WO2020087652A1 - 背光源的制作方法 - Google Patents

背光源的制作方法 Download PDF

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Publication number
WO2020087652A1
WO2020087652A1 PCT/CN2018/119246 CN2018119246W WO2020087652A1 WO 2020087652 A1 WO2020087652 A1 WO 2020087652A1 CN 2018119246 W CN2018119246 W CN 2018119246W WO 2020087652 A1 WO2020087652 A1 WO 2020087652A1
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WO
WIPO (PCT)
Prior art keywords
solder
substrate
pattern
solder pattern
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/119246
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English (en)
French (fr)
Inventor
杨勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/320,102 priority Critical patent/US11000911B2/en
Publication of WO2020087652A1 publication Critical patent/WO2020087652A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of display technology, and in particular to a method for manufacturing a backlight.
  • liquid crystal displays Liquid Crystal Display, LCD
  • LCD liquid crystal Display
  • other flat display devices have been widely used in mobile phones, TVs, and individuals due to their advantages of high image quality, power saving, thin body, and wide range of applications.
  • Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become the mainstream in display devices.
  • liquid crystal display devices which include a liquid crystal display panel and a backlight module.
  • the working principle of the liquid crystal display panel is to place liquid crystal molecules in two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates.
  • the liquid crystal molecules can be controlled to change the direction by turning on or off, and the light of the backlight module Refracted to produce a picture.
  • the backlight module Since the liquid crystal display panel itself does not emit light, the light source provided by the backlight module is required to display images normally. Therefore, the backlight module becomes one of the key components of the liquid crystal display device.
  • the backlight module is divided into two types: an edge type backlight module and a direct type backlight module according to different incident positions of the light source.
  • the direct type backlight module is a backlight source such as a cathode fluorescent lamp (Cold Cathode Fluorescent Lamp (CCFL) or Light Emitting Diode (LED) light source is arranged behind the liquid crystal display panel, and the light is uniformized by the diffusion plate to form a surface light source and provided to the liquid crystal display panel.
  • CCFL Cold Cathode Fluorescent Lamp
  • LED Light Emitting Diode
  • Mini-LED is also known as sub-millimeter light-emitting diode. Compared with the conventional side-entry backlight, it does not need to install a light guide plate in the backlight module, which is more thin and light, and the luminous efficiency is higher. The limitation of the distance will not cause the hotspot phenomenon of the side-emitting backlight, which is suitable for narrow-frame full-screen products. At the same time, Mini-LED can also perform partition control of the backlight to achieve near-perfect dark state performance, higher contrast, and better display quality.
  • Mini-LED also has many defects to be solved in the manufacturing process, one of which is the solid crystal problem of the chip. Due to cost reasons, people prefer to use smaller chips for die bonding. However, in the traditional die bonding process of solder reflow, the solder paste flow time is longer, and the weight of the chip is light, which is easy to cause solder paste. The pulling deviation of the LED will cause uneven brightness across the Mini-LED and affect the light efficiency.
  • the purpose of the present invention is to provide a method for manufacturing a backlight, which has high process efficiency and low process cost, and effectively guarantees the light effect of the backlight.
  • the present invention provides a method for manufacturing a backlight, including the following steps:
  • Step S1 providing a substrate
  • Step S2 forming multiple solder pattern groups at intervals on the substrate; each solder pattern group includes multiple solder patterns at intervals; each solder pattern is in a closed ring shape;
  • Step S3 providing multiple Mini-LEDs; correspondingly setting multiple Mini-LEDs on multiple solder pattern groups;
  • Step S4 Put the substrate after the step S3 into a space with a changing magnetic field, so that the solder patterns in the plurality of solder pattern groups generate an induced current to generate heat and melt, and solder a plurality of Mini-LEDs to the substrate.
  • the substrate includes a plurality of spaced pad groups, and each pad group includes two spaced pads;
  • the plurality of solder pattern groups formed in the step S2 respectively correspond to the plurality of pad groups; each solder pattern group includes two solder patterns; the two solder patterns of each solder pattern group are respectively formed on the corresponding pad groups On both pads;
  • the Mini-LED includes two pins respectively corresponding to the two solder patterns of the corresponding solder pattern group; after the step S3 is completed, each pin is located on or around the corresponding solder pattern Within the area
  • step S4 the two solder patterns of each solder pattern group are melted to solder the two pins of the corresponding Mini-LED to the two pads of the corresponding pad group.
  • each flux pattern group includes two spaced apart flux patterns; each flux The two flux patterns of the pattern group are respectively formed on the two pads of the corresponding pad group; the two solder patterns of each solder pattern group are respectively formed on the flux of the two pads of the corresponding pad group On the pattern.
  • the area of the flux pattern is 0.8-1 times the area of the pad below it.
  • a specific method of forming a plurality of spaced solder pattern groups on the substrate is as follows: firstly, a solder steel mesh is provided, the solder steel mesh includes a first shielding portion, a plurality of second shielding portions, and a plurality of second shieldings, respectively A plurality of connecting portions corresponding to the portion, the first shielding portion is provided with a plurality of spaced openings, and a plurality of second shielding portions are correspondingly located in the plurality of openings and connected to the first shielding portion through the corresponding connecting portions;
  • the solder steel mesh shields the spraying of solder material onto the substrate, forming a plurality of spaced solder pattern groups on the substrate, and each solder pattern group includes a plurality of closed ring-shaped solder patterns.
  • the plurality of flux pattern groups are produced by steel mesh spraying.
  • the thickness of the flux pattern is 1-5 ⁇ m.
  • the solder pattern is a circular ring or a polygonal ring; the thickness of the solder pattern is 20-50 ⁇ m.
  • the rate of change of the magnetic flux is 5 ⁇ 10 -4 -2 ⁇ 10 -3 Wb / s when the substrate after the step S3 is placed in the space with the changing magnetic field, and the solder patterns in the multiple solder pattern groups are generated
  • the temperature of generating heat by induction current is 240 °C -280 °C.
  • the substrate is a printed circuit board or a flexible circuit board.
  • a method for manufacturing a backlight provided by the present invention forms a plurality of solder pattern groups on a substrate.
  • Each solder pattern group includes a plurality of spaced solder patterns.
  • the solder patterns are in a closed ring shape.
  • Each Mini-LED is correspondingly set on multiple solder pattern groups, and the substrate is placed in a space with a varying magnetic field.
  • the loops of the solder patterns in the multiple solder pattern groups generate induced currents and rapidly generate heat to melt, and multiple Mini-LEDs Welding on the substrate to improve the welding speed, high process efficiency, low process cost, and effectively ensure the light effect of the backlight.
  • FIG. 1 is a flowchart of a method for manufacturing a backlight of the present invention
  • FIG. 5 is a schematic top view of the solder pattern in the first embodiment of the manufacturing method of the backlight of the present invention.
  • FIG. 6 is a schematic top view of a solder pattern in the second embodiment of the method for manufacturing a backlight of the present invention.
  • FIG. 7 is a schematic top view of a solder pattern in the third embodiment of the method for manufacturing a backlight of the present invention.
  • FIG. 8 is a schematic top view of a solder pattern in the fourth embodiment of the method for manufacturing a backlight of the present invention.
  • FIG. 9 is a schematic top view of a solder pattern in the fifth embodiment of the method for manufacturing a backlight of the present invention.
  • FIG. 10 is a schematic view of the partial structure of the solder steel mesh in the first embodiment of the manufacturing method of the backlight of the present invention.
  • step S3 is a schematic diagram of step S3 of the method for manufacturing a backlight of the present invention.
  • step S4 of the method for manufacturing a backlight of the present invention.
  • the present invention provides a method for manufacturing a backlight, including the following steps:
  • Step S1 please refer to FIG. 2 to provide a substrate 10.
  • the substrate 10 includes a plurality of spaced pad groups 11, and each land group 11 includes two spaced pads 111.
  • the substrate 10 further includes copper wires connected to the plurality of pads 111 and white oil (not shown) for reflecting light.
  • the substrate 10 is a printed circuit board (PCB) with a rigid plastic substrate or a flexible circuit board (FPC) with a polyimide material substrate.
  • PCB printed circuit board
  • FPC flexible circuit board
  • the substrate 10 is also cleaned.
  • Step S2 a plurality of spaced solder pattern groups 20 are formed on the substrate 10.
  • Each solder pattern group 20 includes a plurality of spaced solder patterns 21.
  • Each solder pattern 21 has a closed ring shape.
  • each solder pattern group 20 formed in step S2 respectively correspond to the plurality of pad groups 11.
  • Each solder pattern group 20 includes two solder patterns 21.
  • the two solder patterns 21 of each solder pattern group 20 are respectively formed on the two pads 111 of the corresponding pad group 11.
  • the solder pattern 21 may be a circular ring, a square ring, a diamond ring, a triangular ring, a hexagonal ring, and other polygonal rings with only a few numbers.
  • the pattern 21 may be formed in a closed ring shape.
  • the thickness of the solder pattern 21 is 20-50 ⁇ m.
  • the plurality of solder pattern groups 20 are formed on the substrate 10 by steel mesh spraying.
  • a specific method of forming a plurality of spaced solder pattern groups 20 on the substrate 10 is: firstly provide a solder steel mesh 90, the solder The steel mesh 90 includes a first shielding portion 91, a plurality of circular second shielding portions 92, and a plurality of connecting portions 93 corresponding to the plurality of second shielding portions 92, respectively.
  • a plurality of circular openings 911, a plurality of second shielding portions 92 are correspondingly located in the plurality of openings 911, and are connected to the first shielding portion 91 through corresponding connecting portions 93.
  • solder steel mesh 90 is used as a shield to spray the solder material onto the substrate 10 to form a plurality of spaced solder pattern groups 20 on the substrate 10, and each solder pattern group 20 includes a plurality of closed circular ring-shaped solders Pattern 21.
  • shape of the second shielding portion 92 and the shape of the opening 911 may be set to polygons such as triangles, squares, rhombuses, and hexagons, so that the resulting solder The pattern 21 is a closed polygonal ring.
  • a plurality of flux pattern groups 40 corresponding to the plurality of pad groups 11 are formed on the substrate 10.
  • Each flux pattern group 40 includes two flux patterns 41 that are spaced apart.
  • the two flux patterns 41 of each flux pattern group 40 are respectively formed on the two pads 111 of the corresponding pad group 11.
  • the two solder patterns 21 of each solder pattern group 20 are respectively formed on the flux patterns 41 on the two pads 111 of the corresponding pad group 11.
  • the area of the flux pattern 41 is 0.8-1 times the area of the pad 111 below it.
  • the thickness of the flux pattern 41 is 1-5 ⁇ m.
  • the plurality of flux pattern groups 40 are manufactured by steel mesh spraying.
  • Step S3. Please refer to FIG. 11 to provide a plurality of Mini-LEDs 30.
  • the plurality of Mini-LEDs 30 are correspondingly provided on the plurality of solder pattern groups 20.
  • the Mini-LED 30 includes two pins 31 respectively corresponding to the two solder patterns 21 of the corresponding solder pattern group 20. After the step S3 is completed, each pin 31 is located on the corresponding solder pattern 21 or in the area enclosed by the corresponding solder pattern 21.
  • Step S4. Please refer to FIG. 12.
  • the continuous change of the magnetic field causes the solder patterns 21 in the multiple solder pattern groups 20 to generate an induced current.
  • the induced current flows in the solder pattern Heat is generated in the closed loop of 21, which causes multiple solder patterns 21 to heat and melt and quickly spread from the periphery to the center.
  • the flux pattern 41 will be heated and volatilized, and finally the molten solder pattern 21 will convert multiple Mini-LEDs 30. Soldered on the substrate 10.
  • step S4 the two solder patterns 21 of each solder pattern group 20 are melted to solder the two pins 31 of the corresponding Mini-LED 30 to the two pads 111 of the corresponding pad group 11 respectively.
  • the rate of change of the magnetic flux of the substrate 10 after the step S3 is placed in a space with a changing magnetic field is 5 ⁇ 10 ⁇ 4 ⁇ 2 ⁇ 10 ⁇ 3 Wb / s, so that multiple solder pattern groups
  • the solder pattern 21 in 20 generates an induced current and generates heat at a temperature of 240 ° C-280 ° C.
  • a solder pattern group 20 including a closed ring-shaped solder pattern 21 on the substrate 10 a plurality of Mini-LEDs 30 are correspondingly provided on the plurality of solder pattern groups 20 on the substrate 10
  • the multiple solder patterns 21 are heated by the induced current and quickly melted and flattened, without the appearance of the "hill-shaped" solder in the existing soldering process.
  • the Mini-LED30 is quickly welded to the substrate 10 with fast welding speed and high process efficiency, and the rapid cooling of the solder will not cause the Mini-LED30 to pull excessively and tilt, which ensures the light effect of the backlight source and can be achieved by induction current welding.
  • the purpose of saving energy consumption is to reduce the production cost of the backlight.
  • other areas on the substrate 10, such as the copper wire area and the white oil area will not be affected by high temperature .
  • the reflectance of white oil will not be affected by the high temperature welding process to reduce, to ensure better light efficiency and mixing Effect, improve the quality of the backlight.
  • the manufacturing method of the backlight of the present invention forms a plurality of solder pattern groups on the substrate, and each solder pattern group includes a plurality of spaced solder patterns.
  • the solder patterns are in a closed ring shape.
  • Correspondingly set on multiple solder pattern groups put the substrate into a space with a changing magnetic field.
  • the loops of the solder patterns in the multiple solder pattern groups generate induced currents to rapidly generate heat and melt, and solder multiple Mini-LEDs on the substrate , Improve welding speed, high process efficiency, low process cost, and effectively ensure the light effect of the backlight.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种背光源的制作方法包括：步骤S1，提供基板（10）；步骤S2，在基板（10）上形成多个焊锡图案组（20），每一焊锡图案组（20）包括间隔的多个焊锡图案（21），焊锡图案（21）呈封闭的环状；步骤S3，将多个Mini-LED（30）对应设于多个焊锡图案组（20）上；步骤S4，将基板（10）放入具有变化磁场的空间，多个焊锡图案组（20）中的焊锡图案（21）的回路产生感应电流而迅速产热熔化，将多个Mini-LED（30）焊接在基板（10）上；背光源的制作方法提升了焊接速度，工艺效率高，工艺成本低，且有效保证了背光源的光效。

Description

背光源的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种背光源的制作方法。
 背景技术
随着显示技术的发展，液晶显示器（Liquid Crystal Display，LCD）等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
现有市场上的液晶显示装置大部分为背光型液晶显示装置，其包括液晶显示面板及背光模组（backlight module）。液晶显示面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，两片玻璃基板中间有许多垂直和水平的细小电线，通过通电与否来控制液晶分子改变方向，将背光模组的光线折射出来产生画面。
由于液晶显示面板本身不发光，需要借由背光模组提供的光源来正常显示影像，因此，背光模组成为液晶显示装置的关键组件之一。背光模组依照光源入射位置的不同分成侧入式背光模组与直下式背光模组两种。直下式背光模组是将背光源例如阴极萤光灯管（Cold Cathode Fluorescent Lamp，CCFL）或发光二极管（Light Emitting Diode，LED）光源设置在液晶显示面板后方，光线经扩散板均匀化后形成面光源提供给液晶显示面板。
Mini-LED又称为次毫米发光二极管，将其应用之背光模组中，相比于常规的侧入式背光，无需设置导光板，显得更加轻薄，发光效率也更高，同时解决了混光距离的限制，不会产生侧发光背光的热点（hotspot）的现象，适合用于窄边框全面屏产品上。同时Mini-LED还可以进行背光的分区控制，实现近乎完美的暗态表现，对比度也更高，显示画质也更好。
然而，Mini-LED在制备工艺中也存在诸多的缺陷有待解决，其中之一就是芯片的固晶问题。由于成本的原因，人们更青睐于使用更小颗的芯片进行固晶，然而，传统的芯片固晶回流焊过程中由于锡膏的熔融流动时间较长，且芯片的重量轻，易造成锡膏的拉扯偏移，从而造成Mini-LED整面的亮度不均现象，影响光效。
 技术问题
本发明的目的在于提供一种背光源的制作方法，工艺效率高，工艺成本低，有效保证了背光源的光效。
 技术解决方案
为实现上述目的，本发明提供一种背光源的制作方法，包括如下步骤：
步骤S1、提供基板；
步骤S2、在所述基板上形成间隔的多个焊锡图案组；每一焊锡图案组包括间隔的多个焊锡图案；每一焊锡图案呈封闭的环状；
步骤S3、提供多个Mini-LED；将多个Mini-LED对应设于多个焊锡图案组上；
步骤S4、将完成步骤S3后的基板放入具有变化磁场的空间，使得多个焊锡图案组中的焊锡图案产生感应电流而发热熔化，将多个Mini-LED焊接在基板上。
所述基板包括间隔的多个焊盘组，每一焊盘组包括间隔的两个焊盘；
所述步骤S2形成的多个焊锡图案组分别与多个焊盘组对应；每一焊锡图案组包括两个焊锡图案；每一焊锡图案组的两个焊锡图案分别形成于对应的焊盘组的两个焊盘上；
所述Mini-LED包括分别与对应的焊锡图案组的两个焊锡图案相对应的两个引脚；所述步骤S3完成后，每一引脚位于对应的焊锡图案上或位于对应的焊锡图案围成的区域内；
所述步骤S4中，每一焊锡图案组的两个焊锡图案熔化将对应的Mini-LED的两个引脚分别与对应的焊盘组的两个焊盘焊接。
所述步骤S2在基板上形成焊锡图案组之前还在基板上形成分别与多个焊盘组对应的多个助焊剂图案组；每一助焊剂图案组包括间隔的两个助焊剂图案；每一助焊剂图案组的两个助焊剂图案分别形成在对应的焊盘组的两个焊盘上；每一焊锡图案组的两个焊锡图案分别形成于对应的焊盘组的两个焊盘上的助焊剂图案上。
所述助焊剂图案的面积为其下方的焊盘的面积的0.8-1倍。
在所述基板上形成间隔的多个焊锡图案组的具体方式为：首先提供一焊锡钢网，所述焊锡钢网包括第一遮挡部、多个第二遮挡部及分别与多个第二遮挡部对应的多个连接部，所述第一遮挡部设有间隔的多个开口，多个第二遮挡部对应位于多个开口内并通过对应的连接部与第一遮挡部连接；接着，利用所述焊锡钢网为遮挡向基板喷涂焊锡材料，在基板上形成间隔的多个焊锡图案组，每一焊锡图案组包括多个呈封闭的环状的焊锡图案。
所述多个助焊剂图案组通过钢网喷涂的方式制作。
所述助焊剂图案的厚度为1-5μm。
所述焊锡图案为圆形环或多边形环；所述焊锡图案的厚度为20-50μm。
所述步骤S4中，将完成步骤S3后的基板放入具有变化磁场的空间的磁通量变化率为5×10 -4-2×10 -3Wb/s，多个焊锡图案组中的焊锡图案产生感应电流而发热的温度为240℃-280℃。
所述基板为印刷电路板或柔性电路板。
 有益效果
本发明的有益效果：本发明提供的一种背光源的制作方法在基板上形成多个焊锡图案组，每一焊锡图案组包括间隔的多个焊锡图案，焊锡图案呈封闭的环状，将多个Mini-LED对应设于多个焊锡图案组上，将基板放入具有变化磁场的空间，多个焊锡图案组中的焊锡图案的回路产生感应电流而迅速产热熔化，将多个Mini-LED焊接在基板上，提升焊接速度，工艺效率高，工艺成本低，且有效保证了背光源的光效。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明的背光源的制作方法的流程图；
图2为本发明的背光源的制作方法的步骤S1的示意图；
图3及图4为本发明的背光源的制作方法的步骤S2的示意图；
图5为本发明的背光源的制作方法的第一实施例中焊锡图案的俯视示意图；
图6为本发明的背光源的制作方法的第二实施例中焊锡图案的俯视示意图；
图7为本发明的背光源的制作方法的第三实施例中焊锡图案的俯视示意图；
图8为本发明的背光源的制作方法的第四实施例中焊锡图案的俯视示意图；
图9为本发明的背光源的制作方法的第五实施例中焊锡图案的俯视示意图；
图10为本发明的背光源的制作方法的第一实施例中焊锡钢网的局部结构示意图；
图11为本发明的背光源的制作方法的步骤S3的示意图；
图12为本发明的背光源的制作方法的步骤S4的示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1，本发明提供一种背光源的制作方法，包括如下步骤：
步骤S1、请参阅图2，提供基板10。
具体地，所述基板10包括间隔的多个焊盘组11，每一焊盘组11包括间隔的两个焊盘111。
进一步地，所述基板10还包括分别与多个焊盘111连接的铜线及用于进行反光的白油（未图示）。
具体地，所述基板 10为以硬质塑料为衬底的印刷电路板（PCB）或以聚酰亚胺材料为衬底的柔性电路板（FPC）。
具体地，所述步骤S1在提供了基板10之后还对所述基板10进行清洗。
步骤S2、请参阅图4，在所述基板10上形成间隔的多个焊锡图案组20。每一焊锡图案组20包括间隔的多个焊锡图案21。每一焊锡图案21呈封闭的环状。
具体地，所述步骤S2形成的多个焊锡图案组20分别与多个焊盘组11对应。每一焊锡图案组20包括两个焊锡图案21。每一焊锡图案组20的两个焊锡图案21分别形成于对应的焊盘组11的两个焊盘111上。
具体地，请参阅图5至图9，所述焊锡图案21可以为圆形环，也可以为正方形环、菱形环、三角形环、六边形环以及其他边数的多边形环，只需要保证焊锡图案21能够成封闭的环状即可。
优选地，所述焊锡图案21的厚度为20-50μm。
具体地，所述多个焊锡图案组20通过钢网喷涂的方式形成在基板10上。
进一步地，请参考图10，以本发明的第一实施例为例，在所述基板10上形成间隔的多个焊锡图案组20的具体方式为：首先提供一焊锡钢网90，所述焊锡钢网90包括第一遮挡部91、多个圆形的第二遮挡部92及分别与多个第二遮挡部92对应的多个连接部93，所述第一遮挡部91设有间隔的多个圆形的开口911，多个第二遮挡部92对应位于多个开口911内并通过对应的连接部93与第一遮挡部91连接。接着，利用所述焊锡钢网90为遮挡向基板10喷涂焊锡材料，在基板10上形成间隔的多个焊锡图案组20，每一焊锡图案组20包括多个呈封闭的圆形环状的焊锡图案21。可以理解的是，在本发明的其他实施例中，可以通过将第二遮挡部92的形状及开口911的形状设置为如三角形、正方形、菱形、六边形的多边形，以使得最终形成的焊锡图案21呈封闭的多边形环。
具体地，请参阅图3及图4，所述步骤S2在基板10上形成焊锡图案组20之前还在基板10上形成分别与多个焊盘组11对应的多个助焊剂图案组40。每一助焊剂图案组40包括间隔的两个助焊剂图案41。每一助焊剂图案组40的两个助焊剂图案41分别形成在对应的焊盘组11的两个焊盘111上。每一焊锡图案组20的两个焊锡图案21分别形成于对应的焊盘组11的两个焊盘111上的助焊剂图案41上。
优选地，所述助焊剂图案41的面积为其下方的焊盘111的面积的0.8-1倍。所述助焊剂图案41的厚度为1-5μm。
具体地，所述多个助焊剂图案组40通过钢网喷涂的方式制作。
步骤S3、请参阅图11，提供多个Mini-LED30。将多个Mini-LED30对应设于多个焊锡图案组20上。
具体地，所述Mini-LED30包括分别与对应的焊锡图案组20的两个焊锡图案21相对应的两个引脚31。所述步骤S3完成后，每一引脚31位于对应的焊锡图案21上或位于对应的焊锡图案21围成的区域内。
步骤S4、请参阅图12，将完成步骤S3后的基板10放入具有变化磁场的空间，通过磁场的不断变化使得多个焊锡图案组20中的焊锡图案21产生感应电流，感应电流在焊锡图案21的闭合回路中产生热量，使得多个焊锡图案21发热熔化而迅速由周边向中心进行摊平，同时，助焊剂图案41会受热挥发，最终使得熔化后的焊锡图案21将多个Mini-LED30焊接在基板10上。
具体地，所述步骤S4中，每一焊锡图案组20的两个焊锡图案21熔化将对应的Mini-LED30的两个引脚31分别与对应的焊盘组11的两个焊盘111焊接。
优选地，所述步骤S4中，将完成步骤S3后的基板10放入具有变化磁场的空间的磁通量变化率为5×10 -4-2×10 -3Wb/s，使得多个焊锡图案组20中的焊锡图案21产生感应电流而发热的温度为240℃-280℃。
需要说明的是，本发明通过在基板10上形成包括呈封闭的环状的焊锡图案21的焊锡图案组20，在将多个Mini-LED30对应设于多个焊锡图案组20上在基板10上之后，通过将基板10放入具有变化磁场的空间内，利用感应电流使得多个焊锡图案21发热而迅速熔化摊平，不会出现现有焊接工艺中“山丘状”形貌的焊锡，能够迅速将Mini-LED30焊接在基板10上，焊接速度快，工艺效率高，并且焊锡快速冷却不会造成Mini-LED30过分拉扯倾斜，保证了背光源的光效，同时采用感应电流焊接的方式能够达到节省能耗的目的，降低背光源的生产成本，另外，由于感应电流仅存在于焊锡图案21的闭合回路中，基板10上其他区域，例如铜线区、白油区，不会受到高温的影响，保证了板材不会存在严重的胀缩卷曲，且白油的反射率不会受到高温焊接工艺的影响而降低，保证较好的光效及混光效果，提升背光源的品质。
综上所述，本发明的背光源的制作方法在基板上形成多个焊锡图案组，每一焊锡图案组包括间隔的多个焊锡图案，焊锡图案呈封闭的环状，将多个Mini-LED对应设于多个焊锡图案组上，将基板放入具有变化磁场的空间，多个焊锡图案组中的焊锡图案的回路产生感应电流而迅速产热熔化，将多个Mini-LED焊接在基板上，提升焊接速度，工艺效率高，工艺成本低，且有效保证了背光源的光效。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种背光源的制作方法，包括如下步骤：
    步骤S1、提供基板；
    步骤S2、在所述基板上形成间隔的多个焊锡图案组；每一焊锡图案组包括间隔的多个焊锡图案；每一焊锡图案呈封闭的环状；
    步骤S3、提供多个Mini-LED；将多个Mini-LED对应设于多个焊锡图案组上；
    步骤S4、将完成步骤S3后的基板放入具有变化磁场的空间，使得多个焊锡图案组中的焊锡图案产生感应电流而发热熔化，将多个Mini-LED焊接在基板上。
  2. 如权利要求1所述的背光源的制作方法，其中，所述基板包括间隔的多个焊盘组，每一焊盘组包括间隔的两个焊盘；
    所述步骤S2形成的多个焊锡图案组分别与多个焊盘组对应；每一焊锡图案组包括两个焊锡图案；每一焊锡图案组的两个焊锡图案分别形成于对应的焊盘组的两个焊盘上；
    所述Mini-LED包括分别与对应的焊锡图案组的两个焊锡图案相对应的两个引脚；所述步骤S3完成后，每一引脚位于对应的焊锡图案上或位于对应的焊锡图案围成的区域内；
    所述步骤S4中，每一焊锡图案组的两个焊锡图案熔化将对应的Mini-LED的两个引脚分别与对应的焊盘组的两个焊盘焊接。
  3. 如权利要求2所述的背光源的制作方法，其中，所述步骤S2在基板上形成焊锡图案组之前还在基板上形成分别与多个焊盘组对应的多个助焊剂图案组；每一助焊剂图案组包括间隔的两个助焊剂图案；每一助焊剂图案组的两个助焊剂图案分别形成在对应的焊盘组的两个焊盘上；每一焊锡图案组的两个焊锡图案分别形成于对应的焊盘组的两个焊盘上的助焊剂图案上。
  4. 如权利要求3所述的背光源的制作方法，其中，所述助焊剂图案的面积为其下方的焊盘的面积的0.8-1倍。
  5. 如权利要求1所述的背光源的制作方法，其中，在所述基板上形成间隔的多个焊锡图案组的具体方式为：首先提供一焊锡钢网，所述焊锡钢网包括第一遮挡部、多个第二遮挡部及分别与多个第二遮挡部对应的多个连接部，所述第一遮挡部设有间隔的多个开口，多个第二遮挡部对应位于多个开口内并通过对应的连接部与第一遮挡部连接；接着，利用所述焊锡钢网为遮挡向基板喷涂焊锡材料，在基板上形成间隔的多个焊锡图案组，每一焊锡图案组包括多个呈封闭的环状的焊锡图案。
  6. 如权利要求3所述的背光源的制作方法，其中，所述多个助焊剂图案组通过钢网喷涂的方式制作。
  7. 如权利要求3所述的背光源的制作方法，其中，所述助焊剂图案的厚度为1-5μm。
  8. 如权利要求1所述的背光源的制作方法，其中，所述焊锡图案为圆形环或多边形环；所述焊锡图案的厚度为20-50μm。
  9. 如权利要求1所述的背光源的制作方法，其中，所述步骤S4中，将完成步骤S3后的基板放入具有变化磁场的空间的磁通量变化率为5×10 -4-2×10 -3Wb/s，多个焊锡图案组中的焊锡图案产生感应电流而发热的温度为240℃-280℃。
  10. 如权利要求1所述的背光源的制作方法，其中，所述基板为印刷电路板或柔性电路板。
     
PCT/CN2018/119246 2018-10-31 2018-12-04 背光源的制作方法 Ceased WO2020087652A1 (zh)

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