WO2020038059A1 - Support, ensemble d'entrée et de sortie, et dispositif mobile - Google Patents

Support, ensemble d'entrée et de sortie, et dispositif mobile Download PDF

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Publication number
WO2020038059A1
WO2020038059A1 PCT/CN2019/090073 CN2019090073W WO2020038059A1 WO 2020038059 A1 WO2020038059 A1 WO 2020038059A1 CN 2019090073 W CN2019090073 W CN 2019090073W WO 2020038059 A1 WO2020038059 A1 WO 2020038059A1
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WO
WIPO (PCT)
Prior art keywords
camera
sub
receiving
receiving cavity
imaging
Prior art date
Application number
PCT/CN2019/090073
Other languages
English (en)
Chinese (zh)
Inventor
韦怡
Original Assignee
Oppo广东移动通信有限公司
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Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020038059A1 publication Critical patent/WO2020038059A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to a bracket, an input-output component, and a mobile device.
  • Mobile phone camera components can be configured with multiple functional modules, and multiple functional components often need to cooperate with each other to work properly.
  • the camera component can include imaging modules and TOF components.
  • imaging modules In order to ensure the relative position between multiple functional modules The fixation is better for mutual cooperation.
  • Most of them are fixed by fixed parts.
  • imaging modules are often equipped with optical image stabilization components, and the fixed components may cause interference with magnetic components such as motors in the optical image stabilization components. This affects the anti-shake performance.
  • Embodiments of the present application provide a stand, an input-output assembly, and a mobile device.
  • the stent according to the embodiment of the present application includes a first surface and a second surface opposite to each other.
  • the second surface is provided with a plurality of receiving chambers
  • the first surface is provided with a plurality of through holes corresponding to the plurality of receiving chambers.
  • the bracket adopts a non-magnetic material integrated structure.
  • the input-output module of the embodiment of the present application includes the bracket and the input-output module of the foregoing embodiment.
  • the input-output module includes an imaging module and a time-of-flight module, and the imaging module and the time-of-flight module are respectively fixed It is installed in a plurality of the receiving chambers and is exposed from the first surface through the corresponding through holes.
  • a mobile device includes a casing and the input-output component of the foregoing embodiment, and the input-output component is mounted on the casing.
  • FIG. 1 is a schematic perspective structural diagram of an input-output component according to an embodiment of the present invention.
  • FIGS. 2 and 3 are exploded perspective views of an input-output component according to an embodiment of the present invention.
  • FIG. 4 is a schematic plan view of a bracket in an input / output module according to an embodiment of the present invention.
  • FIG. 5 is a schematic perspective structural diagram of a bracket in an input / output module according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a three-dimensional structure of a time-of-flight module in an input-output module according to an embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view of the time-of-flight module shown in FIG. 6 along the line VII-VII.
  • FIG. 8 and FIG. 9 are three-dimensional structure diagrams of the electronic device according to the embodiment of the present invention.
  • I / O module 100 bracket 10, side wall 11, first surface 111, second surface 112, receiving cavity 113, imaging receiving cavity 1130, first receiving cavity 1131, second receiving cavity 1132, third receiving cavity 1133, first One sub-receiving cavity 1134, second sub-receiving cavity 1135, through hole 114, first through hole 1141, second through hole 1142, third through hole 1143, first sub through hole 1144, second sub through hole 1145, limit Position slot 115, imaging limit slot 1150, first limit slot 1151, second limit slot 1152, third limit slot 1153, mounting slot 116, limit ring 12, shielding portion 13, dispensing hole 131, flange 14.
  • I / O module 20 imaging module 21, main camera 211, first imaging body 2111, first imaging circuit board 2112, secondary camera 212, second imaging body 2121, second imaging circuit board 2122, time-of-flight mode Group 22, imaging body 201, imaging circuit board 202, light transmitter 221, light receiver 222, housing 2221, optical element 2222, first substrate assembly 223, first substrate 2231, flexible circuit board 2232, reinforcing plate 2233, pad Block 224, accommodating cavity 2241, perforation 225, connector 226, electronic component 227, optical image stabilization module 23, The electronic component 30, the mobile device 200, the casing 40, the main body 41, the movable portion 42, and the display screen 50.
  • the "on" of the first feature on the second feature may include direct contact between the first and second features, and may also include that the first and second features are not in direct contact but are contacted through another feature between them. .
  • the imaging module and the TOF component need to ensure the same optical axis to ensure the use effect.
  • the imaging module and the TOF component need to ensure the same optical axis to ensure the use effect.
  • it may be collided and the components will be misaligned, which will make each component The relative position of the camera does not work well together.
  • the functional modules are often fixed by using fixing members.
  • imaging modules often have optical image stabilization components.
  • the fixed parts may be made of iron and other materials, and Iron as a magnetic material may cause interference with magnetic components such as the motor in the optical image stabilization component. For example, iron may attract the motor in the optical image stabilization component, causing the motor to drive the image sensor not in place, resulting in reduced image stabilization performance.
  • An input / output module 100 includes a bracket 10 and an input / output module 20.
  • the bracket 10 is an integrated structure made of non-magnetic material.
  • the bracket 10 includes a first surface 111 and a second surface 112 opposite to each other.
  • the second surface 112 is provided with a plurality of receiving chambers 113
  • the first surface 111 is provided with a plurality of receiving chambers.
  • a plurality of through holes 114 corresponding to the cavity 113.
  • the input / output module 20 includes an imaging module 21 and a time-of-flight module 22, and the imaging module 21 and the time-of-flight module 22 are respectively fixedly installed in a plurality of receiving chambers 113 and all pass through the corresponding through holes 114 from the first surface 111. Exposed.
  • the bracket 10 may be an integrally formed structure, or may be an integral structure that is assembled after being separately formed.
  • the exposure means that the input / output module 20 can be seen from the first surface 111.
  • the input / output module 20 can be exposed from the first surface 111 through the through hole 114 of the first surface 111, and the input / output module 20 can also be The through-hole 114 is not penetrated, but the input-output module 20 can be seen through the through-hole 114.
  • the bracket 10 in the input-output module 100 is an integrated structure without magnetic materials.
  • the imaging module 21 and the time of flight module 22 are installed in the receiving cavity 113, the imaging module 21 and the time of flight module 22
  • the relative position of the substrate is not easily changed, so that the multiple input-output modules 20 can work better together. Specifically, the positions of the plurality of receiving chambers 113 will not change. As long as the input / output module 20 is fixed in the receiving chamber 113, the relative positions between the input and output modules 20 will not change, thereby improving the entire input and output.
  • the strength of the component 100 increases the stability of the coordination between the functional components.
  • the bracket 10 is made of non-magnetic material, which can effectively avoid the magnetic between the bracket 10 and the optical image stabilization component in the input / output module 20, such as the imaging module 21. interference.
  • the bracket 10 of this embodiment is made of an aluminum-titanium alloy material, and the weight can be controlled within 1 g.
  • the total weight of the bracket 10 is 0.77 grams.
  • the motor of the optical anti-shake component usually uses a VCM motor, and its working principle is to energize in a fixed magnetic field to generate a driving force to drive the image sensor of the imaging module 21 to move to perform shake compensation.
  • the aluminum-titanium alloy is a non-magnetic material, which can effectively avoid magnetic interference between the bracket 10 and the motor in the optical image stabilization component in the imaging module 21.
  • the bracket 10 may attract magnetic components in the VCM motor.
  • aluminum-titanium alloy as a metal material, has the characteristics of high yield of die-casting, dense casting, high strength of the finished product, no fracture, and strong flexibility.
  • the surface of the bracket 10 is processed by sandblasting and spot nickel plating.
  • the thickness of the nickel layer formed by the nickel plating process is 3 micrometers to 8 micrometers, and the overall resistance of the bracket is less than 1 ohm.
  • Sand blasting can break all the dirt such as rust on the surface of the bracket 10, so that the surface has the required roughness and greatly improve the connection between the bracket 10 and the plating material.
  • Nickel plating can improve the abrasion resistance, corrosion resistance and rust prevention of the bracket 10.
  • the bracket also needs to undergo a smoke test and a residual magnetism test. Specifically, the salt fog test is 8 hours, and the residual magnetism is less than 0.8 Gauss. In this way, the physical and electrical properties of the stent can be guaranteed to be better after the tests described.
  • the input / output module 100 includes a bracket 10, an input / output module 20 and electronic components 30.
  • the bracket 10 is an integrated structure and includes a side wall 11, a stop ring 12, a shielding portion 13 and a flange 14.
  • the side wall 11 includes a first surface 111 and a second surface 112 opposite to each other.
  • the second surface 112 defines a plurality of spaced-apart accommodation chambers 113.
  • the first surface 111 is provided with a plurality of through holes 114 corresponding to the plurality of receiving cavities 113.
  • the number of the receiving cavities 113 may be two, three, four, or any plurality, and the number of the through holes 114 is the same as the number of the receiving cavities 113 and is provided in a one-to-one correspondence.
  • the plurality of receiving chambers 113 include an imaging receiving chamber 1130 for mounting the imaging module 21.
  • the imaging receiving chamber 1130 of this embodiment includes a second receiving chamber 1132 and a third receiving chamber 1133.
  • the number of the storage chambers 113 in this embodiment is three, and the three storage chambers 113 include a first storage chamber 1131, a second storage chamber 1132, and a third storage chamber 1133 which are spaced apart in sequence.
  • the first storage chamber 1131 includes a connection
  • the first sub-receiving cavity 1134 and the second sub-receiving cavity 1135 are communicated.
  • the through hole 114 includes a first through hole 1141, a second through hole 1142, and a third through hole 1143 respectively corresponding to the first receiving cavity 1131, the second receiving cavity 1132, and the third receiving cavity 1133.
  • the first through hole 114 The first sub-receiving cavity 1134 and the second sub-receiving cavity 1135 respectively include a first sub-through hole 1144 and a second sub-through hole 1145.
  • the center of the first sub through hole 1144, the center of the second sub through hole 1145, the center of the second through hole 1142, and the center of the third through hole 1143 are located on the same straight line L.
  • the second surface 112 is further provided with a plurality of limiting grooves 115 and mounting grooves 116.
  • Each of the plurality of limiting grooves 115 penetrates the side wall 11, and the plurality of limiting grooves 115 communicate with the plurality of receiving chambers 113 correspondingly.
  • the number of the limiting grooves 115 is the same as the number of the receiving chambers 113 and is located on the same side of the straight line L.
  • the plurality of limiting grooves 115 include a first limiting groove 1151, a second limiting groove 1152, and a third limiting groove 1153.
  • the first limiting slot 1151 is in communication with the first receiving cavity 1131
  • the second limiting slot 1152 is in communication with the second receiving cavity 1132
  • the third limiting slot 1153 is in communication with the third receiving cavity 1133.
  • the plurality of limiting slots 115 include an imaging limiting slot 1150 for mounting the imaging circuit board 202.
  • the imaging limiting slot 1150 of this embodiment includes a second limiting slot 1152 and a third limiting slot 1153.
  • the mounting groove 116 is located on a side of the second receiving cavity 1132 away from the second limiting groove 1152 and is opposite to the second limiting groove 1152.
  • the mounting groove 115 penetrates the side wall 11 and communicates with the second receiving cavity 1132.
  • the opening size of the through hole 114 is smaller than the opening size of the corresponding receiving cavity 113 to form the stop ring 12.
  • the limit ring 12 is used to limit the installation position of the input-output module 20 installed in the receiving cavity 113.
  • the shielding portion 13 extends from the sidewall 11 toward a side away from the second receiving cavity 1132, and the shielding portion 13 is located on the sidewall 11 corresponding to the mounting groove 116.
  • the shielding portion 13 is provided with a dispensing hole 131 penetrating the shielding portion 13.
  • the number of the dispensing holes 131 may be one, two, or any plurality.
  • the flange 14 extends from the side wall 11 to a side away from the receiving cavity 113.
  • the flange 14 is located at an end of the side wall 11 near the first surface 111 and is disposed around the receiving cavity 113.
  • the bracket 10 can pass through a circuit board (not shown) formed with a mounting hole in the mobile device 200 (as shown in FIG. 8), and the flange 14 interferes with the circuit board.
  • the input / output module 20 includes at least an imaging module 21 and a time-of-flight module 22.
  • the imaging module 21 and the time-of-flight module 22 are installed in a plurality of receiving chambers 113 and are located on the same straight line L.
  • the imaging module 21 includes an imaging body 201 and an imaging circuit board 202.
  • the imaging body 201 includes at least one of a first imaging body 2111 and a second imaging body 2121.
  • the imaging circuit board 202 corresponds to the imaging body 201 and includes at least one of the first circuit board 2112 and the second circuit board 2122. Specifically, when the imaging body 201 includes the first imaging body 2111, the imaging circuit board 202 includes the first circuit Board 2112; when the imaging body 201 includes a second imaging body 2121, the imaging circuit board 202 includes a second circuit board 2122.
  • the imaging body 201 is installed in the receiving cavity 113 (for example, the second receiving cavity 1132) and is exposed from the first surface 111 through the through hole 114 (for example, the second through hole 1142).
  • the imaging circuit board 202 is disposed in the limiting slot 115 (for example, the second limiting slot 1152).
  • the imaging module 21 includes any one of a visible light camera, an infrared camera, a black and white camera, a telephoto camera, and a wide-angle camera.
  • the number of the imaging modules 21 may be one, two, three, or any plurality.
  • the imaging module 21 of this embodiment includes a main camera 211 and a sub camera 212.
  • the main camera 211 is installed in the second receiving cavity 1132 and is exposed from the first surface 111 through the second through hole 1142.
  • the main camera 211 includes a first imaging body 2111 and a first circuit board 2112.
  • the first imaging body 2111 is installed in the second receiving cavity 1132 and is exposed through the second through hole 1142.
  • the first circuit board 2112 is disposed in the second limiting slot 1152 and the mounting slot 116.
  • the main camera 211 may be a wide-angle camera, a color camera (ie, an RGB camera), or an infrared camera.
  • the secondary camera 212 is installed in the third receiving cavity 1133 and is exposed from the first surface 111 through the third through hole 1143.
  • the secondary camera 212 includes a second imaging body 2121 and a second circuit board 2122.
  • the second imaging body 2121 is installed in the third receiving cavity 1133 and is exposed through the third through hole 1143.
  • the second circuit board 2122 is disposed in the third limiting slot 1153.
  • the secondary camera 212 may be a telephoto camera, a black and white camera (that is, a Mono camera), a color camera, or an infrared camera.
  • the sub camera 212 when the main camera 211 is a wide-angle camera, the sub camera 212 may be a telephoto camera; when the main camera 211 is a color camera, the sub camera 212 may be a black and white camera; when the main camera 211 is a color camera, the sub camera 212 may be a color camera When the main camera 211 is a color camera, the sub camera 212 may be an infrared camera; when the main camera 211 is an infrared camera, the sub camera 212 may be a black and white camera.
  • wide-angle and telephoto are relative terms.
  • the wide-angle camera has a larger field of view relative to the telephoto camera, and the telephoto camera has a longer focal length and a longer shooting distance than the wide-angle camera.
  • the black and white camera can improve the shooting quality of low-light / night scene images.
  • the time-of-flight module 22 includes a first substrate assembly 223, a pad 224, a light transmitter 221 and a light receiver 222.
  • the time-of-flight module 22 is fixedly installed in the first receiving cavity 1131 and is exposed from the first surface 111 through the first through hole 1141.
  • the first substrate assembly 223, the spacer 224, and the light emitter 221 The light receiver 222 and the light receiver 222 are both contained in the first receiving cavity 1131, and the light transmitter 221 and the light receiver 222 are exposed from the first surface 111 through the first through hole 1141.
  • the first substrate assembly 223 protrudes from the first limiting groove 1151.
  • the first substrate assembly 223 includes a first substrate 2231 and a flexible circuit board 2232 connected to each other.
  • the first substrate 2231 may be a printed circuit board or a flexible circuit board, and the control circuit of the time-of-flight module 22 may be laid on the first substrate 2231.
  • One end of the flexible circuit board 2232 may be connected to the first substrate 2231, and the other end of the flexible circuit board 2232 may be connected to the circuit board 2211 of the light transmitter 221.
  • the flexible circuit board 2232 can be bent at a certain angle, so that the relative positions of the devices connected at both ends of the flexible circuit board 2232 can have more choices.
  • the spacer 224 is disposed on the first substrate 2231.
  • the pad 224 is in contact with the first substrate 2231 and is carried on the first substrate 2231.
  • the pad 224 may be combined with the first substrate 2231 by means of adhesion or the like.
  • the material of the spacer 224 may be metal, plastic, or the like.
  • a surface where the pad 224 is combined with the first substrate 2231 may be a flat surface, and a surface opposite to the combined surface of the pad 224 may also be a flat surface, so that when the light emitter 221 is disposed on the pad 224 Has better stability.
  • the light emitter 221 is installed in the second sub-receiving cavity 1135 and is exposed through the second sub-through hole 1145.
  • the light emitter 221 is disposed on the pad 224.
  • the flexible circuit board 2232 is bent and one end of the flexible circuit board 2232 is connected to the first substrate 2231 and the other end is connected to the light emitter 221.
  • the optical transmitter 221 is configured to emit an optical signal outward.
  • the light receiver 222 is installed in the first sub-receiving cavity 1134 and is exposed through the first sub-through hole 1144.
  • the light receiver 222 is disposed on the first substrate 2231, and the contact surface between the light receiver 222 and the first substrate 2231 is substantially flush with the contact surface between the pad 224 and the first substrate 2231 (that is, the installation starting point of the two is On the same plane).
  • the light receiver 222 includes a housing 2221 and an optical element 2222.
  • the housing 2221 is provided on the first substrate 2231, and the optical element 2222 is provided on the housing 2221.
  • the housing 2221 may be a lens holder and a lens barrel of the light receiver 222, and the optical element 2222 may be a lens or other elements provided in the housing 2221.
  • the optical receiver 222 is configured to receive an optical signal emitted by the reflected optical transmitter 221.
  • the light receiver 222 may further include a photosensitive chip (not shown), and the optical signal reflected by the measured target is irradiated into the photosensitive chip through the action of the optical element 2222, and the photosensitive chip generates a response to the optical signal.
  • the time-of-flight module 22 calculates the time difference between the light signal emitted by the light transmitter 221 and the light chip receiving the light signal reflected by the measured object, and further obtains the depth information of the measured object, which can be used for ranging, For generating depth images or for 3D modeling.
  • the housing 2221 and the cushion block 224 are integrally connected.
  • the housing 2221 and the spacer 224 may be integrally molded.
  • the materials of the housing 2221 and the spacer 224 are the same and integrally formed by injection molding, cutting, or the like; or the materials of the housing 2221 and the spacer 224 are different, and the two are through two-color injection molding. Forming in one way.
  • the housing 2221 and the pad 224 may also be separately formed, and the two form a matching structure.
  • the housing 2221 and the pad 224 may be first integrated into one body, and then jointly disposed on the first substrate 2231; Alternatively, one of the housing 2221 and the pad 224 may be disposed on the first substrate 2231, and then the other is disposed on the first substrate 2231 and connected to form a whole.
  • the center of the light receiver 222, the center of the light transmitter 221, the center of the main camera 211, and the center of the sub camera 212 are located on the same straight line L1.
  • the electronic component group 30 is disposed on the first circuit board 2112 and corresponds to the shielding portion 13. Specifically, the electronic component group 30 is disposed on the same side of the shielding portion 13 as the second surface 112. The user can dispense between the electronic component group 30 and the shielding portion 13 through the dispensing hole 131 to fix the electronic component group 30 on the shielding portion 13.
  • the electronic component group 30 may be components such as a capacitor, an inductor, a transistor, a resistor, an optical device (including a fill light, a lens, etc.), a sensor (for anti-shake), and the like.
  • the electronic component group 30 may be a part of the imaging module 21.
  • the electronic component group 30 may be at least a part of the electronic components in the optical image stabilization component.
  • the electronic component group 30 may be used in conjunction with the imaging module 21, for example, the electronic component group 30 may also be a fill light, and the fill light is used to fill the imaging module 21 with light.
  • the portion 13 is provided with a light through hole, and the electronic component group 30 can be exposed from the first surface 111 through the light through hole.
  • the bracket 10 in the input-output module 100 is a non-magnetic material integrated structure.
  • the imaging module 21 and the time-of-flight module 22 are installed in the receiving cavity 113, the imaging module 21 and the time-of-flight module 22
  • the relative position is not easy to change, so that the multiple I / O modules 20 can work better together.
  • the positions of the plurality of receiving chambers 113 will not change.
  • the strength of the component 100 increases the stability of the coordination between the functional components.
  • the bracket 10 is made of non-magnetic material, which can effectively avoid the magnetic between the bracket 10 and the optical image stabilization component in the input / output module 20, such as the imaging module 21. interference.
  • the pad 224 can raise the height of the light emitter 221, thereby increasing the height of the exit surface of the light emitter 221, and the light emitter 221
  • the transmitted light signal is not easily blocked by the light receiver 222, so that the light signal can be completely irradiated on the measured object;
  • the bracket 10 forms a limit ring 12, and when the input / output module 20 is installed in the receiving cavity 113, the input / output module The group 20 and the stop ring 12 oppose each other, thereby facilitating the positioning and installation of the input / output module 20;
  • the bracket 10 is provided with a shielding portion 13 and the electronic component group 30 is disposed on the same side of the shielding portion 13 and the second surface 112, so that When the input / output module 100 is installed on the mobile device 200, the electronic component group 30 can be protected from collision;
  • the bracket 10 is provided with a flange 14 to facilitate the positioning and installation of the bracket 10.
  • the two receiving cavities 113 are a first receiving cavity 1131 and a second receiving cavity 1132, respectively.
  • the first receiving cavity 1131 includes a first communicating cavity.
  • the through-hole 114 includes a first through-hole 1141 and a second through-hole 1142 corresponding to the first receiving cavity 1131 and the second receiving cavity 1132, respectively, wherein the first through-hole 114 includes a first sub-receiving cavity 1134 and The second sub-receiving cavity 1135 corresponds to the first sub-through hole 1144 and the second sub-through hole 1145, respectively.
  • the centers of the first sub through hole 1144, the second sub through hole 1145, and the second through hole 1142 are located on the same straight line.
  • the number of the imaging modules 21 is one, and the imaging modules 21 are any one of a visible light camera, an infrared camera, a black and white camera, a telephoto camera, and a wide-angle camera.
  • the light receiver 222, the light transmitter 221, and the imaging module 21 are sequentially installed in the first sub-receiving cavity 1134, the second sub-receiving cavity 1135, and the second accommodating cavity 1132, respectively.
  • the center of the light receiver 222, the center of the light transmitter 221, and the center of the imaging module 21 are located on the same straight line.
  • the imaging module 21 is located on a center line (mid-perpendicular line) connecting the centers of the light transmitter 221 and the light receiver 222.
  • the center of the first sub-through hole 1144 and the second sub-through hole The line connecting the center of 1145 is the first line segment, and the line connecting the center of the second through hole 1142 and the center of the first through hole 1141 is the second line segment.
  • the first line segment and the second line segment are perpendicular to each other, and the second line segment Located on the vertical line of the first line segment.
  • the line connecting the center of the light receiver 222 installed in the first sub-receiving cavity 1134 and the center of the light transmitter 221 installed in the second sub-receiving cavity 1135 is the third line segment, and the imaging module 21 is located in the third On the midline (perpendicular line) of the line segment.
  • the number of the receiving chambers 113 is three, and the three receiving chambers 113 include a first receiving chamber 1131, a second receiving chamber 1132, and a third receiving chamber 1133 which are disposed at intervals.
  • the through hole 114 includes a first through hole 1141, a second through hole 1142, and a third through hole 1143 respectively corresponding to the first receiving cavity 1131, the second receiving cavity 1132, and the third receiving cavity 1133.
  • the number of the imaging modules 21 is two, which are the main camera 211 and the sub camera 212, respectively.
  • the main camera 211 is a wide-angle camera, and the sub camera 212 is a telephoto camera; or, the main camera 211 is a color camera, and the sub camera 212 is a black and white camera; or, the main camera 211 is a color camera, and the sub camera 212 is a color camera;
  • the main camera 211 is a color camera, and the sub camera 212 is an infrared camera; or, the main camera 211 is an infrared camera, and the sub camera 212 is a black and white camera.
  • the center of the light transmitter 221 and the center of the light receiver 222 are on the same straight line as at least one of the main camera 211 and the sub camera 212.
  • the center of the light transmitter 221, the center of the light receiver 222, and the center of the main camera 211 are on the same straight line.
  • the line connecting the center of the main camera 211 and the center of the sub camera 212 may be perpendicular to the line;
  • the center of the light transmitter 221, the center of the light receiver 222, and the center of the sub camera 212 are located on the same straight line.
  • the line connecting the center of the main camera 211 and the center of the sub camera 212 may be perpendicular to the line.
  • the time-of-flight module 22 is located on the centerline of the center line of the main camera 211 and the sub-camera 212. Specifically, the line between the center of the main camera 211 and the center of the sub-camera 212 is perpendicular to the light transmitter 221 The center of the light source is connected to the center of the light receiver 222, and the light transmitter 221 and the light receiver 222 are located on the center line (midline) of the line of connection between the center of the main camera 211 and the center of the sub camera 212.
  • the line connecting the center of the main camera 211 and the center of the sub camera 212 is parallel to the line connecting the center of the light transmitter 221 and the center of the light receiver 222.
  • the connection between the center of the main camera 211 and the center line of the light transmitter 221 is perpendicular to the connection between the center of the main camera 211 and the center of the sub camera 212; or, the connection between the center of the main camera 211 and the center line of the light receiver 222 is perpendicular to the main
  • the connection between the center of the camera 211 and the center of the sub camera 212; or, the connection between the center of the sub camera 212 and the center line of the light receiver 222 is perpendicular to the line between the center of the main camera 211 and the center of the sub camera 212; the sub camera 212
  • the connection line between the center of the center and the light emitter 221 is perpendicular to the connection line between the center of the main camera 211 and the center of the sub camera 212.
  • an accommodating cavity 2241 is defined on a side where the pad 224 is combined with the first substrate 2231.
  • the time-of-flight module 22 further includes an electronic component 227 disposed on the first substrate 2231, and the electronic component 227 is received in the accommodation cavity 2241.
  • the electronic component 227 may be an element such as a capacitor, an inductor, a transistor, or a resistor.
  • the electronic component 227 may be electrically connected to a control line laid on the first substrate 2231 and used to drive or control the operation of the light transmitter 221 or the light receiver 222.
  • the electronic component 227 is housed in the accommodating cavity 2241, and the space in the pad 224 is used reasonably.
  • the number of the accommodating cavities 2241 may be one or more, and the plurality of accommodating cavities 2241 may be spaced apart from each other.
  • the positions of the accommodating cavities 2241 and the electronic components 227 can be aligned and the pads can be aligned.
  • 224 is disposed on the first substrate 2231.
  • the cushion block 224 is provided with an escape hole 225 communicating with the at least one receiving cavity 2241, and at least one electronic component 227 extends into the escape hole 225.
  • the height of the electronic component 227 is required to be not higher than the height of the accommodating cavity 2241.
  • an avoidance perforation 225 corresponding to the accommodation cavity 2241 may be provided, and the electronic component 227 may partially extend into the avoidance perforation 225 so as not to increase the height of the cushion block 224. Arranges the electronic component 227.
  • the first substrate assembly 223 further includes a reinforcing plate 2233.
  • the reinforcing plate 2233 is coupled to a side of the first substrate 2231 opposite to the pad 224.
  • the reinforcing plate 2233 may cover one side of the first substrate 2231, and the reinforcing plate 2233 may be used to increase the strength of the first substrate 2231 and prevent deformation of the first substrate 2231.
  • the reinforcing plate 2233 may be made of a conductive material, such as metal or alloy.
  • the time-of-flight module 22 further includes a connector 226.
  • the connector 226 is connected to the first substrate assembly 223 and is used to electrically connect with electronic components outside the time-of-flight module 22. connection.
  • the mobile device 200 includes a casing 40 and the input-output component 100 of any one of the foregoing embodiments.
  • the input-output component 100 is mounted on the casing 40.
  • the mobile device 200 includes any one of a mobile phone, a tablet computer, a notebook computer, a smart bracelet, and a smart helmet.
  • the housing 40 can provide protection for the input / output module 100 from dust, water, and drops.
  • the housing 40 is provided with a hole corresponding to the input / output module 20, and the input / output module 20 (for example, the light transmitter 221) emits light. Light can pass through the hole out of the casing 40; light outside the casing 40 can pass through the hole into the casing 40 and transmitted to the input-output module 20 (for example, the light receiver 222, the imaging module 21).
  • the input-output module 100 is housed in the housing 40 and can extend from the housing 40. At this time, the housing 40 does not need to be opened with the input and output directions of the input-output module 100.
  • the housing 40 includes a main body 41 and a movable portion 42.
  • the input / output assembly 100 is mounted on the movable portion 42.
  • the movable portion 42 can move relative to the main body 41 under the driving of a driving device. 42 can slide relative to the main body 41 to slide into the main body 41 (as shown in FIG. 8) or out of the main body 41 (as shown in FIG. 9).
  • the movable section 42 drives the input / output module 100 to protrude from the housing 40 to the outside of the housing 40; when the input / output module 100 is not needed, the movable section 42 drives the input / output module 100 It is received from the outside of the case 40 into the inside of the case 40.
  • the mobile device 200 further includes a display screen 50.
  • the input / output component 100 is housed in the casing 40 and located below the display screen 50. At this time, the casing 40 does not need to be opened. A hole corresponding to the direction of light entering and exiting the input-output module 100.
  • the bracket 10 in the mobile device 200 is an integrated structure made of non-magnetic material.
  • the imaging module 21 and the time of flight module 22 are installed in the receiving cavity 113, the imaging module 21 and the time of flight module 22
  • the relative position of the substrate is not easily changed, so that the multiple input-output modules 20 can work better together. Specifically, the positions of the plurality of receiving chambers 113 will not change. As long as the input-output module 20 is fixed in the receiving chamber 113, the relative positions between the input-output modules 20 will not change.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un support (10), comprenant une première face (111) et une seconde face (112) qui sont opposées l'une à l'autre, la seconde face (112) étant pourvue d'une pluralité de cavités de réception (113), la première face (111) est pourvue d'une pluralité de trous traversants (114) correspondant à la pluralité de cavités de réception (113), et une structure intégrée de matériau non magnétique est utilisée dans le support (10).
PCT/CN2019/090073 2018-08-22 2019-06-05 Support, ensemble d'entrée et de sortie, et dispositif mobile WO2020038059A1 (fr)

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CN201810962831.5 2018-08-22
CN201810962831.5A CN109194781B (zh) 2018-08-22 2018-08-22 支架、输入输出组件和移动设备

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CN109194781B (zh) * 2018-08-22 2021-03-09 Oppo广东移动通信有限公司 支架、输入输出组件和移动设备
CN110798550A (zh) * 2019-06-28 2020-02-14 RealMe重庆移动通信有限公司 电子设备
CN213661669U (zh) * 2020-08-17 2021-07-09 华为技术有限公司 电子设备
CN114401607B (zh) * 2022-02-28 2023-10-31 青岛歌尔智能传感器有限公司 一种电子产品
CN116506533A (zh) * 2022-08-08 2023-07-28 荣耀终端有限公司 电子设备及电子设备的制作方法

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