WO2020041968A1 - Dispositif de couplage de conversion d'onde de surface et système de communication d'onde de surface - Google Patents

Dispositif de couplage de conversion d'onde de surface et système de communication d'onde de surface Download PDF

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Publication number
WO2020041968A1
WO2020041968A1 PCT/CN2018/102655 CN2018102655W WO2020041968A1 WO 2020041968 A1 WO2020041968 A1 WO 2020041968A1 CN 2018102655 W CN2018102655 W CN 2018102655W WO 2020041968 A1 WO2020041968 A1 WO 2020041968A1
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WO
WIPO (PCT)
Prior art keywords
surface wave
signal line
transmitting
insertion hole
layer
Prior art date
Application number
PCT/CN2018/102655
Other languages
English (en)
Chinese (zh)
Inventor
文玥
王超
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2018/102655 priority Critical patent/WO2020041968A1/fr
Publication of WO2020041968A1 publication Critical patent/WO2020041968A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices

Definitions

  • the present application relates to communication technology, and in particular, to a surface wave conversion coupling device and a surface wave communication system.
  • a signal transmitting chip on a printed circuit board (Printed Circuit Board, abbreviated as PCB) on the signal transmitting side sends out a high-speed signal, and transmits the signal through the high-speed signal line on the PCB and the high-speed cable in the space.
  • the high-speed signal line on the receiving side PCB is finally received by the receiving chip on the PCB to complete the entire high-speed signal transmission process.
  • the transmitting chip sends a high-speed signal.
  • the high-speed signal is transmitted through a PCB trace to form a surface wave transmission.
  • After coupling the surface wave to a cylindrical surface wave it can support the surface of cables such as copper cables and dielectric cables.
  • the cylindrical surface wave is propagated.
  • the cable only plays a role in guiding the propagation of the cylindrical surface wave. There is no current transmission in the cable itself.
  • the received cylindrical surface wave is coupled to a plane surface wave, and then passes through the PCB. The trace finally enters the receiving chip.
  • the present application provides a surface wave conversion coupling device and a surface wave communication system, which are easy to process and fix, and achieve high-energy coupling of a planar surface wave to a cylindrical surface wave.
  • the present application provides a coupling device for transmitting a surface wave, which is composed of a PCB and a cylindrical conductor.
  • the PCB has a two-layer structure, the upper layer is a ground layer, and the lower layer is a signal layer.
  • the signal line is set on the signal layer, and the two ends of the signal line are bent at a certain position and close to a semi-closed area.
  • An insertion hole is provided on the ground layer, and the insertion hole is located in a semi-closed area.
  • the cylindrical conductor is vertically inserted into the insertion hole to contact the signal line.
  • the cylindrical conductor adopts a structure capable of maintaining the propagation of cylindrical surface waves.
  • the coupling device of the present application divides the PCB and the conductor into two parts, which is easy to process.
  • the two parts are connected together by a plug-in method, which is easy to fix.
  • the combination of the propagating structure can ensure the high-energy coupling of the plane surface wave to the cylindrical surface wave and maintain the low loss on the conductor surface, which is suitable for long-distance transmission.
  • the width of the bent portion near the signal line in the semi-closed region is greater than the width of the two ends near the signal line in the semi-closed region.
  • the semi-closed area surrounded by the signal line in this application presents a structure with a gradually changing width.
  • the width of the bent portion near the signal line is larger, and the width near the two ends of the signal line is smaller.
  • Such a structure realizes the transformation process of increasing impedance. Complete the transition from TEM mode to TM mode.
  • the insertion hole covers a bent portion of the signal line.
  • the insertion hole covers the bent portion of the signal line, so that the cylindrical conductor inserted into the insertion hole can be in good contact with the signal line and easily propagate surface waves.
  • a plurality of ground vias penetrating the ground layer and the signal layer are further provided on the ground layer and the signal layer, and the plurality of ground vias surrounds the outside of the signal line and the insertion hole.
  • the ground via is filled with a metal medium, or a metal medium is provided on the hole of the ground via.
  • multiple ground vias are provided around the outside of the signal line and the insertion hole, the purpose of which is to transmit signals from the signal layer to the ground vertically and reduce signal energy radiation.
  • one end of the cylindrical conductor inserted into the insertion hole may adopt a periodic groove structure or a vertebral body structure.
  • the material of the periodic groove structure includes metal, plastic, or polyvinyl chloride (PVC) dielectric.
  • the body structure includes a metal outer wall and a filling medium.
  • both the periodic groove structure and the vertebral body structure can well convert a plane surface wave into a cylindrical surface wave, and can be introduced into a cable for propagation with little energy loss.
  • the present application provides a surface wave communication system, including: a transmitting device and a receiving device; wherein the transmitting device and the receiving device are both provided with the surface wave coupling device of the first aspect;
  • the transmitting device and the receiving device are connected by a cable.
  • One end of the cable is connected to a cylindrical conductor in the coupling device for transmitting surface waves on the transmitting device, and the other end of the cable is connected to the transmitting surface wave on the receiving device. Coupling on a cylindrical conductor.
  • the surface wave communication system of the present application maintains the high energy of the surface wave on the surface of the cable for propagation through the coupling device for transmitting the surface wave in the present application, and realizes long-distance transmission of signals based on the characteristics of large bandwidth and low loss of the surface wave technology.
  • FIG. 1 is a schematic diagram of a high-speed communication application scenario based on surface wave technology
  • FIG. 2 is a schematic diagram of a cylindrical surface wave propagation form on a periodic groove structure
  • FIG. 3 is a schematic diagram of the transmission effect of surface waves of different frequencies on a periodically grooved structured conductor
  • 5a is a schematic diagram of the overall structure of a first embodiment of a coupling device for transmitting a surface wave
  • 5b is a schematic plan view of a PCB of a first embodiment of a coupling device for transmitting a surface wave according to the present application;
  • 5c is a schematic bottom structural view of a PCB of a first embodiment of a coupling device for transmitting a surface wave
  • 5d is a top perspective view of a PCB of a first embodiment of a coupling device for transmitting a surface wave of the present application
  • FIG. 6 is a schematic diagram of an overall structure of a second embodiment of a coupling device for transmitting a surface wave according to the present application
  • FIG. 7 is a schematic structural diagram of a first embodiment of a surface wave communication system of the present application.
  • Figure 1 is a schematic diagram of a high-speed communication application scenario based on surface wave technology.
  • the transmitting chip sends a high-speed signal.
  • the high-speed signal is transmitted through the PCB trace to form a planar surface wave on the PCB.
  • the copper cable is introduced through the conductor.
  • dielectric cables carry cylindrical surface wave propagation; on the signal receiving side, the received cylindrical surface wave is coupled to a planar surface wave on the PCB, and finally enters the receiving chip through the PCB trace, completing the surface wave technology High-speed signal transmission.
  • FIG. 2 is a schematic diagram of the propagation form of a cylindrical surface wave on a periodic groove structure.
  • the cylindrical periodic groove structure can well maintain the surface wave propagation.
  • This is a structure with frequency selection, that is, the size of the periodic groove and the propagation frequency of the supported surface wave correspond one-to-one.
  • FIG. 3 is a schematic diagram of the transmission effect of surface waves of different frequencies on a periodically grooved structured conductor. As shown in Fig. 3, this grooved conductor is most suitable for the propagation of surface waves with a frequency of 0.6 THz, and the energy of the surface waves at this frequency can be transmitted well along the surface of the conductor to the opposite end.
  • the 0.4THz surface wave can also propagate to the opposite end, the energy loss during the propagation process is large, and the propagation performance is low.
  • the 1.0THz surface wave is completely unsuitable for this groove size, and a large amount of energy is radiated as soon as the conductor energy is introduced. It can be seen that, as long as the periodic groove structure is used to propagate surface waves of an adapted frequency, it is a good structure suitable for surface wave propagation.
  • FIG. 4 is a surface wave propagation device in the prior art.
  • the surface wave propagation device uses an integrated horizontal transfer structure, and the left and right transmission and reception use a planar excitation surface wave structure, with a cylindrical conductor in the middle. Both are integrally formed, both are located in the same plane to achieve the plane.
  • Surface wave is transformed into the purpose of cylindrical surface wave propagating on a cylindrical conductor.
  • such an integrated coupling device is difficult to process and cannot withstand large tensile forces, and is not suitable for long-distance transmission.
  • the present application provides a coupling device for transmitting a surface wave, which is composed of a PCB and a cylindrical conductor.
  • the PCB adopts a two-layer structure, the upper layer is a ground layer, and the lower layer is a signal layer.
  • the signal line is arranged on the signal layer and has a curved shape. The two ends of the signal line are close to form a semi-closed area.
  • An insertion hole is provided on the ground layer, and the insertion hole is located in a semi-closed area.
  • the cylindrical conductor is vertically inserted into the insertion hole to contact the signal line.
  • the cylindrical conductor adopts a structure capable of maintaining the propagation of cylindrical surface waves.
  • the characteristic of surface wave is that its electromagnetic field distribution is mainly concentrated in the medium constituting the waveguide and the area near the surface.
  • the electromagnetic field outside the medium decreases exponentially with increasing distance from the surface. Therefore, to achieve effective surface wave transmission, it is necessary to make The surface of the waveguide has a large reactance.
  • the coupling device of the present application divides the PCB and the conductor into two parts, which is easy to process. The two parts are connected together by a plug-in method, which is easy to fix.
  • the progressive structure of the signal line on the PCB and the conductor used to maintain the cylindrical surface wave propagation.
  • the combination of structures can ensure the high-energy coupling of plane surface waves to cylindrical surface waves and maintain low loss on the conductor surface, which is suitable for long-distance transmission.
  • FIG. 5a is a schematic diagram of the overall structure of a first embodiment of a surface wave coupling device of the present application
  • FIG. 5b is a schematic plan view of a PCB of the first embodiment of a surface wave coupling device of the present application
  • FIG. 5c is a surface wave coupling device of the present application.
  • the bottom view of the PCB of the first embodiment is schematically shown in FIG. 5D, which is a top perspective view of the PCB of the first embodiment of the coupling device for transmitting a surface wave.
  • the coupling device for transmitting surface waves includes a PCB and a cylindrical conductor, wherein the PCB adopts a two-layer structure, the upper layer is a ground layer, and the lower layer is a signal layer.
  • the signal layer is provided with a signal line.
  • the two ends of the signal line are bent to form a semi-closed area after being bent.
  • the width of the bent portion near the signal line in the semi-closed area is greater than that of the two ends of the signal line in the semi-closed area. Width, showing a gradual structure.
  • the bent portion is a small portion where the bent point on the signal line is located.
  • An insertion hole is provided on the ground layer, and the insertion hole is located in the semi-closed area and completely covers the bent portion of the signal line.
  • the cylindrical conductor is vertically inserted into the insertion hole to contact the signal line.
  • the cylindrical conductor in the embodiment of the present application adopts a periodic groove structure.
  • This periodic groove structure has the performance of frequency selection.
  • the size of the periodic groove is corresponding to the propagation frequency of the surface wave supported. See FIG. 4.
  • plane surface waves can be well converted into cylindrical surface waves, and they can be introduced into the cable for propagation with little energy loss.
  • the periodic groove structure can be made of metal material to form a unified structure with the connected conductors, or it can be made of other dielectric materials, such as plastic or polyvinyl chloride (PVC), and then connected to the metal material conductor.
  • the surface wave transmission mode is a transverse magnetic (Transverse Magnetic) (TM) mode.
  • TM Transverse Magnetic
  • TEM Transverse Electric Magnetic
  • the signal line on the PCB has a gradual structure to realize the transformation process of increasing impedance.
  • the periodic groove structure adopted by cylindrical conductors can transform plane surface waves into cylindrical surface waves and maintain low loss on the surface of the conductor, which is suitable for long-distance transmission.
  • a plurality of ground vias penetrating the ground layer and the signal layer are also provided on the ground layer and the signal layer, and the plurality of ground vias surround the outside of the signal line and the insertion hole.
  • the ground via is filled with a metal medium, or a metal medium is provided on the hole of the ground via.
  • FIG. 6 is a schematic diagram of the overall structure of a second embodiment of a coupling device for transmitting a surface wave. As shown in FIG. 6, it is different from the first embodiment shown in FIGS. 5 a to 5 d in that the end of the insertion hole on the cylindrical conductor in the embodiment of the present application adopts a vertebral structure, and the vertebral structure includes a metal outer wall and a filling medium .
  • one end of the cylindrical conductor inserted into the insertion hole may adopt other structures. Any structure that can maintain the propagation of cylindrical surface waves can be used in this application, which is not specifically limited.
  • FIG. 7 is a schematic structural diagram of a first embodiment of a surface wave communication system of the present application.
  • the system includes a transmitting-end device and a receiving-end device, wherein the transmitting-end device and the receiving-end device are each provided with a coupling device for transmitting a surface wave in any of the foregoing embodiments.
  • the transmitting device and the receiving device are connected by a cable.
  • One end of the cable is connected to a cylindrical conductor in the coupling device for transmitting surface waves on the transmitting device, and the other end of the cable is connected to the transmitting surface wave on the receiving device. Coupling on a cylindrical conductor.
  • the surface wave communication system of the present application maintains the high energy of the surface wave on the surface of the cable for propagation through the coupling device for transmitting the surface wave in the present application, and realizes long-distance transmission of signals based on the characteristics of large bandwidth and low loss of the surface wave technology.

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Abstract

La présente invention concerne un dispositif de couplage de conversion d'onde de surface et un système de communication d'onde de surface. Le dispositif de couplage destiné à transmettre une onde de surface selon la présente invention comprend : une carte de circuit imprimé (PCB) et un conducteur cylindrique, la PCB comprenant une couche de base et une couche de signal, et la couche de base étant placée au-dessus de la couche de signal. Une ligne de signal est placée sur la couche de signal, les deux extrémités de la ligne de signal étant courbées au niveau d'une position de la ligne de signal, puis fermées pour former une zone semi-fermée. Un orifice d'insertion est formé sur la couche de base, l'orifice d'insertion étant situé dans la zone semi-fermée. Le conducteur cylindrique est inséré verticalement dans l'orifice d'insertion pour entrer en contact avec la ligne de signal. La structure du conducteur cylindrique permet de maintenir la propagation d'ondes de surface cylindriques. La structure du dispositif de couplage selon la présente invention est facile à traiter et à fixer, ce qui permet d'obtenir un couplage à haute énergie d'ondes de surface planes avec des ondes de surface cylindriques.
PCT/CN2018/102655 2018-08-28 2018-08-28 Dispositif de couplage de conversion d'onde de surface et système de communication d'onde de surface WO2020041968A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/102655 WO2020041968A1 (fr) 2018-08-28 2018-08-28 Dispositif de couplage de conversion d'onde de surface et système de communication d'onde de surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/102655 WO2020041968A1 (fr) 2018-08-28 2018-08-28 Dispositif de couplage de conversion d'onde de surface et système de communication d'onde de surface

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WO2020041968A1 true WO2020041968A1 (fr) 2020-03-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200095546A1 (en) * 2013-03-14 2020-03-26 The Johns Hopkins University Nanoscale artificial antigen presenting cells

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101145810A (zh) * 2006-09-11 2008-03-19 索尼株式会社 通信系统以及通信装置
CN102290624A (zh) * 2011-05-11 2011-12-21 东南大学 多方向表面波分波器
CN106711563A (zh) * 2017-02-23 2017-05-24 华南理工大学 共面波导馈电的半环形表面波传输线及功分器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101145810A (zh) * 2006-09-11 2008-03-19 索尼株式会社 通信系统以及通信装置
CN102290624A (zh) * 2011-05-11 2011-12-21 东南大学 多方向表面波分波器
CN106711563A (zh) * 2017-02-23 2017-05-24 华南理工大学 共面波导馈电的半环形表面波传输线及功分器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200095546A1 (en) * 2013-03-14 2020-03-26 The Johns Hopkins University Nanoscale artificial antigen presenting cells
US11939595B2 (en) * 2013-03-14 2024-03-26 The Johns Hopkins University Nanoscale artificial antigen presenting cells

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