WO2020062274A1 - 一种超声探头 - Google Patents

一种超声探头 Download PDF

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Publication number
WO2020062274A1
WO2020062274A1 PCT/CN2018/109175 CN2018109175W WO2020062274A1 WO 2020062274 A1 WO2020062274 A1 WO 2020062274A1 CN 2018109175 W CN2018109175 W CN 2018109175W WO 2020062274 A1 WO2020062274 A1 WO 2020062274A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
backing block
ultrasonic probe
heat
dissipation element
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Ceased
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PCT/CN2018/109175
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English (en)
French (fr)
Inventor
王金池
吴飞
张�浩
郑洲
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Shenzhen Mindray Bio Medical Electronics Co Ltd
Shenzhen Mindray Scientific Co Ltd
Original Assignee
Shenzhen Mindray Bio Medical Electronics Co Ltd
Shenzhen Mindray Scientific Co Ltd
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Application filed by Shenzhen Mindray Bio Medical Electronics Co Ltd, Shenzhen Mindray Scientific Co Ltd filed Critical Shenzhen Mindray Bio Medical Electronics Co Ltd
Priority to PCT/CN2018/109175 priority Critical patent/WO2020062274A1/zh
Publication of WO2020062274A1 publication Critical patent/WO2020062274A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves

Definitions

  • the present application relates to medical detection equipment, and in particular, to an ultrasound probe.
  • the working principle of the ultrasound probe is to use the piezoelectric effect to convert the excitation electric pulse signal of the entire ultrasound machine into an ultrasound signal and enter the patient's body, and then convert the ultrasound echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue.
  • the working ultrasonic probe will generate a large amount of heat, which will cause the temperature of the probe to rise.
  • the probe's heat may affect the patient's personal safety. Regulations clearly stipulate that the temperature of the probe when in contact with the patient cannot exceed a certain temperature. On the other hand, if the probe works in high temperature for a long time, it will accelerate the aging of the probe and shorten the life of the probe.
  • the heat dissipation scheme of some ultrasound probes is to assemble heat sinks on the side or around the ultrasound probe to try to direct the heat to the back of the probe.
  • the main cause of the heating of the ultrasonic probe is the incomplete electro-acoustic conversion of the piezoelectric material, and the piezoelectric material is not a good heat conductor, the heat is mainly accumulated in the middle position of the probe element.
  • the heat sink on the side or around the probe cannot be sufficiently close to the center of the heat source, and the cross-sectional area of the heat sink side plate is too small to conduct sufficient heat exchange with the probe array element. The problem of probe heating is still not well solved.
  • an ultrasound probe which comprises an acoustic window, a matching layer, a piezoelectric layer, a circuit board, a backing block, and a probe housing, the acoustic window, the matching layer, the pressure
  • the electrical layer, the circuit board, and the backing block are connected in sequence.
  • the ultrasound probe further includes a first heat dissipation element provided inside the backing block, and the first heat dissipation element is parallel to the upper surface of the backing block.
  • a plurality of the first heat dissipation elements are provided inside the backing block.
  • the backing block further includes a lower surface opposite to the upper surface, and the plurality of first heat dissipation elements are parallel to each other and are sequentially arranged in a direction from the upper surface to the lower surface, wherein An interval between the first heat radiating elements adjacent to the lower surface is larger than an interval between the first heat radiating elements adjacent to the upper surface.
  • the first heat dissipation element is a metal foil or a flexible graphite film.
  • the thickness of the first heat dissipating element is not greater than 500 microns, or the thickness of the first heat dissipating element is not greater than 25 microns.
  • the acoustic impedance of the first heat dissipation element is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the first heat dissipation element and the acoustic impedance of the backing block is less than 1 trillion Swiss. Profit.
  • a second heat dissipation element is further provided inside the backing block, and the second heat dissipation element intersects the first heat dissipation element.
  • the second heat dissipation element is perpendicular to the first heat dissipation element.
  • a plurality of the second heat dissipation elements are provided inside the backing block.
  • a plurality of the second heat dissipation elements are parallel to each other.
  • the second heat dissipation element is a metal foil or a flexible graphite film.
  • the thickness of the second heat dissipating element is not more than 500 microns, or the thickness of the second heat dissipating element is not greater than 25 microns.
  • the acoustic impedance of the second heat dissipation element is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the second heat dissipation element and the acoustic impedance of the backing block is less than 1 trillion Swiss. Profit.
  • the backing block includes at least one side surface, the first heat dissipation element protrudes from at least one of the side surfaces of the backing block, and the side surface of the backing block is adhered to a heat dissipation side plate, The heat dissipation side plate is in contact with the first heat dissipation element.
  • the backing block further includes at least one side surface, and a third heat dissipation element is adhered to the side surface of the backing block, and the third heat dissipation element is integrally formed with or connected to the first heat dissipation element.
  • the third heat dissipation element is bonded to a heat dissipation side plate.
  • the ultrasound probe further includes a fourth heat dissipation element, and the fourth heat dissipation element is attached to the upper surface of the backing block.
  • the backing block includes at least one side surface, and the first heat dissipation element and / or the fourth heat dissipation element protrudes from at least one of the side surfaces of the backing block, and the backing block is abutted.
  • the backing block further includes at least one side surface, and a third heat dissipating element is adhered to the side surface of the backing block, and the third heat dissipating element is connected to the first heat dissipating element and / or the fourth heat dissipating element. Integrated or connected.
  • the third heat dissipation element is bonded to a heat dissipation side plate.
  • the heat dissipation side plate is a metal plate or a graphite plate.
  • the thickness of the heat dissipation side plate is between 0.1 mm and 3 mm.
  • the third heat dissipation element is a metal foil or a flexible graphite film.
  • the fourth heat dissipation element is a metal foil or a flexible graphite film.
  • the thickness of the fourth heat dissipating element is not greater than 500 microns, or the thickness of the fourth heat dissipating element is not greater than 25 microns.
  • the acoustic impedance of the fourth heat dissipation element is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the fourth heat dissipation element and the acoustic impedance of the backing block is less than 1 trillion Swiss. Profit.
  • the ultrasonic probe according to the above embodiment wherein the backing block is provided with a first heat dissipating element and a second heat dissipating element, the first heat dissipating element is disposed inside the backing block, and the first heat dissipating element is parallel to the upper surface of the backing block.
  • the second heat dissipation element intersects the first heat dissipation element.
  • the heat in the middle of the piezoelectric layer can conduct heat along the first heat dissipation element and the second heat dissipation element, further increasing the heat conduction area and improving the heat conduction efficiency, so that the heat exchange in the middle of the piezoelectric layer of the backing block is sufficient, and the heat can be quickly introduced in time.
  • the heat radiation effect of the ultrasonic probe is good, and it can ensure that the ultrasonic probe is still in a low temperature state during long-term use.
  • FIG. 1 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 2 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 3 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 4 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 5 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 6 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 7 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 8 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 9 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 10 is a schematic structural diagram of an ultrasonic probe in the embodiment.
  • FIG. 11 is a schematic structural diagram of an ultrasound probe in an embodiment
  • connection and “connection” in this application include direct and indirect connections (connections) unless otherwise specified.
  • an ultrasonic probe is provided.
  • the ultrasonic probe 1 in this embodiment mainly includes an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5, a circuit board 11, and a probe.
  • the circuit board 11 in which the acoustic window 2 may be designed as a planar structure or a structure having a function of focusing ultrasound, such as a convex structure, and the acoustic window of the convex structure may be referred to as an acoustic lens.
  • the backing block 5 includes an upper surface 51, a lower surface 52, a first side surface 53, a second side surface 54, a third side surface 55, and a fourth side surface 56.
  • the backing block 5 is attached to the piezoelectric layer 4.
  • the combined surface is defined as the upper surface 51, and the other four side surfaces are shown in FIG. 1.
  • the probe housing 6 at least partially houses the acoustic window 2, the matching layer 3, the piezoelectric layer 4, and the backing block 5.
  • a first heat dissipation element 7 is provided inside the backing block 5, and the first heat dissipation element 7 is parallel to the upper surface of the backing block 5.
  • a plurality of first heat dissipation elements 7 are provided inside the backing block 5, and the plurality of first heat dissipation elements 7 are all parallel to the upper surface of the backing block 5.
  • a plurality of first heat dissipation elements 7 are provided inside the backing block 5.
  • the backing block 5 includes an upper surface 51 and a lower surface 52.
  • the plurality of first heat dissipation elements 7 are parallel to each other and along the Arranged in order from the upper surface 51 of the backing block to the lower surface 52, wherein the distance between the first heat dissipation elements 7 adjacent to the lower surface 52 of the backing block is greater than the distance between the first heat dissipation elements 7 adjacent to the upper surface of the backing block. spacing.
  • this not only ensures excellent heat dissipation, but also reduces the volume of the back pad, which is beneficial to saving the cost of the probe.
  • the first heat dissipation element 7 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m ⁇ K, far more than the thermal conductivity of copper, aluminum and other metal foils.
  • the thickness of the first heat dissipation element 7 is not more than 500 micrometers. Further, in one embodiment, the thickness of the first heat dissipation element 7 is not more than 25 micrometers.
  • the impedance of the first heat dissipation element 7 may be equal to or similar to the acoustic impedance of the backing block 5.
  • the acoustic impedance of the first heat dissipation element 7 may be the same as the acoustic impedance of the backing block 5 or the difference between the two is less than 1 Mega Rayleigh. In this way, the influence of the first heat dissipation element 7 on the acoustic performance of the probe can be further reduced.
  • This embodiment provides an ultrasonic probe.
  • a first heat dissipation element 7 is provided inside the backing block 5.
  • the plurality of first heat dissipation elements 7 are parallel to each other and sequentially in a direction from the upper surface 51 to the lower surface 52 of the backing block. Arrangement, wherein the distance between the first heat dissipation elements 7 adjacent to the lower surface 52 of the backing block is larger than the distance between the first heat dissipation elements 7 adjacent to the upper surface 51 of the backing block, which facilitates the concentration of the middle portion of the piezoelectric layer 4 as soon as possible.
  • the heat is conducted to the periphery or the back end of the backing block 5 to improve the heat conduction efficiency, so that the heat radiation effect of the ultrasonic probe is good, and it can ensure that the ultrasonic probe is still in a low temperature state during long-term use.
  • an ultrasonic probe is provided. Based on the above embodiment, as shown in FIG. 4, a second heat dissipation element 8 is added inside the backing block 5, and the second heat dissipation element 8 and the first heat dissipation element 7 are added. intersect.
  • the first heat dissipation element 7 may be parallel to the upper surface 51 of the backing block.
  • the second heat radiating element 8 may intersect perpendicularly with the first heat radiating element 7, or may intersect non-vertically with the first heat radiating element 7.
  • a second heat dissipating element 8 is provided inside the backing block 5 and intersects the first heat dissipating element 7 perpendicularly.
  • the first heat dissipating element 7 is parallel to the upper surface 51 of the backing block, and the second heat dissipating element 8 may be connected to the backing block.
  • the first side surface 53 intersects the first heat dissipating element 7 at an arbitrary angle, and the second heat dissipating element 8 may also intersect the first heat dissipating element 7 perpendicularly at an arbitrary angle to the third side surface 55. As shown in FIG.
  • the second heat dissipation element 8 is parallel to the first side surface 53 of the backing block and perpendicular to the first heat dissipation element 7; as shown in FIG. 5, the second heat dissipation element 9 is parallel to the third side surface of the backing block. 55 ⁇ perpendicular to the first heat dissipation element 7.
  • the first heat-dissipating element 7 is parallel to the piezoelectric layer
  • the second heat-dissipating element 8 is perpendicular to the piezoelectric layer
  • the first heat-dissipating element 7 intersects the second heat-dissipating element 8.
  • the piezoelectric layer is led in two directions, further increasing the heat dissipation area and improving the heat dissipation efficiency.
  • a plurality of second heat dissipation elements 8 are provided inside the backing block 5.
  • the plurality of second heat dissipation elements 8 and the first heat dissipation element 7 can intersect at any angle, and the second heat dissipation element 8 and the first heat dissipation element 7 Intersect vertically, as shown in Figures 4 and 5.
  • the plurality of second heat dissipation elements 8 inside the backing block 5 are parallel to each other. As shown in FIG. 4, the second heat dissipation elements 8 are parallel to each other, and the second heat dissipation elements 8 are parallel to the first side surface 53 of the backing block 5. As shown in FIG. 5, the second heat dissipation elements are parallel to each other, and the second heat dissipation The elements are all parallel to the third side surface 55 of the backing block 5.
  • the second heat dissipation element 8 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m ⁇ K, far more than the thermal conductivity of copper, aluminum and other metal foils.
  • the thickness of the second heat-dissipating element 8 is not more than 500 micrometers. Further, in one embodiment, the thickness of the second heat-dissipating element 8 is not more than 25 micrometers.
  • the impedance of the second heat dissipation element 8 may be equal to or similar to the acoustic impedance of the backing block.
  • the acoustic impedance of the second heat dissipation element 8 may be the same as the acoustic impedance of the backing block 5 or the difference between the two is less than 1 trillion. Rayleigh. In this way, the influence of the second heat dissipation element 8 on the acoustic performance of the probe can be further reduced.
  • This embodiment provides an ultrasonic probe.
  • a second heat dissipation element 8 is additionally provided inside the backing block 5, and the second heat dissipation element 8 intersects the first heat dissipation element 7.
  • the heat in the middle of the piezoelectric layer 4 can conduct heat along the first heat dissipating element 7 and the second heat dissipating element 8 to further increase the heat conduction area and improve the heat conduction efficiency, so that the heat exchange between the backing block 5 and the middle of the piezoelectric layer 4 is sufficient, and Quickly introduce heat to the periphery or back of the probe in time, so that the heat dissipation effect of the ultrasonic probe is good, and it can ensure that the ultrasonic probe is still in a low temperature state during long-term use.
  • the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, and the first heat dissipation element 7 is extended. At least one side surface of the backing block, the side surface of the backing block 5 is adhered to a heat dissipation side plate 9, and the heat dissipation side plate 9 is in contact with the first heat dissipation element 7.
  • the heat dissipation side plate 9 can be attached to the side surface of the backing block, or it can be extended to the rear end of the probe.
  • the rear end of the probe is the front part of the probe noise reduction lens 2, matching layer 3, piezoelectric layer 4, and backing block 5.
  • the remaining part of the probe is the rear end of the probe 1, and the first heat dissipation element 7 is connected to the heat dissipation mechanism at the rear end of the probe 1 with a thermally conductive adhesive.
  • the heat-dissipating side plate 9 is beneficial for discharging the heat of the first heat-dissipating element 7 to the periphery of the backing block 5 or the rear end of the probe.
  • the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, and a side surface of the backing block 5.
  • a third heat dissipation element 10 is attached, wherein the third heat dissipation element 10 and the first heat dissipation element 7 may be integrally formed, and the third heat dissipation element 10 may also be connected to the first heat dissipation element 7.
  • the third heat dissipation element 10 may be attached to the side surface of the backing block 5 or may extend to the rear end of the probe.
  • the side plate of the third heat dissipation element 10 is beneficial to guide the heat of the first heat dissipation element 7 to the backing block 5. Peripheral or probe back.
  • the third heat dissipation element 10 is attached to the heat dissipation side plate 9, and the heat dissipation side plate can be attached to the third heat dissipation element 10 and can be extended to the rear end of the probe to further improve heat dissipation efficiency.
  • the heat of the first heat dissipation element 7 is led to the periphery of the backing block 5 or the rear end of the probe.
  • the ultrasonic probe further includes a fourth heat dissipation element 11, and the fourth heat dissipation element 11 is attached to the upper surface 51 of the backing block.
  • the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, the first heat dissipation element 7 and / or the fourth heat dissipation element 11 protruding. At least one side surface of the backing block 5, the side surface of the backing block 5 is adhered to the heat dissipation side plate 9, and the heat dissipation side plate 9 is in contact with the first heat dissipation element 7.
  • the heat dissipation side plate 9 may be attached to the side surface of the backing block 5 or may extend to the rear end of the probe.
  • the heat dissipation side plate is beneficial to export the heat of the first heat dissipation element 7 and / or the periphery of the backing block 5 or It's the back end.
  • the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, and a side surface of the backing block 5 is bonded to the third heat dissipation element 10.
  • the third heat dissipation element 10 and the first heat dissipation element 7 and / or the fourth heat dissipation element 11 may be integrally formed, and the third heat dissipation element 10 may also be connected to the first heat dissipation element 7 and / or the fourth heat dissipation element 11.
  • the third heat radiating element 10 and the fourth heat radiating element 11 are integrally formed or connected; as shown in FIGS.
  • the third heat radiating element 10 is connected to the first and fourth heat radiating elements 7 and 11. Integrated or connected.
  • the third heat dissipation element 10 may be attached to the side surface of the backing block 5 or may extend to the rear end of the probe.
  • the side plate of the third heat dissipation element 10 is beneficial to the first heat dissipation element 7 and / or the fourth heat dissipation element 11. Heat is dissipated to the periphery of the backing block 5 or to the back of the probe.
  • the third heat dissipation element 10 is attached to the heat dissipation side plate 9, and the heat dissipation side plate 9 may be attached to the third heat dissipation element 10 and may be extended to The rear end of the probe further improves heat dissipation efficiency, and the heat of the first heat dissipation element 7 and / or the fourth heat dissipation element 11 is discharged to the periphery of the backing block 5 or the rear end of the probe.
  • the heat dissipation side plate is a metal plate or a graphite plate.
  • the thickness of the heat dissipation side plate is between 0.1 mm and 3 mm.
  • the third heat dissipation element 10 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m ⁇ K, far more than the thermal conductivity of copper, aluminum and other metal foils.
  • the thickness of the third heat dissipation element 10 is not more than 500 micrometers. Further, in one embodiment, the thickness of the third heat dissipation element 10 is not more than 25 micrometers.
  • the fourth heat dissipation element 11 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m ⁇ K, far more than the thermal conductivity of copper, aluminum and other metal foils.
  • the thickness of the fourth heat dissipation element 11 is not more than 500 micrometers. Further, in one embodiment, the thickness of the fourth heat dissipation element 11 is not more than 25 micrometers.
  • the impedance of the fourth heat dissipation element 11 is equal to or similar to the acoustic impedance of the backing block.
  • the acoustic impedance of the fourth heat dissipation element 11 may be the same as or less than the acoustic impedance of the backing block 5. 1 trillion Rayleigh. In this way, the influence of the fourth heat dissipation element 11 on the acoustic performance of the probe can be further reduced.
  • This embodiment provides an ultrasonic probe. At least one side surface of the backing block 5 is bonded with a third heat dissipation element 10 and / or a heat dissipation side plate 9, which can quickly introduce the heat in the middle of the piezoelectric layer 4 to The periphery of the backing block 5 or the rear end of the probe further improves the heat conduction efficiency.

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Abstract

一种超声探头（1），包括声窗（2）、匹配层（3）、压电层（4）、电路板（11）、背衬块（5）以及探头外壳（6），其中背衬块（5）内部设有第一散热元件（7）和第二散热元件（8），第一散热元件（7）设于背衬块（5）内部，第一散热元件（7）与背衬块（5）上表面平行，第二散热元件（8）与第一散热元件（7）相交。压电层（4）中部的热量能够沿着第一散热元件（7）和第二散热元件（8）进行热传导，进一步增大热传导面积，提高热传导效率，使得背衬块（5）和压电层（4）中部的热交换充分，能够及时将热量快速导入到探头（1）的外围或者后端，使得超声探头（1）的散热效果好，能够保证超声探头（1）长时间使用过程中仍处于低温状态。

Description

一种超声探头 技术领域
本申请涉及医疗检测设备，具体涉及一种超声探头。
背景技术
超声探头的工作原理是利用压电效应将超声整机的激励电脉冲信号转换为超声波信号进入患者体内，再将组织反射的超声回波信号转换为电信号，从而实现对组织的检测。在电-声信号的转换过程中，工作中的超声探头会产生大量的热量，导致探头温度的上升。一方面探头发热可能会影响到患者的人身安全，法规有明确规定探头与患者接触时的温度不能超过特定温度。另一方面若探头长期工作在较高的温度中，会加速探头的老化，缩短探头使用寿命。而从医学检测诊断的角度，却希望能够提高探头的检测深度。提高整机对探头的激励电压是增加探头检测深度的有效手段。不过，激励电压的提高会使探头产生更大的热量。因此，探头发热严重影响到了患者舒适度、探头寿命和性能。
目前一些超声探头的散热方案，是在超声探头的侧边或四周装配散热片试图将热量导向探头后端。由于超声探头发热的主因是压电材料的电声转换不完全所致，而压电材料又不是的热的良导体，导致热量主要积聚在探头阵元的中间位置。而探头侧边或四周的散热片无法与热源中心充分靠近，同时散热侧板的截面积太小，无法与探头阵元进行充分的热交换。探头发热问题仍然没有得到很好的解决。
另一些超声探头的散热方案，是沿着探头法线方向在背衬材料里规则插入一些散热片或散热片阵列。该方案虽然可以让散热片靠近探头的热源中心，但因为这些散热片厚了会对探头声学造成很大的影响，薄了的散热效果又有限。难于在探头性能和散热同时兼而有之。
发明内容
一个实施例中,提供了一种超声探头，其特征在于，包括声窗、匹配层、压电层、电路板，背衬块以及探头外壳，所述声窗、所述匹配层、所述压电层、所述电路板和所述背衬块依次连接，所述超声探头还包括设于背衬块内部的第一散热元件，所述第一散热元件与所述背衬块的上表面平行。
一个实施例中，所述所述背衬块内部设有多个所述第一散热元件。
一个实施例中，所述背衬块还包括与所述上表面相对的下表面，多个所述第一散热元件相互平行并且沿从所述上表面到所述下表面的方向依次排列，其中邻近所述下表面的所述第一散热元件之间的间距大于邻近所述上表面的所述第一散热元件之间的间距。
一个实施例中，所述第一散热元件为金属箔或柔性石墨膜。
一个实施例中，所述第一散热元件的厚度为不大于500微米、或者所述第一散热元件的厚度为不大于25微米。
一个实施例中，所述第一散热元件的声阻抗与所述背衬块的声阻抗相等、或者所述第一散热元件的声阻抗与所述背衬块的声阻抗的差异小于1兆瑞利。
一个实施例中，所述背衬块内部还设有第二散热元件，所述第二散热元件与所述第一散热元件相交。
一个实施例中，所述第二散热元件垂直于所述第一散热元件。
一个实施例中，所述背衬块内部设有多个所述第二散热元件。
一个实施例中，多个所述第二散热元件相互平行。
一个实施例中，所述第二散热元件为金属箔或柔性石墨膜。
一个实施例中，所述第二散热元件的厚度为不大于500微米、或者所述第二散热元件的厚度为不大于25微米。
一个实施例中，所述第二散热元件的声阻抗与所述背衬块的声阻抗相等、或者所述第二散热元件的声阻抗与所述背衬块的声阻抗的差异小于1兆瑞利。
一个实施例中，所述背衬块包括至少一个侧表面，所述第一散热元件伸出所述背衬块至少一个所述侧表面，所述背衬块侧表面贴合有散热侧板，所述散热侧板与所述第一散热元件相接触。
一个实施例中，所述背衬块还包括至少一个侧表面，所述背衬块侧表面贴合有第三散热元件，所述第三散热元件与第一散热元件一体成型或者相连接。
一个实施例中，所述第三散热元件贴合有散热侧板。
一个实施例中，所述超声探头还包括第四散热元件，所述第四散热元件贴合在所述背衬块的上表面。
一个实施例中，所述背衬块包括至少一个侧表面，所述第一散热元件和/或第四散热元件伸出所述背衬块至少一个所述侧表面，所述背衬块 贴合有散热侧板，所述散热侧板与所述第一散热元件和/或第四散热元件相接触。
一个实施例中，所述背衬块还包括至少一个侧表面，所述背衬块侧表面贴合有第三散热元件，所述第三散热元件与第一散热元件和/或第四散热元件一体成型或者相连接。
一个实施例中，所述第三散热元件贴合有散热侧板。
一个实施例中，所述散热侧板为金属板或石墨板。
一个实施例中，所述散热侧板厚度为0.1毫米至3毫米之间。
一个实施例中，所述第三散热元件为金属箔或柔性石墨膜。
一个实施例中，所述第四散热元件为金属箔或柔性石墨膜。
一个实施例中，所述第四散热元件的厚度为不大于500微米、或者所述第四散热元件的厚度为不大于25微米。
一个实施例中，所述第四散热元件的声阻抗与所述背衬块的声阻抗相等、或者所述第四散热元件的声阻抗与所述背衬块的声阻抗的差异小于1兆瑞利。
依据上述实施例的超声探头，其中背衬块内部设有第一散热元件和第二散热元件，第一散热元件设于背衬块内部，第一散热元件与背衬块上表面平行，所述第二散热元件与第一散热元件相交。压电层中部的热量能够沿着第一散热元件和第二散热元件进行热传导，进一步增大热传导面积，提高热传导效率，使得背衬块压电层中部的热交换充分，能够及时将热量快速导入到探头的外围或者后端，使得本超声探头的散热效果好，能够保证超声探头长时间使用过程中仍处于低温状态。
附图说明
图1为一个实施例中超声探头的结构示意图；
图2为一个实施例中超声探头的结构示意图；
图3为一个实施例中超声探头的结构示意图；
图4为一个实施例中超声探头的结构示意图；
图5为一个实施例中超声探头的结构示意图；
图6为一个实施例中超声探头的结构示意图；
图7为一个实施例中超声探头的结构示意图；
图8为一个实施例中超声探头的结构示意图；
图9为一个实施例中超声探头的结构示意图；
图10实施例中超声探头的结构示意图；
图11为实施例中超声探头的结构示意图；
具体实施方式
下面通过具体实施方式结合附图对本发明作进一步详细说明。其中不同实施方式中类似元件采用了相关联的类似的元件标号。在以下的实施方式中，很多细节描述是为了使得本申请能被更好的理解。然而，本领域技术人员可以毫不费力的认识到，其中部分特征在不同情况下是可以省略的，或者可以由其他元件、材料、方法所替代。在某些情况下，本申请相关的一些操作并没有在说明书中显示或者描述，这是为了避免本申请的核心部分被过多的描述所淹没，而对于本领域技术人员而言，详细描述这些相关操作并不是必要的，他们根据说明书中的描述以及本领域的一般技术知识即可完整了解相关操作。
另外，说明书中所描述的特点、操作或者特征可以以任意适当的方式结合形成各种实施方式。同时，方法描述中的各步骤或者动作也可以按照本领域技术人员所能显而易见的方式进行顺序调换或调整。因此，说明书和附图中的各种顺序只是为了清楚描述某一个实施例，并不意味着是必须的顺序，除非另有说明其中某个顺序是必须遵循的。
本文中为部件所编序号本身，例如“第一”、“第二”等，仅用于区分所描述的对象，不具有任何顺序或技术含义。而本申请所说“连接”、“联接”，如无特别说明，均包括直接和间接连接(联接)。
一个实施例中，提供了一种超声探头，如图1所示，本实施例的超声探头1主要包括有声窗2、匹配层3、压电层4、背衬块5、电路板11和探头外壳6(探头外壳6在图中未标出)，其中匹配层3连接到声窗2，压电层4连接到匹配层3，电路板11连接到压电层4，背衬块5连接到电路板11，其中声窗2可以设计为平面结构，也可以设计为具有聚焦超声波功能的结构，比如凸面结构，所述凸面结构的声窗可以称之为声透镜。背衬块5包括有上表面51、下表面52、第一侧表面53、第二侧表面54，第三侧表面55及第四侧表面56，其中将背衬块5与压电层4贴合的一面定义为上表面51，其它四个侧表面如图1所示，探头外壳6至少部分收容声窗2、匹配层3、压电层4和背衬块5。如图2所示，在背衬块5内部设有第一散热元件7，第一散热元件7与背衬块5上表面平行。
一个实施例中，如图3所示，背衬块5内部设有多个第一散热元件7，多个第一散热元件7均与背衬块5上表面平行。
一个实施例中，如图3所示，背衬块5内部设有多个第一散热元件7，背衬块5包括上表面51和下表面52，多个第一散热元件7相互平行并且沿从背衬块上表面51到下表面52的方向依次排列，其中邻近背衬块下表面52的第一散热元件7之间的间距大于邻近背衬块上表面的第一散热元件7之间的间距。在背衬块上表面51到下表面52垂直方向上，越接近压电层4，热量越大，设置的第一散热元件间距越小，有利于尽快将压电层中部集中的热量传导至背衬块的四周或是后端，这样既保证了优良的散热效果，又减少了背衬块的体积，有利于节约探头的成本。
一个实施例中，第一散热元件7为高导热系数的金属箔或高导热系数的柔性石墨膜，优选为高导热系数的柔性石墨膜，高导热系数的柔性石墨膜的导热系数为1500～1800W/m·K，远超铜、铝等金属箔的导热系数。第一散热元件7的厚度为不大于500微米，进一步的，一个实施例中，第一散热元件7的厚度为不大于25微米。
一个实施例中，第一散热元件7阻抗可以与背衬块5的声阻抗相等或者相近，例如，第一散热元件7的声阻抗可以与背衬块5的声阻抗相同或者二者差异小于1兆瑞利。这样，可以进一步减小第一散热元件7对探头声学性能的影响。
本实施例提供了一种超声探头，在背衬块5的内部设有第一散热元件7，多个第一散热元件7相互平行并且沿从背衬块上表面51到下表面52的方向依次排列，其中邻近背衬块下表面52的第一散热元件7之间的间距大于邻近背衬块上表面51的第一散热元件7之间的间距，有利于尽快将压电层4中部集中的热量传导至背衬块5的四周或是后端，提高热传导效率，使得本超声探头的散热效果好，能够保证超声探头长时间使用过程中仍处于低温状态。
一个实施例中，提供了一种超声探头，在上述实施例的基础上，如图4所示，在背衬块5内部增设第二散热元件8，第二散热元件8与第一散热元件7相交。第一散热元件7可以与背衬块上表面51平行。第二散热元件8可以与第一散热元件7垂直相交，也可以与第一散热元件7非垂直相交。
一个实施例中，背衬块5内部设有第二散热元件8与第一散热元件7垂直相交，第一散热元件7平行于背衬块上表面51，第二散热元件8 可以与背衬块第一侧表面53成任意角度与第一散热元件7相交，第二散热元件8也可以与第三侧表面55成任意角度与第一散热元件7垂直相交。如图4所示，第二散热元件8平行于背衬块第一侧表面53并垂直于第一散热元件7；如图5所示，第二散热元件9平行于背衬块第三侧表面55并垂直于第一散热元件7。第一散热元件7与压电层平行，第二散热元件8与压电层垂直，第一散热元件7与第二散热元件8相交，有利于压电层中部集中热量沿平行压电层和垂直压电层两个方向导出，进一步增大散热面积，提高散热效率。
一个实施例中，背衬块5内部设有多个第二散热元件8，多个第二散热元件8与第一散热元件7可以成任意角度相交，第二散热元件8与第一散热元件7垂直相交，如图4、5所示。
一个实施例中，背衬块5内部多个第二散热元件8相互平行。如图4所示，第二散热元件8相互平行，且第二散热元件8均与背衬块5第一侧表面53平行；如图5所示，第二散热元件相互平行，且第二散热元件均与背衬块5第三侧表面55平行。
一个实施例中，第二散热元件8为高导热系数的金属箔或高导热系数的柔性石墨膜，优选为高导热系数的柔性石墨膜，高导热系数的柔性石墨膜的导热系数为1500～1800W/m·K，远超铜、铝等金属箔的导热系数。第二散热元件8的厚度为不大于500微米，进一步的，一个实施例中，第二散热元件8的厚度为不大于25微米。
一个实施例中，第二散热元件8阻抗可以与背衬块的声阻抗相等或者相近，例如，第二散热元件8的声阻抗可以与背衬块5的声阻抗相同或者二者差异小于1兆瑞利。这样，可以进一步减小第二散热元件8对探头声学性能的影响。
本实施例提供了一种超声探头，背衬块5内部增设有第二散热元件8，第二散热元件8与第一散热元件7相交。压电层4中部热量能够沿着第一散热元件7和第二散热元件8进行热传导，进一步增大热传导面积，提高热传导效率，使得背衬块5与压电层4中部的热交换充分，能够及时将热量快速导入到探头的外围或者后端，使得本超声探头的散热效果好，能够保证超声探头长时间使用过程中仍处于低温状态。
一个实施例中，在上述实施例的基础上，背衬块5还包括第一侧表面53，第二侧表面54，第三侧表面55，第四侧表面56，第一散热元件7伸出背衬块至少一个侧表面，背衬块5侧表面贴合有散热侧板9，散热 侧板9与第一散热元件7相接触。散热侧板9可以贴合在背衬块的侧表面，也可以延伸至探头的后端，探头的后端是探头除声透镜2、匹配层3、压电层4、背衬块5这些前段部分，探头剩余部分均为探头1的后端，用导热胶将第一散热元件7与探头1后端的散热机构相连接。散热侧板9有利于将第一散热元件7的热量导出到背衬块5的外围或是探头后端。
一个实施例中，如图2、3所示，背衬块5还包括第一侧表面53，第二侧表面54，第三侧表面55，第四侧表面56，背衬块5的侧表面贴合有第三散热元件10，其中第三散热元件10与第一散热元件7可以一体成型，第三散热元件10也可以与第一散热元件7相连接。第三散热元件10可以贴合在背衬块5的侧表面，也可以延伸至探头的后端，第三散热元件10侧板有利于将第一散热元件7的热量导出到背衬块5的外围或是探头后端。
一个实施例中，在上述实施例的基础上，第三散热元件10贴合有散热侧板9，散热侧板可以贴合第三散热元件10，可以延伸至探头的后端，进一步提高散热效率，将第一散热元件7的热量导出到背衬块5的外围或是探头后端。
一个实施例中，在上述实施例的基础上，所述超声探头还包括第四散热元件11，第四散热元件11贴合在背衬块的上表面51。
一个实施例中，背衬块5还包括第一侧表面53，第二侧表面54，第三侧表面55，第四侧表面56，第一散热元件7和/或第四散热元件11伸出背衬块5至少一个侧表面，背衬块5侧表面贴合有散热侧板9，散热侧板9与第一散热元件7相接触。散热侧板9可以贴合在背衬块5的侧表面，也可以延伸至探头的后端，散热侧板有利于将第一散热元件7和/或的热量导出到背衬块5的外围或是后端。
一个实施例中，背衬块5还包括第一侧表面53，第二侧表面54，第三侧表面55，第四侧表面56，背衬块5的侧表面贴合有第三散热元件10，其中第三散热元件10与第一散热元件7和/或第四散热元件11可以一体成型，第三散热元件10也可以与第一散热元件7和/或第四散热元件11相连接。如图6、7所示，第三散热元件10与第四散热元件11一体成型或者相连接；如图8、9所示，第三散热元件10与第一散热元件7和第四散热元件11一体成型或者相连接。第三散热元件10可以贴合在背衬块5的侧表面，也可以延伸至探头的后端，第三散热元件10侧板有利于将第一散热元件7和/或第四散热元件11的热量导出到背衬块5 的外围或是探头后端。
一个实施例中，如图10、11所示，在上述实施例的基础上，第三散热元件10贴合有散热侧板9，散热侧板9可以贴合第三散热元件10，可以延伸至探头的后端，进一步提高散热效率，将第一散热元件7和/或第四散热元件11的热量导出到背衬块5的外围或是探头后端。
一个实施例中，散热侧板为金属板或是石墨板。
一个实施例中，散热侧板厚度为0.1毫米至3毫米之间。
一个实施例中，第三散热元件10为高导热系数的金属箔或高导热系数的柔性石墨膜，优选为高导热系数的柔性石墨膜，高导热系数的柔性石墨膜的导热系数为1500～1800W/m·K，远超铜、铝等金属箔的导热系数。第三散热元件10的厚度为不大于500微米，进一步的，一个实施例中，第三散热元件10的厚度为不大于25微米。
一个实施例中，第四散热元件11为高导热系数的金属箔或高导热系数的柔性石墨膜，优选为高导热系数的柔性石墨膜，高导热系数的柔性石墨膜的导热系数为1500～1800W/m·K，远超铜、铝等金属箔的导热系数。第四散热元件11的厚度为不大于500微米，进一步的，一个实施例中，第四散热元件11的厚度为不大于25微米。
一个实施例中，第四散热元件11的阻抗均与与背衬块的声阻抗相等或者相近，例如，第四散热元件11的声阻抗可以与背衬块5的声阻抗相同或者二者差异小于1兆瑞利。这样，可以进一步减小第四散热元件11对探头声学性能的影响。
本实施例提供了一种超声探头，在所述背衬块5的至少一个侧表面贴合有第三散热元件10和/或散热侧板9，能够将压电层4中部的热量快速导入到背衬块5的外围或是探头后端，进一步提高提高了导热效率。

Claims (31)

  1. 一种超声探头,其特征在于，包括：
    声窗；
    匹配层，所述匹配层连接到所述声窗；
    压电层，所述压电层连接到所述匹配层；
    电路板，所述电路板连接到所述压电层；
    背衬块，所述背衬块包括上表面，所述背衬块的上表面连接到所述电路板；
    探头外壳，所述探头外壳至少部分收容所述声窗、所述匹配层、所述压电层和背衬块；
    其中，所述背衬块内部设有第一散热元件和第二散热元件，所述第一散热元件与所述背衬块的上表面平行，所述第二散热元件与所述第一散热元件相交。
  2. 如权利要求1所述的超声探头，其特征在于，所述第二散热元件垂直于所述第一散热元件。
  3. 如权利要求1或2所述的超声探头，其特征在于，所述背衬块内部设有多个所述第一散热元件。
  4. 如权利要求1至3中任意一项所述的超声探头，其特征在于，所述背衬块还包括与所述上表面相对的下表面，多个所述第一散热元件相互平行并且沿从所述上表面到所述下表面的方向依次排列，其中邻近所述下表面的所述第一散热元件之间的间距大于邻近所述上表面的所述第一散热元件之间的间距。
  5. 如权利要求1至4中任意一项所述的超声探头，其特征在于，所述背衬块内部设有多个所述第二散热元件。
  6. 如权利要求5所述的超声探头，其特征在于，多个所述第二散热元件相互平行。
  7. 如权利要求1至6中任意一项所述的超声探头，其特征在于，所述背衬块包括至少一个侧表面，所述第一散热元件伸出所述背衬块至少一个所述侧表面，所述背衬块侧表面贴合有散热侧板，所述散热侧板与所述第一散热元件相接触。
  8. 如权利要求1至6中任意一项所述的超声探头，其特征在于，所述背衬块还包括至少一个侧表面，所述背衬块侧表面贴合有第三散热元件，所述第三散热元件与第一散热元件一体成型或者相连接。
  9. 如权利要求8所述的超声探头，其特征在于，所述第三散热元件贴合有散热侧板。
  10. 如权利要求1至6中任意一项所述的超声探头，其特征在于，所述超声探头还包括第四散热元件，所述第四散热元件贴合在所述背衬块的上表面。
  11. 如权利要求10所述的超声探头，其特征在于，所述背衬块包括至少一个侧表面，所述第一散热元件和/或第四散热元件伸出所述背衬块至少一个所述侧表面，所述背衬块侧表面贴合有散热侧板，所述散热侧板与所述第一散热元件和/或第四散热元件相接触。
  12. 如权利要求10所述的超声探头，其特征在于，所述背衬块还包括至少一个侧表面，所述背衬块的侧表面贴合有第三散热元件，所述第三散热元件与第一散热元件和/或第四散热元件一体成型或者相连接。
  13. 如权利要求12所述的超声探头，其特征在于，所述第三散热元件贴合有散热侧板。
  14. 如权利要求7、9、11或13所述的超声探头，其特征在于，散热侧板为金属板或石墨板。
  15. 如权利要求14所述的超声探头，其特征在于，所述散热侧板厚度为0.1毫米至3毫米之间。
  16. 如权利要求1至15中任意一项所述的超声探头，其特征在于，所述第一散热元件和第二散热元件为金属箔或柔性石墨膜。
  17. 如权利要求1至15中任意一项所述的超声探头，其特征在于：所述第一散热元件和第二散热元件的厚度为不大于500微米、或者所述第一散热元件和第二散热元件的厚度为不大于25微米。
  18. 如权利要求1至15中任意一项所述的超声探头，其特征在于：所述第一散热元件和第二散热元件的声阻抗与所述背衬块的声阻抗相等、或者所述第一散热元件和第二散热元件的声阻抗与所述背衬块的声阻抗的差异小于1兆瑞利。
  19. 如权利要求8、9、12或13所述的超声探头，其特征在于，所述第三散热元件为金属箔或柔性石墨膜。
  20. 如权利要求10所述的超声探头，其特征在于，所述第四散热元件为金属箔或柔性石墨膜。
  21. 如权利要求10所述的超声探头，其特征在于：所述第四散热元件的厚度为不大于500微米、或者所述第四散热元件的厚度为不大于25 微米。
  22. 如权利要求10所述的超声探头，其特征在于：所述第四散热元件的声阻抗与所述背衬块的声阻抗相等、或者所述第四散热元件的声阻抗与所述背衬块的声阻抗的差异小于1兆瑞利。
  23. 一种超声探头，其特征在于，包括：
    声窗；
    匹配层，所述匹配层连接到所述声窗；
    压电层，所述压电层连接到所述匹配层；
    电路板，所述电路板连接到所述压电层；
    背衬块，所述背衬块包括上表面，所述背衬块的上表面连接到所述电路板；
    探头外壳，所述探头外壳至少部分收容所述声窗、所述匹配层、所述压电层和背衬块；
    其中，所述背衬块内部设有第一散热元件，所述第一散热元件与所述背衬块上表面平行。
  24. 如权利要求23所述的超声探头，其特征在于，所述背衬块内部设有多个所述第一散热元件。
  25. 如权利要求23或24所述的超声探头，其特征在于，所述背衬块还包括与所述上表面相对的下表面，多个所述第一散热元件相互平行并且沿从所述上表面到所述下表面的方向依次排列，其中邻近所述下表面的所述第一散热元件之间的间距大于邻近所述上表面的所述第一散热元件之间的间距。
  26. 如权利要求23至25中任意一项所述的超声探头，其特征在于，所述第一散热元件为金属箔或柔性石墨膜。
  27. 如权利要求23至26中任一所述的超声探头，其特征在于，所述背衬块内部还设有第二散热元件，所述第二散热元件与所述第一散热元件相交。
  28. 如权利要求27所述的超声探头，其特征在于，所述第二散热元件垂直于所述第一散热元件。
  29. 如权利要求27或28所述的超声探头，其特征在于，所述背衬块内部设有多个所述第二散热元件。
  30. 如权利要求29所述的超声探头，其特征在于，多个所述第二散热元件相互平行。
  31. 如权利要求27至30中任意一项所述的超声探头，其特征在于，所述第二散热元件为金属箔或柔性石墨膜。
PCT/CN2018/109175 2018-09-30 2018-09-30 一种超声探头 Ceased WO2020062274A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1799510A (zh) * 2004-08-27 2006-07-12 通用电气公司 具有提高的导热率的超声换能器
CN1859871A (zh) * 2003-09-30 2006-11-08 松下电器产业株式会社 超声波探头
JP2006325954A (ja) * 2005-05-26 2006-12-07 Toshiba Corp 超音波プローブ及び超音波診断装置
CN102098965A (zh) * 2008-07-22 2011-06-15 人体扫描有限公司 具有热沉的超声波探头
CN206473341U (zh) * 2016-11-28 2017-09-08 深圳市理邦精密仪器股份有限公司 超声探头
CN206924084U (zh) * 2016-11-28 2018-01-26 深圳市理邦精密仪器股份有限公司 超声探头

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1859871A (zh) * 2003-09-30 2006-11-08 松下电器产业株式会社 超声波探头
CN1799510A (zh) * 2004-08-27 2006-07-12 通用电气公司 具有提高的导热率的超声换能器
JP2006325954A (ja) * 2005-05-26 2006-12-07 Toshiba Corp 超音波プローブ及び超音波診断装置
CN102098965A (zh) * 2008-07-22 2011-06-15 人体扫描有限公司 具有热沉的超声波探头
CN206473341U (zh) * 2016-11-28 2017-09-08 深圳市理邦精密仪器股份有限公司 超声探头
CN206924084U (zh) * 2016-11-28 2018-01-26 深圳市理邦精密仪器股份有限公司 超声探头

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