WO2020088860A1 - A clip-on pin system for improving soldering performance in electronic cards - Google Patents

A clip-on pin system for improving soldering performance in electronic cards Download PDF

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Publication number
WO2020088860A1
WO2020088860A1 PCT/EP2019/076354 EP2019076354W WO2020088860A1 WO 2020088860 A1 WO2020088860 A1 WO 2020088860A1 EP 2019076354 W EP2019076354 W EP 2019076354W WO 2020088860 A1 WO2020088860 A1 WO 2020088860A1
Authority
WO
WIPO (PCT)
Prior art keywords
pin
clip
circuit component
onto
circuit
Prior art date
Application number
PCT/EP2019/076354
Other languages
French (fr)
Inventor
Ibrahim DEMIREL
Emrah Mustafa HOSCOSKUN
Ridvan YUKSEL
Gizem MISIRLI
Caglar Henden
Original Assignee
Arcelik Anonim Sirketi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arcelik Anonim Sirketi filed Critical Arcelik Anonim Sirketi
Publication of WO2020088860A1 publication Critical patent/WO2020088860A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole

Definitions

  • the present invention relates to clip-on pin configurations for improving soldering performance of components mounted onto the electronic cards.
  • PCB printed circuit boards
  • the PCB is composed of surfaces whereon the electronic circuit components are mounted and copper tracks which connect said components to each other.
  • the electronic circuit components are mounted onto the printed circuit boards by using two types of technologies. These are through hole technology (THT) (Dotted PCB) and surface mount technology (SMT).
  • THT through hole technology
  • SMT surface mount technology
  • the components mounted onto the printed circuit board are directly soldered onto the surface they are placed on.
  • the through hole technology is the conventional production method.
  • the pins of the electronic circuit components are inserted through the holes on the printed circuit board and soldered at the other side of the board.
  • a state of the art patent publication can be referred to as WO2016070545.
  • Said patent publication discloses A PCB package bonding pad structure regarding a double row pin device, comprising a PCB board.
  • the PCB board is provided with a double row bonding pad which is in an oval shape, and is provided with a circular drill hole; the center of the circle of the circular drill hole is located on a long axis of the bonding pad and deviates towards the bonding pad.
  • the periphery of the bonding pad is also provided with a solder resistance bridge and said solder resistance bridge matches the periphery of the bonding pad.
  • a routing not longer than 5 millimeters can be led between two bonding pads when wiring, thereby greatly saving space.
  • said invention can avoid narrow slope pad of the bonding pad, avoid a solder-connected short circuit between two pins, and may not generate false welding and device fall-off during welding.
  • mispositioning of the components placed by the THT may cause play and adversely affect the soldering performance.
  • the system of the present invention relates to prevent dislocations which may occur during the soldering of the circuit components so as to improve the soldering performance.
  • the aim of the present invention is the realization of a holding unit which is applied to the pins of the components in order to fix the circuit components onto the circuit board.
  • Another aim of the present invention is to prevent the circuit components from moving during the soldering process so as to improve the soldering performance.
  • Figure 1 - is the general view of a circuit component in an embodiment of the present invention.
  • Figure 2 - is the front and sideways view of the clip-on pin structure of the circuit component in an embodiment of the present invention.
  • Figure 3A - is the view of the initial position before the clip-on pin structure of the circuit component is mounted in an embodiment of the present invention.
  • Figure 3B - is the view of the position after the clip-on pin structure of the circuit component is mounted in an embodiment of the present invention.
  • Figure 4 - is the flow chart showing the formation of the clip-on pin of the circuit component in an embodiment of the present invention.
  • the circuit board (3) of the present invention generally comprises at least one pin housing (7) and at least one pin (6) mounted into said pin housings (7).
  • Pins (6) of the circuit components placed onto said circuit board (3) protrude from a circuit component (1), thus enabling said components to be mounted onto the circuit board (3).
  • a generic version of said circuit component (1) is shown in Figure 1.
  • a different pin (6) structure is provided on said pin (6) so as to allow a clip (4) to move.
  • Said pin (6) is connected to said clip (4) in a manner to allow the clip (4) to move.
  • Said clip (4) is fixed onto said pin (6) at the center thereof, thus allowing radial movement.
  • the movement of said clip (4) enables said circuit component (1) to be fixed onto said circuit board (3).
  • Said clip (4) structure comprises a clip lock (8) and a clip claw (5).
  • At least one pin opening (2) is provided on said pin (6) where said clip lock (8) and said clip claw (5) interact with each other.
  • Said clip lock (8) is inserted through one of said pin openings (2) and locked, thus preventing the clip (4) from moving.
  • Said clip claw (5) is inserted through one of said pin openings (2) and grip onto said circuit board (3), thus preventing the movement of said circuit component.
  • Said circuit components (1) can be a passive or active circuit component.
  • any circuit component (1) having pins (6) such as resistor, capacitor, coil, diode, transistor, integrated circuit, LED, etc. is without the scope of the present invention.
  • a circuit component (1) configuration which has at least one pin (6) which can be placed onto a circuit board (3) with at least one pin housing (7) suitable for the placement of at least one pin (6).
  • the circuit component (1) comprises a clip (4) which enables the same to be locked onto said circuit board (3) and which is fixed so as to move over said pin (6).
  • said pin (6) comprises a pin (4) which is fixed therein with two ends free so as to make angular movement.
  • said clip (4) comprises a protrusion-shaped clip claw (5) which can hold onto the lower surface of said circuit board (3).
  • said clip (4) comprises a clip lock (8) which locks onto said pin (6) so as to prevent the same from moving.
  • said pin (6) comprises at least one pin opening (2) wherein said clip lock (8) is inserted so as to be locked and through which said clip claw (5) passes so as to hold onto said circuit board (3).
  • said circuit component (1) is a passive circuit component.
  • said circuit component (1) is an active circuit component.
  • the circuit components (1) can be properly placed and locked onto the board by means of the clips (4), thus improving the soldering performance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The present invention relates to clip-on pin configurations for improving soldering performance of components mounted onto the electronic cards. The present invention particularly relates to, in a circuit component (1) comprising at least one pin (6) which can be placed onto a circuit board (3) with at least one pin housing (7) suitable for the placement of at least one pin (6), a clip (4) which enables the same to be locked onto said circuit board (3) and which is fixed so as to move over said pin (6).

Description

A CLIP-ON PIN SYSTEM FOR IMPROVING SOLDERING PERFORMANCE IN ELECTRONIC CARDS
Technical Field of the Present Invention
The present invention relates to clip-on pin configurations for improving soldering performance of components mounted onto the electronic cards.
Prior Art
In accordance with the needs of the consumers and developments in technology, electronic devices become smaller day by day and are produced by using different technologies. Surface mount technology is used in a large number of devices produced nowadays. Electronic components used in the surface mount technology has smaller dimensions and different physical structures although they perform the same functions.
All the electronic devices such as cell phone, laptop computers, television, etc. have one or more electronic cards called printed circuit boards (PCB). The PCB is composed of surfaces whereon the electronic circuit components are mounted and copper tracks which connect said components to each other. The electronic circuit components are mounted onto the printed circuit boards by using two types of technologies. These are through hole technology (THT) (Dotted PCB) and surface mount technology (SMT).
In the surface mount technology (SMT), the components mounted onto the printed circuit board are directly soldered onto the surface they are placed on.
The through hole technology (THT) is the conventional production method. The pins of the electronic circuit components are inserted through the holes on the printed circuit board and soldered at the other side of the board.
A state of the art patent publication can be referred to as WO2016070545. Said patent publication discloses A PCB package bonding pad structure regarding a double row pin device, comprising a PCB board. The PCB board is provided with a double row bonding pad which is in an oval shape, and is provided with a circular drill hole; the center of the circle of the circular drill hole is located on a long axis of the bonding pad and deviates towards the bonding pad. The periphery of the bonding pad is also provided with a solder resistance bridge and said solder resistance bridge matches the periphery of the bonding pad. A routing not longer than 5 millimeters can be led between two bonding pads when wiring, thereby greatly saving space. Moreover, said invention can avoid narrow slope pad of the bonding pad, avoid a solder-connected short circuit between two pins, and may not generate false welding and device fall-off during welding.
On the other hand, mispositioning of the components placed by the THT may cause play and adversely affect the soldering performance.
In other words, the system of the present invention relates to prevent dislocations which may occur during the soldering of the circuit components so as to improve the soldering performance.
Aims of the Present Invention
The aim of the present invention is the realization of a holding unit which is applied to the pins of the components in order to fix the circuit components onto the circuit board.
Another aim of the present invention is to prevent the circuit components from moving during the soldering process so as to improve the soldering performance.
Brief Explanation of Figures
A product realized in order to attain the aim of the present invention is illustrated in the attached figures, which are briefly explained below.
The technical drawings attached to the present description should not be used alone in the interpretation of the scope of protection of the invention without reference to the description. On the other hand, the attached technical drawings should be used to determine the scope of protection described in the claims of the present invention and to interpret and not to delimit it.
The attached figures do not refer to the absolute dimensions of the product unless otherwise specified and the proportions of the opposing sections do not reflect the actual product one to one.
Figure 1 - is the general view of a circuit component in an embodiment of the present invention.
Figure 2 - is the front and sideways view of the clip-on pin structure of the circuit component in an embodiment of the present invention.
Figure 3A - is the view of the initial position before the clip-on pin structure of the circuit component is mounted in an embodiment of the present invention.
Figure 3B - is the view of the position after the clip-on pin structure of the circuit component is mounted in an embodiment of the present invention.
Figure 4 - is the flow chart showing the formation of the clip-on pin of the circuit component in an embodiment of the present invention.
Detailed Description of the Invention
The elements illustrated in the figures are numbered as follows:
1) Circuit component
2) Pin opening
3) Circuit board
4) Clip
5) Clip claw
6) Pin
7) Pin housing
8) Clip lock
The circuit board (3) of the present invention generally comprises at least one pin housing (7) and at least one pin (6) mounted into said pin housings (7). Pins (6) of the circuit components placed onto said circuit board (3) protrude from a circuit component (1), thus enabling said components to be mounted onto the circuit board (3). A generic version of said circuit component (1) is shown in Figure 1.
As shown in Figure 2, a different pin (6) structure is provided on said pin (6) so as to allow a clip (4) to move. Said pin (6) is connected to said clip (4) in a manner to allow the clip (4) to move. Said clip (4) is fixed onto said pin (6) at the center thereof, thus allowing radial movement. The movement of said clip (4) enables said circuit component (1) to be fixed onto said circuit board (3). Said clip (4) structure comprises a clip lock (8) and a clip claw (5). At least one pin opening (2) is provided on said pin (6) where said clip lock (8) and said clip claw (5) interact with each other. Said clip lock (8) is inserted through one of said pin openings (2) and locked, thus preventing the clip (4) from moving. Said clip claw (5) is inserted through one of said pin openings (2) and grip onto said circuit board (3), thus preventing the movement of said circuit component.
As shown in Figure 3, when the circuit component (1) having the pin (6) with the clip (4) is placed onto the circuit board (3), the lower surface of the circuit board (3) pushes the moving clip lock (8) on said pin (6) remaining on the upper surface of the circuit board (3) in the vertical axis in a direction opposite to the placement of the circuit component (1). The clip claw (5) which is the other moving part of said clip (4) bears against the lower surface of the circuit board (3), thus providing the locking. During said movement, the clip claw (5) and the clip lock (8) are aligned with the pin openings (2) on the pin (6). With this alignment, the circuit components (1) are prevented from moving in the vertical and horizontal axes, thus improving the soldering performance. Figure 4 shows the flow chart of said process.
Said circuit components (1) can be a passive or active circuit component. For example, any circuit component (1) having pins (6) such as resistor, capacitor, coil, diode, transistor, integrated circuit, LED, etc. is without the scope of the present invention.
In an embodiment of the present invention, a circuit component (1) configuration is provided, which has at least one pin (6) which can be placed onto a circuit board (3) with at least one pin housing (7) suitable for the placement of at least one pin (6).
In another embodiment of the present invention, the circuit component (1) comprises a clip (4) which enables the same to be locked onto said circuit board (3) and which is fixed so as to move over said pin (6).
In another embodiment of the present invention, said pin (6) comprises a pin (4) which is fixed therein with two ends free so as to make angular movement.
In another embodiment of the present invention, said clip (4) comprises a protrusion-shaped clip claw (5) which can hold onto the lower surface of said circuit board (3).
In another embodiment of the present invention, said clip (4) comprises a clip lock (8) which locks onto said pin (6) so as to prevent the same from moving.
In another embodiment of the present invention, said pin (6) comprises at least one pin opening (2) wherein said clip lock (8) is inserted so as to be locked and through which said clip claw (5) passes so as to hold onto said circuit board (3).
In another embodiment of the present invention, said circuit component (1) is a passive circuit component.
In another embodiment of the present invention, said circuit component (1) is an active circuit component.
By means of the present invention, in the perforated electronic cards the circuit components (1) can be properly placed and locked onto the board by means of the clips (4), thus improving the soldering performance.

Claims (7)

  1. A circuit component (1) comprising at least one pin (6) which can be placed onto a circuit board (3) with at least one pin housing (7) suitable for the placement of at least one pin (6), characterized by
    a clip (4) which enables the same to be locked onto said circuit board (3) and which is fixed so as to move over said pin (6).
  2. A circuit component (1) as in Claim 1, characterized by a clip (4) which is fixed in said pin (6) with two ends free so as to make angular movement.
  3. A circuit component (1) as in Claim 1 or 2, characterized by said clip (4) comprising a protrusion-shaped clip claw (5) which can hold onto the lower surface of said circuit board (3).
  4. A circuit component (1) as in Claim 1 or 2, characterized by said clip (4) comprising a clip lock (8) which locks onto said pin (6) so as to prevent the same from moving.
  5. A circuit component (1) as in Claim 1, 3 or 4, characterized by said pin (6) comprising at least one pin opening (2) wherein said clip lock (8) is inserted so as to be locked and through which said clip claw (5) passes so as to hold onto said circuit board (3).
  6. A circuit component (1) as in Claim 1, which is a passive circuit component.
  7. A circuit component (1) as in Claim 1, which is an active circuit component.
PCT/EP2019/076354 2018-10-31 2019-09-30 A clip-on pin system for improving soldering performance in electronic cards WO2020088860A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR2018/16269 2018-10-31
TR201816269 2018-10-31

Publications (1)

Publication Number Publication Date
WO2020088860A1 true WO2020088860A1 (en) 2020-05-07

Family

ID=68138057

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Application Number Title Priority Date Filing Date
PCT/EP2019/076354 WO2020088860A1 (en) 2018-10-31 2019-09-30 A clip-on pin system for improving soldering performance in electronic cards

Country Status (1)

Country Link
WO (1) WO2020088860A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4362353A (en) * 1980-05-27 1982-12-07 Amp Incorporated Contact clip for connecting a ceramic substrate to a printed circuit board
FR2925822A1 (en) * 2007-12-24 2009-06-26 Johnson Controls Tech Co Electrical and/or electronic element i.e. actuator, connecting device for automobile field, has fixed and mobile parts ensuring locking of device on printed circuit board and electrical connection between element and terminal of board
WO2016070545A1 (en) 2014-11-05 2016-05-12 田艺儿 Pcb package bonding pad structure regarding double row pin device
DE202017104268U1 (en) * 2017-07-18 2018-07-20 HKR Seuffer Automotive GmbH & Co. KG fuse element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4362353A (en) * 1980-05-27 1982-12-07 Amp Incorporated Contact clip for connecting a ceramic substrate to a printed circuit board
FR2925822A1 (en) * 2007-12-24 2009-06-26 Johnson Controls Tech Co Electrical and/or electronic element i.e. actuator, connecting device for automobile field, has fixed and mobile parts ensuring locking of device on printed circuit board and electrical connection between element and terminal of board
WO2016070545A1 (en) 2014-11-05 2016-05-12 田艺儿 Pcb package bonding pad structure regarding double row pin device
DE202017104268U1 (en) * 2017-07-18 2018-07-20 HKR Seuffer Automotive GmbH & Co. KG fuse element

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