WO2020065757A1 - Endoscopic imaging device, endoscope, and endoscopic imaging device production method - Google Patents

Endoscopic imaging device, endoscope, and endoscopic imaging device production method Download PDF

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Publication number
WO2020065757A1
WO2020065757A1 PCT/JP2018/035646 JP2018035646W WO2020065757A1 WO 2020065757 A1 WO2020065757 A1 WO 2020065757A1 JP 2018035646 W JP2018035646 W JP 2018035646W WO 2020065757 A1 WO2020065757 A1 WO 2020065757A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
imaging device
pipe
ferrule
tube
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Application number
PCT/JP2018/035646
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French (fr)
Japanese (ja)
Inventor
秀治 宮原
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オリンパス株式会社
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Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to PCT/JP2018/035646 priority Critical patent/WO2020065757A1/en
Publication of WO2020065757A1 publication Critical patent/WO2020065757A1/en

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present invention relates to an imaging device for an endoscope including an imaging device, a light emitting device, and an optical fiber, an endoscope including the imaging device for an endoscope including an imaging device, a light emitting device, and an optical fiber, and imaging.
  • the present invention relates to a method for manufacturing an endoscope imaging device including an element, a light emitting element, and an optical fiber.
  • the endoscope has an image sensor at the distal end of the elongated insertion section.
  • an image sensor having a high pixel count has been studied.
  • the amount of signals transmitted from the image sensor to a signal processing device (processor) increases.
  • the diameter of the conductor is increased in order to transmit a required signal amount, or a plurality of conductors are used, so that the insertion portion is enlarged.
  • an optical signal instead of an electric signal to transmit an optical signal via an optical fiber.
  • an E / O type optical module including a light emitting element for converting an electric signal into an optical signal
  • an O / E type optical module including a light receiving element for converting an optical signal into an electric signal.
  • Optical module optical-electrical converter
  • the optical fiber is inserted and fixed in the insertion hole of the ferrule (holding member) of the optical module.
  • the optical module disposed at the distal end of the insertion section of the endoscope is ultra-small for minimizing invasiveness. For this reason, it has not been easy to insert the optical fiber into the ferrule of the optical module.
  • the appropriate amount is extremely small, it is not easy to provide.
  • Japanese Patent Application Laid-Open No. 2015-175904 discloses an optical transmission module in which a hollow cylindrical body is joined to a light emitting surface of an optical element, and the hollow cylindrical body is inserted into a through hole of a wiring board on which the optical element is mounted. ing.
  • An object of the embodiments of the present invention is to provide an endoscope imaging device that is easy to manufacture, an endoscope that is easy to manufacture, and a method of manufacturing an endoscope imaging device that is easy to manufacture.
  • An imaging device for an endoscope includes an imaging element that outputs an imaging signal, a driving circuit that outputs a driving signal according to the imaging signal, and the driving signal that is converted to an optical signal, and the optical signal is A light-emitting element that emits light from a light-emitting surface, an optical fiber that transmits the optical signal, a flexible tube into which the optical fiber is inserted, and an insertion hole into which the tube and the optical fiber are inserted. And a ferrule, wherein the fiber tip of the optical fiber projects from the tube tip of the tube, and further comprises a transparent resin covering the fiber tip.
  • the endoscope of the embodiment includes an imaging device for an endoscope, the imaging device for an endoscope, an imaging element that outputs an imaging signal, and a driving circuit that outputs a driving signal according to the imaging signal,
  • the drive signal is converted to an optical signal, a light emitting element that emits the optical signal from a light emitting surface, an optical fiber that transmits the optical signal, and a flexible tube into which the optical fiber is inserted,
  • a ferrule having an insertion hole into which the tube and the optical fiber are inserted, wherein a fiber tip of the optical fiber projects from the tube tip of the tube, and covers the fiber tip. Further comprising a transparent resin.
  • the method for manufacturing an imaging device for an endoscope has a first main surface and a second main surface facing the first main surface, and a plurality of the first main surfaces are provided on the first main surface.
  • Each of the plurality of first electrodes of the wiring board on which the first electrode is provided has a light emitting surface for emitting an optical signal, and the light emitting element has a plurality of bonding electrodes provided on the light emitting surface.
  • the method further includes a fiber insertion step of inserting the optical fiber into the tube in the ferrule after the cable joining step, wherein the optical fiber is not inserted into the tube in the ferrule.
  • an imaging device for an endoscope that is easy to manufacture
  • an endoscope that is easy to manufacture and a method for manufacturing an imaging device for an endoscope that is easy to manufacture.
  • FIG. 3 is a cross-sectional view of the endoscope imaging apparatus according to the embodiment, taken along line III-III of FIG. 2.
  • FIG. 4 is a cross-sectional view of the endoscope imaging apparatus according to the embodiment, taken along line IV-IV of FIG. 2.
  • It is a sectional exploded view of an imaging device for endoscopes of an embodiment.
  • It is a flowchart of the manufacturing method of the imaging device for endoscopes of an embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device for endoscopes of embodiment.
  • FIG. 11 is a cross-sectional view of the imaging device for an endoscope of Modification Example 3 of the embodiment, taken along line XII-XII of FIG. 10. It is a flowchart of the manufacturing method of the imaging device for endoscopes of the modification 3 of embodiment.
  • the endoscope 9 of the embodiment shown in FIG. 1 forms a processor 5A, a monitor 5B, and an endoscope system 6. Further, the endoscope imaging apparatus 1 (hereinafter, referred to as “imaging apparatus 1”) of the embodiment is disposed in the endoscope 9.
  • the endoscope 9 includes an insertion portion 3, a grip portion 4 provided at a base end of the insertion portion 3, a universal cord 4B extending from the grip portion 4, and a base portion of the universal cord 4B. And a connector 4C provided.
  • the insertion portion 3 includes a distal end portion 3A, a bending portion 3B extending from the distal end portion 3A and capable of changing the direction of the distal end portion 3A, and a flexible portion 3C extending from the bending portion 3B.
  • the grip part 4 is provided with a rotating angle knob 4A, which is an operation part for the surgeon to operate the bending part 3B.
  • the universal cord 4B is connected to the processor 5A by the connector 4C.
  • the processor 5A controls the entire endoscope system 6, performs signal processing on an image pickup signal, and outputs the image signal as an image signal.
  • the monitor 5B displays an image signal output by the processor 5A as an endoscope image.
  • the endoscope 9 is a flexible endoscope, but may be a rigid endoscope. The endoscope 9 may be for medical use or for industrial use.
  • a small-sized imaging device 1 is provided at the distal end portion 3A of the endoscope 9.
  • the imaging device 1 includes an imaging device 10 and an E / O type optical module including a light emitting device 30 (see FIG. 2) that converts an electric signal into an optical signal.
  • the optical signal is converted into an electric signal again by the O / E type optical module 8 disposed on the holding unit 4 via the optical fiber 61 passing through the insertion unit 3 and transmitted via the conducting wire 61M. . That is, the imaging signal is transmitted through the optical fiber 61 in the small-diameter insertion portion 3 and is not inserted into the body, and in the universal cord 4B having a small outer diameter, the conducting wire 61M is thicker than the optical fiber 61. Is transmitted via
  • the optical fiber 61 has the universal cord 4B inserted therethrough.
  • the imaging device 1 is small and easy to manufacture. Therefore, the endoscope 9 is minimally invasive and easy to manufacture.
  • the imaging apparatus 1 includes an imaging element 10, a drive IC 21 as a driving circuit, a light emitting element 30, a first wiring board 40, an optical fiber 61, and a tube 62. And a ferrule 50 and a transparent resin 70.
  • the first wiring board 40 may be referred to as a wiring board 40.
  • the image sensor 10 is a CCD or CMOS image sensor.
  • a light receiving section 11 is formed on a light receiving surface 10SA of the image sensor 10, and the image sensor 10 images a subject and outputs an image signal.
  • a plurality of external electrodes 12 connected to the light receiving unit 11 are provided on the back surface 10SB facing the light receiving surface 10SA.
  • a cover glass 13 is provided on the light receiving surface 10SA of the image sensor 10.
  • a plurality of semiconductor elements that perform primary processing of an imaging signal may be bonded to the back surface 10SB of the imaging element 10.
  • the drive IC 21 is a drive circuit for driving the light emitting element 30 and outputs a drive signal according to an image signal.
  • the image sensor 10 and the drive IC 21 are mounted on the second wiring board 45.
  • the second wiring board 45 is a three-dimensional wiring board made of MID (Molded Interconnect Device), and the drive IC 21 is housed together with the light emitting element 30 in a concave portion on the back surface side of the surface on which the imaging device 10 is mounted.
  • MID Molded Interconnect Device
  • the light emitting element 30 has a light emitting surface 30SA for emitting an optical signal, and a plurality of bonding electrodes 32 are provided on the light emitting surface 30SA.
  • the plurality of bonding electrodes 32 include a ground potential electrode 32B.
  • a VCSEL having a light emitting element 30 having a diameter of 10 ⁇ m and a plurality of bonding electrodes 32 for supplying a drive signal to the light emitting part 31 on a light emitting surface 30SA is a very small light emitting element 30 having dimensions of 250 ⁇ m ⁇ 250 ⁇ m in plan view. (Vertical Cavity Surface Emitting LASER) or a light emitting diode.
  • the first wiring board 40 having the first main surface 40SA and the second main surface 40SB opposed to the first main surface 40SA is a double-sided wiring board, and the first electrode 41 of the first main surface 40SA. Is connected to the third electrode 44 on the second main surface 40SB via the through wiring 43.
  • the bonding electrode 32 of the light emitting element 30 is bonded to the first electrode 41 of the first wiring board 40.
  • First wiring board 40 is electrically connected to second wiring board 45.
  • the imaging signal output from the imaging element 10 is converted into a driving signal by the drive IC 21 and input to the light emitting element 30 via the first electrode 41 of the first wiring board 40.
  • the substrate of the first wiring board 40 is made of glass, which is a transparent material.
  • the light signal output from the light emitting element 30 to which the drive signal is input passes through the first wiring board 40 and is output from the second main surface 40SB.
  • the optical fiber 61 for transmitting an optical signal has, for example, a core having a diameter of 50 ⁇ m for transmitting an optical signal and a cladding having a diameter of 125 ⁇ m which covers the outer periphery of the core.
  • the tube 62 for protecting the optical fiber 61 is a flexible tube having a hollow inside.
  • the inner diameter R62A of the tube 62 is, for example, 130 ⁇ m, which is slightly larger than the outer diameter R61 of the optical fiber 61, which is 125 ⁇ m. Therefore, before the optical fiber 61 is fixed to the ferrule 50, the optical fiber 61 can move back and forth (in the optical axis direction) inside the tube 62.
  • the tube 62 is made of a flexible resin, for example, PEEK (polyetheretherketone).
  • the ferrule 50 as an optical fiber holding member has a front surface 50SA, a rear surface 50SB facing the front surface 50SA, and four side surfaces 50SS, and is inserted through the front surface 50SA and the rear surface 50SB. There is a hole H50.
  • the ferrule 50 is a rectangular parallelepiped made of ceramic, silicon, or MID having a rectangular cross section orthogonal to the optical axis O.
  • the ferrule 50 may be a cylinder or a polygon having an insertion hole H50.
  • the ferrule 50 has a front surface 50SA fixed to the second main surface 40SB of the first wiring board 40.
  • the ferrule 50 is disposed at a position where the center axis of the insertion hole H50 coincides with the optical axis O of the signal light emitted from the light emitting element 30.
  • the tube 62 and the optical fiber 61 are inserted into the insertion hole H50 of the ferrule 50. That is, the tube 62 into which the optical fiber 61 is inserted is inserted into the insertion hole H50.
  • the inner diameter R50 of the insertion hole H50 is slightly larger than the outer diameter R62B of the tube 62. For example, when the outer diameter R62B of the tube 62 is 160 ⁇ m, the inner diameter R50 of the insertion hole H50 is 165 ⁇ m.
  • the shape of the cross section orthogonal to the optical axis O may be a polygon instead of a circle.
  • the tube 62 is fixed to the ferrule 50 with an adhesive 55.
  • the fiber end of the optical fiber 61 inserted into the insertion hole H50 protrudes from the tube end of the tube 62 by a predetermined length L. That is, the outer peripheral surface of the fiber end portion having the length L is not covered by the tube 62.
  • the tip of the optical fiber 61 is covered with the transparent resin 70. That is, the transparent resin 70 is disposed between the fiber tip and the inner surface of the insertion hole H50. The fiber end surface of the optical fiber 61 is in contact with the second main surface 40SB of the first wiring board 40, and the space therebetween is filled with a transparent resin 70.
  • the transparent resin 70 is a refractive index matching material for preventing interfacial reflection of optical signals, and is a fixing member for fixing the optical fiber 61 to the ferrule 50.
  • the imaging device 1 further includes a plurality of conductive wires (electric cables) 63.
  • Each conductive line 63 is made of a conductor that transmits an electric signal such as power, a drive signal, and a control signal to the image sensor 10.
  • the optical fiber 61 and the plurality of conductive wires 63 form a photoelectric composite cable (composite cable) 60.
  • the composite cable 60 includes an optical fiber 61, a tube 62, a plurality of conductive wires 63, and an insulating member 64. Each of the plurality of conductive wires 63 may be covered with an outer cover made of an insulator. As shown in FIG. 3, the optical fiber 61 is provided at the center of the composite cable 60, and the plurality of conductive wires 63 are provided around the optical fiber 61. Note that the composite cable 60 may include a plurality of optical fibers, and the number of the plurality of conductive wires 63 is not limited to six.
  • the photoelectric composite cable 60 extends through the insertion portion 3 to the grip portion 4.
  • each of the plurality of conductive wires 63 is joined to each of the plurality of relay electrodes 51 using the solder 59 as a joining member.
  • the plurality of relay electrodes 51 are connected to the drive IC 21, the light emitting element 30, or the imaging element 10 via the first wiring boards 40, 45, respectively.
  • the ground potential cable of the plurality of conductive wires 63 is connected to the drive IC 21, the light emitting element 30, and the ground potential electrode of the imaging element 10.
  • the imaging device 1 is easy to manufacture because the optical fiber 61 is inserted into the insertion hole H50 of the ferrule 50 using the flexible tube 62 as a guide, as described later. Further, the heat generated when the conductive wire 63 is joined to the relay electrode 51 of the ferrule 50 using the solder 59 does not degrade the characteristics of the optical fiber 61 whose heat resistance is not high.
  • the transparent resin 70 which is a refractive index matching material, fills the space between the distal end surface of the optical fiber 61 and the second main surface 40SB of the first wiring board 40. Since the distal end surface of the optical fiber 61 is in contact with the second main surface 40SB, the appropriate amount of the transparent resin 70 is extremely small. In the imaging device 1, there is a space corresponding to the thickness of the tube 62 between the outer surface of the fiber tip and the inner surface of the insertion hole H50. Since the transparent resin 70 is accommodated in this space, an excessive amount can be injected. Further, the optical fiber 61 is fixed to the ferrule 50 by the excessively injected transparent resin 70.
  • the imaging device 10 is a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a CCD (Charge Coupled Device), or the like.
  • the cover glass wafer is bonded to the image pickup wafer including the plurality of image pickup devices 10 and then cut, whereby the image pickup device 10 to which the cover glass 13 is adhered is manufactured.
  • the imaging element 10 may further include an optical unit including a plurality of lenses, filters, an optical diaphragm, and the like.
  • the imaging element 10 and the drive IC 21 are mounted on the second wiring board 45.
  • a plurality of chip components such as chip capacitors may be mounted on the second wiring board 45.
  • the base of the second wiring board 45 is made of ceramic, glass, resin, fiber reinforced resin, silicon, or the like.
  • the second wiring board 45 may be composed of a plurality of wiring boards, for example, a flat plate and a frame plate, or may be an MID.
  • each of the plurality of bonding electrodes 32 of the light emitting element 30 is, for example, ultrasonically bonded to each of the plurality of first electrodes 41 on the first main surface 40SA of the first wiring board 40.
  • the imaging device 10 By joining the second wiring board 45 and the first wiring board 40, the imaging device 10, the drive IC 21, and the light emitting element 30 are connected to the third electrode of the second main surface 40SB of the first wiring board 40. 44.
  • the front surface 50SA of the ferrule 50 is fixed to the second main surface 40SB of the first wiring board 40 by, for example, an adhesive.
  • the relay electrode 51 of the ferrule 50 is connected to the second main surface 40SB of the first wiring board 40.
  • the uncured liquid transparent resin 70 is injected into the insertion hole H50 of the ferrule 50.
  • the refractive index of the transparent resin 70 as the refractive index matching material after curing is substantially the same as the refractive index of the core of the optical fiber 61.
  • the transparent resin 70 for example, an acrylic resin, an epoxy resin, a vinyl resin, an ethylene resin, a silicone resin, a urethane resin, a polyamide resin, a fluorine resin, a polybutadiene resin, or a polycarbonate resin is used. be able to. Above all, acrylic resins and epoxy resins are suitable for the transparent resin 70 from the viewpoints of moisture resistance, heat resistance, peel resistance and impact resistance.
  • Tube fixing step The flexible tube 62 is inserted into the insertion hole H50 of the ferrule 50.
  • the tube 62 is inserted at a position where the tube distal end surface has a predetermined length L, for example, 50 ⁇ m from the second main surface 40SB of the first wiring board 40.
  • the tube 62 is fixed to the ferrule 50 by an adhesive 55.
  • the length L is preferably from 10 ⁇ m to 500 ⁇ m. When the length L is within the above range, the excess transparent resin 70 can be accommodated, and the length of the ferrule 50 in the optical axis direction is short, and the length of the imaging device 1 in the optical axis direction is short.
  • the tube 62 is thicker than the optical fiber 61 and is hard to break. Therefore, the insertion of the tube 62 into the insertion hole H50 is easier than that of the optical fiber 61.
  • the opening of the insertion hole H50 may be tapered.
  • each of the plurality of relay electrodes 51 of the ferrule 50 is provided with a plurality of conductive wires 63 made of a conductive material protruding from the end surface of the composite cable 60 by a solder 59. It is joined using.
  • the joining temperature is, for example, 150 ° C. to 250 ° C. at which the solder 59 is melted. Even if the joining is local heating by a laser, the heat applied to the solder 59 conducts heat inside the ferrule 50 and reaches the insertion hole H50. For this reason, although the temperature of the tube 62 rises, the tube 62 is not damaged because it is made of PEEK having excellent heat resistance.
  • the optical fiber 61 is disposed rearward without the fiber end portion being inserted into the insertion hole H50. Therefore, there is no possibility that the optical fiber 61 is damaged by heat.
  • the conductive wire 63 may not be integrated with the optical fiber 61 to form the composite cable 60.
  • the plurality of conductive wires 63 may be a multi-core electric cable different from the optical fiber 61.
  • the excess transparent resin 70 spreads in the space between the tip surface of the fiber tip and the inner surface of the insertion hole H50.
  • the optical fiber 61 is fixed to the ferrule 50 by curing the transparent resin 70.
  • the insertion of the optical fiber 61 and the disposition of the transparent resin 70 are easy, and the optical fiber 61 is not likely to be damaged.
  • the endoscope imaging apparatuses 1A to 1C of the modified examples or the endoscopes 9A to 9C including the endoscope imaging apparatuses 1A to 1C are similar to the endoscope imaging apparatus 1 or the endoscope 9. Therefore, the components having the same function are denoted by the same reference numerals, and description thereof is omitted.
  • the first wiring board 40A of the imaging device 1A shown in FIG. 8 has a base made of an opaque material such as ceramic, resin, or silicon.
  • an optical path hole H40 serving as an optical path of an optical signal is provided at a position facing the light emitting unit 31 of the light emitting element 30.
  • the transparent resin 70 fills the optical path hole H40 and further covers the light emitting part 31 of the light emitting element 30.
  • the optical fiber 61 may be inserted through the optical path hole H40, and the distal end surface of the optical fiber may be in contact with the light emitting surface 30SA of the light emitting element 30.
  • the light emitting element 30 is mounted on the front surface 50SA of the ferrule 50B. That is, the ferrule 50B has the function of the first wiring board 40A (FIG. 8).
  • the imaging device 1B Since the imaging device 1B has a simpler configuration than the imaging device 1A, it is easier to manufacture than the imaging device 1A.
  • the imaging device 1C shown in FIG. 10 further includes an inflexible pipe 80 inserted into the insertion hole H50C of the ferrule 50.
  • the tube 62 and the optical fiber 61 are inserted into a hollow pipe 80.
  • the tip end surface of the pipe 80 is vertically fixed to the light emitting surface 30SA of the light emitting element 30 at a position where the center axis thereof coincides with the optical axis O.
  • the first wiring board 40C has a pipe hole H40C which is an optical path hole and at the same time, a pipe 80 is inserted therethrough.
  • the pipe 80 is provided on the light emitting element 30 as shown in FIG. Then, as shown in FIG. 10, after the pipe 80 is inserted into the pipe hole H40C and the insertion hole H50C, the light emitting element 30 is mounted on the first main surface 40SA of the first wiring board 40C. Since the optical axes of the optical fiber 61 and the light emitting element 30 are automatically aligned by the pipe 80, the imaging device 1C is easy to manufacture.
  • each of the plurality of electric cables 65 of the composite cable 60 ⁇ / b> C includes a conductive wire 63 that is a conductive wire for transmitting an electric signal, a first sheath 65 ⁇ / b> A covering the conductive wire 63, and a ground potential wire.
  • This is a coaxial cable having a shield wire 66 and a second sheath 65B covering the shield wire 66.
  • the pipe 80 is made of a conductive material such as copper.
  • a shield wire 66 which is a ground potential line of the electric cable 65, is joined to the outer surface of the pipe 80 projecting from the rear surface 50SB of the ferrule 50.
  • the pipe tip surface is connected to the ground potential electrode 32B of the light emitting element 30.
  • the shield line 66 may be connected to the ground potential electrode 12B of the imaging device 10 via the pipe 80.
  • the pipe 80 is not limited to the hollow prism shown in FIG. 11, but may be a hollow cylinder or a hollow polygonal pillar.
  • the light emitting element 30 is provided with the pipe 80, and if the insertion hole H50 of the ferrule 50B is a pipe hole through which the pipe 80 is inserted, the imaging device 1C Needless to say, it has the same effect as.
  • the element bonding step S10 includes a pipe fixing step (S12), a pipe insertion step (S14), and a light emitting element mounting step (S16).
  • Step S12> Pipe fixing step An inflexible pipe 80 is attached to the light emitting surface 30SA of the light emitting element 30 having the light emitting surface 30SA for emitting an optical signal and having the plurality of bonding electrodes 32 disposed on the light emitting surface 30SA. Are fixed vertically at a position where the center axis thereof coincides with the optical axis O of the light emitting element 30.
  • Step S14 Pipe Insertion Step A first main surface 40SA and a second main surface 40SB facing the first main surface 40SA are provided, and a plurality of first electrodes 41 are provided on the first main surface 40SA.
  • the pipe 80 is inserted into the pipe hole H40C of the first wiring board 40 which is provided and has the pipe hole H40C.
  • Step S16 Light Emitting Element Mounting Step
  • Each of the bonding electrodes 32 of the light emitting element 30 is bonded to each of the first electrodes 41 of the first wiring board 40.
  • the ferrule fixing step the pipe 80 is inserted into the insertion hole H50C of the ferrule 50. If the inner diameter R50 of the insertion hole H50C is larger than the outer diameter of the pipe 80, there is no need to strictly manage the inner diameter R50.
  • the positioning between the light emitting element 30 and the optical fiber 61 is automatically performed only by performing the positioning when the pipe 80 is provided to the light emitting element 30. Therefore, the manufacturing method of the present modification is easy to manufacture.

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Abstract

This endoscopic imaging device (1) comprises: an image capture element (10) for outputting an image capture signal; a drive IC (21) for outputting a drive signal adapted to the image capture signal; a light-emitting element (30) for converting the drive signal into an optical signal and sending out the optical signal from a light-emitting surface (30SA); an optical fiber (61) for transmitting the optical signal; a flexible tube (62) whereinto the optical fiber (61) has been inserted; a ferrule (50) having an insertion hole (H50) whereinto the tube (62) and the optical fiber (61) have been inserted. The fiber leading end portion of the optical fiber (61) protrudes from the tube leading end portion of the tube (62), and a transparent resin (70) covering the fiber leading end portion is further provided.

Description

内視鏡用撮像装置、内視鏡、および、内視鏡用撮像装置の製造方法Endoscope imaging apparatus, endoscope, and method of manufacturing endoscope imaging apparatus
　本発明は、撮像素子と発光素子と光ファイバとを具備する内視鏡用撮像装置、撮像素子と発光素子と光ファイバとを具備する内視鏡用撮像装置を含む内視鏡、および、撮像素子と発光素子と光ファイバとを具備する内視鏡用撮像装置の製造方法に関する。 The present invention relates to an imaging device for an endoscope including an imaging device, a light emitting device, and an optical fiber, an endoscope including the imaging device for an endoscope including an imaging device, a light emitting device, and an optical fiber, and imaging. The present invention relates to a method for manufacturing an endoscope imaging device including an element, a light emitting element, and an optical fiber.
　内視鏡は、細長い挿入部の先端部に、撮像素子を有する。高品質の画像を表示するため、高画素数の撮像素子が検討されている。高画素数の撮像素子を使用すると、撮像素子から信号処理装置（プロセッサ）へ伝送する信号量が増加する。このため、電気信号による導線（電気ケーブル）を経由した電気信号伝送では、必要な信号量を伝送するために導線の線径を太くしたり、複数の導線を用いたりするため、挿入部が太くなるおそれがある。 The endoscope has an image sensor at the distal end of the elongated insertion section. In order to display a high-quality image, an image sensor having a high pixel count has been studied. When an image sensor having a high number of pixels is used, the amount of signals transmitted from the image sensor to a signal processing device (processor) increases. For this reason, in the electric signal transmission via a conductor (electric cable) using an electric signal, the diameter of the conductor is increased in order to transmit a required signal amount, or a plurality of conductors are used, so that the insertion portion is enlarged. Could be.
　挿入部を細径化し内視鏡を低侵襲化するには、電気信号に替えて光信号による光ファイバを経由した光信号伝送が好ましい。光信号伝送には、電気信号を光信号に変換する発光素子を含むＥ／Ｏ型の光モジュール（電気－光変換器）と、光信号を電気信号に変換する受光素子を含むＯ／Ｅ型の光モジュール（光－電気変換器）とが用いられる。光ファイバは光モジュールのフェルール（保持部材）の挿入孔に挿入されて固定されている。 、 In order to make the insertion section smaller in diameter and to make the endoscope less invasive, it is preferable to use an optical signal instead of an electric signal to transmit an optical signal via an optical fiber. For optical signal transmission, an E / O type optical module (electric-optical converter) including a light emitting element for converting an electric signal into an optical signal, and an O / E type including a light receiving element for converting an optical signal into an electric signal. Optical module (optical-electrical converter). The optical fiber is inserted and fixed in the insertion hole of the ferrule (holding member) of the optical module.
　内視鏡の挿入部の先端部に配設される光モジュールは、低侵襲化のため超小型である。このため、光ファイバを光モジュールのフェルールに挿入することは容易ではなかった。また、伝送効率を向上するために光ファイバのファイバ先端面に屈折率整合樹脂を配設することが好ましいが、適切量は極めて微量であるため、配設することは容易ではなかった。 (4) The optical module disposed at the distal end of the insertion section of the endoscope is ultra-small for minimizing invasiveness. For this reason, it has not been easy to insert the optical fiber into the ferrule of the optical module. In addition, it is preferable to provide a refractive index matching resin on the fiber end face of the optical fiber in order to improve the transmission efficiency. However, since the appropriate amount is extremely small, it is not easy to provide.
　日本国特開２０１５－１７５９０４号公報には、光素子の発光面に中空円筒体を接合し、光素子が実装されている配線板の貫通孔に中空円筒体を挿通する光伝送モジュールが開示されている。 Japanese Patent Application Laid-Open No. 2015-175904 discloses an optical transmission module in which a hollow cylindrical body is joined to a light emitting surface of an optical element, and the hollow cylindrical body is inserted into a through hole of a wiring board on which the optical element is mounted. ing.
特開２０１５－１７５９０４号公報JP-A-2005-175904
　本発明の実施形態は、製造が容易な内視鏡用撮像装置、製造が容易な内視鏡、および、製造が容易な内視鏡用撮像装置の製造方法を提供することを目的とする。 An object of the embodiments of the present invention is to provide an endoscope imaging device that is easy to manufacture, an endoscope that is easy to manufacture, and a method of manufacturing an endoscope imaging device that is easy to manufacture.
　実施形態の内視鏡用撮像装置は、撮像信号を出力する撮像素子と、前記撮像信号に応じた駆動信号を出力する駆動回路と、前記駆動信号を光信号に変換して、前記光信号を発光面から出射する発光素子と、前記光信号を伝送する光ファイバと、前記光ファイバが挿入されている、可撓性のチューブと、前記チューブおよび前記光ファイバが挿入されている挿入孔のあるフェルールと、を具備しており、前記光ファイバのファイバ先端部が、前記チューブのチューブ先端部から突出しており、前記ファイバ先端部を覆っている透明樹脂を、更に具備する。 An imaging device for an endoscope according to an embodiment includes an imaging element that outputs an imaging signal, a driving circuit that outputs a driving signal according to the imaging signal, and the driving signal that is converted to an optical signal, and the optical signal is A light-emitting element that emits light from a light-emitting surface, an optical fiber that transmits the optical signal, a flexible tube into which the optical fiber is inserted, and an insertion hole into which the tube and the optical fiber are inserted. And a ferrule, wherein the fiber tip of the optical fiber projects from the tube tip of the tube, and further comprises a transparent resin covering the fiber tip.
　実施形態の内視鏡は、内視鏡用撮像装置を含み、前記内視鏡用撮像装置は、撮像信号を出力する撮像素子と、前記撮像信号に応じた駆動信号を出力する駆動回路と、前記駆動信号を光信号に変換して、前記光信号を発光面から出射する発光素子と、前記光信号を伝送する光ファイバと、前記光ファイバが挿入されている、可撓性のチューブと、前記チューブおよび前記光ファイバが挿入されている挿入孔のあるフェルールと、を具備しており、前記光ファイバのファイバ先端部が、前記チューブのチューブ先端部から突出しており、前記ファイバ先端部を覆っている透明樹脂を、更に具備する。 The endoscope of the embodiment includes an imaging device for an endoscope, the imaging device for an endoscope, an imaging element that outputs an imaging signal, and a driving circuit that outputs a driving signal according to the imaging signal, The drive signal is converted to an optical signal, a light emitting element that emits the optical signal from a light emitting surface, an optical fiber that transmits the optical signal, and a flexible tube into which the optical fiber is inserted, A ferrule having an insertion hole into which the tube and the optical fiber are inserted, wherein a fiber tip of the optical fiber projects from the tube tip of the tube, and covers the fiber tip. Further comprising a transparent resin.
　実施形態の内視鏡用撮像装置の製造方法は、第１の主面と前記第１の主面と対向している第２の主面とを有し、前記第１の主面に複数の第１電極が配設されている配線板の前記複数の第１電極のそれぞれに、光信号を出射する発光面を有し前記発光面に複数の接合電極が配設されている発光素子の前記複数の接合電極のそれぞれを接合する素子実装工程と、前面と前記前面と対向する後面と側面を有し、前記側面に複数の中継電極が配設されており、挿入孔があるフェルールの前記前面を前記配線板の前記第２の主面に固定するフェルール固定工程と、複数の導電線と可撓性のチューブと前記チューブに挿入されている光ファイバとを含む光電複合ケーブルの端面から突出している、前記チューブのチューブ先端部を、前記挿入孔に挿入し固定するチューブ固定工程と、前記フェルールの複数の中継電極のそれぞれに、前記端面から突出している前記複数の導電線のそれぞれを、半田接合するケーブル接合工程と、を具備し、前記ケーブル接合工程においては、前記フェルールの中の前記チューブに前記光ファイバが挿入されておらず、前記ケーブル接合工程の後に、前記フェルールの中の前記チューブに、前記光ファイバを挿通するファイバ挿通工程を更に具備する。 The method for manufacturing an imaging device for an endoscope according to the embodiment has a first main surface and a second main surface facing the first main surface, and a plurality of the first main surfaces are provided on the first main surface. Each of the plurality of first electrodes of the wiring board on which the first electrode is provided has a light emitting surface for emitting an optical signal, and the light emitting element has a plurality of bonding electrodes provided on the light emitting surface. An element mounting step of bonding each of the plurality of bonding electrodes, a front surface, a rear surface and a side surface facing the front surface, a plurality of relay electrodes disposed on the side surface, and the front surface of the ferrule having an insertion hole; Fixing a ferrule to the second main surface of the wiring board; Insert the tube tip of the tube into the insertion hole. A cable fixing step of soldering each of the plurality of conductive wires projecting from the end face to each of the plurality of relay electrodes of the ferrule, and a cable fixing step of soldering. The method further includes a fiber insertion step of inserting the optical fiber into the tube in the ferrule after the cable joining step, wherein the optical fiber is not inserted into the tube in the ferrule.
　本発明の実施形態によれば、製造が容易な内視鏡用撮像装置、製造が容易な内視鏡、および、製造が容易な内視鏡用撮像装置の製造方法を提供できる。 According to the embodiments of the present invention, it is possible to provide an imaging device for an endoscope that is easy to manufacture, an endoscope that is easy to manufacture, and a method for manufacturing an imaging device for an endoscope that is easy to manufacture.
実施形態の内視鏡を有する内視鏡システムの構成図である。It is a lineblock diagram of an endoscope system which has an endoscope of an embodiment. 実施形態の内視鏡用撮像装置の断面図である。It is a sectional view of an imaging device for endoscopes of an embodiment. 実施形態の内視鏡用撮像装置の図２のＩＩＩ－ＩＩＩ線に沿った断面図である。FIG. 3 is a cross-sectional view of the endoscope imaging apparatus according to the embodiment, taken along line III-III of FIG. 2. 実施形態の内視鏡用撮像装置の図２のＩＶ－ＩＶ線に沿った断面図である。FIG. 4 is a cross-sectional view of the endoscope imaging apparatus according to the embodiment, taken along line IV-IV of FIG. 2. 実施形態の内視鏡用撮像装置の断面分解図である。It is a sectional exploded view of an imaging device for endoscopes of an embodiment. 実施形態の内視鏡用撮像装置の製造方法のフローチャートである。It is a flowchart of the manufacturing method of the imaging device for endoscopes of an embodiment. 実施形態の内視鏡用撮像装置の製造方法を説明するための断面図である。It is sectional drawing for demonstrating the manufacturing method of the imaging device for endoscopes of embodiment. 実施形態の変形例１の内視鏡用撮像装置の断面図である。It is sectional drawing of the imaging device for endoscopes of the modification 1 of embodiment. 実施形態の変形例２の内視鏡用撮像装置の断面図である。It is sectional drawing of the imaging device for endoscopes of the modification 2 of embodiment. 実施形態の変形例３の内視鏡用撮像装置の断面図である。It is sectional drawing of the imaging device for endoscopes of the modification 3 of embodiment. 実施形態の変形例３の内視鏡用撮像装置の製造方法を説明するための斜視図である。It is a perspective view for explaining the manufacturing method of the imaging device for endoscopes of modification 3 of the embodiment. 実施形態の変形例３の内視鏡用撮像装置の図１０の図ＸＩＩ－ＸＩＩ線に沿った断面図である。FIG. 11 is a cross-sectional view of the imaging device for an endoscope of Modification Example 3 of the embodiment, taken along line XII-XII of FIG. 10. 実施形態の変形例３の内視鏡用撮像装置の製造方法のフローチャートである。It is a flowchart of the manufacturing method of the imaging device for endoscopes of the modification 3 of embodiment.
＜内視鏡＞
　図１に示す実施形態の内視鏡９は、プロセッサ５Ａおよびモニタ５Ｂと内視鏡システム６を構成している。また、実施形態の内視鏡用撮像装置１（以下、「撮像装置１」という。）は、内視鏡９に配設されている。 <Endoscope>
The endoscope 9 of the embodiment shown in FIG. 1 forms a processor 5A, a monitor 5B, and an endoscope system 6. Further, the endoscope imaging apparatus 1 (hereinafter, referred to as “imaging apparatus 1”) of the embodiment is disposed in the endoscope 9.
　内視鏡９は、挿入部３と、挿入部３の基端部に配設された把持部４と、把持部４から延設されたユニバーサルコード４Ｂと、ユニバーサルコード４Ｂの基端部に配設されたコネクタ４Ｃと、を具備する。挿入部３は、先端部３Ａと、先端部３Ａから延設された、湾曲自在であり先端部３Ａの方向を変えるための湾曲部３Ｂと、湾曲部３Ｂから延設された軟性部３Ｃとを含む。把持部４には術者が湾曲部３Ｂを操作するための操作部である回動するアングルノブ４Ａが配設されている。 The endoscope 9 includes an insertion portion 3, a grip portion 4 provided at a base end of the insertion portion 3, a universal cord 4B extending from the grip portion 4, and a base portion of the universal cord 4B. And a connector 4C provided. The insertion portion 3 includes a distal end portion 3A, a bending portion 3B extending from the distal end portion 3A and capable of changing the direction of the distal end portion 3A, and a flexible portion 3C extending from the bending portion 3B. Including. The grip part 4 is provided with a rotating angle knob 4A, which is an operation part for the surgeon to operate the bending part 3B.
　ユニバーサルコード４Ｂは、コネクタ４Ｃによってプロセッサ５Ａに接続される。プロセッサ５Ａは内視鏡システム６の全体を制御するとともに、撮像信号に信号処理を行い画像信号として出力する。モニタ５Ｂは、プロセッサ５Ａが出力する画像信号を内視鏡画像として表示する。なお、内視鏡９は軟性鏡であるが、硬性鏡でもよい。また、内視鏡９は、医療用でも工業用でもよい。 The universal cord 4B is connected to the processor 5A by the connector 4C. The processor 5A controls the entire endoscope system 6, performs signal processing on an image pickup signal, and outputs the image signal as an image signal. The monitor 5B displays an image signal output by the processor 5A as an endoscope image. The endoscope 9 is a flexible endoscope, but may be a rigid endoscope. The endoscope 9 may be for medical use or for industrial use.
　内視鏡９の先端部３Ａには、小型の撮像装置１が配設されている。撮像装置１は、撮像素子１０と、電気信号を光信号に変換する発光素子３０（図２参照）を含むＥ／Ｏ型光モジュールと、を含む。 小型 A small-sized imaging device 1 is provided at the distal end portion 3A of the endoscope 9. The imaging device 1 includes an imaging device 10 and an E / O type optical module including a light emitting device 30 (see FIG. 2) that converts an electric signal into an optical signal.
　光信号は、挿入部３を挿通する光ファイバ６１を経由して把持部４に配設されたＯ／Ｅ型の光モジュール８によって再び電気信号に変換され、導線６１Ｍを経由して伝送される。すなわち、撮像信号は、細径の挿入部３内においては光ファイバ６１を経由して伝送され、体内に挿入されず外径の制限の小さいユニバーサルコード４Ｂ内においては光ファイバ６１よりも太い導線６１Ｍを経由して伝送される。 The optical signal is converted into an electric signal again by the O / E type optical module 8 disposed on the holding unit 4 via the optical fiber 61 passing through the insertion unit 3 and transmitted via the conducting wire 61M. . That is, the imaging signal is transmitted through the optical fiber 61 in the small-diameter insertion portion 3 and is not inserted into the body, and in the universal cord 4B having a small outer diameter, the conducting wire 61M is thicker than the optical fiber 61. Is transmitted via
　なお、Ｏ／Ｅ型の光モジュール８がコネクタ４Ｃに配置されている場合には、光ファイバ６１はユニバーサルコード４Ｂを挿通している。 When the O / E type optical module 8 is arranged in the connector 4C, the optical fiber 61 has the universal cord 4B inserted therethrough.
　後述するように、撮像装置１は小型で製造が容易である。このため、内視鏡９は低侵襲で、かつ、製造が容易である。 撮 像 As described below, the imaging device 1 is small and easy to manufacture. Therefore, the endoscope 9 is minimally invasive and easy to manufacture.
＜内視鏡用撮像装置＞
　図２から図５に示すように実施形態の撮像装置１は、撮像素子１０と、駆動回路であるドライブＩＣ２１と、発光素子３０と、第１の配線板４０と、光ファイバ６１と、チューブ６２と、フェルール５０と、透明樹脂７０と、を具備する。なお、以下、第１の配線板４０を、配線板４０ということがある。 <Endoscope imaging device>
As shown in FIGS. 2 to 5, the imaging apparatus 1 according to the embodiment includes an imaging element 10, a drive IC 21 as a driving circuit, a light emitting element 30, a first wiring board 40, an optical fiber 61, and a tube 62. And a ferrule 50 and a transparent resin 70. Hereinafter, the first wiring board 40 may be referred to as a wiring board 40.
　なお、以下の説明において、各実施形態に基づく図面は、模式的なものであり、各部分の厚みと幅との関係、夫々の部分の厚みの比率などは現実のものとは異なることに留意すべきであり、図面の相互間においても互いの寸法の関係や比率が異なる部分が含まれている場合がある。また、一部の構成要素の図示、符号の付与を省略する場合がある。また、被写体方向を「前方向」という。 In the following description, the drawings based on each embodiment are schematic, and the relationship between the thickness and the width of each part, the ratio of the thickness of each part, and the like are different from actual ones. It should be noted that the drawings may include portions having different dimensional relationships and ratios between the drawings. In some cases, illustration of some constituent elements and addition of reference numerals may be omitted. The subject direction is referred to as “forward”.
　撮像素子１０は、ＣＣＤまたはＣＭＯＳ撮像素子からなる。撮像素子１０の受光面１０ＳＡには受光部１１が形成されており、撮像素子１０は被写体を撮像し撮像信号を出力する。受光面１０ＳＡと対向する裏面１０ＳＢには、受光部１１と接続されている複数の外部電極１２が配設されている。 (4) The image sensor 10 is a CCD or CMOS image sensor. A light receiving section 11 is formed on a light receiving surface 10SA of the image sensor 10, and the image sensor 10 images a subject and outputs an image signal. A plurality of external electrodes 12 connected to the light receiving unit 11 are provided on the back surface 10SB facing the light receiving surface 10SA.
　撮像素子１０の受光面１０ＳＡにはカバーガラス１３が配設されている。撮像素子１０の裏面１０ＳＢに、撮像信号を一次処理する複数の半導体素子が接合されていてもよい。ドライブＩＣ２１は、発光素子３０を駆動するための駆動回路であり、撮像信号に応じた駆動信号を出力する。 カ バ ー A cover glass 13 is provided on the light receiving surface 10SA of the image sensor 10. A plurality of semiconductor elements that perform primary processing of an imaging signal may be bonded to the back surface 10SB of the imaging element 10. The drive IC 21 is a drive circuit for driving the light emitting element 30 and outputs a drive signal according to an image signal.
　撮像素子１０およびドライブＩＣ２１は、第２の配線板４５に実装されている。第２の配線板４５は、ＭＩＤ（Molded Interconnect Device）からなる立体配線板であり、ドライブＩＣ２１は撮像素子１０が実装された面の裏面側の凹部に発光素子３０とともに収容されている。 (4) The image sensor 10 and the drive IC 21 are mounted on the second wiring board 45. The second wiring board 45 is a three-dimensional wiring board made of MID (Molded Interconnect Device), and the drive IC 21 is housed together with the light emitting element 30 in a concave portion on the back surface side of the surface on which the imaging device 10 is mounted.
　発光素子３０は、光信号を出射する発光面３０ＳＡを有し、発光面３０ＳＡに複数の接合電極３２が配設されている。なお、複数の接合電極３２は、接地電位電極３２Ｂを含んでいる。例えば、平面視寸法が２５０μｍ×２５０μｍと超小型の発光素子３０は、直径が１０μｍの発光部３１と、発光部３１に駆動信号を供給する複数の接合電極３２と、を発光面３０ＳＡに有するＶＣＳＥＬ（Vertical Cavity Surface Emitting LASER）または発光ダイオードである。 The light emitting element 30 has a light emitting surface 30SA for emitting an optical signal, and a plurality of bonding electrodes 32 are provided on the light emitting surface 30SA. Note that the plurality of bonding electrodes 32 include a ground potential electrode 32B. For example, a VCSEL having a light emitting element 30 having a diameter of 10 μm and a plurality of bonding electrodes 32 for supplying a drive signal to the light emitting part 31 on a light emitting surface 30SA is a very small light emitting element 30 having dimensions of 250 μm × 250 μm in plan view. (Vertical Cavity Surface Emitting LASER) or a light emitting diode.
　第１の主面４０ＳＡと第１の主面４０ＳＡと対向する第２の主面４０ＳＢとを有する第１の配線板４０は、両面配線板であり、第１の主面４０ＳＡの第１電極４１は貫通配線４３を経由して第２の主面４０ＳＢの第３電極４４と接続されている。 The first wiring board 40 having the first main surface 40SA and the second main surface 40SB opposed to the first main surface 40SA is a double-sided wiring board, and the first electrode 41 of the first main surface 40SA. Is connected to the third electrode 44 on the second main surface 40SB via the through wiring 43.
　発光素子３０の接合電極３２は、第１の配線板４０の第１電極４１と接合されている。第１の配線板４０は第２の配線板４５と電気的に接続されている。撮像素子１０が出力する撮像信号は、ドライブＩＣ２１によって駆動信号に変換され、第１の配線板４０の第１電極４１を経由して発光素子３０に入力される。 The bonding electrode 32 of the light emitting element 30 is bonded to the first electrode 41 of the first wiring board 40. First wiring board 40 is electrically connected to second wiring board 45. The imaging signal output from the imaging element 10 is converted into a driving signal by the drive IC 21 and input to the light emitting element 30 via the first electrode 41 of the first wiring board 40.
　第１の配線板４０の基板は、透明材料であるガラスによって構成されている。駆動信号が入力された発光素子３０が出射した光信号は、第１の配線板４０を透過して第２の主面４０ＳＢから出射される。 基板 The substrate of the first wiring board 40 is made of glass, which is a transparent material. The light signal output from the light emitting element 30 to which the drive signal is input passes through the first wiring board 40 and is output from the second main surface 40SB.
　光信号を伝送する光ファイバ６１は、例えば、光信号を伝送する５０μｍ径のコアと、コアの外周を覆う１２５μｍ径のクラッドとを有する。 The optical fiber 61 for transmitting an optical signal has, for example, a core having a diameter of 50 μm for transmitting an optical signal and a cladding having a diameter of 125 μm which covers the outer periphery of the core.
　光ファイバ６１を保護するチューブ６２は、内部が空洞の可撓性の管である。チューブ６２の内径Ｒ６２Ａは、例えば、１３０μｍであり、１２５μｍである光ファイバ６１の外径Ｒ６１よりも僅かに大きい。このため、光ファイバ６１はフェルール５０に固定される前には、チューブ６２の内部を前後（光軸方向）に移動可能である。 The tube 62 for protecting the optical fiber 61 is a flexible tube having a hollow inside. The inner diameter R62A of the tube 62 is, for example, 130 μm, which is slightly larger than the outer diameter R61 of the optical fiber 61, which is 125 μm. Therefore, before the optical fiber 61 is fixed to the ferrule 50, the optical fiber 61 can move back and forth (in the optical axis direction) inside the tube 62.
　チューブ６２は、可撓性の樹脂、例えば、ＰＥＥＫ（ポリエーテルエーテルケトン）からなる。 The tube 62 is made of a flexible resin, for example, PEEK (polyetheretherketone).
　図４および図５に示すように、光ファイバ保持部材であるフェルール５０は、前面５０ＳＡと前面５０ＳＡと対向する後面５０ＳＢと４側面５０ＳＳを有し、前面５０ＳＡと後面５０ＳＢとを挿通している挿入孔Ｈ５０がある。フェルール５０は、光軸Ｏに直交する断面形状が矩形の、セラミック、シリコン、またはＭＩＤからなる直方体である。フェルール５０は、挿入孔Ｈ５０のある円柱または多角柱でもよい。 As shown in FIGS. 4 and 5, the ferrule 50 as an optical fiber holding member has a front surface 50SA, a rear surface 50SB facing the front surface 50SA, and four side surfaces 50SS, and is inserted through the front surface 50SA and the rear surface 50SB. There is a hole H50. The ferrule 50 is a rectangular parallelepiped made of ceramic, silicon, or MID having a rectangular cross section orthogonal to the optical axis O. The ferrule 50 may be a cylinder or a polygon having an insertion hole H50.
　フェルール５０は、前面５０ＳＡが、第１の配線板４０の第２の主面４０ＳＢに固定されている。フェルール５０は挿入孔Ｈ５０の中心軸が、発光素子３０の出射する信号光の光軸Ｏと一致する位置に配置されている。 The ferrule 50 has a front surface 50SA fixed to the second main surface 40SB of the first wiring board 40. The ferrule 50 is disposed at a position where the center axis of the insertion hole H50 coincides with the optical axis O of the signal light emitted from the light emitting element 30.
　フェルール５０の挿入孔Ｈ５０には、チューブ６２および光ファイバ６１が挿入されている。すなわち、光ファイバ６１が挿入されているチューブ６２が、挿入孔Ｈ５０に挿入されている。挿入孔Ｈ５０の内径Ｒ５０は、チューブ６２の外径Ｒ６２Ｂよりも僅かに大きい。例えばチューブ６２の外径Ｒ６２Ｂが１６０μｍの場合、挿入孔Ｈ５０の内径Ｒ５０は、１６５μｍである。なお、挿入孔Ｈ５０は、チューブ６２が挿入できれば、光軸Ｏに直交する断面の形状が円ではなく、多角形でもよい。チューブ６２は、フェルール５０に接着剤５５によって固定されている。 The tube 62 and the optical fiber 61 are inserted into the insertion hole H50 of the ferrule 50. That is, the tube 62 into which the optical fiber 61 is inserted is inserted into the insertion hole H50. The inner diameter R50 of the insertion hole H50 is slightly larger than the outer diameter R62B of the tube 62. For example, when the outer diameter R62B of the tube 62 is 160 μm, the inner diameter R50 of the insertion hole H50 is 165 μm. In addition, as long as the tube 62 can be inserted into the insertion hole H50, the shape of the cross section orthogonal to the optical axis O may be a polygon instead of a circle. The tube 62 is fixed to the ferrule 50 with an adhesive 55.
　図５に示すように、挿入孔Ｈ５０に挿入されている光ファイバ６１のファイバ先端部は、チューブ６２のチューブ先端部から所定長Ｌだけ突出している。すなわち、長さＬのファイバ先端部の外周面は、チューブ６２によって覆われていない。 フ ァ イ バ As shown in FIG. 5, the fiber end of the optical fiber 61 inserted into the insertion hole H50 protrudes from the tube end of the tube 62 by a predetermined length L. That is, the outer peripheral surface of the fiber end portion having the length L is not covered by the tube 62.
　そして、光ファイバ６１のファイバ先端部は、透明樹脂７０によって覆われている。すなわち、ファイバ先端部と挿入孔Ｈ５０の内面との間には、透明樹脂７０が配設されている。なお、光ファイバ６１のファイバ先端面は、第１の配線板４０の第２の主面４０ＳＢに当接しているが、両者の間には透明樹脂７０が充填されている。 {Circle around (2)} The tip of the optical fiber 61 is covered with the transparent resin 70. That is, the transparent resin 70 is disposed between the fiber tip and the inner surface of the insertion hole H50. The fiber end surface of the optical fiber 61 is in contact with the second main surface 40SB of the first wiring board 40, and the space therebetween is filled with a transparent resin 70.
　透明樹脂７０は、光信号の界面反射を防止する屈折率整合材であり、かつ、光ファイバ６１をフェルール５０に固定する固定部材である。 The transparent resin 70 is a refractive index matching material for preventing interfacial reflection of optical signals, and is a fixing member for fixing the optical fiber 61 to the ferrule 50.
　撮像装置１は、複数の導電線（電気ケーブル）６３を更に具備する。各導電線６３は、撮像素子１０に電力、駆動信号および制御信号等の電気信号を伝送する導体からなる。 The imaging device 1 further includes a plurality of conductive wires (electric cables) 63. Each conductive line 63 is made of a conductor that transmits an electric signal such as power, a drive signal, and a control signal to the image sensor 10.
　なお、本実施形態の撮像装置１では、光ファイバ６１と複数の導電線６３とは、光電複合ケーブル（複合ケーブル）６０を構成している。複合ケーブル６０は、光ファイバ６１と、チューブ６２と、複数の導電線６３と、絶縁部材６４と、を含む。複数の導電線６３は、それぞれが絶縁体からなる外皮に覆われていてもよい。図３に示すように、光ファイバ６１は、複合ケーブル６０の中心に配設され、複数の導電線６３は光ファイバ６１の周囲に配設されている。なお、複合ケーブル６０は、複数の光ファイバを含んでいてもよいし、複数の導電線６３の数は６本に限られるものではない。 In the imaging device 1 of the present embodiment, the optical fiber 61 and the plurality of conductive wires 63 form a photoelectric composite cable (composite cable) 60. The composite cable 60 includes an optical fiber 61, a tube 62, a plurality of conductive wires 63, and an insulating member 64. Each of the plurality of conductive wires 63 may be covered with an outer cover made of an insulator. As shown in FIG. 3, the optical fiber 61 is provided at the center of the composite cable 60, and the plurality of conductive wires 63 are provided around the optical fiber 61. Note that the composite cable 60 may include a plurality of optical fibers, and the number of the plurality of conductive wires 63 is not limited to six.
　光電複合ケーブル６０は、挿入部３を挿通し把持部４まで延設されている。 The photoelectric composite cable 60 extends through the insertion portion 3 to the grip portion 4.
　フェルール５０の側面５０ＳＳには、配線（不図示）を経由して第３電極４４と接続されている中継電極５１がある。複数の導電線６３のそれぞれは、複数の中継電極５１のそれぞれと、半田５９を接合部材として接合されている。複数の中継電極５１は、第１の配線板４０、４５を経由して、それぞれがドライブＩＣ２１、発光素子３０または撮像素子１０と接続されている。 On the side surface 50SS of the ferrule 50, there is a relay electrode 51 connected to the third electrode 44 via a wiring (not shown). Each of the plurality of conductive wires 63 is joined to each of the plurality of relay electrodes 51 using the solder 59 as a joining member. The plurality of relay electrodes 51 are connected to the drive IC 21, the light emitting element 30, or the imaging element 10 via the first wiring boards 40, 45, respectively.
　なお、複数の導電線６３のうちの接地電位ケーブルは、ドライブＩＣ２１、発光素子３０および撮像素子１０の接地電位電極と、接続されている。 The ground potential cable of the plurality of conductive wires 63 is connected to the drive IC 21, the light emitting element 30, and the ground potential electrode of the imaging element 10.
　撮像装置１は、後述するように、可撓性のチューブ６２をガイドとして、光ファイバ６１がフェルール５０の挿入孔Ｈ５０に挿入されるため、製造が容易である。また、導電線６３をフェルール５０の中継電極５１に半田５９を用いて接合するときの熱によって、耐熱性が高くはない光ファイバ６１の特性が劣化することがない。 The imaging device 1 is easy to manufacture because the optical fiber 61 is inserted into the insertion hole H50 of the ferrule 50 using the flexible tube 62 as a guide, as described later. Further, the heat generated when the conductive wire 63 is joined to the relay electrode 51 of the ferrule 50 using the solder 59 does not degrade the characteristics of the optical fiber 61 whose heat resistance is not high.
　屈折率整合材である透明樹脂７０は、光ファイバ６１の先端面と第１の配線板４０の第２の主面４０ＳＢとの間を充填している。光ファイバ６１の先端面は第２の主面４０ＳＢに当接しているため、適切な透明樹脂７０の量は極めて微量である。撮像装置１では、ファイバ先端部の外面と挿入孔Ｈ５０の内面との間には、チューブ６２の厚さに相当する空間がある。透明樹脂７０は、この空間に収容されるため、過剰量を注入できる。また、過剰に注入された透明樹脂７０によって、光ファイバ６１はフェルール５０に固定される。 透明 The transparent resin 70, which is a refractive index matching material, fills the space between the distal end surface of the optical fiber 61 and the second main surface 40SB of the first wiring board 40. Since the distal end surface of the optical fiber 61 is in contact with the second main surface 40SB, the appropriate amount of the transparent resin 70 is extremely small. In the imaging device 1, there is a space corresponding to the thickness of the tube 62 between the outer surface of the fiber tip and the inner surface of the insertion hole H50. Since the transparent resin 70 is accommodated in this space, an excessive amount can be injected. Further, the optical fiber 61 is fixed to the ferrule 50 by the excessively injected transparent resin 70.
＜撮像装置の製造方法＞
　図６のフローチャートに沿って撮像装置１の製造方法を説明する。 <Method of manufacturing imaging device>
A method of manufacturing the imaging device 1 will be described with reference to the flowchart of FIG.
＜ステップＳ１０＞素子実装工程
　撮像素子１０は、ＣＭＯＳ（Complementary Metal Oxide Semiconductor）イメージセンサ、または、ＣＣＤ（Charge Coupled Device）等である。複数の撮像素子１０を含む撮像ウエハにカバーガラスウエハが接着されてから切断されることによって、カバーガラス１３が接着された撮像素子１０が作製される。なお、撮像素子１０には、さらに、複数のレンズ、フィルタ、および光学絞り等からなる光学ユニットが配設されていてもよい。 <Step S10> Device Mounting Step The imaging device 10 is a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a CCD (Charge Coupled Device), or the like. The cover glass wafer is bonded to the image pickup wafer including the plurality of image pickup devices 10 and then cut, whereby the image pickup device 10 to which the cover glass 13 is adhered is manufactured. Note that the imaging element 10 may further include an optical unit including a plurality of lenses, filters, an optical diaphragm, and the like.
　撮像素子１０およびドライブＩＣ２１が第２の配線板４５に実装される。なお、チップコンデンサ等の複数のチップ部品が第２の配線板４５に実装されていてもよい。第２の配線板４５の基体は、セラミック、ガラス、樹脂、ファイバ強化樹脂、またはシリコン等からなる。第２の配線板４５は、複数の配線板、例えば平板と枠板とによって構成されていてもよいし、ＭＩＤであってもよい。 (4) The imaging element 10 and the drive IC 21 are mounted on the second wiring board 45. Note that a plurality of chip components such as chip capacitors may be mounted on the second wiring board 45. The base of the second wiring board 45 is made of ceramic, glass, resin, fiber reinforced resin, silicon, or the like. The second wiring board 45 may be composed of a plurality of wiring boards, for example, a flat plate and a frame plate, or may be an MID.
　一方、第１の配線板４０の第１の主面４０ＳＡの複数の第１電極４１のそれぞれに、発光素子３０の複数の接合電極３２のそれぞれが、例えば超音波接合される。 On the other hand, each of the plurality of bonding electrodes 32 of the light emitting element 30 is, for example, ultrasonically bonded to each of the plurality of first electrodes 41 on the first main surface 40SA of the first wiring board 40.
　第２の配線板４５と第１の配線板４０とが接合されることによって、撮像素子１０、ドライブＩＣ２１および発光素子３０は、第１の配線板４０の第２の主面４０ＳＢの第３電極４４と接続される。 By joining the second wiring board 45 and the first wiring board 40, the imaging device 10, the drive IC 21, and the light emitting element 30 are connected to the third electrode of the second main surface 40SB of the first wiring board 40. 44.
＜ステップＳ２０＞フェルール固定工程
　フェルール５０の前面５０ＳＡが、第１の配線板４０の第２の主面４０ＳＢに、例えば接着剤によって固定される。そして、フェルール５０の中継電極５１は、第１の配線板４０の第２の主面４０ＳＢの４４と接続される。 <Step S20> Ferrule fixing step The front surface 50SA of the ferrule 50 is fixed to the second main surface 40SB of the first wiring board 40 by, for example, an adhesive. The relay electrode 51 of the ferrule 50 is connected to the second main surface 40SB of the first wiring board 40.
＜ステップＳ３０＞樹脂注入工程
　フェルール５０の挿入孔Ｈ５０に未硬化の液体の透明樹脂７０が注入される。屈折率整合材である透明樹脂７０は、硬化後の屈折率が光ファイバ６１のコアの屈折率と略同じである。透明樹脂７０には、例えば、アクリル系樹脂、エポキシ系樹脂、ビニル系樹脂、エチレン系樹脂、シリコーン系樹脂、ウレタン系樹脂、ポリアミド系樹脂、フッ素系樹脂、ポリブタジエン系樹脂、またはポリカーボネート系樹脂を用いることができる。中でも、アクリル系樹脂およびエポキシ系樹脂は、耐湿性、耐熱性、耐剥離性および耐衝撃性という観点から透明樹脂７０に好適である。 <Step S30> Resin Injection Step The uncured liquid transparent resin 70 is injected into the insertion hole H50 of the ferrule 50. The refractive index of the transparent resin 70 as the refractive index matching material after curing is substantially the same as the refractive index of the core of the optical fiber 61. As the transparent resin 70, for example, an acrylic resin, an epoxy resin, a vinyl resin, an ethylene resin, a silicone resin, a urethane resin, a polyamide resin, a fluorine resin, a polybutadiene resin, or a polycarbonate resin is used. be able to. Above all, acrylic resins and epoxy resins are suitable for the transparent resin 70 from the viewpoints of moisture resistance, heat resistance, peel resistance and impact resistance.
＜ステップＳ４０＞チューブ固定工程
　可撓性のチューブ６２が、フェルール５０の挿入孔Ｈ５０に挿入される。チューブ６２は、チューブ先端面が、第１の配線板４０の第２の主面４０ＳＢから所定の長さＬ、例えば、５０μｍの位置に挿入される。チューブ６２は、接着剤５５によってフェルール５０に固定される。長さＬは、１０μｍ以上５００μｍ以下が好ましい。長さＬが、前記範囲内であれば、過剰の透明樹脂７０を収容でき、かつフェルール５０の光軸方向の長さが短く、撮像装置１の光軸方向の長さが短い、 <Step S40> Tube fixing step The flexible tube 62 is inserted into the insertion hole H50 of the ferrule 50. The tube 62 is inserted at a position where the tube distal end surface has a predetermined length L, for example, 50 μm from the second main surface 40SB of the first wiring board 40. The tube 62 is fixed to the ferrule 50 by an adhesive 55. The length L is preferably from 10 μm to 500 μm. When the length L is within the above range, the excess transparent resin 70 can be accommodated, and the length of the ferrule 50 in the optical axis direction is short, and the length of the imaging device 1 in the optical axis direction is short.
　チューブ６２は、光ファイバ６１よりも太く、かつ、破損しにくい。このため、チューブ６２は光ファイバ６１よりも、挿入孔Ｈ５０への挿入が容易である。なお、挿入を容易とするため、挿入孔Ｈ５０の開口にテーパーが形成されていてもよい。 The tube 62 is thicker than the optical fiber 61 and is hard to break. Therefore, the insertion of the tube 62 into the insertion hole H50 is easier than that of the optical fiber 61. In addition, in order to facilitate insertion, the opening of the insertion hole H50 may be tapered.
　＜ステップＳ５０＞ケーブル接合工程
　図７に示すように、フェルール５０の複数の中継電極５１のそれぞれに、複合ケーブル６０の端面から突出している導電材料である複数の導電線６３のそれぞれが、半田５９を用いて接合される。接合温度は半田５９が溶融する、例えば１５０℃～２５０℃である。接合がレーザによる局部加熱であっても、半田５９に印加された熱はフェルール５０の内部を伝熱して挿入孔Ｈ５０にも到達する。このため、チューブ６２は、温度が上昇するが、チューブ６２は、耐熱性に優れたＰＥＥＫからなるため、損傷することはない。また、光ファイバ６１は、ファイバ先端部が、挿入孔Ｈ５０には挿入されない後方に配置されている。このため、光ファイバ６１が熱によって損傷するおそれがない。 <Step S50> Cable Joining Step As shown in FIG. 7, each of the plurality of relay electrodes 51 of the ferrule 50 is provided with a plurality of conductive wires 63 made of a conductive material protruding from the end surface of the composite cable 60 by a solder 59. It is joined using. The joining temperature is, for example, 150 ° C. to 250 ° C. at which the solder 59 is melted. Even if the joining is local heating by a laser, the heat applied to the solder 59 conducts heat inside the ferrule 50 and reaches the insertion hole H50. For this reason, although the temperature of the tube 62 rises, the tube 62 is not damaged because it is made of PEEK having excellent heat resistance. In addition, the optical fiber 61 is disposed rearward without the fiber end portion being inserted into the insertion hole H50. Therefore, there is no possibility that the optical fiber 61 is damaged by heat.
　なお、導電線６３は、光ファイバ６１と一体化され、複合ケーブル６０を構成していなくともよい。例えば、複数の導電線６３は、光ファイバ６１とは別の多芯電気ケーブルであってもよい。 The conductive wire 63 may not be integrated with the optical fiber 61 to form the composite cable 60. For example, the plurality of conductive wires 63 may be a multi-core electric cable different from the optical fiber 61.
＜ステップＳ６０＞光ファイバ挿通工程
　ケーブル接合工程の後に、フェルール５０の中のチューブ６２に、光ファイバ６１が挿通され、ファイバ先端面が第１の配線板４０の第２の主面４０ＳＢと当接する。すなわち、ファイバ先端面がチューブ６２の先端から長さＬだけ突出する。 <Step S60> Optical Fiber Inserting Step After the cable joining step, the optical fiber 61 is inserted into the tube 62 in the ferrule 50, and the fiber end face comes into contact with the second main surface 40SB of the first wiring board 40. . That is, the fiber tip surface protrudes from the tip of the tube 62 by the length L.
　このとき、過剰な透明樹脂７０は、ファイバ先端部の先端面と挿入孔Ｈ５０の内面との間の空間に広がる。透明樹脂７０が硬化処理されることによって、光ファイバ６１は、フェルール５０に固定される。 At this time, the excess transparent resin 70 spreads in the space between the tip surface of the fiber tip and the inner surface of the insertion hole H50. The optical fiber 61 is fixed to the ferrule 50 by curing the transparent resin 70.
　本実施形態の撮像装置の製造方法は、すでに説明したように、光ファイバ６１の挿入および透明樹脂７０の配設が容易であり、光ファイバ６１が損傷するおそれがない。 In the method of manufacturing the imaging device according to the present embodiment, as described above, the insertion of the optical fiber 61 and the disposition of the transparent resin 70 are easy, and the optical fiber 61 is not likely to be damaged.
＜変形例＞
　変形例の内視鏡用撮像装置１Ａ～１Ｃ、または、内視鏡用撮像装置１Ａ～１Ｃを含む内視鏡９Ａ～９Ｃは、内視鏡用撮像装置１、または内視鏡９と、類似し同じ効果を有するため、同じ機能の構成要素には同じ符号を付し説明は省略する。 <Modification>
The endoscope imaging apparatuses 1A to 1C of the modified examples or the endoscopes 9A to 9C including the endoscope imaging apparatuses 1A to 1C are similar to the endoscope imaging apparatus 1 or the endoscope 9. Therefore, the components having the same function are denoted by the same reference numerals, and description thereof is omitted.
＜変形例１＞
　図８に示す撮像装置１Ａの第１の配線板４０Ａは、セラミック、樹脂またはシリコン等の不透明材料を基体とする。第１の配線板４０Ａには、発光素子３０の発光部３１と対向する位置に、光信号の光路となる光路孔Ｈ４０がある。また、透明樹脂７０は、光路孔Ｈ４０を充填し、さらに、発光素子３０の発光部３１を覆っている。なお、光ファイバ６１が、光路孔Ｈ４０を挿通し、光ファイバ先端面が発光素子３０の発光面３０ＳＡと当接していてもよい。 <Modification 1>
The first wiring board 40A of the imaging device 1A shown in FIG. 8 has a base made of an opaque material such as ceramic, resin, or silicon. In the first wiring board 40A, an optical path hole H40 serving as an optical path of an optical signal is provided at a position facing the light emitting unit 31 of the light emitting element 30. Further, the transparent resin 70 fills the optical path hole H40 and further covers the light emitting part 31 of the light emitting element 30. Note that the optical fiber 61 may be inserted through the optical path hole H40, and the distal end surface of the optical fiber may be in contact with the light emitting surface 30SA of the light emitting element 30.
＜変形例２＞
　図９に示す撮像装置１Ｂは、発光素子３０は、フェルール５０Ｂの前面５０ＳＡに実装されている。すなわち、フェルール５０Ｂは、第１の配線板４０Ａ（図８）の機能を有している。 <Modification 2>
In the imaging device 1B shown in FIG. 9, the light emitting element 30 is mounted on the front surface 50SA of the ferrule 50B. That is, the ferrule 50B has the function of the first wiring board 40A (FIG. 8).
　撮像装置１Ｂは、撮像装置１Ａよりも構成が簡単であるため、撮像装置１Ａよりも更に製造が容易である。 Since the imaging device 1B has a simpler configuration than the imaging device 1A, it is easier to manufacture than the imaging device 1A.
＜変形例３＞
　図１０に示す撮像装置１Ｃは、フェルール５０の挿入孔Ｈ５０Ｃに挿入されている非可撓性のパイプ８０を更に具備する。チューブ６２および光ファイバ６１は、中空体であるパイプ８０に挿入されている。 <Modification 3>
The imaging device 1C shown in FIG. 10 further includes an inflexible pipe 80 inserted into the insertion hole H50C of the ferrule 50. The tube 62 and the optical fiber 61 are inserted into a hollow pipe 80.
　図１１に示すように、パイプ８０のパイプ先端面は、発光素子３０の発光面３０ＳＡに、その中心軸が光軸Ｏと一致する位置に、垂直に固定されている。図１０に示すように、第１の配線板４０Ｃには、光路孔であると同時にパイプ８０が挿通しているパイプ孔Ｈ４０Ｃがある。 As shown in FIG. 11, the tip end surface of the pipe 80 is vertically fixed to the light emitting surface 30SA of the light emitting element 30 at a position where the center axis thereof coincides with the optical axis O. As shown in FIG. 10, the first wiring board 40C has a pipe hole H40C which is an optical path hole and at the same time, a pipe 80 is inserted therethrough.
　撮像装置１Ｃの製造方法では、図１１に示すように、最初に発光素子３０にパイプ８０が配設される。そして、図１０に示すように、パイプ８０がパイプ孔Ｈ４０Ｃおよび挿入孔Ｈ５０Ｃに挿通されてから、発光素子３０が、第１の配線板４０Ｃの第１の主面４０ＳＡに実装される。パイプ８０によって、光ファイバ６１と発光素子３０との光軸合わせが自動的に行われるため、撮像装置１Ｃは製造が容易である。 In the method of manufacturing the imaging device 1C, first, the pipe 80 is provided on the light emitting element 30 as shown in FIG. Then, as shown in FIG. 10, after the pipe 80 is inserted into the pipe hole H40C and the insertion hole H50C, the light emitting element 30 is mounted on the first main surface 40SA of the first wiring board 40C. Since the optical axes of the optical fiber 61 and the light emitting element 30 are automatically aligned by the pipe 80, the imaging device 1C is easy to manufacture.
　また、図１２に示すように、複合ケーブル６０Ｃの複数の電気ケーブル６５は、それぞれが、電気信号を伝送する導線である導電線６３と、導電線６３を覆う第１外皮６５Ａと、接地電位線であるシールド線６６と、シールド線６６を覆う第２外皮６５Ｂとを有する同軸線ケーブルである。 As shown in FIG. 12, each of the plurality of electric cables 65 of the composite cable 60 </ b> C includes a conductive wire 63 that is a conductive wire for transmitting an electric signal, a first sheath 65 </ b> A covering the conductive wire 63, and a ground potential wire. This is a coaxial cable having a shield wire 66 and a second sheath 65B covering the shield wire 66.
　さらに、パイプ８０は、銅等の導電性材料からなる。そして、フェルール５０の後面５０ＳＢから突出しているパイプ８０の外面に、電気ケーブル６５の接地電位線であるシールド線６６が接合されている。パイプ先端面は、発光素子３０の接地電位電極３２Ｂと接続されている。シールド線６６が、パイプ８０を経由して、撮像素子１０の接地電位電極１２Ｂと接続されていてもよい。 Furthermore, the pipe 80 is made of a conductive material such as copper. A shield wire 66, which is a ground potential line of the electric cable 65, is joined to the outer surface of the pipe 80 projecting from the rear surface 50SB of the ferrule 50. The pipe tip surface is connected to the ground potential electrode 32B of the light emitting element 30. The shield line 66 may be connected to the ground potential electrode 12B of the imaging device 10 via the pipe 80.
　第１の配線板４０Ｃを挿通しているパイプ８０は、光ファイバ６１の位置決め機能だけでなく、接地電位線の機能も有するため、撮像装置１Ｃは構成が簡単である。 (4) Since the pipe 80 passing through the first wiring board 40C has not only the function of positioning the optical fiber 61 but also the function of a ground potential line, the configuration of the imaging device 1C is simple.
　なお、パイプ８０は、図１１に示した中空の角柱に限られるものではなく、中空円筒または中空多角柱でもよい。 The pipe 80 is not limited to the hollow prism shown in FIG. 11, but may be a hollow cylinder or a hollow polygonal pillar.
　また、図９に示した撮像装置１Ｂにおいても、発光素子３０にパイプ８０が配設されており、フェルール５０Ｂの挿入孔Ｈ５０が、パイプ８０が挿通しているパイプ孔であれば、撮像装置１Ｃと同じ効果を有することは言うまでも無い。 Also in the imaging device 1B shown in FIG. 9, the light emitting element 30 is provided with the pipe 80, and if the insertion hole H50 of the ferrule 50B is a pipe hole through which the pipe 80 is inserted, the imaging device 1C Needless to say, it has the same effect as.
＜変形例３の撮像装置の製造方法＞
　図１３のフローチャートに沿って変形例３の撮像装置１Ｃの製造方法を説明する。撮像装置１Ｃの製造方法は、撮像装置１の製造方法と類似しているため、大きく異なる工程についてのみ説明する。 <Method of Manufacturing Imaging Device of Modification 3>
A method for manufacturing the imaging device 1C according to the third modification will be described with reference to the flowchart in FIG. Since the method for manufacturing the imaging device 1C is similar to the method for manufacturing the imaging device 1, only the steps that are significantly different will be described.
＜ステップＳ１０＞素子実装工程
　撮像装置１Ｃの製造方法では、素子接合工程Ｓ１０は、パイプ固定工程（Ｓ１２）と、パイプ挿通工程（Ｓ１４）と、発光素子実装工程（Ｓ１６）と、を含む。 <Step S10> Element Mounting Step In the method of manufacturing the imaging device 1C, the element bonding step S10 includes a pipe fixing step (S12), a pipe insertion step (S14), and a light emitting element mounting step (S16).
＜ステップＳ１２＞パイプ固定工程
　光信号を出射する発光面３０ＳＡを有し発光面３０ＳＡに複数の接合電極３２が配設されている発光素子３０の発光面３０ＳＡに、非可撓性のパイプ８０が、その中心軸が発光素子３０の光軸Ｏと一致する位置に、垂直に固定される。 <Step S12> Pipe fixing step An inflexible pipe 80 is attached to the light emitting surface 30SA of the light emitting element 30 having the light emitting surface 30SA for emitting an optical signal and having the plurality of bonding electrodes 32 disposed on the light emitting surface 30SA. Are fixed vertically at a position where the center axis thereof coincides with the optical axis O of the light emitting element 30.
＜ステップＳ１４＞パイプ挿通工程
　第１の主面４０ＳＡと第１の主面４０ＳＡと対向している第２の主面４０ＳＢとを有し、第１の主面４０ＳＡに複数の第１電極４１が配設されており、パイプ孔Ｈ４０Ｃのある第１の配線板４０のパイプ孔Ｈ４０Ｃに、パイプ８０が挿通される。 <Step S14> Pipe Insertion Step A first main surface 40SA and a second main surface 40SB facing the first main surface 40SA are provided, and a plurality of first electrodes 41 are provided on the first main surface 40SA. The pipe 80 is inserted into the pipe hole H40C of the first wiring board 40 which is provided and has the pipe hole H40C.
＜ステップＳ１６＞発光素子実装工程
　第１の配線板４０の第１電極４１のそれぞれに、発光素子３０の接合電極３２のそれぞれが接合される。 <Step S16> Light Emitting Element Mounting Step Each of the bonding electrodes 32 of the light emitting element 30 is bonded to each of the first electrodes 41 of the first wiring board 40.
　フェルール固定工程（Ｓ２０）以降は、同じである。なお、フェルール固定工程では、フェルール５０の挿入孔Ｈ５０Ｃには、パイプ８０が挿入される。挿入孔Ｈ５０Ｃの内径Ｒ５０は、パイプ８０の外径よりも大きければ、特に厳密に管理する必要はない。 The same applies after the ferrule fixing step (S20). In the ferrule fixing step, the pipe 80 is inserted into the insertion hole H50C of the ferrule 50. If the inner diameter R50 of the insertion hole H50C is larger than the outer diameter of the pipe 80, there is no need to strictly manage the inner diameter R50.
　本変形例の製造方法によれば、発光素子３０にパイプ８０を配設するときに位置決めを行うだけで、発光素子３０と光ファイバ６１との位置決めが自動的に行われる。このため、本変形例の製造方法は製造が容易である。 According to the manufacturing method of the present modification, the positioning between the light emitting element 30 and the optical fiber 61 is automatically performed only by performing the positioning when the pipe 80 is provided to the light emitting element 30. Therefore, the manufacturing method of the present modification is easy to manufacture.
　本発明は、上述した実施形態および変形例等に限定されるものではなく、発明の趣旨を逸脱しない範囲内において種々の変更、組み合わせおよび応用が可能である。 The present invention is not limited to the above-described embodiments and modified examples, and various changes, combinations, and applications are possible without departing from the spirit of the invention.
１、１Ａ～１Ｃ・・・内視鏡用撮像装置
６・・・内視鏡システム
９、９Ａ～９Ｃ・・・内視鏡
１０・・・撮像素子
１０ＳＡ・・・受光面
１０ＳＢ・・・裏面
１１・・・受光部
１２・・・外部電極
１３・・・カバーガラス
３０・・・発光素子
３０ＳＡ・・・発光面
３１・・・発光部
３２・・・接合電極
４０・・・（第１の）配線板
４０ＳＡ・・・第１の主面
４０ＳＢ・・・第２の主面
４１・・・第１電極
４２・・・第２電極
４３・・・貫通配線
４４・・・第３電極
４５・・・第２配線板
５０・・・フェルール
５０ＳＡ・・・前面
５０ＳＢ・・・後面
５０ＳＳ・・・側面
５１・・・中継電極
５５・・・接着剤
５９・・・半田
６０・・・光電複合ケーブル
６１・・・光ファイバ
６２・・・チューブ
６３・・・導電線
６４・・・絶縁部材
６５・・・電気ケーブル
６６・・・シールド線
７０・・・透明樹脂
８０・・・パイプ 1, 1A to 1C: Endoscope imaging device 6: Endoscope system 9, 9A to 9C: Endoscope 10: Image sensor 10SA: Light receiving surface 10SB: Back surface Reference Signs List 11 light receiving part 12 external electrode 13 cover glass 30 light emitting element 30SA light emitting surface 31 light emitting part 32 bonding electrode 40 (first ) Wiring board 40SA first main surface 40SB second main surface 41 first electrode 42 second electrode 43 through wiring 44 third electrode 45 ..Second wiring board 50 Ferrule 50SA Front 50SB Rear 50SS Side 51 Relay electrode 55 Adhesive 59 Solder 60 Photoelectric composite cable 61 ... optical fiber 62 ... tube 63 ... conductive wire 64 ... insulating member 65 ... Cable 66 ... shielded wire 70 ... transparent resin 80 ... Pipe

Claims (13)

  1. 　撮像信号を出力する撮像素子と、
    　前記撮像信号に応じた駆動信号を出力する駆動回路と、
    　前記駆動信号を光信号に変換して、前記光信号を発光面から出射する発光素子と、
    　前記光信号を伝送する光ファイバと、
    　前記光ファイバが挿入されている、可撓性のチューブと、
    　前記チューブおよび前記光ファイバが挿入されている挿入孔のあるフェルールと、を具備しており、
    　前記光ファイバのファイバ先端部が、前記チューブのチューブ先端部から突出しており、
    　前記ファイバ先端部を覆っている透明樹脂を、更に具備することを特徴とする内視鏡用撮像装置。     An image sensor that outputs an image signal;
    A drive circuit that outputs a drive signal according to the imaging signal,
    A light emitting element that converts the drive signal into an optical signal and emits the optical signal from a light emitting surface,
    An optical fiber for transmitting the optical signal,
    The optical fiber is inserted, a flexible tube,
    A ferrule having an insertion hole into which the tube and the optical fiber are inserted,
    The fiber tip of the optical fiber projects from the tube tip of the tube,
    An imaging device for an endoscope, further comprising a transparent resin covering the fiber tip.
  2. 　前記撮像素子に電気信号を伝送する複数の導電線を更に具備し、
    　前記複数の導電線のそれぞれは、前記フェルールに配設されている複数の中継電極のそれぞれと、半田接合されていることを特徴とする請求項１に記載の内視鏡用撮像装置。     Further comprising a plurality of conductive lines for transmitting an electrical signal to the image sensor,
    The imaging device for an endoscope according to claim 1, wherein each of the plurality of conductive wires is soldered to each of a plurality of relay electrodes provided on the ferrule.
  3. 　第１の主面と前記第１の主面と対向する第２の主面とを、有し、前記第１の主面に前記発光素子が実装されており、前記第２の主面に前記フェルールが配設されている配線板を更に具備することを特徴とする請求項１または請求項２に記載の内視鏡用撮像装置。 A first main surface and a second main surface facing the first main surface, wherein the light emitting element is mounted on the first main surface, and the second main surface is provided on the second main surface. The imaging device for an endoscope according to claim 1 or 2, further comprising a wiring board provided with a ferrule.
  4. 　前記配線板の基板が透明であることを特徴とする請求項３に記載の内視鏡用撮像装置。 The imaging device for an endoscope according to claim 3, wherein the substrate of the wiring board is transparent.
  5. 　前記配線板に、光路を構成している光路孔があることを特徴とする請求項３に記載の内視鏡用撮像装置。 The imaging device for an endoscope according to claim 3, wherein the wiring board has an optical path hole constituting an optical path.
  6. 　前記発光素子が、前記フェルールに実装されていることを特徴とする請求項１または請求項２に記載の内視鏡用撮像装置。 The imaging device for an endoscope according to claim 1 or 2, wherein the light emitting element is mounted on the ferrule.
  7. 　前記フェルールの前記挿入孔に挿入されている非可撓性のパイプを更に具備し、
    　前記チューブおよび前記光ファイバが前記パイプに挿入されていることを特徴とする請求項３から請求項５のいずれか１項に記載の内視鏡用撮像装置。     Further comprising an inflexible pipe inserted into the insertion hole of the ferrule,
    The imaging device for an endoscope according to any one of claims 3 to 5, wherein the tube and the optical fiber are inserted into the pipe.
  8. 　前記配線板に前記パイプが挿通しているパイプ孔があり、
    　前記パイプのパイプ先端面が前記発光面に固定されていることを特徴とする請求項７に記載の内視鏡用撮像装置。     There is a pipe hole through which the pipe is inserted in the wiring board,
    The imaging device for an endoscope according to claim 7, wherein a pipe tip surface of the pipe is fixed to the light emitting surface.
  9. 　前記パイプが導電性材料からなり、
    　前記複数の導電線の接地電位線が、前記発光素子または前記撮像素子の少なくともいずれかと、前記パイプを経由して電気的に接続されていることを特徴とする請求項８に記載の内視鏡用撮像装置。     The pipe is made of a conductive material,
    The endoscope according to claim 8, wherein a ground potential line of the plurality of conductive lines is electrically connected to at least one of the light emitting element and the imaging element via the pipe. Imaging device.
  10. 　請求項１から請求項９のいずれか１項に記載の内視鏡用撮像装置を含むことを特徴とする内視鏡。 An endoscope including the imaging device for an endoscope according to any one of claims 1 to 9.
  11. 　第１の主面と前記第１の主面と対向している第２の主面とを有し、前記第１の主面に複数の第１電極が配設されている配線板の前記複数の第１電極のそれぞれに、光信号を出射する発光面を有し前記発光面に複数の接合電極が配設されている発光素子の前記複数の接合電極のそれぞれを接合する素子実装工程と、
    　前面と前記前面と対向する後面と側面を有し、前記側面に複数の中継電極が配設されており、挿入孔があるフェルールの前記前面を前記配線板の前記第２の主面に固定するフェルール固定工程と、
    　複数の導電線と可撓性のチューブと前記チューブに挿入されている光ファイバとを含む光電複合ケーブルの端面から突出している、前記チューブのチューブ先端部を、前記挿入孔に挿入し固定するチューブ固定工程と、
    　前記フェルールの複数の中継電極のそれぞれに、前記端面から突出している前記複数の導電線のそれぞれを、半田接合するケーブル接合工程と、を具備し、
    　前記ケーブル接合工程においては、前記フェルールの中の前記チューブに前記光ファイバが挿入されておらず、
    　前記ケーブル接合工程の後に、前記フェルールの中の前記チューブに、前記光ファイバを挿通するファイバ挿通工程を更に具備することを特徴とする内視鏡用撮像装置の製造方法。     The plurality of wiring boards each having a first main surface and a second main surface facing the first main surface, wherein a plurality of first electrodes are provided on the first main surface. An element mounting step of joining each of the plurality of bonding electrodes of the light emitting element, wherein each of the first electrodes has a light emitting surface that emits an optical signal and has a plurality of bonding electrodes disposed on the light emitting surface;
    It has a front surface, a rear surface facing the front surface, and a side surface, a plurality of relay electrodes are provided on the side surface, and the front surface of the ferrule having an insertion hole is fixed to the second main surface of the wiring board. Ferrule fixing process,
    A tube that inserts and fixes a tube tip of the tube, which protrudes from an end surface of a photoelectric composite cable including a plurality of conductive wires, a flexible tube, and an optical fiber inserted into the tube, into the insertion hole. Fixing process,
    Each of the plurality of relay electrodes of the ferrule, each of the plurality of conductive wires protruding from the end face, a cable joining step of solder joining, comprising:
    In the cable joining step, the optical fiber is not inserted into the tube in the ferrule,
    A method of manufacturing an imaging device for an endoscope, further comprising a fiber insertion step of inserting the optical fiber into the tube in the ferrule after the cable joining step.
  12. 　前記ケーブル接合工程の後、前記ファイバ挿通工程の前に、
    　前記挿入孔に透明樹脂を注入する樹脂注入工程を更に有することを特徴とする請求項１１に記載の内視鏡用撮像装置の製造方法。     After the cable joining step and before the fiber insertion step,
    12. The method according to claim 11, further comprising a resin injecting step of injecting a transparent resin into the insertion hole.
  13. 　前記素子実装工程が、パイプ固定工程と、パイプ挿通工程と、発光素子実装工程と、を含み、
    　前記パイプ固定工程において、前記発光素子の前記発光面に、非可撓性のパイプを、その中心軸が前記発光素子の光軸と一致する位置に、垂直に固定され、
    　前記パイプ挿通工程において、パイプ孔のある前記配線板の前記パイプ孔に、前記パイプを挿通され、
    　前記発光素子実装工程において、前記配線板の前記複数の第１電極のそれぞれに、前記発光素子の前記複数の接合電極のそれぞれが接合され、
    　前記フェルール固定工程において、前記フェルールの前記挿入孔に、前記パイプを挿通した状態において、前記前面が前記配線板の前記第２の主面に固定されることを特徴とする請求項１１または請求項１２に記載の内視鏡用撮像装置の製造方法。     The element mounting step includes a pipe fixing step, a pipe insertion step, and a light emitting element mounting step,
    In the pipe fixing step, a non-flexible pipe, on the light emitting surface of the light emitting element, is fixed vertically at a position where the center axis thereof coincides with the optical axis of the light emitting element,
    In the pipe insertion step, the pipe is inserted into the pipe hole of the wiring board having a pipe hole,
    In the light emitting element mounting step, each of the plurality of bonding electrodes of the light emitting element is bonded to each of the plurality of first electrodes of the wiring board,
    12. The ferrule fixing step, wherein the front surface is fixed to the second main surface of the wiring board in a state where the pipe is inserted through the insertion hole of the ferrule. 13. The method for manufacturing an imaging device for an endoscope according to claim 12.
PCT/JP2018/035646 2018-09-26 2018-09-26 Endoscopic imaging device, endoscope, and endoscopic imaging device production method WO2020065757A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053953A1 (en) * 2021-10-01 2023-04-06 Hoya株式会社 Optical transmitter module and endoscope

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10268162A (en) * 1997-03-25 1998-10-09 Oki Electric Ind Co Ltd Light module
JP2016151684A (en) * 2015-02-18 2016-08-22 株式会社フジクラ Optical fiber with ferrule and manufacturing method thereof
WO2016185537A1 (en) * 2015-05-18 2016-11-24 オリンパス株式会社 Endoscope and light transmitting module
WO2016189691A1 (en) * 2015-05-27 2016-12-01 オリンパス株式会社 Endoscope and optical transmission module
JP2016200647A (en) * 2015-04-07 2016-12-01 フジクラ電装株式会社 Ferrule with optical fiber and optical apparatus
JP2016218279A (en) * 2015-05-21 2016-12-22 住友金属鉱山株式会社 Pigtail fiber module
WO2017109930A1 (en) * 2015-12-25 2017-06-29 オリンパス株式会社 Image pickup module and endoscope
WO2017141368A1 (en) * 2016-02-17 2017-08-24 オリンパス株式会社 Optical transmission module, and endoscope
WO2018042715A1 (en) * 2016-08-30 2018-03-08 オリンパス株式会社 Optical signal transmission module for endoscope
WO2018092233A1 (en) * 2016-11-17 2018-05-24 オリンパス株式会社 Optical module, image pickup module, and endoscope

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10268162A (en) * 1997-03-25 1998-10-09 Oki Electric Ind Co Ltd Light module
JP2016151684A (en) * 2015-02-18 2016-08-22 株式会社フジクラ Optical fiber with ferrule and manufacturing method thereof
JP2016200647A (en) * 2015-04-07 2016-12-01 フジクラ電装株式会社 Ferrule with optical fiber and optical apparatus
WO2016185537A1 (en) * 2015-05-18 2016-11-24 オリンパス株式会社 Endoscope and light transmitting module
JP2016218279A (en) * 2015-05-21 2016-12-22 住友金属鉱山株式会社 Pigtail fiber module
WO2016189691A1 (en) * 2015-05-27 2016-12-01 オリンパス株式会社 Endoscope and optical transmission module
WO2017109930A1 (en) * 2015-12-25 2017-06-29 オリンパス株式会社 Image pickup module and endoscope
WO2017141368A1 (en) * 2016-02-17 2017-08-24 オリンパス株式会社 Optical transmission module, and endoscope
WO2018042715A1 (en) * 2016-08-30 2018-03-08 オリンパス株式会社 Optical signal transmission module for endoscope
WO2018092233A1 (en) * 2016-11-17 2018-05-24 オリンパス株式会社 Optical module, image pickup module, and endoscope

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053953A1 (en) * 2021-10-01 2023-04-06 Hoya株式会社 Optical transmitter module and endoscope

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