JPWO2021006344A1 - - Google Patents

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Publication number
JPWO2021006344A1
JPWO2021006344A1 JP2021530740A JP2021530740A JPWO2021006344A1 JP WO2021006344 A1 JPWO2021006344 A1 JP WO2021006344A1 JP 2021530740 A JP2021530740 A JP 2021530740A JP 2021530740 A JP2021530740 A JP 2021530740A JP WO2021006344 A1 JPWO2021006344 A1 JP WO2021006344A1
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JP
Japan
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JP2021530740A
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Japanese (ja)
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JP7126619B2 (en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
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    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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US20130187830A1 (en) * 2011-06-02 2013-07-25 Brigham Young University Planar array feed for satellite communications
WO2016067906A1 (en) * 2014-10-30 2016-05-06 三菱電機株式会社 Array antenna device and method for manufacturing same

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JPH1154892A (en) * 1997-07-31 1999-02-26 Yupiteru Ind Co Ltd Method and structure for attaching electronic component to glass fluororesin substrate
JPH1188039A (en) * 1997-09-09 1999-03-30 Harness Sogo Gijutsu Kenkyusho:Kk Circuit connection structure inside vehicle
JP2001007628A (en) * 1999-06-25 2001-01-12 Nec Corp Phased array antenna
JP4361658B2 (en) * 2000-02-14 2009-11-11 富士通マイクロエレクトロニクス株式会社 Mounting board and mounting method
US7348666B2 (en) * 2004-06-30 2008-03-25 Endwave Corporation Chip-to-chip trench circuit structure
JP5162988B2 (en) * 2007-07-18 2013-03-13 株式会社村田製作所 Wireless IC device and manufacturing method thereof
JP5442424B2 (en) * 2009-12-25 2014-03-12 新光電気工業株式会社 Semiconductor device

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JPH0548302A (en) * 1991-08-14 1993-02-26 Mitsubishi Electric Corp Microwave integrated circuit device
US20130187830A1 (en) * 2011-06-02 2013-07-25 Brigham Young University Planar array feed for satellite communications
WO2016067906A1 (en) * 2014-10-30 2016-05-06 三菱電機株式会社 Array antenna device and method for manufacturing same

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