WO2020111825A1 - Module d'éclairage à del - Google Patents

Module d'éclairage à del Download PDF

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Publication number
WO2020111825A1
WO2020111825A1 PCT/KR2019/016602 KR2019016602W WO2020111825A1 WO 2020111825 A1 WO2020111825 A1 WO 2020111825A1 KR 2019016602 W KR2019016602 W KR 2019016602W WO 2020111825 A1 WO2020111825 A1 WO 2020111825A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
unit
heat
lighting module
led lighting
Prior art date
Application number
PCT/KR2019/016602
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English (en)
Korean (ko)
Inventor
이덕영
김항모
배언수
Original Assignee
엘이디라이텍(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020190153618A external-priority patent/KR20200064928A/ko
Application filed by 엘이디라이텍(주) filed Critical 엘이디라이텍(주)
Publication of WO2020111825A1 publication Critical patent/WO2020111825A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to an LED lighting module (light emitting diode (LED) lighting module).
  • LED lighting module light emitting diode (LED) lighting module
  • LEDs Light emitting diodes
  • LEDs Light emitting diodes
  • LEDs are widely used as new lighting devices because they are eco-friendly, have low power consumption, and have a long lifespan compared to fluorescent or incandescent lamps.
  • the LED chip on which the LED, which is a high-brightness lighting element, is mounted emits light by supplying a large current to a small element, and according to the current supply, not only light but also heat of high heat is generated in the LED chip, and is generated during light emission.
  • the light output efficiency of the LED is greatly reduced by the heat.
  • the heat generated by the LED chip is mainly determined by the product of the current supplied to the LED and the forward voltage, and generally at 40°C, the LED has a light output efficiency of about 100%, while at 80°C the LED Since it has a light output efficiency of about 60%, it can be seen that due to an increase in temperature, the light output efficiency of the LED is greatly reduced.
  • the design and manufacturing technology of a heat sink for quickly removing heat generated from the LED chip is LED. It greatly affects the efficiency of LED lighting devices using chips.
  • micro LEDs or micro LEDs having a size of 1 to 100 ⁇ m have been developed and used to express lighting or specific information of various shapes as well as simply lighting devices.
  • the conventional printed circuit board structure for driving a general LED does not radiate well, resulting in a problem that the luminous efficiency of the LED decreases.
  • the problem to be solved by the present invention is to improve the heat dissipation efficiency of the LED lighting module.
  • Another problem to be solved by the present invention is to improve the adhesion between the components of the LED lighting module, to increase the durability of the LED lighting module.
  • the LED lighting module for solving the above problems is a light source unit having at least one LED, a driving unit to which the light source unit is mounted, and located at a lower portion of the driving unit to dissipate heat transmitted through the driving unit.
  • a heat dissipation promoting unit located between the heat dissipation unit and the driving unit and the first heat dissipation unit, transferring heat from the light source unit to the first heat dissipation unit, and performing adhesion between the driving unit and the first heat dissipation unit. It includes an induction part.
  • the heat dissipation promoting induction part may contain a metal.
  • the heat dissipation promoting induction part is located under the driving part, and transfers heat transferred from the driving part to the first heat dissipation part, and is located under the heat transfer promoting layer and the heat transfer promoting layer that adheres to the driving part and transferred from the driving part. It may include a heat transfer stabilizing layer for transferring heat to the first heat dissipation unit.
  • the heat transfer stabilization layer may have the same coefficient of thermal expansion as the first heat dissipation unit.
  • the heat transfer stabilization layer may be made of the same material as the first heat dissipation unit.
  • the heat dissipation promotion inducing portion may further include a reaction diffusion preventing layer positioned between the heat transfer promoting layer and the heat transfer stabilizing layer to prevent mixing of the material of the heat transfer promoting layer and the material of the heat transfer stabilizing layer according to the heat diffusion phenomenon.
  • the coefficient of thermal expansion of the reaction diffusion preventing layer may be the same as the coefficient of thermal expansion of the first heat dissipation unit and the heat transfer stabilization layer.
  • the heat transfer promoting layer may contain titanium or chromium, and the heat transfer stabilizing layer may contain one of copper, aluminum, gold, platinum, copper alloy, and aluminum alloy, and the reaction diffusion preventing layer is nickel, gold, and nickel It may contain one of the phosphorus alloy.
  • the first heat dissipation portion may contain a metal.
  • the first heat dissipation portion may include a body containing the metal and a coupling portion containing the metal and protruding from the upper surface of the body toward the driving portion.
  • the entire body may be filled with metal.
  • the body may include a hollow filled with a refrigerant therein.
  • the refrigerant may contain acetone or distilled water.
  • the first heat dissipation unit may further include a plurality of pillars positioned in contact with the lower surface and the upper surface of the main body in the hollow and spaced apart from each other.
  • the plurality of pillars may contain metal.
  • the first heat dissipation portion is positioned to extend in a first direction in the main body, and a first heat dissipation diffusion hole for transmitting heat transmitted from the driving portion downward along the first direction and a first crossing in the main body to cross the first direction.
  • the second heat dissipation diffusion hole may be further disposed to extend in two directions and transmit heat transferred from the first heat dissipation diffusion hole to the first heat dissipation unit and the outside along the second direction.
  • a portion of the second heat dissipation diffusion hole may be filled with metal.
  • the LED lighting module according to the feature may further include a printed circuit board for power that is located above the first heat dissipation unit and supplies power to the driving unit.
  • the printed circuit board for power may include a coupling hole for coupling with the first heat dissipation unit.
  • the coupling portion of the first heat dissipation portion may be inserted into the coupling hole, and the printed circuit board for power may be located on the main body.
  • a second heat dissipation unit positioned below the first heat dissipation unit and having a heat sink may be further included.
  • the LED lighting module according to the above feature may further include a metal bonding agent positioned between the heat dissipation promoting induction unit and the first heat dissipation unit to adhere the heat dissipation promotion induction unit to the first heat dissipation unit.
  • the heat dissipation function is performed together with the power supply to the light source unit.
  • heat transfer efficiency between the driving chip and the first heat dissipation unit is improved by the heat dissipation acceleration induction unit, and bonding property is improved, thereby improving light emission efficiency and durability of the light source unit.
  • the heat generated from the light source unit is quickly transferred to the first and second heat dissipation units located at the bottom, and is dissipated to the outside, thereby reducing or preventing the phenomenon of reducing the luminous efficiency of the LED lighting module due to heat generated by driving the light source unit.
  • FIG. 1 is a cross-sectional view of an LED lighting module according to an embodiment of the present invention.
  • FIG. 2 is a view schematically showing a heat dissipation path in the LED lighting module according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the LED lighting module according to another embodiment of the present invention.
  • FIG. 4 is a view schematically showing a heat dissipation path in the LED lighting module according to another embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of the LED lighting module according to another embodiment of the present invention.
  • FIG. 6 is a view schematically showing a heat dissipation path in the LED lighting module according to another embodiment of the present invention.
  • an LED lighting module (hereinafter referred to as an “LED lighting module” for an LED lighting module) 1 according to an embodiment of the present invention is a light source unit 10 including a plurality of LEDs 11,
  • the first heat dissipation part 50 located between the heat dissipation acceleration induction part 30 and the second heat dissipation part 60 located under the heat dissipation acceleration induction part 30.
  • the LED lighting module 1 of the present example is a junction and heat conduction between the heat dissipation promoting induction unit 30 and the first heat dissipation unit 50 and the junction and heat conduction between the first heat dissipation unit 50 and the second heat dissipation unit 60.
  • First and second heat transfer layers (81, 82) for the power supply and the printed circuit board 40 and the adhesive layer 83 for bonding between the first heat dissipation unit 50 may be provided.
  • Each LED 11 is a light source made of a semiconductor element, and may be a micro LED.
  • each LED 11 is an LED generally used for lighting, but is not limited thereto.
  • each LED 11 may have a specification of 3lm/11mA.
  • the LED 11 may output light of one of red, green, blue, and yellow colors, and the plurality of LEDs 11 may output light of two or more different colors.
  • the plurality of LEDs 11 includes a UV LED outputting ultraviolet (UV) light, a blue LED outputting blue light, a red LED outputting red light, a green LED outputting green light, and a yellow light output. At least one of the yellow LEDs may be provided.
  • UV ultraviolet
  • blue LED blue LED outputting blue light
  • red LED red LED outputting red light
  • green LED green light
  • yellow light output At least one of the yellow LEDs may be provided.
  • the driving unit 20 is for driving each LED 11 and may be formed in a chip form.
  • the driving unit 20 is referred to as a driving chip.
  • the driving chip 20 supplies driving power to the LED 11 mounted thereon to control the light-emitting operation of each LED 11 and stabilize the output current of each LED 11.
  • the driving chip 20 not only drives the LED 11 but also stably fixes the position of the LED 11 located thereon.
  • the plurality of LEDs 11 may be mounted on the driving chip 20 in a serial or parallel structure using mounting technology such as surface mount technology (SMT) or chip bonding, and also, the driving chip ( In 20), an electrical network (not shown) may be formed in a matrix structure for driving the LED 11.
  • SMT surface mount technology
  • an electrical network not shown
  • the driving chip 20 may be manufactured through a semiconductor CMOS or thin-film transistor (TFT) process.
  • the printed circuit board 40 for power is a part that supplies power for driving the LED 11 and is a printed circuit board on which electrical circuits and electrical and electronic devices are mounted.
  • the driving chip 20 receives driving power from the printed circuit board 40 for power and controls the lighting state of the LED 11.
  • the printed circuit board 40 for power supply contains an FR-4 printed circuit board having an insulating layer made of an epoxy resin or an insulating metal such as aluminum (Al) or a non-insulating metal such as copper (Au). It may be a metal printed circuit board (metal PCB). At this time, the metal printed circuit board may be made of an insulating metal or a non-insulating metal.
  • the printed circuit board 40 for power supply may be made of a double-sided printed circuit board or a multi-layer printed circuit board made of multiple layers such as four layers. As shown in FIG. 1, the printed circuit board 40 for power supply is provided with a coupling hole H40 into which the first heat dissipation unit 50 is inserted and coupled to the center portion.
  • the coupling hole H40 is a through hole that completely penetrates the printed circuit board 40 for power in the thickness direction, and a part of the first heat dissipation unit 50 is inserted into the coupling hole H40 to supply the printed circuit board for power ( 40) is coupled between the first heat dissipation unit 50.
  • the driving chip 20 is positioned on the portion of the first heat dissipation unit 50 exposed through the coupling hole H40.
  • the printed circuit board 40 for power supply is electrically and physically connected to the adjacent driving chip 20 through wire bonding, so that signal transmission and power transmission with the driving chip 20 are made.
  • a wiring pattern (not shown) for electrical connection with the driving chip 20 and a wiring pattern P40 such as a pad are provided on the upper surface of the power supply printed circuit board 40 adjacent to the driving chip 20. It is printed. For this reason, the printed circuit board 40 for power supply can be electrically and physically connected to the driving chip 20 by a wire W40 through wire bonding.
  • signal transmission and power transmission between the driving chip 20 and the printed circuit board 40 for power may be performed through the wire W40.
  • the first heat dissipation unit 50 is for receiving heat transmitted from the driving chip 20 and rapidly transferring it to the outside or the second heat dissipation unit 60, and the whole is made of copper (Cu) or aluminum (Al). It may contain a material having good heat conduction efficiency (eg, metal).
  • the first heat dissipation unit 50 is connected to the driving chip 20 located at the top through the heat dissipation promotion induction unit 30.
  • the first heat dissipation unit 50 is formed in the form of a plate having a rectangular or circular planar shape, and the upper portion (ie, the lower surface of the driving chip 20) in the substantially middle portion of the upper surface of the body 51 and the body 51. Direction].
  • the main body 51 functions as a heat dissipation diffuser for dissipating and dissipating heat transferred from the driving chip 20 through the protrusions 52, and has a much larger surface area than the protrusions 52.
  • the protruding portion 52 is a coupling portion inserted into the coupling hole H40 of the printed circuit board 40 for power supply and coupled with the printed circuit board 40 for power supply.
  • the flat shape of the protrusion 52 is the same as the flat shape of the engaging hole H40, and for example, may have a square flat shape.
  • the protrusion 52 As shown in FIG. 1, as the protrusion 52 is inserted into the coupling hole H40 of the printed circuit board 40 for power, the protrusion 52 faces the driving chip 20 located thereon. .
  • the first heat dissipation part 50 is entirely made of a material having good heat conduction efficiency, and the inside of the body 51 and the protrusions 52 are all filled with the material (eg, copper) without empty space. .
  • the heat generated from the driving chip 20 through the protruding portion 52 of the first heat dissipation portion 50 passes through the heat dissipation promotion induction portion 30, and thus the heat of the lower first heat dissipation portion 50 made of copper. It is transmitted to the main body 51.
  • the main body 51 as shown in Figure 1, as the projection 52 is inserted into the coupling hole (H40) of the printed circuit board 40 for power, the printed circuit board 40 for power is the projection 52 It is located on the upper portion of the body 51 which is not located. Therefore, the main body 51 stably supports the printed circuit board 40 for power supply to stabilize the position of the printed circuit board 40 for power supply.
  • an adhesive layer 83 is positioned, and the power supply printed circuit is installed on the main body 51.
  • the substrate 40 can be stably attached.
  • the adhesive layer 83 may be formed of an insulator such as a prepreg.
  • the adhesive layer 83 may contain a thermal interface material (TIM), and in this case, due to the heat transfer material contained in the adhesive layer 83, heat generated from the power supply printed circuit board 40 is located at the bottom. It is quickly and efficiently transferred to the located first heat dissipation unit 50.
  • TIM thermal interface material
  • heat generated from the power supply printed circuit board 40 is also radiated to the outside through the first heat dissipation unit 50.
  • the adhesive layer 83 performs a heat transfer function as well as a bonding function between the power printed circuit board 40 and the first heat dissipation unit 50.
  • An example for coupling the first heat dissipation unit 50 to the power supply printed circuit board 40 is as follows.
  • an adhesive or adhesive tape is attached to both sides of the corresponding surface of the first heat dissipation unit 50 facing the lower surface of the power supply printed circuit board 40 and the driving chip 20, that is, the heat transfer material on the upper surface. Apply or attach an adhesive member such as.
  • the upper surface of the main body 51 is placed in contact with the lower surface of the printed circuit board 40 for power, and on the protrusion 52
  • the driving chip 20 on which the light source unit 10 is mounted is positioned.
  • the adhesive member applied or attached on the protrusion 62 may be applied or attached just before positioning the driving chip 20.
  • the heat dissipation acceleration induction part 30 positioned between the driving chip 20 and the protrusion 52 of the first heat dissipation part 50 performs adhesion of the driving part 20 and the first heat dissipation part 50, and the driving chip ( The heat generated in 20) is efficiently transferred to the first heat dissipation unit 50.
  • the heat dissipation promotion induction part 30 contains metal or is made of a metal, such as the first heat dissipation part 50, so that adhesion and heat conduction with the first heat dissipation part 50 can be easily and efficiently performed.
  • the heat induction promotion induction unit 30 may include a heat transfer promoting layer (eg, a first layer) 31 and a heat transfer stabilizing layer (eg, a second layer) located under the heat transfer promoting layer 31 ( 33) and a heat diffusion promoting layer 31 and a heat diffusion stabilizing layer 33 between the diffusion barrier layer (eg, the third layer) 35 may be provided.
  • a heat transfer promoting layer eg, a first layer
  • a heat transfer stabilizing layer eg, a second layer located under the heat transfer promoting layer 31 ( 33) and a heat diffusion promoting layer 31 and a heat diffusion stabilizing layer 33 between the diffusion barrier layer (eg, the third layer) 35 may be provided.
  • the heat transfer facilitating layer 31 performs bonding between the driving chip 20 made of silicon (Si) and the first heat dissipation unit 50, and the heat generated from the driving chip 20 is first heat dissipation unit 50. It is a layer for efficient transfer to the side without loss.
  • the heat transfer promoting layer 31 is in contact with itself at the top and includes a material that is well bonded with the driving chip 20 made of silicon, that is, a material having good bonding strength with silicon, and the driving chip 20 and the first. Adhesion between the heat dissipation unit 50 may be enhanced.
  • the heat transfer promoting layer 31 may include a material having good heat transfer efficiency in order to increase heat transfer efficiency from the driving chip 20 toward the first heat dissipation unit 50.
  • the heat transfer promoting layer 31 may contain one of titanium (Ti), chromium (Cr), and titanium alloy.
  • the heat transfer stabilization layer 33 may function as a heat transfer passage that transfers heat from the driving chip 20 toward the first heat dissipation unit 50.
  • the heat transfer stabilization layer 33 may have the same or very similar characteristics to the first heat dissipation unit 50 in order to efficiently transfer heat transferred from the driving chip 20 toward the first heat dissipation unit 50. have.
  • the heat transfer stabilization layer 33 may have the same or very similar coefficient of thermal expansion as the first heat dissipation unit 50, and the heat transfer coefficient should also be very good. Accordingly, the heat transfer stabilization layer 33 may contain the same material as the first heat dissipation unit 50 or may contain a material having the same or similar properties as the first heat dissipation unit 50.
  • the heat transfer stabilization layer 33 contains one of copper, aluminum, gold, platinum, copper alloy and aluminum alloy having the same or similar thermal expansion coefficient as the first heat dissipation unit 50 containing a metal such as aluminum or copper. can do.
  • the reaction diffusion preventing layer 35 positioned between the heat transfer promoting layer 31 and the heat transfer stabilizing layer 33 is due to the heat process performed during the process of forming the heat dissipation acceleration inducing portion 30, and the material of the heat transfer promoting layer 31 This is to prevent the material of the heat transfer stabilizing layer 33 from being mixed with the material of the heat transfer promoting layer 31 and the material of the heat transfer stabilizing layer 33 due to the thermal diffusion phenomenon.
  • the reaction diffusion preventing layer 35 may be made of a material that does not easily generate a thermal diffusion phenomenon.
  • the reaction diffusion prevention layer 35 is the material having the same coefficient of thermal expansion as the material used in the first heat dissipation unit 50 and the heat transfer stabilization layer 33 or the first heat dissipation unit 50 and the heat transfer stabilization layer 33 Due to the difference in the coefficient of thermal expansion from at least one, it may have a coefficient of thermal expansion of a size that does not cause cracking. Due to this, cracks are prevented in at least one of the reaction diffusion preventing layer 35, the heat transfer stabilizing layer 33, and the first heat dissipation unit 50 due to different coefficients of thermal expansion with adjacent materials.
  • the diffusion barrier layer 35 may contain one of nickel, gold, and an alloy of nickel and phosphorus.
  • the reaction diffusion preventing layer 35 may be omitted, and in this case, the heat dissipation promoting induction unit 30 is directly in contact with the heat transfer promoting layer 31 and the heat transfer promoting layer 31 attached to the lower surface of the driving chip 20.
  • the heat transfer stabilization layer 33 is provided.
  • the reaction diffusion preventing layer 35 for preventing thermal diffusion may be omitted.
  • the heat transfer promoting layer 31, the heat transfer stabilizing layer 33, and the reaction diffusion preventing layer 35 each containing metal or made of metal may be formed through a deposition process or the like.
  • the heat dissipation promoting unit 30 is a heat transfer promoting layer 31 made of titanium (Ti), a reaction diffusion preventing layer 35 made of nickel (Ni), and a heat transfer stabilizing layer made of copper (Cu) 33 ).
  • the heat transfer promoting layer 31, the heat transfer stabilizing layer 33, and the reaction diffusion preventing layer 35 are physically such as a vacuum evaporation coating, a sputtering method, an ion plating method, and the like. It may be formed using a vapor deposition method (PVD, Physical Vapor Deposition).
  • PVD Physical Vapor Deposition
  • the heat transfer promoting layer 31, the heat transfer stabilizing layer 33 and the reaction diffusion preventing layer 35 may each have a thickness of 10 ⁇ 100 ⁇ m.
  • each thickness of the heat transfer promoting layer 31, the heat transfer stabilizing layer 33, and the reaction diffusion preventing layer 35 is 10 ⁇ m or more, the functions of each layer are stably performed, and when 100 ⁇ m or less, the thickness of each layer Because the total thickness of the heat-stimulation induction layer 30 due to the increase is not unnecessarily increased, heat generated from the driving chip 20 is rapidly and stably steadily toward the first heatsink 50 through the heat-stimulation induction layer 30. Is delivered.
  • the first heat transfer layer 81 and the first heat dissipation facing each other are located between the protrusions 52 of the first heat dissipation part 50 and the heat induction promoting layer 30 facing each other.
  • the second heat transfer layer 82 positioned between the main body 51 of the unit 50 and the second heat dissipation unit 60 performs a bonding operation of two layers facing each other.
  • first and second heat transfer layers 81 and 82 may promote contact and heat transfer operations between adjacent layers.
  • the first heat transfer layer 81 is for adhering the heat dissipation promoting induction unit 30, that is, the heat transfer stabilization layer 33 to the upper surface of the protrusion 52 of the first heat dissipation unit 50.
  • the first heat transfer layer 81 may be a metal bonding agent, stably bonding the heat transfer stabilization layer 33 containing metal or made of metal and the first heat dissipation portion 50 to each other and inducing heat dissipation. The heat from 30 is efficiently transferred to the first heat dissipation unit 50.
  • the second heat transfer layer 82 is for adhering the lower surface of the first heat dissipation part 50, that is, the main body 51 to the upper surface of the second heat dissipation part 61.
  • the second heat transfer layer 82 may be made of a thermal interface material (TIM), such as a thermal conductive paste.
  • TIM thermal interface material
  • the first and second heat transfer layers 81 and 82 By the first and second heat transfer layers 81 and 82, the heat transfer efficiency from the heat dissipation promoting induction unit 30 to the first heat dissipation unit 50 and the second heat dissipation unit 60 from the first heat dissipation unit 50 The heat transfer efficiency of the furnace is improved.
  • the first and second heat transfer layers 81 and 82 may have a thickness of 10 to 50 ⁇ m, respectively.
  • the thicknesses of the first and second heat transfer layers 81 and 82 are 10 ⁇ m or more, a bonding operation between two components facing each other is smoothly performed.
  • the thicknesses of the first and second heat transfer layers 81 and 82 are 50 ⁇ m or less, an excessive thickness increase of each layer 81 and 82 is not achieved, so that the bonding state between the two components is stably maintained and smooth. The heat transfer operation takes place.
  • the second heat dissipation unit 60 includes a heat sink comprising metal or made of metal, for example, a heat sink 61 and a cooling fan (not shown).
  • the heat sink 61 is located below the first heat sink 50 and has a plurality of heat sink fins 612 protruding in the form of a pin from the top 611 and the top 611 having a predetermined shape such as a rectangle. ).
  • the heat dissipation plate 61 receives heat transmitted from the main body 51 of the first heat dissipation unit 50 located at the upper portion thereof, and heats the outside to the upper portion 611.
  • the heat sink 61 is made of copper (Cu).
  • B It may be made of a metal having good heat transfer properties such as aluminum (Al) or may contain a metal.
  • the cooling fan is not shown, it is positioned to face the heat sink 61. At this time, the cooling plate may be located between the radiating fins 63.
  • first heat dissipation unit 50 and the second heat dissipation unit 60 are coupled to each other by bonding by the second heat transfer layer 82, but are not limited thereto and are coupled to each other using a fastening member such as a screw. Can be.
  • the LED lighting module 1 of this example is provided with a driving power supply and a driving signal for driving a plurality of LEDs 11 as well as a heat dissipation operation.
  • the adhesion between the driving chip 20 and the first heat dissipation unit 50 is improved by the heat dissipation promotion induction unit 30, and heat generated from the LED lighting module 1 is efficiently applied to the first heat dissipation unit 50. ) To improve heat dissipation efficiency.
  • the increase in temperature of the LED lighting module 1 according to the driving of the light source unit 10 is suppressed or greatly reduced, and the LED lighting module 1 does not have a problem that the luminous efficiency of the LED 11 decreases due to the increase in temperature. ) Also has the effect of improving the durability.
  • the LED module 1a according to the present example may have the same structure as the LED module 1 shown in FIG. 1 except for the first heat dissipation unit 50a.
  • the LED lighting module 1a of this example is connected to the driving chip 20 and the driving chip 20 on which the light source unit 10 having a plurality of LEDs 11 is mounted, and a coupling hole H40 in the center portion Power supply printed circuit board 40, the driving chip 20 is located in contact with the heat dissipation acceleration induction unit 30, located below the heat dissipation acceleration induction unit 30, the driving chip 20 and the power supply printed circuit board ( 40) may be provided with a first heat dissipation unit 50a and a second heat dissipation unit 60 positioned below the first heat dissipation unit 50a.
  • the first heat dissipation unit 50a may include a main body 51 and a protrusion 52 protruding toward the driving chip 20 from a central portion of the main body 51.
  • the protruding portion 52 of the first heat dissipation portion 50a is also inserted into the coupling hole H40 of the printed circuit board 40 for power and the driving chip 20 is located on the exposed top surface, and the protruding portion 52 is located around The printed circuit board 40 for power is positioned on the upper surface of the main body 51 located at.
  • the first heat transfer layer 81 is positioned between the heat-radiation promoting induction part 30 and the protrusion 52 of the first heat-radiating part 50 to perform the adhesion operation between the heat-radiation promoting induction part 30 and the protrusion 52, , A second heat transfer layer 82 is positioned between the main body 51 of the first heat dissipation part 50 and the second heat dissipation part 60 to adhere the first heat dissipation part 50 and the second heat dissipation part 60 Perform the operation.
  • an adhesive layer 83 is present, and the printed circuit board for power supply is printed on the upper surface of the main body 51 of the first heat dissipation unit 50 ( 40) is stably adhered.
  • the first heat dissipation unit 50a may have first and second heat dissipation diffusion holes 53 and 54 located in different directions, unlike in FIG. 1.
  • the first and second heat dissipation diffusion holes 53 and 54 serve as heat transfer passages for rapid and efficient transfer of heat transferred from the driving chip 20 to the second heat dissipation unit 60 located at the bottom or to the outside. .
  • the first heat dissipation diffusion hole 53 is made of at least one, and is perpendicular to the installation surface of the first heat dissipation part 50 along the thickness direction (eg, the vertical direction or the first direction) of the first heat dissipation part 50. 1 This is a hole penetrating the heat dissipation section 50.
  • first heat dissipation diffusion holes 53 are positioned to be spaced apart from each other along the width direction of the first heat dissipation unit 50.
  • the heat generated in the driving chip 20 is passed through each first heat dissipation diffusion hole 53 as a passage and quickly toward the second heat dissipation unit 60 located at the bottom. Is delivered.
  • the at least one second heat dissipation diffusion hole 54 is the first heat dissipation unit along the first heat dissipation unit 50 in the width direction (ie, the direction crossing the thickness direction) (eg, the horizontal direction or the second direction) It is a hole penetrating the first heat dissipation section 50 in parallel with the installation surface of (50).
  • the second heat dissipation diffusion hole 54 is formed of a plurality, the second heat dissipation diffusion arc 54 is spaced apart along the thickness direction of the first heat dissipation unit 50.
  • some of the plurality of first heat dissipation diffusion holes 53 are first heat dissipated perpendicular to the installation surface from the top of the protrusion 52 of the first heat dissipation part 50 to the bottom of the body 51. It is installed from the second heat dissipation diffusion hole 54 that penetrates the body 50 in the first direction, and the rest crosses the body 51 of the first heat dissipation unit 50 in the second direction to the bottom of the body 51.
  • the first heat dissipation portion 50 penetrates the surface perpendicularly.
  • each second heat dissipation diffusion hole 54 communicates with the first heat dissipation diffusion hole 53 at a point where it intersects the plurality of first heat dissipation diffusion holes 53.
  • first and second heat dissipation diffusion holes 53 and 54 are located inside the first heat dissipation unit 50 in the first and second directions intersecting each other, one first heat dissipation diffusion hole 53 and one The second heat dissipation diffusion holes 54 cross each other and are connected to and communicate with each other at an intersection point.
  • each second heat dissipation diffusion hole 54 receives heat transmitted from the crossing first heat dissipation diffusion hole 53 at the crossing point and transmits the heat to the outside of the side surface of the first heat dissipation unit 50 to the outside. Discharge.
  • the heat transferred from the light source unit 10 to the second heat dissipation unit 60 is vertically (ie, second) along the first and second heat dissipation diffusion holes 53 and 54 at the intersection point. Since the heat dissipation unit (60 side) and the horizontal direction (ie, the outer side of the first heat dissipation unit 50) are distributed, the amount of heat transferred to the second heat dissipation unit (60) decreases, and the first heat dissipation unit ( 50) is to be released to the outside of the heat.
  • the second heat dissipation diffusion hole 54 in this example is an empty hole in which nothing is filled.
  • the second heat dissipation diffusion hole 54 is filled with a material (eg, metal) having good thermal conductivity, such as copper, so that the second heat dissipation diffusion hole 54 may function as a heat dissipation pattern. At this time, a portion of the second heat dissipation diffusion hole 54 crossing the first heat dissipation diffusion hole 53 may not be filled with a thermally conductive material.
  • a material eg, metal having good thermal conductivity, such as copper
  • each second heat dissipation diffusion hole 54 may have a form in which a linear copper wire is located.
  • each second heat dissipation diffusion hole 54 is filled with a thermally conductive material, the rate of heat transfer to the outside through the thermally conductive material is much faster than the rate transmitted through air, so the heat dissipation efficiency is even more Is improved.
  • the LED lighting module 1b of this example also has the same structure as the LED lighting module 1 shown in FIG. 1 except for the first heat dissipation unit 50b.
  • the LED lighting module 1b of the present example is also connected to the driving chip 20 and the driving chip 20 on which the light source unit 10 having a plurality of LEDs 11 is mounted, and a coupling hole in the center portion ( H40) is provided with a power supply printed circuit board 40, the driving chip 20 is located in contact with the heat dissipation acceleration induction portion 30, the heat dissipation acceleration induction portion 30 located below the drive chip 20 and the power supply printed circuit board
  • a first heat dissipation part 50b in which the 40 is located, and a second heat dissipation part 60 positioned under the first heat dissipation part 50b may be provided.
  • the first heat dissipation unit 50b has a different structure from the first heat dissipation unit 50, 50a of the LED light modules 1, 1a shown in FIGS. 1 and 3.
  • the first heat dissipation unit 50b of this example is composed of a heat spreader, and as shown in FIGS. 5 and 6, the body 502 coupled to the substrate 501 and the substrate 501 , It may be provided with a plurality of pillars 503 that are spaced apart in the space (S50) formed inside the body portion 502 by the combination of the substrate 501 and the body portion 502.
  • the substrate 501 is made of a plate shape having a square or circular planar shape as shown in FIG. 6 and forms a bottom surface of the first heat dissipation unit 50b.
  • the body portion 502 includes an upper surface 521 and a side surface 522 connected to the upper surface 521, and the lower portion is open. At this time, the interior of the body portion 502 is provided with a space surrounded by the upper surface 521 and the side 522.
  • the body portion 502 may include a protrusion 523 protruding upward from the outside of the upper surface 521.
  • the protruding portion 523 of this example is also inserted into the coupling hole H40 of the printed circuit board 40 for power supply, and the printed circuit board for power supply 40 ).
  • planar shape of the protrusion 523 is the same as the planar shape of the engaging hole H40.
  • the main body 502 is bonded to the edge of the substrate 501 in a sealed state as illustrated in FIG. 5, and completely encloses the substrate 501 and the body 502 inside the first heat dissipation unit 50b.
  • the enclosed empty space, that is, the hollow ( ⁇ ) S50 is located.
  • the substrate 501 and the body portion 502 coupled to each other are referred to as a body, and thus, the protrusion 523 in the first heat dissipation portion 50b protrudes toward the driving chip 20 from the upper surface of the body.
  • the hollow S50 is filled with a refrigerant for dissipating heat transferred through the driving chip 20.
  • the refrigerant may be a fluid such as distilled water or acetone.
  • the heat transferred from the driving chip 20 through the protrusion 523 is transferred to the refrigerant embedded in the space S50 of the first heat dissipation portion 50b, and the refrigerant made of fluid is changed according to the temperature change due to heat. It causes convection.
  • the heat dissipation operation transferred from the driving chip 20 is more efficiently performed due to the convection phenomenon of the refrigerant.
  • the plurality of pillars 503 are positioned in contact with the corresponding surface between the upper surface of the substrate 501 and the inner side of the upper surface 521 of the body portion 502 (ie, the inner upper surface and the inner lower surface).
  • the main body portion 502 stably maintains a predetermined distance from the substrate 501 by a plurality of pillars 503.
  • the substrate 501, the body portion 502, and the pillar 503 all contain or consist of a material such as metal (eg, copper) having good thermal conductivity.
  • the pillar 503 made of a material having good thermal conductivity is positioned between the main body 502 and the substrate 501 so that each end is in contact with the main body 502 and the substrate 501.
  • a fluid injection port H50 is provided on a corresponding surface (eg, side surface 522) of the first heat dissipation unit 50b as illustrated in FIG. 6.
  • the manufacturer places the plurality of pillars 503 at a predetermined position on the substrate 501, and then positions the main body 502 at the corresponding position of the substrate 501.
  • the bonding portion which is in contact with the substrate 501 and the body portion 502, is completely bonded through a process such as welding, thereby manufacturing a first heat dissipation portion 50b having a body and a protrusion 523.
  • the substrate 501 constitutes a lower surface of the first heat dissipation unit 50b (that is, the main body), and the main body portion 502 is a side surface and an upper surface of the first heat dissipation unit 50b (that is, the main body).
  • the heat transferred from the driving chip 20 toward the first heat dissipation unit 50b is transferred to the protrusion 523 facing the driving chip 20 and transferred to the refrigerant built in the main body 502. , Heat dissipation is performed according to the convection phenomenon of the refrigerant.
  • the LED lighting module 1b according to the present example greatly improves the heat dissipation efficiency of heat generated by the operation of the driving chip 20 due to the refrigerant present in the first heat dissipation unit 50b.
  • the LED lighting module of the present example simultaneously performs power supply and heat dissipation to the light source unit 10.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un module d'éclairage à DEL, Le module d'éclairage à DEL comprenant : une unité de source de lumière comprenant au moins une DEL ; une unité d'excitation ayant l'unité de source de lumière montée dessus ; une première unité de dissipation de chaleur positionnée sur le côté inférieur de l'unité d'excitation et dissipant la chaleur transférée à travers l'unité d'entraînement ; et une unité d'induction de promotion de dissipation positionnée entre l'unité d'excitation et la première unité de dissipation de chaleur de façon à transférer, à la première unité de dissipation de chaleur, de la chaleur de l'unité de source de lumière transférée à partir de l'unité d'excitation, et à effectuer une adhérence entre l'unité d'excitation et la première unité de dissipation de chaleur.
PCT/KR2019/016602 2018-11-29 2019-11-28 Module d'éclairage à del WO2020111825A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20180150686 2018-11-29
KR10-2018-0150686 2018-11-29
KR10-2019-0153618 2019-11-26
KR1020190153618A KR20200064928A (ko) 2018-11-29 2019-11-26 엘이디 조명 모듈

Publications (1)

Publication Number Publication Date
WO2020111825A1 true WO2020111825A1 (fr) 2020-06-04

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PCT/KR2019/016602 WO2020111825A1 (fr) 2018-11-29 2019-11-28 Module d'éclairage à del

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WO (1) WO2020111825A1 (fr)

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CN112216662A (zh) * 2020-07-31 2021-01-12 京东方科技集团股份有限公司 一种显示基板及其制作方法和显示装置

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KR101236470B1 (ko) * 2011-06-27 2013-02-22 주식회사 코스텍시스 기판 및 이를 이용한 반도체소자 패키지
KR101242093B1 (ko) * 2011-01-27 2013-03-11 주식회사 주경 방열 효율을 개선한 엘이디 장치 및 그의 제조 방법
JP2013171911A (ja) * 2012-02-20 2013-09-02 Kyocera Corp 光照射モジュールおよび印刷装置
US9252337B1 (en) * 2014-12-22 2016-02-02 Bridgelux, Inc. Composite substrate for light emitting diodes
JP2018182089A (ja) * 2017-04-14 2018-11-15 市光工業株式会社 半導体構造体及び車両用灯具

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KR101242093B1 (ko) * 2011-01-27 2013-03-11 주식회사 주경 방열 효율을 개선한 엘이디 장치 및 그의 제조 방법
KR101236470B1 (ko) * 2011-06-27 2013-02-22 주식회사 코스텍시스 기판 및 이를 이용한 반도체소자 패키지
JP2013171911A (ja) * 2012-02-20 2013-09-02 Kyocera Corp 光照射モジュールおよび印刷装置
US9252337B1 (en) * 2014-12-22 2016-02-02 Bridgelux, Inc. Composite substrate for light emitting diodes
JP2018182089A (ja) * 2017-04-14 2018-11-15 市光工業株式会社 半導体構造体及び車両用灯具

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112216662A (zh) * 2020-07-31 2021-01-12 京东方科技集团股份有限公司 一种显示基板及其制作方法和显示装置
CN112216662B (zh) * 2020-07-31 2022-07-15 京东方科技集团股份有限公司 一种显示基板及其制作方法和显示装置

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