WO2020038030A1 - 接近传感器及电子装置 - Google Patents

接近传感器及电子装置 Download PDF

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Publication number
WO2020038030A1
WO2020038030A1 PCT/CN2019/088580 CN2019088580W WO2020038030A1 WO 2020038030 A1 WO2020038030 A1 WO 2020038030A1 CN 2019088580 W CN2019088580 W CN 2019088580W WO 2020038030 A1 WO2020038030 A1 WO 2020038030A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
proximity sensor
infrared
electronic device
transmitting portion
Prior art date
Application number
PCT/CN2019/088580
Other languages
English (en)
French (fr)
Inventor
张海平
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP19851952.2A priority Critical patent/EP3839709A4/en
Publication of WO2020038030A1 publication Critical patent/WO2020038030A1/zh
Priority to US17/176,805 priority patent/US11366224B2/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/04—Display arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04101—2.5D-digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface and also measures the distance of the input means within a short range in the Z direction, possibly with a separate measurement setup

Definitions

  • the present application relates to the field of electronic equipment, and in particular, to a proximity sensor and an electronic device.
  • the electronic device is provided with a proximity sensor, and a processor of the electronic device may control a display state of a display screen of the electronic device according to a signal of the proximity sensor. For this reason, how to improve the detection capability of the proximity sensor to accurately control the display state of the display screen has become the focus of attention.
  • the application provides a proximity sensor and an electronic device.
  • the infrared transmitter includes a light emitting source provided on the circuit board and a light transmitting element covering the light emitting source, the light transmitting The element includes a front light transmitting portion and a rear light transmitting portion connected to the front light transmitting portion, the front light transmitting portion is located on a front side of an emission optical axis of the light emitting source, and the rear light transmitting portion is located on a light emitting source The rear side of the emission optical axis, the infrared receiver is located on the side of the light emission source; and
  • a light shielding element covering at least a part of the rear light transmitting portion.
  • the proximity sensor provided in the housing is the above-mentioned proximity sensor.
  • the light shielding element blocks at least a part of the rear light transmitting part, so that the infrared light emitted from the light transmitting source from the front light transmitting part can be more concentrated, and the energy of the infrared light emitted by the infrared emitter is increased. This makes the infrared light emitted farther away, which is also beneficial to the infrared light reflected back to the infrared receiver after hitting the object, which improves the detection ability of the proximity sensor.
  • FIG. 1 is a schematic partial perspective view of an electronic device according to an embodiment of the present application.
  • FIG. 2 is an exploded schematic view of an electronic device according to an embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional view of the electronic device in FIG. 1 along the III-III direction;
  • FIG. 4 is another schematic cross-sectional view of an electronic device according to an embodiment of the present application.
  • FIG 5 is another schematic cross-sectional view of an electronic device according to an embodiment of the present application.
  • FIG. 6 is another schematic cross-sectional view of an electronic device according to an embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional view of a proximity sensor according to an embodiment of the present application.
  • FIG. 8 is another schematic cross-sectional view of a proximity sensor according to an embodiment of the present application.
  • FIG. 9 is another schematic sectional view of a proximity sensor according to an embodiment of the present application.
  • FIG. 10 is a schematic perspective view of a proximity sensor according to an embodiment of the present application.
  • FIG. 11 is an exploded schematic view of a proximity sensor according to an embodiment of the present application.
  • FIG. 12 is a schematic cross-sectional view of a proximity sensor according to an embodiment of the present application.
  • Housing 10 substrate 12, acoustic channel 122, surrounding wall 14, light through hole 142, axis 1422 of light through hole 142, first opening 1424, second opening 1426, outer side surface 144, and receiving space 16;
  • Touch display 20 display 21, cover 22;
  • the light transmitting body 60 and the electro-acoustic element 70 are identical to each other.
  • the electronic device 100 includes a housing 10, a touch display screen 20, and a proximity sensor 30.
  • the housing 10 includes a base plate 12 and a surrounding wall 14 extending rearwardly from an edge of the base plate 12.
  • the base plate 12 and the surrounding wall 14 together form a receiving space 16.
  • the surrounding wall 14 has a light through hole 142 that communicates with the accommodation space 16.
  • the touch display screen 20 is disposed on the front side of the substrate 12.
  • the proximity sensor 30 is provided in the accommodation space 16.
  • the proximity sensor 30 includes an infrared transmitter 33 and an infrared receiver 34.
  • the infrared emitter 33 is used to emit infrared light to the front side of the substrate 12 through the light through hole 142.
  • the infrared receiver 34 is configured to receive infrared light emitted by the infrared transmitter 33 and reflected back by an external object.
  • the proximity sensor 30 emits infrared light to the front side of the substrate 12 through the light through hole 142 located in the surrounding wall 14 and receives infrared light reflected by the object.
  • the electronic device 100 may control a display state of the touch display screen 20 according to a signal of the proximity sensor 30.
  • the proximity sensor 30 is covered by the touch display screen 20, which does not occupy the front space of the substrate 12, avoids interference between the proximity sensor 30 and the touch display screen 20, and increases the screen ratio of the electronic device 100.
  • the electronic device 100 may be any of various types of computer system equipment that is mobile or portable and performs wireless communication (only one form is shown by way of example in FIG. 1).
  • the electronic device 100 may be a mobile phone or a smart phone (e.g., iPhoneTM, AndroidTM-based phone), a portable gaming device (e.g. Nintendo DSTM, PlayStation PortableTM, Gameboy AdvanceTMTM, iPhoneTM), a laptop Computers, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices, such as watches, in-ear headphones, pendants, headphones, etc.
  • the electronic device 100 may also be other wearable devices (for example, Such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or head-mounted devices (HMDs) for smart watches.
  • HMDs head-mounted devices
  • the electronic device 100 may also be any one of a plurality of electronic devices, including, but not limited to, a cellular phone, a smart phone, other wireless communication devices, a personal digital assistant, an audio player, other media players, and a music recorder.
  • PDA personal digital assistant
  • PMP portable Multimedia player
  • MPEG-1 or MPEG-2 Moving Picture Experts Group
  • MP3 audio layer 3
  • the electronic device 100 may perform multiple functions (eg, play music, display video, store pictures, and receive and send phone calls).
  • the electronic device 1000 may be a portable device such as a cellular phone, media player, other handheld device, wristwatch device, pendant device, handset device, or other compact portable device.
  • the casing 10 has a substantially rectangular parallelepiped shape.
  • the casing 10 is a carrier of the electronic device 100 and is used to carry most parts of the electronic device 100.
  • the casing 10 may be made of plastic or metal material, or a plastic and metal may be formed into an integrated structure through an in-mold injection molding process.
  • the material of the substrate 12 is metal
  • the material of the surrounding wall 14 is plastic.
  • the manufacturing method of the casing 12 includes: firstly putting the substrate 12 into a mold, and then injecting molten plastic into the mold, and forming the surrounding wall 14 after the plastic is cured, thereby obtaining the casing 10.
  • the touch display screen 20 may include a display screen 21 and a cover plate 22 that covers the display screen 21.
  • the display screen 21 is, for example, a flexible display such as an OLED (Organic Light-Emitting Diode). Of course, the display screen 21 may also be a liquid crystal display.
  • the cover 22 covers the display screen 21 to reduce the impact of the display screen from the outside.
  • the touch display screen 20 may be fixed on the front side of the substrate 12 by an adhesive.
  • the touch display screen 20 can receive external touch input, thereby generating corresponding signals, so that the touch display screen 20 can run in different states. For example, when the touch display screen 20 is playing video content, if the touch display screen 20 receives a click input, the touch display screen 20 may pause the video playback.
  • the infrared emitter 33 After the infrared emitter 33 emits infrared light to the front side of the substrate 12, if the infrared light reaches the object 200 on the front side of the substrate 12, the infrared light will be reflected by the object 200, and the reflected infrared light will be transmitted from the light through hole 142 to the infrared
  • the receiver 34 and the infrared receiver 34 generate corresponding electric signals according to the acquired infrared light.
  • the electronic device 100 can thus calculate the distance between the proximity sensor 30 and the object 200 according to the time difference between the infrared light emitted by the infrared transmitter 33 and the received infrared light, and then control the display state of the touch display screen 20 according to the time difference.
  • the touch display screen 20 may be controlled to be in an off state.
  • the “screen off state” referred to here means that the touch display screen 20 is powered off and cannot display content.
  • the light emitted and received by the proximity sensor 30 is located outside the cover plate 22. In other words, the light emitted and received by the proximity sensor 30 does not pass through the cover plate 22.
  • the electronic device 100 includes a processor 40 configured to control a display state of the touch display screen 20 according to infrared light received by the infrared receiver 30.
  • the processor 40 calculates the time when the proximity sensor 30 emits infrared light and receives the infrared light reflected by the object 200 to generate detection information.
  • the processor 40 turns off the touch display screen 20 according to the detection information.
  • the processor 40 turns on the touch display screen 20 again according to the detection information fed back by the proximity sensor 30.
  • the proximity sensor 30 may be fixed on the substrate 12 through a component such as a bracket, or the proximity sensor 30 may be fixed on other components of the electronic device 100.
  • the light through hole 142 is, for example, a straight hole, or the inner surface of the light through hole 142 is linear in the axial direction of the light through hole 142.
  • the inner surface of the light through hole 142 may also be a curve type or a polygonal line type.
  • the infrared light emitted by the proximity sensor 30 can pass through the light through hole 142 and be emitted to the front side of the touch display screen 20.
  • the axis 1422 of the light through hole 142 may be vertically arranged. It should be noted that although the axis 1422 of the light through hole 142 is vertically arranged, the infrared light emitted by the infrared emitter 33 can be transmitted to the front side of the touch display screen 20 because the infrared light emitted by the infrared emitter 33 is inclined. In order to detect whether there is an object covering the touch display screen 20 on the front side of the touch display screen 20.
  • the axis 1422 of the light through hole 142 is inclined toward the front side of the substrate 12, as shown in FIG. 4 shown. In this way, the infrared light emitted by the infrared emitter 33 is more easily transmitted to the front side of the touch display screen 20 after passing through the light through hole 142.
  • the light through hole 142 is located at the top position of the surrounding wall 14. That is, the light through hole 142 is located on the top of the electronic device 100.
  • the “top” referred to here is: when the electronic device 100 is in an upright normal use state, the electronic device 100 is located at an end far from the ground. In other words, the “top” is an end portion of one side of the electronic device 100 in the longitudinal direction.
  • the light through hole 142 may be located at other positions of the surrounding wall 14, for example, the light through hole 142 is located at the bottom or side of the surrounding wall 14.
  • the “front side” is that the infrared light generated by the touch display screen 20 is emitted to a side outside the electronic device 100.
  • the side of the touch display screen 20 facing the user is the front side.
  • the side opposite to the front side is the rear side.
  • the infrared light emitted by the infrared emitter 33 does not pass through the substrate 12 and thus does not pass through the touch display screen 20.
  • the infrared light emitted by the infrared emitter 33 forms an acute angle with the thickness direction (horizontal direction in FIG. 3) of the touch display screen 20, so that the infrared light can be emitted to the front side of the substrate 12.
  • the proximity sensor 30 is disposed in the accommodation space 16, that is, the proximity sensor 30 is disposed in the housing 10.
  • the emission optical axis 31 of the infrared emitter 33 passes through the light through hole 142, and the emission optical axis 31 of the infrared emitter 33 is inclined from the infrared emitter 33 to the front side of the substrate 12.
  • the emission optical axis 31 of the infrared emitter 33 is inclined toward the front side of the substrate 12, so that the included angle between the infrared light emitted by the infrared emitter 33 and the horizontal direction is smaller, so that the infrared light emitted by the infrared emitter 33 can be transmitted to
  • the object 200 in front of the display screen 20 is touched to detect whether an object 200 approaches the touch display screen 20.
  • the infrared light emitted by the infrared emitter 33 has a certain emission angle.
  • the emission angle of the infrared emitter 33 is an included angle between the infrared light emitted by the infrared emitter 33 and the emission optical axis 31.
  • the emission optical axis 31 of the infrared emitter 33 passes through the middle portion of the second aperture 1426, so that the infrared light emitted by the infrared emitter 33 can be emitted from the edge position of the second aperture 1426 to the front side of the substrate 12.
  • the emission optical axis 31 of the infrared emitter 33 coincides with the central axis of the infrared light emitted by the infrared emitter 33.
  • the infrared light emitted by the proximity sensor 30 is distributed around the emission optical axis 31 of the infrared emitter 33.
  • the light through hole 142 includes a first aperture 1424 and a second aperture 1426.
  • the first aperture 1424 is close to the proximity sensor 30.
  • the second aperture 1426 is remote from the proximity sensor 30.
  • the emission optical axis 31 of the infrared emitter 33 passes through a middle position of the second aperture 1426.
  • an included angle a between the emission optical axis 31 of the infrared emitter 33 and the horizontal direction is 30-60 degrees.
  • the included angle a is an angle such as 30 degrees, 35 degrees, 40 degrees, 50 degrees, and 60 degrees.
  • more infrared light emitted by the infrared emitter 33 can be emitted from the light through hole 142 to the front side of the touch display screen 20 to detect whether an object 200 covers the touch display screen 20.
  • the infrared light emitted by the infrared emitter 33 has a certain emission angle. Therefore, with the emission optical axis 31 of the infrared emitter 33 as a boundary, the included angle between the infrared light near the front side of the substrate 12 and the horizontal direction is smaller than the included angle a, and the included angle between the infrared light far from the front side of the substrate 12 and the horizontal direction. Greater than the angle a. For example, when the included angle a is 45 degrees, the included angle between the infrared light near the front side of the substrate 12 and the horizontal direction is 35 degrees, and the included angle between the infrared light near the front side of the substrate 12 and the horizontal direction is 60 degrees.
  • the horizontal direction referred to in this application is the thickness direction of the touch display screen 20, that is, the angle a between the emission optical axis 31 of the infrared emitter 33 and the thickness direction of the touch display screen 20 is 30- 60 degrees.
  • the proximity sensor 30 further includes a circuit board 32, and the circuit board 32 is disposed horizontally. Both the infrared transmitter 33 and the infrared receiver 34 are provided on the circuit board 32.
  • the emission optical axis 31 of the infrared emitter 33 is inclined with respect to the circuit board 32 so that the emission optical axis 31 of the infrared emitter 33 is inclined toward the front side of the substrate 12.
  • the circuit board 32 is set horizontally, and the emission optical axis 31 of the infrared emitter 33 is inclined with respect to the circuit board 32, so that the emission optical axis 31 of the infrared emitter 33 is inclined with respect to the horizontal direction, so that the emission of the infrared emitter 33
  • the optical axis 31 passes through the light through hole 142, it can be tilted toward the front side of the substrate 12, so that the infrared light emitted by the infrared emitter 33 can be incident on the front side of the touch display screen 20.
  • the inclined setting of the emission optical axis 31 of the infrared transmitter 33 with respect to the circuit board 32 means that: the emission optical axis 31 of the infrared transmitter 33 is not perpendicular to the circuit board 32, and the emission optical axis 31 of the infrared transmitter 33 is relative to the circuit board
  • the angle b between the surfaces of 32 is an acute angle.
  • the angle b between the emission optical axis 31 of the infrared emitter 33 and the circuit board 32 is less than 90 degrees.
  • the included angle b between the emission optical axis 31 of the infrared emitter 33 and the circuit board 32 is 30-60 degrees.
  • the included angle b is an angle such as 30 degrees, 35 degrees, 45 degrees, 50 degrees, or 60 degrees. It can be understood that when the circuit board 32 is disposed horizontally, the included angle a and the included angle b are the same.
  • the circuit board 32 is, for example, a printed circuit board (PCB).
  • the horizontal setting of the circuit board 32 means that the upper surface of the circuit board 32 is horizontal, or the thickness direction of the circuit board 32 is vertical. status.
  • the circuit board 32 of the proximity sensor 30 is disposed obliquely with respect to the horizontal direction. Both the infrared transmitter 33 and the infrared receiver 34 are provided on the circuit board 32.
  • the infrared transmitter 33 is used to emit infrared light
  • the infrared receiver 34 is used to receive infrared light
  • the emission optical axis 31 of the infrared transmitter 33 is vertically disposed with respect to the circuit board 32 so that the emission optical axis 31 of the infrared transmitter 33 is directed to the substrate
  • the front side of 12 is inclined.
  • the circuit board 32 is disposed obliquely with respect to the horizontal direction, and the emission optical axis 31 of the infrared emitter 33 is disposed perpendicularly with respect to the circuit board 32, so that the emission optical axis 31 of the infrared emitter 33 is disposed obliquely with respect to the horizontal direction, so that infrared emission
  • the transmitting optical axis 31 of the transmitter 33 passes through the light through hole 142, it can be tilted toward the front side of the substrate 12, so that the infrared light emitted by the infrared transmitter 33 can be incident on the front side of the touch display screen 20.
  • the emission optical axis 31 of the infrared emitter 33 is perpendicular to the circuit board 32, since the infrared light emitted by the infrared emitter 33 has a certain emission angle, the infrared light emitted by the infrared emitter 33 can be relative to the circuit The plate 32 is inclined.
  • the angle c of the circuit board 32 inclined with respect to the horizontal direction is 30-60 degrees.
  • the angle c is an angle such as 30 degrees, 35 degrees, 45 degrees, 50 degrees, or 60 degrees.
  • the infrared emitter 33 includes a light emitting source 331 and a light transmitting element 332.
  • the light emission source 331 is provided on the circuit board 32.
  • the light transmitting element 332 covers a light emitting source 331.
  • the light transmitting element 332 includes a front light transmitting portion 3321 and a rear light transmitting portion 3322 connected to the front light transmitting portion 3321.
  • the front light transmitting portion 3321 is located on the front side of the emission optical axis 31 of the light emission source 331.
  • the rear light transmitting portion 3322 is located on the rear side of the emission optical axis 31 of the light emission source 331.
  • the infrared receiver 34 is located on one side of the light emission source 331.
  • the proximity sensor 30 further includes a light shielding element 35 that covers at least a part of the rear light transmitting portion 3322.
  • the light shielding element 35 blocks at least a part of the rear light transmitting portion 3322, so that the infrared light emitted from the front light transmitting portion 3321 can be more concentrated, the energy of the infrared light emitted from the front light transmitting portion 3321 is increased, and the infrared light exit distance is further It is also beneficial for the infrared light to hit the object 200 and be reflected back to the infrared receiver 34, which improves the detection capability of the proximity sensor 30.
  • the light transmitting element 332 may be made of a light transmitting material.
  • the material of the light transmitting element 332 is resin or glass.
  • the light-transmitting element 332 covers a light-emitting source 331, or in other words, the light-emitting source 331 is disposed in the light-transmitting element 332. In this way, the light transmitting element 332 can protect the light emitting source 331 and avoid problems such as damage to the light emitting source 331 due to contact with oxygen.
  • the “front side” referred to in the front side of the emission optical axis 31 coincides with the direction of the “front side” referred to in the front side of the substrate 12 described above. Therefore, the infrared light emitted by the light emitting source 331 can reach the front side of the touch display screen 20 after passing through the front light emitting portion and the light through hole 142 in order to detect whether the touch display screen 20 is blocked.
  • the light shielding element 35 extends from the left side to the right side of the rear light transmitting portion 3322. That is, both the left rear portion and the right rear portion of the rear light transmitting portion 3322 are covered.
  • the light-shielding element 35 is, for example, an element that blocks infrared light, such as foam, a black ink layer, or a metal layer.
  • the emission optical axis 31 of the infrared emitter 33 may be perpendicular to the circuit board 32 or may be disposed obliquely to the circuit board 32.
  • the circuit board 32 may be disposed obliquely with respect to the horizontal direction, or may be disposed horizontally.
  • the front light transmitting portion 3321 is disposed near the touch display screen 20.
  • the rear light transmitting portion 3322 is disposed away from the touch display screen 20.
  • the light emission source 331 is used to emit infrared light to the front side of the substrate 12 through the front light transmitting portion 3321 and the light through hole 142.
  • the proximity sensor 30 can work normally to detect whether an object 200 is blocked by the front side of the touch display screen 20.
  • the emission optical axis 31 of the infrared emitter 33 is perpendicular to the circuit board 32, and the circuit board 32 is disposed horizontally. At this time, the infrared light emitted by the infrared emitter 33 is emitted from the front light transmitting portion 3321 of the light transmitting element 332, and passes through the light through hole 142 to the front side of the touch display screen 20.
  • the light shielding element 35 covers the entire rear light transmitting portion 3322. In other words, the light shielding element 35 completely covers the rear transparent portion 3322. At this time, the infrared light emitted by the light emitting source 331 is emitted from the front transparent portion 3321, so that the energy of the emitted light is more concentrated.
  • the emission optical axis 31 of the light emission source 331 is perpendicular to the circuit board 32.
  • the light-shielding element 35 covers a portion of the front light-transmitting portion 3321 near the emission optical axis 31 of the light emission source 331. That is, a part of the front light transmitting portion 3321 near the emission optical axis 31 is shielded by the light shielding element 35, and infrared light emitted from the light emission source 331 is emitted from a portion far from the emission optical axis 31.
  • the optical axis of the light emission source 331 passes through the light shielding element 35.
  • the light emitting source 331 emits infrared light obliquely from the front light transmitting portion 3321 to the outside of the light transmitting element 332 and passes through the light through hole 142 to the front side of the substrate 12 to detect whether the object 200 covers the touch display screen 20.
  • the light shielding element 35 covers a part of the rear light transmitting portion 3322.
  • an included angle d between the infrared light emitted from the front light transmitting portion 3321 and the emission optical axis 31 of the light emission source 331 is 30-60 degrees.
  • the emission angle of the infrared emitter 33 is 30-60 degrees.
  • the angle of the included angle d is a specific angle such as 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, or 60 degrees.
  • the included angle between the infrared light emitted by the light emitting source 331 and the horizontal direction is also 30-60 degrees, so that the infrared light emitted by the light emitting source 331 can be set on the front side of the touch display screen 20.
  • the proximity sensor 30 includes a cover 36, and the cover 36 is configured with an infrared transmitter 33 and an infrared receiver 34.
  • the cover body 36 includes a top plate 361 and a side plate 362 extending from an edge of the top plate 361.
  • the side plate 362 surrounds the infrared transmitter 33 and the infrared receiver 34.
  • the top plate 361 has a through hole 3611 through which the infrared transmitter 33 and the infrared receiver 34 are exposed.
  • the cover 36 can protect the infrared transmitter 33 and the infrared receiver 34, thereby improving the life of the proximity sensor 30.
  • the cover body 36 may be supported by a material having a relatively high rigidity.
  • the material of the cover body 36 is metal, and specifically, the material of the cover body 36 is stainless steel, for example.
  • the cover body 36 can be formed into a top plate 361 and a side plate 362 by a stamping process, thereby forming the cover body 36.
  • the cover 36 further includes a light blocking plate 363.
  • the light blocking plate 363 is connected to the top plate 361 and isolates the infrared transmitter 33 and the infrared receiver 34. In this way, the light blocking plate 363 can prevent the infrared light emitted by the infrared transmitter 33 from directly transmitting to the infrared receiver 34 and affect the normal operation of the infrared receiver 34.
  • the infrared receiver 34 generates a signal representing that the front side of the touch display screen 20 is blocked, so that the processor 40 incorrectly controls the touch Display status of the display screen 20.
  • the material of the light blocking plate 363 is a light shielding material, and the light blocking plate 363 may be integrated with the top plate 361.
  • the top plate 361, the light blocking plate 363, and the side plate 362 may be formed by a stamping and bending process.
  • the circuit board 32 is formed with a groove 321, and an end of the light blocking plate 363 away from the top plate 361 is inserted into the groove 321.
  • the groove 321 can not only position the cover body 36 through the light blocking plate 363, but also make the cover body 36 mounted on the circuit board 32 more stable, which is beneficial to improving the stability of the proximity sensor 30.
  • the groove 321 is in a strip shape, and the groove 321 cooperates with the light blocking plate 363.
  • the size of the groove 321 is slightly larger than the size of the light blocking plate 363 so that the light blocking plate 363 can be inserted into the groove 321.
  • the electronic device 100 includes a light guide pillar 50 filled in the light through hole 142.
  • the light guide pillar 50 is advantageous for exporting infrared light to the front side of the substrate 12, and also can reduce foreign matter such as dust, liquid and the like from entering the electronic device 100 and damage the electronic device 100.
  • the light guide post 50 is made of a light-transmitting material.
  • the material of the light guide post 50 is a material such as silica gel or resin.
  • the light guide pillar 50 and the casing 10 may be a separate molded structure.
  • the light guide post 50 is inserted into the light through hole 142.
  • a slight gap is formed between the light through hole 142 and the light guide 50.
  • the light guide post 50 and the housing 10 may be an integrally formed structure.
  • a molten light guide material is injected into the light through hole 142, and the light guide material is solidified to form a surrounding wall. 14 is combined into an integrated light guide post 50, and the light guide post 50 and the surrounding wall 14 are difficult to separate.
  • the surrounding wall 14 includes an outer side surface 144
  • the light guide column 50 includes a top surface 52 facing the outer side of the housing 10. This can improve the aesthetics of the electronic device 100.
  • the smooth transition butt refers to that the height difference formed at the abutment between the top surface 52 and the outer side surface 144 is very small, or the height difference is zero.
  • the light through hole 142 includes a first aperture 1424 and a second aperture 1426, the first aperture 1424 is close to the proximity sensor 30, and the second aperture 1426 is far from the proximity sensor 30
  • the electronic device 100 further includes a light transmitting body 60 that covers and seals the first aperture 1424.
  • the transmissive body 60 not only allows infrared light emitted by the infrared emitter 33 to pass into the light through hole 142, but also prevents foreign objects from the outside from entering the electronic device 100 and damaging the electronic device 100.
  • the light-transmitting body 60 is in the shape of a sheet, and the light-transmitting body 60 may be on the inner side of the surrounding wall 14 by an adhesive. Since the adhesive has a sealing effect, this allows the light transmitting body 60 to seal the second aperture 1426.
  • the light transmissive body 60 and the light guide post 50 are integrally formed.
  • the materials of the translucent body 60 and the light guide post 50 are both resins.
  • the integrated translucent body 60 and the light guide post 50 can be formed by in-mold casting.
  • the assembling process of the light guide post 50 includes: the light guide post 50 extends from the housing 10 into the light through hole 142, so that the light transmitting body 60 abuts against the inner side of the surrounding wall 14.
  • the electronic device 100 further includes an electro-acoustic element 70.
  • the electro-acoustic element 70 is disposed adjacent to the proximity sensor 30.
  • the substrate 12 has a sound path 122 through which the power-supplying acoustic element 70 emits sound toward the front side of the substrate 12.
  • the electro-acoustic element 70 is, for example, a receiver.
  • the electro-acoustic element 70 emits a sound when the electronic device 100 is in a call service. In this way, when the electronic device 100 is in a call service, if the user brings the electro-acoustic element 70 close to the ear, the proximity sensor 30 can detect that the object 200 covers the touch display screen 20, and the processor 40 controls the touch display screen 20 to be in the off state. .
  • the proximity sensor 30 includes the circuit board 32, the transmitter 33 and the receiver 34, and the light shielding element 35.
  • the emitter 33 includes a light emitting source 331 and a light transmitting element 332.
  • the light emission source 331 is provided on the circuit board 32.
  • the light transmitting element 332 covers a light emitting source 331.
  • the light transmitting element 332 includes a front light transmitting portion 3321 and a rear light transmitting portion 3322 connected to the front light transmitting portion 3321.
  • the front light transmitting portion 3321 is located on the emission optical axis 31 of the light emitting source 331
  • the rear light transmitting portion 3322 is located on the rear side of the emission optical axis 31 of the light emission source 331
  • the receiver 34 is located on one side of the light emission source 331.
  • the light shielding element 35 covers at least a part of the rear light transmitting portion 3322.

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Abstract

一种接近传感器(30)及电子装置(100)，接近传感器(30)包括电路板(32)；均设置在电路板(32)上的红外发射器(33)和红外接收器(34)，红外发射器(33)包括设置在电路板(32)的光发射源(331)和罩设光发射源(331)的透光元件(332)，透光元件(332)包括前透光部(3321)和连接前透光部(3321)的后透光部(3322)，前透光部(3321)位于光发射源(331)的发射光轴(31)的前侧，后透光部(3322)位于光发射源(331)的发射光轴(31)的后侧，红外接收器(34)位于光发射源(331)的一侧；和遮光元件(35)，遮光元件(35)遮盖至少部分后透光部(3322)。

Description

接近传感器及电子装置
优先权信息
本申请请求2018年08月21日向中国国家知识产权局提交的、专利申请号为201810952376.0的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及电子设备领域，尤其涉及一种接近传感器及电子装置。
背景技术
在手机等电子装置中，电子装置设置有接近传感器，电子装置的处理器可以根据接近传感器的信号控制电子装置的显示屏的显示状态。为此，如何提高接近传感器的检测能力以准确地控制显示屏的显示状态成为关注的焦点。
发明内容
本申请提供一种接近传感器及电子装置。
本申请实施方式的接近传感器，包括：
电路板；
均设置在所述电路板上的红外发射器和红外接收器，所述红外发射器包括设置在所述电路板的光发射源和罩设所述光发射源的透光元件，所述透光元件包括前透光部和连接所述前透光部的后透光部，所述前透光部位于所述光发射源的发射光轴的前侧，所述后透光部位于光发射源的发射光轴的后侧，所述红外接收器位于所述光发射源的一侧；和
遮光元件，所述遮光元件遮盖至少部分所述后透光部。
本申请实施方式的电子装置包括：
壳体；和
设置在所述壳体内的接近传感器，所述接近传感器为以上所述的接近传感器。
本申请实施方式的的接近传感器及电子装置中，遮光元件遮挡至少部分后透光部，使得光发射源从前透光部出射的红外光可以更加集中，提高了红外发射器发出的红外光的能量，使得红外光出射的距离更远，也有利于红外光碰到物体后反射回到红外接收器，提高了接近传感器的检测能力。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的电子装置的部分立体示意；
图2是本申请实施方式的电子装置的分解示意图；
图3是图1的电子装置沿III-III向的截面示意图；
图4是本申请实施方式的电子装置的另一个剖面示意图；
图5是本申请实施方式的电子装置的又一个剖面示意图；
图6是本申请实施方式的电子装置的再一个剖面示意图；
图7是本申请实施方式的接近传感器的剖面示意图；
图8是本申请实施方式的接近传感器的另一个剖面示意图；
图9是本申请实施方式的接近传感器的又一个剖面示意图；
图10是本申请实施方式的接近传感器的立体示意图；
图11是本申请实施方式的接近传感器的分解示意图；
图12是本申请实施方式的接近传感器的剖面示意图。
主要元件符号说明：
电子装置100、物体200；
壳体10、基板12、声通道122、围壁14、光通孔142、光通孔142的轴线1422、第一孔口1424、第二孔口1426、外侧面144、收容空间16；
触摸显示屏20、显示屏21、盖板22；
接近传感器30、发射光轴31、电路板32、凹槽321、红外发射器33、光发射源331、透光元件332、前透光部3321、后透光部3322、红外接收器34、遮光元件35、罩体36、顶板361、通孔3611、侧板362、挡光板363；
处理器40、导光柱50、顶面52；
透光体60、电声元件70。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请一并参阅图1-图2，本申请实施方式的电子装置100包括壳体10、触摸显示屏20和接近传感器30。
请参阅结合图3，壳体10包括基板12和自基板12的边缘向后延伸的围壁14。基板12和围壁14共同围成有收容空间16。围壁14具有连通收容空间16的光通孔142。触摸显示屏20盖设在基板12的前侧。接近传感器30设置在收容空间16内。接近传感器30包括红外发射器33和红外接收器34。红外发射器33用于通过光通孔142向基板12的前侧发射红外光。红外接收器34用于接收红外发射器33发出的且经由外界物体反射回的红外光。
本申请实施方式的电子装置100中，接近传感器30通过位于围壁14的光通孔142向基板12的前侧发射红外光，并接收物体反射回的红外光。电子装置100可以根据接近传感器30的信号控制触摸显示屏20的显示状态。接近传感器30被触控显示屏20覆盖，不会占用基板12的前侧空间，避免接近传感器30与触摸显示屏20干涉，提高了电子装置100的屏占比。
示例性的，电子装置100可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图1中只示例性的示出了一种形态)。具体的，电子装置100可以为移动电话或智能电话(例如，基于iPhone TM，基于Android TM的电话)，便携式游戏设备(例如Nintendo DS TM，PlayStation Portable TM，Gameboy Advance TM，iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备，其他手持设备以及诸如手表、入耳式耳机、吊坠、头戴式耳机等，电子装置100还可以为其他的可穿戴设备(例如，诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身、电子设备或智能手表的头戴式设备(HMD))。
电子装置100还可以是多个电子设备中的任何一个，多个电子设备包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、照相机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理 (PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器，便携式医疗设备以及数码相机及其组合。
在一些情况下，电子装置100可以执行多种功能(例如，播放音乐，显示视频，存储图片以及接收和发送电话呼叫)。如果需要，电子装置1000可以是诸如蜂窝电话、媒体播放器、其他手持设备、腕表设备、吊坠设备、听筒设备或其他紧凑型便携式设备的便携式设备。
壳体10大致呈长方体形。壳体10为电子装置100的承载件，用于承载电子装置100的大部分零件。壳体10可以采用塑料制成，也可以采用金属材料制成，或者采用塑料和金属通过模内注塑的工艺形成一体结构。在一个实施方式中，基板12的材料为金属，围壁14的材料为塑料。
壳体12的制作方法包括：先将基板12放入模具内，然后通过向模具内注入熔融的塑胶，待塑胶固化后形成围壁14，从而得到壳体10。
触摸显示屏20可以包括显示屏21和盖板22，盖板22覆盖显示屏21。显示屏21例如为OLED(Organic Light-Emitting Diode，有机发光二极管)等柔性显示屏。当然，显示屏21也可以为液晶显示屏。盖板22覆盖显示屏21可以减少显示屏受到外界的冲击。触摸显示屏20可以通过粘胶固定在基板12的前侧。
触摸显示屏20可以接收外界的触摸输入，从而产生相应的信号，以使触摸显示屏20可以运行在不同的状态。例如，触摸显示屏20在播放视频内容时，如果触摸显示屏20接收到点击输入，那么，触摸显示屏20可以暂停播放视频。
红外发射器33向基板12的前侧发出红外光后，如果红外光到达基板12的前侧的物体200，那么红外光则会被物体200反射，反射的红外光从光通孔142传至红外接收器34，红外接收器34根据获取的红外光产生相应的电信号。电子装置100从而可以根据红外发射器33发出的红外光和接收到的红外光的时间差以计算接近传感器30与物体200的距离，进而根据控制触摸显示屏20的显示状态。
例如，当有物体200接近触摸显示屏20时，可以控制触摸显示屏20处于熄屏状态。此处所指的“熄屏状态”指的是，触摸显示屏20断电而无法显示内容。
本申请实施方式中，接近传感器30发射和接收的光线位于盖板22的外侧。或者说，接近传感器30发射和接收的光线不穿过盖板22。
如图1所示，电子装置100包括处理器40，所述处理器40用于根据所述红外接收器30接收的红外光控制所述触摸显示屏20的显示状态。在一个例子中，当用户在接听或者拨打电话并将电子装置100靠近头部时，处理器40经过计算接近传感器30发出红外光和接收被物体200反射回来的红外光的时间生成检测信息。处理器40根据该检测信息关闭触摸 显示屏20。当电子装置100远离头部时，处理器40再次根据接近传感器30反馈回来的检测信息重新开启触摸显示屏20。
本实施方式中，接近传感器30可以通过支架等元件固定在基板12上，或者，接近传感器30固定在电子装置100的其他元件上。
光通孔142例如为直孔，或者说，在光通孔142的轴向上，光通孔142的内表面为直线型。当然，在光通孔142的轴向上，光通孔142的内表面也可以为曲线型或折线型。接近传感器30发出红外光可以经过光通孔142后出射至触摸显示屏20的前侧。
请参阅图3，在一个例子中，光通孔142的轴线1422可以竖直设置。需要说明的是，虽然光通孔142的轴线1422竖直设置，但是由于红外发射器33发出的红外光倾斜，因此，红外发射器33发出的红外光也可以传至触摸显示屏20的前侧以检测触摸显示屏20的前侧是否有物体遮挡触摸显示屏20。
当然，在另一个例子中，在光通孔142靠近接近传感器30的一侧向远离接近传感器30的一侧的方向上，光通孔142的轴线1422朝向基板12的前侧倾斜设置，如图4所示。如此，红外发射器33发出的红外光经过光通孔142后更加容易传至触摸显示屏20的前侧。
本实施方式中，光通孔142位于围壁14的顶部位置。也即是说，光通孔142位于电子装置100的顶部。此处所指的“顶部”为：电子装置100处于竖立正常使用状态时，电子装置100位于远离地面的端部。或者说，“顶部”为电子装置100的长度方向一侧的端部。当然，光通孔142也可以位于围壁14的其他位置，例如，光通孔142位于围壁14的底部或侧部等位置。
需要指出的是，本实施方式中，“前侧”的是触摸显示屏20产生的红外光出射至电子装置100外的一侧。例如，用户在观看触摸显示屏20显示的内容时，触摸显示屏20朝向用户的一侧为前侧。反之，与前侧相背的一侧为后侧。
需要指出的是，红外发射器33发出的红外光并没有穿过基板12，从而没有经过触摸显示屏20。红外发射器33发出的红外光与触摸显示屏20的厚度方向(图3中的水平方向)形成锐角，从而使得红外光可以出射至基板12的前侧。接近传感器30设置在收容空间16内，也即是说，接近传感器30设置在壳体10内。
请参阅图3，在某些实施方式中，红外发射器33的发射光轴31穿过光通孔142，红外发射器33的发射光轴31自红外发射器33向基板12的前侧倾斜。
红外发射器33的发射光轴31向基板12的前侧倾斜，这样使得红外发射器33发出的红外光与水平方向的夹角更小，从而使得红外发射器33发出的红外光可以发射至位于触摸显示屏20前方的物体200，以检测是否有物体200接近触摸显示屏20。
可以理解，红外发射器33发出的红外光具有一定的发射角。红外发射器33的发射角为红外发射器33发出的红外光与发射光轴31之间的夹角。红外发射器33的发射光轴31穿过第二孔口1426的中间部位，使得红外发射器33发出的红外光可以从第二孔口1426的边缘位置出射至基板12的前侧。
红外发射器33的发射光轴31与红外发射器33发出的红外光的中心轴线重合。接近传感器30的发出的红外光围绕红外发射器33的发射光轴31分布。
具体地，光通孔142包括第一孔口1424和第二孔口1426。第一孔口1424靠近接近传感器30。第二孔口1426远离接近传感器30。红外发射器33的发射光轴31穿过第二孔口1426的中间位置。
请参阅图3，在某些实施方式中，红外发射器33的发射光轴31与水平方向的夹角a为30-60度。例如，夹角a例如为30度、35度、40度、50度、60度等角度。夹角a在以上的角度范围时，可以使得红外发射器33发出的红外光更多地从光通孔142出射至触摸显示屏20的前侧，以检测是否有物体200遮挡触摸显示屏20。
可以理解，由于红外发射器33发出的红外光具有一定的发射角。因此，以红外发射器33的发射光轴31为界，靠近基板12的前侧的红外光与水平方向的夹角小于夹角a，远离基板12的前侧的红外光与水平方向的夹角大于夹角a。例如，当夹角a为45度时，靠近基板12的前侧的红外光与水平方向的夹角为35度，远离基板12的前侧的红外光与水平方向的夹角为60度。
需要指出的是，本申请所指的水平方向为触摸显示屏20的厚度方向，也即是说，红外发射器33的发射光轴31与触摸显示屏20的厚度方向的夹角a为30-60度。
请一并参阅图3、图7及图8，在某些实施方式中，接近传感器30还包括电路板32，电路板32水平设置。红外发射器33和红外接收器34均设置在电路板32上。红外发射器33的发射光轴31相对于电路板32倾斜设置，以使红外发射器33的发射光轴31向基板12的前侧倾斜。
电路板32水平设置，而红外发射器33的发射光轴31相对于电路板32倾斜设置，这样使得红外发射器33的发射光轴31相对于水平方向倾斜设置，从而使得红外发射器33的发射光轴31穿过光通孔142后，可以向基板12的前侧倾斜，以使红外发射器33发出的红外光可以射至触摸显示屏20的前侧。
红外发射器33的发射光轴31相对于电路板32倾斜设置指的是：红外发射器33的发射光轴31与电路板32并不垂直，红外发射器33的发射光轴31相对于电路板32的表面之间夹角b为锐角。
或者说，红外发射器33的发射光轴31与电路板32之间的夹角b小于90度。在一个例子中，红外发射器33的发射光轴31与电路板32的夹角b为30-60度。例如，夹角b为30度、35度、45度、50度或60度等角度。可以理解，当电路板32水平设置时，夹角a和夹角b相同。
具体地，电路板32例如为印刷电路板(Printed circuit board，PCB)，电路板32水平设置指的是，电路板32的上表面处于水平状态，或者说，电路板32的厚度方向为竖直状态。
请参阅图5，在某些实施方式中，接近传感器30的电路板32相对于水平方向倾斜设置。红外发射器33和红外接收器34均设置在电路板32上。红外发射器33用于发射红外光，红外接收器34用于接收红外光，红外发射器33的发射光轴31相对于电路板32垂直设置，以使红外发射器33的发射光轴31向基板12的前侧倾斜。
电路板32相对于水平方向倾斜设置，而红外发射器33的发射光轴31相对于电路板32垂直设置，这样使得红外发射器33的发射光轴31相对于水平方向倾斜设置，从而使得红外发射器33的发射光轴31穿过光通孔142后，可以向基板12的前侧倾斜，以使红外发射器33发出的红外光可以射至触摸显示屏20的前侧。
可以理解，虽然红外发射器33的发射光轴31垂直于电路板32，但是，由于红外发射器33发出的红外光具有一定的发射角，因此，红外发射器33发出的红外光可以相对于电路板32倾斜。
请参阅图5及图9，在一个例子中，电路板32相对于水平方向倾斜的角度c为30-60度。例如，角度c为30度、35度、45度、50度或60度等角度。
请一并参阅图10-图12，在某些实施方式中，红外发射器33包括光发射源331和透光元件332。光发射源331设置在电路板32。透光元件332罩设光发射源331。透光元件332包括前透光部3321和连接前透光部3321的后透光部3322。前透光部3321位于光发射源331的发射光轴31的前侧。后透光部3322位于光发射源331的发射光轴31的后侧。红外接收器34位于光发射源331的一侧。接近传感器30还包括遮光元件35，遮光元件35遮盖至少部分后透光部3322。
如此，遮光元件35遮挡至少部分后透光部3322，使得从前透光部3321出射的红外光可以更加集中，提高了从前透光部3321出射的红外光的能量，使得红外光出射的距离更远，也有利于红外光碰到物体200后反射回到红外接收器34，提高了接近传感器30的检测能力。
具体地，透光元件332可以由透光材料制成。例如，透光元件332的材料为树脂或玻璃。透光元件332罩设光发射源331，或者说，光发射源331设置在透光元件332内。这样使得透光元件332可以保护光发射源331，避免光发射源331与氧气接触而损坏等问题。
需要指出的是，发射光轴31的前侧中所指的“前侧”与上述基板12的前侧中所指的“前侧”的方向一致。因此，光发射源331发出的红外光依次经过前出光部和光通孔142后可以到达触摸显示屏20的前侧，以检测触摸显示屏20是否被遮挡。
需要说明的是，遮光元件35从后透光部3322的左侧延伸至右侧。即是说，后透光部3322的左后部位和右后部位均被遮盖。遮光元件35例如为泡棉、黑色油墨层或金属层等具有遮挡红外光通过的元件。
在接近传感器30设置有遮光元件35时，红外发射器33的发射光轴31可以垂直于电路板32，也可以倾斜于电路板32设置。电路板32可以相对于水平方向倾斜设置，也可以水平设置。
请结合图6，在某些实施方式中，前透光部3321靠近触摸显示屏20设置。后透光部3322远离触摸显示屏20设置。光发射源331用于通过前透光部3321和光通孔142向基板12的前侧发射红外光。
如此，接近传感器30可以正常工作以检测触摸显示屏20的前侧是否有物体200遮挡。
如图6的示例所示，红外发射器33的发射光轴31垂直于电路板32，电路板32水平设置。此时，红外发射器33发出的红外光从透光元件332的前透光部3321出射，经过光通孔142后出射至触摸显示屏20的前侧。
请参阅图12，在某些实施方式中，遮光元件35遮盖后透光部3322的整体。或者说，遮光元件35完全遮盖后透光部3322，此时，光发射源331发出的红外光从前透光部3321出射，使得出射光的能量更加集中。
进一步地，光发射源331的发射光轴31垂直于电路板32。遮光元件35遮盖前透光部3321靠近光发射源331的发射光轴31的部位。也就是说，靠近发射光轴31的前透光部3321的一部分被遮光元件35遮光，光发射源331发出的红外光从远离发射光轴31的部分射出。
此时，光发射源331的光轴穿过遮光元件35。光发射源331发出红外光从前透光部3321倾斜地射出至透光元件332外，经过光通孔142后传至基板12的前侧以检测物体200是否遮盖触摸显示屏20。
当然，在某些实施方式中，遮光元件35遮盖后透光部3322的一部分。
请参阅图12，在某些实施方式中，从前透光部3321射出的红外光与光发射源331的发射光轴31的夹角d为30-60度。或者说，此时，红外发射器33的发射角为30-60度。例如，夹角d的角度为30度、35度、40度、45度、50度或60度等具体角度。
当电路板32水平设置时，光发射源331发出的红外光与水平方向夹角也为30-60度，这样使得光发射源331发出的红外光可以设置触摸显示屏20的前侧。
请一并参阅图7、图10-图11，在某些实施方式中，接近传感器30包括罩体36，罩体36罩设红外发射器33和红外接收器34。罩体36包括顶板361和自顶板361的边缘延伸的侧板362。侧板362围绕红外发射器33及红外接收器34。顶板361具有供红外发射器33和红外接收器34露出的通孔3611。
如此，罩体36可以保护红外发射器33和红外接收器34，从而提高接近传感器30的寿命。罩体36可以采用刚度较大的材料支撑，例如，罩体36的材料为金属，具体地，罩体36的材料例如为不锈钢。罩体36可以通过冲压的工艺形成顶板361和侧板362，进而形成罩体36。
请一并参阅图7、图10-图11，在某些实施方式中，罩体36还包括挡光板363，挡光板363设置连接顶板361且隔离红外发射器33和红外接收器34。如此，挡光板363可以防止红外发射器33发出的红外光直接传至红外接收器34，而影响红外接收器34正常工作。
可以理解，如果红外发射器33发出的红外光直接地传至红外接收器34，此时，红外接收器34产生代表触摸显示屏20的前侧被遮挡的信号，使得处理器40错误地控制触摸显示屏20的显示状态。
挡光板363的材料为遮光材料，挡光板363可以与顶板361为一体结构。或者说，可以通过冲压折弯的工艺形成顶板361、挡光板363和侧板362。
请一并参阅图7、图10-图11，在某些实施方式中，电路板32形成有凹槽321，挡光板363远离顶板361的一端插入在凹槽321中。如此，凹槽321不仅可以通过挡光板363定位罩体36的位置，还可以使得罩体36安装在电路板32上更加稳定，有利于提高接近传感器30的稳定性。具体地，凹槽321呈条状，凹槽321与挡光板363配合，凹槽321的尺寸略大于挡光板363的尺寸以使挡光板363可以插入到凹槽321中。
请再次参阅图2及图3，在某些实施方式中，电子装置100包括填塞在光通孔142的中的导光柱50。如此，导光柱50有利于将红外光导出至基板12的前侧，还可以减少外界的灰尘、液体等异物进入电子装置100的内部而损坏电子装置100。可以理解，导光柱50采用透光材料制成，例如导光柱50的材料为硅胶或树脂等材料。
导光柱50与壳体10可以为分体成型结构。例如，壳体10和导光柱50分体成型后，将导光柱50塞入光通孔142中，此时，光通孔142和导光柱50形成有微小的间隙。当然，导光柱50与壳体10可以为一体成型结构，例如，围壁14形成光通孔142后，向光通孔142内注入熔融的导光材料，待导光材料凝固后形成与围壁14结合成一体的导光柱50，导光柱50和围壁14难以分离。
请参阅图6，在某些实施方式中，围壁14包括外侧面144，导光柱50包括朝向壳体 10的外侧的顶面52，顶面52与外侧面144平滑过渡对接。这样可以提高电子装置100的美观性。平滑过渡对接指的是，顶面52和外侧面144的对接处形成的高度差非常小，或者高度差为零。
请再次参阅图3，在某些实施方式中，光通孔142包括第一孔口1424和第二孔口1426，第一孔口1424靠近接近传感器30，第二孔口1426远离接近传感器30，电子装置100还包括透光体60，透光体60覆盖且密封第一孔口1424。
如此，透光体60不仅使得红外发射器33发出的红外光通过以进入光通孔142内，还可以防止外界的异物进入电子装置100的内部而损坏电子装置100。
在一个例子中，透光体60呈片状，透光体60可以通过粘胶在围壁14的内侧。由于粘胶具有密封作用，因此，这样可以使得透光体60可以密封第二孔口1426。
请再次参阅图2，在某些实施方式中，透光体60与导光柱50为一体成型结构。例如，透光体60和导光柱50的材料均为树脂，这样可以通过模内浇注的方式形成一体的透光体60和导光柱50。在一个例子中，导光柱50的组装过程包括：导光柱50从壳体10内伸入光通孔142中，以使透光体60抵靠在围壁14的内侧。
请参阅图2及图3，在某些实施方式中，电子装置100还包括电声元件70，电声元件70邻近接近传感器30设置。基板12具有供电声元件70向基板12的前侧出声的声通道122。
电声元件70例如为受话器，电声元件70在电子装置100处于通话业务时发出声音。如此，电子装置100处于通话业务时，如果用户将电声元件70靠近耳朵，那么，接近传感器30可以检测到有物体200遮挡触摸显示屏20，处理器40则控制触摸显示屏20处于熄屏状态。
综上，本发明实施方式的接近传感器30包括电路板32、发射器33和接收器34和遮光元件35。发射器33包括光发射源331和透光元件332。光发射源331设置在电路板32。透光元件332罩设光发射源331，透光元件332包括前透光部3321和连接前透光部3321的后透光部3322，前透光部3321位于光发射源331的发射光轴31的前侧，后透光部3322位于光发射源331的发射光轴31的后侧，接收器34位于光发射源331的一侧。遮光元件35遮盖至少部分后透光部3322。
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施方式，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种接近传感器，其特征在于，包括：
    电路板；
    均设置在所述电路板上的红外发射器和红外接收器，所述红外发射器包括设置在所述电路板的光发射源和罩设所述光发射源的透光元件，所述透光元件包括前透光部和连接所述前透光部的后透光部，所述前透光部位于所述光发射源的发射光轴的前侧，所述后透光部位于光发射源的发射光轴的后侧，所述红外接收器位于所述光发射源的一侧；和
    遮光元件，所述遮光元件遮盖至少部分所述后透光部。
  2. 根据权利要求1所述的接近传感器，其特征在于，所述遮光元件遮盖所述后透光部的整体。
  3. 根据权利要求2所述的接近传感器，其特征在于，所述光发射源的发射光轴垂直于所述电路板，所述遮光元件遮盖所述前透光部靠近所述光发射源的发射光轴的部位。
  4. 根据权利要求3所述的接近传感器，其特征在于，从所述前透光部射出的红外光与所述光发射源的发射光轴的夹角为30-60度。
  5. 根据权利要求1所述的接近传感器，其特征在于，所述遮光元件包括黑色油墨层。
  6. 根据权利要求1所述的接近传感器，其特征在于，所述接近传感器包括罩设所述红外发射器和所述红外接收器的罩体，所述罩体包括顶板和自所述顶板的边缘延伸的侧板，所述侧板围绕所述红外发射器及所述红外接收器，所述顶板具有供所述红外发射器和所述红外接收器露出的通孔。
  7. 根据权利要求6所述的接近传感器，其特征在于，所述罩体还包括设置连接所述顶板且隔离所述红外发射器和所述红外接收器的挡光板。
  8. 根据权利要求7所述的接近传感器，其特征在于，所述电路板形成有凹槽，所述挡光板远离所述顶板的一端插入在所述凹槽中。
  9. 根据权利要求8所述的接近传感器，其特征在于，所述凹槽呈条状，所述凹槽与所述挡光板配合。
  10. 根据权利要求7所述的接近传感器，其特征在于，所述挡光板与所述顶板为一体结构。
  11. 根据权利要求1所述的接近传感器，其特征在于，所述电路板水平设置，所述红外发射器的发射光轴相对于所述电路板倾斜设置。
  12. 根据权利要求1所述的接近传感器，其特征在于，所述遮光元件遮盖所述后透光部的一部分。
  13. 一种电子装置，其特征在于，包括：
    壳体；和
    设置在所述壳体内的接近传感器，所述接近传感器为权利要求1-12任一项所述的接近传感器。
  14. 根据权利要求13所述的电子装置，其特征在于，所述壳体包括基板和自所述基板的边缘向后延伸的围壁，所述基板和所述围壁共同围成有收容空间，所述围壁具有连通所述收容空间的光通孔，所述接近传感器设置在所述收容空间内，所述电子装置还包括盖设在所述基板的前侧的触摸显示屏；
    所述前透光部靠近所述触摸显示屏设置，所述后透光部远离所述触摸显示屏设置，所述光发射源用于通过所述前透光部和所述光通孔向所述基板的前侧发射红外光，所述红外接收器用于接收来自所述基板的前侧的红外光。
  15. 根据权利要求14所述的电子装置，其特征在于，在所述光通孔靠近所述接近传感器的一侧向远离所述接近传感器的一侧的方向上，所述光通孔的轴线朝向所述基板的前侧倾斜设置。
  16. 根据权利要求14所述的电子装置，其特征在于，所述电子装置包括填塞在所述光通孔的中的导光柱。
  17. 根据权利要求16所述的电子装置，其特征在于，所述围壁包括外侧面，所述导光柱包括朝向所述壳体的外侧的顶面，所述顶面与所述外侧面平滑过渡对接。
  18. 根据权利要求14所述的电子装置，其特征在于，所述光通孔包括靠近所述接近传感器的第一孔口和远离所述接近传感器的第二孔口，所述电子装置还包括覆盖且密封所述第一孔口的透光体。
  19. 根据权利要求13所述的电子装置，其特征在于，所述电子装置还包括邻近所述接近传感器设置的电声元件，所述基板具有供所述电声元件向所述基板的前侧出声的声通道。
  20. 一种电子装置，其特征在于，包括：
    触摸显示屏，所述触摸显示屏包括显示屏和盖板，所述盖板覆盖所述显示屏；和
    权利要求1-12任意一项所述接近传感器，所述接近传感器发射和接收的光线位于所述盖板的外侧。
PCT/CN2019/088580 2018-08-21 2019-05-27 接近传感器及电子装置 WO2020038030A1 (zh)

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