WO2020024432A1

WO2020024432A1 - Communication device

Info

Publication number: WO2020024432A1
Application number: PCT/CN2018/110544
Authority: WO
Inventors: 赵晨飞
Original assignee: 中兴通讯股份有限公司
Priority date: 2018-08-01
Filing date: 2018-10-16
Publication date: 2020-02-06
Also published as: CN110797657A; CN110797657B

Abstract

The embodiment of the present application discloses a communication device. The communication device comprises: a circuit board, the circuit board comprising a floor; an antenna being arranged on the floor; and the floor, as an irradiator of the antenna, being used for radiating a radio frequency signal.

Description

communication device

Cross-reference to related applications

This application is based on a Chinese patent application with an application number of 201810864678.2 and an application date of August 01, 2018, and claims the priority of the Chinese patent application. The entire contents of the Chinese patent application are incorporated herein by reference.

Technical field

This application relates to the field of wireless communications but is not limited to the field of wireless communications, and in particular, to a communication device.

Background technique

The antenna is a necessary part of the communication equipment, and the antenna is used for transmitting and receiving wireless signals. In order to meet different communication needs of communication devices, various types of antennas may be provided in a communication device, such as a Global Positioning System (Global Positioning System, GPS) antenna, a WiFi antenna, and a mobile antenna that communicates with a base station. In the prior art, in order to achieve miniaturization and aesthetics of electronic devices, external antennas that are not exclusively independent of the device are no longer provided, but are instead provided on an antenna bracket or housing inside the communication device, for example, on a mobile phone Antenna on the back or side of the internal antenna bracket. However, this antenna design will cause the antenna design of communication equipment to become more difficult. Especially when the number of 5G terminal antennas is increased, it may conflict with the design of the volume key or power key and card slot on the outer surface of the housing.

Summary of the invention

In view of this, embodiments of the present application are expected to provide a communication device.

The technical solution of this application is implemented as follows:

A communication device includes:

A circuit board, wherein the circuit board includes a floor;

An antenna is provided on the floor;

The floor, as a radiator of the antenna, is configured to radiate radio frequency signals.

In the communication device provided in the embodiment of the present application, the antenna is arranged on the floor of the circuit board. In this way, it is not necessary to reserve an antenna setting position on the outer shell of the communication device, thereby reducing the distance between other keys on the shell of the communication device. Conflicts, simplifying the housing of communication equipment; and using the floor as a radiator of the antenna for signal radiation, realizing the reuse of the floor, thereby reducing the setting of the dedicated radiator of the antenna, the structure of the communication equipment is more delicate, and the communication is reduced The number of electronic devices included in the device is due to the thinning and thinning of the communication device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a first communication device according to an embodiment of the present application; FIG.

2 is a schematic structural diagram of a second communication device according to an embodiment of the present application;

3 is a schematic structural diagram of a third communication device according to an embodiment of the present application;

4 is a schematic structural diagram of a fourth communication device according to an embodiment of the present application;

5 is a schematic structural diagram of a fifth communication device according to an embodiment of the present application;

6 is a schematic structural diagram of a sixth communication device according to an embodiment of the present application;

7 is a schematic structural diagram of a seventh communication device according to an embodiment of the present application;

8 is a schematic structural diagram of an eighth communication device according to an embodiment of the present application;

FIG. 9 is a schematic structural diagram of a ninth communication device according to an embodiment of the present application.

detailed description

The technical solution of the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments of the specification. It is worth noting that the ordinal numbers such as “first” and “second” are used in the embodiments of the present application to distinguish different devices, but not to limit the structure or function of the devices themselves.

As shown in FIG. 1, this embodiment provides a communication device, including:

A circuit board 300, wherein the circuit board 300 includes a floor 100;

An antenna 200 is disposed on the floor 100;

The floor 100 serves as a radiator of the antenna 200 and is configured to radiate radio frequency signals.

The communication device includes a circuit board 300 and an antenna 200, and the antenna 200 is disposed on the circuit board 300.

The communication device may be various types of communication devices, and may include a fixed communication device and a mobile communication device. The mobile communication device may include: a human-borne communication device, a vehicle-mounted communication device, and a smart robot; the human-borne communication device may include: a wearable device such as a mobile phone, a tablet computer, a smart bracelet or a smart watch. The in-vehicle communication device may include: communication devices mounted on various vehicles. The intelligent robot may include a bottom-surface mobile robot including a mobile chassis, and an aircraft flying in the air, for example, a drone flying at a low altitude.

The circuit board 300 may be various types of circuit boards 300 located in a housing of the communication device, for example, printed circuit boards (PCBs) of various sizes. In some embodiments, the circuit board 300 for setting the antenna 200 may be a motherboard. The motherboard may also be referred to as a system board. Various chipsets of the communication device may be set on the motherboard, and the chipset includes but is not limited to at least one of the following:

Basic Input / Output (BIOS) chip,

Input / output interface chips, various bus (for example, integrated circuit bus, peripheral component interconnect standard bus) chips;

Processing chip, for example, a central processing unit chip, a digital signal processor chip, a programmable device chip, and the like.

The circuit board 300 may include:

A ground layer, including the floor 100, configured to be grounded;

The wiring layer includes circuits; wiring is provided for mounting electronic components.

The floor 100 may be made of a single piece of metal.

The circuit on the circuit layer may be formed by circuit etching.

An insulation isolation is provided between the line layer and the ground layer, and an electrical connection is established at a ground point.

Generally, the floor 100 is reserved for grounding use. In this embodiment, the antenna 200 is specifically set on the floor 100; thus, on the one hand, the effective use rate of the floor 100 is improved, and on the other hand, the antenna 200 is It is no longer necessary to design an antenna bracket or occupy a housing of a communication device; on the other hand, the floor 100 is also used as a radiator of the antenna 200 to participate in radiation of radio frequency signals. The signal radiated here may be a wireless signal of a predetermined frequency band, for example, a wireless signal of a fifth generation mobile communication (5G). The frequency of the radio frequency signal in this embodiment may be: a Sub6G frequency band. In this embodiment, the floor 100 functions as a radiator of the antenna 200 to radiate radio frequency signals, which is equivalent to enriching the function of the floor 100. It can be used not only for grounding, but also as a radiator for wireless signals. .

In this way, the circuit board 300 can be used to carry the antenna 200. In this way, compared with the antenna 200 being installed on the outer casing of the electronic device, the space for setting the antenna 200 is not reserved in the communication device, and the setting of the antenna 200 is reduced. Interference with the setting of various keys on the outer surface of the communication device, for example, reduces interference with physical keys such as the volume key and power key, and saves the internal space occupied by the antenna 200 to the communication device, thereby reducing the design difficulty and production of the communication device Difficulty.

In some embodiments, as shown in FIG. 2, the antenna 200 is a coupled feed antenna, and the coupled feed antenna further includes:

A first feed source 201 located on the floor 100 and configured to feed an antenna signal;

A first excitation unit, located on the floor 100, electrically connected to the first feed source 201, and configured to excite radiation of a radio frequency signal based on an antenna signal, and serve as a radiator of the coupled feed antenna;

The radiator and the radiator are configured to radiate the radio frequency signal under the excitation of the excitation unit.

The coupled feeding antenna is an antenna 200 that uses a coupled feeding method to feed power. The coupling feed is a method of conducting electrical energy between two circuit elements that are not in contact but have a certain distance by coupling.

In the embodiment of the present application, the electrical connection not only requires a physical connection to be established between the first inductive-capacitance matching component, the first feeder, and the feeder 202, and at the same time, the physical connection needs to be capable of conducting electricity to realize the transmission of electrical signals.

In this embodiment, the first feed source 201 may be a source of electric capacity feed. In this embodiment, the first feed source 201 includes a feed point provided on the floor 100. The first feed source 201 is connected to a radio frequency circuit and receives an electric signal fed by the radio frequency circuit.

The first excitation unit is provided on the floor 100 to establish an electrical connection with the first feed source 201, for example, an electrical connection is established through a wire, and the electrical signal fed by the first feed source 201 is received to excite the electrical signal. The radiator of the antenna 200 radiates radio frequency signals.

In this embodiment, the first excitation unit also functions as a radiator of the antenna 200, and radiates radio frequency signals for the antenna 200 together with the radiator that is the floor 100.

In some embodiments, the first excitation unit is electrically connected to the first feed source 201 through a feed line 202.

In this embodiment, a feed line 202 is further provided on the floor 100, and an electrical connection is established between the feed line 202 and the first feed source 201, which can be used to feed the electric energy fed by the radio frequency circuit with an electric signal. The method is conducted to the first excitation unit, and the first excitation unit is configured to perform excitation of radio frequency signal radiation.

In some embodiments, the first excitation unit includes:

A first wire 203 electrically connected to the feeder 202;

The second wire 204 is electrically connected to the floor 100 and is coupled to the first wire 203.

In this embodiment, the first excitation unit includes a first conducting wire 203 and a second conducting wire 204; the first conducting wire 203 is electrically connected to the feeder 202, and can conduct power supply signals. The second wire 204 may be arranged in parallel with the first wire 203. For example, the first wire 203 and the second wire 204 are arranged in parallel to realize the coupling between the second wire 204 and the first wire 203; thus, the first wire 203 The electric energy received from the feeder 202 can be conducted to the second wire 204 in a coupled manner; it is convenient for the first wire 203 and the second wire 204 to be used together for the excitation of the signal radiation of the radiator of the antenna 200.

In some embodiments, as shown in FIG. 3, the antenna-coupled feed antenna further includes:

The first inductive-capacitive matching component X1 is electrically connected between the first feed source 201 and the feeder line 202 and is configured for inductive-capacitive matching of the antenna 200.

In this embodiment, the first inductive-capacitive matching component X1 includes one or more inductive-capacitive matching components. In this way, the antenna 200 is implemented by the capacitive element and / or inductive element in the first inductive-capacitive matching component X1. To improve the energy conversion efficiency of the antenna 200.

In some embodiments, as shown in FIG. 4, the incentive unit further includes:

The first capacitive component C1 is electrically connected between the feeder and the first wire.

The first capacitive component C1 may be an impedance-capacitive electronic component or a combination of electronic components, and may include one or more capacitors; the first capacitive component C1 may serve as the capacitance of the antenna 200. load. The first capacitive component C1 may be a lumped parameter circuit element or a distributed parameter circuit element. The lumped parameter circuit is: the size of the actual circuit is much smaller than that of the wavelength corresponding to the operating frequency of the circuit. The lumped parameter circuit element may be an electronic component constituting the lumped parameter circuit.

The distributed parameter circuit may be relative to the lumped parameter circuit. The distributed parameter circuit element may be an electronic component constituting a distributed parameter circuit; usually, the size of the transmission line of the distributed parameter circuit is similar to the wavelength of the working frequency of the circuit, for example, the size of the transmission line is the wavelength of the working frequency of the circuit It is on the order of the same unit of measurement. For example, the size of the transmission line of a distributed parameter circuit is similar to the wavelength of the operating frequency of the circuit.

In short, in this embodiment, the first capacitive element may be a lumped parameter circuit element or a distributed parameter circuit element.

The first capacitive component C1 is electrically connected between the feeder and the first wire, so that the capacitive reactance of the antenna 200 is increased; the size of the antenna 200 is inversely related to the capacitive reactance of the antenna 200. The introduction of the capacitive component C1 reduces the size of the antenna 200 by increasing the capacitive reactance of the antenna 200. In this way, the size of the antenna 200 is reduced, and the size of the headroom provided for the antenna signal radiation in the electronic device can also be reduced. It is beneficial for the internal structure of the communication device to be more compact and the volume of the communication device to be reduced.

In some embodiments, the feed-coupled antenna further includes:

The second capacitive component C2 is electrically connected to the second wire and is configured to adjust a radiation frequency and a bandwidth of the feed coupling antenna.

In this embodiment, the antenna 200 is further provided with a second capacitive component C2, and the second capacitive component C2 may also be an electronic component or a combination of electronic components with capacitive impedance; it may be used to utilize its own capacitance. Value, adjust the position of the resonance frequency of the antenna 200 to adjust the radiation frequency and bandwidth. For example, the second capacitive component C2 can be used to make the antenna 200 resonate at a preset radiation frequency, thereby adjusting the radiation frequency. For example, the second capacitive component C2 can be used to make the reflection loss near the resonance point frequency increase slowly, thereby increasing the bandwidth.

This embodiment also provides another antenna 200. This antenna 200 is a loop radiation antenna. A loop radiating antenna generally has a loop shape. As shown in FIG. 5, the loop radiation antenna further includes:

A second feed source 301, located on the floor 100, configured to feed an antenna signal;

The second inductance-capacitance matching component X2, the input end of which is electrically connected to the feed source;

The third wire 302 is electrically connected to the output terminal of the second inductive-capacitance matching component X2;

A fourth wire 303 is electrically connected to the third wire 302 and the floor 100, respectively;

A fifth wire 304 is electrically connected to the third wire 302 and the floor 100, respectively, and is used to adjust the radiation frequency and bandwidth of the antenna 200;

The floor 100, the second inductive-capacitive matching component X2, the third wire 302, and the fourth wire 303 are collectively used as radiators of the antenna 200, and are configured to radiate radio frequency signals.

The second feed source 301 in this embodiment is similar to the aforementioned first feed source and is connected to a radio frequency circuit for feeding electric energy. In order to distinguish the feed source in the feed coupling antenna 200 here, the feed source in this embodiment is called the second feed source 301.

In this embodiment, the output end of the second feed-in source 301 is connected to a sense-capacitance matching component (that is, the second sense-capacitance matching component X2), so as to achieve impedance matching in the loop radiating antenna, so as to improve Radiation efficiency.

In this embodiment, the third wire 302 is connected to the output end of the second inductive-capacitance matching component X2, one end of the fourth wire 303 is electrically connected to the third wire 302, and the other end is electrically connected to the floor 100. At this time, the fourth wire 303 can be used as an excitation unit of the loop radiation antenna, and the radiator of the antenna 200 is excited to radiate radio frequency signals.

In some embodiments, as shown in FIG. 6, the loop radiation antenna further includes:

The third capacitive component C3 is electrically connected to the four wires, and is configured to be used as the antenna 200 with the floor 100, the second inductive-capacitance matching component X2, the third wire 302, and the fourth wire 303. Radiator for radiating radio frequency signals.

The third capacitive component C3 is connected to the fourth wire 303. In this way, the fourth wire 303 can also be used as a part of the excitation unit of the loop radiation antenna and configured to excite the radio frequency signal radiation of the radiator.

In some embodiments, as shown in FIG. 7, the antenna 200 is a loop radiation antenna; the loop radiation antenna further includes:

A third feed source 401 located on the floor 100 and configured to feed an antenna signal;

A third sense-capacitance matching component X3, the input end of which is electrically connected to the third feed source 401;

The sixth wire 402 is electrically connected to the output terminal of the third inductance-capacitance matching component X3;

Seventh wires 403 are electrically connected to the sixth wires 402, respectively;

An eighth lead 404 is electrically connected to the floor 100;

A ninth lead 405 is electrically connected to the eighth lead 404 and is coupled to the seventh lead 403;

The floor 100, the third inductive-capacitive matching component X3, the sixth lead 402, the seventh lead 403, the eighth lead 404, and the ninth lead 405 are collectively used as radiators of the antenna 200 , Configured to radiate RF signals.

The third feed source 401 here is similar to the aforementioned first and second feed sources, and can be used to feed electric energy. The third inductive-capacitance matching component X3 can also be used for impedance matching in a loop radiating antenna to improve radiation efficiency.

The loop radiation antenna provided in this embodiment is different from the loop radiation antenna provided in the previous embodiment. In this embodiment, the loop radiating antenna includes four wires, of which the ninth wire 405 and the second seventh wire are arranged in parallel, and energy coupling of the RF signal excitation is performed through coupling.

In some embodiments, the antenna 200 is a loop radiation antenna;

As shown in FIG. 8, the loop radiation antenna further includes:

A fourth feed source 501 located on the floor 100 and configured to feed an antenna signal;

A fourth sense-capacitance matching component X4, the input end of which is electrically connected to the fourth feed source 501;

The tenth wire 502 is electrically connected to the output terminal of the fourth inductance-capacitance matching component X4;

Eleventh wires 503 are electrically connected to the tenth wires 502, respectively;

The twelfth lead 504 is electrically connected to the eleventh lead 503 and forms a capacitive load with the floor 100.

The fourth feed source 501 here is similar to the aforementioned first feed source, second feed source, and third feed source, and can be used to feed antenna signals. The loop radiating antenna provided in this embodiment also includes 3 wires. Among them, the twelfth wire 504 is electrically connected with the eleventh wire 503 on the one hand, and forms a capacitive load with the floor 100 to reduce the size of the antenna 200 and the clearance .

In the embodiment of the present application, the first capacitive element to the third capacitive element may be lumped parameter circuit elements or distributed parameter circuit elements, and the specific implementation may be selected according to requirements.

Several specific examples are provided below in combination with any of the above embodiments:

Example 1:

This example provides a communication device including:

The floor, feed structure, excitation unit, matching network, and capacitive load of the motherboard; and the floor, feed structure, excitation unit, and matching network of the motherboard are resonant.

The matching network here may correspond to the aforementioned first and the second capacitive-sense matching components, the third and the fourth capacitive-sense matching components, and the like.

The feeding structure includes at least a feeding source.

For example, after the floor of the motherboard, the feeding structure and the excitation unit are electrically connected, the required 6G frequency band resonance is generated by the resonance effect with the matching network. The floor of the motherboard is mainly used for signal radiation. The capacitive loading method helps to reduce the headroom here.

In this way, instead of tangible antennas, instead of using a physical antenna, a slot antenna is created directly on the main board. Instead of using a slot antenna on the metal case of a communication device, the opened slot and side keys on both sides of the fuselage, card slots, etc. are avoided. Device components. In addition, capacitive loading can be performed on this design to further reduce the antenna clearance area.

Example 2:

This example provides two antennas based on the communication device provided in Example 1. Two types of antennas are provided:

Coupled feed antenna

Loop radiating antenna.

The two implementation antennas are described below:

The coupled feed antenna, as shown in Figures 1 to 4, includes:

The excitation unit excites the floor of the motherboard to radiate radio frequency signals.

The loop-compatible antenna can be shown in Figures 5-9. The path indicated by the arrow in FIG. 9 forms a ring, and the ring can excite the floor of the motherboard to radiate radio frequency signals.

Example 3 :,

FIG. 3 shows a floor as a main board and the floor as a floor radiator;

The first feed-in source is used as an input / output port of an antenna signal and is connected to a radio frequency circuit;

The first inductive capacitance matching component can also be used as the capacitive load of the antenna;

A first lead connected to the first inductance-capacitance matching component;

The second lead and the third lead. The first wire, the first inductance-capacitance matching component, the second wire 2 and the third wire are combined to form an antenna feeding structure and a floor of the motherboard to form a radiator of the antenna.

Example 4:

As shown in FIG. 4, another feed coupling antenna includes a floor of a main board, a first feed source, a feed line, a first wire, and a second wire.

The floor of the motherboard is located inside the communication equipment and can provide a reference voltage. Generally speaking, it refers to the PCB of the mobile terminal, and the circuit devices of the mobile terminal are combined with each other in the printed circuit board. According to this application, in addition to providing a reference voltage, the floor of the motherboard is also the main radiator of the antenna.

According to this embodiment of the present application, the feed source, the feed line as a feed structure and the first wire form an excitation unit of the antenna to excite the antenna radiation, and the excitation unit itself also acts as an antenna radiator to radiate radio frequency signals. In addition, the second wire collectively participates in the adjustment of frequency and bandwidth. The second wire can be used as a part of the excitation unit and also as a radiator to radiate radio frequency signals. The floor of the motherboard as a main radiator jointly participates as an antenna radiator to radiate radio frequency signals.

Also shown in FIG. 4 are a first capacitive component C1 and a second capacitive component C2; both the first capacitive component C1 and the second capacitive component C2 can be composed of one or more capacitive components, which can be aggregated. Parametric circuit elements can also be implemented by distributing parametric circuit elements, the purpose is to achieve capacitive load loading, and to reduce the headroom size through capacitive load loading technology.

Example 5:

This example has provided a loop radiation antenna, as shown in FIG. 5, including: a second feed source, a second matching capacitive element X2, a floor of a motherboard, a third wire, a fourth wire, and a fifth wire.

The second feeding source, the second matching capacitive element X2, the third lead, the fourth lead, and the fifth lead constitute a feeding structure. The floor of the motherboard serves as a radiator and is excited by the feeding structure to radiate radio frequency signals. The feeding structure composed of the second matching capacitive element X2, the third wire, and the fourth wire determines the frequency and bandwidth of the antenna.

In the antenna according to this embodiment of the present application, the feeding structure composed of the third wire, the second matching capacitive element X2 and the fourth wire can also be used as a part of the radiator, but most of the radiation is realized by the floor radiator. In addition, the fifth wire is also used as a part of the feeding structure to supplement the frequency and bandwidth of the antenna.

Example 6:

This example has provided a loop radiation antenna, as shown in FIG. 6, including: a second feed source, a second matching capacitive element X2, a floor of a motherboard, a third wire, a fourth wire, a fifth wire, and a first Three capacitive elements.

The second feed source, the second matching capacitive element X2, the third capacitive element, the third wire, the fourth wire, and the fifth wire form a feeding structure. The floor of the motherboard serves as a radiator and is excited by the feeding structure. Thereby radiating radio frequency signals. The feeding structure composed of the second matching capacitive element X2, the third capacitive element, the third wire, and the fourth wire determines the frequency and bandwidth of the antenna.

In the antenna according to this embodiment of the present application, the feeding structure composed of the third wire, the second matching capacitive element X2, the fourth wire, and the third capacitive element can also be used as a part of the radiator, but most of the radiation is Realized by floor radiator. In addition, the fifth wire is also used as a part of the feeding structure to supplement the frequency and bandwidth of the antenna.

Example 7:

Referring to FIG. 7, this example provides a loop radiation antenna including a third feed source, a third inductive-capacitance matching component, a floor of a motherboard, a sixth lead, a seventh lead, an eighth lead, and a ninth lead. The ninth lead is coupled to the seventh lead.

Example 8:

Referring to FIG. 8, this example provides a loop radiation antenna including: a fourth feed source, a fourth inductive-capacitance matching component, a floor of a motherboard, a tenth lead, an eleventh lead, a twelfth lead, and a twelfth lead. 4 and the floor of the motherboard form a distributed parameter capacitive load, which realizes capacitive load loading. The floor of the twelfth lead and the main board essentially forms a parallel plate capacitor. The capacitance value of the capacitor can be adjusted by using the length of the floor between the twelfth lead and the main board and the distance between the two.

The fourth inductance-capacitance matching component is a lumped parameter capacitive load.

In the several embodiments provided in this application, it should be understood that the disclosed device and method may be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the unit is only a logical function division. In actual implementation, there may be another division manner, such as multiple units or components may be combined, or Can be integrated into another system, or some features can be ignored or not implemented. In addition, the components shown or discussed are mutually coupled, or directly coupled, or the communication electrical connection may be through some interfaces, the indirect coupling of the device or unit or the communication electrical connection, which may be electrical, mechanical, or Other forms.

The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, which may be located in one place or distributed to multiple network units; Some or all of the units may be selected according to actual needs to achieve the objective of the solution of this embodiment.

In addition, the functional units in the embodiments of the present application may be all integrated into one processing module, or each unit may be separately used as a unit, or two or more units may be integrated into one unit; the above integration The unit can be implemented in the form of hardware, or in the form of hardware plus software functional units.

A person of ordinary skill in the art may understand that all or part of the steps of the foregoing method embodiments may be completed by a program instructing related hardware. The foregoing program may be stored in a computer-readable storage medium. When the program is executed, the program is executed. Including the steps of the above method embodiment; and the foregoing storage medium includes: a mobile storage device, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, etc. A medium on which program code can be stored.

The above is only a specific implementation of this application, but the scope of protection of this application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in this application. It should be covered by the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A communication device includes:

A circuit board, wherein the circuit board includes a floor;

An antenna is provided on the floor;

The floor, as a radiator of the antenna, is configured to radiate radio frequency signals.
The communication device according to claim 1, wherein:

The antenna is a coupled feed antenna, and the coupled feed antenna further includes:

A first feed source, located on the floor, configured to feed an antenna signal;

A first excitation unit, located on the floor, electrically connected to the first feed source, configured to excite radiation of a radio frequency signal based on an antenna signal, and serves as a radiator of the coupled feed antenna;

The radiator and the radiator are configured to radiate the radio frequency signal under the excitation of the excitation unit.
The communication device according to claim 2, wherein:

The first excitation unit is electrically connected to the first feed source through a feed line.
The communication device according to claim 3, wherein:

The first excitation unit includes:

A first wire electrically connected to the feeder;

A second wire is electrically connected to the floor and is coupled to the first wire.
The communication device according to claim 4, wherein the coupled feed antenna further comprises:

The first inductance-capacitance matching component is electrically connected between the first feed source and the feeder line, and is configured for antenna capacitance-sensitivity matching.
The communication device according to claim 4, wherein the incentive unit further comprises:

A first capacitive component is electrically connected between the feeder and the first wire.
The communication device according to claim 6, wherein the coupled feed antenna further comprises:

A second capacitive component is electrically connected to the second wire and configured to adjust a radiation frequency and a bandwidth of the feed coupling antenna.
The communication device according to claim 1, wherein:

The antenna is a circular radiation antenna;

The loop radiation antenna further includes:

A second feed source, located on the floor, configured to feed an antenna signal;

A second inductance-capacitance matching component, the input end of which is electrically connected to the feed source;

A third wire electrically connected to an output terminal of the second inductive-capacitance matching component;

A fourth lead, which is electrically connected to the third lead and the floor, respectively;

A fifth wire, which is electrically connected to the third wire and the floor, respectively, and is configured to adjust a radiation frequency and a bandwidth of the antenna;

The floor, the second inductive-capacitive matching component, the third lead, and the fourth lead are collectively used as radiators of the antenna, and are configured to radiate radio frequency signals.
The communication device according to claim 8, wherein:

The loop radiation antenna further includes:

A third capacitive component is electrically connected to the four wires, and is configured to work with the floor, the second inductive-capacitance matching component, the third wire, and the fourth wire as radiation of the loop radiation antenna. Body for radiating radio frequency signals.
The communication device according to claim 1, wherein:

The antenna is a circular radiation antenna;

The loop radiation antenna further includes:

A third feed source, located on the floor, configured to feed an antenna signal;

A third inductance-capacitance matching component, the input end of which is electrically connected to the third feed source;

A sixth lead, which is electrically connected to an output terminal of the third inductance-capacitance matching component;

Seventh wires are electrically connected to the sixth wires, respectively;

An eighth wire electrically connected to the floor;

A ninth lead, electrically connected to the eighth lead, and coupled with the seventh lead;

The floor, the third inductive-capacitive matching component, the sixth lead, the seventh lead, the eighth lead, and the ninth lead are collectively used as radiators of the loop radiation antenna and are configured as Radiate radio frequency signals.
The communication device according to claim 1, wherein:

The antenna is a circular radiation antenna;

The loop radiation antenna further includes:

A fourth feed source, located on the floor, configured to feed an antenna signal;

A fourth inductance-capacitance matching component, the input end of which is electrically connected to the fourth feed source;

A tenth lead, which is electrically connected to an output terminal of the fourth inductance-capacitance matching component;

The eleventh lead is electrically connected to the tenth lead, respectively;

A twelfth lead, electrically connected to the eleventh lead, and forming a capacitive load with the floor;

The floor, the fourth inductive-capacitive matching component, the tenth lead, the eleventh lead, and the twelfth lead are collectively used as radiators of the loop radiation antenna and are configured to radiate radio frequency signals.
The communication device according to claim 1, wherein the circuit board is a main board of the communication device.