WO2020054001A1

WO2020054001A1 - Antenna

Info

Publication number: WO2020054001A1
Application number: PCT/JP2018/033879
Authority: WO
Inventors: 哲成齋藤; 幸宣垂井; 靖朗白井
Original assignee: 三菱電機株式会社
Priority date: 2018-09-12
Filing date: 2018-09-12
Publication date: 2020-03-19
Also published as: JPWO2020054001A1; JP6949239B2

Abstract

An antenna (500) according to the present invention is provided with: a control substrate (160) which is provided on a first surface side of a supporting material (141); a multilayer resin substrate for antennas, which is provided on a second surface side of the supporting material (141); a plurality of microwave devices (100) which are provided on a first surface of a first multilayer resin substrate and are electrically connected to the multilayer resin substrate for antennas, said first surface being on the supporting material side; and a plurality of antenna elements (210) which are provided on a second surface side of the first multilayer resin substrate and are electrically connected to the multilayer resin substrate for antennas, said second surface being on the reverse side of the first surface of the first multilayer resin substrate. This antenna (500) is provided with: a bus bar (142) which is provided on a surface of the supporting material (141), said surface being on the multilayer resin substrate for antennas side; and a conductive leaf spring (190) which is provided between the multilayer resin substrate for antennas and the bus bar (142) so as to be in contact with the multilayer resin substrate for antennas and the bus bar (142), while being electrically connected to the multilayer resin substrate for antennas and the bus bar (142).

Description

Aerial

The present invention relates to an antenna having a microwave device.

As an antenna for transmission and reception used for communication using microwaves, Patent Literature 1 discloses a printed board on which components such as a microstrip line having a plurality of antenna elements and an electronic device are mounted. .

On the other hand, as an antenna structure, a layer on which a substrate on which an antenna element is mounted is arranged on the same plane, a layer on which a substrate on which a microwave device is mounted are arranged on the same plane, and a layer on which a power supply circuit is mounted are laminated. Antennas that realize a low profile by electrically connecting the layers are being studied. Generally, a multi-pole board-to-board connector is used for the electrical connection between the layers.

JP-A-6-11219

However, transmission of a power supply requiring a large current capacity such as a drain current for driving an amplifier cannot be handled by the current capacity of one terminal provided in a general multi-pole board-to-board connector. For this reason, it is necessary to use a plurality of terminals, and the board-to-board connector becomes large. Increasing the size of the board-to-board connector reduces the degree of freedom in mounting the board-to-board connector on the board due to the enlargement of the board-to-board connector, and the parts on the board resulting from the enlargement of the board-to-board connector. This leads to a problem such as a reduction in the mounting area, and a problem that the antenna becomes large.

The present invention has been made in view of the above, and an object of the present invention is to obtain an antenna that can be reduced in height and reduced in size.

In order to solve the above-described problems and achieve the object, an antenna according to the present invention includes a support member, a control board provided on a first surface side of the support member, and a control substrate provided on a side opposite to the first surface of the support member. A first multilayer resin substrate provided on the second surface side of the support member, which is a surface, and electrically connected to the control board via a connector; and a first multilayer resin substrate on the support member side of the first multilayer resin substrate. A plurality of microwave devices provided on the first surface and electrically connected to the first multilayer resin substrate; and a plurality of microwave devices provided on the first multilayer resin substrate, the first multilayer resin substrate being a surface opposite to the first surface. A plurality of antenna elements provided on the second surface side and electrically connected to the first multilayer resin substrate. The antenna is provided between the first multilayer resin substrate and the bus bar in contact with the first multilayer resin substrate and the bus bar, the bus bar being provided on the surface of the support member on the first multilayer resin substrate side. A conductive leaf spring electrically connected to the first multilayer resin substrate and the bus bar.

According to the present invention, it is possible to obtain an antenna that can be reduced in height and reduced in size.

Sectional view of a microwave device according to an embodiment of the present invention. Sectional view of an antenna with the microwave device shown in FIG. Overall view of the support shown in FIG. The figure which shows the functional block of the microwave device shown in FIG. The figure which shows the modification of the microwave device shown in FIG. The figure which shows the circulator which has the shield structure based on Embodiment of this invention. The figure which shows the modification of the antenna shown in FIG.

Hereinafter, an antenna according to an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the embodiment.

Embodiment.
FIG. 1 is a sectional view of a microwave device according to an embodiment of the present invention. FIG. 2 is a sectional view of an antenna having the microwave device shown in FIG. FIG. 3 is an overall view of the support member shown in FIG. FIG. 4 is a diagram showing functional blocks of the microwave device shown in FIG.

As shown in FIG. 1, the microwave device 100 includes a multilayer resin substrate 1 that is a multilayer resin substrate for the device, an IC (Integrated Circuit) 4 that is a high heat-generating RF (Radio Frequency) device, and a thermally integrated IC 4. And a conductive heat spreader 5 that is connected to the heat spreader 5.

The microwave device 100 also includes an IC 6 that is an RF device having high heat generation, a conductive heat spreader 7 that is thermally connected to the IC 6, and a chip component 8 that is surface-mounted on the multilayer resin substrate 1.

IC4 and IC6 are examples of a high-frequency circuit which is a circuit device. In the present embodiment, IC4 is a driver amplifier (Driver Amplifier). The IC 6 is a high power amplifier (High Power Amplifier): HPA. The chip component 8 is a bypass capacitor that suppresses an RF superimposed wave.

The multilayer resin substrate 1 has a first plate surface 1a which is an end surface on one end side in the Y-axis direction of the multilayer resin substrate 1 and a second plate surface which is an end surface on the other end side in the Y-axis direction of the multilayer resin substrate 1. 1b. In FIG. 1, in the right-handed XYZ coordinates, the arrangement direction of IC4 and IC6 is the X-axis direction, and the arrangement direction of first plate surface 1a and second plate surface 1b of multilayer resin substrate 1 is the Y-axis direction. The direction orthogonal to both the X-axis direction and the Y-axis direction is defined as the Z-axis direction.

(4) In the multilayer resin substrate 1, a plurality of ground via holes 11, signal via holes 12, and signal via holes 13 formed near the outer periphery of the multilayer resin substrate 1 are formed. On the second plate surface 1 b side of the multilayer resin substrate 1, a ground pattern 14 electrically connected to one end of each of the plurality of ground via holes 11 in the Y-axis direction and a chip component 8 are electrically connected. A signal line 15, a pad 16 electrically connected to one end of the signal via hole 12 in the Y-axis direction, a pad 17 electrically connected to one end of the signal via hole 13 in the Y-axis direction, and a plurality of pads 18. Is provided.

On the first plate surface 1a side of the multilayer resin substrate 1, a ground pattern 19 electrically connected to the other end of the ground via hole 11 in the Y-axis direction, and a ground pattern electrically connected to the other end of the signal via hole 12 in the Y-axis direction. And a signal input / output terminal 21 electrically connected to the other end of the signal via hole 13 in the Y-axis direction.

The plurality of ground via holes 11 include a signal line 15,

pads

16, 17, 18, signal pads such as signal input /

output terminals

20, 21, and signal via

holes

12, 13 near the outer peripheral surface of the multilayer resin substrate 1. It is formed so as to surround it.

The types of the signal line 15 include an input RF line, a gate bias supply line, an output RF line, and a drain bias supply line.

Two input /

output terminals

41 and 42 are provided on one end surface 4a side of the IC 4 in the Y-axis direction. The input / output terminal 41 is electrically connected to the pad 16 via the fine bonding material 30. The input / output terminal 42 is electrically connected to the pad 18 via the fine bonding material 30. Examples of the fine bonding material 30 include a conductive copper pillar or a solder ball. A heat spreader 5 is provided on the other end surface 4b side of the IC 4 in the Y-axis direction. That is, the heat spreader 5 is provided on the surface of the IC 4 opposite to the surface facing the multilayer resin substrate 1 side. The IC 4 is thermally connected to one end surface 5a of the heat spreader 5 in the Y-axis direction.

Two input /

output terminals

61 and 62 are provided on one end surface 6a side of the IC 6 in the Y-axis direction. The input / output terminal 61 is electrically connected to the pad 18 via the fine bonding material 30. The input / output terminal 62 is electrically connected to the pad 17 via the fine bonding material 30. A heat spreader 7 is provided on the other end surface 6b side of the IC 6 in the Y-axis direction. The IC 6 is thermally connected to one end surface 7a of the heat spreader 7 in the Y-axis direction.

The

ICs

4 and 6 provided to be in contact with the

heat spreaders

5 and 7 are joined to the multilayer resin substrate 1, and a mold resin 50 is formed on the multilayer resin substrate 1 to which the

ICs

4 and 6 are joined. The mold resin 50 is molded so as to include the

ICs

4 and 6, the

heat spreaders

5 and 7, the chip component 8, the signal line 15, and the

pads

16, 17 and 18 therein.

The outer peripheral surface of the IC 4 is covered with the mold resin 50 except for the other end surface 4b of the IC 4 in the Y-axis direction. The outer peripheral surface of the IC 6 is covered with the mold resin 50 except for the other end surface 6b of the IC 6 in the Y-axis direction. The outer peripheral surface of the heat spreader 5 is covered with the mold resin 50 except for one end surface 5a of the heat spreader 5 in the Y-axis direction and the other end surface 5b of the heat spreader 5 in the Y-axis direction.

The outer peripheral surface of the heat spreader 7 is covered with the mold resin 50 except for one end surface 7a of the heat spreader 7 in the Y-axis direction and the other end surface 7b of the heat spreader 7 in the Y-axis direction. The other end surface 5b in the Y-axis direction of the heat spreader 5 is exposed without being covered with the mold resin 50. The other end surface 7b of the heat spreader 7 in the Y-axis direction is exposed without being covered with the mold resin 50.

As a molding method of the molding resin 50, a method of molding a resin material around the

ICs

4, 6 and the

heat spreaders

5, 7 so that a step does not occur on the end surface of the conductive film 2 on the inner side surface 2a side in the Y-axis direction. Good. Further, after the resin material is molded around the

ICs

4 and 6 and the

heat spreaders

5 and 7, the end surfaces of the mold resin 50 on the inner side surface 2 a side and the upper end surfaces of the

heat spreaders

5 and 7 are polished so as to be substantially flush with each other. Alternatively, the

other end surfaces

5b, 7b of the

heat spreaders

5, 7 may be exposed by polishing so that the end surfaces of the mold resin 50 on the inner surface 2a side and the upper end surfaces of the

heat spreaders

5, 7 are flat.

The conductive film 2 is formed on the surfaces of the mold resin 50 and the

heat spreaders

5 and 7. The conductive film 2 is a conductive film such as electroless plating or a conductive adhesive. Examples of the material of the plating film include Ni (nickel) and silver, and the conductive adhesive includes silver particles. And the like. When electroless plating is used as the conductive film 2, a conductive adhesive or a thin film conductive metal is provided on the upper surface of the boundary region where the end surface on the inner surface 2 a side of the mold resin 50 and the upper end surfaces of the

heat spreaders

5 and 7 are adjacent to each other. The sheet may be contacted to enhance the electrical connection and electromagnetic shielding (shielding) functions in the boundary region between the end surface on the inner surface 2a side of the mold resin 50 and the upper end surfaces of the

heat spreaders

5, 7. A region indicated by reference numeral 3 is a space formed between the multilayer resin substrate 1 and the conductive film 2 and filled with the mold resin 50.

The inner surface 2a of the conductive film 2 provided on the multilayer resin substrate 1 is thermally connected to the other end surface 5b of the heat spreader 5 in the Y-axis direction, and is thermally connected to the other end surface 7b of the heat spreader 7 in the Y-axis direction. You. An end of the conductive film 2 provided on the multilayer resin substrate 1 in the Y-axis direction is electrically connected to the ground pattern 14.

では In the microwave device 100 configured as described above, an RF signal is input to the signal input / output terminal 20. An RF signal, which is a transmission signal input to the signal input / output terminal 20, is input to the IC 4 via the signal via hole 12, the pad 16, the fine bonding material 30, and the input / output terminal 41. The RF signal input to the IC 4 is transmitted to the IC 6 via the input / output terminal 42, the fine bonding material 30, and the pad 18. The RF signal input to the IC 6 via the input / output terminal 61 is transmitted to the signal input / output terminal 21 via the input / output terminal 62, the fine bonding material 30, the pad 17, and the signal via hole 13.

The pad 16, the signal via hole 12, and the signal input / output terminal 20 constitute a signal terminal portion 84 having a coaxial structure. The pad 17, the signal via hole 13, and the signal input / output terminal 21 constitute a signal terminal 85 having a coaxial structure.

空 As shown in FIG. 2, the antenna 500 includes the microwave module 200, a heat radiating sheet 150 having elasticity, a heat radiating plate 140, and a control board 160. The elastic modulus of the heat radiation sheet 150 is smaller than the elastic modulus of the conductive film 2 of the microwave device 100. The microwave module 200, the heat radiating sheet 150, the heat radiating plate 140, and the control board 160 are arranged in the order of the microwave module 200, the heat radiating sheet 150, the heat radiating plate 140, and the control board 160 in the Y-axis direction.

The microwave module 200 includes a multilayer resin substrate 110, which is a multilayer resin substrate for the module, a plurality of microwave devices 100, a control IC 120, a chip component 130, a leaf spring 190, and a plurality of antenna elements 210. Prepare. Assuming that the multilayer resin substrate 110 for a module is a first multilayer resin substrate, the multilayer resin substrate 1 for a device described above can be said to be a second multilayer resin substrate.

The plurality of microwave devices 100, control ICs 120, chip components 130, and leaf springs 190 are provided on one end surface 110 a of the multilayer resin substrate 110 in the Y-axis direction. The control IC 120, the leaf spring 190, and the chip component 130 are surface-mounted on the multilayer resin substrate 110. As the chip component 130, a resistor or a capacitor can be exemplified. The plurality of antenna elements 210 are provided on the other end surface 110b of the multilayer resin substrate 110 in the Y-axis direction. One end face 110 a is the first face of multilayer resin substrate 110. The other end surface 110b is a second surface of the multilayer resin substrate 110, and is a surface opposite to the first surface of the multilayer resin substrate 110.

{Circle around (2)} As shown in FIG. 2, on the surface of the control substrate 160 on the side of the multilayer resin substrate 110, a support member 141 having a flat plate shape is disposed. That is, the control board 160 is provided on the one end surface 141a side of the support member 141 in the Y-axis direction. Further, the multilayer resin substrate 110 is provided on the other end surface 141b side of the support member 141 in the Y-axis direction. The one end surface 141a is a first surface of the support 141. The other end surface 141b is a second surface of the support 141 that is a surface of the support opposite to the first surface.

The support 141 is made of, for example, a conductive metal. The support member 141 is, for example, a metal turning process, a process of partially cutting a cast product formed by casting, a diffusion bonding process of bonding a plate member formed by sheet metal processing by a diffusion bonding technique, that is, a so-called 3D printer. It is formed by a metal additive manufacturing process using manufacturing (Additive Manufacturing: AM), a process of partially cutting a sheet metal process, or the like.

および As shown in FIGS. 2 and 3, the support member 141 is provided with a plurality of bus bars 142 and a plurality of slits 143. Each slit 143 passes through the supporting member 141 in the thickness direction. Each heat sink 140 is fitted into each slit 143. Further, the RF / power / control connector 170 is electrically connected to the multilayer resin substrate 110 via the slit 143. As the RF / power / control connector 170, a general board-to-board connection connector can be used. The microwave module 200 is laid on the support member 141 on the side opposite to the side on which the control board 160 is arranged. In FIG. 3, the arrangement position of the microwave module 200 in the in-plane direction of the support member 141 is indicated by a broken line.

A bus bar 142 that is electrically connected to the control board 160 is provided on the surface of the support member 141 on the multilayer resin substrate 110 side. The support member 141 and the bus bar 142 are electrically insulated. For example, a through hole 1191 serving as an outer conductor is formed in the support member 141, and a cylindrical insulator 1192 is inserted. An inner conductor 119 is provided at the center of the axis of the cylindrical insulator 1192. As a result, the multilayer resin substrate 110 and the bus bar 142 are electrically connected to each other through the inner surface of the through hole 1191 and the inner conductor 119. An insulating film 1193 is formed over the supporting member 141, and a bus bar 142 is mounted on the insulating film 1193. The inner conductor 119 is electrically connected to a bias power supply terminal on the control board 160.

As another mode, an external power supply board (not shown) may be provided outside the control board 160, and the bus bar 142 may be electrically connected to the bias power supply terminal on the external power supply board. In this case, the bias power supply terminal of the external power supply board and the bus bar 142 are connected via a noise-resistant power supply wiring or a connector provided outside the control board 160. At this time, a hole is provided in the control board 160, and a noise-resistant power supply wiring is passed through the hole while being insulated from the hole to supply power between the bus bar 142 and the external power supply board. It may be electrically connected by a wiring or a connector. By doing so, the control board 160 and the bus bar 142 can be electrically insulated. Accordingly, even if a large power is supplied to the bus bar 142, the control board 160 can be prevented from being affected by noise due to the large power supply, and the power durability of the control board 160 can be reduced. The control board 160 can be manufactured at lower cost. At this time, for example, a twisted pair cable may be used as the noise-resistant power supply wiring. Twisted pair cables are also called twisted pair wires.

導電 A conductive leaf spring 190 electrically connected to the multilayer resin substrate 110 and the bus bar 142 is provided between the multilayer resin substrate 110 and the bus bar 142. The bus bar 142 has one end face in the Y-axis direction in contact with the end of the through hole 1191, the cylindrical insulator 1192, the insulating film 1193, and the inner conductor 119, and the other end face in the Y-axis direction is one end of the leaf spring 190. Is in contact with The other end of the leaf spring 190 is connected to a pad 1901 on the multilayer resin substrate 110. That is, the leaf spring 190 has a Z-shaped cross section. The leaf spring 190 has a flat surface provided on one end side of the Z-shaped cross section in surface contact with a surface of the bus bar 142 on the multilayer resin substrate 110 side, and a flat surface provided on the other end side of the Z-shaped cross section has a pad 1901. Is in surface contact with the surface on the side of the support member 141. Thus, the leaf spring 190 is electrically connected to the multilayer resin substrate 110 and the bus bar 142.

Further, the microwave module 200 and the supporting member 141 are screwed in a state where the side of the microwave module 200 on which the microwave device 100 is surface-mounted and the side of the supporting member 141 on which the bus bar 142 is provided face each other. And the like. For example, in the example of FIG. 2, the fastening portion 1190 includes a bolt and a nut, or a female screw formed on the support member 141 and a female screw formed on the multilayer resin substrate 110. Alternatively, the multilayer resin substrate 110 may be fastened to the support member 141 with a spacer 1195 through which a bolt passes between the multilayer resin substrate 110 and the support member 141 interposed therebetween.

The heat dissipation sheet 150 has one end face in the Y-axis direction in contact with the heat sink 140 and the other end face in the Y-axis direction in contact with the conductive films 2 of the plurality of microwave devices 100. That is, the heat radiating plate 140 is provided on the side of the heat radiating sheet 150 opposite to the side facing the microwave device 100. The heat radiation sheet 150 is a sheet having high elasticity and high thermal conductivity. As a material of the heat radiation sheet 150, silicon rubber or the like in which a high heat conductive material such as carbon or silver is embedded can be exemplified.

The plurality of heat sinks 140 are arranged in the plurality of slits 143 formed in the support member 141, respectively. Each heat dissipation plate 140 has an internal flow path 1801 through which the coolant 1800 flows, and forms a cold plate, that is, a cooling plate. The inlet and outlet of the internal flow channel 1801 of each heat sink 140 are connected to the refrigerant flow channel 1401 provided inside the support member 141 with a rubber seal or the like in a watertight manner. The refrigerant flow path 1401 is connected to a pump (not shown), and has a function of circulating the refrigerant 1800 sent from the pump inside each heat sink 140. Instead of the coolant channel 1401, a pipe that realizes the same function as the coolant channel 1401 may be disposed inside the support member 141.

The heat sink 140 and the coolant channel 1401 are made of a metal having conductivity and good thermal conductivity, respectively. The radiator plate 140 and the coolant channel 1401 are formed by, for example, forming a channel groove by performing a process of partially cutting a casting formed by turning or casting a metal, and then welding the metal plate. In addition, the heat dissipation plate 140 and the coolant passage 1401 may be integrally formed with the internal passage 1801 by diffusion bonding in which a plate member formed by sheet metal processing is fixed by diffusion bonding. In addition, the heat dissipation plate 140 and the coolant passage 1401 may be integrally formed with the internal passage 1801 by metal additive manufacturing using a 3D printer.

The coolant flow path 1401 or the pipe may be formed integrally with the heat sink 140 by metal additive manufacturing using a 3D printer.

Of course, another heatsink made of a good heat conductor such as a graphite plate, an aluminum alloy plate, or a copper tungsten plate may be used in place of the heatsink 140 as long as the heat transfer performance required for the heatsink 140 is obtained. In this case, a hole is provided in the control board 160, another cooling plate is inserted into the hole, and the back surface of the other cooling plate on the side opposite to the microwave device 100 side in the Y-axis direction is in close contact or thermally. It is better to connect.

The multilayer resin board 110 and the control board 160 are interconnected by an RF / power / control connector 170 which is a connector for transmitting an RF signal, a power supply and a control signal, with the heat dissipation sheet 150 and the heat dissipation plate 140 interposed therebetween. Have been.

Since the multilayer resin substrate 110 is fixed to the heat radiating plate 140 by the fastening force of the fastening portion 1190 such as a screw while applying pressure in the Y-axis direction, the conductive film 2 of the microwave device 100 has elastic heat radiation. The sheet is pressed against the sheet 150. Thereby, the conductive film 2 of the microwave device 100, the heat radiation sheet 150, and the heat radiation plate 140 are thermally connected.

(4) The multilayer resin substrate 110 is provided with

signal terminals

115 and 121 having a coaxial structure, an RF transmission line 116 as an inner layer signal line, and an RF transmission line 117 as an inner layer signal line. The RF / power / control connector 170 and the microwave device 100 are connected to each other via the RF transmission line 116 and the signal terminal 115. The antenna element 210 and the microwave device 100 are mutually connected via the RF transmission line 117 and the signal terminal unit 121.

{Circle around (4)} On the multilayer resin substrate 110, an inner layer wiring 118 connected to the pad 1901 is formed. The inner layer wiring 118 is connected to a bias terminal of the microwave module 200.

The control board 160 generates a power supply and a control signal to be supplied to the microwave module 200, and the power supply and the control signal are input to the microwave device 100 on the multilayer resin substrate 110 via the RF / power / control connector 170. Is done. That is, the control board 160 has a function as a power supply board on which a power supply circuit is mounted.

On the other hand, a power source that requires a large current among the power sources generated by the control board 160 is connected to the microwave on the multilayer resin substrate 110 via a bus bar 142, a leaf spring 190, and an inner layer wiring 118 provided on the multilayer resin substrate 110. Input to the device 100.

The bus bar 142 includes three bus bars, each having two ground bus bars and a direct current (DC) signal bus bar provided between the two ground bus bars. May be. The bus bar 142 supplies a drain bias current to, for example, a field-effect transistor (FET) of the amplifier in the microwave module 200.

The transmission input signal and the reception output signal which are the RF signals of the microwave module 200 are transmitted between the antenna element 210 and the transceiver 600 via the RF / power / control connector 170 and the control board 160, or The signal is transmitted between 210 and the distribution / synthesis circuit 700. The connection order of the transceiver 600 and the distribution / combination circuit 700 is arbitrary. Although the transceiver 600 is provided separately from the control board 160 here, the transceiver 600 may be integrated with the control board 160.

The RF transmission signal output from the transceiver 600 is transmitted via the control board 160, the RF / power / control connector 170, the RF transmission line 116, and the signal terminal 115 to the signal input / output terminal 20 shown in FIG. Is transmitted to The RF transmission signal output from the signal input / output terminal 21 illustrated in FIG. 1 is transmitted to the antenna element 210 via the RF transmission line 117 and output from the antenna element 210.

The RF reception signal received by the antenna element 210 is transmitted to the signal input / output terminal 21 shown in FIG. 1 via the RF transmission line 117, and further transmitted to the signal input / output terminal 20 shown in FIG. Is transmitted to the transceiver 600 via the RF transmission line 116 and the RF / power / control connector 170.

マイクロ As shown in FIG. 4, the microwave module 200 is provided with a plurality of microwave devices 100. The microwave device 100 includes a low noise amplifier (Low Noise Amplifier: LNA), a circulator (CirculatoR: CIR), a phase shifter (Phase Shifter: PS), and the like, in addition to the above-described HPA and DA. The RF transmission signal output from transceiver 600 is transmitted to antenna element 210 via PS, DA, HPA, and CIR. The RF reception signal received by antenna element 210 is transmitted to transceiver 600 via CIR, LNA, and PS. Here, a switch may be used in the transmission / reception switching circuit on the antenna side instead of the CIR. In FIG. 4, the switch is described as "SW" (Switch). Further, the size of the microwave module 200 illustrated in FIG. 2 can be further reduced by using a switch instead of the CIR.

FIG. 5 is a view showing a modification of the microwave device shown in FIG. FIG. 6 is a diagram showing a circulator having a shield structure according to the embodiment of the present invention. FIG. 7 is a diagram showing a modification of the antenna shown in FIG.

The difference between the microwave device 100-1 shown in FIG. 5 and the microwave device 100 shown in FIG. 1 is that the microwave device 100-1 has a heat spreader 7A and a transistor that does not include a transistor instead of the IC 6 and the heat spreader 7. The semiconductor device includes a low-cost semiconductor substrate 310 as one semiconductor substrate and a high-cost semiconductor substrate 320 as a second semiconductor substrate including a transistor. The high-cost semiconductor substrate 320 is provided with a transistor made of, for example, gallium nitride, and the low-cost semiconductor substrate 310 is provided with a matching circuit made of, for example, gallium arsenide. The transistor provided on the high-cost semiconductor substrate 320 is a field-effect transistor or a bipolar transistor with high power durability and high voltage, and generates a large amount of heat because it amplifies and outputs a high-output microwave signal. Although a transistor may be mounted on the low-cost semiconductor substrate 310, a transistor having a lower voltage than that of the high-cost semiconductor substrate 320 is used. The low-cost semiconductor substrate 310 as the first semiconductor substrate and the high-cost semiconductor substrate 320 as the second semiconductor substrate are circuit devices having circuits.

(4) The low-cost semiconductor substrate 310 is provided on the multilayer resin substrate 1 and is electrically connected to the multilayer resin substrate 1. The high-cost semiconductor substrate 320 is provided on the opposite side of the low-cost semiconductor substrate 310 facing the multilayer resin substrate 1 and is electrically connected to the low-cost semiconductor substrate 310.

As shown in FIG. 5, the signal pad 310a of the low-cost semiconductor substrate 310 and the signal pad 320a of the high-cost semiconductor substrate 320 are arranged so as to face each other, and the signal pad 310a and the signal pad 320a are connected to the fine bonding material 330. Are flip-chip bonded. Thus, the

surface patterns

313 and 314 of the low-cost semiconductor substrate 310 are electrically connected to the signal pads 320a via the signal pads 310a and the fine bonding material 330.

(4) The high-cost semiconductor substrate 320 is thermally connected to the heat spreader 7A. The heat spreader 7A is thermally connected to the conductive film 2 similarly to the heat spreader 7 shown in FIG. That is, the heat spreader 7A is provided on the opposite side of the high-cost semiconductor substrate 320 from the side facing the low-cost semiconductor substrate 310, and is in contact with the high-cost semiconductor substrate 320.

(4) The input / output terminals 311 provided on the low-cost semiconductor substrate 310 are electrically connected to the surface pattern 313 via through holes 315 formed in the low-cost semiconductor substrate 310. The input / output terminals 311 are electrically connected to the pads 18 on the multilayer resin substrate 1 via the fine bonding material 30.

(4) The input / output terminals 312 provided on the low-cost semiconductor substrate 310 are electrically connected to the surface patterns 314 via the through holes 316 formed on the low-cost semiconductor substrate 310. The input / output terminals 312 are electrically connected to the pads 17 on the multilayer resin substrate 1 via the fine bonding material 30.

The circulator 800 shown in FIG. 6 includes a mold package 860, a permanent magnet 850 provided on the mold package 860, and a resin substrate 880 provided below the mold package 860. That is, the permanent magnet 850 is provided on one end surface side of the mold package 860. The resin substrate 880 is provided on the other end side of the mold package 860.

The mold package 860 includes a plurality of signal terminals 811, a plurality of ground terminals 812 surrounding the plurality of signal terminals 811, and a die pad 810. The mold package 860 includes a ferrite substrate 820 having a signal pattern 821 and provided on the die pad 810, and a wire 830 for electrically connecting the signal terminal 811 and the signal pattern 821. The mold package 860 includes a mold resin 840 covering the die pad 810, the ferrite substrate 820, and the wires 830, and a conductor film 861 covering the surface of the mold resin 840. The mold resin 840 is provided so that the plurality of signal terminals 811, the plurality of ground terminals 812, and the die pad 810 are exposed.

The resin substrate 880 includes a ground via 881, a signal via 882, and a signal pattern 883. The signal terminal 811, the signal via 882, and the signal pattern 883 are electrically connected. The ground terminal 812 and the ground via 881 are electrically connected.

相違 The antenna 500-1 shown in FIG. 7 is different from the antenna 500 shown in FIG. 2 in that the antenna 500-1 includes a microwave module 200-1 instead of the microwave module 200.

The microwave module 200-1 includes the antenna substrate 450 and the multilayer resin substrate 110. The antenna substrate 450 and the multilayer resin substrate 110 are arranged in the order of the antenna substrate 450 and the multilayer resin substrate 110 in the Y-axis direction. The antenna substrate 450 is disposed on the other end surface 110b side of the multilayer resin substrate 110 in the Y-axis direction.

複数 A plurality of microwave devices 100-1, a control IC 120, and a chip component 130 are provided on one end surface 110a in the Y-axis direction of the multilayer resin substrate 110. A plurality of circulators 800 and a control IC 410 are surface-mounted on the other end surface 110b in the Y-axis direction of the multilayer resin substrate 110. The shield structure is formed by electrically connecting the ground of the circulator 800 and the ground surface on the other end surface 110b of the multilayer resin substrate 110.

複数 A plurality of antenna elements 210 are provided on the surface of the antenna substrate 450 opposite to the side on which the multilayer resin substrate 110 is arranged. The plurality of antenna elements 210 provided on the antenna substrate 450 are electrically connected to the RF connector 470. The multilayer resin substrate 110 and the antenna substrate 450 are fixed together by screws or the like.

The multilayer resin substrate 110 is provided with an RF transmission line 122 as an inner layer signal line and an RF transmission line 123 as an inner layer signal line. The circulator 800 is connected to the RF connector 470 via the RF transmission line 122. The circulator 800 is connected to the microwave device 100-1 via the RF transmission line 123. The microwave device 100-1 is connected to the RF / power / control connector 170 similarly to the microwave device 100. Since the multilayer resin substrate 110 and the control substrate 160 are connected to each other by the RF / power / control connector 170, the plurality of antenna elements 210 provided on the antenna substrate 450 connect the microwave device 100-1 to the microwave device 100-1. Through this, it is connected to the transceiver 600.

As described above, in the antennas 500 and 500-1 shown in FIGS. 2 and 7, since the heat sink 140, the microwave modules 200 and 200-1 and the antenna element 210 are arranged in layers, the antennas 500 and 500-1 are arranged in layers. The thickness of the antenna 500-1 in the Y-axis direction can be reduced, and a small and lightweight antenna can be realized.

In the microwave device 100 according to the embodiment, the

ICs

4 and 6, the

heat spreaders

5 and 7, the conductive film 2 and the heat sink 140 are thermally connected, and the cross-sectional area of the heat spreader 5 in the X-axis direction is the X-axis of the IC 4. The cross-sectional area of the heat spreader 7 in the X-axis direction is equal to or larger than the cross-sectional area of the IC 6 in the X-axis direction. In the semiconductor package disclosed in Patent Document 1, the cross-sectional area of the back-side penetrating electrode provided on the back-side cap portion is smaller than the surface area of the back-side electrode provided on the semiconductor chip. The radiation cannot be effectively emitted to the outside of the semiconductor package. On the other hand, in the microwave device 100 according to the embodiment, since the

heat spreaders

5 and 7 having a large cross-sectional area are used, the thermal resistance between the

ICs

4 and 6 and the heat sink 140 is reduced, and the

ICs

4 and 6 are reduced. Can effectively be transmitted to the heat sink 140.

Further, in the microwave device 100, a plurality of microwave devices 100 are caused by a height variation of the microwave device 100, a warp of the multilayer resin substrate 110, a height variation of a bonding layer between the microwave device 100 and the multilayer resin substrate 110, and the like. Even when the respective conductive films 2 have different heights in the Y-axis direction, the thermal connection between the conductive film 2 and the heat dissipation sheet 150 can be ensured by the heat dissipation sheet 150 having elasticity.

Also, since the molding method of the mold resin 50 is a conventionally adopted method, the microwave device 100 can be manufactured at low cost. Further, in the embodiment, since the periphery of the

ICs

4 and 6 and the

heat spreaders

5 and 7 are solidified with a resin material, even when the microwave device 100 is fixed by being pressed against the heat dissipation sheet 150, the conductive film 2 is formed. Since the pressure applied to the

ICs

4 and 6 via the

IC

4 and 6 is also dispersed in the mold resin 50, the mechanical stress applied to the terminals provided on the

ICs

4 and 6 is reduced. Therefore, even when the microwave device 100 is fixed so as to be pressed against the heat radiating sheet 150 in order to reduce the thermal resistance between the

ICs

4 and 6 and the heat radiating sheet 150, the connection between the multilayer resin substrate 1 and the

ICs

4 and 6 is prevented. A decrease in mechanical connection strength is suppressed, and a decrease in the life of the microwave device 100 is suppressed.

In the microwave device 100 according to the embodiment, the periphery of the mold resin 50 and the

heat spreaders

5 and 7 is covered with the conductive film 2, and the ground via hole 11 of the multilayer resin substrate 1 is electrically connected to the conductive film 2. Furthermore,

signal terminals

84 and 85 having a coaxial structure are connected to signal

terminals

115 and 121 having a coaxial structure formed on the multilayer resin substrate 110, respectively. Therefore, the electromagnetic waves radiated from the

ICs

4 and 6 are confined inside the microwave device 100. Therefore, it is not necessary to cover the entire multilayer resin substrate 110 with a shield, and the structure can be simplified.

(4) When a plurality of

ICs

4 and 6 are stored in the microwave device 100 as in the embodiment, the size of the microwave device 100 is about 10 [mm] square. Here, when the

heat spreaders

5 and 7 are not provided in the package covered with the conductive material, the resonance frequency decreases to near the X band (10 GHz band). As a specific example, when the mold dimension is 10 [mm] × 10 [mm] × 1 [mm], the entire outer periphery of the mold resin is covered with a conductor, and when the dielectric constant of the mold material is 3.5, the minimum value is obtained. The next resonance frequency is 11.33 [GHz]. In the embodiment, since the inside of the package is short-circuited by the

conductive heat spreaders

5 and 7 at the ground potential, the resonance frequency can be set sufficiently higher than the operating frequency, and the RF signal inside the microwave device 100 can be set. Oscillation due to coupling can be suppressed.

Also, the loss between the microwave device 100 and the antenna element 210 needs to be minimized, but a certain loss is allowed between the microwave device 100 and the transceiver 600. For this reason, at the time of manufacturing the antenna 500, the RF line is routed inside the multilayer resin substrate 110 and wired, and the RF / power / control connector 170 is assembled at a position where the influence on the heat radiation performance is small. Can be penetrated. This makes it possible to design the heat radiating plate 140 with emphasis on the heat radiating performance of the

heat spreaders

5 and 7. Further, depending on the specifications of the antenna 500, the number of RF connectors penetrating through the heat radiating plate 140 can be reduced by distributing and synthesizing the transmission path of the RF signal in the multilayer resin substrate 110.

In the microwave device 100 according to the embodiment, a power source requiring a large current capacity such as a drain power source of the microwave device 100 is transmitted from the control board 160 or the external power board to the multilayer resin board 110 via the leaf spring 190 and the bus bar 142. can do. On the other hand, a power supply having a small current capacity, which can be handled by the current capacity of one terminal of a general board-to-board connection connector, uses a single terminal provided in the RF / power / control connector 170 to control the control board. 160 to the multilayer resin substrate 110. Therefore, in the RF / power / control connector 170, power can be transmitted to the multilayer resin substrate 110 with a small number of terminals.

For example, a power supply multi-core connector is used in addition to the RF / power / control connector 170, and one power supply multi-core connector and the RF / power / control connector 170 are connected between the multilayer resin substrate 110 and the control substrate 160, respectively. And electrical connection between the two substrates is also possible. However, in this case, if a plurality of pin connection type power supply multi-core connectors for passing large power are used, a plurality of pins and a housing space for casing the insulator and a connector case are required, and the multilayer resin substrate 110 The mounting space for the power supply multi-core connector between the control board 160 and the control board 160 is increased.

On the other hand, however, in the antenna 500 according to the embodiment, the multi-core power supply connector for supplying a large amount of power can be configured by a surface-mount type terminal connection using the bus bar 142 and the leaf spring 190. In addition, the mounting space for the components for supplying large power can be reduced.

This makes it possible to reduce the size of the RF / power / control connector 170. By reducing the size of the RF / power / control connector 170, the degree of freedom in mounting the RF / power / control connector 170 on the control board 160 and the multilayer resin substrate 110 is suppressed, and the RF / power / control connector 170 is suppressed. It is possible to suppress a reduction in the component mounting area in the control board 160 and the multilayer resin board 110 due to the increase in the size of the component. Accordingly, the antenna 500 is prevented from being enlarged due to the enlargement of the control board 160 and the multilayer resin substrate 110, and the antenna 500 can be downsized. The effect of reducing the number of terminals can be obtained even when a plurality of power transmission terminals are provided in the RF / power / control connector 170. Similar effects can be obtained in the microwave device 100-1.

Also, since the bus bar 142 and the leaf spring 190 can be surface-mounted using a solder reflow process, the assembling and mounting operations of the power supply multi-core connector can be reduced.

コネクタ Further, the connector portion including the bus bar 142 and the leaf spring 190 and the RF / power / control connector 170 need to be connected to a connector portion provided in the plane of the multilayer resin substrate 110 and the control substrate 160. For example, when the RF / power / control connector 170 and the power supply multi-core connector are mounted between the multilayer resin substrate 110 and the control board 160, each of the RF / power / control connector 170 and the power supply multi-core connector Cannot be connected unless it is accurately aligned with a connector provided in the plane of the multilayer resin board 110 and the plane of the control board 160.

On the other hand, when the connector portion including the bus bar 142 and the leaf spring 190 and the RF / power / control connector 170 are used, the RF / power / control connector 170 is located at a predetermined position between the multilayer resin substrate 110 and the control substrate 160. Must be precisely aligned. However, the positioning accuracy of the connector portion including the bus bar 142 and the leaf spring 190 with respect to the in-plane of the multilayer resin substrate 110 and the in-plane of the control substrate 160 is different from that of the power supply multi-core connector in the in-plane of the multilayer resin substrate 110. The accuracy of the alignment with respect to the connector provided in the plane between the control circuit board 160 and the control board 160 is extremely low, so that the electrical connection between the multilayer resin board 110 and the control board 160 can be easily performed.

Therefore, with the antennas 500 and 500-1 according to the embodiment, it is possible to reduce the height and size of the antenna.

In the embodiment, a CIR or a switch is used for the transmission / reception switching circuit on the antenna side. However, since the antenna element 210 is provided on the back surface of the multilayer resin substrate 110 provided with the CIR or the switch, the antenna The body-shaped microwave module 200 can be realized, and the number of parts can be reduced.

In the microwave device 100-1 shown in FIG. 5, since only the transistors are mounted on the high-cost semiconductor substrate 320, the chip area is minimized. Further, since the matching circuit is formed on the low-cost semiconductor substrate 310, the cost of the microwave device 100-1 is reduced as compared with the IC 6 of FIG. 1 in which the transistor matching circuit is monolithically manufactured on the high-cost semiconductor substrate 320. it can.

In the antenna 500-1 shown in FIG. 7, the circulator 800 is used outside the microwave device 100-1. The circulator 800 is provided on the other end surface 110b of the multilayer resin substrate 110 in the Y-axis direction, that is, on the surface of the multilayer resin substrate 110 on the antenna element 210 side. Thus, a change in the characteristics of the IC 4 due to a change in the load impedance on the antenna surface can be reduced.

Further, in antenna 500-1 shown in FIG. 7, since circulator 800 has a shield structure by being mounted on multilayer resin substrate 110, a shield structure is provided between multilayer resin substrate 110 and antenna substrate 450. There is no need to provide it separately. Also, by mounting the circulator 800 and the control IC 410 on the same surface as the microwave device 100-1, the antenna substrate 450 can be omitted as in the antenna 500.

In the antenna 500-1 shown in FIG. 7, since the heat radiating plate 140 is disposed on the side opposite to the antenna element 210 side of the multilayer resin substrate 110, the heat radiating plate is disposed between the multilayer resin substrate 110 and the antenna substrate 450. As compared with the case where the 140 is arranged, restrictions on arranging the RF wiring and the RF / power / control connector 170 are reduced, and the cooling performance is improved.

The configurations described in the above embodiments are merely examples of the contents of the present invention, and can be combined with other known technologies, and can be combined with other known technologies without departing from the gist of the present invention. Parts can be omitted or changed.

1,110 {multilayer resin substrate, 1a} first plate surface, 1b {second plate surface, 2} conductive film, 2a inner surface, 3} space, 4,6 IC, 4a, 5a, 6a, 7a, 110a, 141a {one end surface , 4b, 5b, 6b, 7b, 110b, 141b {other end surface, 5, 7, 7A} heat spreader, 8, 130} chip component, 11 {ground via hole, 12, 13} signal via hole, 14, 19 {ground pattern, 15} signal line, 16, 17, 18 pad, 20, 21 signal input / output terminal, 30, 330 fine bonding material, 41, 42, 61, 62, 311, 312 input / output terminal, 50 molding resin, 84, 85, 115, 121 signal terminal, 100, 100-1 {microwave device, 116, 117, 122, 123} RF transmission line, 118} inner layer 119 119 inner conductor, 120 control IC, 140 heat sink, 141 support, 142 bus bar, 143 slit, 150 heat sink, 160 control board, 170 RF / power / control connector, 190 leaf spring, 200, 200-1 micro Wave module, 210 antenna element, 310 low cost semiconductor substrate, 310a, 320a signal pad, 313, 314 surface pattern, 315, 316 through hole, 320 high cost semiconductor substrate, 410 control IC, 450 antenna substrate, 470 RF connector, 500 , 500-1 antenna, 600 transceiver, 700 distribution circuit, 800 circulator, 810 die pad, 811 signal terminal, 812 ground terminal, 820 ferrite substrate, 821 signal pattern 830 wire, 840 a molding resin, 850 permanent magnet, 860 molded package, 861 conductive film, 880 a resin substrate, 881 ground via, 882 signal via, 883 signal pattern.

Claims

Support material,
A control board provided on the first surface side of the support member;
A first multilayer resin substrate provided on a second surface side of the support member opposite to the first surface of the support member and electrically connected to the control substrate via a connector; ,
A plurality of microwave devices provided on the first surface of the first multilayer resin substrate on the support material side and electrically connected to the first multilayer resin substrate;
The first multilayer resin substrate is provided on a second surface side of the first multilayer resin substrate, which is a surface opposite to the first surface, and is electrically connected to the first multilayer resin substrate. A plurality of antenna elements,
A bus bar provided on a surface of the support member on the first multilayer resin substrate side;
The first multilayer resin board is provided between the first multilayer resin board and the bus bar in contact with the first multilayer resin board and the bus bar, and is electrically connected to the first multilayer resin board and the bus bar. A conductive leaf spring,
Having,
Antenna.
The microwave device is connected to a transceiver integrated with or separately provided from the control board via the first multilayer resin board, the connector, and the control board,
The antenna according to claim 1, wherein:
An antenna substrate having the plurality of antenna elements,
The plurality of antenna elements are connected to the transceiver via the microwave device,
The antenna according to claim 2, wherein:
The microwave device,
A second multilayer resin substrate;
A circuit device provided on the second multilayer resin substrate and electrically connected to the second multilayer resin substrate;
A heat spreader provided on the surface of the circuit device opposite to the surface facing the second multilayer resin substrate and in contact with the circuit device;
A resin covering around the circuit device and the heat spreader;
A conductive film covering the resin and the heat spreader,
With
The inside of the conductive film is in contact with the heat spreader, and the conductive film is electrically connected to a ground via hole of the second multilayer resin substrate;
The antenna according to any one of claims 1 to 3, wherein:
A heat radiation sheet provided in opposition to the second multilayer resin substrate and in contact with the conductive film;
The antenna according to claim 4, wherein:
The elastic modulus of the heat dissipation sheet is smaller than the elastic modulus of the microwave device,
The antenna according to claim 5, wherein:
A heat radiating plate is provided on a side of the heat radiating sheet opposite to a side facing the microwave device, and includes a heat radiating plate in contact with the heat radiating sheet,
The support member has a slit portion into which the heat sink is fitted,
The antenna according to claim 5 or 6, wherein:
The circuit device is a high-frequency circuit,
The antenna according to any one of claims 4 to 7, characterized in that:
The circuit device includes:
A first semiconductor substrate provided on the second multilayer resin substrate and electrically connected to the second multilayer resin substrate;
A second semiconductor substrate provided on a side of the first semiconductor substrate opposite to a side facing the second multilayer resin substrate and electrically connected to the first semiconductor substrate;
The heat spreader is provided on a side of the second semiconductor substrate opposite to a side facing the first semiconductor substrate, and is in contact with the second semiconductor substrate,
The resin covers the first semiconductor substrate, the second semiconductor substrate, and the periphery of the heat spreader;
The antenna according to any one of claims 4 to 8, wherein:
A transistor formed of gallium nitride is provided on the second semiconductor substrate;
The antenna according to claim 9, wherein:
A circuit formed of gallium arsenide is provided on the first semiconductor substrate;
The antenna according to claim 9, wherein: