WO2020077772A1 - 显示装置及其制备方法 - Google Patents

显示装置及其制备方法 Download PDF

Info

Publication number
WO2020077772A1
WO2020077772A1 PCT/CN2018/120398 CN2018120398W WO2020077772A1 WO 2020077772 A1 WO2020077772 A1 WO 2020077772A1 CN 2018120398 W CN2018120398 W CN 2018120398W WO 2020077772 A1 WO2020077772 A1 WO 2020077772A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
organic material
transparent organic
material layer
fingerprint recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/120398
Other languages
English (en)
French (fr)
Inventor
曹皓然
千必根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/615,499 priority Critical patent/US11308726B2/en
Publication of WO2020077772A1 publication Critical patent/WO2020077772A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light

Definitions

  • the present application relates to the field of display technology, in particular to a display device and a method for manufacturing the same.
  • fingerprint recognition technology has the advantages of low error matching rate and fast recognition speed. It is increasingly used in terminal devices such as smart phones and tablet computers.
  • the fingerprint recognition module is usually integrated on the screen to better realize the full screen.
  • the fingerprint recognition module integrated on the screen can be realized by optical fingerprint recognition technology, which mainly uses light reflected by the finger to be received by the sensor to distinguish the fingerprint lines, so this light between the sensor and the finger It is necessary to maintain a high pass rate on the propagation path.
  • the existing display panel especially flexible active matrix organic light emitting diode (Active Matrix / Organic Light Emitting Diode (AMOLED) display panel, usually using polyimide (PI) substrate as the back panel of the display panel to carry array substrate, organic light-emitting layer, touch panel and other devices, and then set the fingerprint recognition sensor in The back of the PI board.
  • PI polyimide
  • the color of the PI substrate is usually light yellow, and the light transmittance is low, which affects the sensor's reception of the light reflected by the finger and reduces the accuracy of fingerprint recognition.
  • the embodiments of the present application provide a display device and a preparation method thereof, which are beneficial to improve the accuracy of fingerprint recognition.
  • An embodiment of the present application provides a display device including a display panel and an optical fingerprint recognition sensor
  • the display panel includes a transparent organic material layer, a barrier layer, a buffer layer, and an array substrate stacked in this order from bottom to top.
  • the side of the transparent organic material layer facing away from the barrier layer is the back surface of the transparent organic material layer ,
  • the optical fingerprint recognition sensor is provided on the back of the transparent organic material layer;
  • a groove is provided on the back of the transparent organic material layer, the optical fingerprint recognition sensor is provided in the groove, and the transparent organic material layer is a polyester film layer.
  • the material of the buffer layer is at least one of silicon nitride and silicon oxide.
  • the number of the optical fingerprint recognition sensors is plural, a plurality of the optical fingerprint recognition sensors are distributed on the back surface of the transparent organic material layer, and the position and part of the display panel are displayed Corresponds to the area or all display areas.
  • a plurality of the optical fingerprint recognition sensors are distributed in an array on the back surface of the transparent organic material layer.
  • the display panel is a flexible AMOLED display panel, and the display panel further includes a light emitting layer, a thin film encapsulation layer, a touch layer, a polarizer, and a cover that are sequentially disposed on the array substrate board.
  • An embodiment of the present application also provides a display device, including a display panel and an optical fingerprint recognition sensor;
  • the display panel includes a transparent organic material layer, a barrier layer, a buffer layer, and an array substrate stacked in this order from bottom to top.
  • the side of the transparent organic material layer facing away from the barrier layer is the back surface of the transparent organic material layer.
  • the optical fingerprint recognition sensor is provided on the back of the transparent organic material layer.
  • a groove is provided on the back surface of the transparent organic material layer, and the optical fingerprint recognition sensor is provided in the groove.
  • the material of the buffer layer is at least one of silicon nitride and silicon oxide.
  • the transparent organic material layer is a polyester film layer.
  • the number of the optical fingerprint recognition sensors is plural, and a plurality of the optical fingerprint recognition sensors are distributed on the back surface of the transparent organic material layer, and the position is partially displayed Corresponds to the area or all display areas.
  • a plurality of the optical fingerprint recognition sensors are distributed in an array on the back surface of the transparent organic material layer.
  • the display panel is a flexible AMOLED display panel, and the display panel further includes a light emitting layer, a thin film encapsulation layer, a touch layer, a polarizer, and a cover that are sequentially disposed on the array substrate board.
  • An embodiment of the present application also provides a method for manufacturing a display device, including:
  • An optical fingerprint recognition sensor is installed on the back of the transparent organic material layer.
  • the method further includes:
  • the installing the optical fingerprint recognition sensor on the back of the transparent organic material layer includes installing the optical fingerprint recognition sensor in the groove.
  • providing a substrate includes:
  • the removing the base includes: separating the glass substrate and the polyimide film layer using a laser stripping process, and then separating the polyimide film layer and the buffer layer using a laser stripping process, To remove the substrate.
  • the preparation method provided by the present application after sequentially forming a buffer layer and an array substrate on the base, it further includes: sequentially forming a light-emitting layer, a thin film encapsulation layer, and a touch layer on the array substrate; A polarizer or protective film is formed on the control layer.
  • the transparent organic material layer is a polyester film layer.
  • the material of the buffer layer is at least one of silicon nitride and silicon oxide.
  • the number of the optical fingerprint recognition sensors is plural, and the positions of the plurality of optical fingerprint recognition sensors correspond to part of the display area or the entire display area of the display device.
  • the display device of the present application includes a display panel and an optical fingerprint recognition sensor.
  • the display panel includes a transparent organic material layer, a barrier layer, a buffer layer, and an array substrate stacked in this order from bottom to top.
  • the transparent organic material layer faces away from the barrier layer
  • One side is the backside of the transparent organic material layer, in which the optical fingerprint recognition sensor is arranged on the backside of the transparent organic material layer.
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 2 is another schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 3 is another schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a fingerprint recognition area corresponding to different numbers of optical fingerprint recognition sensors in a display device provided by an embodiment of the present application;
  • FIG. 5 is a schematic flow chart of a method for manufacturing a display device provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a process of a method for manufacturing a display device provided by an embodiment of the present application.
  • the display device includes a display panel 10 and an optical fingerprint recognition sensor 20.
  • the optical fingerprint recognition sensor 20 is integrated on the display panel 10.
  • the display panel 10 includes a transparent organic material layer 11, a barrier layer (Barrier Film layer) 12, a buffer layer (Buffer layer) 13 and an array substrate 14 stacked in this order from bottom to top.
  • Optical glue Optically Clear Adhesive, OCA
  • the display panel 10 may be a flexible AMOLED display panel, which may further include a light emitting layer (Electroluminescent, EL) 15 and a thin film encapsulation layer (Thin Film) disposed on the array substrate 14 in sequence Encapsulation (TFE) 16, touch layer 17, polarizer 18 and cover plate 19.
  • a thin film transistor array is formed on the array substrate 14 for driving the light emitting layer 15 to emit light, so as to realize picture display.
  • the display panel 10 may also be a rigid AMOLED display panel or other types of display panels.
  • the transparent organic material layer 11 is formed of an organic substance, such as a polyester film (Polyester Film, PET) layer can improve the stiffness of the display panel 10.
  • the barrier layer 12 is made of transparent material.
  • the material of the buffer layer 13 may be an inorganic substance, such as at least one of silicon nitride and silicon oxide, such as silicon nitride or silicon oxide, or a combination of silicon nitride and silicon oxide.
  • the side of the transparent organic material layer 11 facing away from the barrier layer 12 is the back surface 111, which can also be understood as the back surface of the display panel 10.
  • the optical fingerprint recognition sensor 20 is disposed on the back surface 111 of the transparent organic material layer 11 Corresponding to the display area of, so that when the user ’s finger is placed in the display area of the display panel 10 for fingerprint operation, the light reflected by the finger passes through the array substrate 14, the buffer layer 13, the barrier layer 12, and the transparent organic material layer 11 It is received by the optical fingerprint recognition sensor 20.
  • the optical fingerprint recognition sensor 20 realizes fingerprint recognition by receiving the light reflected by the finger.
  • the optical fingerprint recognition sensor 20 is provided on the back of the transparent organic material layer 11 by using the transparent organic material layer 11, the barrier layer 12, and the buffer layer 13 as the backplane of the display panel 20 to carry devices such as the array substrate 14 Compared with the method of using the PI substrate as the backplane, the light transmittance is improved, so that the optical fingerprint recognition sensor can receive more light reflected by the finger, and the accuracy of fingerprint recognition is improved.
  • a groove 112 may be provided on the back surface 111 of the transparent organic material layer 11, and the optical fingerprint recognition sensor 20 is provided in the groove 112, thereby helping to reduce display The thickness of the device.
  • the number of optical fingerprint recognition sensors 20 may be one, two, or more to implement partial fingerprint recognition or full-screen fingerprint recognition accordingly.
  • the specific number may be set according to actual needs.
  • the multiple optical fingerprint recognition sensors 20 are distributed and arranged on the back of the transparent organic material layer 11, which may be distributed in an array or may be irregularly disordered Distribution.
  • the number and distribution positions of the optical fingerprint recognition sensors 20 are different, and the size and position of the fingerprint recognition area in the display area of the display panel 20 are also different accordingly.
  • FIG. 4 is a schematic diagram of fingerprint identification areas corresponding to different numbers of optical fingerprint identification sensors.
  • the number of optical fingerprint recognition sensors 20 can be set smaller, such as one, and the position of the one fingerprint recognition sensor 20 on the transparent organic material layer 11 can be a small amount below the display area The block area corresponds, and the fingerprint recognition area 41 is smaller at this time; in figure b, the number of optical fingerprint recognition sensors 20 can be set to be larger, such as 3 or 5, etc.
  • optical fingerprint recognition sensors are all distributed in Below the display area, for example, half of the entire display area, a larger fingerprint recognition area 41 can be obtained at this time; in figure c, there are more optical fingerprint recognition sensors, which can be distributed in the entire display area, so that the entire display Fingerprint recognition can be realized in all areas, and the fingerprint recognition area 41 is a full-screen area at this time.
  • the manufacturing method is used to manufacture the display device of any of the foregoing embodiments, and may include the following steps:
  • step S501 may include the following sub-steps:
  • a polyimide (PI) film layer is formed on the glass substrate to form a base.
  • the base may be a glass substrate and a PI film formed together, or in other embodiments may be a glass substrate.
  • a buffer layer and an array substrate are sequentially formed on the base.
  • the material of the buffer layer is inorganic, and may be at least one of silicon nitride and silicon oxide.
  • a light emitting layer a thin film encapsulation layer, and a touch layer are sequentially formed on the array substrate, and a polarizer or a protective film is formed on the touch layer.
  • a polarizer can be formed on the touch layer after removing the protective film in the subsequent manufacturing process, and then a cover plate can be formed on the polarizer.
  • the touch layer may not be formed.
  • the light emitting layer, the thin film encapsulation layer, the polarizer, and the protective film may be sequentially arranged on the array substrate. After removing the protective film during the manufacturing process, a touch layer is formed on the polarizer and a cover plate is attached.
  • the base includes a glass substrate 61 and a polyimide film layer 62, a buffer layer 13, an array substrate 14, a light emitting layer 15, an encapsulation film layer 16, and a touch layer are formed on the base polyimide film layer 62
  • the substrate is removed.
  • a laser lift-off process (Laser Lift-Off, LLO) may be used to first separate the glass substrate 61 and the polyimide film layer 62, and then the laser lift-off process is used to separate the polyimide film
  • the layer 62 and the buffer layer 13 are separated, thereby removing the substrate.
  • a barrier layer 12 is formed on the side of the buffer layer 13 facing away from the array substrate 14.
  • a transparent organic material layer is formed on the side of the barrier layer facing away from the buffer layer, and the side of the transparent organic material layer facing away from the barrier layer is the back of the transparent organic material layer.
  • a transparent organic material layer 11 is formed on the side of the barrier layer 12 facing away from the buffer layer 13.
  • steps S501 to S505 the display panel in the display device can be manufactured.
  • the optical fingerprint recognition sensor 20 is installed on the back of the transparent organic material layer 11.
  • a groove may be formed on the back surface of the transparent organic material, and then the optical fingerprint recognition sensor is installed in the groove, thereby reducing the thickness of the display device.
  • the number of optical fingerprint recognition sensors can be set according to actual needs, such as 1, 2, or more, wherein, when there are multiple optical fingerprint recognition sensors, the positions of the multiple optical fingerprint recognition sensors can be It corresponds to part of the display area or the entire display area of the display device.
  • the transparent organic material layer, the barrier layer and the buffer layer are used as the backplane for carrying devices such as array substrates.
  • the light transmittance can be improved.
  • the optical fingerprint recognition sensor can receive more light reflected by fingers, and improve the accuracy of fingerprint recognition.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Materials Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Image Input (AREA)

Abstract

公开了一种显示装置及其制备方法，所述显示装置包括显示面板以及光学指纹识别传感器；所述显示面板包括自下而上依次层叠设置的透明有机材料层、阻挡层、缓冲层以及阵列基板，所述透明有机材料层背对所述阻挡层的一面为所述透明有机材料层的背面，所述光学指纹识别传感器设置在所述透明有机材料层的背面上。

Description

显示装置及其制备方法 技术领域
本申请涉及显示技术领域，具体涉及一种显示装置及其制备方法。
 背景技术
指纹识别技术作为目前应用最为广泛的生物识别技术之一，具有较低的错误匹配率、识别速度快等优点，越来越多地应用在智能手机、平板电脑等终端设备中。例如，在智能手机的应用领域中，通常是将指纹识别模块集成在屏幕上，以更好地实现全面屏。而集成于屏幕的指纹识别模块可以采用光学式指纹识别技术来实现，其主要是利用光经过手指反射后被传感器接收，以此来分辨指纹的纹路，因此在传感器和手指之间的这段光传播路径上需要保持较高的通过率。
在现有的显示面板尤其是柔性有源矩阵有机发光二极管（Active Matrix/Organic Light Emitting Diode，AMOLED）显示面板中，一般是采用聚酰亚胺（Polyimide，PI）基板作为显示面板的背板来承载阵列基板、有机发光层、触控面板等器件，然后将指纹识别的传感器设置在PI基板的背面。然而，PI基板的颜色通常为淡黄色，透光率较低，影响了传感器对手指反射的光线的接收，降低指纹识别的准确性。
 技术问题
本申请实施例提供一种显示装置及其制备方法，有利于提高指纹识别的准确性。
 技术解决方案
本申请实施例提供一种显示装置，包括显示面板以及光学指纹识别传感器；
所述显示面板包括自下而上依次层叠设置的透明有机材料层、阻挡层、缓冲层以及阵列基板，所述透明有机材料层背对所述阻挡层的一面为所述透明有机材料层的背面，所述光学指纹识别传感器设置在所述透明有机材料层的背面上；
所述透明有机材料层的背面上设置有凹槽，所述光学指纹识别传感器设置在所述凹槽内，所述透明有机材料层为聚酯薄膜层。
在本申请所提供的显示装置中，所述缓冲层的材料为氮化硅和氧化硅中的至少一种。
在本申请所提供的显示装置中，所述光学指纹识别传感器的数量为多个，多个所述光学指纹识别传感器分布在所述透明有机材料层的背面上，且位置与显示面板的部分显示区域或全部显示区域相对应。
在本申请所提供的显示装置中，多个所述光学指纹识别传感器呈阵列式分布在所述透明有机材料层的背面上。
在本申请所提供的显示装置中，所述显示面板为柔性AMOLED显示面板，所述显示面板还包括依次设置在所述阵列基板上的发光层、薄膜封装层、触控层、偏光片以及盖板。
本申请实施例还提供一种显示装置，包括显示面板以及光学指纹识别传感器；
所述显示面板包括自下而上依次层叠设置的透明有机材料层、阻挡层、缓冲层以及阵列基板，所述透明有机材料层背对所述阻挡层的一面为所述透明有机材料层的背面，所述光学指纹识别传感器设置在所述透明有机材料层的背面上。
在本申请所提供的显示装置中，所述透明有机材料层的背面上设置有凹槽，所述光学指纹识别传感器设置在所述凹槽内。
在本申请所提供的显示装置中，所述缓冲层的材料为氮化硅和氧化硅中的至少一种。
在本申请所提供的显示装置中，所述透明有机材料层为聚酯薄膜层。
在本申请所提供的显示装置中，所述光学指纹识别传感器的数量为多个，多个所述光学指纹识别传感器分布在所述透明有机材料层的背面上，且位置与显示面板的部分显示区域或全部显示区域相对应。
在本申请所提供的显示装置中，多个所述光学指纹识别传感器呈阵列式分布在所述透明有机材料层的背面上。
在本申请所提供的显示装置中，所述显示面板为柔性AMOLED显示面板，所述显示面板还包括依次设置在所述阵列基板上的发光层、薄膜封装层、触控层、偏光片以及盖板。
本申请实施例还提供一种显示装置的制备方法，包括：
提供一基底；
在所述基底上依次形成缓冲层和阵列基板；
除去所述基底，并在所述缓冲层背对所述阵列基板的一面上形成阻挡层；
在所述阻挡层背对所述缓冲层的一面上形成透明有机材料层，所述透明有机材料层背对所述阻挡层的一面为所述透明有机材料层的背面；
在所述透明有机材料层的背面上安装光学指纹识别传感器。
在本申请所提供的制备方法中，在所述阻挡层背对所述缓冲层的一面上形成透明有机材料层之后，还包括：
在所述透明有机材料层的背面形成凹槽；
所述在所述透明有机材料层的背面上安装光学指纹识别传感器，包括：将光学指纹识别传感器安装在所述凹槽内。
在本申请所提供的制备方法中，所述提供一基底，包括：
提供一玻璃基板；在所述玻璃基板上形成聚酰亚胺膜层，以形成基底；
所述除去所述基底，包括：利用激光剥离工艺将所述玻璃基板和所述聚酰亚胺膜层分离，然后利用激光剥离工艺将所述聚酰亚胺膜层和所述缓冲层分离，以除去所述基底。
在本申请所提供的制备方法中，在所述基底上依次形成缓冲层和阵列基板之后，还包括：在所述阵列基板上依次形成发光层、薄膜封装层和触控层；在所述触控层上形成偏光片或者保护膜。
在本申请所提供的制备方法中，所述透明有机材料层为聚酯薄膜层。
在本申请所提供的制备方法中，所述缓冲层的材料为氮化硅和氧化硅中的至少一种。
在本申请所提供的制备方法中，所述光学指纹识别传感器的数量为多个，多个所述光学指纹识别传感器的位置与显示装置的部分显示区域或全部显示区域相对应。
 有益效果
本申请的显示装置中，包括显示面板以及光学指纹识别传感器，显示面板包括自下而上依次层叠设置的透明有机材料层、阻挡层、缓冲层以及阵列基板，透明有机材料层背对阻挡层的一面为透明有机材料层的背面，其中光学指纹识别传感器设置在透明有机材料层的背面上，通过采用透明有机材料层、阻挡层和缓冲层作为显示面板的背板，与现有采用PI基板作为背板的方式相比，可以提高光线的透过率，使得光学指纹识别传感器能接收到更多手指反射的光线，提高指纹识别的准确性。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的显示装置的一结构示意图；
图2是本申请实施例提供的显示装置的另一结构示意图；
图3是本申请实施例提供的显示装置的又一结构示意图；
图4是本申请实施例提供的显示装置中，不同数量的光学指纹识别传感器所对应的指纹识别区域的示意图；
图5是本申请实施例提供的显示装置的制备方法一流程示意图；
图6是本申请实施例提供的显示装置的制备方法的一流程结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
参阅图1，本申请显示装置的一实施例中，显示装置包括显示面板10以及光学指纹识别传感器20。光学指纹识别传感器20集成在显示面板10上。
其中，显示面板10包括自下而上依次层叠设置的透明有机材料层11、阻挡层（Barrier Film层）12、缓冲层（Buffer层）13以及阵列基板14，各层之间可以通过光学胶（Optically Clear Adhesive，OCA）或者其他粘接剂进行粘合。进一步地，显示面板10可以是柔性AMOLED显示面板，其还可以包括依次设置在阵列基板14上的发光层（Electroluminescent ，EL）15、薄膜封装层（Thin Film Encapsulation ，TFE）16、触控层17、偏光片18以及盖板19。其中，阵列基板14上形成有薄膜晶体管阵列，用于驱动发光层15发光，以实现画面显示。
当然，在其他实施例中，显示面板10也可以是刚性AMOLED显示面板或者其他类型的显示面板。
其中，透明有机材料层11为有机物形成，比如可以是聚酯薄膜（Polyester Film ，PET）层，可以提高显示面板10的挺性。阻挡层12为透明材料制成。缓冲层13的材料可以是无机物，比如可以是氮化硅和氧化硅中的至少一种，如可以是氮化硅或者氧化硅，或者氮化硅和氧化硅的组合。
透明有机材料层11背对阻挡层12的一面为背面111，也可以理解为显示面板10的背面，光学指纹识别传感器20设置在透明有机材料层11的背面111上，且位置可以与显示面板10的显示区域相对应，由此当用户的手指放置在显示面板10的显示区域中以进行指纹操作时，手指反射的光线经过阵列基板14、缓冲层13、阻挡层12以及透明有机材料层11后，被光学指纹识别传感器20所接收，光学指纹识别传感器20通过接收手指反射的光线从而实现指纹识别。
本实施例中，通过利用透明有机材料层11、阻挡层12以及缓冲层13作为显示面板20的背板来承载阵列基板14等器件，将光学指纹识别传感器20设置在透明有机材料层11的背面，相比于采用PI基板作为背板的方式相比，提高光线的透过率，使得光学指纹识别传感器能接收到更多手指反射的光线，提高指纹识别的准确性。
参阅图2，在本申请显示装置的另一实施例中，在透明有机材料层11的背面111上可以设置凹槽112，光学指纹识别传感器20设置在凹槽112内，由此有利于降低显示装置的厚度。
其中，光学指纹识别传感器20的数量可以是1个、2个或者更多个，以相应地实现局部指纹识别或者全面屏指纹识别，具体的数量可以根据实际需要进行设置。比如，参阅图3，当光学指纹识别传感器20有多个时，多个光学指纹识别传感器20分布设置在透明有机材料层11的背面上，可以是呈阵列式分布，也可以是无规则的错乱式分布。其中，光学指纹识别传感器20的数量以及分布的位置不同，显示面板20的显示区域中的指纹识别区域的大小和位置也相应不同。
结合图4所示，图4为不同数量的光学指纹识别传感器所对应的指纹识别区域的示意图。图4的a图中，光学指纹识别传感器20的数量可以设置得较少，比如设置为1个，该1个指纹识别传感器20在透明有机材料层11上的位置可以与显示区域下方的一小块区域对应，此时指纹识别区域41较小；在b图中，光学指纹识别传感器20的数量可以设置得较多，比如可以是3个或5个等，这些光学指纹识别传感器比如均分布在显示区域下方，比如占整个显示区域的一半，此时可以获得较大的指纹识别区域41；在c图中，光学指纹识别传感器的数量更多，可以分布在整个显示区域内，以使得整个显示区域均可以实现指纹识别，此时指纹识别区域41为全屏区域。
参阅图5，本申请显示装置的制备方法一实施例中，该制备方法用于制作上述任一实施例的显示装置，可以包括如下步骤：
S501、提供一基底。
具体地，步骤S501可以包括如下子步骤：
（11）提供一玻璃基板。
（12）在玻璃基板上形成聚酰亚胺（Polyimide ，PI）膜层，以形成基底。
因此，本实施例中，基底可以是玻璃基板和PI膜共同形成，或者在其他实施例中可以是玻璃基板。
S502、在基底上依次形成缓冲层和阵列基板。
其中，缓冲层的材料为无机物，可以是为氮化硅和氧化硅中的至少一种。
S503、在阵列基板上在依次形成发光层、薄膜封装层和触控层，以及在触控层上形成偏光片或者保护膜。
其中，当在触控层上形成保护膜时，在后续制程中除去保护膜后可以在触控层上形成偏光片，之后可以在偏光片上形成盖板。或者，在其他实施例中，步骤S503中，在形成阵列基板之后，也可以不形成触控层，此时可以是在阵列基板上依次发光层、薄膜封装层、偏光片以及保护膜，在后续制程中撕掉保护膜后再在偏光片上形成触控层，并贴上盖板。
S504、除去基底，并在缓冲层背对阵列基板的一面上形成阻挡层。
结合图6，基底包括玻璃基板61和聚酰亚胺膜层62，在基底的聚酰亚胺膜层62上形成缓冲层13、阵列基板14、发光层15、封装膜层16、触控层17以及偏光片18之后，除去基底。具体地，如图6的步骤S601，可以利用激光剥离工艺（Laser Lift-Off ，LLO）先将玻璃基板61和聚酰亚胺膜层62分离，然后再利用激光剥离工艺将聚酰亚胺膜层62和缓冲层13分离，从而除去基底。之后，在步骤602中，在缓冲层13背对阵列基板14的一面上形成阻挡层12。
S505、在阻挡层背对缓冲层的一面上形成透明有机材料层，透明有机材料层背对阻挡层的一面为透明有机材料层的背面。
对应图6所示的步骤603，在阻挡层12背对缓冲层13的一面上形成透明有机材料层11。由此，通过步骤S501~S505，可以制作得到显示装置中的显示面板。
S506、在透明有机材料层的背面上安装光学指纹识别传感器。
如图6所示的步骤603，将光学指纹识别传感器20安装在透明有机材料层11的背面上。
在一种实施方式中，在形成透明有机材料层之后，可以在透明有机材料的背面上形成凹槽，之后将光学指纹识别传感器安装在该凹槽内，由此可以降低显示装置的厚度。此外，光学指纹识别传感器的数量可以根据实际需要进行设置，比如可以是1个、2个或更多个，其中，当有多个光学指纹识别传感器时，多个光学指纹识别传感器的位置可以是与显示装置的部分显示区域或者全部显示区域相对应。
本申请实施例中，通过采用透明有机材料层、阻挡层和缓冲层作为承载阵列基板等器件的背板，与现有采用PI基板作为背板的方式相比，可以提高光线的透过率，使得光学指纹识别传感器能接收到更多手指反射的光线，提高指纹识别的准确性。
以上对本申请实施例所提供的一种显示装置及其制备方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (19)

  1. 一种显示装置，其中，包括显示面板以及光学指纹识别传感器；
    所述显示面板包括自下而上依次层叠设置的透明有机材料层、阻挡层、缓冲层以及阵列基板，所述透明有机材料层背对所述阻挡层的一面为所述透明有机材料层的背面，所述光学指纹识别传感器设置在所述透明有机材料层的背面上；
    所述透明有机材料层的背面上设置有凹槽，所述光学指纹识别传感器设置在所述凹槽内，所述透明有机材料层为聚酯薄膜层。
  2. 根据权利要求1所述的显示装置，其中，所述缓冲层的材料为氮化硅和氧化硅中的至少一种。
  3. 根据权利要求1所述的显示装置，其中，所述光学指纹识别传感器的数量为多个，多个所述光学指纹识别传感器分布在所述透明有机材料层的背面上，且位置与显示面板的部分显示区域或全部显示区域相对应。
  4. 根据权利要求3所述的显示装置，其中，多个所述光学指纹识别传感器呈阵列式分布在所述透明有机材料层的背面上。
  5. 根据权利要求1所述的显示装置，其中，所述显示面板为柔性AMOLED显示面板，所述显示面板还包括依次设置在所述阵列基板上的发光层、薄膜封装层、触控层、偏光片以及盖板。
  6. 一种显示装置，其中，包括显示面板以及光学指纹识别传感器；
    所述显示面板包括自下而上依次层叠设置的透明有机材料层、阻挡层、缓冲层以及阵列基板，所述透明有机材料层背对所述阻挡层的一面为所述透明有机材料层的背面，所述光学指纹识别传感器设置在所述透明有机材料层的背面上。
  7. 根据权利要求6所述的显示装置，其中，所述透明有机材料层的背面上设置有凹槽，所述光学指纹识别传感器设置在所述凹槽内。
  8. 根据权利要求6所述的显示装置，其中，所述缓冲层的材料为氮化硅和氧化硅中的至少一种。
  9. 根据权利要求6所述的显示装置，其中，所述透明有机材料层为聚酯薄膜层。
  10. 根据权利要求6所述的显示装置，其中，所述光学指纹识别传感器的数量为多个，多个所述光学指纹识别传感器分布在所述透明有机材料层的背面上，且位置与显示面板的部分显示区域或全部显示区域相对应。
  11. 根据权利要求10所述的显示装置，其中，多个所述光学指纹识别传感器呈阵列式分布在所述透明有机材料层的背面上。
  12. 根据权利要求6所述的显示装置，其中，所述显示面板为柔性AMOLED显示面板，所述显示面板还包括依次设置在所述阵列基板上的发光层、薄膜封装层、触控层、偏光片以及盖板。
  13. 一种显示装置的制备方法，其中，包括：
    提供一基底；
    在所述基底上依次形成缓冲层和阵列基板；
    除去所述基底，并在所述缓冲层背对所述阵列基板的一面上形成阻挡层；
    在所述阻挡层背对所述缓冲层的一面上形成透明有机材料层，所述透明有机材料层背对所述阻挡层的一面为所述透明有机材料层的背面；
    在所述透明有机材料层的背面上安装光学指纹识别传感器。
  14. 根据权利要求13所述的制备方法，其中，在所述阻挡层背对所述缓冲层的一面上形成透明有机材料层之后，还包括：
    在所述透明有机材料层的背面形成凹槽；
    所述在所述透明有机材料层的背面上安装光学指纹识别传感器，包括：将光学指纹识别传感器安装在所述凹槽内。
  15. 根据权利要求13所述的制备方法，其中，所述提供一基底，包括：
    提供一玻璃基板；
    在所述玻璃基板上形成聚酰亚胺膜层，以形成基底；
    所述除去所述基底，包括：利用激光剥离工艺将所述玻璃基板和所述聚酰亚胺膜层分离，然后利用激光剥离工艺将所述聚酰亚胺膜层和所述缓冲层分离，以除去所述基底。
  16. 根据权利要求13所述的制备方法，其中，在所述基底上依次形成缓冲层和阵列基板之后，还包括：
    在所述阵列基板上依次形成发光层、薄膜封装层和触控层；
    在所述触控层上形成偏光片或者保护膜。
  17. 根据权利要求13所述的制备方法，其中，所述透明有机材料层为聚酯薄膜层。
  18. 根据权利要求13所述的制备方法，其中，所述缓冲层的材料为氮化硅和氧化硅中的至少一种。
  19. 根据权利要求13所述的制备方法，其中，所述光学指纹识别传感器的数量为多个，多个所述光学指纹识别传感器的位置与显示装置的部分显示区域或全部显示区域相对应。
PCT/CN2018/120398 2018-10-15 2018-12-11 显示装置及其制备方法 Ceased WO2020077772A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/615,499 US11308726B2 (en) 2018-10-15 2018-12-11 Display device and fabricating method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811195089.6 2018-10-15
CN201811195089.6A CN109446941A (zh) 2018-10-15 2018-10-15 显示装置及其制备方法

Publications (1)

Publication Number Publication Date
WO2020077772A1 true WO2020077772A1 (zh) 2020-04-23

Family

ID=65546711

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/120398 Ceased WO2020077772A1 (zh) 2018-10-15 2018-12-11 显示装置及其制备方法

Country Status (3)

Country Link
US (1) US11308726B2 (zh)
CN (1) CN109446941A (zh)
WO (1) WO2020077772A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110068947A (zh) * 2019-04-02 2019-07-30 惠科股份有限公司 显示面板以及显示装置
CN111725282B (zh) 2020-06-19 2023-05-19 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090160817A1 (en) * 2007-12-24 2009-06-25 Wintek Corporation Transparent capacitive touch panel and manufacturing method thereof
US20100265207A1 (en) * 2009-04-21 2010-10-21 Industrial Technology Research Institute Touch-sensing display apparatus and fabricating method thereof
CN107403877A (zh) * 2017-06-19 2017-11-28 武汉华星光电半导体显示技术有限公司 Oled面板的封装方法
CN107579104A (zh) * 2017-08-31 2018-01-12 京东方科技集团股份有限公司 一种具有指纹识别的柔性显示面板及制造方法
CN107946346A (zh) * 2017-11-24 2018-04-20 武汉华星光电半导体显示技术有限公司 一种全屏指纹识别触控显示屏

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3959678B2 (ja) * 2001-07-13 2007-08-15 ミネベア株式会社 表示装置用タッチパネル
US7660488B2 (en) * 2004-11-04 2010-02-09 Dr Systems, Inc. Systems and methods for viewing medical images
CN105118398B (zh) * 2015-09-28 2018-01-02 上海和辉光电有限公司 一种柔性显示装置及其制造方法
CN108279459B (zh) * 2017-01-05 2019-12-24 京东方科技集团股份有限公司 显示模组及显示装置
US10658592B2 (en) 2017-07-31 2020-05-19 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Method for fabricating flexible display device, flexible display device, and display apparatus
CN107464893A (zh) * 2017-07-31 2017-12-12 武汉华星光电半导体显示技术有限公司 柔性显示器件的制备方法、柔性显示器件及显示器
KR102487063B1 (ko) * 2017-09-27 2023-01-11 삼성전자주식회사 광학 지문 센서를 구비한 전자 장치
CN108073900B (zh) 2017-12-14 2021-01-08 京东方科技集团股份有限公司 用于指纹识别的柔性显示面板、显示装置及指纹识别方法
CN108549499B (zh) * 2018-03-30 2021-07-06 武汉天马微电子有限公司 一种显示面板及显示装置
CN207947317U (zh) * 2018-04-03 2018-10-09 北京蜃景光电科技有限公司 Oled器件的封装结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090160817A1 (en) * 2007-12-24 2009-06-25 Wintek Corporation Transparent capacitive touch panel and manufacturing method thereof
US20100265207A1 (en) * 2009-04-21 2010-10-21 Industrial Technology Research Institute Touch-sensing display apparatus and fabricating method thereof
CN107403877A (zh) * 2017-06-19 2017-11-28 武汉华星光电半导体显示技术有限公司 Oled面板的封装方法
CN107579104A (zh) * 2017-08-31 2018-01-12 京东方科技集团股份有限公司 一种具有指纹识别的柔性显示面板及制造方法
CN107946346A (zh) * 2017-11-24 2018-04-20 武汉华星光电半导体显示技术有限公司 一种全屏指纹识别触控显示屏

Also Published As

Publication number Publication date
US11308726B2 (en) 2022-04-19
CN109446941A (zh) 2019-03-08
US20210365658A1 (en) 2021-11-25

Similar Documents

Publication Publication Date Title
CN107799574B (zh) 柔性显示装置及其制作方法
US9773853B2 (en) Organic light-emitting diode display with bent substrate
US10762326B2 (en) Fingerprint identification device and manufacturing method thereof, and electronic device
US11360611B2 (en) Flexible touch substrate, preparation method thereof and touch display device
US9933870B2 (en) Back plate member for flexible display, display apparatus including the same, and method of manufacturing the same
CN103151467B (zh) 集成有触摸屏的有机发光显示装置及其制造方法
US10338708B2 (en) Flexible touch screen, method for manufacturing the same and touch device
CN106775062A (zh) 一种有机发光二极管触控显示面板和触控显示装置
WO2018000824A1 (zh) 显示面板及其制备方法、显示装置
CN108807480A (zh) 显示基板母板及其制作方法、和显示装置
CN111416056A (zh) 显示面板及显示装置
WO2021139626A1 (zh) 显示基板、拼接显示面板及显示装置
CN111244014B (zh) 一种转移基板、驱动背板、转移方法及显示装置
US10777624B2 (en) Display assembly and manufacturing method thereof and display apparatus
CN217847960U (zh) 显示设备
US11307688B2 (en) Thermal transfer substrate, touch display panel and manufacturing methods therefor, and display device
CN114023906B (zh) 显示面板、显示装置、待切割基板的制作方法
CN108647586A (zh) 显示装置
WO2020077772A1 (zh) 显示装置及其制备方法
CN108279810A (zh) 显示组件及其制备方法、显示装置
US12105366B2 (en) Preparation method of display module, display module, and electronic device
KR20200120784A (ko) 표시장치 및 표시장치 제조방법
WO2020244502A1 (zh) 一种触控显示基板及其制作方法、触控显示装置
CN108493354B (zh) Oled基板及显示装置
WO2017012260A1 (zh) 电容式触控基板和触控显示屏

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18937030

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18937030

Country of ref document: EP

Kind code of ref document: A1