WO2020087675A1 - 蓝牙天线和蓝牙设备 - Google Patents
蓝牙天线和蓝牙设备 Download PDFInfo
- Publication number
- WO2020087675A1 WO2020087675A1 PCT/CN2018/120874 CN2018120874W WO2020087675A1 WO 2020087675 A1 WO2020087675 A1 WO 2020087675A1 CN 2018120874 W CN2018120874 W CN 2018120874W WO 2020087675 A1 WO2020087675 A1 WO 2020087675A1
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- WIPO (PCT)
- Prior art keywords
- antenna
- bluetooth
- main board
- board
- flexible circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/10—Resonant antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
- H01Q5/321—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors within a radiating element or between connected radiating elements
Definitions
- the invention relates to the technical field of antennas, in particular to a Bluetooth antenna and a Bluetooth device using the Bluetooth antenna.
- Bluetooth products In recent years, the development of wireless technology has brought great convenience to people's lives. Among them, all kinds of Bluetooth products using Bluetooth technology are deeply loved by people. At present, many Bluetooth products have a trend of miniaturization and portability, which also brings about the design problems of Bluetooth antennas in narrow spaces. At present, most Bluetooth antennas use ceramic antennas as radiators. Although they can meet a certain degree of Bluetooth transmission requirements, their efficiency is generally low.
- the main purpose of the present invention is to provide a Bluetooth antenna, which aims to improve the efficiency of the ceramic antenna.
- the Bluetooth antenna proposed by the present invention includes:
- a second main board, the second main board is disposed opposite to the first main board, and is electrically connected to the first main board;
- a ceramic antenna is disposed on a side of the second main board facing away from the first main board, and is disposed opposite to the second main board, and the ceramic antenna is electrically connected to the first main board;
- a flexible circuit board is protrudingly arranged on the surface of the second main board facing away from the first main board, and is located outside the clamping area of the ceramic antenna and the second main board
- the circuit board is electrically connected to the second main board.
- the surface of the flexible circuit board is opposite to the side surface of the ceramic antenna.
- the height of the flexible circuit board protruding from the surface of the second motherboard does not exceed the height of the ceramic antenna protruding from the surface of the second motherboard.
- the length of the flexible circuit board extending along the board surface of the second main board is defined as L, 25mm ⁇ L ⁇ 50mm;
- the height of the flexible circuit board protruding from the surface of the second motherboard is H, and 3mm ⁇ H ⁇ 6mm.
- the area of the first main board is larger than the area of the second main board.
- the Bluetooth antenna further includes a Bluetooth chip, and the Bluetooth chip is provided on the first motherboard.
- the ceramic antenna is electrically connected to the first main board through a flexible board.
- the flexible board includes a radio frequency signal line and a ground line, the radio frequency signal line and the ground line form a microstrip line, and the radio frequency signal line is electrically connected to the ceramic antenna and the first motherboard .
- the ceramic antenna is a monopole antenna.
- the invention also proposes a Bluetooth device.
- the Bluetooth device includes a Bluetooth antenna.
- the Bluetooth antenna includes:
- a second main board, the second main board is disposed opposite to the first main board, and is electrically connected to the first main board;
- a ceramic antenna the ceramic antenna is disposed on a side of the second main board facing away from the first main board, and is disposed opposite to the second main board, the ceramic antenna is electrically connected to the first main board;
- a flexible circuit board the flexible circuit board is protrudingly arranged on the surface of the second main board facing away from the first main board, and is located outside the clamping area of the ceramic antenna and the second main board, the flexible The circuit board is electrically connected to the second main board.
- the Bluetooth antenna of the present invention while using the ceramic antenna as a radiator, further introduces a flexible circuit board as an auxiliary radiator, and the coupling effect of the two radiators effectively improves the efficiency of the ceramic antenna.
- Related data shows that the efficiency of a simple ceramic antenna is only about 10%, and the Bluetooth antenna of the present invention can make the efficiency of the ceramic antenna reach more than 40%. That is, the Bluetooth antenna of the present invention can achieve higher antenna efficiency in ultra-small Bluetooth devices by coupling a flexible circuit board with a ceramic antenna.
- the Bluetooth antenna of the present invention realizes the flexible design of the ceramic antenna; moreover, the resonance frequency can be controlled by flexibly designing the size of the coupling capacitor between the flexible circuit board and the ceramic antenna; at the same time, it can also be designed flexibly
- the size of the coupling capacitor between the first motherboard and the second motherboard moves the useless parallel resonance out of band or even above 3.5GHz; in addition, flexible design of flexible circuit boards or selection of ceramic antennas with higher equivalent inductance can also be used. Both the parallel resonance and the series resonance resonate in the Bluetooth frequency band, and become a wide-band Bluetooth antenna.
- FIG. 1 is a schematic structural diagram of an embodiment of a Bluetooth antenna of the present invention
- FIG. 2 is a working principle diagram of the Bluetooth antenna in Figure 1;
- FIG. 3 is an equivalent schematic diagram of the Bluetooth antenna in Figure 2;
- Fig. 4 is a return loss diagram of the Bluetooth antenna in Fig. 1.
- Label name 100 Bluetooth antenna 31 side 10 First motherboard 40 Flexible circuit board 20 Second motherboard 41 Board surface 30 Ceramic antenna 50 Soft board
- first, second, etc. in the present invention are for descriptive purposes only, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated.
- the features defined with “first” and “second” may include at least one of the features either explicitly or implicitly.
- the meaning of “plurality” is at least two, such as two, three, etc., unless specifically defined otherwise.
- connection and “fixed” should be understood in a broad sense.
- “fixed” may be a fixed connection, a detachable connection, or integrated; It is a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediary. It can be the connection between two elements or the interaction between two elements, unless otherwise clearly defined.
- the present invention proposes a Bluetooth antenna 100, which can be applied to a Bluetooth device and can improve the efficiency of the ceramic antenna 30.
- the Bluetooth antenna 100 includes:
- the first motherboard 10 The first motherboard 10;
- a second motherboard 20, the second motherboard 20 is disposed opposite to the first motherboard 10, and is electrically connected to the first motherboard 10;
- a ceramic antenna 30, the ceramic antenna 30 is disposed on a side of the second motherboard 20 facing away from the first motherboard 10, and is disposed opposite to the second motherboard 20, the ceramic antenna 30 and the first The motherboard 10 is electrically connected;
- a flexible circuit board 40, the flexible circuit board 40 is protrudingly disposed on a surface of the second main board 20 facing away from the first main board 10, and is located in a clamping area of the ceramic antenna 30 and the second main board 20 In addition, the flexible circuit board 40 is electrically connected to the second main board 20.
- the first motherboard 10 is arranged horizontally, that is, the surface of the first motherboard 10 is parallel to the horizontal plane.
- the second main board 20 is located above the first main board 10 and spaced apart from the first main board 10; and, the second main board 20 is also horizontally arranged, that is, the second main board 20 is parallel to the first main board 10. At this time, the second motherboard 20 and the first motherboard 10 are electrically connected through the transmission line.
- the ceramic antenna 30 is located above the second main board 20 and is spaced apart from the second main board 20; and the ceramic antenna 30 is also arranged horizontally, that is, the ceramic antenna 30 is arranged parallel to the second main board 20. At this time, the ceramic antenna 30 and the first motherboard 10 are electrically connected by a transmission line.
- the transmission line may be a simple wire body with a signal transmission function or a flexible board (for example, a flexible circuit board), and the flexible board includes a wire body with a signal transmission function.
- a flexible circuit board 40 is convexly formed on the upper surface of the second main board 20, and the flexible circuit board 40 is located outside the clamping area between the ceramic antenna 30 and the second main board 20.
- the flexible circuit board 40 is generally elongated, and the width of the flexible circuit board 40 extends in the same direction as the vertical direction defined in this embodiment, and the length of the flexible circuit board 40 extends in the same direction as the front and rear directions defined in this embodiment. 41 is provided facing the ceramic antenna 30.
- the ceramic antenna 30 and the flexible circuit board 40 form a coupling capacitor C1
- the ceramic antenna 30 and the second main board 20 form a coupling capacitor C2
- the second main board 20 and the first main board 10 form a coupling capacitor C3.
- the coupling capacitor C3 is larger than the coupling capacitor C2.
- the size of the coupling capacitor C1 can be adjusted by the distance between the flexible circuit board 40 and the ceramic antenna 30 and the width of the flexible circuit board 40.
- the ceramic antenna 30 is equivalent to the inductance L1
- the flexible circuit board 40 is equivalent to the inductance L2.
- the coupling capacitance of the ceramic antenna 30 and the first main board 10 and the second main board 20 is C2 + C3. Therefore, the resonance that the entire system can produce includes a series resonance and a parallel resonance,
- the resonance frequency f1 of the serial resonance of the Bluetooth antenna 100 of the present invention is between 2.4 GHz and 2.5 GHz, and the resonance frequency f2 of the parallel resonance of the Bluetooth antenna 100 of the present invention is about 3 GHz. Therefore, when the Bluetooth antenna 100 of the present invention is applied to Bluetooth transmission, series resonance can be utilized.
- the advantages of the Bluetooth antenna 100 of the present invention are:
- the Bluetooth antenna 100 of the present invention while using the ceramic antenna 30 as a radiator, further introduces a flexible circuit board 40 as an auxiliary radiator, and the coupling effect of the two radiators effectively improves the efficiency of the ceramic antenna 30.
- the efficiency of the simple ceramic antenna 30 is only about 10%, and the Bluetooth antenna 100 of the present invention can make the efficiency of the ceramic antenna 30 reach more than 40%. That is, the Bluetooth antenna 100 of the present invention can achieve higher antenna efficiency in ultra-small Bluetooth devices by coupling the flexible circuit board 40 with the ceramic antenna 30.
- the Bluetooth antenna 100 of the present invention realizes the flexible design of the ceramic antenna 30; and, by flexibly designing the size of the coupling capacitance between the flexible circuit board 40 and the ceramic antenna 30, the resonance frequency can be controlled; at the same time, The size of the coupling capacitor between the first motherboard 10 and the second motherboard 20 can be flexibly designed to move the useless parallel resonance out of band or even above 3.5 GHz; in addition, the flexible circuit board 40 can be flexibly designed or an equivalent can be selected The ceramic antenna 30 with higher inductance makes both the parallel resonance and the series resonance resonate in the Bluetooth frequency band, and becomes a wide-bandwidth Bluetooth antenna 100.
- the flexible circuit board 40 may be a connecting device of the second motherboard 20, such as a functional flexible circuit board 40 such as a MIC or a battery.
- the board surface 41 of the flexible circuit board 40 is disposed opposite to the side surface 31 of the ceramic antenna 30. Specifically, the board surface 41 of the flexible circuit board 40 is disposed parallel to the side surface 31 of the ceramic antenna 30. In this way, the stability of the coupling effect between the flexible circuit board 40 and the ceramic antenna 30 can be effectively enhanced, the coupling amount of the flexible circuit board 40 and the ceramic antenna 30 can be guaranteed, and the consistency of the Bluetooth antenna 100 can be improved, thereby optimizing the operation of the Bluetooth antenna 100 Performance purpose.
- the starting position of the flexible circuit board 40 on the second main board 20 is parallel to the side surface 31 of the ceramic antenna 30, that is, the surface of the second main board 20 is used to connect between the introduction point and the output point of the flexible circuit board 40.
- the wiring is parallel to the side surface 31 of the ceramic antenna 30 to facilitate soldering and placement, and to ensure the stability of the coupling between the flexible circuit board 40 and the ceramic antenna 30.
- the height of the flexible circuit board 40 protruding from the surface of the second main board 20 does not exceed the height of the ceramic antenna 30 protruding from the surface of the second main board 20 to protect the ceramic antenna 30 from radiation main body.
- auxiliary components such as brackets and buckles that support and position can be used to limit and fix the positions of the flexible circuit board 40 and the ceramic antenna 30, so that the flexible circuit board 40 protrudes from the second motherboard 20 board
- the height of the surface does not exceed the height of the ceramic antenna 30 protruding from the surface of the second motherboard 20.
- the height of the ceramic antenna 30 is higher, and it works as a radiating body; the height of the flexible circuit board 40 is slightly lower, and it is coupled with the ceramic antenna 30 to enhance the performance of the ceramic antenna 30.
- the length of the flexible circuit board 40 extending along the board surface of the second main board 20 is defined as L, 25 mm ⁇ L ⁇ 50 mm.
- the length of the flexible circuit board 40 is between 1/4 wavelength and half a wavelength, so that the coupling ability of the Bluetooth antenna 100 and the electromagnetic wave can be effectively enhanced, so that the transmission and reception effects of the Bluetooth antenna 100 can be improved.
- the height of the flexible circuit board 40 protruding from the surface of the second main board 20 is H, and 3mm ⁇ H ⁇ 6mm. In this way, while effectively ensuring the high efficiency of the Bluetooth antenna 100 of the present invention, it can also effectively reduce the height of the Bluetooth antenna 100 of the present invention, realize the small size of the Bluetooth antenna 100, save assembly space, and reduce production costs.
- the area of the first motherboard 10 is larger than the area of the second motherboard 20.
- the energy can be transferred from the first motherboard 10 to the outside, which can effectively reduce the energy consumption of the second motherboard 20 and the transmission loss of electromagnetic energy, so that the energy conversion efficiency of the Bluetooth antenna 100 of the present invention can be effectively improved.
- the Bluetooth antenna 100 further includes a Bluetooth chip, and the Bluetooth chip is provided on the first motherboard 10.
- the length of the signal transmission path of the Bluetooth antenna 100 of the present invention can be effectively shortened, and the transmission loss of electromagnetic energy can be reduced, so that the energy conversion efficiency of the Bluetooth antenna 100 of the present invention can be effectively improved.
- the ceramic antenna 30 is electrically connected to the first motherboard 10 through a flexible board 50.
- the structure is simple, the manufacturing is convenient, and the Bluetooth antenna 100 of the present invention has a certain deformability, thereby effectively improving the structural stability of the Bluetooth antenna 100 of the present invention, and ensuring the excellent working performance of the Bluetooth antenna 100 of the present invention.
- the flexible board 50 includes a radio frequency signal line and a ground line, the radio frequency signal line and the ground line form a microstrip line, the radio frequency signal line is electrically connected to the ceramic antenna 30 and the first motherboard 10 sexual connection.
- the ground wire is drawn out from the first motherboard 10 and extends toward the ceramic antenna 30 along with the microstrip line.
- the ground wire is not electrically connected to the ceramic antenna 30. In this way, the impedance characteristic of the microstrip line 50 ⁇ is effectively guaranteed, and the transmission capability of the signal in the working frequency band is guaranteed, so that the working performance and working stability of the Bluetooth antenna 100 can be further improved.
- the second motherboard 20 is also electrically connected to the first motherboard 10 through the flexible board 50.
- the structure is simple, the manufacturing is convenient, and the Bluetooth antenna 100 of the present invention has a certain deformability, thereby effectively improving the structural stability of the Bluetooth antenna 100 of the present invention, and ensuring the excellent working performance of the Bluetooth antenna 100 of the present invention.
- the Bluetooth antenna 100 of the present invention is further provided with a plastic support (not shown) for assisting positioning, so as to enhance the structural stability of the Bluetooth antenna 100 of the present invention.
- the ceramic antenna 30 is a monopole antenna.
- the structure of the Bluetooth antenna 100 of the present invention be further simplified and optimized, making its production more convenient, but also the excellent working performance of the monopole antenna can be utilized, so that the working performance of the Bluetooth antenna 100 of the present invention can be effectively improved.
- the invention also proposes a Bluetooth device.
- the Bluetooth device includes a Bluetooth antenna 100.
- For a specific structure of the Bluetooth antenna 100 refer to the foregoing embodiment. Since this Bluetooth device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by all the technical solutions of all the foregoing embodiments, which will not be repeated here.
- Bluetooth devices include Bluetooth headsets, smart wearable devices (for example: smart watches, smart bracelets, smart glasses, etc.), mobile phones, notebook computers, tablet computers, cameras, etc.
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Abstract
本发明公开一种蓝牙天线和应用该蓝牙天线的蓝牙设备,其中,所述蓝牙天线包括:第一主板;第二主板,所述第二主板与所述第一主板相对设置,并与所述第一主板电性连接;陶瓷天线,所述陶瓷天线设于所述第二主板的背离所述第一主板的一侧,并与所述第二主板相对设置,所述陶瓷天线与所述第一主板电性连接;以及柔性电路板,所述柔性电路板凸设于所述第二主板的背离所述第一主板的板面,并位于所述陶瓷天线与所述第二主板的夹持区域之外,所述柔性电路板与所述第二主板电性连接。本发明的技术方案能够提升陶瓷天线的效率。
Description
本发明涉及天线技术领域,特别涉及一种蓝牙天线和应用该蓝牙天线的蓝牙设备。
近年来,无线技术的发展给人们的生活带来了极大的便利。其中,使用蓝牙技术的各类蓝牙产品更是深受人们喜爱。目前,许多蓝牙产品均有着小型化、便携化的发展趋势,由此也带来了狭小空间内蓝牙天线的设计问题。当下,大多数蓝牙天线均使用陶瓷天线作为辐射体,虽然能够满足一定程度的蓝牙传输需求,但是其效率普遍偏低。
上述内容仅用于辅助理解本实用新型的技术方案,并不代表承认上述内容是现有技术。
发明内容
本发明的主要目的是提供一种蓝牙天线,旨在提升陶瓷天线的效率。
为实现上述目的,本发明提出的蓝牙天线包括:
第一主板;
第二主板,所述第二主板与所述第一主板相对设置,并与所述第一主板电性连接;
陶瓷天线,所述陶瓷天线设于所述第二主板的背离所述第一主板的一侧,并与所述第二主板相对设置,所述陶瓷天线与所述第一主板电性连接;以及
柔性电路板,所述柔性电路板凸设于所述第二主板的背离所述第一主板的板面,并位于所述陶瓷天线与所述第二主板的夹持区域之外,所述柔性电路板与所述第二主板电性连接。
可选地,所述柔性电路板的板面与所述陶瓷天线的侧面相对设置。
可选地,所述柔性电路板凸起于所述第二主板板面的高度不超过所述陶瓷天线凸起于所述第二主板板面的高度。
可选地,定义所述柔性电路板沿所述第二主板的板面延伸设置的长度为L,25mm≤L≤50mm;
且/或,定义所述柔性电路板凸起于所述第二主板板面的高度为H,3mm≤H≤6mm。
可选地,所述第一主板的面积大于所述第二主板的面积。
可选地,所述蓝牙天线还包括蓝牙芯片,所述蓝牙芯片设于所述第一主板。
可选地,所述陶瓷天线通过软板与所述第一主板电性连接。
可选地,所述软板包括射频信号线和地线,所述射频信号线和所述地线形成微带线,所述射频信号线与所述陶瓷天线和所述第一主板电性连接。
可选地,所述陶瓷天线为单极天线。
本发明还提出一种蓝牙设备,该蓝牙设备包括蓝牙天线,该蓝牙天线包括:
第一主板;
第二主板,所述第二主板与所述第一主板相对设置,并与所述第一主板电性连接;
陶瓷天线,所述陶瓷天线设于所述第二主板的背离所述第一主板的一侧,并与所述第二主板相对设置,所述陶瓷天线与所述第一主板电性连接;以及
柔性电路板,所述柔性电路板凸设于所述第二主板的背离所述第一主板的板面,并位于所述陶瓷天线与所述第二主板的夹持区域之外,所述柔性电路板与所述第二主板电性连接。
本发明蓝牙天线的优势在于:
第一,本发明蓝牙天线,在将陶瓷天线作为辐射体的同时,进一步引入了柔性电路板作为辅助辐射体,两辐射体发生耦合作用,有效提高了陶瓷天线的效率。相关数据表明,单纯的陶瓷天线的效率仅为10%左右,而本发明蓝牙天线则可使得陶瓷天线的效率达到40%以上。也即,本发明蓝牙天线,通过将柔性电路板与陶瓷天线耦合使用,可在超小型蓝牙设备中实现较高的天线效率。
第二,本发明蓝牙天线,实现了陶瓷天线的灵活设计;并且,可以通过灵活设计柔性电路板与陶瓷天线之间的耦合电容的大小,来实现谐振频率的控制;同时,还可以通过灵活设计第一主板与第二主板之间的耦合电容的大小,将无用的并联谐振移到带外甚至3.5GHz以上;此外,还可通过灵活设计柔性电路板或选用等效电感更高的陶瓷天线,使并联谐振与串联谐振均谐振在蓝牙频段,而成为宽带宽蓝牙天线。
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。
图1为本发明蓝牙天线一实施例的结构示意图;
图2为图1中蓝牙天线的工作原理图;
图3为图2中蓝牙天线的等效原理图;
图4为图1中蓝牙天线的回波损耗图。
附图标号说明:
| 标号 | 名称 | 标号 | 名称 |
| 100 | 蓝牙天线 | 31 | 侧面 |
| 10 | 第一主板 | 40 | 柔性电路板 |
| 20 | 第二主板 | 41 | 板面 |
| 30 | 陶瓷天线 | 50 | 软板 |
本发明目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
需要说明,本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。
另外,在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。
在本发明中,除非另有明确的规定和限定,术语“连接”、“固定”等应做广义理解,例如,“固定”可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。
另外,本发明各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。
本发明提出一种蓝牙天线100,其可应用于蓝牙设备之中,可提升陶瓷天线30的效率。
如图1所示,在本发明蓝牙天线100一实施例中,该蓝牙天线100包括:
第一主板10;
第二主板20,所述第二主板20与所述第一主板10相对设置,并与所述第一主板10电性连接;
陶瓷天线30,所述陶瓷天线30设于所述第二主板20的背离所述第一主板10的一侧,并与所述第二主板20相对设置,所述陶瓷天线30与所述第一主板10电性连接;以及
柔性电路板40,所述柔性电路板40凸设于所述第二主板20的背离所述第一主板10的板面,并位于所述陶瓷天线30与所述第二主板20的夹持区域之外,所述柔性电路板40与所述第二主板20电性连接。
下面以蓝牙天线100水平设置为例进行介绍,具体请参阅图1:
第一主板10呈水平设置,即第一主板10的板面与水平面平行设置。
第二主板20位于第一主板10的上方,并与第一主板10间隔设置;并且,第二主板20也呈水平设置,即第二主板20与第一主板10平行设置。此时,第二主板20与第一主板10通过传输线实现电性连接。
陶瓷天线30位于第二主板20的上方,并与第二主板20间隔设置;并且,陶瓷天线30也呈水平设置,即陶瓷天线30与第二主板20平行设置。此时,陶瓷天线30与第一主板10通过传输线实现电性连接。
需要说明的是,传输线既可以是单纯的具有信号传输功能的线体,也可以是软板(例如柔性电路板),该软板包含具有信号传输功能的线体。
进一步地,第二主板20的上表面凸设有柔性电路板40,该柔性电路板40位于陶瓷天线30与第二主板20的夹持区域之外。该柔性电路板40大致 呈长条形,其宽度的延伸方向与本实施例定义的上下方向相同,其长度的延伸方向与本实施例定义的前后方向相同,即该柔性电路板40的板面41面向陶瓷天线30设置。
此时,如图2和图3所示,陶瓷天线30与柔性电路板40形成耦合电容C1,陶瓷天线30与第二主板20形成耦合电容C2,第二主板20与第一主板10形成耦合电容C3。由于第一主板10的面积大于第二主板20的面积,所以耦合电容C3大于耦合电容C2。耦合电容C1的大小可以通过柔性电路板40与陶瓷天线30之间的距离以及柔性电路板40的宽度来调节。请进一步参阅图3,下面将对本发明蓝牙天线100谐振模式的原理进行介绍:
陶瓷天线30等效为电感L1,柔性电路板40等效为电感L2,陶瓷天线30与第一主板10和第二主板20的耦合电容总合为C2+C3。因此,整个系统所能产生的谐振包含一个串联谐振和一个并联谐振,
请进一步参阅图4,本发明蓝牙天线100串联谐振的谐振频率f1在2.4GHz与2.5GHz之间,本发明蓝牙天线100并联谐振的谐振频率f2在3GHz左右。因此,当本发明蓝牙天线100应用于蓝牙传送时,可利用串联谐振。
本发明蓝牙天线100的优势在于:
第一,本发明蓝牙天线100,在将陶瓷天线30作为辐射体的同时,进一步引入了柔性电路板40作为辅助辐射体,两辐射体发生耦合作用,有效提高了陶瓷天线30的效率。相关数据表明,单纯的陶瓷天线30的效率仅为10%左右,而本发明蓝牙天线100则可使得陶瓷天线30的效率达到40%以上。也即,本发明蓝牙天线100,通过将柔性电路板40与陶瓷天线30耦合使用,可在超小型蓝牙设备中实现较高的天线效率。
第二,本发明蓝牙天线100,实现了陶瓷天线30的灵活设计;并且,可以通过灵活设计柔性电路板40与陶瓷天线30之间的耦合电容的大小,来实现谐振频率的控制;同时,还可以通过灵活设计第一主板10与第二主板20之间的耦合电容的大小,将无用的并联谐振移到带外甚至3.5GHz以上;此 外,还可通过灵活设计柔性电路板40或选用等效电感更高的陶瓷天线30,使并联谐振与串联谐振均谐振在蓝牙频段,而成为宽带宽蓝牙天线100。
此外,需要说明的是,柔性电路板40可以为第二主板20的连接器件,如MIC、电池等功能柔性电路板40。
如图1所示,在本发明蓝牙天线100一实施例中,所述柔性电路板40的板面41与所述陶瓷天线30的侧面31相对设置。具体地,柔性电路板40的板面41与陶瓷天线30的侧面31平行设置。如此,可有效增强柔性电路板40与陶瓷天线30之间的耦合作用的稳定性,保障柔性电路板40与陶瓷天线30的耦合量,提升蓝牙天线100的一致性,从而达到优化蓝牙天线100工作性能的目的。
进一步地,柔性电路板40在第二主板20上的起始位置与陶瓷天线30的侧面31平行设置,即第二主板20表面用于与柔性电路板40连接的引入点和输出点之间的连线与陶瓷天线30的侧面31平行设置,以方便焊接和布置,保障柔性电路板40与陶瓷天线30之间的耦合作用的稳定性。
进一步地,所述柔性电路板40凸起于所述第二主板20板面的高度不超过所述陶瓷天线30凸起于所述第二主板20板面的高度,以保障陶瓷天线30为辐射主体。具体地,可采用例如支架、卡扣等起支撑、定位作用的辅助部件,对柔性电路板40和陶瓷天线30的位置进行限位固定,从而使柔性电路板40凸起于第二主板20板面的高度不超过陶瓷天线30凸起于第二主板20板面的高度。此时,陶瓷天线30的高度更高,其作为辐射主体进行工作;柔性电路板40的高度略低,其与陶瓷天线30发生耦合,起增强陶瓷天线30性能的作用。
如图1至图3所示,在本发明蓝牙天线100一实施例中,定义所述柔性电路板40沿所述第二主板20的板面延伸设置的长度为L,25mm≤L≤50mm。如此,柔性电路板40的长度介于1/4个波长至半个波长之间,这样,可有效增强蓝牙天线100与电磁波的耦合能力,从而使得蓝牙天线100的发射和接收效果得以提升。
进一步地,定义所述柔性电路板40凸起于所述第二主板20板面的高度 为H,3mm≤H≤6mm。如此,在有效保障本发明蓝牙天线100高效率的同时,还可有效降低本发明蓝牙天线100的高度,实现蓝牙天线100的小体积,节省装配空间,降低生产成本。
如图1所示,在本发明蓝牙天线100一实施例中,所述第一主板10的面积大于所述第二主板20的面积。如此,便可由第一主板10开始向外传递能量,这样,可有效降低第二主板20对能量的阻耗,降低电磁能的传输损耗,使得本发明蓝牙天线100的能量转化效率得以有效提升。
进一步地,所述蓝牙天线100还包括蓝牙芯片,所述蓝牙芯片设于所述第一主板10。如此,可有效缩短本发明蓝牙天线100的信号传输路径的长度,降低电磁能的传输损耗,从而使得本发明蓝牙天线100的能量转化效率得以有效提升。
如图1所示,在本发明蓝牙天线100一实施例中,所述陶瓷天线30通过软板50与所述第一主板10电性连接。这样,结构简单,生产制造方便,并且可使得本发明蓝牙天线100具有一定的形变能力,从而有效提升本发明蓝牙天线100的结构稳定性,保障本发明蓝牙天线100的优异工作性能。
进一步地,所述软板50包括射频信号线和地线,所述射频信号线和所述地线形成微带线,所述射频信号线与所述陶瓷天线30和所述第一主板10电性连接。具体地,地线由第一主板10引出并随微带线向陶瓷天线30延伸,但是,地线并不与陶瓷天线30电性连接。如此,有效保障了微带线50Ω的阻抗特性,保障了工作频段信号的传输能力,使得蓝牙天线100的工作性能和工作稳定性进一步得以提升。
此外,第二主板20也通过软板50与第一主板10电性连接。这样,结构简单,生产制造方便,并且可使得本发明蓝牙天线100具有一定的形变能力,从而有效提升本发明蓝牙天线100的结构稳定性,保障本发明蓝牙天线100的优异工作性能。
需要说明的是,本发明蓝牙天线100还设置有辅助定位的塑料支架(未图示),以增强本发明蓝牙天线100的结构稳定性。
在本发明蓝牙天线100一实施例中,所述陶瓷天线30为单极天线。这样,不仅可进一步简化、优化本发明蓝牙天线100的结构,使得其生产制造更加方便,而且还可利用单极天线优异的工作性能,使得本发明蓝牙天线100的工作性能得以有效提升。
本发明还提出一种蓝牙设备,该蓝牙设备包括蓝牙天线100,该蓝牙天线100的具体结构参照前述实施例。由于本蓝牙设备采用了前述所有实施例的全部技术方案,因此至少具有前述所有实施例的全部技术方案所带来的所有有益效果,在此不再一一赘述。
其中,蓝牙设备包括蓝牙耳机、智能穿戴设备(例如:智能手表、智能手环、智能眼镜等)、手机,笔记本电脑、平板电脑、相机等。
以上所述仅为本发明的优选实施例,并非因此限制本发明的专利范围,凡是在本发明的发明构思下,利用本发明说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。
Claims (10)
- 一种蓝牙天线,其特征在于,包括:第一主板;第二主板,所述第二主板与所述第一主板相对设置,并与所述第一主板电性连接;陶瓷天线,所述陶瓷天线设于所述第二主板的背离所述第一主板的一侧,并与所述第二主板相对设置,所述陶瓷天线与所述第一主板电性连接;以及柔性电路板,所述柔性电路板凸设于所述第二主板的背离所述第一主板的板面,并位于所述陶瓷天线与所述第二主板的夹持区域之外,所述柔性电路板与所述第二主板电性连接。
- 如权利要求1所述的蓝牙天线,其特征在于,所述柔性电路板的板面与所述陶瓷天线的侧面相对设置。
- 如权利要求1所述的蓝牙天线,其特征在于,所述柔性电路板凸起于所述第二主板板面的高度不超过所述陶瓷天线凸起于所述第二主板板面的高度。
- 如权利要求1所述的蓝牙天线,其特征在于,定义所述柔性电路板沿所述第二主板的板面延伸设置的长度为L,25mm≤L≤50mm;且/或,定义所述柔性电路板凸起于所述第二主板板面的高度为H,3mm≤H≤6mm。
- 如权利要求1至4中任一项所述的蓝牙天线,其特征在于,所述第一主板的面积大于所述第二主板的面积。
- 如权利要求5所述的蓝牙天线,其特征在于,所述蓝牙天线还包括蓝牙芯片,所述蓝牙芯片设于所述第一主板。
- 如权利要求1至4中任一项所述的蓝牙天线,其特征在于,所述陶瓷天线通过软板与所述第一主板电性连接。
- 如权利要求7所述的蓝牙天线,其特征在于,所述软板包括射频信号线和地线,所述射频信号线和所述地线形成微带线,所述射频信号线与所述陶瓷天线和所述第一主板电性连接。
- 如权利要求8所述的蓝牙天线,其特征在于,所述陶瓷天线为单极天线。
- 一种蓝牙设备,其特征在于,包括如权利要求1至9中任一项所述的蓝牙天线。
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