GB2598674A - Array antenna device - Google Patents

Array antenna device Download PDF

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Publication number
GB2598674A
GB2598674A GB2115467.9A GB202115467A GB2598674A GB 2598674 A GB2598674 A GB 2598674A GB 202115467 A GB202115467 A GB 202115467A GB 2598674 A GB2598674 A GB 2598674A
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GB
United Kingdom
Prior art keywords
carrier
primary surface
antenna unit
groove
array antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB2115467.9A
Other versions
GB202115467D0 (en
GB2598674B (en
Inventor
uematsu Hiroyuki
Nishimura Toshio
Shiode Takeshi
Nakazato Takeshi
Nagamine Takumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB202115467D0 publication Critical patent/GB202115467D0/en
Publication of GB2598674A publication Critical patent/GB2598674A/en
Application granted granted Critical
Publication of GB2598674B publication Critical patent/GB2598674B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
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    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
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Abstract

Provided is an array antenna device having improved antenna performance. The array antenna device (1) is provided with a carrier (6), a bonding member (7), a first antenna unit (2a), and a second antenna unit (2b). The first antenna unit (2a) and the second antenna unit (2b) are bonded to the carrier (6) by means of the bonding member (7). The carrier (6) has a groove (8) extending from a first major surface (6s) toward a second major surface (6u). In a plan view of the carrier (6), the groove (8) is disposed in correspondence to a gap (10g) between the first antenna unit (2a) and the second antenna unit (2b).

Description

DESCRIPTION
TITLE OF INVENTION
Array Antenna Apparatus
TECHNICAL FIELD
[0001] The present disclosure relates to an array antenna apparatus.
[0002] BACKGROUND ART
[0003] Japanese Patent Laying-Open No. 2001-7628 (PTL 1) discloses a phased array antenna which includes multiple modules and a substrate. The modules each include multiple radiating elements The modules are secured to the substrate with an adhesive.
CITATION LIST
PATENT LITERATURE
PTL 1: Japanese Patent Laying-Open No, 2001-7628
SUMMARY OF INVENTION
TECHNICAL PROBLEM
[0004] However, for the array antenna disclosed in PTL 1, when securing the modules to the substrate with an adhesive, the adhesive may travel up through the gaps between the modules and adheres to the surfaces of the radiating elements. The adhesion of the adhesive to the surfaces of the radiating elements degrades the performance of the array antenna. For example, if the adhesive is an electrically conductive joint member, such as a solder, the radiating elements are electrically shorted together via the electrically conductive joint member, causing the array antenna to be not functional. If the adhesive is an insulating adhesive, the adhesion of the insulating adhesive to the surfaces of the radiating elements increases the dielectric loss of the array antenna increases, reducing the output power of the array antenna. The present disclosure is made in view of the problem above, and an object of the present disclosure is to provide an array antenna apparatus having an improved antenna performance. SOLUTION TO PROBLEM [0005] An array antenna apparatus according to the present disclosure includes a carrier, a joint member, a first antenna unit, and a second antenna unit. The carrier has a first primary surface and a second primary surface opposite to the first primary surface. The joint member includes a first joint and a second joint. The first antenna unit is joined to the first primary surface of the carrier with the first joint. The second antenna unit is joined to the first primary surface of the carrier with the second joint, the second antenna unit being arranged with a gap from the first antenna unit. The second antenna unit is arranged with a gap from the first antenna unit. The first antenna unit and the second antenna unit each include a wiring board located closer to the carrier and a dielectric substrate located farther away from the carrier. The wiring board has a third primary surface facing the carrier, and a fourth primary surface which is opposite to the third primary surface and facing the dielectric substrate. The wiring board includes a feeding patch antenna element disposed on the fourth primary surface. The dielectric substrate includes a non-feeding patch antenna element disposed to correspond to the feeding patch antenna element. A groove is formed in the carrier, the groove extending from the first primary surface toward the second primary surface. In plan view of the first primary surface, the groove is disposed to correspond to the gap between the first antenna unit and the second antenna unit. A slit is formed between the first antenna unit and the second antenna unit, the slit extending from a first top surface of the feeding patch antenna element to a bottom surface of the groove.
ADVANTAGEOUS EFFECTS OF INVENTION
[0006] When securing a wiring board to a carrier with a joint member, the joint member enters into grooves. The grooves prevent the joint member from traveling up through the gap between the first antenna unit and the second antenna unit and adhering to the surface of the non-feeding patch antenna element. Thus, the array antenna apparatus according to the present disclosure has an improved antenna performance. BRIEF DESCRIPTION OF DRAWINGS [0007] Fig. I is a schematic plan view of an array antenna apparatus according to Embodiment 1.
Fig. 2 is a schematic cross sectional view of the array antenna apparatus according to Embodiment 1, taken along a section line of Fig. 1.
Fig. 3 is an enlarged schematic partial cross-sectional view of a region III of Fig. 2 of the array antenna apparatus according to Embodiment 1.
Fig. 4A is an enlarged schematic partial cross-sectional view of a variation of a groove formed in a carrier included in the array antenna apparatus according to Embodiment 1 Fig. 4B is an enlarged schematic partial cross-sectional view of a variation of the groove formed in the carrier included in the array antenna apparatus according to Embodiment 1 Fig. 4C is an enlarged schematic partial cross-sectional view of a variation of the groove formed in the carrier included in the array antenna apparatus according to Embodiment 1.
Fig. 4D is an enlarged schematic partial cross-sectional view of a variation of the groove formed in the carrier included in the array antenna apparatus according to Embodiment 1 Fig. 4E is an enlarged schematic partial cross-sectional view of a variation of the groove formed in the carrier included in the array antenna apparatus according to Embodiment 1.
Fig. 4F is an enlarged schematic partial cross-sectional view of a variation of the groove formed in the carrier included in the array antenna apparatus according to Embodiment 1.
Fig. 5 is an enlarged schematic partial cross-sectional view of an array antenna apparatus according to Comparative Example 1.
Fig. 6 is an enlarged schematic partial cross-sectional view of an array antenna apparatus according to Example 1 of Embodiment 1.
Fig. 7 is an enlarged schematic partial cross-sectional view of an array antenna apparatus according to Comparative Example 2.
Fig. 8 is an enlarged schematic partial cross-sectional view of an array antenna apparatus according to Example 2 of Embodiment 1.
Fig. 9 is a graph representing the depth of a slit versus the gain of the array antenna apparatus.
Fig. 10 is a schematic plan view showing a step included in a method for fabricating the array antenna apparatus according to Embodiment 1.
Fig. 11 is a schematic cross sectional view taken along a section line XI-XI of Fig. 10 in the step of Fig. 10 included in the method for fabricating the array antenna apparatus according to Embodiment 1 Fig. 12 is a schematic plan view showing a step subsequent to the step of Fig. 10 included in the method for fabricating the array antenna apparatus according to Embodiment 1.
Fig. 13 is a schematic cross sectional view taken along a section line in the step of Fig. 12 included in the method for fabricating the array antenna apparatus according to Embodiment 1.
Fig. 14 is a schematic plan view showing a step subsequent to the step of Fig. 12 included in the method for fabricating the array antenna apparatus according to Embodiment 1.
Fig. 15 is a schematic cross sectional view taken along a section line XV-XV of in the step of Fig. 14 included in the method for fabricating the array antenna apparatus according to Embodiment 1.
Fig. 16 is a schematic plan view showing a step subsequent to the step of Fig. 14 included in the method for fabricating the array antenna apparatus according to Embodiment 1.
Fig. 17 is a schematic cross sectional view taken along a section line XVII-XVII in the step of Fig. 16 included in the method for fabricating the array antenna apparatus according to Embodiment I. Fig. 18 is a schematic plan view showing a step subsequent to the step of Fig. 16 included in the method for fabricating the array antenna apparatus according to Embodiment I. Fig. 19 is a schematic cross sectional view taken along a section line XDC-XIX in the step of Fig. 18 included in the method for fabricating the array antenna apparatus according to Embodiment 1.
Fig. 20 is an enlarged schematic partial cross-sectional view of the array antenna apparatus according to a variation of Embodiment 1.
Fig. 21 is a schematic plan view of an array antenna apparatus according to Embodiment 2.
Fig. 22 is a schematic cross sectional view of the array antenna apparatus according to Embodiment 2, taken along a section line XXII-XXII of Fig. 21.
Fig. 23 is an enlarged schematic partial cross-sectional view of a region XXIII of Fig. 22 of the array antenna apparatus according to Embodiment 2.
Fig. 24 is a schematic plan view of an array antenna apparatus according to Embodiment 3 Fig. 25 is a schematic cross sectional view of the array antenna apparatus according to Embodiment 3, taken along a section line XXV-XXV of Fig. 24.
Fig. 26 is a schematic plan view showing a step included in a method for fabricating the array antenna apparatus according to Embodiment 3.
Fig. 27 is a schematic cross sectional view of an array antenna apparatus according to Embodiments 4 Fig. 28 is a schematic plan view of a second primary surface of a carrier included in the array antenna apparatus according to Embodiments 4.
Fig. 29 is a schematic cross sectional view of the carrier included in the array antenna apparatus according to Embodiments 4, taken along a section line XXIXXXIX of Fig. 28.
Fig. 30 is a schematic plan view of a front surface of a housing included in the array antenna apparatus according to Embodiments 4.
Fig. 31 is a schematic cross sectional view of the housing included in the array antenna apparatus according to Embodiments 4, taken along a section line X)OCIXXXI of Fig. 30.
Fig. 32 is a schematic cross sectional view showing a step included in a method for fabricating the array antenna apparatus according to Embodiments 4.
Fig. 33 is a schematic cross sectional view showing a step subsequent to the step of Fig. 32 included in the method for fabricating the array antenna apparatus according to Embodiments 4.
Fig. 34 is a schematic cross sectional view showing a step subsequent to the step of Fig. 33 included in the method for fabricating the array antenna apparatus according to Embodiments 4.
Fig. 35 is a schematic plan view of one example of an array antenna apparatus which includes three or more antenna units.
DESCRIPTION OF EMBODIMENTS
[0008] Hereinafter, embodiments according to the present disclosure will be described. Note that like reference number refers to like configurations, and description thereof will not be repeated.
[0009] Embodiment 1 Referring to Figs. 1 to 4F, an array antenna apparatus 1 according to Embodiment 1 is now described. The array antenna apparatus 1 primarily includes a carrier 6, a joint member 7, a first antenna unit 2a, and a second antenna unit 2b. The array antenna apparatus 1 may further include a housing 5, external substrates 35, electronic parts 37, and electrical connection members 40.
[0010] The housing 5 has a front surface 5s. The front surface 5s of the housing 5 extends in a first direction (x direction) and a second direction (y direction) intersecting with the first direction. Particularly, the second direction is perpendicular to the first direction. For example, the housing 5 is formed of a metal having a high thermal conductivity, such as an aluminum alloy. The housing 5 is electrically grounded.
[0011] The carrier 6 has a first primary surface 6s and a second primary surface 6u opposite to the first primary surface 6s. The first primary surface Gs and the second primary surface 6u each extend in the first direction (x direction) and the second direction (y direction). The first primary surface Gs and the second primary surface 6u are apart from each other in a third direction (z direction) that is perpendicular to the first direction (x direction) and the second direction (y direction). The carrier 6 has a second primary surface 6u facing the front surface 5s of the housing 5. The carrier 6 is secured to the front surface 5s of the housing 5 with, for example, a secure member (not shown), such as screws. The carrier 6 may be more rigidly secured to the housing 5 with a secure member (not shown), such as screws, and an adhesive (not shown). The carrier 6 is electrically grounded.
[0012] The carrier 6 mitigates the thermal strain of the wiring boards 10, which is caused by a difference in coefficient of linear expansion between the housing 5 and the wiring boards 10. Preferably, the difference in coefficient of linear expansion between the carrier 6 and the wiring boards 10 is 3 x 10'(/ K) or less. The carrier 6 transfers to the housing 5 a heat generated at the first antenna unit 2a and the second antenna unit 2b. Thus, preferably, the carrier 6 is formed of a material having a high thermal conductivity, such as a copper (Cu), a copper-tungsten (Cu-W) alloy, or a copper-molybdenum (Cu-Nlo) alloy. For the rust resistance of the carrier 6, the surfaces (the first primary surface 6s and the second primary surface 6u, etc.) of the carrier 6 may be nickel plated or chrome plated.
[0013] The carrier 6 has a groove 8 extending from the first primary surface 6s toward the second primary surface 6u. The groove 8 is demarcated by a bottom surface 8b and side surfaces 8j, 8k. The side surface 8j of the groove 8 is located closer to the first antenna unit 2a and farther away from the second antenna unit 2b. The side surface 8k of the groove 8 is located closer to the second antenna unit 2b and farther away from the first antenna unit 2a. A width 8w of the groove 8 is defined as a minimum distance between the side surface 8j and the side surface 8k. The groove 8 is linearly disposed in plan view of the first primary surface 6s of the carrier 6, shown in Fig. 1.
[0014] The bottom surface 8b of the groove 8 is separated from the second primary surface 6u of the carrier 6. The bottom surface 8b of the groove 8 is, but not particularly limited to, a flat surface parallel to the first primary surface Gs of the carrier 6. If the bottom surface 8b of the groove 8 is a flat surface parallel to the first primary surface Gs of the carrier 6, the management of a depth 60d of a slit 60, described below, is facilitated, stabilizing the quality of the array antenna apparatus I. [0015] A depth 8d of the groove 8 is defined as a distance from the first primary surface Gs of the carrier 6 to the bottom surface 8b of the groove 8. A thickness 6t of a thinnest portion of the carrier 6 is defined as a distance from the bottom surface 8b of the groove 8 to the second primary surface 6u of the carrier 6. The thickness 6t of the thinnest portion of the carrier 6 is given by a difference between the thickness of the carrier 6 and the depth 8d of the groove 8. The thickness 6t of the thinnest portion of the carrier 6 is determined, as appropriate, depending on the mechanical strength requirement of the carrier 6 and the long-term reliability requirement of the array antenna apparatus 1, etc. The thickness 6t of the thinnest portion of the carrier 6 may be, but not particularly limited to, 1 mm or greater.
[0016] As shown in Figs. 2 and 3, the groove 8 has a rectangular cross-sectional shape.
The cross-sectional shape of the groove 8 is not limited to a rectangular shape, and may be the cross-sectional shape shown in any of Figs. 4A to 4F, for example. As shown in Figs. 4A and 4B, the groove 8 may have a trapezoidal cross-sectional shape. As shown in Fig. 4A, the side surfaces 8j, 8k of the groove 8 may be inclined with respect to the first primary surface 6s so that the closer to the first primary surface 6s of the carrier 6, the closer the side surfaces 8j, 8k are to each other. As shown in Fig. 4B, the side surfaces 8j, 8k of the groove 8 may be inclined with respect to the first primary surface 6s so that the closer to the first primary surface 6s of the carrier 6, the farther away the side surfaces 8j, 8k are from each other.
[0017] As shown in Figs. 4C and 4D, the corners between the first primary surface 6s of the carrier 6 and the side surfaces 8j, 8k of the groove 8 may be chamfered.
Specifically, as shown in Fig. 4C, the corners between the first primary surface 6s and the side surfaces 8j, 8k may be C-chamfered. As shown in Fig. 4D, the corners between the first primary surface Gs and the side surfaces 8j, 8k may be R-chamfered. As shown in Fig. 4E, the side surfaces 8j, 8k of the groove 8 may have a greater distance therebetween near the bottom surface 8b of the groove 8, and the bottom surface 8b of the groove 8 may have a wider width than the opening of the groove 8. As shown in Figs. 2, 3, and 4A to 4E, the groove 8 may have a symmetrical shape with respect to the centerline of the groove 8 in the width direction (the first direction (x direction)) of the groove 8. As shown in Fig. 4F, the groove 8 may have an asymmetrical shape with respect to the centerline of the groove 8 in the width direction of the groove 8.
[0018] As shown in Figs. Ito 3, the joint member 7 includes a first joint 7a and a second joint 7b. The joint member 7 may be separated from the bottom surface 8b of the groove 8 formed in the carrier 6. The first joint 7a may be separated from the second joint 7b in the groove 8. The joint member 7 may be an electrically conductive joint member, such as a solder, an electrically conductive resin adhesive, or an anisotropic conductive adhesive, or an insulating joint member, such as an insulating resin adhesive.
[0019] The joint member 7 can be in liquid form or solid form. In the fabrication process described below, the joint member 7 is required to have a viscosity to an extent that the joint member 7 can flexibly change its shape to a load. On the other hand, in order to avoid the joint member 7 from contacting an unintended location, the joint member 7 is required to have a viscosity to an extent that the joint member 7 does not easily flow due to the vibration caused during the fabrication process. In order to achieve both of them, desirably, the viscosity of the joint member 7 in liquid form is in a range of 5 Pa's or greater and 300 Pa's or less, and, more desirably, 10 Pa's or greater and 50 Pa's or less.
[0020] The first antenna unit 2a is joined to the first primary surface 6s of the carrier 6 with the first joint 7a. The second antenna unit 2b is joined to the first primary surface 6s of the carrier 6 with the second joint 7b. The second antenna unit 2b is disposed a gap 108 apart from the first antenna unit 2a. In plan view of the first primary surface 6s of the carrier 6, the groove 8 is disposed to correspond to the gap lOg between the first antenna unit 2a and the second antenna unit 2b. As shown in Fig. 3, the gap lOg has a width lOw narrower than the width 8w of the groove 8. The width lOw of the gap lOg may be wider than the width 8w of the groove 8, as with a variation of the present embodiment shown in Fig. 20. The width lOw of the gap lOg may be equal to the width 8w of the groove 8.
[0021] The second antenna unit 2b has the same configuration as the first antenna unit 2a. In the following, a configuration of the first antenna unit 2a is described. The first antenna unit 2a includes a wiring board 10 and a dielectric substrate 26. The wiring board 10 and the dielectric substrate 26 are stacked in the third direction (z direction). The wiring board 10 is disposed on a side proximal to the carrier 6 with respect to the dielectric substrate 26. The dielectric substrate 26 is disposed on a side distal from the carrier 6 with respect to the wiring board 10.
[0022] The wiring board 10 included in the first antenna unit 2a has a side surface 10j protruding toward the centerline of the groove 8 in the width direction (the first direction (x direction)) of the groove 8, as compared to the side surface 8j of the groove 8. The portion of the wiring board 10 included in the first antenna unit 2a, protruding from the side surface 8j of the groove 8, is an overhang 10m. For example, the overhang 10m has a length of 0.5 mm or less in the width direction of the groove 8. The wiring board 10 included in the second antenna unit 2b has a side surface 10k protruding toward the centerline of the groove 8 in the width direction of the groove 8, as compared to the side surface 8k of the groove 8. The portion of the wiring board included in the second antenna unit 2b, protruding from the side surface 8k of the groove 8, is an overhang 10n. For example, the overhang 10n has a length of 0.5 mm or less in the width direction of the groove 8. The overhangs 10m, 10n effectively prevent the joint member 7 from traveling up to the fourth primary surface lOs of the wiring board 10.
[0023] The side surface 10j of the wiring board 10 included in the first antenna unit 2a may be flush with the side surface 8j of the groove 8. The side surface 10k of the wiring board 10 included in the second antenna unit 2b may be flush with the side surface 8k of the groove 8. The side surface 10j of the wiring board 10 included in the -10 -first antenna unit 2a may have a greater distance to the center of the groove 8 in the width direction (the first direction (x direction)) of the groove 8, than the side surface 8j of the groove 8. The side surface 10k of the wiring board 10 included in the second antenna unit 2b may have a greater distance to the center of the groove 8 in the width direction of the groove 8, than the side surface 8k of the groove 8.
[0024] In plan view of the first primary surface 6s of the carrier 6, one side of the wiring board 10 may have a length of 30 mm or less. Thus, the thermal strain of the wiring board 10, caused by the difference in coefficient of thermal expansion between the wiring board 10 and the carrier 6, decreases, allowing the array antenna apparatus 1 to have an improved long-term reliability.
[0025] As shown in Figs. 2 and 3, the wiring board 10 includes a semiconductor substrate 11, a wiring layer 15 on the semiconductor substrate 11, a feeding patch antenna element 19, and a ground conductor layer 20. The wiring board 10 has a third primary surface 10h facing the first primary surface 6s of the carrier 6, and a fourth primary surface lOs opposite to the third primary surface 10h. The third primary surface 10h and the fourth primary surface lOs each extend in the first direction (x direction) and the second direction (y direction).
[0026] The semiconductor substrate 11 is disposed between the wiring layer 15 and the carrier 6. The semiconductor substrate 11 is located on a side proximal to the carrier 6 with respect to the wiring layer 15. The semiconductor substrate 11 is a circuit board manufactured by a general semiconductor wafer manufacturing process. For example, the semiconductor substrate 11 is formed of a semiconducting material, such as Si, SiGe, GaAs, InP, GaSb, SiC, or GaN, etc. [0027] The semiconductor substrate 11 includes an active circuit 13 and a control circuit 14. The active circuit 13 and the control circuit 14 are integrated on the semiconductor substrate 11. The active circuit 13 and the control circuit 14 are disposed on a surface of the semiconductor substrate 11 facing the wiring layer 15. For example, the active circuit 13 includes a high-frequency electrical element which transmits or receives electromagnetic waves, such as microwave and millimeter wave.
For example, the high-frequency electrical element may be a low noise amplifier, a high power amplifier, or a phase shifter. The active circuit 13 is connected to the feeding patch antenna element 19. The active circuit 13 can transmit or receive the electromagnetic waves via the feeding patch antenna element 19. The control circuit 14 controls the operation of the active circuit 13.
[0028] The wiring layer 15 is electrically connected to the active circuit 13 and the feeding patch antenna element 19. Specifically, the wiring layer 15 includes an insulating layer 16 and conductive vias 18. The conductive vias 18 are provided inside the insulating layer 16. The conductive via 18 is connected to the active circuit 13 and the feeding patch antenna element 19. For example, the conductive via 18 is formed of a metallic material that has a low electric resistance, such as copper. For the rust resistance of the conductive via 18, the surface of the conductive via 18 may be nickel plated and gold plated.
[0029] Preferably, the insulating layer 16 is formed of a material having a small dielectric loss tangent (tan6). The insulating layer 16 may be formed of a material having a dielectric loss tangent (tan5) of 0.005 or less at an electromagnetic wave frequency of 1 GHz, or formed of a material having a dielectric loss tangent of 0.003 or less at an electromagnetic wave frequency of 1 GHz. Preferably, the insulating layer 16 is formed of a material having excellent heat resistance and excellent electrically insulation. The insulating layer 16 may be formed of, but not particularly limited to, a thermoplastic polyimide resin or a thermosetting polyimide resin. The insulating layer 16 may have a thickness of, but not particularly limited to, 3 Jim or greater and 15 pm or less.
[0030] The wiring layer 15 further includes conductors 17. The conductors 17 are disposed inside the insulating layer 16. One end of each conductor 17 is connected to a connection terminal 30. The other end of the conductor 17 is connected to the active circuit 13 or the control circuit 14. The conductor 17 has a thickness of 5 p.m or greater and 30 ji or less, for example. The conductor 17 has a width that depends on an amount or a frequency etc. of a current flowing through the conductor 17. The -12 -width of the conductor 17 is, but not particularly limited to, 51,1m or greater and 500 i_tm or less. For example, the conductor 17 is formed of a metallic material having a low electric resistance, such as copper. For the rust resistance of the conductor 17, the surface of the conductor 17 may be nickel plated and gold plated.
[0031] For example, the wiring layer 15 is formed by the following steps: The insulating layer 16 is formed on the semiconductor substrate 11. In one example, a spin coating is used to apply a liquid insulating resin onto the semiconductor substrate 11 to form insulating resin coating on the semiconductor substrate 11. Then, heat is applied to the insulating resin coating or ultraviolet rays are emitted to the insulating resin coating, to cure the insulating resin coating. In this way, the insulating layer 16 is formed. In another example, an insulating sheet is placed on the semiconductor substrate 11. Heat is applied to the insulating sheet or ultraviolet rays are emitted to the insulating sheet, to cure the insulating sheet. In this way, the insulating layer 16 is formed.
[0032] Then, pores are formed in the insulating layer 16 by a general patterning process, such as etching. The pores are filled with a conductive material, such as copper, thereby forming the conductors 17 and the conductive vias 18. In this way, the wiring layer 15 is obtained.
[0033] For example, the wiring board 10 may include connection terminals 30 formed of a conductive material, such as copper or gold. As shown in Fig. 1, in plan view of the first primary surface Gs of the carrier 6, the connection terminals 30 are arranged along one side of the wiring board 10 facing the external substrate 35. The connection terminals 30 are disposed on the fourth primary surface lOs exposed from the dielectric substrate 26. The fourth primary surface lOs of the wiring board 10 is the surface of the insulating layer 16 located farther away from the carrier 6 (or the semiconductor substrate 11).
[0034] The feeding patch antenna element 19 is disposed on the fourth primary surface lOs of the wiring board 10 facing the dielectric substrate 26. As shown in Figs. 2 and 3, the wiring board 10 may include multiple feeding patch antenna elements 19, and the -13 -feeding patch antenna elements 19 may be disposed in a two-dimensional array on the fourth primary surface lOs of the wiring board 10. The feeding patch antenna elements 19 may also be disposed in a one-dimensional array on the fourth primary surface lOs of the wiring board 10. In plan view of the first primary surface 6s of the carrier 6, the feeding patch antenna elements 19 included in the first antenna unit 2a and the feeding patch antenna elements 19 included in the second antenna unit 2b are arranged, evenly spaced from one another.
[0035] The feeding patch antenna element 19 has a first top surface 19t located farther away from the carrier 6. The feeding patch antenna element 19 is connected to the active circuit 13 via the conductive via 18. The feeding patch antenna element 19 is formed of, but not particularly limited to, a conductive material, such as copper or gold. [0036] The ground conductor layer 20 is disposed on the fourth primary surface lOs of the wiring board 10. The ground conductor layer 20 is separated from the feeding patch antenna element 19, and electrically insulated from the feeding patch antenna element 19. In plan view of the fourth primary surface lOs (or the first primary surface 6s), the ground conductor layer 20 may surround the feeding patch antenna element 19. The ground conductor layer 20 may be disposed on the outermost side of the fourth primary surface lOs of the wiring board 10. The ground conductor layer 20 is formed of, but not particularly limited to, a conductive material, such as copper or gold. The ground conductor layer 20 blocks noise of the electromagnetic wave generated at the active circuit 13, and suppresses the noise from coupling to the feeding patch antenna element 19 or the non-feeding patch antenna element 29.
[0037] The ground conductor layer 20 has a second top surface 20t located farther away from the carrier 6. The second top surface 20t of the ground conductor layer 20 is substantially flush with the first top surface 19t of the feeding patch antenna element 19. As used herein, the second top surface 20t of the ground conductor layer 20 being substantially flush with the first top surface 19t of the feeding patch antenna element 19 means that the displacement in the third direction (z direction) between the second top surface 20t of the ground conductor layer 20 and the first top surface 19t of the feeding -14 -patch antenna element 19 is 5 pm or less. The displacement in the third direction (z direction) between the second top surface 20t of the ground conductor layer 20 and the first top surface 19t of the feeding patch antenna element 19 may be 3 pm or less, 2 pm or less, or 1 [lin or less. Preferably, the second top surface 20t of the ground conductor layer 20 is flush with the first top surface 19t of the feeding patch antenna element 19. In other words, preferably, the displacement in the third direction (z direction) between the second top surface 20t of the ground conductor layer 20 and the first top surface 19t of the feeding patch antenna element 19 is 0 pm.
[0038] The dielectric substrate 26 is mounted on the fourth primary surface lOs of the wiring board 10 via the adhesive layer 22. The dielectric substrate 26 includes a dielectric substrate 27 and a non-feeding patch antenna element 29 which is disposed to correspond to the feeding patch antenna element 19.
[0039] The dielectric substrate 27 has a fifth primary surface 27r facing the fourth primary surface lOs of the wiring board 10, and a sixth primary surface 27s opposite to the fifth primary surface 27r. The fifth primary surface 27r and the sixth primary surface 27s each extend in the first direction (x direction) and the second direction (y direction). For example, the dielectric substrate 27 may be a high-frequency printed circuit board, a liquid crystal polymer substrate, or a ceramic substrate, such as a low temperature co-fired ceramic (LTCC) substrate. The dielectric substrate 27 may be a fluoroplastic, high-frequency printed circuit board which has a low dielectric constant and a low dielectric loss, such as polytetrafluorethylene (PTFE). The dielectric substrate 27 having a low dielectric constant and a low dielectric loss can reduce the transmission delay and the transmission loss for high-frequency signals, such as microwave and millimeter wave.
[0040] For example, the adhesive layer 22 may be composed of a thermoplastic resin, like a fluoro thermoplastic resin, or a thermosetting resin. The adhesive layer 22 may be formed of a material which has a dielectric loss tangent (tan6) of 0.005 or less at an electromagnetic wave frequency of 1 GHz, or a material which has a dielectric loss tangent of 0.003 or less at an electromagnetic wave frequency of 1 GHz. Since the -15 -adhesive layer 22 is composed of the material having a dielectric loss tangent of 0.005 or less at the electromagnetic wave frequency of 1 GHz, the loss in the electromagnetic wave of the array antenna apparatus 1 decreases, and the radiant efficiency of the array antenna apparatus 1 can be improved.
[0041] The non-feeding patch antenna element 29 is disposed on the sixth primary surface 27s of the dielectric substrate 27. As shown in Figs. Ito 3, the dielectric substrate 26 may include multiple non-feeding patch antenna elements 29, and the non-feeding patch antenna elements 29 may be disposed in a two-dimensional array on the sixth primary surface 27s. The non-feeding patch antenna elements 29 may also be disposed in a one-dimensional array on the sixth primary surface 27s. In plan view of the first primary surface 6s of the carrier 6, the non-feeding patch antenna elements 29 included in the first antenna unit 2a and the non-feeding patch antenna elements 29 included in the second antenna unit 2b are arranged, evenly spaced from one another. [0042] The non-feeding patch antenna element 29 is electromagnetically coupled to a corresponding feeding patch antenna element 19 The non-feeding patch antenna element 29 is electromagnetically coupled to the active circuit 13 via the feeding patch antenna element 19 and the conductive via 18. The active circuit 13 can transmit or receive the electromagnetic wave via the feeding patch antenna element 19 and the non-feeding patch antenna element 29. The non-feeding patch antenna element 29 is formed of but no particularly limited to, a conductive material, such as copper or gold.
[0043] The external substrate 35 is placed on the front surface Ss of the housing 5. The external substrate 35 is separated from the wiring board 10. For example, the external substrate 35 is a printed circuit board. For example, the printed circuit board may be a high-frequency printed circuit board, a liquid crystal polymer substrate, or a ceramic substrate, such as a low temperature co-fired ceramic (LTCC) substrate. The printed circuit board may be a fluoroplastic, high-frequency printed circuit board which has a low dielectric constant and a low dielectric loss, such as polytetrafluorethylene (PTFE). The printed circuit board may be formed of a material having a dielectric loss tangent (tan8) of 0.005 or less at an electromagnetic wave frequency of 1 GHz, or a -16 -material having a dielectric loss tangent of 0.003 or less at an electromagnetic wave frequency of 1 GHz. The external substrate 35 having a low dielectric constant and a low dielectric loss can reduce the transmission delay and the transmission loss of high-frequency signals, such as microwave or millimeter wave.
[0044] The circuit 36 is formed of the surface of the external substrate 35 opposite to the housing 5. The circuit 36 is designed to transmit a power supply current, a high-frequency signal, and a digital control signal, etc. The circuit 36 is formed of a conductive material, such as copper, gold, or aluminum. The circuit 36 can be formed by a general subtractive or additive patterning. The electronic part 37 is mounted on the surface of the external substrate 35 opposite to the housing 5. For example, the electronic part 37 is a resistor, a capacitor, an inductor, a connector, or a semiconductor package, etc. The electronic part 37 is electrically connected to the circuit 36, using a solder, an electrically conductive adhesive, or a metal wire.
[0045] The electrical connection member 40 electrically connects the connection terminal 30 and the circuit 36. The electrical connection member 40 includes a conductor that is formed of a conductive material, such as gold, silver, copper, or nickel, etc. The electrical connection member 40 may further include an insulating substrate which supports this conductor. The electrical connection member 40 may be, but not particularly limited to, a flexible printed circuit, a wiring harness, a conductive ribbon, or a conductive wire.
[0046] The groove 8 is disposed to correspond to the gap lOg between the first antenna unit 2a and the second antenna unit 2b. Thus, the slit 60, extending from the first top surface 1 9t of the feeding patch antenna element 19 to the bottom surface 8b of the groove 8, is formed between the first antenna unit 2a and the second antenna unit 2b.
As shown in Fig. 3, the depth 60d of the slit 60 is defined as a distance from the first top surface 19t of the feeding patch antenna element 19 to the bottom surface 8b of the groove 8 in the third direction (z direction). The second top surface 20t of the ground conductor layer 20 is substantially flush with the first top surface 19t of the feeding patch antenna element 19. Thus, the depth 60d of the slit 60 is also the distance from -17 -the second top surface 20t of the ground conductor layer 20 to the bottom surface 8b of the groove 8 in the third direction (z direction).
[0047] The depth 60d of the slit 60 is given by the sum of the depth 8d of the groove 8, a thickness 10d of the wiring board 10, and a thickness 7d of the joint member 7. The depth 8d of the groove 8 is defined as a distance from the first primary surface 6s of the carrier 6 to the bottom surface 8b of the groove 8 in the third direction (z direction). The thickness 10d of the wiring board 10 is defined as a distance from the first top surface 19t of the feeding patch antenna element 19 to the third primary surface 10h of the wiring board 10. The thickness 7d of the joint member 7 is defined as an average distance from the third primary surface 10h of the wiring board 10 to the first primary surface 6s of the carrier 6.
[0048] The slit 60 has a minimum width less than the depth 60d of the slit 60. The minimum width of the slit 60 is defined as a smaller one of the width lOw of the gap lOg and the width 8w of the groove 8. The width lOw of the gap lOg between the first antenna unit 2a and the second antenna unit 2b is defined as an average distance between the side surface 10j of the wiring board 10 included in the first antenna unit 2a and the side surface 10k of the wiring board 10 included in the second antenna unit 2b. The width 8w of the groove 8 is defined as an average distance between the side surface Sj and the side surface Sk of the groove 8.
[0049] Note that the depth 60d of the slit 60, etc. can be measured by a contact type length measuring method using a vernier caliper or the like, or a length measuring method using an optical microscope and a micrometer. The thickness 7d of the joint member 7 is determined by: measuring, after the wiring board 10 is adhered to the carrier 6, the distance from the second primary surface 6u of the carrier 6 to the first top surface 19t of the feeding patch antenna element 19 included in the wiring board 10; and subtracting from this distance the thickness of the carrier 6 and the thickness 10d of the wiring board 10. The distance from the second primary surface Ou of the carrier 6 to the first top surface 19t of the feeding patch antenna element 19 included in the wiring board 10, the thickness of the carrier 6, and the thickness 10d of the wiring -18 -board 10 can be measured by a highly accurate length measuring means, such as a laser microscope.
[0050] As shown in Figs. 6 and 8, the depth 60d of the slit 60 is substantially an integer multiple of a half of the wavelength X of the electromagnetic wave transmitted or received by the feeding patch antenna element 19. As used herein, the depth 60d of the slit 60 being substantially an integer multiple of a half of the wavelength X, of the electromagnetic wave transmitted or received by the feeding patch antenna element 19 means that the depth 60d of the slit 60 is within a range of an integer multiple of a half of the wavelength X of the electromagnetic wave plus or minus one sixteenth of the wavelength X of the electromagnetic wave. Preferably, the depth 60d of the slit 60 is equal to an integer multiple of a half of the wavelength k of the electromagnetic wave transmitted or received by the feeding patch antenna element 19. For example, if the array antenna apparatus 1 transmits or receives an electromagnetic wave having a frequency of 50 GHz, the wavelength X of the electromagnetic wave is set to 6 mm, and the depth 60d of the slit 60 is set to an integer multiple of 3 mm.
[0051] Effects of the groove 8 formed in the carrier 6 of the array antenna apparatus 1 are now described. In plan view of the first primary surface Gs of the carrier 6, the groove 8 is disposed to correspond to the gap lOg between the first antenna unit 2a and the second antenna unit 2b. The joint member 7 used to join the wiring board 10 to the carrier 6 enters into the groove 8 during the joint process, due to a pressure applied to the wiring board 10 or the own weight of the wiring board 10. The groove 8 prevents the joint member 7 from traveling up through the gap 108 between the first antenna unit 2a and the second antenna unit 2b and adhering to the surface of the non-feeding patch antenna element 29.
[0052] If the joint member 7 is an electrically conductive joint member, the joint member 7 can prevent the non-feeding patch antenna element 29 of the first antenna unit 2a and the non-feeding patch antenna element 29 of the second antenna unit 2b from being electrically shorted. If the joint member 7 is an insulating joint member, the joint member 7 can prevent an increase in dielectric loss of the array antenna -19 -apparatus 1, caused by the joint member 7 adhering to the non-feeding patch antenna element 29. In this way, the antenna performance of the array antenna apparatus 1 can be improved.
[0053] Referring to Figs. 5 to 9, effects are now described which are obtained by setting the depth 60d of the slit 60 to substantially an integer multiple of a half of the wavelength I of the electromagnetic wave transmitted or received by the feeding patch antenna element 19 [0054] Consider an imaginary surface 10p which is flush with the second top surface 20t of the ground conductor layer 20 and located in the slit 60 (or the groove 8). Since the depth 60d of the slit 60 is defined as the distance from the first top surface 19t of the feeding patch antenna element 19 (or the second top surface 20t of the ground conductor layer 20) to the bottom surface 8b of the groove 8 in the third direction (z direction), the depth 60d of the slit 60 is equal to the distance from the imaginary surface 10p to the bottom surface 8b of the groove 8.
[0055] A portion of the electromagnetic wave transmitted or received by the array antenna apparatus 1 is incident from the imaginary surface 10p toward the bottom surface 8b of the groove 8, and reflects off the bottom surface 8b of the groove 8. The incident electromagnetic wave and the reflected electromagnetic wave interfere with each other, thereby generating an electromagnetic standing wave within the slit 60 between the bottom surface 8b of the groove 8 and the imaginary surface 10p. The bottom surface 8b of the groove 8 is a fixed end of the standing wave, and the standing wave nodes are located on the bottom surface 8b of the groove 8. The carrier 6 is electrically grounded, and the potential of the standing wave nodes is ground potential. In response to the depth 60d of the slit 60 and the wavelength X of the electromagnetic wave, the potential of the standing wave on the imaginary surface 10p changes as follows: [0056] As shown in Comparative Examples 1 and 2 of Figs. 5 and 7, if the depth 60d of the slit 60 is an odd multiple of a quarter of the wavelength 1 of the electromagnetic wave, the electromagnetic standing wave antinodes are located on the imaginary -20 -surface 10p. Rather than the electromagnetic standing wave nodes, which is the ground potential, the electromagnetic standing wave antinodes are located on the imaginary surface 10p. The potential of the electromagnetic standing wave on the imaginary surface 10p differs from the ground potential. The potential of the electromagnetic standing wave on the imaginary surface 10p between the ground conductor layer 20 of the first antenna unit 2a and the ground conductor layer 20 of the second antenna unit 2b differs from the ground potential of the ground conductor layer 20. Thus, even if the potential of the ground conductor layer 20 of the first antenna unit 2a is the ground potential, the potential of the ground conductor layer 20 of the second antenna unit 2b may be rendered not the ground potential due to the potential of the electromagnetic standing wave on the imaginary surface 10p which differs from the ground potential. The ground conductor layer 20 of the first antenna unit 2a and the ground conductor layer 20 of the second antenna unit 2b may have different potentials. [0057] If the ground conductor layer 20 of the first antenna unit 2a and the ground conductor layer 20 of the second antenna unit 2b have different potentials, the gain of the electromagnetic wave in the array antenna apparatus 1 decreases. The difference between the phase of the electromagnetic wave emitted by the feeding patch antenna element 19 included in the first antenna unit 2a and the phase of the electromagnetic wave emitted by the feeding patch antenna element 19 included in the second antenna unit 2b also deviates from the design value. Thus, the side lobe level of the array antenna apparatus 1 increases The antenna performance of the array antenna apparatus 1 decreases.
[0058] As used herein, the side robe means an electromagnetic wave that is emitted in directions other than the originally-intended directions. The side lobe level means a ratio of the strength of the electromagnetic wave emitted in the directions other than the originally-intended directions to the strength of the electromagnetic wave emitted in the originally-intended directions. The side lobe level is a directivity indicator for the electromagnetic wave emitted by the array antenna apparatus I. The smaller the side lobe level is, the higher the directionality of the electromagnetic wave and the higher -21 -the antenna performance of the array antenna apparatus 1.
[0059] In contrast, as in Examples I and 2 of the present embodiment shown in Figs. 6 and 8, if the depth 60d of the slit 60 is an integer multiple of a half of the wavelength of the electromagnetic wave emitted, the electromagnetic standing wave nodes are located on the imaginary surface 10p. Similar to the bottom surface 8b of the groove 8, the electromagnetic standing wave nodes, which is the ground potential, is located on the imaginary surface 10p. Thus, the potential of the electromagnetic standing wave on the imaginary surface 10p is equal to the ground potential, which is the potential of the electromagnetic standing wave on the bottom surface 8b of the groove 8. The potential of the standing wave on the imaginary surface 10p between the ground conductor layer 20 of the first antenna unit 2a and the ground conductor layer 20 of the second antenna unit 2b is equal to the ground potential of the ground conductor layer 20. The ground conductor layer 20 of the first antenna unit 2a electromagnetically couples to the ground conductor layer 20 of the second antenna unit 2b at the same ground potential. The ground conductor layer 20 of the first antenna unit 2a and the ground conductor layer 20 of the second antenna unit 2b both have the ground potential [0060] Since the ground conductor layer 20 of the first antenna unit 2a and the ground conductor layer 20 of the second antenna unit 2b have an equal ground potential, the gain of the electromagnetic wave in the array antenna apparatus 1 is maximized (see Fig. 9). Since the difference between the phase of the electromagnetic wave emitted by the feeding patch antenna element 19 included in the first antenna unit 2a and the phase of the electromagnetic wave emitted by the feeding patch antenna element 19 included in the second antenna unit 2b comes to the design value, the side lobe level of the array antenna apparatus 1 decreases. The antenna performance of the array antenna apparatus 1 improves.
[0061] Referring to Figs. 1, 2, and 10 to 19, one example of a method for fabricating the array antenna apparatus I according to the present embodiment is now described. [0062] As shown in Figs. 10 and 11, the groove 8 is formed in the carrier 6. For -22 -example, the groove 8 is formed by a machining process, such as grinding or polishing, or a chemical process, such as etching.
[0063] As shown in Figs. 10 and 11, the joint member 7 is disposed on the first primary surface 6s of the carrier 6. The joint member 7 includes a first joint 7a and a second joint 7b. The groove 8 is located between the first joint 7a and the second joint 7b.
If the material used for the joint member 7 is in liquid form, the joint member 7 is disposed on the first primary surface 6s of the carrier 6 by metal mask printing, a discharge method using a dispenser, or a pin transfer method. If the joint member 7 is in solid form like a sheet, the joint member 7 is placed on the first primary surface 6s of the carrier 6.
[0064] As shown in Figs. 12 and 13, the wiring boards 10 are secured to the carrier 6 via the joint member 7. Specifically, the wiring boards 10 are placed on the joint member 7 while aligning the wiring boards 10 with the carrier 6. The joint member 7 is cured while pressing the wiring boards 10 against the carrier 6. In one example, when curing the joint member 7, the first joint 7a and the second joint 7b may be individually cured. Thus, the relative position accuracy between the wiring boards 10 can be improved. The fabrication of the high-frequency array antenna apparatus 1, which requires high accuracy from the assembly, can be enabled. In another example, when curing the joint member 7, the first joint 7a and the second joint 7b may be collectively cured. Thus, the time required to manufacture the array antenna apparatus 1 can be reduced, and the manufacturing cost for the manufacturing time is reduced. [0065] As shown in Figs. 14 and 15, the adhesive layers 22 are disposed on the fourth primary surfaces lOs of the wiring boards 10, the first top surfaces 19t of the feeding patch antenna elements 19, and the second top surfaces 20t of the ground conductor layers 20. If the material used for the adhesive layers 22 is in liquid form, metal mask printing, a discharge method using a dispenser, or a pin transfer method are employed to provide the adhesive layers 22 on the fourth primary surfaces lOs of the wiring boards 10, the first top surfaces 19t of the feeding patch antenna element 19, and the second top surfaces 20t of the ground conductor layers 20. If the adhesive layers 22 -23 -are in solid form, such as a sheet, the adhesive layers 22 are placed on the fourth primary surfaces lOs of the wiring boards 10, the first top surfaces 19t of the feeding patch antenna elements 19, and the second top surfaces 20t of the ground conductor layers 20.
[0066] As shown in Figs. 16 and 17, the dielectric substrate 26 is adhered to the wiring boards 10 via the adhesive layer 22. The non-feeding patch antenna element 29 included in the dielectric substrate 26 is disposed to correspond to the feeding patch antenna element 19 included in the wiring board 10. Specifically, in plan view of the first primary surface Os of the carrier 6, the dielectric substrate 26 is disposed relative to the wiring board 10 so that the center of the non-feeding patch antenna element 29 and the center of the feeding patch antenna element 19 coincide with each other. The alignment mark (not shown) formed on the fourth primary surface lOs of the wiring board 10 and the alignment mark (not shown) formed on the fifth primary surface 27r of the dielectric substrate 26 may be used to align the dielectric substrate 26 with the wiring board 10.
[0067] As shown in Figs. 18 and 19, the carrier 6 is secured to the housing 5, using a secure member (not shown), such as screws. The external substrate 35 is secured to the housing 5, using a secure member (not shown), such as screws. The electronic part 37 is mounted on the external substrate 35. In plan view of the first primary surface 6s of the carrier 6, the external substrate 35 is aligned with the wiring board 10 so that the circuits 36 on the external substrate 35 and the connection terminals 30 on the wiring board 10 face each other.
[0068] The circuit 36 on the external substrate 35 and the connection terminal 30 on the wiring board 10 are then connected, using the electrical connection member 40.
Specifically, if the electrical connection member 40 is a metal wire, the electrical connection member 40 is wire bonded to the circuit 36 and the connection terminals 30, using a wire bonder, etc. If the electrical connection member 40 is a flexible printed circuit, the electrical connection member 40 is joined to the connection terminals 30 and the circuit 36, using a flip chip bonder, etc. The electrical connection member 40 -24 -is joined to the connection terminals 30 and the circuit 36, using a solder, an anisotropic electrically conductive adhesive material, or an electrically conductive adhesive material. In this way, the array antenna apparatus 1 shown in Figs. 1 to 3 can be obtained.
[0069] While the array antenna apparatus 1 according to the present embodiment includes two antenna units (the first antenna unit 2a and the second antenna unit 2b), the array antenna apparatus 1 may include three or more antenna units. Four or more antenna units may be disposed in a matrix in the first direction (x direction) and the second direction (y direction).
[0070] Advantages effects of the array antenna apparatus 1 according to the present embodiment are now described.
The array antenna apparatus 1 according to the present embodiment includes the carrier 6, the joint member 7, the first antenna unit 2a, and the second antenna unit 2b.
The carrier 6 has the first primary surface Gs and the second primary surface Gu opposite to the first primary surface 6s. The joint member 7 includes the first joint 7a and the second joint 7b. The first antenna unit 2a is joined to the first primary surface Gs of the carrier 6 with the first joint 7a. The second antenna unit 2b is joined to the first primary surface 6s of the carrier 6 with the second joint 7b. The second antenna unit 2b is disposed the gap 108 apart from the first antenna unit 2a. The first antenna unit 2a and the second antenna unit 2b each include the wiring board 10 located closer to the carrier 6 and the dielectric substrate 26 located farther away from the carrier G. The wiring board 10 has the third primary surface 10h facing the carrier 6, and the fourth primary surface lOs opposite to the third primary surface 10h and facing the dielectric substrate 26. The wiring board 10 includes the feeding patch antenna element 19 disposed on the fourth primary surface lOs of the wiring board 10. The dielectric substrate 26 includes the non-feeding patch antenna element 29 which is disposed to correspond to the feeding patch antenna element 19. The groove 8 is formed in the carrier 6, the groove 8 extending from the first primary surface 6s toward the second primary surface 6u. In plan view of the first primary surface 6s of the -25 -carrier 6, the groove 8 is disposed to correspond to the gap 10g between the first antenna unit 2a and the second antenna unit 2b. The slit 60, extending from the first top surface 19t of the feeding patch antenna element 19 to the bottom surface 8b of the groove 8, is formed between the first antenna unit 2a and the second antenna unit 2b.
[0071] The joint member 7 enters into the groove 8 when securing the wiring boards 10 to the carrier 6 using the joint member 7. The groove 8 prevents the joint member 7 from traveling up through the gap lOg between the first antenna unit 2a and the second antenna unit 2b and adhering to the surface of the non-feeding patch antenna element 29. The array antenna apparatus 1 has an improved antenna performance.
[0072] In the array antenna apparatus I according to the present embodiment, the wiring board 10 includes the ground conductor layer 20 which is disposed on the fourth primary surface lOs of the wiring board 10 and separated from the feeding patch antenna element 19. The second top surface 20t of the ground conductor layer 20 is substantially flush with the first top surface 19t of the feeding patch antenna element 19. The carrier 6 is electrically grounded. The depth 60d of the slit 60 is substantially an integer multiple of a hall of the wavelength 2t. of the electromagnetic wave transmitted or received by the feeding patch antenna element 19.
[0073] Thus, the ground conductor layer 20 of the first antenna unit 2a electromagnetically couples to the ground conductor layer 20 of the second antenna unit 2b at the same ground potential. The ground conductor layer 20 of the first antenna unit 2a and the ground conductor layer 20 of the second antenna unit 2b have an equal ground potential. The gain of the electromagnetic wave in the array antenna apparatus 1 is maximized. The side lobe level of the array antenna apparatus 1 decreases. The array antenna apparatus 1 has an improved antenna performance.
[0074] In the array antenna apparatus 1 according to the present embodiment, the minimum width of the slit 60 is less than the depth 60d of the slit 60. Thus, the electromagnetic standing wave transmitted or received by the array antenna apparatus 1 is stably formed in the direction of the depth 60d of the slit 60. The gain of the electromagnetic wave in the array antenna apparatus 1 is maximized. The side lobe -26 -level of the array antenna apparatus 1 decreases The array antenna apparatus 1 has an improved antenna performance.
[0075] In the array antenna apparatus 1 according to the present embodiment, the width lOw of the gap lOg is narrower than the width 8w of the groove 8. The first antenna unit 2a (in particular, the overhang 10m) and the second antenna unit 2b (the overhang I On) effectively prevent the joint member 7 from traveling up over the fourth primary surfaces 1 Os of the wiring boards 10. The array antenna apparatus 1 has an improved antenna performance.
[0076] In the array antenna apparatus 1 according to the present embodiment, the joint member 7 is separated from the bottom surface 8b of the groove 8. Thus, the effective length of the depth 60d of the slit 60 for the electromagnetic wave transmitted or received by the array antenna apparatus 1 is not altered by the joint member 7. The gain of the electromagnetic wave in the array antenna apparatus 1 is maximized. The side lobe level of the array antenna apparatus 1 decreases. The array antenna apparatus 1 has an improved antenna performance.
[0077] In the array antenna apparatus 1 according to the present embodiment, the first joint 7a in the groove 8 is separated from the second joint 7b. If the first joint 7a comes into contact with the second joint 7b and a confined space demarcated by the joint member 7 and the groove 8 is formed, a gas in a confined space expands and the joint member 7 may burst during the manufacturing process of the array antenna apparatus 1 or during the operation of the array antenna apparatus 1. In the present embodiment, since the first joint 7a is separated from the second joint 7b, the joint member 7 is prevented from bursting. If the first joint 7a and the second joint 7b are electrically conductive joint members, electrical shortening between the first antenna unit 2a and the second antenna unit 2b can be prevented. The array antenna apparatus 1 has an improved antenna performance.
[0078] In the array antenna apparatus 1 according to the present embodiment, the joint member 7 is an electrically conductive joint member. The groove 8 prevents the joint member 7, which is an electrically conductive joint member, from traveling up through -27 -the gap lOg between the first antenna unit 2a and the second antenna unit 2b and adhering to the surface of the non-feeding patch antenna element 29. The joint member 7, which is an electrically conductive joint member, can prevent the non-feeding patch antenna element 29 of the first antenna unit 2a and the non-feeding patch antenna element 29 of the second antenna unit 2b from being electrically shorted. The array antenna apparatus 1 has an improved antenna performance [0079] In the array antenna apparatus 1 according to the present embodiment, the joint member 7 is an insulating joint member. The groove 8 prevents the joint member 7, which is an insulating joint member, from traveling up through the gap lOg between the first antenna unit 2a and the second antenna unit 2b and adhering to the surface of the non-feeding patch antenna element 29. The joint member 7, which is an insulating joint member, can be prevented from adhering to the surface of the non-feeding patch antenna element 29, thereby preventing an increase in dielectric loss of the array antenna apparatus 1. The array antenna apparatus 1 has an improved antenna performance.
[0080] In the array antenna apparatus 1 according to the present embodiment, the non-feeding patch antenna element 29 of the first antenna unit 2a is multiple non-feeding patch antenna elements 29 The non-feeding patch antenna element 29 of the second antenna unit 2b is multiple non-feeding patch antenna elements 29. In plan view of the first primary surface 6s of the carrier 6, the non-feeding patch antenna elements 29 included in the first antenna unit 2a and the non-feeding patch antenna elements 29 included in the second antenna unit 2b are arranged, evenly spaced from one another. The array antenna apparatus 1 has an improved antenna performance.
[0081] Embodiment 2 Referring to Figs. 21 to 23, an array antenna apparatus lb according to Embodiment 2 is now described. The array antenna apparatus lb according to the present embodiment has the same configuration as the array antenna apparatus 1 according to Embodiment 1, but differs mainly in the following points: [0082] The array antenna apparatus lb includes a groove 8 that extends from a first -28 -primary surface 6s to a second primary surface 6u. The groove 8 passes through a carrier 6 in the direction of thickness (a third direction (z direction)) of the carrier G. The carrier 6 is configured of multiple carrier portions (a first carrier portion 6a and a second carrier portion 6b). A bottom surface 8b of the groove 8 is a front surface Ss of a housing 5 facing the second primary surface 6u. The housing 5 is electrically Grounded.
[0083] In addition to the advantageous effects of the array antenna apparatus 1 according to Embodiment 1, the array antenna apparatus lb according to the present embodiment yields the following advantageous effects: [0084] The array antenna apparatus lb according to the present embodiment further includes the housing 5 which supports the second primary surface 6u of the carrier 6. The groove 8 extends from the first primary surface 6s to the second primary surface 6u. The bottom surface 8b of the groove 8 is the front surface Ss of the housing 5 facing the second primary surface Gu. The housing 5 is electrically grounded.
[0085] Thus, the carrier 6 has a reduced thickness. The array antenna apparatus lb can have a reduced size. Since the carrier 6 has a reduced thickness, the thermal resistance from the wiring boards 10 to the housing 5 is reduced. The array antenna apparatus lb can effectively dissipates the heat generated at the wiring boards 10 to the housing 5.
[0086] Embodiment 3 Referring to Figs. 24 and 25, an array antenna apparatus lc according to Embodiment 3 is now described. The array antenna apparatus 1 c according to the present embodiment has the same configuration as the array antenna apparatus 1 according to Embodiment 1, but differs mainly in the following points: [0087] The array antenna apparatus lc includes a recess 9 in a first primary surface 6s of a carrier 6. A first antenna unit 2a and a second antenna unit 2b are disposed in the recess 9. In plan view of the first primary surface 6s of the carrier 6, the area of the recess 9 is greater than the total area of a wiring board 10 of the first antenna unit 2a and the wiring board 10 of the second antenna unit 2b. Preferably, the recess 9 has a -29 -depth 9d less than a thickness 10d (see Fig. 3) of the wiring board 10. The side surfaces of the recess 9 are inclined with respect to the first primary surface Gs of the carrier 6 so that the recess 9 tapers from the first primary surface 6s of the carrier 6 toward the bottom surface of the recess 9. The side surfaces of the recess 9 may be perpendicular to the first primary surface Gs of the carrier 6.
[0088] A distance 66d, from a side surface 8j of the groove 8 to a side of the bottom surface of the recess 9 opposite to the groove 8, may be equal to the difference between the length of a side of the wiring board 10 included in the first antenna unit 2a and the length of an overhang 10m. Thus, the wiring board 10 of the first antenna unit 2a can be accurately aligned with the carrier 6 in a first direction (x direction). A distance 67d, from a side surface 8k of the groove 8 to a side of the bottom surface of the recess 9 opposite to the groove 8, may be equal to the difference between the length of an overhang 10n and the length of a side of the wiring board 10 included in the second antenna unit 2b. Thus, the wiring board 10 included in the second antenna unit 2b can be accurately aligned with the carrier 6 in the first direction (x direction).
[0089] Referring to Fig. 26, one example of a method for fabricating the array antenna apparatus I c according to the present embodiment is now described. The method for fabricating the array antenna apparatus lc according to the present embodiment includes the same steps as those included in the method for fabricating the array antenna apparatus 1 according to Embodiment 1, but differs mainly in the following points: [0090] As shown in Fig. 26, the recess 9 is formed in the carrier 6, in addition to the groove 8. For example, the recess 9 is formed by a machining process such as grinding or polishing.
[0091] The first antenna unit 2a and the second antenna unit 2b are also aligned by the recess 9 when securing the wiring boards 10 to the carrier 6 via the joint member 7. In one example, the wiring boards 10 are aligned with the recess 9, while observing the sides of third primary surfaces 10h of the wiring boards 10 opposite to the groove 8, and the side of the recess 9 in the carrier 6 opposite to the groove 8. In another -30 -example, the wiring boards 10 are aligned with the recess 9 so that the sides of the third primary surfaces 10h of the wiring boards 10 opposite to the groove 8 come into contact with the side of the recess 9 in the carrier 6 opposite to the groove 8. [0092] In addition to the advantageous effects of the array antenna apparatus 1 according to Embodiment 1, the array antenna apparatus lc according to the present embodiment yields the following advantageous effects: [0093] In the array antenna apparatus lc according to the present embodiment, the recess 9 is formed in the first primary surface 6s of the carrier 6. The first antenna unit 2a and the second antenna unit 2b are joined to the recess 9. Thus, the array antenna apparatus lc has a reduced height. The array antenna apparatus lc can have a reduced size. Moreover, since the first antenna unit 2a and the second antenna unit 2b are aligned by the recess 9, the array antenna apparatus lc can be facilitated with a high accuracy and ease.
[0094] Embodiments 4 Referring to Figs. 27 to 31, an array antenna apparatus ld according to Embodiments 4 is now described. The array antenna apparatus ld according to the present embodiment has the same configuration as the array antenna apparatus 1 according to Embodiment 1, but differs mainly in the following points: [0095] The array antenna apparatus ld has a groove 8 that extends from a first primary surface 6s to a second primary surface 6u of a carrier 6. The groove 8 passes through a carrier 6 in the direction of thickness (a third direction (z direction)) of the carrier 6. The carrier 6 is configured of multiple carrier portions (a first carrier portion 6a and a second carrier portion 6b). A bottom surface 8b of the groove 8 is a front surface 5s of a housing 5 facing the second primary surface 6u The housing 5 is electrically grounded.
[0096] In the array antenna apparatus ld, multiple inserted portions 70 are provided in each of the second primary surface 6u of the first carrier portion 6a and the second primary surface 6u of the second carrier portion 6b. Multiple pin portions 71 corresponding to the multiple inserted portions 70 are also provided in the front surface -31 -Ss of the housing 5.
[0097] Initially, the inserted portion 70 is described. The inserted portion 70 is a hole that extends from the second primary surface 6u to the first primary surface 6s of the first carrier portion 6a and the second carrier portion 6b which are included the carrier 6, as shown in Figs. 28 and 29. The inserted portion 70 may pass through the first carrier portion Ga and the second carrier portion GI) in the third direction (z direction). [0098] Preferably, two or more inserted portions 70 are provided per carrier portion. Preferably, the inserted portions 70 have as much distance therebetween as possible in one carrier portion. For example, if the first carrier portion 6a and the second carrier portion GI) have rectangular planner shapes, the inserted portions 70 may be provided at the diagonal corners of the first carrier portion 6a and the second carrier portion 6b. [0099] In plan view of the second primary surfaces 6u of the first carrier portion 6a and the second carrier portion 6b, any shape can be employed for planner shapes of the inserted portions 70. For example, due to ease of processing, the inserted portion 70 may have a round or obround shape. Alternatively, the inserted portion 70 may have a polygonal planner shape, such as a rectangular shape.
[0100] Next, the pin portion 71 is described. The pin portion 71 is a generally cylindrical protrusion formed, extending from the front surface 5s of the housing 5 away from the housing 5, as shown in Figs. 30 and 31. In other words, the pin portion 71 is a protrusion that is formed to protrude from the front surface 5s of the housing 5.
[0101] The pin portion 71_ is formed so that the dimension thereof in the third direction (z direction) from the front surface 5s of the housing 5 to the top surface of the pin portion 71 is less than a depth 8d. In plan view of the front surface 5s of the housing 5, any shape can be employed for the planner shape of the pin portion 71. For example, as the planner shape of the pin portion 71, a polygonal shape can be used, such as a round shape, a rectangular shape, a generally diamond shape, etc. The dimensions of the pin portion 71 are determined so that the pin portion 71 can be inserted into a corresponding inserted portion 70. The tip of the pin portion 71 located farther away from the front surface 5s of the housing 5 may have a shape whose width -32 -decreases the farther away the tip is from the front surface Ss of the housing 5, such as a tapered portion, a sphere portion, a portion having a curved shape convexed outward, etc. [0102] Next, functionality of the inserted portion 70 and the pin portion 71 are described. The pin portions 71 are inserted into corresponding inserted portions 70 when mounting the first carrier portion 6a and the second carrier portion 6b on the front surface Ss of the housing 5. At this time, owing to the positional accuracy that depends on the dimensional difference between the inserted portion 70 and the pin portion 71 in the first direction (x direction) and the second direction (y direction) as shown in Fig. 27, the first carrier portion 6a and the housing 5 and the second carrier portion 6b and the housing 5 can be accurately aligned in the first direction (x direction) and the second direction (y direction). In other words, the relative position between the first carrier portion 6a and the second carrier portion 6b can be determined with ease and a high accuracy via the housing 5.
[0103] Referring to Figs. 32 to 35, one example of a method for fabricating the array antenna apparatus Id according to the present embodiment is now described. The method for fabricating the array antenna apparatus Id according to the present embodiment includes the same steps as those of the method for fabricating the array antenna apparatus 1 according to Embodiment 1, but differs mainly in the following points: [0104] As shown in Fig. 32, the inserted portions 70 are formed in the first carrier portion 6a and the second carrier portion 6b. The inserted portions 70 are formed using a processing method, such as drilling, laser processing, electropoli shins, etc. when fabricating the first carrier portion 6a and the second carrier portion 6b.
[0105] The pin portions 71 are formed in the front surface 5s of the housing 5. For example, as one example, the pin portion 71 may be processed as a separate member from the housing 5 by a separate process from one used for the housing 5, and then secured to the housing S. While any method may be used to secure the pin portion 71 to the housing 5, for example, screw tightening, press fitting, shrink fitting, etc. In -33 -another example, when fabricating the housing 5, the pin portions 71 may be simultaneously formed as a part of the housing 5 by mechanical grinding, laser processing, or electropolishing, etc. [0106] Moreover, the joint member 7 may be supplied on the first primary surface 6s of the first carrier portion 6a and the first primary surface 6s of the second carrier portion 6b as shown in Fig. 32, and, subsequently, the first antenna unit 2a and the second antenna unit 2b are mounted on the joint member 7. The first antenna unit 2a and the second antenna unit 2b are mounted on the joint member 7, while making sure the relative positions between the first carrier portion 6a and the first primary surface 6s and between the second carrier portion 6b and the first primary surface 6s using equipment, such as a flip chip bonder, which allows a highly accurate alignment by the recognition with a two-lens camera including top and bottom cameras. At this time, the relative position between the first antenna unit 2a and the first carrier portion 6a and the relative position between the second antenna unit 2b and the second carrier portion 6b may be aligned so that the feeding patch antenna elements 19 included in the first antenna unit 2a and the second antenna unit 2b are evenly spaced from one another while the pin portions 71 being inserted in the inserted portions 70, as shown in Figs. 33 and 34. In other words, by fitting the pin portions 71 provided in the front surface 5s of the housings into the inserted portions 70 provided in the first carrier portion 6a and the second carrier portion 6b, the first antenna unit 2a and the second antenna unit 2b can be secured to the housing 5 while they are being highly accurately aligned. [0107] Moreover, the overhangs I Om, 10n shown in Fig. 34 are formed so that the sum of the dimensions of the overhangs I Om, 10n in the first direction (x direction) is less than a distance 8w (see Fig. 3). Thus, the first antenna unit 2a and the second antenna unit 2b do not interfere with each other when mounting the first antenna unit 2a and the second antenna unit 2b onto the housing 5.
[0108] In addition to the advantageous effects of the array antenna apparatus 1 according to Embodiment 1, the array antenna apparatus Id according to the present embodiment yields the following advantageous effects by having the following -34 -configurations: [0109] In the array antenna apparatus Id according to the present embodiment, multiple inserted portions 70 are provided in the second primary surface 6u of the first carrier portion 6a and the second primary surface 6u of the second carrier portion ob.
The multiple pin portions 71 corresponding to the inserted portions 70 are also provided in the front surface Ss of the housing 5. Thus, when mounting the first carrier portion 6a and the second carrier portion 6b onto the front surface Ss of the housing 5, the inserted portions 70 and corresponding pin portions 71 can be used to allow the relative position between the first carrier portion 6a and the second carrier portion 6b in the first direction (x direction) and the second direction (y direction) to be within a certain range. In other words, the housing 5, the first carrier portion 6a, and the second carrier portion 6b can be fabricated while they are being aligned with a high accuracy and ease.
[0110] The advantageous of the array antenna apparatus Id described above can yield relatively high effects when the antenna unit count is increased. In other words, for an array antenna apparatus le as shown in Fig. 35, for example, the alignment using the recess 9 according to Embodiment 3 can allow the third antenna unit 2c and the fourth antenna unit 2d to have the recess 9 formed only on one side. Thus, the third antenna unit 2c and the fourth antenna unit 2d cannot be aligned in the second direction (y direction).
[0111] By providing the inserted portion 70 and the pin portion 71, the array antenna apparatus Id according to the present embodiment allows the alignment of the relative position between the antenna units, irrespective of the antenna unit count. The array antenna apparatus le shown in Fig. 35 has six antenna units (the first antenna unit 2a, the second antenna unit 2b, the third antenna unit 2c, the fourth antenna unit 2d, the fifth antenna unit 2e, and the sixth antenna unit 2f) joined by a joint member to the carrier 6 configured of the first carrier portion 6a and the second carrier portion 6b (see Fig. 27) The first antenna unit 2a is joined to the first carrier portion 6a by the first joint 7a The second antenna unit 2b is joined to the second carrier portion 6b by the -35 -second joint 7b. The third antenna unit 2c is joined to the first carrier portion 6a by the third joint 7c. The fourth antenna unit 2d is joined to the fourth joint 7g by the second carrier portion 6b. The fifth antenna unit 2e is joined to the first carrier portion 6a by the fifth joint 7e. The sixth antenna unit 2f is joined to the second carrier portion 6b by the sixth joint 7f [0112] As such, the application of the configuration of the array antenna apparatus Id according to the present embodiment (the configuration of including multiple inserted portions 70 and the pin portion 71) to an array antenna apparatus which includes three or more antenna units, like the array antenna apparatus le shown in Fig. 35, allows the array antenna apparatus to be fabricated with a high accuracy and ease.
[0113] The presently disclosed embodiments 1 to 4 should be considered in all aspects as illustrative and not restrictive. Unless otherwise indicated herein or clearly contradicted by context, at least two of Embodiments 1 to 4 may be combined. The basic scope of the present disclosure is indicated by the appended claims, rather than by the description above, and all changes that come within the scope of the claims and the meaning and range of equivalency of the claims are intended to be embraced within their scope.
REFERENCE SIGNS LIST
[0114] 1, lb, lc, Id, le array antenna apparatus; 2a first antenna unit; 2b second antenna unit; 2c third antenna unit; 2d fourth antenna unit; 2e fifth antenna unit; 2f sixth antenna unit; .5 housing; Ss front surface; 6 carrier; 6a first carrier portion; 6b second carrier portion; 6s first primary surface; 6t thickness; 6u second primary surface; 7 joint member; 7a first joint; 7b second joint; 7c third joint; 7g fourth joint; 7e fifth joint; 7f sixth joint; 7d thickness; 8 groove; 8b bottom surface; 8d depth; 8j, 8k side surface; 8w, lOw width; 9 recess; 9d depth; 10 wiring board; 10d thickness; lOg gap; 10h third primary surface; 10j, 10k side surface; 10m, 10n overhang; 10p imaginary surface; lOs fourth primary surface; 11 semiconductor substrate; 13 active circuit; 14 control circuit; 15 wiring layer; 16 insulating layer; 17 conductor; 18 conductive via; 19 -36 -feeding patch antenna element; 19t first top surface; 20 ground conductor layer; 20t second top surface; 22 adhesive layer; 26 dielectric substrate; 27 dielectric substrate; 27r fifth primary surface; 27s sixth primary surface; 29 non-feeding patch antenna element, 30 connection terminal, 35 external substrate, 36 circuit, 37 electronic part; 40 electrical connection member; 60 slit; 60d depth, 66d, 67d distance; 70 inserted portion; and 71 pin portion -37 -

Claims (14)

  1. CLAIMS1. An array antenna apparatus, comprising: a carrier having a first primary surface and a second primary surface opposite to the first primary surface; a joint member which includes a first joint and a second joint; a first antenna unit joined to the first primary surface of the carrier with the first joint; a second antenna unit joined to the first primary surface of the carrier with the second joint, the second antenna unit being arranged with a gap from the first antenna unit, wherein the first antenna unit and the second antenna unit each include a wiring board located closer to the carrier and a dielectric substrate located farther away from the carrier, the wiring board has a third primary surface facing the carrier, and a fourth primary surface which is opposite to the third primary surface and facing the dielectric substrate, the wiring board includes a feeding patch antenna element disposed on the fourth primary surface, the dielectric substrate includes a non-feeding patch antenna element disposed to correspond to the feeding patch antenna element, a groove is formed in the carrier, the groove extending from the first primary surface toward the second primary surface, in plan view of the first primary surface, the groove is disposed to correspond to the gap between the first antenna unit and the second antenna unit, and a slit is formed between the first antenna unit and the second antenna unit, the slit extending from a first top surface of the feeding patch antenna element to a bottom surface of the groove.
  2. -38 - 2. The array antenna apparatus according to claim 1, wherein the wiring board includes a ground conductor layer which is disposed on the fourth primary surface and separated from the feeding patch antenna element, the ground conductor layer has a second top surface which is substantially flush with the first top surface of the feeding patch antenna element, the carrier is electrically grounded, and the slit has a depth which is substantially an integer multiple of a half of a wavelength of an electromagnetic wave transmitted or received by the feeding patch antenna element.
  3. 3. The array antenna apparatus according to claim 2, wherein the slit has a minimum width smaller than the depth of the slit.
  4. 4. The array antenna apparatus according to any one of claims 1 to 3, wherein the gap has a width narrower than a width of the groove.
  5. 5. The array antenna apparatus according to any one of claims 1 to 4, wherein the joint member is separated from the bottom surface of the groove
  6. 6. The array antenna apparatus according to any one of claims 1 to 5, wherein the first joint is separated from the second joint in the groove.
  7. 7. The array antenna apparatus according to any one of claims 1 to 6, wherein the bottom surface of the groove is separated from the second primary surface.
  8. 8. The array antenna apparatus according to any one of claims 1 to 6, further comprising a housing that supports the second primary surface of the carrier, wherein the groove extends from the first primary surface to the second primary surface, -39 -the bottom surface of the groove is a front surface of the housing facing the second primary surface, and the housing is electrically grounded.
  9. 9. The array antenna apparatus according to any one of claims 1 to 6, further comprising a housing that supports the second primary surface of the carrier, wherein the housing has a front surface facing the second primary surface, a plurality of pin portions are disposed in the front surface of the housing, a plurality of inserted portions corresponding to the plurality of pin portions are disposed in the second primary surface of the carrier, and a relative position between the carrier and the housing in plan view of the front surface can be secured by fitting the plurality of pin portions into the plurality of inserted portions.
  10. 10. The array antenna apparatus according to claim 9, wherein the groove extends from the first primary surface to the second primary surface, the bottom surface of the groove is the front surface of the housing, and the housing is electrically grounded
  11. 11 The array antenna apparatus according to any one of claims 1 to 10, wherein the first primary surface of the carrier has a recess, and the first antenna unit and the second antenna unit are joined to the recess.
  12. 12. The array antenna apparatus according to any one of claims 1 to 11, wherein the joint member is an electrically conductive joint member.-40 -
  13. 13. The array antenna apparatus according to any one of claims 1 to 11, wherein the joint member is an insulating joint member.
  14. 14 The array antenna apparatus according to any one of claims 1 to 13, wherein the non-feeding patch antenna element included in the first antenna unit is a plurality of non-feeding patch antenna elements, the non-feeding patch antenna element included in the second antenna unit is a plurality of non-feeding patch antenna elements, and in the plan view of the first primary surface, the plurality of non-feeding patch antenna elements included in the first antenna unit and the plurality of non-feeding patch antenna elements included in the second antenna unit are arranged, evenly spaced from one another.-41 -
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JPH1154892A (en) * 1997-07-31 1999-02-26 Yupiteru Ind Co Ltd Method and structure for attaching electronic component to glass fluororesin substrate
JPH1188039A (en) * 1997-09-09 1999-03-30 Harness Sogo Gijutsu Kenkyusho:Kk Circuit connection structure inside vehicle
JP2001007628A (en) * 1999-06-25 2001-01-12 Nec Corp Phased array antenna
JP4361658B2 (en) * 2000-02-14 2009-11-11 富士通マイクロエレクトロニクス株式会社 Mounting board and mounting method
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