WO2020099531A1 - Circuit arrangement for a high-frequency antenna, method for forming a circuit arrangement, substrate carrier and use of a circuit arrangement - Google Patents

Circuit arrangement for a high-frequency antenna, method for forming a circuit arrangement, substrate carrier and use of a circuit arrangement Download PDF

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Publication number
WO2020099531A1
WO2020099531A1 PCT/EP2019/081263 EP2019081263W WO2020099531A1 WO 2020099531 A1 WO2020099531 A1 WO 2020099531A1 EP 2019081263 W EP2019081263 W EP 2019081263W WO 2020099531 A1 WO2020099531 A1 WO 2020099531A1
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WO
WIPO (PCT)
Prior art keywords
substrate
circuit arrangement
antenna
circuit
carrier
Prior art date
Application number
PCT/EP2019/081263
Other languages
German (de)
French (fr)
Inventor
Andreas Kugler
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2020099531A1 publication Critical patent/WO2020099531A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
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    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Definitions

  • the invention relates to a circuit arrangement for a high-frequency antenna.
  • the invention further relates to a method for forming a
  • a circuit arrangement for a high-frequency antenna with the features of the preamble of claim 1 is known from DE 197 10 811 B4.
  • the known circuit arrangement has a metallic base plate on which an existing of dielectric material in the form of a quartz
  • Substrate element is arranged. On the side of the substrate element facing away from the base plate, an electronic component is connected to the upper side thereof, next to which antenna elements are likewise arranged on the surface of the substrate element.
  • the top of the base plate is covered in the area of the electronic component and the antenna elements by means of a cover made of dielectric material.
  • the cover represents an encapsulation which protects the substrate element or the components located on the substrate element, for example, against oxidation.
  • a disadvantage of such encapsulation is that assembly and, for example, evacuation or flooding of the interior of the
  • circuit arrangement according to the invention for a high-frequency antenna with the features of claim 1 has the advantage that it is in
  • Molded mass is encapsulated.
  • Such molding compounds have the particular advantage that they can be processed relatively easily in terms of process technology and enable reliable protection of the electronic component against external factors influencing the functionality of the component. It also allows the use of a
  • Molding compound, substrates with components arranged thereon can be produced in a particularly simple manner from a substrate carrier having a multiplicity of components, the substrate elements being separated or separated from the substrate carrier after the (full-surface) encapsulation of the components on the upper side of the latter.
  • a molding compound to protect the at least one electronic component in a particularly advantageous manner enables such circuit arrangements to be used
  • Circuit arrangements of this type can moreover be connected particularly easily to a larger electronic circuit or a circuit carrier in order to be part of an electronic assembly or the like.
  • the substrate element is made of glass or ceramic.
  • Circuit arrangement that it is additionally at least indirectly electrically connected to a circuit carrier.
  • a circuit carrier can For example, an electronic assembly or part of a control unit that serves as part of a driver assistance system for distance warning or the like in a vehicle.
  • Antenna elements are advantageous if the at least one antenna element is arranged on the substrate element on the side facing away from the circuit carrier, so that the circuit carrier does not provide any shielding for the
  • the at least one electronic component on the side opposite the at least one antenna element on the substrate element i.e. is arranged on the side facing the circuit carrier.
  • plated-through holes or electrically conductive coatings can be provided on the substrate.
  • the at least one electronic component is connected to the substrate element with the interposition of at least one HF prepreg element.
  • This HF prepreg element is typically a metallic one
  • Coating which is arranged on the side of the HF prepreg element facing away from the electronic component and is in turn electrically contacted with the substrate, is connected to the at least one antenna element.
  • a prepreg element has the advantage that one or more additional rewiring layers can be inserted on the substrate element, which enables a complex HF IC to be connected, for example as a flip chip element.
  • a prepreg element can be understood to mean a pre-impregnated fiber element. This includes, for example, textile fiber matrix pre-impregnated with reactive resins. Semi-finished products that are cured under temperature and pressure to produce components.
  • the substrate element or the HF prepreg element is connected via solder connections is connected to the circuit carrier, and that the substrate element in the area of the soldered connections is made free of molding compounds in order to make the contacting as simple and reliable as possible. This enables a direct connection between the circuit carrier and the substrate element.
  • Antenna element are arranged on the same side on the substrate element.
  • Such a design makes it possible, in particular, to simplify the electrical connection between the at least one antenna element and the at least one electronic component, or else to make the production more efficient. Furthermore, this reduces the overall height of the circuit arrangement, which can be advantageous in particular in connection with a circuit arrangement connected to the circuit carrier, since the distance between the circuit carrier and the substrate element is then relatively small, which reduces the formation of the electrical connection or
  • Receiving properties of the at least one antenna element is made possible, provides that the at least one antenna element is covered with molding compound, and that on the molding compound on the side facing away from the substrate element at least one beam shaping element, preferably in Form of a metallic layer, for which at least one antenna element is arranged.
  • Such a design also has the particular advantage that the transmission or
  • Reception properties of the at least one antenna element cannot be influenced or can only be influenced to a small extent or even improved.
  • At least the area in which the at least one antenna element is arranged on the substrate element is designed free of molding compound. This enables optimal transmission and reception properties without additional beam shaping elements.
  • the invention also relates to a method for forming a
  • Circuit arrangement which is preferably designed in the manner described above.
  • the method according to the invention comprises at least the following steps: First, a large number of
  • Antenna elements are formed on the surface of a substrate carrier that can be separated into individual substrate elements. This is followed by an at least indirect arrangement of a multiplicity of identically designed electronic components on the substrate carrier and electrical contact of the components with the antenna elements. The side of the substrate carrier on which the electronic components are located is then overmolded. Finally, the substrate elements are separated from the substrate carrier. The last-mentioned separation of the substrate elements from the substrate carrier is usually carried out by means of sawing techniques, as are known from the prior art.
  • Antenna elements are further provided that the area of the antenna elements is formed before the separation of the substrate elements by freeing or protecting without molding compound, or that on the molding compound in the area of the antenna elements covered by molding compound
  • Beam shaping elements for the antenna elements are arranged.
  • the invention also comprises a substrate carrier with a multiplicity of circuit arrangements produced in the manner described above.
  • a preferred use of circuit arrangements according to the invention is to use them as part of a driver assistance system in one
  • Fig. 4 shows in simplified longitudinal sections with a
  • Fig. 5 shows a substrate carrier which is used to form
  • substrate elements serve in plan view and
  • Fig. 6 shows a flow chart for explaining the essential
  • 1 is a first circuit arrangement 10 for forming a
  • High-frequency antenna 1 shown with a circuit carrier 12, for example in the form of an electronic circuit (not shown)
  • solder connections 16 in the form of so-called solder bumps are in the area of metallizations 18 or lands on the top of the
  • Circuit carrier 12 arranged and connect the circuit arrangement 10 with the aforementioned electronic circuit of the circuit carrier 12.
  • Circuit carrier 12 or the circuit arrangement 10 are, for example, part of a control device, not shown in detail, which as
  • Driver assistance system in a vehicle is used, for example, for distance measurement.
  • the circuit arrangement 10 comprises a substrate element 20 having glass material in the exemplary embodiment, on the upper side of which, facing away from the circuit carrier 12, at least one (RF) antenna element 22 in the form of a metallic line structure is formed by coating or printing.
  • the at least one antenna element 22 is electrically contacted on the side of the substrate element 20 facing away from the at least one antenna element 22 with a metallic coating 24 (which forms an electrical mass).
  • the coating 24 is in turn connected to an HF prepreg element 26, which consists for example of a PCB or a laminate, such as Tachyon.
  • At least one electronic component 30 in the form of an IC or the like is on the side of the HF prepreg element 26 facing away from the coating 24. arranged and electrically connected to the at least one antenna element 22 by means of connections 32.
  • the electronic component 30 is surrounded or protected at least in its immediate area on its upper side and the side surfaces by a molding compound 34.
  • a molding compound 34 To the side of the molding compound 34 are the
  • Soldered connections 16 are arranged, which form the electrical connection between the circuit carrier 12 and the HF prepreg element 26, for which purpose the HF prepreg element 26 has correspondingly designed, not shown metallic coatings or the like.
  • the circuit arrangement 10a shown in FIG. 2 differs from the circuit arrangement 10 according to FIG. 1 in that the
  • Circuit arrangement 10a has neither a metallic coating 24 nor an HF prepreg element 26. Rather, the electronic component 30 is electrically conductively connected directly to the substrate element 20.
  • Component 30 and the at least one antenna element 22 are Component 30 and the at least one antenna element 22
  • both the at least one antenna element 22 and the at least one electronic component 30 are arranged on the upper side of the substrate element 20 facing away from the circuit carrier 12 in the circuit arrangement 10b according to FIG. 3.
  • the at least one antenna element 22 is located laterally next to the electronic component 30, the electronic component 30 being electrically conductively connected to the antenna element 22 or the substrate element 20 via electrical connections 36. It is also provided that the entire top or the entire area of the
  • Substrate element 20 is covered by the molding compound 34.
  • beam shaping elements 38 are provided on the molding compound 34 in operative connection with the antenna element 22, which are designed, for example, in the form of a metallic coating or the like.
  • FIG. 4 shows an exemplary embodiment modified compared to FIG. 3 with a circuit arrangement 10c.
  • the circuit arrangement 10c differs from the circuit arrangement 10b according to FIG. 3 in that the area around the antenna element 22 is freed from molding compound 34 by no molding compound 34 being applied there. Thus, only the area of the electronic component 30 on the substrate element 20 is surrounded by molding compound 34. Due to the fact that the antenna element 22 is not surrounded by molding compound 34, it is possible to use the one shown in FIG. 3
  • Beam shaping elements 38 are dispensed with.
  • FIG. 5 shows a section of a substrate carrier 50 which is used to manufacture a large number of circuit arrangements 10a to 10c on rectangular substrate elements 20.
  • the substrate elements 20 and Circuit arrangements 10a to 10c are after their formation
  • FIG. 6 This shows that initially in a first production step 101 a large number of antenna elements 22 on the
  • a manufacturing step 103 areas in which no molding compound 34 is to be applied may be cut out or protected. This is followed in a step 104
  • the exempted areas are the areas in which at least one electrical connection to the circuit carrier 12 or the arrangement of the antenna elements 22 has been made.
  • substrate elements 20 are separated from the substrate carrier 50.
  • the beam shaping elements 38 can be arranged before the substrate elements 20 are separated.
  • the substrate elements 20 are electrically connected to a respective circuit carrier 12 in accordance with the arrangements shown in FIGS. 1 to 4.

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Abstract

The invention relates to a circuit arrangement (10; 10a to 10c) for a high-frequency antenna (1), comprising a substrate element (20) on which a metal line structure, which forms at least one antenna element (22), is arranged, wherein the substrate element (20) serves as a carrier for at least one electronic component (30) which is arranged in a manner operatively connected to the at least one antenna element (22), and wherein at least the at least one electronic component (30) is enclosed in a hermetically sealed manner by an encapsulation.

Description

Schaltunqsanordnunq für eine Hochfrequenzantenne, Verfahren zur Ausbildung einer Schaltunqsanordnunq, Substratträqer und Verwendung einer  Schaltunqsanordnunq for a radio frequency antenna, method for forming a Schaltunqsanordnunq, substrate carrier and use of
Schaltunqsanordnunq  Circuit arrangement
Technisches Gebiet Technical field
Die Erfindung betrifft eine Schaltungsanordnung für eine Hochfrequenzantenne. Weiterhin betrifft die Erfindung ein Verfahren zur Ausbildung einer The invention relates to a circuit arrangement for a high-frequency antenna. The invention further relates to a method for forming a
Schaltungsanordnung, einen Substratträger mit einer Vielzahl von Circuit arrangement, a substrate carrier with a variety of
Schaltungsanordnungen sowie die Verwendung einer erfindungsgemäß ausgebildeten Schaltungsanordnung. Circuit arrangements and the use of a circuit arrangement designed according to the invention.
Stand der Technik State of the art
Eine Schaltungsanordnung für eine Hochfrequenzantenne mit den Merkmalen des Oberbegriffs des Anspruchs 1 ist aus der DE 197 10 811 B4 bekannt. Die bekannte Schaltungsanordnung weist eine metallische Grundplatte auf, auf der ein aus dielektrischem Material in Form eines Quarzes bestehendes A circuit arrangement for a high-frequency antenna with the features of the preamble of claim 1 is known from DE 197 10 811 B4. The known circuit arrangement has a metallic base plate on which an existing of dielectric material in the form of a quartz
Substratelement angeordnet ist. Auf der der Grundplatte abgewandten Seite des Substratelements ist mit dessen Oberseite ein elektronisches Bauelement verbunden, neben dem ebenfalls auf der Oberfläche des Substratelements Antennenelemente angeordnet sind. Die Oberseite der Grundplatte ist im Bereich des elektronischen Bauelements und der Antennenelemente mittels eines aus dielektrischem Material bestehenden Deckels überdeckt. Der Deckel stellt eine Kapselung dar, die das Substratelement bzw. die auf dem Substratelement befindlichen Bauelemente beispielsweise vor Oxidation schützt. Als nachteilig wird bei einer derartigen Kapselung angesehen, dass die Montage und beispielsweise das Evakuieren oder aber Fluten des Innenraums des Substrate element is arranged. On the side of the substrate element facing away from the base plate, an electronic component is connected to the upper side thereof, next to which antenna elements are likewise arranged on the surface of the substrate element. The top of the base plate is covered in the area of the electronic component and the antenna elements by means of a cover made of dielectric material. The cover represents an encapsulation which protects the substrate element or the components located on the substrate element, for example, against oxidation. A disadvantage of such encapsulation is that assembly and, for example, evacuation or flooding of the interior of the
Deckelelements mit einem inerten Gas sowie das anschließende hermetische Verschließen des Innenraums des Deckels einen relativ großen Cover element with an inert gas and the subsequent hermetic sealing of the interior of the cover a relatively large
Montageaufwand darstellt, der darüber hinaus zur Sicherstellung der Assembly effort, which also ensures the
Funktionalität der Schaltungsanordnung prozesstechnisch aufwendig überwacht werden muss. Offenbarung der Erfindung Functionality of the circuit arrangement must be monitored in a complex process. Disclosure of the invention
Die erfindungsgemäße Schaltungsanordnung für eine Hochfrequenzantenne mit den Merkmalen des Anspruchs 1 hat den Vorteil, dass sie sich in The circuit arrangement according to the invention for a high-frequency antenna with the features of claim 1 has the advantage that it is in
fertigungstechnischer Sicht besonders einfach, kostengünstig und prozesssicher hersteilen lässt. Hierzu ist es erfindungsgemäß vorgesehen, dass zumindest das wenigstens eine elektronische Bauelement zu dessen Schutz von einer manufacturing technology can be manufactured particularly easily, inexpensively and reliably. For this purpose, it is provided according to the invention that at least the at least one electronic component for protecting it from one
Moldmasse als Kapselung umgeben ist. Derartige Moldmassen haben insbesondere den Vorteil, dass sie sich relativ einfach prozesstechnisch verarbeiten lassen und einen sicheren Schutz des elektronischen Bauelements gegenüber äußeren, die Funktionalität des Bauelements beeinflussenden Faktoren ermöglichen. Weiterhin ermöglicht es die Verwendung einer Molded mass is encapsulated. Such molding compounds have the particular advantage that they can be processed relatively easily in terms of process technology and enable reliable protection of the electronic component against external factors influencing the functionality of the component. It also allows the use of a
Moldmasse, Substrate mit darauf angeordneten Bauelementen besonders einfach aus einem eine Vielzahl von Bauelementen aufweisenden Substratträger herzustellen, wobei die Substratelemente nach dem (vollflächigen) Umschließen der Bauelemente auf der Oberseite des Substratträgers aus diesem vereinzelt bzw. ausgetrennt werden. Somit ermöglicht es die Verwendung einer Moldmasse zum Schutz des wenigstens einen elektronischen Bauelements in besonders vorteilhafter Art und Weise, derartige Schaltungsanordnungen mit Molding compound, substrates with components arranged thereon can be produced in a particularly simple manner from a substrate carrier having a multiplicity of components, the substrate elements being separated or separated from the substrate carrier after the (full-surface) encapsulation of the components on the upper side of the latter. Thus, the use of a molding compound to protect the at least one electronic component in a particularly advantageous manner enables such circuit arrangements to be used
Substratelementen in großtechnischer Fertigung hersteilen zu können. Derartige Schaltungsanordnungen können darüber hinaus besonders einfach mit einer größeren elektronischen Schaltung bzw. einem Schaltungsträger verbunden werden, um Teil einer elektronischen Baugruppe oder ähnliches zu sein. To be able to manufacture substrate elements in large-scale production. Circuit arrangements of this type can moreover be connected particularly easily to a larger electronic circuit or a circuit carrier in order to be part of an electronic assembly or the like.
Vorteilhafte Weiterbildungen der erfindungsgemäßen Schaltungsanordnung für eine Hochfrequenzantenne sind in den Unteransprüchen aufgeführt. Advantageous developments of the circuit arrangement according to the invention for a high-frequency antenna are listed in the subclaims.
Zur Erzielung optimaler Strahlungseigenschaften der Hochfrequenzantenne ist es besonders bevorzugt vorgesehen, dass das Substratelement aus Glas oder Keramik ausgebildet ist. In order to achieve optimal radiation properties of the high-frequency antenna, it is particularly preferably provided that the substrate element is made of glass or ceramic.
Wie bereits erläutert, sieht es ein bevorzugter Anwendungsfall der As already explained, it sees a preferred application of the
Schaltungsanordnung vor, dass diese zusätzlich zumindest mittelbar mit einem Schaltungsträger elektrisch verbunden ist. Ein derartiger Schaltungsträger kann beispielsweise eine elektronische Baugruppe oder ein Teil eines Steuergeräts sein, das als Bestandsteil eines Fahrerassistenzsystems zur Abstandswarnung oder ähnlichem in einem Fahrzeug dient. Circuit arrangement that it is additionally at least indirectly electrically connected to a circuit carrier. Such a circuit carrier can For example, an electronic assembly or part of a control unit that serves as part of a driver assistance system for distance warning or the like in a vehicle.
Insbesondere in Verbindung mit dem angesprochenen Schaltungsträger ist es zur Erzielung optimaler Sende- bzw. Empfangseigenschaften der In particular in connection with the circuit carrier mentioned, it is to achieve optimal transmission or reception properties of the
Antennenelemente von Vorteil, wenn das wenigstens eine Antennenelement auf der dem Schaltungsträger abgewandten Seite auf dem Substratelement angeordnet ist, sodass der Schaltungsträger keine Abschirmung für die Antenna elements are advantageous if the at least one antenna element is arranged on the substrate element on the side facing away from the circuit carrier, so that the circuit carrier does not provide any shielding for the
Antennenelemente ausbildet. Forms antenna elements.
Bei dem zuletzt angesprochenen Anwendungsfall kann es zur Minimierung der erforderlichen Baugröße des Substratelements vorgesehen sein, dass das wenigstens eine elektronische Bauelement auf der dem wenigstens einen Antennenelement gegenüberliegenden Seite auf dem Substratelement, d.h. auf der dem Schaltungsträger zugewandten Seite angeordnet ist. Zur elektrischen Kontaktierung zwischen dem wenigstens einen Antennenelement und dem elektronischen Bauelement auf dem Substratelement können beispielsweise Durchkontaktierungen oder elektrisch leitende Beschichtungen an dem Substrat vorgesehen sein. In the application mentioned last, it can be provided to minimize the required size of the substrate element that the at least one electronic component on the side opposite the at least one antenna element on the substrate element, i.e. is arranged on the side facing the circuit carrier. For electrical contacts between the at least one antenna element and the electronic component on the substrate element, for example, plated-through holes or electrically conductive coatings can be provided on the substrate.
In Weiterbildung des zuletzt gemachten Vorschlags kann es vorgesehen sein, dass das wenigstens eine elektronische Bauelement unter Zwischenlage zumindest eines HF-Prepregelements mit dem Substratelement verbunden ist. Dieses HF-Prepregelement ist typischerweise über eine metallische In a further development of the last proposal, it can be provided that the at least one electronic component is connected to the substrate element with the interposition of at least one HF prepreg element. This HF prepreg element is typically a metallic one
Beschichtung, die auf der dem elektronischen Bauelement abgewandten Seite des HF-Prepregelements angeordnet ist und mit dem Substrat wiederum elektrisch kontaktiert ist, mit dem wenigstens einen Antennenelement verbunden. Ein Prepregelement hat den Vorteil, dass auf dem Substratelement eine oder mehrere zusätzliche Umverdrahtungslage eingefügt werden kann/können, was einen Anschluss eines komplexen HF ICs beispielsweise als Flip Chip Element ermöglicht. Coating, which is arranged on the side of the HF prepreg element facing away from the electronic component and is in turn electrically contacted with the substrate, is connected to the at least one antenna element. A prepreg element has the advantage that one or more additional rewiring layers can be inserted on the substrate element, which enables a complex HF IC to be connected, for example as a flip chip element.
Unter einem Prepregelement (pregrep: englische Kurzform für preimpregnated fibres) kann ein vorimprägniertes Faserelement verstanden werden. Hierunter fallen beispielsweise mit Reaktionsharzen vorimprägnierte textile Faser-Matrix- Halbzeuge, die zur Herstellung von Bauteilen unter Temperatur und Druck ausgehärtet werden. A prepreg element (pregrep: short form for preimpregnated fibers) can be understood to mean a pre-impregnated fiber element. This includes, for example, textile fiber matrix pre-impregnated with reactive resins. Semi-finished products that are cured under temperature and pressure to produce components.
Um auf möglichst einfache Art und Weise die elektrische Kontaktierung des Substrats mit einem Schaltungsträger zu ermöglichen, wenn sich das mit der Moldmasse umgebene elektronische Bauelement auf der dem Schaltungsträger zugewandten Seite befindet, ist es vorgesehen, dass das Substratelement oder das HF-Prepregelement über Lötverbindungen mit dem Schaltungsträger verbunden ist, und dass das Substratelement im Bereich der Lötverbindungen moldmassenfrei ausgebildet ist, um die Kontaktierung möglichst einfach und sicher auszubilden. Dadurch wird eine unmittelbare Verbindung zwischen dem Schaltungsträger und dem Substratelement ermöglicht. In order to enable the electrical contacting of the substrate with a circuit carrier in the simplest possible way, when the electronic component surrounded by the molding compound is on the side facing the circuit carrier, it is provided that the substrate element or the HF prepreg element is connected via solder connections is connected to the circuit carrier, and that the substrate element in the area of the soldered connections is made free of molding compounds in order to make the contacting as simple and reliable as possible. This enables a direct connection between the circuit carrier and the substrate element.
Alternativ bzw. im Gegensatz zu einer Anordnung des wenigstens einen elektronischen Bauelements und des wenigstens einen Antennenelements auf unterschiedlichen Seiten des Substratelements kann es vorgesehen sein, dass das wenigstens eine elektronische Bauelement und das wenigstens eine Alternatively or in contrast to an arrangement of the at least one electronic component and the at least one antenna element on different sides of the substrate element, it can be provided that the at least one electronic component and the at least one
Antennenelement auf der gleichen Seite auf dem Substratelement angeordnet sind. Eine derartige Ausbildung ermöglicht es insbesondere, die elektrische Verbindung zwischen dem wenigstens einen Antennenelement und dem wenigstens einen elektronischen Bauelement einfacher auszubilden oder aber die Fertigung rationeller zu gestalten. Weiterhin wird dadurch die Bauhöhe der Schaltungsanordnung verringert, was insbesondere in Verbindung mit einer mit dem Schaltungsträger verbundenen Schaltungsanordnung von Vorteil sein kann, da dann der Abstand zwischen dem Schaltungsträger und dem Substratelement relativ gering ist, was die Ausbildung der elektrischen Verbindung bzw. Antenna element are arranged on the same side on the substrate element. Such a design makes it possible, in particular, to simplify the electrical connection between the at least one antenna element and the at least one electronic component, or else to make the production more efficient. Furthermore, this reduces the overall height of the circuit arrangement, which can be advantageous in particular in connection with a circuit arrangement connected to the circuit carrier, since the distance between the circuit carrier and the substrate element is then relatively small, which reduces the formation of the electrical connection or
Kontaktierung vereinfacht. Contacting simplified.
Eine Weiterbildung des zuletzt gemachten Erfindungsgedankens, bei dem sowohl das wenigstens eine elektronische Bauelement als auch das wenigstens eine Antennenelement einerseits besonders gut gegenüber Umwelteinflüssen geschützt sind, und andererseits nichtsdestotrotz relativ gute Sende- bzw. A further development of the concept of the invention made last, in which both the at least one electronic component and the at least one antenna element are particularly well protected against environmental influences on the one hand, and on the other hand relatively good transmission or
Empfangseigenschaften des wenigstens einen Antennenelements ermöglicht werden, sieht vor, dass das wenigstens eine Antennenelement mit Moldmasse überdeckt ist, und dass auf der Moldmasse auf der dem Substratelement abgewandten Seite wenigstens ein Strahlformungselement, vorzugsweise in Form einer metallischen Schicht, für das wenigstens eine Antennenelement angeordnet ist. Eine derartige Ausbildung hat insbesondere auch den Vorteil, dass die ansonsten durch die Moldmasse verschlechterten Sende- bzw. Receiving properties of the at least one antenna element is made possible, provides that the at least one antenna element is covered with molding compound, and that on the molding compound on the side facing away from the substrate element at least one beam shaping element, preferably in Form of a metallic layer, for which at least one antenna element is arranged. Such a design also has the particular advantage that the transmission or
Empfangseigenschaften des wenigstens einen Antennenelements nicht bzw. nur in geringem Ausmaß beeinflusst oder sogar verbessert werden können. Reception properties of the at least one antenna element cannot be influenced or can only be influenced to a small extent or even improved.
In alternativer Anordnung zum zuletzt gemachten Vorschlag kann es jedoch auch vorgesehen sein, dass zumindest der Bereich, in dem das wenigstens eine Antennenelement auf dem Substratelement angeordnet ist, moldmassenfrei ausgebildet ist. Dadurch werden optimale Sende- und Empfangseigenschaften auch ohne zusätzliche Strahlformungselemente ermöglicht. In an alternative arrangement to the last proposal, however, it can also be provided that at least the area in which the at least one antenna element is arranged on the substrate element is designed free of molding compound. This enables optimal transmission and reception properties without additional beam shaping elements.
Die Erfindung betrifft auch ein Verfahren zur Ausbildung einer The invention also relates to a method for forming a
Schaltungsanordnung, die vorzugsweise auf die oben beschriebene Art und Weise ausgebildet ist. Das erfindungsgemäße Verfahren umfasst dabei zumindest folgende Schritte: Zunächst werden eine Vielzahl von Circuit arrangement, which is preferably designed in the manner described above. The method according to the invention comprises at least the following steps: First, a large number of
Antennenelementen auf der Oberfläche eines in einzelne Substratelemente vereinzelbaren Substratträgers ausgebildet. Danach erfolgen ein zumindest mittelbares Anordnen einer Vielzahl von jeweils identisch ausgebildeten elektronischen Bauelementen auf dem Substratträger und ein elektrisches Kontaktieren der Bauelemente mit den Antennenelementen. Anschließend erfolgt ein Ummolden der Seite des Substratträgers, auf dem sich die elektronischen Bauelemente befinden. Zuletzt findet ein Vereinzeln der Substratelemente aus dem Substratträger statt. Das zuletzt erwähnte Vereinzeln der Substratelemente aus dem Substratträger wird üblicherweise mittels Sägetechniken, wie diese aus dem Stand der Technik bekannt sind, vorgenommen. Antenna elements are formed on the surface of a substrate carrier that can be separated into individual substrate elements. This is followed by an at least indirect arrangement of a multiplicity of identically designed electronic components on the substrate carrier and electrical contact of the components with the antenna elements. The side of the substrate carrier on which the electronic components are located is then overmolded. Finally, the substrate elements are separated from the substrate carrier. The last-mentioned separation of the substrate elements from the substrate carrier is usually carried out by means of sawing techniques, as are known from the prior art.
Eine Weiterbildung des zuletzt beschriebenen Verfahrens sieht vor, dass die vereinzelten Substratelemente anschließend mit jeweils einem Schaltungsträger verbunden werden. A further development of the method described last provides that the separated substrate elements are then connected to a circuit carrier in each case.
Zur Optimierung der Sende- bzw. Empfangseigenschaften der To optimize the transmission or reception properties of the
Antennenelemente ist es darüber hinaus vorgesehen, dass der Bereich der Antennenelemente vor dem Vereinzeln der Substratelemente durch Freistellen oder Schützen ohne Moldmasse ausgebildet wird, oder dass auf der Moldmasse im Bereich der von Moldmasse überdeckten Antennenelemente Antenna elements are further provided that the area of the antenna elements is formed before the separation of the substrate elements by freeing or protecting without molding compound, or that on the molding compound in the area of the antenna elements covered by molding compound
Strahlformungselemente für die Antennenelemente angeordnet werden. Beam shaping elements for the antenna elements are arranged.
Weiterhin umfasst die Erfindung auch einen Substratträger mit einer Vielzahl von auf die oben beschriebene Art und Weise hergestellten Schaltungsanordnungen. Furthermore, the invention also comprises a substrate carrier with a multiplicity of circuit arrangements produced in the manner described above.
Eine bevorzugte Verwendung erfindungsgemäßer Schaltungsanordnungen besteht darin, diese als Bestandteil eines Fahrassistenzsystems in einem A preferred use of circuit arrangements according to the invention is to use them as part of a driver assistance system in one
Fahrzeug zu verwenden. Vehicle to use.
Weitere Vorteile, Merkmale und Einzelheiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung bevorzugter Ausführungsbeispiele sowie anhand der Zeichnungen. Further advantages, features and details of the invention result from the following description of preferred exemplary embodiments and from the drawings.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Fig. 1 Fig. 1
bis to
Fig. 4 zeigt in jeweils vereinfachten Längsschnitten mit einem  Fig. 4 shows in simplified longitudinal sections with a
Schaltungsträger verbundene, unterschiedlich ausgebildete Schaltungsanordnungen,  Circuit carriers connected, differently designed circuit arrangements,
Fig. 5 zeigt einen Substratträger, der zur Ausbildung von Fig. 5 shows a substrate carrier which is used to form
Substratelementen dient, wie diese in der Fig. 1 bis Fig. 4 dargestellt sind, in Draufsicht und  As shown in FIGS. 1 to 4, substrate elements serve in plan view and
Fig. 6 zeigt ein Flussdiagramm zur Erläuterung der wesentlichen Fig. 6 shows a flow chart for explaining the essential
Verfahrensschritte zur Ausbildung einer Schaltungsanordnung.  Method steps for forming a circuit arrangement.
Beschreibung der Ausführungsbeispiele Description of the embodiments
Gleiche Elemente bzw. Elemente mit gleicher Funktion sind in den Figuren mit den gleichen Bezugsziffern versehen. In der Fig. 1 ist eine erste Schaltungsanordnung 10 zur Ausbildung einer Identical elements or elements with the same function are provided with the same reference numbers in the figures. 1 is a first circuit arrangement 10 for forming a
Hochfrequenzantenne 1 dargestellt, die mit einem Schaltungsträger 12, zum Beispiel in Form einer eine (nicht gezeigte) elektronische Schaltung High-frequency antenna 1 shown, with a circuit carrier 12, for example in the form of an electronic circuit (not shown)
aufweisenden Leiterplatte 14 oder ähnlichem über Lötverbindungen 16 verbunden ist. Die Lötverbindungen 16 in Form von sogenannten Lötbumps sind im Bereich von Metallisierungen 18 oder Lands auf der Oberseite des having circuit board 14 or the like is connected via solder connections 16. The solder connections 16 in the form of so-called solder bumps are in the area of metallizations 18 or lands on the top of the
Schaltungsträgers 12 angeordnet und verbinden die Schaltungsanordnung 10 mit der erwähnten elektronischen Schaltung des Schaltungsträgers 12. Der Circuit carrier 12 arranged and connect the circuit arrangement 10 with the aforementioned electronic circuit of the circuit carrier 12. Der
Schaltungsträger 12 bzw. die Schaltungsanordnung 10 sind beispielsweise Bestandteil eines im Einzelnen nicht dargestellten Steuergeräts, das als Circuit carrier 12 or the circuit arrangement 10 are, for example, part of a control device, not shown in detail, which as
Fahrerassistenzsystem in einem Fahrzeug beispielsweise zur Abstandsmessung dient. Driver assistance system in a vehicle is used, for example, for distance measurement.
Die Schaltungsanordnung 10 umfasst ein im Ausführungsbeispiel Glaswerkstoff aufweisendes Substratelement 20, auf dessen dem Schaltungsträger 12 abgewandten Oberseite wenigstens ein (HF-) Antennenelement 22 in Form einer metallischen Leitungsstruktur durch Beschichten oder Bedrucken ausgebildet ist. Das wenigstens eine Antennenelement 22 ist elektrisch auf der dem wenigstens einen Antennenelement 22 abgewandten Seite des Substratelements 20 mit einer metallischen Beschichtung 24 (die eine elektrische Masse ausbildet) elektrisch kontaktiert. Die Beschichtung 24 ist wiederum mit einem HF- Prepregelement 26 verbunden, das beispielsweise aus einem PCB oder einem Laminat, wie Tachyon besteht. Auf der der Beschichtung 24 abgewandten Seite des HF-Prepregelements 26 ist wenigstens ein elektronisches Bauelement 30 in Form eines ICs o.ä. angeordnet und mittels Verbindungen 32 elektrisch zumindest mittelbar mit dem wenigstens einen Antennenelement 22 verbunden. The circuit arrangement 10 comprises a substrate element 20 having glass material in the exemplary embodiment, on the upper side of which, facing away from the circuit carrier 12, at least one (RF) antenna element 22 in the form of a metallic line structure is formed by coating or printing. The at least one antenna element 22 is electrically contacted on the side of the substrate element 20 facing away from the at least one antenna element 22 with a metallic coating 24 (which forms an electrical mass). The coating 24 is in turn connected to an HF prepreg element 26, which consists for example of a PCB or a laminate, such as Tachyon. At least one electronic component 30 in the form of an IC or the like is on the side of the HF prepreg element 26 facing away from the coating 24. arranged and electrically connected to the at least one antenna element 22 by means of connections 32.
Das elektronische Bauelement 30 ist zumindest in seinem unmittelbaren Bereich an seiner Oberseite sowie den Seitenflächen von einer Moldmasse 34 umgeben bzw. geschützt angeordnet. Seitlich neben der Moldmasse 34 sind die The electronic component 30 is surrounded or protected at least in its immediate area on its upper side and the side surfaces by a molding compound 34. To the side of the molding compound 34 are the
Lötverbindungen 16 angeordnet, welche die elektrische Verbindung zwischen dem Schaltungsträger 12 und dem HF-Prepregelement 26 ausbilden, wozu das HF-Prepregelement 26 entsprechend ausgebildete, nicht dargestellte metallische Beschichtungen oder ähnliches aufweist. Die in der Fig. 2 dargestellte Schaltungsanordnung 10a unterscheidet sich von der Schaltungsanordnung 10 gemäß der Fig. 1 dadurch, dass die Soldered connections 16 are arranged, which form the electrical connection between the circuit carrier 12 and the HF prepreg element 26, for which purpose the HF prepreg element 26 has correspondingly designed, not shown metallic coatings or the like. The circuit arrangement 10a shown in FIG. 2 differs from the circuit arrangement 10 according to FIG. 1 in that the
Schaltungsanordnung 10a weder eine metallische Beschichtung 24 noch ein HF- Prepregelement 26 aufweist. Vielmehr ist das elektronische Bauelement 30 unmittelbar mit dem Substratelement 20 elektrisch leitend verbunden. Circuit arrangement 10a has neither a metallic coating 24 nor an HF prepreg element 26. Rather, the electronic component 30 is electrically conductively connected directly to the substrate element 20.
Während bei den Fig. 1 und 2 sich das wenigstens eine elektronische 1 and 2, this is at least one electronic
Bauelement 30 und das wenigstens eine Antennenelement 22 auf Component 30 and the at least one antenna element 22
gegenüberliegenden Seiten des Substratelements 20 befinden, sind bei der Schaltungsanordnung 10b gemäß der Fig. 3 sowohl das wenigstens eine Antennenelement 22 als auch das wenigstens eine elektronische Bauelement 30 auf der dem Schaltungsträger 12 abgewandten Oberseite des Substratelements 20 angeordnet. Beispielhaft befindet sich das wenigstens eine Antennenelement 22 seitlich neben dem elektronischen Bauelement 30, wobei das elektronische Bauelement 30 über elektrische Verbindungen 36 mit dem Antennenelement 22 bzw. dem Substratelement 20 elektrisch leitend verbunden ist. Weiterhin ist es vorgesehen, dass die gesamte Oberseite bzw. der gesamte Bereich des 3, both the at least one antenna element 22 and the at least one electronic component 30 are arranged on the upper side of the substrate element 20 facing away from the circuit carrier 12 in the circuit arrangement 10b according to FIG. 3. As an example, the at least one antenna element 22 is located laterally next to the electronic component 30, the electronic component 30 being electrically conductively connected to the antenna element 22 or the substrate element 20 via electrical connections 36. It is also provided that the entire top or the entire area of the
Substratelements 20 von der Moldmasse 34 überdeckt ist. Zur Verbesserung der Sende- bzw. Empfangseigenschaften des Antennenelements 22 sind auf der Moldmasse 34 in Wirkverbindung mit dem Antennenelement 22 angeordnete Strahlformungselemente 38 vorgesehen, die beispielsweise in Form einer metallischen Beschichtung oder ähnlichem ausgebildet sind. Substrate element 20 is covered by the molding compound 34. In order to improve the transmission or reception properties of the antenna element 22, beam shaping elements 38 are provided on the molding compound 34 in operative connection with the antenna element 22, which are designed, for example, in the form of a metallic coating or the like.
Zuletzt ist in der Fig. 4 ein gegenüber Fig. 3 modifiziertes Ausführungsbeispiel mit einer Schaltungsanordnung 10c dargestellt. Die Schaltungsanordnung 10c unterscheidet sich von der Schaltungsanordnung 10b gemäß der Fig. 3 dadurch, dass der Bereich um das Antennenelement 22 von Moldmasse 34 befreit ist, indem dort keine Moldmasse 34 aufgebracht wurde. Somit ist lediglich der Bereich des elektronischen Bauelements 30 auf dem Substratelement 20 von Moldmasse 34 umgeben. Dadurch, dass das Antennenelement 22 nicht von Moldmasse 34 umgeben ist, kann auf die in der Fig. 3 dargestellten Finally, FIG. 4 shows an exemplary embodiment modified compared to FIG. 3 with a circuit arrangement 10c. The circuit arrangement 10c differs from the circuit arrangement 10b according to FIG. 3 in that the area around the antenna element 22 is freed from molding compound 34 by no molding compound 34 being applied there. Thus, only the area of the electronic component 30 on the substrate element 20 is surrounded by molding compound 34. Due to the fact that the antenna element 22 is not surrounded by molding compound 34, it is possible to use the one shown in FIG. 3
Strahlformungselemente 38 verzichtet werden. Beam shaping elements 38 are dispensed with.
In der Fig. 5 ist ein Ausschnitt eines Substratträgers 50 dargestellt, der zur Herstellung jeweils einer Vielzahl von Schaltungsanordnungen 10a bis 10c auf rechteckförmigen Substratelementen 20 dient. Die Substratelemente 20 bzw. Schaltungsanordnungen 10a bis 10c werden nach deren Ausbildung FIG. 5 shows a section of a substrate carrier 50 which is used to manufacture a large number of circuit arrangements 10a to 10c on rectangular substrate elements 20. The substrate elements 20 and Circuit arrangements 10a to 10c are after their formation
beispielsweise durch Aussägen oder ähnliche, an sich aus dem Stand der Technik bekannte Trenntechnologien, aus dem Substratträger 50 abgetrennt bzw. vereinzelt. for example by sawing or similar separation technologies known per se from the prior art, separated or separated from the substrate carrier 50.
Zur Erläuterung der wesentlichen Verfahrensschritte bei der Ausbildung der Schaltungsanordnungen 10, 10a bis 10c an dem Substratträger 50 wird nunmehr auf die Fig. 6 verwiesen: Darin ist erkennbar, dass zunächst in einem ersten Fertigungsschritt 101 eine Vielzahl von Antennenelementen 22 auf der For an explanation of the essential method steps in the formation of the circuit arrangements 10, 10a to 10c on the substrate carrier 50, reference is now made to FIG. 6: This shows that initially in a first production step 101 a large number of antenna elements 22 on the
Oberfläche des in einzelne Substratelemente 20 vereinzelbaren Substratträgers 50 ausgebildet werden. Anschließend erfolgt in einem Fertigungsschritt 102 ein zumindest mittelbares Anordnen einer Vielzahl von jeweils identisch Surface of the substrate carrier 50 which can be separated into individual substrate elements 20 are formed. Then, in a manufacturing step 102, an at least indirect arrangement of a plurality of identical in each case takes place
ausgebildeten elektronischen Bauelementen 30 auf dem Substratträger 50 und ein elektrisches Kontaktieren der elektronischen Bauelemente 30 mit den Antennenelementen 22. Danach erfolgt in einem Fertigungsschritt 103 ggf. ein Freistellen bzw. Schützen von Bereichen, in denen keine Moldmasse 34 aufgebracht werden soll. Anschließend erfolgt in einem Schritt 104 ein formed electronic components 30 on the substrate carrier 50 and an electrical contact of the electronic components 30 with the antenna elements 22. Thereafter, in a manufacturing step 103, areas in which no molding compound 34 is to be applied may be cut out or protected. This is followed in a step 104
Ummolden mit Moldmasse 34 der Seite des Substratträgers 50, auf dem sich die elektronischen Bauelemente 30 befinden mit Ausnahme ggf. der Bereiche, die im Schritt 103 freigestellt worden sind. Die freigestellten Bereiche sind die Bereiche, in denen wenigstens eine elektrische Verbindung mit dem Schaltungsträger 12 oder die Anordnung der Antennenelemente 22 erfolgt ist. Anschließend erfolgt in einem Fertigungsschritt 105 ein Vereinzeln von Substratelementen 20 aus dem Substratträger 50. Ggf. kann vor dem Vereinzeln der Substratelemente 20 noch das Anordnen der Strahlformungselemente 38 erfolgen. Sheathing with molding compound 34 on the side of the substrate carrier 50 on which the electronic components 30 are located, with the exception, where appropriate, of the areas which were exempted in step 103. The exempted areas are the areas in which at least one electrical connection to the circuit carrier 12 or the arrangement of the antenna elements 22 has been made. Subsequently, in a manufacturing step 105, substrate elements 20 are separated from the substrate carrier 50. the beam shaping elements 38 can be arranged before the substrate elements 20 are separated.
Nach dem Fertigungsschritt 105 erfolgt zum Beispiel das elektrische Verbinden der Substratelemente 20 mit jeweils einem Schaltungsträger 12 entsprechend der in den Figuren 1 bis 4 dargestellten Anordnungen. After the manufacturing step 105, for example, the substrate elements 20 are electrically connected to a respective circuit carrier 12 in accordance with the arrangements shown in FIGS. 1 to 4.
Die soweit beschriebenen Ausführungsbeispiele können in vielfältiger Art und Weise abgewandelt bzw. modifiziert werden, ohne vom Erfindungsgedanken abzuweichen. The exemplary embodiments described so far can be modified or modified in a variety of ways without deviating from the inventive concept.

Claims

Ansprüche Expectations
1. Schaltungsanordnung (10; 10a bis 10c) für eine Hochfrequenzantenne (1 ), mit einem Substratelement (20), auf dem eine wenigstens ein 1. Circuit arrangement (10; 10a to 10c) for a high-frequency antenna (1), with a substrate element (20) on which one at least one
Antennenelement (22) ausbildende metallische Leitungsstruktur angeordnet ist, wobei das Substratelement (20) als Träger für wenigstens ein elektronisches Bauelement (30) dient, das in Wirkverbindung mit dem wenigstens einen Antennenelement (22) angeordnet ist, und wobei zumindest das wenigstens eine elektronische Bauelement (30) durch eine Kapselung hermetisch dicht umschlossen ist, dadurch gekennzeichnet, dass die Kapselung in Form einer Moldmasse (34) ausgebildet ist.  A metallic line structure forming the antenna element (22) is arranged, the substrate element (20) serving as a carrier for at least one electronic component (30), which is arranged in operative connection with the at least one antenna element (22), and wherein at least one at least one electronic component (30) is hermetically sealed by an encapsulation, characterized in that the encapsulation is in the form of a molding compound (34).
2. Schaltungsanordnung nach Anspruch 1 , 2. Circuit arrangement according to claim 1,
dadurch gekennzeichnet,  characterized,
dass das Substratelement (20) zumindest im Wesentlichen aus  that the substrate element (20) at least essentially
Glaswerkstoff oder Keramikwerkstoff ausgebildet ist.  Glass material or ceramic material is formed.
3. Schaltungsanordnung nach Anspruch 1 oder 2, 3. Circuit arrangement according to claim 1 or 2,
dadurch gekennzeichnet,  characterized,
dass das Substratelement (20) zumindest mittelbar mit einem  that the substrate element (20) at least indirectly with a
Schaltungsträger (12) elektrisch verbunden ist.  Circuit carrier (12) is electrically connected.
4. Schaltungsanordnung nach Anspruch 3, 4. Circuit arrangement according to claim 3,
dadurch gekennzeichnet,  characterized,
dass das wenigstens eine Antennenelement (22) auf der dem  that the at least one antenna element (22) on the
Schaltungsträger (12) abgewandten Seite auf dem Substratelement (20) angeordnet ist.  Circuit carrier (12) facing away from the substrate element (20) is arranged.
5. Schaltungsanordnung nach Anspruch 4, 5. Circuit arrangement according to claim 4,
dadurch gekennzeichnet, dass das wenigstens eine elektronische Bauelement (30) auf der dem wenigstens einen Antennenelement (22) gegenüberliegenden Seite auf dem Substratelement (20) angeordnet ist. characterized, that the at least one electronic component (30) is arranged on the side opposite the at least one antenna element (22) on the substrate element (20).
6. Schaltungsanordnung nach Anspruch 5, 6. Circuit arrangement according to claim 5,
dadurch gekennzeichnet,  characterized,
dass das wenigstens eine elektronische Bauelement (30) unter  that the at least one electronic component (30) under
Zwischenlage zumindest eines HF-Prepregelements (26) mit dem  Liner of at least one HF prepreg element (26) with the
Substratelement (20) verbunden ist.  Substrate element (20) is connected.
7. Schaltungsanordnung nach einem der Ansprüche 3 bis 6, 7. Circuit arrangement according to one of claims 3 to 6,
dadurch gekennzeichnet,  characterized,
dass das Substratelement (20) oder das HF-Prepregelement (26) über Lötverbindungen (16) mit dem Schaltungsträger (12) verbunden ist, und dass das Substratelement (20) im Bereich der Lötverbindungen (16) moldmassenfrei ausgebildet ist.  that the substrate element (20) or the HF prepreg element (26) is connected to the circuit carrier (12) via soldered connections (16), and that the substrate element (20) in the area of the soldered connections (16) is free of mold compound.
8. Schaltungsanordnung nach Anspruch 4, 8. Circuit arrangement according to claim 4,
dadurch gekennzeichnet,  characterized,
dass das wenigstens eine elektronische Bauelement (30) und das wenigstens eine Antennenelement (22) auf der gleichen Seite auf dem Substratelement (20) angeordnet sind.  that the at least one electronic component (30) and the at least one antenna element (22) are arranged on the same side on the substrate element (20).
9. Schaltungsanordnung nach Anspruch 8, 9. Circuit arrangement according to claim 8,
dadurch gekennzeichnet,  characterized,
dass das wenigstens eine Antennenelement (22) mit Moldmasse (34) überdeckt ist, und dass auf der Moldmasse (34) auf der dem  that the at least one antenna element (22) is covered with molding compound (34), and that on the molding compound (34) on the
Substratelement (20) abgewandten Seite wenigstens ein  At least one side facing away from the substrate element (20)
Strahlformungselement (38), vorzugsweise in Form einer metallischen Schicht, für das wenigstens eine Antennenelement (22) angeordnet ist.  Beam shaping element (38), preferably in the form of a metallic layer, for which at least one antenna element (22) is arranged.
10. Schaltungsanordnung Anspruch 8, 10. Circuit arrangement claim 8,
dadurch gekennzeichnet,  characterized,
dass zumindest der Bereich, in dem das wenigstens eine Antennenelement (22) auf dem Substratelement (20) angeordnet ist, moldmassenfrei ausgebildet ist. that at least the area in which the at least one antenna element (22) is arranged on the substrate element (20) is designed to be free of molding compound.
1 1. Verfahren zur Ausbildung einer Schaltungsanordnung (10; 10a bis 10c), die vorzugsweise nach einem der Ansprüche 1 bis 10 ausgebildet ist, umfassend zumindest folgende Schritte: 1 1. A method for forming a circuit arrangement (10; 10a to 10c), which is preferably designed according to one of claims 1 to 10, comprising at least the following steps:
- Ausbilden einer Vielzahl von Antennenelementen (22) auf der - Form a plurality of antenna elements (22) on the
Oberfläche eines in einzelne Substratelemente (20) vereinzelbaren Substratträgers (50)  Surface of a substrate carrier (50) which can be separated into individual substrate elements (20)
- Zumindest mittelbares Anordnen einer Vielzahl von jeweils identisch ausgebildeten elektronischen Bauelementen (30) auf dem Substratträger (50) und elektrisches Kontaktieren der Bauelemente (30) mit den Antennenelementen (22)  - At least indirectly arranging a plurality of identical electronic components (30) on the substrate carrier (50) and electrically contacting the components (30) with the antenna elements (22)
- Überdecken mit einer Moldmasse (34) der Seite des Substratträgers (50), auf dem sich die elektronischen Bauelemente (30) befinden - Cover with a molding compound (34) on the side of the substrate carrier (50) on which the electronic components (30) are located
- Vereinzeln von Substratelementen (20) aus dem Substratträger (50) - Separating substrate elements (20) from the substrate carrier (50)
12. Verfahren nach Anspruch 11 , 12. The method according to claim 11,
dadurch gekennzeichnet,  characterized,
dass die vereinzelten Substratelemente (20) mit jeweils einem  that the isolated substrate elements (20) each with one
Schaltungsträger (12) verbunden werden.  Circuit carriers (12) are connected.
13. Verfahren nach Anspruch 1 1 oder 12, 13. The method according to claim 1 1 or 12,
dadurch gekennzeichnet,  characterized,
dass im Bereich der Antennenelemente (22) keine Moldmasse (34) aufgebracht wird, oder dass auf der Moldmasse (34) im Bereich der von Moldmasse (34) überdeckten Antennenelemente (22)  that no molding compound (34) is applied in the area of the antenna elements (22), or that on the molding compound (34) in the area of the antenna elements (22) covered by molding compound (34)
Strahlformungselemente (38) für die Antennenelemente (22) angeordnet werden.  Beam shaping elements (38) for the antenna elements (22) are arranged.
14. Substratträger (50) mit einer Vielzahl von Schaltungsanordnungen (10; 10a bis 10c), die nach einem Verfahren nach einem der Ansprüche 1 1 bis 13 hergestellt sind. 14. substrate carrier (50) with a plurality of circuit arrangements (10; 10a to 10c), which are produced by a method according to any one of claims 1 1 to 13.
15. Verwendung von Schaltungsanordnungen (10; 10a bis 10c), die nach einem der Ansprüche 1 bis 10 ausgebildet sind, als Bestandteil eines 15. Use of circuit arrangements (10; 10a to 10c), which are designed according to one of claims 1 to 10, as part of a
Fahrassistenzsystems in einem Fahrzeug.  Driver assistance system in a vehicle.
PCT/EP2019/081263 2018-11-15 2019-11-14 Circuit arrangement for a high-frequency antenna, method for forming a circuit arrangement, substrate carrier and use of a circuit arrangement WO2020099531A1 (en)

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Application Number Priority Date Filing Date Title
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DE102018219497.1A DE102018219497A1 (en) 2018-11-15 2018-11-15 Circuit arrangement for a high-frequency antenna, method for forming a circuit arrangement, substrate carrier and use of a circuit arrangement

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Citations (5)

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DE19710811B4 (en) 1997-03-15 2006-06-01 Robert Bosch Gmbh Device for directionally emitting and / or picking up electromagnetic waves
DE102016224936A1 (en) * 2016-12-14 2018-06-14 Robert Bosch Gmbh radar module
WO2018111268A1 (en) * 2016-12-14 2018-06-21 Intel Corporation Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
WO2018125240A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems
EP3364457A1 (en) * 2017-02-15 2018-08-22 Nxp B.V. Integrated circuit package including an antenna

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19710811B4 (en) 1997-03-15 2006-06-01 Robert Bosch Gmbh Device for directionally emitting and / or picking up electromagnetic waves
DE102016224936A1 (en) * 2016-12-14 2018-06-14 Robert Bosch Gmbh radar module
WO2018111268A1 (en) * 2016-12-14 2018-06-21 Intel Corporation Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
WO2018125240A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems
EP3364457A1 (en) * 2017-02-15 2018-08-22 Nxp B.V. Integrated circuit package including an antenna

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