WO2020094095A1

WO2020094095A1 - Ultra-thin incoming material packaging method and packaging structure

Info

Publication number: WO2020094095A1
Application number: PCT/CN2019/116270
Authority: WO
Inventors: 王之奇
Original assignee: 苏州晶方半导体科技股份有限公司
Priority date: 2018-11-07
Filing date: 2019-11-07
Publication date: 2020-05-14
Also published as: CN109411377B; CN109411377A; WO2020094096A1

Abstract

An ultra-thin incoming material packaging method and a packaging structure. In the packaging method, a single chip (1) is formed in the manufacturing process of an ultra-thin wafer (100), and then is inverted to a circuit board (800) and then covered with a first adhesive tape (900); and next, a bearing plate (300) and the ultra-thin wafer (100) are subjected to de-bonding, and an accommodating chamber is formed between the first adhesive tape (900) and the circuit board (800) for accommodating the single chip (1), so that a protection effect may be provided for the single chip (1) in a transportation process. During subsequent use, the bearing plate (300) may be brought away from the circuit board (800) while the first adhesive tape (900) is torn off, so that a follow-up process may be carried out conveniently. The risk that the ultra-thin incoming material is easy to warp and even break in a wafer process is reduced by bonding the bearing plate (300); and meanwhile, the single chip (1) may be protected in the transportation process, and the follow-up use does not influence other processes.

Description

Ultra-thin incoming packaging method and packaging structure

This disclosure requires the priority of a Chinese patent application filed with the Chinese Patent Office on November 07, 2018, with application number 201811316986.8. The entire contents of the above applications are incorporated by reference in this disclosure.

Technical field

The present application relates to the technical field of semiconductor device fabrication, for example, to an ultra-thin incoming packaging method and packaging structure.

Background technique

As we all know, packaging technology is actually a technology for packaging chips. This packaging is necessary for chips. Because the chip must be isolated from the outside world to prevent the impurities in the air from corroding the chip circuit and causing electrical performance to deteriorate. On the other hand, the packaged chips are also easier to install and transport. Therefore, packaging technology is a very critical part of the integrated circuit industry.

With the increasing integration of chips, the current mainstream of packaging technology has developed into three-dimensional packaging technology (3D Package). Among them, the advantage of three-dimensional packaging is that it can increase the density of interconnect lines and reduce the overall height of the device shape. Because it is possible to stack different types of chips together and have a high interconnect line density, the three-dimensional packaging technology has a good application prospect.

In the three-dimensional system-in-package technology, the connection path of through-silicon-via (TSV, Through-Silicon-Via) electrodes can be shortened to the thickness of only one chip, so the interconnection with the shortest path and the highest integration can be realized. A system-level integration solution for interconnection through TSVs can reduce the interconnect area delay while reducing chip area.

However, in the three-dimensional packaging process, the thickness of the wafer needs to be reduced to at least 70um, and when the wafer is reduced to less than 100um, the wafer will become extremely fragile. During the grinding process of the wafer The edge of the wafer may be warped or even broken.

Summary of the invention

The present application provides an ultra-thin incoming packaging method and packaging structure to solve the problem that wafers in the prior art are prone to warp or even break during the manufacturing process.

This application provides the following technical solutions:

An ultra-thin incoming packaging method, including:

An ultra-thin wafer is provided. The ultra-thin wafer includes a first surface and a second surface that are disposed oppositely. The first surface of the ultra-thin wafer has a plurality of functional regions arranged in an array, two adjacent There are cutting channels between the functional areas, and the first surface includes a plurality of bonding pads electrically connected to the functional areas;

Bonding a carrier board on the first surface of the ultra-thin wafer;

Forming a plurality of through holes on the second surface of the ultra-thin wafer to expose the bonding pad;

Forming a plurality of solder bumps on the second surface of the ultra-thin wafer, the solder bumps are electrically connected to the solder pads;

Cutting the ultra-thin wafer and the carrier board to form a plurality of single-chip chip packaging units;

Provide circuit board;

Flipping a plurality of the single-chip chips onto the circuit board so that the solder bumps on the single-chip chips are electrically connected to the circuit board;

Covering the first tape, the first tape is bonded to the top surface of the carrier board and the circuit board;

Unbonding the carrier board and the plurality of single-chip chips.

This application provides a packaging structure, including:

A circuit board, the circuit board includes a plurality of circuit structures, and a cutting channel is provided between two adjacent circuit structures;

Multiple chips, one chip is electrically connected to one of the circuit structures;

A bearing board located on each chip away from the circuit board;

A first adhesive tape covering the carrier board and the cutting lane, the first adhesive tape being bonded to the carrier board and the cutting lane.

BRIEF DESCRIPTION

1 is a schematic flowchart of an ultra-thin incoming packaging method provided by an embodiment of the present application;

2 is a schematic top view of an ultra-thin incoming material provided by an embodiment of the present application;

3 is a schematic diagram of the cross-sectional structure along line AA 'in FIG. 2;

4 is a schematic diagram of a cross-sectional structure of an ultra-thin incoming material after bonding a carrier plate provided by an embodiment of the present application;

5 is a schematic diagram of a structure of an ultra-thin incoming material after cutting according to an embodiment of the present application;

6 is a temporary bonding structure after removing the second tape provided by an embodiment of the present application;

7 to 11 are process schematic diagrams of performing a TSV process on an ultra-thin wafer provided by an embodiment of this application;

12 is a schematic structural diagram of a single chip after cutting according to an embodiment of the present application;

13 is a schematic structural diagram of flipping a single chip onto a circuit board according to an embodiment of the application;

14 is a schematic diagram of a top structure corresponding to FIG. 13 provided by an embodiment of the present application;

15 is a schematic structural diagram of a circuit board after being covered with a first adhesive tape according to an embodiment of the present application;

16 is a schematic structural diagram of a top view of a circuit board covered with a first adhesive tape provided by an embodiment of the present application;

FIG. 17 is a schematic structural diagram of a first adhesive tape provided by an embodiment of the present application;

18 is a schematic cross-sectional structure diagram of a packaging structure provided by an embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application.

Please refer to FIG. 1. FIG. 1 is a schematic flowchart of an ultra-thin incoming packaging method provided in an embodiment of the present application. The ultra-thin incoming packaging method includes:

S101: Provide an ultra-thin wafer. The ultra-thin wafer includes a first surface and a second surface that are oppositely arranged. The first surface of the ultra-thin wafer is formed with a plurality of functional regions arranged in an array, adjacent to each other. There is a cutting channel between the two functional areas, and the first surface includes a plurality of bonding pads electrically connected to the functional areas;

Please refer to FIG. 2 and FIG. 3, FIG. 2 is a schematic structural view of a top view of an ultra-thin incoming material provided by an embodiment of the present application, and FIG. 3 is a schematic cross-sectional structure diagram taken along line AA 'in FIG. Only two functional areas are exemplified in FIG. 3, which does not mean that only two functional areas are provided on the ultra-thin wafer; as shown in FIG. 3, the ultra-thin wafer 100 includes a first surface 101 and a second surface that are oppositely arranged Surface 102; a plurality of functional regions 11 arranged in an array are formed on the first surface 101 of the ultra-thin wafer 100, and a cutting channel 10 is provided between two adjacent functional regions 11, and the cutting channel 10 is used for subsequent The wafer is cut into multiple chips. The first surface 101 further includes a plurality of bonding pads 12 electrically connected to the functional area 11. The pad 12 is used to electrically connect the functional area and the external circuit.

The specific structure of the ultra-thin wafer is not limited in the embodiments of the present application. Since the thickness of the ultra-thin wafer 100 is small, bending and cracking during transportation are avoided. In an embodiment of the present application, the ultra-thin wafer The wafer may specifically include: providing an ultra-thin wafer with a second tape 200, the second tape 200 adheres to the second surface 102 of the ultra-thin wafer 100, and the edge of the second tape Provided with a metal ring 201. Referring to FIG. 3, the second surface 102 of the ultra-thin wafer 100 is adhered to the surface of the second tape 200, and the edge of the second tape 200 is provided with a metal ring 201. The ultra-thin wafer 100 with the second tape 200 and the metal ring 201 described in this embodiment is an ultra-thin incoming material, wherein the presence of the second tape 200 and the metal ring 201 can provide the ultra-thin wafer 100 Protection to prevent the wafer 100 from being broken due to large external forces during transportation.

Since the ultra-thin incoming material also includes the second tape 200 and the metal ring 201, and the ultra-thin wafer is a single wafer, in order to avoid the warping or cracking of the ultra-thin wafer in the subsequent manufacturing process, this embodiment also It includes the following step S102.

S102: bonding a carrier board on the first surface of the ultra-thin wafer;

It should be noted that, as described above, the ultra-thin incoming material is actually a structure composed of an ultra-thin wafer, a second tape, and a metal ring. Therefore, after providing the ultra-thin wafer with the second tape, and before bonding the carrier board on the first surface of the ultra-thin wafer, the step of removing the metal ring and the second tape is further included, specifically including:

Temporarily bonding the carrier board on the first surface of the ultra-thin wafer with the second tape;

Using the edge of the ultra-thin wafer as a cutting line, the second adhesive tape, the ultra-thin wafer and the carrier board are cut out to obtain a temporary bonding structure, and the metal ring and the excess second adhesive tape are removed.

Referring to FIG. 4, the carrier board 300 is temporarily bonded to the first surface 101 of the ultra-thin wafer 100 with the second tape. It should be noted that the specific material of the carrier board 300 is not limited in this embodiment, as long as the carrier board 300 It is sufficient to provide supporting stress to the ultra-thin wafer 100 in the subsequent process to avoid the ultra-thin wafer 100 from cracking. The carrier board 300 may be transparent, that is, the carrier board is a transparent carrier board. It may also be opaque, which is not limited in this embodiment. In order to facilitate the subsequent process, in this embodiment, the carrier board 300 may be made of a transparent material, more optionally, made of glass material.

In addition, the temporary bonding described here is not a real bonding process, but only the bonding of the carrier board 300 and the first surface 101 of the ultra-thin wafer 100, and there is a certain adhesion between the two. However, it cannot be used in other processes of ultra-thin wafers. The embodiment of the present application does not limit the specific process of temporarily bonding the first surface of the ultra-thin wafer with the second tape to the carrier board. In an embodiment of the present application, the specific process may be:

Applying a light-curing adhesive to the first surface of the ultra-thin wafer with the second tape;

The carrier board is bonded to the first surface of the ultra-thin wafer with the second adhesive tape through the photo-curable adhesive.

Since the corresponding process of the ultra-thin wafer is subsequently completed, the carrier plate and the first surface of the ultra-thin wafer need to be unbonded. In order to facilitate subsequent debonding, in this embodiment, the photocurable adhesive may be UV Adhesive.

After the carrier plate is temporarily combined with the first surface of the ultra-thin wafer, please refer to FIG. 5, the edge of the ultra-thin wafer 100 is used as a cutting line to remove the metal ring 201 and the excess second adhesive tape 200. The ultra-thin wafer 100 and the second tape 200 and the carrier board 300 having the same size and shape as the ultra-thin wafer 100 are obtained by cutting. In this embodiment, for convenience of subsequent description, this structure is called a temporary bonding structure.

Finally, after obtaining the temporary bonding structure, after officially bonding the ultra-thin wafer and the carrier board, and removing the second tape on the second surface of the ultra-thin wafer, the first carrier board and the ultra-thin wafer are obtained The structure where the surface is bonded to the bearing plate. That is, bonding the carrier board to the first surface of the ultra-thin wafer specifically includes:

Bonding the ultra-thin wafer and the carrier board in the temporary bonding structure;

Remove the second tape.

After the first surface 101 of the ultra-thin wafer 100 and the carrier plate 300 are truly bonded, the second tape can be removed, and when the subsequent etching or other processes are performed on the ultra-thin wafer, the carrier plate 300 can be ultra-thin The thin wafer 100 provides the necessary stress support to avoid warping or cracking of the ultra-thin wafer during high temperature or etching processes.

In this embodiment, the specific process of real bonding between the ultra-thin wafer and the carrier board in the temporary bonding structure is not limited. In one embodiment of the present application, the carrier board is a transparent carrier board, and the photocurable adhesive is In the case of UV adhesives, the bonding process of ultra-thin wafers and carrier boards can specifically include:

Using ultraviolet light to irradiate the bearing plate side of the temporary bonding structure;

The UV adhesive is cured so that the first surface of the ultra-thin wafer in the temporary bonding structure is bonded to the carrier board.

Please refer to FIG. 6. FIG. 6 is a schematic cross-sectional structural view of the first surface of the ultra-thin wafer bonded to the carrier plate; the first surface 101 of the ultra-thin wafer 100 includes a plurality of functional areas 11, two adjacent There are cutting channels 10 between the functional areas 11 and a plurality of bonding pads 12 electrically connected to the functional areas 11. In this embodiment, the PP ′ cross-sectional view in FIG. 2 is used as an example for description.

S103: forming a plurality of through holes on the second surface of the ultra-thin wafer to expose the bonding pad;

After the ultra-thin wafer 100 is bonded to the carrier plate 300, since the carrier plate 300 has a support and protection effect on the ultra-thin wafer 100, the ultra-thin wafer 100 can be appropriately punched, etched, etc. Process.

The specific process of the wafer manufacturing process is not limited in this embodiment. In this embodiment, the TSV (Through Silicon Vias) process is performed on the wafer as an example for description. Please refer to FIG. 7. FIG. 7 is a process of forming a through hole on the ultra-thin wafer 100 to expose the pad.

It should be noted that the specific process of forming a plurality of through holes 103 on the second surface 102 of the ultra-thin wafer 100 to expose the bonding pad 12 is not limited in this embodiment. In an embodiment of the present application, it may be specific include:

An etching treatment is performed on the position of the second surface of the ultra-thin wafer corresponding to the bonding pad to expose the bonding pad 12.

Then, an insulating layer is formed on the second surface of the ultra-thin wafer with a plurality of through holes. Referring to FIG. 8, an insulating layer 400 covers the second surface 102 of the ultra-thin wafer 100 and the insulating layer 400 covers the The side wall of the through hole 103 exposes the bottom surface of the through hole 103; the pad 12 is located on the bottom surface of the through hole 103 so as to be exposed to the outside.

Referring to FIG. 9, a re-wiring layer 500 is formed on the insulating layer 400, and the re-wiring layer 500 is connected to the pad 12 at the bottom of the through hole 103; thereby, the pad 12 can be electrically connected to The second surface of the ultra-thin wafer 100.

10, a solder resist layer 600 is formed, and the solder resist layer 600 covers the re-wiring layer 500 and the insulating layer 400; the solder resist layer 600 is used to protect the re-wiring layer 500 to avoid the re-wiring layer 500 There is a short circuit with other electrical components in the outside world, causing the device to fail.

Please continue to refer to FIG. 10, an opening 601 is formed on the solder resist layer 600. The opening 601 exposes part of the redistribution layer 500 for subsequent formation of solder bumps.

S104: Making a plurality of solder bumps on the second surface of the ultra-thin wafer, the solder bumps are electrically connected to the solder pads;

It should be noted that the plurality of solder bumps are used to electrically connect the pad 12 electrically connecting the first surface 101 of the ultra-thin wafer 100 and the functional area 11 to the second surface 102 of the ultra-thin wafer 100, and then It is used for electrical connection with external circuits. In this embodiment, it is formed by the TSV process. Therefore, referring to FIG. 11, in this embodiment, a plurality of solder bumps 700 are formed on the second surface of the ultra-thin wafer. The solder bump 700 is electrically connected to the solder pad 12 and may specifically include:

Forming a welding protrusion 700 in the opening 601;

The solder bump 700 is electrically connected to the rewiring layer 500, and is electrically connected to the pad 12 through the rewiring layer 500.

S105: cutting the ultra-thin wafer and the carrier board to form a plurality of single-chip chip packaging units;

Referring to FIG. 12, along the cutting trench 10 on the ultra-thin wafer 100, the ultra-thin wafer 100 and the carrier board 300 are cut to form a plurality of single-chip chip packaging units. In this embodiment, the specific cutting process is not limited, and the cutting process may be used, or the cutting process and the etching process layer may be used to complete the cutting. In this embodiment, the cutting process can be performed by using a knife process. The knife process can be completed in one cut, or multiple cuts, each cutting to a certain depth, and finally the ultra-thin wafer and the carrier board can be cut through. This is not limited in this embodiment.

S106: Provide a circuit board;

The specific structure of the circuit board is not limited in this embodiment, and the circuit board is used to electrically connect the single-chip package unit with an external circuit. The specific material of the circuit board is not limited in this embodiment, and the circuit board may be a PCB ( The Printed Circuit Board (printed circuit) board may also be an FPC (Flexible Printed Circuit) board. In one embodiment of the present application, it is preferably a PCB board.

S107: flip a plurality of the single-chip chips onto the circuit board, so that the solder bumps on the chip are electrically connected to the circuit board;

Referring to FIG. 13, a plurality of single-chip chips 1 are flip-chip mounted on a circuit board 800 by specifically connecting the solder bumps 700 on the single-chip chips and the circuits on the circuit board 800 by soldering or conductive glue, Thus, the functional area on the single chip is electrically connected with other external circuits. As shown in FIG. 14, it is a schematic plan view of a plurality of single-chip chips flip-chip mounted on a circuit board.

S108: covering a first adhesive tape, the first adhesive tape is bonded to the top surface of the carrier board and the circuit board;

After all the single-chip chips are flip-chip mounted on the circuit board, the first adhesive tape is covered on the top surface of the carrier board. Please refer to FIG. 15, that is, after the single chip is flip-chip mounted on the circuit board 800, the first surface of the single chip is also bonded with the carrier board 300, and after the first tape 900 covers the chip array, it is adhered to the carrier board 300 Knot.

It should be noted that the specific material of the first adhesive tape is not limited in this embodiment. In order to facilitate subsequent debonding of the carrier board 300 and the ultra-thin wafer 100 using light, in this embodiment, the first adhesive tape may be a transparent adhesive tape. The material may be the same as or different from the material of the second tape, which is not limited in this embodiment.

As shown in FIG. 16, it is a schematic view of the top structure of the circuit board after covering the first tape 900; since the first tape is a flexible material, the area between the two adjacent single-chip chips is also covered to form the first tape 900, that is An accommodating cavity is formed between the first tape 900 and the circuit board 800, thereby fixing and sealing the periphery of the single-chip chip, so as to prevent substances in the external environment from entering between the chip and the circuit board, causing pollution or damage to the chip surface .

S109: Unbond the carrier board and the multiple single-chip chips.

It should be noted that the debonding process is related to the bonding process between the ultra-thin wafer and the carrier board described above. In this embodiment, the ultra-thin wafer and the carrier board are bonded using a light-curing adhesive. Correspondingly, the unbonding the carrier board and the multiple single-chip chips may specifically include:

The side of the carrier board is irradiated with laser, and the UV adhesive is unbonded between the carrier board and the chip through the first adhesive tape and the carrier board.

That is, since the materials of the carrier board and the first adhesive tape are both transparent materials. The UV light can remove the tackiness of the UV adhesive between the carrier plate and the ultra-thin wafer through the first tape and the carrier plate, thereby removing the bonding force between the ultra-thin wafer and the first tape, which is convenient for subsequent use.

It should be noted that in this embodiment, after the TSV wafer manufacturing process of the ultra-thin wafer, it needs to be externally transported to a subsequent manufacturer for subsequent processes, and the chip packaged by the ultra-thin incoming packaging method provided in the embodiment of the present application It also includes the carrier board, the first tape and the circuit board. However, since the bonding force between the ultra-thin wafer of the chip and the carrier board has been removed, after transportation, when the subsequent process is required, it is only necessary to tear off the first tape, which bonds the carrier Board, separating the carrier board from the chip.

Referring to FIG. 17, the first adhesive tape 900 can be directly peeled off from the circuit board. In the process of tearing off the first adhesive tape 900, since the bonding force between the chip electrically connected to the carrier board 300 and the circuit board 800 has been removed, the carrier board 300 is taped by the adhesion of the first adhesive tape 900 From the circuit board 800.

The ultra-thin incoming packaging method provided by the present application includes: providing ultra-thin wafers, forming a carrier board by temporarily bonding on the ultra-thin wafers, and then flipping the ultra-thin wafers after bonding the carrier board on the circuit board On the last, cover with a first layer of adhesive tape for subsequent transportation. In this packaging method, a single chip is formed in the ultra-thin wafer process, and then flipped onto the circuit board and covered with the first tape, then the carrier board and the ultra-thin wafer are unbonded, and the first tape and the circuit board are accommodated The cavity is used for accommodating single-chip chips, so as to provide protection for the single-chip chips during transportation. In subsequent use, the carrier tape can be taken away from the circuit board while tearing off the first adhesive tape, so that the subsequent process can be conveniently performed. That is, the bonding carrier board reduces the risk of ultra-thin incoming materials being prone to warping or even breaking during the wafer manufacturing process. At the same time, it can protect the single chip during transportation, and subsequent use does not affect other processes. get on.

An embodiment of the present application also provides a packaging structure, which is formed using the ultra-thin incoming packaging method described in the above embodiment, please refer to FIG. 18, which is a schematic diagram of a packaging structure provided by an embodiment of the present application; the packaging The structure includes:

A circuit board 800, the circuit board 800 includes a plurality of circuit structures, and a cutting path 80 is provided between two adjacent circuit structures;

Multiple chips 1, one chip 1 is electrically connected to one of the circuit structures;

A carrier board 300 located on each chip 1 facing away from the circuit board 800;

A first adhesive tape 900 covering the carrier plate 300 and the cutting lane 80 is bonded to the carrier plate 300 and the cutting lane 80.

It should be noted that, in the packaging structure provided in this embodiment, it is not limited whether the bonding force between the carrier board 300 and the chip 1 has been removed, that is, the carrier board 300 and the chip 1 may also be unbonded or pass through. The debonding process is not limited in this embodiment. If there is no debonding process between the carrier board 300 and the chip 1, a debonding process can be performed at a downstream manufacturer, and then the first tape is peeled off for subsequent processes, such as high temperature deposition, etching, photolithography, curing, electroplating, and chemical Processes such as cleaning; if the debonding process has been performed between the carrier board 300 and the chip 1, the first tape can be directly torn off at the downstream manufacturer, and then the subsequent process can be performed.

An embodiment of the present application provides an ultra-thin incoming packaging structure. The packaging structure includes a circuit board, a plurality of chips, a carrier board, and a first adhesive tape covering a cutting path between the carrier board and adjacent chips. Since the packaging structure forms a receiving cavity between the first adhesive tape and the circuit board, multiple chips are packaged together, and there is also a carrier board to protect the chips, which can avoid warping of ultra-thin incoming materials during transportation And rupture, protect the transportation of the chip. At the same time, in the subsequent use process, directly tearing off the first adhesive tape can take away from the carrier board, thereby directly performing subsequent processes on the chips on the circuit board, and finally cutting the circuit board into a single structure along the cutting path of the circuit board.

The ultra-thin incoming packaging method provided by the embodiment of the present application, because in this packaging method, a single chip is formed in the ultra-thin wafer process, and then flipped onto the circuit board and covered with the first tape, then the carrier board and the ultra-thin are unbonded A receiving cavity is formed between the wafer, the first adhesive tape and the circuit board, and is used to receive a single chip, so as to provide protection for the single chip during transportation. In subsequent use, the carrier tape can be taken away from the circuit board while tearing off the first adhesive tape, so that the subsequent process can be conveniently performed. That is, the bonding carrier board reduces the risk of ultra-thin incoming materials being prone to warping or even breaking during the wafer manufacturing process. At the same time, it can protect the single chip during transportation, and subsequent use does not affect other processes. get on.

It should be noted that the embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same and similar parts between the embodiments refer to each other. can.

It should also be noted that in this article, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these entities or operations There is any such actual relationship or order. Moreover, the terms "including", "comprising" or any other variant thereof are intended to cover non-exclusive inclusions, such that an article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, Or it also includes elements inherent to such articles or equipment. Without more restrictions, the element defined by the sentence "include one ..." does not exclude that there are other identical elements in the article or device that includes the above elements.

Claims

An ultra-thin incoming packaging method, including:

An ultra-thin wafer is provided. The ultra-thin wafer includes a first surface and a second surface that are disposed oppositely. The first surface of the ultra-thin wafer has a plurality of functional regions arranged in an array, two adjacent There are cutting channels between the functional areas, and the first surface includes a plurality of bonding pads electrically connected to the functional areas;

Bonding a carrier board on the first surface of the ultra-thin wafer;

Forming a plurality of through holes on the second surface of the ultra-thin wafer to expose the bonding pad;

Forming a plurality of solder bumps on the second surface of the ultra-thin wafer, the solder bumps are electrically connected to the solder pads;

Cutting the ultra-thin wafer and the carrier board to form a plurality of single-chip chip packaging units;

Provide circuit board;

Flipping a plurality of the single-chip chips onto the circuit board so that the solder bumps on the single-chip chips are electrically connected to the circuit board;

Covering the first tape, the first tape is bonded to the top surface of the carrier board and the circuit board;

Unbonding the carrier board and the plurality of single-chip chips.
The ultra-thin incoming packaging method according to claim 1, wherein the providing of the ultra-thin wafer specifically includes:

An ultra-thin wafer with a second tape is provided, the second tape adheres to the second surface of the ultra-thin wafer, and a metal ring is further provided on the edge of the second tape.
The ultra-thin incoming packaging method according to claim 2, wherein after providing the ultra-thin wafer with the second tape, and before bonding the carrier board on the first surface of the ultra-thin wafer, include:

Temporarily bonding the carrier board on the first surface of the ultra-thin wafer with the second tape;

Using the edge of the ultra-thin wafer as a cutting line, the second adhesive tape, the ultra-thin wafer and the carrier board are cut out to obtain a temporary bonding structure, and the metal ring and the excess second adhesive tape are removed.
The ultra-thin incoming packaging method according to claim 3, wherein the bonding of the carrier board on the first surface of the ultra-thin wafer specifically includes:

Bonding the ultra-thin wafer and the carrier board in the temporary bonding structure;

Remove the second tape.
The ultra-thin incoming packaging method according to claim 4, wherein the carrier board is a transparent carrier board.
The ultra-thin incoming packaging method according to claim 5, wherein the temporarily bonding the carrier board to the first surface of the ultra-thin wafer with the second adhesive tape is specifically:

Applying a light-curing adhesive to the first surface of the ultra-thin wafer with the second tape;

The carrier board is bonded to the first surface of the ultra-thin wafer with the second adhesive tape through the photo-curable adhesive.
The ultra-thin incoming packaging method according to claim 6, wherein the light-curing adhesive is a UV adhesive.
The ultra-thin incoming packaging method according to claim 7, wherein the bonding of the ultra-thin wafer and the carrier board in the temporary bonding structure specifically includes:

Using ultraviolet light to irradiate the bearing plate side of the temporary bonding structure;

The UV adhesive is cured so that the first surface of the ultra-thin wafer in the temporary bonding structure is bonded to the carrier board.
The ultra-thin incoming packaging method according to claim 8, wherein the first adhesive tape is a transparent adhesive tape, and the unbonding the carrier board and the plurality of single-chip chips specifically include:

The side of the carrier board is irradiated with laser, and the UV adhesive is unbonded between the carrier board and the chip through the first adhesive tape and the carrier board.
The ultra-thin incoming package method according to claim 1, wherein the forming of a plurality of through holes on the second surface of the ultra-thin wafer to expose the solder pad specifically includes:

Performing etching treatment on the position of the second surface of the ultra-thin wafer corresponding to the bonding pad to expose the bonding pad.
The ultra-thin incoming package method according to claim 10, characterized in that an etching process is performed on the second surface of the ultra-thin wafer corresponding to the pad to expose the solder After the mat also includes:

Forming an insulating layer, the insulating layer covering the second surface of the ultra-thin wafer and the insulating layer covering the sidewall of the through hole, and exposing the bottom surface of the through hole;

Forming a rewiring layer on the insulating layer, the rewiring layer is connected to the pad at the bottom of the through hole;

Forming a solder resist layer covering the rewiring layer and the insulating layer;

An opening is formed on the solder resist layer.
The ultra-thin incoming packaging method according to claim 11, wherein the plurality of solder bumps are formed on the second surface of the ultra-thin wafer, and the solder bumps are electrically connected to the solder pads. Sexual connection, including:

Forming a welding protrusion in the opening;

The solder bump is electrically connected to the rewiring layer, and is electrically connected to the pad through the rewiring layer.
The ultra-thin incoming packaging method according to claim 1, further comprising:

The first adhesive tape is torn away, the first adhesive tape bonds the carrier board, and the carrier board is separated from the chip.
A packaging structure is formed by the ultra-thin incoming packaging method according to any one of claims 1-13, and the packaging structure includes:

A circuit board, the circuit board includes a plurality of circuit structures, and a cutting channel is provided between two adjacent circuit structures;

Multiple chips, one chip is electrically connected to one of the circuit structures;

A bearing board located on each chip away from the circuit board;

A first adhesive tape covering the carrier board and the cutting lane, the first adhesive tape being bonded to the carrier board and the cutting lane.