WO2020107567A1 - 电子元件及其线材 - Google Patents

电子元件及其线材 Download PDF

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Publication number
WO2020107567A1
WO2020107567A1 PCT/CN2018/122112 CN2018122112W WO2020107567A1 WO 2020107567 A1 WO2020107567 A1 WO 2020107567A1 CN 2018122112 W CN2018122112 W CN 2018122112W WO 2020107567 A1 WO2020107567 A1 WO 2020107567A1
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WO
WIPO (PCT)
Prior art keywords
wire
circuit board
overflow port
clamping
outer cover
Prior art date
Application number
PCT/CN2018/122112
Other languages
English (en)
French (fr)
Inventor
吴振凯
李忠洪
Original Assignee
深圳市大疆创新科技有限公司
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Publication of WO2020107567A1 publication Critical patent/WO2020107567A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/627—Snap or like fastening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances

Definitions

  • Embodiments of the present invention relate to the field of power electronics technology, and in particular, to an electronic component and its wire.
  • Such output wires are usually connectors that transmit the voltage, current, and signals of electrical products to the outside world.
  • the core wire of the wire is directly welded to the pad of the circuit board. If the wire is stressed, it can be set on the outside of the wire
  • the relief port (Strain Relief, SR for short) is fixed on the housing;
  • the second type press the end of the wire onto a plug male terminal, the female terminal of the soldering terminal on the circuit board, through the male and female terminal Plugging and unplugging realizes the connection between the wire and the circuit board, which is suitable for the environment where the wire often needs to be plugged and unplugged.
  • the above two wire and circuit board conduction methods have the following shortcomings: The first one: the welding point of the core wire and the circuit board pad cannot be stressed, and it is easy to break after being stressed, and when setting the SR, the SR part needs to be set Additional structural parts help to strengthen; the second type: when setting the terminal on the wire, it is necessary to press the metal terminal on the core wire first, and then put on the plastic terminal shell, the process is complicated, and the cost of the terminal is higher.
  • Embodiments of the present invention provide an electronic component and its wire to solve the above-mentioned or other potential problems in the prior art.
  • An aspect of an embodiment of the present invention provides a wire rod including: a main wire and an overflow port; the main wire includes an outer quilt and a plurality of core wires wrapped in the outer quilt, and ends of the core wire exceed the outer quilt
  • the end of the overflow sleeve is sheathed at the end of the outer quilt and forms an integrated structure with the outer quilt and the core wire;
  • the core wire includes the outer cover of the core wire and is wrapped around the core wire
  • the overflow port is provided with a clamping part for clamping the circuit board.
  • the clamping portion includes a clamping groove formed on the side of the clamping portion, and the clamping groove is used to clamp the circuit board from the side of the circuit board.
  • the card slot includes a first card slot and a second card slot that are connected together and have an angle with each other, and the first card slot and the second card slot are respectively used to receive the installation of the circuit board
  • the two adjacent side surfaces of the part, the mounting part is formed by recessing the circuit board inward.
  • the clamping portion includes a clamping claw, and the clamping claw is used to pass through a clamping hole opened on the circuit board to clamp the circuit board and the wire together.
  • the card hole is a through hole or a blind hole.
  • the overflow opening is formed with two oppositely disposed clamping parts, and the metal wire is located between the two clamping parts.
  • the overflow port includes a first end portion and a second end portion, the first end portion is smaller than the second end portion; the end of the outer quilt passes through the first end portion; The ends of the core wire pass through the second end and are arranged radially; the two holding portions are provided on opposite sides of the second end.
  • each accommodating groove is used to accommodate one core wire.
  • a side of the second end close to the circuit board is provided with an escape groove for avoiding components on the circuit board.
  • the plurality of metal wires extending out of the overflow port are arranged in an array.
  • a plurality of the metal wires protruding from the overflow port are linearly arranged at equal intervals.
  • Another aspect of an embodiment of the present invention provides an electronic component, including: a circuit board and the wire as described above, the overflow port of the wire is clipped to the circuit board, and the core wire of the wire is connected to the circuit Plate welding.
  • the end of the wire is provided with an overflow opening forming an integral structure with the outer cover of the wire and the core wire, thereby improving the structural strength of the core wire and avoiding the core wire from being pulled and bent It is broken by force, which further improves the bending performance of the wire and the reliability of the connection; in addition, by providing a clamping portion that is clamped with the circuit board at the overflow port, it is no longer necessary to use an additional wire support or fixing structure, thereby Simplify the overall structure of the wire, and can distribute the pulling force of the wire to the circuit board to further improve the ability of the wire to prevent breakage; Furthermore, the wire of the core wire extends from the overflow port and is soldered with the circuit board Connection, so the overflow port can also play a role in protecting the metal wire.
  • FIG. 1 is a schematic structural diagram of a wire and a circuit board provided by an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a wire provided in an embodiment of the present invention after being connected to a circuit board;
  • FIG. 3 is a schematic structural diagram of a main wire of a wire provided by an embodiment of the present invention.
  • FIG. 4 is a front view of the wire provided by the embodiment of the present invention after being connected to a circuit board;
  • Figure 5 is a perspective view of Figure 4.
  • FIG. 6 is a schematic structural view of the wire rod in FIG. 4 from another perspective.
  • FIG. 1 is a schematic structural view of a wire and a circuit board provided in this embodiment
  • FIG. 2 is a schematic structural view of a wire and a circuit board provided in this embodiment after connection
  • FIG. 3 is a schematic structural view of the main wire of the wire provided in this embodiment
  • 4 is a front view of the wire provided in this embodiment after being connected to the circuit board
  • FIG. 5 is a perspective view of FIG. 4.
  • this embodiment provides a wire 100 including: a main wire 10 and an overflow port 20; the main wire 10 includes an outer cover 11 and a plurality of core wires 12 wrapped in the outer cover 11, the core wires 12 The end of the outer cover 11 is exceeded; the overflow port 20 is sleeved on the end of the outer cover 11 and forms an integral structure with the outer cover 11 and the core wire 12; the core wire 12 includes the outer cover 121 of the core wire and the outer cover coated on the core wire The metal wire 122 in 121 extends from the overflow port 20 to cooperate with the welding hole 51 formed on the circuit board 500; the overflow port 20 is provided with a clamping portion 21 for clamping the circuit board 500.
  • the metal wire 122 of the core wire 12 is a conductor, such as copper wire, tinned copper wire, etc.;
  • the outer cover 121 of the core wire is an insulator, generally made of plastic such as polyethylene, polyvinyl chloride, etc., which is covered in metal Outside the wire 122 to insulate adjacent metal wires 122.
  • a plurality of core wires 12 are arranged inside the outer cover 11, similar to the core wire outer cover 121, and the outer cover 11 may also be an insulator made of plastic such as polyethylene, polyvinyl chloride, or the like.
  • the catching portion of the overflow port 20 can be designed into any structure that can be caught with the circuit board, for example, it can be a buckle, an elastic protrusion, or the like, or a structure that will be described in detail below.
  • the wire 100 When manufacturing the wire 100 provided in this embodiment, first, a part of the outer end of the main wire 10 needs to be removed by 11 to expose the core wire 12 in the outer cover 11; then, the core wire of the end of each core wire 12 is 121 Remove a part to expose the metal wire 122 inside; after that, place all the core wires 12 of the main wire 10 in the manufacturing mold to make a predetermined position to ensure the spacing and position between the core wires 12; Finally, by molding The wire 100 of the integral structure of the overflow port 20.
  • the prefabricated overflow port 20 may be sleeved on the end of the main wire 10, and then the overflow port 20 is integrated with the outer cover 11 and the core wire 12 by heat pressing.
  • the clamping portion 21 of the overflow port 20 is directly engaged with the circuit board 500.
  • the position of the metal wire 122 and the welding hole 51 on the circuit board 500 are matched.
  • the metal wire 122 and the welding hole 51 may be welded and fixed. Therefore, the operation is simple, and the welding spot of the metal wire 122 is effectively protected from being broken by force when the wire 100 is pulled and bent.
  • the wire 100 provided in this embodiment is provided with an overflow port 20 that forms an integral structure with the outer cover 11 of the wire 100 and the core wire 12 at the end of the wire 100, thereby improving the structural strength of the core wire 12 and avoiding the wire 100 from being damaged.
  • the core wire 12 is forced to break, thereby improving the bending performance of the wire 100 and the reliability of the connection; in addition, by providing the overflow portion 20 with a clamping portion 21 that is clamped with the circuit board 500, it can be no longer
  • the additional support or fixing structure of the wire 100 is used to simplify the overall structure of the wire 100, and the pulling force received by the wire 100 can be distributed to the circuit board 500 to further improve the ability of the wire 100 to prevent breakage; furthermore, the core wire 12
  • the metal wire 122 extends from the overflow port 20 and is connected to the welding hole 51 on the circuit board 500, so the overflow port 20 can also protect the metal wire 122.
  • the holding portion 21 includes a groove 211 formed on the side of the holding portion 21, and the groove 211 is used to hold the circuit board 500 from the side of the circuit board 500.
  • the circuit board 500 is a thin plate with a certain thickness. Understandably, the structure of the card slot 211 to sandwich the circuit board 500 from the side of the circuit board 500 is easy to implement.
  • the width of the card slot 211 is the same as the thickness of the circuit board 500, and the card slot 211 has a certain depth, so that the circuit board 500 is stuck in the card slot 211 to a certain depth to ensure that the card slot 211 and the circuit board 500 The reliability of the connection. It can be understood that the fixing position of the wire 100 and the circuit board 500 is not limited to the side of the circuit board 500 as long as the wire 100 can be fixed on the circuit board 500.
  • the card slot 211 includes a first card slot 211a and a second card slot 211b that are connected together and have an angle with each other.
  • the first card slot 211a and the second card slot 211b are respectively used
  • the mounting portion 52 is formed by recessing the circuit board 500 inward.
  • the card slot 211 can hold the circuit board 500 from both sides, thereby reducing the possibility of relative movement in multiple directions, and when the wire 100 and the circuit board 500 are assembled, the volume is relatively small.
  • the mounting portion 52 formed by the inward depression of the circuit board 500 has at least two adjacent sides.
  • the card slot 211 is provided with a first card slot 211a and a second card slot 211b, and the first card slot 211a and The second clamping grooves 211b are in contact with the two adjacent side surfaces, respectively.
  • the angle between the first slot 211a and the second slot 211b is the same as the angle between the two adjacent sides of the mounting portion 52 to ensure that the first slot 211a and the second slot 211b are installed
  • the part 52 is well matched to the snap connection. Compared with the method of providing only one card slot to be directly connected to the circuit board 500, in this embodiment, the first card slot 211a and the second card slot 211b are provided to be engaged with the mounting portion 52, which has better connection stability.
  • the overflow port 20 includes a top surface, two opposing bumps are provided on the top surface, and each of the bumps is opened toward the two sides of the circuit board There is the above-mentioned first locking groove 211a and second locking groove 211b, so that the holding portion 21 is formed.
  • the concave portion of the mounting portion 52 is formed with two opposite structures similar to the step surface.
  • the extending directions of the first locking groove 211a and the second locking groove 211b are respectively consistent with the extending directions of two adjacent side surfaces of the mounting portion 52, so that after the locking portion 21 and the mounting portion 52 are locked, the first locking groove 211a
  • the bottoms of the second locking grooves 211b are in contact with two adjacent side surfaces of the mounting portion 52, respectively.
  • the first clamping groove 211a and the second clamping groove 211b can be directly formed during the integral molding of the wire 100.
  • the holding portion 21 may also be formed in other ways, and its structure may also adopt any other suitable structure.
  • the holding portion 21 includes a claw (not shown in the figure), which is used to pass through a card hole (not shown in the figure) opened on the circuit board 500 to lock the circuit board 500 and the wire 100 Together. It is easy to understand that when there are multiple claws, the number of the claws and the hole can be one-to-one correspondence. When using, only need to pass the claw into the hole, the circuit board 500 and the overflow port 20 can be stuck Pick up.
  • the card hole is a through hole or a blind hole.
  • the function of the card hole is to cooperate with the claw to limit the position of the claw.
  • the structure of the claw and the claw can be matched to achieve a stable connection.
  • the clamping hole is a through hole, the length of the clamping claw is long, so as to pass through the clamping hole to achieve clamping; when the clamping hole is a blind hole, the clamping claw extends into the blind hole and can also be clamped with the blind hole.
  • the overflow port 20 may form two opposing holding portions 21, and the metal wire 122 is located between the two holding portions 21.
  • Providing two holding portions 21 can increase the holding force of the overflow port 20 and the circuit board 500, thereby improving the connection strength of the two, and the two holding portions 21 can also play a role in the metal wire 122 disposed therebetween To a certain degree of protection, to a certain extent, it prevents other surrounding components from colliding with the metal wire 122, thereby damaging the metal wire 122, and can also prevent short circuits or other circuit changes after the metal wire 122 contacts other conductive parts.
  • the overflow port 20 has a structure with a central receiving hole, so that the end of the main wire 10 passes through the overflow port 20.
  • the overflow port 20 includes a first end 201 and a second end 202.
  • the first end 201 is smaller than the second end 202; the outer end 11 is threaded on the first In the end portion 201; the end of the core wire 12 passes through the second end portion 202 and is arranged in a radial pattern; the two holding portions 21 are provided on opposite sides of the second end portion 202.
  • the first end 201 is connected to the main line 10, and the end of the main line 10 passes through the first end 201 and the second end 202.
  • the inner space of the second end 202 is larger, the outer cover 11 of the main wire 10 is kept intact in the first end 201, and the outer cover 11 of the main wire 10 is not exposed in the second end 202, and a plurality of core wires 12 are exposed, and the core
  • the wires 12 are dispersed from the bundled state in the second end portion 202 and are arranged radially, so that the plurality of core wires 12 can be arranged neatly and pre-positioned so as to be connected with the predetermined solder holes 51 on the circuit board 500.
  • a plurality of receiving grooves are provided inside the second end 202, and each receiving groove is used to receive one core wire 12.
  • the specific structure of the accommodating groove is not specifically limited in this embodiment, and the number of accommodating grooves is not less than the number of the core wires 12 to meet the limiting and fixing effects on the plurality of core wires 12.
  • the plurality of metal wires 122 protruding from the overflow port 20 are arranged in an array. Since the multiple wires 122 come from multiple different core wires, the data and signals transmitted by them are different, and the wires 122 contact each other to cause a short circuit. Therefore, it is necessary to set the multiple wires 122 to have certain distance.
  • the plurality of metal wires 122 arranged in an array are neat and orderly, which is convenient for connection with the circuit board 500.
  • a plurality of metal wires 122 protruding from the overflow port 20 are linearly arranged at equal intervals.
  • the multiple metal wires 122 are linearly arranged at equal intervals, which is beneficial to the production of the wire 100 and facilitates the assembly of the wire 100 and the circuit board 500.
  • a plurality of metal wires 122 are linearly arranged, and correspondingly, the solder holes 51 on the circuit board 500 only need to be linearly arranged, thereby facilitating their processing.
  • the soldering hole 51 is formed by further recessing inwardly on the side wall of the mounting portion 52 or opening a small hole with a certain size
  • the solder holes 51 are distributed at the edge of the circuit board 500 and are arranged linearly. Therefore, when the overflow port 20 is snapped onto the circuit board 500, the metal wire 122 can be translated into the welding hole 51 from the opening of the side wall of the welding hole 51, so as to reduce the difficulty of assembly.
  • this embodiment does not exclude that the welding holes 51 are formed in other ways or arranged in other shapes.
  • the second end portion 202 when a plurality of metal wires 122 are linearly arranged, the second end portion 202 can be made into a strip-shaped structure, the metal wires 122 are arranged in the length direction, and the length direction of the second end portion 202 In accordance with the length direction of the mounting portion 52 of the circuit board 500, after the overflow port 20 is snapped onto the circuit board 500, the second end 202 of the elongated structure can increase the second end 202 as a whole with the circuit board The gap between 500 makes the matching space between the wire 100 and the circuit board 500 smaller, thereby avoiding the components on the circuit board 500.
  • FIG. 6 is a schematic structural view of the wire rod in FIG. 4 from another perspective.
  • the side of the second end 202 near the circuit board 500 may be provided with an escape groove 22 for avoiding components on the circuit board 500. Since the overflow port 20 is clamped with the circuit board 500, when the volume of the overflow port 20 is too large, the overflow port 20 will occupy a larger space of the circuit board 500, and may even interfere with the components on the circuit board 500.
  • the provision of the escape groove 22 on the side of the second end 202 close to the circuit board 500 can increase the gap between the second end 202 and the circuit board 500 as a whole, so that the matching space between the wire 100 and the circuit board 500 is more Small, so as to avoid components on the circuit board 500.
  • the overflow port 20 is provided in a block structure, and one or opposite two above-mentioned protrusions are provided on the left side of the top surface thereof to form a first card slot 211 a and a second card ⁇ 211b.
  • the overflow port 20 of the block structure is formed with one, two, or more than two escape grooves 22 having openings on the top surface and the right side surface (the direction shown in FIG. 6 is prevailing) by slotting, thereby After the overflow port 20 is engaged with the circuit board 500, the electronic components on the bottom surface of the circuit board 500 can extend into the escape slot 22 from the top opening and the right side opening of the escape slot 22.
  • the specific shape of the avoidance groove 22 is not specifically limited in this embodiment, and it may be a rectangular groove or an arc-shaped groove, and the number may be set to one or more.
  • the escape groove 22 can be directly formed during the integral molding of the wire 100. It should be understood that this embodiment does not exclude that the escape groove 22 is formed in other ways, or that the escape groove 22 has other structural forms.
  • the core wire of the wire is generally directly welded to the pad of the circuit board, if the wire is stressed, it can be fixed on the case by an overflow opening on the outside of the wire, but due to the core wire and The soldering point of the circuit board pad cannot be stressed, and it is very easy to break after being stressed, and when the overflow port is provided, an additional structural part needs to be provided to assist the reinforcement.
  • the end of the wire is also press-fitted onto a plugged male terminal, the female terminal of the solder terminal on the circuit board, and the connection of the wire and the circuit board is realized by the insertion and removal of the male and female terminal, which is suitable for the wire
  • the environment of plugging and unplugging is often required, but when setting the terminal on the wire, it is necessary to press the metal terminal on the core wire first, and then put on the plastic terminal shell, the process is complicated, and the cost of the terminal is relatively high.
  • the main wire 10 is passed through the overflow port 20, and the overflow port 20 is clamped with the circuit board 500 through the clamping portion 21, and at the same time, the wire 122 extending out of the overflow port 20 It can be directly soldered to the circuit board 500, the clamping relationship is reliable, and it is also easy to install and disassemble. Therefore, the wire 100 provided in this embodiment combines the advantages of the overflow port structure and the terminal structure, and overcomes the shortcomings of the prior art.
  • the connection between the wire 100 and the circuit board 500 has a simple structure, is resistant to bending, and is acceptable. Wire drawing is not easy to break, and the process is simple and the cost is low.
  • This embodiment also provides an electronic component, including: a circuit board 500 and the wire 100 as described above, the overflow port 20 of the wire 100 is clipped to the circuit board 500, and the core wire 12 of the wire 100 is soldered to the circuit board 500.
  • the wire 100 includes: a main wire 10 and an overflow port 20; the main wire 10 includes an outer cover 11 and a plurality of core wires 12 coated in the outer cover 11, the end of the core wire 12 exceeds the end of the outer cover 11; 20 sets of overflow ports It is provided at the end of the outer cover 11 and forms an integral structure with the outer cover 11 and the core wire 12; the core wire 12 includes the core wire cover 121 and the metal wire 122 wrapped in the core wire cover 121, and the metal wire 122 extends and overflows
  • the opening 20 is for cooperating with the welding hole 51 formed on the circuit board 500; the overflow opening 20 is provided with a clamping portion 21 for clamping the circuit board 500.
  • the end of the wire 100 is provided with an overflow port 20 forming an integral structure with the outer cover 11 of the wire 100 and the core wire 12, thereby improving the structural strength of the core wire 12 and avoiding the wire 100 When pulled and bent, the core wire 12 is broken by force, thereby improving the bending performance and connection reliability of the wire 100;
  • the additional support or fixing structure of the wire 100 is used to simplify the overall structure of the wire 100, and the pulling force of the wire 100 can be distributed to the circuit board 500 to further improve the ability of the wire 100 to prevent breakage;
  • the metal wire 122 of 12 extends from the overflow port 20 and is connected to the welding hole 51 on the circuit board 500, so the overflow port 20 can also protect the metal wire 122.

Abstract

一种线材(100)，包括：主线(10)以及溢放口(20)；所述主线(10)包括外被(11)以及包覆在所述外被(11)内的若干芯线(12)，所述芯线(12)的末端超出所述外被(11)的末端；所述溢放口(20)套设在所述外被(11)的末端并与所述外被(11)以及所述芯线(12)形成一体结构；所述芯线(12)包括芯线外被(121)以及包覆在所述芯线外被(121)内的金属丝(122)，所述金属丝(122)伸出所述溢放口(20)，以便与电路板(500)上开设的焊接孔(51)配合；所述溢放口(20)上设有用于卡接所述电路板(500)的卡持部(21)。通过将溢放口(20)与外被(11)和芯线(12)形成一体结构，可以避免芯线(12)在拉拔弯折时断裂，从而提高了线材(100)抗弯折的能力。实施例还提供一种电子元件。

Description

电子元件及其线材 技术领域
本发明实施例涉及电力电子技术领域，尤其涉及一种电子元件及其线材。
背景技术
在电子行业中，经常需要将各种输出线材连接到电路板上，这种输出线材通常是将电器产品的电压、电流、信号等传输到外界的连接器。
现有技术中，线材与电路板导通固定方式有以下二种：第一种：将线材的芯线直接焊接在电路板焊盘上，如果线材有受力情况，可以在线材外被上设置溢放口(Strain Relief，简称SR)固定在外壳上；第二种：将线材端部压装在一个插接的公头端子上，电路板上焊接端子的母头，通过公母头端子的插拔实现线材与电路板的连接，适用于线材经常需要插拔的环境。
但是上述二种线材与电路板导通方式分别具有以下缺点：第一种：芯线与电路板焊盘的焊接点不能受力，受力后极容易断裂，且设置SR时，SR部分需要设置额外的结构件辅助加固；第二种：线材上设置端子时，需要先将金属端子压装在芯线上，再套上塑料端子外壳，工艺复杂，且端子的成本较高。
发明内容
本发明实施例提供一种电子元件及其线材，以解决现有技术存在的上述或者其他潜在问题。
本发明实施例一方面提供一种线材，包括：主线以及溢放口；所述主线包括外被以及包覆在所述外被内的若干芯线，所述芯线的末端超出所述外被的末端；所述溢放口套设在所述外被的末端并与所述外被以及所述芯线形成一体结构；所述芯线包括芯线外被以及包覆在所述芯线外被内的金 属丝，所述金属丝伸出所述溢放口，以便与电路板上开设的焊接孔配合；所述溢放口上设有用于卡接所述电路板的卡持部。
进一步地，所述卡持部包括形成于所述卡持部侧面的卡槽，所述卡槽用于从所述电路板的侧面夹持所述电路板。
进一步地，所述卡槽包括连接在一起且相互之间具有夹角的第一卡槽和第二卡槽，所述第一卡槽和第二卡槽分别用于容纳所述电路板的安装部的相邻的两个侧面，所述安装部为所述电路板向内凹陷而成。
进一步地，所述卡持部包括卡爪，所述卡爪用于穿过所述电路板上开设的卡孔以将所述电路板和所述线材卡接在一起。
进一步地，所述卡孔为通孔或者盲孔。
进一步地，所述溢放口形成有相对设置的两个所述卡持部，所述金属丝位于两个所述卡持部之间。
进一步地，所述溢放口包括第一端部和第二端部，所述第一端部小于所述第二端部；所述外被的末端穿设在所述第一端部内；所述芯线的末端穿设在所述第二端部内并呈放射状排列；两个所述卡持部设置在所述第二端部相对的两侧。
进一步地，所述第二端部的内部设置有若干容纳槽，每个所述容纳槽用于容纳一根所述芯线。
进一步地，所述第二端部靠近所述电路板的一侧设有避让槽，用于避让所述电路板上的元器件。
进一步地，伸出所述溢放口的多个所述金属丝呈阵列式排布。
进一步地，伸出所述溢放口的多个所述金属丝等间距线性排列。
本发明实施例另一方面提供一种电子元件，包括：电路板以及如上所述的线材，所述线材的溢放口与所述电路板卡接，且所述线材的芯线与所述电路板焊接。
根据本发明实施例的技术方案，通过在线材的末端设置与线材的外被和芯线形成一体结构的溢放口，从而提高了芯线的结构强度，避免了线材 被拉扯弯折时芯线受力断裂，进而提高了线材的弯折性能和连接的可靠性；此外，通过在溢放口设置与电路板卡接的卡接部，可以不再使用额外的线材的支撑或者固定结构，从而简化线材的整体结构，并可以将线材受到的拉扯力分散到电路板，以进一步提高线材防断裂的能力；再者，芯线的金属丝从溢放口伸出并与电路板上的焊接孔连接，故溢放口还可以起到保护金属丝的作用。
本发明的附加方面的优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的线材与电路板的结构示意图；
图2为本发明实施例提供的线材与电路板连接后的结构示意图；
图3为本发明实施例提供的线材的主线的结构示意图；
图4为本发明实施例提供的线材与电路板连接后的主视图；
图5为图4的透视图；
图6为图4中的线材在另一视角的结构示意图。
附图标记：
100-线材
10-主线
11-外被
12-芯线
121-芯线外被
122-金属丝
20-溢放口
201-第一端部
202-第二端部
21-卡持部
211-卡槽
211a-第一卡槽
211b-第二卡槽
22-避让槽
500-电路板
51-焊接孔
52-安装部
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合本发明中的附图，对本发明中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，所使用的术语“中心”、“长度”、“宽度”、“厚度”、“顶端”、“底端”、“上”、“下”、“左”、“右”、“前”、“后”、“竖直”、“水平”、“内”、“外”“轴向”、“周向”等指示方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的位置或原件必须具有特定的方位、以特定的构造和操作，因此不能理解为对本发明的限制。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等应做广义理解，例如可以是固定连接，也可以是可拆卸连接，或成为一体；可以是直接相连，也可以通过中间媒介间接相连，可以使两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
图1为本实施例提供的线材与电路板的结构示意图，图2为本实施例提供的线材与电路板连接后的结构示意图，图3为本实施例提供的线材的 主线的结构示意图，图4为本实施例提供的线材与电路板连接后的主视图，图5为图4的透视图。
参考图1-图5所示，本实施例提供一种线材100，包括：主线10以及溢放口20；主线10包括外被11以及包覆在外被11内的若干芯线12，芯线12的末端超出外被11的末端；溢放口20套设在外被11的末端并与外被11以及芯线12形成一体结构；芯线12包括芯线外被121以及包覆在芯线外被121内的金属丝122，金属丝122伸出溢放口20，以便与电路板500上开设的焊接孔51配合；溢放口20上设有用于卡接电路板500的卡持部21。
具体的，芯线12的金属丝122为导体，例如铜线、镀锡铜线等；芯线外被121则为绝缘体，一般采用聚乙烯、聚氯乙烯等塑料制成，其包覆在金属丝122外，以使相邻的金属丝122之间绝缘。多条芯线12设置在外被11内，与芯线外被121类似，外被11同样可以是聚乙烯、聚氯乙烯等塑料制成的绝缘体。
溢放口20的卡持部可以设计成任意能够与电路板卡持的结构形式，例如可以是卡扣、弹性凸起等，或者也可以是下文将要详述的结构形式。
在制作本实施例提供的线材100时，首先需要将主线10末端的一部分外被11去除，以露出外被11内的芯线12；然后，将每根芯线12末端的芯线外被121去除掉一部分，以露出里面的金属丝122；之后，再将主线10的所有芯线12在制作模具中做好预定位，保证芯线12之间的间距及位置；最后，通过模塑形成具有溢放口20的一体结构的线材100。当然，在另一些示例中，也可以将预先制作好的溢放口20套在主线10的末端，然后通过热压合的方式使得溢放口20与外被11以及芯线12形成一体结构。
本实施例提供的线材100在使用时，直接将溢放口20的卡持部21与电路板500卡接，此时，金属丝122与电路板500上的焊接孔51的位置相配合，再将金属丝122与焊接孔51焊接固定即可。因此，操作简单，且有效保护了金属丝122的焊点在线材100拉扯弯折时不会受力断裂。
本实施例提供的线材100，通过在线材100的末端设置与线材100的外被11和芯线12形成一体结构的溢放口20，从而提高了芯线12的结构 强度，避免了线材100被拉扯弯折时芯线12受力断裂，进而提高了线材100的弯折性能和连接的可靠性；此外，通过在溢放口20设置与电路板500卡接的卡接部21，可以不再使用额外的线材100的支撑或者固定结构，从而简化线材100的整体结构，并可以将线材100受到的拉扯力分散到电路板500，以进一步提高线材100防断裂的能力；再者，芯线12的金属丝122从溢放口20伸出并与电路板500上的焊接孔51连接，故溢放口20还可以起到保护金属丝122的作用。
继续参考图1-图5，在一种可行的示例中，卡持部21包括形成于卡持部21侧面的卡槽211，卡槽211用于从电路板500的侧面夹持电路板500。一般地，电路板500为具有一定厚度的薄板，可以理解地，设置卡槽211从电路板500的侧面夹持电路板500，其结构是容易实现的。可选地，卡槽211的宽度与电路板500的厚度相同，且卡槽211具有一定的深度，使得电路板500卡设在卡槽211内一定的深度，以保证卡槽211与电路板500连接的可靠性。可以理解，线材100与电路板500的固定位置并不限于电路板500的侧面，只要能够在电路板500上固定线材100即可。
可选地，如图1所示，卡槽211包括连接在一起且相互之间具有夹角的第一卡槽211a和第二卡槽211b，第一卡槽211a和第二卡槽211b分别用于容纳电路板500的安装部52的相邻的两个侧面，安装部52为电路板500向内凹陷而成。基于上述，卡槽211可以从两个面卡持电路板500，从而能够在多个方向上降低相对移动的可能性，而且当线材100和电路板500装配之后，其体积也比较小。
具体而言，电路板500向内凹陷所形成的安装部52至少具有两个相邻的侧面，对应地，卡槽211设置第一卡槽211a和第二卡槽211b，第一卡槽211a和第二卡槽211b分别与这两个相邻的侧面抵接。第一卡槽211a和第二卡槽211b之间的夹角，与安装部52的相邻的两个侧面之间的夹角一致，以保证第一卡槽211a和第二卡槽211b与安装部52良好匹配卡接。相比于仅设置一个卡槽与电路板500直接卡接的方式，本实施例中，设置第一卡槽211a和第二卡槽211b与安装部52卡接，具有更好的连接稳固性。
如图1和图2所示，在一种示例中，溢放口20包括顶面，在顶面上 设置有相对的两个凸块，在每个凸块朝向电路板的两个侧面分别开设有上述第一卡槽211a和第二卡槽211b，从而形成卡持部21。相应的，为了配合第一卡槽211a和第二卡槽211b，安装部52的凹陷部形成有两个相对的类似于台阶面的结构。第一卡槽211a和第二卡槽211b的延伸方向分别与安装部52的两个相邻的侧面的延伸方向一致，以使得卡接部21和安装部52卡接后，第一卡槽211a和第二卡槽211b的槽底分别与安装部52的相邻的两个侧面抵接。通过在模具上设置对应结构，可在线材100一体成型的过程中直接形成第一卡槽211a和第二卡槽211b。当然，在其他一些示例中，卡持部21也可以通过其他方式形成，其结构也可以采用其他任意合适的结构。
又可选地，卡持部21包括卡爪(图中未示出)，卡爪用于穿过电路板500上开设的卡孔(图中未示出)以将电路板500和线材100卡接在一起。容易理解，当卡爪有多个时，卡爪和卡孔的数量可以一一对应，使用时，仅需将卡爪穿设到卡孔内，即可使电路板500和溢放口20卡接。
具体地，卡孔为通孔或者盲孔，卡孔的作用为与卡爪配合，限制卡爪的位置，制作时，使卡孔和卡爪的结构相匹配，可实现稳固连接即可。卡孔为通孔时，卡爪的长度较长，以穿过卡孔，实现卡接；卡孔为盲孔时，卡爪伸入盲孔内，也可实现与盲孔卡接。
继续参考图1和图2，溢放口20可以形成相对设置的两个卡持部21，金属丝122位于两个卡持部21之间。设置两个卡持部21，可以增加溢放口20与电路板500的卡持力，从而提高二者的连接强度，而且两个卡持部21也可以对设置在其间的金属丝122起到一定的保护作用，在一定程度上避免周围其他的部件与金属丝122发生磕碰，从而损坏金属丝122，也能避免金属丝122与其他导电件接触后发生短路或者其他电路变化。
基于以上描述可知，溢放口20为具有中心容纳孔的结构，以使得主线10的末端穿设在溢放口20内。
具体地，继续参考图4-图5，溢放口20包括第一端部201和第二端部202，第一端部201小于第二端部202；外被11的末端穿设在第一端部201内；芯线12的末端穿设在第二端部202内并呈放射状排列；两个卡持部21设置在第二端部202相对的两侧。
其中，第一端部201与主线10连接，且主线10的末端穿过第一端部201和第二端部202。第二端部202的内部空间较大，在第一端部201内主线10的外被11保持完整，在第二端部202内主线10无外被11，露出多条芯线12，且芯线12在第二端部202内从成束状态分散开，呈放射状排列，以使得多条芯线12可以排列整齐，做好预定位，以便与电路板500上预设的焊接孔51连接。放射状排列的多条芯线12，其末端伸出第二端部202一定长度，且伸出第二端部202的部分不具有芯线外被121，以露出金属丝122来与电路板500接触导通。
为了限制呈放射状排列的芯线12的位置，第二端部202的内部设置有若干容纳槽(图中未示出)，每个容纳槽用于容纳一根芯线12。容纳槽的具体结构在本实施例中不做具体限制，容纳槽的数量不小于芯线12的数量，以满足对多根芯线12的限位和固定作用。
如图1至图5所示，在一些可选地示例中，伸出溢放口20的多个金属丝122呈阵列式排布。由于多个金属丝122来自多个不同的芯线，其传输的数据和信号存在不同，且金属丝122互相接触会导致短路，因此，有必要将多个金属丝122设置为相互之间具有一定的距离。阵列式排布的多个金属丝122，整齐有序，方便与电路板500连接。
可选地，伸出溢放口20的多个金属丝122等间距线性排列。多个金属丝122等间距线性排列，有利于线材100的制作并方便线材100和电路板500的装配。如图1和图2所示，将多个金属丝122线性排列，对应地，电路板500上的焊接孔51也仅需线性设置，从而有利于其加工制作。
如图1和图2所示，电路板500向内凹陷形成安装部52后，通过在安装部52的侧壁上继续向内凹陷或者开设具有一定尺寸的小孔，形成焊接孔51，这多个焊接孔51分布在电路板500的边缘位置，呈线性排列。从而，当将溢放口20卡接到电路板500的时候，金属丝122可以从焊接孔51的侧壁开口处平移进入焊接孔51中，以降低装配难度。当然，本实施例也不排除焊接孔51通过其他方式成形，或者布置成其他形状。
在一种具体的示例中，当多个金属丝122线性排列时，第二端部202可制作为长条形的结构，金属丝122在长度方向上排列，且第二端部202的长度方向与电路板500的安装部52的长度方向一致，溢放口20卡接在 电路板500上后，长条形结构的第二端部202，可增大第二端部202整体上与电路板500之间的空隙，使线材100与电路板500的配合空间更小，从而避让电路板500上的元器件。
图6为图4中的线材在另一视角的结构示意图。参考图6所示，本实施例中，第二端部202靠近电路板500的一侧可以设有避让槽22，用于避让电路板500上的元器件。由于溢放口20和电路板500卡接，当溢放口20的体积过大时，溢放口20会占用电路板500较大的空间，甚至可能会干涉到电路板500上的元器件。设置位于第二端部202的靠近电路板500的一侧的避让槽22，可增大第二端部202整体上与电路板500之间的空隙，使线材100与电路板500的配合空间更小，从而避让电路板500上的元器件。
继续参考图6，在一些示例中，溢放口20设置成块状结构，其顶面的左侧设置一个或者相对设置两个上文中的凸块，以形成第一卡槽211a和第二卡槽211b。在块状结构的溢放口20通过开槽的方式形成有顶面和右侧面(图6中所示的方向为准)具有开口的一个、两个或者两个以上的避让槽22，从而当溢放口20与电路板500卡接后，电路板500底面的电子元件可以从避让槽22的顶部开口、右侧开口伸入到避让槽22内。避让槽22的具体形状在本实施例中不做具体限制，其可以是矩形槽、弧形槽，其数量可以设置为一个或多个。通过在模具上设置对应结构，可在线材100一体成型的过程中直接形成避让槽22。应当理解，本实施例也不排除避让槽22通过其他方式形成，或者避让槽22具有其他结构形式。
在现有技术中，由于一般会将线材的芯线直接焊接在电路板焊盘上，如果线材有受力情况，可以在线材外被上设置溢放口固定在外壳上，但是由于芯线与电路板焊盘的焊接点不能受力，受力后极容易断裂，且设置溢放口时，溢放口部分需要设置额外的结构件辅助加固。现有技术，还将线材端部压装在一个插接的公头端子上，电路板上焊接端子的母头，通过公母头端子的插拔实现线材与电路板的连接，其适用于线材经常需要插拔的环境，但是线材上设置端子时，需要先将金属端子压装在芯线上，再套上塑料端子外壳，工艺复杂，且端子的成本较高。
而根据上述实施例提供的线材100，其主线10穿设在溢放口20内， 溢放口20通过卡接部21与电路板500卡接，同时，伸出溢放口20的金属丝122可直接与电路板500焊接，卡接关系可靠，同时也便于安装和拆卸。因此，本实施例提供的线材100，结合了溢放口结构和端子结构的优点，且克服了现有技术的缺点，线材100与电路板500的连接处结构简单、耐弯折、可受理、线材拉拔不易断裂，且工艺简单，成本低。
本实施例还提供一种电子元件，包括：电路板500以及如上所述的线材100，线材100的溢放口20与电路板500卡接，且线材100的芯线12与电路板500焊接。
其中，线材100包括：主线10以及溢放口20；主线10包括外被11以及包覆在外被11内的若干芯线12，芯线12的末端超出外被11的末端；溢放口20套设在外被11的末端并与外被11以及芯线12形成一体结构；芯线12包括芯线外被121以及包覆在芯线外被121内的金属丝122，金属丝122伸出溢放口20，以便与电路板500上开设的焊接孔51配合；溢放口20上设有用于卡接电路板500的卡持部21。
本发明实施例提供的电子元件，通过在线材100的末端设置与线材100的外被11和芯线12形成一体结构的溢放口20，从而提高了芯线12的结构强度，避免了线材100被拉扯弯折时芯线12受力断裂，进而提高了线材100的弯折性能和连接的可靠性；此外，通过在溢放口20设置与电路板500卡接的卡接部21，可以不再使用额外的线材100的支撑或者固定结构，从而简化线材100的整体结构，并可以将线材100受到的拉扯力分散到电路板500，以进一步提高线材100防断裂的能力；再者，芯线12的金属丝122从溢放口20伸出并与电路板500上的焊接孔51连接，故溢放口20还可以起到保护金属丝122的作用。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (22)

  1. 一种线材，其特征在于，包括：主线以及溢放口；
    所述主线包括外被以及包覆在所述外被内的若干芯线，所述芯线的末端超出所述外被的末端；
    所述溢放口套设在所述外被的末端并与所述外被以及所述芯线形成一体结构；
    所述芯线包括芯线外被以及包覆在所述芯线外被内的金属丝，所述金属丝伸出所述溢放口，以便与电路板上开设的焊接孔配合；
    所述溢放口上设有用于卡接所述电路板的卡持部。
  2. 根据权利要求1所述的线材，其特征在于，所述卡持部包括形成于所述卡持部侧面的卡槽，所述卡槽用于从所述电路板的侧面夹持所述电路板。
  3. 根据权利要求2所述的线材，其特征在于，所述卡槽包括连接在一起且相互之间具有夹角的第一卡槽和第二卡槽，所述第一卡槽和第二卡槽分别用于容纳所述电路板的安装部的相邻的两个侧面，所述安装部为所述电路板向内凹陷而成。
  4. 根据权利要求1所述的线材，其特征在于，所述卡持部包括卡爪，所述卡爪用于穿过所述电路板上开设的卡孔以将所述电路板和所述线材卡接在一起。
  5. 根据权利要求4所述的线材，其特征在于，所述卡孔为通孔或者盲孔。
  6. 根据权利要求1-5任一项所述的线材，其特征在于，所述溢放口形成有相对设置的两个所述卡持部，所述金属丝位于两个所述卡持部之间。
  7. 根据权利要求6所述的线材，其特征在于，所述溢放口包括第一端部和第二端部，所述第一端部小于所述第二端部；所述外被的末端穿设在所述第一端部内；所述芯线的末端穿设在所述第二端部内并呈放射状排列；两个所述卡持部设置在所述第二端部相对的两侧。
  8. 根据权利要求7所述的线材，其特征在于，所述第二端部的内部设置有若干容纳槽，每个所述容纳槽用于容纳一根所述芯线。
  9. 根据权利要求7所述的线材，其特征在于，所述第二端部靠近所述电路板的一侧设有避让槽，用于避让所述电路板上的元器件。
  10. 根据权利要求1-5任一项所述的线材，其特征在于，伸出所述溢放口的多个所述金属丝呈阵列式排布。
  11. 根据权利要求10所述的线材，其特征在于，伸出所述溢放口的多个所述金属丝等间距线性排列。
  12. 一种电子元件，其特征在于，包括：电路板以及线材，所述线材的溢放口与所述电路板卡接，且所述线材的芯线与所述电路板焊接；
    所述线材包括：主线以及溢放口；
    所述主线包括外被以及包覆在所述外被内的若干芯线，所述芯线的末端超出所述外被的末端；
    所述溢放口套设在所述外被的末端并与所述外被以及所述芯线形成一体结构；
    所述芯线包括芯线外被以及包覆在所述芯线外被内的金属丝，所述金属丝伸出所述溢放口，以便与电路板上开设的焊接孔配合；
    所述溢放口上设有用于卡接所述电路板的卡持部。
  13. 根据权利要求12所述的电子元件，其特征在于，所述卡持部包括形成于所述卡持部侧面的卡槽，所述卡槽用于从所述电路板的侧面夹持所述电路板。
  14. 根据权利要求13所述的电子元件，其特征在于，所述卡槽包括连接在一起且相互之间具有夹角的第一卡槽和第二卡槽，所述第一卡槽和第二卡槽分别用于容纳所述电路板的安装部的相邻的两个侧面，所述安装部为所述电路板向内凹陷而成。
  15. 根据权利要求12所述的电子元件，其特征在于，所述卡持部包括卡爪，所述卡爪用于穿过所述电路板上开设的卡孔以将所述电路板和所 述线材卡接在一起。
  16. 根据权利要求15所述的电子元件，其特征在于，所述卡孔为通孔或者盲孔。
  17. 根据权利要求12-16任一项所述的电子元件，其特征在于，所述溢放口形成有相对设置的两个所述卡持部，所述金属丝位于两个所述卡持部之间。
  18. 根据权利要求17所述的电子元件，其特征在于，所述溢放口包括第一端部和第二端部，所述第一端部小于所述第二端部；所述外被的末端穿设在所述第一端部内；所述芯线的末端穿设在所述第二端部内并呈放射状排列；两个所述卡持部设置在所述第二端部相对的两侧。
  19. 根据权利要求18所述的电子元件，其特征在于，所述第二端部的内部设置有若干容纳槽，每个所述容纳槽用于容纳一根所述芯线。
  20. 根据权利要求18所述的电子元件，其特征在于，所述第二端部靠近所述电路板的一侧设有避让槽，用于避让所述电路板上的元器件。
  21. 根据权利要求12-16任一项所述的电子元件，其特征在于，伸出所述溢放口的多个所述金属丝呈阵列式排布。
  22. 根据权利要求21所述的电子元件，其特征在于，伸出所述溢放口的多个所述金属丝等间距线性排列。
PCT/CN2018/122112 2018-11-28 2018-12-19 电子元件及其线材 WO2020107567A1 (zh)

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Citations (4)

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JP2001060780A (ja) * 1999-08-20 2001-03-06 Sumitomo Wiring Syst Ltd フラットケーブルの接続方法及び位置決め構造
CN204538382U (zh) * 2015-04-16 2015-08-05 万旭电业股份有限公司 线材固定结构
CN206349596U (zh) * 2016-11-28 2017-07-21 协讯电子（吉安）有限公司 线缆连接器组件
CN108023186A (zh) * 2017-12-04 2018-05-11 深圳市威通电子有限公司 数据线及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001060780A (ja) * 1999-08-20 2001-03-06 Sumitomo Wiring Syst Ltd フラットケーブルの接続方法及び位置決め構造
CN204538382U (zh) * 2015-04-16 2015-08-05 万旭电业股份有限公司 线材固定结构
CN206349596U (zh) * 2016-11-28 2017-07-21 协讯电子（吉安）有限公司 线缆连接器组件
CN108023186A (zh) * 2017-12-04 2018-05-11 深圳市威通电子有限公司 数据线及其制造方法

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