WO2020103127A1 - Server - Google Patents

Server

Info

Publication number
WO2020103127A1
WO2020103127A1 PCT/CN2018/117180 CN2018117180W WO2020103127A1 WO 2020103127 A1 WO2020103127 A1 WO 2020103127A1 CN 2018117180 W CN2018117180 W CN 2018117180W WO 2020103127 A1 WO2020103127 A1 WO 2020103127A1
Authority
WO
WIPO (PCT)
Prior art keywords
arithmetic
arithmetic circuit
chip
chassis
server
Prior art date
Application number
PCT/CN2018/117180
Other languages
French (fr)
Chinese (zh)
Inventor
乔德浩
彭浩
董迪
Original Assignee
北京比特大陆科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京比特大陆科技有限公司 filed Critical 北京比特大陆科技有限公司
Priority to PCT/CN2018/117180 priority Critical patent/WO2020103127A1/en
Publication of WO2020103127A1 publication Critical patent/WO2020103127A1/en

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements

Abstract

A server, the server comprising: a machine case (100), operating chips (200) and an operating circuit baseboard (300); the operating circuit baseboard (300) is arranged in the machine case (100); M connecting parts (310) are provided on the operating circuit baseboard (300); there are N operating chips (200), and each operating chip (200) may be detachably connected onto one connecting part (310), M being a natural number greater than one, N being a natural number greater than or equal to one, and M being greater than or equal to N. Thus, a user may configure the number of operating chips (200) in the operating circuit baseboard (300) according to the magnitude of necessary data processing functions, thereby adjusting the data processing functions of the server without needing to buy a new server. The production cost is reduced, and when a certain operating circuit baseboard (300) or certain operating chip (200) fails, said component may be directly inserted or extracted and repaired without affecting the normal functioning of the other chips.

Description

服务器server 技术领域Technical field
本公开涉及数据处理技术领域,尤其涉及一种服务器。The present disclosure relates to the field of data processing technology, and particularly to a server.
背景技术Background technique
服务器作为常用的数据处理装置,广泛地应用于工业生产中。并且针对不同的应用领域,所需的服务器的数据处理能力也不同,例如生产规模较小时对服务器的数据处理能力的要求不大,而针对大规模的生产、大批量数据处理和运算时,则需要服务器的数据处理能力较高。As a commonly used data processing device, the server is widely used in industrial production. And for different application areas, the required data processing capacity of the server is also different. For example, when the production scale is small, the data processing capacity of the server is not required, and for large-scale production, large-scale data processing and calculation, The data processing capability of the server is high.
针对上述情况,生产厂商通常会生产多种型号的服务器供客户选择,每种服务器中可以设置有不同数量的运算芯片,运算芯片数量越多,服务器的数据处理能力越强。In response to the above situation, manufacturers usually produce multiple types of servers for customers to choose from. Each server can be equipped with a different number of computing chips. The more computing chips, the stronger the server's data processing capability.
但是,当由于生产规模的扩大而导致当前的服务器无法适应目前所需的数据处理能力时,则需要重新购置新的数据处理能力更强的服务器,造成生产成本的增加。However, when the current server cannot adapt to the currently required data processing capacity due to the expansion of production scale, it is necessary to repurchase a new server with stronger data processing capacity, resulting in an increase in production costs.
上述背景技术内容仅用于帮助理解本申请,而并不代表承认或认可所提及的任何内容属于相对于本申请的公知常识的一部分。The above background content is only used to help understand this application, and does not mean that any content mentioned is recognized or recognized as part of the common general knowledge relative to this application.
发明内容Summary of the invention
本公开实施例提供一种服务器,以克服由于服务器的数据处理能力不足而导致生产成本增加的问题。An embodiment of the present disclosure provides a server to overcome the problem of increased production costs due to insufficient data processing capabilities of the server.
本公开实施例提供一种服务器,包括机箱、运算芯片以及与所述运算芯片通信连接的运算电路底板,所述运算电路底板设置在所述机箱内,所述运算电路底板上设置有M个连接部,所述运算芯片的数量为N个,每个所述运算芯片可拆卸地连接在一个所述连接部上,其中,M为大于1的自然数,N为大于等于1的自然数,且M大于等于N。An embodiment of the present disclosure provides a server including a chassis, an arithmetic chip, and an arithmetic circuit backplane communicatively connected to the arithmetic chip, the arithmetic circuit backplane is disposed in the chassis, and the arithmetic circuit backplane is provided with M connections The number of the arithmetic chips is N, and each of the arithmetic chips is detachably connected to one of the connection parts, where M is a natural number greater than 1, N is a natural number greater than or equal to 1, and M is greater than Is equal to N.
如上所述的服务器,其中,所述连接部包括设置在所述运算电路底板上的凸起,所述运算芯片上设置有用于与所述凸起相卡合的凹槽。In the server as described above, the connection part includes a protrusion provided on the bottom plate of the arithmetic circuit, and the arithmetic chip is provided with a groove for engaging with the protrusion.
如上所述的服务器,其中,以平行于所述运算电路底板的平面为横截面,所述凸起的横截面形状为长方形。In the server as described above, a plane parallel to the bottom plate of the arithmetic circuit is used as a cross-section, and the cross-sectional shape of the protrusion is rectangular.
如上所述的服务器,其中,所述连接部还包括设置在所述运算电路底板上的螺纹孔,所述运算芯片上设置有连接孔,螺钉穿设所述连接孔后与所述螺纹孔螺接。The server as described above, wherein the connection part further includes a screw hole provided on the bottom plate of the arithmetic circuit, the operation chip is provided with a connection hole, and the screw is threaded with the screw hole after passing through the connection hole Pick up.
如上所述的服务器,其中,所述运算电路底板上形成有安装柱,所述螺纹孔设置在所述安装柱中。In the server as described above, a mounting post is formed on the bottom plate of the arithmetic circuit, and the screw hole is provided in the mounting post.
如上所述的服务器,其中,每个所述连接部中所述螺纹孔的数量为多个,多个所述螺纹孔间隔设置在所述运算电路底板上。The server as described above, wherein the number of the screw holes in each of the connecting parts is plural, and the plurality of screw holes are arranged on the arithmetic circuit base plate at intervals.
如上所述的服务器,其中,所述运算电路底板的数量为多个,多个所述运算电路底板间隔设置在所述机箱内。In the server as described above, the number of the arithmetic circuit backplanes is plural, and a plurality of the arithmetic circuit backplanes are arranged in the chassis at intervals.
如上所述的服务器,其中,所述机箱包括:顶壁、与所述顶壁相对设置的底壁、以及连接在所述顶壁与所述底壁之间的侧壁,所述运算电路底板设置在所述底壁上。The server as described above, wherein the chassis includes: a top wall, a bottom wall disposed opposite to the top wall, and a side wall connected between the top wall and the bottom wall, and the arithmetic circuit backplane Set on the bottom wall.
如上所述的服务器,其中,所述运算电路底板上还设置有交换芯片,所述交换芯片分别与N个所述运算芯片通信连接,所述交换芯片用于选择执行数据处理任务的所述运算芯片。The server as described above, wherein a switching chip is further provided on the computing circuit backplane, and the switching chip is respectively communicatively connected to the N computing chips, and the switching chip is used to select the computing for performing data processing tasks chip.
如上所述的服务器,其中,所述机箱内还设置控制板,所述控制板与所述运算电路底板通信连接。In the server as described above, a control board is further provided in the chassis, and the control board is communicatively connected to the computing circuit backplane.
如上所述的服务器,其中,所述控制板具有第一插拔端口,所述运算电路底板具有插接在所述第一插拔端口上的第二插拔端口。The server as described above, wherein the control board has a first plug-in port, and the arithmetic circuit backplane has a second plug-in port plugged in the first plug-in port.
如上所述的服务器,其中,所述机箱内还设置路由板,所述路由板与所述运算电路底板以及所述控制板通信连接。In the server as described above, a routing board is further provided in the chassis, and the routing board is communicatively connected to the computing circuit backplane and the control board.
如上所述的服务器,其中,所述机箱内还设置有电源,所述电源用于为所述控制板、所述路由板、所述运算电路底板供电。In the server as described above, a power supply is also provided in the chassis, and the power supply is used to supply power to the control board, the routing board, and the arithmetic circuit backplane.
如上所述的服务器,其中,所述机箱内还设置有一个或多个风扇,所述风扇可插拔的安装在机箱内。In the server as described above, one or more fans are further provided in the chassis, and the fans are removably installed in the chassis.
本公开提供的服务器,通过设置机箱、运算芯片以及运算电路底板,运算电路底板设置在机箱内,运算电路底板上设置有M个连接部,运算芯片的数量为N个,每个运算芯片可拆卸连接在一个连接部上,其中,M为大于1 的自然数,N为大于等于1的自然数,且M大于等于N,使得用户可以根据所需数据处理能力的大小,来设置运算电路底板中运算芯片的数量,从而调整服务器的数据处理能力,无需重新购买服务器,节省生产成本,同时,当某个运算电路底板或某个运算芯片出现故障时,可直接进行插拔维修,而不影响其他的芯片的正常工作。The server provided by the present disclosure is provided with a chassis, an arithmetic chip, and an arithmetic circuit backplane. The arithmetic circuit backplane is provided in the chassis. The arithmetic circuit backplane is provided with M connection parts. The number of arithmetic chips is N. Each arithmetic chip is removable. Connected to a connection part, where M is a natural number greater than 1, N is a natural number greater than or equal to 1, and M is greater than or equal to N, so that the user can set the arithmetic chip in the arithmetic circuit backplane according to the required data processing capacity Quantity, thereby adjusting the data processing capacity of the server, eliminating the need to repurchase the server, saving production costs, and at the same time, when a certain arithmetic circuit backplane or a certain arithmetic chip fails, it can be directly plugged in and repaired without affecting other chips Works fine.
附图说明BRIEF DESCRIPTION
以下结合附图对本公开的具体实施方式进行详细说明,应当理解的是,此处所描述的具体实施方式仅用于说明和解释本公开,本公开不局限于下述的具体实施方式。The specific implementations of the present disclosure will be described in detail below in conjunction with the drawings. It should be understood that the specific implementations described here are only used to illustrate and explain the present disclosure, and the present disclosure is not limited to the specific implementations described below.
图1为本公开实施例服务器的整体结构示意图;FIG. 1 is a schematic diagram of the overall structure of a server according to an embodiment of the present disclosure;
图2为图1中运算芯片与运算电路底板的结构示意图;FIG. 2 is a schematic structural diagram of the arithmetic chip and the arithmetic circuit backplane in FIG. 1;
图3为图1中运算电路底板的结构示意图;3 is a schematic diagram of the structure of the bottom plate of the arithmetic circuit in FIG. 1;
图4为本公开实施例服务器的拓扑结构图。FIG. 4 is a topology diagram of a server according to an embodiment of the present disclosure.
附图标记说明:Description of reference signs:
100:机箱;100: chassis;
110:底壁;110: bottom wall;
120:顶壁;120: top wall;
130:侧壁;130: side wall;
200:运算芯片;200: arithmetic chip;
210:连接孔;210: connection hole;
300:运算电路底板;300: Operation circuit bottom plate;
310:连接部;310: connection part;
320:凸起;320: raised;
330:螺纹孔;330: threaded hole;
340:安装柱;340: Mounting column;
400:控制板;400: control board;
500:路由板;500: routing board;
600:电源;600: power supply;
700:风扇;700: fan;
800:交换芯片。800: exchange chip.
具体实施方式detailed description
为了能够更加详尽地了解本公开实施例的特点与技术内容,下面结合附图对本公开实施例的实现进行详细阐述,所附附图仅供参考说明之用,并非用来限定本公开实施例。在以下的技术描述中,为方便解释起见,通过多个细节以提供对所披露实施例的充分理解。然而,在没有这些细节的情况下,一个或多个实施例仍然可以实施。在其它情况下,为简化附图,熟知的结构和装置可以简化展示。In order to understand the features and technical contents of the embodiments of the present disclosure in more detail, the following describes the implementation of the embodiments of the present disclosure in detail with reference to the drawings. The accompanying drawings are for reference only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for convenience of explanation, various details are provided to provide a sufficient understanding of the disclosed embodiments. However, without these details, one or more embodiments can still be implemented. In other cases, to simplify the drawings, well-known structures and devices can be simplified.
图1为本公开实施例服务器的整体结构示意图;图2为图1中运算芯片与运算电路底板的结构示意图;图3为图1中运算电路底板的结构示意图;图4为本公开实施例服务器的拓扑结构图。1 is a schematic diagram of the overall structure of a server according to an embodiment of the present disclosure; FIG. 2 is a schematic diagram of the structure of an arithmetic chip and an arithmetic circuit backplane in FIG. 1; FIG. 3 is a schematic diagram of the structure of an arithmetic circuit backplane in FIG. Topological structure diagram.
请参考图1至图4,本实施例提供一种服务器,包括机箱100、运算芯片200以及与运算芯片200通信连接的运算电路底板300,运算电路底板300设置在机箱100内,运算电路底板300上设置有M个连接部310,运算芯片200的数量为N个,每个运算芯片200可拆卸地连接在一个连接部310上,其中,M为大于1的自然数,N为大于等于1的自然数,且M大于等于N。Please refer to FIGS. 1 to 4, this embodiment provides a server including a chassis 100, an arithmetic chip 200 and an arithmetic circuit backplane 300 communicatively connected to the arithmetic chip 200. The arithmetic circuit backplane 300 is disposed in the chassis 100 and the arithmetic circuit backplane 300 There are M connecting parts 310, the number of arithmetic chips 200 is N, and each arithmetic chip 200 is detachably connected to one connecting part 310, where M is a natural number greater than 1, and N is a natural number greater than or equal to 1. , And M is greater than or equal to N.
具体地,服务器可以用于对各种数据进行处理。服务器可以包括机箱100以及设置在机箱100内的运算芯片200以及运算电路底板300。Specifically, the server can be used to process various data. The server may include a chassis 100 and an arithmetic chip 200 and an arithmetic circuit backplane 300 disposed in the chassis 100.
机箱100的形状可以有多种,例如机箱100可以为长方体形、圆柱形多种结构,机箱100可以具有一个容纳腔,容纳腔的形状可以与机箱100的形状相同,也可以不同,优选地,机箱100可以为薄壁状结构,使得容纳腔的体积较大,从而容纳更多的运算电路底板300及运算芯片200。另外,机箱100还可以具有一个开口,从而方便安装运算电路底板300。The shape of the chassis 100 may be various. For example, the chassis 100 may have a rectangular parallelepiped shape or a cylindrical shape. The chassis 100 may have an accommodating cavity. The shape of the accommodating cavity may be the same as or different from the shape of the chassis 100. Preferably, The chassis 100 may have a thin-walled structure, so that the volume of the accommodating cavity is larger, thereby accommodating more arithmetic circuit base plates 300 and arithmetic chips 200. In addition, the chassis 100 may also have an opening, so as to facilitate the installation of the arithmetic circuit backplane 300.
机箱100的材质也可以有多种,例如其可以用现有技术中常见的材料(例如金属或塑料等)以常见的加工方式(例如,焊接或注塑等)加工而成。优选地,机箱100可以用铝合金材质焊接而成,从而提高机箱100的强度,并降低机箱100的重量。There may also be multiple materials for the chassis 100, for example, it may be processed by using common materials (such as metal or plastic, etc.) in common processing methods (such as welding or injection molding, etc.). Preferably, the chassis 100 may be welded with aluminum alloy material, thereby improving the strength of the chassis 100 and reducing the weight of the chassis 100.
运算芯片200可以作为执行数据处理的主要部件,其可以为现有技术中能够实现数据处理的芯片结构,包括能够实现数据处理功能的多种设备,例 如,ARM芯片、CPU芯片、GPU芯片、TPU芯片、人工智能(“Artificial Intelligence”,简称AI)芯片等的一种或多种,在此不做具体限定。运算芯片200的数量可以为N个,N可以为大于等于1的自然数,可以理解的是,运算芯片200的数量多少可以代表服务器的运算能力,运算芯片200的数量越多代表服务器同时可以处理的数据量越大,运算能力越高。The arithmetic chip 200 can be used as a main component for performing data processing, which can be a chip structure capable of realizing data processing in the prior art, including various devices capable of realizing data processing functions, for example, an ARM chip, a CPU chip, a GPU chip, a TPU One or more of chips, artificial intelligence ("Artificial Intelligence", AI for short) chips, etc., are not specifically limited here. The number of computing chips 200 can be N, and N can be a natural number greater than or equal to 1. It is understandable that the number of computing chips 200 can represent the computing power of the server, and the greater the number of computing chips 200, the more the server can process at the same time. The larger the amount of data, the higher the computing power.
运算电路底板300内可以设置有多种电路结构,从而实现运算芯片200与外部设备的通信。外部设备可以是控制器、路由器或者其他x86主机等设备,在此不做具体限定。运算电路底板300上可以设置有连接部310,每个运算芯片200都可以可拆卸安装在一个连接部310上。运算芯片200和连接部310的连接方式可以有多种,例如连接部310可以是设置在运算电路底板300上的通孔,运算芯片200上也可以设置有安装孔,螺钉可以穿过通孔与安装孔后与螺母配合。又或者,连接部310可以是设置在运算电路底板300上的卡槽,运算芯片200上可以设置有与卡槽卡合的卡钩。A variety of circuit structures may be provided in the arithmetic circuit backplane 300, so as to realize communication between the arithmetic chip 200 and external devices. The external device may be a device such as a controller, router, or other x86 host, which is not specifically limited here. The arithmetic circuit base 300 may be provided with a connection part 310, and each arithmetic chip 200 may be detachably mounted on one connection part 310. There may be various connection methods between the arithmetic chip 200 and the connection part 310, for example, the connection part 310 may be a through hole provided on the arithmetic circuit base plate 300, and the arithmetic chip 200 may also be provided with a mounting hole, and the screw may pass through the through hole and Fit the nut after installing the hole. Alternatively, the connecting portion 310 may be a card slot provided on the arithmetic circuit base 300, and the arithmetic chip 200 may be provided with a hook that engages with the card slot.
运算电路底板300与运算芯片200的通信连接方式也可以有多种,例如两者直接可以通过连接部310实现通信,又或者连接部310只用于实现安装功能,当连接部310与运算芯片200连接后,运算电路底板300上的通信接口(例如过孔等)可以与运算芯片200上的通信接口(例如引脚等)连接。There may also be multiple communication connection methods between the arithmetic circuit backplane 300 and the arithmetic chip 200, for example, the two can directly communicate through the connection part 310, or the connection part 310 is only used to implement the installation function. When the connection part 310 and the operation chip 200 After the connection, the communication interface (for example, vias, etc.) on the arithmetic circuit backplane 300 can be connected to the communication interface (for example, pins, etc.) on the arithmetic chip 200.
另外,运算电路底板300上的连接部310的数量可以为M,M可以为大于1的自然数,另外M大于等于N。例如,一块运算电路底板300上可以设置有6个连接部310,当服务器所需的数据处理能力较低时,可以只在其中2个连接部310上安装运算芯片200,即运算电路底板300上设置有2个运算芯片200。当服务器所需的数据处理能力较强时,可以在每个连接部310上都设置运算芯片200,即运算电路底板300上可以设置有6个运算芯片200,使得服务器的通用性更强。In addition, the number of the connection parts 310 on the arithmetic circuit board 300 may be M, M may be a natural number greater than 1, and M is greater than or equal to N. For example, a computing circuit backplane 300 may be provided with six connection parts 310. When the data processing capacity required by the server is low, the arithmetic chip 200 may be installed on only two of the connection parts 310, that is, the arithmetic circuit backplane 300 There are 2 arithmetic chips 200 provided. When the data processing capability required by the server is strong, an arithmetic chip 200 may be provided on each connection part 310, that is, six arithmetic chips 200 may be provided on the arithmetic circuit backplane 300, which makes the server more versatile.
因此,当服务器的数据处理能力不足时,可以将多个运算芯片200安装到连接部310上,提高运算芯片200的数量,进而提高运算能力,无需重新购置新的服务器,降低了生产成本。而当服务器的数据处理能力过大时,即无需利用所有的运算芯片200即可满足当前的运算需求,可以从服务器中拆卸下来几块运算芯片200,避免资源的浪费。Therefore, when the data processing capability of the server is insufficient, a plurality of arithmetic chips 200 can be installed on the connection part 310 to increase the number of arithmetic chips 200, thereby improving the arithmetic capability, without repurchasing a new server, and reducing the production cost. When the data processing capacity of the server is too large, that is, it is not necessary to use all the computing chips 200 to meet the current computing needs, several computing chips 200 can be removed from the server to avoid waste of resources.
另外,由于运算芯片200可拆卸连接在运算电路底板300上,使得服务 器的维护更加方便。例如,当服务器工作时,其中一块或几块运算芯片200出现故障时,可以直接将故障的运算芯片200从运算电路底板300上拆卸,然后更换新的运算芯片200,其他无故障的运算芯片200可以继续运行,无需将整个服务器断电来更换运算芯片200,更换方便且更换过程中还可以保证服务器高效运行。In addition, since the arithmetic chip 200 can be detachably connected to the arithmetic circuit backplane 300, the maintenance of the server is more convenient. For example, when the server is working and one or more of the arithmetic chips 200 fails, you can directly remove the malfunctioning arithmetic chip 200 from the arithmetic circuit backplane 300, and then replace the new arithmetic chip 200 with other malfunction-free arithmetic chips 200. It can continue to run without replacing the computing chip 200 by powering down the entire server. It is convenient to replace and can also ensure the efficient operation of the server during the replacement process.
本实施例提供的服务器,通过设置机箱、运算芯片以及运算电路底板,运算电路底板设置在机箱内,运算电路底板上设置有M个连接部,运算芯片的数量为N个,每个运算芯片可拆卸连接在一个连接部上,其中,M为大于1的自然数,N为大于等于1的自然数,且M大于等于N,使得用户可以根据所需数据处理能力的大小,来设置运算电路底板中运算芯片的数量,从而调整服务器的数据处理能力,无需重新购买服务器,节省生产成本,同时,当某个运算电路底板或某个运算芯片出现故障时,可直接进行插拔维修,而不影响其他的芯片的正常工作。The server provided in this embodiment is provided with a chassis, an arithmetic chip, and an arithmetic circuit backplane. The arithmetic circuit backplane is provided in the chassis. The arithmetic circuit backplane is provided with M connecting parts. The number of arithmetic chips is N. Each arithmetic chip can Disconnect and connect to a connection part, where M is a natural number greater than 1, N is a natural number greater than or equal to 1, and M is greater than or equal to N, so that the user can set the calculation in the calculation circuit baseboard according to the size of the required data processing capacity The number of chips, thereby adjusting the data processing capacity of the server, without the need to re-purchase the server, saving production costs, at the same time, when a certain arithmetic circuit backplane or a certain arithmetic chip fails, it can be directly plugged in and repaired without affecting other The chip works normally.
进一步地,作为连接部310的优选地实施方式,连接部310包括设置在运算电路底板300上的凸起320,运算芯片200上设置有用于与凸起320相卡合的凹槽。Further, as a preferred embodiment of the connection part 310, the connection part 310 includes a protrusion 320 provided on the arithmetic circuit base 300, and the operation chip 200 is provided with a groove for engaging with the protrusion 320.
具体地,凸起320的形状可以有多种,例如凸起320可以为圆柱状凸起,运算芯片200朝向运算电路底板300的底面可以设置有圆柱状凹槽,凹槽的尺寸可以和凸起320的尺寸相等,从而可以将运算芯片200卡合在连接部310上。另外,运算芯片200的形状可以为长方体形,凸起320的数量可以为多个,多个凸起320可以沿运算芯片200的边缘间隔设置,又或者凸起320可以沿运算芯片200的长度方向或宽度方向间隔设置,从而提高固定效果。Specifically, the shape of the protrusion 320 may be various, for example, the protrusion 320 may be a cylindrical protrusion, and the bottom surface of the arithmetic chip 200 facing the arithmetic circuit base plate 300 may be provided with a cylindrical groove, the size of the groove may be the same as that of the protrusion The sizes of 320 are equal, so that the arithmetic chip 200 can be snapped onto the connection part 310. In addition, the shape of the arithmetic chip 200 may be a rectangular parallelepiped, the number of the protrusions 320 may be multiple, the plurality of protrusions 320 may be arranged at intervals along the edge of the operation chip 200, or the protrusions 320 may be along the length direction of the operation chip 200 Or set at intervals in the width direction to improve the fixing effect.
进一步,以平行于运算电路底板300的平面为横截面,凸起320的横截面形状为长方形,即凸起320可以为长条状,凸起320的数量可以为1个,长条状的长度可以与运算芯片200的长度或宽度相等,从而提高运算芯片200与运算电路底板300的连接强度。Further, taking the plane parallel to the arithmetic circuit base plate 300 as a cross-section, the cross-sectional shape of the protrusion 320 is a rectangle, that is, the protrusion 320 may be elongated, the number of protrusions 320 may be one, and the length of the elongated shape The length or width of the arithmetic chip 200 may be equal, so as to improve the connection strength of the arithmetic chip 200 and the arithmetic circuit backplane 300.
另外,连接部310除了设置有凸起320外,其还可以包括设置在运算电路底板300上的螺纹孔330,运算芯片200上设置有连接孔210,螺钉穿设连接孔210后与螺纹孔330螺接。In addition, in addition to the protrusion 320, the connecting portion 310 may include a screw hole 330 provided on the arithmetic circuit base 300, a connection hole 210 is provided on the arithmetic chip 200, and the screw hole 330 is threaded with the screw hole 330 Screwed.
具体地,运算电路底板300可以具有一定的厚度,螺纹孔330可以是直 接形成在运算电路底板300上的,通过螺纹孔330螺接运算芯片200可以进一步提高运算芯片200的固定强度,避免运算芯片200因服务器晃动等原因而从运算电路底板300上脱离。Specifically, the arithmetic circuit backplane 300 may have a certain thickness, and the screw holes 330 may be directly formed on the arithmetic circuit backplane 300. The screwing of the arithmetic chip 200 through the threaded holes 330 may further improve the fixing strength of the arithmetic chip 200 and avoid the arithmetic chip 200 is detached from the arithmetic circuit board 300 due to server shaking and other reasons.
作为螺纹孔330的另一种设置方式,运算电路底板300上形成有安装柱340,螺纹孔330设置在安装柱340中,通过设置安装柱340可以降低运算电路底板300的厚度,从而减小服务器的体积。As another arrangement method of the screw hole 330, the mounting post 340 is formed on the arithmetic circuit base plate 300, and the threaded hole 330 is provided in the mounting post 340. By installing the mounting post 340, the thickness of the arithmetic circuit base plate 300 can be reduced, thereby reducing the server volume of.
同时,每个连接部310中螺纹孔330的数量可以为多个,多个螺纹孔330间隔设置在运算电路底板300上,从而进一步提高运算芯片200的固定程度。优选地,每个运算芯片200可以设置有四个连接孔210,4个连接孔210分别设置在运算芯片200的四个角上,每个连接孔210对应一个螺纹孔330。另外,其中两个连接孔210对应的螺纹孔330可以位于凸起320的两端,从而进一步提高固定效果。At the same time, the number of the screw holes 330 in each connection part 310 may be multiple, and the plurality of screw holes 330 are spaced on the arithmetic circuit board 300 to further improve the fixing degree of the arithmetic chip 200. Preferably, each operation chip 200 may be provided with four connection holes 210, and the four connection holes 210 are respectively provided on the four corners of the operation chip 200, and each connection hole 210 corresponds to one screw hole 330. In addition, the screw holes 330 corresponding to the two connection holes 210 may be located at both ends of the protrusion 320, thereby further improving the fixing effect.
在上述实施例的基础上,运算电路底板300的数量为多个,多个运算电路底板300间隔设置在机箱100内,从而可以进一步提高服务器的运算能力。多个运算电路底板300也可以可插拔地连接在机箱100上,并可以根据需要拆卸或安装,且拆卸过程中不需要关机,可以不影响服务器的正常运行。Based on the above embodiment, the number of the arithmetic circuit backplane 300 is multiple, and the plurality of arithmetic circuit backplanes 300 are arranged in the chassis 100 at intervals, so that the computing capability of the server can be further improved. A plurality of arithmetic circuit backplanes 300 can also be pluggably connected to the chassis 100, and can be disassembled or installed as required, and the shutdown is not required during the disassembly process, which may not affect the normal operation of the server.
作为机箱100的一种实现方式,机箱100包括:顶壁120、与顶壁120相对设置的底壁110、以及连接在顶壁120与底壁110之间的侧壁130,运算电路底板300设置在底壁110上。顶壁120、底壁110可以为平面板状结构,侧壁130可以为环形结构,底壁110、顶壁120和侧壁130可以共同围成容纳腔。侧壁130上还可以形成有用于安装运算电路底板300的开口。运算电路底板300可以通过螺接、焊接或卡接等多种方式安装在底壁110上,结构简单,容易实现。As an implementation manner of the chassis 100, the chassis 100 includes: a top wall 120, a bottom wall 110 opposite to the top wall 120, and a side wall 130 connected between the top wall 120 and the bottom wall 110, and the arithmetic circuit bottom plate 300 is provided On the bottom wall 110. The top wall 120 and the bottom wall 110 may be a planar plate-like structure, the side wall 130 may be an annular structure, and the bottom wall 110, the top wall 120, and the side wall 130 may jointly enclose a receiving cavity. The side wall 130 may also be formed with an opening for mounting the arithmetic circuit base plate 300. The arithmetic circuit bottom plate 300 can be installed on the bottom wall 110 by screwing, welding or clamping, etc., and has a simple structure and is easy to implement.
另外,在上述实施例的基础上,运算电路底板300上还设置有交换芯片800,所述交换芯片800分别与N个所述运算芯片200通信连接,所述交换芯片800用于选择执行数据处理任务的所述运算芯片200。In addition, on the basis of the above-mentioned embodiment, a switching chip 800 is further provided on the arithmetic circuit backplane 300, and the switching chip 800 is respectively communicatively connected to the N arithmetic chips 200, and the switching chip 800 is used to selectively perform data processing The task of the arithmetic chip 200.
具体地,交换芯片800可以为分别与N个运算芯片200连接的多个开关电路,通过选择开关电路的闭合或打开状态可以选择执行当前任务的运算芯片200,从而可以根据当前的需求选择需要执行数据处理任务的一块或多块运算芯片200,避免资源的浪费。Specifically, the switching chip 800 may be a plurality of switch circuits respectively connected to the N operation chips 200, and the operation chip 200 that performs the current task can be selected by selecting the closed or open state of the switch circuit, so that it can be selected according to the current demand. One or more arithmetic chips 200 for data processing tasks to avoid waste of resources.
进一步,机箱100内还设置控制板400,控制板400与运算电路底板300通信连接。Further, a control board 400 is also provided in the chassis 100, and the control board 400 is communicatively connected to the arithmetic circuit backplane 300.
具体地,控制板400可以是现有技术中能够实现控制功能的结构,其可以通过I 2C总线与运算电路底板300通信,从而实现控制板400与运算芯片200通信。控制板400可以通过SPI总线对运算电路底板300上的交换芯片800实施通信,从而可以根据当前的需求选择需要执行数据处理任务的一块或多块运算芯片200。通过设置控制板400使得服务器可以独立执行数据处理任务,无需外接控制器,提高了服务器的集成化程度。 Specifically, the control board 400 may be a structure capable of realizing a control function in the prior art, and it may communicate with the arithmetic circuit backplane 300 through an I 2 C bus, so that the control board 400 and the arithmetic chip 200 communicate. The control board 400 can communicate with the switching chip 800 on the arithmetic circuit backplane 300 through the SPI bus, so that one or more arithmetic chips 200 that need to perform data processing tasks can be selected according to current needs. By setting the control board 400, the server can independently perform data processing tasks without an external controller, which improves the degree of integration of the server.
另外,控制板400还可以读取和控制运算芯片200的各种运行状态,例如运算芯片200的电源或温度状态等。In addition, the control board 400 can also read and control various operating states of the arithmetic chip 200, such as the power supply or temperature state of the arithmetic chip 200.
控制板400与运算电路底板300的连接方式也可以有多种,例如通过导线连接,优选地,控制板400具有第一插拔端口,运算电路底板300具有插接在第一插拔端口上的第二插拔端口。即控制板400和运算电路底板300可以通过可插拔的方式连接,组装更加方便,且当控制板400出现故障时,维护更换也更加方便。There may also be various connection methods between the control board 400 and the arithmetic circuit backplane 300, for example, through a wire connection. Preferably, the control board 400 has a first plug-in port, and the arithmetic circuit backplane 300 has a plug-in port on the first plug-in port The second plug port. That is, the control board 400 and the arithmetic circuit backplane 300 can be connected in a pluggable manner, which is more convenient for assembly, and when the control board 400 fails, maintenance and replacement are also more convenient.
进一步地,机箱100内还设置路由板500,路由板500与运算电路底板300以及控制板400通信连接。Further, a routing board 500 is also provided in the chassis 100, and the routing board 500 is communicatively connected to the arithmetic circuit backplane 300 and the control board 400.
具体地,路由板500可以是现有技术中能够实现网络通信的交换机等结构,其可以实现运算电路底板300与外部设备的数据传输及交换。Specifically, the routing board 500 may be a switch or other structure capable of implementing network communication in the prior art, which may implement data transmission and exchange between the arithmetic circuit backplane 300 and external devices.
当有数据由路由板500的用于连接外部设备的千兆网口访问运算芯片200时,数据经路由板500转发通过路由板500与运算电路底板300之间的网线连接到运算电路底板300的交换芯片800,运算电路底板300上的交换芯片800根据数据报文转发到相应的运算芯片200上,此数据流为全双工的。When data is accessed by the Gigabit Ethernet port of the routing board 500 for connecting external devices, the data is forwarded via the routing board 500 and connected to the computing circuit board 300 through the network cable between the routing board 500 and the computing circuit board 300 Switching chip 800, the switching chip 800 on the operation circuit backplane 300 is forwarded to the corresponding operation chip 200 according to the data message, the data flow is full-duplex.
当有数据由控制板400访问运算芯片200时,数据经控制板400与路由板500之间的网线传输到路由板500,经过路由板500的转发后,由路由板500与运算电路底板300之间的网线发送到运算电路底板300的交换芯片800,运算电路底板300的交换芯片800根据报文内容转发到相应的运算芯片200。When data is accessed by the control board 400 from the arithmetic board 200, the data is transmitted to the routing board 500 via the network cable between the control board 400 and the routing board 500, and after being forwarded by the routing board 500, the routing board 500 and the arithmetic circuit backplane 300 The inter-network cable is sent to the switching chip 800 of the arithmetic circuit backplane 300, and the switching chip 800 of the arithmetic circuit backplane 300 is forwarded to the corresponding arithmetic chip 200 according to the content of the message.
当有外部数据由控制板400访问运算芯片200时,数据经控制板400处理后,经连接控制板400与路由板500的网线传输到路由板500,经过路由 板500的转发后,由路由板500与运算电路底板300之间的网线发送到运算电路底板300的交换芯片800上,运算电路底板300的交换芯片800根据报文内容转发到相应的运算芯片200。When external data is accessed by the control board 400 to the computing chip 200, the data is processed by the control board 400, then transmitted to the routing board 500 via the network cable connecting the control board 400 and the routing board 500, and then forwarded by the routing board 500. The network cable between 500 and the arithmetic circuit backplane 300 is sent to the switching chip 800 of the arithmetic circuit backplane 300, and the switching chip 800 of the arithmetic circuit backplane 300 is forwarded to the corresponding arithmetic chip 200 according to the content of the message.
另外,路由板500与运算电路底板300以及控制板400通信连接的连接方式也可以有多种,例如路由板500与运算电路底板300及控制板400之间都可以通过导线连接,优选地,路由板500可以通过插接端口可插拔地与运算电路底板300及控制板400连接,组装及维护更加方便,具体可以参见控制板400与运算电路底板300的连接方式。In addition, the routing board 500 can be connected to the arithmetic circuit backplane 300 and the control board 400 in various ways. For example, the routing board 500 and the arithmetic circuit backplane 300 and the control board 400 can be connected by wires. Preferably, the routing board The board 500 can be pluggably connected to the arithmetic circuit backplane 300 and the control board 400 through a plug port, which is more convenient for assembly and maintenance. For details, refer to the connection method of the control board 400 and the arithmetic circuit backplane 300.
更进一步地,机箱100内还设置有电源600,电源600用于为控制板400、路由板500、运算电路底板300供电。电源600可以为现有技术中能够实现供电功能的结构,通过将电源600设置在机箱100内可以提高服务器的集成度。控制板400还可以与电源600通信连接,控制板400可以通过PMBUS控制电源600的上下电,从而实现远程控制。Furthermore, a power supply 600 is also provided in the chassis 100, and the power supply 600 is used to supply power to the control board 400, the routing board 500, and the arithmetic circuit backplane 300. The power supply 600 may be a structure capable of realizing a power supply function in the prior art. By disposing the power supply 600 in the chassis 100, the integration of the server can be improved. The control board 400 can also be communicatively connected to the power supply 600, and the control board 400 can control the power supply and power-off of the power supply 600 through PMBUS, thereby achieving remote control.
另外,电源600与控制板400、路由板500、运算电路底板300之间的电连接也可以通过可插拔地方式进行,组装及维护更加方便,具体可以参见控制板400与运算电路底板300的连接方式。In addition, the electrical connection between the power supply 600 and the control board 400, the routing board 500, and the arithmetic circuit backplane 300 can also be done in a pluggable manner, which is more convenient for assembly and maintenance. For details, please refer to the control board 400 and the arithmetic circuit backplane 300. Connection method.
在上述实施例的基础上,机箱100内还设置有一个或多个风扇700,风扇700可插拔的安装在机箱100内。风扇700的数量可以为多个,由于服务器运行过程中会产生大量的热量,风扇700可以降低控制板400、路由板500、运算电路底板300的温度,保证服务器的正常运行。风扇700可以通过可插拔的方式安装在机箱100内,可以根据需要自由插拔,且插拔过程不会影响服务器正常工作。Based on the above embodiment, one or more fans 700 are also provided in the chassis 100, and the fans 700 are pluggable and installed in the chassis 100. The number of the fan 700 may be multiple. Since a large amount of heat is generated during the operation of the server, the fan 700 may reduce the temperature of the control board 400, the routing board 500, and the calculation circuit backplane 300 to ensure the normal operation of the server. The fan 700 can be installed in the chassis 100 in a pluggable manner, and can be freely plugged and unplugged as needed, and the plugging and unplugging process will not affect the normal operation of the server.
控制板400可以根据监测到的运算芯片200的温度控制风扇700的转速,达到节能的目的。The control board 400 can control the rotation speed of the fan 700 according to the monitored temperature of the arithmetic chip 200 to achieve the purpose of energy saving.
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Rear "," Left "," Right "," Vertical "," Horizontal "," Top "," Bottom "," Inner "," Outer "," Clockwise "," Counterclockwise "," Axial " , "Radial", "circumferential" and other indications are based on the orientation or positional relationship shown in the drawings, only to facilitate the description of this application and simplify the description, not to indicate or imply that the device or The element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application.
在本申请中,除非另有明确的规定和限定,术语"安装"、"相连"、"连接"、"固定"等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接或彼此可通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In this application, unless otherwise clearly specified and defined, the terms "installation", "connected", "connection", "fixed" and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , Or integrated; it can be mechanical connection, electrical connection or communication with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the connection between two components or the interaction between two components, Unless otherwise clearly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
在以上描述中,参考术语"一个实施例"、"一些实施例"、"示例"、"具体示例"、或"一些示例"等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the above description, reference to the descriptions of the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means specific features and structures described in conjunction with the embodiments or examples , Materials or features are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, without contradicting each other, those skilled in the art may combine and combine different embodiments or examples and features of the different embodiments or examples described in this specification.
本申请中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的,除非上下文清楚地表明,否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地,如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外,当用于本申请中时,术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素,和/或组件的存在,但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。The terms used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "said" are intended to include plural forms as well . Similarly, the term "and / or" as used in this application is meant to include any and all possible combinations of one or more associated lists. In addition, when used in this application, the term "comprise" and its variations "comprises" and / or includes etc. refer to the stated features, wholes, steps, operations, elements, and / or The presence of components does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups of these.
上述技术描述可参照附图,这些附图形成了本申请的一部分,并且通过描述在附图中示出了依照所描述的实施例的实施方式。虽然这些实施例描述的足够详细以使本领域技术人员能够实现这些实施例,但这些实施例是非限制性的;这样就可以使用其它的实施例,并且在不脱离所描述的实施例的范围的情况下还可以做出变化。所有这些变化被认为包含在所公开的实施例以及权利要求中。The above technical description may refer to the accompanying drawings, which form a part of the present application, and the description shows an implementation according to the described embodiments in the drawings. Although these embodiments are described in sufficient detail to enable those skilled in the art to implement these embodiments, these embodiments are non-limiting; so that other embodiments can be used without departing from the scope of the described embodiments Changes can also be made under circumstances. All these changes are considered to be included in the disclosed embodiments and claims.
另外,上述技术描述中使用术语以提供所描述的实施例的透彻理解。然 而,并不需要过于详细的细节以实现所描述的实施例。因此,实施例的上述描述是为了阐释和描述而呈现的。上述描述中所呈现的实施例以及根据这些实施例所公开的例子是单独提供的,以添加上下文并有助于理解所描述的实施例。上述说明书不用于做到无遗漏或将所描述的实施例限制到本公开的精确形式。根据上述教导,若干修改、选择适用以及变化是可行的。在某些情况下,没有详细描述为人所熟知的处理步骤以避免不必要地影响所描述的实施例。In addition, terminology is used in the above technical description to provide a thorough understanding of the described embodiments. However, no excessively detailed details are required to implement the described embodiments. Therefore, the above description of the embodiments is presented for explanation and description. The embodiments presented in the above description and the examples disclosed according to these embodiments are provided separately to add context and help to understand the described embodiments. The above description is not intended to be without omission or to limit the described embodiments to the precise form of this disclosure. Based on the above teachings, several modifications, choices and changes are possible. In some cases, well-known processing steps are not described in detail to avoid unnecessarily affecting the described embodiments.

Claims (14)

  1. 一种服务器,其特征在于,包括机箱、运算芯片以及与所述运算芯片通信连接的运算电路底板,所述运算电路底板设置在所述机箱内,所述运算电路底板上设置有M个连接部,所述运算芯片的数量为N个,每个所述运算芯片可拆卸地连接在一个所述连接部上,其中,M为大于1的自然数,N为大于等于1的自然数,且M大于等于N。A server, characterized by comprising a chassis, an arithmetic chip and an arithmetic circuit backplane communicatively connected to the arithmetic chip, the arithmetic circuit backplane is arranged in the chassis, and the arithmetic circuit backplane is provided with M connecting parts , The number of the arithmetic chips is N, and each of the arithmetic chips is detachably connected to one of the connection parts, where M is a natural number greater than 1, N is a natural number greater than or equal to 1, and M is greater than or equal to N.
  2. 根据权利要求1所述的服务器,其特征在于,所述连接部包括设置在所述运算电路底板上的凸起,所述运算芯片上设置有用于与所述凸起相卡合的凹槽。The server according to claim 1, wherein the connection portion includes a protrusion provided on the bottom plate of the arithmetic circuit, and the arithmetic chip is provided with a groove for engaging with the protrusion.
  3. 根据权利要求2所述的服务器,其特征在于,以平行于所述运算电路底板的平面为横截面,所述凸起的横截面形状为长方形。The server according to claim 2, wherein the plane parallel to the bottom plate of the arithmetic circuit is a cross section, and the cross-sectional shape of the protrusion is rectangular.
  4. 根据权利要求3所述的服务器,其特征在于,所述连接部还包括设置在所述运算电路底板上的螺纹孔,所述运算芯片上设置有连接孔,螺钉穿设所述连接孔后与所述螺纹孔螺接。The server according to claim 3, wherein the connection portion further includes a screw hole provided on the bottom plate of the arithmetic circuit, the arithmetic chip is provided with a connection hole, and the screw penetrates the connection hole The threaded holes are screwed together.
  5. 根据权利要求4所述的服务器,其特征在于,所述运算电路底板上形成有安装柱,所述螺纹孔设置在所述安装柱中。The server according to claim 4, wherein a mounting post is formed on the bottom plate of the arithmetic circuit, and the screw hole is provided in the mounting post.
  6. 根据权利要求5所述的服务器,其特征在于,每个所述连接部中所述螺纹孔的数量为多个,多个所述螺纹孔间隔设置在所述运算电路底板上。The server according to claim 5, wherein the number of the screw holes in each of the connection parts is plural, and the plurality of screw holes are arranged on the bottom of the arithmetic circuit at intervals.
  7. 根据权利要求1-6任一项所述的服务器,其特征在于,所述运算电路底板的数量为多个,多个所述运算电路底板间隔设置在所述机箱内。The server according to any one of claims 1 to 6, wherein the number of the arithmetic circuit backplanes is plural, and a plurality of the arithmetic circuit backplanes are arranged in the chassis at intervals.
  8. 根据权利要求1-6任一项所述的服务器,其特征在于,所述机箱包括:顶壁、与所述顶壁相对设置的底壁、以及连接在所述顶壁与所述底壁之间的侧壁,所述运算电路底板设置在所述底壁上。The server according to any one of claims 1 to 6, wherein the chassis includes a top wall, a bottom wall disposed opposite to the top wall, and a connection between the top wall and the bottom wall Between the side walls, the arithmetic circuit bottom plate is disposed on the bottom wall.
  9. 根据权利要求1-6任一项所述的服务器,其特征在于,所述运算电路底板上还设置有交换芯片,所述交换芯片分别与N个所述运算芯片通信连接,所述交换芯片用于选择执行数据处理任务的所述运算芯片。The server according to any one of claims 1-6, wherein a switching chip is further provided on the bottom plate of the arithmetic circuit, and the switching chip is respectively communicatively connected to the N arithmetic chips, and the switching chip is used It is used to select the operation chip for performing data processing tasks.
  10. 根据权利要求9所述的服务器,其特征在于,所述机箱内还设置控制板,所述控制板与所述运算电路底板通信连接。The server according to claim 9, wherein a control board is further provided in the chassis, and the control board is communicatively connected to the computing circuit backplane.
  11. 根据权利要求10所述的服务器,其特征在于,所述控制板具有第一插拔端口,所述运算电路底板具有插接在所述第一插拔端口上的第二插拔端 口。The server according to claim 10, wherein the control board has a first plug-in port, and the arithmetic circuit backplane has a second plug-in port plugged into the first plug-in port.
  12. 根据权利要求10所述的服务器,其特征在于,所述机箱内还设置路由板,所述路由板与所述运算电路底板以及所述控制板通信连接。The server according to claim 10, wherein a routing board is further provided in the chassis, and the routing board is communicatively connected to the arithmetic circuit backplane and the control board.
  13. 根据权利要求12所述的服务器,其特征在于,所述机箱内还设置有电源,所述电源用于为所述控制板、所述路由板、所述运算电路底板供电。The server according to claim 12, wherein a power supply is further provided in the chassis, and the power supply is used to supply power to the control board, the routing board, and the arithmetic circuit backplane.
  14. 根据权利要求1-6任一项所述的服务器,其特征在于,所述机箱内还设置有一个或多个风扇,所述风扇可插拔的安装在机箱内。The server according to any one of claims 1-6, wherein one or more fans are further provided in the chassis, and the fans are removably installed in the chassis.
PCT/CN2018/117180 2018-11-23 2018-11-23 Server WO2020103127A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/117180 WO2020103127A1 (en) 2018-11-23 2018-11-23 Server

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/117180 WO2020103127A1 (en) 2018-11-23 2018-11-23 Server

Publications (1)

Publication Number Publication Date
WO2020103127A1 true WO2020103127A1 (en) 2020-05-28

Family

ID=70773458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/117180 WO2020103127A1 (en) 2018-11-23 2018-11-23 Server

Country Status (1)

Country Link
WO (1) WO2020103127A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110138095A1 (en) * 2009-12-08 2011-06-09 International Business Machines Corporation Providing expansion card settings
CN104820473A (en) * 2015-05-13 2015-08-05 曙光云计算技术有限公司 Rack server substrate and rack server substrate group
CN205608616U (en) * 2016-02-19 2016-09-28 深圳海云海量信息技术有限公司 Plug -in storage server
CN207301915U (en) * 2017-09-18 2018-05-01 北京中航永嘉电子科技有限公司 A kind of dual processors rack-mount server

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110138095A1 (en) * 2009-12-08 2011-06-09 International Business Machines Corporation Providing expansion card settings
CN104820473A (en) * 2015-05-13 2015-08-05 曙光云计算技术有限公司 Rack server substrate and rack server substrate group
CN205608616U (en) * 2016-02-19 2016-09-28 深圳海云海量信息技术有限公司 Plug -in storage server
CN207301915U (en) * 2017-09-18 2018-05-01 北京中航永嘉电子科技有限公司 A kind of dual processors rack-mount server

Similar Documents

Publication Publication Date Title
CN102129274B (en) Server, server subassembly and fan speed control method
CN1920746B (en) Method and apparatus for enforcing of power control in a blade center chassis
CN103092138B (en) Control method of equipment cabinet system
US20070274039A1 (en) Embedded computer chassis with redundant fan trays
TWI403884B (en) Rack server system
US8370656B2 (en) Power and data hub
US20090304199A1 (en) Multiple Fan Acoustic Interaction Control
CN105868077A (en) Method for obtaining monitoring information of complete cabinet server nodes
JP2012243304A (en) Server chassis
WO2020037864A1 (en) Integrated board card, display module, and display device
CN102480389A (en) Frame server system
CN113220085A (en) Server
WO2019105015A1 (en) Mvb gateway device
WO2020103127A1 (en) Server
JP6197195B2 (en) Apparatus, program, and method
CN209124591U (en) A kind of server automatic dust removing apparatus
CN113015417B (en) Novel liquid cooling modularization frame power
CN209149208U (en) Server
CN111475004B (en) Server heat dissipation control method
WO2017050221A1 (en) Smart circuit breaker controller
CN208369944U (en) It is a kind of for video-splicing, double back board structures of matrix
CN102478936A (en) Server framework
CN207010559U (en) A kind of highpowerpulse load current transformer power model mounting structure
US20200375067A1 (en) Cooling surface mount for rack servers allowing modular resource configuration
CN216218335U (en) Heat dissipation box of small-size PCB board

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18940618

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 09.09.2021)

122 Ep: pct application non-entry in european phase

Ref document number: 18940618

Country of ref document: EP

Kind code of ref document: A1