WO2020077638A1 - 背衬块、超声探头、面阵超声探头及超声诊断成像设备 - Google Patents
背衬块、超声探头、面阵超声探头及超声诊断成像设备 Download PDFInfo
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- WO2020077638A1 WO2020077638A1 PCT/CN2018/111095 CN2018111095W WO2020077638A1 WO 2020077638 A1 WO2020077638 A1 WO 2020077638A1 CN 2018111095 W CN2018111095 W CN 2018111095W WO 2020077638 A1 WO2020077638 A1 WO 2020077638A1
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
Definitions
- This application relates to the field of ultrasound, in particular to backing blocks, ultrasound probes, area array ultrasound probes and ultrasound diagnostic imaging equipment.
- Ultrasound probe is an important component of ultrasound equipment (such as ultrasound diagnostic imaging equipment). Its working principle is to use the piezoelectric effect to convert the excitation electrical pulse signal of the ultrasound machine into an ultrasound signal into the patient's body, and then reflect the ultrasound echo signal reflected by the tissue. Converted to electrical signals to enable detection of tissues.
- the array element array of the ultrasonic probe needs to be connected with the control circuit of the host, and how to make the circuit connection of the array element array of the ultrasonic probe is a very important process technology for manufacturing the ultrasonic probe.
- the traditional method is to realize the circuit connection to the array of element arrays by soldering wires, but soldering the leads on such an array of high-density micro-spacing ultrasonic probes requires very high skills for the operator, and at the same time High temperature chromium head will also have a certain effect on the performance of piezoelectric materials.
- Another approach is to use multi-layer flexible circuit boards to achieve circuit connection, but in addition to the high positioning requirements, this method also increases the difficulty of bonding and cutting the ultrasonic probe, and the flexible circuit board itself The acoustic performance of the ultrasound probe has a greater impact.
- the present application mainly provides a backing block of an ultrasound probe to reduce the manufacturing difficulty of the circuit connection of the array elements in the ultrasound probe.
- the present application also provides an ultrasound probe using such a backing block, a surface array ultrasound probe, and an ultrasound diagnostic imaging device using the ultrasound probe.
- An embodiment provides a backing block of an ultrasonic probe, which includes a backing block body and a connection circuit laid on the surface of the backing block body, the backing block body has a first for matching with the array of array elements One end face, a second end face for cooperating with the switching circuit, and a side wall connected between the first end face and the second end face, the connection circuit has a first connection end for connecting to the array of elements and for A second connection end connected to the switching circuit, the first connection end is located on the first end face, and the second connection end is located on the second end face and / or side wall.
- connection circuit includes a plurality of leads, the first connection end is one end of the lead, the second connection end is the other end of the lead, and the lead is separated from the first on the surface of the backing block body The end surface extends to the side wall or the second end surface.
- the side wall includes a first side wall and a second side wall disposed oppositely, and the second connection ends are distributed on the first side wall and the second side wall.
- the first connection ends of all the lead wires are arranged in parallel on the first end face at a set distance, and from the outermost lead wire, the second connection of the odd-numbered lead wires The end extends along the surface of the backing block body to the first side wall, and the second connection ends of the leads at even positions extend along the surface of the backing block body to the second side wall.
- the first connecting ends of all the leads are spaced at the same interval.
- connection circuit is formed on the surface of the backing block body by a 3D circuit manufacturing method.
- An embodiment provides an ultrasonic probe, including an array element array and a switching circuit, and further comprising a backing block as described in any one of the above, the array element array is mounted on the first of the backing block The end face is connected to the first connection end of the connection circuit.
- the transition circuit is installed on the second end face of the backing block and connected to the second connection end of the connection circuit.
- the first end face is coated with glue to fix the first connection end to the array of elements.
- An embodiment provides an area array ultrasound probe, which includes an array element array and a switching circuit, and further includes a backing block according to any one of the above, the array element array is mounted on the backing block The first end face is connected to the first connection end of the connection circuit.
- the switching circuit is installed on the second end face of the backing block and connected to the second connection end of the connection circuit.
- the first end face is coated with glue to fix the first connection end to the array of elements.
- An embodiment provides an ultrasound diagnostic imaging device, including the ultrasound probe or the area array ultrasound probe according to any one of the above.
- the backing block according to the above embodiment includes a backing block body and a connecting circuit, and the connecting circuit is laid on the surface of the backing block body.
- the first connection end for connecting to the array element on the connecting circuit is located on the first end surface of the backing block body, and the array element array can be directly fixed to the first end surface to realize the connection with the first connection end
- the connection reduces the manufacturing difficulty of the array connection of the array element, and compared with the existing soldering scheme and flexible circuit board connection scheme, it can not only reduce the difficulty of bonding and cutting when manufacturing the ultrasonic probe, but also help to improve the ultrasonic The acoustic performance of the probe.
- FIG. 1 is a schematic structural diagram of a backing block in an embodiment of the present application.
- FIG. 2 is a schematic structural diagram of a backing block after an array of elements and an acoustic lens are installed in an embodiment of the present application.
- connection and “connection” mentioned in this application, unless otherwise specified, include direct and indirect connection (connection).
- the backing block 100 includes a backing block body 110 and a connection circuit 120 mounted on the backing block body 110.
- the backing block body 110 can be made of a common backing block material. On the one hand, it serves as an acoustic attenuation material to absorb the adverse ultrasonic waves propagated backward by the ultrasonic probe, and on the other hand, it serves as a structural support block to ensure the structure of the ultrasonic probe array element array Sex.
- the connection circuit 120 is used to connect the array element array, and connects the array element array to the control circuit of the host computer, so that the control circuit drives the array element.
- the connecting circuit 120 usually has a plurality of leads 121, and each lead 121 is independently arranged, so as to communicate the corresponding array element with the corresponding switching circuit.
- the backing block body 110 has a first end surface 111 for mating with the array of array elements and a second end surface 112 for mating with the switching circuit.
- One end of the lead 121 is a first connection end 1211 for connecting to the array of elements, and the other end is a second connection end 1212 for connecting to the switching circuit.
- the lead 121 extends from the first end surface 111 to the side wall (not shown in the figure) or the second end surface 112 on the surface of the backing block body 110.
- the first connection end 1211 is located on the first end surface 111, which can facilitate the connection between the array element array and the lead 121.
- the array element array When connecting with the array element array, the array element array can be directly fixed to the first end surface 111, and the connection with the first connecting end 1211 can be achieved, which reduces the manufacturing difficulty of the array element circuit connection, and compared with the existing
- the welding solution and flexible circuit board connection solution can not only reduce the difficulty of bonding and cutting when manufacturing the ultrasonic probe, but also help to improve the acoustic performance of the ultrasonic probe. Especially for high-frequency and ultra-high-frequency ultrasonic probes, the effect is better.
- the second connection end 1212 of the lead 121 is provided on the second end surface 112 or the side wall, which can facilitate the connection of the second connection end 1212 and the switching circuit, and can avoid the influence on the array of elements. At the same time, there is no shielding of the array of elements, and a larger operating space is provided for the connection between the second connection end 1212 and the switching circuit.
- the second connecting end 1212 may be located on the second end surface 112 or any side wall.
- the side wall includes a first side wall 1131 and a second side wall 1132 that are oppositely arranged.
- FIG. 1 mainly shows the first side wall 1131 and the second side wall because of an angle problem.
- 1132 is located opposite to the first side wall 1131.
- the second connection ends 1212 are distributed on the first side wall 1131 and the second side wall 1132.
- the second connection ends 1212 are dispersed on the two side walls, the number of corresponding second connection ends 1212 on each side wall is reduced, so that the spacing between the second connection ends 1212 of the adjacent leads 121 becomes larger, It is convenient to align the second connection end 1212 with the corresponding position of the switching circuit, and reduce the manufacturing difficulty.
- the first side wall 1131 and the second side wall 1132 are arranged oppositely, which can ensure the uniformity of the distribution of the second connection end 1212.
- the first connection ends 1211 of all leads 121 are arranged on the first end surface 111 in parallel and spaced apart by a set distance. From the outermost lead 121 (as calculated from the left or right side of FIG. 1), the second connection end 1212 of the odd-numbered lead 121 extends along the surface of the backing block body 110 to the first side wall 1131, The second connection end 1212 of the lead 121 at an even position extends along the surface of the backing block body 110 to the second side wall 1132.
- the leads 121 are arranged in order of the first position, the second position, the third position and the fourth position, so that they are located at the first position and the third position
- the second connection end 1212 of the lead 121 of the bit extends along the surface of the backing block body 110 to the first side wall 1131, and the second connection end 1212 of the lead 121 at the second and fourth positions follows the backing block
- the surface of the body 110 extends to the second side wall 1132.
- the first connecting ends 1211 of all the leads 121 are spaced at the same interval. This not only ensures the unity of the entire connecting circuit, but also facilitates manufacturing.
- the first connection ends 1211 of the lead 121 may be separated by different intervals.
- connection circuit 120 is formed on the surface of the backing block body 110 by a 3D circuit manufacturing method.
- the 3D circuit manufacturing method refers to a three-dimensional circuit diagram formed in the X, Y, and Z dimensions of the circuit diagram. This term is mainly used to distinguish the traditional two-dimensional circuit diagram formed on the plane of the board.
- an embodiment of the present application also provides an ultrasonic probe, please refer to FIGS. 1 and 2, the ultrasonic probe includes an array element array 200, a switching circuit (not shown in the figure), and any implementation as described above ⁇ ⁇ ⁇ ⁇ ⁇ 100 ⁇ Example backing block 100.
- the ultrasound probe will also include components such as the acoustic window 300, which is not repeated here.
- the array element array 200 is installed on the first end surface 111 of the backing block 100 and is connected to the first connection end 1211 of the lead 121 on the first end surface 111.
- the switching circuit is mounted on the second end surface 112 of the backing block 100 and is connected to the second connection end 1212 of the lead 121.
- the switching circuit is connected to the control circuit of the host through a cable, and the array circuit 200 can be connected to the control circuit of the host through the switching circuit and the connecting circuit 120 on the backing block 100.
- the first end surface 111 is coated with glue, so that the first connection end 1211 and the array element array 200 are fixed by bonding.
- the whole process can be carried out at room temperature without the high temperature problem of welding.
- this adhesive fixation is face-to-face connection, and it only needs to design the alignment of the array element array 200 and the first connection end 1211, which is easy to manufacture.
- an embodiment of the present application further provides an area array ultrasound probe. Please refer to FIGS. 1 and 2.
- the area array ultrasound probe includes an array element array 200, a switching circuit (not shown), and The backing block 100 shown in any of the above embodiments.
- the area array ultrasound probe will also include components such as the acoustic window 300, which is not repeated here.
- the array element array 200 is installed on the first end surface 111 of the backing block 100 and is connected to the first connection end 1211 of the lead 121 on the first end surface 111.
- the switching circuit is mounted on the second end surface 112 of the backing block 100 and is connected to the second connection end 1212 of the lead 121.
- the switching circuit is connected to the control circuit of the host through a cable, and the array circuit 200 can be connected to the control circuit of the host through the switching circuit and the connecting circuit 120 on the backing block 100.
- the first end surface 111 is coated with glue, so that the first connection end 1211 and the array element array 200 are fixed by bonding.
- the whole process can be carried out at room temperature without the high temperature problem of welding.
- this adhesive fixation is face-to-face connection, and it only needs to design the alignment of the array element array 200 and the first connection end 1211, which is easy to manufacture.
- an embodiment provides an ultrasound diagnostic imaging device, such as an ultrasound diagnostic apparatus.
- the ultrasound diagnostic imaging device includes the above-mentioned ultrasound probe or area array ultrasound probe.
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Abstract
一种背衬块、超声探头、面阵超声探头以及超声诊断成像设备。该背衬块包括背衬块本体和连接电路，该连接电路铺设在背衬块本体表面。尤其是，该连接电路上用于与阵元阵列连接的第一连接端位于背衬块本体的第一端面，可以将阵元阵列直接与第一端面进行固定，就可实现与第一连接端的连接，降低了阵元阵列电路连接的制造难度，而且相对于现有的焊接方案和柔性电路板连接方案来说，不但可以降低超声探头制造时的粘接、切割难度，同时也有利于提高超声探头的声学性能。
Description
本申请涉及超声领域，具体涉及背衬块、超声探头、面阵超声探头及超声诊断成像设备。
超声探头是超声设备（例如超声诊断成像设备）的重要部件，其工作原理是利用压电效应将超声整机的激励电脉冲信号转换为超声波信号进入患者体内，再将组织反射的超声回波信号转换为电信号，从而实现对组织的检测。
其中，超声探头的阵元阵列需要与主机的控制电路实现电路连接，而如何进行超声探头阵元阵列的电路连接是制造超声探头一项非常重要的工艺技术。目前，传统的做法是以焊接导线的方式来实现对阵元矩阵的电路连接，但在超声探头如此高密度微间距的阵元阵列上焊接引线，对作业人员来说需要具有非常高的技巧，同时高温铬头也会对压电材料的性能产生一定的影响。另一种做法则是采用多层柔性电路板来实现电路连接，但这种方式除了对定位要求较高外，同时还增加了超声探头的粘接和切割难度，而且柔性电路板本身也会对超声探头的声学性能造成较大的影响。
本申请主要提供一种超声探头的背衬块，用以降低超声探头中阵元阵列电路连接的制造难度。本申请还同时提供了一种采用了这种背衬块的超声探头，面阵超声探头以及采用了该超声探头的超声诊断成像设备。
一种实施例中提供一种超声探头的背衬块，包括背衬块本体和铺设在所述背衬块本体表面的连接电路，所述背衬块本体具有用于与阵元阵列配合的第一端面、用于与转接电路配合的第二端面以及连接在第一端面和第二端面之间的侧壁，所述连接电路具有用于与阵元阵列连接的第一连接端和用于与所述转接电路连接的第二连接端，所述第一连接端位于所述第一端面上，所述第二连接端位于所述第二端面和/或侧壁上。
一种实施例中，所述连接电路包括若干引线，所述第一连接端为引线的一端，所述第二连接端为引线的另一端，所述引线在背衬块本体的表面自第一端面延伸至侧壁或第二端面。
一种实施例中，所述侧壁包括相对设置的第一侧壁和第二侧壁，所述第二连接端分布在所述第一侧壁和第二侧壁上。
一种实施例中，所述引线为至少两个，所有引线的第一连接端在第一端面上平行且间隔设定距离排列，自最外侧的引线起，位于奇数位的引线的第二连接端顺着背衬块本体的表面延伸至第一侧壁，位于偶数位的引线的第二连接端顺着背衬块本体的表面延伸至第二侧壁。
一种实施例中，所有引线的第一连接端之间间隔相同的间距。
一种实施例中，所述连接电路采用3D电路制造方式形成在背衬块本体的表面。
一种实施例中提供了一种超声探头，包括阵元阵列和转接电路，还包括如上述任一项所述的背衬块，所述阵元阵列安装在所述背衬块的第一端面上，并与所述连接电路的第一连接端连接，所述转接电路安装在背衬块的第二端面上，并与所述连接电路的第二连接端连接。
一种实施例中，所述第一端面涂覆胶液，使所述第一连接端与阵元阵列粘接固定。
一种实施例中提供了一种面阵超声探头，包括阵元阵列和转接电路，还包括如上述任一项所述的背衬块，所述阵元阵列安装在所述背衬块的第一端面上，并与所述连接电路的第一连接端连接，所述转接电路安装在背衬块的第二端面上，并与所述连接电路的第二连接端连接。
一种实施例中，所述第一端面涂覆胶液，使所述第一连接端与阵元阵列粘接固定。
一种实施例中提供了一种超声诊断成像设备，包括如上述任一项所述的超声探头或者面阵超声探头。
依据上述实施例的背衬块，其包括背衬块本体和连接电路，该连接电路铺设在背衬块本体表面。尤其是，该连接电路上用于与阵元阵列连接的第一连接端位于背衬块本体的第一端面，可以将阵元阵列直接与第一端面进行固定，就可实现与第一连接端的连接，降低了阵元阵列电路连接的制造难度，而且相对于现有的焊接方案和柔性电路板连接方案来说，不但可以降低超声探头制造时的粘接、切割难度，同时也有利于提高超声探头的声学性能。
图1为本申请一种实施例中背衬块的结构示意图；
图2为本申请一种实施例中背衬块装上阵元阵列以及声透镜后的结构示意图。
具体实施方式
下面通过具体实施方式结合附图对本发明作进一步详细说明。其中不同实施方式中类似元件采用了相关联的类似的元件标号。在以下的实施方式中，很多细节描述是为了使得本申请能被更好的理解。然而，本领域技术人员可以毫不费力的认识到，其中部分特征在不同情况下是可以省略的，或者可以由其他元件、材料、方法所替代。在某些情况下，本申请相关的一些操作并没有在说明书中显示或者描述，这是为了避免本申请的核心部分被过多的描述所淹没，而对于本领域技术人员而言，详细描述这些相关操作并不是必要的，他们根据说明书中的描述以及本领域的一般技术知识即可完整了解相关操作。
另外，说明书中所描述的特点、操作或者特征可以以任意适当的方式结合形成各种实施方式。同时，方法描述中的各步骤或者动作也可以按照本领域技术人员所能显而易见的方式进行顺序调换或调整。因此，说明书和附图中的各种顺序只是为了清楚描述某一个实施例，并不意味着是必须的顺序，除非另有说明其中某个顺序是必须遵循的。
本文中为部件所编序号本身，例如“第一”、“第二”等，仅用于区分所描述的对象，不具有任何顺序或技术含义。而本申请所说“连接”、“联接”，如无特别说明，均包括直接和间接连接（联接）。
本申请一种实施例中提供一种超声探头的背衬块。请参考图1，该背衬块100包括背衬块本体110和安装在该背衬块本体110上的连接电路120。
该背衬块本体110可采用通常的背衬块材料制成，一方面作为声衰减材料吸收超声探头向后传播的不利超声波，另一方面作为结构支撑块，保证超声探头阵元阵列的结构可靠性。该连接电路120则用于阵元阵列连接，将阵元阵列与主机的控制电路连通，以便于控制电路对阵元进行驱动。该连接电路120通常具有多个引线121，每个引线121独立的设置，从而将对应阵元与对应转接电路连通。当然，在其他实施例中，也可能采用其他结构的连接电路来代替该引线，以下仅以引线为例进行说明。
请继续参考图1，该背衬块本体110具有用于与阵元阵列配合的第一端面111和用于与转接电路配合的第二端面112。该引线121的一端为用于与阵元阵列连接的第一连接端1211，另一端则为用于与转接电路连接的第二连接端1212。引线121在背衬块本体110的表面自第一端面111延伸至侧壁（图中未标号）或第二端面112。该第一连接端1211位于第一端面111，这样可方便阵元阵列与引线121的连接。在与阵元阵列连接时，可以将阵元阵列直接与第一端面111进行固定，就可实现与第一连接端1211的连接，降低了阵元阵列电路连接的制造难度，而且相对于现有的焊接方案和柔性电路板连接方案来说，不但可以降低超声探头制造时的粘接、切割难度，同时也有利于提高超声探头的声学性能。特别对于高频、超高频超声探头，效果更佳。
而且，将引线121的第二连接端1212设置到第二端面112或侧壁上，可更方便将第二连接端1212与转接电路的连接，能够避免对阵元阵列的影响。同时没有了阵元阵列的遮挡，也给第二连接端1212和转接电路的连接提供了更大的操作空间。
该第二连接端1212可位于第二端面112或任一个侧壁上。请参考图1，一种实施例中，该侧壁包括相对设置的第一侧壁1131和第二侧壁1132，图1因为角度问题主要示出了第一侧壁1131，该第二侧壁1132位于第一侧壁1131的对面。该第二连接端1212分布在第一侧壁1131和第二侧壁1132上。即第二连接端1212被分散到两个侧壁上，每个侧壁上对应的第二连接端1212数量减少，使相邻引线121的第二连接端1212之间的间距变的更大，便于将该第二连接端1212与转接电路对应位置对位连接，降低制造难度。而第一侧壁1131和第二侧壁1132相对设置，又可以保证第二连接端1212分布的统一性，在设计转接电路的对接结构时，只需要在与第一侧壁1131和第二侧壁1132所对应的位置设置连接端部即可，同样也可以降低制造难度。
一种可能实现的方式中，请继续参考图1，一种实施例中，引线121为至少两个，所有引线121的第一连接端1211在第一端面111上平行且间隔设定距离排列，自最外侧的引线121起（如从图1左侧或右侧算起），位于奇数位的引线121的第二连接端1212顺着背衬块本体110的表面延伸至第一侧壁1131，位于偶数位的引线121的第二连接端1212顺着背衬块本体110的表面延伸至第二侧壁1132。
例如，以4个引线121为例，从图1左侧算起，该引线121依次排列为第1位、第2位、第3位和第4位，如此，则位于第1位和第3位的引线121的第二连接端1212顺着背衬块本体110的表面延伸至第一侧壁1131，而位于第2位和第4位的引线121的第二连接端1212顺着背衬块本体110的表面延伸至第二侧壁1132。
这样可保证位于第一侧壁1131和第二侧壁1132上的第二连接端1212与其他相邻第二连接端1212具有更大的间距，从而便于第二连接端1212与转接电路的连接，同时还可利于后续装配电路连接板工序时对位定位。
进一步地，请参考图1，一种实施例中，所有引线121的第一连接端1211之间间隔相同的间距。这样不仅可保证整个连接电路的统一性，而且还有利于生产制造。
当然，某些实施例中，该引线121的第一连接端1211之间也可以间隔不同的间距。
为了将连接电路直接制造在背衬块本体110的表面，一种实施例中，该连接电路120采用3D电路制造方式形成在背衬块本体110的表面。该3D电路制造方式是在指电路线图在X、Y、Z三个维度上形成的立体电路线图，该叫法主要用于区别传统的在板材平面上形成的二维电路线图。
另一方面，本申请一种实施例还提供了一种超声探头，请参考图1和2，该超声探头包括阵元阵列200、转接电路（图中未示出）以及如上述任一实施例所示的背衬块100。
当然，该超声探头还会包括例如声窗300等部件，在此不在赘言。该阵元阵列200安装在背衬块100的第一端面111，并与引线121位于第一端面111的第一连接端1211连接。该转接电路安装在背衬块100的第二端面112，并与引线121的第二连接端1212连接。该转接电路通过电缆线与主机的控制电路连通，通过该转接电路以及背衬块100上的连接电路120可以将阵元阵列200与主机的控制电路连接。
一种实施例中，该第一端面111涂覆胶液，使第一连接端1211与阵元阵列200粘接固定。整个过程可在室温下进行，不存在焊接的高温问题。而且这种粘接固定是面与面连接，只需做好阵元阵列200与第一连接端1211的对位设计即可，易于加工制造。
另一方面，本申请一种实施例还提供了一种面阵超声探头，请参考图1和2，该面阵超声探头包括阵元阵列200、转接电路（图中未示出）以及如上述任一实施例所示的背衬块100。
当然，该面阵超声探头还会包括例如声窗300等部件，在此不在赘言。该阵元阵列200安装在背衬块100的第一端面111，并与引线121位于第一端面111的第一连接端1211连接。该转接电路安装在背衬块100的第二端面112，并与引线121的第二连接端1212连接。该转接电路通过电缆线与主机的控制电路连通，通过该转接电路以及背衬块100上的连接电路120可以将阵元阵列200与主机的控制电路连接。
一种实施例中，该第一端面111涂覆胶液，使第一连接端1211与阵元阵列200粘接固定。整个过程可在室温下进行，不存在焊接的高温问题。而且这种粘接固定是面与面连接，只需做好阵元阵列200与第一连接端1211的对位设计即可，易于加工制造。
进一步地，一种实施例提供一种超声诊断成像设备，例如超声诊断仪。该超声诊断成像设备包括上述的超声探头或者面阵超声探头。
以上应用了具体个例对本申请进行阐述，只是用于帮助理解本申请，并不用以限制本申请。对于本领域的一般技术人员，依据本申请的思想，可以对上述具体实施方式进行变化。
Claims (11)
- 一种超声探头的背衬块,其特征在于，包括背衬块本体和铺设在所述背衬块本体表面的连接电路，所述背衬块本体具有用于与阵元阵列配合的第一端面、用于与转接电路配合的第二端面以及连接在第一端面和第二端面之间的侧壁，所述连接电路具有用于与阵元阵列连接的第一连接端和用于与所述转接电路连接的第二连接端，所述第一连接端位于所述第一端面上，所述第二连接端位于所述第二端面和/或所述侧壁上。
- 如权利要求1所述的背衬块，其特征在于，所述连接电路包括若干引线，所述第一连接端为引线的一端，所述第二连接端为引线的另一端，所述引线在背衬块本体的表面自第一端面延伸至侧壁或第二端面。
- 如权利要求2所述的背衬块，其特征在于，所述侧壁包括相对设置的第一侧壁和第二侧壁，所述第二连接端分布在所述第一侧壁和所述第二侧壁上。
- 如权利要求3所述的背衬块，其特征在于，所述引线为至少两个，所有引线的第一连接端在第一端面上平行且间隔设定距离排列，自最外侧的引线起，位于奇数位的引线的第二连接端顺着所述背衬块本体的表面延伸至所述第一侧壁，位于偶数位的引线的第二连接端顺着所述背衬块本体的表面延伸至所述第二侧壁。
- 如权利要求4所述的背衬块，其特征在于，所有引线的第一连接端之间间隔相同的间距。
- 如权利要求1-5任一项所述的背衬块，其特征在于，所述连接电路采用3D电路制造方式形成在背衬块本体的表面。
- 一种超声探头，包括阵元阵列和转接电路，其特征在于，还包括如权利要求1-6任一项所述的背衬块，所述阵元阵列安装在所述背衬块的第一端面上，并与所述连接电路的第一连接端连接，所述转接电路安装在背衬块的第二端面上，并与所述连接电路的第二连接端连接。
- 如权利要求7所述的超声探头，其特征在于，所述第一端面涂覆胶液，使所述第一连接端与阵元阵列粘接固定。
- 一种面阵超声探头，包括阵元阵列和转接电路，其特征在于，还包括如权利要求1-6任一项所述的背衬块，所述阵元阵列安装在所述背衬块的第一端面上，并与所述连接电路的第一连接端连接，所述转接电路安装在背衬块的第二端面上，并与所述连接电路的第二连接端连接。
- 如权利要求9所述的面阵超声探头，其特征在于，所述第一端面涂覆胶液，使所述第一连接端与阵元阵列粘接固定。
- 一种超声诊断成像设备，其特征在于，包括如权利要求7-8任一项所述的超声探头或者如权利要求9-10任一项所述的面阵超声探头。
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150182194A1 (en) * | 2013-12-30 | 2015-07-02 | General Electric Company | Systems and methods for connection to a transducer in ultrasound probes |
| JP2017070449A (ja) * | 2015-10-06 | 2017-04-13 | 株式会社日立製作所 | 超音波プローブ |
| CN106684238A (zh) * | 2017-03-02 | 2017-05-17 | 长沙芬贝电子科技有限公司 | 一种二维阵列超声换能器的电极引线装置及方法 |
| US20180140278A1 (en) * | 2016-11-22 | 2018-05-24 | General Electric Company | Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same |
-
2018
- 2018-10-19 WO PCT/CN2018/111095 patent/WO2020077638A1/zh active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150182194A1 (en) * | 2013-12-30 | 2015-07-02 | General Electric Company | Systems and methods for connection to a transducer in ultrasound probes |
| JP2017070449A (ja) * | 2015-10-06 | 2017-04-13 | 株式会社日立製作所 | 超音波プローブ |
| US20180140278A1 (en) * | 2016-11-22 | 2018-05-24 | General Electric Company | Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same |
| CN106684238A (zh) * | 2017-03-02 | 2017-05-17 | 长沙芬贝电子科技有限公司 | 一种二维阵列超声换能器的电极引线装置及方法 |
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