WO2020057306A1 - Radiateur thermique haute puissance combinant plaques supraconductrices et ailettes - Google Patents

Radiateur thermique haute puissance combinant plaques supraconductrices et ailettes Download PDF

Info

Publication number
WO2020057306A1
WO2020057306A1 PCT/CN2019/100971 CN2019100971W WO2020057306A1 WO 2020057306 A1 WO2020057306 A1 WO 2020057306A1 CN 2019100971 W CN2019100971 W CN 2019100971W WO 2020057306 A1 WO2020057306 A1 WO 2020057306A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
thermal superconducting
bottom substrate
deflector
heat transfer
Prior art date
Application number
PCT/CN2019/100971
Other languages
English (en)
Chinese (zh)
Inventor
仝爱星
唐必洪
曾巧
Original Assignee
浙江嘉熙科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201821550020.6U external-priority patent/CN209119079U/zh
Priority claimed from CN201811107416.8A external-priority patent/CN109244050B/zh
Application filed by 浙江嘉熙科技有限公司 filed Critical 浙江嘉熙科技有限公司
Publication of WO2020057306A1 publication Critical patent/WO2020057306A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/10—Arrangements for sealing the margins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Definitions

  • the invention belongs to the technical field of heat dissipation equipment, and particularly relates to a high-power thermal superconducting plate-fin combined radiator.
  • an object of the present invention is to provide a high-power thermal superconducting plate-fin combined heat sink for solving the problem that the heat sink in the prior art cannot meet the heat dissipation of high-power devices.
  • the present invention provides a high-power thermal superconducting plate-fin combined radiator, which includes:
  • a plurality of spaced-apart thermal superconducting plates, interconnected heat transfer channels are formed in the thermal superconducting plates, and the heat transfer channels are filled with a heat transfer working medium;
  • a plurality of bottom substrate spacers are located between adjacent thermal superconducting plates and are attached to the surface of the thermal superconducting plates; at least one side of the bottom substrate spacers is in contact with the thermal superconducting plates A channel is provided on the surface; a surface of the thermal superconducting plate in contact with the bottom substrate spacer is provided with a connection through hole that connects the heat transfer channel and the channel;
  • the radiating fin is located on at least one surface of the thermal superconducting plate and is located above the bottom substrate spacer.
  • the grooves are provided on surfaces of both sides of the bottom substrate spacer that are in contact with the thermal superconducting plate; the bottom substrate spacers are along the thermal superconducting plate.
  • the length direction extends; the channel extends along the length direction of the bottom substrate spacer, and the length of the channel is smaller than the length of the bottom substrate spacer.
  • the bottom substrate spacer is further provided with a plurality of through holes, and the plurality of through holes are arranged at intervals along the length direction of the bottom substrate spacer, and the bottom substrate The channels on both sides of the spacer communicate with each other.
  • the bottom substrate spacer includes:
  • a first bottom substrate spacer located between a portion of adjacent thermal superconducting plates
  • a second bottom substrate spacer is located between other adjacent thermal superconducting plates; the second bottom substrate spacer is also provided with a plurality of through holes, and a plurality of the through holes are along the second bottom substrate.
  • the spacers are arranged at intervals in the length direction and communicate with the channels on both sides of the second bottom substrate spacer.
  • the high-power thermal superconducting plate-fin combined radiator further includes:
  • a plurality of top substrate spacers are located between the adjacent thermal superconducting plates and between the thermal superconducting plates and the side plates, and are located above the heat dissipation fins.
  • the high-power thermal superconducting plate-fin combined radiator further includes a top communication plate located above the top substrate spacer and the thermal superconducting plate; the top connection plate The extending direction is perpendicular to the surface of the thermal superconducting plate; a filling groove and a filling hole communicating with the filling groove are formed on the top communication plate, and the filling groove communicates along the top
  • the plates extend in the length direction and are in communication with the heat transfer channels in each of the thermal superconducting plates.
  • the high-power thermal superconducting plate-fin combined radiator further includes a top communication plate located above the top substrate spacer and the thermal superconducting plate; the top connection plate The extending direction is perpendicular to the surface of the thermal superconducting plate; a plurality of filling grooves and a plurality of filling holes communicating with the filling groove are formed on the top communication plate; a plurality of the filling The grooves are arranged at intervals along the length direction of the top communication plate, and each of the filling grooves is in communication with the heat transfer channels in each of the thermal superconducting plates located directly below it.
  • the thermal superconducting plate includes: a ring frame, a first cover plate, a second cover plate, and at least one deflector; wherein,
  • the first cover plate is attached to a surface of the annular frame, and the second cover plate is attached to a surface of the annular frame away from the first cover plate, so that the first cover plate Forming a sealed cavity with the second cover plate; the first cover plate and / or the second cover plate are provided with the connection through hole;
  • the deflector is located in the sealed cavity; the deflector includes a plurality of convex portions arranged at intervals in the first direction and extending in the second direction, wherein the first direction and the second direction Are perpendicular to each other, the bottoms of adjacent convex portions in the first direction are integrally connected, and there is a gap between the inside of the convex portion and the adjacent convex portions so that the deflector and the first
  • the heat transfer channel is formed between the cover plate and the second cover plate.
  • a plurality of convex portions are formed on the inner surface of the bottom side of the annular frame, and the convex portions are integrally formed with the annular frame; a plurality of the convex portions are along the first Directional arrangement
  • the deflector includes a first deflector and a second deflector; wherein the first deflector is located inside the annular frame and between adjacent bump portions; the second A deflector is located inside the annular frame, and there is a gap between the deflector and the first deflector and the protruding portion.
  • the first deflector includes a first deflector, and the first deflector includes a plurality of the protrusions arranged at intervals along the first direction;
  • the second deflector includes a plurality of second deflectors and a connecting portion, wherein the plurality of second deflectors are arranged in parallel along the second direction, and each of the second deflectors includes A plurality of the convex portions arranged at intervals along the first direction; the connecting portions are located at two ends of the plurality of second guide bars, and are integrally connected with each of the second guide bars.
  • each of the side walls of the convex portion is provided with a plurality of guide holes, and the guide holes penetrate the guide plate in a thickness direction of the guide plate.
  • the high-power thermal superconducting plate-fin combined radiator of the present invention has the following beneficial effects:
  • the sealed cavity inside the thermal superconducting plate is filled with a heat transfer working medium.
  • the phase change or phase change of the heat transfer working medium is used to suppress heat transfer, forming a thermally conductive thermal superconducting property that makes the entire thermal superconducting plate Uniform, can quickly dissipate the heat generated by high-power power devices;
  • the heat radiating fins are welded on the heat superconducting plate, and the heat radiating fins can quickly take away the heat conducted by the air and dissipate them. Reduce the thermal resistance of the system, improve the heat dissipation capacity, and strengthen the thermal superconducting plate to reduce the material thickness of the thermal superconducting plate, increase the strength, reduce the weight and reduce the cost;
  • the inside of the thermal superconducting plate is a sealed cavity and a deflector is provided.
  • the inner deflector welds the first cover plate and the second cover plate together to strengthen the structure and reduce the thickness of the cover plates on both sides. Thin, increased pressure bearing capacity, increased strength, reduce the weight and thickness of the thermal superconducting plate, and increase the internal heat transfer area, enhance the thermal superconducting heat conduction capacity, improve the reliability of the radiator, and reduce costs;
  • the thermal superconducting plate and the bottom substrate spacer are alternately stacked and welded together, and the bottom of the thermal superconducting plate is in direct contact with the heat source, thereby reducing the combined thermal resistance.
  • the channels on both sides of the bottom substrate spacer can serve as a buffer and storage area for the heat transfer medium, balance the distribution of the heat transfer medium, and also serve as a communication or isolation function between the thermal superconducting plates. Play the role of increasing the heating area of the heat transfer medium;
  • the bottom substrate spacer is provided with through holes that connect the channels on both sides, which can connect some or all of the heat transfer working medium in the thermal superconducting plate, making the filling of the heat transfer working medium easier. Convenience;
  • the inner surface of the bottom side of the annular frame is provided with a bump portion, which is used to form a mounting hole for the power device.
  • the annular frame between the bump portions can be made as thin as possible, so that the heat transfer medium is as close to the power device as possible. , So that the thermal resistance can be reduced; at the same time, the existence of the bumps allows the radiator to be tilted at a certain angle (for example, 30 °, etc.) along the parallel direction of the thermal superconducting plate;
  • FIG. 1 is a schematic diagram showing a three-dimensional structure of a high-power thermal superconducting plate-fin combined radiator provided in Embodiment 1 of the present invention.
  • FIG. 2 is a schematic cross-sectional structure diagram of a high-power thermal superconducting plate-fin combined radiator in an example provided in the first embodiment of the present invention along a direction parallel to the thermal superconducting plate arrangement direction.
  • FIG. 3 is a schematic diagram of the three-dimensional structure of the first bottom substrate spacer in the high-power thermal superconducting plate-fin combined radiator provided in the first embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of an end portion of a first bottom substrate spacer in a high-power thermal superconducting plate-fin combined radiator provided in Embodiment 1 of the present invention.
  • FIG. 5 is a schematic side structural view of a first bottom substrate spacer in a high-power thermal superconducting plate-fin combined radiator provided in Embodiment 1 of the present invention.
  • FIG. 6 is a schematic diagram showing an explosion structure of a thermal superconducting plate in a high-power thermal superconducting plate-fin combined radiator provided in Embodiment 1 of the present invention.
  • FIG. 7 is a schematic top view of a ring frame in a high-power thermal superconducting plate-fin combined radiator provided in Embodiment 1 of the present invention.
  • FIG. 8 is a schematic plan view showing a structure in which a deflector in a high-power thermal superconducting plate-fin combined radiator provided in Embodiment 1 of the present invention is placed in a ring frame.
  • FIG. 9 to 14 are schematic structural diagrams of a second deflector of different examples of the thermal superconducting plate in the high-power thermal superconducting plate-fin combined radiator provided in the first embodiment of the present invention; wherein, FIG. 10 is FIG. 9 is a front view, FIG. 12 is a front view of FIG. 11, and FIG. 14 is a front view of FIG. 13.
  • FIG. 15 is a schematic diagram showing a three-dimensional structure of a heat dissipation fin in a high-power thermal superconducting plate-fin combined radiator provided in Embodiment 1 of the present invention.
  • 16 and 20 are schematic cross-sectional structural diagrams of a high-power thermal superconducting plate-fin combined radiator in two other examples provided in the first embodiment of the present invention along a direction parallel to the arrangement of the thermal superconducting plates.
  • FIG. 17 is a schematic diagram showing the three-dimensional structure of the second bottom substrate spacer in the high-power thermal superconducting plate-fin combined radiator provided in the first embodiment of the present invention.
  • FIG. 18 is a schematic structural diagram of an end portion of a second bottom substrate spacer in a high-power thermal superconducting plate-fin combined heat sink provided in Embodiment 1 of the present invention.
  • FIG. 19 is a schematic side structural view of a second bottom substrate spacer in the high-power thermal superconducting plate-fin combined heat sink provided in Embodiment 1 of the present invention.
  • 21 and 22 are three-dimensional structural schematic diagrams of the high-power thermal superconducting plate-fin combined radiator provided in Embodiment 2 of the present invention at different angles.
  • 23 to 25 are schematic cross-sectional structural diagrams of a high-power thermal superconducting plate-fin combined radiator in different examples provided in the second embodiment of the present invention along a direction parallel to the thermal superconducting plate arrangement direction.
  • 26 to 28 are schematic cross-sectional structural diagrams of a high-power thermal superconducting plate-fin combined radiator in different examples provided in Embodiment 3 of the present invention, parallel to the arrangement direction of the thermal superconducting plate.
  • the present invention provides a high-power thermal superconducting plate-fin combined radiator.
  • the high-power thermal superconducting plate-fin combined radiator includes: a plurality of spaced-apart thermal superconducting plates 10 In the thermal superconducting plate 10, interconnected heat transfer channels (not shown) are formed, and the heat transfer channels are filled with a heat transfer working medium 1041; a plurality of bottom substrate spacers 30, the bottom substrate spacers
  • the strip 30 is located between the adjacent thermal superconducting plates 10 and is attached to the surface of the thermal superconducting plates 10; at least one side of the bottom substrate spacer 30 is in contact with the thermal superconducting plates 10
  • the surface is provided with a channel 303; the surface of the thermal superconducting plate 10 that is in contact with the bottom substrate spacer 30 is provided with a connection through hole 105 that communicates the heat transfer channel with the channel 303; a cooling fin
  • the fin 20 is located on at least one surface of the thermal superconducting plate 10 and is
  • the sealed cavity inside the thermal superconducting plate 10 is filled with the heat transfer working medium 1041, and the heat transfer medium 1041 relies on the phase change heat transfer of the heat transfer working medium 1041.
  • phase change inhibits heat transfer and forms a thermally-conductive thermal superconducting characteristic, which makes the temperature of the entire thermal superconducting plate 10 uniform, and can quickly dissipate heat generated by high-power power devices;
  • the radiating fins 20 are welded, and the radiating fins 20 can quickly take away the heat conducted by the thermal superconducting plate 10 and dissipate them away from the air.
  • the heat exchange area of the system reduces the thermal resistance of the system, improves the heat dissipation capacity, and also strengthens the thermal superconducting plate 10 to reduce the material thickness of the thermal superconducting plate 10, increase strength, reduce weight, and reduce Cost;
  • the inside of the thermal superconducting plate 10 is a sealed cavity, and the deflector plate 10 is provided.
  • the inner deflector plate 10 welds the first cover plate 100 and the second cover plate 101. Together, it plays a strengthening role, reducing the thickness of the cover plates on both sides, increasing the pressure bearing capacity and increasing the strength.
  • thermal superconducting plate 10 reduces the weight and thickness of the thermal superconducting plate 10, increase the internal heat exchange area, enhance the thermal superconducting heat conduction capacity, improve the reliability of the radiator, and reduce the cost; the high-power thermal superconducting plate fin combination of the present invention
  • the thermal superconducting plate 10 and the bottom substrate spacer 30 in the heat sink are alternately stacked and welded together, and the bottom of the thermal superconducting plate 10 is in direct contact with a power device (ie, a heat source), thereby reducing the combined thermal resistance; Since the heat transfer channel communicates with the channel 303 via the connection through hole 105, the channels 303 on both sides of the bottom substrate spacer 30 can serve as a buffer and a heat transfer medium 1041.
  • the storage area balances the distribution of the heat transfer working medium 1041, and can also serve as a communication or isolation function between the thermal superconducting plates 10, and can also increase the heating area of the heat transfer working medium 1041.
  • the thermal superconducting heat transfer technology includes a heat pipe technology for filling a working medium in a closed and interconnected micro-channel system, and realizing thermal superconducting heat transfer through evaporation and condensation phase change of the working medium; and by controlling The microstructure state of the working medium in the closed system, that is, during the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and based on this, the consistency of the microstructure of the working medium is achieved to achieve efficient heat transfer.
  • Phase change suppression (PCI) heat transfer technology may be a phase change suppression heat radiating plate.
  • the thermal superconducting plate may also be a heat pipe heat transfer plate.
  • the heat transfer working medium 1041 in the thermal superconducting plate 10 continuously performs evaporative heat absorption and condensation during the heat transfer process. An exothermic phase change cycle to achieve rapid heat transfer.
  • the heat transfer medium 1041 is a fluid.
  • the heat transfer medium 1041 may be a gas or a liquid or a mixture of a gas and a liquid. More preferably, in this embodiment, the heat transfer medium The substance 1041 is a mixture of liquid and gas.
  • the width of the bottom substrate spacer 30 is the same as the distance between the adjacent thermal superconducting plates 10, so that the bottom substrate spacer 30 can be closely attached to the adjacent thermal superconducting plates. 10 surfaces.
  • the bottom substrate spacer 30 may be welded to the surface of the thermal superconducting plate 10 by a welding process.
  • the size of the heat dissipating fins 20 along the arrangement direction of the thermal superconducting plate 10 may be smaller than the distance between adjacent thermal superconducting plates 10. At this time, the heat dissipating fins 20 are located at the The thermal superconducting plate 10 is on one surface.
  • the size of the heat dissipating fins 20 along the arrangement direction of the thermal superconducting plate 10 may also be equal to the distance between adjacent thermal superconducting plates 10. At this time, the heat dissipation The fins 20 are simultaneously located on the surfaces of two adjacent thermal superconducting plates 10.
  • the grooves 303 are provided on the surfaces of both sides of the bottom substrate spacer 30 that are in contact with the thermal superconducting plate 10, as shown in FIG. 3 to FIG. 5;
  • the thermal superconducting plate 10 extends in the length direction;
  • the length of the bottom substrate spacer 30 may be, but is not limited to, the same length as the thermal superconducting plate 10;
  • the channel 303 is along the bottom substrate spacer 30 extends in the length direction, and the length of the channel 303 is shorter than the length of the bottom substrate spacer 30 to ensure that the bottom substrate spacer 30 and the thermal superconducting plate 10 are alternately overlapped and welded together.
  • the channel 303 is sealed.
  • the length of the channel 303 may be the same as the length of the bottom substrate spacer 30. At this time, it is necessary to provide blocking blocks at both ends of the bottom substrate spacer 30 to After the bottom substrate spacers 30 and the thermal superconducting plate 10 are alternately overlapped and welded together, the ends of the channels 303 are sealed.
  • the high-power thermal superconducting plate-fin combined radiator further includes: a side plate 40, and the side plate 40 is attached to the outermost two sides of the heat-dissipating fins 20. Away from the surface of the thermal superconducting plate 10; a plurality of top substrate spacers 50, which are located between adjacent thermal superconducting plates 10 and between the thermal superconducting plate 10 and the side Between the plates 40 and above the heat dissipation fins 20.
  • the top substrate spacers 50 and the bottom substrate spacers 30 are arranged one-to-one correspondingly, and the top substrate spacers 50 are parallel to the bottom substrate spacers 30.
  • the length of the top substrate spacer 50 may be the same as the length of the thermal superconducting plate 10, or may be shorter than the length of the thermal superconducting plate 10.
  • the height of the side plate 40 is not lower than the height difference between the bottom substrate spacer 30 and the top substrate spacer 50 corresponding to the bottom substrate spacer 30.
  • the thermal superconducting plate 10 includes: a ring frame 102, a first cover plate 100, a second cover plate 101, and at least one deflector 103, wherein the first cover plate 100
  • the second cover plate 101 is placed on a surface of the ring frame 102 away from the first cover plate 100, so that the first cover plate 100 and A sealed chamber is formed between the second cover plates 101; the first cover plate 100 or / and the second cover plate 101 is provided with the connection through hole 105, that is, the first cover plate can be
  • the connection through hole 105 is provided on 100, or the connection through hole 105 may be provided on the second cover plate 101, and the first cover plate 100 and the second cover plate 101 may also be provided.
  • the connecting through holes 105 are all provided, as shown in FIG. 6; the deflector 103 is located in the sealed cavity; the deflector 103 includes a plurality of spaces arranged along the first direction and along the second direction.
  • the extended convex portion 1031, wherein the first direction is perpendicular to the second direction, and the bottoms of the convex portions 1031 adjacent to each other in the first direction are integrally connected, and the convex There is a gap between the inside of 1031 and the adjacent convex portions 1031, so that a heat transfer channel 106 communicating with each other is formed between the flow guide plate 103 and the first cover plate 100 and the second cover plate 101;
  • the heat transfer channel 106 is filled with a heat transfer working medium 1041.
  • the direction indicated by arrow a in FIG. 11, FIG. 13, and FIG. 15 is the first direction
  • the direction indicated by arrow b is the second direction
  • the first direction may be the The length direction of the deflector 103.
  • the second direction is the width direction of the deflector 103.
  • the first direction may also be the width direction of the deflector 103.
  • the second direction The direction is the length direction of the deflector 103.
  • the first cover plate 100 and the second cover plate 101 are placed on the upper and lower surfaces of the annular frame 102, and will be placed on the first frame.
  • a cover chamber is formed inside the cover plate 100, the second cover plate 101 and the annular frame 102.
  • the bottoms of the adjacent convex portions 1031 in the first direction are integrally connected, and there is a gap below the convex portions 1031 and between the adjacent convex portions 1031, so that the air guide plate 103 can be made Convex and concave arrangements are alternately spaced along its length.
  • first cover plate 100, the second cover plate 101, the annular frame 102, and the deflector 103 may be soldered together by a solder layer.
  • the height of the deflector 103 is the same as the height of the annular frame 102. Setting the height of the deflector 103 to be the same as the height of the ring frame 102 can ensure that the welding area of the deflector 103 with the first solder layer 104 and the second solder layer 105 is maximized. , Thereby increasing welding strength.
  • one side of the annular frame 102 is provided with a filling hole (not shown) penetrating the side wall.
  • a filling tube 603 is inserted into the filling hole, and the The heat transfer channel is filled with the heat transfer working medium 1041.
  • the filling hole should be closed so that the heat transfer channel is sealed.
  • each of the thermal superconducting plates 10 needs to be filled with a heat transfer working medium 1041, and each of the thermal superconducting plates 10 needs to be filled with different filling pipes 603.
  • a plurality of bump portions 1021 are formed on the inner surface of the bottom side of the ring frame 102, and the bump portions 1021 are integrally formed with the ring frame 102;
  • the portions 1021 are arranged at intervals in the first direction, that is, a plurality of the convex portions 1021 are arranged at intervals in the direction in which the convex portions 1031 are arranged;
  • the deflector 103 includes a first deflector 1035 and a first Two deflectors 1036; wherein the first deflector 1035 is located inside the annular frame 102 and between adjacent convex portions 1021; the second deflector 1036 is located in the annular frame There is a gap between the inside of 102 and the first deflector 1035 and the bump portion 1021.
  • the inner surface of the bottom side of the annular frame 102 is provided with the convex portion 1021.
  • the convex portion 1021 is used to form a mounting hole 106 for mounting the power device 70.
  • the annular frame 102 between the convex portions 1021 can be made.
  • the existence of the bump portion 1021 can be a heat sink parallel to the thermal superconducting plate 10 When the substrate is inclined at a certain angle (for example, 30 °, etc.), the temperature uniformity performance of the substrate does not change.
  • the deflector 103 may be stamped from but not limited to one plate (that is, the first deflector 1035 and the second deflector 1036 may be stamped from but not limited to one plate.
  • the length of the deflector 103 is the same as the length of the inside of the annular frame 102; the side wall of the convex portion 1031 is provided with a plurality of diversion holes 1032.
  • the flow guide hole 1032 penetrates the flow guide plate 103 along a thickness direction of the flow guide plate 103.
  • the deflector 103 may extend in a square wave shape, that is, the deflector 103 includes a plurality of the convex portions 1031 arranged at intervals along the first direction, and along the The bottoms of adjacent convex portions 1031 in the first direction are connected to each other, and adjacent convex portions 1031 are concave.
  • the deflector 103 may extend in a wave shape along the first direction, but it is preferable that the deflector 103 extends in a square wave shape in the first direction, so as to ensure that The upper surface (that is, the top surface of the convex portion 1031) and the lower surface (that is, the bottom surface of the concave portion between the adjacent convex portions 13) of the deflector 103 are planar, so as to ensure the flow guide.
  • the contact area between the board 103 and the first solder layer 104 and the second solder layer 105 is as large as possible, thereby improving the soldering strength.
  • the convex portion 1031 of the deflector 103 and the second solder layer are welded together.
  • the gap between 105, the recess between the convex portion 1031, the gap between the first solder layer 104, and the flow guide hole 1032 together constitute the heat transfer channel 106.
  • the convex portion 1031 extends through the air guide plate 103 in the second direction, that is, the convex portion 1031 extends through the air guide plate 103 in the second direction, that is, the convex portion
  • the length of the portion 1031 is the same as the second direction.
  • Each of the convex portions 1031 is provided with a plurality of the guide holes 1032, and the guide holes 1032 on each of the convex portions 1031 are arranged in a single row or multiple rows at intervals along the extending direction of the convex portions 1031.
  • the side walls of both sides of each of the convex portions 1031 are provided with the guide holes 1032.
  • the flow guide holes 1032 on each of the convex portions 1031 may be arranged one-to-one correspondingly as shown in FIG. 9, or may be arranged in an offset manner. Because there is a sufficient gap between the deflector 103 and the first cover plate 100 and the second cover plate 101 in the second direction, the heat transfer medium 1041 is moving along the second direction.
  • the flow in the direction is very smooth, and the flow of the heat transfer medium 1041 in the first direction (that is, the direction in which the convex portions 1031 are arranged at intervals) is blocked.
  • the convex portion 1031 with the The diversion holes 1032 can increase the flow of the heat transfer working medium 1041 in the first direction, thereby increasing the heat transfer effect in the first direction, so that the heat transfer working medium 1041 is moving along the first direction.
  • the one direction and the second direction have almost the same fluidity, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the temperature of each area of the thermal superconducting plate 10 is the same, which is effective. Avoiding overheating in a local area of the thermal superconducting plate 10 due to poor heat dissipation in one or more directions.
  • the first deflector 1035 includes a first deflector strip, and the first deflector strip includes a plurality of the convex portions 1031 arranged at intervals along the first direction.
  • the second deflector plate 1036 includes a plurality of second deflector bars 1033 and a connecting portion 1034; wherein a plurality of the second deflector bars 1033 are arranged in parallel along the second direction, and each of the second Each of the guide bars 1033 includes a plurality of the convex portions 1031 arranged at intervals along the first direction; the connecting portions 1034 are located at both ends of the plurality of second guide bars 1033, and are connected to each of the first guide bars 1033.
  • the two guide bars 1033 are integrally connected, as shown in FIGS. 11 and 12.
  • the first guide bar and the second guide bar 1033 are along the first direction (generally The length direction of the first guide bar and the second guide bar 1033) may extend in a square wave shape, or may extend in a wave shape, that is, the first guide bar and the second guide bar 1033
  • the first guide bar and the second guide bar 1033 both extend in a square wave shape along the first direction, so that the first guide bar and the first guide bar can be ensured.
  • the upper and lower surfaces of the two deflector strips 1033 are both flat, that is, ensure the upper surface of the deflector 103 (that is, the top surface of the convex portion 1031) and the lower surface (that is, the top of the convex portion 1031).
  • the opposite surfaces are all planar, so that the contact area between the deflector 103 and the first cover plate 100 and the second cover plate 101 is as large as possible, thereby improving the welding strength.
  • first deflector strip and the second deflector strip 1033 are The recesses between the convex portion 1031 and the first cover plate 100 and the second cover plate 101 and the gap between the adjacent first and second guide bars 1033 and 1033 constitute a common structure. Mentioned heat transfer channel 106.
  • the first deflector 1035 may have the same structure as the second deflector 1036, that is, the first deflector 1035 may include a plurality of deflectors and the same A connecting part integrally connected at both ends of the flow bar.
  • the convex portions 1031 on the two adjacent rows of the second guide bars 1033 may be arranged one by one correspondingly, that is, along the second direction (that is, the direction in which the guide bars 1033 are arranged),
  • the convex portions 1031 on the second guide bars 1033 are correspondingly arranged one by one.
  • the protrusions 1031 on the second deflector strips 1033 of two adjacent rows may also be offset, and the protrusions on the second deflector strips 1033 are adjacent 1031 misalignment means that the sides of the convex portions 1031 on the two adjacent rows of the second guide bars 1033 are staggered, as shown in FIG. 11 and FIG.
  • the dislocation distance of the convex portion 1031 of 1033 may be smaller than the width of the convex portion 1031. As shown in FIG. 11 and FIG. 12, the distance of dislocation of the convex portions 1031 of the two adjacent rows of the second guide bars 1033 may also be equal to The width of the convex portion 1031 is described. At this time, the depressions between the convex portions 1031 of one row of the second guide bars 1033 and the convex portions 1031 of the row of the second guide bars 1033 adjacent thereto are aligned. It should be noted that when the convex portions 1031 on the second guide bars 1033 of two adjacent rows are staggered, the convex sections 1031 on the second guide bars 1033 are arranged one by one in a corresponding manner.
  • the convex portions 1031 on the odd-numbered rows of the second guide bars 1033 and the convex portions 1031 on the even-numbered rows of the second guide bars 1033 are offset, and the odd-numbered rows of the second guide bars
  • the convex portions 1031 on 1033 are correspondingly arranged one by one, and the convex portions 1031 on the second guide bar 1033 are evenly arranged on each of the even rows.
  • the specific structure of the first guide bar may be exactly the same as the specific structure of the second guide bar 1033.
  • the side wall of the convex portion 1031 may be provided with a guide hole 1032, and the guide hole 1032 is along the first guide strip and the second guide flow.
  • the thickness direction of the strip 1033 runs through the first and second guide strips 1033. Since there is a sufficient gap between the first guide bar and the guide bar 1033 and the first cover plate 100 and the second cover plate 101 along the second direction, the heat transfer process
  • the flow of the mass 1041 in the second direction is very smooth, and the flow of the heat transfer working substance 1041 in the first direction (that is, the direction in which the flow guide 1033 extends) is blocked.
  • the flow guide hole 1032 is provided on the portion 1031, which can increase the flow of the heat transfer medium 1041 in the first direction, thereby increasing the heat transfer effect in the first direction, so that the heat transfer medium 1041 has almost the same fluidity along the first direction and the second direction, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the thermal superconducting plate 10 in each region has The temperature is the same, thereby effectively avoiding the occurrence of overheating in a local area of the thermal superconducting plate 10 due to poor heat dissipation effect in one or more directions.
  • each of the first and second guide bars 1033 and 1033 on each side of each of the convex portions 1031 are provided with the guide holes 1032 along the first In a direction in which a guide bar and the second guide bar 1033 extend, the guide holes 1032 on each of the convex portions 1031 may be arranged one-to-one correspondingly as shown in FIG. 13, or may be arranged in an offset manner.
  • the heat dissipation fins 20 may be wavy or extend in a square wave shape (as shown in FIG. 15).
  • the heat dissipation fins 20 extend in a wave shape or a square wave shape, which can maximize the surface area of the heat dissipation fins 20 in a limited space, thereby increasing the heat dissipation effect.
  • a region where the first deflector 1035 is located is a heated region, and the power device 70 is disposed on a surface corresponding to the heated region;
  • the gap between the first deflector 1035 and the second deflector 1036 is a balanced area, and the area where the second deflector 1036 is located is a heat release area.
  • Each of the bottom substrate spacers 30 in the present invention separates each of the thermal superconducting plates 10 independently, and has good performance even when the high-power thermal superconducting plate-fin combined radiator is under various inclined angles.
  • the heat dissipation performance does not have the problem that the surface temperature of the power device 70 is not uniform due to the local concentration of the heat transfer working medium 1041.
  • the bottom substrate spacer 30 is further provided with a plurality of through holes 304, and the plurality of through holes 304 are spaced along the length direction of the bottom substrate spacer 30. Arranged and communicate with the channels 303 on both sides of the bottom substrate spacer 30.
  • the bottom substrate spacer 30 is provided with a through hole 304 that communicates with the channels 303 on both sides, so that the heat transfer working medium 1041 in all the thermal superconducting plates 10 can be communicated, so that the heat transfer can be performed.
  • the filling of the working medium 1041 is more simple and convenient, and the temperature uniformity of the power device 70 is better.
  • the bottom substrate spacer 30 includes: a first bottom substrate spacer 301, and the first bottom substrate spacer 301 is located partially adjacent to the thermal superconducting plate 10.
  • the specific structure of the first bottom substrate spacer 301 is shown in FIG. 3 to FIG. 5. For details, please refer to FIGS. 3 to 5 and related descriptions, which will not be repeated here.
  • the second bottom substrate spacer 302 is located between other adjacent thermal superconducting plates 10; the second bottom substrate spacer 302 is also provided with a plurality of through holes 304, and a plurality of the through holes 304 are along the
  • the second bottom substrate spacers 302 are arranged at intervals in the length direction, and communicate with the channels 303 on both sides of the second bottom substrate spacers 302.
  • the specific structure of the second bottom substrate spacer 302 is shown in FIGS. 17 to 19. For details, please refer to FIGS. 17 to 19 and related descriptions, which will not be repeated here.
  • the specific numbers of the first bottom substrate spacer 301 and the second bottom substrate spacer 302 can be set according to actual needs, which is not limited herein.
  • the bottom substrate spacer 30 By selecting the bottom substrate spacer 30 to select the second bottom substrate spacer 302 with the channel 303 and the first bottom substrate spacer 301 without the channel 303, a part of the The heat transfer mediums 1041 of the thermal superconducting plate 10 are connected together, thereby reducing the complexity and difficulty of filling, and not all the heat transfer mediums 1041 of the thermal superconducting plate 10 are connected. That is, the first bottom substrate spacer 301 divides several of the thermal superconducting plates 10 into a plurality of isolated structures.
  • the high-power thermal superconducting plate-fin combined radiator When the high-power thermal superconducting plate-fin combined radiator is inclined, it does not appear. Obviously, the reduction of the local heat transfer working medium 1041 leads to the problems of temperature rise of the power device 70 at a higher position and uneven temperature of the surface on which the power device 70 is placed.
  • the high-power thermal superconducting plate-fin combined radiator of this example may be suitable for special applications, such as uneven heating of the power device 70 and local high-temperature heat conduction.
  • the high-power thermal superconducting described in this example is used.
  • the plate-fin combined radiator can be attached to the specific area (for example, the area where the heat transfer working medium 1041 of the plurality of thermal superconducting plates 10 is connected, that is, The area where the second bottom substrate spacer 302 is located), so as to uniformly distribute the heat generated by the power device 70 to other thermal superconducting plates 10 to dissipate heat.
  • This embodiment also provides a high-power thermal superconducting plate-fin combined heat sink.
  • the high-power thermal superconducting plate-fin combined heat sink described in this embodiment is also provided.
  • the structure of the device is substantially the same as that of the high-power thermal superconducting plate-fin combined radiator described in the first embodiment. The difference between the two is that the high-power thermal superconducting plate-fin combined cooling described in this embodiment is the same.
  • the device is provided with a top communication plate 60, which is located on the top substrate spacer 50 and the thermal superconducting plate.
  • the extending direction of the top connecting plate 60 is perpendicular to the surface of the thermal superconducting plate 10; a filling groove 60 is formed on the top communicating plate 60 and a communication with the filling groove 601 A filling hole 602, the filling groove 601 extends along the length direction of the top communication plate 60, and is in communication with the heat transfer channels in each of the thermal superconducting plates 10.
  • the high-power thermal superconducting plate-fin combined radiator in this embodiment is provided on the top substrate spacer 50 and the thermal superconducting plate 10 with the inside of the thermal superconducting plate 10.
  • the top communication plate 60 of the filling tank 601 that communicates with a heat transfer channel, since the filling tank 601 of the top communication plate 60 and the heat transfer in all the thermal superconducting plates 10 The channels are all in communication, and only one filling pipe 603 is required to be inserted into the filling hole 602 to perform filling of all the thermal superconducting plates 10 with a heat transfer working medium, which makes the filling process more simple and convenient.
  • the other structures of the high-power thermal superconducting plate-fin combined radiator described in this embodiment are the same as the corresponding other structures in the high-power thermal superconducting plate-fin combined radiator described in the first embodiment. Please refer to the first embodiment, which will not be described again here.
  • This embodiment also provides a high-power thermal superconducting plate-fin combined heat sink.
  • the high-power thermal superconducting plate-fin combined heat sink described in this embodiment is also provided.
  • the structure of the device is substantially the same as that of the high-power thermal superconducting plate-fin combined radiator described in the second embodiment. The difference between the two is that the specific structure of the top communication plate 60 is different.
  • a filling groove 60 and a filling hole 602 communicating with the filling groove 601 are formed on the top communication plate 60.
  • the filling groove 601 extends along the length direction of the top communication plate 60 and communicates with the top communication plate 60.
  • the heat transfer channels in each of the thermal superconducting plates 10 are in communication with each other, that is, a heat transfer channel in each of the thermal superconducting plates 10 is formed in the top communication plate 60 in the second embodiment.
  • the filling grooves 601 which are uniformly communicated with each other in the channel; in this embodiment, a plurality of filling grooves 60 and a plurality of irrigations which are in one-to-one correspondence with the filling grooves 601 are formed on the top communication plate 60.
  • Mounting holes 602; a plurality of the filling grooves 601 are arranged at intervals along the length direction of the top communication plate 60, and each Filling said groove 601 located in communication with each of the homogeneous superconducting hot plate 10 directly below the heat transfer within the passage.
  • the present invention provides a high-power thermal superconducting plate-fin combined radiator.
  • the high-power thermal superconducting plate-fin combined radiator includes: a plurality of spaced-apart thermal superconducting plates. Interconnected heat transfer channels are formed in the superconducting plate, and the heat transfer channels are filled with a heat transfer working medium; a plurality of bottom substrate spacers are located between adjacent thermal superconducting plates and are placed on the substrate.
  • a surface of the thermal superconducting plate; a surface of at least one side of the bottom substrate spacer that is in contact with the thermal superconducting plate is provided with a channel; a surface of the thermal superconducting plate that is in contact with the bottom substrate spacer A connection through hole is provided to communicate the heat transfer channel and the channel; a heat dissipation fin is located on at least one surface of the thermal superconducting plate and is located above the bottom substrate spacer.
  • the high-power thermal superconducting plate-fin combined radiator of the present invention has the following beneficial effects: the sealed cavity inside the thermal superconducting plate is filled with a heat transfer working medium, and the phase change heat or phase change of the heat transfer working medium is used to suppress heat transfer To form a thermally-conductive thermal superconducting characteristic that makes the entire thermal superconducting plate uniform in temperature, which can quickly dissipate the heat generated by high-power power devices; 2. the thermal superconducting plate is welded with radiating fins, which are The heat conducted by the thermal superconducting plate can be quickly taken away by the air and dissipated.
  • the heat dissipation fins increase the heat exchange area with the air, reduce the system thermal resistance, improve the heat dissipation capacity, and strengthen the thermal superconductivity.
  • the function of the plate is to reduce the material thickness of the thermal superconducting plate, increase the strength, reduce weight, and reduce costs; 3.
  • the interior of the thermal superconducting plate is a sealed cavity, and a deflector is provided.
  • the cover plate and the second cover plate are welded together, which strengthens the thickness of the cover plates on both sides, increases the pressure bearing capacity, increases the strength, reduces the weight and thickness of the thermal superconducting plate, and increases the internal replacement. Thermal area, enhance thermal superconducting ability, improve heat dissipation The reliability of the heater reduces costs; 4.
  • the thermal superconducting plate and the bottom substrate spacer in the high-power thermal superconducting plate fin-type radiator of the present invention are alternately stacked and welded together, and the bottom of the thermal superconducting plate and the heat source Direct contact to reduce the combined thermal resistance; 5.
  • the channels on both sides of the bottom substrate spacer can serve as a buffer and storage area for the heat transfer medium, balance the distribution of the heat transfer medium, and serve as a thermal superconducting plate.
  • the communication or isolation function can also increase the heating area of the heat transfer medium.
  • the bottom substrate spacer is provided with through holes that connect the channels on both sides, which can partially or fully thermally superconducting plates.
  • the internal heat transfer working medium is connected, so that the filling of the heat transfer working medium is more simple and convenient; 7.
  • the inner surface of the bottom side of the annular frame is provided with a convex portion, and the convex portion is used to form a mounting hole for installing a power device
  • the annular frame between the bumps can be made as thin as possible, so that the heat transfer working fluid is as close as possible to the power device, so that the thermal resistance can be reduced; at the same time, the existence of the bumps can tilt the radiator along the parallel direction of the thermal superconducting plate. At a certain angle (for example, 30 °, etc.) The temperature-sharing performance will not change; 8.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Radiateur thermique haute puissance combinant plaques supraconductrices et ailettes, comprenant : plusieurs plaques supraconductrices thermiques (10) agencées de façon espacée, formant des canaux de transfert de chaleur en communication les uns avec les autres et remplies d'un fluide de travail pour transfert thermique (1041) ; plusieurs éléments d'espacement de substrat inférieur (30) situés entre des plaques supraconductrices thermiques adjacentes (10) et collés sur la surface de celles-ci ; des rainures (303) étant disposées sur la surface où au moins une face de l'élément d'espacement de substrat inférieur (30) est en contact avec les plaques supraconductrices thermiques (10) ; des trous traversants de connexion (105) pour mettre en communication les canaux de transfert de chaleur et les rainures (303) disposées sur la surface où les plaques supraconductrices thermiques (10) entrent en contact avec les éléments d'espacement de substrat inférieur (30) ; et des ailettes de dissipation de chaleur (20) situées sur au moins une surface de la plaque supraconductrice thermique (10) et situées au-dessus de l'élément d'espacement de substrat inférieur (30). Les rainures (303) des deux côtés des éléments d'espacement de substrat inférieur (30) du radiateur thermique haute puissance combinant plaques supraconductrices et ailettes, peuvent être utilisées en tant que zone tampon et de stockage du fluide de travail pour transfert thermique (1041) afin d'équilibrer sa distribution, communiquer avec les plaques supraconductrices thermiques (10) ou les isoler et pouvoir augmenter la surface de chauffage du fluide de travail pour transfert thermique (1041).
PCT/CN2019/100971 2018-09-21 2019-08-16 Radiateur thermique haute puissance combinant plaques supraconductrices et ailettes WO2020057306A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201811107416.8 2018-09-21
CN201821550020.6U CN209119079U (zh) 2018-09-21 2018-09-21 大功率热超导板翅组合式散热器
CN201811107416.8A CN109244050B (zh) 2018-09-21 2018-09-21 大功率热超导板翅组合式散热器
CN201821550020.6 2018-09-21

Publications (1)

Publication Number Publication Date
WO2020057306A1 true WO2020057306A1 (fr) 2020-03-26

Family

ID=69888246

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/100971 WO2020057306A1 (fr) 2018-09-21 2019-08-16 Radiateur thermique haute puissance combinant plaques supraconductrices et ailettes

Country Status (1)

Country Link
WO (1) WO2020057306A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4195894A4 (fr) * 2020-08-24 2024-01-24 Huawei Technologies Co., Ltd. Dispositif de dissipation de chaleur et son procédé de fabrication

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611041A (ja) * 1984-06-13 1986-01-07 Sumitomo Precision Prod Co Ltd 沸騰冷媒式冷却装置
DE102013219558A1 (de) * 2012-09-28 2014-04-03 Behr Gmbh & Co. Kg Vorrichtung zur Führung eines Fluids
CN106922108A (zh) * 2015-09-21 2017-07-04 Abb瑞士股份有限公司 冷却组件及其制造方法
CN107101517A (zh) * 2017-06-13 2017-08-29 杭州沈氏节能科技股份有限公司 一种换热组件、具有其的板翅式换热器及制造方法
CN107359146A (zh) * 2017-06-30 2017-11-17 上海嘉熙科技有限公司 表面设有鳍片的热超导板翅片式散热器
CN108917439A (zh) * 2018-08-30 2018-11-30 无锡格林沃科技有限公司 新型相变散热器
CN109246984A (zh) * 2018-09-21 2019-01-18 浙江嘉熙科技有限公司 轨道交通用大功率热超导板翅组合式散热器
CN109244050A (zh) * 2018-09-21 2019-01-18 浙江嘉熙科技有限公司 大功率热超导板翅组合式散热器
CN209119079U (zh) * 2018-09-21 2019-07-16 浙江嘉熙科技有限公司 大功率热超导板翅组合式散热器

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611041A (ja) * 1984-06-13 1986-01-07 Sumitomo Precision Prod Co Ltd 沸騰冷媒式冷却装置
DE102013219558A1 (de) * 2012-09-28 2014-04-03 Behr Gmbh & Co. Kg Vorrichtung zur Führung eines Fluids
CN106922108A (zh) * 2015-09-21 2017-07-04 Abb瑞士股份有限公司 冷却组件及其制造方法
CN107101517A (zh) * 2017-06-13 2017-08-29 杭州沈氏节能科技股份有限公司 一种换热组件、具有其的板翅式换热器及制造方法
CN107359146A (zh) * 2017-06-30 2017-11-17 上海嘉熙科技有限公司 表面设有鳍片的热超导板翅片式散热器
CN108917439A (zh) * 2018-08-30 2018-11-30 无锡格林沃科技有限公司 新型相变散热器
CN109246984A (zh) * 2018-09-21 2019-01-18 浙江嘉熙科技有限公司 轨道交通用大功率热超导板翅组合式散热器
CN109244050A (zh) * 2018-09-21 2019-01-18 浙江嘉熙科技有限公司 大功率热超导板翅组合式散热器
CN209119079U (zh) * 2018-09-21 2019-07-16 浙江嘉熙科技有限公司 大功率热超导板翅组合式散热器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4195894A4 (fr) * 2020-08-24 2024-01-24 Huawei Technologies Co., Ltd. Dispositif de dissipation de chaleur et son procédé de fabrication

Similar Documents

Publication Publication Date Title
CN107359146B (zh) 表面设有鳍片的热超导板翅片式散热器
CN109152294B (zh) 液冷式热超导散热器
CN109244050B (zh) 大功率热超导板翅组合式散热器
TWI415558B (zh) 用於冷卻電子裝置之散熱片組件
WO2022057938A1 (fr) Chambre d'égalisation de température, dispositif électronique et procédé de production de chambre d'égalisation de température
CN109246984B (zh) 轨道交通用大功率热超导板翅组合式散热器
CN110366358B (zh) 热超导板及热超导散热器
CN110430724B (zh) 热超导板及热超导散热器
CN109192711A (zh) 风冷液冷组合式热超导板式散热器
JP2013157111A (ja) 組電池の冷却兼加熱構造
CN209119079U (zh) 大功率热超导板翅组合式散热器
BR102012015581A2 (pt) Dispositivo de resfriamento, módulo de energia e método
CN109287095A (zh) 风冷式热超导板式散热器
WO2018161498A1 (fr) Radiateur thermique à ailettes supraconductrices thermiques et châssis d'équipement électrique
CN109244048A (zh) 热超导板及其制造方法
CN106686958A (zh) 热超导翅片式散热器及电器设备机箱
CN115332204A (zh) 一种低热阻低泵功稳定性好的歧管微通道散热器
WO2020057306A1 (fr) Radiateur thermique haute puissance combinant plaques supraconductrices et ailettes
CN209298105U (zh) 风冷液冷组合式热超导板式散热器
CN108811447B (zh) 一种带通道的液冷板
WO2017186081A1 (fr) Système de rayonnement et dispositif de communication associé à celui-ci
CN109526183B (zh) 自冷式热超导板翅片散热器
CN210537197U (zh) 热超导板及热超导散热器
CN209882400U (zh) 轨道交通用大功率热超导板翅组合式散热器
CN219514450U (zh) 一种散热器及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19862448

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19862448

Country of ref document: EP

Kind code of ref document: A1