:
  • a protective layer is provided on the reflective layer.
  • the optical reflector is provided with a reflective part, and the reflective part has a reflective surface parallel to the screen, and the fingerprint image from the surface of the screen is reflected through the reflective surface;
  • a base for opening a light-transmitting cavity is provided, and the side of the light-transmitting cavity facing the reflecting portion has a first opening, and a support portion for supporting the optical lens is provided on the first opening, and the reflected fingerprint image is irradiated to the first opening and the optical lens
  • a fingerprint image is finally formed for identification, so that the off-screen fingerprint technology can be applied to the LCD screen.
  • FIG. 1 is a schematic structural diagram of an optical reflector provided by an embodiment of the present application.
  • Figure 2 is a top view of Figure 1;
  • FIG. 3 is a schematic diagram of a use state of an optical reflector provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram 1 of a position of a base and a reflective part in an optical reflector provided by an embodiment of the present application;
  • FIG. 5 is a second schematic diagram of the positions of the base and the reflective part in an optical reflector provided by an embodiment of the present application;
  • FIG. 6 is a schematic diagram 3 of a position of a base and a reflective part in an optical reflector provided by an embodiment of the present application;
  • FIG. 7 is a schematic structural diagram of a fingerprint identification module provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application.
  • FIG. 9 is a flowchart of a reflector packaging method provided by an embodiment of the present application.
  • 100 base; 101—light cavity; 102—first opening; 103—supporting part; 1031—avoidance gap; 104—light-absorbing surface; 105—second opening; 200—reflecting portion; 201—reflecting surface; 202— Base layer; 203—reflective layer; 204—protective layer; 205—light-absorbing layer; 300—screen; 400—optical lens; 500—fingerprint detection chip; 600—fingerprint recognition module; 700—optical reflector; 800—light source ; 900—Mobile terminal.
  • the luminous principle of the LCD screen is: filling liquid crystal material between two parallel plates, changing the arrangement of molecules inside the liquid crystal material by voltage, to achieve the purpose of shading and light transmission, to display different shades and staggered images
  • a ternary color filter layer between two flat plates, a color image can be displayed.
  • the LCD screen requires an external light source, and the back of the LCD screen needs a reflective plate to reflect the light of the external light source to the surface of the screen.
  • the principle of the off-screen fingerprint technology is: when the finger touches the screen, the light emitted by the screen penetrates the surface of the screen to illuminate the fingerprint texture, the reflected light of the fingerprint penetrates the screen and returns to the sensor, and finally forms a fingerprint image for recognition. Therefore, the off-screen fingerprint technology is difficult to apply to LCD screens.
  • the optical reflector provided by the present application aims to solve the above technical problems of the prior art.
  • optical reflector provided by the embodiments of the present application will be described in detail in combination with multiple examples as follows.
  • FIG. 1 is a schematic structural diagram of an optical reflector provided by an embodiment of the present application
  • FIG. 2 is a top view of FIG. 1
  • FIG. 3 is a schematic diagram of a use state of an optical reflector provided by an embodiment of the present application.
  • the optical reflector 700 provided in this embodiment includes: a base 100 and a reflective portion 200;
  • the base 100 is used to be placed on one side of the screen 300, and the reflective part 200 is connected to the base 100, and the reflective part 200 has a reflective surface 201 parallel to the screen 300 for reflecting fingerprint images from the surface of the screen 300;
  • FIG. 3 is only a schematic illustration.
  • the base 100 involved in the present application is installed on one side of the screen 300, which may actually mean that the base 100 is specifically located on the side or below the screen 300. Or set adjacent to the side of the screen 300.
  • the thickness of the screen 300 is generally larger than that of the base.
  • the base 100 is installed at a position where one side of the screen 300 is biased toward the bottom, that is, a position below the side.
  • the base 100 may also be installed below the screen 300, such as an edge position below the screen 300.
  • the base 100 is provided with a light-transmitting cavity 101.
  • the light-transmitting cavity 101 has a first opening 102 on the side facing the light reflecting part 200, and the first opening 102 is provided with a supporting portion 103 for supporting the optical lens 400.
  • the side opposite to the plane where the reflective part 200 is located is used to set the fingerprint detection chip 500, and the light-transmitting cavity 101 is used to irradiate the fingerprint image reflected by the reflective part 200 to the sensing surface of the fingerprint detection chip 500 through the optical lens 400, through
  • the inner wall of the optical cavity 101 is a light absorption surface 104.
  • the reflective part 200 and the base 100 are installed on the side of the screen 300 of the LCD screen, so that the reflective surface 201 of the reflective part 200 connected to the base 100 is parallel to the screen 300, and the side of the reflective part 200 and the screen 300 The square phases abut, and the reflective part 200 is positioned between the base 100 and the side of the screen 300.
  • the reflective part 200 may be installed above the light source for illuminating the fingerprint recognition area on the screen 300.
  • a first opening 102 is opened on the side of the light-transmitting cavity 101 facing the light-reflecting portion 200, and a support portion 103 for supporting the optical lens 400 is provided on the first opening 102, and the optical lens 400 is supported by the support portion 103 to mount the fingerprint detection chip 500 On the side of the light-transmitting cavity 101 opposite to the plane where the light-reflecting portion 200 is located.
  • the first opening 102 may be a rectangle, a circle, an ellipse, or an irregular shape, as long as the first opening 102 can transmit light, and this embodiment is not limited herein.
  • the supporting portion 103 is used to support the optical lens 400.
  • the supporting surface of the supporting portion 103 can be matched with the outer side of the optical lens 400, so that the optical lens 400 can be stably supported on the supporting portion 103.
  • the side of the light-transmitting cavity 101 opposite to the plane where the light-reflecting portion 200 is located is used to set the fingerprint detection chip 500.
  • the fingerprint detection chip 500 can be provided on the inner side wall of the light-transmitting cavity 101, so that the fingerprint image entering the light-transmitting cavity 101 can be timely.
  • the sensing surface of the fingerprint detection chip 500 irradiated on the light-transmitting cavity 101; the side of the light-transmitting cavity 101 opposite to the plane where the reflective part 200 is located can also be set as a light-transmitting surface, and the fingerprint detection chip 500 can be disposed on the The outer side of the light-transmitting surface is convenient for installing the fingerprint detection chip 500.
  • the light of the external light source of the LCD screen is reflected toward the surface of the screen 300, and penetrates the surface of the screen 300 to illuminate the fingerprint texture of the fingerprint recognition area.
  • An independent light source can also be provided on the side of the LCD screen.
  • the light of the independent light source is reflected toward the surface of the screen 300, and the fingerprint image from the surface of the screen 300 is reflected by the reflective surface 201 of the reflective portion 200 to the first opening 102, and the optical supported by the support portion 103 at the first opening 102
  • the lens 400 is irradiated into the light-transmitting cavity 101, and is irradiated on the sensing surface of the fingerprint detection chip 500 on the light-transmitting cavity 101, and finally a fingerprint image is formed for identification, so that the off-screen fingerprint technology can be applied to the LCD screen.
  • a reflective part 200 is provided, and the reflective part 200 has a reflective surface 201 parallel to the screen 300, and the fingerprint image from the surface of the screen 300 is reflected by the reflective surface 201;
  • the side of the optical cavity 101 facing the light reflecting part 200 has a first opening 102, and a supporting part 103 for supporting the optical lens 400 is provided on the first opening 102, and the reflected fingerprint image is irradiated to the light through the first opening 102 and the optical lens 400
  • a fingerprint image is finally formed for identification, so that the off-screen fingerprint technology can be applied to the LCD screen.
  • the light-transmitting cavity 101 has a second opening 105 on the side opposite to the plane where the light-reflecting portion 200 is located, and the second opening 105 is used to set the fingerprint detection chip 500.
  • the fingerprint detection chip 500 may be directly covered and fixed on the second opening 105 to install the fingerprint detection chip 500; the second opening 105 may also be set as a stepped opening, and the fingerprint detection chip 500 may be embedded and fixed On the stepped surface of the second opening 105, the upper surface of the pattern detection chip 500 is flush with the upper surface of the second opening 105, so that the pattern detection chip 500 is less likely to come off.
  • the fixing method of the pattern detection chip 500 and the second opening 105 may be adhesive or other types of connection methods, which will not be repeated here in this embodiment.
  • the base 100 is configured to be installed on the side of the screen 300 or adjacent to the side of the screen 300, and the top of the base 100 is a plane parallel to the reflective surface 201.
  • the top of the base 100 can be used to install the pattern detection chip 500, that is, the pattern detection chip 500 is parallel to the reflective surface 201, so that the fingerprint image reflected by the reflective surface 201 passes through the first opening 102 and the optical lens 400 is irradiated into the light-transmitting cavity 101 and can be irradiated onto the sensing surface of the fingerprint detection chip 500 on the light-transmitting cavity 101.
  • the top of the base 100 may be flush with the reflective surface 201, and the top of the base 100 may be higher or lower than the reflective surface 201, which is not limited in this embodiment.
  • the support portion 103 is used to support the optical lens 400, so that the support portion 103 can stably support the optical lens 400.
  • the supporting portion 103 includes a mounting groove, and the mounting groove has two avoiding notches 1031 oppositely disposed, and the avoiding notch 1031 is used to avoid the optical lens 400.
  • the shape of the avoidance notch 1031 can be set according to the outer side of the optical lens 400, for example, the avoidance notch 1031 can be matched with the outer side of the optical lens 400, so that the optical lens 400 is embedded in the support portion 103 to make the support portion 103 The optical lens 400 can be firmly supported.
  • FIGS. 4-6 are schematic views 1 of a position of a base and a reflective part in an optical reflector provided by an embodiment of the present application;
  • FIG. 5 is a schematic view 2 of a position of a base and a reflective part in an optical reflector provided by an embodiment of the present application;
  • FIG. 6 is a schematic diagram 3 of a position of a base and a reflective part in an optical reflector provided by an embodiment of the present application.
  • a base material layer 202 and a light reflecting layer 203 stacked on the base material layer 202 are provided on the light reflecting portion 200.
  • the reflective part 200 is divided into two layers.
  • the first layer is the base material layer 202.
  • the reflective layer 203 is laminated on the base material layer 202 to form the reflective part 200.
  • the base material layer 202 is used to support the reflective layer 203.
  • the reflective layer 203 is used for reflecting light.
  • the reflective surface 201 can serve as a reflective layer 203.
  • the base material layer 202 may be opaque or transparent.
  • the material of the substrate layer 202 may be silicon wafer, glass, metal plate, ceramic or organic material.
  • the shape of the substrate layer 202 is not limited.
  • the thickness of the substrate layer 202 is in the order of 100 microns.
  • the thickness of the substrate layer 202 is 200 Micron.
  • the reflective layer 203 may be formed on the base material layer 202 by processing methods such as sputtering, evaporation, printing, and depositing silver plating.
  • the material of the reflective layer 203 may be a mirror reflective material such as aluminum or silver, which is not limited in this embodiment.
  • the thickness of the reflective layer 203 is usually in the order of micrometers, for example, the thickness of the reflective layer 203 is 0.2 um.
  • the reflective portion 200 further includes a transparent protective layer 204, which is located outside the reflective layer 203.
  • the protective layer 204 is used to protect the reflective layer 203 and prevent the reflective layer 203 from being damaged.
  • the material of the protective layer 204 is silicon dioxide, silicon nitride, or organic paint.
  • the protective layer 204 may be formed on the outer side of the reflective layer 203 through processing methods such as chemical vapor deposition, glue coating, and printing.
  • the thickness of the protective layer 204 is usually in the order of micrometers, for example, the thickness of the protective layer 204 is 1 ⁇ m.
  • the reflective portion 200 extends below the bottom of the base 100 and is connected to the bottom of the base 100.
  • the connection position of the reflective part 200 and the base 100 is the bottom of the base 100.
  • the reflective part 200 has three layers, which are a substrate layer 202 and a reflective layer 203 stacked with the substrate layer 202, a protective layer 204 outside the reflective layer 203, the base 100 can be connected to the substrate layer 202, the reflective layer 203 or protective layer 204 is connected.
  • the light-reflecting portion 200 further has a light-absorbing layer 205 which is located at the bottom of the base 100.
  • the light reflecting part 200 is connected to the bottom of the base 100, if the light-transmitting cavity 101 of the base 100 is connected to the bottom of the base 100, the light absorbing layer 205 is formed on the light reflecting part 200, and the light absorbing layer 205 is located on the base 100 At the bottom of the light-transmitting cavity 101 to absorb light in the area of the light-transmitting cavity 101, so as to reduce the interference of light noise in the light-transmitting cavity 101.
  • the material of the light absorption layer 205 is organic glue or inorganic paint.
  • the light-absorbing layer 205 is manufactured by processing methods such as pasting, screen printing, chrome plating, and anode.
  • the relative position between the reflective part 200 and the base 100 can also have various forms. The various relative positions between 100 are described in detail.
  • the first relative position between the reflective part 200 and the base 100 is specifically:
  • the reflective layer 203 and the base 100 are located on the same side of the base material layer 202, and the reflective layer 203 extends below the bottom of the base 100.
  • the base material layer 202, the reflective layer 203, and the protective layer 204 are sequentially stacked, and the protective layer 204
  • a light absorption layer 205 is provided above the light absorption layer 205 is located at the bottom of the base 100, that is, the light absorption layer 205 is located between the bottom of the base 100 and the protective layer 204, the light absorption layer 205 and the reflective layer 203 are provided in different layers
  • the protective layer 204 is located between the reflective layer 203 and the light absorption layer 205.
  • the base material layer 202, the reflective layer 203, the protective layer 204, the light absorption layer 205, and the base 100 are formed in this order.
  • the manufacturing process is simple and the manufacturing precision is high.
  • the second relative position between the reflective part 200 and the base 100 is specifically:
  • the reflective layer 203 and the base 100 are located on the same side of the base material layer 202, and the edge of the reflective layer 203 is flush with the edge of the base 100 facing the reflective portion 200, specifically, between the base material layer 202 and the protective layer 204
  • the light absorption layer 205 and the light reflection layer 203 are provided, and the light absorption layer 205 and the light reflection layer 203 are provided in the same layer.
  • the same layer of light-absorbing layer 205 and light-reflecting layer 203 are formed on the base material layer 202, a protective layer 204 is formed on the light-absorbing layer 205 and the light-reflecting layer 203, and a portion of the protective layer 204 opposite to the light-absorbing layer 205 is formed ⁇ 100. In this way, the light absorbing layer 205 and the light reflecting layer 203 are arranged in the same layer, which reduces the cost.
  • the third relative position between the reflective part 200 and the base 100 is specifically:
  • the reflective layer 203 and the base 100 are located on opposite sides of the base material layer 202 respectively, the light absorption layer 205 is located between the base material layer 202 and the base 100, and the reflective layer 203 is located between the base 100 and the protective layer 204.
  • the reflective layer 203 and the protective layer 204 are sequentially stacked on one side surface of the base material layer 202, and the light absorption layer 205 and the base 100 are sequentially stacked on the opposite side surface of the base material layer 202.
  • FIG. 7 is a schematic structural diagram of a fingerprint identification module provided by an embodiment of the present application. As shown in FIG. 7, based on the above embodiments, this embodiment also provides a fingerprint recognition module 600, including a fingerprint recognition chip 500, an optical lens 400, and the optical reflector 700 provided in the above embodiments. Both the chip 500 and the optical lens 400 are located in the light-transmitting cavity 101 of the optical reflector 700.
  • optical reflector 700 The structure and working principle of the optical reflector 700 have been described in detail in the above embodiments, and will not be repeated here.
  • the fingerprint identification module 600 provided in this embodiment further includes a light source 800, and the light source 800 is disposed on the side of the screen 300 for illuminating the fingerprint in the fingerprint identification area on the screen 300.
  • the light source 800 is located below the light reflecting part 200.
  • the reflective part 200 of the optical reflector 700 and the base 100 are installed on the side of the screen 300 of the LCD screen, so that the reflective surface 201 of the reflective part 200 connected to the base 100 is parallel to the screen 300, and the reflective part 200 It is in contact with the side of the screen 300, and the reflective portion 200 is positioned between the base 100 and the side of the screen 300.
  • a first opening 102 is opened on the side of the light-transmitting cavity 101 facing the light-reflecting portion 200, and a support portion 103 for supporting the optical lens 400 is provided on the first opening 102, and the optical lens 400 is supported by the support portion 103 to mount the fingerprint detection chip 500 On the side of the light-transmitting cavity 101 opposite to the plane where the light-reflecting portion 200 is located.
  • the direction of the arrow in FIG. 7 shows the direction of the optical path.
  • the light source 800 illuminates the fingerprint in the fingerprint recognition area on the screen 300, and the fingerprint image from the surface of the screen 300 is reflected by the reflective surface 201 of the reflective part 200 to the first
  • the optical lens 400 supported by the support portion 103 at the first opening 102 is irradiated into the light-transmitting cavity 101, and is irradiated onto the sensing surface of the fingerprint detection chip 500 on the light-transmitting cavity 101, and finally a fingerprint is formed Image recognition.
  • FIG. 8 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application. As shown in FIG. 8, based on the foregoing embodiments, this embodiment provides a mobile terminal 900 including the fingerprint identification module 600 described above.
  • the mobile terminal 900 may be a liquid crystal panel, an electronic paper, an organic light-emitting diode (Organic Light-Emitting Diode, OLED) panel, a mobile phone, a tablet computer, a TV, a display, a notebook computer, a digital photo frame, a navigator, Any product or component with display function, such as a wearable device or a home appliance.
  • OLED Organic Light-Emitting Diode
  • FIG. 9 is a flowchart of a reflector packaging method provided by an embodiment of the present application. As shown in Figure 9. Based on the foregoing embodiments, this embodiment provides an optical reflector packaging method.
  • the method includes:
  • a reflective layer 203 and a light-absorbing layer 205 are respectively provided on the base material layer 202. At least a part of the reflective layer 203 forms a reflective surface 201 for reflecting a fingerprint image from the surface of the screen 300.
  • the light reflecting layer 203 and the light absorbing layer 205 may be located on the same side of the base material layer 202. Further, the light reflecting layer 203 and the light absorbing layer 205 are arranged in the same layer, or may be arranged in different layers. The reflective layer 203 and the light absorbing layer 205 may be located on opposite sides of the base material layer 202, as long as at least part of the reflective layer 203 forms the reflective surface 201 for reflecting the fingerprint image from the surface of the screen 300, which is not limited in this embodiment .
  • a base 100 is provided at a portion of the base material layer 202 where the light absorption layer 202 is provided, and a light-transmitting cavity 101 is opened on the base 100, and the light-transmitting cavity 101 is used to irradiate the fingerprint image to the sensing surface of the fingerprint detection chip 500
  • the inner wall of the light-transmitting cavity 101 is a light-absorbing surface 104.
  • a support layer is provided on the base material layer 202, and the base 100 is formed in the support layer.
  • the base 100 in the supporting layer specifically includes:
  • the support layer is processed to make the support layer form the base 100, and the processing method includes any one or more of the following: patch, bonding, injection molding, and imprinting.
  • the optical reflector packaging method provided in this embodiment after forming the reflective layer 203 on the substrate layer 202, further includes:
  • a protective layer 204 is provided on the reflective layer 203. By providing a protective layer 204, the protective layer 204 is used to protect the reflective layer 203 to avoid damage to the reflective layer 203.
  • the optical reflector packaging method provided in this embodiment after forming the base 100 in the support layer, further includes:
  • a light-absorbing layer 205 is provided on the inner wall of the light-transmitting cavity 101.
  • optical reflector packaging method provided in this embodiment will be described in detail below based on three relative positions between the reflector 200 and the base 100 in FIGS. 4-6.
  • the method of packaging the optical reflector 700 at the first relative position between the reflective part 200 and the base 100 in FIG. 4 may include:
  • the material of the base material layer 202 may be silicon wafer, glass, metal plate, ceramic or organic material, and the shape of the base material layer 202 is not limited.
  • the base material layer 202 is processed to a desired thickness.
  • the thickness of the base material layer 202 is in the order of one hundred microns, for example, the thickness of the base material layer 202 is 200 microns.
  • the reflective layer 203 is formed on the surface of the base material layer 202 by processing methods such as sputtering, evaporation, printing, deposited silver plating, and highly doped aluminum sputtering.
  • processing methods such as sputtering, evaporation, printing, deposited silver plating, and highly doped aluminum sputtering.
  • the specific processing parameters of the processing methods such as sputtering, evaporation, printing, and deposition silver plating may be existing ones, and this embodiment is not limited herein.
  • specular reflective materials such as aluminum and silver can be used, and this embodiment is not limited herein.
  • the thickness of the reflective layer 203 is usually in the order of micrometers, for example, the thickness of the reflective layer 203 is 0.2 um.
  • the material of the protective layer 204 is silicon dioxide, silicon nitride, or organic paint.
  • the protective layer 204 is formed on the surface of the reflective layer 203 by chemical vapor deposition, glue coating, printing and other processing methods, wherein the specific processing parameters of the chemical vapor deposition, glue coating, printing and other processing methods can be the existing ones. This is not limited.
  • the thickness of the protective layer 204 is usually in the order of micrometers, for example, the thickness of the protective layer 204 is 1 ⁇ m.
  • the protective layer 204 is used to protect the reflective layer 203 and prevent the reflective layer 203 from being damaged.
  • the protective layer 204 is not a necessary step. For example, when the reflective layer 203 is processed by depositing silver or highly doped aluminum, this protective layer 204 can be eliminated.
  • the light absorbing layer 205 is made on the surface of the protective layer 204 by coating, screen printing, chrome plating, anode and other processing methods.
  • the specific processing parameters of the processing methods of coating, screen printing, chrome plating, anode, etc. can be the existing ones. This is not limited.
  • the area of the light absorbing layer 205 is larger than the area of the protective layer 204, that is, the area of the protective layer 204 (the area of the reflective layer 203) is larger than the area of the light absorbing layer 205, so that at least part of the reflective layer 203 forms a fingerprint for reflecting the surface from the screen 300
  • the reflective surface 201 of the image may use exposure development or dry and wet etching methods.
  • the specific processing method, position, shape, and size of the light absorbing layer 205 are set according to actual needs, and this embodiment is not limited herein.
  • the base 100 is manufactured on the surface of the light absorption layer 205 by processing methods such as patching, bonding, injection molding, and imprinting.
  • the structure of the base 100 in this embodiment may be: a light-transmitting cavity 101 is opened on the base 100, a side of the light-transmitting cavity 101 facing the light reflecting portion 200 has a first opening 102, and the first opening 102 is provided for supporting optical
  • the supporting portion 103 of the lens 400, the side of the light-transmitting cavity 101 opposite to the plane where the light-reflecting portion 200 is located, is used to set a fingerprint detection chip 500, and the light-transmitting cavity 101 is used to irradiate the fingerprint image reflected by the light-reflecting portion 200 through the optical lens 400 to
  • the inner wall of the light-transmitting cavity 101 is a light absorbing surface 104.
  • the light absorption coefficient of the light absorption surface 104 is not limited, and the thickness of the light absorption surface 104 is usually in the order
  • the base 100 may be made of any solid material such as organic glue, plastic particles, metal, etc., and this embodiment is not limited herein.
  • the position and shape of the base 100 are designed according to the design requirements of the optical path in FIG. 7, and this embodiment is not limited herein.
  • the second method for packaging the optical reflector 700 at the relative position between the reflective part 200 and the base 100 in FIG. 5 may include:
  • a reflective layer 203 and a light-absorbing layer 205 are provided on the base material layer 202.
  • the light reflecting layer 203 and the light absorbing layer 205 are provided in the same layer, and the remaining packaging methods are the same as those in the first embodiment of the optical reflector 700 packaging method at the first relative position between the light reflecting portion 200 and the base 100. I will not repeat them here.
  • the third method of packaging the optical reflector 700 at the relative position between the reflector 200 and the base 100 in FIG. 6 may include:
  • a reflective layer 203 is provided on one side of the base material layer 202;
  • a light absorption layer 205 is provided on the opposite side of the base material layer 202 where the reflective layer 203 is provided;
  • the light reflecting layer 203 and the light absorbing layer 205 are located on opposite sides of the base material layer 202 respectively, and the remaining packaging method is the first type of optical reflector at a position between the light reflecting part 200 and the base 100
  • the 700 packaging method embodiment is the same, and will not be repeated here.

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Abstract

本申请提供一种光学反光器、指纹识别模组、移动终端和反光器封装方法。光学反光器包括：基座和反光部；基座用于安置在屏幕的一侧，反光部和基座连接，且反光部具有与屏幕平行的反光面，以用于反射来自屏幕的表面的指纹图像；基座上开设有通光腔，通光腔朝向反光部的一侧具有第一开口，且第一开口上设置有用于支撑光学镜头的支撑部，通光腔的与反光部所在平面相对的一侧用于设置指纹检测芯片，通光腔用于使反光部反射的指纹图像经由光学镜头照射至指纹检测芯片的感测面上，通光腔的内壁为吸光面。本申请提供的光学反光器，使屏下指纹技术能应用在LCD屏中。

Description

光学反光器、指纹识别模组、移动终端和反光器封装方法 技术领域
本申请实施例涉及指纹识别技术，尤其涉及一种光学反光器、指纹识别模组、移动终端和反光器封装方法。
背景技术
随着手机等电子器件全面屏时代的到来，屏下指纹(也称光感屏幕指纹识别)技术的应用越来越广泛，其中以光学式屏下指纹最为普及。屏下指纹技术的原理为：当手指接触屏幕时，屏幕发出的光线穿透屏幕表面将指纹纹理照亮，指纹反射光线穿透屏幕返回传感器，最终形成指纹图像来进行识别。
OLED((Organic Light Emitting Display，有机发光显示器)屏内自发光，屏幕厚度薄，且整体屏幕结构均为透光材料。因此，现有技术中屏下指纹技术主要应用在OLED屏。具体的，在OLED屏内设置图像传感器，利用OLED子像素之间缝隙让光线穿透过OLED屏幕，进而识别指纹。
现有的LCD(Liquid Crystal Display，液晶显示器)屏内发光需外置光源，将外置光源的光反射向LCD屏幕，因此，屏下指纹技术难以应用在LCD屏中。
发明内容
本申请提供一种光学反光器、指纹识别模组、移动终端和反光器封装方法，以解决现有技术中LCD屏幕无法应用屏下指纹技术的技术问题。
第一方面，本申请提供一种光学反光器，包括：基座和反光部；
基座用于安置在屏幕的一侧，反光部和基座连接，且反光部具有与屏幕平行的反光面，以用于反射来自屏幕的表面的指纹图像；
基座上开设有通光腔，通光腔朝向反光部的一侧具有第一开口，且第一开口上设置有用于支撑光学镜头的支撑部，通光腔的与反光部所在平面相对的一侧用于设置指纹检测芯片，通光腔用于使反光部反射的指纹图像经由光学镜头照射至指纹检测芯片的感测面上，通光腔的内壁为吸光面。
作为一种可选的方式，本申请提供的光学反光器，通光腔的与反光部所在平面相对的一侧具有第二开口，第二开口用于设置指纹检测芯片。
作为一种可选的方式，本申请提供的光学反光器，基座用于安装在屏幕的侧方或者邻近屏幕的侧方设置，且基座的顶端为与反光面平行的平面。
作为一种可选的方式，本申请提供的光学反光器，支撑部包括安置槽，安置槽上具有相对设置的两个避让缺口，避让缺口用于避让光学镜头。
作为一种可选的方式，本申请提供的光学反光器，反光部上设置有基材层以及与基材层层叠设置的反光层。
作为一种可选的方式，本申请提供的光学反光器，反光部还包括透明的保护层，保护层位于反光层外侧。
作为一种可选的方式，本申请提供的光学反光器，反光部延伸至基座的底部下方，并与基座的底部连接。
作为一种可选的方式，本申请提供的光学反光器，反光部还具吸光层，吸光层位于基座的底部。
作为一种可选的方式，本申请提供的光学反光器，反光层和基座位于基材层的同一侧。
作为一种可选的方式，本申请提供的光学反光器，反光层的边缘与基座的朝向反光部的一侧边缘齐平；或者，反光层延伸至基座的底部下方。
作为一种可选的方式，本申请提供的光学反光器，反光层延伸至基座的底部下方，且反光层和吸光层位于不同层，保护层位于反光层与吸光层之间。
作为一种可选的方式，本申请提供的光学反光器，反光层和基座分别位于基材层的相对的两侧。
作为一种可选的方式，本申请提供的光学反光器，吸光层位于基材层与基座之间。
作为一种可选的方式，本申请提供的光学反光器，保护层位于反光层外侧。
作为一种可选的方式，本申请提供的光学反光器，保护层的材料为二氧化硅、氮化硅或有机涂料。
作为一种可选的方式，本申请提供的光学反光器，吸光层的材料为有机胶或无机涂料。
第二方面，本申请提供一种指纹识别模组，包括指纹识别芯片、光学镜头和上述的光学反光器，指纹识别芯片和光学镜头均位于光学反光器的通光腔内。
作为一种可选的方式，本申请提供的指纹识别模组，还包括光源，光源设置在屏幕的侧方，用于照亮屏幕上的指纹识别区域的指纹。
第三方面，本申请提供一种移动终端，包括上述的指纹识别模组。
第四方面，本申请提供一种光学反光器封装方法，包括：
在基材层上分别设置反光层和吸光层，至少部分反光层形成用于反射来自屏幕的表面的指纹图像的反光面；
在基材的设置有吸光层的部位设置基座，基座上开设有通光腔，通光腔用于使指纹图像照射至指纹检测芯片的感测面上，通光腔的内壁为吸光面。
作为一种可选的方式，本申请提供的光学反光器封装方法，在基材的设置有吸光层的部位设置基座具体包括：
在基材层上设置支撑层，并在支撑层中形成基座。
作为一种可选的方式，本申请提供的光学反光器封装方法，在支撑层中形成基座，具体包括：
对支撑层进行加工，以使支撑层形成基座，加工的方式包括以下任意一种或几种：贴片、键合、注塑、压印。
作为一种可选的方式，本申请提供的光学反光器封装方法，在支撑层中形成基座之后，还包括，
在通光腔的内壁设置吸光层。
作为一种可选的方式，本申请提供的光学反光器封装方法，在基材层上设置反光层之后还包括：
在反光层上设置保护层。
本申请提供的光学反光器、指纹识别模组、移动终端和反光器封装方法，光学反光器设置反光部，反光部具有与屏幕平行的反光面，通过反光面反射来自屏幕的表面的指纹图像；设置开设通光腔的基座，通光腔朝向反光部的一侧具有第一开口，第一开口上设置用于支撑光学镜头的支撑部，反射的指纹图像通过第一开口和光学镜头照射至通光腔内，并照射至通光腔上的指纹检测芯片的感测面上，最终形成指纹图像来进行识别，使屏下指纹技术 能应用在LCD屏中。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种光学反光器的结构示意图；
图2为图1的俯视图；
图3为本申请实施例提供的一种光学反光器的使用状态示意图；
图4为本申请实施例提供的一种光学反光器中基座和反光部的位置示意图一；
图5为本申请实施例提供的一种光学反光器中基座和反光部的位置示意图二；
图6为本申请实施例提供的一种光学反光器中基座和反光部的位置示意图三；
图7为本申请实施例提供的一种指纹识别模组的结构示意图；
图8为本申请实施例提供的一种移动终端的结构示意图；
图9为本申请实施例提供的一种反光器封装方法的流程图。
附图标记说明：
100—基座；101—通光腔；102—第一开口；103—支撑部；1031—避让缺口；104—吸光面；105—第二开口；200—反光部；201—反光面；202—基材层；203—反光层；204—保护层；205—吸光层；300—屏幕；400—光学镜头；500—指纹检测芯片；600—指纹识别模组；700—光学反光器；800—光源；900—移动终端。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于 本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”及“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。
此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
LCD屏的发光原理为：在两块平行板之间填充液晶材料，通过电压来改变液晶材料内部分子的排列状况，以达到遮光和透光的目的，来显示深浅不一，错落有致的图象，在两块平板间再加上三元色的滤光层，就可实现显示彩色图象。
LCD屏需要外置光源，LCD屏的背部需要具有反光板将外置光源的光反射向屏幕的表面。而屏下指纹技术的原理为：当手指接触屏幕时，屏幕发出的光线穿透屏幕表面将指纹纹理照亮，指纹反射光线穿透屏幕返回传感器，最终形成指纹图像来进行识别。因此，屏下指纹技术难以应用在LCD屏中。
故而，本申请提供的光学反光器，旨在解决现有技术的如上技术问题。
如下结合多个实例对本申请实施例提供的光学反光器进行详细说明。
图1为本申请实施例提供的一种光学反光器的结构示意图；图2为图1的俯视图；图3为本申请实施例提供的一种光学反光器的使用状态示意图。如图1-图3所示，本实施例提供的光学反光器700，包括：基座100和反光部200；
基座100用于安置在屏幕300的一侧，反光部200和基座100连接，且反光部200具有与屏幕300平行的反光面201，以用于反射来自屏幕300的表面的指纹图像；
应该理解，图3仅是示意性图例，在具体实施例中，本申请涉及的基座100安装在屏幕300的一侧，实际上可以是指基座100具体位于屏幕300的侧方或者 下方，或者邻近所述屏幕300的侧方设置。比如，屏幕300的厚度一般是大于基座的，将基座100安装在屏幕300其中一个侧面偏向底部的位置，即侧下方的位置。在其他替代实施例中，基座100也可以安装在屏幕300的下方，比如屏幕300下方的边缘位置。
基座100上开设有通光腔101，通光腔101朝向反光部200的一侧具有第一开口102，且第一开口102上设置有用于支撑光学镜头400的支撑部103，通光腔101的与反光部200所在平面相对的一侧用于设置指纹检测芯片500，通光腔101用于使反光部200反射的指纹图像经由光学镜头400照射至指纹检测芯片500的感测面上，通光腔101的内壁为吸光面104。
具体实现时，将反光部200和基座100安装在LCD屏的屏幕300的侧方，使与基座100连接的反光部200的反光面201与屏幕300平行，反光部200与屏幕300的侧方相抵接，并使反光部200位于基座100和屏幕300的侧方之间。可以将反光部200安装在用于照亮屏幕300上的指纹识别区域的光源上方。在通光腔101朝向反光部200的一侧开设第一开口102，第一开口102上设置用于支撑光学镜头400的支撑部103，通过支撑部103支撑光学镜头400，将指纹检测芯片500安装在通光腔101的与反光部200所在平面相对的一侧。
具体的，第一开口102可以为矩形、圆形、椭圆形或者不规则的形状，只要第一开口102能透光即可，本实施例在此不作限制。支撑部103用于支撑光学镜头400，支撑部103的支撑面可以与光学镜头400的外侧相匹配，以使光学镜头400能稳固的支撑在支撑部103上。通光腔101的与反光部200所在平面相对的一侧用于设置指纹检测芯片500，可以在通光腔101的内侧壁设置指纹检测芯片500，这样，进入通光腔101的指纹图像能及时照射至通光腔101上的指纹检测芯片500的感测面上；也可以将通光腔101的与反光部200所在平面相对的一侧设置为透光面，将指纹检测芯片500设置在该透光面的外侧，这样，便于安装指纹检测芯片500。
当手指接触屏幕300时，LCD屏外置光源的光反射向屏幕300的表面，并穿透屏幕300表面将指纹识别区域的指纹纹理照亮，也可以在LCD屏的侧方设置独立的光源，独立的光源的光反射向屏幕300的表面，来自屏幕300的表面的指纹图像通过反光部200的反光面201反射至第一开口102处，并经第一开口102处通过支撑部103支撑的光学镜头400照射至通光腔101内，并照射至 通光腔101上的指纹检测芯片500的感测面上，最终形成指纹图像来进行识别，使屏下指纹技术能应用在LCD屏中。
在本实施例中，设置反光部200，反光部200具有与屏幕300平行的反光面201，通过反光面201反射来自屏幕300的表面的指纹图像；设置开设通光腔101的基座100，通光腔101朝向反光部200的一侧具有第一开口102，第一开口102上设置用于支撑光学镜头400的支撑部103，反射的指纹图像通过第一开口102和光学镜头400照射至通光腔101内，并照射至通光腔101上的指纹检测芯片500的感测面上，最终形成指纹图像来进行识别，使屏下指纹技术能应用在LCD屏中。通过在通光腔101的内壁表面设置吸光面104，吸光面104降低光线杂讯的干扰。
在一种具体的实现方式中，通光腔101的与反光部200所在平面相对的一侧具有第二开口105，第二开口105用于设置指纹检测芯片500。通过在通光腔101上设置第二开口105，方便安装指纹检测芯片500。具体实现时，可以直接将纹检测芯片500覆盖并将固定在第二开口105上，以便安装指纹检测芯片500；也可以将第二开口105设置为台阶状的开口，纹检测芯片500嵌入并固定在第二开口105的台阶面上，纹检测芯片500的上表面与第二开口105的上表面平齐，这样，纹检测芯片500不易脱落。其中，纹检测芯片500与第二开口105的固定方式可以为粘接，也可以为其它类型的连接方式，本实施例此处不再赘述。
可选的，基座100用于安装在屏幕300的侧方或者邻近屏幕300的侧方设置，且基座100的顶端为与反光面201平行的平面。在具体实现时，基座100的顶端可以用于安装纹检测芯片500，也就是说，纹检测芯片500与反光面201平行，这样，反光面201反射的指纹图像通过第一开口102和光学镜头400照射至通光腔101内，并能照射至通光腔101上的指纹检测芯片500的感测面上。具体实现时，基座100的顶端可以与反光面201平齐，基座100的顶端可以高于或者低于反光面201，本实施例在此不作限定。
支撑部103用于支撑光学镜头400，为了使支撑部103能稳固的支撑光学镜头400。在一种具体的实现方式中，支撑部103包括安置槽，安置槽上具有相对设置的两个避让缺口1031，避让缺口1031用于避让光学镜头400。具体的，避让缺口1031的形状可以根据光学镜头400的外侧面设置，比如，避让 缺口1031可以与光学镜头400的外侧面相匹配，这样，使光学镜头400嵌入支撑部103内，以使支撑部103能稳固的支撑光学镜头400。
图4为本申请实施例提供的一种光学反光器中基座和反光部的位置示意图一；图5为本申请实施例提供的一种光学反光器中基座和反光部的位置示意图二；图6为本申请实施例提供的一种光学反光器中基座和反光部的位置示意图三。如图4-图6所示，本实施例提供的光学反光器700，反光部200上设置有基材层202以及与基材层202层叠设置的反光层203。也就是说，反光部200分为两个层，第一层为基材层202，在基材层202上层叠反光层203，以形成反光部200，基材层202用于支撑反光层203，反光层203用于反光。其中，反光面201可作为反光层203。
具体的，基材层202可以不透光，也可以透光。基材层202的材料可以为硅片、玻璃、金属板、陶瓷或有机材料，基材层202形状不限，基材层202的厚度为百微米级，比如，基材层202的厚度为200微米。可以在基材层202上通过溅镀、蒸镀、印刷、沉积镀银等加工方式制作反光层203。反光层203的材料可以使用铝、银等镜面反光材料即可，本实施例在此不作限定不限。反光层203的厚度通常为点微米级，比如反光层203的厚度为0.2um。
为了保护反光层203，进一步的，反光部200还包括透明的保护层204，保护层204位于反光层203外侧。保护层204用于保护反光层203，避免反光层203受到损坏。
可选的，保护层204的材料为二氧化硅、氮化硅或有机涂料。
具体的，可以通过化学气相沉积、涂胶、印刷等加工方式在反光层203的外侧制作保护层204。保护层204的厚度通常为微米级，比如保护层204的厚度为1um。
可选的，反光部200延伸至基座100的底部下方，并与基座100的底部连接。也就是说，反光部200与基座100的连接位置为基座100的底部。具体的，反光部200具有三层，分别为基材层202以及与基材层202层叠设置的反光层203，反光层203外侧的保护层204，基座100可以与基材层202、反光层203或保护层204连接。
在具体实现时，反光部200还具吸光层205，吸光层205位于基座100的底部。当反光部200并与基座100的底部连接时，若基座100的通光腔101与基座 100的底部接通时，在反光部200上吸光层205，且吸光层205位于基座100的底部，以使通光腔101的区域内均能吸光，以降低通光腔101内光线杂讯的干扰。
可选的，吸光层205的材料为有机胶或无机涂料。通过涂胶、丝印、镀铬、阳极等加工方式制作吸光层205。
由于反光部200具有基材层202、反光层203、保护层204和吸光层205，反光部200与基座100之间的相对位置也可以具有多种形式，下面对反光部200与基座100之间的各种相对位置进行详细说明。
如图4所示，反光部200与基座100之间第一种相对的位置具体为：
反光层203和基座100位于基材层202的同一侧，反光层203延伸至基座100的底部下方，具体的，基材层202、反光层203和保护层204依次层叠设置，保护层204的上方设置吸光层205，吸光层205位于基座100的底部，也就是说，吸光层205位于基座100的底部和保护层204之间，吸光层205和反光层203不同层设置，保护层204位于反光层203与吸光层205之间。这样，在制作时，依次形成基材层202、反光层203、保护层204、吸光层205和基座100。制造工艺简单，制造精度高。
如图5所示，反光部200与基座100之间第二种相对的位置具体为：
反光层203和基座100位于基材层202的同一侧，反光层203的边缘与基座100的朝向反光部200的一侧边缘齐平，具体的，基材层202和保护层204之间设置吸光层205和反光层203，吸光层205和反光层203同层设置。在制作时，在基材层202上形成同层的吸光层205和反光层203，在吸光层205和反光层203上形成保护层204，在保护层204上与吸光层205相对的部分形成基座100。这样，将吸光层205和反光层203同层设置，降低了成本。
如图6所示，反光部200与基座100之间第三种相对的位置具体为：
反光层203和基座100分别位于基材层202的相对的两侧，吸光层205位于基材层202与基座100之间，反光层203位于基座100与保护层204之间。在制作时，在基材层202的一侧面依次层叠设置反光层203和保护层204，在基材层202的相对的侧面依次层叠设置吸光层205和基座100。
图7为本申请实施例提供的一种指纹识别模组的结构示意图。如图7所示，在上述各实施例的基础上，本实施例还提供一种指纹识别模组600，包 括指纹识别芯片500、光学镜头400和上述实施例提供的光学反光器700，指纹识别芯片500和光学镜头400均位于光学反光器700的通光腔101内。
其中，光学反光器700的结构和工作原理在上述实施例中进行了详细说明，在此不一一赘述。
可选的，本实施例提供的指纹识别模组600，还包括光源800，光源800设置在屏幕300的侧方，用于照亮屏幕300上的指纹识别区域的指纹。具体的，光源800位于反光部200的下方。
具体实现时，将光学反光器700的反光部200和基座100安装在LCD屏的屏幕300的侧方，使与基座100连接的反光部200的反光面201与屏幕300平行，反光部200与屏幕300的侧方相抵接，并使反光部200位于基座100和屏幕300的侧方之间。在通光腔101朝向反光部200的一侧开设第一开口102，第一开口102上设置用于支撑光学镜头400的支撑部103，通过支撑部103支撑光学镜头400，将指纹检测芯片500安装在通光腔101的与反光部200所在平面相对的一侧。
图7中的箭头方向示出了光路的走向，具体的，光源800照亮屏幕300上的指纹识别区域的指纹，来自屏幕300的表面的指纹图像通过反光部200的反光面201反射至第一开口102处，并经第一开口102处通过支撑部103支撑的光学镜头400照射至通光腔101内，并照射至通光腔101上的指纹检测芯片500的感测面上，最终形成指纹图像来进行识别。
通过设置单独的光源800来照亮屏幕300上的指纹识别区域的指纹，使图7中的光路的走向更加精确。
图8为本申请实施例提供的一种移动终端的结构示意图。如图8所示，在上述各实施例的基础上，本实施例提供还一种移动终端900，包括上述的指纹识别模组600。
其中，指纹识别模组600的结构和工作原理在上述实施例中进行了详细说明，在此不一一赘述。
本实施例中，该移动终端900可以为液晶面板、电子纸、有机发光二极管(Organic Light-Emitting Diode，OLED)面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、可穿戴设备或家电设备等任何具有显示功能的产品或部件。
图9为本申请实施例提供的一种反光器封装方法的流程图。如图9所示。在上述各实施例的基础上，本实施例提供一种光学反光器封装方法。
具体的，该方法包括：
S101、在基材层202上分别设置反光层203和吸光层205，至少部分反光层203形成用于反射来自屏幕300的表面的指纹图像的反光面201。
具体的，反光层203和吸光层205可以位于基材层202的同侧，进一步的，反光层203和吸光层205同层设置，也可以不同层设置。反光层203和吸光层205可以位于基材层202的相对两侧，只要至少部分反光层203形成用于反射来自屏幕300的表面的指纹图像的反光面201即可，本实施例在此不作限定。
S102、在基材层202的设置有吸光层202的部位设置基座100，基座100上开设有通光腔101，通光腔101用于使指纹图像照射至指纹检测芯片500的感测面上，通光腔101的内壁为吸光面104。
具体实现时，在基材层202上设置支撑层，并在支撑层中形成基座100。
具体的，并在支撑层中形成基座100，具体包括：
对支撑层进行加工，以使支撑层形成基座100，加工的方式包括以下任意一种或几种：贴片、键合、注塑、压印。
可选的，本实施例提供的光学反光器封装方法，在基材层202上形成反光层203之后，还包括：
在反光层203上设置保护层204。通过设置保护层204，保护层204用于保护反光层203，避免反光层203受到损坏。
可选的，本实施例提供的光学反光器封装方法，在支撑层中形成基座100之后，还包括，
在通光腔101的内壁设置吸光层205。
下面根据图4-图6中反光部200与基座100之间三种相对的位置对本实施提供的光学反光器封装方法进行详细说明。
图4中反光部200与基座100之间第一种相对的位置的光学反光器700封装方法可以包括：
S201、在基材层202上设置反光层203。
具体的，基材层202的材料可以为硅片、玻璃、金属板、陶瓷或有机材 料，而基材层202形状不限。将基材层202加工至需要的厚度，基材层202的厚度为百微米级，比如，基材层202的厚度为200微米。
在基材层202的表面通过溅镀、蒸镀、印刷、沉积镀银、高掺杂溅镀铝等加工方式制作反光层203。其中溅镀、蒸镀、印刷、沉积镀银等加工方式的具体加工参数采用现有的即可，本实施例在此不作限定。
制作反光层203的材料可以使用铝、银等镜面反光材料，本实施例在此不作限定。反光层203的厚度通常为点微米级，比如反光层203的厚度为0.2um。
S202、在反光层203上设置保护层204。
具体的，保护层204的材料为二氧化硅、氮化硅或有机涂料。在反光层203的表面通过化学气相沉积、涂胶、印刷等加工方式制作保护层204，其中化学气相沉积、涂胶、印刷等加工方式的具体加工参数采用现有的即可，本实施例在此不作限定。保护层204的厚度通常为微米级，比如保护层204的厚度为1um。保护层204用于保护反光层203，避免反光层203受到损坏。设置保护层204并非必要步骤，例如反光层203使用沉积镀银或高掺杂溅镀铝的加工方式时，此保护层204可取消。
S203、在保护层204上设置吸光层205。
具体的，吸光层205的材料可使用有机胶、无机涂料等吸光类材料。在保护层204的表面通过涂胶、丝印、镀铬、阳极等加工方式制作吸光层205，其中涂胶、丝印、镀铬、阳极等加工方式的具体加工参数采用现有的即可，本实施例在此不作限定。吸光层205的区域大于保护层204的区域，即保护层204的面积(反光层203的面积)大于吸光层205的面积，以使至少部分反光层203形成用于反射来自屏幕300的表面的指纹图像的反光面201。吸光层205成形方法可使用曝光显影或干、湿法蚀刻的方法，吸光层205具体加工方法、位置、形状、大小根据实际需要进行设置，本实施例在此不作限定。
S204、在吸光层205上设置基座100。
具体的，在吸光层205的表面通过贴片、键合、注塑、压印等加工方式制作基座100。本实施例基座100的结构可以为：基座100上开设有通光腔101，通光腔101朝向反光部200的一侧具有第一开口102，且第一开口102 上设置有用于支撑光学镜头400的支撑部103，通光腔101的与反光部200所在平面相对的一侧用于设置指纹检测芯片500，通光腔101用于使反光部200反射的指纹图像经由光学镜头400照射至指纹检测芯片500的感测面上，通光腔101的内壁为吸光面104。吸光面104的吸光系数不限，吸光面104的厚度通常为微米级，比如20um。
基座100的材料可使用有机胶、塑胶粒子、金属等任何固态材料，本实施例在此不作限定。基座100的位置和形状依照图7中光路的设计需要进行设计，本实施例在此不作限定。
图5中反光部200与基座100之间第二种相对的位置的光学反光器700封装方法可以包括：
S301、在基材层202上设置反光层203和吸光层205。
S302、在吸光层205上设置保护层204。
S304、在保护层204上设置基座100。
具体的，本实施例中反光层203和吸光层205设置在同一层，其余封装方法与上述反光部200与基座100之间第一种相对的位置的光学反光器700封装方法实施例相同，在此不一一赘述。
图6中反光部200与基座100之间第三种相对的位置的光学反光器700封装方法可以包括：
S401、在基材层202的一侧设置反光层203；
S402、在反光层203上设置保护层204；
S403、在基材层202设置反光层203的相对侧设置吸光层205；
S404、在吸光层205上设置基座100。
具体的，本实施例中反光层203和吸光层205分别位于基材层202的相对的两侧，其余封装方法与上述反光部200与基座100之间第一种相对的位置的光学反光器700封装方法实施例相同，在此不一一赘述。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (24)

  1. 一种光学反光器，其特征在于，包括：基座和反光部；
    所述基座用于安置在屏幕的一侧，所述反光部和所述基座连接，且所述反光部具有与所述屏幕平行的反光面，以用于反射来自所述屏幕的表面的指纹图像；
    所述基座上开设有通光腔，所述通光腔朝向所述反光部的一侧具有第一开口，且所述第一开口上设置有用于支撑光学镜头的支撑部，所述通光腔的与所述反光部所在平面相对的一侧用于设置指纹检测芯片，所述通光腔用于使所述反光部反射的指纹图像经由所述光学镜头照射至所述指纹检测芯片的感测面上，所述通光腔的内壁为吸光面。
  2. 根据权利要求1所述的光学反光器，其特征在于，所述通光腔的与所述反光部所在平面相对的一侧具有第二开口，所述第二开口用于设置所述指纹检测芯片。
  3. 根据权利要求2所述的光学反光器，其特征在于，所述基座用于安装在所述屏幕的侧面或者邻近所述屏幕的侧面设置，且所述基座的顶端为与所述反光面平行的平面。
  4. 根据权利要求1所述的光学反光器，其特征在于，所述支撑部包括安置槽，所述安置槽上具有相对设置的两个避让缺口，所述避让缺口用于避让所述光学镜头。
  5. 根据权利要求1所述的光学反光器，其特征在于，所述反光部上设置有基材层以及与所述基材层层叠设置的反光层。
  6. 根据权利要求5所述的光学反光器，其特征在于，所述反光部还包括透明的保护层，所述保护层位于所述反光层外侧。
  7. 根据权利要求6所述的光学反光器，其特征在于，所述反光部延伸至所述基座的底部下方，并与所述基座的底部连接。
  8. 根据权利要求7所述的光学反光器，其特征在于，所述反光部还具吸光层，吸光层位于所述基座的底部。
  9. 根据权利要求7所述的光学反光器，其特征在于，所述反光层和所述基座位于所述基材层的同一侧。
  10. 根据权利要求9所述的光学反光器，其特征在于，所述反光层的边缘 与所述基座的朝向所述反光部的一侧边缘齐平；或者，所述反光层延伸至所述基座的底部下方。
  11. 根据权利要求8所述的光学反光器，其特征在于，所述反光层延伸至所述基座的底部下方，且所述反光层和所述吸光层位于不同层，所述保护层位于所述反光层与所述吸光层之间。
  12. 根据权利要求7所述的光学反光器，其特征在于，所述反光层和所述基座分别位于所述基材层的相对的两侧。
  13. 根据权利要求12所述的光学反光器，其特征在于，所述吸光层位于所述基材层与所述基座之间。
  14. 根据权利要求12或13所述的光学反光器，其特征在于，所述保护层位于所述反光层外侧。
  15. 根据权利要求6-10任一项所述的光学反光器，其特征在于，所述保护层的材料为二氧化硅、氮化硅或有机涂料。
  16. 根据权利要求1-10任一项所述的光学反光器，其特征在于，所述吸光层的材料为有机胶或无机涂料。
  17. 一种指纹识别模组，其特征在于，包括指纹识别芯片、光学镜头和权利要求1-11任一项所述的光学反光器，所述指纹识别芯片和所述光学镜头均位于所述光学反光器的通光腔内。
  18. 根据权利要求17所述的指纹识别模组，其特征在于，还包括光源，所述光源设置在屏幕的侧方，用于照亮屏幕上的指纹识别区域的指纹。
  19. 一种移动终端，其特征在于，包括权利要求17或18所述的指纹识别模组。
  20. 一种光学反光器封装方法，其特征在于，包括：
    在基材层上分别设置反光层和吸光层，至少部分所述反光层形成用于反射来自屏幕的表面的指纹图像的反光面；
    在所述基材的设置有所述吸光层的部位设置基座，所述基座上开设有通光腔，所述通光腔用于使所述指纹图像照射至指纹检测芯片的感测面上，所述通光腔的内壁为吸光面。
  21. 根据权利要求20所述的光学反光器封装方法，其特征在于，所述在所述基材的设置有所述吸光层的部位设置基座具体包括：
    在所述基材层上设置支撑层，并在所述支撑层中形成所述基座。
  22. 根据权利要求21所述的光学反光器封装方法，其特征在于，所述在所述支撑层中形成所述基座，具体包括：
    对所述支撑层进行加工，以使所述支撑层形成所述基座，所述加工的方式包括以下任意一种或几种：贴片、键合、注塑、压印。
  23. 根据权利要求21所述的光学反光器封装方法，其特征在于，所述在所述支撑层中形成所述基座之后，还包括，
    在所述通光腔的内壁设置吸光层。
  24. 根据权利要求20所述的光学反光器封装方法，其特征在于，在所述基材层上设置所述反光层之后还包括：
    在所述反光层上设置保护层。
PCT/CN2018/119033 2018-12-04 2018-12-04 光学反光器、指纹识别模组、移动终端和反光器封装方法 WO2020113395A1 (zh)

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