WO2020107773A1 - 显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板 - Google Patents

显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板 Download PDF

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Publication number
WO2020107773A1
WO2020107773A1 PCT/CN2019/082830 CN2019082830W WO2020107773A1 WO 2020107773 A1 WO2020107773 A1 WO 2020107773A1 CN 2019082830 W CN2019082830 W CN 2019082830W WO 2020107773 A1 WO2020107773 A1 WO 2020107773A1
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Prior art keywords
mask
cooling
display panel
vapor deposition
input end
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PCT/CN2019/082830
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English (en)
French (fr)
Inventor
李朝
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/462,241 priority Critical patent/US20200168799A1/en
Publication of WO2020107773A1 publication Critical patent/WO2020107773A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

Definitions

  • the invention relates to a mask cooling system, in particular to a display panel evaporation mask assembly cooling system and an evaporation mask.
  • the cooling system directly cools the evaporation mask by circulating cooling liquid to improve
  • the cooling efficiency of the evaporation mask and the glass substrate can be effectively reduced, and the color mixing problem caused by the thermal expansion of the evaporation mask and the glass substrate in the evaporation process can be effectively reduced, so the organic light emitting diode (Organic Light Emitting Diode, OLED) display panel product yield.
  • OLED Organic Light Emitting Diode
  • Organic light emitting diode (Organic Light Emitting Diode, OLED) display panel products have the advantages of light and thin, fast response, wide viewing angle, high contrast, bendable and so on, so they gradually become the mainstream display panel, mainly used in mobile phones, flat panel, TV and other display fields .
  • the film formation of the OLED material of the OLED display panel is mainly completed by a deposition process, that is, the crucible containing the OLED material is heated by a heating system to cause the material to be sublimated by heat and then deposited on the glass substrate through a nozzle.
  • FIG. 1 is a schematic structural diagram of a device of the prior art OLED evaporation process.
  • the devices used in the prior art OLED vapor deposition process are as follows: crucible 91, mask plate 94 provided above the crucible 91, glass substrate 95 provided above the mask plate 94, and provided on the glass substrate The magnetic plate 96 above 95.
  • the magnetic plate 96 attracts the mask plate 94 with magnetic force and clamps the glass substrate 95 between the magnetic plate 96 and the mask plate 94.
  • a lower cooling pipe 92 is provided around the crucible 91, and a cooling liquid is passed into the lower cooling pipe 92 to suppress the heat radiated from the crucible 91.
  • An upper cooling tube 97 is provided in the magnetic plate 96, and cooling liquid is passed into the upper cooling tube 97 to dissipate heat from the magnetic plate 96.
  • the crucible 91 carrying the OLED material is heated by an evaporation source (or heating source) 911, and after the OLED material is heated and sublimated, it is ejected from the nozzle on the top of the crucible 91 and deposited above On the glass substrate 95. Since the sublimation temperature of most OLED materials is a high temperature above 400 °C, the residual heat generated by the evaporation source 911 will diffuse into the mask plate 94 and the glass substrate 95 in the form of thermal radiation, causing the mask The temperature of the diaphragm 94 and the glass substrate 95 rises.
  • the mask plate 94 is limited due to the limited cooling capacity of the cooling system
  • the surface temperature of the glass substrate 95 is still higher than room temperature, the temperature difference causes the mask plate 94 and the glass substrate 95 to undergo thermal expansion deformation, and the coefficient of thermal expansion of the mask plate 94 and the glass substrate 95 is different, making The different expansion amounts of the two will cause color mixing problems during the evaporation process.
  • the OLED vapor deposition process needs to further improve the cooling system to improve the cooling efficiency of the cooling system to the mask plate 94 and the glass substrate 95, thereby reducing the temperature of the mask plate 94 and the glass substrate 95 and increasing The color mixing yield of OLED display panel products.
  • the present invention provides a cooling system for an evaporation mask component of a display panel and an evaporation mask.
  • the main object of the present invention is to provide a cooling system for a vapor deposition mask assembly of a display panel.
  • the cooling system directly cools the vapor deposition mask by circulating a cooling liquid, thereby improving the cooling of the vapor deposition mask and the glass substrate.
  • the efficiency can effectively reduce the color mixing problem caused by the thermal expansion of the evaporation mask and the glass substrate in the evaporation process, so it can significantly improve the yield of OLED display panel products.
  • the cooling system of the display panel evaporation mask assembly of the present invention is used to dissipate heat from the evaporation mask assembly, wherein the evaporation mask assembly includes: an evaporation mask plate, which is provided on the A glass substrate above the evaporation mask plate, and a magnetic plate provided above the glass substrate;
  • the cooling system of the display panel vapor deposition mask assembly includes: a mask cooling tube disposed in the vapor deposition mask plate, and a cooling liquid is provided in the mask cooling tube for the vapor deposition mask plate Allow to cool.
  • the cooling system of the display panel evaporation mask assembly further includes: a lower cooling tube, and a cooling liquid is provided in the lower cooling tube.
  • the cooling system of the display panel evaporation mask assembly further includes: an upper cooling tube disposed in the magnetic plate, and a cooling liquid is disposed in the upper cooling tube for the magnetic The plate is cooled.
  • the mask cooling pipe has an input end and an output end, and the cooling liquid in the mask cooling pipe flows from the input end along the mask cooling pipe to the output end.
  • the input end and the output end of the mask cooling pipe are connected with a circulation pump so that the cooling liquid is between the mask cooling pipe and the circulation pump Circulating flow.
  • the circulation pump is provided with two connecting pipes to respectively connect the input end and the output end of the mask cooling pipe, and the ends of each connecting pipe are retracted to form a sleeve joint To insert the input terminal or the output terminal.
  • the evaporation mask plate includes a plate body and a frame surrounding the plate body; the mask cooling tube is disposed in the frame.
  • the mask cooling tube forms at least one ring around the plate body along the frame.
  • a plurality of evaporation holes are formed through the plate body.
  • the frame of the evaporation mask is rectangular and has four sides, and the input end and the output end of the mask cooling tube are located on one side of the frame .
  • the lower cooling pipe has an input end and an output end, and the cooling liquid in the lower cooling pipe flows from the input end along the lower cooling pipe to the output end; the lower cooling A pump is connected to the input end and the output end of the tube to circulate the cooling liquid between the lower cooling tube and the lower pump.
  • the upper cooling pipe has an input end and an output end, and the cooling liquid in the upper cooling pipe flows from the input end along the upper cooling pipe to the output end; the upper cooling An upper pump is connected to the input end and the output end of the tube to circulate the cooling liquid between the upper cooling tube and the upper pump.
  • Another object of the present invention is to provide an evaporation mask for a display panel, including:
  • a mask cooling tube is provided in the frame, and a cooling liquid is provided in the mask cooling tube for cooling the evaporation mask plate.
  • the mask cooling pipe has an input end and an output end, and the cooling liquid in the mask cooling pipe flows from the input end along the mask cooling pipe to the output end.
  • the input end and the output end of the mask cooling pipe are connected with a circulation pump so that the cooling liquid is between the mask cooling pipe and the circulation pump Circulating flow.
  • the circulation pump is provided with two connecting pipes to respectively connect the input end and the output end of the mask cooling pipe, and the ends of each connecting pipe are retracted to form a sleeve joint To insert the input terminal or the output terminal.
  • the mask plate includes a plate body and a frame surrounding the plate body; the mask cooling tube is disposed in the frame.
  • the mask cooling tube forms at least one ring around the plate body along the frame.
  • a plurality of evaporation holes are formed through the plate body.
  • the frame of the mask plate is rectangular and has four sides, and the input end and the output end of the mask cooling tube are located on one side of the frame.
  • the display panel vapor deposition mask assembly cooling system and the vapor deposition mask of the present invention are mainly provided with a mask cooling tube in the vapor deposition mask plate, and the mask cooling tube Passing a cooling liquid to directly circulate and heat dissipate the evaporation mask, improves the cooling efficiency of the evaporation mask and the glass substrate located above the evaporation mask, and can effectively reduce the evaporation
  • the color mixing problem caused by the thermal expansion of the mask plate and the glass substrate in the process can significantly improve the yield of OLED display panel products.
  • FIG. 1 is a schematic front view of a device structure in a conventional evaporation process.
  • FIG. 2 is a schematic front view of the structure of the cooling system of the display panel evaporation mask assembly of the present invention.
  • FIG. 3 is a schematic top view of the evaporation mask of the present invention.
  • FIG. 4 is a partially enlarged front cross-sectional schematic view of the input end and the output end of the evaporation mask of the present invention.
  • FIG. 5 is a partially enlarged side cross-sectional schematic view of the input end of the evaporation mask of the present invention.
  • the cooling system of the vapor deposition mask assembly of the display panel of the present invention is used to dissipate heat from the vapor deposition mask assembly, wherein the vapor deposition mask assembly includes: a vapor deposition mask plate 40 and a The glass substrate 50 above the vapor deposition mask 40 and the magnetic plate 50 provided above the glass substrate 50.
  • the cooling system of the display panel vapor deposition mask assembly of the present invention includes: a lower cooling pipe 20, a mask cooling pipe 40, and an upper cooling pipe 65.
  • the lower cooling tube 20 is arranged around the crucible 10, and a cooling liquid is provided in the lower cooling tube 20 to suppress the heat radiated from the crucible 10.
  • the cooling liquid may be water, alcohol or any evaporable liquid.
  • a nozzle 100 is provided on the top of the crucible 10.
  • the crucible 10 may be filled with organic light-emitting diodes (Organic Light Emitting Diode, OLED) material.
  • the lower cooling pipe 20 has an input end 21 and an output end 22, and the cooling liquid in the lower cooling pipe 20 flows from the input end 21 along the lower cooling pipe 20 to the Output 22.
  • the input end 21 and the output end 22 of the lower cooling pipe 20 are connected to a pump 27 to circulate the cooling liquid between the lower cooling pipe 20 and the lower pump 27,
  • the lower pump 27 may be provided with a radiator or other types of heat exchangers to help dissipate the cooling liquid.
  • the mask cooling pipe 45 is provided in the vapor deposition mask plate 40, and the mask cooling pipe 45 is provided with a cooling liquid for cooling the vapor deposition mask plate 40.
  • the cooling liquid may be water, alcohol or any evaporable liquid.
  • the mask cooling tube 45 can be made of stainless steel.
  • the vapor deposition mask 40 can be erected above the crucible 10 through a bracket 30.
  • the vapor deposition mask 40 includes a plate body 41 and a frame 43.
  • a plurality of vapor deposition holes 410 are formed through the plate body 41 for sublimation of OLED material to be deposited on the glass substrate 50 through the plurality of vapor deposition holes 410.
  • the frame 43 is arranged around the plate body 41, and the mask cooling tube 45 is arranged in the frame 43.
  • the frame 43 of the vapor deposition mask 40 may be rectangular with four sides 431, and the width of the frame 43 may be 50 mm.
  • the mask cooling tube 45 forms at least one loop around the plate body 41 along the frame 43.
  • the mask cooling tube 45 may be a component mounted on the vapor deposition mask plate 40, or the vapor deposition mask plate 40 may be formed together in the manufacturing process such as casting and turning. The mask plate 40 is vapor-deposited.
  • the mask cooling pipe 45 has an input end 451 and an output end 452, and the cooling liquid in the mask cooling pipe 45 runs from the input end 451 along the mask cooling pipe 45 Flow to the output 452.
  • the input end 451 and the output end 452 of the mask cooling tube 45 may be located on one side 431 of the frame 43.
  • a circulation pump 47 is connected to the input end 451 and the output end 452 of the mask cooling pipe 45 to circulate the cooling liquid between the mask cooling pipe 45 and the circulation pump 47 .
  • Two connecting pipes 470 are provided on the circulation pump 47 to connect the input end 451 and the output end 452 of the mask cooling pipe 45 respectively, and the end of each connecting pipe 470 is retracted to form a sleeve section 471 To insert the input terminal 451 or the output terminal 452.
  • a rubber airtight sleeve 48 may be sleeved on the joint of each connecting tube 470 and the corresponding input end 451 or output end 452 to provide the sealability at the place.
  • the circulation pump 47 may be provided with a radiator or other types of heat exchangers to help dissipate the cooling liquid.
  • the outer diameter D1 of the input end 451 of the mask cooling tube 45 is 10 mm
  • the inner diameter D2 is 5 mm
  • the outer diameter D3 of the output end 452 is 10 mm
  • the inner diameter D4 is 5 mm
  • the outer diameter of the sleeve section 471 of the connecting pipe 470 is 5 mm.
  • the glass substrate 50 is provided above the vapor deposition mask 40.
  • the upper cooling tube 65 is provided in the magnetic plate 60, and the upper cooling tube 65 is provided with a cooling liquid for cooling the magnetic plate 60.
  • the cooling liquid may be water, alcohol or any evaporable liquid.
  • the upper cooling pipe 65 has an input end 651 and an output end 652, and the cooling liquid in the upper cooling pipe 65 flows from the input end 651 along the upper cooling pipe 65 to the Output 652.
  • an upper pump 67 is connected to the input end 651 and the output end 652 of the upper cooling pipe 65 to circulate the cooling liquid between the upper cooling pipe 65 and the upper pump 67 .
  • the upper pump 67 may be provided with a radiator or other types of heat exchangers to help dissipate the cooling liquid.
  • the magnetic plate 60 magnetically attracts the vapor deposition mask 40 so that the glass substrate 50 is sandwiched and fixed between the vapor deposition mask 40 and the magnetic plate 60.
  • the crucible 10 carrying the OLED material is heated with an evaporation source (or heating source) 11, and the OLED material is heated and sublimated, then sprayed from the nozzle 100 on the top of the crucible 10 and deposited above On the glass substrate 50. Since the sublimation temperature of most OLED materials is a high temperature above 400 °C, the residual heat generated by the evaporation source 11 will diffuse into the vapor deposition mask 40 and the glass substrate 50 in the form of thermal radiation, causing The temperature of the vapor deposition mask 40 rises.
  • the mask cooling tube 45 in the vapor deposition mask 40 and the circulating cooling fluid therein can immediately dissipate heat from the vapor deposition mask 40, the vapor deposition mask 40 can be effectively removed Is controlled at a reasonable low temperature range, and since the evaporation mask 40 located below the glass substrate 50 has first dissipated most of the heat from the evaporation source 11, it is located in the evaporation mask The glass substrate 50 above the membrane 40 naturally bears less heat, so the temperature rise of the glass substrate 50 can be reduced, thereby avoiding the problem of color mixing during the evaporation of OLED materials.
  • the cooling system and the evaporation mask 40 of the display panel evaporation mask assembly 40 of the present invention are mainly provided with a mask cooling tube 45 in the evaporation mask 40, and
  • the mask cooling pipe 45 passes a cooling liquid to directly circulate and radiate heat to the vapor deposition mask plate 40, which improves the vapor deposition mask plate 40 and the glass substrate 50 located above the vapor deposition mask plate 40
  • the cooling efficiency can effectively reduce the color mixing problem caused by the thermal expansion of the mask plate and the glass substrate 50 in the evaporation process, so it can significantly improve the yield of the OLED display panel product.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一种显示面板蒸镀掩膜组件冷却系统，用于对蒸镀掩膜组件进行散热，蒸镀掩膜组件包括：蒸镀掩膜板(40)、设置在蒸镀掩膜板(40)上方的玻璃基板(50)、以及设置在玻璃基板(50)上方的磁板(60)，显示面板蒸镀掩膜组件冷却系统包括：掩膜冷却管(45)，设置在蒸镀掩膜板(40)内，掩膜冷却管(45)内设置有冷却液以用于对蒸镀掩膜板(40)进行冷却。还公开了一种用于显示面板的蒸镀掩膜板(40)。

Description

显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板 技术领域
本发明关于一种掩膜板冷却系统，尤其关于一种显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板，所述冷却系统通过循环冷却液直接对蒸镀掩膜板进行冷却，提高了对蒸镀掩膜板和玻璃基板的冷却效率，能有效降低蒸镀工艺中因蒸镀掩膜板和玻璃基板的热膨胀引起的混色问题，故能显著提升有机发光二极管(Organic Light Emitting Diode, OLED)显示面板产品良率。
 背景技术
有机发光二极管(Organic Light Emitting Diode, OLED)显示面板产品具有轻薄、响应快、广视角、高对比度、可弯折等优点，因此逐渐成为显示主流面板，主要应用在手机、平板、电视等显示领域。
目前OLED显示面板OLED材料成膜主要通过蒸镀(Deposition)工艺来完成，即通过加热系统对装有OLED材料的坩埚加热使材料受热升华后经过喷嘴沉积到玻璃基板上。
图1为现有技术的OLED蒸镀工艺的装置结构示意图。现有技术的OLED蒸镀工艺使用的装置如下：坩埚91、设置在所述坩埚91上方的掩膜板94、设置在所述掩膜板94上方的玻璃基板95、以及设置在所述玻璃基板95上方的磁板96。所述磁板96以磁力吸附所述掩膜板94并使所述玻璃基板95被夹定在所述磁板96与所述掩膜板94之间。所述坩埚91周围设置有下冷却管92，并在所述下冷却管92中通入冷却液以抑制所述坩埚91散发的热。所述磁板96内设置有上冷却管97，并在所述上冷却管97中通入冷却液为所述磁板96进行散热。
当进行上述蒸镀工艺时，以蒸发源（或称加热源）911对盛载有OLED材料的坩埚91加热，使所述OLED材料受热升华后，由坩埚91顶部的喷嘴喷出并沉积到上方的玻璃基板95上。由于大多数OLED材料的升华温度是在400 ℃以上的高温，所述蒸发源911产生的余热会以热辐射的形式扩散到所述掩膜板94和所述玻璃基板95上，造成所述掩膜板94和所述玻璃基板95温度上升。
尽管在所述坩埚91以及所述磁板96上设置了冷却系统（所述下冷却管92及所述上冷却管97），但是由于所述冷却系统的冷却能力有限，所述掩膜板94和所述玻璃基板95表面温度依然高于室温，温差导致所述掩膜板94和所述玻璃基板95受热膨胀变形，而所述掩膜板94和所述玻璃基板95的热膨胀系数不同，使得两者的膨胀量不同，会在蒸镀过程中造成混色问题。因此，OLED蒸镀工艺有必要对所述冷却系统进一步改善，以提升冷却系统对所述掩膜板94和所述玻璃基板95的冷却效率，从而降低掩膜板94和玻璃基板95温度，提高OLED显示面板产品的混色良率。
故，有必要提供一种显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板，以解决现有技术所存在的问题。
 技术问题
有鉴于现有技术的有机发光二极管(Organic Light Emitting Diode, OLED)蒸镀工艺的冷却系统不足的缺点，本发明提出了一种显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板。
 技术解决方案
本发明的主要目的在于提供一种显示面板蒸镀掩膜组件冷却系统，所述冷却系统通过循环冷却液直接对蒸镀掩膜板进行冷却，提高了对蒸镀掩膜板和玻璃基板的冷却效率，能有效降低蒸镀工艺中因蒸镀掩膜板和玻璃基板的热膨胀引起的混色问题，故能显著提升OLED显示面板产品良率。
为达成本发明上述目的，本发明显示面板蒸镀掩膜组件冷却系统用于对蒸镀掩膜组件进行散热，其中，所述蒸镀掩膜组件包括：蒸镀掩膜板、设置在所述蒸镀掩膜板上方的玻璃基板、以及设置在所述玻璃基板上方的磁板；
所述显示面板蒸镀掩膜组件冷却系统包括：掩膜冷却管，设置在所述蒸镀掩膜板内，所述掩膜冷却管内设置有冷却液以用于对所述蒸镀掩膜板进行冷却。
在本发明一实施例中，所述显示面板蒸镀掩膜组件冷却系统进一步包括：下冷却管，所述下冷却管内设置有冷却液。
在本发明一实施例中，所述显示面板蒸镀掩膜组件冷却系统进一步包括：上冷却管，设置在所述磁板内，所述上冷却管内设置有冷却液以用于对所述磁板进行冷却。
在本发明一实施例中，所述掩膜冷却管具有输入端以及输出端，所述掩膜冷却管内的冷却液自所述输入端沿着所述掩膜冷却管流向所述输出端。
在本发明一实施例中，所述掩膜冷却管的所述输入端及所述输出端连接一循环泵浦以使所述冷却液在所述掩膜冷却管与所述循环泵浦之间循环流动。
在本发明一实施例中，所述循环泵浦上设置有二连接管以分别连接所述掩膜冷却管的所述输入端以及所述输出端，各所述连接管末端内缩形成套接段以插入所述输入端或所述输出端。
在本发明一实施例中，所述蒸镀掩膜板包括板体以及环绕设置在所述板体周围的边框；所述掩膜冷却管设置在所述边框内。
在本发明一实施例中，所述掩膜冷却管沿着所述边框形成至少一环绕所述板体的环圈。
在本发明一实施例中，所述板体上贯穿形成有多个蒸镀孔。
在本发明一实施例中，所述蒸镀掩膜板的边框为矩形而具有四侧边，所述掩膜冷却管的所述输入端及所述输出端位于所述边框的其中一侧边。
在本发明一实施例中，所述下冷却管具有输入端以及输出端，所述下冷却管内的冷却液自所述输入端沿着所述下冷却管流向所述输出端；所述下冷却管的所述输入端及所述输出端连接一下泵浦以使所述冷却液在所述下冷却管与所述下泵浦之间循环流动。
在本发明一实施例中，所述上冷却管具有输入端以及输出端，所述上冷却管内的冷却液自所述输入端沿着所述上冷却管流向所述输出端；所述上冷却管的所述输入端及所述输出端连接一上泵浦以使所述冷却液在所述上冷却管与所述上泵浦之间循环流动。
本发明另一目的在于提供一种用于显示面板的蒸镀掩膜板，包括：
板体；
边框，环绕设置在所述板体周围；以及
掩膜冷却管，设置在所述边框内，所述掩膜冷却管内设置有冷却液以用于对所述蒸镀掩膜板进行冷却。
在本发明一实施例中，所述掩膜冷却管具有输入端以及输出端，所述掩膜冷却管内的冷却液自所述输入端沿着所述掩膜冷却管流向所述输出端。
在本发明一实施例中，所述掩膜冷却管的所述输入端及所述输出端连接一循环泵浦以使所述冷却液在所述掩膜冷却管与所述循环泵浦之间循环流动。
在本发明一实施例中，所述循环泵浦上设置有二连接管以分别连接所述掩膜冷却管的所述输入端以及所述输出端，各所述连接管末端内缩形成套接段以插入所述输入端或所述输出端。
在本发明一实施例中，所述掩膜板包括板体以及环绕设置在所述板体周围的边框；所述掩膜冷却管设置在所述边框内。
在本发明一实施例中，所述掩膜冷却管沿着所述边框形成至少一环绕所述板体的环圈。
在本发明一实施例中，所述板体上贯穿形成有多个蒸镀孔。
在本发明一实施例中，所述掩膜板的边框为矩形而具有四侧边，所述掩膜冷却管的所述输入端及所述输出端位于所述边框的其中一侧边。
 有益效果
与现有技术相比较，本发明的显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板主要在所述蒸镀掩膜板内设置有掩膜冷却管，并在所述掩膜冷却管通入冷却液以直接对所述蒸镀掩膜板进行循环散热，提高了对所述蒸镀掩膜板和位于所述蒸镀掩膜板上方的玻璃基板的冷却效率，能有效降低蒸镀工艺中因掩膜板和玻璃基板的热膨胀引起的混色问题，故能显著提升OLED显示面板产品良率。
为让本发明的上述内容能更明显易懂，下文特举优选实施例，配合所附图式，作详细说明如下：
 附图说明
图1是一现有的蒸镀工艺中的装置结构的正面示意图。
图2是本发明显示面板蒸镀掩膜组件冷却系统结构的正面示意图。
图3是本发明蒸镀掩膜板的俯视示意图。
图4是本发明蒸镀掩膜板的输入端与输出端的局部放大正面剖视示意图。
图5是本发明是本发明蒸镀掩膜板的输入端的局部放大侧面剖视示意图。
 本发明的实施方式
请参照图2及图3，本发明显示面板蒸镀掩膜组件冷却系统用于对蒸镀掩膜组件进行散热，其中，所述蒸镀掩膜组件包括：蒸镀掩膜板40、设置在所述蒸镀掩膜板40上方的玻璃基板50、以及设置在所述玻璃基板50上方的磁板50。
本发明显示面板蒸镀掩膜组件冷却系统包括：下冷却管20、掩膜冷却管40、以及上冷却管65、。
所述下冷却管20，用于设置在坩埚10周围，所述下冷却管20内设置有冷却液以抑制所述坩埚10散发的热。所述冷却液可为水、酒精或任何可蒸发的液体。此外，所述坩埚10顶部设置有喷嘴100。所述坩埚10可填充有有机发光二极管(Organic Light Emitting Diode, OLED)材料。在本发明一实施例中，所述下冷却管20具有输入端21以及输出端22，所述下冷却管20内的冷却液自所述输入端21沿着所述下冷却管20流向所述输出端22。此外，所述下冷却管20的所述输入端21及所述输出端22连接一下泵浦27以使所述冷却液在所述下冷却管20与所述下泵浦27之间循环流动，所述下泵浦27上可设置有散热器或是其他类型热交换器以帮助对冷却液散热。
所述掩膜冷却管45设置在所述蒸镀掩膜板40内有，所述掩膜冷却管45内设置有冷却液以用于对所述蒸镀掩膜板40进行冷却。所述冷却液可为水、酒精或任何可蒸发的液体。所述掩膜冷却管45可以不锈钢制造。所述蒸镀掩膜板40可透过一支架30而架设在所述坩埚10上方。所述蒸镀掩膜板40包括板体41以及边框43。所述板体41上贯穿形成有多个蒸镀孔410以供升华的OLED材料通过所述多个蒸镀孔410而沉积到所述玻璃基板50上。所述边框43环绕设置在所述板体41周围，所述掩膜冷却管45设置在所述边框43内。此外，所述蒸镀掩膜板40的边框43可为矩形而具有四侧边431，且所述边框43的宽度可为50mm。在本发明一实施例中，所述掩膜冷却管45沿着所述边框43形成至少一环绕所述板体41的环圈。此外，上述掩膜冷却管45可以是安装到所述蒸镀掩膜板40的零组件，也可以是所述蒸镀掩膜板40在经过铸造、车削等制造工艺中一并形成在所述蒸镀掩膜板40内。
请参照图4及图5，所述掩膜冷却管45具有输入端451以及输出端452，所述掩膜冷却管45内的冷却液自所述输入端451沿着所述掩膜冷却管45流向所述输出端452。所述掩膜冷却管45的所述输入端451及所述输出端452可位于所述边框43的其中一侧边431。所述掩膜冷却管45的所述输入端451及所述输出端452连接一循环泵浦47以使所述冷却液在所述掩膜冷却管45与所述循环泵浦47之间循环流动。所述循环泵浦47上设置有二连接管470以分别连接所述掩膜冷却管45的所述输入端451以及所述输出端452，各所述连接管470末端内缩形成套接段471以插入所述输入端451或所述输出端452。此外，在各连接管470与对应的输入端451或输出端452的结合处可套设有一橡胶气密套筒48以提供所述处密封性。此外，所述循环泵浦47上可设置有散热器或是其他类型热交换器以帮助对冷却液散热。在本发明一实施例中，所述掩膜冷却管45的所述输入端451外径D1为10mm，内径D2为5mm，所述输出端452外径D3为10mm，内径D4为5mm；各所述连接管470的所述套接段471外径为5mm。
所述玻璃基板50，设置在所述蒸镀掩膜板40上方。
所述上冷却管65设置在所述磁板60内有，所述上冷却管65内设置有冷却液以用于对所述磁板60进行冷却。所述冷却液可为水、酒精或任何可蒸发的液体。在本发明一实施例中，所述上冷却管65具有输入端651以及输出端652，所述上冷却管65内的冷却液自所述输入端651沿着所述上冷却管65流向所述输出端652。此外，所述上冷却管65的所述输入端651及所述输出端652连接一上泵浦67以使所述冷却液在所述上冷却管65与所述上泵浦67之间循环流动。所述上泵浦67上可设置有散热器或是其他类型热交换器以帮助对冷却液散热。所述磁板60以磁力磁吸所述蒸镀掩膜板40以使所述玻璃基板50被夹持固定在所述蒸镀掩膜板40与所述磁板60之间。
当进行蒸镀工艺时，以蒸发源（或称加热源）11对盛载有OLED材料的坩埚10加热，使所述OLED材料受热升华后，由坩埚10顶部的喷嘴100喷出并沉积到上方的玻璃基板50上。由于大多数OLED材料的升华温度是在400 ℃以上的高温，所述蒸发源11产生的余热会以热辐射的形式扩散到所述蒸镀掩膜板40和所述玻璃基板50上，造成所述蒸镀掩膜板40温度上升。由于所述蒸镀掩膜板40内的掩膜冷却管45及其内部循环流动冷却液能即时对所述蒸镀掩膜板40进行散热，因此能有效地将所述蒸镀掩膜板40的温度控制在合理的低温范围下，且由于位于所述玻璃基板50下方的所述蒸镀掩膜板40已先对来自所述蒸发源11的大部分热量进行散热，位于所述蒸镀掩膜板40上方的所述玻璃基板50自然承受较少的热量，故能减少所述玻璃基板50的温度上升量，藉此避免OLED材料蒸镀过程中混色的问题。
与现有技术相比较，本发明的显示面板蒸镀掩膜组件40冷却系统及蒸镀掩膜板40主要在所述蒸镀掩膜板40内设置有掩膜冷却管45，并在所述掩膜冷却管45通入冷却液以直接对所述蒸镀掩膜板40进行循环散热，提高了对所述蒸镀掩膜板40和位于所述蒸镀掩膜板40上方的玻璃基板50的冷却效率，能有效降低蒸镀工艺中因掩膜板和玻璃基板50的热膨胀引起的混色问题，故能显著提升OLED显示面板产品良率。

Claims (20)

  1. 一种显示面板蒸镀掩膜组件冷却系统，用于对蒸镀掩膜组件进行散热，所述蒸镀掩膜组件包括：蒸镀掩膜板、设置在所述蒸镀掩膜板上方的玻璃基板、以及设置在所述玻璃基板上方的磁板，所述显示面板蒸镀掩膜组件冷却系统包括：
    掩膜冷却管，设置在所述蒸镀掩膜板内，所述掩膜冷却管内设置有冷却液以用于对所述蒸镀掩膜板进行冷却。
  2. 如权利要求1所述的显示面板蒸镀掩膜组件冷却系统，进一步包括：
    下冷却管，所述下冷却管内设置有冷却液。
  3. 如权利要求2所述的显示面板蒸镀掩膜组件冷却系统，进一步包括：
    上冷却管，设置在所述磁板内，所述上冷却管内设置有冷却液以用于对所述磁板进行冷却。
  4. 如权利要求3所述的显示面板蒸镀掩膜组件冷却系统，其中所述掩膜冷却管具有输入端以及输出端，所述掩膜冷却管内的冷却液自所述输入端沿着所述掩膜冷却管流向所述输出端。
  5. 如权利要求4所述的显示面板蒸镀掩膜组件冷却系统，其中所述掩膜冷却管的所述输入端及所述输出端连接一循环泵浦以使所述冷却液在所述掩膜冷却管与所述循环泵浦之间循环流动。
  6. 如权利要求5所述的显示面板蒸镀掩膜组件冷却系统，其中所述循环泵浦上设置有二连接管以分别连接所述掩膜冷却管的所述输入端以及所述输出端，各所述连接管末端内缩形成套接段以插入所述输入端或所述输出端。
  7. 如权利要求3所述的显示面板蒸镀掩膜组件冷却系统，其中所述蒸镀掩膜板包括板体以及环绕设置在所述板体周围的边框；所述掩膜冷却管设置在所述边框内。
  8. 如权利要求7所述的显示面板蒸镀掩膜组件冷却系统，其中所述掩膜冷却管沿着所述边框形成至少一环绕所述板体的环圈。
  9. 如权利要求7所述的显示面板蒸镀掩膜组件冷却系统，其中所述板体上贯穿形成有多个蒸镀孔。
  10. 如权利要求7所述的显示面板蒸镀掩膜组件冷却系统，其中所述蒸镀掩膜板的边框为矩形而具有四侧边，所述掩膜冷却管的所述输入端及所述输出端位于所述边框的其中一侧边。
  11. 如权利要求3所述的显示面板蒸镀掩膜组件冷却系统，其中所述下冷却管具有输入端以及输出端，所述下冷却管内的冷却液自所述输入端沿着所述下冷却管流向所述输出端；所述下冷却管的所述输入端及所述输出端连接一下泵浦以使所述冷却液在所述下冷却管与所述下泵浦之间循环流动。
  12. 如权利要求3所述的显示面板蒸镀掩膜组件冷却系统，其中所述上冷却管具有输入端以及输出端，所述上冷却管内的冷却液自所述输入端沿着所述上冷却管流向所述输出端；所述上冷却管的所述输入端及所述输出端连接一上泵浦以使所述冷却液在所述上冷却管与所述上泵浦之间循环流动。
  13. 一种用于显示面板的蒸镀掩膜板，包括：
    板体；
    边框，环绕设置在所述板体周围；以及
    掩膜冷却管，设置在所述边框内，所述掩膜冷却管内设置有冷却液以用于对所述蒸镀掩膜板进行冷却。
  14. 如权利要求13所述的用于显示面板的蒸镀掩膜板，其中所述掩膜冷却管具有输入端以及输出端，所述掩膜冷却管内的冷却液自所述输入端沿着所述掩膜冷却管流向所述输出端。
  15. 如权利要求14所述的用于显示面板的蒸镀掩膜板，其中所述掩膜冷却管的所述输入端及所述输出端连接一循环泵浦以使所述冷却液在所述掩膜冷却管与所述循环泵浦之间循环流动。
  16. 如权利要求15所述的用于显示面板的蒸镀掩膜板，其中所述循环泵浦上设置有二连接管以分别连接所述掩膜冷却管的所述输入端以及所述输出端，各所述连接管末端内缩形成套接段以插入所述输入端或所述输出端。
  17. 如权利要求13所述的用于显示面板的蒸镀掩膜板，其中所述掩膜板包括板体以及环绕设置在所述板体周围的边框；所述掩膜冷却管设置在所述边框内。
  18. 如权利要求13所述的用于显示面板的蒸镀掩膜板，其中所述掩膜冷却管沿着所述边框形成至少一环绕所述板体的环圈。
  19. 如权利要求13所述的用于显示面板的蒸镀掩膜板，其中所述板体上贯穿形成有多个蒸镀孔。
  20. 如权利要求13所述的用于显示面板的蒸镀掩膜板，其中所述掩膜板的边框为矩形而具有四侧边，所述掩膜冷却管的所述输入端及所述输出端位于所述边框的其中一侧边。
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CN109402560A (zh) * 2018-11-27 2019-03-01 武汉华星光电半导体显示技术有限公司 显示面板蒸镀掩膜组件冷却系统及蒸镀掩膜板

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