WO2020063491A1 - 一种半导体压阻结冰探测器及工作方法 - Google Patents

一种半导体压阻结冰探测器及工作方法 Download PDF

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Publication number
WO2020063491A1
WO2020063491A1 PCT/CN2019/107110 CN2019107110W WO2020063491A1 WO 2020063491 A1 WO2020063491 A1 WO 2020063491A1 CN 2019107110 W CN2019107110 W CN 2019107110W WO 2020063491 A1 WO2020063491 A1 WO 2020063491A1
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semiconductor
icing
piezoresistive
icing detector
pressure sensor
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PCT/CN2019/107110
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English (en)
French (fr)
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陈龙
张一术
魏晓娜
刘战强
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山东大学
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Publication of WO2020063491A1 publication Critical patent/WO2020063491A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
    • B64D15/20—Means for detecting icing or initiating de-icing

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  • the invention relates to the field of aviation technology, in particular to a semiconductor piezoresistive icing detector and a working method thereof.
  • the purpose of the present invention is to overcome the shortcomings of the prior art and provide a semiconductor piezoresistive icing detector with simple structure, high accuracy and strong reliability, which can be used for icing monitoring and early warning on the icing surface of aircraft wings. And the icing thickness is obtained through calibration calculation, which can meet the needs of aircraft flight safety assurance and flight reference.
  • the present invention adopts the following technical solutions:
  • a semiconductor piezoresistive icing detector includes a semiconductor fixing frame, which is used for fixed connection with the skin of a wing to be tested.
  • the semiconductor fixing frame is provided with a semiconductor which can slide up and down along its axial direction.
  • the bottom end of the semiconductor is in contact with one end of an insulating ball located inside the skin, and the other end of the insulating ball is in contact with a pressure sensor.
  • the pressure sensor is fixed at the tip of a thimble located inside the skin, and the other end of the thimble is connected to the test object through a spring. Wing connection.
  • the shape of the semiconductor is cylindrical, and a plurality of sliders are provided on a side circumferential surface thereof.
  • a semiconductor wire is connected to the bottom of the semiconductor, and the semiconductor wire is used to form a closed loop with an external system.
  • the semiconductor fixing frame is a cylindrical cylinder structure matching the shape of the semiconductor, and a plurality of chute grooves matching the slider are provided on an inner circumferential surface of the semiconductor fixed connection, and the chute grooves The length is longer than the length of the slider.
  • the bottom surface of the semiconductor fixing frame is provided with an opening, and the opening is used for the bottom end of the semiconductor to contact the insulating ball.
  • the spring is a lightweight spring.
  • the thimble comprises a cylindrical section and a conical section
  • the pressure sensor is fixed at the tip of the conical section
  • one end of the cylindrical section is fixedly connected to the conical section
  • the other end is provided with a sleeve section.
  • the diameter is smaller than the diameter of the cylindrical section.
  • the lightweight spring is sleeved on the sleeve section. One end of the lightweight spring is connected to the end surface of the cylindrical section, and the other end is connected to the internal structure of the wing to be tested.
  • a through hole is penetrated in the cylindrical section, the conical section and the sleeve shaft section, and a sensor wire connected to the pressure sensor is provided in the through hole.
  • the invention also discloses a working method of a semiconductor piezoresistive icing detector, which includes the following steps:
  • Step 1 Before the flight of the aircraft, calibrate the semiconductor piezoresistive icing detector and set the threshold value of the electrical signal for alarm in the semiconductor circuit.
  • Step 2 A plurality of semiconductor piezoresistive icing detectors are installed on the wing to be tested. When the aircraft is flying, the current change value and icing thickness in the semiconductor connection circuit are detected in real time.
  • the semiconductor piezoresistive icing detector is calibrated in an ice wind tunnel environment.
  • step 2 when the surface of the aircraft wing freezes, the semiconductor changes the resistance value under the pressure, the current in the circuit connected to the semiconductor changes, and the real-time according to the change value of the collected current signal Calculate the icing thickness. When the current value exceeds the threshold, an alarm will be issued.
  • the pressure value detected by the pressure sensor is used to compensate for changes in the semiconductor resistance value caused by external factors.
  • the semiconductor piezoresistive icing detector of the present invention has a simple structure, uses the piezoresistive characteristics of semiconductors to measure the icing thickness on the surface of an aircraft wing, and overcomes the problem of high false alarm rates of conventional aircraft icing sensors. High reliability.
  • the semiconductor piezoresistive icing detector of the present invention uses a pressure sensor to compensate for changes in semiconductor resistance caused by external factors.
  • the detection results are accurate and highly accurate, which meets the needs of aircraft flight safety assurance and flight reference.
  • FIG. 1 is an assembly schematic diagram of an icing detector and a skin according to the present invention
  • FIG. 2 is a schematic diagram of a semiconductor structure of the present invention.
  • FIG. 3 is a schematic structural diagram of a semiconductor fixing frame according to the present invention.
  • FIG. 4 is a schematic structural diagram of a thimble according to the present invention.
  • FIG. 5 is a schematic diagram of a use state of the present invention.
  • the existing aircraft icing sensor uses optical fiber and aerodynamic principles for icing detection. There are certain defects and problems in the design. In view of the above problems, this application proposes a semiconductor piezoresistive icing detector. .
  • a semiconductor piezoresistive icing detector includes a semiconductor fixing frame 1.
  • the semiconductor fixing frame passes through the skin 2 of the wing to be tested.
  • a rivet is fixedly connected
  • the skin is provided with a mounting hole for mounting a semiconductor piezoresistive icing detector
  • the semiconductor holder is provided with a semiconductor 3 which can slide up and down along its axis.
  • One end of the insulation ball 4 inside the skin mounting hole is in contact with the other end of the insulation ball is in contact with the pressure sensor 5.
  • the pressure sensor is fixed to the tip of a thimble 6 located inside the skin mounting hole. Wing connection.
  • the semiconductor 3 has a cylindrical structure, and a plurality of sliders 3-1 are evenly distributed on the outer circumferential surface of the semiconductor.
  • a semiconductor wire 3-2 is provided at the bottom of the semiconductor, and the semiconductor wire passes through the skin. It is used to connect with the control device of the external system to form a closed loop. When the semiconductor is under pressure, it moves along the chute and changes the resistance value. The corresponding closed-loop current signal is transmitted to the control device of the external system.
  • the semiconductor holder 1 is a cylindrical cylindrical structure that matches the shape of the semiconductor.
  • the upper end is not sealed.
  • the inner cylindrical surface is provided with a plurality of chute 1-1 matching the slider, and the length of the chute It is longer than the length of the slider.
  • the semiconductor is placed inside the semiconductor holder, and the slider is embedded and installed in the corresponding chute.
  • the semiconductor can slide up and down along the axial direction of the semiconductor holder.
  • the insulating ball is made of insulating material, which can prevent measurement errors caused by short circuits between the semiconductor and the pressure sensor.
  • the thimble 6 includes a cylindrical section 6-1 and a conical section 6-2 which are integrally connected.
  • a pressure sensor is fixed at the tip of the conical section. The pressure sensor is in contact with an insulating ball, and the insulating ball is in approximate point contact with the thimble. The insulation ball is in point contact with the bottom surface of the semiconductor. Through the point contact, the accuracy of the change in the resistance of the semiconductor is improved.
  • One end of the cylindrical section is integrally connected with the conical section, and the other end is integrally connected with the sleeve shaft section 6-3. The diameter of the sleeve section is smaller than the diameter of the cylindrical section.
  • a spring 7 is sleeved on the sleeve shaft section.
  • One end of the spring is connected to the end surface of the cylindrical section, and the other end is connected to the internal structure of the wing inside the wing skin.
  • the spring can ensure that the pressure sensor contacts the insulating ball.
  • the insulating ball is in contact with the bottom surface of the semiconductor.
  • the cylindrical section, the conical section and the sleeve section are provided with a through hole 6-4 penetrating the entire thimble.
  • the through hole is provided with a sensor wire 5-1 connected to the pressure sensor.
  • the said spring adopts a lightweight spring, which can ignore the change of the pressure sensor caused by the flying acceleration of the lightweight spring, and prevent measurement errors introduced by the spring.
  • the invention also discloses a working method of a semiconductor piezoresistive icing detector, which includes the following steps:
  • Step 1 Before the flight, calibrate the detector in an ice wind tunnel environment, and set the threshold value of the current change signal in the circuit connected to the semiconductor during the alarm.
  • Step 2 Arrange multiple icing detectors on the wing of the aircraft as required. When the aircraft is flying, the icing situation can be monitored in real time.
  • the working method of the icing detector is specifically: when the surface of the wing is frozen, the ice layer on the surface of the wing generates vertical pressure on the semiconductor, and the semiconductor moves along the chute in the semiconductor holder, and the semiconductor The resistance will change, and the current data in the circuit connected to the semiconductor will change.
  • the monitoring of the current change in the closed circuit determine whether there is ice, and calculate the thickness of the ice. When the value of the current changes exceeds the threshold value, an alarm signal will be issued.
  • the pressure sensor can also measure changes in the pressure on the semiconductor due to external factors such as flight acceleration, aircraft body vibration, and wind resistance, and compensate for changes in semiconductor resistance values caused by external factors, which improves the ice thickness. calculation accuracy.
  • the icing detector of the present invention has a simple structure, high monitoring accuracy, and high reliability.
  • the icing detector can be used for icing monitoring and early warning on the surface of an aircraft wing, and can obtain icing thickness, which can meet the requirements of aircraft flight safety assurance and flight reference need.

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  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

一种半导体压阻结冰探测器及工作方法，包括半导体固定架（1），半导体固定架（1）用于与待测机翼的蒙皮（2）固定连接，半导体固定架（1）内部设有可沿其轴向上下滑动的半导体（3），半导体（3）底端与位于蒙皮（2）内部的绝缘球（4）一端接触，绝缘球（4）的另一端与压力传感器（5）接触，压力传感器（5）固定于位于蒙皮（2）内部的顶针（6）的尖端，顶针（6）另一端通过弹簧（7）与待测机翼连接，结冰探测器的结构简单，精度高，可靠性高，满足了飞机飞行安全保障及飞行参考工作的需要。

Description

一种半导体压阻结冰探测器及工作方法 技术领域
本发明涉及航空技术领域，具体涉及一种半导体压阻结冰探测器及工作方法。
背景技术
飞机等航空器在高寒带或湿度大的高纬度地区会发生表面结冰现象。飞机表面结冰会严重影响飞行性能，甚至造成飞机失控等后果，因此需要对结冰探测系统进行设计并提高结冰探测器的精度。
现有的飞机结冰传感器主要采用光纤及气动原理进行结冰探测，在结构设计上存在一定的缺陷和问题，例如传统的气动式结冰信号传感器无法将结冰堵塞和灰尘等异物进行分辨，导致当灰尘堵塞进气孔发生气孔堵塞现象，结冰探测信号报警，造成传统的结冰信号传感器虚警率高。因此，迫切需要对其进行适应性改进，并提高结冰探测精度，需要设计发明一种可以在线监测飞机表面结冰情况及结冰厚度的装置。
发明内容
本发明的目的是为克服上述现有技术的不足，提供一种半导体压阻结冰探测器，结构简单、精度高，可靠性强，可用于飞机机翼结冰表面的结冰监测和预警，并通过标定计算得到结冰厚度，能够满足飞机飞行安全保障及飞行参考等工作的需要。
为实现上述目的，本发明采用下述技术方案：
一种半导体压阻结冰探测器，包括半导体固定架，所述半导体固定架用于与待测机翼的蒙皮固定连接，所述半导体固定架内部设有可沿其轴向上下滑动的半导体，所述半导体底端与位于蒙皮内部的绝缘球一端接触，绝缘球的另一端与压力传感器接触，压力传感器固定于位于蒙皮内部的顶针的尖端，所述顶针另一端通过弹簧与待测机翼连接。
进一步的，所述半导体形状为圆柱形，其侧圆周表面设有多个滑块，半导体的底部连接有半导体导线，所述半导体导线用于与外部系统形成闭合回路。
进一步的，所述半导体固定架为与半导体形状相匹配的圆柱型筒体结构，所 述半导体固定接的内圆周表面上设有多个与所述滑块相匹配的滑槽，所述滑槽长度大于滑块长度，所述半导体固定架底端面设有开口，所述开口用于半导体底端与绝缘球接触。
进一步的，所述弹簧采用轻质弹簧。
进一步的，所述顶针包括圆柱段及圆锥段，所述压力传感器固定于圆锥段的尖端部位，所述圆柱段一端与圆锥段固定连接，另一端设有套轴段，所述套轴段的直径小于圆柱段直径，所述轻质弹簧套于套轴段上，轻质弹簧一端与圆柱段的端面连接，另一端与待测机翼的内部结构连接。
进一步的，所述圆柱段、圆锥段及套轴段内贯穿有通孔，所述通孔内设有与压力传感器连接的传感器导线。
本发明还公开了一种半导体压阻结冰探测器的工作方法，包括以下步骤：
步骤1：飞机飞行前，对半导体压阻结冰探测器进行标定，设定半导体的回路中进行报警的电信号阙值。
步骤2：将多个半导体压阻结冰探测器安装在待测机翼上，飞机飞行时，对半导体连接回路中电流变化值及结冰厚度实时进行检测。
进一步的，所述步骤1中，对半导体压阻结冰探测器在冰风洞环境中进行标定。
进一步的，所述步骤2的具体工作方法为：飞机机翼表面结冰时，半导体在压力作用下发生阻值的变化，与半导体连接的回路中电流产生变化，根据采集的电流信号变化值实时计算结冰厚度，当电流变化值超过阙值时，进行报警。
进一步的，结冰厚度计算时，利用压力传感器检测得到的压力值来补偿外界因素导致的半导体阻值的变化。
本发明的有益效果：
1.本发明的半导体压阻结冰探测器，结构简单，利用半导体的压阻特性来测算飞机机翼表面的结冰厚度，克服了传统的飞机结冰传感器所存在的虚报率高的问题，可靠性高。
2.本发明的半导体压阻结冰探测器，利用压力传感器补偿外界因素导致的半导体阻值的变化，检测结果准确，精度高，满足了飞机飞行安全保障及飞行参考等工作的需要。
附图说明
构成本申请的一部分的说明书附图用来提供对本申请的进一步理解，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的限定。
图1为本发明结冰探测器与蒙皮装配示意图；
图2为本发明半导体结构示意图；
图3为本发明半导体固定架结构示意图；
图4为本发明顶针结构示意图；
图5为本发明使用状态示意图；
其中，1.半导体固定架，1-1.滑槽，1-2.开口，2.蒙皮，3.半导体，3-1.滑块，3-2.半导体导线，4.绝缘球，5.压力传感器，5-1.传感器导线，6.顶针，6-1.圆柱段，6-2.圆锥段，6-3.套轴段，6-4.通孔，7.弹簧。
具体实施方式
应该指出，以下详细说明都是例示性的，旨在对本申请提供进一步的说明。除非另有指明，本文使用的所有技术和科学术语具有与本申请所属技术领域的普通技术人员通常理解的相同含义。
需要注意的是，这里所使用的术语仅是为了描述具体实施方式，而非意图限制根据本申请的示例性实施方式。如在这里所使用的，除非上下文另外明确指出，否则单数形式也意图包括复数形式，此外，还应当理解的是，当在本说明书中使用术语“包含”和/或“包括”时，其指明存在特征、步骤、操作、器件、组件和/或它们的组合。
为了方便叙述，本发明中如果出现“上”、“下”、“左”“右”字样，仅表示与附图本身的上、下、左、右方向一致，并不对结构起限定作用,仅仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的设备或元件必须具有特定的方位，以特定的方位构造和操作，因此不能理解为对本发明的限制。
正如背景技术所介绍的，现有的飞机结冰传感器采用光纤及气动原理进行结冰探测，设计上存在一定的缺陷和问题，针对上述问题，本申请提出了一种半导体压阻结冰探测器。
本申请的一种典型实施方式中，如图1-5所示，一种半导体压阻结冰探测器，包括半导体固定架1，使用时，半导体固定架与待测机翼的蒙皮2通过铆钉固定 连接，所述蒙皮上设有用于安装半导体压阻结冰探测器的安装孔，所述半导体固定架内部设有可沿其轴向上下滑动的半导体3，所述半导体底端与位于蒙皮安装孔内部的绝缘球4一端接触，绝缘球的另一端与压力传感器5接触，压力传感器固定于位于蒙皮安装孔内部的顶针6的尖端，所述顶针另一端通过弹簧7与待测机翼连接。
所述半导体3为圆柱型结构，所述半导体的外圆周表面上均匀的分布有多个滑块3-1，所述半导体的底部设有半导体导线3-2，所述半导体导线穿过蒙皮用于与外部系统的控制装置连接，形成闭合回路，半导体受压力时，沿滑槽运动，产生阻值变化，相应的闭合回路中电流信号变化传输给外部系统的控制装置。
所述半导体固定架1为与半导体形状相匹配的圆柱型筒体结构，其上端不密封，其内侧圆柱表面上设有多个与滑块相匹配的滑槽1-1，且滑槽的长度大于滑块的长度，安装时，半导体放置于半导体固定架内部，滑块嵌入安装入相应的滑槽中，半导体可沿半导体固定架的轴向方向上下滑动，所述半导体固定架的底端面设有圆形的开口1-2，所述圆形开口用于半导体底端面与绝缘球的接触。
所述绝缘球采用绝缘材质，可以防止半导体和压力传感器短路造成的测量误差。
所述顶针6包括一体式连接的圆柱段6-1及圆锥段6-2，所述圆锥段的尖端固定有压力传感器，所述压力传感器与绝缘球接触，绝缘球与顶针为近似的点接触，绝缘球与半导体底面为点接触，通过点接触，提高了半导体阻值的变化精度，所述圆柱段一端与圆锥段一体式连接，另一端一体式连接有套轴段6-3，所述套轴段的直径小于圆柱段的直径。所述套轴段上套有弹簧7，所述弹簧的一端与圆柱段的端面连接，另一端与机翼蒙皮内部的机翼内部结构连接，所述弹簧可以保证压力传感器与绝缘球接触，绝缘球与半导体底端面接触，所述圆柱段、圆锥段及套轴段设有贯穿整个顶针的通孔6-4，所述通孔内设有与压力传感器连接的传感器导线5-1，用于将压力传感器检测的压力信号传输给外部系统的控制装置。
所述的弹簧采用轻质弹簧，可以忽略轻质弹簧由于飞行加速度引起的压力传感器的变化，防止由于弹簧引入的测量误差。
本发明还公开了一种半导体压阻结冰探测器的工作方法，包括以下步骤：
步骤1：飞行前将探测器在冰风洞环境下进行标定，设定报警时与半导体连 接回路中电流变化信号的阙值。
步骤2：在飞机机翼上根据需要布置多个结冰探测器，飞机飞行时，即可对结冰情况进行实时监测。
所述步骤2中，结冰探测器的工作方法具体为：当机翼表面结冰时，机翼表面的冰层会对半导体产生竖向压力，半导体沿滑槽在半导体固定架内运动，半导体电阻会发生变化，与半导体连接的回路中的电流数据会产生变化，根据监测闭合回路中电流变化判断是否结冰，并计算结冰厚度，当电流变化值超过阙值时，发出报警信号，结冰厚度进行计算时，压力传感器还可以测量由于飞行加速度、飞机机体振动、风阻等外界因素导致的半导体所受压力的变化，对外界因素导致的半导体阻值变化进行补偿，提高了结冰厚度的计算精度。
本发明的结冰探测器结构简单，监测精度高，可靠性高，可用于飞机机翼表面的结冰监测和预警，并可以得到结冰厚度，能够满足飞机飞行安全保障及飞行参考等工作的需要。
上述虽然结合附图对本发明的具体实施方式进行了描述，但并非对本发明保护范围的限制，所属领域技术人员应该明白，在本发明的技术方案的基础上，本领域技术人员不需要付出创造性劳动即可做出的各种修改或变形仍在本发明的保护范围以内。

Claims (10)

  1. 一种半导体压阻结冰探测器，其特征在于，包括半导体固定架，所述半导体固定架用于与待测机翼的蒙皮固定连接，所述半导体固定架内部设有可沿其轴向上下滑动的半导体，所述半导体底端与位于蒙皮内部的绝缘球一端接触，绝缘球的另一端与压力传感器接触，压力传感器固定于位于蒙皮内部的顶针的尖端，所述顶针另一端通过弹簧与待测机翼连接。
  2. 如权利要求1所述的一种半导体压阻结冰探测器，其特征在于，所述半导体形状为圆柱形，其侧圆周表面设有多个滑块，半导体的底部连接有半导体导线。
  3. 如权利要求2所述的一种半导体压阻结冰探测器，其特征在于，所述半导体固定架为与半导体形状相匹配的圆柱型筒体结构，所述半导体固定接的内圆周表面上设有多个与所述滑块相匹配的滑槽，所述滑槽长度大于滑块长度，所述半导体固定架底端面设有开口，所述开口用于半导体底端与绝缘球接触。
  4. 如权利要求1所述的一种半导体压阻结冰探测器，其特征在于，所述弹簧采用轻质弹簧。
  5. 如权利要求4所述的一种半导体压阻结冰探测器，其特征在于，所述顶针包括圆柱段及圆锥段，所述压力传感器固定于圆锥段的尖端部位，所述圆柱段一端与圆锥段固定连接，另一端设有套轴段，所述套轴段的直径小于圆柱段直径，所述轻质弹簧套于套轴段上，轻质弹簧一端与圆柱段的端面连接，另一端与待测机翼的内部结构连接。
  6. 如权利要求5所述的一种半导体压阻结冰探测器，其特征在于，所述圆柱段、圆锥段及套轴段内贯穿有通孔，所述通孔内设有与压力传感器连接的传感器导线。
  7. 一种权利要求1-6任一项所述的半导体压阻结冰探测器的工作方法，其特征在于，包括以下步骤：
    步骤1：飞机飞行前，对半导体压阻结冰探测器进行标定，设定半导体的回路中进行报警的电信号阙值；
    步骤2：将多个半导体压阻结冰探测器安装在待测机翼上，飞机飞行时，对半导体连接回路中电流变化值及结冰厚度实时进行检测。
  8. 如权利要求7所述的工作方法，其特征在于，所述步骤1中，对半导体压阻结冰探测器在冰风洞环境中进行标定。
  9. 如权利要求7所述的工作方法，其特征在于，所述步骤2的具体工作方法为：飞机机翼表面结冰时，半导体在压力作用下发生阻值的变化，与半导体连接的回路中电流产生变化，根据采集的电流信号变化值实时计算结冰厚度，当电流变化值超过阙值时，进行报警。
  10. 如权利要求9所述的工作方法，其特征在于，结冰厚度计算时，利用压力传感器检测得到的压力值来补偿外界因素导致的半导体阻值的变化。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115628876A (zh) * 2022-12-08 2023-01-20 中国航空工业集团公司沈阳空气动力研究所 一种冰风洞结冰与基底材料的粘附力测量装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109141210B (zh) * 2018-09-27 2019-10-15 山东大学 一种半导体压阻结冰探测器及工作方法
CN109781017B (zh) * 2019-03-21 2020-09-01 四川嘉瑞丰科技有限公司 一种光纤式结冰传感器的快速标定方法
CN117006003A (zh) * 2023-03-29 2023-11-07 哈尔滨理工大学 一种风力发电机叶片超声波除冰智慧方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559302A (en) * 1978-10-30 1980-05-02 Mayekawa Mfg Co Ltd Freezing thickness detector
US20120266669A1 (en) * 2009-11-24 2012-10-25 Qinetiq Limited Sensor Arrangement
CN103512484A (zh) * 2013-09-29 2014-01-15 华北水利水电大学 钻式冰层厚度自动测量仪及其测量方法
CN103954209A (zh) * 2014-05-13 2014-07-30 湖南大学 一种基于压电材料的风机叶片覆冰监测系统及方法
CN108061534A (zh) * 2017-10-30 2018-05-22 哈尔滨理工大学 一种新型电力线路积雪厚度监测系统
CN108180819A (zh) * 2017-12-22 2018-06-19 太原理工大学 一种基于磁弹性材料的冰层厚度测量装置
CN108195282A (zh) * 2017-12-22 2018-06-22 太原理工大学 一种基于压阻传感器的冰层厚度测量装置
CN108444375A (zh) * 2018-02-05 2018-08-24 哈尔滨工程大学 一种冰水池冰层厚度实时测量装置及测量系统
CN109141210A (zh) * 2018-09-27 2019-01-04 山东大学 一种半导体压阻结冰探测器及工作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9714876B2 (en) * 2015-03-26 2017-07-25 Sensata Technologies, Inc. Semiconductor strain gauge

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559302A (en) * 1978-10-30 1980-05-02 Mayekawa Mfg Co Ltd Freezing thickness detector
US20120266669A1 (en) * 2009-11-24 2012-10-25 Qinetiq Limited Sensor Arrangement
CN103512484A (zh) * 2013-09-29 2014-01-15 华北水利水电大学 钻式冰层厚度自动测量仪及其测量方法
CN103954209A (zh) * 2014-05-13 2014-07-30 湖南大学 一种基于压电材料的风机叶片覆冰监测系统及方法
CN108061534A (zh) * 2017-10-30 2018-05-22 哈尔滨理工大学 一种新型电力线路积雪厚度监测系统
CN108180819A (zh) * 2017-12-22 2018-06-19 太原理工大学 一种基于磁弹性材料的冰层厚度测量装置
CN108195282A (zh) * 2017-12-22 2018-06-22 太原理工大学 一种基于压阻传感器的冰层厚度测量装置
CN108444375A (zh) * 2018-02-05 2018-08-24 哈尔滨工程大学 一种冰水池冰层厚度实时测量装置及测量系统
CN109141210A (zh) * 2018-09-27 2019-01-04 山东大学 一种半导体压阻结冰探测器及工作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115628876A (zh) * 2022-12-08 2023-01-20 中国航空工业集团公司沈阳空气动力研究所 一种冰风洞结冰与基底材料的粘附力测量装置
CN115628876B (zh) * 2022-12-08 2023-03-14 中国航空工业集团公司沈阳空气动力研究所 一种冰风洞结冰与基底材料的粘附力测量装置

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